TW201820449A - Method and apparatus for cutting adhesive tape can exactly prevent wafers from being damaged and blades from being worn due to the forwarding change of the knife tip - Google Patents

Abstract

In the process of cutting adhesive tape at the semiconductor wafer formed with a notch, a method and an apparatus for cutting adhesive tape capable of restraining damage on semiconductor wafers and early loss of knife tip while properly cutting the adhesive tape along the shape of the notch are provided. After the knife tip 25a is adjusted to a direction D1, the knife blade 25 penetrates into the adhesive tape T at the opening end E1. Afterwards, the forwarding direction of the knife tip 25a remains in the direction D1 while the adhesive tape T is cut off along the inclination N1 until the deepest portion F of the notch is reached. The knife blade 25 is drawn out of the adhesive tape 25, and the knife tip is adjusted to the direction D2. The adhesive tape T penetrates at the opening end E2. Afterwards, the forwarding direction of the knife tip 25a remains in the direction D2 while the adhesive tape T is cut off along the inclination N2 until the deepest portion F of the notch is reached.

Description

   Method for cutting adhesive tape and device for cutting adhesive tape   

The present invention relates to an adhesive tape cutting method and an adhesive tape cutting device which make a blade edge relatively travel along the outer periphery of a semiconductor wafer to cut the adhesive tape attached to the semiconductor wafer along the shape of the wafer.

When a wafer component is manufactured from a semiconductor wafer (hereinafter referred to as a "wafer" as appropriate), after a circuit pattern is formed on the wafer surface, a protective adhesive tape is attached to the wafer surface, and the The shape cuts the adhesive tape.

In recent years, the number of wafers in which a recessed positioning notch has been formed on the outer periphery has been used. In a wafer having such a V-shaped cut, when the adhesive tape is cut into a circle along the wafer periphery, the adhesive tape remains inside the cut. As a result, dust generated in the subsequent back-grinding process or washing water used in the cleaning process may adhere to the adhesive surface of the remaining adhesive tape and pollute the surrounding environment. Therefore, it is required to cut off not only the wafer periphery but also the adhesive tape inside the notch.

Regarding the configuration of cutting the adhesive tape inside the notch while cutting the adhesive tape on the outer periphery of the wafer, there is a proposal that the blade moves along the outer periphery of the wafer in a fixed direction while the blade edge faces from the open end of the notch side toward A method for moving the inside of the incision (for example, refer to Patent Document 1).

In addition, with regard to other configurations of cutting the adhesive tape inside the cut, a proposal has been made in which the blade edge is inclined along the side of the cut to the valley portion of the V-shaped cut, and then the blade point is cut from the crystal in the valley portion of the cut. After the blade is rotated so that the outer side of the circle is radially inward, the blade is inclined to travel along the other side of the cut to cut the adhesive tape of the cut portion (for example, refer to Patent Document 2).

Prior art literature

Patent Document 1 Japanese Patent Laid-Open No. 2009-125871

Patent Document 2 Japanese Patent Laid-Open No. 2011-198980

However, the above conventional device has the following problems.

That is, in the conventional cutting method of the adhesive tape of Patent Document 1, the blade moves toward the inside of the incision while advancing away from the inclination of the V-shaped incision in the incision portion. Therefore, it is difficult to completely cut the adhesive tape inside the cut, and a lot of the adhesive tape remains near the valley portion of the cut. As a result, there is a concern that during the back grinding process, washing water or dust may invade the surface of the wafer through the remaining adhesive tape and contaminate the circuit.

Moreover, in the conventional method of patent document 2, the blade edge which advances while cutting an adhesive tape is rotated in the valley part of a V-shaped notch, and the orientation of a blade edge is changed by rotating about the axis | shaft perpendicular to the wafer surface. For this reason, there are concerns about the problem that the rotating blade bites into the inner edge of the notch and damages the wafer, and the problem that the edge of the blade is lost due to the contact between the wafer and the blade when the notch valley is rotated.

Especially in recent years, the thickness of the wafer has been reduced, and the rigidity of the wafer has been reduced. Therefore, in order to compensate for the reduced rigidity of the wafer, a thick protective adhesive tape tends to be attached to the wafer. In the case of using a thick and non-deformable adhesive tape, it is difficult to rotate the blade in the state of being inserted into the adhesive tape to change the orientation of the blade tip. If the direction of advance of the blade is forcibly changed in this state, there are concerns about the problem that the blade becomes easy to wear, the problem of cracks or chipping on the wafer, and the problem that the adhesive tape is deformed and peeled from the wafer.

The present invention has been made in view of such circumstances, and a main object thereof is to provide a semiconductor wafer with a notch formed in the adhesive tape cutting process, which can suppress damage to the semiconductor wafer and early loss of the blade edge while suppressing damage to the semiconductor wafer. Adhesive tape cutting method and adhesive tape cutting device for appropriately cutting an adhesive tape with a notch shape.

To achieve this object, the present invention adopts the following configuration.

That is, in the adhesive tape cutting method of the present invention, the blade is relatively moved along the outer periphery of a semiconductor wafer having a V-shaped cut formed at one slope and another slope to attach the blade to the surface of the semiconductor wafer. The adhesive tape cutting method in which the adhesive tape is cut along the outer shape of the semiconductor wafer includes a first adjustment step of forming the blade edge in a radial direction from the semiconductor wafer in a state where the blade is withdrawn from the adhesive tape. The direction of the cutting edge of the cutting edge is adjusted so that the outside faces inward in the first direction. In the first cutting step, the cutting edge is adjusted so that the cutting edge in the first direction penetrates into the adhesive tape. With the orientation maintained in the first direction, the adhesive tape is cut along the one inclination; in the second adjustment step, in a state where the blade is withdrawn from the adhesive tape, the adhesive tape is radially outward from the semiconductor wafer. The direction of the cutting edge of the cutting edge is adjusted in a second direction facing inward. In the second cutting step, the cutting edge is adjusted so that the cutting edge in the second direction penetrates the adhesive tape, and the cutting edge In a state where the direction of the blade edge of the blade is maintained in the second direction, the adhesive tape is cut along the other inclination; and the peripheral cutting step cuts the adhesive tape along the outer periphery of the semiconductor wafer.

(Operation / Effect) According to this method, the adhesive tape is cut along one inclination of the cut in the first cutting step, and the adhesive tape is cut along the other inclination of the cut in the second cutting step. Then, the adhesive tape is cut along the outer periphery of the semiconductor wafer by the outer peripheral cutting process, so that the adhesive tape is accurately cut along the outer shape of the semiconductor wafer containing the cutout. Therefore, it is possible to more surely prevent the adhesive tape from remaining on the cutout portion, so that it is possible to prevent dust or washing water from contaminating the wafer through the residual adhesive tape.

In the first cutting step and the second cutting step, the tip direction of the blade is always maintained in a predetermined direction. That is, the direction change of the blade tip is performed in the first adjustment step or the second adjustment step, and is often performed in a state where the blade edge is withdrawn from the adhesive tape, and the direction of the blade point is not changed while the adhesive tape is pierced. Therefore, damage to the wafer and loss of the blade due to the change in the orientation of the blade tip can be reliably avoided.

Further, in the above-mentioned invention, it is preferable that the deepest portion of the notch is a curved valley portion connecting the one inclination and the other inclination, and at least one of the first cutting step and the second cutting step is performed. Wherein, the inclination of the blade tip with respect to the incision has a predetermined inclination angle, and in a state where the blade having the predetermined incision angle is pressed against the inclination, the inclination is continued to the deepest part of the incision. Cut the adhesive tape.

(Action / Effect) According to this configuration, in at least one of the first cutting step and the second cutting step, the inclination of the blade tip with respect to the incision has a predetermined cutting angle, and the blade edge having the predetermined cutting angle is pressed In the state of being inclined, the adhesive tape is cut along the inclination to the deepest part of the cut. In this case, since the cutting angle is predetermined, the biasing force acts more appropriately on the cutting edge of the cutting edge.

Therefore, even when the deepest portion of the incision is a curved valley portion, there is no case where the blade stops in the middle of the curved valley portion, and it is possible to appropriately advance to the deepest portion of the incision by pressing the biasing force. Therefore, it is possible to more reliably avoid the occurrence of an uncut adhesive tape in the cutout portion.

Further, in the above-mentioned invention, it is preferable that, in at least one of the first cutting step and the second cutting step, the side of the blade is pressed against the inclination along the inclination. The adhesive tape is cut to the deepest part of the incision.

(Operation / Effect) According to this configuration, the adhesive tape is cut along the inclination to the deepest part of the cut in a state where the side surface of the blade is pressed against the inclination. In this case, when the adhesive tape is cut along the slope, it is possible to appropriately prevent the blade edge of the blade from biting into the outer edge portion of the cut such as the slope. Therefore, in the first cutting step or the second cutting step, the problem of blade wear and the problem of wafer damage can be more reliably avoided.

Further, in the above invention, it is preferable that in at least one of the first cutting step and the second cutting step, a side surface of the blade is pressed against the inclination, and the blade tip is not in line with the inclination. In a state of contact, the adhesive tape is cut to the deepest part of the notch along the inclination.

(Action / Effect) According to this configuration, the adhesive tape is cut along the inclination to the deepest part of the incision in a state where the side surface of the blade is pressed against the inclination and the blade tip is not in contact with the inclination of the incision. In this case, since the blade tip does not contact the inclination, it is possible to more surely avoid the inclination of the outer edge portion of the notch from the bite of the blade edge. Therefore, in the first cutting step or the second cutting step, the problem of blade wear and the problem of wafer damage can be more reliably avoided.

Further, in the above-mentioned invention, it is preferable that the deepest portion of the cut is a valley portion that connects the one inclination and the other inclination to form a curved valley, and at least the first cutting step and the second cutting step are at least In one of the blades, the blade tip is straightened toward the deepest part of the cut, and the adhesive tape is cut.

(Operation / Effect) According to this configuration, in at least one of the first cutting step and the second cutting step, the cutting edge advances the cutting edge to the deepest part of the cut to cut the adhesive tape. In this case, since the blade point is advanced straight from the position where it penetrates the adhesive tape toward the deepest part of the incision, the movement control of the blade can be simplified. In addition, even in the case where the deepest portion of the notch becomes a curved valley portion, since it goes straight toward the deepest portion, it is possible to prevent the blade from being caught between the inclination and the valley portion and stopped. Therefore, it is possible to more surely prevent the uncut adhesive tape from being generated in the cut portion.

Moreover, it is preferable that the said invention is provided with the cutting | disconnection detection process which detects the said adhesive tape which cut | disconnected the said notch part by the said 1st cutting process and the said 2nd cutting process.

(Operation / Effect) According to this configuration, it is detected that the adhesive tape of the cut portion is cut in the cut detection step. In this case, if the first cutting step or the second cutting step is not completed properly and the adhesive tape of the cut portion is not cut properly, the situation can be detected more quickly and reliably, so it can be more surely Avoid leaving the adhesive tape in the cut portion without cutting.

In the invention described above, the cutting detection step is preferably performed by the holding tape for holding the cut portion of the cut portion that has been cut by the holding table for holding the semiconductor wafer.

(Operation / Effect) According to this configuration, the cutting detection step is performed by the holding table for holding the semiconductor wafer with the aforementioned adhesive tape that has cut the cut portion. In this case, since the distance between the adhesive tape attached to the wafer and the holding table is very close, the adhesive tape of the cut-out cut portion can be reliably adsorbed by the holding table. And whether the adsorption is possible can be obtained by the pressure change and numerical information in the adsorption device. Therefore, based on the numerical information, it is possible to more accurately and reliably detect whether or not the adhesive tape of the cut portion can be cut.

In order to achieve such an object, the present invention may adopt the following configuration.

That is, the adhesive tape cutting device of the present invention moves the blade relatively along the outer periphery of a semiconductor wafer having a V-shaped notch formed at one slope and another slope, and attaches the A semiconductor wafer whose adhesive tape is cut along the outline of the semiconductor wafer. The adhesive tape cutting device is characterized in that the aforementioned adhesive tape is cut by the adhesive tape cutting method according to any one of claims 1 to 8.

(Action / Effect) According to this configuration, each effect in the above-mentioned method for cutting an adhesive tape can be appropriately achieved.

According to the present invention as described above, in the first cutting step, the adhesive tape is cut along one inclination of the slit, and in the second cutting step, the adhesive tape is cut along the other inclination of the slit. Then, the adhesive tape is cut along the outer periphery of the semiconductor wafer by the peripheral cutting process, so that the adhesive tape is cut accurately along the outer shape of the semiconductor wafer containing the cut. Therefore, it is possible to more surely prevent the adhesive tape from remaining on the cutout portion, so that it is possible to avoid the situation where dust and washing water contaminate the wafer through the residual adhesive tape.

In the first cutting step and the second cutting step, the direction of the cutting edge of the blade is always maintained in a predetermined direction. That is, the direction change of the blade tip is often performed in a state where the blade edge has been withdrawn from the adhesive tape in the first adjustment step or the second adjustment step, so there is no case where the direction of the blade tip is changed while the adhesive tape is pierced. Therefore, damage to the wafer and loss of the blade due to the change in the orientation of the blade tip can be reliably avoided.

1‧‧‧ Adhesive tape attachment device

11‧‧‧ chuck table

12‧‧‧ Cut-off detection department

14‧‧‧ adsorption hole

16‧‧‧ Attraction device

19‧‧‧ Adhesive tape cutting device

21‧‧‧ stripping unit

25‧‧‧Blade

25a‧‧‧Blade

27‧‧‧ Cutting knife goes into the trench

35‧‧‧ sticking roller

43‧‧‧ Mobile station

45‧‧‧ support arm

46‧‧‧Linear Motion Unit

47‧‧‧Cutter unit

53‧‧‧Rotating shaft

54‧‧‧Linear Motion Unit

59‧‧‧ support member

70‧‧‧rotating cylinder

71‧‧‧Cutter holder

77‧‧‧operation flange

79‧‧‧ Motor

83‧‧‧Spring

85‧‧‧ cylinder

85a‧‧‧Piston rod

93‧‧‧control device

99‧‧‧ Surveillance Camera

T‧‧‧adhesive tape

W‧‧‧Semiconductor wafer

N‧‧‧ incision

N1, N2‧‧‧ tilt

N3‧‧‧Tanibe

E1, E2‧‧‧ open end

F‧‧‧ deepest

FIG. 1 is a perspective view showing a basic configuration of the adhesive tape application device of the first embodiment.

FIG. 2 is a side view showing the entire adhesive tape cutting device of the first embodiment.

Fig. 3 is a perspective view showing a main part of the adhesive tape cutting device of the first embodiment.

FIG. 4 is a plan view of a cutter unit according to the first embodiment. FIG.

FIG. 5 is a front view in which a part of the cutter unit of the first embodiment is longitudinally cut.

FIG. 6 is a side view of a main part showing a point when the blade of Example 1 is stuck into the adhesive tape.

FIG. 7 is a side view of a main part showing a state where the cutting edge of Example 1 is brought into contact with an outer peripheral edge of a wafer.

FIG. 8 is a front view of the step S4 of the first embodiment.

FIG. 9 is a front view showing a state where the blade is waiting above the adhesive tape in the step S5 of the first embodiment.

FIG. 10 is a front view showing a state where the blade penetrates the adhesive tape in the step S5 of the first embodiment.

FIG. 11 is a front view showing a step of step S6 in the first embodiment.

FIG. 12 is a diagram showing a configuration of a chuck table of the first embodiment.

(a) is a plan view showing the entire table, (b) is a cross-sectional view of the main part of the table in a state where the adhesive tape of the cutout portion is not cut, and (c) is a cutaway of the adhesive tape of the cutout portion A cross-sectional view of the main part of the table in the state of being adsorbed on the table.

FIG. 13 is a diagram illustrating a configuration of a wafer of the first embodiment.

(a) is a plan view showing the overall configuration of a wafer having a notch, and (b) is an enlarged view of a notch portion.

14 is a flowchart of each step of the first embodiment.

(a) is a flowchart explaining an adhesive tape attachment process, (b) is a flowchart explaining each process of step S5 when a wafer has a notch.

FIG. 15 is a diagram illustrating a step of step S5-1 in the first embodiment.

(a) is a side view of the device showing a state where the blade is rotated, and (b) is an enlarged plan view of a notch portion showing a state where the direction of the blade tip is adjusted to the first direction.

FIG. 16 is a diagram illustrating a step of step S5-1 in the first embodiment.

(a) is a plan view of the device showing a state where the linear motion unit 54 is operated to displace the blade, and (b) is a plan view of the device showing a state where the linear motion unit 46 is operated to displace the blade.

FIG. 17 is an enlarged plan view illustrating a cutout portion in the step S5-2 of the first embodiment. FIG.

(a) is a figure which shows the state which the blade moved along the inclination N1, (b) is a figure which shows the state which moved the blade to the deepest part of a notch.

FIG. 18 is a diagram illustrating steps S5-4 and S5-5 in the first embodiment. FIG.

(a) is a plan view showing a state in which the direction of the blade tip is adjusted to the second direction in step S5-4, (b) is a view showing a state in which the blade moves along the inclination N2 in step S5-5, (c) It is a figure which shows the state which the blade moved to the deepest part of a cut in step S5-5.

FIG. 19 is a plan view showing the position of the adhesive tape Tn in the cutout portion.

FIG. 20 is a diagram illustrating a step of step S5-8 in the first embodiment.

(a) is a figure explaining an example of the positional relationship of a 3rd cutting start position, a 3rd cutting part, and a 4th cutting part, (b) is an example of the orientation of the blade edge adjusted to the 3rd direction.

FIG. 21 is a diagram illustrating the effect of the configuration of the first embodiment.

(a) is a figure explaining the movement trajectory of the blade of Example 1, and (b) is a figure explaining the trajectory and movement range of the blade of a conventional example.

FIG. 22 is a diagram comparing Example 1 and Example 2 with respect to the locus of the first cutting portion and the direction of the blade tip.

(a) is a diagram showing the configuration of the first embodiment, and (b) is a diagram showing the configuration of the second embodiment.

FIG. 23 is an enlarged plan view illustrating a cutout portion in the step S5-2 of the second embodiment. FIG.

(a) is a figure which shows the state which the blade penetrated the adhesive tape of the 1st cutting start position, (b) is a figure which shows the state which the blade moved to the deepest part of a notch.

FIG. 24 is an enlarged plan view illustrating a cutout portion in the step S5-5 of the second embodiment. FIG.

(a) is a figure which shows the state which the blade penetrated the adhesive tape of the 2nd cutting start position, (b) is a figure which shows the state which the blade moved to the deepest part of a notch.

FIG. 25 is a diagram illustrating the effect of each embodiment.

(a) is a plan view of a blade showing the state of piercing the adhesive tape, (b) is a plan view of deformation of the adhesive tape when the direction of the blade of the piercing tape is changed, and (c) is floating due to deformation (D) is a cross-sectional view of the state where the adhesive tape is sunk due to deformation.

FIG. 26 is a diagram for explaining the configuration of a blade in each modification.

(a) is a cross-sectional view of a cutting edge of a modification (2), (b) is a view showing a positional relationship between a cutting edge and a tilt in a modification (2), and (c) is a view showing a position of a cutting edge and a tilt in a modification (3) Relationship diagram.

FIG. 27 is a diagram illustrating a shape of a cutout according to a modification.

FIG. 28 is a diagram illustrating a configuration of a modification of the first embodiment.

(a) is a diagram showing the direction in which the linear motion unit moves the blade and the first cutting start position, (b) is a diagram showing the positional relationship between the piston rod and the blade before the blade contacts the outer periphery of the wafer, (c ) Is a diagram showing the positional relationship between the piston rod and the blade after the blade has contacted the outer peripheral portion of the wafer, and (d) is a diagram illustrating the movement trajectory of the blade.

FIG. 29 is a diagram illustrating a configuration of a modification of the second embodiment.

(a) is a figure explaining the movement locus of a blade, (b) is a figure which shows the positional relationship of a piston rod and a blade.

    [Example 1]    

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the overall configuration of the adhesive tape application device 1 of the first embodiment.

    <Explanation of the overall structure>    

This adhesive tape attaching device 1 includes a wafer supply / recovery unit 3 in which a cassette C containing semiconductor wafers (hereinafter, simply referred to as "wafers") W is loaded, and a wafer transfer mechanism 7 including a robot arm 5 Alignment table 9; chuck table 11 on which wafer W is placed and sucked and held; tape supply section 13 for supplying wafer W with surface protection adhesive tape T; and separation from the own supply section 13 The adhesive tape T of the tape separates and recovers the separation tape s from the separation tape recovery unit 15; attaches the adhesive tape T to the attaching unit 17 on the wafer W that is placed on and held by the chuck table 11; Adhesive tape cutting device 19 that cuts and cuts the adhesive tape T on the wafer W along the shape of the wafer W; a peeling unit that peels off the unnecessary adhesive tape T attached to the wafer W and cuts it 21; and a tape recovery unit 23 for winding the adhesive tape T peeled off by the peeling unit 21 and the like. The specific configuration of each of the structural units and mechanisms described above will be described below with reference to FIGS. 2 to 12.

The wafer supply / recovery unit 3 can load two cassettes C in parallel, and a plurality of wafers W are inserted and stored in multiple layers in each cassette C in a horizontal posture with a circuit pattern facing upward.

The robot arm 5 provided in the wafer transfer mechanism 7 is configured to be capable of horizontally advancing and retreating, and is capable of being driven to rotate and lift as a whole. Further, a horseshoe-shaped vacuum suction type wafer holding portion 5 a is provided at the tip of the robot arm 5. This wafer holding portion 5a is inserted into the gap between the wafers W accommodated in multiple layers in the cassette C, and the wafer W is sucked and held from the back surface. The wafer W that is sucked and held is extracted from the cassette C, and aligned The stage 9, the chuck stage 11, and the wafer supply / recovery unit 3 are sequentially conveyed.

The alignment table 9 has a function of moving in the x and y directions and a rotation function of rotating about an axis in the z direction. The alignment table 9 aligns the wafer W carried by the wafer transfer mechanism 7 in accordance with the notch N formed on the outer periphery thereof.

The chuck table 11 is a vacuum suction of the wafer W transferred from the wafer transfer mechanism 7 and placed on a predetermined alignment posture. In addition, in order to cut the adhesive tape T by rotating the blade 25 provided in the adhesive tape cutting device 19 described below along the outer shape of the wafer W, a cutting knife shown in FIG. 2 is formed on the upper surface of the chuck table 11. Groove 27.

As shown in FIG. 12 (a), the chuck table 11 is provided with a cutting detection unit 12. The cutting detection section 12 is provided outside the cutter advance groove 27 (outer member 11a), and the position of the cutting detection section 12 in the chuck table 11 is configured to approximately match the portion of the cutout N formed on the wafer W. . The cutout detection section 12 is provided with suction holes 14, and each of the suction holes 14 is connected to the suction device 16.

When the adhesive tape T at a portion corresponding to the cutout N is cut, the cut detection unit 12 sucks the cut adhesive tape T with the suction hole 14. The cutting of the adhesive tape T corresponding to the notch portion is detected based on the adsorption of the adhesive tape T by the adsorption hole 14. The process of detecting the cutting of the adhesive tape T corresponding to the cut portion will be described in detail later.

The tape supply unit 13 is configured to wind and guide the adhesive tape T with the separation tape s sent from the supply reel 29 to one or two or more guide rollers 31, and guide the adhesive tape with the separated separation tape s to the sticker. Attached unit 17. The supply reel 29 is configured to impart a moderate rotational resistance so that the tape is not excessively fed out.

The separation tape recovery unit 15 is formed so that the recovery roll 33 for winding the separation tape s peeled from the adhesive tape T is rotationally driven in the winding direction.

The attaching unit 17 is provided with an attaching roller 35 arranged horizontally forward, and is configured to be driven back and forth horizontally by a slide guide mechanism 37 shown in FIG. 8 and a screw-feed driving mechanism (not shown).

The peeling unit 21 includes a peeling roller 39 disposed horizontally forward. The peeling roller 39 is reciprocally driven horizontally to the left and right by a slide guide mechanism 37 and a screw-feed driving mechanism (not shown).

Returning to FIG. 1, the tape recovery unit 23 is formed so that the unnecessary adhesive tape T is wound, that is, the recovery roll 41 of the unnecessary tape T ′ is rotationally driven in the winding direction. Examples of the unnecessary tape T ′ include an adhesive tape piece cut along the outer shape of the wafer W.

Basically, the adhesive tape cutting device 19 is attached to a lower portion of a movable table 43 capable of driving up and down, and a pair of support arms 45 are provided in parallel. The cutter unit 47 provided on the suspension side of the support arm 45 is provided with a cutting edge 25 with the cutting edge 25a facing downward. That is, the support arm 45 is configured to rotate around the vertical axis P as the rotation center, and move the blade 25 along the outer periphery of the wafer W to cut the adhesive tape T. The detailed structure is shown in FIG. 2 to FIG. 6.

The movable table 43 is driven to rotate forward and backward by the motor 49 so as to be raised and lowered along the vertical rail 51 in a spiral feed manner. A rotation shaft 53 provided in the suspension portion of the movable table 43 so as to be rotatable about a longitudinal axis P is decelerated by a motor 55 provided on the movable table 43 via two belts 57. That is, the rotation shaft 53 is rotated in a predetermined direction by the operation of the motor 55. The rotation shaft 53 is configured to be positioned above the center 11 x of the chuck table 11. That is, the vertical axis P is configured to pass through the center 11x.

A linear motion unit 54 is connected below the rotation shaft 53, and a support member 59 is connected below the linear motion unit 54. The linear motion unit 54 extends in a predetermined horizontal direction (x direction in Fig. 2), and moves the connected support member 59 horizontally in the x direction. With the horizontal movement of the support member 59, the support arm 45 and the blade 25 become horizontally movable in the x direction which is the extension direction of the linear motion unit.

The support member 59 extends downward from the linear motion unit 54. The support arm 45 is supported by the lower end portion of the support member 59 so as to be slidably adjustable in the horizontal direction. That is, the distance between the blade edge 25 and the longitudinal axis P which is the rotation center is adjusted by sliding adjustment of the support arm 45. With this configuration, the rotation radius of the adjustment blade 25 can be changed in accordance with the wafer diameter.

The horizontal sliding of the support arm 45 can be performed by a linear motion unit 46 connected to one end of the support arm 45. In FIG. 2, the support arm 45 is horizontally movable in the y-direction. In addition, the linear motion unit 54 can be rotated by the rotation shaft 53. That is, the direction in which the support arm 45, the blade 25, and the like move horizontally by the linear motion unit 54 is not limited to the x direction, and can be appropriately changed by the rotation shaft 53.

The direction in which the linear motion unit 54 moves the support arm 45 horizontally is orthogonal to the direction in which the linear motion unit 46 moves the support arm 45 horizontally. Therefore, each of the structures connected below the linear motion unit 54 is configured to be movable in two directions orthogonal to each other on the horizontal plane (on the xy plane). That is, the support arm 45, the blade 25, and the like can be displaced to any position on the horizontal plane under the control of the linear motion unit 46 and the linear motion unit 54.

The bracket 61 is fixed to the other end portion of the support arm 45. The cutter unit 47 is mounted on this bracket 61 and is supported. As shown in FIGS. 3 and 4, the cutter unit 47 is composed of a rotating member 63 that is supported on a bracket 61 so as to be rotatable within a predetermined range about a longitudinal fulcrum Q; and is connected to the end of the rotating member 63. A vertical wall-shaped support bracket 65 below the portion; a cutter support member 67 connected to the side of the support bracket 65; a bracket 69 supported by the cutter support member 67; a rotary cylinder 70 mounted on this bracket 69; and The cutter holder 71 and the like connected below the rotary cylinder 70. In addition, the cutting edge 25 is locked to the side of the cutter holder 71 so as to be exchangeable.

The rotary cylinder 70 rotates the cutter holder 71 about the axis of the longitudinal fulcrum Q. In accordance with the rotational movement of the cutter holder 71, the blade edge 25 fixed to the cutter holder 71 changes its posture around the longitudinal fulcrum Q. That is, the orientation of the cutting edge 25a can be adjusted within a predetermined range by changing the posture of the cutting edge 25.

Here, as shown in FIG. 4, an operation flange 77 is provided above the rotation member 63 and rotates integrally with the rotation member 63 according to the engagement of the long hole 73 and the protrusion 75. The operation flange 77 is rotated by the motor 79 to change the posture of the cutter unit 47 as a whole around the longitudinal fulcrum Q relative to the support arm 45, and the angle of the blade tip 25a relative to the moving direction of the blade 25 can be adjusted within a predetermined range Cut-in angle).

Both the rotary cylinder 70 and the motor 79 are used to change the direction of the blade tip 25a around the axis of the longitudinal fulcrum Q by its function. The rotary cylinder 70 is mainly used to largely change the direction of the blade tip 25a around the axis of the fulcrum Q (for example, about 180 degrees). On the other hand, the motor 79 is mainly used to finely adjust the direction of the cutting edge 25a around the axis of the fulcrum Q.

With respect to the cutter support member 67, the bracket 69 is linearly slidably supported by the support rail 45 in the longitudinal direction of the support arm 45 (the direction of the back surface of the paper surface in FIG. 5). In addition, a spring 83 is tensioned in the range between the cutter support member 67 and the bracket 69, and the elastic restoring force of the spring 83 biases the bracket 69 to slide in a direction close to the longitudinal axis (rotation center) P.

    Offset    

As shown in FIG. 2, an air cylinder 85 in a posture along the sliding direction of the bracket 69 is fixedly attached to the rotation center side of the cutter support member 67 via a support 87, and a piston rod 85 a of the air cylinder 85 is provided to abut against The end face of the bracket 69.

The air cylinder 85 is connected to the pressurized air supply device 91 via a control valve device 89 that switches the air pressure and the air supply direction by electric control. The control valve device 89 is connected to a control device 93 controlled by a computer. The control device 93 appropriately controls the horizontal sliding of the support arm 45 by the linear motion unit 46, the horizontal movement of the support member 59 by the linear motion unit 54, the rotation of the rotation shaft 53, the rotation of the rotary cylinder 70, and the motor 79. Various operations of the device such as the rotation of the operating flange 77.

In addition, a disc 95 having cutouts or penetration holes formed at equal intervals on the outer peripheral portion is fixed to the upper portion of the rotation shaft 53. At the same time, electromagnetic or photoelectric pulse sensing is disposed opposite the outer peripheral portion of the disc 95.器 97。 The 97.

That is, a pulse signal corresponding to the rotation of the disc 95 is output from the pulse sensor 97. The signal from the pulse sensor 97 is input to the control device 93, and the position of the blade 25 is calculated by counting the pulses. A surveillance camera 99 is disposed above the side of the chuck table 11 and faces the edge of the wafer W. The imaging information from the surveillance camera 99 is transmitted to the control device 93, and the position analysis of the incision is acquired by the image analysis thereof, and the information of the cutting state (such as defective cutting) of the adhesive tape T at the incision portion is obtained.

    <Explanation of wafer structure>    

Here, the configuration of the wafer W and the notch N formed in the wafer W will be described. As shown in FIG. 13 (a), the notch N is formed on a part of the outer periphery of the wafer W. FIG. 13 (b) is an enlarged view of a dotted line portion A surrounding the cutout N in FIG. 13 (a). As shown in FIG. 13 (b), the notch N has two slopes from the outer periphery Wa of the wafer W toward the radially inner side of the wafer W. Among the two tilts, one is set to tilt N1 and the other is set to tilt N2. A portion connecting the inclination N1 and the inclination N2 is a valley portion N3. A point that becomes the boundary between the inclination N1 and the valley portion N3 is defined as a boundary point J1. A point that becomes the boundary between the inclination N2 and the valley portion N3 is referred to as a boundary point J2.

Although the inclination N1 and the inclination N2 are linear, the valley portion N3 faces the radially inner side of the wafer W and has a slightly curved shape. That is, the notch N is V-shaped as a whole, and is a shape that is curved (with a circle) at the valley portion N3 and has a shallow bottom. In addition, for convenience of explanation, the width of the valley portion N3 is shown to be larger than the actual configuration. Therefore, the actual notch N has a configuration in which the distance from the boundary point J1 to the boundary point J2 is very small.

In this embodiment, the internal angle θ1 of the cutout N is about 90 °. The opening width of the cutout N, that is, the distance from one open end E1 to the other open end E2 is about 2 mm. In addition, the size of the internal angle θ1 of the cutout N and the distance of the opening width may be appropriately changed, and are not limited by the configuration of this embodiment.

    <Explanation of basic operation>    

Next, a series of basic operations for attaching the adhesive tape T for protecting the circuit surface to the wafer W using the adhesive tape attaching device of the first embodiment will be described. FIG. 14 (a) is a flowchart illustrating a process of attaching the protective adhesive tape T to the wafer W. FIG. In addition, the adhesive tape is not limited to the circuit surface protection tape attached to the wafer surface, and the configuration of the adhesive tape attaching device of this embodiment can also be applied to an adhesive tape used for any purpose.

When the attaching instruction is issued, first, the robot arm 5 in the wafer transfer mechanism 7 moves toward the magazine C placed on the magazine table. The robot arm 5 inserts the wafer holding portion 5a into the gap between the wafers stored in the cassette C, and uses the wafer holding portion 5a to suck and hold the wafer W from the back surface (lower side) and carry it out, and then takes out the wafer W Transfer to the alignment stage 9 (step S1).

The mounted wafer W is sucked and held by the alignment table 9. Thereafter, the positions of the notches N formed on the outer periphery of the wafer W are specified. Specifically, when the alignment stage 9 that holds and holds the wafer W is rotated, the notch formed on the wafer W is image-detected by the surveillance camera 99, and the notch N is obtained by detecting the detection position and the rotation angle during the rotation. Location information (step S2).

Then, the wafer W is aligned using the position information of the specified notch N. That is, the alignment stage 9 moves appropriately in the x direction and the y direction so that the center Wx of the wafer W coincides with the center of the alignment stage 9 (step S3). The aligned wafer W is carried out by the robot arm 2. The carried-out wafer W is placed on the chuck table 11 in a state where the center Wx of the wafer W can be positioned above the center 11x of the chuck table 11. The mounted wafer W is sucked and held by the chuck table 11. At this time, as shown in FIG. 8, the attaching unit 17 and the peeling unit 21 are at the left starting positions. In addition, the blade 25 of the adhesive tape cutting device 19 stands by at the upper starting position.

Next, as shown by an imaginary line (two-dot chain line) in FIG. 8, the application roller 35 of the application unit 17 is lowered, and at the same time, the adhesive tape T is pressed downward on the wafer W by the application roller 35. Turn forward (to the right in Figure 8). As a result, the adhesive tape T is attached to the entire surface of the wafer W (step S4).

As shown in FIG. 9, when the attaching unit 17 reaches the end position, the blade 25 waiting above is lowered, and the cutter advance groove 27 of the chuck table 11 penetrates the adhesive tape T.

In this case, as shown in FIG. 6, the cylinder 85 is supplied with high-pressure air, so that the piston rod 85 a protrudes greatly, and the bracket 69 slides against the spring 83. The blade 25 penetrates the adhesive tape T at a position slightly deviated from the outer peripheral edge of the wafer W (about several mm in an example) to the outside. After that, the air pressure of the cylinder 85 is reduced, so that the protruding force of the piston rod 85 a becomes smaller than the spring force, and as shown in FIG. 7, the bracket 69 slides toward the wafer center side by the biasing force of the spring 83. . In the embodiment, the cutting edge 25 a of the cutting edge 25 is brought into contact with the outer peripheral edge of the wafer W by sliding.

When the blade 25 penetrates the adhesive tape T at the first cutting start position, as shown in FIG. 10, the support arm 45 is rotated. At the same time, the blade 25 rotates while slidingly contacting the outer periphery of the wafer, so that the adhesive tape T is cut along the outer periphery Wa of the wafer (step S5).

When the cutting of the adhesive tape T along the wafer outer periphery Wa is completed, as shown in FIG. 11, the blade edge 25 is raised to the original standby position. Next, the peeling unit 21 rolls up and peels off the unnecessary tape T 'remaining on the wafer W while moving forward.

When the peeling unit 21 reaches the end position of the peeling operation, the peeling unit 21 and the attaching unit 17 move in opposite directions and return to the starting position. At this time, the unnecessary tape T 'is wound on the recovery roll 41, and at the same time, a fixed amount of the adhesive tape T is sent out from the tape supply section 13 (step S6).

When the processes up to step S6 are completed, after the adsorption on the chuck table 11 is released, the wafer W that has completed the attaching process of the adhesive tape T is transferred to the wafer holding portion 5 a of the robot arm 5, and The cassette C is inserted into the wafer supply / recovery unit 3 and recovered (step S7).

This completes the adhesive tape attaching process once, and thereafter repeats the above operations in order.

    <Description of the process of cutting the adhesive tape at the cutout portion>    

Here, when a positioning cutout N is formed on the outer periphery Wa of the wafer W, the cutting process of the adhesive tape in step S5 follows steps S5-1 to S5- shown in the flowchart of FIG. 14 (b). 8 steps. In the step shown in FIG. 14 (b), the adhesive tape T corresponding to the portion of the cutout N is cut and removed. That is, the adhesive tape T is cut more accurately along the outline of the wafer W including the inclination N1 and N2 including the notch N.

In Example 1, the adhesive tape T was cut in the order of the inclined N1 portion of the cut N at the beginning, the inclined N2 portion of the cut N, and the peripheral portion Wa portion other than the cut N in the order. The wafer W cuts the adhesive tape. However, the order in which the three parts are cut is not limited to this order, and may be replaced as appropriate.

When a wafer W having a cutout N is used, the wafer W is positioned and loaded in a clamp so that the cutout N shown in FIG. 13 (a) is located at the center of the imaging area of the surveillance camera 99 in step S3.台 台 11. The positioned incision N is configured to be positioned on the upper surface of the cut detection unit 12. The position information of the cutout N is obtained based on the imaging result of the surveillance camera 99.

    Step S5-1 (adjust the direction of the blade tip to the first direction)    

As shown in FIG. 9, in accordance with the fact that the attaching unit 17 reaches the end position and the process of step S4 ends, in order to cut off the adhesive tape of the portion inclined N1, the adjustment of the blade edge 25 a of step S5-1 is started. That is, as shown in FIG. 15 (a), the operating flange 77 is rotated by the motor 79 in a state where the blade 25 is waiting above the wafer W to which the adhesive tape T is attached.

With the rotation of the operation flange 77, the posture of the entire cutter unit 47 around the longitudinal support point Q with respect to the support arm 45 is changed. That is, the direction of the blade tip 25a is finely adjusted by rotating the blade edge 25 about the axis of the longitudinal viewpoint Q. As shown in the plan view of FIG. 15 (b), in step S5-1, the blade edge 25 is controlled to rotate from the direction shown by the dotted line to the direction shown by the solid line. As a result, the blade edge 25a is adjusted to face the symbol Direction shown by D1. In addition, for convenience of explanation, the width of the cutting edge 25 is described as wider than it actually is, but the actual cutting edge width is extremely narrow, and the side surface 25b of the cutting edge is set parallel to the direction of the cutting edge 25a.

In addition, the blade 25 is moved and rotated while adjusting the direction of the blade tip 25a. That is, the cutter holder 71 is appropriately displaced in the x direction and the y direction by moving the rotation shaft 53 along the length direction of the movable table 43 and slidingly adjusting the support arm 45 in the horizontal direction. As a result, with the displacement of the cutter holder 71, the blade 25 moves above the first cutting start position. In Example 1, the first cutting start position is the open end E1 on the side of the cutout N.

In addition, as shown in FIG. 15 (b), it is preferable that a predetermined cut-in angle α is formed between the direction D1 and the inclination N1. By forming a predetermined cutting angle, the blade 25 can cut the adhesive tape T along the inclination N1 with a sliding biasing force described later.

For convenience of explanation, the cut-in angle α is shown to be larger in FIG. 15 (b), but the actual cut-in angle α is smaller than this, and it is more preferable to be greater than 0 degrees and 5 degrees or less. Since the cutting angle α is not too large, the cutting edge 25 a contacts the outer edge portion of the wafer W such as the tilt N1 at an acute angle, so that the cutting edge 25 a can be prevented from biting into the outer edge portion of the wafer W. The direction D1 corresponds to a first direction in the present invention. The step S5-1 corresponds to the first adjustment step in the present invention.

Step S5-2 (form the first cutting section)

When the movement of the blade 25 and the adjustment of the orientation of the blade tip 25a are completed, the first cutting step of step S5-2 is started. The first cutting step is a step of cutting the adhesive tape T along the inclination N1 of the cutout N and the valley portion N3 from the opening end E1 which is the first cutting start position to the cutting end position F. Preferably, the cutting end position F is the position closest to the radially inner side of the wafer W in the valley portion N3, that is, the deepest portion of the cutout N.

In the first cutting step, first, the blade 25 is inserted into the adhesive tape T. That is, as shown in FIG. 9, when the cutting edge 25 whose direction of the cutting edge 25 a is adjusted in the direction D1 is moved upward from the first cutting start position, the cutting edge 25 waiting above is lowered and cut on the chuck table 11. The knife advancing groove 27 penetrates the adhesive tape T.

In this case, as shown in FIG. 6, the cylinder 85 is supplied with high-pressure air, so that the piston rod 85a protrudes greatly, the bracket 69 slides outward against the spring 83, and the blade 25 is moving from the wafer W The opening end E1 of the cutout N is inserted into the adhesive tape T at a position slightly deviated outward (for example, several mm).

After that, the portion of the blade edge 25 at the open end E1 of the cutout N contacts the outer peripheral edge of the wafer W by a sliding operation.

At the first cutting start position (open end E1), cutting of the adhesive tape T starts. That is, while the direction of the cutting edge 25a of the cutting edge 25 is maintained in the direction D1, the cutting edge 25 which has penetrated the adhesive tape T is moved horizontally in a direction parallel to the inclination N1, and the adhesive tape T is cut along the inclination N1.

A configuration in which the blade 25 is horizontally moved along the inclination N1 will be described. That is, the support member 59 slides horizontally in the longitudinal direction of the linear motion unit 54 by the linear motion unit 54. With the movement of the support member 59 by the linear motion unit 54, each of the support arm 45, the rotation member 63, and the blade 25 connected to the support member 59 is formed on the linear motion unit 54 as shown in FIG. 16 (a). Displacement on the long side. The direction of displacement of the support arm 45 and the like is indicated by the symbol H1. In Embodiment 1, the direction H1 is configured to be parallel to the x direction.

Next, as shown in FIG. 16 (b), in synchronization with the movement of the support member 59 by the linear motion unit 54, the support arm 45 is horizontally slid in the long side direction of the support arm 45 by the linear motion unit 46. With the sliding of the support arm 45 by the linear motion unit 46, each of the rotating member 31 and the blade 25 supported by the support arm 45 is displaced in the direction shown by the symbol H2. The direction in which the support arm 45 is displaced by the linear motion unit 54 is orthogonal to the direction in which the support arm 45 is displaced by the linear motion unit 46. That is, in Example 1, the direction H1 is parallel to the y direction.

By appropriately adjusting the moving speed of the support member 59 and the moving speed of the support arm 45, the blade 25 moves horizontally in a direction indicated by a symbol H3 in FIG. 16 (b). In Embodiment 1, it is assumed that the direction H3 is parallel to the direction in which the slope N1 extends.

By moving the cutting edge 25 in the direction H3, the cutting edge 25 moves from the position shown by the dotted line to the position shown by the solid line while maintaining the state of the cutting edge 25a in the direction D1 as shown in FIG. 17 (a). Move towards tilt N1.

When the blade 25 forms the first cutting portion C1, the blade 25 is biased and slid toward the vertical axis fulcrum P by a spring 83. In addition, the direction D1 of the cutting edge 25a of the cutting edge 25 is adjusted so that the cutting edge 25a has a predetermined cutting angle α with respect to the inclination N1.

Therefore, the blade 25 in the cutting operation posture moves in the direction H3 while being pressed against the inclination N1 of the notch N by the sliding biasing force. Since the blade edge 25a cuts the adhesive tape T according to the movement of the blade 25, the first cutting portion C1 is formed along the inclination N1 by the blade edge 25a (FIG. 17 (a)).

The blade 25 cuts the adhesive tape T from the open end E1 to the end of the inclination N1, and then cuts the adhesive tape T in a part of the valley N3, and moves to the cutting end position F (FIG. 17 (b)). That is, the blade edge 25 moves from the open end E1 to the position shown by the dotted line in FIG. 17 (b) along the inclination N1, and then moves along the valley portion N3 to the position shown by the solid line in FIG. 17 (b). As the cutting edge 25 moves, the cutting edge 25a cuts into the adhesive tape T along the edge of the cutout N.

When the cutting edge 25a of the cutting edge 25 reaches the cutting end position F which is the deepest part of the cut N, the sliding movement of the support arm 45 by the linear motion unit 46 and the linear motion unit 54 is stopped. The blade 25 is moved from the opening end E1 to the cutting end position F to form a first cutting portion C1 that connects the opening end E1 and the cutting end position F (Fig. 17 (b)).

In the first cutting step, the direction of the cutting edge 25a of the cutting edge 25 is adjusted to always be the direction D1. The moving direction of the blade 25 is controlled so that the direction H3 parallel to the inclination N1 can be maintained. That is, since the orientation of the blade tip 25a is not changed while the adhesive tape T is pierced, it is possible to more reliably avoid breakage of the wafer W and loss of the blade 25 caused by the blade tip 25a biting into the edge of the wafer W.

The blade 25 is pressed against the edge (incline N1 or valley N3) of the cutout N by the sliding biasing force of the spring 83. Therefore, the blade edge 25 can appropriately cut the adhesive tape T along the edge of the cutout N while maintaining a more stable posture. The cutting edge 25a of the cutting edge 25 has a cutting operation posture having a predetermined cutting angle α with respect to the inclination N1.

The valley portion N3 has a curved shape that is more gently curved than the slope N1 that has a straight shape that faces the radially inner side of the wafer. In the configuration of the first embodiment, since the cutting edge 25a has a predetermined cutting angle α, it is possible to appropriately prevent the cutting edge 25 from being caught at the boundary point between the inclination N1 and the valley portion N3 and stopped.

As a result, the blade edge 25a can cut the adhesive tape T along the edge of the cutout N from the open end E1 to the cutting end position F, that is, the innermost portion of the valley portion N3. In addition, by giving a biasing force to the blade edge 25, it is possible to more reliably prevent the blade edge 25 from stopping at the boundary point between the inclination N1 and the valley portion N3. By forming the first cutting portion C1 that connects the open end E1 and the cutting end position F, the process of step S5-2 ends.

Step S5-3 (withdrawing the blade)

After cutting the adhesive tape T to the cutting end position F to form the first cutting portion, the movable table 43 is raised to extract the blade 25 from the adhesive tape T. Alternatively, after returning the cutting edge 25 from the cutting end position F toward the opening end E1, the cutting edge 25 may be extracted from the adhesive tape T.

Step S5-4 (adjust the direction of the blade tip to the second direction)

After the blade 25 is drawn out from the adhesive tape T, in order to cut off the adhesive tape T of the portion inclined at N2, the adjustment of the blade tip 25a of step S5-4 is started. That is, the linear motion units 46 and 54 move the blade 25 upward above the second cutting start position, and use the rotary cylinder 70 and the motor 79 to adjust the direction of the blade tip 25a. In the first embodiment, the second cutting start position is the other open end E2 of the cutout N.

The rotary cylinder 70 quickly adjusts the direction of the blade tip 25a by rotating the cutter holder 71 quickly. After the adjustment is performed by the rotary cylinder 70, the operation flange 77 is rotated around the longitudinal fulcrum Q by the motor 79 to complete the fine adjustment of the direction of the blade tip 25a. Through the process of step S5-4, the cutting edge 25 is controlled to be displaced from the position and direction shown by the dotted line toward the position and direction shown by the solid line, and the cutting edge 25a is adjusted to face the direction indicated by the symbol D2.

The direction D2 is as shown in FIG. 18 (a), and it is preferable to form a predetermined cut-in angle β with the inclination N2. By forming a predetermined cutting angle, the blade 25 can more appropriately cut the adhesive tape T along the inclination N1 by a sliding biasing force described later. The magnitude of the cutting angle β is substantially the same as the cutting angle α. That is, the magnitude of the cut-in angle β is more preferably greater than 0 degrees and less than 5 degrees. The direction D2 corresponds to the second direction in the present invention. The step S5-4 corresponds to the second adjustment step in the present invention.

Step S5-5 (form a second cutting section)

When the movement of the blade 25 and the adjustment of the orientation of the blade tip 25a are completed, the second cutting step of step S5-5 is started. In the second cutting step, the adhesive tape T is cut from the opening end E2 which is the second cutting start position to the cutting end position F along the inclination N2 and the valley portion N3 of the cut N.

In the second cutting step, first, the blade 25 waiting above the second cutting start position is lowered to penetrate the adhesive tape T. In this case, in a state where the piston rod 85 a protrudes greatly, the blade edge 25 pierces the adhesive tape T at a position slightly deviated (approximately several mm) from the open end E2 to the outside.

Thereafter, the tip 25 a of the cutting tool 25 is brought into contact with the outer peripheral edge of the wafer W by sliding.

At the open end E2, the cutting of the adhesive tape T starts. That is, while the orientation of the cutting edge 25a of the cutting edge 25 is maintained in the direction D2, the cutting edge 25 which has penetrated the adhesive tape T is moved horizontally in a direction parallel to the inclination N2, and the adhesive tape T is cut along the inclination N1. . The configuration of moving the blade 25 horizontally along the inclination N2 is the same as that in step S5-2. That is, by the linear motion unit 46 and the linear motion unit 54, the blade 25 is horizontally moved in a downward left direction at an angle of 45 degrees (FIG. 18 (b), a direction shown by a symbol H4).

By moving the cutting edge 25 in the direction H4, as shown in FIG. 17 (a), the cutting edge 25 is inclined from the position shown by the dotted line to the position shown by the solid line along the inclination N1 and while maintaining the state of the tip 25a facing the direction D1. The valley part N3 moves. The blade edge 25a is cut into the adhesive tape T along the inclination N1 and the valley portion N3 to form a second cutting portion C2 that connects the open end E2 and the cutting end position F (FIG. 18 (c)). The first cutting portion C1 and the second cutting portion C2 are connected at the cutting end position F to complete the cutting of the adhesive tape T in the cut portion.

Similarly to step S5-2, even when the blade 25 forms the second cutting portion C2, the blade 25 is biased and slid toward the vertical axis fulcrum P by the spring 83. In addition, the direction D2 of the cutting edge 25a is adjusted so that the cutting edge 25 is formed in a cutting operation posture in which the cutting edge 25a has a predetermined cutting angle β with respect to the inclination N2.

Therefore, the cutting edge 25a can appropriately cut the adhesive tape T along the slope N2 and the valley portion N3 without stopping at the boundary point between the slope N2 and the valley portion N3. By forming the second cutting portion C2 that connects the open end E2 and the cutting end position F, the process of step S5-5 ends.

Step S5-6 (Detection of cut portion)

After the first cutting portion C1 and the second cutting portion C2 are formed, cutting of the adhesive tape T corresponding to the cut portion is detected. When the first cutting portion C1 and the second cutting portion C2 are connected, the adhesive tape T (the portion indicated by the symbol Tn in FIG. 19) of the cut portion is divided from the adhesive tape T of a portion attached to the wafer W. As a result, as shown in FIG. 12 (c), the adhesive tape Tn is attracted to the cutting detector 12 formed on the chuck table 11 through the suction hole 14 located below the adhesive tape Tn.

When the adhesive tape Tn is attracted to the cut detection unit 12, the pressure during suction by the suction device 16 changes. On the other hand, as shown in FIG. 12 (b), when the first cutting portion C1 and the second cutting portion C2 are not connected, the adhesive tape Tn of the cutout portion is the adhesive tape T of the portion of the wafer Since it is connected, the adhesive tape Tn is not attracted to the cut detection section 12. In this case, the suction pressure generated by the suction device 16 does not change. Therefore, by appropriately using a method of detecting a change in the suction pressure in the suction device 16 using a pressure gauge, it is possible to more reliably detect information on whether the adhesive tape Tn is correctly divided based on the numerical information.

Step S5-7 (withdraw the blade)

When it is confirmed that the adhesive tape Tn in the cut portion is cut, the movable table 43 is raised and the blade 25 is pulled out of the adhesive tape T. Alternatively, after returning the cutting edge 25 from the cutting end position F toward the open end E2, the cutting edge 25 may be extracted from the adhesive tape T.

Step S5-8 (cut off the peripheral part except the incision)

After the blade edge 25 is withdrawn from the adhesive tape T, the adhesive tape T is cut at the outer periphery Wa of the wafer other than the notch. In Example 1, as shown in FIG. 20 (a), first, the third cutting portion C3 is formed by cutting the adhesive tape T from the third cutting start position S toward the opening end E1 along the outer periphery Wa. Next, the fourth cutting portion C4 is formed by cutting the adhesive tape T from the third cutting start position S toward the opening end E2 along the outer periphery Wa. The third cutting portion C3 is connected to the fourth cutting portion C4 to complete cutting of the adhesive tape T at the portion of the outer peripheral portion Wa. The process of step S5-8 is equivalent to the outer peripheral cutting process of this invention.

First, the blade 25 drawn from the adhesive tape T is moved horizontally above the third cutting start position S in accordance with the movement of the linear motion units 46 and 54. The third cutting start position S may be selected at any position on the outer periphery Wa or any position slightly outside the outer periphery Wa.

After the blade edge 25 is moved above the third cutting start position S, the position and orientation of the blade edge 25a are adjusted. That is, the linear motion unit 54 and the linear motion unit 46 are used to appropriately shift the blade 25 and the cutter holder 71 in the x direction and the y direction, and the rotary cylinder 70 and the motor 79 are driven to rotate the blade 25 appropriately. The direction D3 of the cutting edge 25a at this time may be parallel to the wiring of the outer periphery Wa, or may be a direction having a predetermined cutting angle γ with respect to the wiring B of the outer periphery Wa as shown in FIG. 20 (b).

After the movement of the blade edge 25 and the adjustment of the orientation of the blade edge 25a are completed, the blade edge 25 that has moved above the third cutting start position S is lowered to penetrate the adhesive tape T. In this case, the piston rod 85a is actuated to protrude greatly, and the blade 25 is inserted into the adhesive tape T at a position slightly deviated outward (for example, several mm) from the third cutting start position S.

After that, the air pressure of the air cylinder 85 is lowered so that the protruding force of the piston rod 85a is smaller than the spring force. As shown in FIG. 7, the carrier 69 is slid to the wafer center side by the biasing force of the spring 83. In the embodiment, the cutting edge 25 a of the cutting edge 25 is brought into contact with the outer peripheral edge of the wafer W by sliding.

At the third cutting start position S, the cutting of the adhesive tape T is started in a state where the blade 25 is pressed toward the outer peripheral edge of the wafer. That is, as shown in FIG. 10, the support arm 45 is rotated. Concomitantly, the blade edge 25 is rotationally moved from the third cutting start position S to the open end E1 while slidingly contacting the outer periphery Wa while maintaining the direction of the blade edge 25a. By the rotational movement of the blade 25, the adhesive tape T is cut along the outer periphery Wa of the wafer while the angle of the blade tip 25a is maintained in the predetermined direction D3, and the third cutting portion C3 is formed in the same manner as the first The cutting section C1 is connected.

When the formation of the third cutting portion C3 is completed, the blade 25 is pulled out from the adhesive tape T again, and the formation of the fourth cutting portion C4 is started. That is, the blade 25 that has been pulled out of the adhesive tape T is moved again above the third cutting start position S, and the rotary cylinder 70 and the motor 79 are driven to appropriately adjust the direction of the blade tip 25a.

Then, the blade 25 is lowered at the third cutting start position S to pierce the adhesive tape T, and the blade 25 in a state in contact with the outer periphery Wa of the wafer W is started from the third cutting by the biasing force of the pressing force of the spring 83. The position S rotates to the open end E2. In the case of Example 1, the piston rod 85a is actuated to protrude greatly, and the blade 25 penetrates the adhesive tape T at a position slightly deviated outward (for example, several mm) from the third cutting start position S. The adhesive tape T is cut along the wafer outer periphery Wa by the rotational movement of the blade 25, and the fourth cutting portion C4 is connected to each of the second cutting portion C2 and the third cutting portion C3.

Since the fourth cutting section C4 is formed, since each of the first cutting section C1 to the fourth cutting section C4 is connected to each other, the adhesive tape T is cut along the outer shape of the wafer W including the cutout N. By cutting the adhesive tape T along the outline of the wafer W, all steps of step S5 (cutting of the adhesive tape) are completed, and the process proceeds to step S6. By performing each step after step S6, all the adhesive tape attaching steps including the adhesive tape cutting step of Example 1 are completed.

    <Effect of the structure according to Example 1>    

In the pressure-sensitive adhesive tape cutting step of Example 1, the adjustment of the direction of the cutting edge of the blade was performed in a state where the blade did not penetrate the pressure-sensitive adhesive tape. That is, the direction of the blade tip is not changed in a state where the blade penetrates the adhesive tape, so that damage to the wafer and loss of the blade due to the rotation of the blade penetrated into the adhesive tape can be avoided.

When the adhesive tape is cut along each of the inclination, the direction of the blade tip is adjusted so as to form a predetermined cutting angle with the inclination. Therefore, a sufficiently large biasing force acts on the cutting edge 25a of the cutting edge 25, so that the cutting edge 25 can be prevented from being jammed and stopped at the boundary point J1.

Therefore, even if the direction in which the blade 25 moves is always fixed to H3, the blade 25 still moves in the inclination N1 in the direction H3, and then moves in the valley portion N3 along the extension direction H5 of the valley by the biasing force. As a result, the cutting edge 25a of the cutting edge can be reliably cut in from the opening end E1 at the first cutting start position to the cutting end position F, which is the deepest part of the cut N, so it can be formed along the outer edge of the cut N The first cutting portion C1 connected from the opening end E1 of the cut to the deepest portion F of the cut (FIG. 21 (a)).

The same applies to the case where the second cutting portion C2 is formed. Because the biasing force acts, the blade 25 can be prevented from stopping at the boundary point J2. Therefore, the second cutting portion C2 is formed to connect the opening end E2 of the cutout with the deepest portion F of the cutout. Therefore, since the first cutting portion C1 and the second cutting portion C2 are surely connected at the cutting end position F which is the deepest portion of the cut, the adhesive tape Tn of the cut portion can be accurately guided along the outside of the cut N The edge is surely divided from the adhesive tape T of a portion attached to the wafer W.

In a case where the cutting angle is not formed and the direction D1 of the blade tip coincides with the obliquely extending direction and the adhesive tape is cut along the oblique N1, the biasing force is not sufficiently applied to the blade edge 25. Therefore, in such a conventional configuration, when the deepest portion of the cutout N has a shallow-bottomed shape (valley portion N3), there is a concern that the boundary point J1 between the straight slope N1 and the curved valley portion N3 Wait for the stuck and stopped problem (Figure 21 (b)).

In this case, the first cutting portion C1 can be formed only from the opening end E1 to the boundary point J1 and does not reach the deepest portion F of the cutout N. Also, the second cutting portion C2 is similarly formed from the opening end E2 to the boundary point J2. Therefore, the first cutting portion C1 is not connected to the second cutting portion C2. As a result, it is difficult to divide the adhesive tape Tn of the notch portion from the adhesive tape T of the wafer W portion.

In Example 1, the cutting edge of which the orientation of the cutting edge was adjusted so as to form a cutting angle was cut into the deepest part of the cut along the inclined direction while maintaining the cutting edge orientation. With such a structure, the present invention can avoid the loss of the blade and the wafer, and can reliably cut the adhesive tape to the deepest part of the cut regardless of the shape of the deepest part of the cut. Furthermore, by making the direction of the moving blade in the first cutting step or the second cutting step fixed, the movement control mechanism by the control device 93 is made easier.

    [Example 2]    

Next, a second embodiment of the present invention will be described. The configuration of the adhesive tape application device of the second embodiment is basically the same as that of the device of the first embodiment. However, the second embodiment differs from the first embodiment in that it is configured not to generate a pressing bias force due to the spring 83. In specific examples, the control of the linear motion units 46 and 54 can be used to set the orbit of the blade 25 to the outside of the edge of the hypotenuse (incline N1 or incline N2) of the cutout N to prevent the spring 83 from being caused. The structure of the pressing bias generated.

The step of attaching the adhesive tape of Example 2 is basically the same as the step of Example 1. However, the step of cutting the adhesive tape T of the cut portion is different.

Here, step S5-2 is taken as an example to explain the differences of the embodiments. As shown in FIG. 22 (a), in Example 1, the orientation of the blade tip 25a is adjusted so as to have a predetermined cutting angle α with respect to the extending direction of the inclination N1. Furthermore, in Example 1, the blade edge 25 cuts the adhesive tape T along the inclination N1 and the valley portion N3 while contacting the edge of the cutout N.

Specifically, the cutting edge 25a moves to the boundary point J1 between the inclination N1 and the valley portion N3 while proceeding in a direction (direction H3) parallel to the inclination N1 while maintaining the direction D1. After moving linearly from the open end E1 to the boundary point J1, the cutting edge 25a moves from the boundary point J1 to the cutting end position F along the curve forming the valley portion N3. Therefore, in Example 1, the first cutting portion C1 has a shape that connects a straight line forming the slope N1 and a curve forming the valley portion N3.

On the other hand, as shown in FIG. 22 (b), in the second embodiment, the blade 25 is pierced into the adhesive tape T at the open end E1, and then it is advanced from the open end E1 to the cutting end position F to cut the adhesive tape T . Therefore, the first cutting portion C1 formed by the cutting edge 25a has a linear shape connecting from the opening end E1 to the cutting end position F.

That is, in the second embodiment, strictly speaking, the trajectory of the first cutting portion C1 does not match the inclination N1. However, since the width between the valleys N3 in the actual configuration is very narrow, the direction in which the first cutting portion C1 extends and the direction in which the slope N1 extends are approximately parallel, and the position where the first cutting portion C1 is formed is extremely close to the slope N1. Office. In the present invention, the case where the cutting is performed so that the trajectory near the slope N1 becomes substantially parallel to the slope N1 is also included in the "cutting along the slope N1" configuration and will be described below.

    <Description of the process of cutting the adhesive tape of a notch part based on Example 2>    

Here, the process of cutting the adhesive tape of a notch part in Example 2 will be described in comparison with Example 1. The outline of this step in the second embodiment is the same as that in the first embodiment. That is, following the steps from step S5-1 to step S5-8 shown in FIG. 14 (b), the adhesive tape T at the cut portion is cut.

Step S5-1 (adjust the direction of the blade tip to the first direction)

The process according to step S4 ends, and the adjustment of the cutting edge 25a of step S5-1 is started. That is, as in the first embodiment, the blade edge 25 is rotated around the axis of the longitudinal point of view Q by the rough adjustment by the rotary cylinder 70 and the fine adjustment of the motor 79, and the orientation of the blade edge 25a is adjusted to the position of the symbol R1. Shown direction. The direction R1 corresponds to the direction of a straight line connecting the opening end E1 which is the first cutting start position and the cutting end position F as shown in Fig. 23 (a).

In addition, the blade edge 25 is moved while adjusting the direction of the blade edge 25a. That is, by the linear motion unit 54 and the linear motion unit 46, the blade 25 and the cutter holder 71 are appropriately displaced in the x direction and the y direction. As a result, with the displacement of the cutter holder 71, the blade edge 25 moves above the open end E1 which is the first cutting start position, and is simultaneously rotated so that the direction of the blade tip 25a becomes R1.

Step S5-2 (form the first cutting section)

When the movement of the blade 25 and the adjustment of the direction of the blade tip 25a are completed, the first cutting step of step S5-2 is started. That is, the cutting edge 25 whose direction of the cutting edge 25a is adjusted in the direction R1 is lowered.

In the first embodiment, the orbit of the blade edge 25 is controlled by the linear motion unit in such a manner that the pressing bias force caused by the spring 83 is not generated. The open end E1 of the cutout N in the wafer W is pierced into the adhesive tape T at a position slightly deviated outward (a few mm) from the outside. On the other hand, in Example 2, the track of the blade 25 is set to be outside the edge of the hypotenuse of the cutout N through the control of the linear motion unit so that the pressing bias force caused by the spring 83 is not generated. In Example 2, the blade 25 penetrates the adhesive tape T at a position on the above-mentioned track slightly deviated outward (a few mm) from the open end E1 of the notch N in the wafer W.

After the blade 25 penetrates the adhesive tape T at the first cutting start position, cutting of the adhesive tape T starts. That is, in a state where the direction of the tip 25a of the knife 25 is maintained in the direction R1, the cutting edge 25 is advanced from the open end E1 to the cutting end position F to cut the adhesive tape T. As a result, as shown in FIG. 23 (b), a linear first cutting portion C1 that connects the opening end E1 and the cutting end position F is formed.

The blade 25 is moved horizontally from the open end E1 to the cutting end position F by the driving of the linear motion units 46 and 54, that is, in the direction R1. The direction of the knife edge 25a in the second embodiment is the same as the direction R1 in which the blade edge 25 is moved, so the knife edge 25a can cut the adhesive tape T more appropriately. The first cutting portion C1 is formed by cutting into the cutting end position F with the blade tip 25a, and the process of step S5-2 is completed.

Step S5-3 (withdraw the blade)

After the adhesive tape T is cut to the cutting end position F to form the first cutting portion C1, as in the first embodiment, the movable table 43 is raised to extract the blade 25 from the adhesive tape T. Alternatively, after returning the cutting edge 25 from the cutting end position F toward the opening end E1, the cutting edge 25 may be extracted from the adhesive tape T.

Step S5-4 (adjust the direction of the blade tip to the second direction)

After the blade edge 25 is withdrawn from the adhesive tape T, the adjustment of the blade edge 25a of step S5-4 is started. That is, while the cutting edge 25 is moved above the open end E2 which is the second cutting start position by the linear motion units 46 and 54, the direction of the cutting edge 25a is adjusted to the position indicated by the symbol R2 by the rotary cylinder 70 and the motor 79. Shown direction. As shown in FIG. 24 (a), the direction R2 corresponds to the direction of a straight line connecting the opening end E2 which is the second cutting start position and the cutting end position F.

Step S5-5 (form a second cutting section)

In accordance with the movement of the blade 25 and the adjustment of the direction of the blade tip 25a, the second cutting step of step S5-5 is started. That is, the blade edge 25 whose orientation of the blade edge 25a has been adjusted in the direction R2 is lowered, and the adhesive tape T is pierced at the opening end E2 which is the second cutting start position.

After the blade 25 penetrates the adhesive tape T at the second cutting start position, cutting of the adhesive tape T starts. That is, while maintaining the orientation of the cutting edge 25a of the cutting edge 25 in the direction R2, the cutting edge 25 is advanced straight from the open end E2 to the cutting end position F to cut the adhesive tape T. As a result, as shown in FIG. 24 (b), a linear second cutting portion C2 is formed which connects the open end E2 and the cutting end position F.

The direction of the adjusted blade tip 25a in step S5-4 and the direction G2 in which the blade 25 is moved in step S5-5 are both the same direction R1. In this case, since the force is efficiently applied to the blade tip 25a, the blade tip 25a can more appropriately cut the adhesive tape T. The cutting edge 25a is cut into the cutting end position F, and the second cutting portion C2 is formed to complete the step S5-5.

The steps from step S5-6 to step S5-7 are the same as those of the first and second embodiments. That is, after the first cutting portion C1 and the second cutting portion C2 are formed, based on the change in the suction pressure in the suction device 16, the detection of the adhesive tape Tn from the adhesive tape T of the portion attached to the wafer W is detected. (Step S5-6). When it is confirmed that the adhesive tape Tn in the cut portion has been cut, the movable table 43 is raised to extract the blade 25 from the adhesive tape T (step S5-7). Alternatively, after returning the blade edge 25 from the cutting end position F to the open end E2, the blade edge 25 may be extracted from the adhesive tape T.

Step S5-8 (cut off the peripheral part except the incision)

After the blade edge 25 is extracted from the adhesive tape T, the adhesive tape T is cut at the outer periphery Wa of the wafer other than the notch. That is, after the orientation of the blade tip 25a is adjusted, the blade edge 25 is pierced into the adhesive tape T at the third cutting start position S. Then, in the same manner as in Example 1, by forming the third cutting portion C3 and the fourth cutting portion as shown in FIG. 20, the adhesive tape T is cut along the outer peripheral portion Wa other than the cutout N.

In addition, in Example 2, since the pressing bias force caused by the spring 83 is not generated, it is preferable that the direction of the blade tip 25a is adjusted to be parallel to the tangent line B of the outer periphery Wa. As each of the first cutting section C1 to the fourth cutting section C4 is connected, the adhesive tape T is accurately cut along the outer shape of the wafer W including the cutout N. After the adhesive tape T is cut, the steps subsequent to step S6 shown in FIG. 14 (a) are performed.

In the second embodiment, as in the first embodiment, the orientation of the blade edge 25 a is adjusted in a state where the blade edge 25 is always pulled out from the adhesive tape T. That is, in a state where the blade edge 25 penetrates the adhesive tape T, the direction of the blade tip 25a around the axis of the longitudinal fulcrum Q is always maintained in a fixed direction. Therefore, it is possible to appropriately avoid the problem of damage to the wafer W caused by the blade 25 penetrating into the adhesive tape T and the problem of rapid loss of the blade 25.

In addition, by cutting the adhesive tape without changing the direction of the blade tip 25a while the blade 25 penetrates the adhesive tape T, the effect of avoiding deformation of the blade 25 and the effect of more appropriately cutting the adhesive tape T can also be obtained. That is, as shown in FIGS. 25 (a) and 25 (b), when the cutting edge 25 penetrates the adhesive tape T, the orientation of the blade tip 25a is changed from D1 to D2, and the adhesive is adhered according to the change of the orientation. The band T causes a deformation shown by the symbol M.

The deformation of the adhesive tape T in a horizontal posture due to the generation of the deformation M may occur (Fig. 25 (c)) or the state of sinking deformation (Fig. 25 (d)). The deformation of the adhesive tape T will cause the cross-section Tk of the adhesive tape T and the blade tip 25a to be out of alignment, so it will become difficult for the blade tip 25a to properly cut the adhesive tape T.

In recent years, as wafers have become thinner, adhesive tapes that are thicker and harder to elastically deform have been used. When the cutting edge 25 is forced into a thick adhesive band that is not easily deformed elastically and the orientation of the blade tip 25a is forcibly changed, there is an adhesive band that is difficult to elastically deform around the blade 25, so an excessively large force acts on On the blade 25. As a result, there is a concern that the blade 25 may be deformed by an excessive force. Therefore, as in the first and second embodiments, by always adjusting the orientation of the cutting edge 25a while the cutting edge 25 has been withdrawn from the adhesive tape T, the cutting edge 25 due to the change in the direction of the cutting edge 25a can be reliably avoided. Deformation problem.

In Example 2, the blade edge 25 cuts off the adhesive tape Tn of the cutout portion without contacting the edge of the cutout N. Therefore, problems such as chip breakage and abrasion of the blade caused by the contact between the blade 25 and the wafer W can be avoided. Since the first cutting portion C1 is a straight line connecting the open end E1 and the deepest portion F of the notch, it is formed approximately parallel to the inclination N1 of the notch N and the inclination N1. Since the second cutting portion C2 is a straight line connecting the open end E2 and the deepest portion F, it is formed approximately in parallel with the inclination N2 near the inclination N2 of the cutout N. Therefore, in Example 2, since the uncut adhesive tape of the cut portion can be further reduced, the problem of contamination of the wafer W by the uncut adhesive tape T, such as dust or washing water, can be avoided more reliably.

The present invention is not limited to the embodiments described above, and can be modified and implemented as described below.

(1) In each embodiment, the opening end E1 and the opening end E2 with the first cutting start position and the second cutting start position as the side of the cutout N have been described. However, the first cutting start position and the second cutting start position are not limited to this. As an example, the first cutting start position may be a position near the opening end E1 that is offset (for example, several mm) from the opening end E1 toward the outside of the wafer W.

(2) In Embodiment 1, the configuration in which the cutting edge 25a of the cutting edge 25 is pressed against the outer edge portion (incline N1, N2, etc.) of the notch N is not limited thereto. That is, a configuration may be adopted in which at least a part of the side surface of the blade 25 is pressed against the outer edge portion of the cutout N.

A first example of the configuration of the modification (2) will be described. As shown in FIG. 26 (a), the blade 25 of the modification (2) includes a side surface 25b and a side surface 25c. Further, as shown in FIG. 26 (b), in step S5-2, the adhesive tape T is moved along the inclination N1 while the side surface 25b of the blade 25 is in contact with the inclination N1 and the orientation of the blade edge 25a is maintained in the direction D1. Cut off. In this way, by contacting the side surface of the cutting edge 25 with the outer edge of the cutout N, it is possible to more surely prevent the cutting edge 25a from biting into the outer edge portion of the cutout N and wearing the cutting edge 25.

(3) As a further modification of the modification (2), as shown in FIG. 26 (c), the cutting edge 25 can be configured such that the side surface 25b is pressed against the inclined portion N1 and faces the cutting edge 25a in the direction of D1. In a position slightly deviated from the inclination N1. In this case, the first contact portion C1 is formed in the vicinity of the inclination N1 in parallel with the inclination N1 (see reference symbol Y). By forming the adhesive tape T that cuts the cut portion in a state where the cutting edge 25a is separated from the inclination N1, it is possible to surely avoid contact between the cutting edge 25a and the outer edge portion of the cutting N. As a result, it is possible to more reliably prevent the blade edge 25a from biting into the wafer W.

In addition, the "cutting of the adhesive tape along the inclination N1" in the cutting process of the adhesive tape of the present invention is not limited to cutting the adhesive tape with the blade edge 25a in contact with the inclination N1 and parallel to the inclination N1 as shown in Example 1. T's case. In other words, as shown in the second embodiment and the modified example (3), it is assumed that the cutting edge 25a cuts the vicinity of the slope so as to be approximately parallel to the slope N1.

(4) For Example 1, for example, in step S5-2, when the blade 25 is moved from the first cutting start position to the cutting end position, the direction in which the linear motion units 46 and 54 move the blade 25 is It is always maintained in the direction H3, but it is not limited to this. That is, as long as the direction of the blade edge 25a is maintained in the direction D1, the direction in which the blade edge 25 is moved may be appropriately changed in accordance with the position of the blade edge 25.

As an example, when the blade 25 is moving along the inclination N1, the blade 25 is moved in the direction H3 where the inclination N1 extends. When the blade 25 moves along the valley N3, the direction H5 is extended according to the curve constituting the valley N3. The configuration of appropriately changing the direction in which the blade 25 is moved (see FIG. 22 (a)). In this modification, when the blade 25 moves along the valley N3, the blade biasing force on the edge of the valley N3 can be prevented from being excessively applied, so that problems such as damage to the wafer N3 between the valleys can be appropriately avoided.

(5) In each embodiment, the cut detection unit 12, the suction hole 14, and the suction device 16 are used to detect the cut of the adhesive tape Tn in the cut portion. However, the configuration for performing the detection is not limited to this. As another example, a surveillance camera 99 can be used to monitor the area of the adhesive tape Tn to detect that the first cutting section C1 and the second cutting section C2 are correctly connected and the adhesive tape Tn is divided.

(6) In each embodiment, the cut detection unit 12 and the suction hole 14 are formed outside the cutter advancing groove 27 provided in the chuck table 11, but are not limited thereto. That is, as long as the cut adhesive tape Tn can be appropriately adsorbed, a cut detection unit 12 and an adsorption hole 14 may be provided inside the cutter traveling groove.

(7) In each embodiment, although the configuration in which the cutout N is bent at its deepest portion F to a valley bottom portion N3 having a shallow bottom has been described as an example, a linear inclination N1 and The linear inclination N2 is a notch N having a shape that is connected at the deepest portion F. That is, even if the shape of the cutout N is a correct V shape, the configuration of the present invention can be applied even if the shape of the cutout N is appropriately changed.

(8) Regarding the embodiments, the configuration for acquiring the position information of the cutout N has been described with reference to the configuration in which the cutout N is imaged and detected by the surveillance camera 99, but is not limited thereto. As another example, there can be mentioned a configuration in which a CCD sensor is provided instead of the surveillance camera 99, and a light source (not shown) is arranged below the edge portion of the wafer W and the like. In this case, the position information of the cutout N can be obtained by detecting a change in the amount of light generated from the light source by a CCD sensor.

(9) In each of the embodiments described above, the first cutting start position is set as the opening end E1, and the second cutting start position is set as the opening end E2, but it is not limited to this.

First, as a modification of the first embodiment, as shown in FIG. 28 (a), a case where the position indicated by the symbol S1 is set as the first cutting start position will be described as an example. The symbol S1 is a distance from the open end E1. The wafer W is located on the outside in the radial direction and on the inside in the outer peripheral direction. Here, the inner side in the outer circumferential direction of the wafer W means a side that is offset from the adhesive tape Tn in the cutout portion.

In the modification of the first embodiment, in the same manner as in the first embodiment, in order to more surely remove the adhesive tape Tn at the cutout portion, the blade 25 penetrating the first cutting start position of the adhesive tape T is controlled to move linearly. The units 46 and 54 move in a direction H3 parallel to the inclination N1 of the cutout N. That is, in the modification of the first embodiment, the assumed movement trajectory of the blade edge 25 which penetrates the first cutting start position S1 is the trajectory L1 shown by a broken line in FIG. 28 (a).

As shown in FIG. 28 (b), when the blade 25 is pierced into the first cutting start position S1, the piston rod 85a comes into contact with the bracket 69. When the blade edge 25 is further slid in the direction H3 while maintaining the abutment state as shown in FIG. 28 (b), the movement trajectory of the blade edge 25 becomes the trajectory L1. Therefore, in a state in which this abutment state is maintained and the direction of the blade tip is adjusted to the direction D1, the blade 25 which penetrates at the first cutting start position S1 first moves along the trajectory L1.

The blade 25 that has moved along the trajectory L1 is in contact with the outer peripheral edge Wa of the wafer W at a position indicated by a symbol W1. As shown in FIG. 28 (c), when the blade edge 25 comes into contact with the wafer W, the holder 69 is separated from the front end of the piston rod 85a and the blade edge 25 abuts against the edge of the wafer W.

The blade edge 25 that has touched the outer peripheral edge Wa moves toward the open end E1 along the outer peripheral edge Wa of the wafer, and then moves to the boundary point J1 along the inclination N1. The blade 25 that has moved to the boundary point J1 moves along the valley portion N3 toward the cutting end position F. As a result, the first cutting portion C1 that connects the cutting start position S1 and the cutting end position F is formed in a trajectory as shown by a solid line in FIG. 28 (d). The same applies to the case where the second cutting portion C2 is formed. As an example, the cutting start position may be set at a position outside the wafer W from the radial end of the wafer W and inside the wafer W. .

As described above, in the modification of the first embodiment, similarly to the first embodiment, the blade 25 cuts the adhesive tape T while abutting against the edge of the wafer W. Therefore, the adhesive tape T can be accurately cut along the outer shape of the wafer W even at the cutout portion, so that problems caused by the existence of the uncut adhesive tape T can be avoided more appropriately.

First, as a modification of the second embodiment, as shown in FIG. 29 (a), the position indicated by the symbol S2 on the radially outer side of the wafer W from the open end E1 is set as the first cutting start position. The case is described as an example. Further, a line connecting the cut-off end position F, which is the innermost part of the valley portion N3, and the first cut-off start position S2 is made parallel to the inclination N1.

In the modification of the second embodiment, as in the second embodiment, as shown in FIG. 29 (b), the piston rod 85a is in contact with the bracket 69. In this abutment state, the blade 25 is configured to cut the adhesive tape T of a portion slightly separated from the edge portion Ed of the cutout N.

Then, while maintaining the abutment state shown in FIG. 29 (b), while adjusting the direction of the blade tip to the direction D1, the blade 25 pierced at the first cutting start position S2 is based on the linear motion unit 46 and The control of 54 advances straight from the first cutting start position S2 to the cutting end position F. As a result, the first cutting portion C1 that connects the cutting start position S2 and the cutting end position F forms a linear trajectory drawn as shown by a solid line in FIG. 29 (a). It is also the same when the second cutting portion C2 is formed. As an example, the cutting start position may be set to a position radially outward of the wafer W from the opening end E2.

As described above, in the modification of the second embodiment, as in the second embodiment, the blade 25 cuts the adhesive tape T while maintaining a slight deviation from the edge of the wafer W. Therefore, the loss of the blade 25 due to the contact between the blade 25 and the wafer W can be appropriately avoided. In addition, since the adhesive tape T exposed from the edge portion Ed of the notch can be minimized, problems caused by the presence of the uncut adhesive tape T can be appropriately avoided.

Claims (9)

    An adhesive tape cutting method in which a blade edge is relatively moved along an outer periphery of a semiconductor wafer having a V-shaped notch formed at one slope and another slope, so as to adhere the edge of the adhesive tape attached to the surface of the semiconductor wafer. The semiconductor wafer is cut into an outer shape, and includes a first adjustment step of adjusting the blade so that the blade is pulled out from the adhesive tape, so that the blade becomes a first direction facing radially inward from the semiconductor wafer. The cutting edge direction of the cutting edge; in the first cutting step, the cutting edge whose cutting edge is adjusted to the first direction is inserted into the adhesive tape, and the direction of the cutting edge of the cutting edge is maintained in the first direction, Cutting the adhesive tape along one of the inclines; the second adjustment step adjusts the blade in a second direction from the radially outer side of the semiconductor wafer to the inside in a state where the blade is withdrawn from the adhesive tape. The cutting direction of the cutting edge; in the second cutting step, the cutting edge whose cutting edge is adjusted to the second direction is inserted into the adhesive tape, and the direction of the cutting edge of the cutting edge is maintained at the first In the two-direction state, the adhesive tape is cut along the other inclination; and the peripheral cutting step cuts the adhesive tape along the outer periphery of the semiconductor wafer.         For example, in the adhesive tape cutting method of claim 1, wherein the deepest portion of the cut is a curved valley portion connecting the one slope and the other slope, at least in the first cutting step and the second cutting step. In one, the inclination of the blade tip with respect to the incision has a predetermined cutting angle, and in a state where the blade having the predetermined incision angle is pressed against the inclination, the inclination is continued to the deepest part of the incision. The adhesive tape is cut off until now.         The method for cutting an adhesive tape according to claim 2, wherein in at least one of the first cutting step and the second cutting step, the side of the blade is pressed against the inclination, and then the The tape is cut by inclining to the deepest part of the cut.         The adhesive tape cutting method according to claim 3, wherein in at least one of the first cutting step and the second cutting step, the side of the blade is pressed against the inclination, and the blade tip and the inclination In a non-contact state, the adhesive tape is cut along the inclination to the deepest part of the cut.         The method for cutting an adhesive tape according to any one of claims 2 to 4, wherein at least one of the first cutting step and the second cutting step is to change the blade edge along the slope and the valley The manner in which the shape of each of the parts moves is controlled.         For example, the method for cutting an adhesive tape according to claim 1, wherein the deepest portion of the cut is a valley portion connecting the one slope and the other slope, and at least in the first cutting step and the second cutting step In one aspect, the blade is cut by cutting the adhesive tape toward the deepest part of the incision with the blade edge straight.         The method for cutting an adhesive tape according to any one of claims 1 to 4, further comprising a cutting detection step for detecting the adhesive tape in the cut portion by the first cutting step and the second cutting step. Case.         The method for cutting an adhesive tape according to claim 7, wherein the cutting detection step is performed by the holding tape holding the semiconductor wafer and holding the cut portion of the cut portion to the adhesive tape.         An adhesive tape cutting device moves a blade edge along an outer periphery of a semiconductor wafer having a V-shaped notch formed at one slope and another slope, and moves an adhesive tape attached to the surface of the semiconductor wafer along the semiconductor. The device for cutting an adhesive tape of a semiconductor wafer whose wafer shape is cut is characterized in that the aforementioned adhesive tape is cut by the adhesive tape cutting method according to any one of claims 1 to 4.