TW201829073A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The purpose of the present invention is to improve the thickness uniformity of a film of a chemical liquid supplied to a central region of a substrate while supplying the chemical liquid to the entire region of the top surface of the substrate. In order to achieve said purpose, the ejection direction when a first nozzle ejects a chemical liquid is set in a direction having: a component oriented upstream along a tangential direction at a first liquid-landing position; and a component oriented toward a rotation axis from the first liquid-landing position along a radial direction of the substrate, wherein the radial direction is perpendicular to the tangent. The tangential velocity component of the chemical liquid ejection velocity through the first nozzle has a magnitude that allows said chemical liquid to overcome the force oriented downstream and flow upstream, and the radial velocity component of the ejection velocity has a magnitude that allows said chemical liquid to overcome the centrifugal force and flow toward the rotation axis side. The ejection direction when a second nozzle ejects a chemical liquid is set in a direction having a component which is oriented downstream along a tangential direction at a second liquid-landing position when viewed from above the second nozzle.

Description

   Substrate processing device and substrate processing method   

The present invention relates to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, and a substrate for a solar cell. (Hereinafter referred to as "substrate") substrate processing technology for performing processing.

Patent Document 1 discloses a cleaning device for cleaning a substrate. The cleaning device includes a first nozzle and a second nozzle that eject cleaning liquid from the upper side of the substrate to the upper surface of the substrate that is rotating forward. The first nozzle sprays the first cleaning liquid in a liquid column shape by spraying a liquid contact position closer to the first nozzle side than the center of the substrate when the substrate is obliquely downward when passing through the center of the substrate when the substrate is viewed from above. The centrifugal force is weak near the center of the substrate. Therefore, the first cleaning liquid follows a straight line on the substrate that overlaps with the ejection direction when the substrate is viewed from above, flows from the liquid contact position toward the center of the substrate and passes over the center of the substrate, and then reaches the liquid column shape while maintaining the shape Over the center of the substrate. The centrifugal force on the peripheral edge of the substrate is strong. Therefore, the first cleaning liquid that has passed the center of the substrate expands into a liquid film shape, and flows toward the peripheral edge of the substrate while bending toward the downstream side of the substrate in the rotation direction.

A liquid column-shaped second cleaning liquid sprayed from the outside of the substrate by the second nozzle passes above the center of the substrate, and contacts the liquid column and the liquid film of the first cleaning liquid on the substrate without touching the position. The liquid contact position of the second cleaning liquid is closer to the downstream side of the substrate in the rotation direction than the liquid contact position of the first cleaning liquid, and it is farther from the center of the substrate than the liquid contact position of the first cleaning liquid, and the strong centrifugal force works. position. The second cleaning liquid after contact is expanded into a liquid film shape by the influence of centrifugal force, and does not hinder the flow of the first cleaning liquid on the substrate, and flows toward the peripheral edge of the substrate while bending toward the downstream side in the rotation direction of the substrate.

The cleaning device of Patent Document 1 has the above-described configuration to clean the central portion of the substrate with the first cleaning liquid, and to clean the peripheral portion of the substrate that is further outside than the central portion with the second cleaning liquid. In addition, this cleaning device also improves the degree of cleaning by preventing the first cleaning liquid and the second cleaning liquid from interfering with each other on the substrate.

[Prior technical literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2015-201627.

In the cleaning device of Patent Document 1, it is necessary to prevent the second cleaning liquid ejected from the second nozzle from interfering with the flow of the first cleaning liquid on the substrate. Therefore, the liquid column-shaped second cleaning liquid sprayed from the second nozzle must cross the liquid column-shaped portion of the first processing liquid flowing on the substrate obliquely downward from above and outside the substrate to reach the center of the substrate. And the liquid contact position on the opposite side to the second nozzle. On the other hand, if the liquid contact position of the second cleaning liquid is too far from the center of the substrate, the range in which the second cleaning liquid can be used for cleaning becomes narrower. Therefore, the second cleaning liquid must accurately reach the liquid contact position which is set to a position where the distance from the center of the substrate becomes a quarter or less of the radius of the substrate. In addition, the first cleaning liquid must also be accurately ejected to a liquid contact position further inside than the liquid contact position of the second cleaning liquid in a way that it does not contact the second cleaning liquid. Therefore, the respective flow rates (respective flow rates) of the first cleaning liquid sprayed from the first nozzle and the second cleaning liquid sprayed from the second nozzle must be set strictly according to the diameter of each spray outlet and the like.

Here, in the case of using a chemical solution such as an etching solution for surface treatment of a substrate, the reactivity of the chemical solution varies depending on the temperature, and therefore, the processing rate of each portion of the substrate surface varies depending on the temperature distribution of the substrate surface. Therefore, by supplying a chemical solution heated in advance to a predetermined temperature to the entire area of the substrate, substrate processing is performed while controlling so that the temperature distribution of the entire area of the substrate surface becomes a desired temperature distribution.

However, in the cleaning device of Patent Document 1, in the case where the respective flow rates of the first cleaning liquid and the second cleaning liquid slightly deviate from the required values, the first cleaning liquid collides with the second cleaning liquid on the substrate, and the directions of the respective cleaning liquids flow. There is a change so that the cleaning liquid cannot be supplied to the center of the substrate. That is, in the device of Patent Document 1, when the respective flow rates of the respective chemical liquids ejected from the first nozzle and the second nozzle are not strictly controlled, the chemical liquid cannot be supplied to the entire area of the upper surface of the substrate. A problem or a problem that the uniformity of the chemical solution supplied to the central region of the substrate is deteriorated.

The present invention is made to solve such a problem, and an object of the present invention is to provide a substrate processing apparatus capable of processing a substrate by spraying a chemical solution on the surface of a rotating substrate, while supplying the chemical solution to the entire area of the upper surface of the substrate. A technology for improving the uniformity of the film thickness of the chemical solution supplied to the center region of the substrate.

In order to solve the above problems, the substrate processing apparatus of the first aspect includes a holding member capable of rotating the substrate while holding the substrate in a substantially horizontal posture, a rotating mechanism that rotates the holding member around a rotation axis, and a first nozzle. Spraying the chemical liquid above the substrate so that the chemical liquid sprays the first liquid contact position in the intermediate area between the central area and the peripheral area in the rotation track of the substrate; and the second nozzle The substrate is ejected further above the substrate so that the solution sprays the second liquid contact position in the intermediate region; and when viewed from above the first nozzle in the direction of the rotation axis of the substrate, the first The ejection direction when the nozzle ejects the chemical solution is a direction containing the following components: along a tangential direction of the circle passing through the first liquid contact position centered on the rotation axis and passing through the first liquid contact position, and toward the substrate The component on the upstream side of the direction of rotation; and along the radial direction of the substrate orthogonal to the tangent, from the first liquid contact The position is directed toward the aforementioned component of the rotation axis. The speed component in the tangential direction of the ejection speed when the first nozzle ejects the chemical liquid has the following magnitude: it can overcome the rotation of the chemical liquid that is acting on the first liquid contact position due to the rotation of the substrate toward the substrate. The force on the downstream side causes the chemical solution to flow toward the upstream side in the rotation direction of the substrate. The radial velocity component of the ejection speed has the following magnitude: it can overcome the centrifugal force caused by the rotation of the substrate on the chemical liquid acting on the first liquid contact position, so that the chemical liquid flows toward the rotation axis side . Viewed from above the second nozzle in the direction of the rotation axis of the substrate, the discharge direction when the second nozzle ejects the chemical solution is a direction containing the following components: along the center of the rotation axis and passing through the second liquid A component of the circle of the contact position in the tangential direction of the second liquid contact position and toward the downstream side of the rotation direction of the substrate.

The substrate processing apparatus of the second aspect is the substrate processing apparatus of the first aspect, and the first liquid contact position of the chemical liquid ejected by the first nozzle, and the second of the chemical liquid ejected by the second nozzle The liquid contact position is the same distance from the aforementioned rotation axis.

The substrate processing apparatus of the third aspect is the substrate processing apparatus of the first aspect, and the first liquid contact position of the chemical liquid ejected by the first nozzle is closest to the first liquid among the periphery of the substrate. When the midpoint of the point of contact position is used to define the center of attention, the second liquid contact position of the medicinal solution ejected by the second nozzle is farther from the rotation axis than the first liquid contact position, and is more than the middle point of attention. Closer to the aforementioned rotation axis.

The fourth aspect of the substrate processing device is any one of the first aspect to the third aspect, and the first liquid contact position of the chemical liquid ejected by the first nozzle and the second liquid The second liquid contact positions of the chemical solution ejected by the nozzles are on the same straight line forming the diameter of the substrate, and are respectively located at positions where the rotation shafts are held between each other.

The substrate processing apparatus of the fifth aspect is the substrate processing apparatus of any one of the first aspect to the third aspect, and the second liquid contact position of the chemical solution ejected by the second nozzle is located at the first The chemical liquid sprayed from the nozzle is expanded from the first liquid contact position to the surroundings and is formed on the liquid film on the substrate.

A sixth aspect of the substrate processing apparatus includes: a holding member capable of rotating the substrate while holding it in a substantially horizontal posture; a rotating mechanism that rotates the holding member around a rotation axis; and a first nozzle that is closer to the substrate than the substrate A chemical liquid is ejected from above to cause the chemical liquid to spray a first liquid contact position in a middle region between a central region and a peripheral region in the rotation track of the substrate; and a second nozzle is ejected from above the substrate. The medicinal solution is sprayed so that the medicinal solution hits the second liquid contact position in the intermediate region; and the first nozzle ejects the medicinal solution in the following manner: An amount of the chemical liquid flowing from a liquid contact position to the rotation axis side is greater than an amount of the chemical liquid flowing from the first liquid contact position to the side opposite to the rotation axis immediately after the first liquid contact position is sprayed; Viewed from above the second nozzle in the direction of the rotation axis of the substrate, the ejection direction when the second nozzle ejects the chemical solution includes the following Component direction: the component along the tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position toward the downstream side of the substrate in the rotation direction.

The substrate processing apparatus of the seventh aspect is the substrate processing apparatus of the first aspect or the sixth aspect, and the flow rate of the chemical solution ejected by the second nozzle is greater than the flow rate of the chemical solution ejected by the first nozzle.

The substrate processing apparatus of the eighth aspect is the substrate processing apparatus of the first aspect or the sixth aspect, and viewed from above the second nozzle in the direction of the rotation axis of the substrate, when the second nozzle ejects the chemical solution The ejection direction is a direction containing a component along the tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position toward the downstream side of the substrate in the rotation direction. And a component along the radial direction of the substrate orthogonal to the tangent line from the second liquid contact position toward the side opposite to the rotation axis.

The substrate processing apparatus of the ninth aspect is the substrate processing apparatus of the first aspect or the sixth aspect, and the ejection directions when the nozzles of the first nozzle and the second nozzle eject the chemical liquid are relative to each other. Each of the nozzles is viewed in a radial direction of the substrate when the bits on the opposite side to the rotation axis are placed, and the ejection directions are obliquely downward from above the substrate.

A tenth aspect of the substrate processing method includes: a rotation step, while rotating the substrate around the rotation axis while holding the substrate in a substantially horizontal posture; a first ejection step, in parallel with the rotation step, since it is closer to the substrate Spraying a chemical liquid from above to spray the chemical liquid against a first liquid contact position in a middle region between a central region and a peripheral region in a rotation track of the substrate; and a second spraying step, the rotation step, and the first A spraying step is performed in parallel, spraying the chemical liquid from above the substrate so that the chemical liquid sprays the second liquid contact position in the intermediate region; and the chemical liquid sprayed in the first spraying step. The ejection direction is the direction in which the medicinal solution is viewed from above in the direction of the rotation axis and contains the following components: along a tangent to the first liquid contact position along a circle centered on the rotation axis and passing through the first liquid contact position And a component facing the upstream side of the rotation direction of the substrate; and along a radial direction of the substrate orthogonal to the tangent line , A component toward the rotation axis from the first liquid contact position. The velocity component in the tangential direction of the ejection speed of the chemical solution ejected in the first ejecting step has the following magnitude: it can overcome the orientation of the chemical solution acting on the first liquid contact position due to the rotation of the substrate toward the substrate The force on the downstream side in the rotation direction causes the chemical solution to flow toward the upstream side in the rotation direction of the substrate. The radial velocity component of the ejection speed has the following magnitude: it can overcome the centrifugal force caused by the rotation of the substrate on the chemical liquid acting on the first liquid contact position, so that the chemical liquid flows toward the rotation axis side . The ejection direction of the medicinal solution ejected in the second ejecting step is viewed from above in the direction of the axis of rotation and contains the following components: along a circle centered on the axis of rotation and passing through the second liquid contact position The component in the tangential direction of the second liquid contact position and toward the downstream side in the rotation direction of the substrate.

The substrate processing method of the eleventh aspect is the substrate processing method of the tenth aspect, and the first liquid contact position of the chemical liquid sprayed in the first spraying step and the drug sprayed in the second spraying step are The second liquid contact position of the liquid is the same distance from the rotation axis.

The twelfth aspect of the substrate processing method is the tenth aspect of the substrate processing method, and the closest position between the first liquid contact position of the chemical solution sprayed in the first spraying step and the periphery of the substrate is closest to the aforementioned. When the midpoint of the point of the first liquid contact position is used to define the center of attention, the second liquid contact position of the chemical liquid ejected in the second ejection step is farther from the rotation axis than the first liquid contact position, and It is closer to the aforementioned rotation axis than the aforementioned midpoint of attention.

The substrate processing method of the thirteenth aspect is a substrate processing method of any one of the tenth aspect to the twelfth aspect, and the first liquid contact position of the chemical solution sprayed in the first spraying step, The second liquid contact positions with the chemical liquid ejected in the second ejection step are on the same straight line forming the diameter of the substrate, and are located at positions where the rotation shafts are held between each other.

The fourteenth aspect of the substrate processing method is a substrate processing method of any one of the tenth aspect to the twelfth aspect, and the second liquid contact position of the chemical liquid ejected in the second ejecting step is The medicinal solution ejected in the first ejecting step is expanded from the first liquid contact position to the periphery and is formed on the liquid film on the substrate.

A fifteenth aspect of the substrate processing method includes a rotation step of rotating the substrate around a rotation axis while holding the substrate in a substantially horizontal posture; a first ejection step, in parallel with the rotation step, and being closer to the substrate than the substrate Spraying a chemical liquid from above to spray the chemical liquid against a first liquid contact position in a middle region between a central region and a peripheral region in a rotation track of the substrate; and a second spraying step, the rotation step, and the first A spraying step is performed in parallel, and the chemical liquid is sprayed from above the substrate so that the chemical liquid hits the second liquid contact position in the intermediate region. In addition, the first ejecting step is a step of ejecting the chemical liquid in such a manner that the amount of the chemical liquid flowing from the first liquid contact position to the rotation axis side immediately after the first liquid contact position is sprayed is more than that The amount of the chemical solution flowing from the first liquid contact position to the side opposite to the rotation axis after the first liquid contact position is sprayed. The ejection direction of the medicinal solution ejected in the second ejection step is a direction in which the medicinal solution is viewed from above in the direction of the rotation axis and contains the following components: along the center of the rotation axis and passing through the second liquid contact position The component of the circle in the tangential direction of the second liquid contact position and toward the downstream side of the rotation direction of the substrate.

The sixteenth aspect of the substrate processing method is the tenth aspect or the fifteenth aspect of the substrate processing method, and the flow rate of the chemical solution sprayed in the second spraying step is greater than that of the chemical solution sprayed in the spraying step. Of traffic.

The substrate processing method of the seventeenth aspect is the substrate processing method of the tenth aspect or the fifteenth aspect, and the ejection direction of the chemical solution ejected in the second ejection step is viewed from above in the direction of the rotation axis. This medicinal solution contains a component along the tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position, and toward the downstream side of the rotation direction of the substrate. And a component along the radial direction of the substrate orthogonal to the tangent line from the second liquid contact position toward the side opposite to the rotation axis.

The eighteenth aspect of the substrate processing method is the tenth aspect or the fifteenth aspect of the substrate processing method, and each of the aforementioned first ejection step and the aforementioned second ejection step is ejected in each ejection step when the aforementioned chemical solution is ejected. The ejection directions are viewed in a radial direction of the substrate from a side opposite to the rotation axis with respect to each of the chemical liquids ejected in each of the ejection steps, and the ejection directions are obliquely directed from above the substrate. Down direction.

According to the invention of the first aspect, at least a portion of the medicinal solution sprayed from the first nozzle immediately after the first liquid contact position is sprayed, overcomes both the force acting on the medicinal solution toward the downstream side of the substrate in the direction of rotation and the centrifugal force. This kind of force flows from the first liquid contact position to a liquid film-like side while flowing toward the upstream side and the rotation axis side of the substrate in the direction of rotation, and then passes through the central region of the substrate to reach the peripheral edge of the substrate. Thereby, a large amount of chemical liquid is supplied to the first liquid contact position, and a smaller amount of chemical liquid is supplied to each position of the central portion of the substrate than the first liquid contact position. The rotation speed in the circumferential direction of each part of the substrate increases from the rotation axis toward the peripheral edge of the substrate. In addition, the chemical solution supplied to each position of the substrate is stretched in the circumferential direction as the rotation speed in the circumferential direction of each position is increased, and the film thickness is reduced. Therefore, although a greater amount of chemical solution is supplied to the first liquid contact position than the central region of the substrate, the film thickness of the chemical solution is likely to be thinner than the central region of the substrate. A smaller amount of chemical liquid is supplied than the first liquid contact position, but the film thickness of the chemical liquid is less likely to become thinner than the first liquid contact position. Therefore, the uniformity of the film thickness of the chemical liquid in the portion of the substrate surface closer to the center side of the substrate than the first liquid contact position can be improved by the first nozzle. In addition, most of the chemical liquid ejected from the second nozzle expands into a liquid film shape from the second liquid contact position, and flows toward the downstream side of the rotation direction of the substrate in the peripheral region of the substrate and reaches the peripheral edge portion of the substrate. Therefore, the first nozzle and the second nozzle can be used to supply the entire surface of the substrate, and the first nozzle can be used to increase the supply to the portion closer to the rotation axis side than the first liquid contact position, that is, the center of the substrate. The uniformity of the film thickness of the chemical solution in the region and the intermediate region of the substrate closer to the rotation axis side than the first liquid contact position.

According to the invention of the second aspect, the first liquid contact position of the chemical liquid ejected by the first nozzle and the second liquid contact position of the chemical liquid ejected by the second nozzle are the same distance from the rotation axis. Therefore, it is easier to supply the chemical liquid discharged from the two nozzles to the entire surface of the substrate.

According to the invention of the fourth aspect, the first liquid contact position of the chemical liquid ejected by the first nozzle and the second liquid contact position of the chemical liquid ejected by the second nozzle are on the same straight line forming the diameter of the substrate, and are respectively located on the The rotation shafts are clamped between each other. Therefore, for example, when viewed from above the substrate, in the case where the chemical liquids ejected from the two nozzles are parallel to each other and ejected in the same direction, the ejection direction of the chemical liquid ejected from the second nozzle can be set to be not viewed from above the substrate. There is a direction of the component toward the center side of the substrate. Therefore, the chemical liquid can be efficiently supplied to the peripheral region of the substrate from the second nozzle.

According to the fifth aspect of the invention, the second liquid contact position of the chemical liquid ejected from the second nozzle is located on the liquid film on the substrate, the chemical liquid ejected from the first nozzle spreads from the first liquid contact position to the surroundings. Therefore, when the contact position with the second liquid is located on the substrate other than the liquid film formed by the chemical liquid ejected from the first nozzle, the splash of the chemical liquid ejected from the second nozzle can be reduced.

According to the invention of the sixth aspect, the chemical liquid sprayed from the first nozzle is more likely to flow from the first liquid contact position to the center of the substrate while expanding into a liquid film shape, and then reaching the first liquid contact position relative to the center of the substrate. The periphery of the substrate on the opposite side. Thereby, a large amount of chemical liquid is supplied to the first liquid contact position, and a smaller amount of chemical liquid is supplied to each position of the central portion of the substrate than the first liquid contact position. The rotation speed in the circumferential direction of each part of the substrate increases from the rotation axis toward the peripheral edge of the substrate. In addition, the chemical solution supplied to each position of the substrate is stretched in the circumferential direction as the rotation speed in the circumferential direction of each position is increased, and the film thickness is reduced. Therefore, although a greater amount of chemical solution is supplied to the first liquid contact position than the central region of the substrate, the film thickness of the chemical solution is likely to be thinner than the central region of the substrate. A smaller amount of chemical liquid is supplied than the first liquid contact position, but the film thickness of the chemical liquid is less likely to become thinner than the first liquid contact position. Therefore, the uniformity of the film thickness of the chemical solution in the portion of the substrate surface closer to the center side of the substrate than the first liquid contact position can be improved by the first nozzle. In addition, a part of the chemical liquid ejected from the second nozzle spreads into a liquid film shape from the second liquid contacting position, flows in the peripheral region of the substrate toward the downstream side in the rotation direction of the substrate, and reaches the peripheral edge portion of the substrate. Therefore, the entire surface of the substrate can be supplied with the first nozzle and the second nozzle, and the first nozzle can be used to increase the supply to the portion closer to the rotation axis side than the first liquid contact position, that is, the central region of the substrate. And the uniformity of the film thickness of the chemical liquid in the middle region of the substrate closer to the rotation axis side than the first liquid contact position.

According to the seventh aspect of the invention, the flow rate of the chemical liquid ejected from the second nozzle is greater than the flow rate of the chemical liquid ejected from the first nozzle, so that more chemical liquid can be supplied from the second nozzle to the peripheral area of the substrate.

According to the eighth aspect of the invention, viewed from above the second nozzle in the direction of the rotation axis of the substrate, the discharge direction when the second nozzle ejects the chemical liquid is a direction containing the following components: along the center of the rotation axis and passing through the first The component of the circle at the second liquid contact position in the tangential direction of the second liquid contact position and toward the downstream side of the rotation direction of the substrate; and along the radial direction of the substrate orthogonal to the tangent line, the direction and rotation from the second liquid contact position Components on opposite sides of the axis. Therefore, the chemical liquid can be efficiently supplied to the peripheral region of the substrate from the second nozzle.

According to the ninth aspect of the invention, regarding the respective ejection directions when each of the first nozzle and the second nozzle ejects the medicinal solution, each of the ejection directions of the first nozzle and the second nozzle is viewed in the radial direction of the substrate from the side opposite to the rotation axis of the nozzle. Each of the above ejection directions is an oblique downward direction from above the substrate. The first nozzle and the second nozzle can eject the medicinal liquid more accurately toward the first liquid contact position and the second liquid contact position.

According to the tenth aspect of the invention, at least a portion of the chemical liquid ejected in the first ejection step is immediately after the first liquid contacting position is contacted, and the force and the centrifugal force acting on the downstream side of the chemical liquid toward the substrate in the rotation direction are overcome. These two forces flow from the first liquid contact position into a liquid film while flowing toward the upstream side and the rotation axis side of the substrate, and then pass through the central region of the substrate to reach the peripheral edge of the substrate. Thereby, a large amount of chemical liquid is supplied to the first liquid contact position, and a smaller amount of chemical liquid is supplied to each position of the central portion of the substrate than the first liquid contact position. The rotation speed in the circumferential direction of each part of the substrate increases from the rotation axis toward the peripheral edge of the substrate. In addition, the chemical solution supplied to each position of the substrate is stretched in the circumferential direction as the rotation speed in the circumferential direction of each position is increased, and the film thickness is reduced. Therefore, although a greater amount of chemical solution is supplied to the first liquid contact position than the central region of the substrate, the film thickness of the chemical solution is likely to be thinner than the central region of the substrate. A smaller amount of chemical liquid is supplied than the first liquid contact position, but the film thickness of the chemical liquid is less likely to become thinner than the first liquid contact position. Therefore, the uniformity of the film thickness of the chemical liquid in the portion of the substrate surface closer to the center side of the substrate than the first liquid contact position can be improved by the first ejection step. In addition, most of the chemical liquid ejected in the second ejection step expands into a liquid film shape from the second liquid contact position, and flows toward the downstream side of the rotation direction of the substrate in the peripheral region of the substrate and reaches the peripheral edge portion of the substrate. Therefore, the chemical solution can be supplied to the entire surface of the substrate by the first ejection step and the second ejection step, and the supply can be increased by the first ejection step to the portion closer to the rotation axis side than the first liquid contact position, that is, The uniformity of the film thickness of the chemical solution in the central region and the intermediate region of the substrate closer to the rotation axis side than the first liquid contact position.

According to the invention of the fifteenth aspect, the chemical liquid ejected in the first ejecting step is easier to expand from the first liquid contact position to a liquid film while flowing toward the center of the substrate, and then reaches the first liquid relative to the center of the substrate. The contact position is the peripheral edge of the substrate on the opposite side. Thereby, a large amount of chemical liquid is supplied to the first liquid contact position, and a smaller amount of chemical liquid is supplied to each position of the central portion of the substrate than the first liquid contact position. The rotation speed in the circumferential direction of each part of the substrate increases from the rotation axis toward the peripheral edge of the substrate. In addition, the chemical solution supplied to each position of the substrate is stretched in the circumferential direction as the rotation speed in the circumferential direction of each position is increased, and the film thickness is reduced. Therefore, although a greater amount of chemical solution is supplied to the first liquid contact position than the central region of the substrate, the film thickness of the chemical solution is likely to be thinner than the central region of the substrate. A smaller amount of chemical liquid is supplied than the first liquid contact position, but the film thickness of the chemical liquid is less likely to become thinner than the first liquid contact position. Therefore, the uniformity of the film thickness of the chemical liquid in the portion of the substrate surface closer to the center side of the substrate than the first liquid contact position can be improved by the first ejection step. In addition, a part of the medicinal solution ejected in the second ejection step expands into a liquid film shape from the second liquid contact position, flows in the peripheral region of the substrate toward the downstream side in the rotation direction of the substrate, and reaches the peripheral edge portion of the substrate. Therefore, the chemical solution can be supplied to the entire surface of the substrate through the first ejection step and the second ejection step, and the supply can be increased to the portion closer to the rotation axis side than the first liquid contact position, that is, the substrate, by the first ejection step. The uniformity of the film thickness of the chemical solution in the central region and the intermediate region of the substrate closer to the rotation axis side than the first liquid contact position.

1‧‧‧ substrate processing device

2‧‧‧rotation holding mechanism

5‧‧‧ Processing Department

9‧‧‧ substrate

21‧‧‧Rotary Chuck

22‧‧‧Rotating shaft

23‧‧‧Rotary drive unit

51‧‧‧Nozzle (first nozzle)

52‧‧‧Nozzle (second nozzle)

53‧‧‧Medicine Supply Department

130‧‧‧Control Department

201, 202‧‧‧imaginary circle

231‧‧‧rotating mechanism

521, 522‧‧‧ On-off valve

531, 532‧‧‧medicine supply source

541, 542‧‧‧Piping

AR1‧‧‧Arrow

K1‧‧‧ central area

K2‧‧‧ middle area

K3‧‧‧surrounding area

L1, L2‧‧‧‧ Liquid

P1‧‧‧Liquid contact position (first liquid contact position)

P2‧‧‧Liquid contact position (second liquid contact position)

S10, S20, S30, S40, S50 ‧‧‧ steps

a1‧‧‧rotation axis

c1‧‧‧ center

u1, v1‧‧‧ejection direction

u2, u3, v2, v3‧‧‧components

FIG. 1 is a schematic side view illustrating a configuration example of a substrate processing apparatus according to an embodiment.

FIG. 2 is a schematic plan view for explaining a configuration example of the substrate processing apparatus of FIG. 1.

FIG. 3 is a diagram for explaining an example of an intermediate region on the upper surface of the substrate.

FIG. 4 is a diagram showing an example of a flow of a chemical solution ejected onto a substrate.

FIG. 5 is a diagram showing an example of the relationship between the radius of the substrate and the heat loss in a graph format.

FIG. 6 is a diagram showing an example of the relationship between the ejection state of the chemical solution and the temperature distribution of the substrate in a graph format.

FIG. 7 is a schematic plan view showing another example of the arrangement of two nozzles.

FIG. 8 is a schematic plan view showing another example of the arrangement of two nozzles.

FIG. 9 is a schematic plan view showing another example of the arrangement of two nozzles.

FIG. 10 is a diagram showing an example of a film thickness distribution of the chemical liquid discharged from the two nozzles in the radial direction of the substrate in a graph form.

FIG. 11 is a flowchart showing an example of the operation of the substrate processing apparatus according to the embodiment.

Hereinafter, embodiments will be described with reference to the drawings. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention. In addition, in each of the drawings referred to below, the size or number of each part may be exaggerated or simplified in order to facilitate understanding. The vertical direction is a vertical direction, and the substrate side is up with respect to the spin chuck.

(Implementation form)

(1. Overall configuration of the substrate processing apparatus 1)

The configuration of the substrate processing apparatus 1 will be described with reference to FIGS. 1 and 2. 1 and 2 are diagrams for explaining the structure of the substrate processing apparatus 1 according to the embodiment. FIG. 1 is a schematic side view of the substrate processing apparatus 1, and FIG. 2 is a schematic top view of the substrate processing apparatus 1.

In FIGS. 1 and 2, in a state where the nozzles 51 and 52 are disposed at a processing position above the substrate 9, the substrate 9 is rotated around the rotation axis a1 by a rotating chuck 21 to a predetermined rotation direction (arrow AR1). Direction). The nozzle 51 (52) sprays a liquid columnar chemical liquid L1 (L2) onto the upper surface of the substrate 9. In FIG. 2, the description of some constituent elements such as the control unit 130 among the constituent elements of the substrate processing apparatus 1 is omitted.

The surface shape of the substrate 9 is substantially circular. The loading and unloading of the substrate 9 into the substrate processing apparatus 1 is performed by a robot or the like in a state where the nozzles 51 and 52 are arranged in an avoiding position by a nozzle moving mechanism (not shown). The substrate 9 carried into the substrate processing apparatus 1 is detachably held by rotating the chuck 21.

The substrate processing apparatus 1 includes a rotation holding mechanism 2, a processing unit 5, and a control unit 130. Each of the rotation holding mechanisms 2 and the processing unit 5 is electrically connected to the control unit 130 and operates according to an instruction from the control unit 130. As the control unit 130, for example, it may be the same as a general computer. That is, the control unit 130 includes, for example, a CPU (Central Processing Unit) that performs various arithmetic processing, a ROM (Read Only Memory) that stores basic programs as a read-only memory, and stores various types of memory. The information is RAM (Random Access Memory), which is a readable and writable memory, and a magnetic disk in which control software or data is stored in advance. In the control unit 130, a CPU, which is a main control unit, performs arithmetic processing in the order described in the program, thereby controlling each unit of the substrate processing apparatus 1.

(2.Substrate 9)

The surface shape of the substrate 9 regarded as a processing target by the substrate processing apparatus 1 is substantially circular. The radius of the substrate 9 is, for example, 150 mm. The substrate processing apparatus 1 supplies a processing liquid to the upper surface of the substrate 9 from the nozzles 51 and 52 to process the substrate 9.

FIG. 3 is a diagram for explaining an example of the intermediate region K2 on the upper surface of the substrate 9. The intermediate region K2 is a region between the central region K1 and the peripheral region K3 in the rotation track of the substrate 9. The length from the center c1 of the substrate 9 to the boundary between the central region K1 and the intermediate region K2 is, for example, a third of the radius of the substrate 9. The width of the peripheral region K3, that is, the length from the boundary between the intermediate region K2 and the peripheral region K3 to the periphery of the substrate 9 is, for example, one third of the radius of the substrate 9. Therefore, in this case, the width of the intermediate region K2, that is, the length from the boundary between the central region K1 and the intermediate region K2 to the boundary between the intermediate region K2 and the peripheral region K3 is one third of the radius of the substrate 9.

(3. Configuration of each section of the substrate processing apparatus 1)

(Rotary holding mechanism 2)

The rotation holding mechanism 2 is a mechanism capable of rotating the substrate 9 while holding the main surface of the substrate 9 upward, while holding the substrate 9 in a substantially horizontal posture. The rotation holding mechanism 2 rotates the substrate 9 about the vertical rotation axis a1 passing through the center c1 of the main surface. When the nozzles 51 and 52 of the rotation holding mechanism 2 eject the chemical liquids L1 and L2, for example, the substrate 9 is rotated at a rotation speed of 200 rpm to 400 rpm.

The rotation holding mechanism 2 includes a rotation chuck (“holding member”, “substrate holding portion”) 21 as a disc-shaped member smaller than the substrate 9. The spin chuck 21 is provided so that the upper surface of the spin chuck 21 becomes substantially horizontal, and the center axis of the spin chuck 21 is aligned with the rotation axis a1. A cylindrical rotating shaft portion 22 is connected to the lower surface of the rotating chuck 21. The rotation shaft portion 22 is arranged in a posture such that the axis of the rotation shaft portion 22 is along the vertical direction. The axis of the rotation shaft portion 22 coincides with the rotation shaft a1. In addition, a rotation driving unit (for example, a servo motor) 23 is connected to the rotation shaft portion 22. The rotation driving portion 23 rotates and drives the rotation shaft portion 22 around the axis of the rotation shaft portion 22. Therefore, the rotary chuck 21 can be rotated around the rotary shaft a1 together with the rotary shaft portion 22. The rotation driving section 23 and the rotation shaft section 22 are a rotation mechanism 231 that rotates the rotation chuck 21 around the rotation shaft a1. The rotation shaft portion 22 and the rotation driving portion 23 are housed in a cylindrical casing (not shown).

A through hole (not shown) is provided in the central portion of the rotary chuck 21 and communicates with the internal space of the rotary shaft portion 22. A pump (not shown) is connected to the internal space via a pipe (not shown) and an on-off valve. The pump and the on-off valve are electrically connected to the control unit 130. The control unit 130 controls operations of the pump and the on-off valve. The pump can selectively supply a negative pressure and a positive pressure in accordance with the control of the control unit 130. When the substrate 9 is placed on the upper surface of the spin chuck 21 in a substantially horizontal posture, a negative pressure is supplied by the pump, and the spin chuck 21 sucks and holds the substrate 9 from below. If the pump supplies positive pressure, the substrate 9 can be removed from the upper surface of the spin chuck 21.

In this configuration, when the rotation driving portion 23 rotates the rotation shaft portion 22 while the rotation chuck 21 holds and holds the substrate 9, the rotation chuck 21 is rotated around an axis along the vertical direction. Thereby, the substrate 9 held on the rotary chuck 21 is rotated in the direction of the arrow AR1 with the vertical rotation axis a1 passing through the center c1 in the plane of the substrate 9 as a center. As the rotation chuck 21, a plurality of (3 or more) peripheral edges of a disc-shaped spin base that rotates around the rotation axis a1 may be used to hold the peripheral edge of the substrate 9. Chuck pinner.

(Processing Section 5)

The processing unit ("medicine supply mechanism") 5 processes the substrate 9 held on the spin chuck 21. Specifically, the processing unit 5 supplies a chemical solution to the upper surface of the substrate 9 held on the spin chuck 21. The processing unit 5 includes nozzles 51 and 52 and a chemical liquid supply unit 53.

The nozzles 51 and 52 are, for example, attached to the tip of a long arm provided in a nozzle moving mechanism (not shown). This nozzle moving mechanism is a mechanism for moving the nozzles 51 and 52 between the processing position and the retreat position.

The processing unit 5 includes a nozzle 51 (52) that ejects the chemical liquid L1 (L2) from above the substrate 9 to the upper surface (surface) of the substrate 9. The nozzles 51 (52) each have, for example, a cylindrical distal end portion extending toward the upper surface of the substrate 9, and ejects the chemical liquid L1 (L2) from an ejection port formed at the distal end of the distal end portion so as to contact the upper surface of the substrate 9. ).

The nozzle 51 ejects the chemical liquid L1 from above the substrate 9 so that the pharmaceutical industry L1 sprays the liquid contact position P1 in the middle region K2 of the substrate 9. The nozzle 52 ejects the medicinal solution L2 from above the substrate 9 so that the medicinal solution L2 sprays the liquid contact position P2 in the intermediate region K2. The respective ejection directions u1 and v1 when the nozzles 51 and 52 eject the chemical liquids L1 and L2 are viewed in the radial direction of the substrate 9 from the positions on the side opposite to the rotation axis a1 with respect to the respective nozzles 51 and 52. The ejection directions u1 and v1 are directions obliquely downward from above the substrate 9.

The chemical liquid supply unit 53 supplies the chemical liquids L1 and L2 to the nozzles 51 and 52. Specifically, the medicinal solution supply unit 53 is configured by combining medicinal solution supply sources 531 and 532, pipes 541 and 542, and on-off valves 521 and 522. The chemical solution supply source 531 (532) supplies the chemical solution L1 (L2) to the nozzle 51 (52) through a pipe 541 (542). An on-off valve 521 (522) is provided in the middle of the route of the pipe 541 (542). Examples of the chemical liquids L1 and L2 include SPM, SC-1, DHF, and SC-2. The medicinal liquid L1 and the medicinal liquid L2 are the same kind of medicinal liquid.

When the medicinal solution L1 (L2) is supplied from the medicinal solution supply source 531 (532) to the nozzle 51 (52), the nozzle 51 (52) ejects the medicinal solution L1 (L2) in the form of a liquid stream. Among them, the on-off valve 521 (522) provided in the chemical liquid supply unit 53 is opened and closed under the control of the control unit 130 by a valve opening and closing mechanism (not shown) electrically connected to the control unit 130. In more detail, the opening degree of the on-off valve 521 (522) is changed according to the control of the control unit 130, so that the opening of the nozzle 51 (52) supplied from the chemical liquid supply source 531 (532) through the pipe 541 (542) can be changed. Flow rate of chemical liquid L1 (12). The valve opening and closing mechanism can independently change the opening degrees of the opening and closing valves 521 and 522 under the control of the control unit 130. Thereby, the flow rate of the chemical liquid L1 ejected from the nozzle 51 and the flow rate of the chemical liquid L2 ejected from the nozzle 52 are controlled independently of each other. That is, the ejection state (specifically, the ejection start timing, ejection end timing, and ejection flow rate of the ejected chemical liquid L1 (L2)) from the nozzle 51 (52) is controlled by the control unit 130. . That is, under the control of the control unit 130, the nozzle 51 (52) of the processing unit 5 ejects the liquid flow of the chemical liquid L1 (L2), so that the liquid flow of the chemical liquid L1 (L2) is sprayed with the rotation axis a1 as the center The upper surface of the substrate 9 is rotated.

In addition, as shown in FIG. 2, viewed from above the nozzle 51 in the direction of the rotation axis a1 of the substrate 9, the discharge direction u1 when the nozzle 51 ejects the chemical liquid L1 is a direction containing the following components: along the center of the rotation axis a1 And the component passing through the tangential direction of the circle at the liquid contact position P1 at the liquid contact position P1 toward the upstream side of the rotation direction of the substrate 9 ("direction component") u2; and along the radial direction of the substrate 9 orthogonal to the tangent , The component ("direction component") u3 from the liquid contact position P1 toward the rotation axis a1. The horizontal velocity component of the ejection speed when the nozzle 51 ejects the chemical liquid L1 is a velocity component obtained by combining the following velocity components: along the center of the rotation axis a1 and passing through the liquid contact position P1 at the circular liquid contact position P1 Velocity component of the tangential direction toward the upstream side of the rotation direction of the substrate 9; and along the radial direction of the substrate 9 orthogonal to the tangential direction, from the liquid contact position P1 toward the radial direction of the rotation axis a1 Speed component. The velocity component in the tangential direction of the ejection speed when the nozzle 51 ejects the chemical liquid L1 has the following magnitude: The chemical liquid L1 acting on the liquid contact position P1 due to the rotation of the substrate 9 can be overcome toward the downstream side of the substrate 9 in the rotational direction. The force causes the chemical solution L1 to flow toward the upstream side in the rotation direction of the substrate 9. The radial velocity component of the ejection velocity has the following magnitude: the centrifugal force caused by the rotation of the substrate 9 on the chemical liquid L1 acting on the liquid contact position P1 can be overcome, so that the chemical liquid L1 flows toward the rotation axis a1 side. Therefore, at least a part of the chemical liquid L1 ejected from the nozzle 51 is immediately after the liquid contact position P1 is struck, and overcomes the two forces acting on the chemical liquid toward the downstream side of the substrate in the direction of rotation and the centrifugal force from the liquid contact position. P1 flows to the upstream side of the rotation direction of the substrate 9 and the rotation axis a1 side while expanding into a liquid film shape, and then passes through the central region of the substrate to reach the peripheral edge of the substrate. In more detail, at least a part of the chemical liquid L1 is temporarily bent from the liquid contact position P1 toward the center side of the substrate 9 while facing the upstream side of the rotation direction of the substrate 9, and then along the side toward the downstream side of the rotation direction of the substrate 9. The arc-shaped path toward the center c1 of the substrate 9 is bent while reaching the center c1 of the substrate 9 while expanding into a liquid film shape. Then, when the chemical solution L1 passes the center of the substrate 9, it flows along the arc-shaped path toward the periphery of the substrate 9 while bending toward the downstream side of the rotation direction of the substrate 9 due to the influence of centrifugal force (see FIG. 4).

Therefore, the nozzle 51 shown in FIG. 2 ejects the chemical liquid L1 in such a manner that the amount of the chemical liquid L1 flowing from the liquid contact position P1 to the rotation axis a1 side immediately after the liquid contact position P1 is sprayed is more than that immediately after the liquid contact position P1 is sprayed. After P1, the amount of the chemical liquid L1 flowing from the liquid contact position P1 to the side opposite to the rotation axis a1. In addition, regarding the chemical liquid L1 immediately after being ejected to the liquid contact position P1, the centrifugal force caused by the rotation of the substrate 9 does not work strongly, so there is also an advantage that the temperature of the chemical liquid L1 is not easy to decrease.

Viewed from above the nozzle 52 in the direction of the rotation axis a1 of the substrate 9, the discharge direction v1 when the nozzle 52 sprays the liquid L2 is a direction containing the following components: along a circle centered on the rotation axis a1 and passing through the liquid contact position P2 The component ("direction component") v2 of the tangential direction at the liquid contact position P2, which is toward the downstream side in the rotation direction of the substrate 9. Therefore, the chemical liquid L2 sprayed from the nozzle 52 is strongly affected by the centrifugal force immediately after hitting the liquid contact position P2, and follows an arc-shaped path toward the peripheral edge of the substrate 9 while bending toward the downstream side of the rotation direction of the substrate 9, It flows while expanding into a liquid film shape (see FIG. 4).

Therefore, a part of the medicinal liquid L1 ejected from the nozzle 51 expands into a liquid film shape from the liquid contact position P1, and passes through the central portion of the substrate 9 to reach the periphery of the substrate 9. A part of the medicinal liquid L2 ejected from the nozzle 52 is from the liquid. While the contact position P2 is expanded into a liquid film shape, it flows in the peripheral region K3 of the substrate 9 toward the downstream side in the rotation direction of the substrate 9 and reaches the peripheral edge portion of the substrate 9.

In the example of FIG. 2, the imaginary circle 201 is centered on the center c1 (rotation axis a1) of the substrate 9 and passes through both the liquid contact positions P1 and P2. That is, the liquid contact position P1 and the liquid contact position P2 are the same distance from the rotation axis a1. In addition, the chemical liquids L1 and L2 flow while expanding into a liquid film shape. Therefore, the liquid film formed by the chemical liquid L1 near the liquid contact position P1 and the liquid film formed by the chemical liquid L2 near the liquid contact position P2 extend to approximately the same range in the radial direction of the substrate 9. Therefore, it is easier to supply the chemical liquid L1 and the chemical liquid L2 respectively ejected from the two nozzles to the entire surface of the substrate 9.

FIG. 5 is a diagram showing an example of the relationship between the radius of the substrate 9 and the heat loss in a graph format. In the example shown in FIG. 5, in the substrate 9 having a radius of 150 mm, the heat loss increases from the center c1 of the substrate 9 toward the periphery. Within a radius of approximately 130 mm from the center c1, the increase rate of heat loss is relatively low, but within a radius of approximately 130 mm or more, the heat loss increases toward the periphery as an exponential function. Therefore, in order to make the temperature distribution of the substrate uniform using the chemical solution supplied on the upper surface of the substrate, it is necessary to increase the amount of the chemical solution supplied to the peripheral portion of the substrate compared to the chemical solution supplied to the central portion of the substrate.

FIG. 6 is a diagram showing an example of the relationship between the ejection state of the chemical solution and the temperature distribution of the substrate in the substrate processing apparatus 1 having the configuration shown in FIG. 2 in a graph format. The temperature distribution represented by a quadrangle represents the temperature distribution of the substrate 9 when the chemical liquid L1 is ejected from only the nozzle ("first nozzle") 51 of the nozzles 51, 52. The temperature distribution indicated by the black-painted diamond represents the temperature distribution of the substrate 9 when the chemical liquids L1 and L2 are ejected from both the nozzles 51 and 52. The rotation speed of the substrate 9 is 200 rpm, and a part of the medicine liquid L1 flowing from the liquid contact position P1 to the center c1 is discharged at a rate of 2L / min. The liquid medicine L2 mainly flows from the liquid contact position P2 to the peripheral side of the substrate 9 The flow is 3L / min. That is, the flow rate of the chemical liquid L2 ejected from the nozzle 52 is greater than the flow rate of the chemical liquid L1 ejected from the nozzle 51.

Here, regarding the relationship between the ejection flow rate X of the chemical liquid L1 and the ejection flow rate Y of the chemical liquid L2, if the area of the portion closer to the center c1 side than the virtual circle 201 (see FIG. 2) is set to Acm ² in the substrate 9 If the area of the part on the periphery side is Bcm ² , the above relationship is expressed by the formula (1). The α-series value is a variable that varies depending on the wind speed when exhausting the atmosphere in a chamber (not shown) that houses the substrate processing apparatus 1 from the chamber, and the rotation speed of the substrate 9.

As shown in the graph of FIG. 6, when only the chemical solution L1 of the nozzle 51 is ejected, the temperature distribution in the radial direction of the substrate 9 in the central region K1 and the intermediate region K2 of the substrate 9 where a large amount of the chemical solution L1 is supplied becomes relative. The distribution is relatively uniform, but in the peripheral region K3, because the supplied chemical liquid L1 is insufficient, the temperature of the substrate 9 decreases sharply toward the periphery of the substrate. However, by appropriately adjusting the discharge flow rate of the liquid medicines L1 and L2 according to the rotation speed of the substrate 9 or the size of the area where the liquid medicines L1 and L2 are discharged, the liquid medicines L1 and L2 are discharged from both the nozzles 51 and 52, which can be spread throughout the substrate. A relatively uniform temperature distribution is achieved over the entire area of the upper surface.

Furthermore, as shown in FIG. 2, in the substrate processing apparatus 1, the liquid contact position P2 of the chemical liquid L2 is preferably located on the liquid film formed on the substrate 9 and spreads from the liquid contact position P1 to the surroundings. on.

FIG. 10 is a diagram showing an example of a film thickness distribution of the chemical liquids L1 and L2 ejected from the nozzles 51 and 52 in the radial direction of the substrate 9 in a graph form. As described above, the chemical liquid L1 ejected from the nozzle 51 to the liquid contact position P1 flows from the liquid contact position P1 to a liquid film side while flowing toward the upstream side of the substrate 9 in the rotation direction and the rotation axis a1 side, and then passes through the center of the substrate 9 The region K1 reaches the periphery of the substrate 9. Thereby, a large amount of the chemical liquid is supplied to the liquid contact position P1, and a small amount of the chemical liquid L1 is supplied to each position of the central portion of the substrate 9.

The rotational speed in the circumferential direction of each part of the substrate 9 increases from the rotation axis a1 toward the peripheral edge of the substrate 9. In addition, the chemical liquids L1 and L2 supplied to the respective positions of the substrate 9 are stretched in the circumferential direction as the rotation speed in the circumferential direction of each position increases, and the film thickness is reduced. Further, the rotation speed in the circumferential direction of the substrate 9 at the liquid contact position P1 is high, and the rotation speed in the circumferential direction of the substrate 9 in the central region K1 is low.

Therefore, although a greater amount of the chemical solution L1 is supplied from the nozzle 51 to the liquid contact position P1 than the central region K1 of the substrate 9, the film thickness of the chemical solution L1 is likely to be thinner than the central region K1. Although a smaller amount of the chemical liquid L1 than the liquid contact position P1 is supplied from the nozzle 51 to the central region K1, the film thickness of the chemical liquid L1 is less likely to become thinner than the liquid contact position P1. Therefore, as shown in FIG. 10, the uniformity of the film thickness of the chemical liquid L1 in the portion of the surface of the substrate 9 closer to the center side of the substrate 9 than the liquid contact position P1 can be improved by the nozzle 51.

In addition, most of the chemical liquid L2 ejected from the nozzle 52 spreads into a liquid film shape from the liquid contact position P2, and flows toward the downstream side of the rotation direction of the substrate 9 in the peripheral region of the substrate 9 and reaches the peripheral edge portion of the substrate 9. Therefore, the chemical liquids L1 and L2 can be supplied to the entire area of the upper surface of the substrate 9 through the nozzle 51 and the nozzle 52, and the liquid can be supplied to the portion closer to the rotation axis a1 side than the liquid contact position P1 through the first nozzle. That is, the uniformity of the film thickness of the chemical liquid L1 in the central region K1 of the substrate 9 and the intermediate region K2 of the substrate 9 is closer to the rotation axis a1 than the liquid contact position P1. In addition, although the heat loss of the substrate 9 increases sharply from the center side of the substrate 9 toward the peripheral side due to the rotation of the substrate 9, the chemical liquid L2 sprayed from the second nozzle is mainly supplied to the peripheral area K3 of the substrate 9, so it can be connected The chemical liquid L1 supplied to the central portion of the substrate 9 is increased compared to the chemical liquid L1 supplied to the peripheral area K3 of the substrate 9. Therefore, the uniformity of the temperature distribution on the surface of the substrate 9 can be improved.

(4. Example of arrangement relationship of nozzles 51 and 52)

7 to 9 are diagrams each showing an example of another arrangement relationship of the nozzles 51 and 52 of the substrate processing apparatus 1 which is different from the arrangement relationship shown in FIG. 2. In FIGS. 7 to 9, the nozzle 51 ejects the medicinal liquid L1 to the liquid contact position P1 in the same ejection state from the same position as the nozzle 51 described in FIG. 2.

In the arrangement shown in FIG. 7, the liquid contact position P2 of the chemical liquid L2 is farther away from the rotation axis a1 than the liquid contact position P1 of the chemical liquid L1, and is closest to the liquid contact position in the peripheral edge of the substrate 9 from the liquid contact position P1 The midpoint of the point of P1 ("attention midpoint") is closer to the rotation axis a1. The imaginary circle 202 is centered on the center c1 and passes through the midpoint, and the imaginary circle 201 is centered on the center c1 and passes through the liquid contact position P1. In this case, although there is a space in the radial direction of the substrate 9 between the liquid contact position P1 and the liquid contact position P2, the chemical liquid L1 (L2) flows from the liquid contact position P1 (P2) while expanding toward the surroundings. Therefore, in the radial direction of the substrate 9, a gap is formed between the liquid film formed near the liquid contact position P1 of the chemical liquid L1 and the liquid film formed near the liquid contact position P2 of the chemical liquid L1.

In the arrangement relationship shown in FIG. 8, the liquid contact position P1 of the chemical liquid L1 ejected from the nozzle 51 and the liquid contact position P2 of the chemical liquid L2 ejected from the nozzle 52 are on the same straight line forming the diameter of the substrate 9 and are located respectively The rotation shafts a1 are sandwiched between positions.

In the arrangement relationship shown in FIG. 9, viewed from above the nozzle 52 in the direction of the rotation axis a1 of the substrate 9, the discharge direction v1 when the nozzle 52 ejects the chemical liquid L2 is a direction containing the following components: along the rotation axis a1 And the component v2 of the circle passing through the liquid contact position P2 at the center of the liquid contact position P2 toward the downstream side of the rotation direction of the substrate 9; and along the radial direction of the substrate 9 orthogonal to the tangent, The component ("direction component") v3 of the contact position P2 faces the side opposite to the rotation axis a1. Therefore, an angle formed by the tangent line and the ejection direction v1 becomes an acute angle. Therefore, the chemical solution L2 can be efficiently supplied from the nozzle 52 to the peripheral region K3 of the substrate 9.

(5. Operation of substrate processing device)

FIG. 11 is a flowchart showing an example of the operation of the substrate processing apparatus 1. The substrate processing apparatus 1 processes the substrate 9 using the chemical solutions L1 and L2 according to this flowchart. Before the operation of this flowchart is started, the substrate 9 is held in advance by rotating the chuck 21.

First, the rotation mechanism 231 starts the rotation of the spin chuck 21 according to the control of the control unit 130, thereby starting the rotation of the substrate 9 held by the spin chuck 21 (step S10 in FIG. 11).

Then, the valve opening and closing mechanism of the processing unit 5 opens the on-off valve 521 at a predetermined opening degree under the control of the control unit 130, whereby the nozzle 51 starts to eject the chemical liquid L1 and causes the chemical liquid L1 to strike the rotation track of the substrate 9. The liquid contact position P1 in the middle area K2 (step S20), the valve opening and closing mechanism opens the on-off valve 522 at a predetermined opening degree under the control of the control unit 130, whereby the nozzle 52 starts to eject the liquid medicine L2 to make the liquid medicine L2 contact The liquid contact position P2 in the intermediate area K2 (step S30).

The ejection direction of the medicinal liquid L1 ejected in step S20 is a direction in which the medicinal liquid L1 is viewed from above in the direction of the rotation axis a1 and contains the following components: along the center of the rotation axis a1 and passing through the liquid contact position P1 in a circular liquid The component of the tangential direction of the contact position P1 toward the upstream side in the rotation direction of the substrate 9; and the component from the liquid contact position P1 toward the rotation axis a1 along the radial direction of the substrate 9 orthogonal to the tangent.

In step S20, the velocity component of the tangential direction of the ejection speed of the chemical liquid L1 sprayed from the nozzle 51 has the following magnitude: it can overcome the rotation of the chemical liquid on the liquid contact position P1 toward the substrate 9 due to the rotation of the substrate 9 The force on the downstream side causes the chemical solution to flow toward the upstream side in the rotation direction of the substrate 9. The radial velocity component of the ejection speed of the chemical liquid L1 has the following magnitude: it can overcome the centrifugal force caused by the rotation of the substrate 9 of the chemical liquid L1 acting on the liquid contact position P1, so that the chemical liquid L1 is directed to the rotation axis a1 side flow. In step S20, the nozzle 51 preferably ejects the chemical liquid L1 in the following manner: the amount of the chemical liquid L1 from the liquid contact position P1 toward the rotation axis a1 side immediately after the liquid contact position P1 is touched is more than that immediately after the liquid contact position P1 is touched After the position P1, the amount of the chemical liquid L1 from the liquid contact position P1 toward the side opposite to the rotation axis a1. In step S30, the ejection direction of the medicinal liquid L2 ejected from the nozzle 52 is viewed from above in the direction of the rotation axis a1 and contains the following components: along a circle centered on the rotation axis a1 and passing through the liquid contact position P2 The component in the tangential direction of the liquid contact position P2 and toward the downstream side in the rotation direction of the substrate 9.

The control unit 130 waits for the time required for the processing of the chemical liquids L1 and L2, causes the valve opening and closing mechanism of the processing unit 5 to close the on-off valves 521 and 522, and stops the discharge of the chemical liquids L1 and L2 of the nozzles 51 and 52 (step S40) Then, the rotation mechanism 231 stops the rotation of the spin chuck 21 and stops the rotation of the substrate 9 (step S50). The processing operation of the substrate processing apparatus 1 shown in FIG. 11 ends.

According to the substrate processing apparatus of this embodiment configured as described above, viewed from above the nozzle 51 in the direction of the rotation axis a1 of the substrate 9, the ejection direction u1 when the nozzle 51 ejects the chemical liquid L1 is a direction containing the following components: A component u2 centered on the rotation axis a1 and passing through the liquid contact position P1 in the tangential direction of the liquid contact position P1 and toward the upstream side of the rotation direction of the substrate 9; and along the radial direction of the substrate 9 orthogonal to the tangent , The component u3 from the liquid contact position P1 toward the rotation axis a1. The velocity component in the tangential direction of the ejection speed when the nozzle 51 ejects the chemical liquid L1 has the following magnitude: it can overcome the force of the chemical liquid L1 on the liquid contact position P1 toward the downstream side in the direction of rotation of the substrate 9 due to the rotation of the substrate 9 , The chemical solution L1 is caused to flow toward the upstream side in the rotation direction of the substrate 9. The radial velocity component of the ejection velocity has the following magnitude: the centrifugal force caused by the rotation of the substrate 9 on the chemical liquid L1 acting on the liquid contact position P1 can be overcome, so that the chemical liquid L1 flows toward the rotation axis a1 side. Therefore, after at least a portion of the chemical liquid L1 ejected from the first nozzle immediately contacts the liquid contact position P1, the force acting on the downstream side of the chemical liquid L1 toward the rotation direction of the substrate 9 is overcome, and the liquid contact position P1 is temporarily moved to one side first. After the center side of the substrate 9 is bent toward the upstream side of the rotation direction of the substrate 9, the arc-shaped path toward the center c1 of the substrate 9 while being bent toward the downstream side of the rotation direction of the substrate 9 is extended while reaching a liquid film shape. The center c1 of the substrate 9. Then, when the chemical solution L1 crosses the center of the substrate 9, it flows along an arc-shaped path toward the periphery of the substrate 9 while bending toward the downstream side of the rotation direction of the substrate 9 due to the influence of centrifugal force. Viewed from above the nozzle 52 in the direction of the rotation axis a1 of the substrate 9, the discharge direction v1 when the nozzle 52 ejects the chemical liquid L2 is a direction containing the following components: along a circle centered on the rotation axis a1 and passing through the liquid contact position P2 The component v2 in the tangential direction of the liquid contact position P2 and toward the downstream side in the rotation direction of the substrate 9. Therefore, the medicinal solution L2 has been strongly affected by centrifugal force immediately after contacting the liquid contact position P2, and has expanded into a liquid film shape along an arc-shaped path that is curved toward the downstream side of the substrate 9 in the direction of rotation and toward the periphery of the substrate 9. One side flows. Therefore, a part of the medicinal liquid L1 ejected from the nozzle 51 expands into a liquid film shape from the liquid contact position P1, and passes through the central portion of the substrate 9 to reach the periphery of the substrate 9; While the contact position P2 is expanded into a liquid film shape, it flows in the peripheral region K3 of the substrate 9 toward the downstream side in the rotation direction of the substrate 9 and reaches the peripheral edge portion of the substrate 9. Therefore, the chemical liquids L1 and L2 ejected from the nozzles 51 and 52 are supplied to the entire surface of the substrate 9 as a whole. In addition, although the heat loss of the substrate 9 increases sharply from the center side of the substrate 9 toward the peripheral side due to the rotation of the substrate 9, the chemical liquid L2 sprayed from the second nozzle is mainly supplied to the peripheral area K3 of the substrate 9, so it can be increased The amount of the chemical liquids L1 and L2 supplied to the peripheral region K3 of the substrate 9.

In addition, according to the substrate processing apparatus of this embodiment, the liquid contact position P1 of the chemical liquid L1 ejected from the nozzle 51 and the liquid contact position P2 of the chemical liquid L2 ejected from the nozzle 52 are the same distance from the rotation axis a1. Therefore, it is easier to supply the chemical liquids L1 and L2 discharged from the two nozzles to the entire surface of the substrate 9.

In addition, according to the substrate processing apparatus of this embodiment, the liquid contact position P1 of the chemical liquid L1 ejected from the nozzle 51 and the liquid contact position P2 of the chemical liquid L2 ejected from the nozzle 52 are on the same straight line forming the diameter of the substrate 9, respectively. It is located in the position which clamped the rotation axis a1 between each other. Therefore, for example, when the chemical liquid L1 and the chemical liquid L2 ejected from the two nozzles are parallel to each other and ejected in the same direction when viewed from above the substrate 9, the ejection direction v1 of the chemical liquid L2 ejected from the nozzle 52 may be set to Viewed from above the substrate 9 without having a direction of a component toward the center side of the substrate 9. Therefore, the chemical solution L2 can be efficiently supplied from the nozzle 52 to the peripheral region K3 of the substrate 9.

In addition, according to the substrate processing apparatus of this embodiment, the liquid contact position P2 of the chemical liquid L2 ejected from the nozzle 52 is located at the liquid film formed on the substrate 9 and spreads from the liquid contact position P1 to the periphery of the chemical liquid L1 ejected from the nozzle 51. on. Thereby, compared with the case where the liquid contact position P2 is located at a portion other than the liquid film formed by the chemical liquid L1 ejected from the nozzle 51 on the substrate 9, the splash of the chemical liquid L2 ejected from the nozzle 52 can be reduced.

In addition, according to the substrate processing apparatus of this embodiment, the nozzle 51 ejects the chemical liquid L1 in such a manner that the amount of the chemical liquid L1 from the liquid contact position P1 toward the rotation axis a1 immediately after the liquid contact position P1 is struck is greater than that of the liquid spray After hitting the liquid contact position P1, the amount of the chemical liquid L1 from the liquid contact position P1 toward the side opposite to the rotation axis a1; when viewed from above the nozzle 52 in the direction of the rotation axis a1 of the substrate 9, the nozzle 52 ejects the chemical liquid L2. The ejection direction v1 is a direction including a component v2 along the tangential direction at the liquid contact position P2 of the circle passing through the liquid contact position P2 with the rotation axis a1 as the center, and toward the downstream side of the rotation direction of the substrate 9. Therefore, the chemical liquid L1 ejected from the nozzle 51 easily flows from the liquid contact position P1 toward the center of the substrate 9 while expanding into a liquid film shape, and then reaches the substrate 9 opposite to the liquid contact position P1 with respect to the center of the substrate 9 The perimeter. Thereby, a large amount of chemical liquid is supplied to the first liquid contact position, and a smaller amount of chemical liquid is supplied to each position of the central portion of the substrate than the first liquid contact position. The rotation speed in the circumferential direction of each part of the substrate increases from the rotation axis toward the peripheral edge of the substrate. In addition, the chemical solution supplied to each position of the substrate is stretched in the circumferential direction as the rotation speed in the circumferential direction of each position is increased, and the film thickness is reduced. Therefore, although a greater amount of chemical solution is supplied to the first liquid contact position than the central region of the substrate, the film thickness of the chemical solution is likely to be thinner than the central region of the substrate. A smaller amount of chemical liquid is supplied than the first liquid contact position, but the film thickness of the chemical liquid is less likely to become thinner than the first liquid contact position. Therefore, the uniformity of the film thickness of the chemical liquid in the portion of the substrate surface closer to the center side of the substrate than the first liquid contact position can be improved by the first nozzle. In addition, a part of the medicinal liquid L2 ejected from the nozzle 52 spreads into a liquid film shape from the liquid contact position P2, and flows toward the downstream side of the rotation direction of the substrate 9 in the peripheral region K3 of the substrate 9 and reaches the peripheral portion of the substrate 9. Therefore, the entire surface of the substrate can be supplied with the first nozzle and the second nozzle, and the first nozzle can be used to increase the supply to the portion closer to the rotation axis side than the first liquid contact position, that is, the central region of the substrate. And the uniformity of the film thickness of the chemical liquid in the middle region of the substrate closer to the rotation axis side than the first liquid contact position. In addition, although the heat loss of the substrate 9 increases sharply from the center side of the substrate 9 toward the peripheral side due to the rotation of the substrate 9, the chemical liquid L2 ejected from the second nozzle is mainly supplied to the peripheral area K3 of the substrate 9, so it can be used with The chemical liquid L1 supplied to the central portion of the substrate 9 is increased compared to the chemical liquid L1 supplied to the peripheral area K3 of the substrate 9. Therefore, the uniformity of the temperature distribution on the surface of the substrate 9 can be improved.

In addition, according to the substrate processing apparatus of this embodiment, the flow rate of the chemical liquid L2 sprayed from the nozzle 52 is greater than the flow rate of the chemical liquid L1 sprayed from the nozzle 51, so that more chemical liquid can be supplied from the nozzle 52 to the peripheral region K3 of the substrate 9. L2.

In addition, according to the substrate processing apparatus of this embodiment, viewed from above the nozzle 52 in the direction of the rotation axis a1 of the substrate 9, the discharge direction v1 when the nozzle 52 ejects the liquid medicine L2 is a direction containing the following components: along the rotation axis The component v2 with a1 as the center and passing through the liquid contact position P2 in the tangential direction of the liquid contact position P2 and facing the downstream side of the rotation direction of the substrate 9; along the radial direction of the substrate 9 orthogonal to the tangent, from the liquid contact position P2 faces the component v3 on the side opposite to the rotation axis a1. Therefore, the chemical solution L2 can be efficiently supplied from the nozzle 52 to the peripheral region K3 of the substrate 9.

In addition, according to the substrate processing apparatus of this embodiment, the ejection directions u1 and u2 when the nozzles 51 and 52 eject the chemical liquids L1 and L2 are placed on the opposite sides of the rotation axis a1 with respect to the nozzles 51 and 52. When viewed in the radial direction of the substrate 9, the above-mentioned respective ejection directions u1 and u2 are obliquely downward directions from above the substrate 9. The nozzles 51 and 52 can more accurately eject the liquid medicines L1 and L2 toward the liquid contact positions P1 and P2.

In addition, according to the substrate processing method of this embodiment as described above, at least a portion of the chemical liquid L1 immediately after the liquid contact position P1 is sprayed, overcomes the force acting on the downstream side of the chemical liquid L1 in the direction of rotation of the substrate 9 and These two forces, centrifugal force, flow from the liquid contact position P1 into a liquid film shape while flowing toward the upstream side of the substrate 9 in the direction of rotation and the rotation axis a1 side, and then pass through the central region of the substrate 9 to reach the periphery of the substrate 9. Thereby, a large amount of the chemical liquid L1 is supplied to the liquid contact position P1, and a smaller amount of the chemical liquid L1 is supplied to each position of the central portion of the substrate 9 than the liquid contact position P1. Although a larger amount of the chemical liquid L1 is supplied to the liquid contact position P1 than the central area of the substrate 9, the film thickness of the chemical liquid L1 is likely to be thinner than the central area of the substrate 9. The central region supplies a smaller amount of the chemical solution L1 than the liquid contact position P1, but the film thickness of the chemical solution L1 is less likely to become thinner than the liquid contact position P1. Therefore, the uniformity of the film thickness of the chemical liquid in the portion of the surface of the substrate 9 closer to the center c1 side of the substrate 9 than the liquid contact position P1 can be improved by ejecting the chemical liquid L1 toward the liquid contact position P1. In addition, most of the medicinal liquid L2 ejected to the liquid contact position P2 expands into a liquid film shape from the liquid contact position P2, while flowing toward the downstream side of the rotation direction of the substrate 9 in the peripheral region of the substrate 9 and reaching the peripheral portion of the substrate 9 . Therefore, the chemical liquids L1 and L2 can be supplied to the entire surface of the substrate 9, and the liquid can be supplied to a portion closer to the rotation axis a1 side than the liquid contact position P1, that is, in the central region of the substrate 9 and the intermediate region of the substrate 9 in contact with the liquid. The position P1 depends more on the uniformity of the film thickness of the chemical solution L1 on the side of the rotation axis a1.

The present invention has been shown in detail and described, but the above description is illustrative and not restrictive in all aspects. Therefore, the present invention can appropriately deform and omit the embodiments within the scope of the present invention.

Claims (18)

    A substrate processing apparatus includes: a holding member capable of rotating a substrate while holding the substrate in a substantially horizontal posture; a rotating mechanism that rotates the holding member about a rotation axis; and a first nozzle that ejects medicine from above the substrate. Liquid, so that the chemical liquid sprays the first liquid contact position in the intermediate region between the central region and the peripheral region in the rotation track of the substrate; and the second nozzle ejects the chemical liquid from above the substrate So that the chemical liquid sprays the second liquid contact position in the intermediate region; and when viewed from above the first nozzle in the direction of the rotation axis of the substrate, the first nozzle sprays the chemical liquid when it is sprayed. The direction is a direction including a component along a tangential direction of the circle passing through the first liquid contact position at the first liquid contact position and centered on the rotation axis and upstream of the substrate in the rotation direction; and Along the radial direction of the substrate orthogonal to the tangent line, the portion from the first liquid contact position toward the rotation axis ; The speed component in the tangential direction of the ejection speed when the first nozzle ejects the chemical liquid has the following magnitude: it can overcome the direction of the chemical liquid that is acting on the first liquid contact position due to the rotation of the substrate and faces the substrate; The force on the downstream side of the rotation direction causes the medicinal solution to flow toward the upstream side of the substrate in the rotation direction; the radial velocity component of the ejection speed has the following magnitude: the medicine acting on the first liquid contact position can be overcome The centrifugal force of the liquid caused by the rotation of the substrate causes the chemical solution to flow toward the rotation axis side; when viewed from above the second nozzle in the direction of the rotation axis of the substrate, The ejection direction is a component including a component along the tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position, and facing the downstream side of the substrate in the rotation direction.         The substrate processing apparatus according to claim 1, wherein the first liquid contact position of the chemical liquid ejected by the first nozzle and the second liquid contact position of the chemical liquid ejected by the second nozzle are separated from the rotation The axes are the same distance.         The substrate processing apparatus according to claim 1, wherein a midpoint between the first liquid contact position of the chemical liquid ejected by the first nozzle and a point closest to the first liquid contact position on a periphery of the substrate When defining the center of attention, the second liquid contact position of the chemical liquid ejected by the second nozzle is farther from the rotation axis than the first liquid contact position and closer to the rotation axis than the center point of interest.         The substrate processing apparatus according to any one of claims 1 to 3, wherein the first liquid contact position of the chemical liquid ejected by the first nozzle and the second liquid of the chemical liquid ejected by the second nozzle The contact positions are located on the same straight line forming the diameter of the substrate, and the positions are sandwiched between the rotation axes.         The substrate processing apparatus according to any one of claims 1 to 3, wherein the second liquid contact position of the chemical liquid ejected by the second nozzle is located at the chemical liquid ejected by the first nozzle from the first liquid The contact position spreads around and is formed on the liquid film on the substrate.         A substrate processing apparatus includes: a holding member capable of rotating a substrate while holding the substrate in a substantially horizontal posture; a rotating mechanism that rotates the holding member about a rotation axis; and a first nozzle that ejects medicine from above the substrate. Liquid, so that the chemical liquid sprays the first liquid contact position in the intermediate region between the central region and the peripheral region in the rotation track of the substrate; and the second nozzle ejects the chemical liquid from above the substrate So that the chemical liquid sprays the second liquid contact position in the intermediate region; and the first nozzle sprays the chemical liquid in the following manner: immediately after the first liquid contact position is sprayed, the first liquid contacts the first liquid contact position. The amount of the chemical solution flowing toward the rotation axis side from the position is greater than the amount of the chemical solution flowing from the first liquid contact position to the side opposite to the rotation axis immediately after the first liquid contact position is sprayed; When viewed from above the two nozzles in the direction of the rotation axis of the substrate, the ejection direction when the second nozzle ejects the chemical solution contains the following components Direction: the component along the tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position, and facing the downstream side of the rotation direction of the substrate.         The substrate processing apparatus according to claim 1 or 6, wherein a flow rate of the chemical solution ejected by the second nozzle is greater than a flow rate of the chemical solution ejected by the first nozzle.         The substrate processing apparatus according to claim 1 or 6, wherein the second nozzle is viewed from above the second nozzle in the direction of the rotation axis of the substrate, and the discharge direction when the second nozzle discharges the chemical solution is a direction containing the following components: A component along a tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position toward the downstream side of the rotation direction of the substrate; and along a line orthogonal to the tangent line A component of a radial direction of the substrate from the second liquid contact position toward a side opposite to the rotation axis.         The substrate processing apparatus according to claim 1 or 6, wherein each of the ejection directions when each of the first nozzle and the second nozzle ejects the chemical liquid is opposite to the rotation axis with respect to the nozzles. Each side of the substrate is viewed in a radial direction of the substrate, and each of the ejection directions is an oblique downward direction from above the substrate.         A substrate processing method includes a rotation step of rotating a substrate around a rotation axis while holding the substrate in a substantially horizontal posture, and a first ejection step, in parallel with the rotation step, ejecting medicine from above the substrate. Liquid, so that the chemical liquid sprays the first liquid contact position in the intermediate region between the central region and the peripheral region in the rotation track of the substrate; and a second spraying step, the rotation step, and the first spraying step In parallel, the chemical solution is ejected from above the substrate so that the chemical solution sprays the second liquid contact position in the intermediate region; and the ejection direction of the chemical solution ejected in the first ejection step is from The direction in which the medicinal solution is viewed from above in the direction of the rotation axis contains the following components: along the tangent direction of the circle passing through the first liquid contact position centered on the rotation axis and passing through the first liquid contact position, and facing the aforementioned The component on the upstream side of the rotation direction of the substrate; and along the radial direction of the substrate orthogonal to the tangent, from the first The component of the liquid contact position facing the rotation axis; the speed component of the tangential direction of the spray speed of the chemical liquid sprayed in the first spraying step has the following size: it can overcome the first liquid contact due to the rotation of the substrate The position of the medicinal solution toward the downstream side of the substrate in the direction of rotation causes the medicinal fluid to flow toward the upstream side of the substrate in the direction of rotation; the radial velocity component of the ejection speed has the following magnitude: can overcome the effect The centrifugal force of the chemical solution at the first liquid contact position caused by the rotation of the substrate causes the chemical solution to flow toward the rotation axis side; the spray direction of the chemical solution sprayed in the second spraying step is from The medicinal solution is viewed from above in the direction of the rotation axis and contains the following components: along a tangential direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position, and toward the substrate The component on the downstream side of the rotation direction.         The substrate processing method according to claim 10, wherein the first liquid contact position of the chemical liquid ejected in the first ejection step and the second liquid contact position of the chemical liquid ejected in the second ejection step The system is the same distance from the aforementioned rotation axis.         The substrate processing method according to claim 10, wherein the contact point between the first liquid contact position and the point closest to the first liquid contact point in the periphery of the substrate is obtained by the first liquid contact position of the chemical liquid ejected in the first ejection step. When the midpoint is defined by the midpoint, the second liquid contact position of the medicinal solution sprayed in the second spraying step is farther from the rotation axis than the first liquid contact position and closer to the rotation than the midpoint of attention. axis.         The substrate processing method according to any one of claims 10 to 12, wherein the first liquid contact position of the chemical liquid sprayed in the first spraying step and the chemical liquid that is sprayed in the second spraying step are The second liquid contact positions are located on the same straight line forming the diameter of the substrate, and the positions are sandwiched between the rotation shafts.         The substrate processing method according to any one of claims 10 to 12, wherein the second liquid contact position of the chemical liquid ejected in the second ejecting step is located at the position where the chemical liquid ejected in the first ejecting step is The first liquid-contacting position spreads around and is formed on a liquid film on the substrate.         A substrate processing method includes a rotation step of rotating a substrate around a rotation axis while holding the substrate in a substantially horizontal posture, and a first ejection step, in parallel with the rotation step, ejecting medicine from above the substrate. Liquid, so that the chemical liquid sprays the first liquid contact position in the intermediate region between the central region and the peripheral region in the rotation track of the substrate; and a second spraying step, the rotation step, and the first spraying step In parallel, the chemical solution is ejected from above the substrate so that the chemical solution sprays the second liquid contact position in the intermediate region; and the first ejection step is to eject the chemical solution as follows: The amount of the medicinal liquid flowing from the first liquid contact position to the rotation axis side after the first liquid contact position is greater than that from the first liquid contact position to the rotation axis immediately after the first liquid contact position is sprayed. The amount of the chemical liquid on the opposite side; the discharging direction of the chemical liquid discharged in the second discharging step is from above to above The medicinal solution is viewed in the direction of the rotation axis and contains the following components: along the tangent direction of the circle passing through the second liquid contact position centered on the rotation axis and passing through the second liquid contact position, and rotating toward the substrate The component on the downstream side.         The substrate processing method according to claim 10 or 15, wherein a flow rate of the chemical solution ejected in the second ejection step is greater than a flow rate of the chemical solution ejected in the ejection step.         The substrate processing method according to claim 10 or 15, wherein the ejection direction of the chemical solution ejected in the second ejecting step is a direction in which the chemical solution is viewed from above in the direction of the rotation axis and contains the following components: along A component of the circle having the rotation axis as the center and passing through the second liquid contact position in a tangential direction of the second liquid contact position and facing the downstream side of the rotation direction of the substrate; and along the substrate orthogonal to the tangent The component in the radial direction from the second liquid contact position toward the side opposite to the rotation axis.         The substrate processing method according to claim 10 or 15, wherein the ejection directions when the chemical solution is ejected in each of the ejection steps of the first ejection step and the second ejection step are ejected relative to the ejection steps. Each of the chemical liquids is viewed from the side of the substrate opposite to the rotation axis in the radial direction of the substrate, and each of the ejection directions is an oblique downward direction from above the substrate.