TW201901711A - 線圈封裝模組 - Google Patents
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Abstract
一種線圈封裝模組,包含一個殼體、數支安裝在該殼體上的端子,以及至少一個線圈單元,該殼體具有至少一個端子安裝部,該端子安裝部具有一個基面、數個由該基面往下突出的突塊,以及數個分別介於相鄰之該等突塊間的凹槽,每支端子都具有一個突出於該殼體的接腳段,以及一個伸入其中一個凹槽內的焊接段,該焊接段具有一個焊接面,以及一個與該焊接面彎折連接的轉折導引面,該線圈單元具有數個線頭,每個線頭都具有一個與該焊接面貼合的結合段,以及一個可勾掛在相對應之該端子的該轉折導引面上的勾掛段,前述結構的配合,可以提高焊接作業的方便性。
Description
本發明是關於一種模組,特別是指一種可將數個線圈單元封裝在一個殼體內的線圈封裝模組。
參閱圖1、2,是證書號數M416890號新型專利,該新型專利公開一種線圈封裝模組1,其包含一個殼體11、數支安裝在該殼體11上的端子12,以及數個擺放在該殼體11內部並分別與該等端子12的其中數支電連接的線圈單元13,該殼體11具有一個界定出一個容置空間110的殼壁111,該殼壁111具有兩個位於該容置空間110相反側的端子安裝部112,每個端子安裝部112都具有一個朝向該容置空間110的內側面113、一個與該內側面113平行間隔的外側面114、一個與該內側面113垂直連接並水平往外延伸的基面115,以及數個彼此間隔並介於該基面115及該外側面114之間的突塊116。
該等端子12是左右兩排且間隔的組裝在所述端子安裝部112上,每個端子12都具有一個埋設在相對應之該端子安裝部112內的埋腳段121、一個突出於該外側面114的接腳段122,以及一個一體連接在該埋腳段121及該接腳段122之間的焊接段123,該焊接段123是水平的突出相對應之該端子安裝部112的該基面115。每個線圈單元13都具有數個可與其中一個端子12的該焊接段123電連接的線頭131。
組裝時,將每個線圈單元13的所述線頭131分別拉到相對應之該端子12的該焊接段123底部,接著,利用鍍錫加工,將每個線頭131電連接的組接在相對應之該端子12的該焊接段123處,即可完成該線圈封裝模組1的組裝作業。
前述新型專利雖然可以利用鍍錫加工,將每個線頭131結合在相對應之該端子12的該焊接段123處,但是在組裝及焊接的過程中,每個線頭131都只是擺靠在相對應之該端子12的該焊接段123的底部,由於前述線頭131只是平直擺靠在相對應之該端子12的該焊接段123底部,因此,在擺靠後,該等線頭131在缺乏定位的情況下容易移動,甚至掉落,故前述新型專利的焊接品質不佳,製造過程也容易產生瑕疵品。
本發明的目的是在提供一種能夠克服先前技術的至少一個缺點的線圈封裝模組。
本發明的線圈封裝模組包含一個殼體、數支安裝在該殼體上的端子,以及至少一個與所述端子電連接的線圈單元,該殼體具有至少一個端子安裝部,該至少一個端子安裝部具有一個基面、數個由該基面往下突出並間隔設置的突塊,以及數個分別介於相鄰之該等突塊間的凹槽,每支端子都具有一個突出於該殼體的接腳段,以及一個伸入其中一個凹槽內的焊接段,該焊接段具有一個垂直於該基面的焊接面,以及一個與該焊接面彎折連接的轉折導引面,該至少一個線圈單元具有數個線頭,每個線頭都具有一個與該焊接面貼合的結合段,以及一個與該結合段連接並勾掛在相對應之該端子的該轉折導引面的勾掛段。
本發明的功效在於:藉由改變該等端子的結構,可以讓每個線頭穩固的跨靠在相對應之該端子的焊接段上,藉以提高該線圈封裝模組的焊接品質及良率。
參閱圖3至圖6,本發明線圈封裝模組的一個實施例包含一個殼體2、數支安裝在該殼體2上的端子3,以及數個安裝在該殼體2內並分別與所述端子3的其中數支電連接的線圈單元4。該殼體2具有一個殼壁20,以及一個由殼壁20界定而成的容置空間21,該殼壁20具有一個矩形的頂壁部22,該頂壁部22具有兩個平行間隔的長邊221,以及兩個垂直連接在該等長邊221之間的短邊222。該殼壁20還具有兩個分別由該等頂壁部22之長邊221往下延伸的端子安裝部23,以及兩個分別由該等短邊222往下延伸的連接部24,前述連接部24並與該等端子安裝部23垂直連接。
每個端子安裝部23都具有一個朝向該容置空間21的內側面231、一個與該內側面231平行間隔的外側面232、一個垂直連接在該內側面231及該外側面232之間的基面233、數個沿著長度方向設置的突塊234,以及數個分別介於相鄰之該等突塊234之間的凹槽235,每個突塊234都具有至少一個朝向相鄰之該凹槽235的抵靠面238。又該基面233具有數個傾斜並連接在該內側面231及其中一個凹槽235間的斜面區域239。
本實施例的所述端子3是左右對稱的安裝在該殼體2的該等端子安裝部23上,並沿著長度方向間隔,每支端子3都具有一個埋設在相對應之該端子安裝部23內的埋腳段31、一個呈曲折狀並由相對應之該端子安裝部23的該外側面232突出的接腳段32,以及一個與該埋腳段31連接並突出於該基面233的焊接段33。該埋腳段31是一個L形的結構,並具有一個鄰近相對應之該端子安裝部23之該基面233並與該焊接段33一體連接的第一端311,以及一個鄰近相對應之該端子安裝部23的該外側面232並與該接腳段32一體連接的第二端312,該接腳段32的形式並無特別的限制,只要可以結合在圖中未示出的一個電路板上即可。
而該焊接段33是插設在該殼體2的其中一個凹槽235內,並具有一個朝向該容置空間21的內表面331、一個與該內表面331平行的焊接面332,以及一個垂直連接在該內表面331及該焊接面332之間的轉折導引面333,該轉折導引面333並頂靠在相鄰近的所述突塊234的所述抵靠面238間。每個線圈單元4都具有數個線頭41,每個線頭41都具有一個勾掛在相對應之該端子3的該轉折導引面333上的勾掛段411,以及一個自與該勾掛段411延伸並與該焊接面332貼合的結合段412,由於前述線圈單元4為習知結構,不再詳述。
本實施例該線圈封裝模組在製造時,該等端子3也是先擺放在成型模具內部,然後以塑膠材料射出成型該殼體2,製造後,受到兩兩相鄰之該等突塊234的夾持,每支端子3都可以穩固的結合在該殼體2上。接著,將該等線圈單元4擺放在該殼體2之該容置空間21內,同時讓每個線圈單元4的每個線頭41分別往相對應的該端子3導引並拉伸,每個線頭41都是傾斜的通過該殼體2上相對應的該斜面區域239,然後勾掛在該端子3的該轉折導引面333,最後垂直往上彎繞,並貼靠在該端子3的該焊接面332外側,即每個線頭41都是以U形曲折的方式勾掛在相對應之該端子3的該焊接段33上,最後在每個端子3的該焊接面332處施以焊錫,即可將該等線圈單元4的每個線頭41電連接的安裝在每個端子3的該焊接面332處。附帶說明的是,本實施例該線圈封裝模組在組裝時,整個結構體是反向置放,故前述線頭41可輕易並穩固的勾掛在相對應之該端子3的該焊接段33上。
由以上說明可知,本發明改變該等端子3的結構,以及每個線圈單元4的所述線頭41與相對應之該端子3的接觸方式,確實可以讓每個線頭41都以類似U形曲折的方式勾掛在相對應之該端子3上,此種結構可以讓每個線頭41穩固的勾掛在相對應的端子3上,因此,本發明不僅在焊接加工時相當方便,也可以提高焊接品質及成品的良率。
惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。
2‧‧‧殼體
20‧‧‧殼壁
21‧‧‧容置空間
22‧‧‧頂壁部
221‧‧‧長邊
222‧‧‧短邊
23‧‧‧端子安裝部
231‧‧‧內側面
232‧‧‧外側面
233‧‧‧基面
234‧‧‧突塊
235‧‧‧凹槽
238‧‧‧抵靠面
239‧‧‧斜面區域
24‧‧‧連接部
3‧‧‧端子
31‧‧‧埋腳段
311‧‧‧第一端
312‧‧‧第二端
32‧‧‧接腳段
33‧‧‧焊接段
331‧‧‧內表面
332‧‧‧焊接面
333‧‧‧轉折導引面
4‧‧‧線圈單元
41‧‧‧線頭
411‧‧‧勾掛段
412‧‧‧結合段
本發明的其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是證書號數M416890號新型專利的一個仰視立體圖; 圖2是圖1之新型專利的一個組合剖視圖; 圖3是本發明線圈封裝模組的一個實施例的一個仰視立體圖; 圖4是該實施例的一個仰視圖,說明該線圈封裝模組的一個殼體及數支端子的相對關係,為了方便區別,圖中標示黑點的區域為所述端子; 圖5是該實施例的一個組合剖視圖;及 圖6是該實施例的一個側視圖,亦說明該殼體及所述端子,圖中標示黑點的區域亦為所述端子。
Claims (8)
- 一種線圈封裝模組,包含: 一個殼體,具有至少一個端子安裝部,該至少一個端子安裝部具有一個基面、數個由該基面突出並間隔設置的突塊,以及數個分別介於相鄰之該等突塊間的凹槽; 數支端子,安裝在該殼體上,每支端子都具有一個突出於該殼體的接腳段,以及一個伸入其中一個凹槽內的焊接段,該焊接段具有一個垂直於該基面的焊接面,以及一個與該焊接面彎折連接的轉折導引面;及 至少一個線圈單元,具有數個線頭,每個線頭都具有一個與相對應之該端子的該焊接面貼合的結合段,以及一個與該結合段連接並勾掛在相對應之該端子的該轉折導引面上的勾掛段。
- 如請求項1所述的線圈封裝模組,其中,每支端子還都具有一個連接在該接腳段及該焊接段之間的埋腳段,該埋腳段是一個彎折的結構,並被嵌埋在該殼體的該至少一個端子安裝部內。
- 如請求項2所述的線圈封裝模組,其中,每支端子的該焊接段還都具有一個與該焊接面平行的內表面,該轉折導引面是垂直的連接在該內表面及該焊接面之間。
- 如請求項1所述的線圈封裝模組,其中,該殼體具有一個殼壁,以及一個由該殼壁界定而成並用來容置該至少一個線圈單元的容置空間,該殼體具有兩個位於該容置空間相反側的所述端子安裝部,每個端子安裝部還都具有一個朝向該容置空間的內側面,以及一個與該內側面間隔的外側面,每支端子還都具有一個連接在該接腳段及該焊接段之間的埋腳段,該埋腳段是一個彎折的結構,並被嵌埋在該殼體上相對應之該端子安裝部內。
- 如請求項4所述的線圈封裝模組,其中,每支端子的該埋腳段都具有一個鄰近相對應之該端子安裝部的該基面並與該焊接段連接的第一端,以及一個鄰近相對應之該端子安裝部的該外側面並與該接腳段連接的第二端。
- 如請求項4所述的線圈封裝模組,其中,每支端子還都具有一個鄰近該容置空間並與該焊接面平行的內表面,而該轉折導引面是垂直的連接在該內表面及該焊接面之間。
- 如請求項6所述的線圈封裝模組,其中,該殼體的該殼壁還具有一個矩形的頂壁部,該頂壁部具有兩個平行的長邊,以及兩個彼此間隔並與所述長邊垂直連接的短邊,該等端子安裝部分別由與該頂壁部的其中一個長邊往下延伸,又該殼壁還具有兩個分別由該頂壁部的所述短邊往下延伸的連接部,前述連接部並與該等端子安裝部垂直連接,並共同圍繞該容置空間。
- 如請求項4所述的線圈封裝模組,其中,每個突塊都具有至少一個朝向其中一個凹槽並與相對應之該端子的該焊接段抵靠的抵靠面。
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JP2017004598U JP3214104U (ja) | 2017-05-09 | 2017-10-06 | 電子装置のパッケージモジュール |
US15/782,285 US10051757B1 (en) | 2017-05-09 | 2017-10-12 | Electronic package module |
KR1020170133214A KR102424716B1 (ko) | 2017-05-09 | 2017-10-13 | 전자 패키지 모듈 |
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KR102424716B1 (ko) | 2022-07-25 |
US10051757B1 (en) | 2018-08-14 |
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