KR20040003735A - Vertical type probe card - Google Patents

Abstract

PURPOSE: A vertical type probe card is provided to be capable of easily corresponding to a ball type electrode pad, improving electrical conductivity, and preventing a contact terminal from being stained with electrode pad material. CONSTITUTION: A vertical type probe card is provided with a PCB(Printed Circuit Board)(120) having through holes, a plurality of connection pins(126) protruded from the lower portions of the through holes, and a space transformer(124) connected with the protruded connection pins. The vertical type probe card further includes a plurality of probe tips(130) vertically connected to the lower portions of the space transformer and reinforcing plates(122,132) installed at the upper portion of the PCB and at the lower portion of the space transformer, respectively. Each probe tip includes a body part made of micro tube having an inner hole, an elastic part formed at the lower portion of the body part, and a contact terminal formed at the lower portion of the elastic part.

Description

Vertical type probe card {Vertical type probe card}

The present invention relates to a probe card, and more particularly, a probe card having a vertical probe tip that is easily provided in contact with a ball-type contact terminal by being provided with a cut-out contact terminal at a lower end of a main body portion formed of a microtube. It is about.

Usually, in a semiconductor manufacturing process, after finishing a wafer manufacturing process, a good product is sorted by a probing test, this good product is accommodated in a package, and it finishes in the form of a final product. Then, burn-in is performed for the semiconductor device after package completion, which is finished in the form of a final product.

The probing test may be performed by applying a predetermined electrical signal to a test apparatus through a probe tip of a probe card in contact with an electrode pad of a chip implemented on a semiconductor substrate, and then receiving the electrical signal corresponding thereto. Test the normal and abnormality of the chip implemented on the semiconductor substrate.

As described above, a probe card for testing a semiconductor chip, that is, a semiconductor chip, is formed in the center of the upper surface of the printed circuit board 110 and the printed circuit board 110 as shown in FIG. 1. A needle 114 having a reinforcement plate 112 and a probe tip 114 ′ contacting an electrode pad of a wafer (not shown) and connected to a circuit of the printed circuit board 110, and a bottom surface of the printed circuit board 110. It is formed of a fixed plate 116 formed in the center to support and fix the probe tip 114 'and an insulator 118 to fix the probe tip 114' to the fixed plate 116.

In this case, the predetermined portion of the probe tip 114 ′ is bent at a predetermined angle downward in the horizontal direction, that is, in the electrode pad direction.

The probe card configured as described above is moved up and down by a jig (not shown) to allow the probe tip 114 'to come into contact with the center of the electrode pad to check for abnormality of the electrode pad.

However, a probe tip mounted on a conventional probe card has a needle type, and a predetermined portion is bent downward in a horizontal direction, that is, a predetermined angle in an electrode pad direction, thereby making it difficult to cope with a highly integrated semiconductor device.

That is, a probe tip mounted on the probe card has a predetermined portion bent downward in a horizontal direction, that is, a predetermined angle in the direction of the electrode pad, so that it is impossible to install the probe tips on the fixed plate of the probe card in a high density so that the electrode of the semiconductor device is highly integrated. There was a problem that the pad could not be responded to.

In addition, the probe card equipped with the needle-type probe tip is easily contacted with a ball type electrode pad, which is used mainly in recent years, that is, a ball type electrode pad whose upper surface protrudes upward due to slippage or the like. There was a problem that did not.

It is an object of the present invention to provide a vertical probe card having a probe tip capable of high density array installation.

Another object of the present invention is to provide a vertical probe card having a probe tip that can easily correspond to a ball type electrode pad.

1 is a cross-sectional view for explaining a conventional probe card.

2 is a cross-sectional view for describing a vertical probe card according to an exemplary embodiment of the present invention.

3 is a flowchart illustrating a method of manufacturing the probe tip illustrated in FIG. 2.

4A is a perspective view illustrating an example of the probe tip illustrated in FIG. 2, and FIG. 4B is a perspective view illustrating another example of the probe tip illustrated in FIG. 2.

5 is a bottom view of the probe tip shown in FIG. 2.

6A and 6B are cross-sectional views illustrating a state of use of the probe tip shown in FIG. 2.

<Description of Symbols for Main Parts of Drawings>

120: printed circuit board 122: upper reinforcement plate

124: space converter 126: pogo pin

128: connection 130: probe tip

132: lower reinforcement plate 134: bolt

In order to achieve the above object, a vertical probe card according to the present invention includes a printed circuit board having a through hole connected to a multilayer circuit, an electrical connection pin of an elastic material inserted into the through hole, and protruding downward, and the protruding connection pin. A probe card having a space transducer connected to a probe and a probe tip vertically attached to a lower portion of the space transducer and a reinforcement plate provided on upper and lower portions of the printed circuit board and the space transducer, wherein the probe tip is made of an electrically conductive material having elastic force. It characterized in that it comprises a main body consisting of a micro-tube having a hole, an elastic portion having a plurality of cutouts formed on the lower side of the main body and a contact terminal provided on the lower end of the elastic portion.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view illustrating a probe card according to an exemplary embodiment of the present invention.

As shown in FIG. 2, the probe card according to the present invention includes a printed circuit board 120 having a through hole (not numbered) connected to a multilayer internal circuit, and formed in the through hole of the printed circuit board 120. A plurality of pogo pins (126) of elastic material are inserted and protrude downward.

At this time, the pogo pin 126 is provided with an elastic body such as a spring (Spring) so that a predetermined clearance is generated up and down to adjust the vertical gap.

In addition, the pogo pin 126 inserted into the through hole of the printed circuit board 120 and the connecting portion 128 on the space converter 124 provided with the multilayer circuit are connected by soldering or the like.

In addition, an upper reinforcement plate 122 and a lower reinforcement plate 132 are provided on upper and lower portions of the printed circuit board 120 and the space converter 124 connected by the pogo pins 126 to be printed by being fastened by bolts 134. The circuit board 120 and the space converter 124 are fixed.

In addition, the probe tip 130 using the microtube according to the present invention is provided below the space transducer 124 by a connecting means (not shown) using a material such as an epoxy resin.

In this case, the space transducer 124 is probe tip 130 is installed in an extremely tight arrangement to correspond to the small pitch interval of the semiconductor device by attaching the probe tip 130 in accordance with the present invention vertically to the space transducer 124 This relatively wide array of the printed circuit board 120 is installed to perform a function to be electrically connected.

In addition, the probe tip 130, the space converter 124 having a multilayer circuit, the pogo pins 126, and the circuits inside the printed circuit board 120 are electrically connected to each other.

3 is a process diagram for explaining a method for manufacturing a probe tip mounted on a probe card according to an embodiment of the present invention.

Method of manufacturing the probe tip 130 according to the present invention, as shown in Figure 3, first with a predetermined elastic force copper (Cu), tungsten (W), a copper alloy and a tungsten alloy material in the center of the inner hole (10a) Prepare a predetermined length of the micro tube (ie, the micro tube), that is, the main body portion 10.

In this case, the main body 10 is manufactured by the probe tip 130 in a subsequent process, so that the diameter of the inner hole 10a of the main body 10 is several μm, the size of the electrode pad of the electronic device highly integrated. Take into consideration microtubes of suitable diameter.

Next, a protective film 12 such as a photoresist having a predetermined thickness is formed on the outer surface of the main body portion 10. At this time, it will be obvious that the protective film 12 may be used in various materials used as an etching mask in a semiconductor manufacturing process, such as an oxide film, in addition to a photoresist.

Subsequently, the inner center of the main body portion 10 is tipped by tipping the lower end portion of the main body portion 10 having the protective film formed on the outer surface into the first bath 2 in which the first etching liquid having a predetermined depth is stored. The inclined surface 14 is formed at the lower end of the main body 10 by inclining the inner hole 10a formed at a predetermined angle in the inward direction.

Subsequently, the fitting material 16 having a low selectivity with respect to the etchant, such as a photoresist, is embedded in the inner hole 10a formed at the inner center of the main body portion 10 on which the inclined surface 14 is formed.

At this time, the fitting material 16 may be buried in the entire inner hole (10a) formed in the inner center of the main body portion 10, but in consideration of the convenience of the main body portion 10 at the lower end of the main body portion 10 Only landfill until

Next, the protective film pattern 18 is formed by scanning the laser beam on the protective film 12 formed on the outer surface of the body portion 10 in which the fitting material 16 is embedded in the inner hole 10a.

In this case, the passivation layer pattern 18 is formed at the lower end of the main body portion 10 in which the elastic portion is formed in a subsequent process, and the process of forming the passivation layer pattern 18 rotates the main body portion 16 while the passivation layer 12 is formed. It is formed by repeatedly scanning the laser beam on the protective film 12. In particular, the spot size of the laser beam in the process of scanning the laser beam is preferably adjusted to an appropriate size in consideration of the convenience of the process coordinator.

Subsequently, the main body 10 opened by the protective film pattern 18 by tipping the main body 10 having the protective film pattern 18 formed at the lower end thereof into the second bath 4 in which the predetermined second etching solution is stored. Completely wet etching to form an elastic part 20 having a plurality of cutouts 19 spaced apart from each other by a predetermined interval.

In this case, the fitting material 16 embedded in the inner hole 10a formed at the inner center of the main body portion 10 may include a main body portion in which the second etchant stored in the second bath 4 is closed by the protective layer pattern 18. (10) It performs a function to prevent wet etching of the inner surface of the bottom.

Finally, the elastic part 20 and the elastic part 10 having a plurality of cutouts 19 by removing the fitting material 16 embedded in the inner hole 10a formed at the inner center of the main body part 10. ) To form a probe tip 130 having a contact terminal 22 inclined at an angle to an end thereof.

Hereinafter, a probe tip implemented by the method as described above will be described in detail.

4A and 4B are perspective views of the probe tip shown in FIG. 2, and FIG. 5 is a bottom view.

Probe tip 130 according to the present invention, as shown in Figures 4a, 4b and 5 has a predetermined elastic force copper (Cu), tungsten (W), copper alloy and tungsten alloy material in the center hole The cylindrical main body part 10 which consists of a micro tube of predetermined length in which 10a was formed is provided.

At this time, the diameter of the inner hole (10a) of the main body portion 10 is made of several ㎛ considering the size of the electrode pad of the highly integrated electronic device.

In addition, after forming the protective film pattern 18 on the lower end of the main body 10 by removing a protective film 12 of a predetermined region by scanning a laser beam to the protective film 12 formed on the lower outer surface of the main body 10. In addition, an elastic portion 20 having a plurality of cutouts 19 formed by dipping a lower side of the main body portion 10 on which the protective layer pattern 18 is formed into an etching solution and wet etching the same is formed.

In this case, at least two cutouts 19 of the elastic part 20 are preferably provided so that the elastic part 20 can be restored to its original position after the elastic part 20 is expanded outward, in particular, FIG. 4B. As shown in FIG. 2, the neighboring cutouts 19 of the plurality of cutouts 19 have a predetermined step with each other so that physical stress is applied to a predetermined part of the main body 10 in the process of contacting the electrode pads. It is to prevent.

In addition, the lower end surface of the elastic portion 20 is provided with a contact terminal 22 in which the end portion of the elastic portion 20 is inclined at a predetermined angle.

Referring to the effect of the probe tip of the present invention as described above are as follows.

The probe tip 130 according to the present invention is a space transducer of a probe card having an upper reinforcement plate 122, a printed circuit board 120, a pogo pin 126, a space transducer 124, and a lower reinforcement plate 132. (124) the lower side of the probe tip 130 is a ball-type electrode pad 30, the upper surface of which protrudes upward as shown in Figs. 5A and 5B and the electrode pad 32 of which the upper surface is flat; When contacted, the probe tip 130 is vertically fixed to the assembly of the probe card to press the electrode pads 30 and 32 in the vertical direction.

In addition, as the electrode pads 30 and 32 are pressed, the elastic portion 20 of the probe tip is opened to the outside and slides a predetermined length in a shape that surrounds the electrode pads 30 and 32. Contact with.

At this time, the bottom surface of the elastic portion 20 is inclined in the direction of the inner hole 10a formed in the inner center more easily slips on the surface of the ball-type electrode pad 30, and finally after the sliding electrode pad ( Since the contact terminal 22 in contact with 30 is inclined, the contact area is increased than before.

In addition, after a predetermined electrical signal is applied to the electrode pad while the contact terminal 22 of the probe tip and the electrode pads 30 and 32 are in contact with each other, the test terminal is applied to the electrode pads 30 and 32. When the losing pressure is removed, the elastic portion 20 is restored to its original position by its elastic force.

In particular, in the process of restoring to its original position by the elastic force of the elastic part 20, the elastic part 20 is moved back to the electrode pads 30 and 32 where the sliding of the contact terminal 22 occurs. The electrode pad material does not adhere to the contact terminal 22.

In addition, the elastic part 20 of the lower end of the main body 10 is opened to the outside and the ball-type electrode pad 30 in contact with the ball-type electrode pad 30 in a shape surrounding the ball-type electrode pad 30 ( 30) can be easily contacted.

In addition, since the probe tip 130 of the probe card according to the present invention is vertical, it is possible to install a high-density array, so that it is possible to cope with the small size of the electrode pad of the electronic device that is highly integrated by the high-density probe tip. It is easy to cope with pitch interval.

The probe tip of the probe card according to the present invention can easily correspond to the ball-type electrode pad protruding from the upper surface by contact with the electrode pad, and has excellent electrical conductivity. It can be prevented from being buried, and it is easy to cope with a highly integrated electronic device as a vertical type.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical spirit of the present invention, and such modifications and modifications are naturally within the scope of the appended claims.

Claims (6)

A printed circuit board having a through hole connected to a multilayer circuit, an electrical connection pin of an elastic material inserted into the through hole and protruding downward, a space converter connected to the protruding connection pin, and a probe vertically attached to a lower portion of the space converter. A probe card having a tip and a reinforcing plate provided on upper and lower portions of the printed circuit board and the space converter, The probe tip is made of a conductive material having an elastic force and includes a body part formed of a microtube having an inner hole, an elastic part having a plurality of cutouts formed under the body part, and a contact terminal provided at the bottom of the elastic part. Probe card, characterized in that. The probe tip of claim 1, wherein the microtube is made of any one of copper (Cu), tungsten (W), a copper alloy, and a tungsten alloy material. The probe tip of claim 1, wherein at least two cutouts are provided. The method of claim 1, wherein the elastic portion is formed by forming a protective film pattern by scanning a laser beam on a predetermined portion of the protective film formed on the outer surface of the main body portion, and then the lower side of the main body portion on which the protective film pattern is formed in a etching solution Probe tip for electronic device inspection using a micro-tube, characterized in that formed by wet etching. The probe tip of claim 1, wherein the contact terminal is formed to be inclined at a predetermined angle inside the elastic portion. The probe tip of claim 1, wherein the neighboring cutouts of the plurality of cutouts have a predetermined step with each other.