JP3519603B2 - Substrate processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor wafer, a glass substrate for plasma display, a glass substrate for liquid crystal,
The present invention relates to a substrate processing apparatus for rinsing a surface of a substrate, such as a printed circuit board, which has been treated with a chemical solution.

[0002]

2. Description of the Related Art In recent years, in a manufacturing process of various substrates such as a semiconductor wafer, a glass substrate for plasma display, a glass substrate for liquid crystal, and a printed circuit board, a substrate processing apparatus for dipping the substrate in a chemical solution and performing various treatments on its surface has been proposed. It is commonly used. Such a substrate processing apparatus includes a chemical solution processing unit having a substrate processing tank to which a chemical liquid is supplied, and a rinse processing unit having a substrate processing tank to which pure water, which is a rinse liquid, is supplied. After immersing in the substrate processing tank supplied with the above, the surface is treated with a chemical solution, and then immersed in the substrate processing tank supplied with the rinse liquid, while supplying the rinse liquid into the substrate processing tank supplied with the rinse liquid. By continuing to do so, a rinse treatment is performed to wash away the chemical liquid adhering to the surface.

Further, in addition to the multi-tank type substrate processing apparatus having a plurality of substrate processing tanks to which the chemical solution and the rinse solution are individually supplied, a single tank type substrate processing apparatus is also widely used. There is. This single tank type substrate processing apparatus is configured such that a chemical solution and a rinsing solution are sequentially supplied to one substrate processing tank. By supplying the chemical solution into the substrate processing tank containing the substrate, While chemical treatment is applied to the surface, when the chemical treatment is completed, pure water, which is a rinse liquid, is supplied into the substrate treatment bath to flush the chemical liquid out of the substrate treatment bath and replace it with the rinse liquid. The rinse treatment is performed to wash away the chemical liquid adhering to the surface of the substrate by continuously supplying the chemical liquid.

By the way, in the above-described substrate processing apparatus, regardless of whether it is a multi-tank type or a single-tank type, if the liquid chemical remains on the surface of the substrate, the liquid chemical processing proceeds unnecessarily or causes the generation of particles. Therefore, it is necessary to finish the rinse process after confirming whether the rinse process has been sufficiently performed. For this reason, in the drainage route of the rinse liquid discharged from the substrate processing tank, a measuring unit of a resistivity measuring device is provided as a detecting means for detecting the mixing degree of the chemical liquid in the rinse liquid, and after the rinse treatment. When the specific resistance of the rinse liquid becomes equal to or higher than a predetermined value, it is determined that the rinse process is completed.

That is, when the rinse treatment is not sufficiently performed, the specific resistance is lowered by the chemical liquid mixed in the rinse liquid, but the rinse treatment is sufficiently performed and the chemical liquid is almost mixed in the rinse liquid. When the specific resistance reaches a predetermined value, it is determined that the rinsing process has been completed.

[0006]

However, in the substrate processing apparatus as described above, the measuring section of the resistivity measuring device, which is the detecting means, is always arranged in the drainage path. In the case of the tank type, the measuring unit is immersed in the rinse liquid containing the chemical liquid, and in the case of the single tank type, the measuring unit is immersed in the rinse liquid containing the chemical liquid and the chemical liquid. . Therefore, there is a possibility that the electrodes and the like that form the measurement unit may be corroded by the chemical liquid with the passage of time and a measurement error may easily occur.

Therefore, it is an object of the present invention to provide a substrate processing apparatus capable of suppressing corrosion of a detecting means for detecting the mixing degree of a chemical solution in a rinse solution by the chemical solution as much as possible. .

[0008]

In order to achieve the above object, a substrate processing apparatus according to a first aspect of the present invention is a substrate processing in which a chemical solution or a rinse solution for washing away the chemical solution is sequentially stored and a chemical solution treatment or a rinse treatment is performed on a substrate. Bath, liquid supply means for sequentially supplying the chemical or rinse liquid to the substrate processing bath, detection means for detecting the degree of mixing of the chemical into the rinse liquid in the substrate processing bath, and detection of the chemical or rinse liquid in the substrate processing bath Introduction means leading to means,
And a diluting means for diluting the chemical liquid introduced to the detecting means by the introducing means.

According to this structure, when the chemical solution in the substrate processing bath is introduced to the detecting means by the introducing means, the chemical solution is diluted by the diluting means. Therefore, the detecting means comes into contact only with the diluted chemical liquid even during the chemical liquid treatment, and the corrosion due to the chemical liquid is suppressed.

A substrate processing apparatus according to a second aspect of the present invention is for rinsing a surface of a substrate that has been subjected to a chemical solution treatment, and a substrate processing tank in which the surface of the substrate is rinsed with a rinse solution, and a substrate processing tank. Detecting means for detecting the degree of mixing of the chemical liquid into the rinse liquid, introducing means for guiding the rinse liquid in the substrate processing tank to the detecting means, and after the start of the rinse treatment, until a predetermined time elapses, the detecting means is detected by the introducing means. And a diluting means for diluting the rinse liquid introduced.

According to this structure, when the rinsing liquid in the substrate processing bath is guided to the detecting means by the introducing means, the rinsing liquid is diluted by the diluting means until a predetermined time has elapsed after the start of the rinsing processing. For this reason, the detection means does not come into contact with the rinse liquid having a high degree of mixing of the chemical liquid, and corrosion by the chemical liquid is suppressed.

A substrate processing apparatus according to a third aspect is the substrate processing apparatus according to the first or second aspect, wherein the diluting means has a diluting liquid supply means for supplying the diluting liquid toward the detecting means. .

According to this structure, the chemical liquid or the rinse liquid guided to the detecting means is diluted with the diluting liquid. For this reason,
The detection means does not come into contact with the chemical liquid or the rinse liquid with a high degree of mixing of the chemical liquid, and corrosion by the chemical liquid is suppressed.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus in which a chemical solution or a rinse solution for flushing the chemical solution is sequentially stored to perform a chemical solution treatment or a rinse treatment on a substrate, and a chemical solution or a rinse solution in the substrate treatment tank. A liquid supply means for sequentially supplying, a detection means for detecting the mixing degree of the chemical liquid in the rinse liquid in the substrate processing tank, an introducing means for guiding the chemical liquid or the rinse liquid in the substrate processing tank to the detection means, and the surroundings of the detection means. The protective means is provided to protect the detecting means from the chemical liquid guided to the detecting means by being covered with the protective liquid.

According to this structure, when the chemical solution in the substrate processing bath is guided to the detection means by the introduction means, the periphery of the detection means is covered with the protection liquid by the protection means. For this reason, the detecting means does not come into contact with the chemical even during the chemical treatment, and corrosion by the chemical is suppressed.

A substrate processing apparatus according to a fifth aspect of the present invention is for rinsing a surface of a substrate that has been subjected to a chemical solution treatment, and a substrate processing tank in which the surface of the substrate is rinsed with a rinse liquid, and a substrate processing tank. Detecting means for detecting the degree of mixing of the chemical solution into the rinse solution, introducing means for guiding the rinse solution in the substrate processing tank to the detecting means, and protecting the surroundings of the detecting means until a predetermined time elapses after the start of the rinse treatment. It is characterized in that it is provided with a protection means for protecting the detection means from the chemical liquid guided to the detection means by being covered with the liquid.

According to this structure, when the rinse liquid in the substrate processing bath is guided to the detection means by the introduction means, the periphery of the detection means is covered with the protection liquid by the protection means until a predetermined time has elapsed after the start of the rinse treatment. . For this reason, the detection means does not come into contact with the rinse liquid having a high degree of mixing of the chemical liquid, and corrosion by the chemical liquid is suppressed.

Further, a substrate processing apparatus according to a sixth aspect is the one according to the fourth or fifth aspect, wherein the protection means has a protection liquid supply means for supplying a protection liquid around the detection means. .

According to this structure, when the chemical liquid or the rinse liquid having a high degree of mixing of the chemical liquid is guided to the detecting means by the introducing means, the protective liquid is supplied around the detecting means by the protective liquid supplying means. Therefore, the detection means does not come into contact with the chemical liquid or the rinse liquid with a high degree of mixing of the chemical liquid, and the corrosion due to the chemical liquid is suppressed.

[0020]

1 is a diagram showing a schematic configuration of a substrate processing apparatus according to a first embodiment of the present invention. In this figure, a substrate processing apparatus includes a substrate processing tank 10 in which a substrate B such as a semiconductor wafer is immersed in a chemical solution or a rinse solution, and the chemical solution processing or the rinse processing is performed on the substrate B, and the inside of the substrate processing tank 10. To the substrate processing bath 10, a pure water supply unit 14 that supplies pure water that is a rinse liquid into the substrate processing tank 10, and a chemical liquid or pure water from these chemical liquid supply units 12. A processing liquid discharge unit 16 for discharging the chemical liquid or pure water overflowing from the upper opening of the substrate processing tank 10 by the supply of pure water from the water supply unit 14, and a control unit 18 for controlling the operation of the entire apparatus are provided. .

The substrate processing tank 10 is formed of quartz glass or the like into a substantially V shape in a side view and a substantially rectangular shape in a plan view, and a carrier (not shown) accommodating a substrate B therein is sandwiched by a transfer robot. Processing liquid supply pipe 20 serving as a supply passage for the chemical liquid and pure water at the bottom thereof.
Are connected. An introduction valve connection pipe 22, a static mixer 24, and a supply / discharge liquid switching valve 26 are sequentially arranged in the treatment liquid supply pipe 20 from the upstream side to the downstream side.
Further, in the introduction valve connecting pipe 22, the chemical liquid introduction valves 28, 30, 32, 34, 36 for introducing the chemical liquid from the chemical liquid supply unit 12 are introduced.
Are connected.

The introduction valve connecting pipe 22 is connected to the chemical liquid supply unit 12 via the chemical liquid introduction valves 28, 30, 32, 34 and 36.
Each of the chemical solutions from is introduced individually. Further, the static mixer 24 mixes the chemical liquid from the chemical liquid supply unit 12 and the pure water from the pure water supply unit 14 to generate a chemical liquid having a predetermined concentration. Further, the supply / discharge liquid switching valve 26 supplies a chemical liquid or pure water into the substrate processing tank 10 or supplies the chemical liquid or pure water in the substrate processing tank 10 through a drain pipe 76 and a drain drain 78 described later. Is discharged to the outside of the device.

The chemical liquid supply section 12 is provided with a plurality of chemical liquids Q _A ,
_{Q B, Q C, Q D} , chemical stores the Q _E container 38,40,4
2, 44, 46 and respective chemical liquid introduction valves 28, 30, 32, 3
4, 36 and each chemical solution container 38, 40, 42, 44, 46
Liquid supply pipes 48, 50, 52, which communicate with each other,
54, 56 and each chemical solution supply pipe 48, 50, 52, 54,
Chemical solution switching valves 481, 501, 5 for opening and closing 56 respectively
And 21,541,561, chemical _{Q A, Q B, Q C} , Q D, Q
Pressure pumps 482, 502, 522, 542, 562 for respectively pumping _E to the processing liquid supply pipe 20 side,
Each pressure pump 482, 502, 522, 542, 562
Solution supply amount measuring devices 48 respectively arranged on the upstream side of the
3, 503, 523, 543, 563, and the chemical liquid filters 484, 504, 52 arranged on the downstream side of the respective pressure pumps 482, 502, 522, 542, 562.
4, 544, 564.

The pure water supply unit 14 pumps pure water W from a pure water supply source (not shown) to the processing liquid supply pipe 20 side.
And a pure water heating unit 60, a pure water opening / closing valve 62, a pressure adjusting regulator 64, a pure water pressure measuring device 66, and a pure water filter 68, which are sequentially arranged on the pure water supply pipe 58 from the upstream side to the downstream side. I have it. The pressure regulator 64 controls the flow rate of pure water pressure-fed in the pure water supply pipe 58 by air pressure control.

The processing liquid discharge section 16 is disposed on the outer periphery of the upper portion of the substrate processing tank 10 and receives a chemical liquid or pure water that overflows from the upper opening of the substrate processing tank 10.
A drainage container 72 for receiving a chemical liquid or pure water discharged from the side opening of the drainage tank 70, and a drainage pipe having one end connected to a drainage port 74 formed at the bottom of the drainage container 72. 76 and a drainage drain 78 connected to the other end of the drainage pipe 76. These drainage tank 70, drainage container 7
2. The drainage pipe 76 and the drainage drain 78 form a drainage path.

FIG. 2 is a perspective view showing in detail the configurations of the drainage tank 70 and the drainage container 72. That is, the drainage tank 70
Is an opening 7 formed by cutting out a part of the side wall 701.
02 and a discharge inclined plate 703 arranged at the bottom of the opening 702 so as to be inclined downward. Therefore, the chemical liquid or pure water that overflows from the upper opening of the substrate processing tank 10 is discharged from the opening 702 and the discharge inclined plate 703.
And is discharged to the drainage container 72 via.

The drainage container 72 is provided with a receiving inclined plate 723 having one end attached to the upper end of the side wall 721 and the other end gently inclined downward toward the opposite side wall 722, The chemical liquid or pure water that has flowed out via the discharge inclined plate 703 of the liquid discharge tank 70 is discharged onto the receiving inclined plate 723. The chemical liquid or pure water discharged onto the receiving inclined plate 723 flows into the bottom of the drainage container 72 from the other end via the receiving inclined plate 723 and is stored therein. When the chemical liquid or pure water flowing into the drainage container 72 exceeds a certain level, it is discharged from the drainage pipe 76 to the outside.

Further, a specific resistance measuring device 80 for measuring the specific resistance of pure water is attached to the drainage container 72 as a detecting means for detecting the mixing degree of the chemical liquid in the pure water. It is arranged horizontally below the receiving inclined plate 723 in the drainage container 72 and at a position where it is immersed in the chemical liquid or pure water.

Further, a diluting liquid supply pipe 82 for diluting the chemical liquid or pure water having a high degree of mixing of the chemical liquid discharged inside is attached to the drainage container 72, and a diluting liquid supply portion 821 on the tip side thereof is received. Below the inclined plate 723, the resistivity measuring device 8
They are arranged in parallel in the vicinity of the 0 measurement unit 801. Also,
The diluting liquid supply pipe 82 is connected to the pure water supply pipe 58 via an opening / closing means 84 such as an air valve for opening / closing a passage, and when the opening / closing means 84 is opened, the pure water is measured by the measuring unit 80.
It is designed to be released toward 1.

In this embodiment, the discharge inclined plate 703 of the drainage tank 70 and the receiving inclined plate 723 of the drainage container 72 are used to measure the chemical liquid or pure water in the substrate processing bath 10 with the measuring unit of the resistivity measuring device 80. An introduction means for leading to 801 is configured.

Returning to FIG. 1, although not shown, the control unit 18 is composed of a CPU for performing a predetermined arithmetic processing, a ROM in which a predetermined processing program is stored, and a RAM for temporarily storing processing data. Therefore, the operation of the substrate processing apparatus is controlled according to the predetermined processing program.

That is, the control unit 18 is connected with the chemical liquid supply amount measuring devices 483, 503, 523, 543, 563, the pure water pressure measuring device 66, and the specific resistance measuring device 80, and a predetermined output signal is inputted. It has become so. In addition, the control unit 18 includes a supply / discharge liquid switching valve 26, chemical liquid introduction valves 28, 3
0, 32, 34, 36, chemical liquid switching valve 481, 501, 5
21, 541, 561, pressure feed pumps 482, 502, 5
22, 542, 562, pure water heating unit 60, pure water open / close valve 6
2. The pressure regulator 64 and the opening / closing means 84 are connected to each other so that their operations are controlled based on the output signal.

Next, the operation of the substrate processing apparatus configured as described above will be described. First, when the start switch (not shown) is turned on, the pure water on-off valve 62 is opened,
Pure water W supplied from an unillustrated pure water supply source is pure water heating unit 6
It is heated to a predetermined temperature at 0 and supplied into the substrate processing bath 10 through the processing liquid supply pipe 20. At this time, the liquid medicine introducing valve 2
8, 30, 32, 34 and 36 are closed and only pure water is continuously supplied into the substrate processing bath 10. And
The pure water overflowing from the upper opening of the substrate processing tank 10 is discharged into the drainage tank 70 and is discharged into the drainage container 72 through the draining inclined plate 703 of the opening 702, and the drainage pipe 76 and the drainage liquid. It is discharged to the outside of the device via the drain 78.

As described above, when the pure water overflows from the substrate processing bath 10, the substrate B is transferred to the substrate processing bath 1.
It is brought into 0. Then, while the first chemical liquid Q _A fed into the substrate processing chamber _{10, Q B, Q C,} Q D, chemical introducing valve 28,30,32,34,36 corresponding to Q _E is opened,
Part 1 of the chemical liquid _{Q A, Q B, Q C} , Q D, 1 pumping pump 482,502,522,542,562 corresponding to Q _E is driven a predetermined chemical liquid (undiluted solution) is introduced valve connecting pipe 22 And is fed to the static mixer 24 via. The chemical solution fed to the static mixer 24 is mixed with the pure water fed from the pure water supply unit 14 in the static mixer 24 to obtain a chemical solution having a predetermined concentration, and then the substrate processing tank 1
It is supplied within 0.

By continuing this operation, the pure water in the substrate processing bath 10 is replaced with the chemical liquid, and the chemical liquid treatment is applied to the surface of the substrate B. At this time, the one chemical liquid introduction valve 28, 30, 32, 34, 36 is opened, so that it is determined that the chemical liquid processing is being performed, and the pure water W fed from the pure water supply source is the pressure adjustment regulator. 64
Is controlled so that the flow rate is smaller than that in the rinse process, and the static mixer 24 is fed to the static mixer 24.

Further, by continuously supplying the chemical solution having a predetermined concentration to the substrate processing tank 10, the chemical solution overflows from the upper opening and is discharged into the drainage tank 70. The chemical liquid discharged into the drainage tank 70 is discharged to the drainage container 72 via the draining inclined plate 703 of the opening 702, as in the case of pure water, and is discharged via the drainage pipe 76 and the drainage drain 78 to the device. It is discharged to the outside.

Further, when it is judged that the chemical liquid treatment is performed as described above, the diluting liquid supply pipe 82 is opened by the opening / closing means 84.
Is opened, and pure water (diluting liquid) is discharged from the diluting liquid supply unit 821 toward the measuring unit 801 of the resistivity measuring instrument 80, and the chemical liquid around the measuring unit 801 or the pure water mixed with the chemical liquid is diluted. It is supposed to be done. As a result, the measuring unit 801 of the resistivity measuring device 80 is prevented from being immersed in the chemical solution or pure water having a high degree of mixing of the chemical solution, and corrosion of the measuring unit 801 by the chemical solution is suppressed.

When a certain period of time has passed and the chemical solution treatment for the substrate B is completed, the open chemical solution introduction valve 2
8, 30, 32, 34, 36 are closed, and the driving of the corresponding one pumping pump 482, 502, 522, 542, 562 is stopped. At this time, the chemical liquid introducing valve 28,
Since all of 30, 32, 34 and 36 are closed, it is determined that the rinse treatment is performed, and the pure water W fed from the pure water supply source has a flow rate higher than that in the chemical treatment by the pressure adjusting regulator 64. It is controlled so as to be fed into the substrate processing bath 10.

Then, when only pure water is supplied into the substrate processing bath 10, the chemical in the substrate processing bath 10 overflows from the upper opening and is discharged into the drainage bath 70, so that the inside of the substrate processing bath 10 is discharged. The chemical solution is replaced with pure water. Drainage tank 70
The chemical liquid discharged to the drainage drain 78 is discharged in the same manner as above.
It is discharged to the outside of the device via. In this way, the chemical solution in the substrate processing bath 10 is replaced with pure water, so that the surface of the substrate B is rinsed with the chemical solution. The pure water that overflows from the substrate processing tank 10 during the rinsing process is discharged to the drainage container 72 via the draining inclined plate 703 and the receiving inclined plate 723, and is discharged to the outside of the apparatus via the drainage drain 78 in the same manner as above. Is discharged.

The pure water is discharged from the diluting liquid supply pipe 82 continuously until a predetermined time elapses after the rinsing process is started, whereby the measuring unit 801 of the specific resistance measuring unit 80 causes the degree of mixing of the chemical liquid. It will not come into contact with high-purity pure water. After the elapse of a predetermined time, the passage is closed by the opening / closing means 84 to stop the release of pure water from the diluting liquid supply pipe 82, while the measuring unit 801 of the specific resistance measuring device 80.
Thus, the specific resistance of the pure water discharged into the drainage container 72 is continuously measured.

The pure water discharged to the drainage tank 70 is discharged to the drainage container 72 via the draining slope plate 703 and the receiving slope plate 723, so that the pure water is discharged into the drainage container 72. The inclusion of bubbles in pure water is suppressed, and the error in measuring the specific resistance due to the inclusion of bubbles in pure water can be reduced.

When the output from the resistivity measuring device 80 exceeds a predetermined value (for example, 18 MΩcm), it is judged that the rinsing process is completed, and the supply of pure water W to the substrate processing bath 10 is stopped. The substrate B is carried out of the substrate processing bath 10 and carried to the next step.

The substrate processing apparatus according to the embodiment of the present invention is
As described above, the specific resistance measuring device 80 detects the degree of mixing of the chemical solution into the pure water after the rinse treatment, which is discharged to the drainage container 72, while the chemical solution or the pure degree of mixing of the chemical solution into the drainage container 72 is high. When the water is discharged, the measuring unit 801 of the resistivity measuring device 80 changes the mixing degree of the chemical solution or the chemical solution by discharging pure water from the diluent supply section 821 to dilute the chemical solution or the pure water having a high mixing degree of the chemical solution. Since it is not soaked in high-purity water, corrosion of the measuring part 801 of the resistivity measuring device 80 due to the chemical liquid can be suppressed as much as possible, and the specific resistance of pure water can be accurately measured for a long period of time. Will be able to.

Further, in the substrate processing apparatus according to this embodiment, since the resistivity measuring device 80 is arranged separately from the substrate processing tank 10, it is affected by the metal ions dissociated in the measuring section 801 and the like. The substrate can be processed in the substrate processing bath 10 without using it. Further, since the resistivity measuring device 80 is arranged apart from the substrate processing tank 10, maintenance work such as replacement of the resistivity measuring device 80 can be easily performed.

The diluent supply unit 8 of the diluent supply pipe 82
The release of pure water from 21 may be stopped at any time after the start of the rinsing process, but empirically, the time when the rinsing process is almost completed is set as the predetermined time, and the predetermined time is stored in the control unit 18. More preferably, the release of pure water is stopped when the predetermined time has elapsed after the start of the rinse treatment. In this way, the measuring unit 801 of the resistivity measuring device 80 is prevented from coming into contact with the pure water containing the chemical solution until the rinse treatment is almost completed, and thus the measuring unit 801
The corrosion of can be suppressed more effectively.

Further, in this embodiment, the diluent supply unit 8
Since pure water is discharged from the measuring unit 801 to the measuring unit 801 of the specific resistance measuring device 80, the chemical solution around the measuring unit 801 or the pure water mixed with the chemical solution can be easily diluted, but not necessarily. It is not necessary to discharge pure water toward the measuring unit 801. In short, if the pure water is discharged into the drainage container 72, the chemical liquid discharged into the drainage container 72 or the pure water mixed with the chemical liquid is discharged from the diluent supply unit 821. Since the measuring unit 801 is diluted with, it is possible to prevent the measuring unit 801 from directly contacting the chemical liquid or pure water in which the chemical liquid is highly mixed, and it is possible to suppress corrosion of the measuring unit 801 by the chemical liquid.

Further, in this embodiment, the diluent supply unit 8
Although the pure water mixed with the chemical liquid or the chemical liquid discharged to the drainage container 72 is diluted by releasing the pure water from 21, the diluted liquid supply unit 821 to the measuring unit 801 of the resistivity measuring device 80 are used, for example. Alternatively, a large amount of pure water may be discharged toward, and the circumference of the measuring unit 801 may be covered with pure water. In such a case, the measuring unit 801 can be protected from the chemical liquid or pure water mixed with the chemical liquid, and the corrosion of the measuring unit 801 by the chemical liquid can be effectively suppressed.

When the circumference of the measuring unit 801 is covered with pure water in this way, for example, a plurality of diluent supplying units 821 are arranged around the measuring unit 801 or the diluent supplying unit 821.
If it is configured in an annular shape and is arranged around the measurement unit 801, the circumference of the measurement unit 801 can be more effectively covered with pure water. When diluting the chemical liquid or the pure water mixed with the chemical liquid, which is discharged to the drainage container 72, the diluting liquid supply unit 821 constitutes a diluting unit, and the measuring unit 801 is used.
In the case where the surroundings of are covered with pure water, the diluting liquid supply unit 821 constitutes a protection means for protecting the measuring unit 801 by covering it with pure water (protective liquid).

In this embodiment, a single tank type apparatus is described as the substrate processing apparatus, but a substrate having a chemical solution processing section and a rinse processing section and having been subjected to the chemical solution processing is a substrate of the rinse processing section. Even in a multi-tank type substrate processing apparatus which carries in a rinsing process by carrying it into the processing tank, the above-described configuration can be applied to the substrate processing tank of the rinsing processing section.

In such a configuration, for example, pure water is discharged from the diluting liquid supply unit 821 in the initial state, and the substrate processed by the chemical solution processing unit is carried into the substrate processing tank of the rinse processing unit. The release of pure water may be stopped after a predetermined time, and the specific resistance of the pure water discharged may be measured. The predetermined time at this time may be any time after the start of the rinsing process, but it is more preferable to empirically find the time when the rinsing process is almost completed and set this as the predetermined time. By doing so, pure water with a high degree of mixing of the chemical liquid is measured by the measuring unit 801.
Can be prevented, and corrosion of the resistivity measuring device can be suppressed.

Further, in this embodiment, the discharge inclined plate 70
3 and the receiving inclined plate 723 are provided so as to suppress the entrainment of bubbles in the pure water discharged to the drainage container 72, but both the discharging inclined plate 703 and the receiving inclined plate 723 are not necessarily provided. However, if any one of them is provided, entrainment of bubbles can be effectively suppressed.

Further, without forming the opening 702 in the drainage tank 70, the processing liquid discharged into the drainage tank 70 is made to flow into the drainage container 72 through the pipe attached to the bottom of the drainage tank 70. May be. In this case, it may be made to flow from the pipe of the drainage tank 70 to the receiving inclined plate 723 of the drainage container 72, or the receiving inclined plate 723 may be removed and directly flowed to the bottom of the drainage container 72 or the like. Good. In this case, the pipe and the receiving inclined plate 723 or the pipe constitutes an introducing means for guiding the chemical liquid or pure water in the substrate processing tank to the measuring unit 801.

The rinse liquid is not limited to pure water, but may be pure water containing ozone. Further, the diluting liquid for diluting the chemical liquid or the pure water having a high degree of mixing of the chemical liquid and the protective liquid for covering and protecting the circumference of the measuring unit 801 are not limited to the pure water, but those containing ozone in the pure water, etc. May be Furthermore, although the specific resistance measuring device 80 is used as the detecting means for detecting the mixing degree of the chemical liquid in the rinse liquid, it is also possible to use another measuring device for measuring the physical properties other than the specific resistance. .

If a material having corrosion resistance to all chemicals used (for example, platinum or carbon) is used as a material for the electrodes of the measuring unit 801, malfunctions due to deterioration of the electrodes, etc. will occur. Can be prevented.

[0055]

As described above, according to the invention of claim 1,
In the rinse liquid of the substrate processing tank, a substrate processing bath for sequentially storing the chemical liquid or the rinse liquid for rinsing the chemical liquid to perform the chemical liquid treatment or the rinse treatment on the substrate, a liquid supply means for sequentially supplying the chemical liquid or the rinse liquid to the substrate processing bath Since the detecting means for detecting the degree of mixing of the chemical liquid into the substrate, the introducing means for guiding the chemical liquid or the rinse liquid in the substrate processing tank to the detecting means, and the diluting means for diluting the chemical liquid guided by the introducing means to the detecting means are provided. The corrosion of the detection means due to the chemical liquid can be suppressed as much as possible.

According to a second aspect of the present invention, there is provided a substrate processing apparatus for rinsing a surface of a substrate which has been subjected to a chemical solution treatment, the substrate processing tank rinsing the surface of the substrate with a rinsing liquid, and the substrate processing. Detecting means for detecting the degree of mixing of the chemical liquid into the rinse liquid in the bath, introducing means for guiding the rinse liquid in the substrate processing bath to the detecting means, and detecting means by the introducing means until a predetermined time has elapsed after the start of the rinse treatment Since it is provided with a diluting means for diluting the rinsing liquid introduced in the above, it is possible to suppress corrosion of the detecting means by the chemical liquid as much as possible.

According to the third aspect of the present invention, since the diluting means has the diluting liquid supply means for supplying the diluting liquid to the detecting means, the corrosion of the detecting means by the chemical liquid is surely suppressed. be able to.

Further, according to the invention of claim 4, a substrate processing tank for sequentially storing a chemical solution or a rinse solution for rinsing the chemical solution to perform a chemical solution treatment or a rinse treatment on the substrate, and a chemical solution or a rinse solution in the substrate treatment tank in order. Liquid supply means for supplying, detection means for detecting the mixing degree of the chemical liquid in the rinse liquid of the substrate processing tank, introduction means for guiding the chemical liquid or rinse liquid of the substrate processing tank to the detection means, and the surroundings of the detection means Since the protective means is provided to protect the detecting means from the chemical liquid guided to the detecting means by covering with the liquid, it is possible to suppress corrosion of the detecting means by the chemical liquid as much as possible.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for rinsing the surface of a substrate which has been subjected to a chemical solution treatment, the substrate processing tank having the surface of the substrate rinsed with the rinse liquid, and the substrate processing. Detecting means for detecting the degree of mixing of the chemical liquid into the rinse liquid in the bath, introducing means for guiding the rinse liquid in the substrate processing bath to the detecting means, and the surroundings of the detecting means until a predetermined time has elapsed after the start of the rinse treatment. Since the protective means is provided to protect the detecting means from the chemical liquid guided to the detecting means by covering with the protective liquid, the corrosion of the detecting means by the chemical liquid can be suppressed as much as possible.

Further, according to the invention of claim 6, since the protection means has the protection liquid supply means for supplying the protection liquid to the periphery of the detection means, the corrosion of the detection means by the chemical liquid is surely suppressed. be able to.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a drainage tank and a drainage container of the substrate processing apparatus shown in FIG.

[Explanation of symbols]

10 Substrate processing tank 12 Chemical liquid supply unit (liquid supply means) 14 Pure water supply unit (liquid supply means) 16 Processing liquid discharge part 70 drainage tank 72 Drainage container 80 Specific resistance measuring device (detection means) 82 Diluent supply pipe (diluting means) 703 Discharge inclined plate (introduction means) 723 Receiving inclined plate (introducing means) B board W Pure water (rinse liquid)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-9-219386 (JP, A) JP-A-9-246226 (JP, A) JP-A-6-21036 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 21/304 648 B08B 3/04 C03C 17/00 C23G 3/00

Claims (6)

(57) [Claims] 1. A substrate processing bath for sequentially storing a chemical liquid or a rinse liquid for rinsing the chemical liquid and performing a chemical liquid treatment or a rinse treatment on a substrate; and a liquid supply means for sequentially supplying the chemical liquid or the rinse liquid to the substrate processing bath, Detecting means for detecting the degree of mixing of the chemical liquid into the rinse liquid of the substrate processing bath, introducing means for guiding the chemical liquid or rinse liquid of the substrate processing bath to the detecting means, and the chemical liquid guided to the detecting means by the introducing means. And a diluting unit for diluting the substrate processing apparatus. 2. A substrate processing apparatus for rinsing a surface of a substrate that has been subjected to a chemical solution treatment, comprising: a substrate processing tank in which the surface of the substrate is rinsed with a rinse solution; and a chemical solution into the rinse solution in the substrate processing tank. Detecting means for detecting the degree of mixing of the substrate, introducing means for guiding the rinse liquid in the substrate processing tank to the detecting means, and after the start of the rinse treatment, a rinsing guided by the introducing means to the detecting means until a predetermined time elapses. A substrate processing apparatus comprising: a diluting unit that dilutes a liquid. 3. The substrate processing apparatus according to claim 1, wherein the diluting unit has a diluting liquid supplying unit that supplies a diluting liquid toward the detecting unit. 4. A substrate processing bath for sequentially storing a chemical liquid or a rinse liquid for rinsing the chemical liquid and performing a chemical liquid treatment or a rinse treatment on the substrate, and a liquid supply means for sequentially supplying the chemical liquid or the rinse liquid to the substrate processing bath, Detecting means for detecting the degree of mixing of the chemical liquid into the rinse liquid in the substrate processing tank, introducing means for guiding the chemical liquid or rinse liquid in the substrate processing tank to the detecting means, and covering the periphery of the detecting means with a protective liquid. A substrate processing apparatus, comprising: a protection unit that protects the detection unit from a chemical liquid that is guided to the detection unit. 5. A substrate processing apparatus for rinsing a surface of a substrate that has been subjected to a chemical solution treatment, comprising: a substrate processing tank in which the surface of the substrate is rinsed with a rinse solution; and a chemical solution into the rinse solution in the substrate processing tank. Detection means for detecting the degree of contamination of the substrate treatment means, introducing means for guiding the rinse liquid in the substrate processing bath to the detection means, and covering the periphery of the detection means with a protective liquid until a predetermined time elapses after the start of the rinse treatment. A substrate processing apparatus, comprising: a protection unit that protects the detection unit from a chemical liquid that is guided to the detection unit. 6. The substrate processing apparatus according to claim 4, wherein the protection unit has a protection liquid supply unit that supplies a protection liquid around the detection unit.