JP2010032226A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simply adjust the quantity of an elastic deformation at a free end of a probe without drastically changing a design. <P>SOLUTION: A probe card is provided with a support substrate 4 disposed under a main substrate 2, the probe 3 disposed on a lower surface of the support substrate 4, and a support pin 5. The support substrate 4 is provided with a metal plate 41 having a flat surface, an insulating plate 43 disposed on a lower surface of the metal plate 41 through an insulating film 42, a pin insertion hole 43b penetrating through the insulating plate 43, and a probe insertion hole entirely penetrating through the support substrate. The probe 3 includes a cantilevered beam section 31 along the support substrate 4, a base section 32 formed at a fixed end of the beam section 31 and conducted to an external terminal 24 of the main substrate 2 through the probe insertion hole, and a contact section 33 formed at a free end of the beam section 31. The support pin 5 is inserted into the pin insertion hole 43b, abuts on the insulating film 42 at one end, and supports the beam section 31 at the other end. A height of the beam section 31 can be adjusted by changing a length of the support pin 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a probe card, and more particularly to an improvement of a probe card used when inspecting electrical characteristics of an inspection object such as a device formed on a semiconductor wafer.

  The probe card is an electrical connection means for taking out an electrical signal from the electrode pad by bringing a probe (contact probe) into contact with the electrode pad of the semiconductor integrated circuit. The probe card generally uses a multilayer wiring board (main board), and a plurality of probes are arranged on one surface of the multilayer wiring board corresponding to the number and pitch of electrode pads.

  When inspecting the electrical characteristics of devices on a semiconductor wafer, the probe is brought into contact with the electrode pad on the semiconductor wafer, and then overdrive, which is an operation of pressing the probe further toward the semiconductor wafer, is performed. Make sure to contact each electrode pad.

  As the probe, one having an elastically deformable cantilever beam structure in which one end is fixed to the substrate and the other end is a free end, and a contact portion formed on the free end side of the beam portion. is there.

  By the way, semiconductor devices have been highly integrated due to a significant improvement in microfabrication accuracy due to advances in photolithography technology and the like. As a result, the number of electrode pads with respect to the chip area of a semiconductor device has increased dramatically. Recently, more than 1,000 electrode pads have been arranged on a semiconductor chip of several millimeters square at a narrow pitch. . In order to perform an electrical characteristic test on such a semiconductor chip, a probe card in which probes are arranged at the same pitch as the electrode pads is required.

  However, along with the high integration of semiconductor integrated circuits, there is a limit to narrowing the pitch interval of the probes.

  Therefore, the applicant of the present application can reduce the pitch interval of the probe by giving the probe a fixed position on the main substrate, and the fulcrum when the beam portion is elastically deformed from the tip of the contact portion. A probe card with a constant distance is proposed (for example, see Patent Document 1).

  The probe card disclosed in FIG. 1 of Patent Document 1 includes a probe and an insulating support substrate that is fixed to the main substrate and supports the probe. Then, the probe is bent so as to extend along the surface of the support substrate from a through hole formed in the support substrate and a linear base portion inserted into the through hole formed in the main substrate. And a contact portion that contacts the surface of the support substrate, an inclined portion that is bent obliquely downward from an end of the contact portion so that a predetermined space is formed between the surface of the support substrate, and the inclination And a tip portion bent downward from the end of the portion.

  In the probe card disclosed in FIG. 1 of Patent Document 1, the inclined portion side end of the contact portion of the probe serves as a fulcrum, and the inclined portion is elastically deformed. Therefore, in this probe card, for two or more probes, the distance from the tip part to the inclined part side end part in the contact part can be made constant, and the length of the contact part can be freely determined, Since the distance between the base portions of the probes can be increased, the base portions can be prevented from leaking.

  The probe card disclosed in FIG. 4 of Patent Document 1 includes a probe and an insulating support substrate that is fixed to the main substrate and supports the probe. The shape of the probe and the support substrate Is different from the probe disclosed in FIG.

  The probe disclosed in FIG. 4 of Patent Document 1 is not formed with the inclined portion, and has a tip portion that is bent downward at an end portion on the opposite side of the base portion side end portion of the contact portion. is doing. Further, the support substrate is provided with a recess in which the tip of the contact portion enters by elastic deformation at a position facing the end on the tip side of the contact portion. In this case, the base portion side of the contact portion of the probe is in contact with the support substrate and the tip portion side is not in contact with the support substrate, and the portion located at the corner of the recess portion of the support substrate in the contact portion is elastically deformed. It becomes a fulcrum when doing.

In the two or more probes disclosed in FIG. 4 of Patent Document 1, the distance from the tip to the contact portion of the contact portion with the corner of the recess can be made constant, and the length of the contact portion can be freely set. By defining the distance, the distance between the base portions of the probes can be increased, so that the base portions can be prevented from leaking.
JP 2004-47648 A

  The two types of probe cards disclosed in Patent Document 1 can prevent leakage of each probe, and the pressing force due to elastic deformation when contacting the electrode pad is constant despite the size of each probe being different. Can be.

  Incidentally, the probe card disclosed in FIG. 1 of Patent Document 1 presses the electrode pad with the tip of the probe by elastically deforming the inclined portion of the probe. Therefore, the maximum amount of elastic deformation can be determined by the height of the inclined portion, that is, the height from the lower surface of the support substrate to the tip portion. As a result, in order to change the amount of elastic deformation in order to set the pressing force of the probe to the electrode pad to a desired pressing force, it is necessary to change the design of the probe.

  Further, in the probe card disclosed in FIG. 4 of Patent Document 1, the depth of the concave portion formed in the support substrate is the maximum amount of elastic deformation on the tip end side in the contact portion of the probe. As a result, when it is desired to further increase the pressing force of the probe against the electrode pad, it is necessary to change the design of the entire support substrate in order to change the depth of the recess.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a probe card that can easily adjust the elastic deformation amount of the free end of the probe without making a large design change. To do. It is an object of the present invention to provide a probe card that can be manufactured at low cost without causing a problem of leakage or short-circuit between probes and having a uniform elastic deformation amount of each probe.

  A probe card according to a first aspect of the present invention includes a main board having external terminals, a support board arranged to face the lower surface of the main board, and a probe and support pins arranged on the lower surface side of the support board. . The support substrate includes a metal plate having a flat plane, an insulating plate disposed on the lower surface side of the metal plate with an insulating film interposed therebetween, a pin insertion hole penetrating the insulating plate, and the support substrate. And a probe insertion hole therethrough. The probe includes a beam portion having a cantilever structure extending along the support substrate, and a base portion formed at a fixed end of the beam portion and electrically connected to the external terminal of the main substrate through the probe insertion hole. And a contact portion formed at a free end of the beam portion and protruding in a direction opposite to the support substrate. The support pin is inserted into the pin insertion hole, and is configured such that one end contacts the insulating film and the other end contacts the beam portion of the probe.

  According to the probe card of the present invention, the support substrate includes a metal plate having high strength and excellent surface smoothness, the insulating plate used for positioning the support pin, and the metal plate and the support pin. The support pin is inserted into the pin insertion hole formed in the insulating plate until one end contacts the insulating film, and the other end of the support pin By simply contacting the beam portion of the probe, the beam portion can be supported at a predetermined distance from the surface of the insulating plate so as to be elastically deformable.

  In addition, since the probe card of the present invention can adjust the distance of the beam portion from the surface of the insulating plate only by changing the length of the support pins, the maximum elastic deformation amount of the probe can be reduced. Can be changed.

  In the probe card according to the second aspect of the present invention, in addition to the above-described configuration, two or more of the probe insertion holes and the pin insertion holes are formed, the adjacent probes have different lengths of the beam portions, The pin insertion hole is formed at a position where the distance from the contact portion to the support pin is constant.

  According to the probe card of the second aspect of the present invention, the pin insertion hole is formed at a predetermined position with respect to two or more probes having different beam lengths from the contact portion. The distance to the support pin can be made the same, and the probe insertion hole can be formed at a position where the base portion of the adjacent probe does not leak. As a result, even if each of the probes has a different length of the beam portion, the pressing force for pressing the inspection object can be made constant, and the connection position of the probe with respect to the main substrate can be set to the probe. It can be in a position where they do not leak.

  In the probe card according to a third aspect of the present invention, in addition to the above-described configuration, the support pin has a recess formed at the protruding end. According to the probe card of the third aspect of the present invention, since the outer peripheral surface of the beam portion can be supported by the concave portion, the contact portion of the probe can be easily positioned.

  According to the probe card of the present invention, the allowable maximum elastic deformation amount of the probe can be adjusted simply by changing the length of the support pin. Therefore, the allowable maximum elastic deformation amount of the probe is easily adjusted. The probe card which can be provided can be provided at low cost. In addition, it is possible to provide a probe card that can make the amount of elastic deformation of each probe uniform without causing a problem of leakage or short circuit between the probes at low cost.

  Embodiments of a probe card according to the present invention will be described below with reference to the drawings. FIG. 1 is a partial sectional view showing an example of a probe card 1 according to an embodiment of the present invention. FIG. 7 is an overall configuration diagram showing an example of the probe card 1 according to the embodiment of the present invention, (a) is a plan view of the probe card 1, and (b) is a side view of the probe card. .

  As shown in FIGS. 1 and 7, the probe card 1 has one end connected to the main board 2 having an external terminal 24 and an electrode 21 that are conducted through wiring (not shown), and the electrode 21 of the main board 2. The other end includes a probe 3 that contacts the electrode pad 61 of the semiconductor integrated circuit 6, and a support substrate 4 that is disposed below the main substrate 2 and supports the probe 3 via support pins 5. Yes.

  As shown in FIG. 7, the main board 2 is a disk-shaped printed board, and includes an external terminal 24 for inputting / outputting signals to / from the tester device, an electrode 21 connected to the probe 3, and these electrodes 21 and a wiring pattern (not shown) for connecting the external terminals 24 to each other. In the present embodiment, a multilayer printed circuit board mainly composed of glass epoxy is used as the main board 2. The external terminal 24 is a terminal for conducting with devices other than the probe card 1 such as a tester device, and is formed in the vicinity of the peripheral portion of the main substrate 2 in order to widen the electrode pitch.

  As shown in FIG. 1, the main board 2 further includes two or more first probe insertion holes 22 into which the base portion 32 of the probe 3 is inserted, and the first probe insertion hole on the upper surface of the main board 2. A ring-shaped electrode 21 is formed around the opening 22.

  As shown in FIGS. 1 and 7, the support substrate 4 is disposed to face the lower surface of the main substrate 2, and is fixed to the main substrate 2 through fixing bolts 45. Further, the support substrate 4 includes a metal plate 41 having a flat plane, an insulating plate 43 disposed on the lower surface side of the metal plate 41 with the insulating film 42 interposed therebetween, and a support film 44 that covers the upper surface of the metal plate 41. Have

  The metal plate 41 is smoothly polished on the upper surface and the lower surface. The metal plate 41 is formed with two or more second probe insertion holes 41a through which the base portion 32 of the probe 3 is inserted.

  The insulating film 42 is formed of an insulating material such as a thin oxide film and covers the entire lower surface of the metal plate 41. In the insulating film 42, a third probe insertion hole 42a having the same inner diameter as the second probe insertion hole 41a is formed coaxially with the second probe insertion hole 41a formed in the metal plate 41. The insulating film 42 insulates the support pin 5 from the metal plate 41 so that the metal support pin 5 and the metal plate 41 do not conduct.

  The insulating plate 43 is made of ceramic and has the same area as the metal plate 41. A fourth probe insertion hole 43a having a diameter smaller than the inner diameter of the second probe insertion hole 41a is formed in the insulating plate 43 coaxially with the second probe insertion hole 41a formed in the metal plate 41. The insulating plate 43 is formed with a circular pin insertion hole 43b through which the support pin 5 that supports the beam portion 31 of the probe 3 is inserted. The insulating film 42 is exposed inside the pin insertion hole 43b.

  The support film 44 is made of an insulating material such as a resin film and covers the entire upper surface of the metal plate 41. A fifth probe insertion hole 44 a having a diameter smaller than the inner diameter of the fourth probe insertion hole 43 a of the insulating plate 43 is formed in the support film 44.

  In the present embodiment, each of the probe insertion holes 22, 41 a, 42 a, 43 a, 44 a is formed in a circle, and the fourth probe insertion hole 43 a of the insulating plate 43 and the fifth probe insertion hole 44 a of the support film 44 Thus, the base portion 32 of the probe 3 is supported so as not to tilt.

  FIG. 2 is a schematic perspective view showing an arrangement state of the probe 3 and the support pin 5. In the probe 3 shown in FIG. 2, a bulging portion 32a of the base portion 32 described later is omitted.

  As shown in FIG. 2, the support pin 5 is formed in a cylindrical shape made of metal, inserted into the pin insertion hole 43 b of the insulating plate 43, one end abutting the insulating film 42, and the other end of the probe 3. It comes into contact with the beam portion 31.

  As shown in FIG. 1, the length of the support pin 5 is inserted into the pin insertion hole 43 b and when the one end abuts against the insulating film 42, the other end is predetermined from the lower surface of the insulating plate 43. The length is protruding. The outer diameter of the support pin 5 is slightly smaller than the inner diameter of the pin insertion hole 43b. By making the outer diameter of the support pin 5 slightly smaller than the inner diameter of the pin insertion hole 43b, the support pin 5 can be easily inserted into the pin insertion hole 43b, and the support pin 5 is supported by the inner surface of the pin insertion hole 43b. be able to.

  Further, as shown in FIG. 2, the support pin 5 has a concave portion 51 formed of an arc surface at a tip protruding from the insulating plate 43. The arc surface of the recess 51 is formed to have the same curvature as that of the outer surface of the beam portion 31 of the probe 3. Therefore, by causing the beam portion 31 to contact the arc surface of the support pin 5, it is possible to prevent the beam portion 31 from being displaced in a direction parallel to the outer surface of the insulating plate 43 around the base portion 32. it can.

  In addition, although the support pin 5 was formed in the column shape, you may form in a prismatic shape. In this case, the pin insertion hole 43 b is also formed in a rectangular shape that matches the shape of the support pin 5. By making the cross-sectional shape of the support pin 5 and the shape of the pin insertion hole 43b rectangular, it becomes easy to perform positioning when the arcuate concave portion 51 is formed at the tip of the support pin 5. Moreover, the recessed part 51 formed in the front-end | tip of the support pin 5 is good also as a recessed part with a cross-sectional V character not only in a circular arc surface. When the V-shaped recess is formed at the tip of the support pin 5, the outer surface of the beam portion 31 is supported by being supported at two points in the circumferential direction in the recess, so that the beam portion 31 can be prevented from being displaced. .

  The probe 3 is formed of an alloy of rhenium tungsten, and extends from the support plate 4 along the insulating plate 43 to the support plate 4 from one end serving as a fixed end of the beam unit 31. The base portion 32 is bent and extends linearly, and the contact portion 33 is projected from the other end, which is the free end of the beam portion 31, in the direction opposite to the support substrate 4. The probe 3 has a circular cross section. Here, the probe 3 is composed of an alloy of rhenium tungsten, but may be composed of another alloy.

  As shown in FIG. 1, the beam portion 31 of the probe 3 is formed to extend parallel to the lower surface of the insulating plate 43 when supported by the support substrate 4 via the support pins 5. In the present embodiment, as shown in FIGS. 1, 2, and 7A, two types of probes 3 having different lengths of the beam portion 31 are used.

  As shown in FIG. 1, the base portion 32 of the probe 3 is bent substantially vertically from the fixed end of the beam portion 31 and extends linearly. The base portion 32 has a length inserted through the base portion 32 from the fourth probe insertion hole 43a of the insulating plate 43, and the first probe insertion of the main board 2 with the beam portion 31 in contact with the support pin 5. The length protrudes from the hole 22. The outer diameter of the base portion 32 is smaller than the inner diameter of the fifth probe insertion hole 44a of the support film 44 having the smallest diameter. The base portion 32 is formed with a bulging portion 32 a in the middle of the base portion 32 when it is inserted into the fourth probe insertion hole 43 a of the insulating plate 43 and pressed against the inner surface of the fourth probe insertion hole 43 a. . The bulging part 32a is formed so as to project outward from the base part 32 in the radial direction.

  In the present embodiment, the base portion 32 of the probe 3 is inserted from the fourth probe insertion hole 43 a of the insulating plate 43 to the first probe insertion hole 22 of the main board 2 and protruded from the upper surface of the main board 2. Thereafter, the protruding portion is soldered to the electrode 21 to be electrically connected to the external terminal 24 through the wiring pattern of the main board 2. The base portion 32 can be positioned at the center of each probe insertion hole 22, 41 a, 42 a, 43 a, 44 a by the bulge portion 32 a being pressed against the inner surface of the fourth probe insertion hole 43 a, and the support film 44. The middle of the base portion 32 can also be supported by the fifth probe insertion hole 44a. In this way, the portion protruding from the main board 2 of the base portion 32 in a state where the center of the base portion 32 is aligned with the center of the fourth probe insertion hole 43a can be fixed to the main substrate 2 by soldering. The part 32 can be prevented from contacting the metal plate 41.

  The contact portion 33 of the probe 3 is formed so as to be bent obliquely downward from the free end of the beam portion 31 and protrude downward. Further, the contact portion 33 is formed in a conical shape so as to taper toward the tip. The tip of the contact portion 33 is brought into contact with the electrode pad 61 of the semiconductor integrated circuit 6.

  In the present embodiment, when the beam portion 31 is brought into contact with the support pin 5 in a state where the base portion 32 is inserted into each of the probe insertion holes 22, 41 a, 42 a, 43 a, 44 a, the beam portion 31 becomes the insulating plate 43. The support substrate 4 is supported via the support pins 5 at a predetermined distance from the lower surface of the substrate.

  In the present embodiment, the plurality of electrode pads 61 of the semiconductor integrated circuit 6 are arranged in two rows so as to be line-symmetric, and the number of probes 3 corresponding to each electrode pad 61 is arranged on the support substrate 4. Established. The positions of the pin insertion holes 43b into which the support pins 5 are inserted and the positions of the probe insertion holes 22, 41a, 42a, 43a, 44a so that the tips of the contact portions 33 of the probes 3 are in contact with the electrode pads 61, respectively. Is stipulated.

  Specifically, first, as shown in FIG. 1, the position of the support substrate 4 facing the center of the electrode pad 61 is the position where the tip of the contact portion 33 is disposed. Then, with respect to the center line between the two rows of the electrode pads 61, two rows are arranged outside the electrode pad 61 so as to be symmetrical with respect to the center line at the same interval as the pitch interval in the column direction of the electrode pads 61. The pin insertion hole 43b is formed. Therefore, the distance from each pin insertion hole 43b to the position of the tip of the contact portion 33 is constant.

  The fourth probe insertion hole 43a is formed on a line connecting the center of the pin insertion hole 43b and the tip of the contact portion 33, as shown in FIGS. The plurality of fourth probe insertion holes 43a provided in the row direction of the electrode pads 61 are formed so that the distance from the center of the pin insertion hole 43b is alternately different in the row direction. Accordingly, two types of probes 3 having different beam portions 31 are alternately arranged in the column direction of the electrode pads 61. The first probe insertion hole 22, the second probe insertion hole 41a, the third probe insertion hole 42a, and the fifth probe insertion hole 44a are formed coaxially with the fourth probe insertion hole 43a.

  Thus, by forming the probe insertion holes 22, 41 a, 42 a, 43 a, 44 a, the pitch interval in the column direction of each probe 3 can be made narrow according to the pitch of the electrode pads 61, and adjacent to each other. Since the distance between the base portions 32 of the probes 3 can be made larger than the pitch interval of the electrode pads 61, it is difficult for leaks and shorts to occur between the probes 3.

  Next, a method for manufacturing the probe card 1 according to the present embodiment will be described. FIG. 3 is an explanatory diagram showing the assembly order of the probe card 1.

  First, as shown in FIG. 3A, the insulating film 42 is formed on one surface of the metal plate 41, the support film 44 is formed on the other surface, and the insulating plate 43 is overlaid on the insulating film 42. Thus, the support substrate 4 is configured. And this support substrate 4 is arrange | positioned so that the insulating plate 43 may become upward, and it fixes to the main board | substrate 2 arrange | positioned below it. The support pins 5 are inserted into the pin insertion holes 43 b of the insulating plate 43 with respect to the support substrate 4 fixed to the main substrate 2.

  Next, as shown in FIG. 3B, the base portion 32 of the probe 3 is inserted into each of the probe insertion holes 41 a, 42 a, 43 a, 44 a of the support substrate 4 with the support pins 5 attached to the support substrate 4. Further, the base portion 32 is inserted through the first probe insertion hole 22 of the main board 2.

  Then, as shown in FIG. 3C, the end portion of the base portion 32 is protruded from the main substrate 2 with the beam portion 31 in contact with the support pin 5. In this state, the portion protruding from the main substrate 2 of the base portion 32 and the electrode 21 are connected by the solder 23, whereby the base portion 32 is fixed to the main substrate 2 by the solder 23 and the probe card 1 is formed. .

  In the present embodiment, even if the probe card 1 is turned over so that the insulating plate 43 faces downward, the end portion of the base portion 32 of the probe 3 is fixed to the main substrate 2 via the solder 23, and the base portion 32. Since the bulging portion 32a formed on the insulating plate 43 is in pressure contact with the fourth probe insertion hole 43a, the support pin 5 and the probe 3 do not fall from the support substrate 4. Moreover, the beam portion 31 of the probe 3 is supported by the support substrate 4 in a state of being spaced a predetermined distance from the lower surface of the insulating plate 43 by contacting the support pins 5. Further, in the beam portion 31 of the probe 3, the free end side corner portion in contact with the support pin 5 serves as a fulcrum for elastic deformation. In the present embodiment, the height of the support pin 5 protruding from the lower surface of the insulating plate 43 is the maximum allowable amount by which the beam portion 31 of the probe 3 is elastically deformed.

  In the probe card 1 of the present embodiment, the support substrate 4 to which the probe 3 is attached is brought relatively close to the semiconductor integrated circuit 6, the contact portion 33 of the probe 3 is brought into contact with the electrode pad 61, and the support substrate 4 Is brought closer to the semiconductor integrated circuit 6 and so-called overdrive is performed, so that the contact portion 33 is brought into pressure contact with the electrode pad 61. By this overdrive, the beam portion 31 is elastically deformed toward the insulating plate 43 on the free end side within the range of the protruding height of the support pin 5 with the free end corner portion of the recess 51 of the support pin 5 as a fulcrum. As a result, the probe 3 can obtain a stable contact resistance with the electrode pad 61 of the semiconductor integrated circuit 6.

  In the present embodiment, since the support substrate 4 is configured to include the metal plate 41 having high strength and excellent smoothness accuracy and the insulating plate 43 for supporting the support pins 5, the surface of the metal plate 41 is It can be used as a reference surface for supporting the tip of the support pin 5, and even if the support pin 5 protrudes from the insulating plate 43, it can be reliably supported by the insulating plate 43 so that the support pin 5 does not fall down. As a result, the height of all the support pins 5 from the metal plate 41 can be made constant, and the height of all the probes 3 from the support substrate 4 can be kept constant.

  In addition, by forming the length of the base portion 32 of the probe 3 to be sufficiently longer than the height from the lower surface of the insulating plate 43 of the support substrate 4 to the upper surface of the main substrate 2, the configuration of the support substrate 4 remains unchanged. By simply changing the length of the support pin 5, the height of the beam portion 31 of the probe 3 from the support substrate 4 can be freely adjusted. As a result, when the height of the probe 3 is adjusted from the lower surface of the support substrate 4, the design can be changed at a low cost with a small number of parts without making a large design change.

  Further, since the probe card 1 according to the present embodiment can make the distance from the tip of the contact portion 33 to the support pin 5 constant with respect to each probe 3, the elastic deformation amount of the beam portions 31 of all the probes 3. Can be made uniform, the pressing force on the electrode pad 61 can be made substantially constant, and a stable electrical characteristic inspection can be performed. In addition, the probe 3 can be attached to a desired position simply by determining the position of the probe insertion hole and the position of the pin insertion hole 43b in accordance with the length of the beam portion 31 of the probe 3, and the arrangement of the probe 3 is free. The degree is increased.

  As described above, in the probe card 1 according to the present embodiment, the distance between the base portions 32 of the adjacent probes 3 can be made larger than the pitch interval of the electrode pads 61 of the semiconductor integrated circuit in order to achieve high integration. it can. As a result, a leak or a short circuit is unlikely to occur between the probes 3, and a failure due to this is unlikely to occur.

  In addition, since the concave portion 51 made of an arc surface is formed at the tip of the support pin 5 that contacts the beam portion 31, the beam portion 31 of the probe 3 is parallel to the surface of the insulating plate 43 by the concave portion 51 of the arc surface. It can be reliably supported without being displaced in the direction. As a result, the probe 3 can be reliably supported on the support substrate 4 at a predetermined position and orientation.

  In the above embodiment, in order to prevent the base portion 32 of the probe 3 from coming into contact with the second probe insertion hole 41a of the metal plate 41, the fourth probe insertion of the insulating plate 43 rather than the inner diameter of the second probe insertion hole 41a. The inner diameter of the hole 43a and the inner diameter of the fifth probe insertion hole 44a of the support film 44 are reduced, and a bulge portion 32a is formed in the base portion 32, and the bulge portion 32a is pressed against the inner surface of the fourth probe insertion hole 43a. Thus, the base portion 32 is prevented from shifting in the radial direction.

  The means for preventing the positional deviation of the base portion 32 is not limited to the configuration in the above embodiment, and for example, the configuration shown in FIGS.

  FIG. 4 is a schematic cross-sectional view of the probe card 1 according to the second embodiment of the present invention. In the second embodiment, the inner diameter of the second probe insertion hole 41 a provided in the metal plate 41 of the support substrate 4 is the same as the inner diameter of the fourth probe insertion hole 43 a provided in the insulating plate 43, and the bulging portion 32 a is provided in the base portion 32. The bulging portion 32a is formed and pressed against the fourth probe insertion hole 43a. In the present embodiment, the second probe insertion hole 41a and the fourth probe insertion hole 43a have the same inner diameter, but the center of the base portion 32 is the center of the fourth probe insertion hole 43a due to the bulging portion 32a of the base portion 32. Therefore, the base portion 32 can be prevented from contacting the second probe insertion hole 41a of the metal plate 41 only by providing the bulge portion 32a.

  FIG. 5 is a schematic cross-sectional view of the probe card 1 according to the third embodiment of the present invention. In Embodiment 3, the inner diameter of the fourth probe insertion hole 43 a provided in the insulating plate 43 is considerably smaller than the inner diameter of the second probe insertion hole 41 a provided in the metal plate 41, and the fifth probe insertion provided in the support film 44. The inner diameter is substantially the same as the inner diameter of the hole 44a. Further, the bulging portion 32 a is not formed in the base portion 32. In the present embodiment, since the base portion 32 can be prevented from being inclined by the fourth probe insertion hole 43a and the fifth probe insertion hole 44a, the base portion 32 contacts the second probe insertion hole 41a of the metal plate 41. Can be prevented.

  FIG. 6 is a schematic sectional view of a probe card 1 according to the fourth embodiment of the present invention. In the fourth embodiment, the insulating film 42 is formed of the same insulating film as the support film 44. The inner diameter of the second probe insertion hole 41 a provided in the metal plate 41 and the inner diameter of the fourth probe insertion hole 43 a provided in the insulating plate 43 are the same, and the inner diameter of the third probe insertion hole 42 a provided in the insulating film 42 and the support film 44 are The inner diameters of the fifth probe insertion holes 44a to be provided are the same. Further, the inner diameters of the third probe insertion hole 42a and the fifth probe insertion hole 44a are considerably smaller than the inner diameters of the second probe insertion hole 41a and the fourth probe insertion hole 43a. The base portion 32 is not formed with a bulging portion 32a. In the present embodiment, the base portion 32 can be prevented from being tilted by the third probe insertion hole 42 a of the insulating film 42 and the fifth probe insertion hole 44 a of the support film 44. It is possible to prevent contact with the two-probe insertion hole 41a.

  In the present embodiment, the electrode pads 61 are arranged in two rows, but the arrangement of the electrode pads 61 is not limited to this. Therefore, in the probe card of the present invention, the length of the beam portion 31 of the probe 3, the position of the pin insertion hole 43 b, and the probe insertion holes 22, 41 a so that the probes 3 do not leak with each other in accordance with the arrangement of the electrode pads 61. , 42a, 43a, 44a can be freely determined.

  In addition, the probe 3 can also be formed by the electrocasting method, and can also use the probe which sharpened the tip of the wire-shaped metal.

It is the schematic sectional drawing which showed an example of the probe card 1 by Embodiment 1 of this invention. It is a schematic perspective view which shows the arrangement | positioning state of the probe used for the probe card 1 of this Embodiment 1, and a support pin. It is explanatory drawing which shows the assembly of the probe card 1 by Embodiment 1 of this invention. The schematic sectional drawing of the probe card 1 by Embodiment 2 of this invention is shown. The schematic sectional drawing of the probe card 1 by Embodiment 3 of this invention is shown. The schematic sectional drawing of the probe card 1 by Embodiment 4 of this invention is shown. It is the whole block diagram which showed an example of the probe card 1 by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe card 2 Main board | substrate 21 Electrode 22 1st probe insertion hole 23 Solder 24 External terminal 3 Probe 31 Beam part 32 Base part 32a Swelling part 33 Contact part 4 Support substrate 41 Metal plate 41a Second probe insertion hole 42 Insulating film 42a First 3 probe insertion hole 43 Insulating plate 43a Fourth probe insertion hole 43b Pin insertion hole 44 Support film 44a Fifth probe insertion hole 45 Fixing bolt 5 Support pin 51 Recess 6 Semiconductor integrated circuit 61 Electrode pad

Claims (3)

A main board having an external terminal; a support board arranged to face the lower surface of the main board; and a probe and a support pin arranged on the lower surface side of the support board,
The support substrate includes a metal plate having a flat plane, an insulating plate disposed on the lower surface side of the metal plate with an insulating film interposed therebetween, a pin insertion hole penetrating the insulating plate, and penetrating the support substrate. A probe insertion hole,
The probe includes a beam portion having a cantilever structure extending along the support substrate, and a base portion formed at a fixed end of the beam portion and electrically connected to the external terminal of the main substrate through the probe insertion hole. And a contact portion formed at a free end of the beam portion and protruding in a direction opposite to the support substrate,
The probe card, wherein the support pin is inserted into the pin insertion hole, one end abuts on the insulating film, and the other end abuts on a beam portion of the probe.   Two or more of the probe insertion holes and the pin insertion holes are formed, the adjacent probes have different beam lengths, and the distance from the contact portion to the support pin of each probe is constant. The probe card according to claim 1, wherein a pin insertion hole is formed.   The probe card according to claim 1, wherein the support pin has a recess formed at a protruding side end.

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