TW201824224A - 用於薄膜電晶體的陣列基板及包含該陣列基板的顯示裝置 - Google Patents
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
本發明揭露一種碳同素異形體以及一種包括該碳同素異形體的顯示裝置。薄膜電晶體陣列基板包括:一基板;一閘極電極,位於該基板上;一主動層,包含一第一主動層,該第一主動層與該閘極電極相對並且與該閘極電極相鄰從而包括一半導體材料和複數個碳同素異形體、以及一第二主動層,該第二主動層與該第一主動層接觸並且包含一半導體材料;一閘極絕緣膜,設置在該閘極電極與該主動層之間;以及一源極電極和一汲極電極,分別與該主動層接觸。
Description
本發明係關於一種薄膜電晶體陣列基板以及一種包含該薄膜電晶體陣列基板的顯示裝置。
近來,隨著多媒體的發展,平板顯示(FPD)裝置的重要性在不斷增加。因此,液晶顯示(LCD)裝置、電漿顯示面板(PDP)、場發射顯示(FED)裝置、有機發光顯示(OLED)裝置等各種顯示裝置投入實際使用。
用於驅動顯示裝置的方法包括被動式矩陣方法和使用薄膜電晶體的主動式矩陣方法。在被動式矩陣方法中,陽極和陰極形成為彼此正交並且一條線被選擇驅動,而在主動式矩陣方法中,薄膜電晶體連接到每個像素電極以根據開/關切換執行驅動。
薄膜電晶體是非常重要的,不僅因為薄膜電晶體諸如電子遷移率和漏電流的基本特性,而且因為其可以保持長壽命的耐久性和電性可靠性。特別地,薄膜電晶體的主動層主要由非晶矽、多晶矽、或氧化物半導體形成。雖然非晶矽的優點在於成膜程序簡單且生產成本低,但不利的是電子遷移率低至0.5cm2/Vs。氧化物半導體具有約108的開/關比率和低漏電流,但其不利之處在於電子遷移率為10cm2/Vs,低於多晶矽的電子遷移率。多晶矽具有約100cm2/Vs的高電子遷移率,但其不利之處在於與氧化物半導體相比具有低開/關比率,並且將其應用於大面積區域非常昂貴。因此,對於改善薄膜電晶體的特性,例如電子遷移率、漏電流、開/關比率等的研究也一直在持續中。
本發明提供一種能够通過形成包括碳同素異形體的主動層來改善元件特性的薄膜電晶體陣列基板以及一種包含該薄膜電晶體陣列基板的顯示裝置。
在一態樣中,提供一種薄膜電晶體陣列基板,包括:一基板;一閘極電極,位於該基板上;一主動層,包含一第一主動層,該第一主動層與閘極電極相對並且與該閘極電極相鄰從而包含一半導體材料和複數個碳同素異形體、以及一第二主動層,該第二主動層與該第一主動層接觸並且包含一半導體材料;一閘極絕緣膜,設置在該閘極電極與該主動層之間;以及一源極電極和一汲極電極,分別與該主動層接觸。
該第二主動層還包含複數個碳同素異形體,並且該第一主動層中的該等碳同素異形體所佔的含量比率高於該第二主動層中的該等碳同素異形體所佔的含量比率。
該等碳同素異形體分散在該半導體材料內。
該第一主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
該第二主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
該等碳同素異形體具有一維結構或二維結構。
該等碳同素異形體係選自由還原氧化石墨烯(rGO)、非氧化石墨烯、石墨烯奈米碳管、碳奈米管(CNT)、以及其混合物所組成的群組的其中一種。
半導體材料係選自由陶瓷半導體、有機半導體、過渡金屬硫族化物、氧化物半導體、以及其混合物所組成的群組的其中一種。
基於100wt%的該半導體材料的含量,該第一主動層中的該等碳同素異形體的含量為0.05wt%至1wt%。
基於100wt%的該半導體材料的含量,該第二主動層中的該等碳同素異形體的含量為0.001wt%至0.01wt%。
該第一主動層和該第二主動層的厚度分別在1nm至10nm的範圍內。
在一態樣中,提供一種顯示裝置,包括:一基板;一閘極電極,位於該基板上;一主動層,包括一第一主動層,該第一主動層與該閘極電極相對並且與該閘極電極相鄰從而包含一半導體材料和複數個碳同素異形體、以及一第二主動層,該第二主動層與該第一主動層接觸並且包含一半導體材料;一閘極絕緣膜,設置在該閘極電極與該主動層之間;以及一源極電極和一汲極電極,分別與該主動層接觸。一有機絕緣膜,位於該源極電極和該汲極電極上;以及一像素電極,位於該有機絕緣膜上。
該第二主動層還包含複數個碳同素異形體,並且該第一主動層中的該等碳同素異形體所佔的含量比率高於該第二主動層中的該等碳同素異形體所佔的含量比率。
該等碳同素異形體分散在該半導體材料內。
該第一主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
該第二主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
該等碳同素異形體具有一維結構或二維結構。
該等碳同素異形體係選自由還原氧化石墨烯(rGO)、非氧化石墨烯、石墨烯奈米帶、碳奈米管(CNT)、以及其混合物所組成的群組的其中一種。
半導體材料係選自由陶瓷半導體、有機半導體、過渡金屬硫族化物、氧化物半導體、以及其混合物所組成的群組的其中一種。
基於100wt%的該半導體材料含量,該第一主動層中的該等碳同素異形體的含量為0.05wt%至1wt%。
基於100wt%的該半導體材料含量,該第二主動層中的該等碳同素異形體的含量為0.001wt%至0.01wt%。
該第一主動層和該第二主動層的厚度分別在1nm至10nm的範圍內。
該顯示裝置進一步包括一有機發光二極體,電性連接至該像素電極;一封裝層,位於該有機發光二極體上;以及一覆蓋窗口,位於該封裝層上。
該顯示裝置還包括一共同電極,設置為與在同一平面上或在其下部上的該像素電極隔開;以及一液晶層,設置在該共同電極上。
100‧‧‧薄膜電晶體陣列基板
110‧‧‧基板
120‧‧‧閘極電極
130‧‧‧閘極絕緣膜
140‧‧‧主動層
142‧‧‧第一主動層
146‧‧‧第二主動層
150a‧‧‧源極電極
150b‧‧‧汲極電極
160‧‧‧有機絕緣膜
165‧‧‧通孔
170‧‧‧像素電極
175‧‧‧堤層
180‧‧‧共同電極
190‧‧‧有機層
200‧‧‧相對電極
210‧‧‧封裝層
220‧‧‧覆蓋窗口
OLED‧‧‧有機發光二極體
後附圖式,被包含以提供本發明進一步理解並且被併入並構成本說明書一部分,說明瞭本發明實施例並且與說明書一起用於解釋本發明之原理。在該等圖式中:
第1圖和第2圖係顯示說明用於製備本發明的碳同素異形體半導體組合物的程序的示意圖。
第3圖係顯示根據本發明一示例性實施例之薄膜電晶體陣列基板的剖面圖。
第4圖和第5圖係顯示說明根據本發明示例性實施例之主動層的剖面圖。
第6圖至第8圖係顯示說明根據本發明示例性實施例之薄膜電晶體陣列基板的各種結構的剖面圖。
第9圖和第10圖係顯示說明根據本發明示例性實施例之顯示裝置的剖面圖。
第11圖係顯示說明僅由半導體材料製成的主動層的拉曼光譜分析結果的曲線圖。
第12圖係顯示說明混合了半導體材料和碳同素異形體的主動層的拉曼光譜分析結果的曲線圖;
第13圖係顯示說明根據比較例1和2以及示例所製造之薄膜電晶體的電流-電壓曲線的曲線圖。
第14圖係顯示說明表示第13圖的汲極電流的平方根值的SQRT電壓的曲線圖。
以下,將參考說明性後附圖式詳細闡述本發明之示例性實施例。另外,在為後附圖式的組成元件添加參考數字時,應當注意,在整個說明書中,相同的組成元件由相同的參考數字表示,即使他們顯示在不同的後附圖式中,相似的參考數字實質上表示相似組件。此外,在解釋本發明的示例性實施例時,如果確定對於與本發明相關的習知功能或配置的詳細描述可能會模糊本發明的要點,將省略其詳細描述。
在描述本發明的組成元件時,可以使用例如第一、第二、A、B、(a)、以及(b)。這些術語旨在將組成元件與其他組成元件相區分,並且組成元件的性質、順序、次序等不受這些術語的限制。當一組成元件被描述為與另一組成元件「接合」、「耦合」、或「連接」時,可以理解為該組成元件被直接接合、耦合、或連接到不同的組成元件,但是還可以理解為不同的組成元件在每個組成元件之間接合、耦合、或連接。在相同文本中,當一組成元件被描述為形成在不同組成元件的「之上」或「之下」時,應理解為包括組成元件直接形成在不同組成元件上的情況以及組成元件藉由在其間插入另一個組成元件而間接形成在不同組成元件上的情況。
根據以下描述之本發明的顯示裝置可以是一種有機發光顯示裝置、一種液晶顯示裝置、一種電泳顯示裝置等等。在本發明中,描述液晶顯示裝置作為一示例性實施例。液晶顯示裝置由薄膜電晶體陣列基板、彩色濾光片基板、以及液晶層組成,其中像素電極和共同電極形成在該薄膜電晶體上,該液晶層插入在該薄膜電晶體陣列基板與該彩色濾光片基板之間。在這種液晶顯示裝置中,液晶由垂直地或水平地施加到共同電極和像素電極的電場驅動。根據本發明的顯示裝置還可以用在有機發光顯示裝置中。例如,有機發光顯示裝置包括與薄膜電晶體連接的第一電極和第二電極、以及設置在其間由有機材料製成的發光層。因此,自第一電極提供的電洞和自第二電極提供的電子在發光層中組合以形成電洞-電子對的激子,並且該等激子通過在其返回基態時所產生的能量發光。含有以下所述本發明的碳同素異形體的主動層可以用在上述顯示裝置的薄膜電晶體中。
下文中,參考後附圖式說明本發明的示例性實施例。
本發明揭露了一種包括碳同素異形體和半導體材料的薄膜電晶體,更具體而言,揭露了一種其中形成包括碳同素異形體和半導體材料的主動層的薄膜電晶體。該薄膜電晶體用作顯示裝置的開關元件或驅動元件。
<碳同素異形體>
揭露在本發明中的碳同素異形體表示一種具有彼此共價鍵結的碳原子的多環芳香族分子。共價鍵結的碳原子可以形成6員環作為重複單元,另外還可以包括選自5員環和7員環中的至少一個。碳同素異形體可以是單層,或者其可以包括堆疊在碳同素異形體的不同層上的複數個碳同素異形體層。碳同素異形體可以具有一維或二維結構。碳同素異形體具有約100nm的最大厚度,具體而言約10nm至約90nm,更具體而言約20nm至約80nm。
碳同素異形體主要可以通過四種不同方法來製造,例如物理剝離、化學氣相沉積、化學剝離、以及磊晶生長。物理剝離是一種將透明膠帶黏附到石墨樣品上然後將其去除以便在透明膠帶的表面上獲得與石墨分離的碳同素異形體薄層的方法。化學氣相沉積是一種通過在將要生長碳結晶同素異形體的基板表面上吸收/分解具有高動能的氣體或蒸汽形式的碳前軀體以便分離碳原子並且在相應碳原子之間形成原子鍵來生長碳結晶同素異形體的方法。化學剝離利用石墨的氧化還原特性,將石墨加入到硫酸和硝酸的混合物中,且將羧基化合物附著到碳同位素板的邊緣。將所得物通過氯化的薄醇轉化為醯氯,然後使用十八胺再次形成碳同素異形體醯胺。當使用諸如四氫呋喃的溶液回收碳同素異形體醯胺時,發生粉化,並且獲得單獨的碳同素異形體薄層。磊晶生長是一種通過在1500℃的高溫下加熱碳化矽(SiC)來獲得碳同素異形體的方法,從而去除矽(Si),碳同素異形體由剩餘的碳獲得。
使用在本發明中的碳同素異形體可以包括還原氧化石墨烯(rGO)、非氧化石墨烯、石墨烯奈米帶、碳奈米管(CNT)等。還原氧化石墨烯(GO)是石墨烯的還原形式,還原氧化石墨烯可以通過還原石墨烯氧化物來製備,而還原氧化石墨烯是通過將强酸加入待氧化的石墨來製備的並且通過化學方法形成小顆粒。非氧化石墨烯是指通過除了氧化還原程序以外之上述用於製備碳同素異形體的方法中的一種方法製備的碳同素異形體。石墨烯奈米帶通過將石墨烯切割為奈米寬度的帶狀而製備並且根據其寬度具有恆定的能量帶 隙。石墨烯奈米帶可以由含有碳同素異形體的單體或通過切割碳奈米管並將其鋪展成平面來合成。除了上述類型的碳同素異形體以外,習知的碳同素異形體結構如石墨烯奈米粒等可以用於本發明的碳同素異形體。
本發明的碳同素異形體以片狀形式來使用。通過將其中碳同素異形體分散在溶劑中的分散體塗佈在基材上,乾燥溶劑,並向其施加物理力來製備碳同素異形體片。作為施加物理力的方法,可以通過諸如球磨機、珠磨機、超音波均化器以及攪拌的方法來獲得碳同素異形體片。
<半導體材料>
本發明的半導體材料是可以用溶液塗佈的陶瓷半導體、有機半導體、過渡金屬硫族化物、或氧化物半導體。
陶瓷半導體利用陶瓷的電性能。由於陶瓷被某些離子或原子限制,其不能自由移動因此幾乎不帶電。然而,當從外部施加電場時,由於響應狀態的改變而重新排列,被限制的電子可以移動。陶瓷半導體由通過諸如矽(Si)、鍺(Ge)、硒(Se)、鋁(Al)、鈦(Ti)、鋯(Zr)等的金屬元素與氧(O)、碳(C)、氮(N)等之間的結合所製備的氧化物、碳化物、和氮化物組成。典型的陶瓷半導體包括鈦酸鋇(BaTiO3)。
有機半導體是具有半導體特性的有機化合物並且可以包括聚合物有機半導體或低分子有機半導體。聚合物有機半導體的示例可以包括聚[(9,9-二辛基芴基-2,7-二基)-共-噻吩](F8T2)、聚[(5,6-二氫-5-辛基-4,6-二氧代-4H-噻吩並[3,4-C]吡咯-1,3-二基){4,8-雙[(2-丁基辛基)氧]苯並[1,2-b:4,5-b’]二噻吩-2,6-二基}](PBDTBOTPDO)、聚〔〔5-(2-乙基己基)-5,6-二氫-4,6-二氧代-4H-噻吩並〔3,4-c〕吡咯-1,3-二酮二][4,8-雙[(2-乙基己基)氧]苯並[1,2-b:4,5-b’]二噻吩-2,6-二基]](PBDT-TPD)、聚[1-(6-{4,8-雙[(2-乙基己基)氧基]-6-甲基苯並[1,2-b:4,5-b’]二噻吩-2-基}-3-氟-4-甲基[3,4-b]噻吩-2-基)-1-辛酮](PBDTTT-CF)、聚[N-9’-十七烷基-2,7-哢唑-alt-5,5-(4’,7’-二(2-噻吩基)-2’,1’,3’-苯並噻二唑(PCDTBT)、聚[[9-(1-辛基壬基)-9H-哢唑-2,7-二基]-2,5-噻吩二基-2-2,1,3-苯並噻二唑-4,7-二基-2,5-噻吩二基])、聚[2,6-(4,4-雙-(2-乙基己基)-4H-環戊二烯並[2,1-b:3,4-b’]二噻吩)-alt-4,7(2,1,3-苯並噻二唑)](PCPDTBT)、 聚[2,7-(9,9-二辛基芴)雙(噻吩-2-基)b(PFO-DBT)、聚[雙(4-苯基)(2,4,6-三甲基苯基)胺](PTAA)、聚[(5,6-二氫-5-辛基-4,6-二氧代-4H-噻吩並[3,4-c]吡咯-1,3-二基)[4,8-雙[(2-乙基己基)氧基]苯並[1,2-b:4,5-b’]二噻吩-2,6-二基]]、聚[(9,9-二正辛基芴基-2,7-二基)-酯-(苯並[2,1,3]噻二唑-4,8-二基)](F8BT)、聚(3-十二烷基噻吩-2,5-二基)(P3DDT)、聚(3-己基噻吩-2,5-二基)(P3HT)、聚[2-甲氧基-5-(3’,7’-二甲基辛氧基)-1,4-亞苯基亞乙烯基](MDMOPPV)、聚[2-甲氧基-5-(2-乙基己氧基)-1,4-亞苯基亞乙烯基](MEH-PPV)、聚(3-辛基噻吩-2,5-二基)(P3OT)、以及聚({4,8-雙[(2-乙基己基)氧基]苯並[1,2-b:4,5-b’]二噻吩-2,6-二基}{3-氟-2-[(2-乙基己基)羰基]噻吩並[3,4-b]噻吩二基})(PTB7)等。
低分子有機半導體可以包括例如6,13-雙(三異丙基甲矽烷基乙炔基)並五苯(TIPS-並五苯)、6,13-雙((三乙基甲矽烷基)乙炔基)並五苯(TES並五苯)、5,5’(7-己基-9H-芴-2-基)-2,2’-二噻吩(DH-FTTF)、2,8-二氟-5,11-雙(三乙基甲矽烷基乙炔基)蒽二噻吩(diF-TES-ADT)、5,5’-二己基-2,2’-二噻吩(DH2T)、3,3”-二己基-2,2’:5’,2”:5”,2”-四噻吩(DH4T)、5,5’-二己基-2,2’:5’,2”:5”,2”’:5”,2”’:5’’’’,2”-”-噻吩(DH6T)、2(4,4’-[4,4-雙(2-乙基己基)-4H-矽基[3,2-b:4,5-b’]二噻吩-2,6-二基]雙[7-(5’-己基-[2,2’-聯噻吩]-5-基)-[1,2,5]噻二唑並[3,4-c]吡啶](DTS(PTTh2)、5,5’-雙{[4-(7-己基噻吩-2-基)噻吩-2-基]-[1,2,5]噻二唑並[3,4-c]吡啶}-3,3’-二-2-乙基己基亞甲矽烷基-2,2’-二噻吩)、2,5-二-(2-乙基己基)-3,6-雙-(5”-正-己基-[2,2’,5’,2”]三噻吩-5-基)-吡咯並[3,4-c]吡咯-1,4-二酮(SMDPPEH)、5,11-雙(三乙基甲矽烷基乙炔基)蒽二噻吩(TES-ADT)等。
作為上述有機半導體,可以使用選自聚合物有機半導體和低分子有機半導體中的至少兩種,或者可以使用相互不同的聚合物有機半導體,或者可以使用相互不同的低分子有機半導體。
過渡金屬二硫族元素化合物是一種具有半導體特性的材料並且可以包括過渡金屬硫化物、過渡金屬硒化物、過渡金屬碲化物等。作為過渡金屬二硫族元素化合物,例如,可以使用SnSe2、CdSe、ZnSe、ZnTe、MoS2,MoSe2、MoTe2、WS2、WSe2、WTe2等。
氧化物半導體是具有半導體特性的材料並且可以是含有諸如鎵(Ga)、銦(In)、鋅(Zn)、錫(Sn)、矽(Si)、鋯(Zr)等金屬元素的氧化物。使用的氧化物半導體的示例可以包括IGZO、In2O3、ZnO、IZO、IGO等,但不限於此,也可以使用周知的材料。
<碳同素異形體半導體組合物>
第1圖和第2圖係顯示說明用於製備本發明的碳同素異形體半導體組合物的程序的示意圖。
本發明可以通過混合碳同素異形體和半導體材料來製備碳同素異形體半導體組合物。更具體而言,參考第1圖,製備碳同素異形體薄片和半導體材料。製備粉末狀的碳同素異形體薄片和半導體材料。將碳同素異形體薄片和半導體材料加入溶劑後進行混合以製備碳同素異形體半導體組合物。與上述不同,參考第2圖,本發明的碳同素異形體半導體組合物可以通過混合碳同素異形體分散體來製備,在該碳同素異形體分散體中碳同素異形體分散在含有半導體材料的半導體溶液中。
尤其,所使用的溶劑可以是選自由水;選自乙醇、甲醇、異丙醇、丁醇、2-乙基己醇、甲氧基戊醇、丁氧基乙醇、乙氧基乙氧基乙醇、丁氧基乙氧基乙醇、甲氧基丙氧基丙醇、德克薩斯醇、萜品醇、及其組合的醇;四氫呋喃(THF);甘油、乙二醇、三甘醇、聚乙二醇、丙二醇、二丙二醇、二己二醇、或其烷基醚;甘油、N-甲基-2-吡咯烷酮(NMP)、2-吡咯烷酮、乙醯丙酮、1,3-二甲基咪唑啉酮、硫二甘醇、二甲基亞碸(DMSO)、N,N-二甲基乙醯胺(DMAc)、二甲基甲醯胺(DMF)、環丁碸、二乙醇胺、三乙醇胺、及其組合所組成的群組中的至少其中一種。
為了更好的碳同素異形體的分散性,可以加入其它添加劑或者可以向其照射超音波。當用超音波照射碳同素異形體半導體組合物時,較佳的是在間隔時間內多次照射超音波。例如,使用超音波破碎機將碳同素異形體和半導體材料混合並用强超音波(約250W)照射約30分鐘。通過重複這一程序,可以製備具有良好分散的碳同素異形體的碳同素異形體半導體組合物。
基於100wt%半導體材料固體,在本發明的碳同素異形體-半導體組合物中所使用的碳同素異形體的含量可以在0.001wt%與1wt%之間。尤其是,基於100wt%半導體材料固體,當碳同素異形體的含量等於或大於0.001wt%時,可以提高電荷遷移率,而基於100wt%半導體材料固體,當碳同素異形體的含量等於或小於1wt%時,能够顯示出防止開關比降低的效果。
在下文中,將說明包含使用上述碳同位素半導體組合物的主動層的薄膜電晶體及其顯示裝置。
第3圖係顯示根據本發明一示例性實施例之薄膜電晶體陣列基板的剖面圖。第4圖和第5圖係顯示說明根據本發明示例性實施例之主動層的剖面圖。第6圖至第8圖係顯示說明根據本發明示例性實施例之薄膜電晶體陣列基板的各種結構的剖面圖。
<薄膜電晶體陣列基板>
使用其中閘極電極設置在主動層下方的底閘型薄膜電晶體作為示例性實施例來解釋揭露在本發明中的薄膜電晶體陣列基板100。
參考第3圖,閘極電極120設置在基板110上。基板110由透明或不透明的玻璃、塑料、或金屬製成。閘極電極120可以由選自於由銅(Cu)、鉬(Mo)、鋁(Al)、鉻(Cr)、金(Au)、鈦(Ti)、鎳(Ni)、釹(Nd)、鉭(Ta)、和鎢(W)、及其合金所組成的群組中的任何一種的單層或多層製成。閘極絕緣膜130設置在閘極電極120上,用於使閘極電極120絕緣。閘極絕緣膜130由氧化矽膜(SiOx)、氮化矽膜(SiNx)、或其多層製成。
主動層140設置在閘極絕緣膜130上。主動層140由本發明的碳同素異形體半導體組合物形成。本發明的主動層140包括第一主動層142和第二主動層146。第一主動層142設置為鄰近該閘極電極120,而第二主動層146設置為與閘極電極120間隔開,其間具有第一主動層142。第一主動層142形成主動層140的下部,而第二主動層146設置在第一主動層142的頂部上並且形成主動層140的上部。
第一主動層142是其中形成主動層通道的一層,並且第一主動層142包含一半導體材料和複數個碳同素異形體。在第一主動層142中,通過使第 一主動層142用作半導體,半導體材料控制閾值電壓。在第一主動層142中,通過使載子快速移動穿過碳同素異形體,複數個碳同素異形體加速電子遷移率。第一主動層142的大部分由半導體材料製成,並且碳同素異形體分散在半導體材料中。特別地,由於碳同素異形體分散在該第一主動層142中,電子和電洞在半導體材料中最初根據半導體材料的電荷遷移率移動,然後在被設置為接近導體的碳同素異形體中快速移動。電子和電洞可以與半導體和碳同素異形體一起移動,從而顯著地提高電荷遷移率。
第二主動層146是具有向第一主動層142的通道提供載子的作用的一層,並且第二主動層146可以僅由半導體材料製成,或者第二主動層146可以具有分散在半導體材料中的複數個碳同素異形體。在第二主動層146中,半導體材料使得第二主動層146用作半導體。當第二主動層146含有複數個碳同素異形體時,複數個碳同素異形體允許載子快速移動穿過碳同素異形體,從而加速電子遷移率。
參考第4圖,碳同素異形體在第一主動層142中所佔的含量比率可以高於碳同素異形體在第二主動層146中所佔的含量比率。例如,當第一主動層142和第二主動層146中的每一個的半導體固體含量為100g時,第一主動層142的碳同素異形體可以形成為具有0.1g的含量,並且第二主動層146的碳同素異形體可以形成為具有0.01g的含量。含量比率較高的碳同素異形體意味著碳同素異形體的特性用作導體。因此,通過提高其中形成通道的第一主動層142中的碳同素異形體的含量比率,可以加速載子移動穿過通道的遷移率。因此,具有的優勢是能夠提高主動層140的電子遷移率。即使當第二主動層146的碳同素異形體的含量比率形成為相對小於第一主動層142的碳同素異形體的含量比率時,在第二主動層146中也不會形成實質的通道,因此第二主動層146可以有助於向第一主動層142提供載子,而對電子遷移率沒有顯著的影響。
基於100wt%的半導體材料含量,第一主動層142中碳同素異形體的含量為0.05wt%至1wt%。更具體而言,基於100wt%的半導體材料,當碳同素異形體的含量等於或大於0.05wt%時,可以提高主動層的電子遷移率,而基於100wt%的半導體材料含量,當碳同素異形體的含量等於或小於1wt%時,可以防止電晶體的閾值電壓沿負(-)方向移動。
第二主動層146中可以不含有碳同素異形體,但是當第二主動層146中含有碳同素異形體時,基於100wt%的半導體材料,第二主動層146中的碳同素異形體的含量為0.001wt%至0.01wt%。更具體而言,基於100wt%的半導體材料含量,當碳同素異形體的含量等於或大於0.001wt%時,可以提高主動層的電子遷移率,而基於100wt%的半導體材料含量,當碳同素異形體的含量等於或小於0.01wt%時,可以防止電晶體的閾值電壓沿負(-)方向移動。作為參考,100wt%半導體材料意味著100wt%半導體材料固體,並且是指碳同素異形體固體相對於100wt%半導體材料固體的重量百分比wt%。
第一主動層142具有1nm至10nm的厚度。當第一主動層142的厚度等於或大於1nm時,可以防止通道形成更小的厚度,而當第一主動層142的厚度等於或小於10nm時,可以防止主動層變厚。第二主動層146可以具有約1nm至約10nm的厚度。當第二主動層146的厚度等於或大於1nm時,其易於向通道提供載子,而當第二主動層146的厚度等於或小於10nm時,可以防止主動層變厚。
同時,包含在第一主動層142或第二主動層146中的碳同素異形體的含量比率可以形成斜率。
參考第3圖和第5圖,當在第一主動層142和第二主動層146中含有碳同素異形體時,隨著第一主動層142和第二主動層146的碳同素異形體遠離閘極電極120,第一主動層142和第二主動層146的含量比率可以減小。由於第一主動層142設置為鄰近閘極電極120,所以在第一主動層142中與閘極電極120相鄰的區域中形成一通道。因此,可以通過使在第一主動層142的通道區域中的碳同素異形體的含量比率達到最高來提高主動層的電子遷移率。此外,碳同素異形體的含量比率從第一主動層142到第二主動層146逐漸減小,這是逐漸遠離閘極電極120的方向。碳同素異形體的電子遷移率增强特性在通道區域中表現出最佳效果並且用於在通道區域之外的區域中提供載子。因此,碳同素異形體的含量比率在主動層140的通道區域中最高,並且隨著與通道區域越來越遠而逐漸減小。
上述主動層140是通過在其上形成有閘極絕緣膜130的基板110上兩次塗佈上述碳同素異形體半導體組合物來形成,以便包括第一主動層142和第 二主動層146。用於塗佈碳同素異形體半導體組合物的示例性方法可以包括旋塗、狹縫塗佈、網版印刷、噴墨印刷等,並且可以使用任何方法,只要其係關於塗佈溶液即可。通過在250℃下加熱碳同素異形體半導體薄膜2小時來除去溶劑。然後,本發明的主動層140可以通過經微影蝕刻方法圖案化碳同素異形體半導體薄膜來製備。
與主動層140的一側接觸的源極電極150a和與主動層140的另一側接觸的汲極電極150b設置在主動層140上。源極電極150a和汲極電極150b可以由單層或多層形成。當源極電極150a和汲極電極150b由單層形成時,它們可以由選自於由鉬(Mo)、鋁(Al)、鉻(Cr)、金(Au)、鈦(Ti)、鎳(Ni)、釹(Nd)、和銅(Cu)、及其合金所組成的群組中的任何一種製成。此外,當源極電極150a和汲極電極150b由多層形成時,它們可以由雙層的鉬/鋁-釹、鉬/鋁、或鈦/鋁或者三層的鉬/鋁-釹/鉬、鉬/鋁/鉬、或鈦/鋁/鈦形成。
在本發明的上述主動層140中,當通過將碳同素異形體分散在半導體材料中而將電壓施加到源極電極150a和汲極電極150b時,電子和電洞移動到主動層140的通道。更具體而言,由於碳同素異形體分散在主動層140的通道中,電子和電洞根據半導體材料的電荷遷移率在半導體材料中移動,並且在靠近導體設置的碳同素異形體中非常快速地移動。隨著電子和電洞沿著半導體和碳同素異形體移動,電荷遷移率可以顯著地提高。更具體而言,雖然半導體材料具有電子遷移率降低的特性,這是由於電子運動期間發生的散射現象,但散射很少發生在碳同素異形體內,從而可以消除電子遷移率降低的風險。
另外,因為本發明的主動層140含有少量碳同素異形體,由於碳同素異形體之間的接觸(或化學鍵結)幾乎不能形成載子移動的路徑。因此,可以防止由於主動層140的半導體特性的劣化導致的關閉電流的增加。
同時,本發明的薄膜電晶體陣列基板具有與薄膜電晶體相關的各種結構。
參考第6圖,本發明的薄膜電晶體陣列基板形成為具有底閘型結構,其中源極電極150a和汲極電極150b可以設置在主動層140與閘極絕緣膜130之間。更具體而言,閘極電極120設置在基板110上,並且閘極絕緣膜130設置在 閘極電極120上。彼此間隔開的源極電極150a和汲極電極150b可以設置在閘極絕緣膜130上,並且主動層140可以設置為與閘極絕緣膜130上的源極電極150a和汲極電極150b接觸。更具體而言,主動層140可以設置為使得第一主動層142鄰近閘極電極120設置,而第二主動層146與閘極電極120間隔開。因此,允許在具有高含量比率的碳同素異形體的第一主動層142中形成一通道。
另外,參考第7圖,本發明由頂閘型結構組成的薄膜電晶體陣列基板的特徵在於閘極電極120、源極電極150a、以及汲極電極150b可以設置在閘極絕緣膜130上。更具體而言,主動層140設置在基板110上,並且閘極絕緣膜130設置在主動層140上。彼此間隔開的源極電極150a和汲極電極150b可以設置在閘極絕緣膜130上並且與主動層140接觸,並且閘極電極120可以插入在源極電極150a與汲極電極150b之間。特別地,主動層140可以設置為使得第一主動層142鄰近閘極電極120設置,而第二主動層146被設置為與閘極電極120間隔開。因此,一通道被設置為形成在具有高含量比率的碳同素異形體的第一主動層142上。
此外,參考第8圖,本發明由頂閘型結構組成的薄膜電晶體陣列基板的特徵在於源極電極150a和汲極電極150b可以設置在主動層140的下方。更具體而言,彼此間隔開的源極電極150a和汲極電極150b可以設置在基板110上,並且主動層140可以被設置為在源極電極150a和汲極電極150b上分別與源極電極150a和汲極電極150b接觸。閘極絕緣膜130可以設置在主動層140上,並且閘極電極120可以設置在閘極絕緣膜130上。特別地,主動層140可以設置為使得第一主動層142鄰近閘極電極120設置,並且第二主動層146設置為與閘極電極120間隔開。因此,一通道被設置為形成在具有高含量比率的碳同素異形體的第一主動層142上。
在下文中,將參照第9圖和第10圖說明具有本發明的薄膜電晶體陣列基板的顯示裝置。下面將揭露根據第一實施例之包括薄膜電晶體陣列基板的顯示裝置,並且將省略任何重複的描述。第9圖係顯示說明根據本發明一示例實施例之液晶顯示裝置的剖面圖,以及第10圖係顯示說明根據本發明一示例實施例之有機發光顯示裝置的剖面圖。
<顯示裝置>
參考第9圖,有機絕緣膜160形成在源極電極150a和汲極電極150b上。有機絕緣膜160是用於使其下方不平整之處變得平坦化並且可以由諸如光聚合物、聚醯亞胺、苯並環丁烯樹脂、丙烯酸酯樹脂等的有機材料製成。有機絕緣膜160具有露出汲極電極150b的通孔165。儘管未顯示,但是可以在源極電極150a和極電極150b上設置由氧化矽(SiOx)、氮化矽(SiNx)、或其多層製成的鈍化膜。
像素電極170和共同電極180設置在有機絕緣膜160上。像素電極170通過形成在有機絕緣膜160上的通孔165連接至汲極電極150b。像素電極170由例如氧化銦錫(ITO)和氧化銦鋅(IZO)之透明並且導電的材料形成。共同電極180由與像素電極170相同的材料製成。像素電極170和共同電極180交替地設置,並且在像素電極170與共同電極180之間形成水平電場,從而驅動設置在像素電極170和共同電極180上的液晶層。
已經說明的本發明的示例性實施例是關於一種其中像素電極和共同電極設置在同一平面上的面內切換(IPS)液晶顯示裝置。然而,本發明不限於此,相反地共同電極可以設置在像素電極下方,或者共同電極可以設置在與薄膜電晶體陣列基板相對的彩色濾光片陣列基板上。
同時,參考第10圖,本發明的顯示裝置可以是一種包括有機發光二極體的有機發光顯示裝置。更具體而言,有機絕緣膜160設置在源極電極150a和汲極電極150b上。有機絕緣膜160具有暴露汲極電極150b的通孔165。
像素電極170設置在有機絕緣膜160上。像素電極170通過有機絕緣膜160上的通孔165連接到汲極電極150b。堤層175設置在像素電極170上。堤層175可以是通過露出像素電極170的一部分來定義像素的像素定義層。有機層190設置在堤層175和暴露的像素電極170上。有機層190包括通過電子與電洞之間的結合發光的發光層,並且有機層190可以包括電洞注入層、電洞傳輸層、電子傳輸層、或者電子注入層。相對電極200設置在其上形成有有機層190的基板110上。相對電極200是陰極並且可以由具有低功函數的鎂(Mg)、鈣(Ca)、鋁(Al)、銀(Ag)、或其合金製成。藉此,形成了一種包括像素電極170、有機層190、以及相對電極200的有機發光二極體(OLED)。
封裝層210形成在其上形成有機發光二極體(OLED)的基板110上。封裝層210封裝包括底層的有機發光二極體(OLED)的基板110,並且封裝層210可以由無機膜、有機膜、或其多層結構組成。覆蓋窗口220設置在封裝層210上並且形成有機發光顯示裝置。
在下文中,將描述根據本發明實施例之關於包括碳同素異形體和半導體材料的主動層的實驗示例。以下實驗示例僅是本發明的示例性實施例,本發明不限於此。
實驗示例1:主動層組成物的分析
將僅由半導體材料和主動層組成的主動層組成物進行拉曼光譜分析,在該主動層組成物中混合有半導體材料和碳同素異形體。特別地,使用石墨烯作為碳同素異形體,並且相對於100wt%的半導體材料固體混合0.1wt%的石墨烯。第11圖顯示說明僅由半導體材料製成的主動層的拉曼光譜分析結果的曲線圖。第12圖顯示說明其中混合有半導體材料和碳同素異形體的主動層的拉曼光譜分析結果的曲線圖。
參考第11圖,僅由半導體材料組成的主動層的拉曼光譜分析結果僅顯示其中形成了主動層的基板的峰。
同時,參考第12圖,在碳同素異形體的存在的情況下,除了基板峰之外,其中混合有半導體材料和石墨烯的主動層的拉曼光譜分析結果顯示了G峰、D峰、2D峰。通常,當石墨烯或碳奈米管存在於薄膜中時,拉曼光譜分析中出現G峰、D峰、以及2D峰。特別地,G峰的位置為1580cm-1,D峰的位置為1340cm-1,2D峰的位置為2700cm-1。以石墨的「g」而被稱為G峰的G峰是石墨材料中常見的峰,由於晶體缺陷而形成峰的D峰是與石墨烯或碳奈米管的缺陷有關的峰。由於當具有1350cm-1能量的聲子的非彈性散射連續兩次發生時2D峰出現,2D峰出現在約2700cm-1處。通常,在單層石墨烯中,2D峰高於G峰,而在多層石墨烯中,2D峰低於G峰。在D峰中,隨著石墨烯或碳奈米管中存在的缺陷數量的增加,峰值增加。因此,基於出現的G、D、以及2D峰,拉曼光譜分析的結果證實了碳同素異形體的存在。
實驗示例2:薄膜電晶體的評估
<比較例1>
如第3圖所示,通過塗佈純主動IGZO形成主動層,並且製備底閘型薄膜電晶體。
<比較例2>
在與上述比較例1相同的程序條件下製造薄膜電晶體,除了相對於100wt%的IGZO固體通過將IGZO溶液與0.1wt%的石墨烯粉末混合形成主動層之外。
<示例>
在與上述比較例1相同的程序條件下製造薄膜電晶體,除了相對於100wt%的IGZO固體通過將IGZO溶液與0.1wt%的石墨烯粉末混合形成第一主動層以及通過在第一主動層上塗佈純IGZO形成第二主動層之外。
測量根據比較例1和2以及示例所製造的薄膜電晶體的電流-電壓曲線,並且顯示於第13圖中;以及測量表示第13圖的汲極電流的平方根值的SQRT電壓,並且顯示於第14圖中。在下表1中顯示閾值電壓和電子遷移率。
參考第13圖、第14圖以及表1,在其中提供僅由IGZO製成的主動層的比較例1中,閾值電壓顯示為-6±0.5V,電子遷移率顯示為3.6±0.7cm2/Vs。在其中提供混合有IGZO和石墨烯的單層主動層的比較例2中,閾值電壓顯示為-14±2V,電子遷移率顯示為14.5±0.9cm2/Vs。在其中堆疊混合有IGZO和石墨烯的第一主動層和僅由IGZO組成的第二主動層的示例中,閾值電壓顯示為-7±0.5V,電子遷移率顯示為7.8±0.4cm2/Vs。
總之,在其中提供僅由IGZO製成的主動層的比較例1中,閾值電壓特性良好但電子遷移率低。此外,在其中提供混合有IGZO和石墨烯的單層主動層的比較例2中,電子遷移率高,但閾值電壓沿負(-)方向移動,因此特性 低。同時,在其中堆疊混合有IGZO和石墨烯的第一主動層和僅由IGZO組成的第二主動層的示例中,與比較例1相比,閾值電壓更高,並且與比較例2相比,電子遷移率也更高。
因此,通過形成具有包含半導體材料和碳同素異形體的雙層結構的主動層,使得複數個碳同素異形體被包含在其中形成有通道的第一主動層上,本發明的優勢在於其可以提高薄膜電晶體的電子遷移率。此外,通過形成與第一主動層相比具有更少量碳同素異形體的第二主動層,本發明的優勢在於可以改善閾值電壓特性。
雖然本發明之實施例以示例性之實施例揭露如上,然而本領域之技術人員應當意識到在不脫離本發明所附之申請專利範圍所揭示之本發明之精神和範圍的情況下,所作之變化與修飾,均屬本發明之專利保護範圍之內。尤其是,在本發明、圖式以及所附申請專利範圍的範圍內,對主題結合配置的組成部分及/或配置可作出各種變化與修飾。除對組成部分及/或配置做出的變化與修飾之外,可替代的用途對本領域技術人員而言將是顯而易見的。
Claims (24)
- 一種薄膜電晶體陣列基板,包括:一基板;一閘極電極,位於該基板上;一主動層,包含一第一主動層,該第一主動層與該閘極電極相對並且與該閘極電極相鄰從而包含一半導體材料和複數個碳同素異形體、以及一第二主動層,該第二主動層與該第一主動層接觸並且包含一半導體材料;一閘極絕緣膜,設置在該閘極電極與該主動層之間;以及一源極電極和一汲極電極,分別與該主動層接觸。
- 如申請專利範圍第1項所述之薄膜電晶體陣列基板,其中該第二主動層進一步包含複數個碳同素異形體,並且該第一主動層中的該等碳同素異形體的含量比率高於該第二主動層中的該等碳同素異形體的含量比率。
- 如申請專利範圍第1項或第2項所述之薄膜電晶體陣列基板,其中該等碳同素異形體分散在該半導體材料內。
- 如申請專利範圍第2項所述之薄膜電晶體陣列基板,其中該第一主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
- 如申請專利範圍第2項所述之薄膜電晶體陣列基板,其中該第二主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
- 如申請專利範圍第1項或第2項所述之薄膜電晶體陣列基板,其中該等碳同素異形體具有一維結構或二維結構。
- 如申請專利範圍第1項或第2項所述之薄膜電晶體陣列基板,其中該等碳同素異形體係選自由還原氧化石墨烯(rGO)、非氧化石墨烯、石墨烯奈米帶、碳奈米管(CNT)、以及其混合物所組成的群組的其中一種。
- 如申請專利範圍第1項或第2項所述之薄膜電晶體陣列基板,其中該半導體材料係選自由陶瓷半導體、有機半導體、過渡金屬硫族化物、氧化物半導體、以及其混合物所組成的群組的其中一種。
- 如申請專利範圍第2項所述之薄膜電晶體陣列基板,其中基於100wt%的該半導體材料的含量,該第一主動層中的該等碳同素異形體的含量為0.05wt%至1wt%。
- 如申請專利範圍第2項所述之薄膜電晶體陣列基板,其中基於100wt%的該半導體材料的含量,該第二主動層中的該等碳同素異形體的含量為0.001wt%至0.01wt%。
- 如申請專利範圍第1項或第2項所述之薄膜電晶體陣列基板,其中該第一主動層和該第二主動層的厚度分別在1nm~10nm的範圍內。
- 一種顯示裝置,包括:一基板;一閘極電極,位於該基板上;一主動層,包含一第一主動層,該第一主動層與該閘極電極相對並且與該閘極電極相鄰從而包含一半導體材料和複數個碳同素異形體、以及一第二主動層,該第二主動層與該第一主動層接觸並且包含一半導體材料;一閘極絕緣膜,設置在該閘極電極與該主動層之間;以及一源極電極和一汲極電極,分別與該主動層接觸。一有機絕緣膜,位於該源極電極和該汲極電極上;以及一像素電極,位於該有機絕緣膜上。
- 如申請專利範圍第12項所述之顯示裝置,其中該第二主動層進一步包含複數個碳同素異形體,並且該第一主動層中的該等碳同素異形體所佔的含量比率高於該第二主動層中的該等碳同素異形體所佔的含量比率。
- 如申請專利範圍第12項或第13項所述之顯示裝置,其中該等碳同素異形體分散在該半導體材料內。
- 如申請專利範圍第13項所述之顯示裝置,其中該第一主動層中的該等碳同素異形體的含量比率隨著遠離該閘極電極而減小。
- 如申請專利範圍第13項所述之顯示裝置,其中該第二主動層中碳同素異形體的含量比率隨著遠離該閘極電極而減小。
- 如申請專利範圍第12項或第13項所述之顯示裝置,其中該等碳同素異形體具有一維結構或二維結構。
- 如申請專利範圍第12項或第13項所述之顯示裝置,其中該等碳同素異形體係選自由還原氧化石墨烯(rGO)、非氧化石墨烯、石墨烯奈米碳管、碳奈米管(CNT)、以及其混合物所組成的群組的其中一種。
- 如申請專利範圍第12項或第13項所述之顯示裝置,其中,該半導體材料係選自由陶瓷半導體、有機半導體、過渡金屬硫族化物、氧化物半導體、以及其混合物所組成的群組的其中一種。
- 如申請專利範圍第13項所述之顯示裝置,其中基於100wt%該半導體材料的含量,該第一主動層中的該等碳同素異形體的含量為0.05wt%至1wt%。
- 如申請專利範圍第13項所述之顯示裝置,其中基於100wt%的該半導體材料的含量,該第二主動層中的該等碳同素異形體含量為0.001wt%至0.01wt%。
- 如申請專利範圍第12項或第13項所述之顯示裝置,其中該第一主動層和該第二主動層之厚度分別在1nm~10nm的範圍內。
- 如申請專利範圍第12項或第13項所述之顯示裝置,進一步包括:一有機發光二極體,電性連接至該像素電極;一封裝層,位於該有機發光二極體上;以及一覆蓋窗口,位於該封裝層上。
- 如申請專利範圍第12項或第13項所述之顯示裝置,還包括:一共同電極,設置為與在同一平面上或在其下部上的該像素電極隔開;以及一液晶層,設置在該共同電極上。
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TWI813023B (zh) * | 2021-09-02 | 2023-08-21 | 鴻海精密工業股份有限公司 | 薄膜電晶體及採用薄膜電晶體的濾波器 |
TWI820891B (zh) * | 2021-09-03 | 2023-11-01 | 南韓商樂金顯示科技股份有限公司 | 薄膜電晶體、其製造方法以及包含其的顯示裝置 |
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TWI517265B (zh) | 2013-08-01 | 2016-01-11 | 國立臺灣科技大學 | 薄膜電晶體的製造方法 |
KR101535619B1 (ko) | 2013-10-04 | 2015-07-09 | 포항공과대학교 산학협력단 | 알킬화 그래핀 옥사이드 조성물 및 그를 포함하는 전계효과 트랜지스터형 가스 센서 |
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TWI737973B (zh) * | 2019-03-22 | 2021-09-01 | 友達光電股份有限公司 | 電子裝置與其製造方法 |
TWI813023B (zh) * | 2021-09-02 | 2023-08-21 | 鴻海精密工業股份有限公司 | 薄膜電晶體及採用薄膜電晶體的濾波器 |
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TWI666622B (zh) | 2019-07-21 |
US10529806B2 (en) | 2020-01-07 |
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