TW201843758A - Die bonding device and method for manufacturing semiconductor device capable of reliably removing foreign matters with strong adhesion without scattering the foreign matters - Google Patents

Abstract

The object of the present invention is to provide a collet-cleanable die bonding device capable of reliably removing foreign matters with strong adhesion without scattering the foreign matters. The solution of the present invention is a die bonding device comprising a pickup head configured to make an element forming surface side of a die sucked by a suction surface of a collet provided at the front end, so as to pick up the die from a wafer; a cleaning device which comprises a brush for removing foreign matters on the suction surface, a suction unit for sucking the foreign matters, a driving unit for rotating the brush along the suction surface, and a control unit configured to control the pickup head and the cleaning device. A brush surface of the aforementioned brush has a rectangular shape. The control unit is configured to bring the brush into contact with the suction surface, so as to rotate the brush while moving the suction surface of the collet along a straight line or in a circular manner by using the suction surface of the collet as a center, and use the suction unit to suck the removed foreign matters.

Description

Sticky crystal device and manufacturing method of semiconductor device

[0001] This case relates to a die attach device, and is applicable to, for example, a semiconductor manufacturing device including a chuck cleaning device.

[0002] A part of a manufacturing process of a semiconductor device includes a process of mounting a semiconductor wafer (hereinafter referred to as a die) on a wiring board, a lead frame, or the like (hereinafter referred to as a substrate) and combining the packaging, and a part of the process of combining packaging includes A process of dividing a die from a semiconductor wafer (hereinafter referred to as a wafer) and a bonding process of mounting the divided die on a substrate. As a manufacturing apparatus used for the bonding process, there is a die attaching device such as a die attaching machine. [0003] A die bonder is a device that uses solder, gold plating, and resin as bonding materials to bond (attach) the crystals to the substrate or the bonded crystals. In a die-bonding machine that bonds crystal grains to the surface of a substrate, for example, a suction nozzle called a chuck is used to pick up the crystal grains from a wafer, pick them up, transfer them to the substrate, apply a pressing force, and heat the bonding material. This joining operation (work) is repeated. The chuck is a holder having an adsorption hole to attract air while adsorbing and holding crystal grains. [Prior Art Document] [Patent Document] [0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-58575

(Problems to be Solved by the Invention) [0005] In the series of operations described above, since the crystal grains need to be adsorbed on the chuck, there is a gap between the crystal grains and the front end portion (adsorption surface) of the chuck. When the chip of the wafer produced by the dicing process is mainly a foreign matter adhesion. If the amount of adhesion is more than a predetermined amount, the element portion or the protective film of the crystal grains may be damaged, or the wiring may be broken.课题 The object of this case is to provide a sticky crystal device which reduces the scattering of the foreign matter adhering to the chuck and can remove the foreign matter. Other problems and novel features can be clearly understood from the description of this specification and the drawings. (Means to Solve the Problem) [0006] The outline of the representative in this case is briefly explained as follows. That is, the die sticking device is provided with: (i) a pick-up head that picks up the element formation surface side of the crystal grains to the suction surface of a chuck provided at the front end to pick up the crystal grains from the wafer; (ii) a cleaning device that includes: A brush for removing the foreign matter on the suction surface, a suction part for sucking the foreign matter, and a driving part for rotating the brush along the suction surface; (ii) a control part that controls the pickup head and the cleaning device. The brush surface of the brush is rectangular. The control unit rotates the brush while the brush is in contact with the suction surface, the suction surface of the chuck is moved linearly or the center of the suction surface of the chuck is drawn in a circle, and the brush is rotated by the suction unit. Suction removed foreign matter. [Effects of the Invention] [0007] According to the above-mentioned sticky crystal device, the scattering of the foreign matter adhering to the chuck can be reduced, and the foreign matter can be removed.

[0009] Below, Use drawings to explain related embodiments, Examples and Comparative Examples. but, In the following description, In some cases, the same reference numerals are attached to the same constituent elements, and redundant descriptions may be omitted. In addition, To make the description clearer, Compared to the actual form, Sometimes it shows the width of each part, thickness, Shape, etc. But after all, it's just one example. It does not limit the interpreter of this invention.  [0010] The inventor of this case reviewed the situation of cleaning the chuck by rotating the brush. FIG. 23 is a schematic diagram showing a trajectory of a rotating brush. As shown in Figure 23, Just touch the rotating brush to the chuck, There is less movement of the brush in the center, When foreign matter cannot be removed.  [0011] Again, For circular brushes (disc brushes with a circular brush face), Foreign matter removed from the chuck, Because after one side rotates, While brush face comes continuously, Therefore, it becomes a situation where it gets caught in a brush (residual).  [0012] Secondly, The chuck cleaning according to the embodiment will be described with reference to FIGS. 24 to 26. 24 to 26 are schematic views showing how the chuck cleaning brush and the chuck move according to the embodiment.  [0013] In an embodiment, As shown in Figure 24, Rotate (rotate) the rectangular brush around the center of the brush. And move the chuck, This allows the center of rotation of the brush to move relative to the chuck (relatively move), Therefore, foreign matter in the entire chuck can be removed.  [0014] The movement of the chuck is in addition to the left and right (Y direction) only, Back and forth (Y direction), Back and forth (X direction) only, Back and forth (X direction), In addition to linear movements in the X and Y directions, As shown in Figure 25, Without changing the direction of the chuck, The chuck is rotated (revolved) around an axis that is offset from the center of the chuck. also, As shown in Figure 26, The brush is moved while the chuck is rotated (rotated) around the center of the chuck. The movement of the brush is the same as the movement of the chuck, In addition to the left and right (Y direction), Back and forth (Y direction), Back and forth (X direction) only, Back and forth (X direction), In addition to linear movements in the X and Y directions, You can also make the brush revolve.  [0015] Again, If a suction part is provided around the rectangular brush, The foreign matter after the brush is removed is that the brush surface is not there, Therefore, it is sucked by the suction of the suction part of the outer periphery of the brush, Will also leave from the brush side, Re-adhesion of foreign matter can also be prevented.  [0016] Again, When the diameter of the circular brush is the same as the length of the long side of the rectangular brush, Since the rectangular brush has a small brush area, Therefore, the suction area (the area of the brush portion attracted by the suction portion) can be reduced, Can be efficiently attracted.    [Embodiment] [0017] FIG. 1 is a schematic top view of a die attacher of an embodiment. Figure 2 is viewed from the direction of arrow A in Figure 1, A diagram illustrating the operation of the bonding head 41.  区分 The sticky crystal machine 10 is roughly divided into:  Crystal supply unit 1, It is supplied to the die D mounted on the substrate P;  JOIN 4, It picks up the crystal grains from the crystal grain supply unit 1, Bonding the picked-up die D to the substrate P or the bonded die;  Chuck cleaning device 60, It is a foreign substance on the grain adsorption surface of the cleaning chuck 6;  Transportation Department 5, It is to transfer the substrate P to the bonding position;  Substrate supply section 9K, This is to supply the substrate P to the transfer section 5;  Substrate carrying-out section 9H, It accepts the mounted substrate P; And control section 7, It monitors and controls the operation of each unit.  [0018] First, The die supply unit 1 has: Picking device 12 holding wafer 11, And a jacking unit 13 shown by a dotted line to jack up the die D from the wafer 11. The die supply unit 1 is moved in the XY direction (horizontal direction) by a driving means (not shown). The picked-up die D is moved to the position of the jack unit 13.  [0019] The joint 4 is provided with:  Engagement head 41, It picks up die D from wafer 11, Bonded to the transferred substrate P;  YDrive43, It moves the joint head 41 in the Y direction;  Substrate recognition camera 44, This is a position identification mark (not shown) for picking up the transferred substrate P. Identify the joining position of the die D to be joined; And Grain pose recognition camera 45, This is to detect the posture of the die D picked up from the wafer 11.  As shown in Figure 2, The joint head 41 is a chuck jig 6h having a chuck 6 detachably held at a front end thereof. The chuck 6 has a suction hole (not shown) connected to a suction pump (not shown) via the joint head 41, The crystal grains D are adsorbed and held by the adsorption holes. The chuck 6 has a square shape as a plane, The same size as the grain D.  [0020] The chuck cleaning device 60 is provided between a pick-up position where the die D is picked up from the wafer 11 and a bonding position where the die is placed and pressed for bonding, As described later, The foreign matter on the suction surface of the crystal grain D of the chuck 6 is removed and cleaned by the brush 61.  [0021] With such a structure, The bonding head 41 performs a bonding operation indicated by a thin dotted line in FIG. 2. That is, the posture of the die D is corrected according to the imaging data of the die posture recognition camera 45, Bonding the die to the substrate P based on the imaging data of the substrate recognition camera 44, It returns to the pickup position of the wafer 11 again.  [0022] And, The joint head 41 performs a cleaning operation indicated by a thick dotted line, That is, at the right time, For example, after starting a series of joining operations, During or after the action, Move to the position of the chuck cleaning device 60, The chuck 6 is cleaned.  Therefore, A suitable installation position of the chuck cleaning device 60 is preferably provided at a position that does not hinder the moving path of the joint head 41 during the joint operation. but, If the joint operation is blocked or the installation place is not sufficiently obtained, The position may be shifted outside the ends of the normal path or the substrate conveyance direction of the normal path. Anyway, It suffices if it is provided in the movable range of the joint head 41.  [0023] The transportation unit 5 is provided with: A substrate transfer tray 51 on which one or more substrates P (four in FIG. 1) are placed, And the tray rail 52 where the substrate transfer tray 51 moves, Number 1 with the same structure in parallel The second transfer section. The substrate transfer tray 51 uses a ball screw (not shown) provided along the tray rail 52 to drive a nut (not shown) provided on the substrate transfer tray 51. Take this move.  [0024] With such a structure, The substrate transfer tray 51 mounts the substrate P on the substrate supply section 9K. Along the tray track 52 to the engaged position, After joining, Move to the substrate carrying-out section 9H, The substrate P is delivered to the substrate carrying-out portion 9H. First The second transfer unit is driven independently of each other, In the substrate P bonding die D placed on one of the substrate transfer trays 51, The other substrate transfer tray 51 carries the substrate P, Back to the substrate supply unit 9K, Preparations for placing a new substrate P and the like are made.  [0025] The control section 7 is provided with:   Memory, It is a program (software) that stores and monitors the operation of each part of the sticky crystal machine 10; And Central Processing Unit (CPU), It executes programs stored in memory.  The control unit 7 takes in image information from the substrate recognition camera 44 and the die posture recognition camera 45, Various information such as the position of the joint head 41, Controlling the joining operation and cleaning operation of the joining head 41, Each operation of each component, such as a cleaning operation of the chuck cleaning device 60.  [0026] Secondly, The configuration of the pickup device 12 will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing an external perspective view of the pickup device of FIG. 1. FIG. 4 is a schematic cross-sectional view showing a main part of the pickup device of FIG. 1.  As shown in Figure 3, As shown in Figure 4, The pickup device 12 has:  Expansion ring 15, It holds the wafer ring 14;  Support ring 17, It positions the dicing tape 16 with a plurality of dies D adhered to the wafer ring 14 positioned horizontally; And jacking unit 13, It is arranged inside the support ring 17, It is used to lift the die D to the top.  The jacking unit 13 can be moved in the vertical direction by a driving mechanism (not shown). The pickup device 12 is movable in a horizontal direction.  [0027] The pick-up device 12 is The expansion ring 15 holding the wafer ring 14 is lowered. the result, The dicing tape 16 held by the wafer ring 14 is stretched, Increase the interval between grains D, The die D is jacked from below the die by the jacking unit 13, The pick-up property of the crystal grain D is improved. Between the die D (wafer 11) and the dicing tape 16, a film-shaped adhesive material called a die bonding film (hereinafter referred to as DAF) 18 is attached. On wafer 11 with DAF18, Dicing is performed on wafer 11 (die D) and DAF18. therefore, In the stripping project, The wafer 11 and the DAF 18 are peeled from the dicing tape 16.  [0028] When cutting, Foreign matter that mainly generates Si debris on wafers (Si) Attached to the chuck 6 during the peeling process. Since the adsorption surface of the chuck 6 is in contact with the element forming surface of the crystal grain D, Therefore, once the amount of adhesion has reached a predetermined amount or more, There is a possibility of damaging the element part or the protective film of the crystal grain, Or the wiring is broken.  [0029] Second, The chuck cleaning device 60 will be described.  [0030] FIG. 5 is a configuration diagram showing the chuck cleaning device of FIG. 1. Fig. 5 (a) is a view of the chuck cleaning device viewed from the direction of arrow A in Fig. 1. FIG. 5 (b) is a view of the chuck cleaning device viewed from the direction of arrow B in FIG. 5 (a). Figure 5 (c), Figure 5 (d) corresponds to Figure 5 (a), Figure 5 (b), Indicates that the joint head 41 is lowered, In contact with the brush 61, Diagram of the state of the cleaning action. FIG. 6 is a configuration diagram showing a brush. Figure 6 (a) is the top view, FIG. 6 (b) is a side view seen from the direction of the arrow A1 in FIG. 6 (a), FIG. 6 (c) is a side view of FIG. 6 (a) viewed from the direction of the arrow A2.  [0031] The chuck cleaning device 60 has:  刷 61, It is the adsorption surface of the grain D of the cleaning chuck 6;  Suction section 63, It is attached to the lower part of the brush 61, Attracts foreign matter such as silicon (Si) shavings in the brush 61;  Move frame 62, It is a fixed brush 61 and a suction part 63, With a nut 62n inside;  Driving section 65, It is a mobile brush 61; And Fixing part 66, This is to fix these components to a mechanism (not shown) of the die attach machine 10.  003 [0032] The brush 61 is ideally an ultra-fine metal brush, As a metal of wool, It is preferable to have softness such as SUS (stainless steel). and, The diameter of the hair of the brush 61, It is best to keep the elastic diameter to some extent. If there is softness like SUS, Then, the wire diameter may be about ten μm to several hundreds μm.  [0033] More specifically, The brush 61 is, for example, a wire diameter of 30 μm, 6mm SUS metal wire, For example, rectangular brush holders 61B are inserted in a grid or staggered pattern, The brush portion 61H is formed in a rectangular shape in plan view. Rectangle is a corner with arcs, At least the long side has the shape of the width of the chuck 6. The length (LB) of the brush effective portion in the longitudinal direction is a length having at least the width of the chuck 6. all in all, Determine the wire diameter, Length and length of the short side of the rectangle. Scheduled flexibility, Or wire diameter, The length and the length of the rectangular short side can be determined by experiments. In addition, The extending direction of the short side of the brush 61 is the moving direction (Y direction) of the brush 61, The length (width (WE)) of the short side of the brush effective portion of the brush 61 is shorter than the length in the Y direction of the chuck 6, Keep it as short as possible. In order to avoid the movement of the removed foreign matter by the brush 61, Attach to the chuck 6 again.  [0034] The brush 61 is an adsorption surface of the crystal grain D even if it is pressed against the chuck 6, The removal rate will not increase, The degree of light contact (the amount of advancement of the brush 61 after the brush portion 61H contacts the chuck 6 is approximately 0 to 1 mm) is desirable. If the brush 61 is a conductive metal, By grounding the brush 61, The charge (discharge) charged to the chuck 6 can be removed. The brush base 61B has a plurality of holes penetrating from the top to the bottom. It communicates with the suction part 63.  [0035] The suction portion 63 is formed in the moving frame portion 62, have: The suction hole portions 63a provided on both sides of the ball joint 65b for driving, A connecting portion 63b connecting the two suction hole portions 63a, 63h from the soft connection piping provided by the suction pump (not shown), And a connection bolt 63s to which a connection pipe is connected.  [0036] The driving section 65 is provided with:  Ball joint 65b, It engages with a nut 62n fixed to the moving frame portion 62, Supported by the fixed portion 66;  Motor 65m, It rotates the ball joint; And g 2 rails 65g, It is provided on both sides of the fixed portion 66 formed by the recessed portion formed in the moving frame portion 62.  [0037] Using FIG. 2 7. The following describes the bonding operation of the bonding head 41 to the substrate P and the cleaning operation of the chuck 6 of the chuck cleaning device 60. 7 is a flowchart showing a bonding operation and a chuck cleaning operation of the die attacher of FIG. 1. FIG. 8 is a flowchart showing brush cleaning and brush replacement of the chuck cleaning device of FIG. 1. FIG. Figure 9 (a), Fig. 9 (b) shows the correspondence with Fig. 5 (c), Figure 5 (d), Means that the joint head is lowered and comes into contact with the brush, Diagram of state of brush cleaning action.  [0038] First, The operation before joining and the operation after finishing will be described. The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown), Moved into the die attach machine 10. The control unit 7 supplies the wafer ring 14 to the die supply unit 1 from a wafer cassette filled with the wafer ring 14. and, Prepare substrate P, Moved into the die attach machine 10. The control unit 7 mounts the substrate P on the substrate transfer tray 51 with the substrate supply unit 9K.  [0039] After joining, The control unit 7 uses the substrate carrying-out unit 9H to take out the substrate P to which the die D is bonded from the substrate carrying tray 51. The substrate P is carried out from the die attacher 10.  [0040] Second, The joint operation will be described. usually, The joining operation shown by the thin dotted line in FIG. 2 is repeated. In the joining action, The control unit 7 sucks and picks up the die D pushed up from the wafer 11 by the jacking unit 13 by the chuck 6 mounted on the tip of the bonding head 41 (step B1). While the picked-up die D moves to the joining position, The control unit 7 recognizes the posture of the crystal grain D by the crystal grain posture recognition camera 45, Based on the recognition results, The posture of the crystal grain D is corrected by rotating the chuck 6 by the bonding head 41 (step B2). The control unit 7 joins the die D to the substrate P transferred by the tray rail 52 (step B3). The control unit 7 returns the bonding head 41 from the wafer 11 to the pickup position of the die D (step B4).  [0041] During the aforementioned joining operation, Per predetermined number of engagements, On the way back to the pickup position of step B4, The control unit 7 picks up the suction surface of the chuck 6 with the crystal orientation recognition camera 45, Judge the cleaning of the chuck 6 (step J1, J2). This cleaning is not judged to clean the chuck every time it is engaged, But minimize the number of cleanings, Reduce cleaning time (improve processing capacity). The judgment of whether or not is performed is made by judging the number or size of foreign matters such as Si chips in a predetermined region of the adsorption surface. The predetermined area is, for example, an area which is designated to have a step difference and is easily dirty. Of course, it can also be judged in the area of the adsorption surface. Time-consuming image processing, Or once the video is taken, Image processing is performed after the next bonding process or after the second bonding process, It is determined whether cleaning of the chuck 6 is necessary. Once the control unit 7 determines whether the chuck 6 is clean, Then go to step B4.  [0042] Once the control unit 7 determines that cleaning of the chuck 6 is necessary, Then, the cleaning operation represented by the thick dotted line shown in FIG. 2 is entered. The control unit 7 moves the chuck 6 (the joint head 41) down to an upper portion of the chuck cleaning device 60, As shown in Figure 5 (c) (d), The brush 61 is brought into contact (step C1). then, The control unit 7 rotates the joint head 41 about the center of the chuck 6 as an axis. Control motor 65m, Make the brush 61 as shown by arrow C, For example 1 reciprocating, If necessary, the number is reciprocated to clean the suction surface of the chuck (step C2). In addition, If you can get the cleanliness you want in a single trip, You can also operate only one way. then, The control unit 7 raises the joint head 41, Return to the pickup position of the die D (step C3), Go back to the joint action.  The ytterbium control unit 7 repeats the above-mentioned process until the predetermined number of crystal grains is bonded (step J3).  [0043] In addition, Once cleaning of the chuck 6 is repeated, Then, the foreign matter removed from the chuck 6 stays in the brush 61. then, As shown in Figure 8, The control unit 7 determines whether cleaning or replacement of the brush 61 is necessary (step J4, J5). The judgment of whether the brush 61 is to be cleaned is, for example, whether the cleaning operation of the chuck 6 has been performed a predetermined number of times (step J4). The judgment as to whether the brush 61 is to be replaced is, for example, whether the cleaning of the brush 61 has been performed a predetermined number of times (step J5). When the judgment of step J4 is NO, Return to step C3, When the judgment of step J4 is necessary, Proceed to step J5. When the judgment of step J5 is NO, Cleaning brush 61 (step C4), When necessary, Replace the brush 61 (step C5), Move to step C1 of FIG. 7. The cleaning of the brush 61 is as shown in FIG. 9, for example. Will be installed with a brush, The bonding head 41 of the brush cleaning plate 6C composed of a plate or a plate having irregularities is moved to the brush 61, While attracting with the attracting part 63, While moving the brush 61 in a straight line, Then, the brush cleaning plate 6C is rotated to perform (the chuck cleaning device 60 performs the same operation as the chuck cleaning operation).  [0044] In the above process, Per predetermined number of engagements, In other words, A predetermined number of picks per die D from the wafer 11, Based on camera data, Determine whether the head 6 is clean or not, But you ca n’t judge, Periodically every predetermined number of pickups.  And, Based on the camera data in the above process, Per predetermined number of engagements, Determine whether the chuck 6 is clean or not, However, it is not necessary to judge whether it is necessary to clean each subsequent time. From the safety side, The view of an increase in takt time, The subsequent determination cycle is made shorter than a predetermined number of engagements.  And, As the timing for cleaning the chuck 6, It is also possible to automatically perform chuck cleaning every two rows of the wafers 11 on which the plurality of rows of the wafers are retained. also, If necessary, the operator can also operate the sticky crystal machine to carry out at any time.  [0045] Furthermore, The above description is that the joint head 41 is lowered and cleaned during the cleaning operation of the chuck 6, However, the chuck cleaning device 60 may be raised for cleaning.  [0046] If according to the embodiment, The foreign matter is removed by combining the rotary motion of the chuck 6 and the linear motion of the brush 61. and, By providing the suction section 63, Removable foreign matter can be recovered, The die can be safely bonded to the substrate. and, By using metal in the brush 61, Can perform static elimination of chuck 6, Can prevent the electrostatic damage of the crystal grains.  [0047] <Modifications> 例 or less, A few examples of representative modifications are given. In the description of the following modifications, For the parts having the same configuration and function as those explained in the above-mentioned embodiment, the same symbols as those in the above-mentioned embodiment can be used. then, The description of such a part can appropriately refer to the description of the above-mentioned embodiment within a technically non-contradictory range. and, A part of the above-mentioned embodiment and all or a part of the plural modification examples can be appropriately combined and applied within a range not technically contradictory.  [0048] (Modification 1) The embodiment is to rotate the chuck 6, Move the brush 61 in a straight line, However, in the first modification, the chuck 6 is moved linearly. The brush 61 is rotated.  FIG. 10 is a view showing a chuck cleaning device according to a first modification. FIG. 10 (a) is a view viewed from the direction of an arrow A in FIG. 1. FIG. 10 (b) is a diagram viewed from the direction of arrow A3 in FIG. 10 (a). Fig. 11 (a) is a top view of a brush and a brush holder of the chuck cleaning device. FIG. 11 (b) is a sectional view taken along the line A4-A5 in FIG. 11 (a). Fig. 11 (c) is a sectional view taken along the line A6-A7 in Fig. 11 (a). FIG. 12 is a diagram corresponding to FIG. 10 (a), Indicates that the body of the chuck cleaning device is raised to make contact with the pickup head, Diagram of the state of the cleaning action.  [0049] The chuck cleaning device 60 is provided with: Brush 61, The brush holder 64 holding the brush 61, The driving portion 65 and the lifting device 67 supported by the fixing portion 66.  [0050] The brush holder 64 is provided with: Rectangular bottom 64a, 64d on the long side, 64e, Short side side 64b, 64c, The convex portion 64f of the bottom surface of the brush base 61B is provided on the short side of the bottom surface portion 64a, The convex part 64g provided in the side surface which supports the brush stand 61B in four corners, And a piping portion 64h extending from the center of the bottom surface portion 64a to the lower portion. With this, The side surface portion 64d of the long side of the brush holder 64 and the side surface 64d of the long side of the brush holder 64 are formed. A gap between 64 e and a gap formed between the bottom surface of the brush 61 and the bottom surface portion 64 a of the brush holder 64 forms a part of the suction portion 63.  [0051] In other words, The suction portion 63 is formed between the inside of the brush holder 64 and the brush 61, have: Suction grooves 63c provided on both sides of the brush 61, A connecting portion 63d (piping portion 64h) connecting the two suction grooves 63c, 63h from the soft connection piping provided by the suction pump (not shown), And a connection bolt 63s to which a connection pipe is connected.  [0052] The driving section 65 is provided with: The rotation axis that engages with the brush holder 64, A motor that rotates a rotating shaft, And a pipe connecting the connecting portion 63d to the connecting plug 63s.  [0053] The main difference from the embodiment of the chuck cleaning device 60 according to Modification 1 is the next three points.  [0054] The first point, In the embodiment, the chuck 6 is rotated, Move the brush 61 in a straight line to remove foreign matter on the suction surface, relatively, In modification 1, the brush 61 is rotated, The bonding head 41 is moved left and right in the direction of the arrow J shown in FIG. 16 to remove foreign matter on the suction surface. The arrow J direction is moved in the left-right direction (the Y direction) for another purpose (normal joining) which is different from the purpose of the joint head 41 for cleaning. By implementing cleaning, No extra functions need to be given.  [0055] The second point, In the embodiment, the joint head 41 is lowered, Contact the suction surface of the chuck 6 with the brush 61, relatively, In the first modification, the brush 61 is raised by a lift device 67 having a lift function in the H direction. The brush 61 is brought into contact with the suction surface of the chuck 6. By giving the brush 61 a lift function, Can be matched with the joint head 41 to move above the brush 61, The brush 61 is moved up and down to make contact with the joint head 41, Processing power can be increased. In addition, The second point is to reduce the drive shaft in Modification 1. The joint head 41 may be lowered similarly to the embodiment.  [0056] Point 3, In the embodiment, the suction hole portion 63a of the suction portion 63 is a hole formed in the brush base 61B. relatively, The first modification is an elongated groove formed between the brush holder 64 and the brush table 61B.  [0057] Secondly, The cleaning operation of the chuck 6 of the chuck cleaning device 60 according to the first modification will be described with reference to FIG. 7. In addition, The joining operation is the same as in the embodiment.  [0058] Once the control section 7 determines that cleaning of the chuck 6 is necessary, Then, the cleaning operation represented by the thick dotted line shown in FIG. 2 is entered. The control section 7 moves the chuck 6 (the joint head 41) to an upper portion of the chuck cleaning device 60, Control lifting device 67, Raise brush 61, As shown in Figure 12, The brush 61 is brought into contact with the chuck 6 (step C1). then, The control section 7 is a control driving section 65, Rotate the brush 61, And control the joint head 41, Make chuck 6 as shown by arrow J, For example 1 reciprocating, If necessary, reciprocate the number to clean the suction surface of the chuck (step C2). In addition, If you can get the cleanliness you want in a single trip, You can also operate only one way. then, The control unit 7 raises the joint head 41, Return to the pickup position of the die D (step C3), Go back to the joint action.  [0059] Secondly, Brush cleaning (step C4) will be described using FIG. FIG. 13 is a diagram for explaining cleaning of a brush of a chuck cleaning device according to Modification 1. FIG. FIG. 13 (a) is a diagram corresponding to FIG. 11 (b), Means that the brush cleaning plate is in contact with the brush, A cross-sectional view of the state of the brush cleaning operation. FIG. 13 (b) is a diagram corresponding to FIG. 11 (c), Means that the brush cleaning plate is in contact with the brush, A cross-sectional view of the state of the brush cleaning operation.  [0060] A comb-like protrusion or brush reaching the end of the brush will be attached, The brush cleaning plate 6C protruding from the surface of a groove or the like is mounted on the brush cleaning jig 6Ch of the joint head 41 in the same manner as the chuck 6, Make chuck cleaning action. The brush cleaning jig 6Ch is slightly larger than the brush jig 64. As shown in Figure 13 (b), The control section 7 is a control driving section 65, After aligning the long side direction of the brush 61 with the X direction (the short side direction is the Y direction), The joint head 41 is controlled to move the brush cleaning plate 6C little by little in the up-down direction (Z direction) and the left-right direction (Y direction), And exhaust from the suction portion 63, Perform brush cleaning. The brush cleaning plate 6C is configured to protrude below the lower end of the brush cleaning jig 6Ch, The control section 7 can also control the driving section 65 to rotate the brush 61 in the same manner as the chuck cleaning. And controlling the joint head 41 to move the brush cleaning plate 6C in the Y direction, While exhausting from the suction section 63, Brush cleaning while.  [0061] Generally, There is a lot of foreign matter stagnating at the end of the brush 61 (near the brush base (hair root) of the brush part 61H), Can be effectively removed.  [0062] Second, The brush replacement will be described with reference to FIG. 14 (step C5). FIG. 14 is a diagram for explaining brush replacement of the cleaning device according to Modification 1. FIG. FIG. 14 (a) is a diagram corresponding to FIG. 11 (b), Indicates that the replacement arm is held by the brush, A cross-sectional view of the state of the brush replacement operation. FIG. 14 (b) is a diagram corresponding to FIG. 11 (c), Indicates that the replacement arm is held by the brush, A cross-sectional view of the state of the brush replacement operation. FIG. 14 (c) is a diagram corresponding to FIG. 14 (b), Front view of the replacement arm.  [0063] The dedicated replacement arm 6Ah includes both side surfaces that can be inserted into the long side of the brush table 61B, and side surfaces 64d of the brush holder 64, The holding portion of the suction groove 63c between 64e, Like the brush cleaning jig 6Ch, Is filled to the joint head 41, Replace the brush 61.  [0064] The control section 7 is a control driving section 65, Align the long direction of the brush 61 with the X direction (the short direction is the Y direction), After controlling the joint head 41 to align the holding portion of the dedicated replacement arm 6Ah with the X direction, The engagement head 41 is controlled to insert the grip portion into the suction groove 63c to grip the brush stage 61B, Pull out the brush 61 from the brush holder 64, Replace the brush 61.  [0065] The special replacement arm 6Ah is a chuck-type jig (brush attachment and detachment tool capable of changing the chuck), It can be replaced with the joint head 41.  [0066] According to Modification Example 1 of the chuck cleaning device described above, By rotating the brush 61, Using the suction section, There will be no situation where foreign objects are scattered around, It can also remove foreign objects. and, The brush 61 can be cleaned or replaced.  [0067] (Modification 2) 的 The brush of Modification 2 has an air blowing function. FIG. 15 is a diagram illustrating a chuck cleaning device according to a modification 2. FIG. Corresponds to the cross-sectional view of Fig. 11 (c).  [0068] The brush base 61B of the brush 61 of Modification 2 is provided with: A plurality of holes 61a for ejecting air, The hollow portion 61b connected to the hole 61a, And a piping 61c that supplies air to the cavity 61b. Except that the piping 61c extends into the connecting portion 63d, The brush holder 64 of the second modification is the same as the first modification.  [0069] The driving unit 65 of the modification 2 has: The rotation axis that engages with the brush holder 64, And a motor that rotates the rotary shaft, A pipe connecting the connecting portion 63d to the connecting plug 63s, And a piping connecting the piping 61c to the air supply unit.  [0070] When the control unit 7 is cleaning the chuck or brush, The air supply unit is controlled to blow air from the hair-implanting portion of the brush (the plurality of holes 61 a of the brush base 61B). With this, It is possible to make it difficult for foreign matter to adhere to the brush portion 61H (the end of the brush portion 61H (hair planting portion)).  [0071] (Modification 3) The brush of Modification 3 rotates along a vertical plane, This replaces the new side of the brush face. 16 is a diagram illustrating a chuck cleaning device according to a third modification. FIG. 16 (a) is a sectional view corresponding to FIG. 11 (b). FIG. 16 (b) is a sectional view corresponding to FIG. 11 (c).  [0072] The brush stand 61B of the brush 61 is a horizontally long rectangular parallelepiped, Rotate around the central axis (rotation shaft rod 61C) in the direction of the rectangular parallelepiped. Brush portions 61H are formed on four sides of the brush base 61B.  [0073] The side surface portion 64b of the brush holder 64, 64c is a rotatable shaft rod 61C rotatably supported. therefore, The brush holder 64 is not provided with the convex part 64f of the modification 1, 64g.  [0074] The suction section 63 is the same as the first modification. 2 Similarly, Is formed between the inside of the brush holder 64 and the brush 61, have: The suction grooves 63c provided on both sides of the brush 61, And a connecting portion 63d connecting the two suction grooves 63c. The cleaning device of the modification 3 is other than a brush and a brush holder. This is the same as the first modification. also, The chuck cleaning operation and the brush cleaning operation of the cleaning device of the modification 3 are the same as those of the operation modification 1.  [0075] The control unit 7 controls a driving unit (not shown), Rotate the rotating shaft rod 61C, Brush replacement (replace brush face) (step C5).  [0076] Rotate the complex surface by rotation, Every time the brush is dirty, Clean with a new face. Whether the rotation of the brush 61 can be determined by a predetermined number of cleanings, Or you can clean the recognition camera to make sure the brush is dirty. In Modification 3, The brush is explained on four sides, But it can also be 2 sides, 3 or more sides.  [0077] (Modification 4) 变形 Modification 3 is a special mechanism that does not have a cleaning brush. However, the modification 4 is a mechanism having a cleaning brush. FIG. 17 is a diagram illustrating a chuck cleaning device according to a fourth modification. FIG. 17 (a) is a sectional view corresponding to FIG. 16 (a). FIG. 17 (b) is a sectional view corresponding to FIG. 16 (b).  [0078] The cleaning device of Modification 4 is provided on the side surface portion 64b of the brush holder 64, A protrusion or brush portion 62C is provided inside 64c. Other than that, it is the same structure as the modification 3. The chuck cleaning operation is the same as the first modification. The control unit 7 controls a driving unit (not shown), Rotate the rotating shaft rod 61C of the brush 61, Every new face, The brush portion 61H of the brush 61 is cleaned by a protrusion or a brush portion 64C provided inside the brush holder 64, Clean the chuck again with the cleaned brush. At this time, exhaust is performed from the suction part 63. In addition, The structure of the brush 61 and the brush holder 64 was made into the structure which blows out air like the modification 2, When the brush is cleaned, You can also blow. It is also possible to perform brush cleaning similar to the modification 1.  [0079] (Modification 5) The bristle length (HH) of the brush portion 61H of the brush 61 of the modification 5 is longer than that of the embodiment and the modification 1. A chuck cleaning device according to a fifth modification will be described with reference to FIG. 18. Fig. 18 (a) is a top view of a brush of the chuck cleaning device. FIG. 18 (b) is a sectional view taken along the line B1-B2 in FIG. 18 (a). FIG. 18 (c) is a sectional view taken along the line B3-B4 in FIG. 18 (a).  [0080] The bristle length (HH) of the brush portion 61H of the brush 61 of the modification 5 is about 10 mm, Then, The height of the brush holder 64 is also high. The upper end of the brush portion 61H is higher than the upper end of the brush holder 64, If the height from the upper end of the brush table 61B to the upper end of the brush holder 64 is HF, The difference between HH and HF is, for example, about 1 to 2 mm. In addition, The configuration is the same as that of the first modification.  [0081] According to Modification 5, The gap between HH and HF is narrow, Efficient exhaust, There will be no situation where foreign objects are scattered around, It can also remove foreign objects. and, usually, There is a lot of foreign matter staying at the end of the brush 61 (near the brush base (hair root) of the brush part 61H), Since this part is arranged at the end of the brush holder, Therefore, it is also possible to prevent the scattering of foreign objects, Remove it efficiently.  [0082] (Modification 6) In Modification 1, the suction groove 63c (brush holder 64) is rotated together with the brush 61, However, in the sixth modification, the suction portion 63 (the frame portion 62) is not rotated. The brush 61 is rotated. 19 is a configuration diagram showing a chuck cleaning device according to a sixth modification. FIG. 19 (a) is a view of the chuck cleaning device viewed from the direction of an arrow A in FIG. 1. Figure 19 (b) is in Figure 19 (a), View the chuck cleaning device from the direction of arrow B5. Figure 19 (c), Figure 19 (d) corresponds to Figure 19 (a), Figure 19 (b), Raise the body of the chuck cleaning device to make contact with the joint head 41, The figure which shows the state of a cleaning operation. Fig. 20 (a) is a top view of the chuck cleaning device. FIG. 20 (b) is a diagram viewed from the direction of the arrow B6 in FIG. 20 (a). FIG. 20 (c) is a diagram viewed from the direction of the arrow B7 in FIG. 20 (a).  [0083] The chuck cleaning device 60 according to Modification 6 is provided with: Brush 61, Frame section 62, Driving section 65, The lifting device 67 and the suction portion 63 supported by the fixed portion 66.  [0084] The brush holder 64 is provided with: Rectangular bottom 64a, 64d on the long side, 64e, Short side side 64b, 64c and a connecting portion 64j extending from the center of the bottom surface portion 64a to the lower portion. The side surface portion 64d of the long side of the brush holder 64, 64e for the replacement of the brush 61, A part of the brush base 61B is exposed. The short side surface portion 64b of the brush holder 64, 64c for the replacement of the brush 61, A part of the brush base 61B may or may not be exposed.  [0085] The suction portion 63 is formed between the inside of the cylindrical frame portion 62 and the cylindrical driving portion 65. have: 63h from the soft connection piping provided by the suction pump (not shown), And a connection bolt 63s to which a connection pipe is connected. In the modification 1, The brush holder 64 and the suction portion 63 (suction groove 63c) rotate together with the brush 61, However, in Modification 6, The frame portion 62 and the suction portion 63 are not rotated. The driving section 65 is provided with: The rotation axis that engages with the brush 61, And a motor that rotates a rotating shaft.  [0086] Joining operation of Modification 6, Chuck cleaning action, The brush cleaning operation and the brush replacement operation are the same as those of the first modification.  [0087] (Modification 7) Modification 7 includes a pick-up section 2 between the die supply section 1 and the joint section 4. 21 is a schematic top view showing the configuration of a die bonder according to Modification 7. FIG. FIG. 22 is viewed from the direction of the arrow G in FIG. 21. A diagram illustrating the operation of the pickup head and the bonding head 41.  [0088] The die bonder 10 according to Modification 7 is an intermediate platform having a pick-up unit 2 which is picked up from a wafer 11 and a pick-up portion 2 which is different from the bonding head 41 in the embodiment. Composition of 31. and, The die bonder 10 according to the seventh modification is provided with a chuck cleaning device 60 between the intermediate stage 31 and the pickup position of the die D. The chuck cleaning device 60 is also an example, Modifications 1 to 6, Chuck cleaning device of any of 8.  Since foreign matter and the like will attach from the wafer 11 to the chuck 6 of the pickup head 21, So as mentioned above, The chuck cleaning device 60 is provided between the intermediate platform 31 and the pickup position of the die D. In addition, Stored in the sticky crystal machine of the intermediate platform 31, When the chuck cleaning is also required for the joint head 41, It may be provided between the positions where the intermediate stage 31 and the die D are joined.  [0089] The pickup unit 2 has:  Pick head 21, It picks up die D from wafer 11, Placed on the intermediate platform 31; And 驱动 drive unit 23 of the pickup head, The pickup head 21 moves in the Y direction.  The pickup head 21 has the same structure as the joint head 41, The Y driving unit 23 includes a chuck 6 for raising and lowering, Each driving unit (not shown) that rotates and moves in the X direction.  [0090] In the embodiment, the degree of the foreign body is monitored by the die posture recognition camera, However, in the modification 7, when the die D is placed on the intermediate stage 31, Since it is not necessary to obtain the correct orientation of the crystal grains as in bonding, Therefore, in Modification 7, Do not use the degree of foreign objects as image surveillance, The degree of foreign matter is monitored by the number of picks of the die D from the wafer 11 of the pick-up head 21. of course, The same as the embodiment, Means for taking in the suction surface of the chuck 6 of the pickup head, Determine whether cleaning is required based on the camera results.  [0091] (Modification 8) In the brush 61 of Modification 8, A part of the central portion of the brush portion 61H is removed. A chuck cleaning device according to Modification 8 will be described with reference to FIG. 27. Fig. 27 (a) is a top view of a brush and a brush holder of the chuck cleaning device. Fig. 27 (b) is a sectional view taken along the line A4-A5 in Fig. 27 (a). Fig. 27 (c) is a sectional view taken along the line A6-A7 in Fig. 27 (a).  [0092] In a method of rotating the brushes of Modifications 1 to 6, As shown in Figure 27, Remove the brush portion 61H and the brush base 61B of the center portion (rotation center portion) of the rotating brush by a predetermined width, This is to effectively prevent the chuck 6 from being damaged during cleaning. This is to prevent in the center, Compared to other brush contacts, The damage is accelerated by continuous brush contact during 4 rotations. and, The predetermined width (LW) from which the brush is removed is usually preferably about 1 to 6 mm.  [0093] Above, According to the implementation form, Examples and modifications specifically describe inventions developed by the present inventors, However, the present invention is not limited to the above-mentioned embodiments, Examples and modifications, Various changes can of course be implemented.  [0094] For example, In an embodiment, The judgment of whether the brush is cleaned and the judgment of whether the brush is replaced is judged by the number of times the cleaning is performed. However, it is also possible to set a brush recognition camera above the cleaning device, Take a brush to determine if it is clean.  [0095] Again, In the embodiment, the pushing amount of the brush after contacting the chuck is set to about 0 to 1 mm. But it may not be managed by the amount of advancement, Instead, set a pressure sensor on the part that pushes the brush, Perform proper pressure management and pressure control.  [0096] Again, It is also possible for the brush to contact the chuck in parallel, Flexiblely fix the brush part or the entire rotating part, Enables to follow the chuck.  [0097] Again, The example is to attach DAF on the back of the wafer, But also without DAF.  Alas, In the embodiment, one pickup head and one bonding head are provided, But there are two or more. also, The embodiment is provided with an intermediate platform, But there is no intermediate platform. In this case, The pickup head and the bonding head may be used in combination.  [0098] Again, In the embodiment, the surfaces of the crystal grains are bonded together, However, it is also possible to reverse the front and back of the grain after picking it up. Bonding was performed with the back side of the die as the top. In this case, The intermediate platform is optional. This device is called a flip chip bonder. When flip chip soldering is also applicable, Because the suction side of the chuck is facing up, Therefore, the cleaning device may be provided on the upper side of the movable range of the pickup head. that is, Set the cleaning device to face the suction.

[0099]

1‧‧‧Crystal Supply Department

2‧‧‧Pick up department

21‧‧‧Pickup head

31‧‧‧ intermediate platform

4‧‧‧ Junction

41‧‧‧Joint head

44‧‧‧ substrate identification camera

45‧‧‧ Crystal Posture Recognition Camera

6‧‧‧ chuck

7‧‧‧Control Department

10‧‧‧ Sticky Crystal Machine

11‧‧‧ wafer

12‧‧‧ Pickup device

13‧‧‧ jacking unit

18‧‧‧ Grain Adhesive Film (DAF)

60‧‧‧Chuck cleaning device

61‧‧‧Brush

62‧‧‧Frame

63‧‧‧Attraction

64‧‧‧Brush fixture

65‧‧‧Driver

67‧‧‧Lifting device

D‧‧‧ Grain

P‧‧‧ substrate

[0008] FIG. 1 is a schematic top view showing the configuration of a die bonder of an embodiment. FIG. 2 is a diagram illustrating the movement of the joint head when viewed from the direction of arrow A in FIG. 1. FIG. 3 is an external perspective view of the pickup device of FIG. 1. FIG. 4 is a schematic cross-sectional view showing a main part of the pickup device of FIG. 1. FIG. 5 is a configuration diagram showing the chuck cleaning device of FIG. 1. FIG. 6 is a configuration diagram showing the brush of FIG. 5. 7 is a flowchart showing a bonding operation and a chuck cleaning operation of the die attacher of FIG. 1. FIG. 8 is a flowchart showing brush cleaning and brush replacement of the chuck cleaning device of FIG. 1. FIG. 9 is a diagram showing a state of the brush cleaning operation. FIG. 10 is a configuration diagram showing a chuck cleaning device according to a first modification. FIG. 11 is a view showing a brush and a brush holder of FIG. 10. FIG. 12 is a view showing a chuck cleaning operation of the chuck cleaning device of FIG. 10. 13 is a view for explaining brush cleaning of the chuck cleaning device of FIG. 10. FIG. 14 is a diagram for explaining brush replacement of the chuck cleaning device of FIG. 10. FIG. 15 is a diagram illustrating a chuck cleaning device according to a second modification. FIG. 16 is a diagram illustrating a chuck cleaning device according to a third modification. 17 is a diagram illustrating a chuck cleaning device according to a fourth modification. FIG. 18 is a diagram illustrating a chuck cleaning device according to a fifth modification. FIG. 19 is a diagram illustrating a chuck cleaning device according to a sixth modification. FIG. 20 is a view showing a brush and a brush holder of FIG. 19. FIG. 21 is a schematic top view showing the configuration of a die bonder according to a seventh modification. FIG. 22 is a diagram illustrating the operation of the joint head when viewed in the direction of the arrow G in FIG. 21. FIG. 23 is a schematic diagram showing the trajectory of a rotating brush. FIG. 24 is a schematic view showing a state of a chuck cleaning brush and a chuck according to the embodiment. FIG. 25 is a schematic view showing a state of a chuck cleaning brush and a chuck according to the embodiment. FIG. 26 is a schematic view showing a state of a chuck cleaning brush and a chuck according to the embodiment. FIG. 27 is a diagram illustrating a chuck cleaning device according to Modification 8.

Claims (20)

A die-bonding device is characterized by: (1) a pick-up head for picking up the die from a wafer by adsorbing an element-forming surface side of a die on an adsorption surface of a chuck provided at a front end; : A brush for removing the foreign matter on the suction surface, a suction part for sucking the foreign matter, and a driving part for rotating the brush along the suction surface; and a control part that controls the pickup head and the cleaning device, and The brush surface is rectangular. The control unit is to bring the brush into contact with the suction surface, rotate the suction surface of the chuck in a straight line or draw a circle in the center of the suction surface of the chuck, and rotate the brush. The foreign matter after removal is sucked by the suction part. For example, the crystal sticking device according to the first patent application range, wherein the cleaning device further includes a brush holder for holding the brush, and the brush includes a brush portion that is in contact with the chuck and a brush holding the brush portion. The suction unit is constituted by a gap between the brush holder and the brush table. For example, the crystal sticking device according to the second patent application range, wherein the brush has a rotation axis that rotates the brush table along a surface perpendicular to the suction surface, and has a brush portion on a plurality of surfaces of the brush table. For example, in the crystal sticking device according to claim 3, the brush holder has a protrusion or a brush portion on a surface facing the brush table to clean the brush portion. For example, the crystal sticking device according to item 2 of the patent application, wherein the brush table has a hole that sprays air to the brush portion. For example, the crystal sticking device according to item 1 of the patent application range, wherein the cleaning device is provided in the movable range of the pickup head. For example, the crystal sticking device according to item 6 of the patent application range, wherein the cleaning device is provided between a pickup position where the crystal grains are picked up from the wafer and a position where the crystal grains are placed. The position where the foreign matter faces the aforementioned suction. For example, the crystal sticking device according to item 1 of the scope of the patent application, wherein the control unit is that the chuck or the brush is raised and lowered so that the brush contacts the suction surface, and the advancement amount of the brush is set to 0 to 1 mm. For example, the crystal sticking device according to the first scope of the patent application, wherein the brush is formed by binding a plurality of metal brushes having a line width of ten μm to several hundreds μm. For example, the crystal sticking device according to the first patent application range, wherein the brush has a brush portion having a length of one side as a long side on the suction surface. For example, the crystal sticking device according to the first scope of the patent application, wherein the pick-up head is also a bonding head, and the die is directly bonded to the substrate or the die to be bonded from the wafer. For example, the crystal sticking device according to item 1 of the patent application scope further includes a bonding head for bonding the picked-up crystal grains to the substrate or the bonded crystal grains. The intermediate platform, the bonding head picks up the die from the intermediate platform, and bonds the die to the substrate. For example, the crystal sticking device according to the first patent application range, wherein a brushless portion is provided at a predetermined width at the rotation center of the brush. For example, the crystal sticking device according to item 13 of the patent application scope, wherein the predetermined width is set to 1 to 6 mm. A method for manufacturing a semiconductor device, comprising: (a) a process for preparing a die-bonding device such as any one of claims 1 to 14 in the scope of patent application; (b) cutting to which a die is attached The process of moving the wafer ring fixture of the adhesive tape; (c) the process of preparing to move into the substrate; (d) the process of picking up the crystal grains; (e) bonding the previously picked crystal grains to the aforementioned substrate or the crystal grains which have been bonded Engineering; and (f) engineering to clean the chuck by the cleaning device. For example, the method for manufacturing a semiconductor device according to item 15 of the patent application, further comprising: (g) a process for cleaning the aforementioned brush, the aforementioned (g) process includes: (g1) mounting a brush cleaning plate having a protrusion or a brush portion (G2) a process in which the brush cleaning plate is brought into contact with the brush; (g3) a process in which the pickup head or the brush is moved, and the brush is cleaned by being attracted by the suction portion. For example, the method for manufacturing a semiconductor device according to item 16 of the patent application, which further includes: (h) a process of replacing the aforementioned brush; ； the aforementioned (h) process includes: (h1) installing a brush replacement jig on the aforementioned picking head Process; and (h2) a process of holding the brush by the brush changing jig and removing the brush from the brush holder. For example, the method for manufacturing a semiconductor device according to item 16 of the scope of patent application, further comprising: (h) a process of replacing the aforementioned brush, and (ii) the process of (h), wherein the rotation axis is rotated to replace the brush surface. For example, the method for manufacturing a semiconductor device according to item 15 of the patent application, wherein: (d) the project is to pick up the crystal grains on the cutting tape by the aforementioned picking head; (e) the project is to be picked up by the aforementioned picking head The crystal grains are bonded to the aforementioned substrate or the crystal grains that have been bonded. For example, the method for manufacturing a semiconductor device according to item 15 of the application, wherein the aforementioned (d) project has: (d1) a process of picking up crystal grains on the cutting tape by a pick-up head; and (d2) a process of picking up the aforementioned pick-up head The project where the picked-up grains are placed on the intermediate platform, The above (e) project includes: (e1) the process of picking up the grains placed on the intermediate platform with a joint head; (e2) will be picked up with the aforementioned joint head The subsequent process of placing the dies on the aforementioned substrate.