KR20040056635A - Spinner for semiconductor device fabrication - Google Patents

Spinner for semiconductor device fabrication Download PDF

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Publication number
KR20040056635A
KR20040056635A KR1020020083156A KR20020083156A KR20040056635A KR 20040056635 A KR20040056635 A KR 20040056635A KR 1020020083156 A KR1020020083156 A KR 1020020083156A KR 20020083156 A KR20020083156 A KR 20020083156A KR 20040056635 A KR20040056635 A KR 20040056635A
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South Korea
Prior art keywords
hmds
spinner
wafer
semiconductor device
supplying
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KR1020020083156A
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Korean (ko)
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장홍석
서용원
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삼성전자주식회사
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Priority to KR1020020083156A priority Critical patent/KR20040056635A/en
Publication of KR20040056635A publication Critical patent/KR20040056635A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: A spinner apparatus for fabricating a semiconductor device is provided to directly inspect the supply of HMDS(hexamethyldisilazane) and prevent a photoresist pattern from being lifted by an abnormal supply of HMDS by installing a sensor capable of detecting the HMDS component in a pipe for supplying HMDS to a wafer. CONSTITUTION: A detecting apparatus(31) capable of detecting the HMDS component is installed in a supply line(29) for supplying HMDS altogether with carrier gas to generate a signal so that an operator can recognize the signal when the HMDS component is not detected.

Description

반도체 장치 제조용 스피너 장비{Spinner for semiconductor device fabrication}Spinner equipment for semiconductor device manufacturing {Spinner for semiconductor device fabrication}

본 발명은 반도체 장치 제조용 스피너에 관한 것으로서, 보다 상세하게는 스피너 장비의 HMDS 공급과 관련된 것이다.TECHNICAL FIELD The present invention relates to spinners for manufacturing semiconductor devices, and more particularly to HMDS supply of spinner equipment.

반도체 장치의 노광 공정에서 웨이퍼에 포토레지스트를 도포하기 위해 통상 스피너가 사용된다. 스피너 장비에서는 포토레지스트 도포뿐 아니라 이와 관련된 HMDS 처리, 각종 베이크(Bake) 등이 함께 이루어진다. HMDS(Hexamethyldisilazane)는 웨이퍼 표면과 포토레지스트 사이의 접착력을 높이기 위해 웨이퍼 표면 처리용으로 사용된다. HMDS 처리를 하지 않으면 포토레지스트 막에 리프팅이 발생하기 쉬워 정상적인 패턴을 얻기 어렵게 된다.Spinners are commonly used to apply photoresist to wafers in the exposure process of semiconductor devices. In spinner equipment, not only photoresist coating but also HMDS processing and various baking are performed. Hexamethyldisilazane (HMDS) is used for wafer surface treatment to increase the adhesion between the wafer surface and the photoresist. Without the HMDS treatment, the photoresist film is liable to be lifted, making it difficult to obtain a normal pattern.

도1은 스피너 장비에서 종래에 웨이퍼에 HMDS를 공급하여 웨이퍼 표면을 처리하는 장치부를 나타내는 개략적 구성도이다.1 is a schematic block diagram showing an apparatus part for treating a wafer surface by supplying HMDS to a wafer in a spinner apparatus.

도시된 바와 같이 HMDS는 저장 용기(11)에 질소를 공급하면서 질소와 함께 기화된 상태로 웨이퍼 상면에 공급된다. HMDS가 질소와 함께 흐르는 공급용 배관(19)에는 통상 물질의 흐름을 감지 혹은 조절하는 센서 혹은 콘트롤러가 설치되어 있으나 직접 HMDS 성분을 감지할 수 없다. 따라서, HMDS 저장 용기(11)에 HMDS가 소진되어 질소만 공급되는 경우에도 웨이퍼로 HMDS가 공급되는 것으로 인식된다. 결국 노광 공정에서 포토레지스트 패턴 리프팅이 빈발하게 된 후에 HMDS 공급의 문제점을 발견하는 경우가 많다.As shown, the HMDS is supplied to the upper surface of the wafer in a vaporized state with nitrogen while supplying nitrogen to the storage container 11. The supply pipe 19 through which the HMDS flows with nitrogen is usually provided with a sensor or a controller that detects or regulates the flow of a substance, but cannot directly detect the HMDS component. Therefore, even when HMDS is exhausted and only nitrogen is supplied to the HMDS storage container 11, it is recognized that HMDS is supplied to the wafer. As a result, the problem of HMDS supply is often found after the photoresist pattern lifting becomes frequent in the exposure process.

이런 상태에서는 문제가 발생한 사후에 원인을 발견, 조치하게 되므로 노광 공정의 불량 가능성이 많아지고 재작업에 따른 공정 비용 손실이 커지게 된다.In this state, since the cause is found and corrected after the problem occurs, the possibility of a defective exposure process is increased, and the process cost loss due to rework is increased.

본 발명은 상술한 종래의 스피너 장비의 문제점을 해결하기 위한 것으로, 공정 웨이퍼에 포토레지스트 패턴 리프팅같은 불량이 발생하기 전에 HMDS 공급 계통의 문제를 발견하고 웨이퍼에 포토레지스트 도포가 이루어지기 전에 HMDS가 공급되지 않는 사실을 경고할 수 있는 구성을 가진 스피너 장비를 제공하는 것을 목적으로 한다.The present invention is to solve the problems of the above-described conventional spinner equipment, finds a problem of the HMDS supply system before the defect such as lifting the photoresist pattern on the process wafer and supply the HMDS before the photoresist coating is applied to the wafer It is an object of the present invention to provide a spinner device having a configuration that can warn of a failure.

도1은 스피너 장비에서 종래에 웨이퍼에 HMDS를 공급하여 웨이퍼 표면을 처리하는 장치부를 나타내는 개략적 구성도이다.1 is a schematic block diagram showing an apparatus part for treating a wafer surface by supplying HMDS to a wafer in a spinner apparatus.

도2는 본 발명에 따른 스피너 장비에서 웨이퍼에 HMDS를 공급하여 웨이퍼 표면을 처리하는 장치부를 나타내는 개략적 구성도이다.Figure 2 is a schematic block diagram showing an apparatus for treating the surface of the wafer by supplying the HMDS to the wafer in the spinner equipment according to the present invention.

상기 목적을 달성하기 위한 본 발명의 스피너 장비는, 캐리어 가스와 함께 HMDS를 공급하는 공급 라인 상에 HMDS 성분을 검출할 수 있는 감지장치가 설치되어HMDS 성분이 검출되지 않을 때에 작업자가 인식할 수 있는 신호를 발생하도록 이루어지는 것을 특징으로 한다.The spinner equipment of the present invention for achieving the above object is provided with a sensing device that can detect the HMDS component on the supply line for supplying the HMDS with the carrier gas so that the operator can recognize when the HMDS component is not detected. Characterized in that it is made to generate a signal.

이때, HMDS 감지장치는 여러 가지 방식의 것을 사용할 수 있으며, 디지탈 혹은 아나로그 방식의 센서를 사용할 수 있다.At this time, the HMDS detection device may use a variety of ways, it may use a digital or analog sensor.

HMDS 센서의 설치 위치는 웨이퍼가 장착되어 있는 플레이트를 수용하는 HMDS 처리용 챔버의 입구 혹은 HMDS 용기의 출구 등 어디에도 설치할 수 있으며, 이들을 연결하는 배관 상의 여러 위치에도 설치할 수 있다.The installation position of the HMDS sensor can be installed at the inlet of the chamber for HMDS processing or the outlet of the HMDS container that accommodates the plate on which the wafer is mounted, and can be installed at various positions on the pipe connecting them.

본 발명의 스피너 장비는 웨이퍼에 포토레지스트를 도포하기 전에 웨이퍼 표면에 HMDS를 분사하여 처리하는 공정을 가지는 것이 통상이나 이 외의 어떤 형태의 HMDS 공급 장치를 가진 것도 해당될 수 있다.The spinner apparatus of the present invention typically has a process of spraying and processing HMDS on the wafer surface before applying photoresist to the wafer, but may also include any other type of HMDS supply device.

이하 도면을 참조하면서 본 발명의 실시예를 통해 본 발명을 좀 더 상세히 설명하기로 한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

도2는 본 발명에 따른 스피너 장비에서 웨이퍼에 HMDS를 공급하여 웨이퍼 표면을 처리하는 장치부를 나타내는 개략적 구성도이다.Figure 2 is a schematic block diagram showing an apparatus for treating the surface of the wafer by supplying the HMDS to the wafer in the spinner equipment according to the present invention.

액체 상태의 HMDS가 준비되는 저장 용기(11)가 있고, 저장 용기(11)에는 HMDS 중앙 공급 장치에서 HMDS를 공급하는 파이프 라인(17) 및 질소 가스를 공급하는 파이프 라인(15)이 연결되어 있다. 저장 용기(11)에서 질소 가스 버블링을 통해 액체 상태의 HMDS가 기화된다. 기화된 HMDS는 질소 가스와 함께 HMDS 공급 배관(29)을 통해 웨이퍼 처리 챔버(21)로 공급된다. 저장 용기(11)에는 내부에 축적된 가스를 강제로 배기시킬 수 있는 배기 라인(25)과 하부에 생길 수 있는 불순물을 잔류된 소량의 HMDS와 함께 배출시키킬 수 있는 드레인 라인(23)이 설치되어 있다.There is a storage vessel 11 in which a liquid HMDS is prepared, and the storage vessel 11 is connected to a pipeline 17 for supplying HMDS from an HMDS central supply device and a pipeline 15 for supplying nitrogen gas. . The liquid HMDS is vaporized through nitrogen gas bubbling in the storage vessel 11. The vaporized HMDS is supplied to the wafer processing chamber 21 through the HMDS supply pipe 29 together with the nitrogen gas. The storage container 11 is provided with an exhaust line 25 for forcibly evacuating the gas accumulated therein and a drain line 23 for discharging impurities that may be generated in the lower part together with a small amount of residual HMDS. It is.

한편, HMDS 공급 배관(29)에는 종래와 달리 HMDS 성분을 직접 감지할 수 있는 센서(31)가 설치되어 있다. 센서(31)에서는 HMDS 성분이 감지되지 않는 즉시로 자체의 신호를 발생시킨다. 발생된 신호는 센서(31)에 함께 혹은 작업자 근처에 설치된 경보장치(33)를 작동시켜 작업자가 감지할 수 있는 형태의 시각 혹은 청각 경보가 발생된다. 경우에 따라서는 센서(31)의 신호는 HMDS 처리를 끝낸 웨이퍼를 포토레지스트 도포용 스피너 척에 공급하는 이송장치를 중단시키는 인터록(inter lock) 신호로 작용할 수 있다.On the other hand, unlike the conventional HMDS supply pipe 29 is provided with a sensor 31 that can directly detect the HMDS components. The sensor 31 generates its own signal as soon as the HMDS component is not detected. The generated signal is triggered by the alarm device 33 installed in the vicinity of the sensor 31 or near the operator to generate a visual or auditory alarm in the form that can be detected by the operator. In some cases, the signal of the sensor 31 may act as an interlock signal for stopping the transfer device for supplying the wafer after the HMDS processing to the spinner chuck for photoresist application.

경보가 발생되면 작업자는 HMDS 처리와 관련된 작업을 중단시키거나, 중단시키지 않은채 HMDS의 공급 라인(29)이나 저장 용기(11)의 이상 유무를 검토하게 되고, 수작업을 통해서 HMDS의 공급이 이루어지도록 조처할 수도 있다.When an alarm is triggered, the operator stops or stops the work related to HMDS processing and examines whether there is an abnormality in the supply line 29 or the storage container 11 of the HMDS, and supplies HMDS by hand. You can also take action.

HMDS 감지장치는 여러 가지 방식의 것을 사용할 수 있으며, 가령, 디지탈 혹은 아나로그 방식의 센서를 사용할 수 있다. 또한, HMDS 센서(31)의 설치 위치는 웨이퍼가 장착되어 있는 플레이트를 수용하는 HMDS 처리 챔버(21)의 입구, HMDS 저장 용기(11)의 출구 혹은 이들을 연결하는 배관 상의 여러 위치 가운데 어디에도 설치할 수 있다.The HMDS sensor can be used in a variety of ways, for example digital or analog sensors. In addition, the installation position of the HMDS sensor 31 can be installed at any one of the inlet of the HMDS processing chamber 21 containing the plate on which the wafer is mounted, the outlet of the HMDS storage container 11, or various positions on the pipe connecting them. .

본 발명에 따르면, 종래와 달리 웨이퍼에 HMDS를 공급하는 배관에 HMDS 성분을 감지할 수 있는 센서를 설치하므로 HMDS가 공급되는 것을 직접적으로 판단할 수있고, HMDS 공급 이상에 따른 포토레지스트 패턴 리프팅을 사전에 방지하는 효과를 가질 수 있다.According to the present invention, unlike the related art, since the sensor for detecting the HMDS component is installed in the pipe for supplying the HMDS to the wafer, it is possible to directly determine that the HMDS is supplied, and to advance the photoresist pattern lifting due to the abnormal supply of the HMDS. It can have an effect to prevent.

Claims (3)

캐리어 가스와 함께 HMDS를 공급하는 공급 라인 상에 HMDS 성분을 검출할 수 있는 감지장치가 설치되어 HMDS 성분이 검출되지 않을 때에 작업자가 인식할 수 있는 신호를 발생하도록 이루어지는 것을 특징으로 하는 반도체 장치 제조용 스피너 장비.A spinner for manufacturing a semiconductor device, characterized in that a sensing device is provided on a supply line for supplying HMDS together with a carrier gas so as to generate a signal that an operator can recognize when the HMDS component is not detected. equipment. 제 1 항에 있어서,The method of claim 1, 상기 HMDS 감지장치는 디지탈 혹은 아나로그 방식의 센서를 사용하는 것을 특징으로 하는 반도체 장치 제조용 스피너 장비.The HMDS detection device is a spinner device for manufacturing a semiconductor device, characterized in that using a digital or analog sensor. 제 1 항에 있어서,The method of claim 1, 상기 공급 라인은 HMDS 저장 용기와 웨이퍼 표면 처리 챔버를 연결하는 것이며,The supply line connects the HMDS storage container and the wafer surface treatment chamber, 상기 HMDS 감지 장치는 웨이퍼 표면 처리 챔버의 입구 혹은 HMDS 저장 용기의 출구에 설치됨을 특징으로 하는 반도체 장치 제조용 스피너 장비.The HMDS sensing device is a spinner device for manufacturing a semiconductor device, characterized in that installed at the inlet of the wafer surface treatment chamber or the outlet of the HMDS storage container.
KR1020020083156A 2002-12-24 2002-12-24 Spinner for semiconductor device fabrication KR20040056635A (en)

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