TW201818423A - Copper alloy wire and a method for manufacturing the same capable of improving the soldering capability of copper wire and preventing copper wire from oxidation - Google Patents
Copper alloy wire and a method for manufacturing the same capable of improving the soldering capability of copper wire and preventing copper wire from oxidation Download PDFInfo
- Publication number
- TW201818423A TW201818423A TW105136887A TW105136887A TW201818423A TW 201818423 A TW201818423 A TW 201818423A TW 105136887 A TW105136887 A TW 105136887A TW 105136887 A TW105136887 A TW 105136887A TW 201818423 A TW201818423 A TW 201818423A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper alloy
- wire
- copper
- alloy wire
- manufacturing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
本發明係關於一種銅導線及其製造方法,特別是關於一種銅合金導線及其製造方法。 The invention relates to a copper wire and a manufacturing method thereof, and more particularly to a copper alloy wire and a manufacturing method thereof.
近年來由於金價走高,習用以作為半導體封裝導線的金線也開始被其他金屬導線取代,以材質成分或創新結構開發半導體封裝導線已然成為該領域的主要發展方向。 In recent years, due to the rise in gold prices, the gold wires used as semiconductor packaging wires have begun to be replaced by other metal wires. The development of semiconductor package wires with material composition or innovative structures has become the main development direction in this field.
因此,在導電性質與成本上都有優勢的銅金屬,亦被作為主要替代材質來開發導線,惟,銅金屬雖然有良好的導電性與延展性且價格較低廉,但在實際應用上,卻因銅金屬易於氧化的特性影響了傳導的功能並大幅縮減了銅導線的壽命;是以,藉由成分、製程或結構之改良來改善銅導線氧化的問題也成為領域中其中一個研究的課題。 Therefore, copper metal, which has advantages in conductive properties and cost, has also been used as a main substitute material to develop wires. However, although copper metal has good conductivity and ductility and is inexpensive, but in practical applications, The easy oxidation of copper metal affects the conduction function and greatly reduces the life of the copper wire; therefore, the improvement of the oxidation of the copper wire through the improvement of the composition, process or structure has also become one of the research topics in the field.
例如在專利文獻(證書號TW I509089)中,揭示一種純銅合金線的剖面構造,該線的組成係由40~100ppm鈦、鋯、鋅、錫中的至少一種卑金屬,以及剩餘部份用銅所構成;該線材的剖面構造係該線材因鑽石伸線眼模加工而徑縮的加工面,該線材表面形成由總有機碳量為50~3000μg/m2所構成的有機碳層。 For example, in the patent document (certificate number TW I509089), the cross-section structure of a pure copper alloy wire is disclosed. The composition of the wire is at least one base metal of 40 to 100 ppm titanium, zirconium, zinc, and tin, and the remaining portion is made of copper. The cross-sectional structure of the wire rod is a processed surface of the wire rod that has been reduced in diameter by diamond drawing eye mold processing. The surface of the wire rod forms an organic carbon layer composed of a total organic carbon content of 50 to 3000 μg / m 2 .
上述專利文獻(TW I509089)之技術主要在於為了抑制銅線表面銅氧化物變質成為斑點,故使銅母材中含有易氧化之卑金屬元素先與氧原子進行內部氧化。接著,在表面氧化層大部分還是未飽和之銅氧化物期間,藉由鑽石拉伸模在線材表面形成不使該氧化層還原的有機碳層,而取得銅氧化物層的氧化還原平衡,進而阻止斑狀的銅氧化物在表面產生;然而,此一專利之銅導線在實際上與鋁墊銲接時,由於成分比例的關係,會有銲接性較差的情形。 The technology of the above-mentioned patent document (TW I509089) is mainly to prevent the copper oxide on the surface of the copper wire from deteriorating into spots, so that the base metal containing copper which is easily oxidized is first oxidized internally with oxygen atoms. Next, during the period when most of the surface oxide layer is still unsaturated copper oxide, an organic carbon layer that does not reduce the oxide layer is formed on the surface of the wire by a diamond stretching die, thereby achieving a redox balance of the copper oxide layer, and further Prevent the formation of spot-shaped copper oxide on the surface; however, when the copper wire of this patent is actually soldered to the aluminum pad, the solderability may be poor due to the composition ratio.
又,於專利文獻(證書號TW I512121)中,揭示一種接合線,其包含:以銅作為主要成分之具有表面的核心,其中銅之總量至少97%,另包含0.5%~3%的鈀、45~900ppm的銀;此專利文獻之技術在於其於核心外結合一塗層,該塗層包括Pd、Au、Pt、Ag之至少一者作為主要成分。 若選擇退火溫度作為變量參數,且將退火時間設為定值,則將退火溫度選為高於最大延伸率之退火溫度值尤其有益;特定而言,可使用此製造原理將線之平均晶粒大小調節至較大之晶粒尺寸,可以正性方式影響其他性質,如線柔軟性、球接合行為等。 In addition, in the patent document (certificate number TW I512121), a bonding wire is disclosed, which includes: a core with a surface having copper as a main component, wherein the total amount of copper is at least 97%, and the other contains 0.5% to 3% palladium 45 to 900 ppm of silver; the technology of this patent document is that it incorporates a coating outside the core, the coating including at least one of Pd, Au, Pt, Ag as a main component. If the annealing temperature is selected as the variable parameter and the annealing time is set to a fixed value, it is particularly beneficial to select the annealing temperature as the annealing temperature value higher than the maximum elongation; in particular, the average grain size of the wire can be used by this manufacturing principle Adjusting the size to a larger grain size can positively affect other properties such as wire softness, ball bonding behavior, and so on.
惟,上述專利文獻(TW I512121)在實際應用上,由於其表面塗層係包括Pd、Au、Pt、Ag之至少一者作為主要成分,是以製造成本較高且成球性會較無鍍層的來的差。 However, in practical applications, the above-mentioned patent document (TW I512121), because its surface coating system includes at least one of Pd, Au, Pt, and Ag as the main component, it has a higher manufacturing cost and a higher sphericity than an unplated layer. It ’s bad.
有鑑於此,本發明即研發一種特定成分之銅合金導線,既可改善其氧化之問題,亦可保有並提升其銲接 性。 In view of this, the present invention is to develop a copper alloy wire with a specific composition, which can not only improve its oxidation problem, but also maintain and improve its solderability.
本發明所欲解決的主要問題,係在於銅導線易氧化的特性在半導體封裝上應用的限制;因此本發明以加入銀、鈦作為組成成分,並對其製作方法進行改良,克服銅導線易氧化的問題,同時提升銅導線之銲接性。 The main problem to be solved by the present invention lies in the limitation of the application of the characteristics of easy oxidation of copper wires on semiconductor packages; therefore, the present invention adds silver and titanium as constituents and improves its manufacturing method to overcome the easy oxidation of copper wires. Problems, while improving the solderability of copper wires.
為達成上述的目的,本發明公開了一種銅合金導線,係以銅、銀、鈦為主要組成成分,並以重量百分比如下的比例真空熔煉製成:0.3~0.45的銀、0.01~0.02的鈦以及其餘為銅。 In order to achieve the above object, the present invention discloses a copper alloy wire, which is mainly composed of copper, silver, and titanium, and is made by vacuum melting in the following percentages by weight: 0.3 to 0.45 of silver and 0.01 to 0.02 of titanium And the rest is copper.
而本發明所述的銅合金導線,係於真空狀態下進行二階段熔煉後,以連續鑄造法製成銅合金線材,再經伸線設備抽製為銅合金精細線,最後經退火溫度580~700℃(退火時間0.1秒以上)之熱處理完成銅合金導線之製程。 The copper alloy wire according to the present invention is made of copper alloy wire by continuous casting after two-stage melting in a vacuum state, and then drawn into a copper alloy fine wire through a wire drawing equipment, and finally annealed at a temperature of 580 ~ Heat treatment at 700 ° C (annealing time of 0.1 seconds or more) completes the process of copper alloy wires.
在真空熔煉步驟中,「二階段熔煉」係分為第一階段的真空電弧熔煉與第二階段的真空感應熔煉,說明如下:1.真空電弧熔煉:全份額的鈦與部分份額的銅以真空電弧熔煉製成熔點較低的銅鈦母合金;2.真空感應熔煉:銅鈦母合金與全份額的銀、剩餘份額的銅共同進行感應熔煉為熔融狀的銅合金。 In the vacuum smelting step, the "two-stage smelting" is divided into the first stage of vacuum arc smelting and the second stage of vacuum induction smelting, as explained below: 1. Vacuum arc smelting: a full share of titanium and a portion of copper are vacuumed Arc melting to produce copper-titanium master alloy with lower melting point; 2. Vacuum induction melting: copper-titanium master alloy is inductively smelted into a molten copper alloy with all the silver and the remaining copper.
接下來,經均勻熔煉後的熔融狀的銅合金會經過連續鑄造法(continuous casting)鑄造為線徑8mm到4mm的銅合金線材,然後經由無滑動伸線設備於室溫下以100~1000m/min的速度抽製為10~20μm的銅合金精細線。 Next, the molten copper alloy after uniform melting will be continuously cast into copper alloy wire with a wire diameter of 8mm to 4mm, and then passed through a non-sliding wire drawing device at room temperature at 100 ~ 1000m / The copper alloy fine wire is drawn at a speed of 10 to 20 μm.
最後,銅合金精細線會以氬氣作為保護氣體,以退火溫度580~700℃(退火時間0.1秒以上)的熱處理完成銅合金導線之製程,使該銅合金導線之氧化問題獲得明顯改善,並且達到更佳的銲接性,具有整體機械性質優化之功效。 Finally, the copper alloy fine wire will use argon as a protective gas and complete the process of copper alloy wire by heat treatment at an annealing temperature of 580 ~ 700 ° C (annealing time of more than 0.1 second), so that the oxidation problem of the copper alloy wire is significantly improved, Achieve better weldability and optimize the overall mechanical properties.
A‧‧‧全份額的鈦 A‧‧‧ full share of titanium
B1‧‧‧部份份額的銅 B1‧‧‧Part of copper
B2‧‧‧剩餘份額的銅 B2‧‧‧Remaining share of copper
C‧‧‧全份額的銀 C‧‧‧ full share of silver
100’‧‧‧銅鈦母合金 100’‧‧‧Cu-Ti master alloy
100‧‧‧熔融狀的銅合金 100‧‧‧ molten copper alloy
300‧‧‧無滑動伸線設備 300‧‧‧No-sliding wire drawing equipment
301‧‧‧張力控制裝置 301‧‧‧tension control device
302‧‧‧眼模 302‧‧‧eye mold
303‧‧‧銅合金線材 303‧‧‧copper alloy wire
S10~S12‧‧‧真空熔煉步驟 S10 ~ S12‧‧‧ Vacuum melting step
S20‧‧‧連續鑄造步驟 S20‧‧‧Continuous casting steps
S30~S31‧‧‧抽線步驟 S30 ~ S31‧‧‧Drawing steps
S40~S41‧‧‧熱處理步驟 S40 ~ S41‧‧‧‧Heat treatment steps
圖1A為本發明主要成分及第一階段熔煉之表示圖;圖1B為本發明主要成分及第二階段熔煉之表示圖;圖2A為本發明製造方法之步驟流程圖;圖2B為本發明真空熔煉步驟之流程說明圖;圖2C為本發明抽線步驟之流程說明圖;圖2D為本發明熱處理步驟之流程說明圖;圖3為本發明無滑動伸線設備之示意圖。 Figure 1A is a representation of the main components of the present invention and the first stage of smelting; Figure 1B is a representation of the main components of the present invention and the second stage of smelting; Figure 2A is a flowchart of the steps of the manufacturing method of the present invention; and Figure 2B is a vacuum of the present invention Figure 2C is a flow chart of the drawing step of the present invention; Figure 2D is a flow chart of the heat treatment step of the present invention; and Figure 3 is a schematic view of the non-sliding wire drawing device of the present invention.
首先,請同時參閱圖1A及圖1B,圖1A及圖1B係為本發明所述之銅合金導線的成分與熔煉方式,本發明係銅、銀、鈦以組成成分如下的重量百分比真空熔煉製成:0.3~0.45的銀、0.01~0.02的鈦以及其餘部分為銅。 First, please refer to FIG. 1A and FIG. 1B at the same time. FIG. 1A and FIG. 1B are the composition and melting method of the copper alloy wire according to the present invention. The present invention is that copper, silver, and titanium are vacuum smelted at the following weight percentages: Composition: 0.3 to 0.45 silver, 0.01 to 0.02 titanium, and the rest are copper.
由於鈦金屬熔點為1668℃,高於熔點1085℃的銅與熔點961.8℃的銀相差近600~700℃,為避免鈦金屬熔融不全無法均勻的分布於熔融狀的銅合金中進行鑄造,因此於真空熔煉階段採取「二階段熔煉」,先如圖1A中將「全份額的鈦A」與「部分份額的銅B1」以真空電弧熔煉製成熔點較低的「銅鈦母合金100’」;再如圖1B中將「銅鈦母合金100’」與「全 份額的銀C」、「剩餘份額的銅B2」共同進行感應熔煉為「熔融狀的銅合金100」。上述部分份額的銅B1及剩餘份額的銅B2皆使用純度4N以上的銅。 Because the melting point of titanium is 1668 ° C, copper with a melting point above 1085 ° C and silver with a melting point of 961.8 ° C differ by nearly 600 ~ 700 ° C. In order to avoid the incomplete melting of titanium metal, it cannot be uniformly distributed in the molten copper alloy for casting, so The vacuum melting phase adopts "two-stage melting". As shown in Fig. 1A, "the full share of titanium A" and "part of the share of copper B1" are vacuum arc smelted to produce a "copper titanium master alloy 100 '" with a lower melting point; Then, as shown in FIG. 1B, the "copper-titanium master alloy 100 '", "the full share of silver C", and the "remaining share of copper B2" are all subjected to induction melting to "a molten copper alloy 100". For the above-mentioned portion of copper B1 and the remaining portion of copper B2, copper having a purity of 4N or more is used.
而本發明所述的銅合金導線,係如圖2A所示透過真空熔煉以連續鑄造法製成銅合金線材,再經伸線設備抽為銅合金精細線,最後經熱處理完成銅合金導線之製程,步驟如下:步驟S10:真空狀態下進行二階段熔煉;步驟S20:經連續鑄造製成銅合金線材;步驟S30:經伸線設備抽製為銅合金精細線;步驟S40:以580~700℃退火時間0.1秒以上進行熱處理。 The copper alloy wire according to the present invention is made of a copper alloy wire by continuous casting through vacuum melting as shown in FIG. 2A, and then drawn into a copper alloy fine wire through a wire drawing device, and finally the heat treatment is performed to complete the copper alloy wire manufacturing process. The steps are as follows: Step S10: Two-stage melting under vacuum; Step S20: Copper alloy wire made by continuous casting; Step S30: Copper alloy fine wire drawn through wire drawing equipment; Step S40: 580 ~ 700 ° C The heat treatment is performed at an annealing time of 0.1 seconds or more.
於圖2B中可進一步了解,步驟S10中提到的「二階段熔煉」係分為第一階段的步驟S11與第二階段的步驟S12,說明如下: It can be further understood in FIG. 2B that the “two-stage smelting” mentioned in step S10 is divided into step S11 of the first stage and step S12 of the second stage, which are described as follows:
步驟S11:全份額的鈦與部分份額的銅以真空電弧熔煉製成熔點較低的銅鈦母合金。詳言之,熔點為1668℃的鈦投入熔點1085℃的銅金屬液時,該銅金屬液無法使鈦金屬完全熔融於其中,因此在步驟S11中,將要熔煉的鈦及部分的銅先置入坩鍋中並抽至真空,使降低熔煉過程中空氣裡的汙染源,再透過電擊棒產生電弧對坩鍋內之鈦和銅直接進行加溫熔融,先行將銅和鈦煉製為熔點更接近銅熔點的銅鈦母合金。此一步驟之目的,係在於防止熔點較高的鈦金屬在熔融不完全或熔融不均勻的狀態下,與其餘成分一起煉製為銅合金線材,導 致鈦金屬於銅合金內部的分布不均勻,造成該銅合金抗氧化性不理想的情形。 Step S11: The titanium and master alloys with a lower melting point are produced by vacuum arc smelting of all the titanium and some copper. In detail, when titanium having a melting point of 1668 ° C is added to a copper metal liquid having a melting point of 1085 ° C, the copper metal liquid cannot completely melt the titanium metal therein. Therefore, in step S11, the titanium to be smelted and a part of the copper are first placed in The crucible is evacuated to reduce the pollution source in the air during the smelting process, and then the titanium and copper in the crucible are directly heated and melted through the electric arc to generate an arc. The copper and titanium are first refined to have a melting point closer to the melting point of copper. Copper-titanium master alloy. The purpose of this step is to prevent titanium with a higher melting point from being melted together with the remaining components into copper alloy wires under the condition of incomplete melting or uneven melting, resulting in uneven distribution of titanium metal inside the copper alloy. This results in a situation where the oxidation resistance of the copper alloy is not ideal.
步驟S12:銅鈦母合金與全份額的銀、剩餘份額的銅共同進行感應熔煉為熔融狀的銅合金。 Step S12: The copper-titanium master alloy is inductively smelted into a molten copper alloy with all the silver and the remaining copper.
經均勻熔煉後的銅合金熔融液在步驟S20(如圖2A所示)中,熔融狀的銅合金會經過連續鑄造法(continuous casting)鑄造為線徑8mm到4mm的銅合金線材;在煉製成形為線材的步驟中,基於線材的物理特徵與鑄造的成本及便利性,採用直接將銅合金熔融液倒入不斷振動與冷卻的鑄道模體生成連續不斷線材的連續鑄造法。 In step S20 (as shown in FIG. 2A), the molten copper alloy melt is uniformly smelted into a copper alloy wire with a wire diameter of 8mm to 4mm through continuous casting. In the step of forming into a wire, based on the physical characteristics of the wire and the cost and convenience of casting, a continuous casting method is used to directly generate a continuous wire by pouring a copper alloy molten liquid into a continuously-vibrating and cooling runner mold.
接下來,線徑8mm到4mm的銅合金線材會再經過步驟S30中的伸線設備經粗抽、中抽、細抽於室溫下以100~1000m/min的速度抽製為10~20μm的銅合金精細線。 Next, the copper alloy wire with a wire diameter of 8mm to 4mm is further drawn through the wire drawing equipment in step S30 through rough drawing, middle drawing, and fine drawing at room temperature at a speed of 100 ~ 1000m / min into 10 ~ 20μm. Fine copper alloy wire.
在一實施例中,可使用如圖2C所示之步驟S31中所述的「無滑動伸線設備」對銅合金線材進行抽線。舉例,參考圖3,於該抽線步驟中,該無滑動伸線設備300包括一張力控制裝置301及一眼模302,該張力控制裝置301(例如張力桿)用以在該眼模302後方增加該銅合金線材303的背向拉力,可使線材中心材料流動的均勻性提高達到更佳的機械性質,並減少一般抽線中晶粒常見的扇形缺陷衍生的斷線問題。 In one embodiment, the “copper-free wire drawing device” described in step S31 shown in FIG. 2C can be used to draw the copper alloy wire. For example, referring to FIG. 3, in the thread drawing step, the non-sliding wire drawing device 300 includes a force control device 301 and an eye mold 302, and the tension control device 301 (such as a tension rod) is used to increase behind the eye mold 302. The back pulling force of the copper alloy wire 303 can improve the uniformity of the material flow in the center of the wire to achieve better mechanical properties, and reduce the disconnection problems caused by fan-shaped defects common to grains in general drawing.
在抽線完成後,銅合金精細線會在步驟S40中經過退火溫度580~700℃、退火時間0.1秒以上的熱處理,完成銅合金導線的製程;經過無滑動伸線設備抽製成之銅合金精細線,其表面的晶粒仍可維持大小及分布皆較均勻的排列,因此 在經過熱處理後之線材內部流動的均勻性佳,可優化線材的機械性質讓導線具備更佳的延展性以利於封裝銲接之作業,經實測驗證後,本發明之銅合金導線其破斷強度(B.L.)及延伸率可增加。在一實施例中,可如圖2D所示之步驟S41中以氬氣取代常見的氮氣作為熱處理時的保護氣體,改善銅導線易氧化的問題。 After the drawing is completed, the copper alloy fine wire will be subjected to a heat treatment at an annealing temperature of 580 to 700 ° C. and an annealing time of more than 0.1 seconds in step S40 to complete the process of the copper alloy wire; the copper alloy drawn through the non-sliding wire drawing equipment Fine wires, the grains on the surface can still maintain a relatively uniform size and distribution, so the uniformity of the internal flow of the wire after heat treatment is good, the mechanical properties of the wire can be optimized, and the wire has better ductility to facilitate After the welding operation of the package is verified by actual measurement, the breaking strength (BL) and elongation of the copper alloy wire of the present invention can be increased. In one embodiment, as shown in FIG. 2D, argon gas can be used instead of the common nitrogen gas as a protective gas during heat treatment to improve the problem of easy oxidation of the copper wire.
請參考表一,其為本發明不同配比之實施例1~4,以組成成分重量百分比如下: Please refer to Table 1, which are Examples 1 to 4 of different formulations of the present invention. The weight percentages of the components are as follows:
本發明在組成成分中加入鈦金屬,係用以提升銅合金導線的抗氧化能力,改良銅導線在使用上易氧化導致影響導線特性之缺失。本發明在組成成分中加入銀金屬係用以改善純銅導線之銲接性,未添加銀金屬的純銅導線在銲接時有成球性不好、銅球易脫落的情形,而添加了銀金屬的銅合金導線在銲接時可形成銲接強度較強之介金屬化合物(Intermetallic Compound,IMC)層,在破斷強度(B.L.)與延伸率(E.L.)上也都有較純銅導線更佳的表現。 Titanium metal is added to the composition in the present invention to improve the oxidation resistance of copper alloy wires, and the copper wires are easily oxidized during use, which leads to the loss of the characteristics of the wires. In the present invention, silver metal is added to the composition to improve the solderability of pure copper wires. Pure copper wires without silver metal have poor ball formation and copper balls are easy to fall off when soldered, and copper with silver metal is added. The alloy wire can form an intermetallic compound (IMC) layer with stronger welding strength during welding. It also has better performance in terms of breaking strength (BL) and elongation (EL) than pure copper wire.
請參考表二,其為本發明實施例1~4與6N純銅線在破斷強度(B.L.)與延伸率(E.L.)上之差異表,如下: Please refer to Table 2, which is a table of the differences in breaking strength (B.L.) and elongation (E.L.) of the pure copper wires of Examples 1 to 4 and 6N according to the present invention, as follows:
綜上所述,本發明可達到以下幾項功效:1.以微量成分添加銀、鈦金屬,提升銅導線之銲接性與抗氧化能力;2.真空連續鑄造生產設備,結合無滑動伸線設備的抽線製程,使線材品質佳且清淨度高;以及3.以特定溫度、時間之熱處理條件,優化銅導線本身的機械性質。 To sum up, the present invention can achieve the following effects: 1. Add silver and titanium metal with trace components to improve the solderability and oxidation resistance of copper wires; 2. Vacuum continuous casting production equipment, combined with non-sliding wire drawing equipment The drawing process of the wire makes the wire of good quality and cleanliness; and 3. The heat treatment conditions of specific temperature and time are used to optimize the mechanical properties of the copper wire itself.
上述本發明所採用的技術手段之實施方式或實施例,並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符,或依本發明專利範圍所做的均等變化與修 飾,皆為本發明專利範圍所涵蓋。 The foregoing implementation manners or embodiments of the technical means adopted by the present invention are not intended to limit the scope of patent implementation of the present invention. That is, all changes and modifications that are consistent with the meaning of the scope of the patent application of the present invention or made in accordance with the scope of the patent of the present invention are covered by the scope of the patent of the present invention.
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105136887A TWI592946B (en) | 2016-11-11 | 2016-11-11 | Copper alloy wire and its manufacturing method |
CN201710651291.4A CN108070734A (en) | 2016-11-11 | 2017-08-02 | Copper alloy wire and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105136887A TWI592946B (en) | 2016-11-11 | 2016-11-11 | Copper alloy wire and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI592946B TWI592946B (en) | 2017-07-21 |
TW201818423A true TW201818423A (en) | 2018-05-16 |
Family
ID=60048290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105136887A TWI592946B (en) | 2016-11-11 | 2016-11-11 | Copper alloy wire and its manufacturing method |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN108070734A (en) |
TW (1) | TWI592946B (en) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183426A (en) * | 1985-02-06 | 1986-08-16 | Furukawa Electric Co Ltd:The | High strength, highly conductive heat resisting copper alloy |
JPH06264165A (en) * | 1993-03-12 | 1994-09-20 | Hitachi Cable Ltd | Metal gasket |
JP4494610B2 (en) * | 2000-09-04 | 2010-06-30 | 株式会社フルヤ金属 | Sputtering target material for thin film formation |
JP4583564B2 (en) * | 2000-09-04 | 2010-11-17 | 株式会社フルヤ金属 | Wiring, electrodes and contacts |
CN100368573C (en) * | 2005-04-15 | 2008-02-13 | 中国科学院金属研究所 | Copper-base lump non-crystalline alloy |
CN101525703A (en) * | 2009-03-08 | 2009-09-09 | 聊城北科电子信息材料有限公司 | Semiconductor device brazing wire and preparation technology thereof |
JP5562218B2 (en) * | 2010-12-02 | 2014-07-30 | 株式会社Shカッパープロダクツ | Rolled copper foil |
JP5470483B1 (en) * | 2012-10-22 | 2014-04-16 | Jx日鉱日石金属株式会社 | Copper alloy sheet with excellent conductivity and stress relaxation properties |
CN102899521A (en) * | 2012-11-09 | 2013-01-30 | 华东理工大学 | Copper-chromium-zirconium alloy material and preparation method thereof |
CN104164578B (en) * | 2014-08-30 | 2016-08-17 | 海安南京大学高新技术研究院 | A kind of low modulus, improved corrosion ternary Ni-Ti-Cu alloy and preparation method thereof |
-
2016
- 2016-11-11 TW TW105136887A patent/TWI592946B/en active
-
2017
- 2017-08-02 CN CN201710651291.4A patent/CN108070734A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN108070734A (en) | 2018-05-25 |
TWI592946B (en) | 2017-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102013214B1 (en) | Bonding wire for semiconductor devices | |
JP5219316B1 (en) | Copper platinum alloy wire for semiconductor device connection | |
CN103194637B (en) | Bonding alloy filamentary silver and preparation method thereof | |
JP5668087B2 (en) | Structure of copper dilute nickel alloy wire for semiconductor device bonding | |
JP5213146B1 (en) | Copper rhodium alloy wire for connecting semiconductor devices | |
US20190161841A1 (en) | Copper alloy wire and manufacturing method thereof | |
JP6710141B2 (en) | Copper alloy wire for ball bonding | |
CN102130067A (en) | Surface palladium-plated bonding brass wire | |
CN105132735A (en) | Ultra-thin copper alloy bonding wire for microelectronic packaging and preparing method of ultra-thin copper alloy bonding wire | |
TWI538122B (en) | A bonding wire for packaging and a preparation method thereof | |
JP2014055327A (en) | Silver gold palladium-based alloy bump wire | |
CN105463237A (en) | Copper-silver alloy bonding wire and manufacturing method thereof | |
CN106992164A (en) | A kind of microelectronics Packaging copper alloy monocrystal bonding wire and preparation method thereof | |
TWI714562B (en) | Copper alloy bonding wire | |
CN115148419B (en) | High-conductivity antioxidant microalloyed copper alloy bonding wire and preparation method thereof | |
TW201818423A (en) | Copper alloy wire and a method for manufacturing the same capable of improving the soldering capability of copper wire and preventing copper wire from oxidation | |
TWI510652B (en) | Construction of thin copper alloy wire for copper alloy for joining semiconductor device | |
CN105177345A (en) | High-reliability copper alloy bonding wire for microelectronic packaging and manufacturing method thereof | |
CN107195608A (en) | A kind of copper microalloy bonding line and preparation method thereof | |
CN110718526A (en) | Rare earth copper alloy bonding wire for superfine linear pitch electronic packaging and preparation method thereof | |
TWI656222B (en) | Gold alloy package wire and manufacturing method thereof | |
TW201711150A (en) | Copper alloy wire for ball bonding capable of increasing the Young's modulus by adjusting the blending ratio | |
CN117418134A (en) | High-conductivity silver-copper-nickel alloy bonding wire and preparation method thereof | |
CN111653540A (en) | Bonding copper wire with iron-plated platinum alloy on surface | |
CN112626368A (en) | Preparation method of silver alloy bonding wire |