TW201841739A - Carrier sheet for electronic component and apparatus for thin film formation using the same - Google Patents

Abstract

The present disclosure relates to a carrier sheet for electronic component and an apparatus for thin film formation using the same, and more particularly, to a carrier sheet for electronic component and an apparatus for thin film formation using the same which are used for forming a thin film on a surface of an electronic component. In accordance with an exemplary embodiment, a carrier sheet for electronic component may include an adhesive sheet on one surface of which the electronic component is attached, and a deformation maintaining layer provided on the other surface opposed to the one surface of the adhesive layer, and plastically deformed by an attachment pressure of the electronic component.

Description

Electronic component carrier and device using the same to form a film

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a slide for an electronic component and a device for forming the same, and more particularly to an electronic component for forming a film on a surface of an electronic component. A sheet and a device that uses it to form a film.

Recently, as electromagnetic waves have been widely known to the human body, technologies for shielding a large amount of electromagnetic waves generated from various electronic products such as portable communication devices, video display devices, and game machines are being developed.

In general, since electromagnetic waves are mainly generated from electronic devices such as semiconductor packages included in electronic devices and devices, various techniques for shielding electromagnetic waves generated and output mainly from electronic components such as semiconductor packages have recently been developed.

The simplest method is a method of covering electronic components mounted on a substrate, but such a method has the limitation that the volume of the substrate is significantly increased by the metal cap and the number of processes and assembly components is increased. .

Recently, a method of shielding electromagnetic waves by forming a metal film directly on the surface of an electronic component is being developed, and such a method is mainly implemented by a sputtering apparatus. However, when a metal film is formed on the surface of the electronic component using a sputtering apparatus and the metal film is deposited on an electrode portion such as a solder ball of a semiconductor package, there is electrical property due to contamination of the electrode portion by sputtering deposition. Limitations of shorting or similar failures. Therefore, there is a need for a technique for protecting an electrode portion (for example, a solder ball of a semiconductor package) in which a metal film is not deposited.

In general, a metal film is formed on a surface of the electronic component by attaching one surface (or lower surface) of the electronic component to the adhesive sheet, and since only one surface of the electronic component can be attached to a typical adhesive sheet Therefore, except for the one surface of the electronic component, the use of only the adhesive sheet cannot protect a portion that does not need to be deposited.

Specifically, when a protruding terminal is formed on one surface of an electronic component such as a solder ball of a semiconductor package, since only an end portion of the protruding terminal can be attached to a typical adhesive sheet, in the typical adhesive sheet A gap phenomenon occurs between the one surface of the electronic component, and the protruding terminal of the electronic component is not protected, and further, an electrode portion (for example, a semiconductor) for protecting a metal film from being deposited is further required The technology of packaged solder balls).

Therefore, a method has recently been used in which sputtering is performed after a hole is formed in a flexible tape, and a bottom surface is provided across the hole so that an electrode portion on which a metal film is not deposited is not required ( For example, a solder ball of a semiconductor package is inserted into the hole.

However, as such, when a hole or a groove is formed in the flexible tape or material mounting member, an electronic component such as a semiconductor package is provided, and then sputtering is performed, it is further provided in the flexible tape or The process of forming the holes or grooves in the material, and thus the manufacturing process becomes complicated.

In addition, when sputtering is performed after an electronic component such as a semiconductor package is formed in a hole or a groove formed in a flexible tape or material, there is a problem in bringing the electronic component into close contact or fixing the electronic component. Therefore there may be gaps. Therefore, an undesired metal film may be formed on an electrode such as a solder ball of a semiconductor package.

In addition, there is a limitation that when the outer shape of the electronic component or the interval or shape of the electrode such as a solder ball is changed, the size of the hole or the groove should be changed thereby; and when a hole or a hole is formed in the flexible tape or material In the case of the groove, the degree of freedom of arrangement of the electronic components is low, and the interval between the holes of the electronic component is restricted, and thus the electronic component is not easily disposed densely.

[Prior Art Document] [Patent Document] Korean Patent No. 10-1590593

The present invention provides a slide for an electronic component and a device for forming the same using the slide for tightly fixing the electronic component and forming a film on the surface of the electronic component.

According to an exemplary embodiment, a carrier for an electronic component includes: an adhesive layer having one surface on which the electronic component is attached; and a deformation maintaining layer disposed on the other surface of the adhesive layer opposite to one surface And plastically deformed by the adhesion pressure of the electronic component.

The adhesive layer may have a thickness of from 5 micrometers (μm) to 100 micrometers.

The adhesive layer can have an adhesion of approximately 200 gram force per gram (gf/in) to 1,500 gram force per inch.

The deformation maintaining layer may be formed of a metal film.

The deformation maintaining layer may have a thickness of approximately 3 microns to 60 microns.

The deformation maintaining layer may have an elongation of approximately 10% to 80%.

The deformation maintaining layer may have a thermal conductivity of approximately 200 W/m x K to 450 W/m x K at room temperature.

The slide sheet may further include a magnetic layer disposed on the other surface of the deformation maintaining layer opposite to a surface facing the adhesive layer.

The magnetic layer may be formed in such a manner that the magnetic powder is dispersed in the binder resin.

The magnetic powder may be contained in an amount of 30% by weight (% by weight) to 90% by weight based on the total weight of the magnetic layer.

The magnetic powder may have an average particle diameter of 0.1 to 30 μm.

The magnetic layer may have a thickness of from 10 micrometers to 500 micrometers.

The slide sheet may further include a base film disposed on the other surface of the deformation maintaining layer opposite to a surface facing the adhesive layer and configured to support the deformation maintaining layer.

The restoring force of the base film may be a yield value at which the deformation maintaining layer can be plastically deformed or lower than the yield value.

At least one of the adhesive layer and the deformation maintaining layer may have magnetic properties.

The base film may be formed of a synthetic resin material and contain a magnetic powder.

The slide can have an elongation of approximately 10% to 80%.

The slide may have a tensile strength of approximately 25 N/mm ² (N/mm ² ) to 250 N/mm ² .

According to another exemplary embodiment, an apparatus for forming a film includes: a deposition material supply member that provides a deposition material for forming a thin film on a deposition target object, the article including a slide for an electronic component, The carrier is provided with a magnetic layer; and a susceptor configured to support the deposition target object, wherein the pedestal comprises: a magnet plate configured to provide a pulling force to the carrier; and a cooling unit configured to be The slide is cooled.

The pedestal may further include an elastic layer disposed between the magnet plate and the deposition target object.

The deposition target article may further include an electronic component attached to the slide, and the device may form the thin film on an exposed surface of the electronic component.

Hereinafter, exemplary embodiments will be explained in more detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments described herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the description, the same reference numerals are used to refer to the same components, and the same reference numerals are used to refer to the same components in the drawings.

FIG. 1 is a cross-sectional view illustrating a slide for an electronic component, according to an exemplary embodiment.

Referring to FIG. 1, a slide 100 for an electronic component according to an exemplary embodiment may include an adhesive layer 110 to which an electronic component 10 is attached; and a deformation maintaining layer 120 disposed on one surface of the adhesive layer 110 The other surface is plastically deformed by the adhesion pressure of the electronic component 10.

The slide 100 may also be provided as a rectangular slide or a circular slide, or may be formed in a roll shape, and may be used to securely and tightly fix the electronic component 10 to one surface of the slide 100 (for example, On the surface). At this time, at least one or more semiconductor packages may be disposed on the slide 100 in a closed form.

The adhesive layer 110 (the electronic component 10 can be attached (or adhered to) on one surface of the adhesive layer 110) can be used for attaching (or tightly fixing), for example, a semiconductor package 11 and a multilayer ceramic capacitor (MLCC) 12, etc. The electronic component 10 is subjected to a film forming process such as sputtering and thereby preventing deposition contamination of the electrode portion, and is used to adhere the electronic component 10 so that the electronic component 10 is easily peeled off from the carrier 100 after the process. Here, the electronic component 10 may include a protruding portion such as the protruding terminal 11a, and the semiconductor package 11 may include: a ball grid array (BGA) package in which a matrix is formed on one surface of the ball grid array package A plurality of solder balls are disposed; a land grid array (LGA) package is provided in which a plurality of land-shaped metal electrodes are disposed in a matrix form. At this time, the adhesive layer 110 may be disposed to face the electronic component 10, and the electronic component 10 may be attached to the adhesive layer 110, and the surface of the electronic component 10 faces the adhesive layer 110 as an adhesion surface.

Additionally, the adhesive layer 110 can comprise an adhesive material and is formed by processing the adhesive fluid material into a film form. For example, the adhesive material may include, but is not limited to, an anthrone-based adhesive material, and various materials other than the anthrone-based adhesive material may be used for the adhesive material constituting the adhesive layer 110.

In addition, the adhesive layer 110 may have an adhesive force of approximately 200 gram force/inch to 1,500 gram force/inch. When the adhesive force of the adhesive layer 110 is less than approximately 200 gram force/inch, the electronic component 10 may not be firmly adhered and fixed, and the electronic component 10 may move or separate relative to the slide 100 during the movement of the slide 100. In contrast, when the adhesive force of the adhesive layer 110 is greater than approximately 200 gram force/inch, the electronic component 10 is excessively firmly adhered, and thus the electronic component is not easily separated from the carrier 100 after the film forming process, or in the electron While the component 10 cannot be clearly separated from the adhesive layer 110, a part (or foreign matter) of the adhesive layer 110 may remain on the attachment surface (for example, the lower surface) of the electronic component 10.

Meanwhile, the adhesive layer 110 may have a thickness of 5 micrometers to 100 micrometers. When the thickness of the adhesive layer 110 is less than 5 μm, since thickness uniformity is not easily ensured in a large area, defects such as adhesion defects of the electronic component 10 and local contamination defects of the adhesion surface of the electronic component 10 may be caused, and The cohesive force of the adhesive or the like of the adhesive layer 110, and thus a part of the adhesive layer 110 can be separated and may remain on the attachment surface of the electronic component 10. In addition, not only the adhesive layer 110 may be torn or broken very easily and thus is not easy to handle, and the electronic component 10 may not be attached to the broken portion.

In contrast, when the thickness of the adhesive layer 110 is more than 100 μm, even when a pressing force is applied while the electronic component 10 is attached to the adhesive layer 110, the pressing force may not be easily transmitted to the deformation maintaining layer 120. In addition, when there are a plurality of protruding portions such as the protruding terminals 11a of the semiconductor package 11, a thick adhesive layer 100 is interposed between the protruding portions and thereby the occlusion space of the deformation maintaining layer 120 is blocked. Therefore, the deformation maintaining layer 120 may become difficult to change the shape according to the shape of the electronic component 10.

The deformation maintaining layer 120 may be disposed on the other surface of the adhesive layer 110 opposite to a surface on which the electronic component 10 is attached, may be bonded (or adhered) to the adhesive layer 110, and is adhered by the electronic component 10. And plastic deformation. That is, the deformation maintaining layer 120 may have a property that the shape of the deformation maintaining layer 120 is not restored after being plastically deformed by the pressure (or external force) to which the electronic component 10 is attached, and may be a shape restoration prevention film. For example, the shape of the deformation maintaining layer 120 may be changed by the pressure applied to the adhesive layer 110 while the electronic component 10 is attached to the adhesive layer 110, and the shape may not be restored after the shape is changed and plastically deformed. To the original shape. At this time, a portion of the electronic component 10 that is depressed to the carrier sheet 100 (for example, a protruding terminal of the semiconductor package) may be held in the deformation maintaining layer 120 and fixed to the deformation maintaining layer 120. Therefore, a gap phenomenon between the adhesive layer 110 and the attachment surface of the electronic component 10 can be prevented. In addition, the limitation that deposition contamination may occur in the electrode portion of the electronic component 10 due to the gap phenomenon, and thus the quality of the electronic component 10 may be degraded and the yield of the electronic component 10 may become low may be solved.

At this time, in order to improve the operational property while restoring the shape of the deformation maintaining layer 120 after the deformation is not deformed, the material of the deformation maintaining layer 120 may be important, and the deformation maintaining layer 120 may be composed (or formed) of the metal film. At this time, the metal film may include a metal piece or a metal foil having a small thickness and is formed of a metal material having malleability and ductility. Here, the malleability and ductility include the malleability as a property of widening by receiving pressure and the ductility as a property extended by the tensile resistance, and may mean the ease of plastic processing (ie, plasticity). (plasticity)). For example, the metal film can be formed using a material such as aluminum, aluminum alloy, copper, and copper alloy which is ductile and excellent in processability and thereby easily processed into a very small thickness.

In addition, in order to improve the operational properties while the shape is not restored after the shape of the deformation maintaining layer 120 has been deformed, the thickness of the deformation maintaining layer 120 may be important. For example, the deformation maintaining layer 120 may be formed of a shape of a metal piece, a metal film, or a metal foil having a small thickness. At this time, the deformation maintaining layer 120 may have a thickness of approximately 3 to 60 μm. When the thickness of the deformation maintaining layer 120 is less than 3 μm, the deformation maintaining layer 120 may be torn or broken very easily and thus is very difficult to handle. In addition, the yield value of the plastic deformation of the deformation maintaining layer 120 is lowered, and therefore, the plastically deformed shape may not be easily maintained along the depressed portion of the electronic component 10 (for example, the protruding terminal of the semiconductor package). In contrast, when the thickness of the deformation maintaining layer 120 is more than 60 μm, even when pressure is applied while the electronic component 10 is attached to the adhesive layer 110, the shape of the deformation maintaining layer 120 may not be effectively deformed along the depressed portion of the electronic component 10. . For example, when formed of aluminum, the deformation maintaining layer 120 may be formed to a thickness of 5 micrometers to 15 micrometers (approximately 9 micrometers), and depending on the material (type of material), the thickness of the deformation maintaining layer 120 may be changed. .

In addition, the deformation maintaining layer 120 may have an elongation of approximately 10% to 80%. When the elongation of the deformation maintaining layer 120 is less than approximately 10%, since the pressure applied while attaching the electronic component 10 to the adhesive layer 110 cannot be easily extended or a large pressure may be necessary for plastic deformation, Therefore, the deformation maintaining layer 120 may not be plastically deformed, and even if it is plastically deformed, the deformation maintaining layer 120 may not be accurately deformed along the shape of the depressed portion of the electronic component 10. In contrast, when the elongation of the deformation maintaining layer 120 is more than 80%, the deformation maintaining layer 120 is excessively extended and thus it becomes difficult to operate the deformation maintaining layer 120 to be plastically deformed so that the adhesive layer 110 closely contacts the attachment of the electronic component 10. surface. Therefore, it is not only difficult to create (or maintain) pressurization conditions to change the shape of the deformation maintaining layer 120 to a shape in which the adhesive layer 110 can closely contact the attachment surface of the electronic component 10, and when the adhesive layer 110 is not completely uniformly pressurized At this time, the adhesive layer 110 may not be uniformly attached to the attachment surface of the electronic component 10 due to the pressure difference of each zone and a gap (or a gap phenomenon) may occur between the adhesive layer 110 and the attachment surface of the electronic component 10. Therefore, the stability of mass production may be lowered.

2 is a conceptual diagram illustrating a process of attaching an electronic component to a carrier for an electronic component according to an embodiment, and FIG. 2(a) is a diagram in which a semiconductor package is attached to the carrier, (b of FIG. 2) Is a diagram in which the deformation maintaining layer of the carrier is plastically deformed by the adhesion pressure of the semiconductor package, and (c) of FIG. 2 is a diagram in which a multilayer ceramic capacitor (MLCC) is attached to the carrier. (d) of FIG. 2 is a view in which the deformation maintaining layer of the slide sheet is plastically deformed by the adhesion pressure of the multilayer ceramic capacitor (MLCC).

Referring to FIG. 2, the deformation maintaining layer 120 may be plastically deformed according to the shape of the electronic component 10, and the deformation maintaining layer 120 may be plasticized according to the shape of the depressed portion of the electronic component 10 to the carrier sheet 100 or the deformation maintaining layer 120. Deformation.

At this time, the electronic component 10 such as the semiconductor package 11 may face the state of the adhesive layer 110 while a part of the electronic component 10 is inserted (or depressed) (for example, in the case of the semiconductor package, the terminal face is protruded therein) In the state of the adhesive layer, the adhesive layer 110 is contacted. In addition, the electronic component 10 is pressed in a direction toward the adhesive layer 110, and thus, the adhesive layer 110 and the deformation maintaining layer 120 may be pressed by an attachment surface or a contact surface of the electronic component 10 (for example, a protruding terminal of the semiconductor package). The shape of the adhesive layer 110 and the deformation maintaining layer 120 can be deformed by pressing the electronic component 10, and thus, at least a portion (for example, a protruding terminal) of the electronic component 10 can be depressed into the adhesive layer 110 and from being exposed to the outside. In addition, after the shape of the deformation maintaining layer 120 has been plastically deformed, the shape of the deformation maintaining layer 120 may not be restored. Here, when the electronic component 10 is pressed in the direction toward the adhesive layer 110, a pusher such as a soft roller may directly contact and press the electronic component 10 and may indirectly contact the electronic component 10 and/or the slide. 100 applies pressure.

For example, when the electronic component 10 is the semiconductor package 11 including at least one protruding terminal 11a on one surface (ie, on the adhesion surface), the electronic component 10 can be plastically deformed along the protruding terminal 11a such as a solder ball or an electrode. The electronic component 10 is attached to the adhesive layer 110 on the one surface.

In addition, when the electronic component 10 is the multilayer ceramic capacitor 12, as shown in (c) of FIG. 2, at least a portion of the multilayer ceramic capacitor 12 is depressed into the carrier sheet 100, and thus, the adhesive layer 110 may be attached not only to The lower surface of the multilayer ceramic capacitor 12 is attached to at least a portion of the side surface of the multilayer ceramic capacitor 12. Further, as shown in (d) of FIG. 2, the deformation maintaining layer 120 may be plastically deformed along the shape of at least a portion of the lower surface and the side surface of the multilayer ceramic capacitor 12 that is depressed to the carrier sheet 100.

Here, the adhesive layer 110 or the deformation maintaining layer 120 may have a thickness smaller than the height of the depressed portion of the electronic component 10. For example, the adhesive layer 110 or the deformation maintaining layer 120 may have a thickness smaller than a predetermined depth at which the electronic component 10 is depressed, and when the protruding terminal 11a is depressed into the carrier 100, the adhesive layer 110 or the deformation maintaining layer 120 may have a smaller thickness. The thickness of the terminal 11a is protruded to a small thickness.

When the adhesive layer 110 or the deformation maintaining layer 120 has a thickness equal to or larger than the height of the depressed portion of the electronic component 10, the adhesion pressure of the electronic component 10 is not easily transmitted to the deformation maintaining layer 120 and thus, the deformation maintaining layer 120 cannot receive equal or The yield value larger than the plastic deformation of the deformation maintaining layer 120 and thus, may not be plastically deformed or may not be flexibly bendable due to a large thickness at the edge portion or the like of the electronic component 10. Therefore, the deformation maintaining layer 120 may not be accurately deformed along the shape of the depressed portion of the electronic component 10. Specifically, when a plurality of protruding portions such as the protruding terminals 11a of the semiconductor package 11 are densely present on the attachment surface of the electronic component 10, a thick adhesive layer 110 is interposed between the protruding members and is thereby blocked and deformed. The adhesion space of the layer 120 is maintained, or the adhesion layer 110 cannot be sandwiched due to the large thickness of the deformation maintaining layer 120. Therefore, the shape of the deformation maintaining layer 120 may not be easily changed according to the shape of the depressed portion of the electronic component 10.

3 is a conceptual diagram illustrating a film formation process performed on a surface of an electronic component according to an exemplary embodiment, and (a) of FIG. 3 is a diagram in which a film is formed on a surface of the semiconductor package, (b) of FIG. Is a diagram in which a semiconductor package on which a thin film is formed is peeled off from a carrier for an electronic component, and (c) of FIG. 3 is a diagram in which a thin film is formed on a surface of a multilayer ceramic capacitor (MLCC), and (d) of FIG. ) is a view in which a multilayer ceramic capacitor (MLCC) having a thin film formed thereon is peeled off from a carrier for an electronic component.

Referring to FIG. 3, a thin film forming process such as sputtering can be performed while the electronic component 10 is adhered (or tightly fixed) to the slide 100 for an electronic component. Therefore, a film (for example, a metal film or an electromagnetic wave shielding film for shielding electromagnetic waves) may be formed on the exposed surface of the surface of the electronic component 10 that is not adhered to the carrier 100, and may not be adhered to the carrier 100 and is not exposed. A film 20 is formed on the surface. For example, when the electronic component 10 is the semiconductor package 11, a metal film may be formed on the side surface and the upper surface of the exposed semiconductor package 11, and a protruding terminal such as a solder ball or an electrode may be formed on the upper surface of the semiconductor package 11 The lower surface is sealed by the slide 100 without forming the metal film. Therefore, a portion of the surface of the electronic component 10 on which the film is not required to be formed is sealed, and therefore, if necessary, the film can be selectively formed only on a portion on which the film needs to be formed.

For example, the electronic component 10 can be adhered (or mounted) to the carrier 100, and after the carrier 100 on which the electronic component 10 has been disposed is transferred to the device 200 for forming a film to be described later, The surface of the electronic component 10 in the device 200 performs a film forming process. At this time, the sputtering process is performed in the device 200, and thus, a metal film for shielding electromagnetic waves can be formed on the exposed surface (for example, the side surface and the upper surface of the semiconductor package). When the film 20 is formed on the exposed surface of the electronic component 10, the picker 30 can pick up and transport the electronic component 10 disposed on the carrier 100 to a subsequent process.

Here, when the film forming process is performed by putting the slide 100 into the apparatus 200, the electronic component 10 is exposed to a high-temperature atmosphere. Therefore, since the electronic component 10 such as a semiconductor wafer provided in the semiconductor package 11 may be damaged due to high-temperature heat, rapid cooling of the electronic component 10 is indispensable.

The deformation maintaining layer 120 may have a thermal conductivity of approximately 200 W/m·K or higher than 200 W/m·K at room temperature. That is, the deformation maintaining layer 120 can have excellent thermal conductivity. In a film forming process such as sputtering, high-temperature heat may be generated, and heat dissipation characteristics of the carrier 100 are important, so that the electronic component 10 is protected from damage and breakage due to the high-temperature heat. Therefore, the slide 100 can also be used to quickly transfer heat supplied to the electronic component 10 to the outside during the film forming process and to quickly dissipate heat supplied to the electronic component 10.

For example, the deformation maintaining layer 120 may be formed of a metal material having high thermal conductivity, and absorbs heat transferred (or generated) from the electronic component 10 and transfers the heat to the susceptor 220 of the device 200. At this time, when the deformation maintaining layer 120 is formed of an aluminum material or a copper material, heat supplied to the electronic component 10 can be quickly dissipated to the outside. Therefore, the electronic component 10 exposed to a high temperature atmosphere during a thin film forming process such as sputtering can be rapidly cooled. Therefore, it is possible to prevent the electronic component 10 such as a semiconductor wafer provided in the semiconductor package 11 from being damaged due to high-temperature heat, and deformation of the electronic component 10 (for example, bending of the semiconductor package 11) can be prevented.

At this time, when the thermal conductivity of the deformation maintaining layer 120 is less than approximately 200 W/m·K at room temperature, the amount of heat that can be transferred to the susceptor of the device 200 after absorbing heat transferred from the electronic component 10 is limited. Therefore, the electronic component 10 exposed to a high temperature atmosphere during a thin film forming process such as sputtering may not be rapidly cooled and may be damaged due to high temperature heat. The higher the thermal conductivity of the deformation maintaining layer 120, the better. However, since the deformation maintaining layer 120 has material limitations due to other characteristics, the upper limit of the thermal conductivity may be 450 W/m·K at room temperature. Preferably, the deformation maintaining layer 120 may have a thermal conductivity of approximately 200 W/m·K to 450 W/m·K at room temperature.

Therefore, a gap phenomenon can be prevented from occurring in the deformation maintaining layer 120 between the adhesive layer 110 and the attachment surface of the electronic component 10, and the deformation maintaining layer 120 has high thermal conductivity and thereby enables heat transferred from the electronic component 10 to be borrowed The susceptor 220 is efficiently transferred to the susceptor 220, and a film having an excellent film quality can be formed on the surface of the electronic component 10.

However, when the slide 100 does not closely contact the susceptor 220, the heat supplied to the slide 100 may not be easily dissipated.

Therefore, at least one of the adhesive layer 110 and the deformation maintaining layer 120 may have magnetic properties. At this time, in order to make the electric component carrier 100 in close contact with the susceptor 220, the susceptor 220 may include the magnet plate 221, and the cooling unit 222 is installed (or disposed) in the magnet plate 221 or on the rear surface of the magnet plate 221 and The magnet plate 221 and/or the electrical component carrier 100 can thereby be cooled. To generate (or provide) a pulling force in the electrical component carrier 100 by utilizing the magnetic force generated from the magnetic plate 221 and thereby bringing the electrical component carrier 100 into close contact with the susceptor 220, at least one of the adhesive layer 110 and the deformation maintaining layer 120 It can have magnetic properties.

For example, the adhesive layer 110 may contain magnetic powder 132. By adding a magnetic powder 132 such as a powder-shaped magnetic metal powder to the adhesive layer 110 formed of a non-magnetic material, the adhesive layer 110 can have not only an adjustable thickness but also maintain the adhesiveness of the adhesive layer 110. Similar properties of magnetic films. That is, by adding the magnetic powder 132 to the adhesive layer 110, the slide 100 can closely contact the susceptor 220 by the magnetic force generated from the magnetic plate 221. Therefore, heat transferred to the electronic component 10 can be supplied to the magnetic plate 221 and/or the cooling unit 222 by the slide 100 and the electronic component 10 can be quickly cooled. Here, when the magnetic powder 132 is added to the adhesive layer 110, the adhesive layer 110 containing the magnetic powder 132 may be formed to have a thickness of approximately 50 μm to perform a function similar to that of the magnetic metal film. However, the thickness of the adhesive layer 110 containing the magnetic powder 132 is not limited thereto, and may be adjusted to a thickness of approximately 50 μm or more according to the size, average particle diameter, density, and the like of the magnetic powder or A thickness of approximately 50 microns or less than 50 microns. Meanwhile, when the deformation maintaining layer 120 is formed of a non-magnetic metal film which is processed into a very small thickness due to ductility and workability, the deformation maintaining layer 120 may be formed of a non-magnetic metal material through which a magnetic field can pass.

In addition, the deformation maintaining layer 120 may be formed of a magnetic metal film. Further, in this case, the slide 100 can be in close contact with the susceptor 220 by the magnetic force generated from the magnetic plate 221, and thus, heat transferred to the electronic component 10 can be supplied to the magnetic plate by the slide 100 The 221 and/or the cooling unit 222 can thereby be used to rapidly cool the electronic component 10. Here, the magnetic metal may include iron (Fe), cobalt (Co), nickel (Ni), and a compound thereof.

4 is a cross-sectional view showing a slide for an electronic component including a magnetic layer according to an embodiment, and FIG. 4(a) shows a slide for an electronic component including a magnetic layer, and (b) of FIG. The plastic deformation of the deformation maintaining layer of the slide for the electronic component including the magnetic layer is shown.

Referring to FIG. 4, a slide 100 for an electronic component according to an exemplary embodiment may further include a magnetic layer 130 disposed on another surface of the deformation maintaining layer 120 opposite to a surface facing the adhesive layer 110. . The magnetic layer 130 may be disposed on the other surface of the deformation maintaining layer 120 opposite to one surface facing the adhesive layer 110. For example, the magnetic layer 130 may be formed as a magnetic thin film, and a magnetic metal film in which the magnetic metal powder is formed into a film shape. When the carrier 100 includes the magnetic layer 130, the carrier 100 can closely contact the susceptor 220 by the magnetic force generated from the magnet plate 221. Therefore, heat transferred to the electronic component 10 can be supplied to the magnetic plate 221 and/or the cooling unit 222 by the slide 100 and the electronic component 10 can be quickly cooled.

Here, the magnetic layer 130 may be formed in such a manner that the magnetic powder 132 is dispersed in the binder resin 131. In this case, it may be advantageous to increase the thickness of the magnetic layer 130, which can be adjusted by adjusting the content of the magnetic powder 132, and only the thickness of the magnetic layer 130 can be adjusted to a state having the same magnetic strength. Therefore, the magnetic layer 130 can be formed to stably support the thickness of the deformation maintaining layer 120 according to the thickness of the deformation maintaining layer 120 or the like. In addition, the binder resin 131 provides ductility and/or elasticity, thereby acting as a buffer, and may also constrain the deformation range of the deformation maintaining layer 120. Therefore, the deformation maintaining layer 120 can also be prevented from being torn and/or damaged.

At this time, the magnetic powder 132 may be contained in an amount of 30% by weight to 90% by weight based on the total weight of the magnetic layer 130. When the magnetic powder 132 is contained in an amount of 30% by weight or less than 30% by weight based on the total weight of the magnetic layer 130, since the magnetic strength is low, the slide sheet 100 may not stably contact the susceptor 220 in close contact. In contrast, when the magnetic powder 132 is contained in an amount of more than 90% by weight based on the total weight of the magnetic layer 130, the adhesion to the deformation maintaining layer 120 or the like may be lowered, or the ductility and/or elasticity of the magnetic layer 130 may be lowered, and Therefore, it may not be effective to buffer.

In addition, the magnetic powder 132 may have an average particle size (or average particle diameter) of 0.1 to 30 μm. When the magnetic powder 132 has an average particle diameter of less than 0.1 μm, since the size (or average size) of the magnetic powder 132 is too small, the magnetic powder 132 may not be easily uniformly dispersed throughout the entire region (or the entire region) of the magnetic layer 130. . In contrast, when the magnetic powder 132 has an average particle diameter of more than 30 μm, since the number of particles of the magnetic powder 132 which can enter the predetermined region of the magnetic layer 130 is limited, the magnetic strength cannot be adjusted or the thickness of the magnetic layer 130 cannot be adjusted to The average particle diameter of the magnetic powder 132 is smaller than the average particle diameter.

In addition, the magnetic layer 130 may have a thickness of 10 micrometers to 500 micrometers. When the thickness of the magnetic layer 130 is less than 10 μm, magnetic properties sufficient to make the slide 100 in close contact with the strength of the susceptor 220 may not be provided, or the magnetic layer 130 may not function effectively as a buffer. In contrast, when the thickness of the magnetic layer 130 is more than 500 μm, the distance from the electronic component 10 to the susceptor 220 increases, and thus, the heat dissipation path may increase and effective heat dissipation may not be efficiently performed.

Meanwhile, the magnetic layer 130 may also replace the role of the base film 140 to be described later, and when not only the magnetic layer 130 but also the base film 140, the deformation maintaining layer 120 and the base film 140 may also replace the deformation maintaining layer 120 and the foundation. The role of the adhesive 150 to which the film 140 is bonded.

Further, the sum of the thickness of the adhesive layer 110, the thickness of the deformation maintaining layer 120, and the thickness of the magnetic layer 130 may have a value larger than the height of the depressed portion of the electronic component 10. For example, the sum of the thickness of the adhesive layer 110, the thickness of the deformation maintaining layer 120, and the thickness of the magnetic layer 130 may have a value larger than a predetermined depth, and when only the protruding terminal 11a is depressed into the slide 100, And a value that can have a height greater than the height of the protruding terminal 11a.

When the sum of the thickness of the adhesive layer 110, the thickness of the deformation maintaining layer 120, and the thickness of the magnetic layer 130 has a value equal to or smaller than the height of the depressed portion of the electronic component 10, the adhesive layer 110, the deformation maintaining layer 120, and the magnetic layer The owner of 130 should be deformed along the shape of the depressed portion of the electronic component 10. Therefore, when the electronic component 10 is attached to the slide 100, the bottom surface of the slide 100 (or the contact surface contacting the susceptor) becomes uneven and uneven.

However, as in the exemplary embodiment, when the sum of the thickness of the adhesive layer 110, the thickness of the deformation maintaining layer 120, and the thickness of the magnetic layer 130 has a larger value than the height of the depressed portion of the electronic component 10, in the magnetic layer A portion of at least a portion of 130 may be affected by a shape that is not affected by the shape of the depressed portion of the electronic component 10 or that is less affected by the shape of the depressed portion, and the curvature of the bottom surface of the slide 100 may be lowered and the bottom surface Variable flat. Therefore, the strength of the close contact between the slide sheets 100 can be enhanced, and the effect of cooling the susceptor 220 by the cooling unit 222 can be further improved.

5 is a cross-sectional view showing a slide for an electronic component including a base film according to an embodiment, and FIG. 5(a) shows a slide for an electronic component including a base film, and (b) of FIG. The plastic deformation of the deformation maintaining layer of the slide for the electronic component including the base film is shown.

Referring to FIG. 5, the slide 100 for an electronic component may further include a base film 140 disposed on the other surface of the deformation maintaining layer 120 opposite to one surface facing the adhesive layer 110 and supporting the deformation maintaining layer 120. . The base film 140 may be disposed on the other surface of the deformation maintaining layer 120 opposite to one surface facing the adhesive layer 110, supporting the deformation maintaining layer 120, and thereby constraining the deformation range of the deformation maintaining layer 120. Therefore, the deformation maintaining layer 120 can be prevented from being torn or damaged, and thus the deformation maintaining layer 120 can be prevented from being damaged and handleability can be improved. Specifically, the base film 140 can prevent physical damage such as damage or tear of the deformation maintaining layer 120, and can prevent contamination of the deformation maintaining layer 120 due to the external material. At this time, the base film 140 may support not only the deformation maintaining layer 120 but also the adhesive layer 110, the magnetic layer 130, or the adhesive 150 provided on the base film 140 (for example, on one surface of the base film), and may be used for The deformation maintaining layer 120 is prevented from being torn and broken.

In addition, the base film 140 may provide a force for fastening the deformation maintaining layer 120 and the adhesive layer 110 to constrain the deformation range of the deformation maintaining layer 120 (or a force for closely contacting the attachment surface of the electronic component), and the adhesive layer 110 is made Closer contact with the attachment surface.

The restoring force of the base film 140 may be a yield value (or plastic deformation force) at which the deformation maintaining layer 120 can be plastically deformed or lower than the yield value. When the restoring force of the base film 140 is greater than the yield value at which the deformation maintaining layer 120 can be plastically deformed, in order to achieve the first plastic deformation of the deformation maintaining layer 120, a restoring force equal to or greater than the base film 140 and the deformation maintaining layer 120 are required. The pressing force of the sum of the yield values of the yield values of the plastic deformation. In addition, even if the deformation maintaining layer 120 is first plastically deformed, the restoring force of the base film 140 larger than the yield value at which the deformation maintaining layer 120 can be plastically deformed can plastically deform the deformation maintaining layer 120 into another shape. Therefore, the restoring force of the base film 140 may be a yield value at which the deformation maintaining layer 120 can be plastically deformed or lower than the yield value, so that the deformation maintaining layer 120 is plastically deformed and the shape of the deformation maintaining layer 120 can be maintained.

Meanwhile, the base film 140 may be formed of a synthetic resin material and may contain the magnetic powder 132. The base film 140 may be formed of a synthetic resin material that is deformable in shape corresponding to plastic deformation (or shape deformation) of the deformation maintaining layer 120. For example, the base film 140 can be formed by processing polyethylene terephthalate (PET) into a sheet shape or a film shape.

When the thickness of the film 140 is too thick compared to the thickness of the deformation maintaining layer 120, the shape of the base film 140 may not be easily deformed and has a strong restoring force, and thus, the deformation force of the deformation maintaining layer 120 (ie, , elastic deformation force or plastic deformation force) may be reduced.

Therefore, the thickness of the base film 140 and the deformation maintaining layer 120 can be determined such that the restoring force of the base film 140 is a yield value at which the deformation maintaining layer 120 can be plastically deformed or lower than the yield value. That is, the thickness of the base film 140 can be determined by the thickness of the deformation maintaining layer 120. For example, when the thickness of the deformation maintaining layer 120 formed of an aluminum material is approximately 9 μm, the thickness of the base film 140 formed of a polyethylene terephthalate (PET) material is set to approximately 15 μm, and Therefore, the restoring force of the base film 140 may be equal to or less than the yield value at which the deformation maintaining layer 120 can be plastically deformed.

In addition, the thickness of the base film 140 may be determined according to the size of the solder ball of the semiconductor package 11 or the like, and the larger the size of the solder ball, the thinner the thickness of the base film 140 may be. For example, base film 140 can be machined to a thickness that can correspond to a solder ball having a size of approximately 350 microns.

The base film 140 may contain magnetic powder 132. The magnetic powder 132 may be added to the base film 140 instead of the adhesive layer 110, and the base film 140 may also be formed by adding the magnetic powder 132 to the synthetic resin material, and the magnetic powder 132 is formed on the surface of the base film 140. It can be excellent for the film shape. Further, in this case, the slide 100 can be in close contact with the susceptor 220 by the magnetic force generated from the magnetic plate 221, and thus, heat transferred to the electronic component 10 can be supplied to the magnetic plate by the slide 100 The 221 and/or the cooling unit 222 can thereby be used to rapidly cool the electronic component 10. At this time, the magnetic powder 132 may have an average particle diameter of 0.1 μm to 30 μm for the same reason as the magnetic powder 132 of the magnetic layer 130.

Therefore, at least one or more of the adhesive layer 110, the deformation maintaining layer 120, and the base film 140 may have magnetic properties, and the magnetic layer 130 is no longer used, but the adhesive layer 110, the deformation maintaining layer 120, and the base film 140 are used. At least one or more of them may have magnetic properties.

The slide 100 in the exemplary embodiment may further include an adhesive 150 disposed between the deformation maintaining layer 120 and the base film 140 and reinforcing the adhesion between the deformation maintaining layer 120 and the base film 140. The adhesive 150 may be disposed in the shape of an adhesive layer between the deformation maintaining layer 120 and the base film 140 and may enhance adhesion between the deformation maintaining layer 120 and the base film 140. For example, the adhesive 150 may be formed on the other surface (or lower portion) of the deformation maintaining layer 120, and the base film may be formed (or disposed) on the facing deformation maintaining layer 120 of the adhesive 150 with the adhesive 150. One surface is opposite to the other surface. At this time, the adhesive 150 may be an adhesive in which the magnetic powder 132 is dispersed in the adhesive material, and the magnetic powder 132 may include a metal powder or a ferrite powder.

At the same time, the base film 140 may not be affected by the shape of the depressed portion of the electronic component 10 and may not be deformed. The electronic component 10 is pressed in the direction of the adhesive layer 110 after contacting the adhesive layer 110 of the carrier 100. Therefore, when the adhesive 150 is disposed between the deformation maintaining layer 120 and the base film 140, the self-adhesive layer 110 only to the adhesive 150 may generate a shape corresponding to the shape of the depressed portion of the electronic component 10 (for example, the protruding terminal of the semiconductor package). The deformation of the base film 140 may not be deformed. Therefore, the base film 140 can be used to prevent tearing and breaking of the deformation maintaining layer 120 for the thin metal film. When the shape of the base film 140 is not deformed, unevenness unevenness may not occur on the other surface (for example, the lower surface) of the base film 140 opposite to one surface of the base film 140 facing the adhesive 150. Therefore, the base film 140 can closely contact the susceptor 220 of the apparatus 200, and can be effectively cooled by the cooling unit 222 when the thin film 20 is formed by a thin film forming process such as sputtering, and thus, the heat dissipation of the slide 100 Performance can be further improved.

The slide 100 according to an exemplary embodiment may have an elongation of approximately 10% to 80%. When the elongation of the carrier 100 is less than approximately 10%, the electronic component 10 is not easily extended by the pressure applied during the process in which the electronic component 10 is attached to the adhesive layer 110 and thus, the deformation maintaining layer 120 may not be plastic. Deformation, or plastic deformation of the deformation maintaining layer 120, may require a large pressing force. In addition, even if it is plastically deformed, the deformation maintaining layer 120 may not be accurately deformed according to the shape of the depressed portion of the electronic component 10.

In contrast, when the elongation of the carrier sheet 100 is more than 80%, the carrier sheet 100 extends too easily and thus, it becomes difficult to operate the deformation maintaining layer 120 to plastically deform the deformation maintaining layer 120 to bring the adhesive layer 110 into close contact with the electronic component. 10 attached surface. Therefore, it is not only difficult to establish a pressing condition to change the shape of the deformation maintaining layer 120 to a shape in which the adhesive layer 110 can closely contact the attachment surface of the electronic component 10, and when the adhesive layer 110 is not completely uniformly pressurized, the adhesive layer 110 is unevenly attached to the attachment surface of the electronic component 10 according to the pressure of each zone and a gap (or gap phenomenon) may occur between the adhesive layer 110 and the attachment surface of the electronic component 10. In addition, the slide 100 is attached to the hollow support frame (not shown) in a state in which at least one or more of the electronic components 10 are adhered to the slide 100, and in this case, since the slide 100 is larger than 80% The high elongation of the slide 100 may be undulated or deformed. Therefore, the adhered electronic component 10 may be affected, for example, may move or separate, and thus the stability of mass production may be degraded.

At this time, the elongation of the slide sheet 100 may preferably be from 35% to 70% to achieve effective deformation and high mass production stability, and more preferably from 50% to 60%.

The slide 100 according to an exemplary embodiment may have a tensile strength of approximately 25 N/mm ² (N/mm ² ) to 250 N/mm ² . When the tensile strength of the carrier 100 is less than approximately 25 N/mm 2, the slide 100 may be torn or damaged by the pressure (or pressing force) attached to the electronic component 10. In contrast, when the tensile strength of the slide 100 is more than approximately 250 N/mm 2 , the deformation maintaining layer 120 may not be easily deformed and may thus be unable to be plastically deformed, or the elastic force (or elastic deformation force) may increase. Therefore, a large pressing force may be required to achieve plastic deformation, and even if it is plastically deformed, the deformation maintaining layer 120 may not be accurately deformed according to the shape of the depressed portion of the electronic component 10. At this time, the tensile strength of the slide sheet 100 may preferably be approximately 34 N/mm 2 to 250 N/mm 2 . Meanwhile, when the tensile strength of the deformation maintaining layer 120 is high and the tensile strength of approximately 25 N/mm 2 to 250 N/mm 2 can be obtained only by the adhesive layer 110 and the deformation maintaining layer 120, the slide is provided. 100 can be fabricated (or manufactured) using only the adhesive layer 110 and the deformation maintaining layer 120.

FIG. 6 is a cross-sectional view illustrating an apparatus for forming a film, according to another exemplary embodiment.

Referring to FIG. 6, a device for forming a film according to another exemplary embodiment will be explained in more detail, and a portion of the content repeated with respect to the slide described above and according to the exemplary embodiment will not be given again. Narration.

The apparatus 200 for forming a thin film according to another exemplary embodiment may include: a deposition material supply part 210 on which a deposition material 21 for forming the thin film 20 is provided, and the deposition target object D includes an electronic element a carrier 100, the carrier 100 is provided with a magnetic layer; and a susceptor 220 for supporting the deposition target object D, wherein the susceptor 220 may include: a magnet plate 221 to provide a pulling force to the carrier 100; and a cooling unit 222, The slide 100 is cooled.

The deposition material supply part 210 may provide a deposition material 21 for forming a film 20 on the deposition target object D, and the deposition target object D includes a slide 100 provided with a magnetic layer. Here, the slide 100 may be a slide 100 for an electronic component to which an electronic component 10 is adhered (or fixed) according to an exemplary embodiment. The deposition material supply part 210 may provide the deposition material 21 for forming the film 20 on the deposition target object D by at least one method selected from all physical and chemical deposition methods such as the following: a spray method, impregnation A dipping method, a sputtering method, a thermal deposition method, a thermal evaporation method, or a chemical vapor deposition (CVD) method.

For example, the deposition material providing part 210 may be disposed over the susceptor 220 and may provide a deposition material 21 for forming a film 20 on the deposition target object D, and the deposition target object D includes the carrier sheet 100. Here, the deposition target article D may include not only the slide 100 but also the electronic component 10 adhered to the slide 100, and the deposition material supply member 210 may provide the deposition material 21 on the exposed surface of the electronic component 10 and form the film 20. In addition, the film 20 formed by the deposition material providing member 210 may be an electromagnetic interference (EMI) shielding film for shielding electromagnetic waves released from the electronic component 10, and formed on the exposed surface of the electronic component 10. The electromagnetic interference shielding film can be formed by providing a metal material as a deposition material. At this time, the deposition material supply member 210 can freely deposit the deposition material 21 formed of the metal material by the sputtering method, and supply the deposition material to the deposition target object D such as the slide 100.

Meanwhile, in the case of a spraying method, a sputtering method, a thermal deposition method, a thermal evaporation method, a chemical vapor deposition (CVD) method, or the like, the deposition material supply member 210 can be sprayed on the deposition target object D The material is deposited to provide the deposited material 21, and in the case of a quenching method, the deposited material providing part 210 can provide a solution of the deposited material 21 into the container. In addition, the film 20 may be various coating films that are not only selectively formed (or coated) on the electromagnetic interference shielding film but also formed on the surface of the insulating film or the electronic component 10.

The susceptor 220 is a chuck module and can support the deposition target object D such that the deposition surface of the deposition target object D contacts the deposition material 21. For example, the susceptor 220 may be disposed under the deposition providing member 210, and a deposition target object D such as the slide 100 may be mounted on the susceptor 220.

Here, the susceptor 220 may include a magnet plate 221 that provides a pulling force to the carrier 100, and a cooling unit 222 that cools the carrier 100. The magnet plate 221 can supply (or generate) a pulling force to the slide 100 provided with the magnetic layer due to a magnetic force generated by a magnet such as an electromagnet and a permanent magnet. The magnetic force generated from the magnet plate 221 can generate a tensile force to the magnetic layer (for example, the magnetic layer) of the slide 100, and thus, the slide 100 can closely contact the base 220.

The cooling unit 222 can cool the magnet plate 221 and/or the carrier plate 100 of the magnet plate 221 by the tensile force generated by the magnetic force generated from the magnet plate 221, and/or cool the magnet plate 221. At this time, the cooling unit 222 may also be disposed (or installed) outside the magnet plate 221 to contact the magnet plate 221 and may also be installed (or disposed) in the magnet plate 221. The cooling unit 222 can rapidly cool the heat applied to the electronic component 10 during a thin film forming process such as sputtering, and can cool the electronic component 10 by the slide 100 that closely contacts the magnet plate 221 of the susceptor 220.

The susceptor 220 has a support surface that may be formed of an elastic material and the deposition target object D is supported by the support surface. In this case, the close contact force between the contact surface (for example, the lower surface) of the deposition target object D such as the slide 100 and the support surface of the susceptor 220 can be improved. Therefore, heat from the deposition target object D can be smoothly transmitted to the susceptor 220, and the cooling efficiency of the cooling unit 222 can be improved.

For example, the pedestal 220 may be further disposed on an elastic layer (not shown) between the magnet plate 221 and the deposition target object D. The elastic layer (not shown) may be formed of an elastic material and improve the close contact force between the magnet plate 221 and the deposition target object D. Therefore, heat from the deposition target object D can be smoothly transmitted to the susceptor 220, and the cooling efficiency of the cooling unit 222 can be improved. At this time, when the slide 100 closely contacts the susceptor 220 by the magnetic force generated by the magnet plate 221, the area of the contact surface between the slide 100 and the susceptor 220 may be due to the elastic layer (not shown). The elasticity is further increased. Here, the elastic layer (not shown) may be formed of at least any one of an anthrone, an adhesive, a fiberglass sheet, and a graphite sheet.

Meanwhile, the magnet plate 221 may include a platform that supports the deposition target object D and the magnetic layer installed in the platform. At this time, the platform itself may be formed of an elastic material, or an elastic layer (not shown) formed of an elastic material may be formed on the stage. Therefore, a support surface supporting the deposition target object D can be provided.

Further, the magnet plate 221 may be directly elastic by being formed into a magnetic layer by itself, and an elastic layer (not shown) formed of an elastic material is formed on the magnet plate 221. Therefore, a support surface supporting the deposition target object D can also be provided.

As such, the susceptor 220 has a support surface that can be formed of an elastic material, and the deposition target object D is supported by the support surface.

The deposition target article D may further include the electronic component 10 attached (or adhered) to the slide 100, and the device 200 according to an exemplary embodiment may form the film 20 only on the exposed surface of the electronic component 10. In an exemplary embodiment, a portion of the surface of the electronic component 10 on which the film 20 is not required to be formed may be fabricated by sealing with the carrier 100 such that the film 20 is not formed, and the film 20 may be selectively formed only The exposed surface of the film 20 needs to be formed on the upper surface of the electronic component 10.

For example, the apparatus 200 of the exemplary embodiment may be a sputtering apparatus, and may include: a chamber (not shown) providing an accommodation space in which a sputtering process is performed; a sputtering cathode disposed in the cavity Inside the chamber (not shown); and a plasma generating component (not shown), produces plasma in the chamber (not shown).

In general, a vacuum pressure may be formed in a chamber (not shown) and a high temperature atmosphere for the sputtering process may be formed. Below the chamber (not shown), the susceptor 220 can be configured as a chuck module, and the sputter cathode can be disposed as a deposited material providing component 210 in an upper portion spaced from the susceptor 220. In addition, a plasma region can be formed by generating a plasma by using a plasma generating member (not shown) between the sputtering cathode and the susceptor 220, and ions generated by the plasma hit the splash. The target of the cathode is plated and allows the deposition material 21 to escape from the target of the sputtering cathode. The deposited material 21 escaping from the target of the sputter cathode is deposited on the exposed surface of the electronic component 10 attached (or mounted) on the slide 100, and thus a film 20 such as a metal film can be formed.

At this time, when the temperature of the internal atmosphere of the device 200 is lowered to prevent the electronic component 10 from being exposed to a high temperature atmosphere, the energy for forming the thin film 20 on the surface of the electronic component 10 may be insufficient. Therefore, the output increases during the sputtering process, and this increases the physical amount of collision of the target, and thus, forms an internal high temperature atmosphere having a temperature of approximately 90 ° C to approximately 130 ° C.

Here, while the sputtering process is being performed, in order to quickly dissipate heat applied to the electronic component 10, the cooling unit 222 may be disposed on the susceptor 220, and may be provided for generating a magnetic force on the upper surface of the cooling unit 222. Magnet plate 221. At this time, regardless of the elasticity and the inelasticity, a magnetic force can be generated in the magnet plate 221 by the magnetic material, and the magnetic force generated from the magnet plate 221 can generate a tensile force to the magnetic layer of the carrier 100. Therefore, the slide 100 can be in close contact with the magnet plate 221 and cooled by the cooling unit 222. In addition, the electronic component 10 can be maintained at a temperature from room temperature to 90 ° C or less than 90 ° C by effectively cooling the electronic component 10 .

As such, in an exemplary embodiment, at least one surface of the electronic component is tightly fixed by including a deformation maintaining layer that is plastically deformed by the adhesion pressure of the electronic component, and thus, is sealable and It is not necessary to form a part of the film (for example, the electrode portion of the electronic component). Further, a sacrificial layer is formed on a portion of the surface of the electronic component and on which a film is not required to be formed, a film forming process is performed, and then, for example, the sacrificial layer is removed together with the film fixed on the surface, for example An additional process such as a process can seal and protect the portion on which the film is not formed by merely attaching the electronic component to the carrier. Therefore, the film is not formed thereon without forming a part of the film, and the film may be formed only on the portion on which the film needs to be formed. In addition, the portion of the surface of the electronic component that does not need to form a film thereon is sealed by a slide, and thus, the film may be selectively formed only on the surface on which the film is to be formed, if necessary. Part of it. In addition, when the electronic component is attached to the carrier, a gap can be prevented from occurring between the electronic component and the carrier. Therefore, it is also possible to prevent contamination of the electrode portion of the electronic component due to a gap between the electronic component and the carrier during the film forming process. In addition, no holes or grooves are formed in the slide to simplify the manufacturing process, and the electronic component can be tightly fixed to the slide regardless of the outer shape of the electronic component. Therefore, the degree of freedom of arrangement of the electronic components can be enhanced and the electronic components can be tightly disposed, and damage and breakage of the electronic components due to high-temperature heat during a film forming process such as sputtering can be prevented. Meanwhile, the slide piece includes a magnetic layer, or at least one of the adhesive layer, the deformation maintaining layer, and the base film is made magnetic. Therefore, the slide sheet can be in close contact with the magnet plate of the device for forming the film during the film forming process. Therefore, during the film forming process such as sputtering, heat transferred to the electronic component can be smoothly transferred to the magnet plate of the slide, and thus is effectively cooled by the cooling unit of the device. In addition, the electronic component can be maintained in an allowable temperature range by effectively cooling the electronic component.

A slide for an electronic component according to an exemplary embodiment includes a deformation maintaining layer that is plastically deformed due to an adhesion pressure of the electronic component and tightly fixes at least one surface of the electronic component, and thus, even Without forming holes or grooves, it is still possible to seal and protect a portion of the film (such as the electrode portion of the electronic component) that does not need to be formed thereon. In addition, a sacrificial layer is formed on a portion on which the thin film is not required to be formed, and a thin film forming process is performed, and then, even if an additional process such as a process of removing the sacrificial layer together with the film fixed on the surface is not performed, The portion on which the film does not need to be formed can be sealed and protected only by attaching the electronic component to the carrier.

Therefore, the film is not formed on the portion on which the film is not formed, and the film may be formed only on the portion on which the film is to be formed. In addition, the portion of the surface of the electronic component that does not need to form a film thereon is sealed by a slide, and thus, the film may be selectively formed only on the surface on which the film is to be formed, if necessary. Part of it. In addition, when the electronic component is attached to the carrier, a gap can be prevented from occurring between the electronic component and the carrier. Therefore, it is also possible to prevent contamination of the electrode portion of the electronic component due to a gap between the electronic component and the carrier during the film forming process.

In addition, holes or grooves are not formed in the carrier to simplify the manufacturing process, and the electronic component can be tightly fixed to the carrier regardless of the outer shape of the electronic component. Therefore, the degree of freedom of arrangement of the electronic components can be enhanced, the electronic components can be tightly disposed, and damage and breakage of the electronic components due to high-temperature heat during the film forming process can also be prevented.

Meanwhile, the carrier includes a magnetic layer, or at least one of the adhesive layer, the deformation maintaining layer, and the base film is made magnetic, and thus, the carrier may be in close contact with the film forming process during the film forming process. The magnet plate of the device. Therefore, during the film forming process such as sputtering, heat transferred to the electronic component can be smoothly transferred to the magnet plate and the slide, and thus is effectively cooled by the cooling unit of the device. In addition, the electronic component can be maintained in an allowable temperature range by effectively cooling the electronic component.

The term "on~" as used in the above description includes the case of direct contact and the case of being positioned to face the upper portion or the lower portion but not directly contacting the portion, and may include not only being positioned as Partially facing the entire upper or lower surface and including being positioned to face the surface partially, and being used to face the upper or lower surface in a position spaced apart from the surface or directly The meaning of touching the surface. In addition, the numerical characteristics of the configuration may be values measured at room temperature.

The preferred embodiments have now been described in more detail with reference to the drawings. However, the present invention is not limited to the above-described embodiments, and those skilled in the art should understand that various modifications and other equivalent embodiments can be made without departing from the subject matter of the invention. Therefore, the scope of the invention should be determined by the technical scope of the appended claims.

10‧‧‧Electronic components

11‧‧‧Semiconductor package

11a‧‧‧ protruding terminal

12‧‧‧Multilayer Ceramic Capacitors

20‧‧‧ film

21‧‧‧Deposited materials

30‧‧‧ Picker

100‧‧‧ slides

110‧‧‧Adhesive layer

120‧‧‧ deformation maintenance layer

130‧‧‧Magnetic layer

131‧‧‧Binder resin

132‧‧‧Magnetic powder

140‧‧‧Metal/base film

150‧‧‧Adhesive

200‧‧‧ device

210‧‧‧Deposited material supply parts

220‧‧‧Base

221‧‧‧ Magnet plate

222‧‧‧cooling unit

D‧‧‧Deposition target object

The exemplary embodiments can be understood in more detail in conjunction with the following description in which: FIG.

FIG. 1 is a cross-sectional view illustrating a slide for an electronic component, according to an exemplary embodiment.

2 is a conceptual diagram illustrating a process of attaching an electronic component to a carrier for an electronic component, in accordance with an exemplary embodiment.

FIG. 3 is a conceptual diagram illustrating a film formation process performed on a surface of an electronic component, according to an exemplary embodiment.

FIG. 4 is a cross-sectional view illustrating a slide for an electronic component including a magnetic layer, according to an exemplary embodiment.

FIG. 5 is a cross-sectional view illustrating a slide for an electronic component including a base film, according to an exemplary embodiment.

FIG. 6 is a cross-sectional view illustrating an apparatus for forming a film, according to another exemplary embodiment.

Claims (21)

A carrier for an electronic component, comprising: an adhesive layer having a surface on which an electronic component is attached; and a deformation maintaining layer disposed on the other surface of the adhesive layer opposite to a surface, and The adhesion pressure of the electronic component is plastically deformed. The slide of claim 1, wherein the adhesive layer has a thickness of approximately 5 microns to 100 microns. The slide of claim 1, wherein the adhesive layer has an adhesive force of approximately 200 gram force/inch to 1,500 gram force/inch. The slide according to claim 1, wherein the deformation maintaining layer is formed of a metal film. The slide of claim 1, wherein the deformation maintaining layer has a thickness of approximately 3 microns to 60 microns. The slide of claim 1, wherein the deformation maintaining layer has an elongation of approximately 10% to 80%. The slide of claim 1, wherein the deformation maintaining layer has a thermal conductivity of approximately 200 W/m x K to 450 W/m x K at room temperature. The slide according to claim 1, further comprising a magnetic layer disposed on the other surface of the deformation maintaining layer opposite to a surface facing the adhesive layer. The carrier sheet according to claim 8, wherein the magnetic layer is formed by dispersing a magnetic powder in a binder resin. The slide according to claim 9, wherein the magnetic powder is contained in an amount of approximately 30% by weight to 90% by weight based on the total weight of the magnetic layer. The slide of claim 9, wherein the magnetic powder has an average particle diameter of approximately 0.1 to 30 μm. The slide of claim 8, wherein the magnetic layer has a thickness of approximately 10 microns to 500 microns. The carrier sheet of claim 1, further comprising a base film disposed on the other surface of the deformation maintaining layer opposite to a surface facing the adhesive layer and configured to The deformation maintaining layer is supported. The slide according to claim 13, wherein the restoring force of the base film is a yield value at which the deformation maintaining layer can be plastically deformed or lower than the yield value. The slide of claim 1, wherein at least one of the adhesive layer and the deformation maintaining layer has magnetic properties. The slide according to claim 13, wherein the base film is formed of a synthetic resin material and contains a magnetic powder. The slide of claim 1, wherein the slide has an elongation of approximately 10% to 80%. The slide of claim 1, wherein the slide has a tensile strength of approximately 25 N/mm 2 to 250 N/mm 2 . An apparatus for forming a film, comprising: a deposition material providing member for providing a deposition material for forming a film on a deposition target object, the article comprising a carrier for an electronic component, the carrier being provided with a magnetic layer; And a susceptor configured to support the deposition target article, wherein the pedestal comprises: a magnet plate configured to provide a pulling force to the carrier; and a cooling unit configured to cool the carrier. The device of claim 19, wherein the base further comprises an elastic layer disposed between the magnet plate and the deposition target. The device of claim 19, wherein the deposition target article further comprises an electronic component attached to the carrier, and the device forms the film on an exposed surface of the electronic component.