TW201841234A - 複合構件及其製造方法 - Google Patents
複合構件及其製造方法 Download PDFInfo
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- TW201841234A TW201841234A TW106129143A TW106129143A TW201841234A TW 201841234 A TW201841234 A TW 201841234A TW 106129143 A TW106129143 A TW 106129143A TW 106129143 A TW106129143 A TW 106129143A TW 201841234 A TW201841234 A TW 201841234A
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- aliphatic polycarbonate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016197371 | 2016-10-05 | ||
| JP2016-197371 | 2016-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201841234A true TW201841234A (zh) | 2018-11-16 |
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ID=61830872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106129143A TW201841234A (zh) | 2016-10-05 | 2017-08-28 | 複合構件及其製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6337363B1 (ja) |
| TW (1) | TW201841234A (ja) |
| WO (1) | WO2018066203A1 (ja) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003073844A (ja) * | 2001-09-05 | 2003-03-12 | Hitachi Cable Ltd | 無電解めっき方法 |
| JP2005008909A (ja) * | 2003-06-16 | 2005-01-13 | Canon Inc | 構造体の製造方法 |
| JP2005029735A (ja) * | 2003-07-10 | 2005-02-03 | Mitsuboshi Belting Ltd | ポリイミド樹脂の無機薄膜形成方法及び表面改質した無機薄膜形成用ポリイミド樹脂の製造方法 |
| JP4737386B2 (ja) * | 2005-03-31 | 2011-07-27 | 日本ゼオン株式会社 | 電子機器用回路基板の製造方法、電子機器用回路基板、および表示装置 |
| JP2012077342A (ja) * | 2010-09-30 | 2012-04-19 | Yamato Denki Kogyo Kk | 金属パターンの形成方法 |
| DK2640868T3 (en) * | 2010-11-16 | 2018-12-10 | Cuptronic Tech Ltd | METAL COATING OF ARTICLES USING A PLASMA POLYMERIZATION PRESERVATION |
| JP2013102072A (ja) * | 2011-11-09 | 2013-05-23 | Japan Science & Technology Agency | 型押し構造体の製造方法、薄膜トランジスター、薄膜キャパシター、アクチュエーター、圧電式インクジェットヘッド及び光学デバイス |
| JP2016121387A (ja) * | 2014-12-25 | 2016-07-07 | キヤノン・コンポーネンツ株式会社 | めっき皮膜付樹脂製品の製造方法 |
-
2017
- 2017-07-14 JP JP2017550638A patent/JP6337363B1/ja active Active
- 2017-07-14 WO PCT/JP2017/025743 patent/WO2018066203A1/ja active Application Filing
- 2017-08-28 TW TW106129143A patent/TW201841234A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6337363B1 (ja) | 2018-06-06 |
| WO2018066203A1 (ja) | 2018-04-12 |
| JPWO2018066203A1 (ja) | 2018-10-04 |
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