TW201823490A - Linear evaporator having multiple evaporation materials improving greatly the usage rate of the evaporation materials as well as the uniformity of thin film preparation - Google Patents

Abstract

A linear evaporator having multiple evaporation materials is disclosed, comprising a primary crucible, a secondary crucible, a plurality of evaporation material heaters, and an evaporation chamber. The inner walls and outer walls of the primary and the secondary crucibles are sandwiched to form an interlayer, and the interlayer is filled with a heat medium. The primary crucible is provided to carry a first evaporation material while the secondary crucible is provided to carry a second evaporation material; the evaporation material heaters are configured to uniformly heat the first evaporation material and the second evaporation material through the heat medium; the evaporation chamber has a linear evaporation opening and is installed at one side of the primary and the secondary crucibles, in addition, a flow introducing space is arranged inside the evaporation chamber for introducing vapor of the second evaporation material, a heating space for introducing vapor of the primary evaporation material, and the evaporation chamber is provided with an evaporation heater corresponding to the heating space, thereby enabling the temperature in the heating space to be higher than that in the flow introducing space, and the vapor from the primary and the secondary evaporation materials is flowing out from the linear evaporation opening all together for evaporation process, thereby, the disclosed improves greatly the usage rate of the evaporation materials as well as the uniformity of thin film preparation.

Description

   Multi-plating material linear evaporation device   

The present invention relates to the field of vapor deposition devices, and in particular to a multi-plating linear vapor deposition device that can effectively adjust the characteristics of various types of OLED light-emitting layers to improve the overall uniformity of the OLED light-emitting layers.

In the field of display technology, displays made using OLED (Organic Light Emitting Diode) technology have become thinner, more flexible, higher brightness, wider viewing angles, and more energy-saving. The main trends of the display.

The basic structure of an OLED is a transparent anode, a hole transport layer, a light emitting layer, an electron transport layer, and a metal cathode in this order. OLEDs are currently made mainly by evaporation methods, such as dot evaporation or linear evaporation, among which linear evaporation is the bulk.

In the OLED linear evaporation process, it is common to cause mutual interference due to different evaporation angles and process temperatures of the independent linear evaporation sources, which greatly reduces the uniformity of the produced thin film. In addition, when the positions of the independent linear evaporation sources are placed, when the material to be plated is moved in the direction of the vertical evaporation source, the depth component of the prepared film may be uneven. Under the aforementioned influences, the poor uniformity of the thin film system leads to the problem of uneven yields in future products. In addition, due to the poor temperature uniformity of the heating evaporation material, in addition to increasing the heat loss of the corresponding heating device, the evaporation state of the evaporation material is not stable enough, which greatly reduces the utilization rate of the evaporation material.

In order to solve the shortcomings of the prior art, the present invention provides a multi-plating material linear evaporation device, which improves the uniformity of the heating of the plating material through a heating medium heating method to increase the utilization rate of the plating material and can effectively prevent the evaporation material from evaporating. Coating unevenness caused by excessive temperature difference to provide high-quality OLED light-emitting layer films.

The invention provides a multi-plating material linear evaporation device, comprising: a main crucible, an inner wall of which is sandwiched with an outer wall to form an interlayer, and the interlayer is filled with a heat medium, and the main crucible is used for carrying a first Plating material; a primary crucible, whose inner wall and outer wall are sandwiched to form a sandwich, and the sandwich is filled with a heat medium. The secondary crucible is used to carry a second plating material; a plurality of plating material heaters are arranged in the main The crucible and the outer side of the secondary crucible are used to uniformly heat the first plating material and the second plating material through a heat medium; and an evaporation cavity is provided on one side of the main crucible and the secondary crucible and has A linear evaporation port, the evaporation chamber has a diversion space and a heating space inside, and the evaporation chamber is provided with an evaporation heater corresponding to the heating space, so that the temperature of the heating space is higher than the guide space The temperature of the flow space; the heating space is provided for introducing the vapor of the first plating material, the diversion space is provided for introducing the vapor of the second plating material, and the vapor of the first plating material and the vapor of the second plating material It flows out from the linear vapor deposition port together. In this way, in addition to the heat energy of the plated material heaters through the heat medium to achieve uniform heating of the main crucible and the areas of the crucible, through the installation of the diversion space and the heating space, can provide Spaces with different temperatures allow the vapors of the first plating material and the second plating material not to interfere with each other, but can smoothly flow out from the linear evaporation port for the coating process, thereby improving the uniformity of the subsequent preparation of the film.

In one embodiment of the present invention, the evaporation heater is disposed inside the evaporation chamber to prevent thermal energy loss caused by the escape of thermal energy to the external environment and improve the operation efficiency of the evaporation heater.

In one embodiment of the present invention, a heating chamber is provided in the evaporation chamber, and the heating space is formed by a frame of the heating chamber, and the evaporation heater is arranged on the outer side of the heating chamber. It completely separates the heating space and the diversion space, especially in the case where the vapor temperature of the first plating material and the vapor temperature of the second plating material are very different, the two can be further isolated in the evaporation chamber. .

In one embodiment of the present invention, the evaporation chamber further includes a plurality of heat insulation plates. The heat insulation plates are arranged on the side of the evaporation cavity and are arranged at intervals. Each of the adjacent heat insulation plates is sandwiched to form a heat insulation plate. Vacuum layer. Thereby, the thermal energy of the evaporation heater can be effectively prevented from escaping to the outside, and external environmental influences can also be prevented.

In one embodiment of the present invention, the multi-plating material linear vapor deposition device further includes a plurality of temperature control components, which are respectively connected to the plating material heater and arranged to control the corresponding ones according to the first plating material and the second plating material. The temperature of the plating material heater can be controlled according to the material characteristics of the first plating material and the second plating material.

In one embodiment of the present invention, the multi-plating material linear evaporation device further includes a plurality of pressure detectors, which are respectively connected to the main crucible and the secondary crucible to detect the main crucible and the interior of the secondary crucible. Pressure value, so as to monitor the evaporation amount of the first plating material and the second plating material in real time, and control the evaporation of the first plating material and the second plating material according to the required ratio of the light-emitting layer film material. percentage.

In one embodiment of the present invention, the multi-plating material linear evaporation device can make the saturation vapor pressure of the main crucible greater than the background pressure of the heating space; the saturation vapor pressure of the secondary crucible is greater than the diversion space. Background pressure. This can ensure that the steam of the first plating material and the steam of the second plating material flow into the heating space and the diversion space separately and uniformly, and maintain the stability of the evaporation process.

In one embodiment of the present invention, the heat medium is a heat-conducting oil, alcohol, hydrocarbon, mercury, water, or other heat-conducting medium.

In summary, the multi-plating material linear evaporation device of the present invention penetrates the main crucible and the secondary crucible to set an interlayer and a heat medium, thereby improving the uniform heating of the first plating material and the second plating material. And the heating efficiency of these plated material heaters, and can prevent uneven heating from affecting the uniformity of the vapor deposition material, or even causing some steam to condense. In addition, the installation of the heating space and the diversion space enables the vaporization chamber to simultaneously introduce vapors of vaporization materials having different temperatures, preventing the vapors from affecting each other, which causes thermal cracking failure and reduces the uniformity of the prepared film. . Especially for the OLED light-emitting layer thin film generally prepared with various light-emitting materials with great differences in evaporation temperature, the uniformity of the thin-film formed by evaporation can be effectively improved by the multi-plating linear evaporation device of the present invention.

The above summary and the following detailed description and drawings are all for further explaining the methods, means and effects adopted by the present invention to achieve the intended purpose. Other objects and advantages of the present invention will be described in the following description and drawings.

1‧‧‧Linear evaporation device

10‧‧‧Main Crucible

101‧‧‧ mezzanine

102‧‧‧ Heat medium

11‧‧‧ crucibles

111‧‧‧ mezzanine

112‧‧‧ heat medium

12‧‧‧Plating material heater

13‧‧‧Evaporation chamber

131‧‧‧Linear evaporation

132‧‧‧Diversion space

133‧‧‧ heated space

134‧‧‧Evaporation heater

135‧‧‧Insulation board

1351‧‧‧Vacuum layer

136‧‧‧heating room

14‧‧‧Temperature Control Module

15‧‧‧ Pressure Detector

2‧‧‧The first plating material

3‧‧‧Second Plating Material

FIG. 1 is a schematic diagram of a preferred embodiment of a multi-plating linear evaporation device according to the present invention.

FIG. 2 is a schematic diagram of an application of the preferred embodiment of the multi-plating material linear evaporation device of the present invention.

FIG. 3 is a schematic diagram of another embodiment of a preferred embodiment of a multi-plating linear evaporation device according to the present invention.

The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

Please refer to FIGS. 1 and 2, which are schematic diagrams and application diagrams of the preferred embodiment of the multi-plating linear evaporation apparatus of the present invention. The invention discloses a multi-plating material linear evaporation device 1 capable of improving the uniformity of the OLED light-emitting layer thin film. The multi-plating material linear evaporation device 1 is used to prepare a light-emitting layer thin film of an OLED by evaporation using a plurality of light-emitting materials. It includes a main crucible 10, a primary crucible 11, a plurality of plating material heaters 12, and an evaporation chamber 13.

The main crucible 10 is used to carry a first plating material 2, and an inner wall and an outer wall of the main crucible 10 are sandwiched to form an interlayer 101, and the interlayer 101 is filled with a heat medium 102. The crucible 11 is used to carry a second plating material 3. Similarly, the inner wall and the outer wall of the crucible 11 are sandwiched to form an interlayer 111, and the interlayer 111 is filled with a heat medium 112. The plating material heaters 12 are separately disposed outside the main crucible 10 and the secondary crucible 11 to uniformly heat the first plating material 2 and the second plating material 3 through the heat medium 102, 112. Among them, the thermal energy of these plated material heaters 12 is transmitted through the heat mediums 102 and 112. The heat mediums 102 and 112 can be selected from liquids or gases with good thermal conductivity to form a flow in the interlayers 101 and 111 after heating. The heat energy is uniformly brought to each area of the main crucible 10 and the secondary crucible 11, so as to achieve the effect of uniform and uniform heating, so that the first plating material 2 and the second plating material 3 are uniformly heated to form a material vapor, which is effective The utilization rate of the evaporation material is maintained, and the heating efficiency of the first plating material 2 and the second plating material 3 can be avoided from being affected by the external environment.

The evaporation chamber 13 is disposed on one side of the main crucible 10 and the secondary crucible 11 and has a linear evaporation port 131. The evaporation chamber 13 has a diversion space 132 and a heating space 133 inside. And the evaporation chamber 13 is provided with an evaporation heater 134 corresponding to the heating space 133, so that the temperature of the heating space 133 is higher than the temperature of the diversion space 132. The heating space 133 is used for introducing the vapor of the first plating material 2, the diversion space 132 is used for introducing the vapor of the second plating material 3, and the vapor of the first plating material 2 and the second plating material 3 are introduced. The vapor flows out from the linear vapor deposition port 131 together. Since the evaporation chamber 13 is internally partitioned to form the diversion space 132 and the heating space 133 to introduce the vapors of the first plating material 2 and the second plating material 3 respectively, the first plating material 2 can be adapted accordingly. Provides a space with a different temperature from the material characteristics of the second plating material 3 so that the vapors of the first plating material 2 and the second plating material 3 do not interfere with each other, and can be smoothly passed from the linear evaporation port 131 together. The outflow is applied to the coating process to improve the uniformity of the subsequent preparation of the thin film, and at the same time to prevent the thermal cracking failure caused by the difference between the evaporation temperatures of the first plating material 2 and the second plating material 3, especially in the selection of the first In the case where the evaporation temperature between the plating material 2 and the second plating material 3 is extremely different, the multi-plating material linear evaporation device 1 can further exert its effectiveness and effectively prevent the aforementioned various situations affecting the uniformity of the light-emitting layer film. In addition, the vapor from the first plating material 2 and the second plating material 3 through the evaporation cavity 13 is flowed out from the linear evaporation port 131 for vapor deposition, which can effectively prevent multiple groups from being affected by conventional techniques. The placement position of the independent line source and the eruption angle interfere with each other, thereby affecting the uniformity of the subsequent preparation of the film.

Preferably, the evaporation heater 134 is disposed inside the evaporation chamber 13, thereby effectively preventing the evaporation heater 134 from being affected by the external environment and increasing thermal energy loss, so as to improve the heating efficiency and the heating space 133. Maintained at the required temperature. In addition, in order to further enhance the heat insulation efficiency, the evaporation chamber 13 further includes a plurality of heat insulation plates 135. The heat insulation plates 135 are arranged on the side of the evaporation cavity 13 and are arranged at intervals. Each of the adjacent heat insulation plates 135 is sandwiched to form a vacuum layer 1351. Through the vacuum state between the heat insulation plates 135 and the vacuum, it can effectively prevent the heat energy from escaping to the outside through transmission, reduce the work heat loss of the evaporation heater 134, and avoid The cooling of the heating space 133 affects the vapor state of the first plating material 2. In this embodiment, it is taken as an example that the heat insulation plates 135 are arranged corresponding to the inner surface of the heating space 132, but the arrangement manner is not limited to this. It can even be determined by the placement of the heat insulation plates 135. The temperature of the heating space 133 is further prevented from affecting the temperature of the diversion space 132.

In this embodiment, the multi-plating material linear evaporation device 1 further includes a plurality of temperature control components 14 respectively connected to the plating material heater 12 so as to be controlled according to the first plating material 2 and the second plating material 3 Corresponding to the temperature of these plated material heaters 12. Since the OLED light-emitting layer is formed by evaporation of different light-emitting materials, and according to the characteristics of different evaporation materials, the required evaporation temperature is also different. Therefore, based on the characteristics of the first plating material 2 and the second plating material 3 Through each of the temperature control components 14, the corresponding plating material heaters 12 can be controlled to appropriately heat the first plating material 2 and the second plating material 3 according to a required temperature rise curve.

Further, the multi-plated linear evaporation device 1 further includes a plurality of pressure detectors 15 which are respectively connected to the main crucible 10 and the secondary crucible 11 to detect the main crucible 10 and the secondary crucible. The pressure value inside the pot 11 can accurately control the evaporation amount of the first plating material 2 and the second plating material 3, so that the two can form a light-emitting layer film at a desired ratio, and can maintain the light-emitting layer film. Uniform material distribution. For example, when the first plating material 2 and the second plating material 3 respectively belong to a host light emitting body (Host) and a dopant constituting a light emitting layer film, the pressure detector 15 is used to monitor the two at any time. The pressure can be used to determine its evaporation state, and the evaporation percentage of the first plating material 2 or the second plating material 3, which is a dopant, can be further adjusted so that the prepared light-emitting layer film has a desired doping ratio. . In addition, in this embodiment, the saturated steam pressure of the main crucible 10 is greater than the background pressure of the heating space 133, and the saturated steam pressure of the secondary crucible 11 is greater than the background pressure of the diversion space 132 to maintain the pressure. Under the foregoing conditions, the steam of the first plating material 2 and the steam of the second plating material 3 can be ensured to flow stably and continuously into the heating space 133 and the diversion space 132 respectively, so as to stabilize the overall evaporation process. In addition to the aforementioned pressure conditions, when the multi-plating linear evaporation device 1 performs coating on a substrate, the vapor pressure inside the evaporation chamber 13 can also be adjusted to be greater than the environmental pressure inside the cavity provided by the substrate. The pressure difference makes the vapor of the first plating material 2 and the second plating material 3 have high directivity when flowing out from the linear vapor deposition port 131.

When preparing an OLED light-emitting layer film by evaporation, the first plating material 2 is placed in the main crucible 10, the second plating material 3 is placed in the secondary crucible 11, and the temperature control components 14 are passed through According to the material characteristics of the first plating material 2 and the second plating material 3, the corresponding plating material heaters 12 are controlled to be heated. The steam formed after the first plating material 2 and the second plating material 3 are heated flows into the heating space 133 and the diversion space 132, respectively. Since the steam temperature of the first plating material 2 is high, the vapor passes through the evaporation The heater 134 can keep the heating space 133 at a desired temperature to prevent the vapor of the first plating material 2 from condensing, and the steam of the second plating material 3 having a lower temperature flows into the diversion space 132, and finally communicates with the The vapor of the first plating material 2 flows out from the linear evaporation port 131 together to prepare an OLED light-emitting layer film. And during the evaporation process, the evaporation condition of the first plating material 2 and the second plating material 3 can be known at any time through the aforementioned pressure detector 15, which is beneficial to adjust the first plating material 2 and the second plating at any time. The amount of material 3 evaporated effectively controls the ratio of the two in the light-emitting layer film, and improves the overall uniformity of the light-emitting layer film.

Please continue to refer to FIG. 3, which is a schematic diagram of another embodiment of the preferred embodiment of the multi-plating linear evaporation device of the present invention. In this embodiment, a heating chamber 136 is provided in the evaporation chamber 13, the heating space 133 is surrounded by the heating chamber 136, and the evaporation heater 134 is arranged in the heating chamber 136. On the outside, it is revealed here that the heating chamber 136 separates the heating space 133 and the diversion space 132 from another structure state of the evaporation chamber 13 so that the evaporation chamber can be more completely integrated into the evaporation chamber. 13 internally separates the heating space 133 and the diversion space 132, and the evaporation heater 134 is also disposed in the evaporation chamber 13, which can also effectively prevent the escape of thermal energy and thus has extremely high heating efficiency.

In summary, the multi-plating material linear vapor deposition device of the present invention improves the heating of the first plating material and the second plating material through the way of providing an interlayer and a heat medium in the main crucible and the secondary crucible. Uniformity, to prevent uneven vaporization caused by uneven heating. In addition, through the installation of the heating space and the diversion space, the vaporization chamber can simultaneously introduce vapors of vaporization materials with different temperatures, preventing the vapors from interfering with each other, thereby reducing the uniformity of the thin film and causing thermal cracking failure. . Especially for the OLED light-emitting layer thin film generally prepared with various light-emitting materials with great differences in evaporation temperature, the uniformity of the thin-film formed by evaporation can be effectively improved by the multi-plating linear evaporation device of the present invention. In addition, by arranging the evaporation heater inside the evaporation chamber and the installation of the thermal insulation plates, the effect of preventing thermal energy loss can be achieved, and the heating efficiency of the evaporation heater can be improved, and the heating can be performed. The space is maintained at the required temperature. Further, the multi-plating linear evaporation device of the present invention can control the plating heaters according to different materials through the temperature control components and the pressure detectors to provide the required temperature rise curve, and at any time Monitoring the pressure state of the main crucible and the secondary crucible, which is beneficial to adjust the evaporation state of the first plating material and the second plating material, so that the prepared light-emitting layer film has the expected material ratio and has excellent uniformity .

The above-mentioned embodiments are merely illustrative for describing the features and effects of the present invention, and are not intended to limit the scope of the essential technical content of the present invention. Anyone skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

Claims (8)

    A multi-plating material linear evaporation device includes: a main crucible whose inner wall and outer wall are sandwiched to form an interlayer, and the interlayer is filled with a heat medium; the main crucible is used to carry a first plating material; The inner wall and the outer wall of the pot are sandwiched to form a sandwich, and the interlayer is filled with a heat medium. The crucible is used to carry a second plating material; a plurality of plating material heaters are separately arranged in the main crucible and the secondary crucible. Outside the crucible, the first plating material and the second plating material are uniformly heated through a heat medium; and an evaporation cavity is provided on one side of the main crucible and the secondary crucible and has a linear evaporation port. The evaporation chamber has a diversion space and a heating space inside, and the evaporation chamber is provided with an evaporation heater corresponding to the heating space, so that the temperature of the heating space is higher than the temperature of the diversion space; The heating space is provided for introducing steam of the first plating material, the diversion space is provided for introducing steam of the second plating material, and the steam of the first plating material and the steam of the second plating material are together from the The linear vapor deposition port flows outward.         The multi-plating material linear evaporation device according to claim 1, wherein the evaporation heater is disposed inside the evaporation chamber.         The multi-plating material linear evaporation device according to claim 2, wherein a heating chamber is provided in the evaporation chamber, the heating space is formed by the heating chamber frame, and the evaporation heater is arranged in the heating system. Outdoor side.         The multi-plating linear evaporation device according to claim 1, wherein the evaporation chamber further comprises a plurality of heat insulation plates, and the heat insulation plates are arranged corresponding to the sides of the evaporation cavity and are arranged at intervals. The isothermal insulation board is sandwiched to form a vacuum layer.         The multi-plating material linear vapor deposition device as described in claim 4, further comprising a plurality of temperature control components, which are respectively connected to the plating material heater and are set to correspond to the first plating material and the second plating material. Etc. Plating material heater temperature.         The multi-plating linear vapor deposition device according to claim 4, further comprising a plurality of pressure detectors, which are respectively connected to the main crucible and the secondary crucible and set to detect the main crucible and the secondary crucible. Internal pressure value.         The multi-plating linear vapor deposition device according to claim 4, wherein the saturation vapor pressure of the main crucible is greater than the background pressure of the heating space, and the saturation vapor pressure of the secondary crucible is greater than the background pressure of the diversion space. .         The multi-plating linear evaporation device according to claim 1, wherein the heat medium is a heat-conducting oil, alcohol, hydrocarbon, mercury, water, or other heat-conducting medium.