TW201908250A - Method and apparatus for adjustable glass ribbon heat transfer - Google Patents

Method and apparatus for adjustable glass ribbon heat transfer Download PDF

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Publication number
TW201908250A
TW201908250A TW107125164A TW107125164A TW201908250A TW 201908250 A TW201908250 A TW 201908250A TW 107125164 A TW107125164 A TW 107125164A TW 107125164 A TW107125164 A TW 107125164A TW 201908250 A TW201908250 A TW 201908250A
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Taiwan
Prior art keywords
glass ribbon
glass
heat transfer
side wall
modular
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TW107125164A
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Chinese (zh)
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油田知宏
羅伯特 戴利亞
艾柏 奧圖克
賈斯汀尚恩 史塔奇
杰賢 余
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美商康寧公司
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Publication of TW201908250A publication Critical patent/TW201908250A/en

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B17/00Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
    • C03B17/06Forming glass sheets
    • C03B17/067Forming glass sheets combined with thermal conditioning of the sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B17/00Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
    • C03B17/06Forming glass sheets
    • C03B17/064Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00Annealing glass products
    • C03B25/04Annealing glass products in a continuous way
    • C03B25/10Annealing glass products in a continuous way with vertical displacement of the glass products
    • C03B25/12Annealing glass products in a continuous way with vertical displacement of the glass products of glass sheets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

A method and apparatus for manufacturing a glass article includes flowing a glass ribbon through a housing having first and second side walls. The apparatus includes a modular cartridge that is removably positioned in at least one of first and second side walls and the modular cartridge includes at least one heat transfer mechanism and a removable wall component extending between the at least one heat transfer mechanism and the glass ribbon.

Description

用於可調節的玻璃帶熱傳送的方法與設備Method and equipment for adjustable heat transfer of glass ribbon

本發明一般關於製造玻璃物件的方法與設備,且更特定關於在玻璃物件製造中提供可調整玻璃帶熱傳送的方法與設備。The present invention relates generally to methods and equipment for manufacturing glass objects, and more specifically to methods and equipment for providing adjustable glass ribbon heat transfer in the manufacture of glass objects.

在玻璃物件的生產中,諸如用於顯示器應用的玻璃片,包含電視與手持裝置(例如,電話與平板),可由連續流動穿過殼體的玻璃帶來生產玻璃物件。殼體可包含上壁部分,提供玻璃帶與處理設備(例如,加熱與冷卻設備)之間的物理分離。此上壁部分不僅作為保護此設備的物理障壁,亦可提供玻璃帶所經歷的平滑熱梯度中的熱效應。相信此熱效應會影響某些玻璃性質,例如,厚度均勻性與表面平坦度或波紋。In the production of glass objects, such as glass sheets for display applications, including televisions and handheld devices (eg, phones and tablets), glass objects can be produced from glass ribbons that continuously flow through the housing. The housing may contain an upper wall portion, providing physical separation between the glass ribbon and the processing equipment (eg, heating and cooling equipment). The upper wall portion not only serves as a physical barrier to protect the device, but also provides a thermal effect in the smooth thermal gradient experienced by the glass ribbon. It is believed that this thermal effect will affect certain glass properties, for example, thickness uniformity and surface flatness or ripple.

然而,玻璃帶與處理設備(例如,冷卻設備)之間的物理障壁會減小該設備的散熱能力。對於具有低比熱容及/或放射率的玻璃、具有高黏度及/或相對較冷的帶溫度的玻璃,此散熱在升高的玻璃流速下會變得更加重要。此外,關於玻璃帶與處理設備之間的熱傳送,玻璃流速、比熱容、放射率以及黏度之間的差異會需要不同的最佳化條件。再造或修整現有上壁部分與相關處理設備以消除此差異可能涉及大量的費用與停工時間。因此,需要可調整地消除此差異而無需大量的費用與停工時間的上壁部分。However, the physical barrier between the glass ribbon and the processing equipment (eg, cooling equipment) reduces the heat dissipation capacity of the equipment. For glass with low specific heat capacity and / or emissivity, glass with high viscosity and / or relatively cold temperature, this heat dissipation becomes more important at increased glass flow rates. In addition, regarding the heat transfer between the glass ribbon and the processing equipment, the difference between the glass flow rate, specific heat capacity, emissivity, and viscosity may require different optimization conditions. Rebuilding or refurbishing existing upper wall sections and related processing equipment to eliminate this discrepancy may involve significant expense and downtime. Therefore, there is a need for an upper wall portion that can be adjusted to eliminate this difference without a lot of expense and downtime.

在此揭露的實施例包含製造玻璃物件的設備。該設備包含殼體,殼體包含第一側壁與第二側壁。配置殼體以至少部分圍起玻璃帶,玻璃帶具有第一相對主要表面與第二相對主要表面,延伸於縱向與橫向方向中。配置第一側壁與第二側壁以沿著玻璃帶的第一相對主要表面與第二相對主要表面的至少一部分延伸於縱向與橫向方向中。該設備亦包含模組化卡匣,可移除地設置在第一側壁與第二側壁的至少一者中。模組化卡匣包含至少一個熱傳送機構與可移除壁組件,配置可移除壁組件以延伸於至少一個熱傳送機構與玻璃帶之間。當可移除壁組件不存在時,玻璃帶與至少一個熱傳送機構之間的觀測因子(view factor)大於當可移除壁組件存在時。The embodiments disclosed herein include equipment for manufacturing glass objects. The device includes a housing that includes a first side wall and a second side wall. The housing is configured to at least partially enclose the glass ribbon, the glass ribbon having a first relatively major surface and a second relatively major surface, extending in the longitudinal and lateral directions. The first side wall and the second side wall are configured to extend in the longitudinal and lateral directions along at least a portion of the first and second opposing major surfaces of the glass ribbon. The device also includes a modular cassette that is removably disposed in at least one of the first side wall and the second side wall. The modular cassette includes at least one heat transfer mechanism and a removable wall assembly, and the removable wall assembly is configured to extend between the at least one heat transfer mechanism and the glass ribbon. When the removable wall component is not present, the view factor between the glass ribbon and the at least one heat transfer mechanism is greater than when the removable wall component is present.

在此所揭露的實施例亦包含製造玻璃物件的方法。該方法包含流動玻璃帶穿過殼體,玻璃帶具有第一相對主要表面與第二相對主要表面,延伸於縱向與橫向方向中,而殼體包含第一側壁與第二側壁。第一側壁與第二側壁沿著玻璃帶的第一相對主要表面與第二相對主要表面的至少一部分延伸於縱向與橫向方向中。將模組化卡匣可移除地設置在第一側壁與第二側壁的至少一者中。模組化卡匣包含至少一個熱傳送機構與可移除壁組件,可移除壁組件延伸於至少一個熱傳送機構與玻璃帶之間。當可移除壁組件不存在時,玻璃帶與至少一個熱傳送機構之間的觀測因子大於當可移除壁組件存在時。The embodiments disclosed herein also include methods of manufacturing glass objects. The method includes flowing a glass ribbon through a housing, the glass ribbon having a first relatively major surface and a second relatively major surface extending in the longitudinal and lateral directions, and the housing includes a first side wall and a second side wall. The first side wall and the second side wall extend in the longitudinal and lateral directions along at least a portion of the first and second opposing major surfaces of the glass ribbon. The modularized cassette is removably disposed in at least one of the first side wall and the second side wall. The modular cassette includes at least one heat transfer mechanism and a removable wall component that extends between the at least one heat transfer mechanism and the glass ribbon. When the removable wall assembly is not present, the observation factor between the glass ribbon and the at least one heat transfer mechanism is greater than when the removable wall assembly is present.

在此所揭露的實施例的額外特徵與優點將在以下的實施方式中說明,且在此技術領域中具有通常知識者由該描述可明瞭在此所揭露的實施例的一部分的額外特徵與優點或藉由實施如在此描述的所揭露的實施例,包含以下實施方式、申請專利範圍以及後附圖式,可理解在此所揭露的實施例的一部分的額外特徵與優點。The additional features and advantages of the embodiments disclosed herein will be described in the following embodiments, and those skilled in the art can understand the additional features and advantages of a part of the embodiments disclosed herein from this description. Or by implementing the disclosed embodiments as described herein, including the following implementation, patent application scope, and subsequent drawings, it is possible to understand additional features and advantages of a part of the disclosed embodiments.

應理解,前述發明內容與以下實施方式均呈現意圖提供用於理解所請實施例的本質與特徵的概述或架構的實施例。包含後附圖式以提供進一步的理解,且將後附圖式併入此說明書中並構成此說明書的一部分。圖式說明本發明的各種實施例,且與說明書內容一起解釋本發明的原理與操作。It should be understood that the foregoing summary of the invention and the following embodiments present examples intended to provide an overview or architecture for understanding the nature and features of the requested embodiments. The back drawings are included to provide further understanding, and the back drawings are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the invention, and together with the description explain the principles and operation of the invention.

現將詳細參照本發明的實施例,該些實施例的實例說明於後附圖式中。儘可能,將在整個圖式中使用相同的元件符號來表示相同或類似的部分。然而,可以不同形式來實施本發明且不應將本發明建構為受限於在此所說明的實施例。Reference will now be made in detail to the embodiments of the present invention, and examples of these embodiments are illustrated in the following drawings. Wherever possible, the same symbol will be used throughout the drawings to refer to the same or similar parts. However, the present invention can be implemented in different forms and should not be constructed to be limited to the embodiments described herein.

範圍在此可表示為由「約」一個特定數值及/或至「約」另一個特定數值。當表示此範圍時,另一個實施例包含由一個特定數值及/或至另一個特定數值。類似地,當表達數值為近似時,例如使用先行詞「約」,將理解該特定數值形成另一個實施例。將進一步理解該些範圍的每一個範圍的端點相對另一個端點都是重要的,且獨立於另一個端點。The range can be expressed here from "about" one specific value and / or to "about" another specific value. When this range is expressed, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when expressing numerical values as approximate, for example using the antecedent "about", it will be understood that the particular numerical value forms another embodiment. It will be further understood that the endpoint of each of these ranges is important relative to the other endpoint and is independent of the other endpoint.

在此所使用的方向性用語,例如,上、下、右、左、前、後、頂、底,僅用於參照所繪示的圖式且並非意味者絕對方向。The directional terms used herein, for example, up, down, right, left, front, back, top, and bottom, are only used to refer to the drawings shown and do not mean absolute directions.

除非另有明確說明,在此所說明的任何方法不應解釋為需要以特定順序來執行該些方法的步驟,且不需要任何設備具體方位。因此,方法請求項沒有實際記載方法步驟所遵循的順序、或任何設備請求項沒有實際記載個別組件的順序或方位、或在申請專利範圍或說明書中沒有特別具體說明該些步驟被限制為特定順序、或未記載設備組件的特定順序或方位,此並非意圖代表在任何態樣中推論順序或方位。這適用於任何可能的用於解釋的隱含基礎,包含:關於步驟配置的邏輯問題、操作流程、組件順序或組件方位、衍生自語法邏輯或標點符號的簡單含義以及在說明書中所描述的實施例數量或種類。Unless otherwise explicitly stated, any method described herein should not be interpreted as requiring the steps of the methods to be performed in a particular order, and without requiring any specific orientation of the equipment. Therefore, the method request item does not actually record the order in which the method steps are followed, or any device request item does not actually record the order or orientation of the individual components, or the patent application or the specification does not specifically specify that these steps are limited to a specific order , Or does not record the specific order or orientation of equipment components, this is not intended to represent inference order or orientation in any form. This applies to any possible implicit basis for interpretation, including: logical questions about step configuration, operation flow, component order or component orientation, simple meaning derived from grammatical logic or punctuation, and implementation described in the specification Number or type of cases.

如在此所使用,除非上下文另有明確指出,單數形式「一(a)」、「一(an)」 與「該(the)」包含複數個指涉對象。因此,舉例來說,除非上下文另有明確指出,參照「一」組件包含具有兩個或多個此組件的態樣。As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" include plural referents. Thus, for example, unless the context clearly indicates otherwise, reference to "a" component includes aspects that have two or more such components.

如在此所使用的,用語「加熱機構」代表相對於不存在此加熱機構的條件,提供來自至少一部分的玻璃帶的減少熱傳送的機構。減少熱傳送可透過傳導、對流與輻射的至少一種而產生。舉例來說,相對於不存在此加熱機構的條件,加熱機構可提供至少一部分的玻璃帶與玻璃帶的環境之間的減少溫度差異。As used herein, the term "heating mechanism" represents a mechanism that provides reduced heat transfer from at least a portion of the glass ribbon relative to the condition where this heating mechanism does not exist. Reduced heat transfer can occur through at least one of conduction, convection, and radiation. For example, the heating mechanism may provide a reduced temperature difference between at least a portion of the glass ribbon and the environment of the glass ribbon relative to the condition where there is no such heating mechanism.

如在此所使用的,用語「冷卻機構」代表相對於不存在此冷卻機構的條件,提供來自至少一部分的玻璃帶的增加熱傳送的機構。增加熱傳送可透過傳導、對流與輻射的至少一種而產生。舉例來說,相對於不存在此冷卻機構的條件,冷卻機構可提供至少一部分的玻璃帶與玻璃帶的環境之間的增加溫度差異。As used herein, the term "cooling mechanism" represents a mechanism that provides increased heat transfer from at least a portion of the glass ribbon relative to the condition where this cooling mechanism does not exist. Increased heat transfer can occur through at least one of conduction, convection, and radiation. For example, the cooling mechanism may provide an increased temperature difference between at least a portion of the glass ribbon and the environment of the glass ribbon relative to the condition where this cooling mechanism does not exist.

如在此所使用的,用語「熱傳送機構」代表加熱機構與冷卻機構的至少一者。As used herein, the term "heat transfer mechanism" represents at least one of a heating mechanism and a cooling mechanism.

如在此所使用的,用語「觀測因子」代表離開一個表面並撞擊另一個表面的輻射比例,例如,離開玻璃帶並撞擊熱傳送機構的輻射比例。As used herein, the term "observation factor" represents the proportion of radiation that leaves one surface and hits another surface, for example, the proportion of radiation that leaves a glass ribbon and hits a heat transfer mechanism.

如在此所使用的,用語「殼體」代表玻璃帶形成於其中的外殼,其中當玻璃帶移動通過殼體時,玻璃帶通常由相對高的溫度冷卻至相對低的溫度。儘管已參照熔融下拉製程(其中玻璃帶在大致垂直的方向中向下流動穿過殼體)描述在此揭露的實施例,但應理解到,此實施例亦可應用至其他玻璃成型製程,例如,浮法製程、狹縫拉製製程、上拉製程以及壓延製程,其中玻璃帶可在各種方向中流動穿過殼體,例如大致垂直方向或大致水平方向。As used herein, the term "housing" refers to the outer shell in which the glass ribbon is formed, wherein when the glass ribbon moves through the housing, the glass ribbon is generally cooled from a relatively high temperature to a relatively low temperature. Although the embodiments disclosed herein have been described with reference to a melt-down process in which the glass ribbon flows downward through the housing in a substantially vertical direction, it should be understood that this embodiment can also be applied to other glass forming processes, such as , Float process, slit drawing process, pull-up process, and calendering process, in which the glass ribbon can flow through the housing in various directions, such as a substantially vertical direction or a substantially horizontal direction.

繪示於第1圖中的為示例性玻璃製造設備10。在一些實例中,玻璃製造設備10可包含玻璃熔融爐12,玻璃熔融爐12可包含熔融槽14。除了熔融槽14,玻璃熔融爐12可選擇性包含一或多個額外組件,例如,加熱元件(例如,燃燒器或電極),加熱元件加熱原始材料並將原始材料轉換為熔融玻璃。在進一步實例中,玻璃熔融爐12可包含熱管理裝置(例如,絕緣組件),熱管理裝置減少來自熔融槽附近的熱損失。在又進一步實例中,玻璃熔融爐12可包含電子裝置及/或電子機械裝置,幫助原始材料熔融成為玻璃熔體。又進一步,玻璃熔融爐12可包含支撐結構(例如,支撐底盤、支撐構件等等)或其他組件。Shown in FIG. 1 is an exemplary glass manufacturing apparatus 10. In some examples, the glass manufacturing apparatus 10 may include a glass melting furnace 12, and the glass melting furnace 12 may include a melting tank 14. In addition to the melting tank 14, the glass melting furnace 12 may optionally include one or more additional components, for example, heating elements (eg, burners or electrodes), which heat the raw material and convert the raw material into molten glass. In a further example, the glass melting furnace 12 may include a thermal management device (eg, an insulating component) that reduces heat loss from the vicinity of the melting tank. In still further examples, the glass melting furnace 12 may include electronic devices and / or electromechanical devices to help the original material melt into a glass melt. Still further, the glass melting furnace 12 may include a supporting structure (eg, supporting chassis, supporting member, etc.) or other components.

玻璃熔融槽14通常由耐火材料所組成,諸如,耐火陶瓷材料,例如,包含氧化鋁或氧化鋯的耐火陶瓷材料。在一些實例中,玻璃熔融槽14可由耐火陶瓷磚構成。以下將更詳細描述玻璃熔融槽14的特定實施例。The glass melting tank 14 is generally composed of a refractory material, such as a refractory ceramic material, for example, a refractory ceramic material containing alumina or zirconia. In some examples, the glass melting tank 14 may be composed of refractory ceramic tiles. A specific embodiment of the glass melting tank 14 will be described in more detail below.

在一些實例中,可併入玻璃熔融爐作為玻璃製造設備的組件,以製造玻璃基板,例如,連續長度的玻璃帶。在一些實例中,可併入本發明的玻璃熔融爐作為玻璃製造設備的組件,玻璃製造設備包含狹縫拉製設備、浮浴設備、下拉設備(諸如,熔融製程)、上拉設備、壓延設備、抽管設備或任何其他可受惠於在此揭露的態樣的玻璃製造設備。舉例來說,第1圖示意說明玻璃熔融爐12,作為熔融下拉玻璃製造設備10的組件,用於熔融拉製玻璃帶以進行後續處理成為個別玻璃片。In some examples, a glass melting furnace may be incorporated as a component of glass manufacturing equipment to manufacture a glass substrate, for example, a continuous length of glass ribbon. In some examples, the glass melting furnace of the present invention may be incorporated as a component of a glass manufacturing equipment including a slit drawing equipment, a float bath equipment, a drawing equipment (such as a melting process), a drawing equipment, a calendering equipment , Drawing equipment or any other glass manufacturing equipment that can benefit from the aspects disclosed here. For example, FIG. 1 schematically illustrates a glass melting furnace 12 as a component of a melt-down glass manufacturing apparatus 10 for melting and drawing glass ribbons for subsequent processing into individual glass sheets.

玻璃製造設備10(例如,熔融下拉設備10)可選擇性包含上游玻璃製造設備16,設置在相對於玻璃熔融槽14的上游處。在一些實例中,可併入一部分或整個上游玻璃製造設備16作為玻璃熔融爐12的一部分。The glass manufacturing apparatus 10 (for example, the melt-down apparatus 10) may optionally include an upstream glass manufacturing apparatus 16, which is provided upstream with respect to the glass melting tank 14. In some examples, part or all of the upstream glass manufacturing equipment 16 may be incorporated as part of the glass melting furnace 12.

如說明性實例中所示,上游玻璃製造設備16可包含儲倉18、原始材料輸送裝置20以及與原始材料輸送裝置連接的馬達22。可配置儲倉18以儲存一定量的原始材料24,可饋送一定量的原始材料24進入玻璃熔融爐12的熔融槽14,如箭頭26所示。原始材料24通常包含一或多種玻璃成形金屬氧化物與一或多種改良劑。在一些實例中,原始材料輸送裝置20可由馬達22供電,使得原始材料輸送裝置20可由儲倉18輸送預定數量的原始材料24至熔融槽14。在進一步實例中,馬達22可供電給原始材料輸送裝置20,根據熔融槽14下游處所感測的熔融玻璃位準以受控速率導入原始材料24。之後可加熱熔融槽14中的原始材料24,以形成熔融玻璃28。As shown in the illustrative example, the upstream glass manufacturing apparatus 16 may include a storage bin 18, a raw material conveying device 20, and a motor 22 connected to the raw material conveying device. The storage bin 18 may be configured to store a certain amount of raw material 24, which may be fed into the melting tank 14 of the glass melting furnace 12, as indicated by arrow 26. The raw material 24 usually contains one or more glass forming metal oxides and one or more modifiers. In some examples, the raw material delivery device 20 may be powered by the motor 22 so that the raw material delivery device 20 may deliver a predetermined amount of raw material 24 from the storage bin 18 to the melting tank 14. In a further example, the motor 22 may supply power to the raw material delivery device 20 to introduce the raw material 24 at a controlled rate according to the level of molten glass sensed downstream of the melting tank 14. The raw material 24 in the melting tank 14 can then be heated to form molten glass 28.

玻璃製造設備10亦可選擇性包含下游玻璃製造設備30,設置在相對於玻璃熔融爐12的下游處。在一些實例中,可併入一部分的下游玻璃製造設備30作為玻璃熔融爐12的一部分。在一些情況下,可併入第一連接導管32(以下討論)或下游玻璃製造設備30的其他部分作為玻璃熔融爐12的一部分。下游玻璃製造設備的元件,包含第一連接導管32,可由貴重金屬形成。適合的貴重金屬包含鉑系金屬,選自由下列所組成的群組:鉑、銥、銠、鋨、釕與鈀或前述金屬的合金。舉例來說,玻璃製造設備的下游組件可由包含約70至約90重量%的鉑與約10重量%至約30重量%的銠的鉑-銠合金所形成。然而,其他適合的金屬可包含鉬、鈀、錸、鉭、鈦、鎢與前述金屬的合金。The glass manufacturing facility 10 may optionally include a downstream glass manufacturing facility 30 and be provided downstream of the glass melting furnace 12. In some examples, a portion of downstream glass manufacturing equipment 30 may be incorporated as part of glass melting furnace 12. In some cases, the first connection conduit 32 (discussed below) or other parts of the downstream glass manufacturing equipment 30 may be incorporated as part of the glass melting furnace 12. The components of the downstream glass manufacturing equipment, including the first connection duct 32, may be formed of precious metals. Suitable precious metals include platinum-based metals selected from the group consisting of platinum, iridium, rhodium, osmium, ruthenium and palladium, or alloys of the foregoing metals. For example, the downstream components of the glass manufacturing equipment may be formed of a platinum-rhodium alloy containing about 70 to about 90% by weight of platinum and about 10 to about 30% by weight of rhodium. However, other suitable metals may include alloys of molybdenum, palladium, rhenium, tantalum, titanium, tungsten and the foregoing metals.

下游玻璃製造設備30可包含第一調節(亦即,處理)槽,例如,澄清槽34,位於熔融槽14的下游處並經由前述第一連接導管32與熔融槽14耦接。在一些實例中,可經由第一連接導管32將熔融玻璃28由熔融槽14重力饋送至澄清槽34。舉例來說,重力可使熔融玻璃28由熔融槽14通過第一連接導管32的內部路徑至澄清槽34。然而,應理解到,可設置其他調節槽於熔融槽14的下游處,例如,介於熔融槽14與澄清槽34之間。在一些實施例中,可在熔融槽與澄清槽之間採用調節槽,其中進一步加熱來自主要熔融槽的熔融玻璃,以持續進行熔融製程或在進入澄清槽之前,或者冷卻來自主要熔融槽的熔融玻璃至低於熔融槽中的熔融玻璃的溫度。The downstream glass manufacturing apparatus 30 may include a first conditioning (ie, processing) tank, for example, a clarification tank 34, located downstream of the melting tank 14 and coupled to the melting tank 14 via the aforementioned first connection conduit 32. In some examples, the molten glass 28 may be gravity fed from the melting tank 14 to the clarification tank 34 via the first connection duct 32. For example, gravity can cause the molten glass 28 to pass from the melting tank 14 through the internal path of the first connecting duct 32 to the clarifying tank 34. However, it should be understood that other adjustment tanks may be provided downstream of the melting tank 14, for example, between the melting tank 14 and the clarification tank 34. In some embodiments, a conditioning tank may be used between the melting tank and the clarification tank, where the molten glass from the main melting tank is further heated to continue the melting process or before entering the clarification tank, or to cool the melting from the main melting tank The glass is below the temperature of the molten glass in the melting tank.

可利用各種技術將氣泡由澄清槽34的熔融玻璃28中移除。舉例來說,原始材料24可包含多價化合物(亦即,澄清劑),諸如,氧化錫,當加熱多價化合物時,進行化學還原反應並釋放氧。其他適合的澄清劑包含,但不限於,砷、銻、鐵與鈰。加熱澄清槽34至高於熔融槽溫度的溫度,因而加熱熔融玻璃與澄清劑。由澄清劑(多種澄清劑)的溫度誘導化學還原所產生的氧氣氣泡上升穿過澄清槽中的熔融玻璃,其中產生在熔融爐的熔融玻璃中的氣體可擴散至或聚結至由澄清劑所產生的氧氣氣泡。擴大的氣體氣泡可接著上升至澄清槽中的熔融玻璃的自由表面,然後由澄清槽中排出。氧氣氣泡可進一步誘導澄清槽中的熔融玻璃的機械混合。Various techniques can be used to remove air bubbles from the molten glass 28 of the clarification tank 34. For example, the raw material 24 may include a multivalent compound (ie, a clarifying agent), such as tin oxide, and when the multivalent compound is heated, a chemical reduction reaction is performed and oxygen is released. Other suitable clarifying agents include, but are not limited to, arsenic, antimony, iron, and cerium. The clarifying tank 34 is heated to a temperature higher than the temperature of the melting tank, thereby heating the molten glass and the clarifying agent. Oxygen bubbles generated by the temperature-induced chemical reduction of the clarifier (a variety of clarifiers) rise through the molten glass in the clarifier tank, where the gas generated in the molten glass of the melting furnace can diffuse or coalesce to the Oxygen bubbles generated. The expanded gas bubbles can then rise to the free surface of the molten glass in the clarification tank and then be discharged from the clarification tank. Oxygen bubbles can further induce mechanical mixing of the molten glass in the clarification tank.

下游玻璃製造設備30可進一步包含其他調節槽,諸如混合槽36,用於混合熔融玻璃。混合槽36可位於澄清槽34的下游處。可使用混合槽36來提供均勻玻璃熔融組成,因而降低可能存在於離開澄清槽的經澄清熔融玻璃中的化學或熱不均勻性的帶(cord)。如圖所示,可經由第二連接導管38將澄清槽34耦接至混合槽36。在一些實例中,可經由第二連接導管38將熔融玻璃28由澄清槽34重力輸送至混合槽36。舉例來說,重力可使熔融玻璃28由澄清槽34通過第二連接導管38的內部路徑至混合槽36。應注意,儘管顯示混合槽36位於澄清槽34的下游處,然而可將混合槽36設置在澄清槽34的上游處。在一些實施例中,下游玻璃製造設備30可包含多重混合槽,例如,澄清槽34上游處的混合槽與澄清槽34下游處的混合槽。該些多重混合槽可為相同設計或該些多重混合槽可為不同設計。The downstream glass manufacturing apparatus 30 may further include other adjustment tanks, such as a mixing tank 36, for mixing molten glass. The mixing tank 36 may be located downstream of the clarification tank 34. The mixing tank 36 may be used to provide a uniform glass melting composition, thus reducing the cords of chemical or thermal inhomogeneities that may be present in the clarified molten glass leaving the clarification tank. As shown, the clarification tank 34 can be coupled to the mixing tank 36 via the second connection duct 38. In some examples, the molten glass 28 may be gravity conveyed from the clarification tank 34 to the mixing tank 36 via the second connection duct 38. For example, gravity can cause the molten glass 28 to pass from the clarifying tank 34 through the internal path of the second connecting duct 38 to the mixing tank 36. It should be noted that although the mixing tank 36 is shown downstream of the clarification tank 34, the mixing tank 36 may be provided upstream of the clarification tank 34. In some embodiments, the downstream glass manufacturing apparatus 30 may include multiple mixing tanks, for example, a mixing tank upstream of the clarification tank 34 and a mixing tank downstream of the clarification tank 34. The multiple mixing tanks may be the same design or the multiple mixing tanks may be different designs.

下游玻璃製造設備30可進一步包含其他調節槽,諸如輸送槽40,可位於混合槽36的下游處。輸送槽40可調節將輸送至下游成型裝置中的熔融玻璃28。舉例來說,輸送槽40可作為累加器(accumulator)及/或流量控制器,以調節及/或提供熔融玻璃28的一致流動經由出口導管44至成型體42。如圖所示,可經由第三連接導管46將混合槽36耦接至輸送槽40。在一些實例中,可經由第三連接導管46將熔融玻璃28由混合槽36重力輸送至輸送槽40。舉例來說,重力可使熔融玻璃28由混合槽36通過第三連接導管46的內部路徑至輸送槽40。The downstream glass manufacturing apparatus 30 may further include other adjusting tanks, such as the conveying tank 40, which may be located downstream of the mixing tank 36. The conveying tank 40 can adjust the molten glass 28 to be conveyed to the downstream forming device. For example, the transfer tank 40 may serve as an accumulator and / or flow controller to regulate and / or provide a consistent flow of molten glass 28 to the shaped body 42 through the outlet conduit 44. As shown in the figure, the mixing tank 36 may be coupled to the conveying tank 40 via the third connection duct 46. In some examples, the molten glass 28 may be gravity transferred from the mixing tank 36 to the transport tank 40 via the third connection duct 46. For example, gravity can cause molten glass 28 from the mixing tank 36 through the internal path of the third connecting duct 46 to the conveying tank 40.

下游玻璃製造設備30可進一步包含成型設備48,成型設備48包含前述成型體42與入口導管50。可設置出口導管44以將熔融玻璃28由輸送槽40輸送至成型設備48的入口導管50。舉例來說,出口導管44可套在入口導管50的內表面中並與入口導管50的內表面分隔開來,因而提供設置在出口導管44的外表面與入口導管50的內表面之間的熔融玻璃自由表面。在熔融下拉玻璃製造設備中的成型體42可包含凹槽52與會聚成型表面54,凹槽52設置在成型體的上表面,而會聚成型表面54沿著成型體的底部邊緣56會聚於拉伸方向中。通過輸送槽40、出口導管44與入口導管50輸送至成型體凹槽的熔融玻璃溢流流出凹槽的側壁並沿著會聚成型表面54下降成為熔融玻璃的分離流動。熔融玻璃的分離流動在底部邊緣56下方並沿著底部邊緣56接合,以產生玻璃的單一條帶58,藉由諸如重力、邊緣輥72與拉輥82施加拉力至玻璃帶,而在拉伸或流動方向60中由底部邊緣56拉製玻璃的單一條帶58,以當玻璃冷卻且玻璃黏度提高時,控制玻璃帶的尺寸。據此,玻璃帶58經歷黏彈性轉變且獲得賦予玻璃帶58穩定尺寸特徵的機械性質。在一些實施例中,可藉由在玻璃帶的彈性區域利用玻璃分離設備100將玻璃帶58分離為個別玻璃片62。接著,機械手臂64使用抓取工具65將個別玻璃片62傳送至輸送機系統,可在輸送機系統上進一步處理個別玻璃片。The downstream glass manufacturing apparatus 30 may further include a molding apparatus 48 that includes the aforementioned molded body 42 and the inlet duct 50. An outlet duct 44 may be provided to transport molten glass 28 from the transport tank 40 to the inlet duct 50 of the forming apparatus 48. For example, the outlet duct 44 may be nested in the inner surface of the inlet duct 50 and spaced from the inner surface of the inlet duct 50, thus providing a space between the outer surface of the outlet duct 44 and the inner surface of the inlet duct 50 Free surface of molten glass. The molded body 42 in the molten down-drawing glass manufacturing apparatus may include a groove 52 and a convergent forming surface 54. The groove 52 is provided on the upper surface of the molded body, and the convergent forming surface 54 converges on the stretch along the bottom edge 56 of the molded body In the direction. The molten glass conveyed to the molded body groove through the conveying tank 40, the outlet duct 44 and the inlet duct 50 overflows out of the side wall of the groove and descends along the converging forming surface 54 into a separate flow of molten glass. The separate flow of molten glass is below the bottom edge 56 and joined along the bottom edge 56 to produce a single strip 58 of glass, which is stretched or A single strip 58 of glass is drawn from the bottom edge 56 in the flow direction 60 to control the size of the glass ribbon as the glass cools and the glass viscosity increases. According to this, the glass ribbon 58 undergoes a viscoelastic transition and obtains mechanical properties that give the glass ribbon 58 stable dimensional characteristics. In some embodiments, the glass ribbon 58 can be separated into individual glass sheets 62 by using the glass separating apparatus 100 in the elastic region of the glass ribbon. Next, the robotic arm 64 uses the gripping tool 65 to transfer the individual glass sheets 62 to the conveyor system, where the individual glass sheets can be further processed.

第2圖為包含模組化卡匣210的玻璃帶成型設備與製程的末端剖視示意圖,模組化卡匣210包含加熱機構230,加熱機構230包含電阻元件214與絕緣封裝212。具體來說,在第2圖所示的實施例中,玻璃帶58在拉伸或流動方向60中縱向流動於成型體42的底部邊緣56下方並介於殼體200的第一與第二側壁202之間。通常可利用隔離件206將殼體200與成型體外殼208隔開,其中,參照玻璃帶58的拉伸或流動方向60,殼體200相對於成型體外殼208是位於下游處。FIG. 2 is a schematic cross-sectional view of a glass ribbon forming apparatus and a manufacturing process including a modular cassette 210. The modular cassette 210 includes a heating mechanism 230 including a resistance element 214 and an insulating package 212. Specifically, in the embodiment shown in FIG. 2, the glass ribbon 58 flows longitudinally under the bottom edge 56 of the molded body 42 in the stretching or flow direction 60 and is interposed between the first and second side walls of the housing 200 Between 202. The housing 200 is generally separated from the molded body housing 208 by a spacer 206, wherein the housing 200 is located downstream with respect to the molded body housing 208 with reference to the stretching or flow direction 60 of the glass ribbon 58.

模組化卡匣210亦包含可移除壁組件218,延伸在加熱機構230與玻璃帶58之間。如第2圖所示,在一個實施例中,可移除壁組件218和第一與第二側壁202共平面,其中平面通常與玻璃帶58的流動方向60平行。The modular cassette 210 also includes a removable wall assembly 218 that extends between the heating mechanism 230 and the glass ribbon 58. As shown in FIG. 2, in one embodiment, the removable wall assembly 218 and the first and second side walls 202 are coplanar, where the plane is generally parallel to the flow direction 60 of the glass ribbon 58.

每一個可移除壁組件218可包含相同或不同於包含第一與第二側壁202的材料或多種材料的材料或多種材料。在某些示例性實施例中,每一個可移除壁組件218以及每一個第一與第二側壁202包含在高溫下具有相對高熱傳導性且同時維持此溫度(例如,高於約750℃)下的高機械整體性的材料。用於可移除壁組件218以及第一與第二側壁202的示例性材料可包含下列至少一種:各種等級的碳化矽、氧化鋁耐火材料、鋯石為主的耐火材料、鈦為主的鋼合金以及鎳為主的鋼合金。可移除壁組件218亦可塗佈有高放射率塗層,例如,可購自Cetek的M700黑塗層。Each removable wall assembly 218 may include the same or different materials or materials than the materials and materials including the first and second side walls 202. In certain exemplary embodiments, each removable wall assembly 218 and each of the first and second sidewalls 202 include relatively high thermal conductivity at high temperatures while maintaining this temperature (eg, above about 750 ° C) Material under high mechanical integrity. Exemplary materials for the removable wall assembly 218 and the first and second side walls 202 may include at least one of the following: various grades of silicon carbide, alumina refractories, zircon-based refractories, titanium-based steel Alloys and nickel-based steel alloys. The removable wall assembly 218 may also be coated with a high emissivity coating, for example, the M700 black coating available from Cetek.

儘管第2圖中所示之實施例顯示的模組化卡匣210包含具有電阻元件214與絕緣封裝212的加熱機構230,但應理解在此所揭露的實施例包含其他類型的加熱機構,例如,舉例來說,包含感應加熱、火焰加熱、電漿加熱、震動加熱、雷射加熱與微波加熱的加熱機構。Although the embodiment shown in FIG. 2 shows the modularized cassette 210 including a heating mechanism 230 having a resistance element 214 and an insulating package 212, it should be understood that the embodiments disclosed herein include other types of heating mechanisms, such as For example, the heating mechanism includes induction heating, flame heating, plasma heating, vibration heating, laser heating and microwave heating.

模組化卡匣210亦可延伸圍繞或包含至少一個加熱機構,例如,包含桿狀或棒狀電阻加熱元件的加熱機構,在橫向方向中實質延伸平行於玻璃帶58且連接至適當電源。例如,桿或棒狀加熱元件可包含碳化矽、二矽化鉬、鎳鉻合金、鉑合金以及在此技術領域中具有通常知識者已知的各種商用加熱器組成物。商業上可購得的電阻加熱棒包含可購自I Squared R Element Co.的碳化矽Starbars® 以及可購自Sandvik的Globars™。The modular cassette 210 may also extend around or include at least one heating mechanism, for example, a heating mechanism including a rod-shaped or rod-shaped resistance heating element, extending substantially parallel to the glass ribbon 58 in the lateral direction and connected to an appropriate power source. For example, the rod or rod-shaped heating element may include silicon carbide, molybdenum disilicide, nichrome, platinum alloy, and various commercial heater compositions known to those of ordinary skill in the art. Commercially available resistance heating rods include silicon carbide Starbars® available from I Squared R Element Co. and Globars available from Sandvik.

如第2圖所示,模組化卡匣210延伸圍繞冷卻機構228,冷卻機構228包含導管216,具有冷卻流體流動穿過導管216。導管216延伸於加熱機構230與玻璃帶58之間。此外,可移除壁組件218延伸於導管216與玻璃帶58之間。As shown in FIG. 2, the modular cassette 210 extends around the cooling mechanism 228. The cooling mechanism 228 includes a duct 216 with cooling fluid flowing through the duct 216. The duct 216 extends between the heating mechanism 230 and the glass ribbon 58. In addition, the removable wall assembly 218 extends between the catheter 216 and the glass ribbon 58.

在某些示例性實施例中,流動通過導管216的冷卻流體可包含液體,例如,水。在某些示例性實施例中,流動通過導管216的冷卻流體可包含氣體,例如,空氣。且儘管第2、6與7圖顯示具有大致圓形橫截面的導管216,但應理解,在此所揭露的實施例包含導管具有其他橫截面幾何形狀(例如,橢圓形或多邊形)的該些實施例。此外,應理解,在此所揭露的實施例包含每一個導管216的直徑或橫截面面積是大致相同或沿著導管的縱向長度而變化的該些實施例,這是取決於來自玻璃帶58的期望熱傳送量(例如,當期望來自在玻璃帶58的橫向方向中的玻璃帶58的不同熱傳送量)。此外,在此所揭露的實施例包含每一個導管216的縱向長度為相同或不同的該些實施例且每一個導管216的縱向長度可或不可跨越玻璃帶58整體延伸於玻璃帶58的橫向方向中的該些實施例。In certain exemplary embodiments, the cooling fluid flowing through the conduit 216 may contain liquid, such as water. In some exemplary embodiments, the cooling fluid flowing through the conduit 216 may contain a gas, for example, air. And although Figures 2, 6 and 7 show a catheter 216 having a substantially circular cross-section, it should be understood that the embodiments disclosed herein include those with other cross-sectional geometries (eg, elliptical or polygonal) Examples. In addition, it should be understood that the embodiments disclosed herein include those embodiments where the diameter or cross-sectional area of each duct 216 is approximately the same or varies along the longitudinal length of the duct, depending on the The heat transfer amount is desired (for example, when a different heat transfer amount from the glass ribbon 58 in the lateral direction of the glass ribbon 58 is desired). In addition, the embodiments disclosed herein include those embodiments where the longitudinal length of each duct 216 is the same or different, and the longitudinal length of each duct 216 may or may not extend across the entire length of the glass ribbon 58 in the transverse direction of the glass ribbon 58 Examples of these.

用於導管210的示例性材料包含在高溫下具有良好機械與氧化性質的該些材料,包含各種鋼合金,包含不鏽鋼,例如,300系列不鏽鋼。Exemplary materials for the catheter 210 include those having good mechanical and oxidizing properties at high temperatures, including various steel alloys, including stainless steel, for example, 300 series stainless steel.

在此所揭露的實施例亦包含將高放射率塗層沉積在每一個導管216的外側表面的至少一部份上,以影響玻璃帶58與導管216之間的輻射熱傳送的該些實施例,其中根據來自玻璃帶58的期望熱傳送量,可沿著導管216的縱向長度將相同或不同塗層沉積在每一個導管216的外側表面上。示例性高放射率塗層應在高溫下為穩定且具有對諸如不鏽鋼的材料的良好附著性。示例性高放射率塗層為可購自Cetek的M700黑塗層。The embodiments disclosed herein also include those embodiments in which a high emissivity coating is deposited on at least a portion of the outer surface of each conduit 216 to affect the radiant heat transfer between the glass ribbon 58 and the conduit 216, Where depending on the desired amount of heat transfer from the glass ribbon 58, the same or different coatings can be deposited on the outside surface of each duct 216 along the longitudinal length of the duct 216. An exemplary high emissivity coating should be stable at high temperatures and have good adhesion to materials such as stainless steel. An exemplary high emissivity coating is the M700 black coating available from Cetek.

每一個導管216可包含一或多個流體通道,沿著每一個導管216的縱向長度的至少一部分延伸,包含至少一個通道沿圓周環繞至少一個其他通道的實施例,例如,當冷卻流體導入第一端處的導管中時,沿著導管的縱向長度的至少一部分沿著第一通道流動且之後沿著第二通道流回導管的第一端處,第二通道圓周環繞第一通道或第一通道圓周環繞第二通道。例如,導管216的該些與額外示例性實施例描述於WO2006/044929A1中,WO2006/044929A1的全文以引用的方式併入本文中。Each duct 216 may include one or more fluid channels extending along at least a portion of the longitudinal length of each duct 216, including an embodiment in which at least one channel circumferentially surrounds at least one other channel, for example, when the cooling fluid is introduced into the first When in the catheter at the end, at least a portion of the longitudinal length of the catheter flows along the first channel and then flows back to the first end of the catheter along the second channel, the second channel circumferentially surrounds the first channel or the first channel The second channel is surrounded by a circumference. For example, these and additional exemplary embodiments of catheter 216 are described in WO2006 / 044929A1, the entire contents of WO2006 / 044929A1 are incorporated herein by reference.

儘管第2圖顯示在玻璃帶58的每一側上延伸圍繞三個導管216的模組化卡匣210,但應理解到在此所揭露的實施例可包含模組化卡匣210延伸圍繞任何數量的導管及/或其他種類的冷卻機構228的該些實施例。在此所揭露的實施例亦包含模組化卡匣210延伸圍繞至少一個加熱機構的該些實施例。Although FIG. 2 shows a modular cassette 210 extending around three conduits 216 on each side of the glass ribbon 58, it should be understood that the embodiments disclosed herein may include the modular cassette 210 extending around any The number of ducts and / or other types of cooling mechanisms 228 of these embodiments. The embodiments disclosed herein also include those embodiments where the modular cassette 210 extends around at least one heating mechanism.

此外,儘管模組化卡匣210可延伸圍繞冷卻機構228,例如第2圖所示,但在此所揭露的實施例包含模組化卡匣包含至少一個冷卻機構228的該些實施例。舉例來說,模組化卡匣可延伸圍繞或包含對流冷卻機構,例如,包含複數個真空埠的真空冷卻機構,例如揭露於WO2014/193780A1中,WO2014/193780A1的全文以引用的方式併入本文中。In addition, although the modular cassette 210 may extend around the cooling mechanism 228, such as shown in FIG. 2, the embodiments disclosed herein include those embodiments where the modular cassette includes at least one cooling mechanism 228. For example, the modular cassette may extend around or include a convection cooling mechanism, for example, a vacuum cooling mechanism including a plurality of vacuum ports, such as disclosed in WO2014 / 193780A1, the entire content of WO2014 / 193780A1 is incorporated herein by reference in.

模組化卡匣210亦可延伸圍繞或包含冷卻機構228,冷卻機構228包含複數個冷卻管,每一個冷卻管包含縱向軸,縱向軸正交於流動方向60而實質延伸。每一個冷卻管包含開口端,可相鄰於可移除壁組件218設置且可提供冷卻流體,例如,空氣,冷卻流體由冷卻管的開口端排出並撞擊可移除壁組件218的後表面。可個別控制供應至冷卻管的流體,以在玻璃帶58的橫向方向中控制或改變溫度分布。示例性的冷卻管包含揭露於美國專利第3,682,609號與第3,723,082號中的該些冷卻管,該些美國專利的全文以引用的方式併入本文中。The modular cassette 210 may also extend around or include a cooling mechanism 228. The cooling mechanism 228 includes a plurality of cooling tubes, and each cooling tube includes a longitudinal axis that extends substantially perpendicular to the flow direction 60. Each cooling tube includes an open end, which may be disposed adjacent to the removable wall assembly 218 and may provide cooling fluid, for example, air, which is discharged from the open end of the cooling tube and strikes the rear surface of the removable wall assembly 218. The fluid supplied to the cooling tube can be individually controlled to control or change the temperature distribution in the lateral direction of the glass ribbon 58. Exemplary cooling tubes include those cooling tubes disclosed in US Patent Nos. 3,682,609 and 3,723,082, the entire contents of which are incorporated herein by reference.

模組化卡匣210亦可延伸圍繞或包含冷卻機構228,冷卻機構228利用蒸發冷卻效果來達到提高來自玻璃帶58的熱傳送(例如,輻射熱傳送)的目的。例如,此冷卻機構可包含蒸發器單元,蒸發器單元包含液體儲存器與熱傳送元件,配置液體儲存器以容納工作液體(例如,水),配置熱傳送元件以與容納在液體儲存器中的工作液體熱接觸,其中可配置熱傳送元件以藉由接收來自玻璃帶58的輻射熱並將熱傳送至容納在液體儲存器中的工作液體,因而使一定數量的工作流體轉換為蒸氣的方式來冷卻玻璃帶58。例如,使用蒸發冷卻效果的冷卻機構的該些與額外示例性實施例係揭露於US2016/0046518A1中,US2016/0046518A1的全文以引用的方式併入本文中。The modular cassette 210 may also extend around or include a cooling mechanism 228 that utilizes the evaporative cooling effect to improve the heat transfer (eg, radiant heat transfer) from the glass ribbon 58. For example, the cooling mechanism may include an evaporator unit that includes a liquid reservoir and a heat transfer element, the liquid reservoir is configured to contain working liquid (eg, water), and the heat transfer element is configured to accommodate the liquid contained in the liquid reservoir Working fluid thermal contact, in which a heat transfer element can be configured to cool by receiving radiant heat from the glass ribbon 58 and transferring the heat to the working liquid contained in the liquid reservoir, thus converting a certain amount of working fluid to vapor Glass ribbon 58. For example, these and additional exemplary embodiments of cooling mechanisms using evaporative cooling effects are disclosed in US2016 / 0046518A1, the entire text of US2016 / 0046518A1 is incorporated herein by reference.

可與在此所揭露的實施例一起使用的其他冷卻機構包括包含複數個冷卻線圈的該些冷卻機構,沿著冷卻軸設置複數個冷卻線圈,冷卻軸延伸橫向於玻璃帶58的流動方向60,例如,揭露於WO2012/174353A2中的該些冷卻機構,WO2012/174353A2的全文以引用的方式併入本文中。此冷卻線圈可與導管216合併使用及/或取代導管216。Other cooling mechanisms that can be used with the embodiments disclosed herein include those cooling mechanisms including a plurality of cooling coils, a plurality of cooling coils are provided along the cooling axis, the cooling axis extending transverse to the flow direction 60 of the glass ribbon 58, For example, the cooling mechanisms disclosed in WO2012 / 174353A2, the entire text of WO2012 / 174353A2 is incorporated herein by reference. This cooling coil may be used in conjunction with the catheter 216 and / or replace the catheter 216.

第3圖顯示第2圖的玻璃帶成型設備與製程的頂端剖視示意圖,其中顯示玻璃帶58在橫向方向中具有第一末端58A、第一珠區58B、中央區58C、第二珠區58D以及第二末端58E。儘管第3圖顯示四個模組化卡匣210,在橫向方向中沿著玻璃帶58的相對主要表面延伸,但應理解在此所揭露的實施例並未如此限制且可包含延伸於橫向方向中的任何數量的模組化卡匣。FIG. 3 shows a schematic cross-sectional view of the top of the glass ribbon forming apparatus and process of FIG. 2, showing that the glass ribbon 58 has a first end 58A, a first bead area 58B, a central area 58C, and a second bead area 58D And the second end 58E. Although FIG. 3 shows four modular cassettes 210 extending along the opposite major surface of the glass ribbon 58 in the lateral direction, it should be understood that the embodiments disclosed herein are not so limited and may include extending in the lateral direction Any number of modular cassettes.

第4圖顯示第2圖的玻璃帶成型設備與製程的頂端剖視示意圖,其中已將包含具有冷卻流體流動穿過其中的導管216的冷卻機構228由設備中移除。舉例來說,可沿著導管216的軸向方向將導管216移除穿過其中一個側壁202,其中每一個側壁202包含開口,導管216延伸穿過開口。Figure 4 shows a schematic top cross-sectional view of the glass ribbon forming apparatus and process of Figure 2, in which the cooling mechanism 228, including the conduit 216 with cooling fluid flowing therethrough, has been removed from the apparatus. For example, the catheter 216 may be removed through one of the side walls 202 along the axial direction of the catheter 216, where each side wall 202 includes an opening through which the catheter 216 extends.

第5圖顯示第4圖的玻璃帶成型設備與製程的末端剖視示意圖,其中已將模組化卡匣210由設備中移除,接著移除包含導管216的冷卻機構228。在第5圖中,在相對方向中,如箭頭A與B所示,將模組化卡匣210由設備中移除,模組化卡匣210包含可移除壁組件218與加熱機構230,加熱機構230包含電阻元件214與絕緣封裝212,當由第5圖所示之玻璃帶成型設備的末端觀察時,該相對方向大致垂直於玻璃帶58的流動方向60。FIG. 5 shows a schematic end sectional view of the glass ribbon forming apparatus and manufacturing process of FIG. 4, in which the modular cassette 210 has been removed from the apparatus, and then the cooling mechanism 228 including the duct 216 is removed. In FIG. 5, in the opposite direction, as indicated by arrows A and B, the modular cassette 210 is removed from the device. The modular cassette 210 includes a removable wall assembly 218 and a heating mechanism 230, The heating mechanism 230 includes a resistance element 214 and an insulating package 212, and when viewed from the end of the glass ribbon forming apparatus shown in FIG. 5, the relative direction is substantially perpendicular to the flow direction 60 of the glass ribbon 58.

由設備移除模組化卡匣210之後,如第5圖所示,可用替代卡匣來替換此模組化卡匣。此替代卡匣可包含與被替換的模組化卡匣相同或不同的模組化卡匣。舉例來說,替代卡匣可包含模組化卡匣210,其中已移除可移除壁組件218。替代卡匣亦可包含模組化卡匣,模組化卡匣包含至少一個熱傳送機構,該至少一個熱傳送機構比由設備移除的模組化卡匣中的熱傳送機構影響更多數量或更少數量的來自玻璃帶的熱傳送。After the modularized cassette 210 is removed from the device, as shown in FIG. 5, the modularized cassette can be replaced with an alternative cassette. The replacement cassette may include a modular cassette that is the same as or different from the modular cassette being replaced. For example, the replacement cassette may include a modular cassette 210 in which the removable wall assembly 218 has been removed. The replacement cassette may also include a modular cassette, the modular cassette includes at least one heat transfer mechanism that affects a greater number than the thermal transfer mechanism in the modular cassette removed by the device Or a smaller amount of heat transfer from the glass ribbon.

第6圖顯示第2圖的玻璃帶成型設備與製程的末端剖視示意圖,其中不存在可移除壁組件218(如第2至5圖中所示)。當可移除壁組件218不存在於模組化卡匣210,玻璃帶58與模組化卡匣210延伸圍繞或包含的任何熱傳送機構之間的觀測因子是大於當可移除壁組件218存在時。舉例來說,在第6圖中,其中不存在可移除壁組件218(如第2至5圖中所示),玻璃帶58與包含電阻元件214與絕緣封裝212的加熱機構230之間的觀測因子以及玻璃帶58與包含具有冷卻流體流動穿過其中的導管216的冷卻機構228之間的觀測因子是大於當可移除壁組件218存在時。Figure 6 shows a schematic cross-sectional view of the end of the glass ribbon forming apparatus and process of Figure 2, where no removable wall assembly 218 is present (as shown in Figures 2 to 5). When the removable wall component 218 is not present in the modular cassette 210, the observation factor between the glass ribbon 58 and any heat transfer mechanism that the modular cassette 210 extends around or contains is greater than when the removable wall component 218 When it exists. For example, in Figure 6, there is no removable wall assembly 218 (as shown in Figures 2 to 5), between the glass ribbon 58 and the heating mechanism 230 including the resistive element 214 and the insulating package 212 The observation factor and the observation factor between the glass ribbon 58 and the cooling mechanism 228 containing the conduit 216 through which the cooling fluid flows are greater than when the removable wall assembly 218 is present.

第7圖顯示第6圖的玻璃帶成型設備與製程的末端剖視示意圖,其中將模組化卡匣210由設備中移除。相較於第5圖,其中已將包含導管216的冷卻機構228由設備中移除,在第7圖中,其中不存在可移除壁組件218,當模組化卡匣210移除時,導管216仍存在於設備中。如第5圖所示,在相對方向中,如箭頭A與B所示,將模組化卡匣210由設備中移除,模組化卡匣210包含具有電阻元件214與絕緣封裝212的加熱機構230,當由第7圖所示之玻璃帶成型設備的末端觀察時,該相對方向大致垂直於玻璃帶58的流動方向60。FIG. 7 shows a schematic cross-sectional view of the end of the glass ribbon forming apparatus and manufacturing process of FIG. 6, in which the modular cassette 210 is removed from the apparatus. Compared to FIG. 5, the cooling mechanism 228 including the duct 216 has been removed from the device. In FIG. 7, there is no removable wall assembly 218. When the modular cassette 210 is removed, The catheter 216 is still present in the device. As shown in FIG. 5, in the opposite direction, as indicated by arrows A and B, the modular cassette 210 is removed from the device. The modular cassette 210 includes heating with a resistive element 214 and an insulating package 212 The mechanism 230, when viewed from the end of the glass ribbon forming apparatus shown in FIG. 7, the relative direction is substantially perpendicular to the flow direction 60 of the glass ribbon 58.

第8圖顯示包含可移除壁組件218的模組化卡匣210的側面剖視示意圖,藉由可滑動地設置在玻璃帶成型設備的支撐框架220上而可移除地設置可移除壁組件218。如第8圖所示,支撐框架220包含引導特徵222,可使模組化卡匣210設置在玻璃帶的寬度方向中的一組預定位置上,同時沿著引導特徵222的縱向長度可滑動地設置遠離帶(例如,在第5與7圖的箭頭A與B所示的方向中)或可滑動地設置朝向帶。用於支撐框架220的示例性材料包含在高溫下具有良好機械與氧化性質的該些材料,例如,各種鋼合金。FIG. 8 shows a schematic side sectional view of the modularized cassette 210 including the removable wall assembly 218, and the removable wall is removably provided by being slidably disposed on the support frame 220 of the glass ribbon forming apparatus Component 218. As shown in FIG. 8, the support frame 220 includes a guide feature 222, which enables the modular cassette 210 to be disposed at a set of predetermined positions in the width direction of the glass ribbon while being slidably along the longitudinal length of the guide feature 222 Set away from the belt (for example, in the directions shown by arrows A and B in FIGS. 5 and 7) or slidably toward the belt. Exemplary materials for the support frame 220 include those having good mechanical and oxidizing properties at high temperatures, such as various steel alloys.

第9圖顯示可移除壁組件218的末端剖視示意圖,藉由可滑動地設置在模組化卡匣210上而可移除地設置可移除壁組件218,其中模組化卡匣210依序可滑動地設置在支撐框架220上,參照第8圖所描述。如第9圖所示,模組化卡匣210包含引導特徵224與226,當模組化卡匣210完全嵌入設備中(舉例來說,如第2至4圖所示)且可滑動地移除模組化卡匣210時,例如,當模組化卡匣210由設備中移除時,引導特徵224與226可使可移除壁組件218為固定設置。FIG. 9 shows a schematic cross-sectional view of the end of the removable wall assembly 218, and the removable wall assembly 218 is removably provided by being slidably disposed on the modular cartridge 210, wherein the modular cartridge 210 It is slidably arranged on the support frame 220 in sequence, as described with reference to FIG. 8. As shown in FIG. 9, the modular cassette 210 includes guide features 224 and 226. When the modular cassette 210 is completely embedded in the device (for example, as shown in FIGS. 2 to 4) and slidably moved In addition to the modular cassette 210, for example, when the modular cassette 210 is removed from the device, the guide features 224 and 226 can make the removable wall assembly 218 in a fixed configuration.

在此所揭露的實施例中,可手動或利用自動化系統移動模組化卡匣210,舉例來說,自動化系統包含至少一個伺服馬達。In the embodiments disclosed herein, the modular cassette 210 can be moved manually or using an automated system. For example, the automated system includes at least one servo motor.

儘管第2至7圖所示之實施例顯示一個模組化卡匣210,沿著玻璃帶58的第一與第二相對主要表面延伸於縱向方向中(亦即,如第2、5至7圖所示之垂直方向),但應理解到在此所揭露的實施例並未如此限制且可包含延伸於縱向方向中的任何數量的模組化卡匣。因此,在此揭露的實施例包括包含模組化卡匣210的MxN矩陣的設備,沿著玻璃帶58的第一與第二相對主要表面的至少一部分延伸於縱向與橫向方向(其中M表示沿著橫向方向延伸的模組化卡匣210數量,而N表示沿著縱向方向延伸的模組化卡匣210數量),其中可獨立操作並獨立移除及置換每一個模組化卡匣210。每一個此模組化卡匣210可包含至少一個熱傳送機構與可移除壁組件218,配置可移除壁組件218以延伸於至少一個熱傳送機構與玻璃帶之間,其中當可移除壁組件218不存在時,玻璃帶與至少一個熱傳送機構之間的觀測因子是大於當可移除壁組件218存在時。Although the embodiment shown in FIGS. 2 to 7 shows a modular cassette 210, the first and second opposite major surfaces of the glass ribbon 58 extend in the longitudinal direction (ie, as shown in FIGS. 2, 5 to 7). (The vertical direction shown in the figure), but it should be understood that the embodiments disclosed herein are not so limited and may include any number of modular cassettes extending in the longitudinal direction. Therefore, the embodiments disclosed herein include an MxN matrix device that includes a modular cassette 210 that extends in the longitudinal and lateral directions along at least a portion of the first and second opposing major surfaces of the glass ribbon 58 (where M represents along The number of modular cassettes 210 extending in the lateral direction, and N represents the number of modular cassettes 210 extending in the longitudinal direction), wherein each modular cassette 210 can be independently operated and independently removed and replaced. Each of the modular cassettes 210 may include at least one heat transfer mechanism and a removable wall assembly 218, the removable wall assembly 218 is configured to extend between the at least one heat transfer mechanism and the glass ribbon, wherein when removable When the wall assembly 218 is not present, the observation factor between the glass ribbon and the at least one heat transfer mechanism is greater than when the removable wall assembly 218 is present.

模組化卡匣210的獨立操作與移除及置換以及壁構件218的可移除性對於玻璃製造設備的設計與操作來說是具有較高靈活性的,故可實現利用各種熱傳送機構的無限數量配置,其中可以最短製程停機時間快速改變該些配置(例如,對應於玻璃組成物、玻璃流動速率、玻璃黏度、玻璃溫度、玻璃放射率等等的變化)。舉例來說,在此揭露的實施例包括包含複數個模組化卡匣210的設備的該些實施例,其中不同模組化卡匣210包含或延伸圍繞不同熱傳送機構。在此揭露的實施例亦包括包含複數個模組化卡匣210的設備的該些實施例,其中不同模組化卡匣210包含或延伸圍繞相同操作或不同操作的相同熱傳送機構(例如,在此揭露的實施例包含以相同或不同功率位準操作不同模組化卡匣210的電阻元件214的該些實施例)。在此揭露的實施例亦包括包含複數個模組化卡匣210的設備的該些實施例,其中不同模組化卡匣210包含或延伸圍繞相同或不同的絕緣封裝212。在此揭露的實施例亦包括包含至少一個模組化卡匣210且存在可移除壁組件218的設備的該些實施例,且同時包含至少一個模組化卡匣210且不存在可移除壁組件218的設備的該些實施例。The independent operation and removal and replacement of the modular cassette 210 and the removability of the wall member 218 are highly flexible for the design and operation of the glass manufacturing equipment, so that various heat transfer mechanisms can be used Unlimited number of configurations, where these configurations can be quickly changed with the shortest process downtime (for example, corresponding to changes in glass composition, glass flow rate, glass viscosity, glass temperature, glass emissivity, etc.). For example, the embodiments disclosed herein include those embodiments of devices that include a plurality of modular cassettes 210, where different modular cassettes 210 include or extend around different heat transfer mechanisms. The embodiments disclosed herein also include those embodiments of devices including a plurality of modular cassettes 210, wherein different modular cassettes 210 include or extend around the same heat transfer mechanism of the same operation or different operations (eg, The embodiments disclosed herein include those embodiments that operate the resistance elements 214 of different modular cassettes 210 at the same or different power levels). The embodiments disclosed herein also include those embodiments of a device including a plurality of modular cassettes 210, wherein different modular cassettes 210 include or extend around the same or different insulating packages 212. The embodiments disclosed herein also include those embodiments of devices that include at least one modular cassette 210 and that have a removable wall assembly 218, and also include at least one modular cassette 210 and that there is no removable These embodiments of the device of the wall assembly 218.

儘管已參照熔融下拉製程來描述前述實施例,但應理解此實施例亦可應用於其他玻璃成型製程,例如,浮法製程、狹縫拉製製程、上拉製程以及壓延製程。Although the foregoing embodiment has been described with reference to the melt-down process, it should be understood that this embodiment can also be applied to other glass forming processes, such as a float process, a slit drawing process, a pull-up process, and a calendering process.

可使用此製程來製造玻璃物件,例如,可在電子元件與其他應用中使用該玻璃物件。This process can be used to manufacture glass objects, for example, it can be used in electronic components and other applications.

可實施本發明實施例的各種修飾例與變化例,而不會編離本發明的精神與範疇,這對於在此技術領域中具有通常知識者來說是顯而易見的。因此,意圖使本發明涵蓋該些修飾例與變化例,使該些修飾例與變化例落入後附申請專利範圍以及該些修飾例與變化例的等效例的範疇中。Various modifications and variations of the embodiments of the present invention can be implemented without departing from the spirit and scope of the present invention, which is obvious to those with ordinary knowledge in this technical field. Therefore, it is intended that the present invention covers these modified examples and modified examples, so that the modified examples and modified examples fall within the scope of the attached patent application and the equivalent examples of the modified examples and modified examples.

10‧‧‧玻璃製造設備 10‧‧‧Glass manufacturing equipment

12‧‧‧玻璃熔融爐 12‧‧‧Glass melting furnace

14‧‧‧熔融槽 14‧‧‧melting tank

16‧‧‧上游玻璃製造設備 16‧‧‧Upstream glass manufacturing equipment

18‧‧‧儲倉 18‧‧‧Storage

20‧‧‧原始材料輸送裝置 20‧‧‧ Raw material conveying device

22‧‧‧馬達 22‧‧‧Motor

24‧‧‧原始材料 24‧‧‧ original material

26‧‧‧箭頭 26‧‧‧arrow

28‧‧‧熔融玻璃 28‧‧‧Molten glass

30‧‧‧下游玻璃製造設備 30‧‧‧ Downstream glass manufacturing equipment

32‧‧‧第一連接導管 32‧‧‧First connection catheter

34‧‧‧澄清槽 34‧‧‧Clarification tank

36‧‧‧混合槽 36‧‧‧Mixing tank

38‧‧‧第二連接導管 38‧‧‧Second connection catheter

40‧‧‧輸送槽 40‧‧‧Conveyor

42‧‧‧成型體 42‧‧‧Molded body

44‧‧‧出口導管 44‧‧‧Exit duct

46‧‧‧第三連接導管 46‧‧‧The third connection conduit

48‧‧‧成型設備 48‧‧‧Molding equipment

50‧‧‧入口導管 50‧‧‧Inlet duct

52‧‧‧凹槽 52‧‧‧groove

54‧‧‧會聚成型表面 54‧‧‧Convergence molding surface

56‧‧‧底部邊緣 56‧‧‧Bottom edge

58‧‧‧玻璃帶 58‧‧‧glass ribbon

58A‧‧‧第一末端 58A‧‧‧The first end

58B‧‧‧第一珠區 58B‧‧‧First Pearl District

58C‧‧‧中央區 58C‧‧‧Central

58D‧‧‧第二珠區 58D‧‧‧Second Pearl District

58E‧‧‧第二末端 58E‧‧‧The second end

60‧‧‧拉伸或流動方向 60‧‧‧Stretch or flow direction

62‧‧‧個別玻璃片 62‧‧‧Individual glass

64‧‧‧機械手臂 64‧‧‧Robot

65‧‧‧抓取工具 65‧‧‧Grab tool

72‧‧‧邊緣輥 72‧‧‧Edge Roll

82‧‧‧拉輥 82‧‧‧ Pull roller

100‧‧‧玻璃分離設備 100‧‧‧Glass separation equipment

200‧‧‧殼體 200‧‧‧Housing

202‧‧‧第一與第二側壁 202‧‧‧First and second side walls

206‧‧‧隔離件 206‧‧‧Isolation

208‧‧‧成型體外殼 208‧‧‧Moulded body shell

210‧‧‧模組化卡匣 210‧‧‧Modular cassette

212‧‧‧絕緣封裝 212‧‧‧Insulation package

214‧‧‧電阻元件 214‧‧‧Resistance element

216‧‧‧導管 216‧‧‧Catheter

218‧‧‧可移除壁組件 218‧‧‧Removable wall assembly

220‧‧‧支撐框架 220‧‧‧support frame

222‧‧‧引導特徵 222‧‧‧Guide characteristics

224‧‧‧引導特徵 224‧‧‧Guide features

226‧‧‧引導特徵 226‧‧‧Guide characteristics

228‧‧‧冷卻機構 228‧‧‧cooling mechanism

230‧‧‧加熱機構 230‧‧‧Heating mechanism

A‧‧‧箭頭 A‧‧‧arrow

B‧‧‧箭頭 B‧‧‧arrow

第1圖為熔融下拉玻璃製造設備與製程的實例示意圖。Figure 1 is a schematic diagram of an example of the equipment and process for melting down-drawing glass.

第2圖為玻璃帶成型設備與製程的末端剖視示意圖,包含可移除地設置在設備的第一側壁與第二側壁中的模組化卡匣。Figure 2 is a schematic cross-sectional view of the end of the glass ribbon forming equipment and process, including modular cassettes removably disposed in the first and second side walls of the equipment.

第3圖為第2圖的玻璃帶成型設備與製程的頂端剖視示意圖。FIG. 3 is a schematic cross-sectional view of the top of the glass ribbon forming apparatus and manufacturing process of FIG. 2.

第4圖為第2圖的玻璃帶成型設備與製程的頂端剖視示意圖,其中已將冷卻機構由設備中移除。Figure 4 is a schematic top cross-sectional view of the glass ribbon forming equipment and manufacturing process of Figure 2, in which the cooling mechanism has been removed from the equipment.

第5圖為第4圖的玻璃帶成型設備與製程的末端剖視示意圖,其中已將模組化卡匣由設備中移除。Figure 5 is a schematic cross-sectional view of the end of the glass ribbon forming apparatus and manufacturing process of Figure 4, in which the modular cassette has been removed from the apparatus.

第6圖為第2圖的玻璃帶成型設備與製程的末端剖視示意圖,其中不存在可移除壁組件。FIG. 6 is a schematic cross-sectional view of the end of the glass ribbon forming apparatus and manufacturing process of FIG. 2, where there is no removable wall component.

第7圖為第6圖的玻璃帶成型設備與製程的末端剖視示意圖,其中已將模組化卡匣由設備中移除。FIG. 7 is a schematic cross-sectional view of the end of the glass ribbon forming apparatus and manufacturing process of FIG. 6, in which the modular cassette has been removed from the apparatus.

第8圖為模組化卡匣的側面剖視示意圖,該模組化卡匣可滑動地設置在玻璃帶成型設備的支撐框架上,以及Figure 8 is a schematic side sectional view of a modular cassette, which is slidably arranged on a support frame of a glass ribbon forming apparatus, and

第9圖為可移除壁組件的末端剖視示意圖,該可移除壁組件可滑動地設置在模組化卡匣上。FIG. 9 is a schematic cross-sectional view of the end of the removable wall component that is slidably disposed on the modular cassette.

國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic storage information (please note in order of storage institution, date, number) No

國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Overseas hosting information (please note in order of hosting country, institution, date, number) No

Claims (26)

一種製造一玻璃物件的設備,包含: 一殼體,包含一第一側壁與一第二側壁,配置該殼體以至少部分圍起一玻璃帶,該玻璃帶具有第一相對主要表面與第二相對主要表面,延伸於一縱向與橫向方向中,其中配置該第一側壁與該第二側壁以沿著該玻璃帶的第一相對主要表面與第二相對主要表面的至少一部分延伸於該縱向與橫向方向中;以及一模組化卡匣,可移除地設置在第一側壁與第二側壁的至少一者中,該模組化卡匣包含至少一個熱傳送機構與一可移除壁組件,配置該可移除壁組件以延伸於該至少一個熱傳送機構與該玻璃帶之間,其中當該可移除壁組件不存在時,該玻璃帶與該至少一個熱傳送機構之間的一觀測因子是大於當該可移除壁組件存在時。An apparatus for manufacturing a glass object includes: a housing including a first side wall and a second side wall, the housing is configured to at least partially enclose a glass ribbon, the glass ribbon has a first relatively major surface and a second The relative main surface extends in a longitudinal and lateral direction, wherein the first side wall and the second side wall are configured to extend along the longitudinal and at least a portion of the first and second opposite main surfaces of the glass ribbon In a lateral direction; and a modular cassette, removably disposed in at least one of the first side wall and the second side wall, the modular cassette includes at least one heat transfer mechanism and a removable wall assembly , The removable wall assembly is configured to extend between the at least one heat transfer mechanism and the glass ribbon, wherein when the removable wall assembly is not present, the one between the glass ribbon and the at least one heat transfer mechanism The observation factor is greater than when the removable wall assembly is present. 如請求項1所述之設備,其中該至少一個熱傳送機構包含一加熱機構。The apparatus of claim 1, wherein the at least one heat transfer mechanism includes a heating mechanism. 如請求項1所述之設備,其中該至少一個熱傳送機構包含一冷卻機構。The apparatus of claim 1, wherein the at least one heat transfer mechanism includes a cooling mechanism. 如請求項2所述之設備,其中該模組化卡匣延伸圍繞一冷卻機構。The apparatus of claim 2, wherein the modular cassette extends around a cooling mechanism. 如請求項4所述之設備,其中配置該冷卻機構以延伸於該加熱機構與該玻璃帶之間。The apparatus according to claim 4, wherein the cooling mechanism is configured to extend between the heating mechanism and the glass ribbon. 如請求項5所述之設備,其中該冷卻機構包含一導管,一冷卻流體流動穿過該導管。The apparatus of claim 5, wherein the cooling mechanism includes a duct through which a cooling fluid flows. 如請求項2所述之設備,其中該加熱機構包含一電阻加熱機構。The apparatus according to claim 2, wherein the heating mechanism includes a resistance heating mechanism. 如請求項5所述之設備,其中配置該模組化卡匣為可由該設備移除,接著由該設備移除該可移除壁組件或移除該冷卻機構。The device of claim 5, wherein the modular cassette is configured to be removable by the device, and then the removable wall assembly or the cooling mechanism is removed by the device. 如請求項1所述之設備,其中該可移除壁組件與該側壁共平面,其中可移除地設置該模組化卡匣。The apparatus of claim 1, wherein the removable wall assembly is coplanar with the side wall, wherein the modular cassette is removably provided. 如請求項1所述之設備,其中可移除地設置至少一個模組化卡匣於第一側壁與第二側壁兩者中。The apparatus of claim 1, wherein at least one modular cassette is removably disposed in both the first side wall and the second side wall. 如請求項1所述之設備,其中該設備包含複數個模組化卡匣,獨立操作該複數個模組化卡匣。The device according to claim 1, wherein the device includes a plurality of modular cassettes, and independently operates the plurality of modular cassettes. 如請求項1所述之設備,其中該設備包含至少一個模組化卡匣且存在該可移除壁組件,且該設備包含至少一個模組化卡匣且不存在該可移除壁組件。The apparatus of claim 1, wherein the apparatus includes at least one modular cassette and the removable wall assembly is present, and the apparatus includes at least one modular cassette and the removable wall assembly is not present. 一種製造一玻璃物件的方法,包含:  流動一玻璃帶穿過一殼體,該玻璃帶具有第一相對主要表面與第二相對主要表面,延伸於一縱向與橫向方向中,該殼體包含一第一側壁與一第二側壁,其中該第一側壁與該第二側壁沿著該玻璃帶的第一相對主要表面與第二相對主要表面的至少一部分延伸於該縱向與橫向方向中; 且其中,  將一模組化卡匣可移除地設置在第一側壁與第二側壁的至少一者中,該模組化卡匣包含至少一個熱傳送機構與一可移除壁組件,該可移除壁組件延伸於該至少一個熱傳送機構與該玻璃帶之間,其中當該可移除壁組件不存在時,該玻璃帶與該至少一個熱傳送機構之間的一觀測因子是大於當該可移除壁組件存在時。A method of manufacturing a glass object, comprising: Flowing a glass ribbon through a housing, the glass ribbon having a first relative main surface and a second relative main surface, extending in a longitudinal and lateral direction, the housing includes a A first side wall and a second side wall, wherein the first side wall and the second side wall extend in the longitudinal and lateral directions along at least a portion of the first and second opposing major surfaces of the glass ribbon; and wherein , A modular cassette is removably disposed in at least one of the first side wall and the second side wall, the modular cassette includes at least one heat transfer mechanism and a removable wall assembly, the removable The wall removing component extends between the at least one heat transfer mechanism and the glass ribbon, wherein when the removable wall component is not present, an observation factor between the glass ribbon and the at least one heat transfer mechanism is greater than when When the removable wall assembly is present. 如請求項13所述之方法,其中該至少一個熱傳送機構包含一加熱機構。The method of claim 13, wherein the at least one heat transfer mechanism includes a heating mechanism. 如請求項13所述之方法,其中該至少一個熱傳送機構包含一冷卻機構。The method of claim 13, wherein the at least one heat transfer mechanism includes a cooling mechanism. 如請求項14所述之方法,其中該模組化卡匣延伸圍繞一冷卻機構。The method of claim 14, wherein the modular cassette extends around a cooling mechanism. 如請求項16所述之方法,其中該冷卻機構延伸於該加熱機構與該玻璃帶之間。The method of claim 16, wherein the cooling mechanism extends between the heating mechanism and the glass ribbon. 如請求項17所述之方法,其中該冷卻機構包含一導管,一冷卻流體流動穿過該導管。The method of claim 17, wherein the cooling mechanism includes a conduit through which a cooling fluid flows. 如請求項14所述之方法,其中該加熱機構包含一電阻加熱機構。The method according to claim 14, wherein the heating mechanism includes a resistance heating mechanism. 如請求項17所述之方法,其中該方法進一步包含:由該設備移除該模組化卡匣,接著由該設備移除該可移除壁組件或該冷卻機構。The method of claim 17, wherein the method further comprises: removing the modular cassette from the device, and then removing the removable wall assembly or the cooling mechanism from the device. 如請求項13所述之方法,其中該可移除壁組件與該側壁共平面,其中可移除地設置該模組化卡匣。The method of claim 13, wherein the removable wall assembly is coplanar with the side wall, wherein the modular cassette is removably disposed. 如請求項13所述之方法,其中可移除地設置至少一個模組化卡匣於第一側壁與第二側壁兩者中。The method of claim 13, wherein at least one modular cassette is removably disposed in both the first side wall and the second side wall. 如請求項13所述之方法,其中該方法進一步包含:由該設備移除該模組化卡匣,且將該模組化卡匣置換為包含至少一個熱傳送機構的一模組化卡匣,該至少一個熱傳送機構比由該設備移除的該模組化卡匣中的該熱傳送機構影響更多數量或更少數量的來自該玻璃帶的熱傳送。The method of claim 13, wherein the method further comprises: removing the modular cassette from the device, and replacing the modular cassette with a modular cassette including at least one heat transfer mechanism The at least one heat transfer mechanism affects a greater or lesser amount of heat transfer from the glass ribbon than the heat transfer mechanism in the modular cassette removed by the device. 如請求項13所述之方法,其中該方法進一步包含:獨立操作複數個模組化卡匣。The method according to claim 13, wherein the method further comprises: independently operating a plurality of modular cassettes. 一種玻璃物件,由如請求項13所述之方法所製造。A glass object manufactured by the method described in claim 13. 一種電子元件,包含如請求項25所述之玻璃物件。An electronic component comprising the glass object as described in claim 25.
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