TW201819736A - Plastic tile with attachment structure and method for manufacturing the same enabling the attachment structure to be integrally formed on the plastic tile during the manufacturing process, no additional adhesives is required - Google Patents

Plastic tile with attachment structure and method for manufacturing the same enabling the attachment structure to be integrally formed on the plastic tile during the manufacturing process, no additional adhesives is required Download PDF

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TW201819736A
TW201819736A TW105138897A TW105138897A TW201819736A TW 201819736 A TW201819736 A TW 201819736A TW 105138897 A TW105138897 A TW 105138897A TW 105138897 A TW105138897 A TW 105138897A TW 201819736 A TW201819736 A TW 201819736A
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layer
plastic floor
floor tile
semi
plastic
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TW105138897A
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TWI604115B (en
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柯五男
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柯五男
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Abstract

The present invention provides a plastic tile with attachment structure and a method for manufacturing the same. The structure at least comprises a base layer and a bottom surface layer, wherein the bottom surface layer is bonded to one surface of the base layer, the surface of the bottom surface layer away from the base layer is a bottom surface, a plurality of physical attachment structures formed by means of rolling are provided on the bottom surface and configured to directly contact and attach to a setting surface. A method for manufacturing the plastic tile includes steps of plastic material extruding, roll bonding, cooling and annealing, and punch forming, wherein in the roll bonding step, an embossing roller for forming the attachment structure on the surface of the plastic tile by rolling is used to enable the attachment structure to be integrally formed on the plastic tile during the manufacturing process, and no additional adhesives is required when paving the plastic tiles.

Description

具吸附結構的塑膠地磚及其製造方法    Plastic floor tile with adsorption structure and manufacturing method thereof   

本發明係關於一種塑膠地磚;更詳而言之,係一種具吸附結構的塑膠地磚。 The invention relates to a plastic floor tile; more specifically, it relates to a plastic floor tile with an adsorption structure.

目前市面上的塑膠地磚在裝設時,多利用黏膠將塑膠地磚黏貼於建築物之建置表面,惟,上膠黏附的塑膠地磚除了在裝設時需塗加黏膠,增加了人力工時與材料成本,並且於塑膠地磚拆下後多會因黏膠之撕毀而形成塑膠地磚之損壞,無法再次使用。 At present, when plastic floor tiles on the market are installed, they are mostly glued to the building surface of the building. However, in addition to the glued plastic floor tiles, they need to be coated with adhesive during installation, which increases labor. Time and material cost, and after the plastic floor tile is removed, the plastic floor tile will be damaged due to the tearing of the adhesive, and it cannot be used again.

為解決上述之缺失,本案發明人亦曾提出解決方法,請參閱我國專利公告第I496976號專利,即以崁接槽的設計使塑膠地磚與塑膠地磚間相連結並鋪設於建置表面,以取代黏膠在塑膠地磚上之應用。 In order to solve the above-mentioned shortcomings, the inventor of this case has also proposed a solution. Please refer to Chinese Patent Bulletin No. I496976, that is, the design of the joint groove connects the plastic floor tiles and the plastic floor tiles and lays them on the construction surface to replace Application of adhesive on plastic floor tiles.

惟,透過崁接槽連結之塑膠地磚雖可大範圍的設置於建置表面,但塑膠地磚缺乏底面與建置表面的附著力,因此當塑膠地磚的裁切長度與鋪設範圍長度不一致時,易因縫隙產生滑動的情形。 However, although the plastic floor tiles connected through the joint grooves can be set on the construction surface in a large range, the plastic floor tiles lack the adhesion between the bottom surface and the construction surface. Therefore, when the cutting length of the plastic floor tiles does not match the length of the laying range, it is easy to Slipping due to the gap.

本發明所欲解決的問題係利用「輥壓時壓製出物 理吸附結構」來改善習用「塑膠地磚使用黏膠」的問題。 The problem to be solved by the present invention is to use the "pressing out the physical adsorption structure when rolling" to improve the problem of using "adhesive for plastic floor tiles".

為解決上述問題,本發明係揭露一種具吸附結構的塑膠地磚,其結構包含:一基材層,具有一上表面與一背對該上表面的下表面;以及一底面層,係貼合於該基材層之該下表面,其遠離該基材層之一側的底面設置有多個以輥壓方式形成的物理吸附結構,該些吸附結構用以直接接觸並附著於一建置表面。 In order to solve the above problems, the present invention discloses a plastic floor tile with an adsorption structure. The structure includes: a base material layer having an upper surface and a lower surface facing away from the upper surface; and a bottom surface layer attached to the bottom surface layer. The bottom surface of the lower surface of the base material layer, a bottom surface remote from the base material layer, is provided with a plurality of physical adsorption structures formed in a rolling manner, and the adsorption structures are used to directly contact and attach to a building surface.

在一實施例中,該塑膠地磚更包含一結合於該上表面的印刷層以及覆蓋於該印刷層之面料層。 In one embodiment, the plastic floor tile further includes a printing layer bonded to the upper surface and a fabric layer covering the printing layer.

在上述之實施例中,該上表面與該印刷層之間可貼合一黏著層。 In the above embodiment, an adhesive layer may be adhered between the upper surface and the printing layer.

在一實施例中,該吸附結構係由多個在該底面層之該底面下凹的吸盤狀凹坑所組成,並係以點狀方型陣列、點狀環形陣列或點狀隔行交錯方式排列。 In one embodiment, the adsorption structure is composed of a plurality of sucker-shaped pits recessed on the bottom surface of the bottom surface layer, and is arranged in a dot-shaped square array, a dot-shaped circular array, or a dot-interlaced staggered manner .

如上述塑膠地磚,其未貼合黏著層之塑膠地磚製造方法的步驟包含:1.一塑料押出步驟:將各層原料依比例調和後放進攪拌機內混合攪拌完成原料混配程序,並經塑化程序後由一押出機完成押出程序;2.一輥壓貼合步驟:將預先分別押出的該底面層與該基材層同步引入一T型押出機進行T型模押出程序,該底面層與該基材層經T型押出機結合後經輥壓形成預定的厚度完成輥壓出片程序為一材料片,接著將該材料片需經壓紋的底面層與預先形成的面料層以分層預熱程序軟化,再將該材料片 與預先形成的該印刷層與該面料層用一組壓紋輥輪進行壓紋貼合程序成為一塑膠地磚半成品;3.一冷卻回火步驟:將該塑膠地磚半成品予以進行冷卻程序,並利用一回火裝置對該塑膠地磚半成品進行回火程序;以及4.一沖切成型步驟:該塑膠地磚半成品在完成回火程序後,再經沖切成型將該塑膠地磚半成品裁切成所需的尺寸規格。 As mentioned above, the steps of the method for manufacturing a plastic floor tile without an adhesive layer include the following steps: 1. A plastic extruding step: the raw materials of each layer are blended according to the ratio and then mixed into a mixer to complete the raw material mixing process and plasticized After the procedure, the extruding process is completed by an extruder; 2. A roll laminating step: the bottom surface layer and the substrate layer that are separately extruded in advance are simultaneously introduced into a T-shaped extruder for the T-type extrusion process, and the bottom layer and the The base material layer is combined with a T-shaped extruder to form a predetermined thickness after being rolled. The roll sheeting process is completed as a material sheet, and then the bottom surface layer of the material sheet to be embossed and the pre-formed fabric layer are layered. The preheating process is softened, and then the material sheet and the pre-formed printing layer and the fabric layer are embossed and bonded with a set of embossing rollers to become a semi-finished plastic floor tile. 3. A cooling and tempering step: The plastic floor tile semi-finished product is subjected to a cooling process, and a tempering device is used to perform a tempering process on the plastic floor tile semi-finished product; and 4. a die-cutting step: after the plastic floor tile semi-finished product has completed the tempering process, Formed by punching the semi Plastic tiles cut to the desired dimensions.

又如上述塑膠地磚,貼合有黏著層之塑膠地磚製造方法的步驟包含:1.一塑料押出步驟:將各層原料依比例調和後放進攪拌機內混合攪拌完成原料混配程序,並經塑化程序後由一押出機完成押出程序;2.一輥壓貼合步驟:將預先分別押出的該底面層、該基材層與該黏著層同步引入一T型押出機進行T型模押出程序,該底面層、該基材層與該黏著層經T型押出機結合後經輥壓形成預定的厚度完成輥壓出片程序為一材料片,接著將該材料片需經壓紋的底面層與預先形成的面料層以分層預熱程序軟化,再將該材料片與預先形成的該印刷層與該面料層用一組壓紋輥輪進行壓紋貼合程序成為一塑膠地磚半成品;3.一冷卻回火步驟:將該塑膠地磚半成品予以進行冷卻程序,並利用一回火裝置對該塑膠地磚半成品進行回火程序;以及4.一沖切成型步驟:該塑膠地磚半成品在完成回 火程序後,再經沖切成型將該塑膠地磚半成品裁切成所需的尺寸規格。 Another example is the plastic floor tile. The method for manufacturing a plastic floor tile with an adhesive layer includes the following steps: 1. A plastic extruding step: the raw materials of each layer are blended in proportion according to the ratio, and then mixed into the mixer to complete the raw material mixing process and plasticized. After the procedure, the extruding process is completed by an extruder; 2. A roll laminating step: the bottom layer, the substrate layer and the adhesive layer that are separately extruded in advance are simultaneously introduced into a T-shaped extruder for the T-shaped mold extrusion process, The bottom layer, the substrate layer and the adhesive layer are combined by a T-shaped extruder to form a predetermined thickness by rolling, and the rolling sheet is completed into a material sheet, and then the material sheet is subjected to an embossed bottom layer and The pre-formed fabric layer is softened by a layered pre-heating procedure, and the material sheet and the pre-formed printing layer and the fabric layer are embossed and bonded with a set of embossing rollers to become a semi-finished plastic floor tile; 3. A cooling and tempering step: the plastic floor tile semi-finished product is subjected to a cooling process, and a plastic tempering device is used to perform a tempering process on the plastic floor tile semi-finished product; and 4. a die-cutting forming step: the plastic floor tile is semi-finished After completing the program back to the fire, and then shaping the semi-finished plastic tiles cut to the desired dimensions by punching.

上述兩種製造方法中,該材料片之底面層預熱後經一第一壓紋輥輪於底面層之底面壓製出吸盤狀凹坑,而該面料層預熱後經一第二壓紋輥輪於面料層壓製出對應於該印刷層之特殊紋路,該第一壓紋輥輪與該第二壓紋輥輪同時可將該材料片與該印刷層及該面料層輥壓貼合為一體。 In the above two manufacturing methods, the bottom surface layer of the material sheet is preheated by a first embossing roller to press out a sucker-like recess on the bottom surface of the bottom surface layer, and the fabric layer is preheated by a second embossing roller. The first embossing roller and the second embossing roller can simultaneously press the material sheet and the printing layer and the fabric layer into a single body. .

上述兩種製造方法中,該輥壓貼合步驟的分層預熱程序後,可先經一展開程序,以克服柔軟之該印刷層及該面料層於輸送過程中的皺褶,讓該印刷層及該面料層可完全的平貼黏合於該上表面,再進入壓紋貼合程序。 In the above two manufacturing methods, after the layered pre-heating process of the roll lamination step, an unrolling process may be first performed to overcome the soft wrinkles of the printing layer and the fabric layer during the conveying process, so that the printing The layer and the fabric layer can be completely flat bonded to the upper surface, and then enter the embossed bonding process.

上述兩種製造方法中,該冷卻回火步驟前,可先進行一修邊裁切步驟,使該塑膠地磚半成品的幅寬一致。 In the above two manufacturing methods, before the cooling and tempering step, a trimming and cutting step may be performed to make the width of the semi-finished plastic floor tile uniform.

本發明之主要特點在於,藉由壓紋輥輪的紋路設計,即可在製造塑膠地磚的過程中在塑膠地磚的底面輥壓形成具吸附效果的物理吸附結構,用以取代習用塗加的黏膠。 The main feature of the present invention is that, by using the texture design of the embossing roller, a physical adsorption structure with an adsorption effect can be formed by rolling on the bottom surface of the plastic floor tile during the process of manufacturing the plastic floor tile, instead of the conventionally applied adhesive. gum.

藉此,本發明即可在不需黏膠塗加的情形下,利用自身物理結構達到附著於建置表面的目的,不僅在裝設時可省去黏膠的人力與材料成本,更可在拆卸時保有塑膠地磚之完整度,以便再次鋪設利用。 In this way, the present invention can use its own physical structure to achieve the purpose of attaching to the building surface without the need for adhesive coating. Not only can the labor and material costs of adhesive be saved during installation, but also When dismantling, keep the integrity of the plastic floor tiles for re-laying.

接下來便結合圖式和具體實施例對本發明作進一步說明,以使本領域的技術人員可以更輕易理解本發明並加以實施運用。 Next, the present invention will be further described with reference to the drawings and specific embodiments, so that those skilled in the art can more easily understand the present invention and implement it.

1‧‧‧塑膠地磚 1‧‧‧Plastic floor tiles

1’‧‧‧塑膠地磚 1’‧‧‧plastic floor tiles

11‧‧‧材料片 11‧‧‧Materials

111‧‧‧基材層 111‧‧‧ substrate layer

111A‧‧‧上表面 111A‧‧‧ Top surface

111B‧‧‧下表面 111B‧‧‧ lower surface

112‧‧‧底面層 112‧‧‧ bottom layer

112A‧‧‧底面 112A‧‧‧Underside

113‧‧‧吸附結構 113‧‧‧ Adsorption structure

12‧‧‧印刷層 12‧‧‧print layer

13‧‧‧面料層 13‧‧‧ fabric layer

14‧‧‧黏著層 14‧‧‧ Adhesive layer

S10‧‧‧塑料押出步驟 S10‧‧‧Plastic Extrusion Procedure

S101‧‧‧原料混配程序 S101‧‧‧Raw material mixing procedure

S102‧‧‧塑化程序 S102‧‧‧Plasticizing Procedure

S103‧‧‧押出程序 S103‧‧‧Exclamation Procedure

S20‧‧‧輥壓貼合步驟 S20‧‧‧Rolling and laminating steps

S201‧‧‧T型模押出程序 S201‧‧‧T Model Extrusion Procedure

S202‧‧‧輥壓出片程序 S202‧‧‧Roller pressing out procedure

S203‧‧‧分層預熱程序 S203‧‧‧Layered preheating procedure

S203’‧‧‧展開程序 S203’‧‧‧Expansion procedure

S204‧‧‧壓紋貼合程序 S204‧‧‧Embossed Fitting Procedure

S20’‧‧‧修邊裁切步驟 S20’‧‧‧ Trimming and cutting steps

S20A‧‧‧輥壓貼合步驟 S20A‧‧‧Rolling and laminating steps

S30‧‧‧冷卻回火步驟 S30‧‧‧Cooling and tempering steps

S301‧‧‧冷卻程序 S301‧‧‧Cooling program

S302‧‧‧回火程序 S302‧‧‧Tempering procedure

S40‧‧‧沖切成型步驟 S40‧‧‧Punching step

圖1A為本發明第一實施例之截面結構圖;圖1B為本發明第二實施例之截面結構圖;圖2A為本發明輥壓吸附結構的第一分布形態;圖2B為本發明輥壓吸附結構的第二分布形態;圖2C為本發明輥壓吸附結構的第三分布形態;圖3為本發明所述塑膠地磚之製造方法流程圖;圖4為本發明所述輥壓貼合步驟的另一種態樣;圖5A為本發明所述具修邊裁切的第一種製造方法流程圖;圖5B為本發明所述具修邊裁切的第一種製造方法流程圖。 FIG. 1A is a cross-sectional structure diagram of the first embodiment of the present invention; FIG. 1B is a cross-sectional structure diagram of the second embodiment of the present invention; FIG. 2A is a first distribution form of the roll adsorption structure of the present invention; The second distribution form of the adsorption structure; FIG. 2C is the third distribution form of the rolled adsorption structure of the present invention; FIG. 3 is a flowchart of a method for manufacturing a plastic floor tile according to the present invention; FIG. 5A is a flowchart of a first manufacturing method with trimming and cutting according to the present invention; and FIG. 5B is a flowchart of a first manufacturing method with trimming and cutting according to the present invention.

首先,本發明第一實施例的截面結構圖請參閱圖1A,所述具吸附結構的塑膠地磚1其結構包含:一基材層111,具有一上表面111A與一背對該上表面111A的下表面111B;以及一底面層112,係貼合於該基材層111之該下表面111B,其遠離該基材層111之一側的底面112A設置有多個以輥壓方式形成的物理吸附結構113,該些吸附結構113用以直接接觸並附著於一建置表面,其中該基材層111與該底面層112結合後係形成一材料片11。 First, please refer to FIG. 1A for a cross-sectional structural diagram of a first embodiment of the present invention. The structure of the plastic floor tile 1 with an adsorption structure includes: a substrate layer 111 having an upper surface 111A and a back surface facing the upper surface 111A. A lower surface 111B; and a bottom surface layer 112, which is attached to the lower surface 111B of the substrate layer 111, and a plurality of physical adsorptions formed by rolling are provided on the bottom surface 112A far from one side of the substrate layer 111 Structures 113, the adsorption structures 113 are used to directly contact and attach to a building surface, wherein the base material layer 111 and the bottom surface layer 112 are combined to form a material sheet 11.

在同一實施例中,該塑膠地磚1更包含一結合於該上表面111A的印刷層12以及覆蓋於該印刷層12之面料層13。 In the same embodiment, the plastic floor tile 1 further includes a printing layer 12 bonded to the upper surface 111A and a fabric layer 13 covering the printing layer 12.

接下來請參閱圖1B,圖1B係為本發明之第二實施例的截面示意圖,本發明之第二實施例與第一實施例大體類 似,相同元件使用相同標號,其中不同之處在於,在第二實施例的塑膠地磚1’中,該上表面111A與該印刷層12之間可貼合一黏著層14。 Next, please refer to FIG. 1B. FIG. 1B is a schematic cross-sectional view of a second embodiment of the present invention. The second embodiment of the present invention is substantially similar to the first embodiment, and the same elements are denoted by the same reference numerals. The difference is that In the plastic floor tile 1 ′ of the second embodiment, an adhesive layer 14 may be adhered between the upper surface 111A and the printing layer 12.

接下來敬請參閱圖2A至圖2C,圖2A至圖2C係為該吸附結構113於底面112A的三種分布形態,然以下所述者,僅係本發明之較佳實施例而已,舉凡吸附結構113的結構與分布數量可合理提供塑膠地磚附著力之分布型態,理應包含在本發明之申請專利範圍內。 Next, please refer to FIGS. 2A to 2C. FIGS. 2A to 2C are three distribution forms of the adsorption structure 113 on the bottom surface 112A. However, the following description is only a preferred embodiment of the present invention. The structure and distribution number of 113 can reasonably provide the distribution pattern of the adhesion of plastic floor tiles, which should be included in the scope of patent application of the present invention.

如圖2A中,該吸附結構113係由多個在該底面112A下凹的吸盤狀凹坑所組成,並係以點狀方型陣列方式排列。 As shown in FIG. 2A, the adsorption structure 113 is composed of a plurality of sucker-shaped recesses recessed on the bottom surface 112A, and is arranged in a dot-shaped square array.

或圖2B中,該吸附結構113係由多個在該底面112A下凹的吸盤狀凹坑所組成,並係以點狀環形陣列方式排列。 Or in FIG. 2B, the adsorption structure 113 is composed of a plurality of sucker-shaped recesses recessed on the bottom surface 112A, and is arranged in a dot-shaped annular array.

或圖2C中,該吸附結構113係由多個在該該底面112A下凹的吸盤狀凹坑所組成,並係以點狀隔行交錯方式排列。 Or in FIG. 2C, the adsorption structure 113 is composed of a plurality of sucker-shaped recesses recessed on the bottom surface 112A, and is arranged in a staggered interlaced manner.

接下來有關本發明所述塑膠地磚的製造方法流程圖敬請參閱圖3,其步驟包括:1.一塑料押出步驟S10:將各層原料依比例調和後放進攪拌機內混合攪拌完成原料混配程序S101,並經塑化程序S102後由一押出機完成押出程序S103;2.一輥壓貼合步驟S20:將預先分別押出的該底面層與該基材層同步引入一T型押出機進行T型模押出程序 S201,該底面層與該基材層經T型押出機結合後經輥壓形成預定的厚度完成輥壓出片程序S202為一材料片11(如圖1A所示),接著將該材料片11需經壓紋的底面層112與預先形成的面料層13(如圖1A所示)以分層預熱程序S203軟化,再將該材料片11與預先形成的該印刷層12與該面料層13(如圖1A所示)用一組壓紋輥輪進行壓紋貼合程序S204成為一塑膠地磚半成品;3.一冷卻回火步驟S30:將該塑膠地磚半成品予以進行冷卻程序S301,並利用一回火裝置對該塑膠地磚半成品進行回火程序S302;以及4.一沖切成型步驟S40:該塑膠地磚半成品在完成回火程序後,再經沖切成型將該塑膠地磚半成品裁切成所需的尺寸規格。 Next, please refer to FIG. 3 for a flowchart of a method for manufacturing a plastic floor tile according to the present invention. The steps include: 1. A plastic extruding step S10: the raw materials of each layer are blended according to the ratio and then mixed in a mixer to complete the raw material mixing process. S101, and after the plasticizing process S102, the extruding process S103 is completed by an extruder; 2. a roll pressing and laminating step S20: the bottom surface layer and the substrate layer separately extruded in advance are simultaneously introduced into a T-type extruder for T The mold extruding process S201, the bottom surface layer and the substrate layer are combined by a T-type extruder to form a predetermined thickness by rolling, and the rolling extruding process S202 is a material sheet 11 (as shown in FIG. 1A), and then The material sheet 11 needs to be embossed with a bottom surface layer 112 and a pre-formed fabric layer 13 (as shown in FIG. 1A) to be softened in a layered preheating procedure S203, and then the material sheet 11 and the pre-formed printing layer 12 and The fabric layer 13 (as shown in FIG. 1A) is embossed and bonded with a set of embossing rollers to form a semi-finished plastic floor tile; 3. a cooling and tempering step S30: the semi-finished plastic floor tile is subjected to a cooling process S301 , And use a tempering device to the plastic floor The brick semi-finished product is subjected to a tempering procedure S302; and 4. a die-cutting forming step S40: after the plastic floor tile semi-finished product has completed the tempering procedure, the plastic floor tile semi-finished product is cut into the required size specifications by die-cutting.

在上述的製造方法中,若該製造方法製造的塑膠地磚係為貼合有黏著層的塑膠地磚,則該輥壓貼合步驟S20則係將預先分別押出的該底面層112、該基材層111與該黏著層14(如圖1B所示)同步引入一T型押出機進行T型模押出程序S201,該底面層112、該基材層111與該黏著層14(如圖1B所示)經T型押出機結合後經輥壓形成預定的厚度完成輥壓出片程序S202為一材料片11(如圖1B所示),接著將該材料片11需經壓紋的底面層112與預先形成的面料層13(如圖1B所示)以分層預熱程序S203軟化,再將該材料片11與預先形成的該印刷層12與該面料層13(如圖1B所示)用一組壓紋輥輪進行壓紋貼合程序S204成為一塑膠地磚半成品。 In the above manufacturing method, if the plastic floor tile manufactured by the manufacturing method is a plastic floor tile bonded with an adhesive layer, the roll bonding step S20 is to separately extrude the bottom surface layer 112 and the base material layer in advance. 111 and the adhesive layer 14 (shown in FIG. 1B) are synchronously introduced into a T-shaped extruder for a T-shaped mold extrusion process S201. The bottom layer 112, the substrate layer 111 and the adhesive layer 14 (shown in FIG. 1B) After being combined with a T-shaped extruder, it is rolled to form a predetermined thickness, and the roll sheeting process S202 is completed as a material sheet 11 (as shown in FIG. 1B). Then, the material sheet 11 needs to be embossed with a bottom layer 112 and The formed fabric layer 13 (as shown in FIG. 1B) is softened by the layer preheating procedure S203, and then the material sheet 11 and the printing layer 12 and the fabric layer 13 (as shown in FIG. 1B) formed in advance are used in a group. The embossing roller performs the embossing process S204 to become a semi-finished plastic floor tile.

而在上述兩種塑膠地磚的製造方法中,該材料片11之底面層112預熱後經一第一壓紋輥輪於該底面層112之該底面112A壓製出吸盤狀凹坑,而該面料層13預熱後經一第二壓紋輥輪於面料層13壓製出對應於該印刷層12之特殊紋路,該第一壓紋輥輪與該第二壓紋輥輪同時可將該材料片11、該印刷層12及該面料層13輥壓貼合為一體(如圖1A或圖1B所示)。 In the two manufacturing methods of the above-mentioned plastic floor tiles, the bottom surface layer 112 of the material sheet 11 is preheated by a first embossing roller on the bottom surface 112A of the bottom surface layer 112 to press out a sucker-like recess, and the fabric After the layer 13 is preheated, a special texture corresponding to the printing layer 12 is pressed on the fabric layer 13 through a second embossing roller. The first embossing roller and the second embossing roller can simultaneously compress the material sheet. 11. The printing layer 12 and the fabric layer 13 are laminated together by rolling (as shown in FIG. 1A or FIG. 1B).

其中,圖3的輥壓貼合步驟S20亦可如圖4中的該輥壓貼合步驟S20A所示,於該分層預熱程序S203後,先經一展開程序S203’,以克服柔軟之該印刷層12及該面料層13於輸送過程中的皺褶,讓該印刷層12及該面料層13可完全的平貼黏合於該上表面111A(如圖1A或圖1B所示),再進入壓紋貼合程序S204;其餘步驟與圖3中的輥壓貼合步驟S20類似,相同步驟及相同程序使用相同標號。 Wherein, the rolling bonding step S20 in FIG. 3 can also be shown in the rolling bonding step S20A in FIG. 4. After the layer preheating procedure S203, a step S203 ′ is carried out to overcome the softness. Wrinkles of the printing layer 12 and the fabric layer 13 during transportation, so that the printing layer 12 and the fabric layer 13 can be completely and flatly adhered to the upper surface 111A (as shown in FIG. 1A or 1B), and then Enter the embossing and bonding procedure S204; the remaining steps are similar to the rolling and bonding step S20 in FIG. 3, and the same steps and the same procedures use the same reference numerals.

最後,在製造方法的過程中,亦可如圖5A或圖5B所示,於該冷卻回火步驟S30前,先進行一修邊裁切步驟S20’,使該塑膠地磚半成品的幅寬一致;其餘步驟與圖3或圖4所述製造方法大體類似,相同步驟及相同程序使用相同標號。 Finally, during the manufacturing method, as shown in FIG. 5A or FIG. 5B, before the cooling and tempering step S30, a trimming and cutting step S20 'is performed to make the width of the semi-finished plastic floor tile uniform; The remaining steps are substantially similar to the manufacturing method described in FIG. 3 or FIG. 4, and the same steps and the same procedures use the same reference numerals.

據此,本發明即可藉由壓紋輥輪的紋路設計,在製造塑膠地磚的過程中,於塑膠地磚的底面112A輥壓形成具吸附效果的物理吸附結構113(如圖2A至圖2C所示),用以取代習用塗加的黏膠。亦即本發明可在不需黏膠塗加的情形下,利用自身物理結構達到附著於建置表面的目的,不僅在裝設時 可省去黏膠的人力與材料成本,更可在拆卸時保有塑膠地磚之完整度,以便再次鋪設利用。 According to this, the present invention can use the texture design of the embossing roller to roll the bottom surface 112A of the plastic floor tile to form a physical adsorption structure 113 with an adsorption effect during the process of manufacturing the plastic floor tile (as shown in FIGS. 2A to 2C). (Shown) to replace the conventionally applied adhesive. That is, the present invention can use its own physical structure to achieve the purpose of attaching to the building surface without the need for adhesive coating. Not only can the labor and material costs of adhesive be saved during installation, but also during disassembly Maintain the integrity of the plastic floor tiles for re-laying.

綜上所述,乃僅記載本發明為呈現解決問題所採用的技術手段之實施方式或實施例而已,並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符,或依本發明專利申請範圍所做的均等變化與修飾,皆為本發明之專利範圍所涵蓋。 In summary, it only describes the implementation or examples of the technical means adopted by the present invention to solve the problem, and is not intended to limit the scope of patent implementation of the present invention. That is, all changes and modifications that are consistent with the meaning of the scope of the patent application of the present invention or made according to the scope of the patent application of the present invention are covered by the scope of the patent of the present invention.

Claims (10)

一種具吸附結構的塑膠地磚,其結構包含:一基材層,具有一上表面與一背對該上表面的下表面;以及一底面層,係貼合於該基材層之該下表面,其遠離該基材層之一側的底面設置有多個以輥壓方式形成的物理吸附結構,該些吸附結構用以直接接觸並附著於一建置表面。     A plastic floor tile with an adsorption structure. The structure includes: a substrate layer having an upper surface and a lower surface facing away from the upper surface; and a bottom surface layer attached to the lower surface of the substrate layer. A plurality of physical adsorption structures formed in a rolling manner are disposed on a bottom surface away from one side of the substrate layer, and the adsorption structures are used to directly contact and attach to a building surface.     如申請專利範圍第1項所述之塑膠地磚,更包含一結合於該上表面的印刷層以及覆蓋於該印刷層之面料層。     The plastic floor tile described in item 1 of the scope of patent application, further includes a printing layer bonded to the upper surface and a fabric layer covering the printing layer.     如申請專利範圍第2項所述之塑膠地磚,其中,該上表面與該印刷層之間可貼合一黏著層。     The plastic floor tile according to item 2 of the scope of the patent application, wherein an adhesive layer can be adhered between the upper surface and the printing layer.     如申請專利範圍第1項所述之塑膠地磚,其中,該吸附結構係由多個在該底面層之該底面下凹的吸盤狀凹坑所組成。     The plastic floor tile according to item 1 of the scope of the patent application, wherein the adsorption structure is composed of a plurality of sucker-shaped recesses recessed on the bottom surface of the bottom surface layer.     如申請專利範圍第1項所述之塑膠地磚,其中,該吸盤狀凹坑係以點狀方型陣列、點狀環形陣列或點狀隔行交錯方式排列。     The plastic floor tile according to item 1 of the scope of the patent application, wherein the sucker-shaped recesses are arranged in a dot-shaped square array, a dot-shaped circular array, or a dot-interlaced interlaced manner.     一種製造如申請專利範圍第1項所述之塑膠地磚的方法,其步驟包含: 一塑料押出步驟:將各層原料依比例調和後放進攪拌機內混合攪拌完成原料混配程序,並經塑化程序後由一押出機完成押出程序;一輥壓貼合步驟:將預先分別押出的該底面層與該基材層同步引入一T型押出機進行T型模押出程序,該底面層與該基材層經T型押出機結合後經輥壓形成預定的厚度完成輥壓出片程序為一材料片,接著將該材料片需經壓紋的底面層與預先形成的面料層以分層預熱程序軟化,再將該材料片與預先形成的該印刷層與該面料層用一組壓紋輥輪進行壓紋貼合程序成為一塑膠地磚半成品;一冷卻回火步驟:將該塑膠地磚半成品予以進行冷卻程序,並利用一回火裝置對該塑膠地磚半成品進行回火程序;以及一沖切成型步驟:該塑膠地磚半成品在完成回火程序後,再經沖切成型將該塑膠地磚半成品裁切成所需的尺寸規格。     A method for manufacturing a plastic floor tile as described in item 1 of the scope of patent application, the steps include: a plastic extrusion step: each layer of raw materials is blended according to the proportion and put into a mixer to complete the raw material mixing process, and the plasticization process Then, an extruder completes the extrusion process; a roll pressing and bonding step: the bottom surface layer and the substrate layer that are separately extruded in advance are simultaneously introduced into a T-shaped extruder for a T-shaped mold extrusion process, and the bottom surface layer and the substrate are extruded. The layers are combined by a T-shaped extruder and rolled to form a predetermined thickness. The rolled sheet process is completed as a material sheet, and then the bottom surface layer of the material sheet to be embossed and a pre-formed fabric layer are subjected to a layer preheating process. Soften, then embossing and bonding the material sheet with the pre-formed printing layer and the fabric layer with a set of embossing rollers to become a semi-finished plastic floor tile; a cooling and tempering step: performing the semi-finished plastic floor tile Cooling process, and using a tempering device to temper the plastic floor tile semi-finished product; and a die-cutting step: after the plastic floor tile semi-finished product has completed the tempering process, - cut the semi Plastic tiles cut into desired sizes.     一種製造如申請專利範圍第1項所述之塑膠地磚的方法,其步驟包含:一塑料押出步驟:將各層原料依比例調和後放進攪拌機內混合攪拌完成原料混配程序,並經塑化程序後由一押出機完成押出程序; 一輥壓貼合步驟:將預先分別押出的該底面層、該基材層與該黏著層同步引入一T型押出機進行T型模押出程序,該底面層、該基材層與該黏著層經T型押出機結合後經輥壓形成預定的厚度完成輥壓出片程序為一材料片,接著將該材料片需經壓紋的底面層與預先形成的面料層以分層預熱程序軟化,再將該材料片與預先形成的該印刷層與該面料層用一組壓紋輥輪進行壓紋貼合程序成為一塑膠地磚半成品;一冷卻回火步驟:將該塑膠地磚半成品予以進行冷卻程序,並利用一回火裝置對該塑膠地磚半成品進行回火程序;以及一沖切成型步驟:該塑膠地磚半成品在完成回火程序後,再經沖切成型將該塑膠地磚半成品裁切成所需的尺寸規格。     A method for manufacturing a plastic floor tile as described in item 1 of the scope of patent application, the steps include: a plastic extrusion step: the layers of raw materials are blended in proportion according to the ratio and then mixed into a mixer to complete the raw material mixing process, and the plasticization process The extrusion process is then completed by an extruder; a roll lamination step: the bottom surface layer, the substrate layer and the adhesive layer that are separately extruded in advance are simultaneously introduced into a T-shaped extruder for the T-shaped mold extrusion process, the bottom surface layer 1. The base material layer and the adhesive layer are combined by a T-shaped extruder to form a predetermined thickness by rolling. The roll-extrusion process is completed as a material sheet, and then the bottom surface layer of the material sheet to be embossed and a pre-formed The fabric layer is softened by a layered preheating procedure, and the material sheet and the pre-formed printing layer and the fabric layer are embossed and bonded with a set of embossing rollers to become a semi-finished plastic floor tile; a cooling and tempering step : Cooling the semi-finished plastic floor tile, and using a tempering device to temper the semi-finished plastic floor tile; and a die-cutting step: the semi-finished plastic floor tile is After the annealing process into, and then molding the semi Plastic tiles cut into desired dimensions by punching.     如申請專利範圍第6或7項所述之製造塑膠地磚的方法,該輥壓貼合步驟中,該材料片之底面層預熱後經一第一壓紋輥輪於該底面層之該底面壓製出吸盤狀凹坑,而該面料層預熱後經一第二壓紋輥輪於面料層壓製出對應於該印刷層之特殊紋路,該第一壓紋輥輪與該第二壓紋輥輪同時可將該材料片與該印刷層及該面料層輥壓貼合為一體。     According to the method for manufacturing a plastic floor tile according to item 6 or 7 of the scope of patent application, in the rolling and bonding step, the bottom surface layer of the material sheet is preheated and passed through a first embossing roller on the bottom surface of the bottom surface layer. A suction cup-shaped depression is pressed, and the fabric layer is preheated by a second embossing roller to emboss a special texture corresponding to the printing layer on the fabric layer. The first embossing roller and the second embossing roller At the same time, the material sheet can be rolled and bonded together with the printing layer and the fabric layer at the same time.     如申請專利範圍第6或7項所述之製造塑膠地磚的方 法,該輥壓貼合步驟中,分層預熱程序後可先經一展開程序,以克服柔軟之該印刷層及該面料層於輸送過程中的皺褶,讓該印刷層及該面料層可完全的平貼黏合於該上表面,再進入壓紋貼合程序。     According to the method for manufacturing a plastic floor tile described in the patent application scope item 6 or 7, in the rolling and bonding step, a layering and pre-heating process may be followed by an unrolling process to overcome the soft printing layer and the fabric layer. The wrinkles during the conveying process allow the printed layer and the fabric layer to be completely and flatly adhered to the upper surface, and then enter the embossing and attaching process.     如申請專利範圍第6或7項所述之製造塑膠地磚的方法,其中,該冷卻回火步驟前,可先進行一修邊裁切步驟,使該塑膠地磚半成品的幅寬一致。     According to the method for manufacturing a plastic floor tile as described in item 6 or 7 of the scope of application for patent, before the cooling and tempering step, a trimming and cutting step may be performed to make the width of the semi-finished plastic floor tile uniform.    
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Publication number Priority date Publication date Assignee Title
CN110735511A (en) * 2018-07-18 2020-01-31 柯五男 Method for manufacturing plastic floor tile
TWI704992B (en) * 2018-07-13 2020-09-21 柯五男 Plastic floor tiles manufacturing method

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TWI776265B (en) * 2020-11-03 2022-09-01 柯五男 Manufacturing method of plastic floor tiles
CN114947603A (en) * 2022-06-30 2022-08-30 西安交通大学城市学院 Adsorption equipment and curtain cleaning machines people

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704992B (en) * 2018-07-13 2020-09-21 柯五男 Plastic floor tiles manufacturing method
CN110735511A (en) * 2018-07-18 2020-01-31 柯五男 Method for manufacturing plastic floor tile

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