TW201843438A - Circuit board assembly detection system and detection method thereof - Google Patents

Abstract

A circuit board assembly detection system includes a circuit-testing platform, an auxiliary light source, a camera device, a press board and a computing device. The circuit-testing platform has a carrying surface for putting a circuit board assembly and the carrying surface has a plurality of electrical testing points. The auxiliary light source faces to the carrying surface to project the light. The camera device takes a photo of the circuit board assembly on the carrying surface to generate a testing image signal. The up-and-down movable press board is disposed between the circuit-testing platform and the camera device. The press board has a transparent part whose position is corresponding to the camera device. The press board moves down to give pressure to circuit board assembly for electrical contact between a plurality testing points from DIP elements and a plurality of probes. The computing device electrically connects to the circuit-testing platform and the camera device for receiving image signal then doing image analysis program and for executing in-circuit testing program through the circuit-testing platform.

Description

Assembly circuit board detection system and assembly circuit board detection method

The invention relates to an assembled circuit board detecting system and an assembled circuit board detecting method, in particular to an integrated circuit board detecting system and assembly integrated with Automated-Optical Inspection (AOI) and In Circuit Tester (ICT). Board test method.

In the process of manufacturing electronic products, it is necessary to assemble a variety of electronic components on a Printed Circuit Board (PCB). These electronic components are typically available in Surface Mount Technology (SMT) or Dual In Line Package (DIP) processes. Among them, the DIP process parts are assembled by inserting the pins of the DIP parts into a Plating Through Hole (PTH) on the printed circuit board, and applying flux to the bottom of the printed circuit board, and then passing the parts through the soldering furnace. Soldering is fixed on the printed circuit board and then assembled and tested to confirm whether the printed circuit board after assembling the components is normal in the test items such as plate bending, leakage current, capacitance and electrical functions of other assembled parts. Check the assembled circuit board for missing parts, wrong parts, and Polarity reversed.

In particular, the types of post-assembly tests can be broadly classified into AOI, ICT, and Function Verification Test (FVT). In practice, each of the aforementioned types of test items is usually performed in a substation processing manner, and an operator of each station performs a corresponding detection step on the test machine. However, multiple test items belonging to different test machines are generally arranged according to actual needs, and there is no inevitable sequential test sequence. However, due to the fact that the hardware devices of the test machine are individually set independently, the test items that can theoretically be processed simultaneously must be divided into multiple sites in sequence, resulting in a total test time for a single assembled circuit board. Lengthy and inefficient. In addition, due to the large number of DIP parts on the assembled circuit board, the operator who cooperates with the test machine is prone to errors in the visual inspection process due to factors such as negligence and fatigue, resulting in the assembly board not being able to maintain a stable yield. Increase the rework cost after the test error.

Considering the lengthy time of the total test time and the problem of human operation in the post-furnace inspection process of the assembled circuit board, the present invention proposes an integrated circuit board detection system and an assembly circuit board detection method for integrating multi-station test in a single station, by testing The hardware integration of the machine and the software are combined to achieve the effect of shortening the total test hours and improving the quality of the shipment.

An assembled circuit board detecting system according to an embodiment of the invention includes a detecting platform, a camera device, a pressing plate and a computing host. The inspection platform has a bearing surface for placing the assembled circuit board, and the mounting surface has a plurality of circuit detecting contacts. The imaging device has a light incident side facing the bearing surface, and the imaging device is configured to capture the assembled circuit board by the light incident side to generate an image to be tested. The pressing plate is movably disposed between the detecting platform and the imaging device, the pressing plate has a light transmitting portion, the light transmitting portion is located on the light incident side of the image capturing device, and the pressing plate is pressed against the assembled circuit board to assemble the circuit board. The pins of the plurality of materials are electrically connected to the plurality of circuit detecting contacts described above. The computing host is electrically connected to the detection platform and the camera device for receiving the image to be tested and performing an image analysis program on the image to be tested, and performing material testing on the assembled circuit board through the detection platform.

The assembled circuit board detecting system according to another embodiment of the present invention also includes the detecting platform, the image capturing device, the pressing plate and the computing host in the above embodiments, and further includes an auxiliary light source, a plate bending test component, a display device, and a scanning device. , data transmission device, database host, detection source and sensor. The auxiliary light source has a light exiting side facing the bearing surface, and the light emitting side is for outputting light to illuminate the assembled circuit board. The bearing cover of the aforementioned detection platform has a plate area, and the plate bending test component is protruded from the bearing surface and located outside the plate area. The display device is electrically connected to the computing host for displaying the image analysis signal generated by the image analysis program and the material test signal generated by the material test. The scanning device is electrically connected to the computing host for obtaining a serial number corresponding to the assembled circuit board. The data transmission device is electrically connected to the computing host and communicates with the database host, and the data transmission device transmits the image analysis signal and the material test signal to the database host for storage. The detecting light source is located in the aforementioned plate area, and the detecting light source projects light toward the light incident side of the image capturing device. The sensor is disposed on the carrying surface, and the sensor is electrically connected to the computing host and is configured to sense whether the assembled circuit board is located in a mounting area of the bearing surface of the detecting platform.

An assembly circuit board detecting method according to an embodiment of the present invention includes: placing an assembled circuit board on a detecting platform; photographing an assembled circuit board on a light incident side of the image capturing device to generate an image to be tested; and receiving, by the computing host, the image to be tested Generating a continuable signal; after the computing host generates a continuable signal, the moving pressing plate is pressed against the assembled circuit board to electrically connect the detecting circuit board to the detecting platform; and the detecting platform performs the material testing on the assembled circuit board; The image to be tested is analyzed and an image analysis signal is generated; and the test piece is generated by the computing host according to the material test.

With the above structure, the assembled circuit board detecting system and the assembled circuit board detecting method disclosed in the present invention integrate the material testing and image analysis which must be performed for assembling the circuit board, and complete the two main assembly circuits on the same detecting platform. Board inspection process; not only saves the overall test time, but also saves test manpower and reduces the rate of detection of omissions caused by human factors.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

The assembled circuit board inspection system and the assembled circuit board inspection method of the present invention are applicable to an assembled circuit board of a soldered DIP component. Referring to FIG. 1 and FIG. 2A together, FIG. 1 is a functional block diagram of an assembled circuit board detecting system according to an embodiment of the present invention. The assembled circuit board detecting system 1 includes at least a detecting platform 11 and an imaging device 13. The plate 14 and the computing host 15 are pressed. 2A is a side view showing the relative position of the aforementioned elements other than the computing unit 15. It should be emphasized that, in the present invention, the computing host 15 is at least used to perform data processing in the conventional online detection and automatic optical detection, especially when the computing host 15 cooperates with the detection platform 11 and the pressing plate 14 to perform online. The item is detected, and the computing host 15 cooperates with the camera 13 to execute an automatic optical detection item.

Please refer to FIG. 3, which is a top view of the detection platform 11. In an embodiment of the invention, the detection platform 11 has a bearing surface 111 having a plated area 1111 for the assembled circuit board 20 to be tested. For convenience of the following description, when the assembled circuit board 20 is located in the boarding area 1111, the side of the assembled circuit board 20 facing the carrying surface 111 is simply referred to as the back side, and the side of the assembled circuit board 20 facing away from the carrying surface 111 is simply referred to as the front side. The positioning area 1111 is defined by a plurality of positioning elements 1113 around the boarding area 1111 according to the plane area of the assembled circuit board 20. The positioning component 1113 is, for example, a plastic bump, a metal baffle or is marked on the bearing surface 111. The positioning point is not limited to the present invention. The boarding area 1111 has a plurality of circuit detecting contacts 113. When the assembled circuit board 20 is located in the boarding area 1111, the circuit detecting contacts 113 respectively face the test pins of the DIP parts on the assembled circuit board 20.

In another embodiment of the invention, the detection platform 11 further includes a plurality of detection light sources 115 and these detection light sources 115 are located in the plate-mounting region 1111 of the bearing surface 111. The detection light source 115 is, for example, a Light-Emitting Diode (LED) or other small light-emitting fixture for projecting light toward the back of the assembled circuit board 20. When the assembled circuit board 20 has a missing component, the metal pin representing the missing component is not correctly mounted to the through hole of the assembled circuit board 20, so that the light projected by the detecting light source 115 can pass through the through hole and reach the imaging device 13. Light side 131.

Referring to FIG. 2A and FIG. 2B together, the pressing plate 14 has a light transmitting portion 141, such as a hollow hole or a transparent material plate. The pressing plate 14 is movably disposed between the imaging device 13 and the detecting platform 11. When the pressing plate 14 is moved to be stationary, as shown in FIG. 2B, pressure is applied to make the back of the assembled circuit board 20 a plurality of tests. The circuit in the electrical contact plate area 1111 of the pin detects the contact 113. In another embodiment, the pressing plate 14 further includes a needle bed having a plurality of circuit detecting probes. When the pressing plate 14 is moved to be stationary, the pressure is applied to cause the front surface of the assembled circuit board 20 to be plural. The test pins are electrically connected to the circuit detection probe on the needle bed. In practice, the pressing plate 14 is, for example, a flat acrylic plate, one side of the pressing plate 14 contacts the front surface of the assembled circuit board 20 to apply pressure, and the other side of the pressing plate 14 is vertically connected to the telescopic rod member 143. At one end, the other end of the telescopic rod 143 is vertically connected to a power source 145. The movement under the pressure plate 14 is sent by the computing host 15 to send a renewable signal to notify the power source 145 that the telescopic rod 143 is actuated. The continuation signal is generated by the operator pressing the physical button, or the computing host 15 generates the image after assembling the circuit board 20, which is not limited by the invention. After the computing host 15 completes the component inspection of the assembled circuit board 20, the power source 145 is notified to instruct the telescopic rod member 143 to actuate to move the pressing plate 14 upward.

While the pressing plate 14 applies pressure to the assembled circuit board 20 so that the circuit detecting contact 113 of the detecting platform 11 electrically contacts the test pin of the assembled circuit board 20, the computing host 15 executes the component detecting program. The component inspection program performs at least test items including conventional online testers, such as open circuit, short circuit, missing parts and wrong parts, and specific test items such as Type C, capacitance and leakage current. It should be noted that since the pressing plate 14 may discharge the assembly circuit board 20 when moving downward, and thus the leakage current measurement data has an error, the material detecting program executed by the computing host 15 of the present invention includes one. Voltage correction operation to correct leakage current measurement data.

The imaging device 13 is, for example, a high-pixel color camera, which is an essential component for performing automatic optical detection. Referring to FIG. 2A, in an embodiment of the present invention, the imaging device 13 is mounted directly above the detection platform 11, and the distance between the imaging device 13 and the bearing surface 111 of the detection platform 11 is sufficient for the imaging device 13 to capture a complete area of the assembly. The circuit board 20 is front side and generates a to-be-tested image for transmission to the computing host 15. Although the pressing plate 14 is located between the imaging device 13 and the detecting platform 11, the shielding device 13 is not shielded from the front surface of the assembled circuit board 20. Since the pressing plate 14 of the present invention has the design of the light transmitting portion 141, the light transmitting portion 141 is, for example, a hollow hole or a transparent material plate, and the position of the light transmitting portion 141 corresponds to the light incident side 131 of the image pickup device 13 and the light incident side 131, that is, the image pickup lens. Therefore, the image pickup device is not moved down after the pressure plate 14 has been moved. 13 The entire front surface of the assembled circuit board 20 can be photographed via the light transmitting portion 141.

In another embodiment of the present invention, the assembled circuit board detection system 1 further includes an auxiliary light source 12, such as a brightness-adjustable light fixture for projecting light from the light-emitting side 121 of the auxiliary light source 12 to the assembled circuit board. The front side of the 20 is to prevent the external light from being insufficient, and the contrast of the image to be tested caused by the camera device 13 to photograph the front side of the assembled circuit board 20 is too low, which affects the image analysis result. It is worth noting that, in practice, in order to avoid the uneven illumination of the assembled circuit board 20 caused by the influence of external light, the auxiliary light source 12 can be adjusted to the brightest level, and then the exposure degree is corrected by the image analysis program to reach the assembled circuit board 20. The overall brightness of the light source is uniform. Referring to FIG. 2A, in the embodiment, the auxiliary light source 12 is located on the left and right sides of the detecting platform 11, but not limited thereto, but the position that the light is projected from the light emitting side 121 to the bearing surface 111 can be satisfied. An auxiliary light source 12 can be provided.

The computing host 15 is, for example, an industrial control computer having a multi-core CPU or a single-core CPU, and the invention is not limited thereto. The computing host 15 includes a component test program running on the computing host 15 and an image analysis program for analyzing the image to be tested. The material test program generates a material test signal after completing all circuit test items, indicating that the material test result is pass or error. The image analysis program performs an image comparison algorithm based on the image to be tested and a standard image, including color comparison, gray histogram, color histogram, and color analysis level linear analysis, but is not limited thereto; the image analysis program is Upon completion, an image analysis signal is generated indicating that the image analysis result is a pass or an error. In practice, the component test program and the image analysis program can be operated by different CPUs or by different threads that belong to a single CPU.

Referring to FIG. 1, in another embodiment of the present invention, the detection platform 11 further includes a plate bending test assembly 117. The plate bending test assembly 117 is, for example, an infrared device having an infrared radiation receiving function. The plate bending test assembly 117 is protruded from the periphery of the platen area 1111, and can measure the plate bending phenomenon of a long side, a short side or a corner of the assembled circuit board 20. The direction in which the plate bending test component 117 emits light is parallel to the plane to be measured of the assembled circuit board 20, and the path of the plate bending test component 117 emitting light is close to the plane to be tested of the assembled circuit board 20. If the plane to be tested of the assembled circuit board 20 has a plate bending phenomenon, the light emitted by the plate bending test assembly 117 will be blocked by the bent assembled circuit board 20 and reflected back by the original path and received by the same plate bending test assembly 117. The plate bend test assembly 117 and thus a plate bend test error signal is transmitted to the computing host 15.

Referring to FIG. 1, in another embodiment of the present invention, the assembly circuit board 20 detection system 1 further includes a detection light source 115, a display device 151, a scanning device 171, a data transmission device 173, and a database host 175. The detecting light source 115 is disposed in the platen area 1111 of the detecting platform 11 as described above, and the image analyzing program enhances the assembled circuit board detecting system 1 for small components by determining whether the image to be tested has the light signal projected by the detecting light source 115. The ability to detect missing parts. The display device 151 is, for example, a screen, a seven-segment display, or an identifiable light. The invention is not limited thereto. In the present embodiment, the display device 151 presents the detection items of the assembled circuit board 20 by the screen, and the presentation manner is the state indicated by the text or image display material test signal and the image analysis signal. In practice, the operator views the display device 151 to know the results of the plurality of test items of the assembled circuit board 20, and accordingly determines whether or not the currently detected assembled circuit board 20 is determined to be defective. The scanning device 171 is a gun type barcode reader for reading a barcode label on the assembled circuit board 20 to obtain a serial number corresponding to the assembled circuit board 20, and transmitting the serial number to the computing host 15. The data transmission device 173 is, for example, a data collection terminal (DCT) for transmitting the serial number of the assembled circuit board 20 and the component detection result generated by the computing host 15 and the image analysis result to the database host 175. The database host 175 is, for example, a Shop Floor Integrated System (SFIS) for storing various detection information of the assembled circuit board 20. The database host 175 detects information by collecting a large number of assembled circuit boards 20 on the inspection line. According to the manufacturing process of the assembled circuit board 20, the test yield of the subsequent assembled circuit board 20 is improved.

Referring to FIG. 1, in another embodiment of the present invention, the detecting platform 11 further includes a board sensor for sensing whether the board area 1111 has an assembled circuit board 20 to be tested, and generates a board sensing. The signal is notified to the computing host 15. The pressing plate 14 also includes a pressing state sensor for sensing the position of the pressing plate 14 (pressing state or idle state), and generating a pressing plate position signal to notify the computing host 15. The computing host 15 controls the operation of the imaging device 13, the plate bending test assembly 117, and the pressing plate 14 according to the plate sensing signal and the pressing plate position signal. The above-mentioned plate sensor and the pressing state sensor are, for example, a light sensor or a contact sensor, and the invention is not limited thereto.

Referring to FIG. 4, a flow of actual implementation of the assembled circuit board detecting method according to an embodiment of the present invention is described below. The assembled circuit board detecting method is applied to the assembled circuit board detecting system 1 described above. As described in step S41, an operator assembled circuit board 20 to be tested is first placed on the boarding area 1111 of the detecting platform 11. Then, as described in step S43, the computing host 15 controls the imaging device 13 to capture the assembled circuit board 20 and generate a to-be-tested image.

In another embodiment, the operator first obtains a serial number of the assembled circuit board 20 to be tested using the scanning device 171, and the scanning device 171 transmits the serial number to the computing host 15, where the audio signal or a visual is detected by the scanning device 171. After the signal informs the operator that the serial number of the assembled circuit board 20 has been obtained, the operator places the assembled circuit board 20 on the boarding area 1111 of the detecting platform 11. After the plate sensor of the inspection platform 11 confirms that the assembled circuit board 20 has been correctly placed, the plate bending test assembly 117 on the bearing surface 111 of the detection platform 11 performs the plate bending measurement of the assembled circuit board 20 and transmits the result to The computing host 15 is operated. In addition, the computing host 15 also adjusts the brightness of the auxiliary light source 12 at this time, and controls the imaging device 13 to capture the assembled circuit board 20 and generate a signal to be tested. The imaging device 13 transmits the image to be tested to the computing host 15.

In an embodiment of the present invention, after the assembled circuit board 20 captures an image (and after the plate bending measurement is completed), the computing host 15 generates a renewable signal as described in step S45. The continuation signal is presented, for example, in the form of a text or image by the display device 151, the purpose of which is to notify the operator to manually press the button to press the pressing plate 14, as described in step S47. In another embodiment, the computing host 15 can also set a waiting time. After the computing host 15 generates a renewable signal, the computing host 15 controls the pressing plate 14 to press down. The pressing will cause the circuit detecting contact 113 in the boarding area 1111 to electrically contact the test pin on the back side of the assembled circuit board 20 and on the front side of the pressing board 14 on the pressing board 14 to electrically contact the assembled circuit board 20 Test pins are provided to detect that the platform 11 performs circuit detection actions of the components.

In an embodiment of the present invention, as described in step S47, when the pressing plate 14 completes the lower movement and is stationary, the pressing state sensor located on the pressing plate 14 notifies the computing host 15 that the operating host 15 is currently in a pressed state. The computing host 15 then executes the component inspection and image analysis programs as described in steps S491 and S493. The material inspection system controls the detection platform 11 to perform electrical test items on the assembled circuit board 20 for a plurality of DIP parts, and accordingly generates a material test signal indicating that the material test result is pass or error. The image analysis program performs a plurality of image comparison algorithms by using the image to be measured stored in the assembly board 20 of the computing host 15 as the input data in step S43, thereby detecting the error of the assembly circuit board 20, such as missing parts. (Missing), skew (Skew) or tombstone (Tombstone), etc., and accordingly generate an image analysis signal indicating that the image analysis result is a pass or an error. It should be particularly emphasized that the computing host 15 of the present invention has the computing capability of performing step S491 (material detection) and step S493 (image analysis) at the same time, so that the additional work of step S491 and step S493 can be saved. Time. In another embodiment, before performing the component inspection, the computing host 15 first performs the leakage current measurement, and returns the measurement result to the computing host 15 for voltage correction operation to obtain the correct leakage current measurement data. The voltage correction operation is performed, for example, by the computing host 15 to convert the high voltage to a low voltage to reduce the problem that the components in the assembled circuit board detecting system 1 discharge the assembled circuit board 20 and cause the leakage current measurement data to be inaccurate. After the leakage current measurement is completed, the computing host 15 continues the component inspection and image analysis routine.

In practice, when each test item such as the plate bending test, the leakage current detection, the material detection, and the image analysis program of the assembled circuit board 20 is completed, the detection result will be presented by the display device 151 in text or image. Let the operator know whether the respective detection items of the assembled circuit board 20 pass or not, and judge whether or not the assembled circuit board 20 is a good one. The respective test results and the serial numbers corresponding to the assembled circuit board 20 to be tested are also transmitted to the database host 175 via a data transmission device 173 (for example, a data data collector) by wireless communication or wired communication (for example, on the site). Information integration system) storage. In another embodiment, when the computing host 15 receives the serial number of the assembled circuit board 20 sent by the scanning device 171, the serial number is transmitted to the database host 175 via the data transmission device 173 for storage; in other words, the present invention The timing of assembling the circuit board 20 and the transmission result of the assembled circuit board corresponding to the serial number is not limited.

In summary, the assembled circuit board detecting system 1 and the assembled circuit board detecting method of the present invention can achieve the hardware integration of the online test function and the automatic optical detecting function, and perform the detection performed by the online test and the automatic optical test. The software is installed on the same computing host 15, so that the component inspection and image analysis can be performed in the same test time zone, thereby achieving the effect of reducing the total test time and reducing the probability of human error.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧Assembled board inspection system

11‧‧‧Testing platform

111‧‧‧ bearing surface

1111‧‧‧Setting area

1113‧‧‧ Positioning components

113‧‧‧Circuit detection contacts

115‧‧‧Detection light source

117‧‧‧ plate bending test assembly

12‧‧‧Auxiliary light source

121‧‧‧Lighting side

13‧‧‧ camera

131‧‧‧light side

14‧‧‧Pressing board

141‧‧‧Transmission Department

143‧‧‧ Telescopic rods

145‧‧‧Power source

15‧‧‧ computing host

151‧‧‧Display device

171‧‧‧ scanning device

173‧‧‧Data transmission device

175‧‧‧Database Host

20‧‧‧Assemble the board

S41~S493‧‧‧Steps

1 is a functional block diagram of an assembled circuit board detection system according to an embodiment of the invention. 2A is a side view of an assembled circuit board inspection system in accordance with an embodiment of the invention, wherein the pressure plate is in an idle state. 2B is a side view of the assembled circuit board detection system according to an embodiment of the invention, wherein the pressing plate is in a pressed state. 3 is a top plan view of a detection platform according to an embodiment of the invention.

Claims (14)

An assembly circuit board inspection system includes: a detection platform having a bearing surface for placing an assembled circuit board having a plurality of circuit detection contacts; and an imaging device having a light incident side facing the bearing surface The camera device is configured to capture the assembled circuit board by the light incident side to generate a to-be-tested image; a pressing plate is movably disposed between the detecting platform and the image capturing device, and the pressing plate has a transparent In the light portion, the light transmitting portion is located on the light incident side of the image capturing device, and the pressing plate is pressed against the assembled circuit board to electrically connect the pins of the plurality of materials of the assembled circuit board to the circuit detecting And a computing host electrically connected to the detection platform and the camera device for receiving the image to be tested and performing an image analysis program on the image to be tested, and for assembling the circuit board through the detection platform Perform a material test. The assembled circuit board inspection system of claim 1, further comprising an auxiliary light source having a light exiting side facing the carrying surface, the light emitting side for outputting light to illuminate the assembled circuit board. The assembled circuit board detecting system of claim 1, wherein the carrying mask area is used for the assembled circuit board; the detecting platform further comprises a board bending test component electrically connected to the computing host, the board The bending test component is protruded from the bearing surface and located outside the plate area. The assembled circuit board detection system of claim 1, further comprising a display device electrically connected to the computing host, wherein the display device is configured to display one of the image analysis signals generated by the image analysis program and the one of the component test generations Material test signal. The assembled circuit board detecting system of claim 1, further comprising a scanning device electrically connected to the computing host, wherein the scanning device is configured to obtain a serial number of the assembled circuit board. The assembled circuit board detecting system of claim 1, further comprising a data transmission device and a database host, wherein the data transmission device is electrically connected to the computing host and communicably connected to the database host, and the data transmission device is used for One image analysis signal generated by the image analysis program and one of the material test signals generated by the material test are transmitted to the database host for storage. The assembled circuit board inspection system of claim 1, wherein the detection platform further comprises a detection light source located in the plate area, and the detection light source projects light toward the light entrance side. The assembled circuit board detecting system of claim 1, wherein the detecting platform further comprises a sensor disposed on the carrying surface, the sensor is electrically connected to the computing host and configured to sense whether the assembled circuit board is The plate area of the bearing surface of the detecting platform. An assembled circuit board detecting method includes: placing an assembled circuit board on a detecting platform; photographing the assembled circuit board on one side of a camera device to generate a to-be-tested image; receiving the image to be tested by a computing host And generating a renewable signal; after the computing host generates the renewable signal, moving a pressing plate against the assembled circuit board to electrically contact the assembled circuit board with the detecting platform; The circuit board performs a material test; the computing host analyzes the image to be tested and generates an image analysis signal; and the computing host generates a material test signal according to the material test. The method of detecting an assembled circuit board according to claim 9, wherein a plate bending test is performed by a plate bending test component before the computing host generates the renewable signal. The method of detecting an assembled circuit board according to claim 9, wherein before the image capturing device generates the image to be tested, the assembled circuit board is scanned by a scanning device to obtain a serial number corresponding to the assembled circuit board. The method of detecting an assembled circuit board according to claim 9, wherein an auxiliary light source projects light toward a bearing surface of the detecting platform before the image capturing device generates the image to be tested. The method for detecting an assembled circuit board according to claim 9, wherein a detecting light source located in a panel region on one of the bearing surfaces of the detecting platform faces the camera device before the image capturing device generates the image to be tested. The light incident side projects light. The method for detecting an assembled circuit board according to claim 9, wherein after the image analysis signal is generated by the computing host and the material test signal is generated by the computing host, a data transmission device corresponds to the assembled circuit board. A serial number, the image analysis signal and the material test signal are transmitted to a database host.