TW201402917A - Method of making a plastic floor tile - Google Patents
Method of making a plastic floor tile Download PDFInfo
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本發明是有關於一種塑膠地磚之製造技術,特別是有關於可提高面料層厚度,增加產品耐壓、耐磨等效益之一種塑膠地磚製造方法。 The invention relates to a manufacturing technology of a plastic floor tile, in particular to a method for manufacturing a plastic floor tile which can increase the thickness of the fabric layer and increase the pressure resistance and wear resistance of the product.
目前塑膠地磚主要係由塑性材料製成,並可依市場需求提供不同飾紋,而塑膠地磚因其材料特性具有較佳之絕緣效果,且塑膠地磚具有低成本及可DIY施作的優點,加上具防水無需求特別保養等優點,故被廣泛運用於各種場合之地板。 At present, plastic floor tiles are mainly made of plastic materials, and can provide different decorative patterns according to market demand. Plastic floor tiles have better insulation effect due to their material characteristics, and plastic floor tiles have the advantages of low cost and DIY application. It has the advantages of waterproof and no special maintenance, so it is widely used in flooring for various occasions.
習知塑膠地磚組成結構,請配合參閱第1圖所示,其係為習知塑膠地磚剖面示意圖。圖中,習知塑膠地磚1,其係於一基材11表面貼設有具飾紋之印刷膠布12,並於印刷膠布12表面覆設有一表面膠層13。其中塑膠地磚底面的基材11主要係用來吸收地面的不平處,故其材質會較軟,而印刷膠布13表面覆設之表面膠層13需抵抗人員或物品的踩踏與磨耗,故以耐壓性與耐磨性較佳的材質為主。由於兩者或因材質或因變形量不同,因此為了避免塑膠地磚1於使用過程中,發生扭曲變形或剝離的現象,故其表面膠層13的厚度受到相當之限制,連帶的亦無法提高塑膠地磚1表面膠層13的厚度,造成耐壓與耐磨性不足的現象,此為業界垢病已久。 For the structure of the plastic floor tiles, please refer to Figure 1 for a cross-sectional view of the plastic floor tiles. In the figure, a conventional plastic floor tile 1 is attached to a surface of a substrate 11 with a decorative printing tape 12, and a surface adhesive layer 13 is coated on the surface of the printing tape 12. The substrate 11 on the bottom surface of the plastic floor tile is mainly used to absorb the unevenness of the ground, so the material thereof is soft, and the surface adhesive layer 13 coated on the surface of the printing adhesive tape 13 is resistant to the pedaling and abrasion of personnel or articles, so The material with better pressure and wear resistance is the main material. Since the two are different in material or deformation amount, in order to avoid the phenomenon of distortion or peeling of the plastic tile 1 during use, the thickness of the surface adhesive layer 13 is limited, and the plastic cannot be improved. The thickness of the surface rubber layer 13 of the floor tile 1 causes a phenomenon of insufficient pressure resistance and wear resistance, which is a long-standing problem in the industry.
為解決此一缺失,本案發明人亦曾提出解決方法,請參閱我國專利公告第I292005號專利,於前案中已提出自動化一貫作業生產之塑膠地磚方法,藉由此一方法提高塑膠地磚耐壓性與耐磨性,並兼具生產效率,降低相關生產成本。 In order to solve this deficiency, the inventor of the present case has also proposed a solution. Please refer to Patent No. I292005 of China Patent Proposal. In the previous case, the plastic floor tile method of automatic operation has been proposed, and the pressure resistance of the plastic floor tile is improved by this method. Sex and wear resistance, and both production efficiency, reduce related production costs.
但因應市場之需求,雖本案發明人曾於前案提出解決方案,使其表面膠層厚度提升至0.07~0.18mm遠優於習知之塑膠地磚。但市場需求與要求不斷的提升,前案之表面膠層厚度顯無法滿足高端消費者,為使塑膠地磚之表面膠層厚度更蓁完善,再次提出創新之製造方法。 However, in response to the needs of the market, although the inventor of the present case proposed a solution in the previous case, the thickness of the surface adhesive layer was increased to 0.07~0.18mm, which is far superior to the plastic floor tiles of the prior art. However, the market demand and requirements are constantly improving. The thickness of the surface rubber layer of the previous case can not meet the high-end consumers. In order to make the thickness of the surface layer of the plastic floor tile more perfect, an innovative manufacturing method is proposed again.
有鑑於上述習知技藝之問題,本發明之目的其中之一就是在於提供一種塑膠地磚製造方法。藉此提供至少可達0.2mm~1mm高厚度面料層之膠塑地磚,使其膠塑地磚成品具有高厚度面料層,提供相較於習知膠塑地磚更耐壓、耐磨之效益並符合高端市場需求者。也因為面料層厚度增加,致使原有製程方法無法滿足需求,因而衍生出更高階之製程方法,藉以符合實際之生產需求者 In view of the above-mentioned problems of the prior art, one of the objects of the present invention is to provide a method for manufacturing a plastic floor tile. Thereby providing a plastic floor tile of at least 0.2mm~1mm high-thickness fabric layer, so that the finished product of the plastic-plastic floor tile has a high-thickness fabric layer, providing the pressure-resistant and wear-resistant benefits and conforming to the conventional plastic-plastic floor tiles. High-end market demanders. Also, because the thickness of the fabric layer is increased, the original process method cannot meet the demand, and thus a higher-order process method is derived, so as to meet the actual production demand.
根據本發明之目的,提出一種塑膠地磚之製造方法,其步驟包含: According to the purpose of the present invention, a method for manufacturing a plastic floor tile is provided, the steps of which include:
原料混配:將底面層的原料依比例調整完成 後,投入一攪拌機內進行混合攪拌,使底面層的原料可完全的均勻混合。另將基材的原料依比例調整完成後,投入另一攪拌機內進行混合攪拌,使基材的原料可完全的均勻混合,以維持產品的穩定性。 Raw material compounding: the raw materials of the bottom layer are adjusted according to the ratio. After that, it is put into a mixer and mixed and stirred, so that the raw materials of the bottom layer can be completely and uniformly mixed. After the raw materials of the substrate are adjusted according to the ratio, the mixture is put into another mixer for mixing and stirring, so that the raw materials of the substrate can be completely and uniformly mixed to maintain the stability of the product.
塑化:將混配完成的底面層原料置入萬馬力機內,使底面層的原料得到初期的塑化效果。又將基材混配完成的基材原料置入高速攪拌機內攪拌,使基材的原料得到半膠化狀態的效果。 Plasticization: The raw material of the bottom layer layer that has been compounded is placed in a 10,000-horsepower machine to obtain an initial plasticizing effect on the raw material of the bottom layer. Further, the substrate raw material obtained by mixing the substrates is placed in a high-speed mixer and stirred to obtain a semi-gelled state of the raw material of the substrate.
押出:將底面層經塑化步驟後的初期塑化原料由萬馬力機輸送至對應的押出機押出,使底面層原料達到完全塑化的效果,再者將基材經塑化步驟的半膠狀原料由高速攪拌機輸送至另一押出機押出,使基材原料達到完全塑化的效果。 Extrusion: The initial plasticized raw material after the plasticization step of the bottom layer is transported by the 10,000 horsepower machine to the corresponding extruder, so that the raw material of the bottom layer layer can be completely plasticized, and the semi-adhesive of the substrate is plasticized. The raw material is conveyed by a high-speed mixer to another extruder to make the substrate material fully plasticized.
T型模押出:將底面層與基材同步引入T型模押出,藉由高溫使其底面層與基材呈半溶狀,將底面層與基材的相對接觸面完全溶合成一體。 T-die extrusion: the bottom layer and the substrate are introduced into the T-die simultaneously, and the bottom layer and the substrate are semi-solvent by high temperature, and the opposite contact surface of the bottom layer and the substrate is completely dissolved.
輥壓出片:將經T型模押出之複合狀底面層與基材的材料片經輥壓調整成預設之厚度。 The roll is pressed out: the composite bottom layer which is extruded through the T-die and the material piece of the substrate are rolled to a predetermined thickness.
第一次預熱:將面料層繞行於複數加熱輪,藉由加熱輪逐步對面料層預熱到第一預設溫度。 The first preheating: the fabric layer is wound around the plurality of heating wheels, and the fabric layer is gradually preheated to the first preset temperature by the heating wheel.
第二次預熱:將第一次預熱後之面料層,經紅外線高週波加熱裝置,將面料層再次預熱達第二預設溫度。 The second preheating: the fabric layer after the first preheating is preheated to the second preset temperature by the infrared high frequency heating device.
輥壓貼合:將第二次預熱後之面料層披覆於一印刷層上,且印刷層相對於面料層披覆面並披覆於經輥壓出片之複合狀底面層的頂面。將面料層、印刷層及複合狀底面層三者,藉由具熱源之輥壓輪輥壓,除使面料層又一次預熱達第三預設溫度外並對複合狀底面層預熱,將面料層、印刷層及複合狀底面層輥壓貼合。且對應面料層之輥壓輪上設有壓紋,於輥壓貼合面料層、印刷層及複合狀底面層的同時,亦對面料層進行壓紋,俾以形成一塑膠地磚半成品。 Roll press bonding: the second preheated fabric layer is coated on a printed layer, and the printed layer is coated on the top surface of the composite bottom layer of the rolled sheet relative to the fabric layer. The fabric layer, the printed layer and the composite bottom layer are rolled by a roller with a heat source, except that the fabric layer is once again preheated to a third preset temperature and the composite bottom layer is preheated. The fabric layer, the printed layer and the composite bottom layer are rolled and bonded. The embossing wheel is arranged on the roller of the corresponding fabric layer, and the fabric layer is embossed at the same time as the roller layer is pressed to cover the fabric layer, the printing layer and the composite bottom layer, so as to form a plastic floor tile semi-finished product.
第一次冷卻,藉由冷卻液對塑膠地磚之半成品作第一次冷卻降溫,使各層材料的變化趨於緩和穩定,方便進行後續之加工製程。 The first cooling, the first cooling and cooling of the semi-finished products of the plastic floor tile by the cooling liquid, the changes of the material of each layer tend to be moderate and stable, and the subsequent processing process is facilitated.
第二次冷卻,藉由冷卻液對塑膠地磚之半成品再施以第二次冷卻降溫,使各層材料的變化趨於緩和穩定,方便進行後續之加工製程。 In the second cooling, the second cooling and cooling of the semi-finished products of the plastic floor tile by the cooling liquid is used to make the changes of the materials of the layers tend to be moderate and stable, and the subsequent processing process is facilitated.
修邊處理,將塑膠地磚半成品進行毛邊料之修整,去除塑膠地磚半成品邊側之多餘殘料。 The trimming treatment will be carried out to trim the semi-finished plastic floor tiles to remove the excess residue from the side of the semi-finished plastic floor tiles.
回火處理,在完成前述的製程步驟後,進一步利用回火裝置對塑膠地磚半成品進行回火處理,克服產品於製程中的應力,使塑膠地磚的物性穩定,提高產品品質的要求。 The tempering treatment, after completing the above-mentioned process steps, further tempering the semi-finished plastic floor tiles by using the tempering device to overcome the stress in the process, to stabilize the physical properties of the plastic floor tiles, and to improve the product quality requirements.
沖切成型,將回火處理步驟後之塑膠地磚半成品,先堆疊於室溫中冷卻至室溫使其物性更為穩定 後,再將膠塑地磚半成品進行沖切成客戶需求成品之尺寸規格。 After die-cutting, the semi-finished plastic bricks after the tempering treatment step are first stacked at room temperature and cooled to room temperature to make the physical properties more stable. After that, the semi-finished products of the plastic-plastic floor tiles are die-cut into the size specifications of the finished products required by the customers.
藉此,本發明之塑膠地磚具有不易變形以及高厚度面料層之膠塑地磚,提供相較於習知膠塑地磚具有更耐壓、耐磨之效益,除符合高端市場需求外,更可大幅減化工序以及避免面料層、印刷層及複合底面層粘合不佳者。 Thereby, the plastic floor tile of the invention has the non-deformable and high-strength fabric layer of the plastic-plastic floor tile, and has the advantages of more pressure resistance and wear resistance than the conventional plastic-plastic floor tile, in addition to meeting the requirements of the high-end market, The reduction process and the avoidance of poor adhesion of the fabric layer, the printed layer and the composite underlayer.
承上所述,本發明塑膠地磚之製造方法,其至少具有下述優點: According to the above, the method for manufacturing the plastic floor tile of the present invention has at least the following advantages:
1.本發明塑膠地磚之製造方法,可進一步精減生產工序,降低生產成本。 1. The manufacturing method of the plastic floor tile of the invention can further reduce the production process and reduce the production cost.
2.本發明塑膠地磚之製造方法,可進一步提高面料層厚度,使其至少可達0.2mm~1mm,遠優於習知塑膠地磚的0.07mm。 2. The manufacturing method of the plastic floor tile of the invention can further increase the thickness of the fabric layer to at least 0.2 mm to 1 mm, which is far superior to 0.07 mm of the conventional plastic floor tile.
3.本發明塑膠地磚之製造方法,藉由複數次逐步預熱,使面料層、印刷層及複合底面層粘合更為緊密。 3. The method for manufacturing a plastic floor tile according to the present invention, wherein the fabric layer, the printed layer and the composite bottom layer are more closely bonded by a plurality of stepwise preheating.
4.本發明塑膠地磚之製造方法,藉由輥壓時並同步對面料層進行壓紋,大幅減化生產工序與生產時間。 4. The method for manufacturing a plastic floor tile according to the present invention, which simultaneously embosses the fabric layer by rolling and greatly reduces the production process and production time.
以下進一步說明本發明之塑膠地磚之製造方法實施例。請參照相關圖式與說明,為便於理解本發明實施方式,以下相同元件係採相同符號標示說明。 Hereinafter, an embodiment of a method of manufacturing a plastic floor tile of the present invention will be further described. For the sake of understanding of the embodiments of the present invention, the same components are denoted by the same reference numerals.
請參閱第2及5圖所示,圖2其係為本發明塑膠地磚之製造方法其流程示意圖、圖3其係為本發明塑膠地磚之製造方法其T型模押出實施例示意圖、圖4其係為本發明塑膠地磚之製造方法其實施例示意圖及圖5其係為本發明塑膠地磚之製造方法其成品剖面示意圖。圖中,本發明塑膠地磚之製造方法,至少包含: 2 and 5, FIG. 2 is a schematic flow chart of a method for manufacturing a plastic floor tile according to the present invention, and FIG. 3 is a schematic view showing a T-die extrusion embodiment of the method for manufacturing the plastic floor tile of the present invention, and FIG. It is a schematic diagram of an embodiment of a method for manufacturing a plastic floor tile of the present invention, and FIG. 5 is a schematic cross-sectional view of a finished method for manufacturing a plastic floor tile of the present invention. In the figure, the method for manufacturing the plastic floor tile of the present invention comprises at least:
S111、S211:原料混配,將底面層211的原料依比例調整完成後,投入一攪拌機內進行混合攪拌,使底面層211的原料可完全的均勻混合。另將基材212的原料依比例調整完成後,投入另一攪拌機內進行混合攪拌,使基材212的原料可完全的均勻混合,以維持產品的穩定性。 S111 and S211: The raw materials are mixed, and the raw materials of the bottom layer 211 are adjusted in proportion, and then mixed and stirred in a mixer to completely and uniformly mix the raw materials of the bottom layer 211. After the raw materials of the substrate 212 are adjusted in proportion, the mixture is placed in another mixer to be mixed and stirred, so that the raw materials of the substrate 212 can be completely and uniformly mixed to maintain the stability of the product.
S112、S212:塑化,將混配完成的底面層211原料置入萬馬力機內,使底面層211的原料得到初期的塑化效果。又將基材212混配完成的基材原料置入高速攪拌機內攪拌,使該基 材212的原料得到半膠化狀態的效果。 S112 and S212: plasticizing, the raw material of the bottom layer 211 which has been compounded is placed in a 10,000-horsepower machine, and the raw material of the bottom layer 211 is initially plasticized. Further, the substrate material obtained by compounding the substrate 212 is placed in a high-speed mixer and stirred to make the base. The material of the material 212 has the effect of a semi-gelatinized state.
S113、S213:押出,將底面層211經塑化S112步驟後的初期塑化原料由萬馬力機輸送至對應的押出機押出,使底面層211原料達到完全塑化的效果,再者將基材212經塑化S212步驟的半膠狀原料由高速攪拌機輸送至另一押出機押出,使基材212原料達到完全塑化的效果。 S113, S213: Extrusion, the initial plasticizing raw material after the step of step S112 is plasticized and sent to the corresponding extruder by the 10,000 horsepower machine to make the raw material of the bottom layer 211 reach the complete plasticizing effect, and then the substrate is further processed. The semi-gelatinous raw material of the step 212 of the plasticizing step S212 is transported by a high-speed mixer to another extruder to force the raw material of the substrate 212 to achieve a complete plasticizing effect.
S3:T型模押出,將底面層211與基材212同步引入T型模押出,此時由於將底面層211與基材212的相對接觸面係藉由高溫使其底面層211與基材212呈半溶狀,故當以T型模押出後,可讓底面層211與基材212的相對接觸面完全溶合成一體,令底面層211與基材212在使用過程中不致發生剝離的現象。 S3: The T-type mold is extruded, and the bottom layer 211 is introduced into the T-die simultaneously with the substrate 212. At this time, the bottom surface layer 211 and the substrate 212 are caused by the high temperature of the opposite contact surface of the bottom layer 211 and the substrate 212. It is semi-soluble, so that when it is extruded by the T-die, the opposite contact surface of the bottom layer 211 and the substrate 212 can be completely dissolved, so that the bottom layer 211 and the substrate 212 do not peel off during use.
S4:輥壓出片,經T型模押出之複合狀底面層211與基材212的材料片,經輥壓調整成預設厚度之複合狀底面層21。 S4: Rolling out the sheet, and the material sheet of the composite bottom layer 211 and the substrate 212 extruded through the T-die is adjusted by rolling to form a composite bottom layer 21 of a predetermined thickness.
S5:第一次預熱,將面料層23繞行於複數加熱輪 31作為第一次的先期預熱,藉由加熱輪31逐步對面料層23預熱到至少攝氏溫度100度之第一預設溫度。 S5: The first preheating, the fabric layer 23 is wound around the plurality of heating wheels As the first preheating of the first time, the fabric layer 23 is gradually preheated by the heating wheel 31 to a first preset temperature of at least 100 degrees Celsius.
S6:第二次預熱,將第一次預熱後之面料層23,再利用紅外線高週波加熱裝置32做第二次的預熱,將面料層23再次預熱到至少攝氏溫度110度之第二預設溫度。 S6: the second preheating, the fabric layer 23 after the first preheating is further preheated by the infrared high frequency heating device 32, and the fabric layer 23 is preheated again to at least 110 degrees Celsius. The second preset temperature.
S7:輥壓貼合,將第二次預熱後之面料層23披覆於一印刷層24上,且印刷層24相對於面料層23披覆面則披覆於經T型模押出之複合狀底面層21的頂面(底面層211)。將三者藉由具熱源之輥壓輪331、332輥壓,除使面料層23又一次預熱到至少130度之第三預設溫度外,並對複合狀底面層21預熱(印刷層24不作預熱,以避免變形),而將面料層23、印刷層24及複合狀底面層21輥壓貼合。且對應面料層23之輥壓輪331上得設有壓紋3311,於輥壓貼合面料層23、印刷層24及複合狀底面層21的同時,亦對面料層23進行壓紋而形成一塑膠地磚半成品。 S7: roll bonding, the second pre-heated fabric layer 23 is coated on a printing layer 24, and the printing layer 24 is coated on the T-shaped mold with respect to the fabric layer 23 The top surface (bottom layer 211) of the bottom layer 21. The three are rolled by the heat roller 105, 332, and the fabric layer 23 is once again preheated to a third preset temperature of at least 130 degrees, and the composite bottom layer 21 is preheated (print layer 24, without preheating to avoid deformation, the fabric layer 23, the printed layer 24, and the composite bottom layer 21 are roll-bonded. And the embossing wheel 331 corresponding to the fabric layer 23 is provided with an embossing 3311, and the fabric layer 23 is embossed to form a lining at the same time as the roll bonding fabric layer 23, the printing layer 24 and the composite bottom layer 21. Semi-finished plastic floor tiles.
S8:第一次冷卻,藉由冷卻液對輥壓貼合之塑膠地磚半成品作第一次冷卻降溫,使各層材料的變化趨於緩和穩定,以便進行後續之加工製程。其中冷卻液溫度不能高於攝氏溫度30度。 S8: The first cooling, the first cooling and cooling of the plastic floor tile by the cooling liquid is applied, so that the change of the material of each layer tends to be moderate and stable, so as to carry out the subsequent processing. The coolant temperature cannot be higher than 30 degrees Celsius.
S9:第二次冷卻,藉由冷卻液對輥壓貼合之塑膠地磚半成品再施以第二次冷卻降溫,使各層材料的變化趨於緩和穩定,以便進行後續之加工製程。其中冷卻液溫度不能高於攝氏溫度15度。 S9: The second cooling, the second cooling of the plastic floor tile by the cooling liquid is applied to the second cooling and cooling, so that the change of the material of each layer tends to be moderated and stabilized, so as to carry out the subsequent processing. The coolant temperature cannot be higher than 15 degrees Celsius.
S10:修邊處理,將塑膠地磚半成品進行毛邊料之修整,去除塑膠地磚半成品邊側之多餘殘料。 S10: Trimming treatment, trimming the semi-finished plastic floor tiles with trimming materials to remove excess residue from the side of the semi-finished plastic floor tiles.
S11:回火處理,在完成前述的製程步驟後,進一步利用回火裝置對塑膠地磚半成品進行回火處理,克服塑膠地磚半成品於製程中的應力,使塑膠地磚的物性穩定,提高產品品質的要求。 S11: tempering treatment, after completing the foregoing process steps, further tempering the semi-finished plastic floor tiles by using a tempering device to overcome the stress of the semi-finished plastic tile in the process, so that the physical properties of the plastic floor tiles are stabilized and the product quality is improved. .
S12:沖切成型,將回火處理後之塑膠地磚半成品,先堆疊於室溫中冷卻至室溫使其物性更為穩定後,再將膠塑地磚半成品進行裁切成客戶需求的成品尺寸 規格。 S12: After die-cutting, the semi-finished plastic bricks after tempering are first stacked at room temperature and cooled to room temperature to make the physical properties more stable. Then, the semi-finished products of the plastic-plastic floor tiles are cut into finished product sizes. specification.
藉由上述步驟將高厚度之面料層23逐步加溫避免焦化,使其達到溶粘溫度時,利用輥壓加以貼合印刷層24及複合狀底面層21,徹底解決膠塑地磚表面膠層(面料層)厚度無法提升的缺失,或塑膠地磚易扭曲變形的問題,並藉由第一、二次冷卻與回火處理等,使其塑膠地磚半成品藉由回火處理以克服產品於製程中的應力,避免塑膠地磚受環境影響而導致扭曲變形的問題使產品穩定性提升。如此,在相同的製造產能、效率下,進而可加厚其表面膠層(面料層)之厚度,而能提升塑膠地磚更具耐壓與耐磨效果,有效的延長使用壽命,增加其生產經濟效益者。 By the above steps, the high-thickness fabric layer 23 is gradually heated to avoid coking, and when it reaches the dissolving temperature, the printing layer 24 and the composite bottom layer 21 are bonded by roll pressing, and the surface rubber layer of the plastic-plastic floor tile is completely solved ( The lack of thickness of the fabric layer, or the problem that the plastic floor tiles are easily distorted, and the first and second cooling and tempering treatments, so that the semi-finished plastic floor tiles are tempered to overcome the product in the process. Stress, to avoid the problem of distortion caused by plastic floor tiles affected by the environment, to improve product stability. In this way, under the same manufacturing capacity and efficiency, the thickness of the surface adhesive layer (fabric layer) can be further increased, and the plastic floor tile can be improved in pressure resistance and wear resistance, effectively extending the service life and increasing the production economy. Benefits.
以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.
1‧‧‧塑膠地磚 1‧‧‧Plastic floor tiles
11‧‧‧基材 11‧‧‧Substrate
12‧‧‧印刷膠布 12‧‧‧Printed tape
13‧‧‧表面膠層 13‧‧‧Surface adhesive layer
21‧‧‧複合狀底面層 21‧‧‧Composite bottom layer
211‧‧‧底面層 211‧‧‧ bottom layer
212‧‧‧基材 212‧‧‧Substrate
23‧‧‧面料層 23‧‧‧ fabric layer
24‧‧‧印刷層 24‧‧‧Printing layer
31‧‧‧加熱輪 31‧‧‧heating wheel
32‧‧‧紅外線高週波加熱裝置 32‧‧‧Infrared high frequency heating device
331、332‧‧‧輥壓輪 331, 332‧‧‧ Roller wheel
3311‧‧‧壓紋 3311‧‧‧ embossing
S3~S12‧‧‧步驟 S3~S12‧‧‧Steps
S111~S113‧‧‧步驟 S111~S113‧‧‧Steps
S211~S213‧‧‧步驟 S211~S213‧‧‧Steps
第1圖 習知塑膠地磚剖面示意圖。 Figure 1 Schematic diagram of a conventional plastic floor tile.
第2圖 本發明塑膠地磚之製造方法其流程示意圖。 Fig. 2 is a schematic flow chart showing the manufacturing method of the plastic floor tile of the present invention.
第3圖 本發明塑膠地磚之製造方法其T型模押出實施例示意圖。 Fig. 3 is a schematic view showing a T-die extrusion embodiment of the method for producing a plastic floor tile according to the present invention.
第4圖 本發明塑膠地磚之製造方法其實施例示意圖。 Fig. 4 is a schematic view showing an embodiment of a method for producing a plastic floor tile according to the present invention.
第5圖 本發明塑膠地磚之製造方法其成品剖面示意圖。 Fig. 5 is a schematic cross-sectional view showing the finished method of the method for manufacturing the plastic floor tile of the present invention.
23‧‧‧面料層 23‧‧‧ fabric layer
24‧‧‧印刷層 24‧‧‧Printing layer
S3~S12‧‧‧步驟 S3~S12‧‧‧Steps
S111~S113‧‧‧步驟 S111~S113‧‧‧Steps
S211~S213‧‧‧步驟 S211~S213‧‧‧Steps
Claims (8)
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TW101124239A TW201402917A (en) | 2012-07-05 | 2012-07-05 | Method of making a plastic floor tile |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108891007A (en) * | 2018-08-10 | 2018-11-27 | 东莞市石碣昌达五金模具厂 | A kind of plastic floor brick forming method and its equipment |
CN110735511A (en) * | 2018-07-18 | 2020-01-31 | 柯五男 | Method for manufacturing plastic floor tile |
TWI700904B (en) * | 2015-09-24 | 2020-08-01 | 美商蘋果公司 | Mapping of physical broadcast channel (pbch) repetition symbols for machine-type communication (mtc) |
TWI704992B (en) * | 2018-07-13 | 2020-09-21 | 柯五男 | Plastic floor tiles manufacturing method |
TWI776265B (en) * | 2020-11-03 | 2022-09-01 | 柯五男 | Manufacturing method of plastic floor tiles |
-
2012
- 2012-07-05 TW TW101124239A patent/TW201402917A/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI700904B (en) * | 2015-09-24 | 2020-08-01 | 美商蘋果公司 | Mapping of physical broadcast channel (pbch) repetition symbols for machine-type communication (mtc) |
TWI704992B (en) * | 2018-07-13 | 2020-09-21 | 柯五男 | Plastic floor tiles manufacturing method |
CN110735511A (en) * | 2018-07-18 | 2020-01-31 | 柯五男 | Method for manufacturing plastic floor tile |
CN108891007A (en) * | 2018-08-10 | 2018-11-27 | 东莞市石碣昌达五金模具厂 | A kind of plastic floor brick forming method and its equipment |
TWI776265B (en) * | 2020-11-03 | 2022-09-01 | 柯五男 | Manufacturing method of plastic floor tiles |
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