[熱固性助焊劑組合物] 首先，對本實施形態之熱固性助焊劑組合物進行說明。 本實施形態之熱固性助焊劑組合物係於藉由回流焊接使具有焊料凸塊之電子零件接合於電子基板之情形時所使用者，且具有以下所說明之(A)氧雜環丁烷化合物及(B)有機酸。 關於本實施形態之熱固性助焊劑組合物，必須於以5℃/min之升溫速度自溫度25℃升溫之情形時，於溫度200℃下之黏度為5 Pa・s以下，且於溫度250℃下之黏度為50 Pa・s以上。於溫度200℃下之黏度超過5 Pa・s之情形時，熱固性助焊劑組合物之硬化過度進行，而有礙熔融焊料之流動性，故而回焊中之焊接性或自動校準性降低。另一方面，於溫度250℃下之黏度未達50 Pa・s之情形時，熱固性助焊劑組合物之硬化性不充分，因此硬化物之絕緣性變得不充分。 此處，黏度可藉由流變計進行測定。具體而言，可使用流變計(HAAKE公司製造，商品名「MARS-III」)並藉由特定之條件測定黏度。 又，製作將包含錫96.5質量%、銀3.0質量%及銅0.5質量%之焊料合金且平均粒徑為30 μm之焊料粉末、與上述熱固性助焊劑組合物以質量比成為1：1之方式進行混合而成之焊料組合物，於將上述焊料組合物以5℃/min之升溫速度自溫度25℃升溫之情形時，較佳為溫度200℃下之黏度為5 Pa・s以下，且溫度250℃下之黏度為50 Pa・s以上。於滿足此種條件之情形時，可更確實地謀求硬化物之絕緣性、以及回焊中之焊接性及自動校準性之兼顧。 於使用熱固性助焊劑組合物進行回流焊接之情形時，熱固性助焊劑組合物係與焊料接觸。並且，焊料亦發揮作為熱固性助焊劑組合物之熱硬化觸媒之功能。因此，根據將熱固性助焊劑組合物與焊料粉末進行混合而成之焊料組合物之黏度變化，可更正確地界定進行回流焊接之情形時之熱固性助焊劑組合物之硬化溫度。 再者，作為將熱固性助焊劑組合物及焊料組合物於200℃及250℃下之黏度調整為上述範圍之方法，可列舉如以下之方法。 熱固性助焊劑組合物及焊料組合物於200℃及250℃下之黏度可藉由變更氧雜環丁烷化合物及有機酸等之種類，或併用氧雜環丁烷化合物與環氧樹脂，或使用硬化劑而進行調整。 [(A)成分] 作為本實施形態所使用之(A)氧雜環丁烷化合物，可適當使用公知之氧雜環丁烷化合物。又，該(A)成分必須含有(A1)於1分子中具有2個氧雜環丁烷環之二官能氧雜環丁烷化合物。 又，該(A)成分亦可含有(A2)於1分子中具有1個氧雜環丁烷環之單官能氧雜環丁烷化合物。藉由含有該(A2)成分，可提高熱固性助焊劑組合物之硬化溫度，而可調整熱固性助焊劑組合物之硬化溫度。 作為上述(A1)成分，可列舉：苯二甲基雙氧雜環丁烷(東亞合成公司製造之「OXT-121」)、3-乙基-3{[(3-乙基氧雜環丁烷-3-基)甲氧基]甲基}氧雜環丁烷(東亞合成公司製造之「OXT-221」)、及具有聯苯骨架之二官能氧雜環丁烷化合物(宇部興產公司製造之「ETERNACOLL OXBP」)等。 作為上述(A2)成分，可列舉：3-乙基-3-羥甲基氧雜環丁烷(東亞合成公司製造之「OXT-101」)、2-乙基己基氧雜環丁烷(東亞合成公司製造之「OXT-212」)、及3-乙基-3-(甲基丙烯醯氧基)甲基氧雜環丁烷(宇部興產公司製造之「ETERNACOLL OXMA」)等。 於併用上述(A1)成分及上述(A2)成分之情形時，上述(A1)成分相對於上述(A2)成分之質量比((A1)/(A2))較佳為1以上且50以下，更佳為3/2以上且30以下，尤佳為2以上且20以下。若質量比為上述範圍內，則可一面維持熱固性助焊劑組合物之硬化物之絕緣性，一面調整熱固性助焊劑組合物之硬化溫度。 上述(A)成分之調配量相對於熱固性助焊劑組合物之固形物成分總量，較佳為40質量%以上且95質量%以下，更佳為60質量%以上且92質量%以下，尤佳為70質量%以上且90質量%以下。若(A)成分之調配量為上述範圍內，則可確保充分之硬化性，而可充分地補強電子零件與電子基板之焊料接合。 [(B)成分] 關於本實施形態所使用之(B)活性劑，可列舉：有機酸、有機酸胺鹽、包含非解離性鹵化化合物之非解離型活性劑、及胺系活性劑等。該等活性劑可單獨使用1種，亦可混合2種以上使用。又，該(B)成分必須含有(B1)有機酸。於回焊步驟中，由於有機酸與氧雜環丁烷化合物之硬化反應不會那麼充分地進行，故而可將熱固性助焊劑組合物之硬化溫度調整至較佳之範圍。 作為上述(B1)成分，除單羧酸、二羧酸等以外，還可列舉其他有機酸。該等可單獨使用1種，亦可混合2種以上使用。 作為單羧酸，可列舉：甲酸、乙酸、丙酸、丁酸、戊酸、己酸、庚酸、癸酸、月桂酸、肉豆蔻酸、十五烷酸、棕櫚酸、珠光子酸、硬脂酸、結核菌硬脂酸(tuberculostearic acid)、花生酸、山萮酸、二十四碳酸、及乙醇酸等。 作為二羧酸，可列舉：草酸、丙二酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、富馬酸、馬來酸、酒石酸、及二甘醇酸等。該等中，就熱固性助焊劑組合物之硬化物之物性之觀點而言，較佳為戊二酸、己二酸、庚二酸、辛二酸。 作為其他有機酸，可列舉：二聚酸、乙醯丙酸、乳酸、丙烯酸、苯甲酸、水楊酸、大茴香酸、檸檬酸、及吡啶甲酸等。 作為上述(B1)成分之調配量，相對於熱固性助焊劑組合物之固形物成分總量，較佳為1質量%以上且15質量%以下，更佳為2質量%以上且12質量%以下，尤佳為3質量%以上且10質量%以下。若(B1)成分之調配量為上述下限以上，則可更確實地防止焊料接合之不良。又，若(B1)成分之調配量為上述上限以下，則可確保熱固性助焊劑組合物之絕緣性。 上述(B)成分亦可視需要含有上述(B1)成分以外之活性劑((B2)成分)。作為(B2)成分，可列舉有機酸胺鹽、包含非解離性鹵化化合物之非解離型活性劑、及胺系活性劑等。 上述有機酸胺鹽係上述(B1)成分之胺鹽。作為上述胺，可適當使用公知之胺。此種胺可為芳香族胺，亦可為脂肪族胺。該等可單獨使用1種，亦可混合2種以上使用。作為此種胺，就有機酸胺鹽之穩定性等觀點而言，較佳為使用碳數為3以上且13以下之胺，更佳為使用碳數為4以上且7以下之一級胺。 作為上述芳香族胺，可列舉：苄胺、苯胺、1,3-二苯胍等。該等中，尤佳為苄胺。 作為上述脂肪族胺，可列舉：丙基胺、丁基胺、戊基胺、己基胺、庚基胺、辛基胺、環己基胺、三乙醇胺等。 作為上述包含非解離性鹵化化合物之非解離型活性劑，可列舉藉由共價鍵結而鍵結有鹵素原子之非鹽系有機化合物。作為該鹵化化合物，可為如氯化物、溴化物、氟化物般藉由氯、溴、氟之各單獨元素之共價鍵之化合物，亦可為具有氯、溴及氟之任意2個或全部之各自之共價鍵的化合物。為了提高對於水性溶劑之溶解性，該等化合物例如較佳為如鹵化醇或鹵化羧酸般具有羥基或羧基等極性基。作為鹵化醇，例如可列舉：2,3-二溴丙醇、2,3-二溴丁二醇、反-2,3-二溴-2-丁烯-1,4-二醇、1,4-二溴-2-丁醇、及三溴新戊醇等溴化醇；1,3-二氯-2-丙醇、及1,4-二氯-2-丁醇等氯化醇；3-氟鄰苯二酚等氟化醇；以及類似該等之化合物。作為鹵化羧酸，可列舉：2-碘苯甲酸、3-碘苯甲酸、2-碘丙酸、5-碘水楊酸、及5-碘鄰胺苯甲酸等碘化羧酸；2-氯苯甲酸、及3-氯丙酸等氯化羧酸；2,3-二溴丙酸、2,3-二溴丁二酸、及2-溴苯甲酸等溴化羧酸；以及類似該等之化合物。 作為上述胺系活性劑，可列舉：胺類(乙二胺等聚胺等)、胺鹽類(乙基胺、二乙胺、三羥甲基胺、環己基胺、及二乙胺等胺或胺基醇等之有機酸鹽或無機酸鹽(鹽酸、硫酸、氫溴酸等))、胺基酸類(甘胺酸、丙胺酸、天冬胺酸、麩胺酸、及纈胺酸等)、及醯胺系化合物等。具體而言，可列舉：乙基胺氫溴酸鹽、二苯胍氫溴酸鹽、環己基胺氫溴酸鹽、二乙基胺鹽(鹽酸鹽、丁二酸鹽、己二酸鹽、及癸二酸鹽等)、三乙醇胺、單乙醇胺、及該等胺之氫溴酸鹽等。 作為上述(B)成分之調配量，相對於熱固性助焊劑組合物之固形物成分總量，較佳為1質量%以上且25質量%以下，更佳為2質量%以上且20質量%以下，尤佳為3質量%以上且15質量%以下。若(B)成分之調配量為上述下限以上，則可更確實地防止焊料接合之不良。又，若(B)成分之調配量為上述上限以下，則可確保熱固性助焊劑組合物之絕緣性。 本實施形態之熱固性助焊劑組合物亦可視需要，除上述(A)成分及上述(B)成分以外，進而含有選自由(C)環氧樹脂、(D)硬化劑及(E)觸變劑所組成之群中之至少1種。 [(C)成分] 作為本實施形態中所使用之(C)環氧樹脂，可適當使用公知之環氧樹脂。藉由該(C)成分，可提高硬化物之玻璃轉移點，或提高耐衝擊性。又，藉由該(C)成分，可調整熱固性助焊劑組合物之硬化溫度。 作為此種環氧樹脂，例如可列舉：雙酚A型、雙酚F型、聯苯型、萘型、甲酚酚醛清漆型、酚系酚醛清漆型等環氧樹脂。該等環氧樹脂可單獨使用1種，亦可混合2種以上使用。又，就硬化物之耐衝擊性之觀點而言，該等環氧樹脂較佳為經橡膠改性者。進而，該等環氧樹脂較佳為含有常溫下為液狀者，於使用常溫下為固體者之情形時，較佳為與常溫下為液狀者併用。 又，就提高硬化物之玻璃轉移點並提高耐衝擊性之觀點而言，上述(C)成分更佳為雙酚A型環氧樹脂、萘型環氧樹脂。 於使用上述(C)成分之情形時，其調配量相對於熱固性助焊劑組合物之固形物成分總量，較佳為1質量%以上且30質量%以下，更佳為2質量%以上且25質量%以下，尤佳為3質量%以上且20質量%以下。若(C)成分之調配量為上述範圍內，則不會使熱固性助焊劑組合物之硬化溫度變得過低而可提高熱固性助焊劑組合物之硬化物之強度。 又，就相同之觀點而言，上述(C)成分相對於上述(A)成分之質量比((C)/(A))較佳為1/20以上且1/2以下，更佳為1/15以上且1/3以下，尤佳為1/10以上且1/3以下。 [(D)成分] 作為本實施形態中所使用之(D)硬化劑，可適當使用公知之硬化劑。藉由該(D)成分，可調整熱固性助焊劑組合物之硬化溫度。作為該(D)成分，可列舉：咪唑系硬化劑、三聚氰胺類及雙氰胺類等。該等可單獨使用1種，亦可混合2種以上使用。 作為上述咪唑系硬化劑，可列舉：2-苯基-4-甲基-5-羥甲基咪唑、2-苯基-4,5-二羥甲基咪唑、2,4-二胺基-6-[2'-乙基-4'-甲基咪唑基-(1')]-乙基-對稱三、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-對稱三、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-對稱三異三聚氰酸加成物、1-氰乙基-2-苯基咪唑、1-氰乙基-2-苯基咪唑鎓三酸酯、1-氰乙基-2-十一烷基咪唑、及2,4-二胺基-6-[2'-十一烷基咪唑基-(1')]-乙基-對稱三。其中，較佳為使用2-苯基-4-甲基-5-羥甲基咪唑、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-對稱三異三聚氰酸加成物、及1-氰乙基-2-苯基咪唑鎓偏苯三酸酯等。該等可單獨使用1種，亦可混合2種以上使用。 作為上述咪唑系硬化劑之市售品，可列舉：2P4MHZ、2PHZ-PW、2E4MZ-A、2MZ-A、2MA-OK、2PZ-CN、2PZCNS-PW、C11Z-CN、及C11Z-A(四國化成工業公司製造等，商品名)。 作為上述三聚氰胺類，可列舉：三聚氰胺、乙胍、及苯并胍胺等。 作為上述雙氰胺類，可列舉：雙氰胺、及N苯基雙氰胺等。 於使用上述(D)成分之情形時，其調配量相對於熱固性助焊劑組合物之固形物成分總量，較佳為0.1質量%以上且10質量%以下。更佳為0.2質量%以上且5質量%以下，尤佳為0.5質量%以上且3質量%以下。若(D)成分之調配量為上述下限以上，則可提高熱固性助焊劑組合物之硬化性。另一方面，若(D)成分之調配量為上述上限以下，則可確保熱固性助焊劑組合物之保存穩定性。 [(E)成分] 作為本實施形態中所使用之(E)觸變劑，可列舉：氫化蓖麻油、醯胺類、高嶺土、膠體氧化矽、有機膨潤土、及玻璃料等。該等觸變劑可單獨使用1種，亦可混合2種以上使用。 於使用上述(E)成分之情形時，其調配量相對於熱固性助焊劑組合物之固形物成分總量，較佳為0.1質量%以上且5質量%以下，更佳為0.5質量%以上且2質量%以下。若(E)成分之調配量為上述範圍內，則可將熱固性助焊劑組合物之觸變性調整至較佳之範圍。 [其他成分] 本實施形態之熱固性助焊劑組合物亦可視需要，除上述(A)成分～上述(E)成分以外，還含有界面活性劑、偶合劑、消泡劑、粉末表面處理劑、反應抑制劑、防沈澱劑、及填料等添加劑。作為該等添加劑之調配量，相對於熱固性助焊劑組合物之固形物成分總量，較佳為0.01質量%以上且10質量%以下，更佳為0.05質量%以上且5質量%以下。又，就塗佈性之調整等觀點而言，本實施形態之熱固性助焊劑組合物亦可含有溶劑。於使用溶劑之情形時，其調配量並無特別限制。 [熱固性助焊劑組合物之製造方法] 本實施形態之熱固性助焊劑組合物可藉由將上述(A)成分及上述(B)成分等以上述特定之比率進行調配並進行攪拌混合而製造。 [電子基板之製造方法] 其次，對本實施形態之電子基板之製造方法進行說明。再者，本實施形態之熱固性助焊劑組合物之使用方法並不限於本實施形態之電子基板之製造方法。 本實施形態之電子基板之製造方法係使用上述本實施形態之熱固性助焊劑組合物的方法，該方法包括以下所說明之塗佈步驟、搭載步驟、回焊步驟及熱硬化步驟。 於塗佈步驟中，於配線基板上塗佈上述熱固性助焊劑組合物。 作為配線基板，可列舉：印刷配線基板、設置有配線之矽基板等。 作為塗佈裝置，可列舉：旋轉塗佈機、噴霧塗佈機、棒式塗佈機、敷料器、分注器、及網版印刷機等。再者，於使用旋轉塗佈機、噴霧塗佈機等作為塗佈裝置之情形時，較佳為利用溶劑稀釋熱固性助焊劑組合物後使用。 作為溶劑，可列舉：酮類(甲基乙基酮及環己酮等)、芳香族烴類(甲苯及二甲苯等)、醇類(甲醇、異丙醇及環己醇等)、脂環烴類(環己烷及甲基環己烷等)、石油系溶劑類(石油醚及石腦油等)、溶纖劑類(溶纖劑及丁基溶纖劑等)、卡必醇類(卡必醇及丁基卡必醇等)、以及酯類(例如乙酸乙酯、乙酸丁酯、乙酸溶纖劑、丁基溶纖劑乙酸酯、卡必醇乙酸酯、丁基卡必醇乙酸酯、二乙二醇乙醚乙酸酯、二乙二醇單甲醚乙酸酯、及二乙二醇單乙醚乙酸酯等)等。該等可單獨使用1種，亦可混合2種以上使用。 塗佈膜之厚度(塗佈膜厚)可適當設定。 於搭載步驟中，將具有焊料凸塊之電子零件搭載於上述配線基板之接合用焊墊上。 作為具有焊料凸塊之電子零件，例如可列舉：BGA封裝、及晶方尺寸封裝等。 焊料凸塊包含熔點為200℃以上且240℃以下之焊料合金。再者，焊料凸塊亦可為其表面經焊料合金鍍覆者。作為熔點為200℃以上且240℃以下之焊料合金，可列舉Sn-Ag-Cu系、及Sn-Ag系等焊料合金。 作為搭載步驟中所用之裝置，可適當使用公知之晶片安裝裝置。 又，作為接合用焊墊之材質，可適當使用公知之導電性材料(銅、銀等)。 於回焊步驟中，藉由對搭載有上述電子零件之配線基板進行加熱，而使上述焊料凸塊熔融，從而將上述焊料凸塊接合於上述接合用焊墊。 作為此處所使用之裝置，可適當使用公知之回焊爐。 回焊條件只要視焊料之熔點適當設定即可。例如於使用Sn-Ag-Cu系焊料合金之情形時，只要於溫度150～180℃下進行60～120秒鐘預熱，並將峰值溫度設為220～260℃即可。 於熱硬化步驟中，對上述熱固性助焊劑組合物進行加熱而使之硬化。 作為加熱條件，加熱溫度較佳為150℃以上且220℃以下，更佳為180℃以上且200℃以下。若加熱溫度為上述範圍內，則可使熱固性助焊劑組合物充分地硬化，且對搭載於電子基板之電子零件之不良影響亦較少。 加熱時間較佳為10分鐘以上且3小時以下，更佳為30分鐘以上且90分鐘以下。若加熱時間為上述範圍內，則可使熱固性助焊劑組合物充分地硬化，且對搭載於電子基板之電子零件之不良影響亦較少。 根據如以上之電子基板之製造方法，可藉由熱固性助焊劑組合物之硬化物而補強利用焊料凸塊之接合部。 再者，本實施形態之電子基板之製造方法並不限定於上述實施形態，於本發明中包括於可達成本發明之目的之範圍內之變化、改良等。實施例
繼而，藉由實施例及比較例對本發明進一步詳細地進行說明，但本發明並不受該等例任何限定，再者，將實施例及比較例中所使用之材料示於以下。 ((A1)成分) 二官能氧雜環丁烷化合物A：商品名「ETERNACOLL OXBP」，宇部興產公司製造 二官能氧雜環丁烷化合物B：商品名「ARON OXETANE OXT-121」，東亞合成公司製造 二官能氧雜環丁烷化合物C：商品名「ARON OXETANE OXT-221」，東亞合成公司製造 ((A2)成分) 單官能氧雜環丁烷化合物A：商品名「ETERNACOLL OXMA」，宇部興產公司製造 單官能氧雜環丁烷化合物B：商品名「ARON OXETANE OXT-212」，東亞合成公司製造 ((B1)成分) 活性劑A：己二酸 ((B2)成分) 活性劑B：苄胺己二酸鹽 ((C)成分) 環氧樹脂A：雙酚A型環氧樹脂，商品名「EPICLON EXA-850CRP」，DIC公司製造 環氧樹脂B：萘型環氧樹脂，商品名「EPICLON HP-4032D」，DIC公司製造 ((D)成分) 硬化劑A：2-苯基-4-甲基-5-羥甲基咪唑，商品名「2P4MHZ」，四國化成工業公司製造 硬化劑B：乙胍 硬化劑C：N苯基雙氰胺 ((E)成分) 觸變劑：商品名「GEL ALL D」，新日本理化公司製造 [實施例1] 將二官能氧雜環丁烷化合物A 80質量份、環氧樹脂A 10質量份、活性劑A 5質量份及活性劑B 5質量份投入容器中，利用粉碎混合機進行粉碎混合而使該等分散，從而獲得熱固性助焊劑組合物。 又，相對於所獲得之熱固性助焊劑組合物100質量份，加入溶劑(丙二醇單甲醚乙酸酯)10質量份，而製備旋轉塗佈機用塗佈液。 其次，準備能夠搭載晶片零件之基板，藉由網版印刷法將焊膏(Tamura製作所公司製造，SAC系焊膏)塗佈於該基板之電極上，進行回焊處理，而形成焊料凸塊，其後進行清洗。 然後，使用旋轉塗佈機將旋轉塗佈機用塗佈液塗佈至所獲得之基板上。塗佈膜之塗佈膜厚為30 μm。其次，將晶片零件(1005晶片，焊料合金：Sn-Ag3.0-Cu0.5，焊料之熔點：217℃～220℃)搭載於塗膜形成後之基板之接合用焊墊上，通過回焊爐(Tamura製作所公司製造)以加熱。此處之回焊條件係預熱溫度為150～180℃(60秒鐘)，溫度220℃以上之時間為50秒鐘，峰值溫度為230℃。其後，將回焊後之基板投入加熱爐中，於溫度200℃下實施1小時之加熱處理，而製作冷熱循環試驗用基板。 [實施例2～5及比較例1～3] 依據表1所示之組成調配各材料，除此以外，以與實施例1相同之方式獲得熱固性助焊劑組合物及旋轉塗佈機用塗佈液。 再者，關於實施例5，依據表1所示之組成調配各材料，除此以外，以與實施例1相同之方式製作冷熱循環試驗用基板。 ＜熱固性助焊劑組合物之評價＞ 藉由如以下之方法進行熱固性助焊劑組合物之評價(熱固性助焊劑組合物於200℃及250℃下之黏度、焊料組合物於200℃及250℃下之黏度、焊料熔融性、絕緣性、冷熱循環試驗)。將所獲得之結果示於表1。 (1)熱固性助焊劑組合物之黏度 使用流變計(HAAKE公司製造，商品名「MARS-III」)，一面以5℃/min之升溫速度自溫度25℃升溫至焊料之熔點，一面測定熱固性助焊劑組合物之黏度。自所獲得之結果求出(i)溫度200℃下之黏度、及(ii)溫度250℃下之黏度。然後，對於黏度，依據下述基準進行劃分。 A：黏度為5 Pa・s以下。 B：黏度超過5 Pa・s且未達50 Pa・s。 C：黏度為50 Pa・s以上。 (2)焊料組合物之黏度 將熱固性助焊劑組合物50質量%、與焊料粉末(焊料合金：Sn-Ag3.0-Cu0.5，平均粒徑：20 μm，粒徑分佈：10～40 μm)50質量%進行混合，而獲得焊料組合物。藉由與上述(1)熱固性助焊劑組合物之黏度相同之方法對所獲得之焊料組合物於200℃及250℃下之黏度進行測定。然後，對於黏度，依據下述基準進行劃分。 A：黏度為5 Pa・s以下。 B：黏度超過5 Pa・s且未達50 Pa・s。 C：黏度為50 Pa・s以上。 (3)焊料熔融性 將熱固性助焊劑組合物50質量%、與焊料粉末(焊料合金：Sn-Ag3.0-Cu0.5，平均粒徑：20 μm，粒徑分佈：10～40 μm)50質量%進行混合，而獲得焊料組合物。藉由網版印刷法將所獲得之焊料組合物於基板(表面之材質：銅)上形成為直徑1 cm、厚度50 μm之塗膜，於設定為溫度250℃之加熱板上加熱30秒鐘。然後，利用目視觀察焊料之熔融狀態，依據下述基準評價焊料熔融性。 A：焊料已熔融。 B：焊料未熔融。 (4)絕緣性 將熱固性助焊劑組合物50質量%、與焊料粉末(焊料合金：Sn-Ag3.0-Cu0.5，平均粒徑：20 μm，粒徑分佈：10～40 μm)50質量%進行混合，而獲得焊料組合物。 對於所獲得之焊料組合物，依據JIS Z3284-1及JIS Z3197之8.5.3中所記載之絕緣電阻試驗測定絕緣電阻值。即，於梳狀電極基板(導體寬度：0.318 mm，導體間隔：0.318 mm，大小：30 mm×30 mm)上使用金屬遮罩(與梳狀電極圖案匹配並加工成狹縫狀者，厚度：100 μm)印刷焊料組合物。其後，於將預熱150℃設為60秒鐘，將溫度250℃下之熔融時間設為30秒鐘之條件下進行回焊，而製作試驗基板。將該試驗基板投入設定為溫度85℃、相對濕度95%之高溫高濕試驗機中，測定500小時後之絕緣電阻值。然後，依據下述基準評價絕緣性。 A：絕緣電阻值為1.0×109
以上。 B：絕緣電阻值未達1.0×109
。 (5)冷熱循環試驗 將冷熱循環試驗用基板投入冷熱循環試驗機中，進行如下冷熱循環試驗(依據車輛用焊膏之冷熱循環試驗)，即以於在溫度-40℃下放置10分鐘後在溫度125℃下放置10分鐘作為1個循環，將其反覆進行2000個循環。利用顯微鏡觀察冷熱循環試驗後之基板，確認晶片零件中有無焊料龜裂，依據下述基準評價對冷熱循環試驗之耐受性。 A：產生焊料龜裂之部位未達50%。 B：產生焊料龜裂之部位為50%以上且未達90%。 C：產生焊料龜裂之部位為90%以上。 [表1]
自表1所示之結果可明確地確認到如下情況：於使用本發明之熱固性助焊劑組合物之情形時(實施例1～5)，焊料熔融性及絕緣性良好。又，確認到由於焊料熔融性良好，故而回焊中之焊接性及自動校準性優異。 相對於此，可知於使用不含有(A1)成分或(B1)成分之熱固性助焊劑組合物之情形時(比較例1～3)，焊料熔融性及絕緣性之至少一者不充分。[Thermosetting Flux Composition] First, the thermosetting flux composition of the present embodiment will be described. The thermosetting flux composition according to this embodiment is used when an electronic component having solder bumps is bonded to an electronic substrate by reflow soldering, and has (A) an oxetane compound and (B) Organic acids. Regarding the thermosetting flux composition of this embodiment, when the temperature is raised from a temperature of 25 ° C at a temperature increase rate of 5 ° C / min, the viscosity at a temperature of 200 ° C is 5 Pa · s or less, and at a temperature of 250 ° C. Its viscosity is 50 Pa · s or more. When the viscosity at a temperature of 200 ° C exceeds 5 Pa · s, the hardening of the thermosetting flux composition proceeds excessively, and the flowability of the molten solder is hindered, so the solderability or automatic alignment during reflow is reduced. On the other hand, when the viscosity at a temperature of 250 ° C. is less than 50 Pa · s, the curability of the thermosetting flux composition is insufficient, and therefore the insulation of the cured product becomes insufficient. Here, the viscosity can be measured by a rheometer. Specifically, the viscosity can be measured using a rheometer (manufactured by HAAKE, trade name "MARS-III") under specific conditions. In addition, a solder powder containing a solder alloy containing 96.5 mass% of tin, 3.0 mass% of silver, and 0.5 mass% of copper and having an average particle diameter of 30 μm was produced in such a manner that the mass ratio of the solder powder to the thermosetting flux composition was 1: 1. When the solder composition obtained by mixing is heated from a temperature of 25 ° C at a temperature increase rate of 5 ° C / min, the viscosity at a temperature of 200 ° C is preferably 5 Pa · s or less, and the temperature is 250. The viscosity at ℃ is 50 Pa · s or more. When such a condition is satisfied, it is possible to more surely achieve the balance between the insulation properties of the hardened material, the weldability during reflow, and the automatic alignment. When reflow soldering is performed using a thermosetting flux composition, the thermosetting flux composition is in contact with the solder. In addition, the solder also functions as a thermosetting catalyst for a thermosetting flux composition. Therefore, based on the viscosity change of the solder composition obtained by mixing the thermosetting flux composition with the solder powder, the hardening temperature of the thermosetting flux composition when reflow soldering can be more accurately defined. In addition, as a method of adjusting the viscosity of the thermosetting flux composition and the solder composition at 200 ° C and 250 ° C to the above-mentioned range, the following method can be cited. The viscosity of the thermosetting flux composition and the solder composition at 200 ° C and 250 ° C can be changed by changing the types of oxetane compounds and organic acids, or by using oxetane compounds and epoxy resins in combination, or by using Hardener is adjusted. [Component (A)] As the (A) oxetane compound used in this embodiment, a known oxetane compound can be appropriately used. The component (A) must contain (A1) a bifunctional oxetane compound having two oxetane rings in one molecule. The (A) component may also contain (A2) a monofunctional oxetane compound having one oxetane ring in one molecule. By containing this (A2) component, the hardening temperature of a thermosetting flux composition can be raised, and the hardening temperature of a thermosetting flux composition can be adjusted. Examples of the component (A1) include xylylenedioxetane ("OXT-121" manufactured by Toa Synthesis Corporation), 3-ethyl-3 {[(3-ethyloxetane Alk-3-yl) methoxy] methyl} oxetane ("OXT-221" manufactured by Toa Kosei Co., Ltd.), and a bifunctional oxetane compound having a biphenyl skeleton (Ube Kosan Co., Ltd. "ETERNACOLL OXBP"), etc. Examples of the component (A2) include 3-ethyl-3-hydroxymethyloxetane ("OXT-101" manufactured by Toa Synthesis Corporation), and 2-ethylhexyloxetane (East Asia) "OXT-212" manufactured by Kasei Corporation), and 3-ethyl-3- (methacryloxy) methyloxetane ("ETERNACOLL OXMA" manufactured by Ube Kosan Co., Ltd.) and the like. When the (A1) component and the (A2) component are used in combination, the mass ratio ((A1) / (A2)) of the (A1) component to the (A2) component is preferably 1 or more and 50 or less, It is more preferably 3/2 or more and 30 or less, and even more preferably 2 or more and 20 or less. When the mass ratio is within the above range, the hardening temperature of the thermosetting flux composition can be adjusted while maintaining the insulation of the hardened material of the thermosetting flux composition. The blending amount of the component (A) is preferably 40% by mass or more and 95% by mass or less, more preferably 60% by mass or more and 92% by mass or less, more preferably, based on the total solid content of the thermosetting flux composition. It is 70 mass% or more and 90 mass% or less. When the compounding amount of the component (A) is within the above range, sufficient hardenability can be ensured, and solder bonding between the electronic component and the electronic substrate can be sufficiently strengthened. [(B) Component] The active agent (B) used in this embodiment includes organic acids, organic acid amine salts, non-dissociative active agents containing non-dissociable halogenated compounds, and amine-based active agents. These active agents may be used singly or in combination of two or more kinds. The (B) component must contain (B1) an organic acid. In the reflow step, since the hardening reaction of the organic acid and the oxetane compound does not proceed sufficiently, the hardening temperature of the thermosetting flux composition can be adjusted to a better range. As said (B1) component, other organic acids other than a monocarboxylic acid, a dicarboxylic acid, etc. are mentioned. These can be used alone or in combination of two or more. Examples of the monocarboxylic acid include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, heptanoic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, pearlic acid, hard Fatty acid, tuberculostearic acid, arachidic acid, behenic acid, behenic acid, and glycolic acid. Examples of the dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, Tartaric acid and diethylene glycol. Among these, glutaric acid, adipic acid, pimelic acid, and suberic acid are preferred from the viewpoint of the physical properties of the cured product of the thermosetting flux composition. Examples of other organic acids include dimer acid, acetopropionic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, fennelic acid, citric acid, and picolinic acid. The blending amount of the component (B1) is preferably 1% by mass or more and 15% by mass or less, more preferably 2% by mass or more and 12% by mass or less with respect to the total solid content of the thermosetting flux composition. Especially preferably, it is 3 mass% or more and 10 mass% or less. If the blending amount of the component (B1) is equal to or more than the above-mentioned lower limit, it is possible to more surely prevent defective solder joints. Moreover, if the compounding quantity of (B1) component is below the said upper limit, the insulation property of a thermosetting flux composition can be ensured. The said (B) component may contain the active agent ((B2) component) other than the said (B1) component as needed. Examples of the component (B2) include organic acid amine salts, non-dissociative active agents containing non-dissociable halogenated compounds, and amine-based active agents. The organic acid amine salt is an amine salt of the component (B1). As said amine, a well-known amine can be used suitably. Such an amine may be an aromatic amine or an aliphatic amine. These can be used alone or in combination of two or more. As such an amine, from the viewpoint of stability of an organic acid amine salt, it is preferable to use an amine having a carbon number of 3 or more and 13 or less, and it is more preferable to use a primary amine having a carbon number of 4 or more and 7 or less. Examples of the aromatic amine include benzylamine, aniline, and 1,3-diphenylguanidine. Among these, benzylamine is particularly preferred. Examples of the aliphatic amine include propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, cyclohexylamine, and triethanolamine. Examples of the non-dissociative active agent containing the non-dissociable halogenated compound include a non-salt-based organic compound having a halogen atom bonded by covalent bonding. The halogenated compound may be a compound having a covalent bond of each of the individual elements of chlorine, bromine, and fluorine, such as chloride, bromide, and fluoride, and may have any two or all of chlorine, bromine, and fluorine. The respective covalently bonded compounds. In order to improve the solubility in an aqueous solvent, these compounds preferably have a polar group such as a hydroxyl group or a carboxyl group, such as a halogenated alcohol or a halogenated carboxylic acid. Examples of the halogenated alcohol include 2,3-dibromopropanol, 2,3-dibromobutanediol, trans-2,3-dibromo-2-butene-1,4-diol, 1, Brominated alcohols such as 4-dibromo-2-butanol and tribromoneopentyl alcohol; chlorinated alcohols such as 1,3-dichloro-2-propanol and 1,4-dichloro-2-butanol; Fluorinated alcohols such as 3-fluorocatechol; and compounds similar to these. Examples of halogenated carboxylic acids include 2-iodobenzoic acid, 3-iodobenzoic acid, 2-iodopropionic acid, 5-iodosalicylic acid, and 5-iodoanthranilic acid; 2-chloro Chlorinated carboxylic acids such as benzoic acid and 3-chloropropionic acid; brominated carboxylic acids such as 2,3-dibromopropionic acid, 2,3-dibromosuccinic acid, and 2-bromobenzoic acid; and the like Of compounds. Examples of the amine-based active agent include amines (polyamines such as ethylenediamine), amine salts (ethylamine, diethylamine, trimethylolamine, cyclohexylamine, and amines such as diethylamine). Or organic acid salts or inorganic acid salts (such as hydrochloric acid, sulfuric acid, hydrobromic acid, etc.) of amino alcohols, amino acids (glycine, alanine, aspartic acid, glutamic acid, valamic acid, etc.) ), And amidine compounds. Specific examples include ethylamine hydrobromide, diphenylguanidine hydrobromide, cyclohexylamine hydrobromide, and diethylamine salts (hydrochloride, succinate, and adipate). , And sebacates, etc.), triethanolamine, monoethanolamine, and hydrobromides of these amines. The blending amount of the component (B) is preferably 1% by mass or more and 25% by mass or less, and more preferably 2% by mass or more and 20% by mass or less with respect to the total solid content of the thermosetting flux composition. It is particularly preferably 3% by mass or more and 15% by mass or less. When the blending amount of the component (B) is equal to or more than the above-mentioned lower limit, it is possible to more surely prevent defective solder joints. Moreover, if the compounding quantity of (B) component is below the said upper limit, the insulation property of a thermosetting flux composition can be ensured. The thermosetting flux composition according to this embodiment may optionally contain, in addition to the component (A) and the component (B), a component selected from the group consisting of (C) epoxy resin, (D) hardener, and (E) thixotropic agent. At least one of the groups formed. [(C) component] As the (C) epoxy resin used in this embodiment, a known epoxy resin can be appropriately used. By this (C) component, the glass transition point of hardened | cured material can be improved, or impact resistance can be improved. Moreover, by this (C) component, the hardening temperature of a thermosetting flux composition can be adjusted. Examples of such epoxy resins include epoxy resins such as bisphenol A type, bisphenol F type, biphenyl type, naphthalene type, cresol novolac type, and phenol novolac type. These epoxy resins may be used alone or in combination of two or more. From the viewpoint of impact resistance of the cured product, these epoxy resins are preferably those modified with rubber. Further, these epoxy resins preferably contain those which are liquid at normal temperature, and when using those which are solid at normal temperature, they are preferably used in combination with those which are liquid at normal temperature. From the viewpoint of increasing the glass transition point of the cured product and improving the impact resistance, the (C) component is more preferably a bisphenol A-type epoxy resin or a naphthalene-type epoxy resin. In the case of using the component (C), the blending amount is preferably 1% by mass or more and 30% by mass or less, more preferably 2% by mass or more and 25% by weight relative to the total solid content of the thermosetting flux composition. Mass% or less, particularly preferably 3 mass% or more and 20 mass% or less. If the compounding amount of (C) component is in the said range, the hardening temperature of a thermosetting flux composition will not become too low, and the intensity | strength of the hardened | cured material of a thermosetting flux composition can be improved. From the same viewpoint, the mass ratio ((C) / (A)) of the (C) component to the (A) component is preferably 1/20 or more and 1/2 or less, more preferably 1 / 15 or more and 1/3 or less, particularly preferably 1/10 or more and 1/3 or less. [Component (D)] As the (D) curing agent used in this embodiment, a known curing agent can be appropriately used. By this (D) component, the hardening temperature of a thermosetting flux composition can be adjusted. Examples of the (D) component include imidazole-based hardeners, melamines, and dicyandiamides. These can be used alone or in combination of two or more. Examples of the imidazole-based hardener include 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dimethylol imidazole, and 2,4-diamino- 6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-symmetric tris, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-Ethyl-symmetric tris, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-symmetric triisocyanuric acid adduct, 1 -Cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium triester, 1-cyanoethyl-2-undecylimidazole, and 2,4-diamino- 6- [2'-undecylimidazolyl- (1 ')]-ethyl-symmetric tris. Among these, 2-phenyl-4-methyl-5-hydroxymethylimidazole and 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl are preferably used. -Symmetrical triisotricyanic acid adducts, 1-cyanoethyl-2-phenylimidazolium trimellitate, and the like. These can be used alone or in combination of two or more. As commercially available products of the aforementioned imidazole-based hardeners, 2P4MHZ, 2PHZ-PW, 2E4MZ-A, 2MZ-A, 2MA-OK, 2PZ-CN, 2PZCNS-PW, C11Z-CN, and C11Z-A (four (Manufactured by Kokusei Kagaku Kogyo, etc., trade name). Examples of the melamines include melamine, ethylguanidine, and benzoguanamine. Examples of the dicyandiamides include dicyandiamide and Nphenyldicyandiamide. When using the said (D) component, it is preferable that the compounding quantity is 0.1 mass% or more and 10 mass% or less with respect to the total solid content component of a thermosetting flux composition. It is more preferably 0.2% by mass or more and 5% by mass or less, and particularly preferably 0.5% by mass or more and 3% by mass or less. When the compounding quantity of (D) component is more than the said minimum, the hardenability of a thermosetting flux composition can be improved. On the other hand, if the compounding amount of the (D) component is equal to or less than the above upper limit, the storage stability of the thermosetting flux composition can be ensured. [(E) component] Examples of the (E) thixotropic agent used in this embodiment include hydrogenated castor oil, ammonium, kaolin, colloidal silica, organic bentonite, and glass frit. These thixotropic agents can be used alone or in combination of two or more. In the case of using the component (E), the blending amount is preferably 0.1% by mass or more and 5% by mass or less, more preferably 0.5% by mass or more and 2% by weight of the total solid content of the thermosetting flux composition. Mass% or less. When the compounding amount of the (E) component is within the above range, the thixotropy of the thermosetting flux composition can be adjusted to a preferable range. [Other components] The thermosetting flux composition of this embodiment may contain a surfactant, a coupling agent, a defoaming agent, a powder surface treatment agent, and a reaction in addition to the components (A) to (E) as required. Additives such as inhibitors, anti-settling agents, and fillers. The blending amount of these additives is preferably 0.01 mass% or more and 10 mass% or less, and more preferably 0.05 mass% or more and 5 mass% or less with respect to the total solid content of the thermosetting flux composition. Moreover, the thermosetting flux composition of this embodiment may contain a solvent from a viewpoint of adjustment of coating property, and the like. When a solvent is used, the amount of the solvent to be blended is not particularly limited. [Manufacturing method of thermosetting flux composition] The thermosetting flux composition of the present embodiment can be produced by blending the component (A) and the component (B) at a specific ratio as described above, and mixing the components. [Manufacturing method of electronic substrate] Next, a manufacturing method of the electronic substrate of this embodiment will be described. Furthermore, the method of using the thermosetting flux composition of this embodiment is not limited to the method of manufacturing the electronic substrate of this embodiment. The method for manufacturing an electronic substrate according to this embodiment is a method using the above-mentioned thermosetting flux composition according to this embodiment, and the method includes a coating step, a mounting step, a reflow step, and a thermosetting step described below. In the coating step, the above-mentioned thermosetting flux composition is coated on a wiring substrate. Examples of the wiring substrate include a printed wiring substrate, a silicon substrate provided with wiring, and the like. Examples of the coating device include a spin coater, a spray coater, a bar coater, an applicator, a dispenser, and a screen printer. When a spin coater, spray coater, or the like is used as the coating device, it is preferred to use the solvent after diluting the thermosetting flux composition with a solvent. Examples of the solvent include ketones (such as methyl ethyl ketone and cyclohexanone), aromatic hydrocarbons (such as toluene and xylene), alcohols (such as methanol, isopropanol, and cyclohexanol), and alicyclics. Hydrocarbons (cyclohexane, methylcyclohexane, etc.), petroleum solvents (petroleum ether, naphtha, etc.), cellosolves (cellosolve and butyl cellosolve, etc.), carbitol (card And butyl carbitol, etc.), and esters (such as ethyl acetate, butyl acetate, acetic acid cellosolve, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate) Esters, diethylene glycol ether acetate, diethylene glycol monomethyl ether acetate, and diethylene glycol monoethyl ether acetate, etc.). These can be used alone or in combination of two or more. The thickness of the coating film (coating film thickness) can be appropriately set. In the mounting step, an electronic component having a solder bump is mounted on the bonding pad of the wiring substrate. Examples of electronic components having solder bumps include a BGA package and a cube-size package. The solder bump includes a solder alloy having a melting point of 200 ° C. or higher and 240 ° C. or lower. Furthermore, the solder bump may also be one whose surface is coated with a solder alloy. Examples of the solder alloy having a melting point of 200 ° C. or higher and 240 ° C. or lower include solder alloys such as Sn-Ag-Cu-based and Sn-Ag-based solder alloys. As a device used in the mounting step, a known wafer mounting device can be appropriately used. As a material of the bonding pad, a known conductive material (copper, silver, etc.) can be appropriately used. In the reflow step, the solder bump is melted by heating the wiring board on which the electronic component is mounted, thereby bonding the solder bump to the bonding pad. As the device used here, a known reflow furnace can be appropriately used. The reflow conditions need only be set appropriately depending on the melting point of the solder. For example, when a Sn-Ag-Cu based solder alloy is used, it is only necessary to perform preheating at a temperature of 150 to 180 ° C for 60 to 120 seconds and set the peak temperature to 220 to 260 ° C. In the thermosetting step, the above-mentioned thermosetting flux composition is heated to harden it. As heating conditions, the heating temperature is preferably 150 ° C or higher and 220 ° C or lower, and more preferably 180 ° C or higher and 200 ° C or lower. When the heating temperature is within the above range, the thermosetting flux composition can be sufficiently hardened, and the adverse effects on the electronic components mounted on the electronic substrate are also small. The heating time is preferably 10 minutes or more and 3 hours or less, and more preferably 30 minutes or more and 90 minutes or less. When the heating time is within the above range, the thermosetting flux composition can be sufficiently hardened, and the adverse effects on the electronic components mounted on the electronic substrate are also small. According to the method for manufacturing an electronic substrate as described above, the joint portion using the solder bump can be reinforced by the hardened material of the thermosetting flux composition. In addition, the manufacturing method of the electronic substrate of this embodiment is not limited to the above-mentioned embodiment, and the invention includes changes, improvements, and the like within a range that can achieve the purpose of the invention. EXAMPLES Next, the present invention will be described in more detail with reference to examples and comparative examples. However, the present invention is not limited to these examples. The materials used in the examples and comparative examples are shown below. ((A1) component) Bifunctional oxetane compound A: Trade name "ETERNACOLL OXBP", manufactured by Ube Industries Ltd. Bifunctional oxetane compound B: Trade name "ARON OXETANE OXT-121", East Asia Synthetic Bifunctional oxetane compound C manufactured by the company: Trade name "ARON OXETANE OXT-221", manufactured by Toa Kosei (component (A2)) Monofunctional oxetane compound A: trade name "ETERNACOLL OXMA", Ube Monofunctional oxetane compound B manufactured by Hingsan Co., Ltd .: Trade name "ARON OXETANE OXT-212", manufactured by Toa Kosei Corporation ((B1) component) Active agent A: Adipic acid ((B2) component) Active agent B : Benzylamine adipate (component (C)) epoxy resin A: bisphenol A type epoxy resin, trade name "EPICLON EXA-850CRP", epoxy resin manufactured by DIC Corporation B: naphthalene type epoxy resin, product Name "EPICLON HP-4032D", manufactured by DIC (component (D)) Hardener A: 2-phenyl-4-methyl-5-hydroxymethylimidazole, trade name "2P4MHZ", manufactured by Shikoku Chemical Industry Co., Ltd. Hardener B: Ethylguanidine Hardener C: N-phenyldicyandiamide (component (E)) Thixotropic agent: Trade name "GEL ALL D", new Manufactured by Honki Chemical Co., Ltd. [Example 1] 80 parts by mass of difunctional oxetane compound A, 10 parts by mass of epoxy resin A, 5 parts by mass of active agent A, and 5 parts by mass of active agent B were put into a container, and crushed A mixer performs pulverization and mixing to disperse these, thereby obtaining a thermosetting flux composition. In addition, 10 parts by mass of a solvent (propylene glycol monomethyl ether acetate) was added to 100 parts by mass of the obtained thermosetting flux composition to prepare a coating liquid for a spin coater. Next, a substrate capable of mounting wafer components is prepared, and a solder paste (manufactured by Tamura Manufacturing Co., Ltd., SAC-based solder paste) is applied to the electrodes of the substrate by screen printing to form a solder bump to form solder bumps. Thereafter, washing is performed. Then, the coating liquid for a spin coater was applied onto the obtained substrate using a spin coater. The coating film thickness of the coating film was 30 μm. Next, the wafer component (1005 wafer, solder alloy: Sn-Ag3.0-Cu0.5, solder melting point: 217 ° C to 220 ° C) was mounted on a bonding pad for bonding a substrate after the coating film was formed, and passed through a reflow furnace (Manufactured by Tamura Seisakusho). The reflow conditions here are a preheating temperature of 150 to 180 ° C (60 seconds), a temperature of 220 ° C or higher for 50 seconds, and a peak temperature of 230 ° C. Thereafter, the substrate after reflow was put into a heating furnace, and a heating treatment was performed at a temperature of 200 ° C. for 1 hour to prepare a substrate for a cold-heat cycle test. [Examples 2 to 5 and Comparative Examples 1 to 3] Except that each material was prepared according to the composition shown in Table 1, a thermosetting flux composition and a coating for a spin coater were obtained in the same manner as in Example 1. liquid. In addition, about Example 5, except having prepared each material according to the composition shown in Table 1, it carried out similarly to Example 1, and produced the board | substrate for a cold-heat cycle test. <Evaluation of the thermosetting flux composition> The evaluation of the thermosetting flux composition was performed by the following method (the viscosity of the thermosetting flux composition at 200 ° C and 250 ° C, the solder composition at 200 ° C and 250 ° C Viscosity, solder melting, insulation, cold and heat cycle test). The obtained results are shown in Table 1. (1) The viscosity of the thermosetting flux composition is measured by using a rheometer (made by HAAKE Co., Ltd., "MARS-III") while increasing the temperature from 25 ° C to the melting point of the solder at a temperature rise rate of 5 ° C / min. Viscosity of the flux composition. From the obtained results, (i) a viscosity at a temperature of 200 ° C and (ii) a viscosity at a temperature of 250 ° C. Then, the viscosity is classified according to the following criteria. A: The viscosity is 5 Pa · s or less. B: The viscosity exceeds 5 Pa · s and less than 50 Pa · s. C: The viscosity is 50 Pa · s or more. (2) Viscosity of solder composition 50% by mass of thermosetting flux composition and solder powder (solder alloy: Sn-Ag3.0-Cu0.5, average particle size: 20 μm, particle size distribution: 10 to 40 μm ) 50% by mass was mixed to obtain a solder composition. The viscosity of the obtained solder composition at 200 ° C and 250 ° C was measured by the same method as the viscosity of the above-mentioned (1) thermosetting flux composition. Then, the viscosity is classified according to the following criteria. A: The viscosity is 5 Pa · s or less. B: The viscosity exceeds 5 Pa · s and less than 50 Pa · s. C: The viscosity is 50 Pa · s or more. (3) Solder melting property 50% by mass of the thermosetting flux composition and solder powder (solder alloy: Sn-Ag3.0-Cu0.5, average particle diameter: 20 μm, particle size distribution: 10 to 40 μm) 50 The mass% was mixed to obtain a solder composition. The obtained solder composition was formed on a substrate (surface material: copper) into a coating film having a diameter of 1 cm and a thickness of 50 μm by a screen printing method, and heated on a heating plate set to a temperature of 250 ° C. for 30 seconds. . Then, the molten state of the solder was visually observed, and the solder meltability was evaluated according to the following criteria. A: The solder is melted. B: The solder is not melted. (4) Insulation 50% by mass of the thermosetting flux composition and 50% by mass of the solder powder (solder alloy: Sn-Ag3.0-Cu0.5, average particle diameter: 20 μm, particle size distribution: 10-40 μm) % Was mixed to obtain a solder composition. About the obtained solder composition, the insulation resistance value was measured based on the insulation resistance test described in JIS Z3284-1 and 8.5.3 of JIS Z3197. That is, a metal mask (one that matches the comb electrode pattern and is processed into a slit shape) is used on a comb-shaped electrode substrate (conductor width: 0.318 mm, conductor spacing: 0.318 mm, size: 30 mm × 30 mm), thickness: 100 μm) printed solder composition. Thereafter, reflow was performed under the conditions of preheating 150 ° C. for 60 seconds and a melting time at 250 ° C. for 30 seconds to produce a test substrate. This test substrate was put into a high-temperature and high-humidity testing machine set to a temperature of 85 ° C and a relative humidity of 95%, and the insulation resistance value after 500 hours was measured. Then, the insulation was evaluated according to the following criteria. A: The insulation resistance value is 1.0 × 10 9 or more. B: The insulation resistance value does not reach 1.0 × 10 9 . (5) Cold and hot cycle test Put the substrate for cold and hot cycle test into the cold and hot cycle tester, and perform the following cold and hot cycle test (based on the cold and hot cycle test of vehicle solder paste). It was left at the temperature of 125 ° C for 10 minutes as one cycle, and this was repeated for 2000 cycles. The substrate after the cold and heat cycle test was observed with a microscope to confirm the presence or absence of solder cracks in the wafer part, and the resistance to the cold and heat cycle test was evaluated according to the following criteria. A: The portion where solder cracks occur is less than 50%. B: 50% or more and less than 90% of the solder crack occurred. C: 90% or more of the locations where solder cracks occur. [Table 1] From the results shown in Table 1, it is clearly confirmed that when the thermosetting flux composition of the present invention is used (Examples 1 to 5), the solder has good meltability and insulation. In addition, it was confirmed that the solder has good meltability, and therefore excellent solderability and automatic alignment during reflow. In contrast, when using a thermosetting flux composition containing no (A1) component or (B1) component (Comparative Examples 1 to 3), it was found that at least one of solder melting property and insulation property was insufficient.