TW201915092A - Resin sheet and method for manufacturing the same wherein the resin sheet is capable of forming a thick film of resin composition layer, and a cured layer formed by curing the resin composition layer is provided with an excellent electroplating adhesion - Google Patents

Abstract

Provided is a resin sheet 1, which is a resin sheet 1 used for sealing electronic parts in a method of manufacturing a semiconductor device. The resin sheet 1 is provided with a curable resin composition layer 11, wherein the resin composition layer 11 is formed by a resin composition containing a curable resin, a film-forming resin and an inorganic filler. The film-forming resin contains a polyvinyl acetal resin. The resin sheet 1 is capable of forming a thick film of resin composition layer, and a cured layer formed by curing the resin composition layer is provided with an excellent electroplating adhesion.

Description

Resin sheet and method of producing the same

The present invention relates to a resin sheet for sealing a metal component used in a method of manufacturing a semiconductor device, and a method of manufacturing the sheet.

Conventionally, in a method of manufacturing a semiconductor device, an electronic component called a semiconductor wafer is sealed by using a resin sheet having a curable resin composition layer. For example, after the resin composition of the resin sheet is laminated on the electronic component provided on the substrate, the resin composition layer is cured to form a hardened layer, thereby sealing the electronic component (Patent Document 1). Here, in the sealing, from the viewpoint of suppressing generation of voids between the electronic component and the hardened layer, the resin composition layer is required to have a sufficient thickness, whereby the resin composition layer can carry the electronic component It is well covered around.

In recent years, development of a substrate in which an electronic component is incorporated (hereinafter referred to as a "component built-in substrate") continues to progress, and in the manufacture of such a component-embedded substrate, the resin sheet is used to seal electronic components. The situation. At this time, after the electronic component is sealed, the hole penetrating the hardened layer is formed, and then the wiring for electrically connecting the electronic component to the outside through the hole is formed.

When the above-mentioned pores are formed, there is a case where a residue of a resin constituting the hardened layer (hereinafter referred to as "smear") is generated, and the slag remains in the pores. When the wiring is formed in a state in which the glue remains in the hole, the problem of poor conduction of the wiring is likely to occur. Therefore, after the holes are formed and before the wiring is formed, the process of removing the generated slag (hereinafter referred to as "squeegee treatment") is performed. As one of the methods for such desmear treatment, there is a method of exposing the treated object to an alkaline solution. By this method, the dross can be dissolved in an alkaline solution and removed. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2016-175972

[Questions to be solved by the invention]

In the method of manufacturing a part-embedded substrate, immediately after the desmear treatment using the above-described alkaline solution, metal plating treatment is performed on the surface of the hardened layer as part of the wiring forming step. Here, in the resin sheet disclosed in Patent Document 1, there is a problem that plating hardly adheres to the hardened layer obtained by hardening the resin composition layer during the plating treatment. When the adhesion of plating is insufficient, the formation of wiring cannot be satisfactorily performed, and the quality of the obtained built-in substrate is low.

The present invention has been made in view of such a practical situation, and an object of the invention is to provide a resin sheet capable of forming a thick film, and a resin sheet having excellent plating adhesion in a hardened layer obtained by hardening the resin composition layer, and A method of producing a resin sheet. [Means to solve the problem]

In order to achieve the above object, a first aspect of the invention provides a resin sheet which is a resin sheet for sealing a metal component in a method for producing a semiconductor device, characterized in that the resin sheet has a curable resin composition layer, and the resin The composition layer is formed of a resin composition containing a curable resin, a film-forming resin, and an inorganic filler, and the film-forming resin contains a polyvinyl acetal resin (Invention 1).

In the resin sheet of the invention (Invention 1), the resin composition for forming the resin composition layer contains a polyvinyl acetal resin, and since the coating liquid of the resin composition becomes a substance having a high viscosity, A resin composition layer having a sufficient thickness can be formed by applying the coating liquid. Further, the resin composition for forming the resin composition layer contains a polyvinyl acetal resin, and the hardened layer is formed by hardening the resin composition layer, and only inorganic is used for desmear treatment using an alkaline solution. The filler is moderately detached from the hardened layer, and the matrix component present around the inorganic filler is not easily eluted into the alkaline solution. As a result, the surface of the hardened layer after the desmear treatment becomes a material having minute irregularities, and when the plating treatment is subsequently performed, the anchoring effect of the plating on the surface can be satisfactorily exhibited, and the plating in the hardened layer becomes excellent in adhesion. Things.

In the above invention (Invention 1), the thickness of the resin composition layer is preferably 100 μm or more and 300 μm or less (Invention 2).

In the above invention (Inventions 1 and 2), it is preferred that the resin composition layer is composed of a single layer (Invention 3).

In the above-mentioned invention (Inventions 1 and 2), the resin composition layer is formed by laminating two or more unit resin compositions, and the thickness of the unit resin composition layer is preferably 100 μm or more (Invention 4).

In the above invention (Inventions 1 to 4), it is preferred that the inorganic filler is surface-treated with a surface treatment agent having a minimum coating area of less than 550 m ² /g (Invention 5).

In the above invention (Inventions 1 to 5), the method for producing a semiconductor device preferably includes a step of performing a plating treatment on at least a part of the surface of the cured layer obtained by curing the resin composition layer (Invention 6).

In the above-described invention (Inventions 1 to 6), the method for producing a semiconductor device is preferably a step of contacting at least a part of the surface of the cured layer obtained by curing the resin composition layer with an alkaline solution (Invention 7).

In the above invention (Inventions 1 to 7), the semiconductor device is preferably a component-embedded substrate (Invention 8).

According to a second aspect of the invention, there is provided a method of producing a resin sheet, which is characterized in that the resin sheet has a curable resin composition layer, and the resin sheet is used in the method of manufacturing a semiconductor device. The resin composition layer is formed of a resin composition containing a curable resin, a film-forming resin, and an inorganic filler, the film-forming resin contains a polyvinyl acetal resin, and the production method includes a coating liquid for the resin composition. a step of forming a coating film by coating; and a step of forming the resin composition layer by drying the coating film (Invention 9).

In the above invention (Invention 9), the coating film is formed by coating the coating liquid of the resin composition once, and the coating film is dried to form a single layer of the above (Invention 3). It is preferable that the resin composition layer is formed or the unit resin composition layer of the above (Invention 4) is formed (Invention 10).

In the above invention (Inventions 9, 10), it is preferred that the coating liquid of the resin composition contains a diluent having a boiling point of 130 ° C or higher (Invention 11). [Effect of the invention]

The resin sheet of the present invention can form a thick film resin composition layer and has excellent plating adhesion in the hardened layer obtained by laminating the resin composition layer.

Form for implementing the invention

Hereinafter, embodiments of the present invention will be described. [Resin Sheet 1] Fig. 1 is a cross-sectional view showing the resin sheet 1 of the present embodiment. As shown in FIG. 1, the resin sheet 1 of the present embodiment includes a resin composition layer 11 and a release sheet 12 laminated on at least one surface of the resin composition layer 11. Further, another peeling sheet may be further laminated on the opposite side of the resin composition layer 11 from the release sheet 12. However, the release sheet 12 and the additional release sheet may also be omitted.

1. Resin composition layer In the resin sheet 1 of the present embodiment, the resin composition layer 11 has curability. Here, the term "curable property" means that the resin composition layer 11 can be cured by heating or the like. That is, the resin composition layer 11 is not cured in a state in which the resin sheet 1 is formed. The resin composition layer 11 is preferably thermosetting. By this means, even if the thickness of the resin composition layer 11 is large or a coloring agent is contained, the resin composition layer 11 can be easily irradiated by irradiation with energy rays, and the resin composition layer 11 can be made. Hardened well.

In the resin sheet 1 of the present embodiment, the resin composition layer 11 is formed of a resin composition containing a curable resin, a film-forming resin, and an inorganic filler. Further, in the resin sheet 1 of the present embodiment, the resin composition contains a polyvinyl acetal resin as a film-forming resin.

(1) Curable resin In the resin sheet 1 of the present embodiment, the resin composition contains a curable resin, and the electronic component can be firmly sealed. The curable resin can be cured from the resin composition layer 11 even if the thickness of the resin composition layer 11 is large or the coloring agent is not easily applied to the resin composition layer 11 In other words, a thermosetting resin is preferred. The thermosetting resin is not particularly limited as long as it can cure the resin composition layer 11. For example, a resin which is usually contained in the sealing material can be used. Specific examples thereof include an epoxy resin, a phenol resin, a maleimide compound, a melamine resin, a urea resin, a benzoxazine compound, an acid anhydride compound, an amine compound, and an active ester resin. Cyanate-based resin or the like can be used alone or in combination of two or more. Among these, it is preferred to use an epoxy resin, a phenol resin, or a mixture thereof, and it is preferred to use at least an epoxy resin. In addition, a phenoxy resin, an acrylic resin, or the like has a high molecular weight body and an epoxy group in a side chain, and the epoxy gene is thermally reacted and can participate in the hardening of the resin composition layer 11. In the resin sheet 1 of the present embodiment, a high molecular weight body and a function of forming the resin composition layer 11 into a sheet shape are regarded as a film-forming resin. Such a high molecular weight body usually has a weight average molecular weight of 25,000 or more.

Epoxy resins are generally three-dimensionally networked upon heating and have the property of forming a strong cured product. As such an epoxy resin, various conventional epoxy resins can be used, and specific examples thereof include phenols such as bisphenol A, bisphenol F, resorcin, phenyl novolac, and cresol novolak. a propylene glycol ether; a glycidyl ether of an alcohol such as butanediol, polyethylene glycol or polypropylene glycol; a ring of a carboxylic acid such as phthalic acid, isophthalic acid or tetrahydrophthalic acid; Oloxypropyl ether; aniline isocyanurate or the like; epoxy propyl-type or alkoxy-epoxypropyl type epoxy resin obtained by using an epoxy propylene-substituted active hydrogen bonded to a nitrogen atom; Vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5,5- A so-called alicyclic epoxide in which an epoxy group is formed by oxidizing a carbon-carbon double bond in the molecule, for example, by snail (3,4-epoxy)cyclohexane-m-dioxane. Further, an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton or the like can also be used. These epoxy resins can be used alone or in combination of two or more. Among the above epoxy resins, a epoxidized propyl ether (bisphenol A type epoxy resin) using bisphenol A, an epoxy resin having a biphenyl skeleton (biphenyl type epoxy resin), and a ring having a naphthalene skeleton are used. An oxygen resin (naphthalene type epoxy resin) or the like is preferred.

Examples of the phenol resin include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane phenol, and tetra. Phenol, novolak type phenol, cresol novolac resin, phenol having a biphenyl aralkyl skeleton (biphenyl type phenol), etc., among which biphenyl type phenol is preferably used. These phenol resins can be used alone or in combination of two or more. Further, when an epoxy resin is used as the thermosetting resin, it is preferred to use a phenol resin in combination from the viewpoint of reactivity with an epoxy resin and the like.

The content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and more preferably 20% by mass or more. Further, the content is preferably 60% by mass or less, more preferably 50% by mass or less, and still more preferably 40% by mass or less. When the content is 10% by mass or more, the resin composition layer 11 is more sufficiently cured and the electronic component can be more firmly sealed. In addition, when the content is 60% by mass or less, it is possible to further suppress the resin composition layer 11 from being hardened in an unexpected stage and to be more excellent in storage stability. In addition, when the resin composition is diluted into a coating liquid and applied and dried to form a sheet, the content of the thermosetting resin in the resin composition is the amount after removing the volatile component in the drying step. The content of the other constituent components of the resin composition is also the same.

An energy ray curable resin can also be used as the curable resin. Examples of the energy ray-curable resin include a resin which is cured by ultraviolet rays, and examples of the resin which is cured by ultraviolet rays include an acryl fluorenyl group, a methacryl fluorenyl group or the like in the molecule. Reactive double bond resin. When the energy ray-curable resin is used, the resin composition preferably further contains a photopolymerization initiator. In the resin sheet 1 of the present embodiment, the resin composition may contain both a thermosetting resin and an energy ray curable resin.

(2) Film-forming resin The resin sheet 1 of the present embodiment contains the film-forming resin by the resin composition, and the resin composition layer 11 is easily formed into a sheet shape. Further, in the resin sheet 1 of the present embodiment, the resin composition contains a polyvinyl acetal resin as a film-forming resin. When the resin composition contains a polyvinyl acetal resin, the coating liquid of the resin composition has a high viscosity, and by coating the coating liquid, a resin composition layer having a sufficient thickness can be formed.

Further, in the resin sheet 1 of the present embodiment, when the resin composition contains a polyvinyl acetal resin, when the hardened layer obtained by curing the resin composition layer 11 is subjected to desmear treatment using an alkaline solution, The matrix component present around the inorganic filler of the hardened layer is not easily eluted in the alkaline solution. On the other hand, since the inorganic filler is appropriately detached from the hardened layer into the alkaline solution, there are fine voids formed by the inorganic filler detached on the surface of the hardened layer and minute irregularities formed by the residual matrix. After the desmear treatment, the surface of the hardened layer having such fine irregularities is subjected to a plating treatment, whereby the anchoring effect of the plating on the surface can be satisfactorily exhibited, and the plating in the hardened layer is excellent in adhesion. As a result, it is possible to manufacture a semiconductor device in which wiring is adhered to the surface of the cured layer.

As the polyvinyl acetal resin, as long as it is a viscosity which is required to impart a coating liquid to the resin composition, and the hardened layer obtained by curing the resin composition layer has a desired resistance to an alkaline solution, The resin is not limited, and examples thereof include polyvinyl butyral obtained by reacting polyvinyl alcohol with butyraldehyde, polyvinyl formal obtained by reacting polyvinyl alcohol with formaldehyde, and reacting polyvinyl alcohol with acetaldehyde. The obtained polyvinyl acetal acetal or the like can be used alone or in combination of two or more. Among these, polyvinyl butyral is preferably used.

The weight average molecular weight of the polyvinyl acetal resin is preferably 25,000 or more, and particularly preferably 50,000 or more. Further, the weight average molecular weight is preferably 600,000 or less, and more preferably 300,000 or less.

In the resin sheet 1 of the present embodiment, the resin composition may contain both a polyvinyl acetal resin and another film-forming resin. Examples of the other film-forming resin include a phenoxy resin, an olefin resin, a polyester resin, a polyurethane resin, a polyester urethane resin, and a polyamide compound. A resin, a polystyrene-based resin, a polyoxyalkylene-based resin, a rubber-based resin, or the like may be used alone or in combination of two or more. The weight average molecular weight of the other film-forming resin is preferably 25,000 or more, and particularly preferably 50,000 or more. Further, the weight average molecular weight is preferably 1,500,000 or less, and particularly preferably 800,000 or less.

The phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, bisphenol A/bisphenol F copolymerization type, bisphenol S type, bisphenol acetophenone type, and novolac type. Type, hydrazine type, dicyclopentadiene type, norbornene type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type, biphenyl type, etc. Among them, it is preferred to use a bisphenol A type phenoxy resin.

Further, in the resin sheet 1 of the present embodiment, the content of the film-forming resin which is easily eluted from the hardened layer in which the resin composition layer 11 is cured to the alkaline solution in the resin composition is preferably small, particularly It is preferred that the film-forming resin is not contained. Examples of the film-forming resin which is easily eluted from the hardened layer into the alkaline solution include an acrylic resin, a polyester resin, and a polyester urethane resin.

The content of the polyvinyl acetal resin in the resin composition is preferably 4% by mass or more, more preferably 6% by mass or more, and still more preferably 8% by mass or more. Further, the content is preferably 40% by mass or less, more preferably 30% by mass or less, and still more preferably 20% by mass or less. When the content is in the above range, it is easy to prepare a coating liquid of a resin composition having a desired viscosity, and it is easy to form a thick film-forming resin composition layer 11 and to cure the resin composition layer 11 to a hardened layer. The resistance to the alkaline solution is effectively high, and the plating adhesion to the hardened layer is more excellent.

In addition, the content of all the film-forming resins containing the polyvinyl acetal resin in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more, and still more preferably 5% by mass or more. Further, the content is preferably 30% by mass or less, more preferably 20% by mass or less, and still more preferably 10% by mass or less. By the content being in the above range, the resin composition layer 11 can be more easily formed into a sheet shape.

The content of the polyvinyl acetal resin in the film-forming resin is preferably 75 mass% or more, more preferably 85 mass% or more, and further preferably 92 mass% or more. Further, the content of the polyvinyl acetal resin in the film-forming resin is preferably 100% by mass or less.

(3) Inorganic filler The resin sheet 1 of the present embodiment exhibits excellent mechanical strength by curing the resin composition layer 11 by containing an inorganic filler in the resin composition. Further, when the hardened layer is subjected to desmear treatment using an alkaline solution, the inorganic filler is appropriately detached from the hardened layer, and as a result, the plating anchoring effect on the surface of the hardened layer can be favorably exhibited as described above, and has a hardened layer in the hardened layer. Excellent plating adhesion.

Examples of the inorganic filler include cerium oxide, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium citrate, magnesium citrate, calcium oxide, magnesium oxide, and aluminum oxide. a composite oxide of aluminum nitride, aluminum borate whisker, boron nitride, crystalline cerium oxide, amorphous cerium oxide, mullite, cordierite, montmorillonite, As a filler of the material, smectite or the like can be used alone or in combination of two or more. Among these, it is preferred to use a cerium oxide filler.

The shape of the inorganic filler may be any of a granular shape, a needle shape, a plate shape, an amorphous shape, and the like, and among these, a spherical shape is preferred.

The average particle diameter of the inorganic filler is preferably 0.01 μm or more, more preferably 0.1 μm or more, and further preferably 0.3 μm or more. Further, the inorganic filler preferably has an average particle diameter of 3.0 μm or less, and particularly preferably 1.0 μm or less. When the average particle diameter of the inorganic filler is within the above range, the hardened layer obtained by curing the resin composition layer 11 is likely to exhibit mechanical strength efficiently, and the inorganic filler is easily detached from the hardened layer in an alkaline solution. In addition, the average particle diameter of the inorganic filler in the present specification is a value measured by a dynamic light scattering method using a particle size distribution measuring apparatus (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT 151").

Further, the inorganic filler preferably has a maximum particle diameter of 0.05 μm or more, and particularly preferably 0.5 μm or more. Further, the maximum particle diameter is preferably 5 μm or less, and particularly preferably 3 μm or less. Since the maximum particle diameter of the inorganic filler is in the above range, the inorganic filler is easily filled into the hardened layer, and the hardened layer has more excellent mechanical strength. In addition, the maximum particle diameter of the inorganic filler in the present specification is a value measured by a dynamic light scattering method using a particle size distribution measuring apparatus (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT 151").

In the resin sheet 1 of the present embodiment, the inorganic filler is preferably surface-treated with a surface treatment agent. Thereby, the dispersibility and the filling property of the inorganic filler in the resin composition can be improved, and the inorganic filler is easily hardened when the hardened layer obtained by hardening the resin composition layer 11 is subjected to desmear treatment using an alkaline solution. The layers are moderately separated. In particular, the minimum coating area of the surface treating agent is less than 550m ² / g preferably to 520m ² / g or less is particularly preferred, and further to 450m ² / g or less is preferable. Further, the minimum coating area of the surface treatment agent is preferably 100 m ² /g or more, particularly preferably 200 m ² /g or more, and more preferably 300 m ² /g or more. When the minimum coating area of the surface treatment agent is less than 550 m ² /g, the inorganic filler is easily detached from the hardened layer obtained by curing the resin composition layer 11, and as a result, it is easy to have excellent plating adhesion in the hardened layer. Moreover, the inorganic filler has more excellent dispersibility and filling property in the resin composition by the minimum coating area of the surface treatment agent of 100 m ² /g or more.

Examples of the surface treatment agent include epoxy decane, vinyl decane, and the like. Among these, it is preferred to use epoxy decane. Specific examples of the epoxy decane include 3-glycidoxypropyltriethoxydecane, 3-glycidoxypropyltrimethoxydecane, and 3-epoxypropoxypropane. Methyldimethoxydecane, 3-glycidoxypropylmethyldiethoxydecane, 2-(3,4 epoxycyclohexyl)ethyltrimethoxydecane, and the like. Among these, from the viewpoint of effectively promoting the detachment of the inorganic filler, 3-glycidoxypropyltrimethoxydecane is preferably used.

Specific examples of the vinyl decane include vinyl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane, vinyl trichloro decane, and vinyl ginseng (2-A). Oxyethoxyethoxy) decane, and the like. Among these, vinyl trimethoxy decane is preferably used from the viewpoint of effectively promoting the detachment of the inorganic filler.

The method of surface-treating the inorganic filler using a surface treatment agent is not specifically limited, and can be performed using a normal method. For example, the untreated inorganic filler can be stirred at a normal temperature by using a mixer, and after the surface treatment agent is sprayed, the surface treatment can be carried out by further stirring for a predetermined time. The stirring time after the spraying is preferably, for example, 5 minutes or longer and 15 minutes or shorter. Further, in order to sufficiently adhere the surface treatment agent to the inorganic filler, after the above operation, the inorganic filler may be taken out from the mixer and left for one day or more, and may be subjected to a slight heat treatment. Further, in order to uniformly perform the surface treatment, after the surface treatment agent is sprayed, the above-mentioned stirring may be further carried out by further adding an organic solvent. As the mixer, a conventional product can be used, and examples thereof include a blender of a V blender, a closed blender, a bubble cone blender, a Scherrer mixer, and a concrete mixer. Mixers, ball mills, etc., etc., among which it is preferred to use a mixer.

The content of the inorganic filler in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more. Further, the content is preferably 90% by mass or less, particularly preferably 85% by mass or less, and more preferably 80% by mass or less. The hardened layer obtained by hardening the resin composition layer 11 by the inorganic filler content of 40% by mass or more has better mechanical strength. In addition, when the content of the inorganic filler is 90% by mass or less, the resin composition layer 11 is easily cured, and the resin sheet 1 can be used to manufacture a semiconductor device having better quality.

In addition, when the inorganic filler is surface-treated with a surface treatment agent, among the inorganic fillers contained in the resin composition, the ratio of the inorganic filler surface-treated with the surface treatment agent is preferably 70% by mass or more, and is preferably 85. More than % by mass is particularly good. When the ratio is in the above range, the inorganic filler can be favorably promoted to be detached from the hardened layer and the hardened layer has excellent mechanical strength.

(4) Curing catalyst In the resin sheet 1 of the present embodiment, when the resin composition contains a thermosetting resin, it is preferable to further contain a curing catalyst. Thereby, the hardening reaction of the thermosetting resin can be efficiently performed, and the resin composition layer 11 can be favorably cured. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2. -methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2- Methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl 4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-bis(hydroxymethyl)imidazole, etc., from the viewpoint of reactivity, using 2-ethyl-4-methyl Imidazole is preferred.

Specific examples of the amine-based curing catalyst include a triazine compound such as 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-5-triazine. A tertiary amine compound of 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), triethylenediamine, benzyldimethylamine, triethanolamine or the like. In particular, 2,4-diamino-6-[2,-methylimidazolyl-(1')]ethyl-s-triazine is preferred.

Further, specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tris(p-methylphenyl)phosphine, and tris(nonylphenyl)phosphine.

The curing catalyst may be used singly or in combination of two or more.

The content of the curing catalyst in the resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more. Further, the content is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, and still more preferably 1.0% by mass or less. When the content is in the above range, the resin composition layer 11 can be cured more satisfactorily.

(5) Plasticity solvent In the resin sheet 1 of the present embodiment, the resin composition layer 11 preferably contains a plastic solvent in an amount of 1.0% by mass or more. Thereby, the brittleness of the resin composition layer 11 can be improved, and the resin composition layer 11 is not easily collapsed, and damage and breakage in the resin composition layer 11 can be suppressed during storage, transportation, and use. In addition, since the resin composition layer 11 has a predetermined flexibility, the resin composition layer 11 is used to sufficiently cover the periphery of the electronic component, and the hardened layer and the electron formed by hardening the resin composition layer 11 can be satisfactorily suppressed. A gap is formed between the parts.

The plastic solvent is not limited as long as the brittleness of the resin composition layer 11 can be sufficiently improved. As described above, the resin composition layer 11 is preferably formed of a resin composition containing a thermosetting resin. In this case, when the electronic component is sealed, the resin composition layer 11 can be cured by heating. Here, since the plastic solvent is volatilized by heating, it can be sufficiently removed from the formed hardened layer by the above heating. Moreover, in the stage before application to the electronic component at the time of storage and transportation, the plastic solvent is preferably a substance which is not easily volatilized at normal temperature in order to suppress excessive discharge from the resin composition layer 11. Further, as described later, when the resin composition is diluted with a solvent to prepare a coating liquid, and the resin composition layer 11 is formed by using the coating liquid, it is preferred that the plastic solvent is used as a solvent for preparing the coating liquid. .

The boiling point of the plastic solvent is preferably 130 ° C or higher, and the boiling point of the plastic solvent is preferably 210 ° C or lower. When the coating film obtained by applying the coating liquid containing the plastic solvent is dried at a boiling point of the plastic solvent of 130 ° C or higher, the plastic solvent is not volatilized in the coating film, and it is easy to remain in an appropriate manner. The content of the plastic solvent in the resin composition layer 11 is easily adjusted to the above value. In addition, during the storage and transportation of the resin sheet 1, it is possible to effectively suppress the release of the plastic solvent from the resin composition layer 11, and it is easy to maintain the plastic solvent content as adjusted as described above. On the other hand, when the boiling point of the plastic solvent is 210 ° C or less and the resin composition layer 11 is cured by heating, the plastic solvent is easily volatilized by the heating, and the plastic solvent in the hardened layer is easily obtained. The content is sufficiently reduced.

Specific examples of the plastic solvent include cyclohexanone (boiling point: 155.6 ° C), dimethylformamide (boiling point: 153 ° C), dimethyl hydrazine (boiling point: 189.0 ° C), and ethylene glycol. An organic solvent such as an ether (Serub) (boiling point: 120 to 310 ° C) or o-xylene (boiling point: 144.4 ° C).

(6) Other components The resin composition of the present embodiment may further contain a plasticizer, a stabilizer, an adhesion-imparting agent, a colorant, a coupling agent, an antistatic agent, an antioxidant, and the like.

(7) Configuration of Resin Composition Layer The thickness of the resin composition layer 11 is preferably 100 μm or more, more preferably 105 μm or more, and still more preferably 110 μm or more. In the resin sheet 1 of the present embodiment, the resin composition contains a polyvinyl acetal resin, and the coating liquid of the resin composition has a high viscosity, and can be applied once by using the coating liquid. A sufficiently thick resin composition layer 11 of 100 μm or more is formed. When the thickness of the resin composition layer 11 is 100 μm or more, when the electronic component is sealed using the resin sheet 1, the resin composition layer 11 can be used to effectively cover the periphery of the electronic component, and the resin composition can be effectively suppressed. The layer 11 is hardened to create a gap between the hardened layer and the electronic component. Further, the upper limit of the thickness of the resin composition layer 11 is not particularly limited, and is preferably 300 μm or less, more preferably 250 μm or less, and further preferably 200 μm or less. Further, when the resin composition layer 11 is formed by laminating two or more resin compositions, the thickness of the resin composition layer 11 is the total thickness of all the resin composition layers 11.

In the resin sheet 1 of the present embodiment, as described above, the coating liquid of the resin composition has a high viscosity, and by using the coating liquid once, it is possible to form a sufficiently thick resin composition of 100 μm or more. Object layer 11. In the resin sheet 1 of the present embodiment, the resin composition layer 11 is preferably composed of a single layer. Here, the term "consisting of a single layer" means that the resin composition layer 11 is not formed by laminating a plurality of unit resin compositions, but is composed of a single unit resin composition layer. In the resin sheet 1 of the present embodiment, when the resin composition layer is formed by laminating a plurality of layers, the resin composition layer 11 is composed of a single layer, and is excellent in productivity. Further, when a plurality of unit resin compositions are laminated, there is a possibility that foreign matter and bubbles are mixed during lamination, but the resin composition layer 11 is composed of a single layer, and the defects caused by such a phenomenon can be avoided.

In addition, when the resin composition layer 11 is formed by laminating two or more unit resin compositions, the thickness of the unit resin composition layer is preferably 100 μm or more. By this means, since the resin composition layer 11 having a total thickness of 200 μm or more can be obtained by laminating a small number of unit resin composition layers, it has excellent productivity. The thickness of the unit resin composition layer is preferably 150 μm or less.

2. Release Sheet The resin sheet 1 of the present embodiment may further include a release sheet 12. The structure of the release sheet 12 is arbitrary, and examples thereof include a polyester film such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate, polypropylene, polyethylene, or the like. A plastic film such as a polyolefin film. The peeling surface (the surface in contact with the resin composition layer 11 of the resin sheet 1) is preferably subjected to a release treatment. The release agent used for the release treatment may, for example, be a release agent such as a polyfluorene-based, fluorine-based or long-chain alkyl group.

The thickness of the release sheet 12 is not particularly limited, and is usually 20 μm or more and 250 μm or less.

3. Physical properties of the resin sheet The resin sheet 1 of the present embodiment is electroless copper plating on the cured layer obtained by curing the resin composition layer 11, and a copper plating layer having a thickness of 30 μm formed by electrolytic copper plating. The peeling strength at the time of peeling of the hardened layer is preferably 2 N/10 mm or more, and particularly preferably 4 N/10 mm or more. In the resin sheet 1 of the present embodiment, the resin composition contains a polyvinyl acetal resin, and as a result, the cured layer obtained by curing the resin composition layer 11 has excellent plating adhesion. Therefore, the higher peel strength as described above can be achieved and the expansion of the plating can be effectively suppressed. Further, the upper limit of the peel strength is not particularly limited, but is preferably 15 N/10 mm or less, and preferably 12 N/10 mm. The details of the method for measuring the peel strength described above are as described in the test examples described later.

4. Method for Producing Resin Sheet The resin sheet 1 of the present embodiment is preferably produced by applying the resin composition coating liquid to form the resin composition layer 11. In the production method, when the resin composition layer 11 containing a small amount of the plastic solvent is formed, the diluent added to the coating liquid for dissolving, dispersing, or diluting the resin composition component is not completely dried. On the other hand, the resin composition layer 11 is easily formed, and the resin composition layer 11 containing a small amount of a plastic solvent can be easily obtained. Further, in particular, the resin composition layer 11 composed of a single layer is formed by one application coating of the coating liquid of the resin composition (the resin composition layer 11 is a layer in which a plurality of unit resin compositions are laminated) It is preferably produced in the form of a unit resin composition layer. For example, a coating liquid containing a resin composition or a solvent or a dispersion medium further contained as needed, and a coating liquid can be applied to the release surface of the release sheet 12 to form a coating film. The resin sheet 1 is produced by drying the coating film. In the resin sheet 1 of the present embodiment, the resin composition contains a polyvinyl acetal resin, and the coating liquid has a high viscosity, and the resin composition layer 11 capable of forming a thick film can be formed by one application ( Unit resin composition layer).

Examples of the coating include a doctor blade coating method, a die coating method, a bar coating method, a gravure coating method, a blade coating method, and a roll coating method, and the like. good. When these coating methods are used, it is easy to form the resin composition layer 11 having a sufficient thickness.

When coating by a doctor blade method, the coating speed is preferably 0.3 m/min or more, and particularly preferably 0.5 m/min or more. Further, the speed is preferably 30 m/min or less, and particularly preferably 15 m/min or less. By setting such a coating speed, the resin composition layer 11 is easily formed.

As a condition for drying the formed coating film, the drying temperature is preferably 40 ° C or higher, and particularly preferably 45 ° C or higher. Further, the drying temperature is preferably 150 ° C or lower, and particularly preferably 130 ° C or lower. The drying time is preferably 8 minutes or more, and more preferably 10 minutes or more. Further, the drying time is preferably 20 minutes or less, and particularly preferably 15 minutes or less. Further, the drying of the coating film may be carried out while changing the drying temperature. For example, the drying time is set to be about 3 minutes to 4 minutes for each temperature, and the drying temperature is in the order of 50 ° C, 70 ° C, 90 ° C, and 100 ° C. It is better to rise and dry.

As the above-mentioned diluent, those which can be used in the above-mentioned plastic solvent can be used, and examples thereof include toluene (boiling point: 110.6 ° C), ethyl acetate (boiling point: 77.1 ° C), and methyl ethyl ketone (boiling point: 79.6). °C), an organic solvent such as isopropyl alcohol (boiling point: 82.6 ° C), and the like. The diluent may be used in combination of two or more kinds. The release sheet 12 can be peeled off as a process material, and the resin composition layer 11 can be protected during use until sealing.

In addition, as a method of producing a laminate in which a sheet is peeled off on both surfaces of the resin sheet 1, the coating liquid can be applied onto a release surface of a release sheet to form a coating film, which is dried to form a resin. After the layered body of the layer 11 and the release sheet, the surface of the resin composition layer 11 of the laminate is attached to the peeling surface of the other release sheet, and a release sheet can be obtained. / Resin composition layer 11 / Resin sheet 1 composed of other release sheets. At this time, at least one of the release sheets may be peeled off as a process material, and the resin composition layer 11 may be protected during use until sealing.

When the resin composition layer 11 is obtained by laminating a plurality of layers, the resin composition layer obtained by the above method can be used as a unit resin composition layer, and a plurality of layers can be laminated to obtain a resin composition layer 11. . In this case, there is an advantage that a resin composition layer 11 having a relatively large thickness can be obtained in accordance with the amount of the resin layer of the buildup unit.

5. Method of Using Resin Sheet The resin sheet 1 of the present embodiment is used for sealing an electronic component in a method of manufacturing a semiconductor device. For example, after the resin composition layer 11 of the resin sheet 1 is laminated on an electronic component provided on a substrate or a temporary fixing material such as an adhesive sheet, the resin composition layer 11 is cured to form a hardened layer, thereby enabling electronic parts. Sealed.

It is preferable that the resin sheet 1 of the present embodiment is stored in a substantially all or part of a period from the time of manufacture to the time of use. By refrigerating storage, it is possible to prevent the curable resin contained in the resin composition layer 11 from reacting. Further, when the resin composition layer 11 contains a small amount of a plastic solvent, volatilization of the plastic solvent during storage can be suppressed. It is preferred to carry out the refrigerating storage at 15 ° C or lower, preferably at 0 to 12 ° C.

When the resin composition contains a thermosetting resin, the curing is preferably carried out by heating the resin composition layer 11. In this case, the temperature of the heat treatment is preferably 100° C. or more, and particularly preferably 120° C. or more. Further, the temperature is preferably 240 ° C or lower, and particularly preferably 200 ° C or lower. Moreover, it is preferable to set the heat treatment time to 15 minutes or more, and it is preferable to set it as 20 minutes or more. Further, it is preferable to set the time to 300 minutes or less, and it is particularly preferable to set it to 100 minutes or less.

Moreover, it is preferable to harden the resin composition layer 11 by the above-described heating, and to perform it in stages by a plurality of heat treatments. In this case, it is preferable to carry out the heating in two or more steps, in particular, the first heating treatment which is thermally cured at the temperature T1 and the second heating which is thermally cured at a temperature T2 higher than the temperature T1. It is preferred to carry out the two-stage heat treatment for the treatment. At this time, in the first heat treatment, the temperature T1 is preferably 100° C. or higher and 130° C. or lower, and the heat treatment time is preferably 15 minutes or longer and 60 minutes or shorter. Further, in the second heat treatment, the temperature T2 is preferably 150° C. or higher and 220° C. or lower, and the heat treatment time is preferably 30 minutes or longer and 120 minutes or shorter.

When the resin composition contains an energy ray-curable resin, the curing of the resin composition layer 11 may be performed by irradiation with an energy ray, for example, irradiation with ultraviolet rays. When ultraviolet rays are irradiated, the conditions are usually 50 to 500 mW/cm ² and the irradiation amount is about 100 to 2,500 mJ/cm ² . At this time, after the electronic component is laminated by the resin composition layer, a heating step for volatilizing the plastic solvent in the resin composition layer 11 may be performed before or after the curing of the resin composition layer 11.

When the resin sheet 1 of the present embodiment is provided with the release sheet 12 on one surface side of the resin composition layer 11, the release sheet 12 is formed by laminating the resin composition layer 11 after the electronic component, and the resin composition layer 11 can be formed. The resin composition layer 11 is peeled off before curing, or may be peeled off from the formed hardened layer after the resin composition layer 11 is cured. When the resin sheet 1 of the present embodiment is provided with a release sheet on both surfaces of the resin composition layer 11, a release sheet can be peeled off, and the exposed area of the exposed resin composition layer 11 can be layered on the electronic component, and other release sheets can be removed. It is peeled off in any case before and after hardening of the resin composition layer 11.

The method for producing a semiconductor device described above preferably includes a step of contacting at least a part of the surface of the cured layer obtained by curing the resin composition layer 11 with an alkaline solution. Moreover, it is preferable that the method of manufacturing the semiconductor device includes a step of performing a plating treatment on at least a part of the surface of the cured layer obtained by curing the resin composition layer 11.

An example of a production method including the step of contacting the alkaline solution and the step of performing the plating treatment described above is a method of manufacturing a component-embedded substrate as a semiconductor device. In the method of manufacturing the component-embedded substrate, for example, first, after the resin component layer 11 of the resin sheet 1 is laminated on the electronic component provided on the substrate, the resin composition layer 11 is cured to form a hardened layer. When the peeling sheet 12 is laminated on the hardened layer, the peeling sheet 12 is peeled off, and then formed from the surface of the hardened layer opposite to the electronic component, to the interface between the hardened layer and the electronic component, or to the hardened layer. There are holes in the surface of the side of the electronic component. Next, as a step of bringing the alkaline solution into contact with the above, the hardened layer in which the pores are formed and the layered body of the electronic component and the substrate are brought into contact with the alkaline solution. By this treatment, the slag generated at the time of forming the cavities is removed from the inside of the cavities (excluding the slag treatment). Next, as the plating treatment step described above, wiring is formed. Specifically, the surface of the hardened layer in which the holes are formed is subjected to a plating treatment using copper metal, and after the metal is buried in the holes, the unnecessary portions of the metal are removed by etching or the like. Wiring can be formed in the form of a residual metal piece. Subsequently, a multilayer substrate is formed on both surfaces of the hardened layer by a build up method or the like to obtain a part-embedded substrate.

In the resin sheet 1 of the present embodiment, when the resin composition contains a polyvinyl acetal resin and the step of contacting the alkaline solution is carried out, the hardened layer obtained by curing the resin composition layer 11 is inorganic. The matrix components present around the filler are not readily soluble in the alkaline solution. On the other hand, since the inorganic filler is appropriately detached from the hardened layer into the alkaline solution, the surface of the hardened layer has minute irregularities due to minute voids and residual matrix generated by the inorganic filler being detached. Further, when the step of contacting the alkaline solution is carried out, and then the step of performing the above-described plating treatment, the plating and anchoring effect on the surface of the hardened layer on which the fine unevenness is formed can be satisfactorily exhibited, so that it has excellent plating adhesion in the hardened layer. As a result, it is possible to manufacture a semiconductor device in which wiring is adhered to the surface of the cured layer.

The electronic component is not particularly limited as long as it is an electronic component to be sealed, and examples thereof include a semiconductor wafer and a capacitor. Further, examples of the semiconductor device to be manufactured include a component-embedded substrate, a semiconductor package, and the like, and the component-embedded substrate is particularly preferable.

The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, the respective elements disclosed in the above embodiments are intended to include all design changes and equivalents belonging to the technical scope of the invention. [Examples]

Hereinafter, the present invention will be described in more detail by explaining examples, test examples, and the like, but the present invention is not limited by the following test examples and the like.

[Example 1 and Comparative Examples 1 and 2] The constituent components shown in Table 1 were mixed, and diluted with methyl ethyl ketone to obtain a coating liquid having a resin composition having a solid content concentration shown in Table 1. The coating liquid was applied to a peeling surface of a release film (manufactured by LINTEC Co., Ltd., product name "PET38AL-5*") which was subjected to a polyfluorene stripping treatment using a knife coater under the following conditions, and The obtained coating film was dried under the following conditions to form a resin composition layer. Then, the peeling area layer of the second release film (manufactured by LINTEC Co., Ltd., product name "SP-PET381031") was peeled off from the surface of the resin composition layer which was not in contact with the release film, and the resin composition layer and the two sheets were peeled off. A resin sheet composed of a sheet. Moreover, as described later, the inorganic filler is blended in the coating liquid of the resin composition in a state of being dispersed in cyclohexanone as a dispersion medium. The cyclohexanone also remains in the resin sheet after forming the resin sheet. Here, the amount of the inorganic filler in Table 1 reflects only the content of the inorganic filler, and does not reflect the content of the above cyclohexanone. Further, Table 1 also shows the viscosity of the coating liquid measured by a viscometer (manufactured by Anton Paar Co., Ltd., product name "Rheometer MCR302"). <Coating conditions using a knife coater> Coating speed: 0.6 m/min Coating gap: 700 μm <Drying conditions> Drying temperature: 50 ° C → 70 ° C → 90 ° C → 100 ° C Drying time: for each temperature, 3 Minute 20 seconds

Here, Table 1 shows the details of the constituent components as follows. [thermosetting resin] BisA type epoxy resin: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "YL980") Biphenyl type epoxy resin: biphenyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) , product name "NC-3000-L") Naphthalene type epoxy resin: Naphthalene type epoxy resin (made by DIC company, product name "HP-6000") Biphenyl type phenol resin: Biphenyl type phenol resin (Mingwa Chemical Co., Ltd. Manufactured product name "MEHC-7851-SS") [film-forming resin] Polyvinyl acetal resin: polyvinyl acetal resin (product name "BX-5" manufactured by Sekisui Chemical Co., Ltd., weight average molecular weight: 130,000 BisA type phenoxy resin: bisphenol A type phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "YX7200B35", weight average molecular weight: 30,000) Acrylic resin: acrylate copolymer (manufactured by NAGASE CHEMTEX Co., Ltd., product name) SG-P3", weight average molecular weight: 130,000) [Curing catalyst] Imidazole-based thermosetting catalyst: 2-ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd., product name "2E4MZ") [Inorganic filler] Treatment of cerium oxide filler by epoxy decane: cerium oxide filler (made by ADMATECHS, product name) "SO-C2", average particle diameter: 0.5 μm, maximum particle diameter: 2 μm, shape: spherical shape, and 3-glycidoxypropyltrimethoxydecane (manufactured by Shin-Etsu Chemical Co., Ltd., product name "K BM"-403", minimum coated area: 330 m ² /g) Surface-treated material. Further, cyclohexanone is blended in a dispersion state as a dispersion medium in a coating liquid of a resin composition.

[Test Example 1] (surface observation) After the surface on the side of the resin composition layer of the resin sheet produced in the examples and the comparative examples was bonded to a copper foil laminate, the release sheet was peeled off from the resin composition layer. Next, the resin composition layer was heated at 100 ° C for 60 minutes, and further cured by heating at 170 ° C for 60 minutes to form a hardened layer. The layered body of the obtained hardened layer and the copper foil laminated plate was made into a sodium hydroxide solution containing potassium permanganate as an alkaline solution (made by Okuno Pharmaceutical Co., Ltd., product name "OPC-1200" 35 ml of water 315 ml After diluting, potassium permanganate was added, and the potassium permanganate concentration was 0.32 mol/L; hereinafter referred to as "alkaline solution (1)"), it was immersed at 80 ° C for 15 minutes. The surface of the sample for measurement after immersion was imaged under the conditions of an acceleration voltage of 5 kV or 10 kV, an inclination angle of 45 degrees, and a magnification of 10,000 times using a scanning electron microscope (product name "S-4700" manufactured by Hitachi, Ltd.). The obtained image is displayed in the second to fourth figures. Here, each is shown below, FIG. 2 is an image of Example 1, FIG. 3 is an image of Comparative Example 1, and FIG. 4 is an image of Comparative Example 2.

According to the images shown in Figs. 2 and 3, on the surface of the cured layer of Example 1 and Comparative Example 1, there were voids in which a plurality of inorganic fillers were separated from the hardened layer. Therefore, it has been found that when the hardened layer formed by using the resin sheets of the first embodiment and the comparative example 1 is treated with an alkaline solution, the inorganic filler is appropriately removed, and on the other hand, the substrate filled with the inorganic filler is not Dissolved to an alkaline solution and remained substantially directly.

On the other hand, according to the image shown in Fig. 4, many inorganic fillers were present on the surface of the hardened layer of Comparative Example 2, and on the other hand, the above-mentioned matrix was hardly found. Therefore, it was found that the hardened layer formed by using the resin sheet of Comparative Example 2 was eluted to an alkaline solution in a state in which the inorganic filler remained.

[Test Example 2] (Measurement of Thickness of Resin Composition Layer) The thickness of the resin sheet produced in the examples and the comparative examples was measured using a constant pressure thickness measuring device (product name "PG-02J" manufactured by Teclock Co., Ltd.). The measured value was subtracted from the thickness of the peeled film to calculate the thickness (μm) of the resin composition layer. The results are shown in Table 1.

[Test Example 3] (Evaluation of Electroplating Peeling) The surface of the resin sheet layer of the resin sheet produced in the examples and the comparative examples was placed at 90 ° C using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name "V130"). On the one side of the core material (manufactured by Hitachi Chemical Co., Ltd., product name "MCL-E-679FG"), the release sheet was peeled off from the resin composition layer. Next, after heating at 100 ° C for 60 minutes, the resin composition layer was further thermally cured by heating at 180 ° C for 60 minutes. Thereby, a laminated body composed of a core material and a hardened layer obtained by curing the resin composition layer is obtained.

The laminate obtained by mixing the glycol ether solvent and ethylene glycol monobutyl ether at a ratio of 2:1 (manufactured by Okuno Pharmaceutical Co., Ltd., product name "OPC-1080 Conditioner") After immersing at 60 ° C for 5 minutes, the desmear treatment was carried out by immersing the above alkaline solution (1) as a roughening solution at 80 ° C for 5 minutes.

Then, the laminate was immersed in a palladium/tin colloid catalyst solution (product name "OPC50 Inducer M" manufactured by Okuno Pharmaceutical Co., Ltd.) at 40 ° C for 6 minutes, and then activated in a solution (manufactured by Okuno Pharmaceutical Co., Ltd.). The product name "OPC-150 Cryster RW" was immersed at room temperature for 5 minutes, and then immersed in an electroless copper plating solution (ATS Add Kappa - IW, manufactured by Okuno Pharmaceutical Co., Ltd.) at room temperature. Electroless copper plating was performed on the above laminated body in minutes. Thereby, a plating layer of copper having a thickness of 1 μm was formed. Subsequently, the laminated body on which the plating layer was formed was subjected to annealing treatment by being left in an environment of 150 ° C for 30 minutes.

After the annealing treatment, the laminate was subjected to a current density of 1 A/dm ² in an electrolytic solution (copper sulfate concentration: 200 g/L, sulfuric acid concentration: 50 g/L, chloride ion concentration: 50 mg/L). Electrolytic copper plating. Thereby, the final thickness of the plating layer was 30 μm. Next, the laminate having the plated layer was subjected to an annealing treatment by being left in an environment of 190 ° C for 60 minutes.

The laminate having a plating layer having a thickness of 30 μm was formed, and it was visually confirmed whether or not the plating layer was peeled off from the hardened layer. The results are shown in Table 1.

[Test Example 4] (Measurement of Peeling Strength of Electroplating) The laminate of the plating layer having a thickness of 30 μm formed in Example 1 and Comparative Example 1 was obtained by the peeling of the plating in Test Example 3. The plated layer on the contact-hardened layer side was hardened by the universal tensile tester (product name "AUTOGRAPH AG-IS" manufactured by Shimadzu Corporation) at a peeling angle of 90 ∘ and a peeling speed of 50 mm/min. The layer was peeled off and the peel strength (N/10 mm) at this time was measured. The results are shown in Table 1.

[Table 1]

As described above, the resin sheet obtained in the examples has a thickness of the resin composition layer which is sufficiently thick and has excellent plating adhesion in the hardened layer. [Industrial availability]

The resin sheet of the present invention can be suitably used for producing a semiconductor device called a part-embedded substrate.

1‧‧‧resin sheet

11‧‧‧ resin composition layer

12‧‧‧ peeling sheet

Fig. 1 is a cross-sectional view showing a resin sheet according to an embodiment of the present invention. Fig. 2 is an image of a scanning electron microscope of the surface of the hardened layer of Example 1. Fig. 3 is an image of a scanning electron microscope of the surface of the hardened layer of Comparative Example 1. Fig. 4 is an image of a scanning electron microscope of the surface of the hardened layer of Comparative Example 2.

Claims (11)

A resin sheet used in a method of manufacturing a semiconductor device for sealing a resin sheet of an electronic component, wherein the resin sheet has a curable resin composition layer, and the resin composition layer contains a curable resin. The resin composition of the film resin and the inorganic filler is formed, and the film forming resin contains a polyvinyl acetal resin. The resin sheet according to claim 1, wherein the resin composition layer has a thickness of 100 μm or more and 300 μm or less. The resin sheet according to claim 1, wherein the resin composition layer is composed of a single layer. The resin sheet according to the first aspect of the invention, wherein the resin composition layer is formed by laminating two or more unit resin compositions, and each of the unit resin composition layers has a thickness of 100 μm or more. The resin sheet according to claim 1, wherein the inorganic filler is surface-treated with a surface treatment agent having a minimum coating area of less than 550 m ² /g. The resin sheet according to claim 1, wherein the method for producing the semiconductor device includes a step of performing a plating treatment on at least a part of a surface of the hardened layer obtained by curing the resin composition layer. The resin sheet according to claim 1, wherein the method for producing the semiconductor device comprises the step of contacting at least a part of the surface of the hardened layer obtained by curing the resin composition layer with an alkaline solution. The resin sheet according to claim 1, wherein the semiconductor device is a component-embedded substrate. A method for producing a resin sheet, which is a method for producing a resin sheet used for sealing an electronic component in a method of manufacturing a semiconductor device, characterized in that the resin sheet has a curable resin composition layer, and the resin composition layer It is formed of a resin composition containing a curable resin, a film-forming resin, and an inorganic filler, and the film-forming resin contains a polyvinyl acetal resin; and the production method includes coating a coating liquid of the resin composition. And a step of forming a coating film; and forming the resin composition layer by drying the coating film. The method for producing a resin sheet according to claim 9, which comprises forming the coating film by applying the coating liquid of the resin composition once, and drying the coating film to form an application. A resin composition layer composed of a single layer described in the third aspect of the patent, or a unit resin composition layer as described in claim 4 of the patent application. The method for producing a resin sheet according to claim 9, wherein the coating liquid of the resin composition contains a diluent having a boiling point of 130 ° C or higher.