JPH11354483A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the corrosion of a detection means for detecting the mixing degree of a liquid chemical into rinsing liquid as much as possible. SOLUTION: This processor is provided with a waste liquid tank 70 for receiving the liquid chemical or pure water overflowing from a substrate processing tank 10 for processing the surface of a substrate B, and a waste liquid container 72 for receiving the liquid chemical or the pure water discharged from the waste liquid tank 70. The liquid chemical or pure water of the waste liquid tank 70 is discharged to the waste liquid container 72 through a discharge inclination plate 703 disposed in the waste liquid tank 70, and a reception inclination plate 723 disposed in the waste liquid container 72. While the measurement part 801 of a specific resistance measurement device 80 is disposed inside the waste liquid container 72, the dilution liquid supply part 821 of a dilution liquid supply pipe 82 is arranged side by side at a position near the measurement part 801, and the pure water is supplied from the dilution liquid supply part 821 of the dilution liquid supply pipe 82 to the measurement part 801 of the specific resistance measurement device 80, at the time of discharging the liquid chemical or the pure water of the high mixing degree of the liquid chemical to the waste liquid container 72.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor wafer, a glass substrate for a plasma display, a glass substrate for a liquid crystal,
The present invention relates to a substrate processing apparatus that performs a rinsing process on a surface of a substrate such as a printed circuit board that has been subjected to a chemical treatment.

[0002]

2. Description of the Related Art In recent years, in a process of manufacturing various substrates such as a semiconductor wafer, a glass substrate for a plasma display, a glass substrate for a liquid crystal, and a printed circuit board, a substrate processing apparatus for immersing the substrate in a chemical solution and performing various processes on the surface has been developed. It is widely used. Such a substrate processing apparatus includes a chemical processing section having a substrate processing tank to which a chemical is supplied, and a rinsing section having a substrate processing tank to which pure water as a rinsing liquid is supplied. Immersed in the substrate processing tank supplied with the rinsing liquid and then subjected to the chemical treatment, and then immersed in the substrate processing tank supplied with the rinsing liquid, and supplied the rinsing liquid into the substrate processing tank supplied with the rinsing liquid By continuing the rinsing, a rinsing process for washing out the chemical solution adhering to the surface is performed.

In addition to the above-described multi-tank type substrate processing apparatus having a plurality of substrate processing tanks to which a chemical solution and a rinsing liquid are separately supplied, a single-tank type substrate processing apparatus is also widely used. I have. This single-tank type substrate processing apparatus is configured such that a chemical solution and a rinsing liquid are sequentially supplied to one substrate processing tank. After the chemical treatment is performed on the surface, when the chemical treatment is completed, the chemical liquid flows out of the substrate processing tank by supplying pure water as a rinsing liquid into the substrate processing tank, and is replaced with the rinsing liquid. A rinsing process is performed in which the supply of the chemical liquid is continued to wash out the chemical solution attached to the surface of the substrate.

In the above-described substrate processing apparatus, if a chemical solution remains on the surface of the substrate, whether it is a multi-tank type or a single-tank type, the chemical solution processing proceeds unnecessarily or the generation of particles may be caused. Therefore, it is necessary to confirm whether or not the rinsing process has been performed sufficiently before terminating the rinsing process. For this reason, a measuring section of a specific resistance measuring device as a detecting means for detecting the degree of mixing of the chemical solution in the rinsing liquid is provided in a drain path of the rinsing liquid discharged from the substrate processing tank, When the specific resistance of the rinsing liquid becomes equal to or more than a predetermined value, it is determined that the rinsing process has been completed.

That is, when the rinsing treatment is not sufficiently performed, the specific resistance is lowered due to the chemical mixed in the rinsing liquid. However, when the rinsing processing is sufficiently performed, almost no chemical is mixed in the rinsing liquid. Since the specific resistance becomes higher when it disappears, it is determined that the rinsing process has been completed when the specific resistance reaches a predetermined value.

[0006]

However, in the above-described substrate processing apparatus, since the measuring section of the specific resistance measuring device, which is the detecting means, is always disposed in the drainage path, there are many cases. In the case of the tank type, the measuring part is immersed in the rinse liquid mixed with the chemical liquid, and in the case of the single tank type, the measuring part is immersed in the chemical liquid and the rinse liquid mixed with the chemical liquid . For this reason, there is a possibility that the electrodes and the like constituting the measuring unit are corroded by the chemical solution with the passage of time and a measurement error is likely to occur.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a substrate processing apparatus capable of minimizing corrosion of a detecting means for detecting the degree of mixing of a chemical solution in a rinsing solution due to the chemical solution. .

[0008]

In order to achieve the above object, a substrate processing apparatus according to a first aspect of the present invention provides a substrate processing apparatus for sequentially storing a chemical solution or a rinsing solution for washing out the chemical solution and performing a chemical solution process or a rinsing process on the substrate. A tank, a liquid supply means for sequentially supplying a chemical solution or a rinsing liquid to the substrate processing tank, a detecting means for detecting the degree of mixing of the chemical liquid into the rinsing liquid in the substrate processing tank, and a chemical or rinsing liquid for the substrate processing tank Introduction means leading to the means,
And a diluting means for diluting the chemical solution guided to the detecting means by the introducing means.

According to this structure, when the chemical in the substrate processing tank is guided to the detecting means by the introducing means, the chemical is diluted by the diluting means. For this reason, the detecting means comes into contact only with the diluted chemical solution even during the chemical solution treatment, and the corrosion by the chemical solution is suppressed.

According to a second aspect of the present invention, there is provided a substrate processing apparatus for rinsing a surface of a substrate which has been subjected to a chemical treatment, wherein the substrate processing tank is provided with a rinsing liquid for rinsing the surface of the substrate. Detecting means for detecting the degree of mixing of the chemical liquid into the rinsing liquid, introducing means for guiding the rinsing liquid in the substrate processing tank to the detecting means, and detecting means by the introducing means until a predetermined time has elapsed after the start of the rinsing processing. And a diluting means for diluting the rinsing liquid to be guided.

According to this structure, when the rinsing liquid in the substrate processing tank is guided to the detecting means by the introducing means, the rinsing liquid is diluted by the diluting means until a predetermined time elapses after the start of the rinsing processing. For this reason, the detecting means does not come into contact with the rinsing liquid having a high degree of mixing of the chemical liquid, and the corrosion by the chemical liquid is suppressed.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the diluting unit includes a diluting liquid supplying unit that supplies a diluting liquid to the detecting unit. .

According to this structure, the chemical or rinsing liquid guided to the detecting means is diluted by the diluting liquid. For this reason,
The detecting means does not come into contact with the chemical solution or the rinsing liquid having a high degree of mixing of the chemical solution, so that corrosion by the chemical solution is suppressed.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus, comprising: a substrate processing tank for sequentially storing a chemical solution or a rinsing liquid for washing out the chemical solution and performing a chemical processing or a rinsing processing on the substrate; A liquid supply means for sequentially supplying, a detection means for detecting the degree of mixing of the chemical solution into the rinsing liquid in the substrate processing tank, an introduction means for guiding the chemical solution or the rinsing liquid in the substrate processing tank to the detection means, and a periphery of the detection means. And a protection unit that protects the detection unit from a chemical solution guided to the detection unit by covering with the protection liquid.

According to this configuration, when the chemical solution in the substrate processing tank is guided to the detection means by the introduction means, the periphery of the detection means is covered with the protection liquid by the protection means. For this reason, the detecting means does not come into contact with the chemical solution even during the chemical solution treatment, and corrosion due to the chemical solution is suppressed.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for rinsing a surface of a substrate which has been subjected to a chemical treatment, wherein the substrate processing tank is provided with a rinsing liquid for rinsing the surface of the substrate. Detecting means for detecting the degree of mixing of the chemical solution into the rinsing liquid, introducing means for guiding the rinsing liquid in the substrate processing tank to the detecting means, and protecting around the detecting means until a predetermined time has elapsed after the start of the rinsing processing. And a protection unit that protects the detection unit from a chemical solution guided to the detection unit by covering with the liquid.

According to this configuration, when the rinsing liquid in the substrate processing tank is guided to the detection means by the introduction means, the protection means covers the periphery of the detection means with the protection liquid until a predetermined time elapses after the start of the rinsing processing. . For this reason, the detecting means does not come into contact with the rinsing liquid having a high degree of mixing of the chemical liquid, and the corrosion by the chemical liquid is suppressed.

According to a sixth aspect of the present invention, in the substrate processing apparatus according to the fourth or fifth aspect, the protection means includes a protection liquid supply means for supplying a protection liquid around the detection means. .

According to this configuration, when the chemical solution or the rinse liquid with a high degree of mixing of the chemical solution is guided to the detection means by the introduction means, the protection liquid is supplied around the detection means by the protection liquid supply means. For this reason, the detecting means does not come into contact with the chemical solution or the rinsing liquid having a high degree of mixing of the chemical solution, and the corrosion by the chemical solution is suppressed.

[0020]

FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to a first embodiment of the present invention. In this figure, a substrate processing apparatus includes a substrate processing tank 10 for immersing a substrate B such as a semiconductor wafer in a chemical solution or a rinsing liquid, and performing a chemical solution process or a rinsing process on the substrate B; , A pure water supply unit 14 for supplying pure water as a rinsing liquid into the substrate processing tank 10, and a chemical solution or pure water from these chemical solution supply units 12. The apparatus includes a processing liquid discharge unit 16 that discharges a chemical solution or pure water overflowing from an upper opening of the substrate processing tank 10 by supplying pure water from the water supply unit 14, and a control unit 18 that controls the operation of the entire apparatus. .

The substrate processing tank 10 is made of quartz glass or the like and has a substantially V-shape in a side view and a substantially rectangular shape in a plan view, and a carrier (not shown) in which a substrate B is accommodated is held by a transfer robot. The processing liquid supply pipe 20 which also serves as a supply path for the chemical liquid and the pure water is provided at the bottom thereof.
Are connected. In the processing liquid supply pipe 20, an introduction valve connecting pipe 22, a static mixer 24, and a supply / drainage switching valve 26 are arranged in order from the upstream side to the downstream side.
The introduction valve connecting pipe 22 has chemical solution introduction valves 28, 30, 32, 34, and 36 for introducing a chemical solution from the chemical solution supply unit 12.
Are connected.

The introduction valve connecting pipe 22 is connected to the chemical supply section 12 through each of the chemical introduction valves 28, 30, 32, 34, 36.
Each chemical solution from is introduced individually. The static mixer 24 mixes the chemical solution from the chemical solution supply unit 12 and pure water from the pure water supply unit 14 to generate a chemical solution having a predetermined concentration. Further, the supply / drainage switching valve 26 supplies a chemical solution or pure water into the substrate processing tank 10, or supplies a chemical solution or pure water in the substrate processing tank 10 via a drain pipe 76 and a drain 78 described below. Is discharged outside the apparatus.

The chemical solution supply section 12 includes a plurality of types of chemical solutions Q _A ,
_{Q B, Q C, Q D} , chemical stores the Q _E container 38,40,4
2, 44, 46, and each chemical solution introduction valve 28, 30, 32, 3
4, 36 and each chemical solution container 38, 40, 42, 44, 46
Liquid supply pipes 48, 50, 52,
54, 56 and the respective chemical supply pipes 48, 50, 52, 54,
Chemical switching valves 481, 501, 5 for opening and closing 56 respectively
And 21,541,561, chemical _{Q A, Q B, Q C} , Q D, Q
Pumps 482, 502, 522, 542, and 562 for pumping _E to the processing liquid supply pipe 20, respectively;
Each pump 482, 502, 522, 542, 562
Chemical supply amount measuring devices 48 arranged respectively on the upstream side of
3, 503, 523, 543, and 563, and chemical liquid filters 484, 504, and 52 disposed downstream of the pressure pumps 482, 502, 522, 542, and 562, respectively.
4,544,564.

The pure water supply section 14 is a pure water supply pipe 58 for feeding pure water W from a pure water supply source (not shown) to the processing liquid supply pipe 20 side.
And a pure water heating unit 60, a pure water opening / closing valve 62, a pressure regulating regulator 64, a pure water pressure measuring device 66, and a pure water filter 68 which are arranged in this order from the upstream side to the downstream side in the pure water supply pipe 58. Have. The pressure adjustment regulator 64 controls the flow rate of pure water pumped through the pure water supply pipe 58 by air pressure control.

The processing liquid discharge unit 16 is disposed on the outer periphery of the upper part of the substrate processing tank 10 and receives a chemical solution or pure water overflowing from the upper opening of the substrate processing tank 10.
And a drainage container 72 for receiving a chemical solution or pure water discharged from a side opening of the drainage tank 70, and a drainage pipe having one end connected to a discharge port 74 formed at the bottom of the drainage container 72. 76 and a drainage drain 78 connected to the other end of the drainage pipe 76. The drainage tank 70 and the drainage container 7
2. A drain path is constituted by the drain pipe 76 and the drain 78.

FIG. 2 is a perspective view showing in detail the configurations of the drainage tank 70 and the drainage container 72. That is, the drainage tank 70
Is an opening 7 formed by cutting out a part of the side wall 701.
02, and a discharge inclined plate 703 that is disposed at the bottom of the opening 702 so as to be inclined downward. For this reason, the chemical solution or pure water overflowing from the upper opening of the substrate processing tank 10 is discharged from the opening 702 and is discharged to the inclined plate 703.
Is discharged to the drainage container 72 via

The drainage container 72 includes a receiving inclined plate 723 having one end attached to the upper end of the side wall 721 and the other end gently inclined downward toward the opposing side wall 722. The chemical or pure water that has flowed out through the drain inclined plate 703 of the drain tank 70 is discharged onto the receiving inclined plate 723. The chemical or pure water discharged onto the receiving inclined plate 723 flows from the other end to the bottom of the drainage container 72 via the receiving inclined plate 723 and is stored. When the chemical solution or pure water flowing into the drainage container 72 exceeds a certain level, it is discharged from the drainage pipe 76 to the outside.

The drainage container 72 is provided with a specific resistance measuring device 80 for measuring the specific resistance of pure water as detecting means for detecting the degree of mixing of the chemical solution into the pure water. It is disposed horizontally below the receiving inclined plate 723 in the drainage container 72 and at a position where it is immersed in a chemical solution or pure water.

A diluent supply pipe 82 for diluting the chemical discharged into the drainage tank 72 or pure water with a high degree of mixing of the chemical is attached to the drainage container 72, and the diluent supply 821 on the distal end side thereof receives the diluent. Below the inclined plate 723, the resistivity measuring device 8
It is juxtaposed at a position near the zero measuring unit 801. Also,
The diluent supply pipe 82 is connected to the pure water supply pipe 58 via opening / closing means 84 such as an air valve for opening and closing the passage. When the opening / closing means 84 is opened, the pure water is supplied to the measuring section 80.
1 to be released.

In this embodiment, the chemical or pure water in the substrate processing tank 10 is measured by the measuring plate of the resistivity measuring device 80 by the discharging inclined plate 703 of the drain tank 70 and the receiving inclined plate 723 of the drain container 72. The introduction means for leading to 801 is constituted.

Returning to FIG. 1, although not shown, the control unit 18 comprises a CPU for performing predetermined arithmetic processing, a ROM for storing a predetermined processing program, and a RAM for temporarily storing processing data. And controls the operation of the substrate processing apparatus according to the predetermined processing program.

That is, the control unit 18 is connected to the chemical supply amount measuring devices 483, 503, 523, 543, 563, the pure water pressure measuring device 66, and the resistivity measuring device 80, and receives a predetermined output signal. It has become so. The control unit 18 includes a supply / drainage switching valve 26 and chemical solution introduction valves 28 and 3.
0, 32, 34, 36, chemical liquid switching valves 481, 501, 5
21,541,561, pressure pumps 482,502,5
22, 542, 562, pure water heating section 60, pure water on-off valve 6
2. The pressure regulating regulator 64 and the opening / closing means 84 are connected, and each operation is controlled based on the output signal.

Next, the operation of the substrate processing apparatus configured as described above will be described. First, when a start switch (not shown) is turned on, the pure water on-off valve 62 is opened,
Pure water W supplied from a pure water supply source (not shown) is supplied to a pure water heating unit 6.
At 0, the substrate is heated to a predetermined temperature and supplied into the substrate processing tank 10 through the processing liquid supply pipe 20. At this time, the chemical solution introduction valve 2
8, 30, 32, 34 and 36 are closed, and only pure water is continuously supplied into the substrate processing tank 10. And
The pure water overflowing from the upper opening of the substrate processing tank 10 is discharged into the drain tank 70, and is also discharged to the drain container 72 via the discharge inclined plate 703 of the opening 702, and the drain pipe 76 and the drain liquid are discharged. It is discharged to the outside of the apparatus via the drain 78.

As described above, when the pure water overflows from the substrate processing tank 10, the substrate B is moved to the substrate processing tank 1.
It is carried into 0. Then, while the first chemical liquid Q _A fed into the substrate processing chamber _{10, Q B, Q C,} Q D, chemical introducing valve 28,30,32,34,36 corresponding to Q _E is opened,
Part 1 of the chemical liquid _{Q A, Q B, Q C} , Q D, 1 pumping pump 482,502,522,542,562 corresponding to Q _E is driven a predetermined chemical liquid (undiluted solution) is introduced valve connecting pipe 22 Is supplied to the static mixer 24 via the. The chemical solution supplied to the static mixer 24 is mixed with the pure water supplied from the pure water supply unit 14 in the static mixer 24 to obtain a chemical solution having a predetermined concentration, and then the substrate processing tank 1
It is supplied within 0.

Then, by continuing this operation, the pure water in the substrate processing tank 10 is replaced with a chemical, whereby the surface of the substrate B is subjected to the chemical processing. At this time, since one of the chemical liquid introduction valves 28, 30, 32, 34, and 36 is open, it is determined that the chemical liquid processing is to be performed, and the pure water W supplied from the pure water supply source is supplied to the pressure regulating regulator. 64
Is controlled so that the flow rate becomes smaller than that in the case of the rinsing process, and is supplied to the static mixer 24.

Further, by continuously supplying a chemical solution having a predetermined concentration to the substrate processing tank 10, the chemical solution overflows from the upper opening and is discharged into the drain tank 70. The chemical solution discharged into the drainage tank 70 is discharged to the drainage container 72 through the discharge inclined plate 703 of the opening 702 in the same manner as in the case of pure water, and is discharged through the drainage pipe 76 and the drainage drain 78. It is discharged outside.

When it is determined that the process is a chemical process as described above, the diluent supply pipe 82 is opened and closed by the opening / closing means 84.
Is opened, the pure water (diluent) is discharged from the diluent supply unit 821 toward the measuring unit 801 of the resistivity measuring device 80, and the chemical solution around the measuring unit 801 or the pure water mixed with the chemical solution is diluted. It is supposed to be. As a result, the measuring unit 801 of the resistivity measuring device 80 is not immersed in the chemical solution or pure water with a high degree of mixing of the chemical solution, and the corrosion of the electrodes of the measuring unit 801 by the chemical solution is suppressed.

When the processing of the chemical solution on the substrate B is completed after a certain time has elapsed, the one chemical solution introducing valve 2 that has been opened is opened.
8, 30, 32, 34, and 36 are closed, and the driving of the corresponding one of the pumps 482, 502, 522, 542, and 562 is stopped. At this time, the chemical solution introduction valve 28,
Since all of 30, 32, 34, and 36 are closed, it is determined that the rinsing process is performed, and the pure water W supplied from the pure water supply source is supplied by the pressure regulating regulator 64 at a flow rate larger than that in the case of the chemical liquid process. And is fed into the substrate processing tank 10.

When only pure water is supplied into the substrate processing tank 10, the chemical in the substrate processing tank 10 overflows from the upper opening and is discharged to the drain tank 70, so that the chemical in the substrate processing tank 10 is discharged. The chemical is replaced with pure water. Drainage tank 70
Is discharged to the drainage drain 78 in the same manner as described above.
Is discharged out of the apparatus via As described above, the chemical solution in the substrate processing tank 10 is replaced with pure water, so that the surface of the substrate B is subjected to a rinsing process for washing the chemical solution. Pure water overflowing from the substrate processing tank 10 during this rinsing process is discharged to the drainage container 72 via the draining inclined plate 703 and the receiving inclined plate 723, and is discharged outside the apparatus via the drainage drain 78 in the same manner as described above. Is discharged.

The release of pure water from the diluent supply pipe 82 is continuously performed until a predetermined time elapses after the rinsing process is started, whereby the measuring unit 801 of the specific resistance measuring unit 80 determines the degree of mixing of the chemical solution. So that it does not come into contact with high purity water. After the elapse of the predetermined time, the passage is closed by the opening / closing means 84 and the discharge of the pure water from the diluent supply pipe 82 is stopped, while the measuring unit 801 of the resistivity measuring instrument 80 is stopped.
, The specific resistance of the pure water discharged into the drainage container 72 is continuously measured.

The pure water discharged to the drainage tank 70 is discharged to the drainage container 72 via the discharge inclined plate 703 and the receiving inclined plate 723, so that the pure water is discharged into the drainage container 72. Entrapment of bubbles in pure water is suppressed, and a measurement error of the specific resistance due to the mixture of bubbles in pure water can be reduced.

When the output from the resistivity measuring device 80 exceeds a predetermined value (for example, 18 MΩcm), it is determined that the rinsing process has been completed, and the supply of the pure water W to the substrate processing tank 10 is stopped. The substrate B is unloaded from the substrate processing tank 10 and transported to the next step.

The substrate processing apparatus according to the embodiment of the present invention comprises:
As described above, the degree of mixing of the chemical solution into the pure water after the rinsing treatment discharged to the drainage container 72 is detected by the specific resistance measuring device 80, and the pure liquid having a high degree of mixing of the chemical solution or the chemical solution into the drainage container 72 is detected. When water is discharged, pure water is released from the diluent supply unit 821 to dilute the pure water having a high degree of mixing of the chemical solution or the chemical solution, so that the measuring unit 801 of the resistivity measuring device 80 determines the degree of mixing of the chemical solution or the chemical solution. Since it is prevented from being immersed in high pure water, corrosion of the measuring unit 801 of the specific resistance measuring device 80 due to the chemical solution can be suppressed as much as possible, and the specific resistance of the pure water can be accurately measured over a long period of time. Will be able to do it.

In the substrate processing apparatus according to this embodiment, since the specific resistance measuring device 80 is provided separately from the substrate processing tank 10, it is affected by metal ions dissociated by the measuring section 801 and the like. The substrate can be processed in the substrate processing tank 10 without any processing. Further, since the specific resistance measuring device 80 is disposed apart from the substrate processing tank 10, maintenance work such as replacement of the specific resistance measuring device 80 can be easily performed.

The diluent supply section 8 of the diluent supply pipe 82
The timing for stopping the release of the pure water from 21 may be any time after the start of the rinsing process. However, empirically, the ending time of the rinsing process is assumed to be a predetermined time, and the predetermined time is stored in the control unit 18. It is more preferable to stop the release of pure water when the predetermined time has elapsed after the start of the rinsing process. In this way, by preventing the measuring unit 801 of the resistivity measuring device 80 from contacting the pure water mixed with the chemical solution until the time when the rinsing process is substantially completed, the measuring unit 801
Corrosion can be suppressed more effectively.

In this embodiment, the diluent supply unit 8
Since pure water is discharged from 21 to the measuring unit 801 of the resistivity measuring device 80, the chemical solution around the measuring unit 801 or pure water mixed with the chemical solution can be easily diluted, but not necessarily. It is not necessary to discharge pure water toward the measuring unit 801. In short, if pure water is discharged into the drainage container 72, the chemical solution discharged into the drainage container 72 or the pure water mixed with the chemical solution is discharged from the diluent supply unit 821. Therefore, the measurement unit 801 is prevented from directly contacting the chemical solution or pure water having a high degree of mixing of the chemical solution, and the corrosion of the measurement unit 801 due to the chemical solution can be suppressed.

In this embodiment, the diluent supply unit 8
The chemical solution discharged into the drainage container 72 or the pure water mixed with the chemical solution is diluted by discharging the pure water from the drain 21. For example, the diluent supply unit 821 supplies the measuring unit 801 of the resistivity meter 80. , A large amount of pure water may be discharged toward the measuring unit 801, and the periphery of the measuring unit 801 may be covered with pure water. In such a case, the measuring unit 801 can be protected from a chemical solution or pure water mixed with the chemical solution, and corrosion of the measuring unit 801 by the chemical solution can be effectively suppressed.

When the periphery of the measuring section 801 is covered with pure water in this way, for example, a plurality of diluent supply sections 821 may be provided around the measuring section 801 or the diluent supply section 821 may be provided.
Is arranged in an annular shape, and is disposed around the measurement unit 801, the periphery of the measurement unit 801 can be more effectively covered with pure water. When diluting the chemical discharged into the drainage container 72 or pure water mixed with the chemical, the diluent supply unit 821 constitutes a diluting unit, and the measuring unit 801 is used.
When the surrounding area is covered with pure water, the diluent supply unit 821 constitutes a protection unit that covers and protects the measuring unit 801 with pure water (protective liquid).

In this embodiment, a single-tank type substrate processing apparatus is described. However, the substrate processing apparatus has a chemical processing section and a rinsing processing section. The above-described configuration can be applied to the substrate processing tank of the rinsing processing unit also in a multi-tank type substrate processing apparatus that carries the rinsing processing by carrying the rinsing processing into the processing tank.

In such a configuration, for example, pure water is discharged from the diluent supply unit 821 in the initial state, and after the substrate processed in the chemical processing unit is carried into the substrate processing tank of the rinsing processing unit. The discharge of pure water may be stopped after a predetermined time, and the specific resistance of the discharged pure water may be measured. The predetermined time at this time may be any time after the start of the rinsing process. However, it is more preferable to empirically determine a time at which the rinsing process is substantially finished and set the predetermined time. By doing so, the pure water with a high degree of mixing of the chemical solution is measured by the measuring unit 801.
Can be prevented from contacting, and corrosion of the resistivity measuring instrument can be suppressed.

In this embodiment, the discharge inclined plate 70
3 and the receiving inclined plate 723 are provided so as to prevent air bubbles from being trapped in the pure water discharged to the drainage container 72. However, it is necessary to provide both the discharging inclined plate 703 and the receiving inclined plate 723. However, if any one of them is provided, the entrapment of air bubbles can be effectively suppressed.

Also, the processing liquid discharged into the drainage tank 70 is allowed to flow into the drainage container 72 via a pipe attached to the bottom of the drainage tank 70 without forming the opening 702 in the drainage tank 70. You may. In this case, the liquid may be poured from the pipe of the drainage tank 70 into the receiving inclined plate 723 of the drainage container 72, or the receiving inclined plate 723 may be removed and directly flow into the bottom of the drainage container 72 or the like. Good. In this case, the pipe and the receiving inclined plate 723 or the pipe constitute an introduction unit that guides the chemical solution or the pure water in the substrate processing tank to the measuring unit 801.

The rinsing liquid is not limited to pure water, but may be one containing pure water containing ozone. Further, the diluting solution for diluting the chemical solution or pure water having a high degree of mixing of the chemical solution, and the protective solution for covering and protecting the periphery of the measuring unit 801 are not limited to pure water, but include ozone in pure water. It may be. Furthermore, although the specific resistance measuring device 80 is used as a detecting means for detecting the degree of mixing of the chemical solution into the rinsing liquid, other measuring devices for measuring physical properties other than specific resistance may be used. .

If a material having corrosion resistance to all the chemicals used (for example, platinum or carbon) is used as a material for the electrodes and the like of the measuring section 801, malfunctions due to deterioration of the electrodes and the like will occur. Can be prevented.

[0055]

As described above, according to the first aspect of the present invention,
A substrate processing tank for sequentially storing a chemical solution or a rinsing liquid for washing out the chemical liquid and performing a chemical processing or a rinsing processing on the substrate; a liquid supply unit for sequentially supplying the chemical processing liquid or the rinsing liquid to the substrate processing tank; A detecting means for detecting the degree of mixing of the chemical solution into the substrate processing means, an introducing means for guiding the chemical solution or the rinsing liquid in the substrate processing tank to the detecting means, and a diluting means for diluting the chemical solution guided to the detecting means by the introducing means. In addition, corrosion of the detection means by the chemical can be suppressed as much as possible.

According to the second aspect of the present invention, there is provided a substrate processing apparatus for rinsing a surface of a substrate which has been subjected to a chemical treatment, wherein the substrate processing tank is provided with a rinsing liquid for rinsing the surface of the substrate, Detecting means for detecting the degree of mixing of the chemical solution into the rinsing liquid in the tank, introducing means for guiding the rinsing liquid in the substrate processing tank to the detecting means, and detecting means by the introducing means until a predetermined time has elapsed after the start of the rinsing process. And a diluting means for diluting the rinsing liquid guided to the apparatus, so that corrosion of the detecting means by the chemical can be suppressed as much as possible.

According to the third aspect of the present invention, since the diluting means has the diluting liquid supplying means for supplying the diluting liquid to the detecting means, the corrosion of the detecting means by the chemical solution is surely suppressed. be able to.

According to the fourth aspect of the present invention, a chemical treatment or a rinse liquid for washing away the chemical liquid is sequentially stored, and a substrate treatment tank for applying a chemical treatment or a rinsing treatment to the substrate is provided. Liquid supply means for supplying, detection means for detecting the degree of mixing of the chemical solution into the rinsing liquid in the substrate processing tank, introduction means for guiding the chemical or rinsing liquid in the substrate processing tank to the detection means, and protection around the detection means Since the protection means for protecting the detection means from the chemical solution guided to the detection means by covering with the liquid is provided, corrosion of the detection means by the chemical solution can be suppressed as much as possible.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for rinsing a surface of a substrate which has been subjected to a chemical treatment, wherein the substrate processing tank is provided with a rinsing liquid for rinsing the surface of the substrate. Detecting means for detecting the degree of mixing of the chemical solution into the rinsing liquid in the tank, introducing means for guiding the rinsing liquid in the substrate processing tank to the detecting means, and surrounding the detecting means until a predetermined time elapses after the start of the rinsing processing. Since the protection unit is provided with a protection unit that protects the detection unit from the chemical solution guided to the detection unit by covering with the protection liquid, corrosion of the detection unit by the chemical solution can be suppressed as much as possible.

According to the sixth aspect of the present invention, since the protection means has the protection liquid supply means for supplying the protection liquid around the detection means, corrosion of the detection means by the chemical solution is reliably suppressed. be able to.

[Brief description of the drawings]

FIG. 1 is a view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a drainage tank and a drainage container of the substrate processing apparatus shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate processing tank 12 Chemical supply part (liquid supply means) 14 Pure water supply part (liquid supply means) 16 Processing liquid discharge part 70 Drainage tank 72 Drainage container 80 Resistivity measuring device (detection means) 82 Diluent supply pipe (Diluting means) 703 Discharge inclined plate (introducing means) 723 Receiving inclined plate (introducing means) B Substrate W Pure water (rinse liquid)

Claims (6)

[Claims] 1. A substrate processing tank for sequentially storing a chemical solution or a rinsing liquid for washing out a chemical solution and performing a chemical liquid processing or a rinsing processing on a substrate; a liquid supply unit for sequentially supplying a chemical liquid or a rinsing liquid to the substrate processing tank; Detecting means for detecting the degree of mixing of the chemical liquid into the rinsing liquid in the substrate processing tank; introducing means for guiding the chemical liquid or the rinsing liquid in the substrate processing tank to the detecting means; and a chemical liquid guided to the detecting means by the introducing means. And a diluting means for diluting the substrate. 2. A substrate processing apparatus for rinsing a surface of a substrate that has been subjected to a chemical treatment, comprising: a substrate processing tank in which a surface of the substrate is rinsed by a rinsing liquid; and a chemical liquid in the rinsing liquid in the substrate processing tank. Detecting means for detecting the degree of contamination of the substrate, introducing means for guiding the rinsing liquid in the substrate processing tank to the detecting means, and rinsing guided to the detecting means by the introducing means until a predetermined time has elapsed after the start of the rinsing process. A substrate processing apparatus, comprising: a diluting unit for diluting a liquid. 3. The substrate processing apparatus according to claim 1, wherein the diluting unit includes a diluting liquid supplying unit that supplies a diluting liquid to the detecting unit. 4. A substrate processing tank for sequentially storing a chemical solution or a rinsing liquid for washing out the chemical liquid and performing a chemical liquid processing or a rinsing processing on the substrate; a liquid supply unit for sequentially supplying a chemical liquid or a rinsing liquid to the substrate processing tank; Detecting means for detecting the degree of mixing of the chemical solution into the rinsing liquid in the substrate processing tank; introducing means for guiding the chemical solution or the rinsing liquid in the substrate processing tank to the detecting means; and covering the periphery of the detecting means with a protective liquid. And a protecting means for protecting the detecting means from a chemical solution guided to the detecting means by the detecting means. 5. A substrate processing apparatus for rinsing a surface of a substrate that has been subjected to a chemical treatment, wherein the substrate treatment tank rinses the surface of the substrate with a rinsing liquid, and a chemical solution in the rinsing liquid of the substrate processing tank. Detecting means for detecting the degree of contamination of the substrate processing means, introducing means for guiding the rinsing liquid in the substrate processing tank to the detecting means, and covering around the detecting means with a protective liquid until a predetermined time has elapsed after the start of the rinsing process. And a protecting means for protecting the detecting means from a chemical solution guided to the detecting means by the detecting means. 6. The substrate processing apparatus according to claim 4, wherein the protection unit includes a protection liquid supply unit that supplies a protection liquid around the detection unit.