TW201837476A - Probe, probe unit, and semiconductor inspection device provided with probe unit - Google Patents

Abstract

The probe according to one embodiment of the present invention is provided with: a first plunger; a first end section having a first cutout for fitting in the first plunger; a first spiral section having a first spiral groove; and a first pipe having a first cylindrical section.

Description

Probe, probe unit and semiconductor inspection device with probe unit

The present invention relates to probes. For example, a probe, a probe unit, and a semiconductor unit having a probe unit for inspecting an object such as an electronic component having an electronic circuit or a semiconductor device having a semiconductor integrated circuit or the like Device.

The semiconductor integrated circuit can be used for various electronic parts. Further, an electronic device such as a display device typified by a liquid crystal display device, an electroluminescence (EL) display device, or the like can be used for an electronic component having a semiconductor integrated circuit. Hereinafter, these electronic parts or electronic devices are collectively referred to as electronic parts.

The electronic component is composed of, for example, an element such as a semiconductor element, a resistance element, and a capacitance element, or a circuit including such elements. These elements are produced, for example, by forming a pattern of electrodes, wirings, and through holes for electrically connecting wirings on a substrate such as a germanium wafer or a glass substrate. The electronic component is manufactured by manufacturing hundreds or more of the plurality of components described above. The manufacture of electronic components includes a plurality of manufacturing processes for fabricating a plurality of components as described above. Therefore, it is difficult to completely suppress the damage of the substrate or the circuit, the occurrence of patterning failure, etc., although it is carried out in an environment where the foreign matter is highly restricted. Therefore, it is necessary to investigate the damage of the substrate or the circuit, the occurrence of patterning defects, and the like, and check various characteristics of the electronic component to prevent the incorporation of defective products.

The inspection of the characteristics of the electronic component can generally be carried out using an inspection device called a semiconductor inspection device. In such inspections, for example, the tips of the thin needle electrodes called probes (also referred to as conductive contacts) are electrically connected to the plurality of electrodes or wires formed on the semiconductor integrated circuit, respectively. And get all kinds of electrical information.

In recent years, semiconductor integrated circuits or display devices have been highly dense and miniaturized, and a plurality of electrodes or a plurality of wirings formed by electronic components such as semiconductor integrated circuits have been reduced. Depending on the electronic components, there are also electronic components with electrodes or wiring sizes of one hundred and ten micrometers (μm) or less. Therefore, in the probe of the semiconductor inspection apparatus, for example, it is also required to reduce the outer diameter of the probe and the interval between the narrowed probe and the probe. Moreover, if the size of the probe is reduced, the electrical connection between the probe and the electrode or wiring formed by the electronic component or the durability of the probe will become a problem. Therefore, attempts have been made to make the configuration of the probe of the semiconductor inspection apparatus or the shape of the end of the probe.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-080657.

One of the problems of the present invention is to provide a probe that can reliably achieve electrical connection with a "semiconductor integrated circuit to be inspected or an electrode or wiring including the electronic component." One of the problems of the present invention is to provide a probe excellent in durability (for example, durability of an end portion in contact with an electrode or a wiring). One of the problems of the present invention is to provide a probe unit including one or two or more probes, or to provide a semiconductor inspection apparatus including the same.

A probe according to an embodiment of the present invention includes a first plunger and a first tube. The first tube body has a first end portion, a first spiral portion, and a first cylindrical portion. The first end has a first notch that fits the first plunger. The first spiral portion has a first spiral groove.

A probe according to an embodiment of the present invention may further include a second plunger, and the first tube may have a second end, and the second end may have a second notch that fits the second plunger.

The first plunger of the probe according to an embodiment of the present invention may further have a first sliding portion, and the first sliding portion may be in contact with the first cylindrical portion.

The first tube body of the probe according to an embodiment of the present invention may further include a second spiral portion, and the second spiral portion may have a second spiral groove.

The second plunger of the probe of one embodiment of the present invention may further have a second sliding portion, and the second sliding portion may be in contact with the first cylindrical portion.

In the probe according to an embodiment of the present invention, the second tube may be further disposed on the inner side of the first tube and in contact with the first cylindrical portion.

The second tube body of the probe of one embodiment of the present invention may also have a third spiral groove.

In the second tube body of the probe according to the embodiment of the present invention, at least one end portion of the second tube body may have a notch, and the second tube body has a notch fitted to the first plunger or The second plunger.

The first plunger or the second plunger to which the first tube body and the second tube body of the probe according to the embodiment of the present invention are fitted may also have the first a second boss portion to which the first boss portion of the tubular body is fitted and the second boss portion to which the second tubular body is fitted, the diameter of the first boss portion is larger than the diameter of the second boss portion, and the second boss portion is first The boss portion is convex.

In the probe according to an embodiment of the present invention, the second tube may be disposed on the inner side of the first tube, in contact with the first cylindrical portion, and have a third spiral groove. The second tube body may have a notch at at least one of the two end portions of the second tube body. In the first tube body and the second tube body, the first spiral portion overlaps with the first sliding portion. The entire length of the second spiral portion overlaps with the notch of the second cylindrical portion or the second tubular body of the second tubular body, and the entire length of the third helical groove is different from the first cylindrical portion or the second tubular body There is a gap overlap.

One embodiment of the invention is a probe unit having a probe.

One embodiment of the present invention is a semiconductor inspection apparatus having a probe unit.

Hereinafter, various embodiments of the invention disclosed in the present application will be described with reference to the drawings. The present invention may be embodied in various forms without departing from the spirit and scope of the invention, and is not limited to the description of the embodiments described below.

Further, in order to explain more clearly, the drawings have a schematic representation of the width, thickness, shape, and the like of the respective portions as compared with the actual ones, which are merely examples, and are not intended to limit the present invention. . In the specification and the drawings, the same reference numerals are given to the elements having the same functions as those already described in the drawings, and the repeated description is omitted.

<First embodiment>

In the present embodiment, a configuration of a semiconductor inspection apparatus according to an embodiment of the present invention will be described. Further, the configuration of the probe unit and the probe included in the semiconductor inspection apparatus will be described.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a semiconductor inspecting apparatus of the present invention relating to a first embodiment. The semiconductor inspection apparatus 100 has a probe unit 120 and a probe 110 provided therewith. The probe 110 may be one or more, and a plurality of (for example, tens to thousands) probes 110 are usually provided. The probe 110 transmits and receives electrical signals to and from the circuit board 140. Further, in FIG. 1, the circuit substrate 140 is connected to the tester 150. The tester 150 includes units such as a measurement power source 152, an LCR meter 154, or a pulse generator 156.

2A is a schematic cross-sectional view of the probe 110 and the probe unit 120 shown in FIG. 1. Further, a specific example of the first pipe body 10 will be described later by FIG. 3A. As shown in FIG. 2A, the probe 110 is housed in the probe unit 120, and one of the first plungers 14 is partially exposed. The first tip portion 12 is in contact with the electrodes or wiring of the inspection object 170 to measure electrical characteristics. The inspection object 170 can be, for example, an IC package or the like formed on a germanium wafer. Further, the portion with respect to the first tip end portion 12 and the first plunger 14 is the second tip end portion 22 and the second plunger portion 24.

The probe unit 120 can also be constructed, for example, from a probe holder 70 having a first probe holder assembly 72 and a second probe holder assembly 74. The first probe holder assembly 72 and the second probe holder assembly 74 may also be formed using an insulator such as resin or ceramic. The plurality of probes 110 are configured to have their heights uniform. Further, the arrangement may be determined depending on the electrode or the wiring pattern of the inspection object. The probe 110 may also contain a conductive material, for example, a metal such as gold, copper, nickel, palladium, or tungsten, or an alloy of the above metals. Alternatively, the probe 110 may also contain a conductive material and be plated with gold or the like.

The probe 110 has a first plunger 14, a second plunger 24, and a first tube. The first plunger 14 has a first tip end portion 12, a first plunger boss portion 16 and a first sliding portion 18. The second plunger 24 has a second tip end portion 22, a second plunger boss portion 26, and a second sliding portion 28. The first tube body 10 has a first end portion 30, a first spiral portion 40, a second end portion 31, a second spiral portion 60, and a first cylindrical portion 50. The first end portion 30 has a first notch 20, the first spiral portion 40 has a first spiral groove 41, the second end portion 31 has a second notch 21, and the second spiral portion 60 has a second spiral groove 61. The first notch 20 is in communication with the first spiral groove 41. Further, the second notch 21 is in communication with the second spiral groove 61. The first plunger boss portion 16 is fitted to the first notch 20. Further, the second plunger boss portion 26 is fitted to the second notch 21. The first plunger 14 is electrically connected to the electrode or wiring of the inspection object 170 at the first tip end portion 12. The first plunger 14 and the second plunger 24 preferably have a cylindrical shape, and in the present embodiment, they are also described in a cylindrical shape. Further, the interval between the first spiral portion 40 and the groove and the groove included in the second spiral portion 60 is not limited to the case shown in the drawings. The number of grooves can be changed without departing from the scope of the invention. Further, the length or the thickness of each part is also not limited to the case shown in the drawings, and can of course be changed without departing from the scope of the invention.

At the time of making the probe 110, the first plunger 14 is pressed into the first tube body 10, and the first plunger boss portion 16 is fitted into the first notch 20. Further, the second plunger 24 is also pressed into the first tube body 10, and the second plunger boss portion 26 is fitted to the second notch 21. Since the diameter of the first pipe body 10 is easily enlarged by having a notch, the load for pushing the plunger into the pipe body can be reduced. Moreover, even if there is a slight deviation in the diameter of the plunger and the pipe body, it is acceptable.

The diameter of the first sliding portion 18 is smaller than that of the first plunger boss portion 16. Further, as shown in FIG. 2A, the thin portion of the first sliding portion 18 may also include two different diameters. Further, the diameter of the second sliding portion 28 is smaller than that of the second plunger boss portion 26. Further, as shown in FIG. 2A, the thin portion of the second sliding portion 28 may also include two different diameters. In the first sliding portion 18, the tip end portion which is slightly thinner than the first plunger boss portion 16 is deflected by the first tube body 10 which is generated when receiving the load from the electrode or wiring of the inspection object. It is in contact with the first cylindrical portion 50. Similarly, in the second sliding portion 28, the tip end portion which is slightly thinner than the second plunger boss portion 26 is in contact with the first cylindrical portion 50. The probe 110 having such a configuration can define a conduction path when the electrode or the wiring of the inspection object 170 is electrically connected to the first plunger 14, the first cylindrical portion 50, and the second plunger 24. Therefore, since the electrode or the wiring is electrically connected to the probe without interposing the spiral portion, the resistance value and the inductance value of the probe can be reduced. Further, the conduction path of the intermediate spiral portion is not required to be electrically connected to the electrode or the wiring of the inspection object 170, and the conduction path may not be secured before the connection.

Further, when the first tip end portion 12 of the probe 110 is in contact with the electrode or the wiring of the inspection object 170, the probe 110 of the above configuration can be expanded and contracted in the axial direction by the first tube body 10 to alleviate the object to be inspected. Shock.

In FIG. 2A, the case where the notches of the respective ends of the first pipe body 10 are one (also referred to as one place) is taken as an example, but the notches may be two or more (also referred to as two or more). . Further, the length of the notch may be longer or shorter than the length of the drawing without departing from the scope of the present invention. Since the diameter of the first pipe body 10 is more easily expanded by the number of notches, the load for pushing the plunger into the pipe body can be further reduced.

In addition, in FIG. 2A, although the case where the notch and the spiral groove are connected is illustrated as an example, the notch and the spiral groove may not be connected. By not communicating with the spiral groove, the strength of the pipe body can be increased. Further, the length of the notch and the spiral groove is not limited to the length shown in FIG. 2A.

2B has a second tubular body 32 with respect to the configuration of FIG. 2A, and the configuration of the second plunger 24 is different. The second tube 32 is in contact with the first tube body 10. Further, one end portion of the second pipe body 32 has a notch. Further, a specific example of the second pipe body 32 will be described later by FIG. 3F. The third plunger boss portion 29 of the second plunger 24 has a smaller diameter and is more convex than the second plunger boss portion 26. The second plunger boss portion 26 is fitted to the second notch 21, and the third plunger boss portion 29 is fitted to the third notch 23. Further, the first plunger 14 may have the same configuration as that of the second plunger 24, and may be fitted to a tubular body having no spiral groove similarly to the second tubular body. In this case, since the sliding portion is not required to be provided in the first plunger 14, the manufacturing can be simplified. Further, when electrically connected to the electrode or the wiring of the inspection object 170, the first spiral portion 40 and the second spiral portion 60 are not interposed between the first sliding portion 18 and the second tubular body 32, but the first cylinder is interposed. The portion 50 is electrically connected, so that the resistance value of the probe can be lowered.

2C shows an example in which the second tubular body 32 has a spiral groove with respect to the structure of FIG. 2B. Further, in the second pipe body 32, a portion having no spiral groove and a notch is defined as a second cylindrical portion. By using the second tube 32 having a helical groove, the load resistance of the probe 110 can be increased. Also, the movable area can be enlarged. Further, an example in which the spiral groove of the second pipe body 32 does not overlap the first spiral portion 40 and the second spiral portion 60 is disclosed. In other words, since the first tube body 10 and the second tube body 32 can overlap at least one of the spiral-free grooves, or the spiral groove is not set as the conduction path, the resistance value of the probe can be further reduced. Further, the spiral groove of the second pipe body 32 may overlap the first spiral groove 41 and the second spiral groove 61. In this case, the movable area of the probe 110 can be further enlarged. Further, the first sliding portion 18 is disclosed as being in contact with the second tubular body 32, but is not limited to this example. The first sliding portion 18 may be in contact with the second tube 32 when transmitting and receiving electrical signals, and the first sliding portion 18 in the state of FIG. 2C may not be in contact with the second tube 32.

2D shows an example in which the first plunger 14 is inserted into the second tube body with respect to the structure of FIG. 2C. In addition, the first plunger 14 can also be pressed into the second tube body. In this case, the first plunger boss portion 16 of the first plunger 14 is fitted to the first notch 20, and the fourth plunger boss portion 19 is fitted to the other end portion of the second pipe body 32. The second tube 32 is in contact with the first plunger 14 and the second plunger 24 even in a state where the probe 110 does not receive the load from the electrode or wiring of the inspection object. Therefore, the conduction path can be ensured in a normal state, and the resistance value of the probe can be maintained substantially at a low level.

FIG. 3A to FIG. 3E are schematic top views of the first tube 10 of the probe 110. A schematic top view of the second tube 32 is shown in FIG. 3F.

FIG. 3A has the same configuration as that of the first pipe body 10 of FIG. 2A, and the description thereof is omitted.

3B shows an example in which the first notch 20 has an angle with respect to the end surface of the first end portion 30 and the second notch 21 has an angle with respect to the end surface of the second end portion 31 with respect to FIG. 3A. Even if the second notch 21 has an angle with respect to the end surface of the second end portion 31, the end surface of the second end portion 31 is substantially horizontal. Therefore, when the second plunger 24 is pressed into the first pipe body 10, the diameter of the second end portion 31 is enlarged, and the second plunger 24 can be substantially straight with respect to the expansion and contraction direction of the first pipe body 10. And press it in reasonably. Therefore, it is possible to provide a probe having less damage and the like and having high reliability.

FIG. 3C shows an example in which the first notch 20 is not in communication with the first spiral groove 41 and the second notch 21 is not in communication with the second spiral groove 61 with respect to FIG. 3B. Even if the first notch 20 is not in communication with the first spiral groove 41, since the end surface of the first end portion 30 is substantially horizontal, the first plunger boss portion 16 of the first plunger 14 can be opposite to the first tube. The direction of expansion and contraction of the body 10 is substantially straightly pressed in. Therefore, the first pipe body 10 and the first plunger 14 can be connected substantially horizontally, and are indeed electrically connected. The same is true for the second plunger 24. Further, in Fig. 3C, as compared with Fig. 3A or Fig. 3B, since the surface area of the tube body is increased by the number of grooves, a probe having higher durability can be realized. Therefore, it is possible to provide a probe having less damage and the like and having high reliability.

3D and 3E show an example in which "the first notch 20 is increased by one, the spiral groove 42 is increased by one, the second notch 21 is increased by one, and the spiral groove 62 is increased by one", as compared with FIG. 3A and FIG. 3C, respectively. Further, the same configuration is omitted, and detailed description is omitted. Since one of the spiral grooves is added to become two, the spring constant of the first pipe body is reduced, and the first pipe body is more likely to expand and contract in the axial direction, so that the probe can be in contact with the electrode or wiring of the inspection object. The impact is more moderate.

FIG. 3F is a schematic top view of the second tube 32 of the probe 110. FIG. 3F is a top plan view of the second tube 32 shown in FIG. 2B. One end portion of the second pipe body 32 has a third notch 23. By having a notch in the tubular body, the plunger can be pressed substantially straightly with respect to the direction of expansion and contraction of the tubular body. Therefore, the electrical connection between the tube and the plunger can be ensured. The probe 110 having such a structure can be expanded and contracted in the axial direction by the first pipe body 10, and the impact on the inspection object can be alleviated. Further, in the second pipe body 32, a spiral groove may be provided as shown in Figs. 2C and 2D. Further, the third notch 23 may have an angle with respect to the end surface of the second pipe body 32 as shown in FIG. 3B. Moreover, the spiral groove and the third notch 23 may communicate as shown in FIG. 3A or may not communicate as shown in FIG. 3C. Further, the spiral groove may be two as shown in FIGS. 3D and 3E.

In FIGS. 3A to 3F, although an example of a probe taken in an embodiment of the present invention is shown, the probe is not limited to these examples. In the first tube body and the second tube body, for example, the direction in which the notch expands and contracts with respect to the tube body may be parallel or may have an angle. Further, the length of the notch may be longer or shorter than the length of the drawing without departing from the scope of the present invention. Further, in the case where the end portions of both the first end portion 30 and the second end portion 31 have a notch, the shape of each end portion may be different. Further, in the case where the end portions of both the first end portion 30 and the second end portion 31 have notches, the number of the notches provided in each end portion may be different. Further, although two examples of spiral grooves are disclosed, three or more spiral grooves may be used. Further, the length of the spiral groove may be longer or shorter than the length of the drawing without departing from the scope of the present invention.

Further, when the first pipe body 10 has two or more spiral grooves, for example, the number of the notches may be at least one. Moreover, the notch can also be in communication with the spiral groove. In the case where the ends of the first end portion 30 and the second end portion 31 have notches, the notches and the spiral grooves may not be connected, and may be connected, or one of them may be connected while the other is not Connected.

The probe 110 according to an embodiment of the present invention having the above-described structure, when the first plunger 14 is pressed into the first tube 10, has a first notch 20, compared to the first In the case of a notch 20, the diameter of the first pipe body 10 can be enlarged, and the load for pushing the plunger into the pipe body can be reduced. Also, in the probe 110, the first end portion 30 can be maintained substantially horizontal. Therefore, the first plunger 14 can be pressed substantially straightly with respect to the direction in which the first tube body 10 is stretched. The press-fitting between the second plunger boss portion 26 and the second end portion 31 of the second plunger 24 is also the same. Therefore, since the first pipe body 10 is substantially horizontally fitted to the first plunger 14 and the second plunger 24, it can be reliably electrically connected. Further, since the pressure can be applied substantially straight at the tip end of the probe, even if the electrode or the wiring of the semiconductor integrated circuit is repeatedly brought into contact with each other, the tip end of the probe can be prevented from being broken and rapidly worn, and durability can be achieved. High probe. Also, the accuracy of the probe tip position can be improved. Further, a probe unit having such a probe can be provided, or a semiconductor inspection apparatus having the same can be provided.

<Second embodiment>

In the present embodiment, another configuration of the probe according to an embodiment of the present invention will be described. In addition, the description of the same configuration as that of the first embodiment will be omitted.

4 is a schematic cross-sectional view of the probe 112 and a top view of the first tube 80 of the probe 112. Further, the probe 112 is housed in the probe unit 120 shown in FIG. 2A. 4A to 4C show an example in which the second spiral groove 61 is not provided with respect to the probe 110 of FIGS. 2B to 2D. In FIG. 4, the same configuration as that of FIG. 2 will be omitted.

4A, with respect to the structure of FIG. 2A, the first tube 80 has only one spiral groove, and the structure of the second plunger 24 is different. The same configuration as that of FIG. 2A will be omitted from the description. The probe 112 has a second plunger 24 having a second tip end portion 22 and a second plunger boss portion 26. Further, as shown in FIG. 4D, the first tube body 80 has a first end portion 30, a first spiral portion 40, a first cylindrical portion 50, and a second end portion 31. The first end portion 30 has a first notch 20, the first spiral portion 40 has a first spiral groove 41, and the second end portion 31 has a second notch 21. The second plunger boss portion 26 is fitted to the second notch 21. Further, the interval between the groove and the groove included in the first spiral portion 40 is not limited to the case shown in the drawings. The number of grooves can be changed without departing from the scope of the invention. Further, the length or the thickness of each part is also not limited to the case shown in the drawings, and can of course be changed without departing from the scope of the invention.

4B, with respect to the structure of FIG. 4A, discloses that the second tube 32 has a spiral groove and the configuration of the second plunger 24 is different. The same configuration as that of FIG. 4A will be omitted from the description. The second tube 32 is in contact with the first tube 80. The load resistance of the probe 112 can be increased by using the second tube 32 having a spiral groove. Also, the movable area of the probe 112 can be enlarged. Further, an example in which the spiral groove of the second pipe body 32 does not overlap with the first spiral groove 41 is disclosed. That is, since the spiral groove can be set as the conduction path, the resistance value of the probe can be further reduced. Further, in the structure of Fig. 4B, the spiral groove is located at one side of the one side of the first pipe body, and the joint of the sliding portion is one place. Moreover, there is a spiral groove in the second pipe body. Therefore, the movable area of the probe can be enlarged. Further, although the example in which the shape of the third plunger boss portion 29 is a columnar shape is disclosed, it is not limited to this example. For example, by making the tip into a pointed shape such as a conical shape, the role of guiding the third plunger boss portion 29 to the second tubular body 32 can be easily pressed.

4C, relative to the structure of FIG. 4B, discloses an example in which the first plunger 14 is also inserted into the second tube. The same configuration as that of FIG. 4B will be omitted from the description. The second tube 32 is in contact with the first plunger 14 and the second plunger 24 even in a state where the probe 112 does not receive the load from the electrode or wiring of the inspection object. Therefore, the conduction path can be ensured in a normal state, and the resistance value of the probe can be maintained substantially at a low level.

Further, in the first tube body 80 and the second tube body 32 shown in FIG. 4, the spiral groove may be two as shown in FIGS. 3D and 3E. Moreover, there may be three or more spiral grooves (not shown).

In FIG. 4, the case where the notch of the first end portion 30 is one (also referred to as one place) is taken as an example, but the number of the notches may be two or more (also referred to as two or more). Further, the case where the notch of the first cylindrical portion 50 is one (also referred to as one) is described as an example, but the number of the notches may be two or more (also referred to as two or more). Further, the length of the notch may be longer or shorter than the length of the drawing without departing from the scope of the present invention. Since the diameter of the first pipe body 80 is more easily increased by the notch of two or more, the load for pushing the plunger into the pipe body can be further reduced. Further, the length of the spiral groove may be longer or shorter than the length of the drawing without departing from the scope of the present invention.

In FIGS. 4A to 4D, an example of a probe according to an embodiment of the present invention is disclosed, but the probe is not limited to these examples. In the first pipe body 80 and the second pipe body 32, for example, the direction in which the notch expands and contracts with respect to the pipe body may be parallel or may have an angle. Further, the length of the notch may be longer or shorter than the length of the drawing without departing from the scope of the present invention. Further, in the case where the end portions of both the first end portion 30 and the second end portion 31 have a notch, the shape of each end portion may be different. Further, in the case where the end portions of both the first end portion 30 and the second end portion 31 have notches, the number of the notches provided in each end portion may be different. Further, the length of the spiral groove may be longer or shorter than the length of the drawing without departing from the scope of the present invention.

Further, when the first pipe body 80 has two or more spiral grooves, for example, the number of the notches may be at least one. Moreover, the notch can also be in communication with the spiral groove. In the case where the ends of the first end portion 30 and the second end portion 31 have notches, the notches and the spiral grooves may not be connected, and may be connected, or one of them may be connected while the other is not Connected.

According to the configuration described above, when the semiconductor integrated circuit or the electrode or the wiring including the electronic component to be inspected is electrically connected, since the resistance value can be ensured to be small, the conductive path can be ensured. A probe is provided that can reliably achieve an electrical connection. Further, it is possible to provide a probe excellent in durability at the end portion in contact with the electrode or the wiring. Further, a probe unit having such probes may be provided, or a semiconductor inspection apparatus having the same may be provided.

<Third embodiment type>

In this embodiment, still another configuration of the probe according to an embodiment of the present invention will be described. Further, the same configurations as those of the first embodiment or the second embodiment may be omitted.

FIG. 5 is a schematic cross-sectional view of the probe 113 and the probe unit 120 and a top view of the first tube 90 of the probe 112.

The probe 113 shown in FIG. 5A discloses an example in which "the structure of the probe 112 of FIG. 4A does not have the second plunger 24 and the first tube body 90 does not have the second notch 21". The other structure is the same as that of FIG. 4B, and the description thereof is omitted. As shown in FIG. 5B, the first tube body 90 has a first end portion 30, a first spiral portion 40, a first cylindrical portion 50, and a second end portion 31. The first end portion 30 has a first notch 20, the first spiral portion 40 has a first spiral groove 41, and the second end portion 31 does not have a notch. The first end portion 30, which is pressed by the first plunger 14 in contact with the electrode or wiring of the semiconductor integrated circuit, has a first notch 20, and the first plunger 14 is substantially perpendicular to the expansion and contraction direction of the first tube 90. Press it straight in. Therefore, the first tube body 90 and the first plunger 14 can be connected substantially horizontally, and are indeed electrically connected. Further, since the tip end of the probe can be substantially straightly contacted with respect to the surface of the semiconductor integrated circuit without tilting, it is possible to prevent the tip end of the probe from being broken or rapidly worn, and a probe having high durability can be realized. Moreover, since the first tube body 90 does not have the second notch 21, the manufacture of the probe can be simplified. Further, the interval between the groove and the groove included in the first spiral portion 40 is not limited to the case shown in the drawings. The number of grooves can be changed without departing from the scope of the invention. Further, the length or the thickness of each part is also not limited to the case shown in the drawings, and can of course be changed without departing from the scope of the invention.

The probe mount 70 can be formed only by the first probe mount assembly 72. Therefore, the manufacturing cost can be reduced as compared with FIG. 2A.

FIG. 5C discloses an example of the first tubular body 90. Fig. 5C discloses an example in which the tip end portion 180 of a crown-like shape (also referred to as a crown shape) is formed at the second end portion 31 with a plurality of sharp claws for the structure of Fig. 5B. With such a configuration, the probe 113 can be electrically connected to the electrodes or wirings on the circuit board 140 more reliably.

In addition, in the first pipe body 90 shown in FIG. 5, the spiral groove may also be two as shown in FIG. 3D and FIG. 3E. Further, there may be three or more spiral grooves.

In FIG. 5, the case where the notch of the first pipe body is one (also referred to as one place) is taken as an example, but the number of the notches may be two or more (also referred to as two or more). Further, the length of the notch may be longer or shorter than the length of the drawing without departing from the scope of the present invention. Since the diameter of the first pipe body 90 is more easily increased by the notch of two or more, the load for pushing the plunger into the pipe body can be further reduced. Further, the length of the spiral groove may be longer or shorter than the length of the drawing without departing from the scope of the present invention.

In Fig. 5, an example of a probe taken in an embodiment of the present invention is disclosed, but the probe is not limited to these examples. In the first tube body 90, for example, the direction in which the notch expands and contracts with respect to the tube body may be parallel or may have an angle. Further, the length of the notch may be longer or shorter than the length of the drawing without departing from the scope of the present invention. Further, when the first end portion 30 has a plurality of notches, the notches may be parallel with respect to the direction in which the tubular body expands and contracts, and may have an angle, or may be formed by mixing parallel notches and angled notches. Further, the length of the spiral groove may be longer or shorter than the length of the drawing without departing from the scope of the present invention.

Further, when the first pipe body 90 has two or more spiral grooves, for example, the number of the notches may be at least one. Moreover, the notch may or may not be in communication with the spiral groove. In the case of two notches, one of them may be connected and the other may not be connected.

According to the configuration described above, when the semiconductor integrated circuit or the electrode or the wiring including the electronic component to be inspected is electrically connected, since the resistance value can be ensured to be small, the conductive path can be ensured. A probe is provided that can reliably achieve an electrical connection. Further, it is possible to provide a probe excellent in durability at the end portion in contact with the electrode or the wiring. Further, a probe unit having such probes may be provided, or a semiconductor inspection apparatus having the same may be provided.

<Fourth embodiment>

In the present embodiment, the structure of the tip end portion of the probe according to an embodiment of the present invention will be described. In addition, the description of the same configuration as the first embodiment to the third embodiment will be omitted.

FIG. 6 is a top plan view showing a first tip end portion 12 or a second tip end portion 22 of a probe according to an embodiment of the present invention.

Figure 6A reveals the tip portion of a crown-like shape. This shape is also called, for example, a crown type. The shape shown in FIG. 6A is used, for example, for the first tip end portion 12. By forming the first tip portion 12 into a crown shape, a plurality of vertices of the crown can be used to make contact with the semiconductor integrated circuit to be inspected or the electrode or wiring including the electronic component. Therefore, it is possible to electrically connect the electrode or the wiring of the inspection object more reliably.

Figure 6B reveals the tip portion of a conical shape. The shape shown in FIG. 6B is used, for example, for the first tip end portion 12. By forming such a shape, it is possible to make contact with the electrode or wiring of the semiconductor integrated circuit or the electronic component including the electronic component, which can be inspected, so that local contact can be made. Also, a larger load can be contacted than in the case of a plurality of claws as in the crown type. Further, it can be reliably electrically connected to the electrode or wiring of the inspection object.

Figure 6C, relative to Figure 6B, reveals the tip end with rounded tips. The shape shown in FIG. 6C is used, for example, for the first tip end portion 12 or the second tip end portion 22. By forming such a shape, it is possible to increase the area electrically connected to the semiconductor integrated circuit to be inspected or the electrode or wiring including the electronic component. Therefore, it is possible to reduce the surface pressure of the electrode or wiring of the inspection object and the probe.

As an embodiment of the present invention, each of the above-described embodiments can be combined as appropriate without any contradiction. Further, those skilled in the art who have added, deleted, or changed the design components according to the respective embodiments are also included in the scope of the present invention as long as they have the gist of the present invention.

Further, even if it is an effect different from the effects of the above-described respective embodiments, those who are known from the description of the present invention or who are easily predicted by those skilled in the art are of course understood to be brought by the present invention.

10, 80, 90‧‧‧ first tube

12‧‧‧First tip

14‧‧‧First plunger

16‧‧‧First plunger boss

18‧‧‧First sliding part

19‧‧‧fourth plunger boss

20‧‧‧ first gap

21‧‧‧ second gap

22‧‧‧second tip

23‧‧‧ third gap

24‧‧‧Second plunger

26‧‧‧Second plunger boss

28‧‧‧Second sliding part

29‧‧‧ Third plunger boss

30‧‧‧First end

31‧‧‧ second end

32‧‧‧Second body

40‧‧‧First spiral

41‧‧‧First spiral groove

42, 62‧‧‧ spiral groove

50‧‧‧First cylindrical part

60‧‧‧second spiral

61‧‧‧Second spiral groove

70‧‧‧ probe holder

72‧‧‧First probe base assembly

74‧‧‧Second probe base assembly

100‧‧‧Semiconductor inspection device

110, 112, 113‧‧ ‧ probe

120‧‧‧ probe unit

140‧‧‧ circuit board

150‧‧‧Tester

152‧‧‧Measurement power supply

154‧‧‧LCR measuring device

156‧‧‧pulse generator

170‧‧‧Check objects

180‧‧‧ tip

1 is a schematic view of a semiconductor inspection apparatus according to an embodiment of the present invention. 2A is a schematic view of a probe unit according to an embodiment of the present invention. 2B is a schematic view of a probe according to an embodiment of the present invention. 2C is a schematic view of a probe according to an embodiment of the present invention. 2D is a schematic view of a probe according to an embodiment of the present invention. 3A is a schematic view of a first tube body according to an embodiment of the present invention. 3B is a schematic view of a first tube body according to an embodiment of the present invention. 3C is a schematic view of a first tube body according to an embodiment of the present invention. 3D is a schematic view of a first tube body according to an embodiment of the present invention. 3E is a schematic view of a first tube body according to an embodiment of the present invention. 3F is a schematic view of a second tube body according to an embodiment of the present invention. 4A is a schematic view of a probe according to an embodiment of the present invention. 4B is a schematic view of a probe according to an embodiment of the present invention. 4C is a schematic view of a probe according to an embodiment of the present invention. 4D is a schematic view of a first tube body according to an embodiment of the present invention. Fig. 5A is a schematic view of a probe unit according to an embodiment of the present invention. FIG. 5B is a schematic view of a first tube body according to an embodiment of the present invention. Fig. 5C is a schematic view of a first tube body according to an embodiment of the present invention. Fig. 6A is a schematic view showing a tip end portion of a probe according to an embodiment of the present invention. Fig. 6B is a schematic view showing a tip end portion of a probe according to an embodiment of the present invention. Fig. 6C is a schematic view showing a tip end portion of a probe according to an embodiment of the present invention.

Claims (13)

a probe comprising: a first plunger; and a first tube having a first end, a first spiral, and a first cylindrical portion, the first end having the first post The first notch of the plug has a first spiral groove. The probe of claim 1, further comprising a second plunger, the first tube body including a second end portion having a second gap that fits the second plunger. The probe of claim 2, wherein the first plunger further has a first sliding portion that is in contact with the first cylindrical portion. The probe of claim 3, wherein the first tube body comprises a second spiral portion, the second spiral portion having a second spiral groove. The probe of claim 4, wherein the second plunger further has a second sliding portion that is in contact with the first cylindrical portion. The probe of claim 1, wherein the first plunger further has a first sliding portion that is in contact with the first cylindrical portion. The probe of claim 2, further comprising a second tube disposed on the inner side of the first tube and contacting the first cylindrical portion. The probe of claim 7, wherein the second tube has a second helical groove. The probe according to claim 7, wherein at least one of the two end portions of the second tubular body has a notch, and the second tubular body has a notch to fit the first plunger or the first Two plungers. The probe according to claim 9, wherein the first plunger or the second plunger that is fitted to both the first tubular body and the second tubular body has the first a first boss portion to which the tubular body is fitted and a second boss portion to which the second tubular body is fitted, wherein the diameter of the first boss portion is larger than the diameter of the second boss portion, the second convex portion The table portion protrudes from the first boss portion. The probe of claim 4, further comprising a second tube disposed on the inner side of the first tube, contacting the first cylindrical portion, and having a third spiral groove, The second pipe body has a notch at at least one of the two end portions of the second pipe body, and the first spiral portion and the first sliding portion are in the first pipe body and the second pipe body Overlap, the entire length of the second spiral portion overlaps with the second cylindrical portion of the second tubular body or the notch of the second tubular body, and the entire length of the third spiral groove and the first cylindrical portion Or the second gap overlaps. A probe unit having the probe of claim 1. A semiconductor inspection apparatus having the probe unit of claim 12.