TW201915067A - Resin sheet and method for manufacturing the same in which collapse of a resin composition layer is suppressed and the resin composition performs sealing by following unevenness of the adhered surface - Google Patents

Abstract

A resin sheet (1), which is a resin sheet (1) used for encapsulating electronic components in a manufacturing method of a semiconductor device, wherein the resin sheet 1 comprises a curable resin composition layer (11), and the resin composition layer (11) is formed by a resin composition containing a curable resin; the thickness of the resin composition layer (11) is 100 [mu]m or more and 300 [mu]m or less, and the resin composition layer (11) contains 1.0% by mass or more and 5.0% by mass or less of a plastic solvent which is volatilized by heating. The resin sheet (1) is capable of suppressing a collapse of the resin composition layer, and allowing the resin composition layer to perform sealing by following unevenness of the adhered surface.

Description

Resin sheet and method of producing the same

The present invention relates to a resin sheet used for sealing electronic parts in a method of manufacturing a semiconductor device, and a method of manufacturing the sheet.

Conventionally, in a method of manufacturing a semiconductor device, an electronic component called a semiconductor wafer is sealed by using a resin sheet having a curable resin composition layer. For example, after the resin composition of the resin sheet is laminated on the electronic component provided on the substrate, the resin composition layer is cured to form a hardened layer, thereby sealing the electronic component.

As an example of the above-mentioned resin sheet, Patent Document 1 discloses a resin sheet used in the production of a substrate in which an electronic component is housed (hereinafter referred to as a "part-embedded substrate"). In particular, in the example of the patent document 1, it is disclosed that a predetermined resin is melt-kneaded to prepare a kneaded product, and then the kneaded product is formed into a sheet shape by a flat plate press method to produce a resin sheet (Patent Document 1 of paragraph 0067) ). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2016-219638

[Questions to be solved by the invention]

In the resin sheet, the resin composition layer is brittle according to the composition of the resin composition for forming the resin composition layer, and the resin composition layer is easily broken and broken during storage, transportation, and use, that is, resin composition. The problem of the layer being easily collapsed. When the resin composition layer is broken, the resin sheet is difficult to be used in the production of a semiconductor device, and when such a resin sheet is intentionally used to manufacture a semiconductor device, sealing is not performed satisfactorily and the quality of the obtained semiconductor device is lowered. In addition, when the surface to be adhered to the resin composition layer is formed with irregularities due to electronic components or the like, the resin composition of the resin sheet can be sealed by following the irregularities.

The present invention has been made in view of such a practical situation, and an object of the present invention is to provide a resin sheet capable of suppressing collapse of a resin composition layer and sealing the resin composition layer to follow the unevenness of the surface to be adhered, and the resin sheet. Production method. [Means to solve the problem]

In order to achieve the above object, a first aspect of the invention provides a resin sheet which is a resin sheet for sealing a metal component in a method for producing a semiconductor device, characterized in that the resin sheet has a curable resin composition layer, and the resin The composition layer is formed of a resin composition containing a curable resin, and the thickness of the resin composition layer is 100 μm or more and 300 μm or less, and the resin composition layer is contained in a content of 1.0% by mass or more and 5.0% by mass or less by heating. The volatilizable plastic solvent (Invention 1).

In the resin sheet of the invention (Invention 1), the thickness of the resin composition layer is in the above range, and the resin composition layer contains the plastic solvent (hereinafter referred to simply as "plastic solvent") in the above content, so that the resin The composition layer does not easily collapse, and it is not easy to cause breakage and breakage in the resin composition layer during storage, transportation, and use, and the resin composition layer can be sealed by following the unevenness of the surface to be adhered. From the above, a semiconductor device having excellent quality can be manufactured by using the above resin sheet.

In the above invention (Invention 1), the resin composition layer is preferably composed of a single layer (Invention 2).

In the above invention (Inventions 1 and 2), the resin composition contains a film-forming resin and an inorganic filler, and the film-forming resin preferably contains no resin having an ester bond (Invention 3).

In the above invention (Invention 3), it is preferred that the inorganic filler is surface-treated with a surface treatment agent having a minimum coating area of less than 550 m ² /g (Invention 4).

In the above invention (Inventions 1 to 4), the method for producing a semiconductor device preferably includes a step of performing a plating treatment on at least a part of the surface of the cured layer obtained by curing the resin composition layer (Invention 5).

In the above invention (Inventions 1 to 5), the semiconductor device is preferably a component-embedded substrate (Invention 6).

According to a second aspect of the invention, there is provided a method of producing a resin sheet, wherein the resin sheet comprises a curable resin composition layer, and the resin sheet is a method of producing a resin sheet. The resin composition layer is formed of a resin composition containing a curable resin, and the thickness of the resin composition layer is 100 μm or more and 300 μm or less, and the resin composition layer is contained in an amount of 1.0% by mass or more and 5.0% by mass or less. a plastic solvent which is volatilized by heating; the manufacturing method includes a step of applying a coating liquid of the resin composition to form a coating film; and a step of forming the resin composition layer by drying the coating film (Invention 7) ).

In the above invention (Invention 7), the coating film is formed by coating the coating liquid of the resin composition once, and the coating film is dried to form a single layer of the above (Invention 2). The resin composition layer formed is preferable (Invention 8).

In the above invention (Inventions 7 and 8), the coating liquid of the resin composition preferably contains a diluent having a boiling point of 130 ° C or higher (Invention 9). [Effect of the invention]

In the resin sheet of the present invention, it is possible to suppress the collapse of the resin composition layer during storage, transportation, and use, and to seal the resin composition layer following the unevenness of the surface to be adhered.

Form for implementing the invention

Hereinafter, embodiments of the present invention will be described. [Resin Sheet 1] Fig. 1 is a cross-sectional view showing the resin sheet 1 of the present embodiment. As shown in FIG. 1, the resin sheet 1 of the present embodiment includes a resin composition layer 11 and a release sheet 12 laminated on at least one surface of the resin composition layer 11. Further, another peeling sheet may be further laminated on the opposite side of the resin composition layer 11 from the release sheet 12. However, the release sheet 12 and the additional release sheet may also be omitted.

1. Resin composition layer In the resin sheet 1 of the present embodiment, the resin composition layer 11 has curability. Here, the term "curable property" means that the resin composition layer 11 can be cured by heating or the like. That is, the resin composition layer 11 is not cured in a state in which the resin sheet 1 is formed. The resin composition layer 11 is preferably thermosetting. By this means, even if the thickness of the resin composition layer 11 is large or a coloring agent is contained, the resin composition layer 11 can be easily irradiated by irradiation with energy rays, and the resin composition layer 11 can be made. Hardened well.

In the resin sheet 1 of the present embodiment, the resin composition layer 11 is formed of a resin composition containing a curable resin. In the resin sheet 1 of the present embodiment, the thickness of the resin composition layer 11 is 100 μm or more and 300 μm or less, and the resin composition layer 11 contains a plastic solvent in an amount of 1.0% by mass or more and 5.0% by mass or less.

In the resin sheet 1 of the present embodiment, the resin composition layer 11 contains the plastic solvent in the above-mentioned content, and the thickness of the resin composition layer 11 is sufficiently thick as described above, even when the resin composition layer 11 is attached. When the unevenness is present, the resin composition layer 11 can also be sealed while following the unevenness.

As described above, by using the resin sheet 1 of the present embodiment, a semiconductor device having excellent quality can be manufactured.

The resin composition of the present embodiment contains at least one of a film-forming resin, an inorganic filler, and a curing catalyst, as described above.

(1) Curable resin The resin sheet 1 of the present embodiment can contain the curable resin, and the resin composition layer 11 formed of the resin composition can be satisfactorily cured, and the electronic component can be firmly solidified. seal. When the thickness of the resin composition layer 11 is large or the coloring agent is contained and the resin composition layer 11 is not easily irradiated with an energy ray, the resin composition layer 11 can be satisfactorily cured. From the viewpoint of curing, a thermosetting resin is preferred. In addition, since the plastic solvent in the resin composition layer 11 is easily volatilized by the heating for curing the thermosetting resin, the cured layer formed by curing the resin composition layer 11 does not contain a plastic solvent. Therefore, the semiconductor device including the cured layer produced by using the resin sheet 1 of the present embodiment does not cause adverse effects due to the plastic solvent. The thermosetting resin is not particularly limited as long as it can cure the resin composition layer 11. For example, a resin which is usually contained in the sealing material can be used. Specific examples thereof include an epoxy resin, a phenol resin, a maleimide compound, a melamine resin, a urea resin, a benzoxazine compound, an acid anhydride compound, an amine compound, and an active ester resin. Cyanate-based resin or the like can be used alone or in combination of two or more. Among these, it is preferred to use an epoxy resin, a phenol resin, or a mixture thereof, and it is preferred to use at least an epoxy resin. In addition, a phenoxy resin, an acrylic resin, or the like has a high molecular weight body and an epoxy group in a side chain, and the epoxy gene is thermally reacted and can participate in the hardening of the resin composition layer 11. In the resin sheet 1 of the present embodiment, a high molecular weight body and a function of forming the resin composition layer 11 into a sheet shape are regarded as a film-forming resin. Such a high molecular weight body usually has a weight average molecular weight of 25,000 or more.

Epoxy resins are generally three-dimensionally networked upon heating and have the property of forming a strong cured product. As such an epoxy resin, various conventional epoxy resins can be used, and specific examples thereof include phenols such as bisphenol A, bisphenol F, resorcin, phenyl novolac, and cresol novolak. a propylene glycol ether; a glycidyl ether of an alcohol such as butanediol, polyethylene glycol or polypropylene glycol; a ring of a carboxylic acid such as phthalic acid, isophthalic acid or tetrahydrophthalic acid; Oloxypropyl ether; aniline isocyanurate or the like; epoxy propyl-type or alkoxy-epoxypropyl type epoxy resin obtained by using an epoxy propylene-substituted active hydrogen bonded to a nitrogen atom; Vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5,5- A so-called alicyclic epoxide in which an epoxy group is formed by oxidizing a carbon-carbon double bond in the molecule, for example, by snail (3,4-epoxy)cyclohexane-m-dioxane. Further, an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton or the like can also be used. These epoxy resins can be used alone or in combination of two or more. Among the above epoxy resins, a epoxidized propyl ether (bisphenol A type epoxy resin) using bisphenol A, an epoxy resin having a biphenyl skeleton (biphenyl type epoxy resin), and a ring having a naphthalene skeleton are used. An oxygen resin (naphthalene type epoxy resin) or the like is preferred.

Examples of the phenol resin include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane phenol, and tetra. Phenol, novolak type phenol, cresol novolac resin, phenol having a biphenyl aralkyl skeleton (biphenyl type phenol), etc., among which biphenyl type phenol is preferably used. These phenol resins can be used alone or in combination of two or more. Further, when an epoxy resin is used as the thermosetting resin, it is preferred to use a phenol resin in combination from the viewpoint of reactivity with an epoxy resin and the like.

The content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and more preferably 20% by mass or more. Further, the content is preferably 60% by mass or less, more preferably 50% by mass or less, and still more preferably 40% by mass or less. When the content is 10% by mass or more, the resin composition layer 11 is more sufficiently cured, and the electronic component can be more firmly sealed. In addition, when the content is 60% by mass or less, it is possible to further suppress the resin composition layer 11 from being hardened in an unexpected stage and to be more excellent in storage stability. In addition, when the resin composition is diluted into a coating liquid and applied and dried to form a sheet, the content of the thermosetting resin in the resin composition is the amount after removing the volatile component in the drying step. The same is true for the content of the other constituent components of the resin composition.

An energy ray curable resin can also be used as the curable resin. Examples of the energy ray-curable resin include a resin which is cured by ultraviolet rays, and examples of the resin which is cured by ultraviolet rays include an acryl fluorenyl group, a methacryl fluorenyl group or the like in the molecule. Reactive double bond resin. When the energy ray-curable resin is used, the resin composition preferably further contains a photopolymerization initiator. In the resin sheet 1 of the present embodiment, the resin composition may contain both a thermosetting resin and an energy ray curable resin.

(2) Film-forming resin In the resin sheet 1 of the present embodiment, the resin composition preferably contains a film-forming resin. Thereby, the resin composition layer 11 is easily formed into a sheet shape.

The film-forming resin preferably contains a resin having substantially no ester bond. The resin sheet 1 of the present embodiment is a method for producing a semiconductor device which is suitable for a step of performing treatment using an alkaline solution and a step of performing a plating treatment, and uses a resin having substantially no ester bond as a film-forming resin. It is better. As an example of such a manufacturing method, the manufacturing method of the component built-in board|substrate is mentioned. In the method of manufacturing the component-embedded substrate, after the resin composition layer 11 of the resin sheet 1 is laminated on the electronic component, the resin composition layer 11 is cured to form a hardened layer, and the electronic component is sealed. Subsequently, a hole through which the hardened layer penetrates is formed, and wiring through which the electronic component is electrically connected to the outside is formed. When the pores are formed, a residue of a resin constituting the hardened layer (hereinafter referred to as "slag") is generated, and the slag remains in the pores. When the wiring is formed in a state in which the dross remains in the hole, since the problem of poor conduction of the wiring is likely to occur, the process of removing the generated dross is performed after the hole is formed and the wiring is formed (hereinafter referred to as " In the case of slag treatment". As one of the methods for such desmear treatment, there is a method of exposing a treatment target to an alkaline solution, which is capable of dissolving the residue in an alkaline solution and removing it.

Here, the resin which does not substantially have an ester bond is not easily eluted into an alkaline solution. Therefore, the resin sheet 1 of the present embodiment having the resin composition layer 11 formed using a resin composition of a resin having substantially no ester bond is used in the method for producing a semiconductor device described above, and an alkaline solution is used. In the desmear treatment, the components in the hardened layer are not easily eluted into the alkaline solution. Further, the resin composition contains an inorganic filler to be described later, and when the hardened layer contains the inorganic filler, the inorganic filler is appropriately removed from the hardened layer into the alkaline solution. Thus, the matrix portion around the inorganic filler does not elute into the alkaline solution and remains well, while the inorganic filler is moderately detached, and minute irregularities are present on the surface of the hardened layer. After the slag treatment, the surface of the hardened layer having the fine unevenness is subsequently subjected to a plating treatment, whereby the anchoring effect of the plating on the surface can be satisfactorily exhibited and the plating has excellent adhesion in the hardened layer (hereinafter, this effect is obtained). Also known as "plating adhesion enhancement effect"). As a result, it is possible to manufacture a semiconductor device in which wiring is adhered to the surface of the hardened layer.

Examples of the film-forming resin include a polyvinyl acetal resin, a phenoxy resin, an olefin resin, a polyester resin, a polyurethane resin, and a polyester urethane system. A resin, a polyamine-based resin, a polystyrene-based resin, a polyoxyalkylene-based resin, a rubber-based resin, an acrylic resin, or the like can be used alone or in combination of two or more. Examples of the resin having substantially no ester bond include a polyvinyl acetal resin, a phenoxy resin, an olefin resin, a polyurethane resin, a polyamine resin, a polystyrene resin, and a polyalkylene oxide system. Among the resins, rubber-based resins and the like, among them, a polyvinyl acetal resin and a phenoxy resin are preferably used, and a polyvinyl acetal resin is preferably used. When the resin composition contains a polyvinyl acetal resin, the coating liquid of the resin composition has a high viscosity, and by coating the coating liquid, the resin composition layer 11 is easily formed into the aforementioned thickness. . In particular, since the resin composition layer 11 can be formed by one application of the coating liquid, the resin sheet 1 can be produced with high productivity.

Examples of the polyvinyl acetal resin include polyvinyl butyral obtained by reacting polyvinyl alcohol with butyraldehyde, polyvinyl formal obtained by reacting polyvinyl alcohol with formaldehyde, and polyethylene. The polyvinyl acetal acetal obtained by the reaction of the alcohol and the acetaldehyde may be used alone or in combination of two or more. Among these, polyvinyl butyral is preferably used.

The phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, bisphenol A/bisphenol F copolymerization type, bisphenol S type, bisphenol acetophenone type, and novolac type. Type, hydrazine type, dicyclopentadiene type, norbornene type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type, biphenyl type, etc. Among them, it is preferred to use a bisphenol A type phenoxy resin.

The weight average molecular weight of the resin having substantially no ester bond is preferably 25,000 or more, and particularly preferably 50,000 or more. Further, the weight average molecular weight is preferably 600,000 or less, and more preferably 300,000 or less.

The content of the film-forming resin in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more, and still more preferably 5% by mass or more. Further, the content is preferably 30% by mass or less, more preferably 20% by mass or less, and still more preferably 10% by mass or less. When the content is in the above range, the resin composition layer 11 is more easily formed into a sheet shape.

In the hardened layer obtained by curing the resin composition layer 11, the cured product of the curable resin is more resistant to alkali. Therefore, it is preferable that the main component of the film-forming resin which is easily affected by the alkali is a substance which does not substantially have an ester bond, and it is easy to stably exhibit the plating adhesion improving effect. The resin content which does not substantially have an ester bond in the film-forming resin is preferably 75 mass% or more, more preferably 85 mass% or more, and further preferably 92 mass% or more. Further, the content of the resin having substantially no ester bond in the film-forming resin is preferably 100% by mass or less.

Examples of the resin having an ester bond include an acrylic resin, a polyester resin, and a polyester urethane resin. From the viewpoint of improving the effect of improving the plating adhesion, it is preferable to reduce the content of the resin having an ester bond in the film-forming resin, and the mass of the resin having an ester bond is 25 mass with respect to the mass of the entire film-forming resin. % or less is preferably 15% by mass or less, more preferably 8% by mass or less, and the film-forming resin is particularly preferably not contained in a resin having an ester bond.

(3) Inorganic filler In the resin sheet 1 of the present embodiment, the resin composition preferably contains an inorganic filler. Thereby, the hardened layer obtained by hardening the resin composition layer 11 effectively exhibits excellent mechanical strength. Further, when the hardened layer is subjected to desmear treatment using an alkaline solution, the inorganic filler is appropriately removed from the hardened layer, and as a result, the anchoring effect of the plating on the surface of the hardened layer can be favorably exhibited, and the hardened layer becomes Excellent plating adhesion.

Examples of the inorganic filler include cerium oxide, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium citrate, magnesium citrate, calcium oxide, magnesium oxide, and aluminum oxide. a composite oxide of aluminum nitride, aluminum borate whisker, boron nitride, crystalline cerium oxide, amorphous cerium oxide, mullite, cordierite, montmorillonite, As a filler of the material, smectite or the like can be used alone or in combination of two or more. Among these, it is preferred to use a cerium oxide filler.

The shape of the inorganic filler may be any of a granular shape, a needle shape, a plate shape, and an amorphous shape, and among these, a spherical shape is preferred.

The average particle diameter of the inorganic filler is preferably 0.01 μm or more, more preferably 0.1 μm or more, and further preferably 0.3 μm or more. Further, the inorganic filler preferably has an average particle diameter of 3.0 μm or less, and particularly preferably 1.0 μm or less. When the average particle diameter of the inorganic filler is within the above range, the hardened layer obtained by curing the resin composition layer 11 is likely to exhibit mechanical strength efficiently, and the inorganic filler is easily detached from the hardened layer in an alkaline solution. In addition, the average particle diameter of the inorganic filler in the present specification is a value measured by a dynamic light scattering method using a particle size distribution measuring apparatus (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT151").

Further, the inorganic filler preferably has a maximum particle diameter of 0.05 μm or more, and particularly preferably 0.5 μm or more. Further, the maximum particle diameter is preferably 5 μm or less, and particularly preferably 3 μm or less. Since the maximum particle diameter of the inorganic filler is in the above range, the inorganic filler is easily filled into the hardened layer, and the hardened layer has more excellent mechanical strength. In addition, the maximum particle diameter of the inorganic filler in the present specification is a value measured by a dynamic light scattering method using a particle size distribution measuring apparatus (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT 151").

In the resin sheet 1 of the present embodiment, the inorganic filler is preferably subjected to surface treatment using a surface treatment agent. Thereby, the dispersibility and the filling property of the inorganic filler in the resin composition can be improved, and the inorganic filler is easily hardened when the hardened layer obtained by hardening the resin composition layer 11 is subjected to desmear treatment using an alkaline solution. The layers are moderately separated. In particular, the minimum coating area of the surface treating agent is less than 550m ² / g preferably to 520m ² / g or less is particularly preferred, and further to 450m ² / g or less is preferable. Further, the minimum coating area of the surface treatment agent is preferably 100 m ² /g or more, particularly preferably 200 m ² /g or more, and more preferably 300 m ² /g or more. When the minimum coating area of the surface treatment agent is less than 550 m ² /g, the inorganic filler is easily detached from the hardened layer obtained by curing the resin composition layer 11, and as a result, it is easy to have excellent plating adhesion in the hardened layer. Moreover, the inorganic filler has more excellent dispersibility and filling property in the resin composition by the minimum coating area of the surface treatment agent of 100 m ² /g or more.

Examples of the surface treatment agent include epoxy decane, vinyl decane, and the like. Among these, it is preferred to use epoxy decane. Specific examples of the epoxy decane include 3-glycidoxypropyltriethoxydecane, 3-glycidoxypropyltrimethoxydecane, and 3-epoxypropoxypropane. Methyldimethoxydecane, 3-glycidoxypropylmethyldiethoxydecane, 2-(3,4 epoxycyclohexyl)ethyltrimethoxydecane, and the like. Among these, from the viewpoint of effectively promoting the detachment of the inorganic filler, 3-glycidoxypropyltrimethoxydecane is preferably used.

Specific examples of the vinyl decane include vinyl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane, vinyl trichloro decane, and vinyl ginseng (2-A). Oxyethoxyethoxy) decane, and the like. Among these, vinyl trimethoxy decane is preferably used from the viewpoint of effectively promoting the detachment of the inorganic filler.

The method of surface-treating the inorganic filler using a surface treatment agent is not specifically limited, and can be performed using a normal method. For example, the untreated inorganic filler can be stirred at a normal temperature by using a mixer, and after the surface treatment agent is sprayed, the surface treatment can be carried out by further stirring for a predetermined time. The stirring time after the spraying is preferably, for example, 5 minutes or longer and 15 minutes or shorter. Further, in order to sufficiently adhere the surface treatment agent to the inorganic filler, after the above operation, the inorganic filler may be taken out from the mixer and left for one day or more, and may be subjected to a slight heat treatment. Further, in order to uniformly perform the surface treatment, after the surface treatment agent is sprayed, the above-mentioned stirring may be further carried out by further adding an organic solvent. As the mixer, a conventional product can be used, and examples thereof include a blender of a V blender, a closed blender, a bubble cone blender, a Scherrer mixer, and a concrete mixer. Mixers, ball mills, etc., etc., among which it is preferred to use a mixer.

The content of the inorganic filler in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more. Further, the content is preferably 90% by mass or less, particularly preferably 85% by mass or less, and more preferably 80% by mass or less. The hardened layer obtained by hardening the resin composition layer 11 by the inorganic filler content of 40% by mass or more has better mechanical strength. In addition, when the content of the inorganic filler is 90% by mass or less, the resin composition layer 11 is easily cured, and the resin sheet 1 can be used to produce a semiconductor device having better quality. In the resin sheet, when the resin composition layer is formed of a resin composition containing a large amount of an inorganic filler in the above range, the resin composition layer becomes brittle, and is easy to store, transport, and use. Collapsed. However, in the resin sheet 1 of the present embodiment, the thickness of the resin composition layer 11 is in the above range, and the resin composition layer contains the plastic solvent in the above-mentioned content, and the resin composition can be suppressed even when the content of the inorganic filler is within the above range. The collapse of the layer 11 is broken.

In addition, when the inorganic filler is surface-treated with a surface treatment agent, among the inorganic fillers contained in the resin composition, the ratio of the inorganic filler surface-treated with the surface treatment agent is preferably 70% by mass or more, and is preferably 85. More than % by mass is particularly good. When the ratio is in the above range, the inorganic filler can be favorably promoted to be detached from the hardened layer and the hardened layer has excellent mechanical strength.

(4) Curing catalyst In the resin sheet 1 of the present embodiment, when the resin composition contains a thermosetting resin, it is preferable to further contain a curing catalyst. Thereby, the hardening reaction of the thermosetting resin can be efficiently performed, and the resin composition layer 11 can be favorably cured. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2. -methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2- Methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl 4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-bis(hydroxymethyl)imidazole, etc., from the viewpoint of reactivity, using 2-ethyl-4-methyl Imidazole is preferred.

Specific examples of the amine-based curing catalyst include a triazine compound such as 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-5-triazine. A tertiary amine compound of 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), triethylenediamine, benzyldimethylamine, triethanolamine or the like. In particular, 2,4-diamino-6-[2,-methylimidazolyl-(1')]ethyl-s-triazine is preferred.

Further, specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tris(p-methylphenyl)phosphine, and tris(nonylphenyl)phosphine.

The curing catalyst may be used singly or in combination of two or more.

The content of the curing catalyst in the resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more. Further, the content is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, and still more preferably 1.0% by mass or less. When the content is in the above range, the resin composition layer 11 can be cured more satisfactorily.

(5) Plasticity solvent In the resin sheet 1 of the present embodiment, the resin composition layer 11 contains a plastic solvent in an amount of 1.0% by mass or more. When the coating liquid of the resin composition is applied to form a coating film and the coating film is dried to form the resin composition layer 11, the coating film remains in the resin composition layer 11 after drying. In the middle of things. By including the plastic solvent in the above-mentioned content, the resin composition layer 11 can improve the brittleness of the resin composition layer 11 and the resin composition layer 11 is not easily broken, and can be stored, transported, used, etc. The occurrence of breakage and breakage in the resin composition layer 11 is suppressed. Further, since the resin composition layer 11 has a predetermined flexibility, the resin composition layer 11 is used to sufficiently cover the periphery of the electronic component, and the hardened layer and the electronic component which are hardened by the resin composition layer 11 can be satisfactorily suppressed. A gap is formed between them. From such a viewpoint, the content of the plastic solvent of the resin composition layer 11 is preferably 1.2% by mass or more, and particularly preferably 1.5% by mass or more. On the other hand, the upper limit of the plastic solvent content in the resin composition layer 11 is 5.0% by mass or less, preferably 4.5% by mass or less, and particularly preferably 4.0% by mass or less. When the content of the plastic solvent in the resin composition layer 11 is more than 5.0% by mass, it is difficult to form the resin composition layer 11 into a sheet shape. Moreover, the method of measuring the plastic solvent content of the resin composition layer 11 is as described in the test examples described later.

The plastic solvent is not limited as long as the brittleness of the resin composition layer 11 can be sufficiently improved. As described above, the resin composition layer 11 is preferably formed of a resin composition containing a thermosetting resin. In this case, when the electronic component is sealed, the resin composition layer 11 can be cured by heating. Here, since the plastic solvent is volatilized by heating, it can be sufficiently removed from the formed hardened layer by the above heating. Moreover, in the stage before application to the electronic component at the time of storage and transportation, the plastic solvent is preferably a substance which is not easily volatilized at normal temperature in order to suppress excessive discharge from the resin composition layer 11. Further, as described later, when the resin composition is diluted with a solvent to prepare a coating liquid, and the resin composition layer 11 is formed by using the coating liquid, it is preferred that the plastic solvent is used as a solvent for preparing the coating liquid. .

The boiling point of the plastic solvent is preferably 130 ° C or higher, more preferably 135 ° C or higher, and further preferably 140 ° C or higher. Further, the boiling point of the plastic solvent is preferably 210 ° C or lower, more preferably 190 ° C or lower, and further preferably 170 ° C or lower. When the coating film obtained by applying the coating liquid containing the plastic solvent is dried at a boiling point of the plastic solvent of 130 ° C or higher, the plastic solvent is likely to remain in the coating film appropriately, and the resin composition layer can be formed. The plastic solvent content in 11 was easily adjusted to the aforementioned value. In addition, during the storage and transportation of the resin sheet 1, it is possible to effectively suppress the release of the plastic solvent from the resin composition layer 11, and it is easy to maintain the plastic solvent content as adjusted as described above. On the other hand, when the boiling point of the plastic solvent is 210 ° C or less and the resin composition layer 11 is cured by heating, the plastic solvent is easily volatilized by the heating, and the plastic solvent in the hardened layer is easily obtained. The content is sufficiently reduced.

Specific examples of the plastic solvent include cyclohexanone (boiling point: 155.6 ° C), dimethylformamide (boiling point: 153 ° C), dimethyl hydrazine (boiling point: 189.0 ° C), and ethylene glycol. An organic solvent such as an ether (Serub) (boiling point: 120 to 310 ° C) or o-xylene (boiling point: 144.4 ° C).

(6) Other components The resin composition of the present embodiment may further contain a plasticizer, a stabilizer, an adhesion-imparting agent, a colorant, a coupling agent, an antistatic agent, an antioxidant, and the like.

(7) Configuration of Resin Composition Layer The thickness of the resin composition layer 11 is preferably 100 μm or more, more preferably 105 μm or more, and still more preferably 110 μm or more. When the thickness of the resin composition layer 11 is 100 μm or more, the resin composition layer 11 contains a plastic solvent in the above-mentioned content, and the resin composition layer 11 does not easily collapse, and has excellent followability to electronic parts and the like. . On the other hand, the thickness of the resin composition layer 11 is 300 μm or less, preferably 250 μm or less, and particularly preferably 200 μm or less. When the thickness of the resin composition layer 11 is more than 300 μm, it is difficult to reduce the size and thickness of the semiconductor device manufactured by using the resin sheet 1 of the present embodiment. Further, when the resin composition layer 11 is formed by laminating two or more resin compositions, the thickness of the resin composition layer 11 is the total thickness of all the resin composition layers 11.

In the resin sheet 1 of the present embodiment, the resin composition layer 11 is preferably composed of a single layer. Here, the term "consisting of a single layer" means that the resin composition layer 11 is not formed by laminating a plurality of unit resin compositions, but is composed of a single unit resin composition layer. In particular, when the coating liquid of the resin composition is applied to form a coating film, and the coating film is dried to form the resin composition layer 11, the coating film is applied once by the coating liquid. form. In the resin sheet 1 of the present embodiment, when the resin composition layer is formed by laminating a plurality of layers, the resin composition layer 11 is composed of a single unit resin composition layer, and is excellent in productivity. . Further, when a plurality of unit resin compositions are laminated, there is a possibility that foreign matter and bubbles are mixed during lamination, but the resin composition layer 11 is composed of a single layer, and the defects caused by such a phenomenon can be avoided.

2. Release Sheet The resin sheet 1 of the present embodiment may further include a release sheet 12. The structure of the release sheet 12 is arbitrary, and examples thereof include a polyester film such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate, polypropylene, polyethylene, or the like. A plastic film such as a polyolefin film. The peeling surface (the surface in contact with the resin composition layer 11 of the resin sheet 1) is preferably subjected to a release treatment. The release agent used for the release treatment may, for example, be a release agent such as a polyfluorene-based, fluorine-based or long-chain alkyl group.

The thickness of the release sheet 12 is not particularly limited, and is usually 20 μm or more and 250 μm or less.

3. Method for Producing Resin Sheet The resin sheet 1 of the present embodiment is preferably produced by forming the resin composition layer 11 by using the coating liquid of the resin composition. In particular, it is preferable that the resin composition layer 11 is coated with the coating liquid to form a coating film, and the coating is dried. For example, a coating liquid containing the resin composition and a solvent further contained as needed is prepared, and the coating liquid is applied to the release surface of the release sheet 12 to form a coating film, and the coating film is dried to produce a coating film. The resin sheet 1 is preferred.

As the diluent for preparing the coating liquid, it is preferred to use a plastic solvent contained in the resin composition layer 11 as a diluent. At this time, when the coating film is dried, it is preferable to prepare the plastic solvent in the coating film, and the obtained resin composition layer 11 contains the plastic solvent of the above content. In addition to the above-mentioned organic solvent suitable for the plastic solvent, preferred examples of the organic solvent to be used as the diluent include cyclohexane (boiling point: 80.7 ° C), toluene (boiling point: 110.6 ° C), and ethyl acetate. (boiling point: 77.1 ° C), methyl ethyl ketone (boiling point: 79.6 ° C), isopropyl alcohol (boiling point: 82.6 ° C), and the like. The diluent may be used in combination of two or more kinds. The release sheet 12 can be peeled off as a process material, and the resin composition layer 11 can be protected during use until sealing.

As a condition for drying the formed coating film, the drying temperature is preferably 40° C. or higher, more preferably 45° C. or higher, and further preferably 50° C. or higher. Further, the drying temperature is preferably 130 ° C or lower, more preferably 125 ° C or lower, and further preferably 115 ° C or lower. The drying time is preferably 8 minutes or longer, more preferably 10 minutes or longer, and further preferably 11 minutes or longer. Further, the drying time is preferably 20 minutes or less, and particularly preferably 15 minutes or less. By drying under such conditions, the content of the plastic solvent in the resin composition layer 11 is easily adjusted to the above value. Further, the drying of the coating film may be carried out while changing the drying temperature. For example, the drying time is set to about 3 minutes to 4 minutes for each temperature, and the drying temperature is set to 50° C., 70° C., 90° C., and 100° C. It is better to increase the order and dry.

In addition, the resin sheet 1 of the present embodiment is formed by applying a coating liquid of the resin composition once to form a coating film, and drying the coating film to form a resin composition composed of a single layer. Layer 11 is preferably manufactured. When the resin composition layer 11 is formed into a single layer, a coating film is formed by one application, and the resin composition layer 11 is formed by drying the coating film, and the coating film and the resin are combined with respect to repeated coating. When the plurality of layers are laminated on the material layer 11 or the like, the resin sheet 1 can be produced with high productivity. In addition, when the resin composition contains a polyvinyl acetal resin as a film-forming resin, since the coating liquid has a high viscosity, the coating film is formed by the above-described single application, and the coating film is easily formed. A thicker resin composition layer 11.

Examples of the coating include a doctor blade coating method, a die coating method, a bar coating method, a gravure coating method, a blade coating method, and a roll coating method, and the like. good. When these coating methods are used, the resin composition layer 11 having the above-described thickness is easily formed.

When coating by a doctor blade coating method, the coating speed is preferably 0.3 m/min or more, and particularly preferably 0.5 m/min or more. Further, the speed is preferably 30 m/min or less, and particularly preferably 15 m/min or less. By setting such a coating speed, it is easy to form the resin composition layer 11 of a thick thickness.

In addition, as a method of producing a laminate in which a sheet is peeled off on both surfaces of the resin sheet 1, the coating liquid can be applied onto a release surface of a release sheet to form a coating film, which is dried to form a resin. After the layered body composed of the object layer 11 and the release sheet, the surface of the layered body opposite to the peeling sheet of the resin composition layer 11 is attached to the peeling surface of the other release sheet, and one can be obtained. The resin sheet 1 of the sheet/resin composition layer 11/other release sheet is peeled off. At this time, at least one of the release sheets may be peeled off as a process material, and the resin composition layer 11 may be protected during the period of sealing.

When the resin composition layer 11 is obtained by laminating a plurality of layers, the resin composition layer obtained by the above method can be used as a unit resin composition layer, and a plurality of layers can be laminated to obtain a resin composition layer 11. . In this case, there is an advantage that a resin composition layer 11 having a relatively large thickness can be obtained in accordance with the component of the resin composition layer of the buildup unit.

4. Method of Using Resin Sheet The resin sheet 1 of the present embodiment is used for sealing an electronic component in a method of manufacturing a semiconductor device. For example, after the resin composition layer 11 of the resin sheet 1 is laminated on an electronic component provided on a temporary fixing material such as a substrate or an adhesive sheet, the resin composition layer 11 is cured to form a hardened layer, thereby enabling electronic components. seal.

It is preferable that the resin sheet 1 of the present embodiment is stored in a substantially all or part of a period from the time of manufacture to the time of use. By refrigerating storage, it is possible to prevent the curable resin contained in the resin composition layer 11 from reacting. Further, it is possible to suppress volatilization of the plastic solvent during storage. It is preferred to carry out the refrigerating storage at 15 ° C or lower, preferably at 0 to 12 ° C.

The thickness of the resin composition layer 11 of the resin sheet 1 of the present embodiment is in the above range, and the resin composition layer 11 contains a plastic solvent in the above-mentioned content, and the resin composition layer 11 is not easily broken, and is stored and handled during storage. It is not easy to cause breakage and breakage in the resin composition layer at the time, use, and the like. Further, the resin composition layer 11 can sufficiently cover the periphery of the electronic component, and it is possible to satisfactorily suppress the formation of a void between the hardened layer obtained by curing the resin composition layer 11 and the electronic component. As described above, by using the resin sheet 1 of the present embodiment, it is possible to manufacture a semiconductor device having excellent quality.

When the resin composition contains a thermosetting resin, the curing is preferably carried out by heating the resin composition layer 11. Since the resin composition layer 11 of the present embodiment is formed of a resin composition containing a thermosetting resin, it can be favorably cured by heating. In addition, since the plastic solvent in the resin composition layer 11 is easily volatilized by the heating, the cured layer formed by curing the resin composition layer 11 contains almost no plastic solvent. Therefore, the semiconductor device including the cured layer produced by using the resin sheet 1 of the present embodiment does not cause adverse effects due to the plastic solvent. The heating temperature is preferably 100 ° C or higher, and particularly preferably 120 ° C or higher. Further, the temperature is preferably 240 ° C or lower, and particularly preferably 200 ° C or lower. Moreover, it is preferable to set the heating time to 15 minutes or more, and it is preferable to set it as 20 minutes or more. Further, it is preferable to set the time to 300 minutes or less, and it is particularly preferable to set it to 100 minutes or less.

Moreover, it is preferable that the resin composition layer 11 is cured by the above-described heating, and it is preferably carried out in stages by a plurality of heat treatments. In this case, it is preferable to carry out the heating in two or more steps, in particular, the first heating treatment which is thermally cured at the temperature T1 and the second heating which is thermally cured at a temperature T2 higher than the temperature T1. It is preferred to carry out the two-stage heat treatment for the treatment. At this time, in the first heat treatment, the temperature T1 is preferably 100° C. or higher and 130° C. or lower, and the heat treatment time is preferably 15 minutes or longer and 60 minutes or shorter. Further, in the second heat treatment, the temperature T2 is preferably 150° C. or higher and 220° C. or lower, and the heat treatment time is preferably 30 minutes or longer and 120 minutes or shorter.

When the resin composition contains an energy ray-curable resin, the curing of the resin composition layer 11 may be performed by irradiation with an energy ray, for example, irradiation with ultraviolet rays. When ultraviolet rays are irradiated, the conditions are usually 50 to 500 mW/cm ² and the irradiation amount is about 100 to 2,500 mJ/cm ² . At this time, after the electronic component is laminated by the resin composition layer, a heating step for volatilizing the plastic solvent in the resin composition layer 11 may be performed before or after the curing of the resin composition layer 11.

When the resin sheet 1 of the present embodiment is provided with the release sheet 12 on one surface side of the resin composition layer 11, the release sheet 12 is formed by laminating the resin composition layer 11 after the electronic component, and the resin composition layer 11 can be formed. The resin composition layer 11 is peeled off before curing, or may be peeled off from the formed hardened layer after the resin composition layer 11 is cured. When the resin sheet 1 of the present embodiment is provided with a release sheet on both surfaces of the resin composition layer 11, a release sheet can be peeled off, and the exposed area of the exposed resin composition layer 11 can be layered on the electronic component, and other release sheets can be removed. It is peeled off in any case before and after hardening of the resin composition layer 11.

In the method for producing a semiconductor device described above, it is preferred that at least a part of the surface of the hardened layer obtained by curing the resin composition layer 11 is in contact with an alkaline solution. Moreover, in the method of manufacturing a semiconductor device described above, it is preferred to include a step of plating a surface of at least a portion of the surface of the cured layer obtained by curing the resin composition layer 11. In the resin sheet 1 of the present embodiment, when the resin composition contains a polyvinyl acetal resin as a film-forming resin and contains an inorganic filler, as described above, the matrix component existing around the inorganic filler of the cured layer is not easily eluted to At the same time, the alkaline solution is appropriately detached by the inorganic filler, and as a result of the presence of minute irregularities on the surface of the hardened layer, the plating anchoring effect on the surface of the hardened layer can be favorably exhibited, and the plating layer has excellent plating adhesion. Therefore, the resin composition contains a polyvinyl acetal resin as the resin sheet 1 of the film-forming resin, and is preferably used in a production method including a step of bringing the alkaline solution into contact as described above and a step of performing a plating treatment.

An example of a production method including the step of contacting the alkaline solution and the step of performing the plating treatment described above is a method of manufacturing a component-embedded substrate as a semiconductor device. In the method of manufacturing the component-embedded substrate, for example, first, after the resin component layer 11 of the resin sheet 1 is laminated on the electronic component provided on the substrate, the resin composition layer 11 is cured to form a hardened layer. When the peeling sheet 12 is laminated on the hardened layer, the peeling sheet 12 is peeled off, and then formed from the surface of the hardened layer opposite to the electronic component, to the interface between the hardened layer and the electronic component, or to the hardened layer. There are holes in the surface of the side of the electronic component. Next, as a step of bringing the alkaline solution into contact with the above, the hardened layer in which the pores are formed and the layered body of the electronic component and the substrate are brought into contact with the alkaline solution. By this treatment, the slag generated at the time of forming the cavities is removed from the inside of the cavities (excluding the slag treatment). Next, as the plating treatment step described above, wiring is formed. Specifically, the surface of the hardened layer in which the holes are formed is subjected to a plating treatment using copper metal, and after the metal is buried in the holes, the unnecessary portions of the metal are removed by etching or the like. Wiring can be formed in the form of a residual metal piece. Subsequently, a multilayer substrate is formed on both surfaces of the hardened layer by a build up method or the like, and the formation of the wiring is completed to obtain a component-embedded substrate.

The electronic component is not particularly limited as long as it is an electronic component to be sealed, and examples thereof include a semiconductor wafer and a capacitor. Further, examples of the semiconductor device to be manufactured include a component-embedded substrate, a semiconductor package, and the like, and the component-embedded substrate is particularly preferable.

The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, the respective elements disclosed in the above embodiments are intended to include all design changes and equivalents belonging to the technical scope of the invention. [Examples]

Hereinafter, the present invention will be described in more detail by explaining examples, test examples, and the like, but the present invention is not limited by the following test examples and the like.

[Example 1 and Comparative Examples 1 and 2] The constituent components shown in Table 1 were mixed, and diluted with methyl ethyl ketone to obtain a coating liquid having a resin composition having a solid content concentration shown in Table 1. This coating liquid was applied to a peeling surface of a release film (manufactured by LINTEC Co., Ltd., product name "PET38AL-5*") which was subjected to polyfluorination stripping treatment using a doctor blade under the following conditions, and The obtained coating film was dried by the following conditions to form a resin composition layer. Then, the peeling area layer of the second release film (manufactured by LINTEC Co., Ltd., product name "SP-PET381031") was peeled off from the surface of the resin composition layer which was not in contact with the release film, and the resin composition layer and the two sheets were peeled off. A resin sheet composed of a sheet. Moreover, as described later, the inorganic filler is blended in the coating liquid of the resin composition in a state of being dispersed in cyclohexanone or methyl ethyl ketone as a dispersion medium. The dispersion medium also remains in the resin sheet after the resin sheet is formed. Here, the blending amount of the inorganic filler in Table 1 reflects only the inorganic filler content, and does not reflect the content of the above dispersion medium. <Coating conditions using a knife coater> Coating speed: 0.6 m/min Coating gap: 700 μm in Example 1 and Comparative Example, 320 μm in Comparative Example 2 < Drying condition> Drying temperature: 50 ° C → 70 °C→90°C→100°C Drying time: for each temperature, 3 minutes and 20 seconds

Here, Table 1 shows the details of the constituent components as follows. [thermosetting resin] BisA type epoxy resin: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "YL980") Biphenyl type epoxy resin: biphenyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) , product name "NC-3000-L") Naphthalene type epoxy resin: Naphthalene type epoxy resin (made by DIC company, product name "HP-6000") Biphenyl type phenol resin: Biphenyl type phenol resin (Mingwa Chemical Co., Ltd. Manufactured product name "MEHC-7851-SS") [film-forming resin] Polyvinyl acetal resin: polyvinyl acetal resin (product name "BX-5" manufactured by Sekisui Chemical Co., Ltd., weight average molecular weight: 130,000 ) [Curing catalyst] Imidazole-based thermosetting catalyst: 2-ethyl-4-methylimidazole (manufactured by Shikoku Chemicals Co., Ltd., product name "2E4MZ") [Inorganic filler] Epoxy decane treatment of cerium oxide filler: oxidation矽 filler (manufactured by ADMATECHS, product name "SO-C2", average particle diameter: 0.5 μm, maximum particle diameter: 2 μm, shape: spherical shape), using 3-glycidoxypropyltrimethoxydecane (Shin-Etsu Chemical company, product name "KBM-403", minimum coated area: 330m ² /g). Further, in Example 1 and Comparative Example 2, a dispersion of cyclohexanone was blended in a coating liquid of a resin composition, and in Comparative Example 1, a dispersion of methyl ethyl ketone was blended in a resin. A coating liquid of the composition.

[Test Example 1] (Measurement of Thickness of Resin Composition Layer) The thickness of the resin sheet produced in the examples and the comparative examples was measured using a constant pressure thickness measuring instrument (manufactured by Teclock Co., Ltd., product name "PG-02J"). The thickness of the resin composition layer (μm) was calculated by subtracting the thickness of the release film from the obtained measurement value. The results are shown in Table 1.

[Test Example 2] (Measurement of Plastic Solvent in Resin Composition Layer) The resin composition sheets obtained by peeling the release sheets were cut out after the resin sheets produced in the examples and the comparative examples were cut to a size of 10 mm × 50 mm. Sample. The measurement sample was sealed in a measuring vial (vial), and heated at 120 ° C for 30 minutes, and the generated gas was introduced into a gas chromatograph (manufactured by SHIMAZU Co., Ltd., product name "GC-2010") to measure The amount of gas produced. The amount is shown in Table 1 as the amount of residual solvent (content of the plastic solvent containing cyclohexanone as a main component) (% by mass).

[Test Example 3] (Evaluation of the collapse of the resin composition layer) The resin composition layer was visually observed for the resin sheet produced in the examples and the comparative examples, and the resin composition layer was evaluated for collapse based on the following criteria. Bad. ○: The resin composition layer was not damaged or broken. X: At least one of breakage and breakage occurred in the resin composition layer.

[Test Example 4] (Evaluation of the followability of the resin composition layer) The resin composition of the resin sheets obtained in the examples and the comparative examples was used using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name "V130"). The surface on the side of the object layer was laminated on a 2 mm × 2 mm semiconductor wafer (thickness: 50 μm) fixed on a glass plate. Next, the resin composition layer was cured by heating at 100 ° C for 60 minutes and further at 170 ° C for 60 minutes to form a hardened layer. Then, it was confirmed by visual observation and the presence of a gap between the hardened layer and the semiconductor wafer through the glass plate, and the followability of the resin composition layer was evaluated based on the following criteria. The results are shown in Table 1. Further, in Comparative Example 1, since the evaluation of the collapse of the resin composition layer was poor, the test was not carried out. ○: There are no bubbles at all and floating. ×: At least one of bubbles and floatation is generated.

[Table 1]

As described above, the resin sheet obtained in the examples can suppress the collapse of the resin composition layer, and the resin composition layer has excellent followability. Industrial availability

The resin sheet of the present invention can be suitably used in a semiconductor device in which a substrate is built in a part.

1‧‧‧resin sheet

11‧‧‧ resin composition layer

12‧‧‧ peeling sheet

Fig. 1 is a cross-sectional view showing a resin sheet according to an embodiment of the present invention.

Claims (9)

A resin sheet used in a method of manufacturing a semiconductor device, which is a resin sheet for sealing an electronic component, wherein the resin sheet has a curable resin composition layer, and the resin composition layer is a resin containing a curable resin. The thickness of the resin composition layer is 100 μm or more and 300 μm or less, and the resin composition layer contains a plastic solvent which is volatilized by heating at a content of 1.0% by mass or more and 5.0% by mass or less. The resin sheet according to claim 1, wherein the resin composition layer is composed of a single layer. The resin sheet according to claim 1, wherein the resin composition contains a film-forming resin and an inorganic filler, and the film-forming resin does not substantially contain a resin having an ester bond. The resin sheet according to claim 3, wherein the inorganic filler is surface-treated with a surface treatment agent having a minimum coating area of less than 550 m ² /g. The resin sheet according to the first aspect of the invention, wherein the method for producing a semiconductor device comprises the step of performing a plating treatment on at least a part of a surface of the hardened layer obtained by curing the resin composition layer. The resin sheet according to claim 1, wherein the semiconductor device is a component-embedded substrate. A method for producing a resin sheet, which is a method for producing a resin sheet for sealing a metal component, wherein the resin sheet has a curable resin composition layer, and the resin composition layer is a resin composition containing a curable resin, wherein the resin composition layer has a thickness of 100 μm or more and 300 μm or less, and the resin composition layer contains volatilization by heating at a content of 1.0% by mass or more and 5.0% by mass or less. A plastic solvent; the production method includes a step of applying a coating liquid of the resin composition to form a coating film, and a step of forming the resin composition layer by drying the coating film. The method for producing a resin sheet according to claim 7, which comprises forming the coating film by applying the coating liquid of the resin composition once, and drying the coating film to form A resin composition layer composed of a single layer described in the second item of the patent application. The method for producing a resin sheet according to claim 7, wherein the coating liquid of the resin composition contains a diluent having a boiling point of 130 ° C or higher.