TW201816835A - Processing liquid generator and substrate processing apparatus using the same - Google Patents

Processing liquid generator and substrate processing apparatus using the same Download PDF

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TW201816835A
TW201816835A TW106122352A TW106122352A TW201816835A TW 201816835 A TW201816835 A TW 201816835A TW 106122352 A TW106122352 A TW 106122352A TW 106122352 A TW106122352 A TW 106122352A TW 201816835 A TW201816835 A TW 201816835A
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concentration
processing liquid
liquid
processing
valve
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TWI653661B (en
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林航之介
宮崎邦浩
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芝浦機械電子裝置股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)

Abstract

A processing liquid generator that generates processing liquid having undergone concentration adjustment includes a processing liquid adjuster, which adjusts the concentration of the processing liquid, a first processing liquid path, through which the processing liquid flows to the processing liquid adjuster, a second processing liquid path, through which the processing liquid flows to the processing liquid adjuster, a first concentration meter, which measures the concentration of the processing liquid flowing through the first processing liquid path, the measured concentration being the concentration of a component involved in the concentration adjustment in the processing liquid adjuster, a second concentration meter, which measures the concentration of the processing liquid flowing through the second processing liquid path, the measured concentration being the concentration of a component that is involved in the concentration adjustment and should be measured with the first concentration meter in terms of concentration, a first valve mechanism, which opens and closes the first processing liquid path, and a second valve mechanism, which opens and closes the second processing liquid path.

Description

處理液生成裝置及使用該裝置的基板處理裝置Processing liquid generating device and substrate processing device using the same

發明領域 本發明是有關於一種生成用於半導體晶圓之處理程序等之處理液的處理液生成裝置及使用其之基板處理裝置。FIELD OF THE INVENTION The present invention relates to a processing liquid generating device for generating a processing liquid for a semiconductor wafer processing program and the like, and a substrate processing device using the same.

發明背景 迄今,已知的是專利文獻1所記載的有機物之剝離裝置(基板處理裝置之一例)。該有機物之剝離裝置將藥液(剝離處理液)供給至半導體晶圓(基板之一例)的表面,除去在該半導體晶圓之製造程序所形成之光阻劑或聚合物等之有機物。該有機物之剝離裝置中,是以濃度計(有機成分濃度計、水分濃度計)測定構成藥液之各成分及純水的濃度,並且在循環槽(藥液槽)將該等各成分混合,使之循環,並在循環槽追加各成分及純水,以使各成分及純水的測定濃度值保持在預定範圍。藉此,在循環槽內生成由保持在預定濃度範圍之各成分及水分構成的藥液(剝離處理液)(作為處理液生成裝置的功能)。而且,在循環槽中生成的藥液通過剝離液供給管而供給到支撐在旋轉台之半導體晶圓的表面。BACKGROUND OF THE INVENTION Hitherto, an organic substance peeling device (an example of a substrate processing device) described in Patent Document 1 is known. The organic substance peeling device supplies a chemical solution (a peeling treatment solution) to the surface of a semiconductor wafer (an example of a substrate), and removes organic substances such as a photoresist or a polymer formed in a manufacturing process of the semiconductor wafer. In this peeling device for organic matter, the concentration of each component constituting the medicinal solution and the concentration of pure water is measured by a concentration meter (organic component concentration meter, water concentration meter), and the respective components are mixed in a circulation tank (chemical solution tank) It is circulated, and each component and pure water are added to a circulation tank so that the measured concentration value of each component and pure water may be maintained in a predetermined range. As a result, a chemical liquid (peeling treatment liquid) composed of each component and moisture held within a predetermined concentration range is generated in the circulation tank (function as a treatment liquid generation device). Then, the chemical solution generated in the circulation tank is supplied to the surface of the semiconductor wafer supported on the turntable through a peeling liquid supply pipe.

根據如此的有機物之剝離裝置,由於是測定貯存於循環槽(藥液槽)之藥液之各成分的濃度,並且僅將濃度變低的成分追加到循環槽,因此可將貯存於循環槽之藥液之各成分的濃度分別保持在預定範圍內。因此,可高度地維持藥液的剝離性能,並且可將貯存於循環槽的藥液重複地使用於在半導體晶圓形成之有機物的剝離處理。 [先行技術文獻] [專利文獻]According to such an organic substance stripping device, since the concentration of each component of the medicinal solution stored in the circulation tank (medicine solution tank) is measured, and only the component having a lower concentration is added to the circulation tank, it can be stored in the circulation tank. The concentration of each component of the chemical liquid is kept within a predetermined range, respectively. Therefore, the peeling performance of the chemical solution can be maintained at a high level, and the chemical solution stored in the circulation tank can be repeatedly used for the peeling treatment of the organic substance formed on the semiconductor wafer. [Antecedent Literature] [Patent Literature]

[專利文獻1]日本特開第2005-347384號公報[Patent Document 1] Japanese Patent Laid-Open No. 2005-347384

發明概要 發明欲解決之課題 適用於如上述之有機物之剝離裝置的處理液(藥液)生成裝置中,由於是以單一的濃度計來測定藥液(處理液)之各成分的濃度,故濃度測定之信賴性依賴單一的濃度計。因此,生成之處理液之濃度的信賴性未必可說是足夠的。本發明是有鑒於如此的情況而做成者,因此提供一種可提高生成之處理液之濃度的信賴性之處理液生成裝置。SUMMARY OF THE INVENTION The problem to be solved by the present invention is applicable to a processing liquid (medicine liquid) generating device for an organic material peeling device as described above. Since the concentration of each component of the chemical liquid (processing liquid) is measured with a single concentration meter, the concentration The reliability of the measurement depends on a single densitometer. Therefore, the reliability of the concentration of the produced processing liquid may not necessarily be sufficient. The present invention has been made in view of such a situation, and therefore, a processing liquid generating device capable of improving the reliability of the concentration of the generated processing liquid is provided.

又,本發明是提供一種藉由上述處理液生成裝置所生成之處理液來處理基板的基板處理裝置。The present invention also provides a substrate processing apparatus for processing a substrate using a processing solution generated by the processing solution generating apparatus.

解決課題之方法 本發明之處理液生成裝置是根據濃度計的測定濃度而生成經過濃度調整的處理液的處理液生成裝置,具有:處理液調整部,用以調整前述處理液的濃度;第1處理液路,使處理液流向前述處理液調整部;第2處理液路,使處理液流向前述處理液調整部;第1濃度計,用以測定在前述第1處理路徑流動之前述處理液的濃度,且前述濃度是在前述處理液調整部之濃度調整相關之成分的濃度;第2濃度計,用以測定在前述第2處理液路流動之前述處理液的濃度,且前述濃度是應由前述第1濃度計測定濃度測定,且在前述處理液調整部之濃度調整相關的成分之濃度;第1閥機構,用以進行前述第1處理液路的開閉;及第2閥機構,用以進行前述第2處理液路的開閉。Solution to Problem The processing liquid generating device of the present invention is a processing liquid generating device that generates a concentration-adjusted processing liquid based on a measured concentration of a densitometer, and includes a processing liquid adjusting unit for adjusting the concentration of the processing liquid; The processing liquid path causes the processing liquid to flow to the processing liquid adjusting section; the second processing liquid path causes the processing liquid to flow to the processing liquid adjusting section; and the first concentration meter is used to measure the amount of the processing liquid flowing through the first processing path. Concentration, and the foregoing concentration is the concentration of the components related to the concentration adjustment in the processing liquid adjusting section; the second concentration meter is used to measure the concentration of the processing liquid flowing in the second processing liquid path, and the concentration is determined by The first concentration meter measures the concentration measurement, and adjusts the concentration of the components related to the concentration adjustment in the processing liquid adjusting section; a first valve mechanism for opening and closing the first processing liquid path; and a second valve mechanism for The second processing liquid path is opened and closed.

根據如此的構成,藉由第1閥機構及第2閥機構,令第1處理液路及第2處理液路為開狀態時,處理液會在第1處理液路內流動而流入處理液調整部,並且處理液會在第2處理液路流動而流入處理液調整部。在此狀態下,前述處理液調整部可根據在前述第1濃度計、及前述第2濃度計之至少一者的測定濃度,進行處理液的濃度調整,即,進行處理液中之前述成分的濃度調整,前述第1濃度計是用以測定在前述第1處理液路流動之處理液的濃度,且前述濃度是其濃度調整相關之成分的濃度,前述第2濃度計是用以測定在前述第2處理液路流動之處理液的濃度,且前述濃度是應由前述第1濃度計濃度測定且前述濃度調整相關之成分的濃度。According to such a configuration, when the first processing liquid path and the second processing liquid path are opened by the first valve mechanism and the second valve mechanism, the processing liquid flows in the first processing liquid path and flows into the processing liquid. The processing liquid flows in the second processing liquid path and flows into the processing liquid adjusting section. In this state, the processing liquid adjusting unit may perform the concentration adjustment of the processing liquid based on the measured concentration of at least one of the first concentration meter and the second concentration meter, that is, perform the determination of the components in the processing liquid. For the concentration adjustment, the first concentration meter is used to measure the concentration of the processing liquid flowing in the first processing liquid path, and the concentration is the concentration of components related to the concentration adjustment, and the second concentration meter is used to measure the concentration The concentration of the processing liquid flowing in the second processing liquid path, and the concentration is a concentration of a component to be measured by the concentration of the first concentration meter and the concentration adjustment.

藉由第1閥機構,令第1處理液路為開狀態,並且藉由第2閥機構,令第2處理液路為閉狀態時,處理液不在第2處理液路流動,處理液在第1處理液路流動後流入處理液調整部。在該狀態下,前述處理液調整部可根據在用以測定為在前述第1處理液路流動之處理液的濃度,且其濃度調整相關之成分的濃度之前述第1濃度計的測定濃度,進行處理液之濃度調整,即,進行處理液中之前述成分的濃度調整。When the first processing liquid path is opened by the first valve mechanism, and when the second processing liquid path is closed by the second valve mechanism, the processing liquid does not flow in the second processing liquid path, and the processing liquid is in the first (1) The process liquid flow flows into the process liquid adjustment section. In this state, the processing liquid adjusting unit may adjust the measurement concentration of the first concentration meter based on the concentration of the processing liquid used to measure the concentration of the processing liquid flowing in the first processing liquid path, and the concentration of the relevant components. The concentration of the processing liquid is adjusted, that is, the concentration of the aforementioned components in the processing liquid is adjusted.

藉由第1閥機構令第1處理液路為閉狀態,並且藉由第2閥機構令第2處理液路為開狀態時,處理液不在第1處理液路流動而不會通過第1濃度計,處理液會在第2處理液路流動且通過第2濃度計流入處理液調整部。在此狀態下,前述處理液調整部可根據在前述第2濃度計之測定濃度進行處理液的濃度調整,即,進行處理液中之應濃度調整之成分的濃度調整。When the first processing liquid path is closed by the first valve mechanism and the second processing liquid path is opened by the second valve mechanism, the processing liquid does not flow through the first processing liquid path and does not pass through the first concentration. The processing liquid flows through the second processing liquid path and flows into the processing liquid adjustment unit through the second concentration meter. In this state, the processing liquid adjustment unit can perform the concentration adjustment of the processing liquid based on the measured concentration in the second concentration meter, that is, the concentration adjustment of the components in the processing liquid that should be adjusted in concentration.

又,本發明之基板處理裝置,具有:處理液生成裝置,是用以生成根據在濃度計之測定濃度而經過濃度調整的處理液;工作台,用以保持基板;驅動機構,用以使前述工作台旋轉;及處理液供給機構,將藉由前述處理液生成裝置生成之處理液供給到與前述工作台一起旋轉之前述基板的表面,前述處理液生成裝置具有:處理液調整部,用以調整前述處理液的濃度;第1處理液路,使處理液流向前述處理液調整部;第2處理液路,使處理液流向前述處理液調整部;第1濃度計,用以測定在前述第1處理液路流動之前述處理液的濃度,且前述濃度是在前述處理液調整部之濃度調整相關成分的濃度;第2濃度計,用以測定在前述第2處理液路流動之前述處理液的濃度,且前述濃度是應由前述第1濃度計測定濃度且在前述處理液調整部之濃度調整相關的成分之濃度;第1閥機構,用以進行前述第1處理液路的開閉;及第2閥機構,用以進行前述第2處理液路的開閉。In addition, the substrate processing apparatus of the present invention includes a processing liquid generating device for generating a processing liquid whose concentration is adjusted according to a measured concentration in a densitometer; a table for holding the substrate; and a driving mechanism for causing the foregoing The table is rotated; and a processing liquid supply mechanism supplies the processing liquid generated by the processing liquid generating device to the surface of the substrate rotated together with the table. The processing liquid generating device includes a processing liquid adjusting unit for: Adjusting the concentration of the processing liquid; a first processing liquid path to flow the processing liquid to the processing liquid adjusting section; a second processing liquid path to flow the processing liquid to the processing liquid adjusting section; and a first concentration meter for measuring the 1 The concentration of the processing liquid flowing in the processing liquid path, and the concentration is the concentration of the relevant components in the concentration adjustment section of the processing liquid adjusting section; the second concentration meter is used to measure the processing liquid flowing in the second processing liquid path And the aforementioned concentration is the concentration of a component whose concentration should be measured by the aforementioned first concentration meter and which is adjusted in the concentration adjustment of the processing solution adjusting section; A first valve mechanism is used to open and close the first processing liquid path; and a second valve mechanism is used to open and close the second processing liquid path.

發明效果 根據本發明之處理液生成裝置,可提升生成之處理液之濃度的信賴性。ADVANTAGE OF THE INVENTION According to the processing-solution production apparatus of this invention, the reliability of the density | concentration of the processing liquid produced can be improved.

又,根據本發明之基板處理裝置,可藉由以上述處理液生成裝置生成之處理液來處理基板。In addition, according to the substrate processing apparatus of the present invention, the substrate can be processed by the processing liquid generated by the processing liquid generating apparatus.

較佳實施例之詳細說明 以下,就本發明之實施形態,使用圖面進行說明。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, an embodiment of the present invention will be described using drawings.

包含本發明之實施之一形態之處理液生成裝置的基板處理裝置是如圖1所示般構成。A substrate processing apparatus including a processing liquid generating apparatus according to an embodiment of the present invention is configured as shown in FIG. 1.

圖1中,該基板處理裝置具有:2個處理液生成裝置、2系統之處理液供給(處理液供給機構)/回收系統、及旋轉裝置100。其中一個處理液生成裝置是構成為具有:第1供給槽11a、2個積分流量計14a、15a、2個調整閥16a、17a、第1泵18a、開閉閥19a、生成循環系統之2個三向閥21、22、上游側第1閥群12a、上游側第2閥群12b、第1濃度計側部20a、第2濃度計側部20b、下游側第1閥群13a、及下游側第2閥群13b。另一個處理液生成裝置構成為與前述其中一個處理液生成裝置共用生成循環系統之2個三向閥21、22、上游側第1閥群12a、上游側第2閥群12b;第1濃度計側部20a、第2濃度計側部20b、下游側第1閥群13a、及下游側第2閥群13b,除此之外具有:第2供給槽11b、2個積分流量計14b、15b、2個調整閥16b、17b、及第2泵18b及開閉閥19b。其中一個系統的處理液供給/回收系統是構成為:與前述之其中一個處理液生成裝置共用第1供給槽11a及第1泵18a,並且具有三向閥23、24及回收槽10。又,另一個系統的處理液供給/回收系統構成為與前述之另一個處理液生成裝置共用第2供給槽11b及第2泵18b,並且與前述之其中一個系統的處理液供給/回收系統共用回收槽10及2個三向閥23、24。In FIG. 1, the substrate processing apparatus includes two processing liquid generating devices, two systems of processing liquid supply (processing liquid supply mechanism) / recovery system, and a rotation device 100. One of the processing liquid generating devices is configured to include a first supply tank 11a, two integrating flow meters 14a, 15a, two adjusting valves 16a, 17a, a first pump 18a, an on-off valve 19a, and two generating systems. Directional valves 21, 22, first upstream valve group 12a, upstream second valve group 12b, first concentration meter side portion 20a, second concentration meter side portion 20b, downstream side first valve group 13a, and downstream side 2 valve group 13b. The other processing liquid generating device is configured to share the two three-way valves 21 and 22, the first upstream valve group 12a, and the second upstream valve group 12b of the circulation system with one of the foregoing processing liquid generating devices; the first concentration meter The side portion 20a, the second concentration meter side portion 20b, the downstream first valve group 13a, and the downstream second valve group 13b further include a second supply tank 11b, two integrating flow meters 14b, 15b, Two adjustment valves 16b, 17b, a second pump 18b, and an on-off valve 19b. The processing liquid supply / recovery system of one system is configured to share the first supply tank 11a and the first pump 18a with one of the processing liquid generating devices described above, and includes three-way valves 23, 24 and a recovery tank 10. In addition, the processing liquid supply / recovery system of the other system is configured to share the second supply tank 11b and the second pump 18b with the other processing liquid generating device, and to share the processing liquid supply / recovery system of one of the systems. The recovery tank 10 and two three-way valves 23 and 24.

如後述,在第1供給槽11a內經過濃度調整而生成的處理液是藉由三向閥23切換到第1供給槽11a側,且第1泵18a動作,而從第1供給槽11a通過三向閥23供給到旋轉裝置100內的噴嘴111,並從該噴嘴111吐出處理液(處理液供給機構)。在旋轉裝置100,設置有藉由馬達等之驅動機構112旋轉的支撐台110(工作台),且噴嘴111是配置成與其周緣部受支撐於支撐台110之半導體晶圓W對向。設置有從支撐台110之側方覆蓋下方的杯部115。從噴嘴111吐出之處理液(例如蝕刻液)施加於與支撐台110一起旋轉之半導體晶圓W的表面,藉由該處理液,處理(蝕刻處理)半導體晶圓W的表面。從旋轉之半導體晶圓W的表面飛散之使用過的處理液收容於杯部115內,進而,通過排出路徑(圖示略)而回收到回收槽10。接著,回收槽10內之使用過的處理液通過切換到第1供給槽11a側之三向閥24而返回到第1供給槽11a。As described later, the processing liquid generated by the concentration adjustment in the first supply tank 11a is switched to the first supply tank 11a side by the three-way valve 23, and the first pump 18a is operated, and the first supply tank 11a passes through the three The valve 23 is supplied to the nozzle 111 in the rotary device 100, and a processing liquid (processing liquid supply mechanism) is discharged from the nozzle 111. The rotating device 100 is provided with a support table 110 (table) rotated by a driving mechanism 112 such as a motor, and the nozzle 111 is arranged to face the semiconductor wafer W supported by the support table 110 at its peripheral portion. A cup portion 115 is provided to cover the lower side from the side of the support base 110. A processing liquid (e.g., an etching solution) discharged from the nozzle 111 is applied to the surface of the semiconductor wafer W that rotates together with the support table 110, and the surface of the semiconductor wafer W is processed (etched) by the processing liquid. The used processing liquid scattered from the surface of the rotating semiconductor wafer W is stored in the cup portion 115, and further collected in the recovery tank 10 through a discharge path (not shown). Next, the used processing liquid in the recovery tank 10 is returned to the first supply tank 11a by switching to the three-way valve 24 on the side of the first supply tank 11a.

另一方面,當2個三向閥23、24切換到第2供給槽11b側時,在第2供給槽11b內經過濃度調整而生成的處理液,藉由第2泵18b的動作,從第2供給槽11b通過三向閥23而供給到旋轉裝置100的噴嘴111(處理液供給機構)。而且,與前述同樣,從噴嘴111吐出而施加到在旋轉裝置100內旋轉之半導體晶圓W的表面,成為使用過的處理液回收到回收槽10,進而,從回收槽10通過三向閥24而回到第2供給槽11b。On the other hand, when the two three-way valves 23 and 24 are switched to the side of the second supply tank 11b, the processing liquid generated by the concentration adjustment in the second supply tank 11b is moved from the first pump 18b by the operation of the second pump 18b. The 2 supply tank 11 b is supplied to the nozzle 111 (processing liquid supply mechanism) of the rotary device 100 through the three-way valve 23. In the same manner as described above, the surface of the semiconductor wafer W spouted from the nozzle 111 and applied to the rotation device 100 is recovered into the recovery tank 10 as a used processing liquid, and further passes from the recovery tank 10 through the three-way valve 24 Then, it returns to the second supply tank 11b.

分成前述之第1供給槽11a與第2供給槽11b的2系統之處理液供給(處理液供給機構)/回收系統分別因應於各供給槽11a、11b內之處理液的狀態(量、濃度、雜質之量等),藉由三向閥23、24而適宜地切換。其結果是,旋轉裝置100中,可使適當狀態(濃度等)之處理液所進行之半導體晶圓W的表面處理繼續。The processing liquid supply (processing liquid supply mechanism) / recovery system of the two systems divided into the aforementioned first supply tank 11a and second supply tank 11b depends on the state (amount, concentration, and concentration) of the processing liquid in each supply tank 11a, 11b. The amount of impurities, etc.) is appropriately switched by the three-way valves 23 and 24. As a result, in the rotating device 100, the surface treatment of the semiconductor wafer W by the processing liquid in an appropriate state (concentration, etc.) can be continued.

其次,說明處理液生成裝置之具體構成。再者,2個處理液生成裝置除了共用上游側第1閥群12a、上游側第2閥群12b、下游側第1閥群13a、下游側第2閥群13b、第1濃度計側部20a、第2濃度計側部20b及2個三向閥21、22之外,具有複數個同類的構成零件,進行相同動作,因此說明包含第1供給槽11a的其中一個處理液生成裝置。Next, a specific configuration of the processing liquid generating device will be described. In addition, the two treatment liquid generating devices share the first upstream valve group 12a, the second upstream valve group 12b, the first downstream valve group 13a, the second downstream valve group 13b, and the first concentration meter side portion 20a. Since the second concentration meter side portion 20b and the two three-way valves 21 and 22 have a plurality of similar components and perform the same operation, one of the processing liquid generating devices including the first supply tank 11a will be described.

設置有積分流量計14a及調整閥16a的液路連接於第1供給槽11a,處理液(例如,作為蝕刻液之磷酸水溶液)的原液通過該液路而供給到第1供給槽11a。設置有積分流量計15a及調整閥17a之液路連接於第1供給槽11a,稀釋液(例如純水)通過該液路而供給到第1供給槽11a。The liquid path provided with the integral flow meter 14a and the adjustment valve 16a is connected to the first supply tank 11a, and a raw solution of a processing liquid (for example, an aqueous phosphoric acid solution as an etching solution) is supplied to the first supply tank 11a through the liquid path. The liquid path provided with the integral flow meter 15a and the adjustment valve 17a is connected to the first supply tank 11a, and the diluent (for example, pure water) is supplied to the first supply tank 11a through the liquid path.

形成有出自第1供給槽11a、通過第1泵18a及開閉閥19a而返回到第1供給槽11a的循環液路。又,形成有出自第1供給槽11a、經由第1泵18a、三向閥21、上游側第1閥群12a、第1濃度計側部20a、下游側第1閥群13a、及三向閥22而返回到第1供給槽11a的液路P1。以下,將該液路P1稱為第1循環液路P1(第1處理液路)。進而,形成有出自第1供給槽11a,經由第1泵18a、三向閥21、上游側第2閥群12b、第2濃度計側部20b、下游側第2閥群13b、及三向閥22而返回到第1供給槽11a的液路P2。以下,將該液路P2稱為第2循環液路P2(第2處理液路)。A circulating fluid path is formed from the first supply tank 11a and returned to the first supply tank 11a by the first pump 18a and the on-off valve 19a. In addition, a first supply tank 11a, a first pump 18a, a three-way valve 21, a first upstream valve group 12a, a first concentration meter side portion 20a, a first downstream valve group 13a, and a three-way valve are formed. 22 and returns to the liquid path P1 of the first supply tank 11a. Hereinafter, this liquid path P1 is referred to as a first circulation liquid path P1 (first processing liquid path). Furthermore, a first supply tank 11a is formed, and via a first pump 18a, a three-way valve 21, a second upstream valve group 12b, a second concentration meter side portion 20b, a second downstream valve group 13b, and a three-way valve 22 and returns to the liquid path P2 of the first supply tank 11a. Hereinafter, this liquid path P2 is referred to as a second circulation liquid path P2 (second processing liquid path).

上游側第1閥群12a、上游側第2閥群12b、下游側第1閥群13a及下游側第2閥群13b是如圖2A所示般構成。The upstream first valve group 12a, the upstream second valve group 12b, the downstream first valve group 13a, and the downstream second valve group 13b are configured as shown in FIG. 2A.

上游側第1閥群12a包含設置於從三向閥21延續之第1循環液路P1的開閉閥120a,上游側第2閥群12b包含設置於從三向閥21延續之第2循環液路P2的開閉閥120b。下游側第1閥群13a包含設置於第1循環液路P1的開閉閥130a,第1循環液路P1是通過第1濃度計側部20a而朝三向閥22延伸,下游側第2閥群13b包含設置於第2循環液路P2的開閉閥130b,第2循環液路P2通過第2濃度計側部20b而朝三向閥22延伸。The upstream first valve group 12 a includes an on-off valve 120 a provided on the first circulation liquid path P1 extending from the three-way valve 21, and the upstream second valve group 12 b includes a second circulation liquid path extending from the three-way valve 21. On-off valve 120b of P2. The first downstream valve group 13a includes an on-off valve 130a provided in the first circulation liquid path P1. The first circulation liquid path P1 extends to the three-way valve 22 through the first concentration meter side portion 20a, and the second valve group on the downstream side 13b includes an on-off valve 130b provided in the second circulation liquid path P2, and the second circulation liquid path P2 extends to the three-way valve 22 through the second concentration meter side portion 20b.

上游側第1閥群12a所包含的開閉閥120a與下游側第1閥群13a所包含的開閉閥130a之組,構成為進行第1循環液路P1(第1處理液路)之開閉的第1閥機構。又,上游側第2閥群12b所包含的開閉閥120b與下游側第2閥群13b所包含的開閉閥130b之組,構成為進行第2循環液路P2(第2處理液路)之開閉的第2閥機構。The group of the on-off valve 120a included in the upstream first valve group 12a and the on-off valve 130a included in the first downstream valve group 13a is configured to be the first to perform the opening and closing of the first circulation liquid path P1 (the first processing liquid path). 1 valve mechanism. The group of the on-off valve 120b included in the upstream second valve group 12b and the on-off valve 130b included in the second downstream valve group 13b is configured to open and close the second circulation liquid path P2 (second processing liquid path). 2nd valve mechanism.

雖然在圖1沒有顯示,但上游側第1閥群12a、上游側第2閥群12b、下游側第1閥群13a及下游側第2閥群13b包含進行其他液路之開閉的複數個開閉閥。具體而言,如圖2A所示,除了第1循環液路P1之外,形成有通過第1濃度計側部20a的2個液路Pc1、Pp1,除了第2循環液路P2之外,形成有通過第2濃度計側部20b的2個液路Pc2、Pp2。液路Pc1是從利用於第1濃度計側部20a之濃度計之校正的校正液之液源,通過第1濃度計側部20a而朝排出部延伸的液路,且構成第1校正液路Pc1。再者,上述校正液可使用與處理液同成分的液體。第1校正液路Pc1供給濃度已知的校正液。再者,只要至少通過濃度計時之校正液的濃度為已知即可,校正液可從校正液之液源直接供給,來自液源的校正液也可以是調整為預定濃度後才供給。液路Pc2是從同樣的校正液的液源通過第2濃度計側部20b而向排出部延伸的液路,且流經該液路Pc2之校正液也使用於第2濃度計側部20b中之濃度計的校正,構成第2校正液路Pc2。液路Pp1是從純水的液源通過第1濃度計側部20a而向排出部延伸的液路,且構成第1洗淨液路Pp1。液路Pp2是從同樣之純水液源通過第2濃度計側部20b而向排出部延伸的液路,且構成第2洗淨液路Pp2。Although not shown in FIG. 1, the upstream first valve group 12a, the upstream second valve group 12b, the downstream first valve group 13a, and the downstream second valve group 13b include a plurality of openings and closings for opening and closing other liquid paths. valve. Specifically, as shown in FIG. 2A, in addition to the first circulation liquid path P1, two liquid paths Pc1 and Pp1 passing through the first concentration meter side portion 20a are formed, and in addition to the second circulation liquid path P2, There are two liquid paths Pc2 and Pp2 passing through the second concentration meter side portion 20b. The liquid path Pc1 is a liquid path extending from the liquid source of the correction liquid used for the correction of the densitometer used in the first concentration meter side portion 20a to the discharge portion through the first concentration meter side portion 20a, and constitutes the first correction liquid path. Pc1. The correction liquid may be a liquid having the same composition as the processing liquid. The first correction liquid path Pc1 supplies a correction liquid having a known concentration. In addition, as long as the concentration of the calibration solution through the concentration measurement is known, the calibration solution can be directly supplied from the source of the calibration solution, and the calibration solution from the source can also be supplied after being adjusted to a predetermined concentration. The liquid path Pc2 is a liquid path extending from the liquid source of the same calibration solution to the discharge section through the second concentration meter side section 20b, and the calibration solution flowing through this liquid path Pc2 is also used in the second concentration meter side section 20b. The calibration of the densitometer constitutes a second calibration liquid path Pc2. The liquid path Pp1 is a liquid path extending from a liquid source of pure water to the discharge section through the first concentration meter side portion 20a, and constitutes a first cleaning liquid path Pp1. The liquid path Pp2 is a liquid path extending from the same pure water liquid source to the discharge portion through the second concentration meter side portion 20b, and constitutes a second cleaning liquid path Pp2.

上游側第1閥群12a包含:設置於第1洗淨液路Pp1的開閉閥121a、及設置於第1校正液路Pc1的開閉閥122a。下游側第1閥群13a也包含:設置於第1洗淨液路Pp1的開閉閥131a、及設置於第1校正液路Pc1的開閉閥132a。又,上游側第2閥群12b包含:設置於第2洗淨液路Pp2的開閉閥121b、及設置於第2校正液路Pc2的開閉閥122b。下游側第2閥群13b也包含:設置於第2洗淨液路Pp2的開閉閥131b、及設置於第2校正液路Pc2的開閉閥132b。The upstream-side first valve group 12 a includes an on-off valve 121 a provided on the first cleaning liquid path Pp1 and an on-off valve 122 a provided on the first correction liquid path Pc1. The downstream first valve group 13a also includes an on-off valve 131a provided in the first cleaning liquid path Pp1 and an on-off valve 132a provided in the first correction liquid path Pc1. The upstream second valve group 12b includes an on-off valve 121b provided in the second cleaning liquid path Pp2 and an on-off valve 122b provided in the second correction liquid path Pc2. The downstream second valve group 13b also includes an on-off valve 131b provided in the second cleaning liquid path Pp2 and an on-off valve 132b provided in the second correction liquid path Pc2.

上游側第1閥群12a之開閉閥122a、與下游側第1閥群13a之開閉閥132a的組構成為用以開閉第1校正液路Pc1的第3閥機構。上游側第2閥群12b之開閉閥122b、與下游側第2閥群13b之開閉閥132b的組是構成為用以開閉第2校正液路Pc2的第4閥機構。又,上游側第1閥群12a之開閉閥121a、與下游側閥群13a之開閉閥131a的組構成為用以開閉第1洗淨液路Pp1的第5閥機構,上游側第2閥群12b之開閉閥121b、與下游側第2閥群13b之開閉閥群131b的組構成為用以開閉第2洗淨液路Pp2的第6閥機構。The set of the on-off valve 122a of the upstream first valve group 12a and the on-off valve 132a of the first downstream valve group 13a is configured as a third valve mechanism for opening and closing the first correction liquid path Pc1. The set of the on-off valve 122b of the upstream second valve group 12b and the on-off valve 132b of the second downstream valve group 13b is a fourth valve mechanism configured to open and close the second correction liquid path Pc2. The set of the on-off valve 121a of the upstream first valve group 12a and the on-off valve 131a of the downstream valve group 13a is configured as a fifth valve mechanism for opening and closing the first cleaning liquid path Pp1, and the upstream second valve group The group of the on-off valve 121b of 12b and the on-off valve group 131b of the second valve group 13b on the downstream side is configured as a sixth valve mechanism for opening and closing the second cleaning liquid path Pp2.

第1濃度計側部20a是如圖2B所示般構成,又,第2濃度計側部20b是如圖2C所示般構成。The first concentration meter side portion 20a is configured as shown in FIG. 2B, and the second concentration meter side portion 20b is configured as shown in FIG. 2C.

如圖2B所示,第1濃度計側部20a具有:第1濃度計201a、上游側第1切換閥202a、及下游側第1切換閥203a。如前述,設有上游側第1閥群12a及下游側第1閥群13a的第1循環液路P1、第1校正液路Pc1及第1洗淨液路Pp1之3個液路在第1濃度計側部20a內,在上游側並列地連接於上游第1切換閥202a,並且在下游側並列地連接於下游側第1切換閥203a,藉此集合成將上游側第1切換閥202a與下游側第1切換閥203a結合的1個流路Pm1。而且,在流路Pm1之部分設置有第1濃度計201a。As shown in FIG. 2B, the first concentration meter side portion 20a includes a first concentration meter 201a, an upstream first switching valve 202a, and a downstream first switching valve 203a. As described above, the three liquid paths provided with the first circulation liquid path P1, the first correction liquid path Pc1, and the first cleaning liquid path Pp1 of the upstream first valve group 12a and the downstream first valve group 13a are in the first position. In the concentration meter side portion 20a, the upstream first switching valve 202a is connected in parallel on the upstream side and the downstream first switching valve 203a is connected in parallel on the downstream side, thereby integrating the upstream first switching valve 202a and One flow path Pm1 connected to the downstream-side first switching valve 203a. A first concentration meter 201a is provided in a portion of the flow path Pm1.

在如此之第1濃度計側部20a中,藉由上游側第1切換閥202a及下游側第1切換閥203a的切換動作,液路Pm1連通到第1循環液路P1時,在第1循環液路P1流動之處理液成為在液路Pm1流動。藉此,可藉由第1濃度計201a測量在液路Pm1流動之處理液的濃度,也就是測量在第1循環液路P1流動之處理液的濃度。又,藉由上游側第1切換閥202a及下游側第1切換閥203a的切換動作,當流路Pm1連通至第1校正液路Pc1時,在第1校正液路Pc1流動的校正液會在液路Pm1內流動,可進行第1濃度計201a的校正。進而,藉由上游側第1切換閥201a及下游側第1切換閥203a的切換動作,當流路Pm1連通到第1洗淨液路Pp1時,在第1洗淨液路Pp1流動的洗淨液成為在液路Pm1流動,藉由該洗淨液,可洗淨液路Pm1及第1濃度計201a。In the first concentration meter side portion 20a as described above, when the switching operation of the upstream first switching valve 202a and the downstream first switching valve 203a causes the liquid path Pm1 to communicate with the first circulation liquid path P1, the first circulation The processing liquid flowing through the liquid path P1 flows through the liquid path Pm1. Thereby, the concentration of the processing liquid flowing in the liquid path Pm1 can be measured by the first concentration meter 201a, that is, the concentration of the processing liquid flowing in the first circulation liquid path P1 can be measured. In addition, due to the switching operation of the first switching valve 202a on the upstream side and the first switching valve 203a on the downstream side, when the flow path Pm1 communicates with the first correction liquid path Pc1, the correction liquid flowing in the first correction liquid path Pc1 is in The flow in the liquid path Pm1 allows the first concentration meter 201a to be calibrated. Furthermore, by the switching operation of the upstream first switching valve 201a and the downstream first switching valve 203a, when the flow path Pm1 communicates with the first cleaning liquid path Pp1, the cleaning flowing in the first cleaning liquid path Pp1 The liquid flows through the liquid path Pm1, and the liquid path Pm1 and the first concentration meter 201a can be cleaned by the cleaning liquid.

又,如圖2C所示,第2濃度計側部20b具有:第2濃度計201b、上游側第2切換閥202b、及下游側第2切換閥203b。如前述,設置有上游側第2閥群12b及下游側第2閥群13b的第2循環液路P2、第2校正液路Pc2及第2洗淨液路Pp2的3個液路在第2濃度計側部20b內,於上游側並列地連接於上游側第2切換閥202b,並且於下游側並列地連接於下游側第2切換閥203b,集合成將該等上游側第2切換閥202b與下游側第2切換閥203b結合的液路Pm2。而且,在液路Pm2之部分設置有第2濃度計201b。As shown in FIG. 2C, the second concentration meter side portion 20b includes a second concentration meter 201b, a second upstream switching valve 202b, and a second downstream switching valve 203b. As described above, the three liquid paths provided with the second circulation liquid path P2, the second correction liquid path Pc2, and the second cleaning liquid path Pp2 of the upstream second valve group 12b and the downstream second valve group 13b are in the second position. In the concentration meter side portion 20b, the upstream side second switching valve 202b is connected in parallel on the upstream side, and the downstream side second switching valve 203b is connected in parallel on the downstream side. The liquid path Pm2 connected to the downstream second switching valve 203b. A second concentration meter 201b is provided in a portion of the liquid path Pm2.

在如此的第2濃度計側部20b中,藉由上游側第2切換閥202b及下游側第2切換閥203b的切換動作,當液路Pm2連通到第2循環液路P2時,在第2循環液路P2流動的處理液成為在液路Pm2流動,可藉由第2濃度計201b測量在液路Pm2流動之處理液的濃度。又,藉由上游側第2切換閥202b及下游側第2切換閥203b的切換動作,當液路Pm2連通到第2校正液路Pc2時,在第2校正液路Pc2流動的校正液成為在液路Pm2流動,可進行第2濃度計201a的校正。進而,藉由上游側第2切換閥202b及下游側第2切換閥203b的切換動作,當流路Pm2連通到第2洗淨液路Pp1時,在第2洗淨液路Pp2流動的洗淨液成為在液路Pm2流動,可藉由該洗淨液,洗淨液路Pm2及第2濃度計201b。In such a second concentration meter side portion 20b, the switching operation of the upstream second switching valve 202b and the downstream second switching valve 203b causes the liquid path Pm2 to communicate with the second circulating liquid path P2, and the second The processing liquid flowing in the circulating liquid path P2 flows in the liquid path Pm2, and the concentration of the processing liquid flowing in the liquid path Pm2 can be measured by the second concentration meter 201b. In addition, by the switching operation of the upstream second switching valve 202b and the downstream second switching valve 203b, when the liquid path Pm2 communicates with the second correction liquid path Pc2, the correction liquid flowing in the second correction liquid path Pc2 becomes the The liquid path Pm2 flows, and the second concentration meter 201a can be calibrated. Furthermore, by the switching operation of the upstream second switching valve 202b and the downstream second switching valve 203b, when the flow path Pm2 communicates with the second cleaning liquid path Pp1, the cleaning flowing in the second cleaning liquid path Pp2 The liquid flows through the liquid path Pm2, and the liquid path Pm2 and the second concentration meter 201b can be cleaned by the cleaning liquid.

設置於第1濃度計側部20a的第1濃度計201a與設置於第2濃度計側部20b的第2濃度計201b是藉由不同的測定原理,測定在該等濃度計側部20a、20b流動之處理液(校正液)的濃度,並輸出對應於其測定濃度的測定信號。也就是說,第1濃度計201a與第2濃度計201b是根據使各自在第1循環液路P1及第2循環液路P2流動的處理液(更詳而言之是分別在液路Pm1及Pm2的處理液)之濃度不同的測定原理而測定。第1濃度計201a(參照圖2B)可使用例如、根據作為對象之液體的電導率測定濃度者。第2濃度計201b是如圖2C所示,由隔著液路Pm2之透明部TP設置之雷射光源與受光部構成,可使用以光學方式測定作為對象之液體的濃度者。第1濃度計201a及第2濃度計201b分別可使用其他如利用超音波測定濃度者、利用紅外線測定濃度者等。The first densitometer 201a provided in the first densitometer side portion 20a and the second densitometer 201b provided in the second densitometer side portion 20b are measured on the densitometer side portions 20a and 20b by different measuring principles. The concentration of the flowing processing solution (calibration solution) is output, and a measurement signal corresponding to the measurement concentration is output. In other words, the first concentration meter 201a and the second concentration meter 201b are based on the treatment liquids that flow through the first circulation liquid path P1 and the second circulation liquid path P2 (more specifically, the liquid paths Pm1 and Pm2 treatment solution) was measured using different measurement principles. The first concentration meter 201a (see FIG. 2B) can be used, for example, to measure the concentration based on the electrical conductivity of the target liquid. As shown in FIG. 2C, the second concentration meter 201b is composed of a laser light source and a light-receiving portion provided through the transparent portion TP of the liquid path Pm2, and can be used to optically measure the concentration of the target liquid. The first concentration meter 201a and the second concentration meter 201b can be used, for example, those who measure the concentration by using ultrasound, those who measure the concentration by using infrared rays, and the like.

又,第1濃度計201a與第2濃度計201b是測定在處理液中之第1供給槽11a或第2供給槽11b(包含於處理液調整部)之調整濃度相關的相同成分之濃度作為該處理液的濃度者。例如,若處理液為磷酸水溶液的蝕刻處理液,該蝕刻處理液中之磷酸濃度調整作為該處理液之濃度調整進行時,第1濃度計201a與第2濃度計201b測定蝕刻處理液中之磷酸濃度作為該處理液的濃度。又,一般而言,即使處理液含有複數個成分,第1濃度計201a與第2濃度計201b測定在第1供給槽11a或第2供給槽11b(包含於處理液調整部)之調整濃度相關的相同成分之濃度作為處理液的濃度。In addition, the first concentration meter 201a and the second concentration meter 201b measure the concentration of the same component related to the adjusted concentration of the first supply tank 11a or the second supply tank 11b (included in the processing liquid adjustment unit) in the processing liquid as the The concentration of the treatment liquid. For example, if the treatment solution is an etching treatment solution of an aqueous phosphoric acid solution, and the phosphoric acid concentration adjustment in the etching treatment solution is performed as the concentration adjustment of the treatment solution, the first concentration meter 201a and the second concentration meter 201b measure the phosphoric acid in the etching treatment solution. The concentration is taken as the concentration of the treatment liquid. In general, even if the processing liquid contains a plurality of components, the first concentration meter 201a and the second concentration meter 201b measure the adjusted concentration in the first supply tank 11a or the second supply tank 11b (included in the processing liquid adjustment unit). The concentration of the same component is used as the concentration of the treatment liquid.

又,第1濃度計201a及第2濃度計201b之至少任一者是可測定複數個成分(例如,磷酸濃度與水分濃度)的濃度。若其中一個濃度計進行包含濃度調整有關的成分之複數個成分的濃度測定,另一個濃度計只要進行至少前述濃度調整有關之成分的濃度測定。藉此,第1濃度計201a及第2濃度計201b之雙方中,至少可測定前述濃度調整有關的成分之濃度測定,根據第1濃度計201a及第2濃度計201b之至少一者的測定濃度,可調整處理液中的成分濃度。In addition, at least one of the first concentration meter 201a and the second concentration meter 201b is a concentration capable of measuring a plurality of components (for example, a phosphoric acid concentration and a water concentration). If one of the densitometers performs concentration measurement of a plurality of components including a component related to concentration adjustment, the other densitometer only needs to perform concentration measurement of at least the component related to concentration adjustment. Thereby, at least both the first concentration meter 201a and the second concentration meter 201b can measure the concentration measurement of at least the components related to the concentration adjustment, and based on the measured concentration of at least one of the first concentration meter 201a and the second concentration meter 201b. , You can adjust the component concentration in the processing solution.

如前述,構成之處理液生成裝置的控制系統是如圖3所示般構成。As described above, the control system of the processing liquid generating device is configured as shown in FIG. 3.

圖3中,該處理液供給裝置具有控制單元30。控制單元30是控制在第1濃度計側部20a(參照圖2B)中,第1濃度計側部20a之上游側第1切換閥202a及下游側第1切換閥203a,使液路Pm1連通到第1循環液路P1,在第2濃度計側部20b(參照圖2C)中,液路Pm2連通到第2循環路徑P2,並且驅動控制第2濃度計側部20b之上游側第2切換閥202b及下游側第2切換閥203b。在該狀態下,控制單元30監視來自積分流量計14a的處理液(例如,為磷酸水溶液的蝕刻處理液)之流量資訊及來自積分流量計15a之稀釋液(例如純水)的流量資訊,並且根據在第1濃度計側部20a(第1濃度計201a:參照圖2B)及第2濃度計側部20b(第2濃度計201b:參照圖2C)的測定濃度(例如,磷酸的測定濃度),控制用以驅動調整閥16a、17a的驅動電路31a,前述調整閥16a、17a是設置於用以將處理液及稀釋液供給到第1供給槽11a的2個液路。藉此,調整在第1供給槽11a內生成之處理液的濃度(例如,磷酸濃度)。又,控制單元30監視來自積分流量計14b之處理液的流量資訊及來自積分流量計15b之稀釋液的流量資訊,並且根據在第1濃度計側部20a及第2濃度計側部20b之測定值,控制用以驅動調整閥16b、17b的驅動電路31b,前述調整閥16b、17b是設置於用以將處理液及稀釋液供給到第2供給槽11b的2個液路。藉此,調整在第2供給槽11b內生成之處理液的濃度。再者,關於該濃度調整之詳情於後敘述。In FIG. 3, the processing liquid supply device includes a control unit 30. The control unit 30 controls the first concentration meter side portion 20a (see FIG. 2B), and the first concentration meter side portion 20a upstream of the first switching valve 202a and the downstream side first switching valve 203a communicates the liquid path Pm1 to In the first circulation liquid path P1, in the second concentration meter side portion 20b (see FIG. 2C), the liquid path Pm2 communicates with the second circulation path P2, and the second switching valve on the upstream side of the second concentration meter side portion 20b is driven and controlled. 202b and the second downstream switching valve 203b. In this state, the control unit 30 monitors the flow rate information of the processing liquid (for example, an etching treatment liquid that is an aqueous phosphoric acid solution) from the integrating flowmeter 14a and the flow rate information of the diluent (for example, pure water) from the integrating flowmeter 15a, and Based on the measured concentration (for example, the measured concentration of phosphoric acid) based on the first concentration meter side portion 20a (first concentration meter 201a: see FIG. 2B) and the second concentration meter side portion 20b (second concentration meter 201b: see FIG. 2C). The driving circuit 31a for controlling the adjustment valves 16a and 17a is controlled, and the adjustment valves 16a and 17a are provided in two liquid paths for supplying the processing liquid and the diluent to the first supply tank 11a. Thereby, the concentration (for example, phosphoric acid concentration) of the processing liquid generated in the first supply tank 11a is adjusted. In addition, the control unit 30 monitors the flow rate information of the processing liquid from the integrating flowmeter 14b and the flow rate information of the diluent from the integrating flowmeter 15b, and based on the measurement at the first concentration meter side portion 20a and the second concentration meter side portion 20b. The control circuit 31b controls the drive circuits 31b for driving the adjustment valves 16b and 17b. The adjustment valves 16b and 17b are provided in two liquid paths for supplying the processing liquid and the diluent to the second supply tank 11b. Thereby, the density | concentration of the processing liquid produced in the 2nd supply tank 11b is adjusted. The details of the density adjustment will be described later.

控制單元30控制用以切換驅動處理液供給/回收系統之三向閥23的驅動電路34a,以將處理液對旋轉裝置100(噴嘴111)的供給源切換成第1供給槽11a及第2供給槽11b之任一者。又,控制單元30控制用以切換驅動處理液供給/回收系統之三向閥24的驅動電路34a,以將從旋轉裝置100返回到回收槽10之使用過的處理液之傳送目的地切換成第1供給槽11a及第2供給槽11b之任一者。The control unit 30 controls the driving circuit 34a for switching the three-way valve 23 of the processing liquid supply / recovery system to switch the supply source of the processing liquid to the rotary device 100 (the nozzle 111) to the first supply tank 11a and the second supply. Either of the slots 11b. In addition, the control unit 30 controls the driving circuit 34a for switching the three-way valve 24 for driving the processing liquid supply / recovery system to switch the transfer destination of the used processing liquid returned from the rotary device 100 to the recovery tank 10 to the first Either the first supply tank 11a or the second supply tank 11b.

控制單元30控制用以進行生成循環系統之三向閥21、22之切換控制的驅動電路34b,以將通過第1濃度計側部20a及第2濃度計側部20b且循環而應濃度調整的處理液的貯留源切換成第1供給槽11a及第2供給槽11b之任一者。在其濃度調整時,控制單元30控制驅動電路33a,驅動電路33a是進行設置於第1循環液路P1(參照圖2A)之上游側第1閥群12a之開閉閥120a及下游側第1閥群13a之開閉閥130a的開閉驅動。又,此時,控制單元30控制驅動電路33b,驅動電路33b進行設置於第2循環液路P2(參照圖2A)之上游側第2閥群12b之開閉閥120b及下游側第2閥群13b之開閉閥130b的開閉驅動。The control unit 30 controls the drive circuit 34b for performing switching control of the three-way valves 21 and 22 for generating a circulation system so as to circulate through the first concentration meter side portion 20a and the second concentration meter side portion 20b and adjust the concentration to be adjusted. The storage source of the processing liquid is switched to either the first supply tank 11a or the second supply tank 11b. During the concentration adjustment, the control unit 30 controls the drive circuit 33a. The drive circuit 33a performs an on-off valve 120a and a first valve on the downstream side of the first valve group 12a on the upstream side of the first circulation liquid path P1 (see FIG. 2A). The opening and closing valve 130a of the group 13a is driven. At this time, the control unit 30 controls the drive circuit 33b, and the drive circuit 33b performs an on-off valve 120b and a second valve group 13b on the upstream side of the second valve group 12b and the second valve group 13b on the second circulation liquid path P2 (see FIG. 2A). The opening and closing valve 130b is driven.

進而,控制單元30在第1濃度計側部20a之第1濃度計201a之校正時,控制驅動電路33a,驅動電路33a是進行設置於第1校正液路Pc1(參照圖2)之上游側第1閥群12a之開閉閥122a及下游側第1閥群13a之開閉閥132a的開閉驅動、及設置於第1洗淨液路Pp1(參照圖2)之上游側第1閥群12a之開閉閥121a及下游側第1閥群13a之開閉閥131a的開閉驅動。此時,控制單元30在第1濃度計側部20a(參照圖2B)中,進行上游側第1切換閥202a及下游側第1切換閥203b的切換控制,以切換液路Pm1連通至第1校正液路Pc1的狀態、及液路Pm1連通至第1洗淨液路Pp1的狀態。進而,又,控制單元30在第2濃度計側部20b之第2濃度計201b之校正時,控制驅動電路33b,進行設置於第2校正液路Pc2(參照圖2)之上游側第2閥群12b之開閉閥122b及下游側第2閥群13b之開閉閥132b的開閉驅動、及設置於第2洗淨液路Pp2(參照圖2A)之上游側第2閥群12b之開閉閥121b及下游側第2閥群13b之開閉閥131b的開閉驅動。此時,控制單元30在第2濃度計側部20b(參照圖2C)中,進行上游側第2切換閥202b及下游側第2切換閥203b的切換控制,切換液路Pm2連通到第2校正液路Pc2的狀態、及液路Pm2連通到第2洗淨液路Pp2的狀態。又,控制單元30控制使第1泵18a驅動的驅動電路35a及使第2泵18b驅動的驅動電路35b。又,控制單元30控制用以進行開閉閥19a之開閉驅動的驅動電路32a及用以進行開閉閥19b之開閉驅動的驅動電路32b。Furthermore, the control unit 30 controls the driving circuit 33a during the calibration of the first concentration meter 201a of the first concentration meter side portion 20a, and the driving circuit 33a is provided on the upstream side of the first calibration liquid path Pc1 (see FIG. 2). On-off valve 122a of the first valve group 12a and on-off valve 132a of the first valve group 13a on the downstream side, and on-off valve of the first valve group 12a on the upstream side of the first cleaning liquid path Pp1 (see FIG. 2) 121a and the on-off drive of the on-off valve 131a of the first downstream valve group 13a. At this time, the control unit 30 performs switching control of the upstream first switching valve 202a and the downstream first switching valve 203b in the first concentration meter side portion 20a (see FIG. 2B) to switch the liquid path Pm1 to the first The state of the correction liquid path Pc1 and the state of the liquid path Pm1 communicating with the first cleaning liquid path Pp1. Furthermore, the control unit 30 controls the drive circuit 33b to perform the second valve on the upstream side of the second calibration liquid path Pc2 (see FIG. 2) during the calibration of the second concentration meter 201b of the second concentration meter side portion 20b. The on-off valve 122b of the group 12b and the on-off valve 132b of the second valve group 13b on the downstream side, and the on-off valve 121b and the second valve group 12b on the upstream side of the second cleaning liquid path Pp2 (see FIG. 2A) and Opening and closing driving of the on-off valve 131b of the downstream second valve group 13b. At this time, the control unit 30 performs switching control of the upstream second switching valve 202b and the downstream second switching valve 203b in the second concentration meter side portion 20b (see FIG. 2C), and the switching liquid path Pm2 is communicated to the second correction. The state of the liquid path Pc2 and the state in which the liquid path Pm2 communicates with the second cleaning liquid path Pp2. In addition, the control unit 30 controls a drive circuit 35a that drives the first pump 18a and a drive circuit 35b that drives the second pump 18b. The control unit 30 controls a drive circuit 32a for driving the on-off valve 19a to open and close and a drive circuit 32b for driving the on-off valve 19b to open and close.

控制單元30隨著圖4A及圖4B所示之順序,進行在第1供給槽11a及第2供給槽11b生成之處理液(例如,作為蝕刻處理液之磷酸水溶液)之濃度調整相關的處理。再者,以下,是就在第1供給槽11a生成之處理液之濃度調整相關的處理進行說明,但就在第2供給槽11b生成之處理液之濃度調整相關的處理以同樣的順序進行。The control unit 30 performs processing related to the concentration adjustment of the processing liquid (for example, an aqueous phosphoric acid solution as an etching processing liquid) generated in the first supply tank 11a and the second supply tank 11b in the order shown in FIGS. 4A and 4B. In the following, the processes related to the concentration adjustment of the processing liquid generated in the first supply tank 11a will be described, but the processes related to the concentration adjustment of the processing liquid generated in the second supply tank 11b will be performed in the same order.

控制單元30監視來自積分流量計14a、15a的流量資訊,令調整閥16a、17a為開狀態,預定量之處理液(原液)及稀釋液貯存於第1供給槽11a時,令調整閥16a、17a為閉狀態。然後,控制單元30令開閉閥19a為開狀態,且令三向閥21、23之第1供給槽11a側為關閉之狀態,使第1泵18a驅動。藉此,出自第1供給槽11a的處理液及稀釋液通過設置有開閉閥19a的循環液路而回到第1供給槽11a並循環。在其過程中,在第1供給槽11a內生成經過處理液與稀釋液混合且稀釋化的處理液。在第1供給槽11a內,使處理液與稀釋液混合後而調整處理液之濃度(例如,蝕刻液中之磷酸濃度)的機制整體、也就是說在第1供給槽11a內生成處理液時相關的構成發揮處理液調整部的功能。The control unit 30 monitors the flow information from the integral flow meters 14a and 15a, and makes the adjustment valves 16a and 17a in an open state. When a predetermined amount of processing liquid (original liquid) and diluent are stored in the first supply tank 11a, the adjustment valves 16a, 17a is closed. Then, the control unit 30 sets the on-off valve 19a to an open state, and sets the first supply tank 11a side of the three-way valves 21 and 23 to a closed state to drive the first pump 18a. Thereby, the processing liquid and the dilution liquid from the 1st supply tank 11a return to the 1st supply tank 11a and circulate through the circulation liquid path provided with the on-off valve 19a. During this process, a treatment liquid in which the treatment liquid and the diluent are mixed and diluted is generated in the first supply tank 11a. In the first supply tank 11a, the entire mechanism of mixing the processing liquid with the diluent and adjusting the concentration of the processing liquid (for example, the concentration of phosphoric acid in the etching solution), that is, when the processing liquid is generated in the first supply tank 11a The related configuration functions as a processing liquid adjustment unit.

然後,控制單元30將開閉閥19a切換成閉狀態,並且將循環系統之三向閥21、22切換成第1供給槽11a側。又,此時,控制單元30令設置於第1循環液路P1的上游側第1閥群12a之開閉閥120a及下游側第1閥群13a之開閉閥130a(第1閥機構:參照圖2A)為開狀態,並且令設置於第2循環液路P2的上游側第2閥群12b之開閉閥120b及下游側第2閥群13b之開閉閥130b(第2閥機構:參照圖2A)為開狀態。在該狀態下,出自第1供給槽11a的處理液並列地通過第1循環液路P1及第2循環液路P2返回到第1供給槽11a並且循環。Then, the control unit 30 switches the on-off valve 19a to the closed state, and switches the three-way valves 21 and 22 of the circulation system to the side of the first supply tank 11a. At this time, the control unit 30 causes the on-off valve 120a of the first valve group 12a on the upstream side and the on-off valve 130a of the first valve group 13a on the downstream side (first valve mechanism: see FIG. 2A) ) Is open, and the on-off valve 120b (second valve mechanism: see FIG. 2A) of the second valve group 12b on the upstream side and the second valve group 13b on the downstream side of the second circulation liquid path P2 are set as follows: On. In this state, the processing liquid from the first supply tank 11a is returned to the first supply tank 11a and circulated in parallel through the first circulation liquid path P1 and the second circulation liquid path P2.

如此,當處理液通過第1循環液路P1及第2循環液路P2的循環開始時,控制單元30依照圖4A及圖4B所示之順序而開始處理。In this way, when the circulation of the processing liquid through the first circulation liquid path P1 and the second circulation liquid path P2 is started, the control unit 30 starts processing in the order shown in FIGS. 4A and 4B.

圖4A中,控制單元30確認第1濃度計側部20a(第1濃度計201a:參照圖2B)及第2濃度計側部20b(第2濃度計201b:參照圖2C)是否在校正中(S11、S12),若第1濃度計側部20a及第2濃度計側部20b之雙方不是在校正中(在S11為NO,在S12為NO),則取得根據來自第1濃度計201a(第1濃度計側部20a)之測定信號的濃度C1、及取得根據來自第2濃度計201b(第2濃度計側部20b)之測定信號的濃度C2(S13、S14)。而且,控制單元30根據該等2個測定濃度C1、C2,判定第2濃度計201b是否正常(S15:第2判定部(處理液用閥控制部))、及第1濃度計201a是否正常(S16:第1判定部(處理液用閥控制部))。In FIG. 4A, the control unit 30 checks whether the first concentration meter side portion 20a (first concentration meter 201a: see FIG. 2B) and the second concentration meter side portion 20b (second concentration meter 201b: see FIG. 2C) are being calibrated ( (S11, S12), if both the first concentration meter side 20a and the second concentration meter side 20b are not in calibration (NO in S11, NO in S12), the data obtained from the first densitometer 201a (No. 1 The concentration C1 of the measurement signal of the densitometer side portion 20a) and the concentration C2 obtained based on the measurement signal from the second densitometer 201b (the second densitometer side portion 20b) (S13, S14). Then, the control unit 30 determines whether the second concentration meter 201b is normal based on the two measured concentrations C1 and C2 (S15: the second determination unit (valve control unit for processing liquid)) and whether the first concentration meter 201a is normal ( S16: The first determination unit (valve control unit for processing liquid)).

第1濃度計201a與第2濃度計201b測定了相同處理液之濃度(具體而言,蝕刻處理液中之磷酸濃度),測定濃度本來相同。因此,在第1濃度計201a之測定濃度C1與在第2濃度計201b之測定濃度C2的差若在預先設定的預定範圍內,可判定為第1濃度計201a與第2濃度計201b為正常。另一方面,循環之處理液的濃度急遽地變動的可能性較低。而且,第1濃度計201a及第2濃度計201b之雙方同時故障的可能性也較低。特別是,第1濃度計201a之濃度測定原理與第2濃度計201b之濃度測定原理不同,所以在相同環境下使用的第1濃度計201a與第2濃度計201b同時故障的可能性更低。因此,在其中一個濃度計之測定濃度的推移已穩定的狀態下,若在另一個濃度計之測定濃度急遽地變動(例如,從其中一個濃度計與另一個濃度計分別得到之測定濃度的差超出預先設定的預定範圍,而且若另一個濃度計測定之濃度每隔單位時間的變動幅度超過預先設定之容許值時,或者由另一個濃度計進行測定濃度每隔單位時間的變動幅度超出預先設定之容許值時),可判定為其另一個濃度計不正常。也就是說,本實施形態中,關於濃度計具有自我診斷功能。再者,若第1濃度計201a之測定濃度C1與第2濃度計201b之測定濃度C2皆急遽地變動時,若測定濃度C1與C2之差在預先設定之容許範圍內,第1濃度計201a、第2濃度計201b皆正常,可判定在第1供給槽11a之處理液的濃度調整有狀況。The first concentration meter 201a and the second concentration meter 201b measured the concentration of the same treatment liquid (specifically, the phosphoric acid concentration in the etching treatment liquid), and the measured concentrations were originally the same. Therefore, if the difference between the measured concentration C1 of the first concentration meter 201a and the measured concentration C2 of the second concentration meter 201b is within a predetermined range set in advance, it can be determined that the first concentration meter 201a and the second concentration meter 201b are normal. . On the other hand, there is a low possibility that the concentration of the circulating treatment liquid will rapidly change. In addition, the possibility that both the first density meter 201a and the second density meter 201b will fail at the same time is low. In particular, the principle of measuring the concentration of the first concentration meter 201a is different from the principle of measuring the concentration of the second concentration meter 201b. Therefore, it is less likely that the first concentration meter 201a and the second concentration meter 201b used in the same environment will fail at the same time. Therefore, in a state where the measured concentration of one of the densitometers has stabilized, if the measured concentration of the other densitometer is rapidly changed (for example, the difference between the measured concentrations obtained from one of the densitometers and the other of the densitometers) It exceeds the predetermined range, and if the fluctuation range of the concentration measured by another densitometer per unit time exceeds the preset allowable value, or the fluctuation range of the measured concentration by the other densitometer per unit time exceeds the preset range Allowable value), it can be determined that the other densitometer is abnormal. That is, in this embodiment, the concentration meter has a self-diagnostic function. In addition, if the measured concentration C1 of the first concentration meter 201a and the measured concentration C2 of the second concentration meter 201b are rapidly changed, if the difference between the measured concentrations C1 and C2 is within a preset allowable range, the first concentration meter 201a Both the second concentration meter 201b is normal, and it can be determined that the concentration of the processing liquid in the first supply tank 11a is in a state of being adjusted.

當判定第2濃度計201b及第1濃度計201a雙方為正常時(在S15為YES,在S16為YES),控制單元30根據來自第1濃度計201a的測定濃度C1進行處理液的濃度調整處理(S17)。具體而言,控制單元30一面監視在積分流量計14a、15b的流量資訊,一面調整調整閥16a、17a的開閉狀態,以使測定濃度C1成為目標濃度。然後,控制單元30判定是否滿足用以調整處理液之濃度的循環結束的條件,例如,是否滿足在經過預定時間、或者測定濃度C1到達以目標濃度為中心之預定濃度範圍等的條件(S18)。若判定為不滿足使用以調整處理液濃度的循環結束的條件時(在S18為NO),控制單元30隨著與上述之順序相同的順序(S11~S18)而執行處理。而且,控制單元30在第1濃度計201a及第2濃度計201b為正常的狀況中,依照同樣的順序(S11~S18)重複執行其處理。其結果是,根據在第1濃度計201a之測定濃度C1,在第1供給槽11a(處理液調整部)內,進行處理液的濃度調整(具體而言,調整蝕刻處理液中的磷酸濃度),生成調整成預先設定之目標濃度的處理液(具體而言,磷酸濃度調整成目標濃度的蝕刻處理液)。而且,當如下條件:在用以調整處理液濃度之循環開始後經過預定時間、或者測定目標C1達到以目標濃度為中心之預定濃度範圍等用以調整處理液濃度之循環的條件滿足時(在S18為YES),控制單元30使第1泵18a停止,將設置在第1循環液路P1之上游側第1閥群12a的開閉閥120a及下游側第1閥群13a的開閉閥130a(第1閥機構:參照圖2A)切換為閉狀態,並且將設置於第2循環液路P2之上游側第2閥群12b的開閉閥120b及下游側第2閥群13b的開閉閥130b(第2閥機構:參照圖2A)切換為閉狀態。藉此,停止用以調整第1供給槽11a內之處理液濃度的循環。When it is determined that both the second concentration meter 201b and the first concentration meter 201a are normal (YES at S15 and YES at S16), the control unit 30 performs a concentration adjustment process of the processing liquid based on the measured concentration C1 from the first concentration meter 201a. (S17). Specifically, the control unit 30 monitors the flow rate information of the integrating flow meters 14a and 15b and adjusts the opening and closing states of the adjustment valves 16a and 17a so that the measured concentration C1 becomes the target concentration. Then, the control unit 30 determines whether the conditions for the end of the cycle for adjusting the concentration of the processing liquid are satisfied, for example, whether the conditions for measuring the concentration C1 to reach a predetermined concentration range centered on the target concentration after a predetermined time elapses (S18) . If it is determined that the conditions for the end of the cycle for adjusting the concentration of the processing liquid are not satisfied (NO at S18), the control unit 30 executes processing in the same order (S11 to S18) as the above-mentioned order. Then, the control unit 30 repeatedly executes its processing in the same order (S11 to S18) in a state where the first concentration meter 201a and the second concentration meter 201b are normal. As a result, based on the measured concentration C1 in the first concentration meter 201a, the concentration of the processing liquid is adjusted in the first supply tank 11a (the processing liquid adjustment unit) (specifically, the phosphoric acid concentration in the etching processing liquid is adjusted). To generate a treatment liquid adjusted to a predetermined target concentration (specifically, an etching treatment liquid whose phosphoric acid concentration is adjusted to a target concentration). Furthermore, when the following conditions are satisfied: a predetermined time elapses after the cycle for adjusting the concentration of the processing liquid has elapsed, or a condition for adjusting the concentration of the processing liquid has been satisfied, such as when the measurement target C1 reaches a predetermined concentration range centered on the target concentration S18 is YES), the control unit 30 stops the first pump 18a, and opens and closes the on-off valve 120a and the on-off valve 130a of the first valve group 12a on the upstream side and the first valve group 13a of the downstream side valve group 13a (the 1 valve mechanism: refer to FIG. 2A) is switched to the closed state, and the on-off valve 120b and the on-off valve 130b (the second valve group 13b) of the second valve group 12b on the upstream side of the second circulation liquid path P2 Valve mechanism: Refer to FIG. 2A) to switch to the closed state. Thereby, the circulation for adjusting the concentration of the processing liquid in the first supply tank 11a is stopped.

在上述之處理過程,控制單元30根據在第2濃度計201b之測定濃度C2已經穩定的狀態下,在第1濃度計201a之測定濃度C1成為急遽地變動的狀況(例如,分別從第1濃度計201a與第2濃度計201b得到之測定濃度差超出預先設定之預定範圍,而且在第1濃度計201a檢測之濃度C1每隔單位時間的變動幅度超出預先設定之容許值的狀況)等,則判定為第1濃度計201a不正常(在S16為NO)時,設置於第1循環路徑P1之上游側第1閥群12a的開閉閥120a及下游側第1閥群13a的開閉閥130a(第1閥機構:參照圖2A)切換成閉狀態(做為第1閥控制部(處理液用閥控制部)的功能)後,並行開始第1濃度計201a的校正處理(S20)。在該狀態下,藉由前述之第1濃度計測部20a(參照圖2B)中之上游側第1切換閥202a及下游側第1切換閥203a的切換動作,不對第1濃度計201a(液路Pm1)供給處理液,而是進行第1濃度計201a的校正處理。再者,關於校正處理於後敘述。然後,控制單元30判定為並未滿足使用以調整處理液濃度的循環結束之條件時(在S18為NO),則進而判定第1濃度計201a是否為校正中(S11)。In the above-mentioned processing procedure, the control unit 30 changes the measurement concentration C1 of the first concentration meter 201a in a state where the measurement concentration C2 of the second concentration meter 201b has stabilized (for example, from the first concentration, respectively). If the difference between the measured concentration obtained by the meter 201a and the second concentration meter 201b exceeds a predetermined range, and the fluctuation range of the concentration C1 detected by the first concentration meter 201a per unit time exceeds a preset allowable value), etc., then When it is determined that the first concentration meter 201a is abnormal (NO in S16), the on-off valve 120a of the first valve group 12a on the upstream side of the first circulation path P1 and the on-off valve 130a of the first valve group 13a on the downstream side (the first 1-valve mechanism: refer to FIG. 2A) After switching to the closed state (as a function of the first valve control unit (valve control unit for processing liquid)), the calibration process of the first concentration meter 201a is started in parallel (S20). In this state, the switching operation of the upstream first switching valve 202a and the downstream first switching valve 203a in the aforementioned first concentration measurement unit 20a (see FIG. 2B) does not affect the first concentration meter 201a (liquid path). Pm1) The processing liquid is supplied, and the calibration process of the first concentration meter 201a is performed. The correction processing will be described later. Then, when the control unit 30 determines that the conditions for the end of the cycle for adjusting the concentration of the processing liquid are not satisfied (NO in S18), it further determines whether or not the first concentration meter 201a is being calibrated (S11).

由於第1濃度計201a之校正處理已經開始,因此控制單元30判定為第1濃度計201a為校正中時(在S11為YES),移行到圖4B所示之順序,判定第2濃度計201b(第2濃度計測部20b:參照圖2C)是否為校正中(S21)。第2濃度計201b若不是校正中(在S21為NO),控制單元30根據在第2濃度計201b之測定濃度C2是否維持已經穩定的狀態(例如,在第2濃度計201b檢測之濃度C2每隔單位時間的變動幅度是否超出予先設定之容許值),判定第2濃度計201b是否正常(S22)。當判定第2濃度計201b為正常時(在S22為YES),控制單元30從第2濃度計201b取得根據測定信號的濃度C2(S23),根據其測定濃度C2進行處理液的濃度調整處理(S24)。具體而言,控制單元30一面監視在積分流量計14a、15a之流量資訊,一面調整調整閥16a、17a的開閉狀態,以使測定濃度C2為目標濃度。然後,控制單元30回到圖4A之步驟,判定是否滿足使處理液用以調整濃度的循環結束的條件(S18),當未滿足使用以調整處理液濃度的循環結束的條件時(在S18為NO),控制單元30依據與上述步驟同樣的步驟執行處理。在這種情況下,由於第1濃度計201a為校正中,因此根據在第2濃度計201b之測定濃度C2,在第1供給槽11a(處理液調整部)內,進行處理液的濃度調整,生成其調整後之濃度的處理液(具體而言,含有經過調整之濃度之磷酸的蝕刻處理液)。接著,當測定濃度C2達到以目標濃度為中心之預定濃度範圍等、滿足用以使調整處理液濃度的循環結束之條件時(在S18為YES),控制單元30同樣使第1泵18a停止等,使用以調整處理液濃度的循環結束(S19)Since the calibration process of the first densitometer 201a has already started, when the control unit 30 determines that the first densitometer 201a is being calibrated (YES in S11), it shifts to the sequence shown in FIG. 4B and determines the second densitometer 201b ( The second concentration measurement unit 20b: refer to FIG. 2C) is the calibration in progress (S21). If the second concentration meter 201b is not being calibrated (NO at S21), the control unit 30 determines whether the measured concentration C2 of the second concentration meter 201b has maintained a stable state (for example, the concentration C2 detected by the second concentration meter 201b is Whether the fluctuation range per unit time exceeds a preset allowable value), it is determined whether the second concentration meter 201b is normal (S22). When it is determined that the second concentration meter 201b is normal (YES in S22), the control unit 30 obtains the concentration C2 based on the measurement signal from the second concentration meter 201b (S23), and performs a concentration adjustment process of the processing liquid based on the measured concentration C2 ( S24). Specifically, the control unit 30 monitors the flow rate information of the integrating flow meters 14a and 15a and adjusts the opening and closing states of the adjustment valves 16a and 17a so that the measured concentration C2 becomes the target concentration. Then, the control unit 30 returns to the step of FIG. 4A to determine whether the conditions for the end of the cycle for adjusting the concentration of the processing liquid for the processing liquid are satisfied (S18). NO), the control unit 30 executes processing in accordance with the same steps as those described above. In this case, since the first concentration meter 201a is being calibrated, the concentration of the processing solution is adjusted in the first supply tank 11a (the processing solution adjustment unit) based on the measured concentration C2 of the second concentration meter 201b. A treatment liquid (specifically, an etching treatment liquid containing phosphoric acid with the adjusted concentration) is generated at the adjusted concentration. Then, when the measured concentration C2 reaches a predetermined concentration range centered on the target concentration, etc., and the conditions for ending the cycle for adjusting the concentration of the processing liquid are satisfied (YES in S18), the control unit 30 similarly stops the first pump 18a, etc. To end the cycle for adjusting the concentration of the processing liquid (S19)

再者,如上所述,根據在第2濃度計201b之測定濃度C2,在第1供給槽11a內進行處理液之濃度調整(具體而言,蝕刻處理液中之磷酸濃度調整)的狀況下,當第1濃度計201a之校正處理結束時,由於控制單元30判定為第1濃度計201a(第1濃度計測部20a)及第2濃度計201b(第2濃度計測部20b)雙方不在校正中(在S11為NO,在S12為NO),因此設置於為閉狀態之第1循環液路P1之上游側第1閥群12a之開閉閥120a及下游側第1閥群13a之開閉閥130a(第1閥機構:參照圖2A)切換成開狀態後,反覆執行與前述處理步驟同樣的步驟(S11~S18)。其結果是,再次根據在第1濃度計201a之測定濃度C1,在第1供給槽11內進行處理液的濃度調整。In addition, as described above, based on the measured concentration C2 in the second concentration meter 201b, the concentration of the processing liquid (specifically, the concentration of phosphoric acid in the etching processing liquid) is adjusted in the first supply tank 11a. When the calibration process of the first concentration meter 201a is completed, the control unit 30 determines that both the first concentration meter 201a (the first concentration measurement section 20a) and the second concentration meter 201b (the second concentration measurement section 20b) are not in calibration ( (NO in S11 and NO in S12). Therefore, the on-off valve 120a of the first valve group 12a on the upstream side and the on-off valve 130a of the first valve group 13a on the downstream side are provided in the closed state of the first circulation liquid path P1 (the first 1-valve mechanism: refer to FIG. 2A) After switching to the open state, the same steps (S11 to S18) as the aforementioned processing steps are repeatedly executed. As a result, the concentration of the processing liquid is adjusted in the first supply tank 11 based on the measured concentration C1 in the first concentration meter 201a again.

進而,在第1濃度計201a及第2濃度計201b之雙方是正常的,且根據在第1濃度計201a之測定濃度C1進行濃度調整處理的過程(S11~S18)中,例如,在其測定濃度C1維持穩定的狀態下,測定濃度C2急遽地變動(這是例如分別從第1濃度計201a與第2濃度計201b得到之濃度差超出預先設定之預定範圍,而且在第2濃度計201b檢測之濃度C2每隔單位時間的變動幅度超出預先設定之容許值),據此,判定為第2濃度計201b不正常時(在S15為NO),控制單元30在將設置於第2循環液路P2之上游側第2閥群12b之開閉閥120b及下游側第2閥群13b之開閉閥130b(第2閥機構:參照圖2A)切換成閉狀態(作為第2閥控制部(處理液用閥控制部)的功能)後,進行前述之第2濃度計測部20b(參照圖2C)中之上游側第2切換閥202b及下游側第2切換閥203b的切換動作,並行開始第2濃度計201b的校正處理(S25)。以後,控制單元30確認第1濃度計201a並非在校正中,且第2濃度計201b在校正中的情況(在S11為NO,在S12為YES),取得來自第1濃度計201a之測定信號的濃度C1(S26),維持其測定濃度C1穩定之狀態(此情況是例如在第1濃度計201a檢測之濃度C1每隔單位時間的變動幅度不超出預先設定之容許值),即,確認第1濃度計201a是正常的(在S16為YES),根據測定濃度C1進行第1供給槽11a中之處理液的濃度調整處理(具體而言,蝕刻處理液中之磷酸濃度調整處理)(S17)。Furthermore, both the first concentration meter 201a and the second concentration meter 201b are normal, and the concentration adjustment process (S11 to S18) is performed based on the measured concentration C1 of the first concentration meter 201a, for example, during the measurement While the concentration C1 remains stable, the measured concentration C2 fluctuates sharply (this is, for example, that the difference between the concentration obtained from the first concentration meter 201a and the second concentration meter 201b exceeds a predetermined range, and the second concentration meter 201b detects The fluctuation range of the concentration C2 per unit time exceeds the preset allowable value). Based on this, when it is determined that the second concentration meter 201b is abnormal (NO in S15), the control unit 30 will set the second concentration meter 201b in the second circulation liquid path. The on-off valve 120b of the second valve group 12b on the upstream side of P2 and the on-off valve 130b of the second valve group 13b on the downstream side (second valve mechanism: refer to FIG. 2A) are switched to a closed state (as a second valve control unit (for processing liquid) Function of the valve control unit), the switching operation of the upstream second switching valve 202b and the downstream second switching valve 203b in the aforementioned second concentration measurement unit 20b (see FIG. 2C) is started to start the second concentration meter in parallel. 201b correction processing (S25). After that, the control unit 30 confirms that the first concentration meter 201a is not in calibration and the second concentration meter 201b is in calibration (NO in S11 and YES in S12), and obtains the measurement signal from the first concentration meter 201a. Concentration C1 (S26), maintaining the state where the measured concentration C1 is stable (in this case, for example, the fluctuation range of the concentration C1 detected by the first concentration meter 201a per unit time does not exceed a preset allowable value), that is, confirm the first The densitometer 201a is normal (YES in S16), and the concentration adjustment processing of the processing liquid in the first supply tank 11a is performed based on the measured concentration C1 (specifically, the phosphoric acid concentration adjustment processing in the etching processing liquid) (S17).

再者,判定為第1濃度計201a在校正中,且測定濃度C2已經穩定之第2濃度計201b的該測定濃度C2急遽地變動(例如,在第2濃度計201b檢測之濃度C2每隔單位時間的變動幅度超出預先設定之容許值等),而第2濃度計201b不正常時(在圖4B的S22為NO),控制單元30進而將設置於第2循環液路P2之上游側第2閥群12b的開閉閥120b及下游側第2閥群13b的開閉閥130b(第2閥機構:參照圖2A)切換為閉狀態後,並行開始第2濃度計201b的校正處理(S27)。在該狀況下,由於第1濃度計201a及第2濃度計201b之雙方在校正中,因此控制單元30使第1泵18a停止等,而使用以調整處理液濃度的循環結束(S19)。又,再者,當判定為第1濃度計201a及第2濃度計201b之雙方為校正中時(在圖4A的S11為YES,在圖4B的S21為YES),該情況也是控制單元30使第1泵18a停止等,而使用以調整處理液之濃度的循環結束(S19)Furthermore, it is determined that the measurement concentration C2 of the second concentration meter 201b whose first concentration meter 201a is being calibrated and the measurement concentration C2 has stabilized (for example, the concentration C2 detected by the second concentration meter 201b changes every unit). When the time fluctuation range exceeds a preset allowable value, etc.), and when the second concentration meter 201b is abnormal (NO in S22 of FIG. 4B), the control unit 30 further sets the second concentration meter on the upstream side of the second circulation liquid path P2. After the on-off valve 120b of the valve group 12b and the on-off valve 130b (second valve mechanism: see FIG. 2A) of the second downstream valve group 13b are switched to the closed state, the calibration process of the second concentration meter 201b is started in parallel (S27). In this case, since both the first concentration meter 201a and the second concentration meter 201b are being calibrated, the control unit 30 stops the first pump 18a, etc., and uses the cycle to adjust the concentration of the processing liquid (S19). In addition, when it is determined that both the first concentration meter 201a and the second concentration meter 201b are being calibrated (YES in S11 in FIG. 4A and YES in S21 in FIG. 4B), this case is also the control unit 30. The first pump 18a is stopped, etc., and the cycle for adjusting the concentration of the processing liquid is ended (S19)

依據上述步驟調整濃度而生成處理液的裝置(處理液生成裝置)中,即使判定為第1濃度計201a不正常,也會根據在判定為正常之第2濃度計201b的測定濃度C2,繼續處理液之濃度調整(具體而言,蝕刻處理液中之磷酸濃度調整)的處理,因此可以防止根據不正常之濃度計的測定濃度而繼續調整處理液濃度,可提高其生成之處理液濃度的信賴性。In the device (processing liquid generating device) that generates a processing liquid by adjusting the concentration according to the above steps, even if it is determined that the first concentration meter 201a is abnormal, the processing is continued based on the measured concentration C2 of the second concentration meter 201b that is determined to be normal. The process of adjusting the concentration of the liquid (specifically, the adjustment of the concentration of phosphoric acid in the etching treatment liquid) can prevent the adjustment of the concentration of the processing liquid based on the measured concentration of the abnormal concentration meter, and can increase the reliability of the concentration of the processing liquid that is generated. Sex.

又,由於1個濃度計在校正時,仍可使用其他濃度計測量正確濃度,因此不使處理液的濃度調整中斷,而可繼續進行。In addition, since one density meter can still use other densitometers to measure the correct concentration during calibration, the concentration adjustment of the processing liquid can be continued without interruption.

又,即使其中一個濃度計故障,也可以根據另一個濃度計的測定濃度而繼續濃度調整的處理,因此可使處理液之濃度調整相關的處理效率提高。In addition, even if one of the densitometers fails, the process of concentration adjustment can be continued based on the measured concentration of the other densitometer, so that the processing efficiency related to the concentration adjustment of the processing liquid can be improved.

再者,在前述之處理中,若第1濃度計201a及第2濃度計201b之雙方正常,則根據在第1濃度計201a之測定濃度C1進行濃度調整的處理(參照S17),但亦可根據在第1濃度計201a及第2濃度計201b之雙方之測定濃度C1、C2,例如該等之平均值而進行濃度調整之處理。Furthermore, in the foregoing processing, if both the first and second concentration meters 201a and 201b are normal, the concentration adjustment processing is performed based on the measured concentration C1 of the first concentration meter 201a (see S17), but it may be performed. The concentration adjustment process is performed based on the measured concentrations C1 and C2 of both the first concentration meter 201a and the second concentration meter 201b, for example, the average of these.

上述校正處理是依據圖5所示之步驟進行。再者,校正處理是以第1濃度計側部20a(圖2B參照)之第1濃度計201a及第2濃度計側部20b(圖2C參照)之第2濃度計201b之雙方進行,但該等校正處理相同,因此,以下,以第1濃度計側部20a(參照圖2B)之第1濃度計20a的校正處理為例進行說明。The above-mentioned correction processing is performed according to the steps shown in FIG. 5. The correction process is performed by both the first concentration meter 201a of the first concentration meter side portion 20a (refer to FIG. 2B) and the second concentration meter 201b of the second concentration meter side portion 20b (refer to FIG. 2C). The isochronous correction process is the same. Therefore, the correction process of the first densitometer 20a of the first densitometer side portion 20a (see FIG. 2B) will be described below as an example.

控制單元30將設置於第1循環液路P1之上游側第1閥群12a之開閉閥120a及下游側第1閥群13a之開閉閥130a(第1閥機構:參照圖2)切換成閉狀態後,依據圖5所示之步驟執行處理。圖5中,控制單元30是令設置於第1洗淨液路Pp1之上游側第1閥群12a的開閉閥121a及下游側第1閥群13a的開閉閥131a(第5閥機構:參照圖2)為開狀態,並且使上游側第1切換閥202a及下游側第1切換閥203a動作,以使第1濃度計側部20a中之液路Pm1連通於第1洗淨液路Pp1。接著,將洗淨液(例如,純水)流動至其第1洗淨液路Pp1預定時間後,將開閉閥121a、131a(第5閥機構)切換成閉狀態(S31(1))。藉此,通過第1洗淨液路Pp1之洗淨液在設置有第1濃度計測部20a之第1濃度計201a的Pm1流動,第1濃度計20a(濃度檢測部)與其液路Pm1一起洗淨。The control unit 30 switches the on-off valve 120a (the first valve mechanism: see FIG. 2) of the first valve group 12a on the upstream side and the first valve group 13a on the downstream side of the first circulation liquid path P1 to the closed state. Thereafter, the processing is performed according to the steps shown in FIG. 5. In FIG. 5, the control unit 30 is an on-off valve 121a (a fifth valve mechanism: refer to the figure) for opening and closing the valve 121a and the first valve group 13a on the upstream side of the first cleaning liquid path Pp1. 2) It is in an open state, and the upstream first switching valve 202a and the downstream first switching valve 203a are operated so that the liquid path Pm1 in the first concentration meter side portion 20a communicates with the first cleaning liquid path Pp1. Next, after the cleaning liquid (for example, pure water) flows to the first cleaning liquid path Pp1 for a predetermined time, the on-off valves 121a and 131a (the fifth valve mechanism) are switched to the closed state (S31 (1)). Thereby, the cleaning liquid passing through the first cleaning liquid path Pp1 flows through Pm1 of the first concentration meter 201a provided with the first concentration measurement section 20a, and the first concentration meter 20a (concentration detection section) is washed with its liquid path Pm1 net.

然後,控制單元30將設置於第1洗淨液路Pp1之前述開閉閥121a及131a切換到閉狀態後,令設置於第1校正液路Pc1之上游側第1閥群12a的開閉閥122a及下游側第1閥群13a的開閉閥132a(第3閥機構:參照圖2A)為開狀態(作為第1校正液用閥控制部(相當於第2校正液用閥控制部)的功能),並且使上游側第1切換閥202a及下游側第1切換閥203a動作,以使設有第1濃度計201a之液路Pm1連通於第1校正液路Pc1。接著,濃度為既知之第1校正液Lc1在其第1校正液路Pc1流動(S32(1))。藉此,通過第1校正液路Pc1之第1校正液Lc1在設置有第1濃度計側部20a之第1濃度計20a(濃度檢測部)的液路Pm1流動。在該狀態下,控制單元30取得由第1濃度計201a輸出之測定信號之值(例如,級值)(S33(1))。然後,控制單元30使第1校正液Lc1的供給停止(S34(1))。Then, the control unit 30 switches the on-off valves 121a and 131a provided in the first cleaning liquid path Pp1 to a closed state, and then causes the on-off valves 122a and 122a provided in the first valve group 12a on the upstream side of the first correction liquid path Pc1. The on-off valve 132a (the third valve mechanism: see FIG. 2A) of the first valve group 13a on the downstream side is in an open state (functions as a first correction liquid valve control unit (equivalent to the second correction liquid valve control unit)), The upstream first switching valve 202a and the downstream first switching valve 203a are operated so that the liquid path Pm1 provided with the first concentration meter 201a communicates with the first correction liquid path Pc1. Next, the first correction liquid Lc1 having a known concentration flows through the first correction liquid path Pc1 (S32 (1)). Thereby, the first correction liquid Lc1 passing through the first correction liquid path Pc1 flows through the liquid path Pm1 of the first concentration meter 20a (concentration detection unit) provided with the first concentration meter side portion 20a. In this state, the control unit 30 obtains a value (for example, a step value) of the measurement signal output from the first density meter 201a (S33 (1)). Then, the control unit 30 stops the supply of the first correction liquid Lc1 (S34 (1)).

之後,依序切換濃度不同的校正液,重複執行同樣的處理(S31(n)~S34(n)直到第n次的校正液Lcn。接著,控制單元30根據與各校正液Lc1~Lcn之濃度對應之測定信號之值的關係(相關關係),生成測定信號值與濃度的對應資訊(S35:第1校正處理部(相當於第2校正處理部))。接著,控制單元30根據其對應資訊而更新記憶於第1濃度計201a之測定信號值與濃度的對應表。如此,本實施形態中,關於判定為不正常的濃度計,具有自我校正功能。如此校正處理已經結束的控制單元30參照其對應表而取得根據來自第1濃度計201a之測定信號的濃度C1。After that, the calibration solutions with different concentrations are sequentially switched, and the same processing is repeatedly performed (S31 (n) to S34 (n) until the n-th calibration solution Lcn. Then, the control unit 30 controls the concentration of each calibration solution Lc1 to Lcn. Correspondence (correlation) of the corresponding measurement signal values generates correspondence information between the measurement signal value and the concentration (S35: first correction processing unit (equivalent to the second correction processing unit)). Next, the control unit 30 based on the corresponding information The correspondence table between the measured signal value and the concentration stored in the first concentration meter 201a is updated. Thus, in this embodiment, the concentration meter judged to be abnormal has a self-calibration function. The control unit 30 that has finished the calibration process is referred to The correspondence table is used to obtain the concentration C1 based on the measurement signal from the first concentration meter 201a.

再者,本實施形態中,已經就濃度計之自我校正功能,說明依序使用濃度不同的校正液,並且更新各測定信號值與濃度的對應表之例。然而,校正功能亦可僅使用例如濃度為既知之特定濃度的校正液達成。例如,在第1洗淨液路Pp1連通於流路Pm1的狀態下,洗淨液流動預先設定之預定時間後,使第1校正液路Pc1連通於流路Pm1,並且特定濃度之校正液流動至流路Pm1。在該狀態下,控制單元30取得從第1濃度計201a輸出之測定信號值。接著,第1濃度計201a測定之濃度C1若與流動至流路Pm1的特定濃度一致,進行附著於濃度計之電極、或附著於濃度計設置之流路內面的髒汙等的除去,可判斷為正常地校正。亦可將如此之處理功能作為校正功能。進而,第1濃度計201a測定出之濃度C1若與流動至流路Pm1之特定濃度不一致時,則亦可將洗淨液往流路Pm1的供給、校正液的供給重複預先設定之次數到上限。Furthermore, in this embodiment, the self-calibration function of the densitometer has been described as an example of sequentially using calibration solutions with different concentrations, and updating the correspondence table of each measured signal value and concentration. However, the calibration function may be achieved using only a calibration solution having a known specific concentration. For example, in a state where the first cleaning liquid path Pp1 is communicated with the flow path Pm1, after the cleaning liquid flows for a predetermined time, the first correction liquid path Pc1 is communicated with the flow path Pm1, and a calibration solution of a specific concentration flows. To flow path Pm1. In this state, the control unit 30 obtains the measurement signal value output from the first densitometer 201a. Next, if the concentration C1 measured by the first densitometer 201a matches the specific concentration flowing to the flow path Pm1, dirt or the like attached to the electrode of the densitometer or the inner surface of the flow path provided by the densitometer can be removed. It is judged that the correction is normal. Such a processing function can also be used as a correction function. Furthermore, if the concentration C1 measured by the first concentration meter 201a does not match the specific concentration flowing to the flow path Pm1, the supply of the cleaning liquid to the flow path Pm1 and the supply of the calibration solution may be repeated a preset number of times to an upper limit. .

當如上述之校正處理結束時,控制單元30將設置於第1校正液路Pc1的開閉閥122a及132a切換成閉狀態後,將設置於第1循環路徑P1之開閉閥120a、130a切換成開狀態(第1閥恢復控制設備(相當於第2閥恢復控制設備))。藉此,可使第1濃度計測部20a之第1濃度計201a恢復成處理液的濃度調整。When the correction process as described above ends, the control unit 30 switches the on-off valves 122a and 132a provided on the first correction fluid path Pc1 to a closed state, and switches the on-off valves 120a and 130a provided on the first circulation path P1 to open. State (the first valve recovery control device (equivalent to the second valve recovery control device)). Thereby, the 1st density meter 201a of the 1st density measurement part 20a can be restored to the density | concentration adjustment of a processing liquid.

在圖1所示之基板處理裝置中,如上所述,當在第1供給槽11a之處理液的濃度調整(具體而言,蝕刻處理液中之磷酸濃度調整)結束時,三向閥21、22切換到第2供給槽11b(處理液調整部)側,並且三向閥23、24切換到第1供給槽11a側。在此狀態下,藉由第1泵18a的動作,在第1供給槽11內經過濃度調整而生成之處理液(具體而言,蝕刻處理液)由其第1供給槽11a供給到旋轉裝置100(噴嘴111),在旋轉裝置100內藉由第1供給槽11a供給之處理液進行半導體晶圓W之表面的處理(蝕刻處理)。而且,從旋轉裝置100回收之使用過的處理液透過回收槽10返回第1供給槽11a。In the substrate processing apparatus shown in FIG. 1, as described above, when the concentration adjustment of the processing liquid in the first supply tank 11 a (specifically, the adjustment of the phosphoric acid concentration in the etching processing liquid) is completed, the three-way valve 21, 22 is switched to the 2nd supply tank 11b (process liquid adjustment part) side, and the three-way valves 23 and 24 are switched to the 1st supply tank 11a side. In this state, the processing liquid (specifically, the etching processing liquid) generated by the concentration adjustment in the first supply tank 11 by the operation of the first pump 18a is supplied to the rotary device 100 from the first supply tank 11a. (Nozzle 111) The surface of the semiconductor wafer W is processed (etched) by the processing liquid supplied from the first supply tank 11a in the rotary device 100. The used processing liquid recovered from the rotary device 100 passes through the recovery tank 10 and returns to the first supply tank 11a.

如此,在處理液從第1供給槽11a供給到旋轉裝置100的狀態下,第2供給槽11b中,隨著上述步驟(參照圖4A、圖4B等),進行處理液之濃度調整相關的處理,並且生成為預定濃度的處理液。然後,在第1供給槽11a及第2供給槽11b之處理液的濃度調整與處理液往旋轉裝置100之供給可相互切換繼續進行。In this way, in a state where the processing liquid is supplied from the first supply tank 11a to the rotating device 100, the second supply tank 11b performs processing related to the concentration adjustment of the processing liquid in accordance with the above-mentioned steps (see FIGS. 4A and 4B, etc.). And generate a treatment solution with a predetermined concentration. Then, the concentration adjustment of the processing liquid in the first supply tank 11a and the second supply tank 11b and the supply of the processing liquid to the rotary device 100 can be switched to each other and continued.

根據上述之步驟進行校正處理的裝置(處理液生成裝置)中,即使是判定為不正常的濃度計,可活用自我校正功能,使之自己恢復,並可提高處理液濃度的信賴性。而且,由於也具備先前所述之自我診斷功能,因此可經常提高處理液的信賴性。In the device (processing liquid generating device) that performs the calibration process according to the above steps, even if the concentration meter is determined to be abnormal, the self-calibration function can be utilized to restore itself, and the reliability of the processing liquid concentration can be improved. In addition, since the self-diagnostic function described above is also provided, the reliability of the treatment liquid can always be improved.

又,由於個別具有洗淨濃度計本身、或洗淨設置有濃度計之液路內面時所使用之洗淨液路,因此在濃度計之校正中,在洗淨該濃度計時,可防止附著於該濃度計之電導板(電極)及流路內面的髒汙混入到處理液流動之循環液路或校正液流動之校正液路。In addition, since there are individual washing liquid channels used for washing the concentration meter itself or for cleaning the inner surface of the liquid channel provided with the concentration meter, in the calibration of the concentration meter, the concentration timer is washed to prevent adhesion. The dirt on the conductive plate (electrode) of the concentration meter and the inner surface of the flow path are mixed into the circulating liquid path through which the treatment liquid flows or the correction liquid path through which the correction liquid flows.

再者,上述實施形態中,第1濃度計201a與第2濃度計201b是利用不同的測定原理來測定處理液濃度。然而,考量到2個濃度計同時會變不正常的機率較低,亦可為相同原理的濃度計。In the above embodiment, the first concentration meter 201a and the second concentration meter 201b use different measurement principles to measure the concentration of the processing liquid. However, considering that the two densitometers will become abnormal at the same time, the probability is low, and it can also be a densitometer with the same principle.

又,圖2A中,個別地設置有第1循環液路P1、第1校正液路Pc1、及第1洗淨液路Pp1,但亦可為具有三向閥之單一配管,使處理液、校正液、純水交互地流動至第1濃度計側部20a。個別地設置於第2濃度計20b之第2循環液路P2、第2校正液路Pc2、第2洗淨液路Pp2也同樣。In FIG. 2A, the first circulation liquid path P1, the first correction liquid path Pc1, and the first cleaning liquid path Pp1 are individually provided. However, a single piping with a three-way valve may be used for the processing liquid and the correction. Liquid and pure water alternately flow to the first concentration meter side portion 20a. The same applies to the second circulation liquid path P2, the second correction liquid path Pc2, and the second cleaning liquid path Pp2 that are individually provided in the second concentration meter 20b.

又,上述實施形態中,第1濃度計201a(圖2B參照)之例是使用根據電導率的濃度計,第2濃度計201b(參照圖2C)之例是使用雷射光之例在說明。在此情況下,就洗淨液進行濃度計之洗淨來看,關於第1濃度計201a是進行例如第1濃度計201a具有之電導板(電極)的洗淨等,關於第2濃度計201b,是利用洗淨液洗淨液路內面。In the above embodiment, an example of the first concentration meter 201a (refer to FIG. 2B) is a concentration meter based on conductivity, and an example of the second concentration meter 201b (refer to FIG. 2C) is an example of using laser light. In this case, in terms of washing the concentration meter with the washing solution, the first concentration meter 201a is used to clean, for example, the conductive plate (electrode) included in the first concentration meter 201a, and the second concentration meter 201b , Use the cleaning solution to clean the inside of the liquid path.

又,上述實施形態中,作為處理液,是以蝕刻液(例如,磷酸水溶液)為例,但若為檢測濃度且進行處理之處理液,液可適用於光阻劑剝離液等其他處理液。又,處理液亦可為含有純水以外之複數個成分。在此情況下,各濃度計亦可為測定全部成分之濃度,亦可為測定一或複數個部分成分之各個濃度。In addition, in the above embodiment, the etching liquid (for example, an aqueous phosphoric acid solution) is taken as an example of the processing liquid. However, if it is a processing liquid that detects the concentration and is processed, the liquid can be applied to other processing liquids such as a photoresist stripping liquid. The treatment liquid may include a plurality of components other than pure water. In this case, each densitometer may be used to measure the concentration of all the components, or it may be used to measure the concentration of one or more partial components.

在上述之裝置中,使用了第1濃度計201a與第2濃度計201b的2個濃度計,但亦可使用3個以上之濃度計。在此情況下,可將該等3個以上濃度計中之任一個作為第1濃度計,將另一個作為第2濃度計,又,可將任一個作為第1濃度計或第2濃度計,亦可將剩餘之濃度計之組別作為第2濃度計或第1濃度計。In the above-mentioned device, two density meters of the first density meter 201a and the second density meter 201b are used, but three or more density meters may be used. In this case, any one of the three or more concentration meters may be used as the first concentration meter, the other may be used as the second concentration meter, and any one may be used as the first or second concentration meter. The remaining concentration meter group can also be used as the second concentration meter or the first concentration meter.

上述之裝置中,各開閉閥、三向閥、調整閥是藉由受控制單元30控制之驅動電路進行,但該等閥亦可以手動進行切換。在此情況下,操作者觀察在第1濃度計201a及第2濃度計201b之測定濃度,並且隨著與上述步驟同樣的步驟,切換各閥。In the above device, each of the on-off valve, the three-way valve, and the regulating valve is performed by a driving circuit controlled by the control unit 30, but these valves can also be manually switched. In this case, the operator observes the measured concentrations in the first concentration meter 201a and the second concentration meter 201b, and switches the valves according to the same steps as those described above.

又,上述之裝置中,構成為濃度調整結束後之處理液從供給槽11a(11b)供給到旋轉裝置100時,使用完之處理液作為回收液,回到供給槽11a(11b)。在如此之構成中,將處理液從供給槽11a(11b)供給到旋轉裝置100時,也可進行供給槽11a(11b)內之處理液的濃度調整。在此情況下,例如,將三向閥23、24切換到第1供給槽11a側而將第1供給槽11a內之處理液供給到旋轉裝置100時,三向閥21、22也切換到第1供給槽11a側。將三向閥21、22切換到第1供給槽11a側後之第1供給槽11a內之處理液的濃度調整、濃度計之自我校正功能與使用圖4A、4B、圖5所說明的動作同樣。又,從第2供給槽11b將處理液供給到旋轉裝置100時也同樣。根據如此構成,不僅是處理液開始往旋轉裝置100供給時,在供給中也可進行濃度管理,可以經過濃度管理之處理液繼續適切地處理基板處理。又,若2個濃度計201a、201b之至少一者是正常的,則可繼續往旋轉裝置100供給處理液,而且在此期間內,亦可實施判斷為不正常之濃度計的校正,也有助於提升生產率。In the above-mentioned device, when the processing liquid after the concentration adjustment is supplied from the supply tank 11a (11b) to the rotary device 100, the used processing liquid is returned to the supply tank 11a (11b) as a recovery liquid. In such a configuration, when the processing liquid is supplied from the supply tank 11a (11b) to the rotating device 100, the concentration of the processing liquid in the supply tank 11a (11b) can also be adjusted. In this case, for example, when the three-way valves 23 and 24 are switched to the first supply tank 11a side and the processing liquid in the first supply tank 11a is supplied to the rotary device 100, the three-way valves 21 and 22 are also switched to the first 1 supply tank 11a side. After the three-way valves 21 and 22 are switched to the side of the first supply tank 11a, the concentration adjustment of the processing liquid in the first supply tank 11a and the self-calibration function of the concentration meter are the same as those described using FIGS. 4A, 4B, and 5 . The same applies when the processing liquid is supplied from the second supply tank 11b to the rotating device 100. With this configuration, not only when the processing liquid starts to be supplied to the rotary device 100, the concentration management can be performed during the supply, and the processing liquid that can undergo the concentration management can continue to appropriately process the substrate processing. In addition, if at least one of the two concentration meters 201a and 201b is normal, the processing liquid can be continuously supplied to the rotary device 100, and during this period, calibration of the concentration meter determined to be abnormal can also be performed, which also helps To increase productivity.

以上,以說明本發明之幾個實施形態及各部的變形例,但該實施形態或各部的變形例是提示為一例,意不在於用以限定發明範圍。上述之該等新穎的實施形態可以其他各種形態實施,可在不脫離發明要旨的範圍內,進行各種省略、置換、變更。該等實施形態或其變形也包含在發明範圍或要旨內,並且包含在申請專利範圍所記載之發明。In the above, several embodiments of the present invention and modification examples of each part have been described, but this embodiment or modification examples of each part is suggested as an example, and is not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. Such embodiments or modifications thereof are also included in the scope or gist of the invention, and are included in the invention described in the scope of patent application.

10‧‧‧回收槽10‧‧‧ Recovery Tank

11a‧‧‧第1供給槽11a‧‧‧The first supply tank

11b‧‧‧第2供給槽11b‧‧‧ 2nd supply tank

12a‧‧‧上游側第1閥群12a‧‧‧The first valve group on the upstream side

12b‧‧‧上游側第2閥群12b‧‧‧ upstream 2nd valve group

13a‧‧‧下游側第1閥群13a‧‧‧The first valve group on the downstream side

13b‧‧‧下游側第2閥群13b‧‧‧ 2nd downstream valve group

14a、14b、15a、15b‧‧‧積分流量計14a, 14b, 15a, 15b ‧‧‧ integral flowmeter

16a、16b、17a、17b‧‧‧調整閥16a, 16b, 17a, 17b ‧‧‧ regulating valve

18a‧‧‧第1泵18a‧‧‧The first pump

18b‧‧‧第2泵18b‧‧‧Second pump

19a、19b‧‧‧開閉閥19a, 19b‧‧‧ On-off valve

20a‧‧‧第1濃度計側部20a‧‧‧ side of the first concentration meter

20b‧‧‧第2濃度計側部20b‧‧‧Second Densitometer Side

21、22、23、24‧‧‧三向閥21, 22, 23, 24‧‧‧Three-way valve

30‧‧‧控制單元30‧‧‧Control unit

31a、31b、32a、32b、33a、33b、34a、34b、35a、35b‧‧‧驅動電路31a, 31b, 32a, 32b, 33a, 33b, 34a, 34b, 35a, 35b ‧‧‧ drive circuit

100‧‧‧旋轉裝置100‧‧‧ rotating device

110‧‧‧支撐台110‧‧‧Support

111‧‧‧噴嘴111‧‧‧Nozzle

115‧‧‧杯部115‧‧‧ Cup

120a、130a‧‧‧開閉閥/第1閥機構120a, 130a‧‧‧Open / close valve / first valve mechanism

120b、130b‧‧‧開閉閥/第2閥機構120b, 130b‧‧‧Open / close valve / second valve mechanism

121a、131a‧‧‧開閉閥/第5閥機構121a, 131a‧‧‧Open / close valve / 5th valve mechanism

121b、131b‧‧‧開閉閥/第6閥機構121b, 131b‧‧‧Open / close valve / 6th valve mechanism

122a、132a‧‧‧開閉閥/第3閥機構122a, 132a‧‧‧Open / close valve / 3rd valve mechanism

122b、132b‧‧‧開閉閥/第4閥機構122b, 132b‧‧‧Open / close valve / 4th valve mechanism

201a‧‧‧第1濃度計201a‧‧‧The first concentration meter

201b‧‧‧第2濃度計201b‧‧‧Second Densitometer

202a‧‧‧上游側第1切換閥202a‧‧‧ upstream side first switching valve

202b‧‧‧上游側第2切換閥202b‧‧‧ 2nd upstream switching valve

203a‧‧‧下游側第1切換閥203a‧‧‧The first switching valve on the downstream side

203b‧‧‧下游側第2切換閥203b‧‧‧ 2nd downstream switching valve

P1‧‧‧第1處理液路(第1循環液路)P1‧‧‧The first processing liquid path (the first circulation liquid path)

P2‧‧‧第2處理液路(第2循環液路)P2‧‧‧Second treatment fluid path (second circulation fluid path)

Pc1‧‧‧第1校正液路Pc1‧‧‧The first calibration fluid path

Pc2‧‧‧第2校正液路Pc2‧‧‧Second calibration fluid path

Pm1、Pm2‧‧‧液路Pm1, Pm2‧‧‧Liquid circuit

Pp1‧‧‧第1洗淨液路Pp1‧‧‧The first cleaning liquid path

Pp2‧‧‧第2洗淨液路Pp2‧‧‧Second washing liquid path

TP‧‧‧透明部TP‧‧‧Transparency Department

W‧‧‧晶圓W‧‧‧ Wafer

圖1是顯示包含本發明之實施形態之處理液生成裝置的基板處理裝置的圖。 圖2A是顯示圖1所示之處理液生成裝置中之上游側第1閥群、上游側第2閥群、下游側第1閥群、及下游側第2閥群之構成例的圖。 圖2B是顯示圖2A所示之第1濃度計測部之構成例的圖。 圖2C是顯示圖2A所示之第2濃度計測部之構成例的圖。 圖3是顯示圖1、圖2A至圖2C所示之處理液生成裝置中之控制各閥之控制系統的構成例的區塊圖。 圖4A是顯示圖3所示之控制系統中之控制單元之處理步驟的一例的流程圖(其1)。 圖4B是顯示圖3所示之控制系統中之控制單元之處理步驟的一例的流程圖(其2)。 圖5是顯示濃度計之校正處理之步驟的一例的流程圖。FIG. 1 is a diagram showing a substrate processing apparatus including a processing liquid generating apparatus according to an embodiment of the present invention. FIG. 2A is a diagram showing a configuration example of an upstream first valve group, an upstream second valve group, a downstream first valve group, and a downstream second valve group in the processing liquid generating device shown in FIG. 1. FIG. 2B is a diagram showing a configuration example of the first concentration measurement unit shown in FIG. 2A. FIG. 2C is a diagram showing a configuration example of a second concentration measurement unit shown in FIG. 2A. 3 is a block diagram showing a configuration example of a control system for controlling each valve in the processing liquid generating device shown in FIGS. 1, 2A to 2C. FIG. 4A is a flowchart (No. 1) showing an example of processing steps of a control unit in the control system shown in FIG. 3. FIG. FIG. 4B is a flowchart (part 2) showing an example of processing steps of a control unit in the control system shown in FIG. 3. FIG. 5 is a flowchart showing an example of the procedure of the calibration process of the densitometer.

Claims (12)

一種處理液生成裝置,是根據濃度計的測定濃度而生成經過濃度調整的處理液,具有: 處理液調整部,用以調整前述處理液的濃度; 第1處理液路,使處理液流向前述處理液調整部; 第2處理液路,使處理液流向前述處理液調整部; 第1濃度計,用以測定在前述第1處理路徑流動之前述處理液的濃度,且前述濃度是在前述處理液調整部之濃度調整相關之成分的濃度; 第2濃度計,用以測定在前述第2處理液路流動之前述處理液的濃度,且前述濃度是應由前述第1濃度計測定濃度,且在前述處理液調整部之濃度調整相關的成分之濃度; 第1閥機構,用以進行前述第1處理液路的開閉;及 第2閥機構,用以進行前述第2處理液路的開閉。A processing liquid generating device generates a concentration-adjusted processing liquid based on a measured concentration of a densitometer, and includes: a processing liquid adjusting unit for adjusting the concentration of the processing liquid; and a first processing liquid path for allowing the processing liquid to flow to the processing. A liquid adjusting section; a second processing liquid path for causing the processing liquid to flow to the processing liquid adjusting section; a first concentration meter for measuring the concentration of the processing liquid flowing in the first processing path, and the concentration is in the processing liquid The concentration of the relevant components is adjusted by the concentration of the adjusting unit; the second concentration meter is used to measure the concentration of the processing solution flowing in the second processing liquid path, and the concentration is to be measured by the first concentration meter, and The concentration of the components related to the concentration adjustment of the processing liquid adjusting section; a first valve mechanism for opening and closing the first processing liquid path; and a second valve mechanism for opening and closing the second processing liquid path. 如請求項1之處理液生成裝置,其中前述第1處理液路包含使前述處理液從前述處理液調整部通過前述第1濃度計而回到該處理液調整部的第1循環液路, 前述第2處理液路包含使前述處理液從前述處理液調整部通過前述第2濃度計而回到該處理液調整部的第2循環液路。The processing liquid generating device according to claim 1, wherein the first processing liquid path includes a first circulating liquid path for returning the processing liquid from the processing liquid adjusting section to the processing liquid adjusting section through the first concentration meter, and The second processing liquid path includes a second circulating liquid path for returning the processing liquid from the processing liquid adjusting section to the processing liquid adjusting section through the second concentration meter. 如請求項1或2之處理液生成裝置,其中前述第1濃度計與前述第2濃度計是利用不同的測定原理測定前述處理液的濃度。For example, the processing liquid generating device according to claim 1 or 2, wherein the first concentration meter and the second concentration meter use different measuring principles to measure the concentration of the processing solution. 如請求項1至3中任一項之處理液生成裝置,具有: 第1校正液路,使濃度為既知之校正液流向前述第1濃度計; 第2校正液路,使濃度為既知之校正液流向前述第2濃度計; 第3閥機構,用以開閉前述第1校正液路;及 第4閥機構,用以開閉前述第2校正液路。For example, the processing liquid generating device according to any one of claims 1 to 3 includes: a first correction liquid path for making a known correction liquid to the first concentration meter; and a second correction liquid path for making a concentration known. The liquid flows to the second concentration meter; a third valve mechanism for opening and closing the first calibration liquid path; and a fourth valve mechanism for opening and closing the second calibration liquid path. 如請求項1至4中任一項之處理液生成裝置,其具有處理液用閥控制部,前述處理液用閥控制部是根據由前述第1濃度計所得之第1測定濃度與由前述第2濃度計所得之第2測定濃度,控制前述第1閥機構及前述第2閥機構的動作。The processing liquid generating device according to any one of claims 1 to 4, further comprising a valve control unit for the processing liquid, wherein the valve control unit for the processing liquid is based on the first measured concentration obtained by the first concentration meter and the first measured concentration obtained by the first concentration meter. The second measurement concentration obtained by the 2 densitometer controls the operation of the first valve mechanism and the second valve mechanism. 如請求項5之處理液生成裝置,其中前述處理液用閥控制部具有: 第1判定部,根據前述第1測定濃度及前述第2測定濃度中之至少第1測定濃度,判定前述第1濃度計是否正常;及 第1閥控制部,當根據該第1判定部判定為前述第1濃度計不正常時,將前述第1閥機構控制成前述第1處理液路為閉狀態。The processing liquid generating device according to claim 5, wherein the processing liquid valve control unit includes a first determination unit that determines the first concentration based on at least a first measurement concentration of the first measurement concentration and the second measurement concentration. Whether the meter is normal; and when the first valve control unit determines that the first concentration meter is abnormal according to the first determination unit, controls the first valve mechanism so that the first processing liquid path is closed. 如請求項5或6之處理液生成裝置,其中前述處理液用閥控制部具有: 第2判定部,根據前述第1測定濃度及前述第2測定濃度中之至少第2測定濃度,判定前述第2濃度計是否正常;及 第2閥控制部,當根據該第2判定部判定為前述第2濃度計不正常時,將第2閥機構控制成前述第2處理液路為閉狀態。The processing liquid generating device according to claim 5 or 6, wherein the processing liquid valve control unit includes: a second determination unit that determines the first measurement concentration based on at least a second measurement concentration of the first measurement concentration and the second measurement concentration. 2 whether the concentration meter is normal; and the second valve control unit, when it is determined by the second determination unit that the second concentration meter is abnormal, controls the second valve mechanism so that the second processing liquid path is closed. 如請求項6之處理液生成裝置,具有: 第1校正液用閥控制部,當根據前述第1判定部判定為前述第1濃度計不正常時,將前述第3閥機構控制成前述第1校正液路為開狀態;及 第1校正處理部,當在前述第1校正液路流動之校正液通過前述第1濃度計時,根據該第1濃度計之輸出值進行該第1濃度計的校正。For example, the processing liquid generating device of claim 6 includes: a first correction liquid valve control unit that controls the third valve mechanism to be the first when the first determination unit determines that the first concentration meter is abnormal. The calibration liquid path is in an open state; and a first calibration processing unit, when the calibration liquid flowing in the first calibration liquid path passes the first concentration timing, the first concentration meter is calibrated based on the output value of the first concentration meter. . 如請求項7之處理液生成裝置,具有: 第2校正液用閥控制部,當根據前述第2判定部判定為前述第2濃度計不正常時,將前述第4閥機構控制成前述第2校正液路為開狀態;及 第2校正處理部,當在前述第2校正液路流動之校正液通過前述第2濃度計時,根據該第2濃度計之輸出值進行前述該第2濃度計的校正。For example, the processing liquid generating device of claim 7 includes: a second correction liquid valve control unit that controls the fourth valve mechanism to be the second when the second determination unit determines that the second concentration meter is abnormal. The calibration liquid path is in an open state; and the second calibration processing unit, when the calibration fluid flowing in the second calibration liquid path passes the second concentration timing, performs the second concentration meter's output based on the output value of the second concentration meter. Correction. 如請求項8之處理液生成裝置,具有第1閥恢復控制設備,該第1閥恢復控制設備是在前述第1校正處理部進行之前述第1濃度計的校正結束後,使前述第1處理液路恢復為開狀態。For example, the processing liquid generating device of claim 8 includes a first valve recovery control device that performs the first processing after the calibration of the first concentration meter by the first calibration processing unit is completed. The fluid path returns to the open state. 如請求項9之處理液生成裝置,具有第2閥恢復控制設備,該第2閥恢復控制設備是在前述第2校正處理部進行之前述第2濃度計的校正結束後,使前述第2處理液路恢復為開狀態。For example, the processing liquid generating device of claim 9 includes a second valve recovery control device for performing the second processing after the calibration of the second concentration meter by the second calibration processing unit is completed. The fluid path returns to the open state. 一種基板處理裝置,具有: 處理液生成裝置,是用以生成根據在濃度計之測定濃度而經過濃度調整的處理液; 工作台,用以保持基板; 驅動機構,用以使前述工作台旋轉;及 處理液供給機構,將藉由前述處理液生成裝置生成之處理液供給到與前述工作台一起旋轉之前述基板的表面, 前述處理液生成裝置具有: 處理液調整部,用以調整前述處理液的濃度; 第1處理液路,使處理液流向前述處理液調整部; 第2處理液路,使處理液流向前述處理液調整部; 第1濃度計,用以測定在前述第1處理液路流動之前述處理液的濃度,且前述濃度是在前述處理液調整部之濃度調整相關成分的濃度; 第2濃度計,用以測定在前述第2處理液路流動之前述處理液的濃度,且前述濃度是應由前述第1濃度計測定濃度,且在前述處理液調整部之濃度調整相關的成分之濃度; 第1閥機構,用以進行前述第1處理液路的開閉;及 第2閥機構,用以進行前述第2處理液路的開閉。A substrate processing device includes: a processing liquid generating device for generating a processing liquid whose concentration is adjusted according to a measured concentration in a densitometer; a table for holding a substrate; a driving mechanism for rotating the foregoing table; And a processing liquid supply mechanism for supplying a processing liquid generated by the processing liquid generating device to a surface of the substrate rotated together with the table, the processing liquid generating device includes: a processing liquid adjusting unit for adjusting the processing liquid The first processing liquid path causes the processing liquid to flow to the processing liquid adjusting section; the second processing liquid path causes the processing liquid to flow to the processing liquid adjusting section; the first concentration meter is used to measure the first processing liquid path A concentration of the processing solution flowing, and the concentration is a concentration of a component related to concentration adjustment in the processing solution adjusting section; a second concentration meter for measuring the concentration of the processing solution flowing in the second processing liquid path, and The concentration is the concentration of a component to be measured by the first concentration meter, and the concentration of the component related to the concentration adjustment in the processing liquid adjusting section; A valve mechanism for opening and closing the first liquid passage; and a second valve means for opening and closing the second liquid path.
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