JP2014120644A - Substrate processing apparatus and self diagnostic method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the rate of operation of an apparatus, while reducing the number of dummy substrates used.SOLUTION: When the parameters after maintenance fall within a fluctuation permissible range, with reference to the parameters, after replacing a circulation filter 25 in the maintenance, a determination unit 39 determines that processing of a substrate W becoming a product is possible. On the basis of the determination of the determination unit 39, a control unit 35 controls a processing unit 1 to perform processing. Since the processing can be carried out under substantially same conditions as those before maintenance, when the control unit 35 controls a processing unit 1 to perform processing, checking is simply required even in the case of verification by a dummy substrate, and thereby the number of dummy substrates used can be reduced. As a result, the rate of operation of an apparatus can be enhanced.

Description

  The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL substrate, an FED (Field Emission Display) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate. The present invention relates to a substrate processing apparatus for processing a substrate and a substrate for a solar cell (hereinafter simply referred to as a substrate) and a self-diagnosis method thereof, and more particularly, to a technique for diagnosing after replacing parts for maintenance.

  Conventionally, as an apparatus of this type, an inner tank that stores a processing liquid and performs processing by immersing a substrate, an outer tank that collects a processing liquid overflowing from the inner tank, and an inner tank and an outer tank are connected to each other. A circulation pipe for supplying and circulating the treatment liquid to the inner tank, a filter member provided so as to cover an upper part of the drainage port of the outer tank communicating with the circulation pipe, and a circulation pipe provided in the treatment liquid. Some include a circulation filter that removes particles and a lifter that holds a plurality of substrates on which a photoresist coating is applied (see, for example, Patent Document 1).

  In the apparatus configured in this manner, for example, in a state where the stripping solution is stored and circulated in the inner tank and the outer tank, a plurality of substrates coated with a photoresist liquid film are placed on the lifter, It is immersed in the stripping solution of the inner tank. Then, while the stripping solution is circulated at a predetermined flow rate according to the recipe and the state is maintained for a predetermined time, the photoresist film deposited on the substrate is stripped. The stripped photoresist film is discharged along with the flow of the stripping solution from the inner tank to the outer tank, and is captured by the filter member. Therefore, clogging of the circulation filter due to the fragments of the photoresist film can be prevented. However, since the fragments of the coating cannot be completely captured by the filter member, it is necessary to perform maintenance and replace the circulation filter.

JP 2002-96012 A

However, the conventional example having such a configuration has the following problems.
That is, in the conventional apparatus, after the circulation filter is replaced by maintenance, it is necessary to verify whether or not the stripping liquid is circulated at a predetermined flow rate according to the recipe and the stripping process is performed under substantially the same conditions as before the maintenance. . Specifically, the actual processing is performed using a dummy substrate equivalent to the product substrate, and the substrate is inspected after the processing, and whether maintenance is in the same range as before maintenance is a problem. Judging that there is no. Therefore, there is a problem that the number of dummy substrates used increases from the maintenance to the processing of the product substrate, and the operating rate of the apparatus decreases.

  The present invention has been made in view of such circumstances, and provides a substrate processing apparatus and its self-diagnosis method capable of improving the operating rate of the apparatus while reducing the number of used dummy substrates. For the purpose.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate processing apparatus for processing a substrate, wherein a processing unit that performs a predetermined process on the substrate and a configuration that affects the processing of the substrate processed by the processing unit. A storage means for preliminarily storing a part, an allowable variation range of a parameter affected by the component, the parameter measured before maintenance, and the parameter after exchanging the component for maintenance Is determined as a post-maintenance parameter, and when the post-maintenance parameter is within the variation allowable range with reference to the parameter, a determination unit that determines that the product substrate can be processed, and the product substrate Control means for performing processing by the processing unit when the processing is possible. .

  [Operation / Effect] According to the first aspect of the present invention, after a component is replaced during maintenance, if the post-maintenance parameter is within the allowable variation range based on the parameter, the determination means is a product. It is determined that the substrate can be processed. Then, the control unit causes the processing unit to perform processing based on the determination of the determination unit. Therefore, when the control unit causes the processing unit to perform processing, processing can be performed under almost the same conditions as before maintenance. The number of sheets used can be reduced. As a result, the operating rate of the apparatus can be improved.

  Note that the fluctuation tolerance here refers to the substrate processing that can be performed on the basis of the substrate processing before the component replacement even if the parameters change and the substrate processing is affected after the component replacement. This is a parameter variation range that can be performed.

  In the present invention, the processing unit includes a processing tank that stores the processing liquid and stores the substrate, and an overflow tank that collects the processing liquid overflowing from the processing tank, and further includes the processing tank and the overflow. A circulation pipe that is connected in communication with the tank, and a circulation filter that is provided in the circulation pipe and removes foreign substances in the processing liquid, the component is the circulation filter, and the parameter is the circulation pipe. The flow rate of the processing liquid to be circulated is preferable (Claim 2).

  In a device that removes foreign matter in the processing liquid using a circulation filter provided in the circulation pipe and that is processed by a treatment unit equipped with a treatment tank and an overflow tank, the circulation pipe is circulated as a parameter when the circulation filter is replaced. Set the flow rate of the processing solution. As a result, even if the next substrate is processed after replacing the circulating filter, the parameters are within the allowable range of variation, so the processing of the product substrate is processed in the same way as the processing before replacing the circulating filter. can do.

  In the present invention, it is preferable that the allowable variation range is set within the abnormality determination range, unlike the abnormality determination range for determining an abnormal operation of the apparatus.

  Since the fluctuation allowable range is set narrower than the abnormality determination range in the case of determining an abnormal operation of the apparatus, it can also be determined that the fluctuation allowable range is within the abnormality determination range.

  According to a fourth aspect of the present invention, in a self-diagnosis method for a substrate processing apparatus for processing a substrate, a parameter affected by the replacement of a component that affects the processing of the substrate processed by the processing unit is measured. A process of exchanging the component parts for maintenance, a process of measuring the parameter as a post-maintenance parameter, and the post-maintenance parameter within a preset allowable fluctuation range based on the parameter. In this case, it is characterized by having a process of determining that a substrate as a product can be processed.

  [Operation / Effect] According to the invention described in claim 4, the parameter affected by the replacement of the component is measured, and after the component is replaced, the parameter is measured as the post-maintenance parameter. Then, based on the parameters, if the post-maintenance parameters are within the allowable fluctuation range, it is determined that the substrate that is the product can be processed. With this self-diagnosis, when processing is performed in the processing unit, processing can be performed under almost the same conditions as before maintenance. The number of sheets used can be reduced. As a result, the operating rate of the apparatus can be improved.

  According to the substrate processing apparatus of the present invention, after replacement of component parts for maintenance, when the post-maintenance parameter is within the allowable variation range based on the parameter, the judging means can process the substrate as a product. It is judged that. Then, the control unit causes the processing unit to perform processing based on the determination of the determination unit. Therefore, when the control unit causes the processing unit to perform processing, processing can be performed under almost the same conditions as before maintenance. The number of sheets used can be reduced. As a result, the operating rate of the apparatus can be improved.

It is a block diagram which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a figure which shows the fluctuation | variation of a flow volume and uses for description of a fluctuation | variation tolerance range. It is a flowchart which shows operation | movement of an apparatus.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to an embodiment.

  The substrate processing apparatus according to the present embodiment is a so-called batch type apparatus that collectively processes a plurality of substrates W. The processing unit 1 includes a processing tank 3 and an overflow tank 5. The processing tank 3 stores the processing liquid and performs processing with the processing liquid on the plurality of substrates W at once. The overflow tank 5 collects the processing liquid overflowing from the processing tank 3. An ejection pipe 7 is attached to the bottom of the processing tank 3. One end side of the circulation pipe 9 is connected to the ejection pipe 7 in communication. The other end side of the circulation pipe 9 is inserted from the upper opening of the overflow tank 5 and connected to the bottom surface of the overflow tank 5.

  The processing unit 1 includes a processing liquid supply unit 11. The processing liquid supply unit 11 includes a supply pipe 13 having one end connected to a processing liquid supply source and the other end connected to the processing tank 3. The supply pipe 13 supplies the processing liquid from the processing liquid supply source to the processing tank 3 and is equipped with a control valve 15 for adjusting the supply and flow rate. Examples of the treatment liquid include pure water and hydrofluoric acid. Here, for example, a case where the substrate W is cleaned by supplying pure water will be described as an example.

  The circulation pipe 9 circulates the pure water supplied to the treatment tank 3 through the overflow tank 5 and the ejection pipe 7. The circulation pipe 9 includes a control valve 17, a circulation pump 19, a control valve 21, an in-line heater 23, a circulation filter 25, and a flow meter 27 in order from the overflow tank 5 side on the upstream side. The circulation pipe 9 is provided with a drain pipe 29 having one end connected in communication between the circulation pump 19 and the control valve 21. The other end of the drainage pipe 29 is connected to a drainage facility (not shown). The drain pipe 29 is provided with a control valve 31.

  The control valve 17 controls the circulation of pure water from the overflow tank 5. The circulation pump 19 pumps pure water from the overflow tank 5. The control valves 21 and 31 perform control for switching the flow of pure water between the circulation pipe 9 and the drain pipe 29. The in-line heater 23 controls the temperature of pure water flowing through the circulation pipe 9. The circulation filter 25 removes foreign substances from the pure water flowing through the circulation pipe 9. The circulation filter 25 is configured to be detachable from the circulation pipe 9. Since the foreign matter accumulates in the circulating filter 25 as processing is performed, it is necessary to periodically replace the circulating filter 25 for maintenance. The flow meter 27 detects the flow rate of the processing liquid flowing through the circulation pipe 9 and outputs a signal corresponding to the flow rate. In this embodiment, the flow rate from the flow meter 27 is handled as a “parameter” in the present invention.

  The circulation filter described above corresponds to the “component” in the present invention.

  A lifter 33 is disposed above the processing unit 1. The lifter 33 holds the plurality of substrates W in a standing posture. The lifter 33 is configured to be movable up and down over a “delivery position” that is above the processing unit 1 and a “processing position” that is inside the processing tank 3.

  The control valves 15, 17, 21, 31, the circulation pump 19, the in-line heater 23, and the lifter 33 are collectively operated by the control unit 35. The control unit 35 is configured by a CPU, a memory, and the like. A storage unit 37 and a determination unit 39 are connected to the control unit 35.

  The storage unit 37 stores recipes, parameters measured before the maintenance of the apparatus, preset parameter fluctuation allowable ranges, parameter abnormality determination ranges for determining apparatus abnormality, and the like.

  The recipe is composed of a plurality of steps that define the processing procedure of the substrate W. The control unit 35 refers to the recipe in the storage unit 37 and sequentially executes the steps.

  Reference is now made to FIG. FIG. 2 is a diagram for illustrating the fluctuation of the flow rate and explaining the fluctuation allowable range.

  The parameter variation allowable range Rvt is used to determine whether or not the parameter (post-maintenance parameter) fv2 measured after the maintenance is within a range that does not affect the processing, with the parameter fv1 before the maintenance as a reference. is there. The parameter abnormality determination range Rml is for determining whether or not the apparatus is in an abnormal state due to a failure or the like with reference to the parameter. Here, the fluctuation allowable range Rvt is set as a reference fv1 ± x% with reference to the parameter fv1 before maintenance, and the abnormality determination range Rml has an upper limit UL and a lower limit DL determined by a flow rate value. To do. The allowable fluctuation range Rvt is set to be within the abnormality determination range Rml. Therefore, if it is within the fluctuation allowable range Rvt, it falls within the abnormality determination range Rml.

  The control unit 35 operates each unit as described above, and sequentially acquires signals corresponding to the flow rate from the flow meter 27. When the start of maintenance is instructed by an operator from an instruction unit (not shown), the control unit 35 transmits the flow rate fv1 at that time to the determination unit 39 as a parameter fv1, and can perform maintenance by stopping the operation of each unit. Put it in a state. Here, after the maintenance work for replacing the circulation filter 25 with a new one is completed, when the operator gives an instruction to end the maintenance from an instruction unit (not shown), the control unit 35 can start the operation of each unit and perform processing. Put it in a state. Further, the control unit 35 transmits the flow rate fv2 from the flow meter 27 to the determination unit 39 as the post-maintenance parameter fv2.

  The determination unit 39 determines whether or not the post-maintenance parameter fv2 is within the fluctuation allowable range Rvt with the parameter fv1 as a reference. When it falls within the fluctuation allowable range Rvt, a process start permission signal is transmitted to the control unit 35. On the other hand, when it is out of the allowable fluctuation range Rvt, an adjustment signal is transmitted to the control unit 35. When receiving the process start permission signal, the control unit 35 informs the operator that the process can be started. Further, when an adjustment required signal is received, the operator is notified that the adjustment is required.

  The control unit 35 described above corresponds to the “control unit” in the present invention, the storage unit 37 corresponds to the “storage unit” in the present invention, and the determination unit 39 corresponds to the “determination unit” in the present invention.

  Next, the operation of the above-described apparatus will be described with reference to FIG. FIG. 3 is a flowchart showing the operation of the apparatus.

Step S1
The control unit 35 operates each unit to cause the processing unit 1 to clean the substrate W with pure water.

Step S2, S3
For example, when the replacement time for replacing the circulation filter 25 has elapsed, the operator instructs the control unit 35 to perform maintenance (step S2). Before stopping the operation of each unit, the control unit 35 causes the flow meter 27 to measure the flow rate, receives the flow rate as the parameter fv1, and transmits the parameter fv1 to the determination unit 37 (step S3).

Step S4
Maintenance is performed to replace the circulation filter 25 with a new one.

Steps S5 and S6
The operator instructs the control unit 35 to end the maintenance (step S5). The control part 35 operates each part according to a process, and makes the state which can be processed. Further, the control unit 3 causes the flow meter 27 to measure the flow rate, receives the flow rate as the post-maintenance parameter fv2, and transmits the post-maintenance parameter fv2 to the determination unit 37 (step S6).

Steps S7 to S9
The determination unit 39 determines whether or not the post-maintenance parameter fv2 is within the fluctuation allowable range Rvt with the parameter fv1 as a reference. When the post-maintenance parameter fv2 is within the variation allowable range Rvt, the control unit 35 is notified that the process can be started (step S8), and when the parameter fv2 is outside the variation allowable range Rvt, the control unit 35 is notified. Is notified that adjustment is necessary (step S9).

  After the above-described operation, the control unit 35 causes the substrate W to be a product to be processed or adjusted using a dummy substrate based on a recipe after an instruction from the operator.

  As described above, according to the present embodiment, after the circulation filter 25 is replaced by maintenance, when the post-maintenance parameter fv2 is within the fluctuation allowable range Rvt with the parameter fv1 as a reference, the determination unit 39 is a product. It is determined that the substrate W can be processed. Then, the control unit 35 causes the processing unit 1 to perform processing based on the determination of the determination unit 39. Therefore, when the control unit 35 causes the processing unit 1 to perform processing, processing can be performed under substantially the same conditions as before maintenance. The number of substrates used can be reduced. As a result, the operating rate of the apparatus can be improved.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the circulation filter 25 has been described as an example of the component, but the component may be the circulation pump 19. In this case, the flow rate described above or the stroke amount of the stroke sensor of the circulation pump 19 may be used as a parameter. Further, when the inline heater 23 is a component, the temperature may be used as a parameter. In addition, the component in this invention is a structure which affects the process of the board | substrate W as mentioned above, and is not sensors which detect a parameter.

  (2) In the above-described embodiment, a so-called batch-type substrate processing apparatus is illustrated, but the present invention can be applied to a so-called single-wafer type substrate processing apparatus that processes the substrates W one by one. . In this case, for example, if the rotation motor that rotates the substrate W is a component, the number of rotations may be used as a parameter.

  (3) In the above-described embodiment, the flow rate value at one point before maintenance is used as a parameter. For example, the average value of the flow rate from the point t1 immediately before the maintenance in FIG. Also good. And also about the parameter after maintenance, you may employ | adopt as an after-maintenance parameter the average value of the flow volume in the time t4 from the time t3 after a maintenance. As a result, erroneous determination due to the influence of noise or the like can be prevented.

W ... Substrate 1 ... Processing unit 3 ... Processing tank 5 ... Overflow tank 9 ... Circulating piping 19 ... Circulating pump 25 ... Circulating filter 27 ... Flow meter 35 ... Control unit 37 ... Storage unit 39 ... Judgment unit Rvt ... Allowable fluctuation range fv1, fv2 ... Parameter Rml ... Abnormality judgment range

Claims (4)

In a substrate processing apparatus for processing a substrate,
A processing unit for performing predetermined processing on the substrate;
Components that affect the processing of the substrate processed in the processing unit;
Storage means for preliminarily storing a variation allowable range of a parameter affected by the component;
After the parameter measured before maintenance and the component parts are replaced for maintenance, the parameter is measured as a post-maintenance parameter, and the post-maintenance parameter is within the variation allowable range based on the parameter. A determination means for determining that a substrate as a product can be processed;
When processing of the substrate to be a product is possible, control means for performing processing by the processing unit,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The processing unit includes a processing tank that stores the processing liquid and stores the substrate, and an overflow tank that recovers the processing liquid overflowing from the processing tank,
Furthermore, a circulation pipe that communicates and connects the treatment tank and the overflow tank, and a circulation filter that is provided in the circulation pipe and removes foreign matters in the treatment liquid,
The substrate processing apparatus, wherein the component is the circulation filter, and the parameter is a flow rate of a processing liquid flowing through the circulation pipe. The substrate processing apparatus according to claim 1 or 2,
The substrate processing apparatus is characterized in that the variation allowable range is set within the abnormality determination range, unlike an abnormality determination range for determining an operation abnormality of the apparatus. In a self-diagnosis method of a substrate processing apparatus for processing a substrate,
The process of measuring parameters affected by the replacement of components that affect the processing of substrates processed in the processing unit;
Replacing the components for maintenance; and
Measuring the parameters as post-maintenance parameters;
When the post-maintenance parameter is within a preset allowable range of variation based on the parameter, a process of determining that the product substrate can be processed;
A self-diagnosis method for a substrate processing apparatus, comprising:

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