TW201822619A - Electronic device and foot pad thereof - Google Patents

Abstract

An electronic device includes a case, a heat source and a foot pad. The heat source is disposed in the case. The foot pad includes a thermal conductive member and a phase change material. The thermal conductive member has an air-tight chamber. The phase change material is disposed in the air-tight chamber, and the heat source is in thermal contact with the thermal conductive member.

Description

Electronic device and its foot pad

The present invention relates to an electronic device and a foot pad thereof, and more particularly to a thin and light electronic device and a foot pad thereof.

With the development of science and technology, electronic devices are gradually moving toward a more light and thin design trend, and their performance is also enhanced. Light and thin electronic devices such as notebook computers, mobile phones, tablet computers, portable video game machines, and the like. As the performance of electronic devices increases, more and more heat is generated, and the heat generated causes the temperature of the electronic device to rise, resulting in damage to internal electronic components.

Traditionally, conventional electronic devices use heat sinks such as fans or heat sink fins to help dissipate heat to avoid excessive temperature of the electronic device. However, because the electronic device is light and thin, the internal space is also getting smaller and smaller. Therefore, some thin and light electronic devices cannot be provided with large-sized heat dissipating components such as fans or fins. Based on the above problems, the industry is currently looking for a heat dissipation structure that can be applied to thin and light electronic devices.

In view of the above problems, the present invention discloses an electronic device and a foot pad, which contributes to solving the problem of heat dissipation of the thin and light electronic device.

The electronic device disclosed in the present invention comprises a casing, a heating element and a foot pad. The heating element is disposed inside the casing. The foot pad includes a heat conductive member and a phase change material. The heat conducting member has a closed chamber. The phase change material is disposed in the sealed chamber, and the heat generating component is in thermal contact with the heat conductive member.

The foot pad for an electronic device disclosed in the present invention comprises a heat conducting member and a phase change material. The heat conducting member has a closed chamber and the phase change material is disposed in the closed chamber.

According to the electronic device and the foot pad disclosed in the present invention, the foot pad includes a heat conductive member and a phase change material disposed in the heat conductive member. When the heat generated by the heating element is conducted to the heat conducting member of the foot pad, the phase change material absorbs heat to produce a phase change, and the heat dissipating effect of the heat conducting member on the heating element is achieved, so that the temperature of the heating element is controlled within a certain range without being over High helps to prevent the heating element from being damaged due to excessive temperature. After the phase change material absorbs heat to produce a phase change, the heat can be further transmitted to the casing through the heat conducting member of the foot pad, thereby increasing the heat dissipation capability of the entire electronic device.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

Please refer to FIG. 1 and FIG. 2 at the same time. 1 is a schematic cross-sectional view of an electronic device in accordance with a first embodiment of the present invention. 2 is a cross-sectional view of the foot pad of the electronic device of FIG. 1. In the embodiment, the electronic device 1 includes a casing 10, a heating element 20, and a foot pad 30.

The casing 10 has an opening 110 and an accommodating space 120, and the opening 110 is located at the bottom of the casing 10. The heating element 20 is disposed in the accommodating space 120, and the opening 110 corresponds to the heating element 20. In this embodiment, the heating element 20 is, for example, a central processing unit or a display card, which is disposed on a motherboard (not labeled) of the electronic device 1.

The foot pad 30 is disposed on the casing 10, and the heating element 20 is in thermal contact with the foot pad 30. In the present embodiment, the foot pad 30 includes a heat conductive member 310 and a phase change material 320. The heat conducting member 310 is disposed at the opening 110 of the casing 10, and the heat conducting member 310 has a closed chamber 311. The phase change material 320 is disposed in the sealed chamber 311. The heating element 20 is in thermal contact with the heat conducting member 310.

In the present embodiment, the heat conducting member 310 is made of a metal material such as silver, copper, aluminum or an alloy of the above metals, and provides good heat conduction and high structural strength, and the phase change material 320 is liquefied by absorbing heat. Or, when vaporized, the metallic heat conductive member 310 helps to prevent the foot pad 30 from being deformed. However, the material of the above heat conducting member 310 is not intended to limit the present invention. In other embodiments, the thermally conductive member may be a non-metallic material having a high thermal conductivity. The phase change material 320 is, for example, a paraffin wax, an alkane, an alcohol or an acid. The alkane is, for example, eicosane or triacontane, the alcohol is, for example, n-nonanol or eicosyl alcohol, and the acid is, for example, n-decanoic acid or icosonic acid.

In this embodiment, the foot pad 30 further includes a non-slip member 330. The anti-slip member 330 is, for example, a rubber pad that is disposed on the outer surface of the heat conductive member 310 and the anti-slip member 330 is exposed. The anti-slip member 330 provides the foot pad 30 with a good anti-slip function, thereby allowing the electronic device 1 to be stably placed on a table or display stand (not shown).

In the embodiment, the electronic device 1 further includes a thermal conductive gasket 40 , and the thermal conductive gasket 40 is disposed between the heat conductive member 310 of the foot pad 30 and the heating element 20 . In the embodiment, the heat conducting gasket 40 is disposed in the accommodating space 120 of the casing 10, and the heat conducting component 310 and the heat generating component 20 are respectively attached to opposite sides of the heat conducting gasket 40. The thermal pad 40 is, for example, an aluminum sheet, a tantalum film or a graphite sheet. The thermal pad 40 can fill the air gap between the heat conducting member 310 and the heat generating component 20, and contribute to improving the heat transfer efficiency between the heat conducting member 310 and the heat generating component 20.

In the present embodiment, the phase change material 320 has a great latent heat, that is, the phase change material 320 can absorb a great amount of heat when the phase changes. The phase change material 320 is solid when cooled, and becomes liquid or gaseous when heated; or, the phase change material 320 is liquid when cooled, and becomes gaseous when heated, when the phase change material 320 changes phase. It has an endothermic effect to achieve heat dissipation. Therefore, when the heat generated by the heat generating component 20 is conducted to the heat conducting member 310 of the foot pad 30 via the heat conducting gasket 40, the phase change material 320 absorbs heat to generate a phase change, and the heat radiating effect of the heat conducting member 310 on the heat generating component 20 is achieved, thereby The temperature of the heating element 20 is controlled within a certain range without being too high. After the phase change material 320 absorbs heat to generate a phase change, the heat can be further transmitted to the casing through the heat conducting member 310 of the foot pad 30, thereby increasing the heat dissipation capability of the electronic device 1 as a whole. In addition, since the phase change material 320 is disposed in the heat conductive member 310 of the foot pad 30, the space utilization is enhanced, so that the electronic device 1 does not need to be provided with other heat dissipating components in the accommodating space 120, which further contributes to further thinning of the electronic device 1.

Please refer to FIG. 3, which is a cross-sectional view of a foot pad according to a second embodiment of the present invention. Since the second embodiment is similar to the first embodiment, the following description will be made only on the difference.

In this embodiment, the foot pad 30 further includes a support member 340. The support member 340 is disposed on the sealed chamber 311 of the heat conductive member 310 of the foot pad 30. In the present embodiment, the support member 340 is, for example, a plurality of metal spacers disposed in the sealing chamber 311 to form a plurality of receiving grooves 312 independent of each other. The support member 340 may be integrally formed with the heat conductive member 310, or the support member 340 may be assembled with the heat conductive member 310. The phase change material 320 is disposed in the accommodating grooves 312. Thereby, the support member 340 contributes to the structural strength of the heat conductive member 310, and further prevents the foot pad 30 from being deformed. At the same time, since the sealed chamber 311 is divided into a plurality of accommodating grooves 312, the phase change material 320 can be evenly distributed in the respective accommodating grooves 312, thereby enhancing the effect of the phase change material 320 to help dissipate heat.

The support member 340 in this embodiment divides the sealed chamber 311 into a plurality of accommodating grooves 312, but the invention is not limited thereto. In other embodiments, the support member is, for example, a plurality of metal posts that are disposed in the closed chamber but do not form a plurality of receiving grooves.

In summary, in the electronic device and the foot pad disclosed in the present invention, the foot pad includes a heat conductive member and a phase change material disposed in the heat conductive member. When the heat generated by the heating element is conducted to the heat conducting member of the foot pad, the phase change material absorbs heat to produce a phase change, and the heat dissipating effect of the heat conducting member on the heating element is achieved, so that the temperature of the heating element is controlled within a certain range without being over High helps to prevent the heating element from being damaged due to excessive temperature. After the phase change material absorbs heat to produce a phase change, the heat can be further transmitted to the casing through the heat conducting member of the foot pad, thereby increasing the heat dissipation capability of the entire electronic device. In addition, since the phase change material is disposed in the heat conductive member of the foot pad, the space utilization is enhanced, so that the electronic device does not need to be provided with other heat dissipating components in the accommodating space, which further contributes to further thinning of the electronic device.

In addition, when the heat conductive member is made of a metal material, it can provide a good heat conduction effect and at the same time have a high structural strength. Thereby, when the phase change material produces a phase change, the foot pad is also less likely to be deformed.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧Electronic device
10‧‧‧Chassis
110‧‧‧ openings
120‧‧‧ accommodating space
20‧‧‧heating components
30‧‧‧foot pads
310‧‧‧Heat-conducting parts
311‧‧‧Closed chamber
312‧‧‧ accommodating slots
320‧‧‧ phase change materials
330‧‧‧Slip-resistant parts
340‧‧‧Support
40‧‧‧ Thermal pad

1 is a schematic cross-sectional view of an electronic device in accordance with a first embodiment of the present invention. 2 is a cross-sectional view of the foot pad of the electronic device of FIG. 1. Fig. 3 is a schematic cross-sectional view showing a foot pad according to a second embodiment of the present invention.

Claims (10)

An electronic device comprising: a casing; a heating element disposed in the casing; and a foot pad disposed on the casing, the foot pad comprising a heat conducting member and a phase change material, the heat conducting member having a a sealed chamber, the phase change material is disposed in the sealed chamber, and the heat generating component is in thermal contact with the heat conducting member. The electronic device of claim 1, wherein the heat conductive member is made of a metal material. The electronic device of claim 1, wherein the foot pad further comprises a non-slip member, and the anti-slip member is disposed on an outer surface of the heat conducting member. The electronic device of claim 3, wherein the housing has an opening and an accommodating space, and the heating element is disposed in the accommodating space, and the heat conducting member of the foot pad is disposed at the opening. And the anti-slip member is exposed. The electronic device of claim 1, wherein the foot pad further comprises a support member disposed in the sealed chamber of the heat conductive member. The electronic device of claim 5, wherein the support member is disposed in the sealed chamber to form a plurality of accommodating grooves, and the phase change material is disposed in the accommodating grooves. The electronic device of claim 1, further comprising a thermal pad disposed between the heat conducting member of the foot pad and the heating element. A foot pad for an electronic device, comprising: a heat conducting member having a closed chamber; and a phase change material disposed in the closed chamber. The foot pad of claim 8, wherein the foot pad further comprises a non-slip member, and the anti-slip member is disposed on an outer surface of the heat conducting member. The foot pad of claim 8, wherein the heat conductive member is made of a metal material.