TW201905585A - 圖形圖案之形狀修正裝置及形狀修正方法、程式以及資訊記錄媒體 - Google Patents

圖形圖案之形狀修正裝置及形狀修正方法、程式以及資訊記錄媒體

Info

Publication number
TW201905585A
TW201905585A TW107120657A TW107120657A TW201905585A TW 201905585 A TW201905585 A TW 201905585A TW 107120657 A TW107120657 A TW 107120657A TW 107120657 A TW107120657 A TW 107120657A TW 201905585 A TW201905585 A TW 201905585A
Authority
TW
Taiwan
Prior art keywords
pattern
correction
offset
graphic pattern
evaluation point
Prior art date
Application number
TW107120657A
Other languages
English (en)
Chinese (zh)
Inventor
下村剛哉
大川洋平
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW201905585A publication Critical patent/TW201905585A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biophysics (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Biomedical Technology (AREA)
  • Power Engineering (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW107120657A 2017-06-19 2018-06-15 圖形圖案之形狀修正裝置及形狀修正方法、程式以及資訊記錄媒體 TW201905585A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2017-119472 2017-06-19
JP2017119472 2017-06-19

Publications (1)

Publication Number Publication Date
TW201905585A true TW201905585A (zh) 2019-02-01

Family

ID=64737678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120657A TW201905585A (zh) 2017-06-19 2018-06-15 圖形圖案之形狀修正裝置及形狀修正方法、程式以及資訊記錄媒體

Country Status (3)

Country Link
JP (1) JP6508504B1 (ja)
TW (1) TW201905585A (ja)
WO (1) WO2018235669A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113703277A (zh) * 2020-05-20 2021-11-26 中芯国际集成电路制造(上海)有限公司 图形修正方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794376A (ja) * 1993-09-20 1995-04-07 Fujitsu Ltd 露光パターンデータの補正方法
JP3097907B2 (ja) * 1997-06-19 2000-10-10 株式会社日立製作所 電子線描画装置
US6584609B1 (en) * 2000-02-28 2003-06-24 Numerical Technologies, Inc. Method and apparatus for mixed-mode optical proximity correction
JP3686367B2 (ja) * 2001-11-15 2005-08-24 株式会社ルネサステクノロジ パターン形成方法および半導体装置の製造方法
JP4543614B2 (ja) * 2003-03-18 2010-09-15 凸版印刷株式会社 フォトマスクの製造方法および半導体集積回路の製造方法
JP4461806B2 (ja) * 2004-01-06 2010-05-12 凸版印刷株式会社 パターン描画装置及びパターン描画方法ならびにそのプログラム、フォトマスクとその製造方法および半導体集積回路とその製造方法
JP4649187B2 (ja) * 2004-12-07 2011-03-09 株式会社東芝 荷電ビーム描画データの作成方法、荷電ビーム描画方法および荷電ビーム描画装置
JP5063071B2 (ja) * 2006-02-14 2012-10-31 株式会社ニューフレアテクノロジー パタン作成方法及び荷電粒子ビーム描画装置
JP2008071928A (ja) * 2006-09-14 2008-03-27 Nuflare Technology Inc 描画パターンのリサイズ方法及び荷電粒子ビーム描画方法
JP5020849B2 (ja) * 2008-02-13 2012-09-05 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置、パターンの寸法誤差補正装置及びパターンの寸法誤差補正方法
JP2010044101A (ja) * 2008-08-08 2010-02-25 Toshiba Corp パターン予測方法、プログラム及び装置

Also Published As

Publication number Publication date
WO2018235669A1 (ja) 2018-12-27
JP6508504B1 (ja) 2019-05-08
JPWO2018235669A1 (ja) 2019-06-27

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