TW201812972A - Flip device handler having the same - Google Patents

Abstract

The present invention relates to a flip device handler and, more specifically, to a flip device handler for picking up a device from a loading member such as a wafer ring on which multiple devices are loaded, flipping same and then unloading same. Disclosed is a flip device handler comprising: a loading member table (200) for receiving loading members (60) from a loading member cassette part (100) on which loaded are the plurality of loading members (60) having multiple devices (1) attached thereto, and for moving the loading members (60) in the horizontal direction; one or more unloading parts (300) disposed away in the horizontal direction from the loading member table (200), and having an unloading member (70) for receiving the devices (1) from the loading members (60) and mounting same; a first conveying tool (400) for picking up the devices (1) from the loading members (60) at a pick-up position (P1) on the loading member table (200), flipping same and then moving to a delivering position (P2); and a second conveying tool (500) for receiving the devices (1) from the first conveying tool (400) at the delivering position (P2) and unloading the devices (1) to the unloading member (70) at an unloading position (P3).

Description

   Flip-chip processor   

The present invention relates to a flip-chip component processor, and more particularly, to a flip-chip component processor that picks up components from a loading component such as a wafer ring on which a plurality of components are mounted, and performs flip-chip loading and unloading.

Semiconductor components such as dynamic random access memory, flash memory, LSI, and LED (hereinafter referred to as "components") are generally completed after the semiconductor process is completed, and then subjected to a cutting process and a packaging process.

In addition, terminal structures such as component lead frames and BGAs are becoming more diverse, so there are more and more types of chips.

Furthermore, with the development of fine processes such as nano-fabrication, the overall size of semiconductor devices has become significantly smaller than before.

In addition, under the influence of the development of smart phones and the trend of thinner and lighter smartphones, the size and thickness of components used in smart phones and smart watches are required to be minimized.

In order to meet this trend and requirements, semiconductor components are not packaged based on leads, etc. through bonding machines after the dicing process, but in accordance with Korean Registered Patent No. 10-1088205, individual devices are used through the dicing process from the wafer level to the packaging process The technology of packaging components-the so-called WL-CSP (Wafer level chip scale pacake).

At the same time, when the components used to form the WL-CSP components are small components, the formation of spherical terminations on a wafer-level basis is subject to many restrictions, and there is a problem that the component production process is difficult.

Therefore, for a component that has completed a semiconductor process, a so-called Fan-Out WLP process is proposed in which a single component is leaded, a terminal is formed, etc. after the dicing process.

At the same time, with the intensified competition in semiconductor markets such as dynamic random access memory, mobile dynamic random access memory, and mobile CPUs, it is necessary to reduce component manufacturing costs, and in the end, it is particularly urgent to increase productivity.

In addition, in view of the fact that semiconductor manufacturing processes are performed in ultra-clean plants and the processing speed of the equipment that executes each process in the ultra-clean plants is directly related to productivity, it is important to improve wafer-level components that are not used for packaging or before the process. The processing speed of the component processor or device.

Increasing the processing speed of a component processor or equipment used to offload wafer-level components is particularly important for semiconductor production.

However, a component processor that unloads wafer-level components picks up components from a wafer ring that has completed a semiconductor process and a dicing process, and places them on a loading material such as a carrier tape, thereby unloading the components from the wafer ring.

Here, the processing speed of the component processor (usually calculated as the number of processed hours per hour (UPH)) depends on the processing capacity of the component placed on a carrier material such as a carrier tape after the component is picked up from the wafer ring and inverted.

Specifically, the processing speed of the component processor depends on the wafer ring component picking efficiency determined by the position adjustment between the imaging lens recognition component and the wafer ring and the picker (pickup), and the position of the component on the loading material after picking up. Component loading efficiency.

In addition, the processing speed of the component processor also depends on the accuracy when picking components from a wafer ring with multiple components, picking speed, component transfer after flip-chip, and so on.

An object of the present invention is to satisfy the above-mentioned trend and demand, and to provide a flip-chip component processor that picks up components from a loading component that loads a plurality of components and inverts them and then loads them into unloading components such as a carrier tape, so that the processing of the equipment can be significantly improved. speed.

The present invention is made in order to achieve the above-mentioned object of the present invention. The present invention discloses a flip-chip component processor, which is characterized by including a loading component work tray 200 and loading of a loading component 60 to which a plurality of components 1 are attached. The component carrier portion 100 receives the loading component 60 and moves the loading component 60 in a horizontal direction; the unloading portion 300 is horizontally spaced from the loading component work tray 200 and is provided with one or more components receiving the component 1 from the loading component 60 and loading it. unloading unit 70; a first delivery tool 400, the working disk loading member pickup position P ₁ of the loading member 60 and the pickup element 1 is flip 200, after moving to the transfer position P _2; second transfer means 500, in the transfer position P ₂ receives the component 1 from the first transfer tool 400 and unloads the component 1 to the unloading member 70 at the unloading position P ₃ .

The first conveyance tool 400 may include two or more pickers 410 that rotate on the loading part work tray 200 around the first rotation axis 420 perpendicular to the upper part of the loading part 60 through the picking position P ₁ and the transfer position P ₂ , Picking up the component 1 at the pick-up position P ₁ , and transferring the component 1 to the second transfer tool 500 at the transfer position P ₂ ; the first rotation driving part rotates and drives two or more of the pickers 410 with the first rotation axis 420 as the center; , Passing through the pick-up position P ₁ and the transfer position P ₂ in sequence; the flip rotation part 430 rotates the pick-up head of the picker 410 at the pick-up position P ₁ toward the top of the loading member 60, and makes the pick-up 410 at the transfer position P ₂ The pickup head is facing up.

The second conveyance tool 500 includes two or more pickers 510 that rotate on the loading member work tray 200 around a second rotation axis 520 that is perpendicular to the upper surface of the loading member 60 to pass through the transfer position P ₂ and the unloading position P ₃ , Picking up the component 1 picked up by the picker 410 of the first transfer tool 400 and flipped at the picking position P ₁ , and unloading the component 1 to the unloading part 70 at the unloading position P ₃ ; 520 rotates and drives two or more pickups 510 as the center, and passes the transfer position P ₂ and the unloading position P _{3 in order} .

The advantages of the flip-chip processor of the present invention are as follows: a transfer tool for transferring components is constituted by using a plurality of pickers that rotate around a rotation axis that is perpendicular to the top of a loading member such as a wafer ring, and then picks up the components When placing and placing, multiple components can be picked and placed at once, which can significantly increase the unloading speed of components.

Further, the advantages of the flip-chip processor of the present invention are as follows: the first transfer tool is used to perform picking and flip-chip components from loading parts such as wafer rings, and the second transfer tool is used to perform pick-up by the first transfer tool and The components are flipped to unload to the unloading section, so that the components can be continuously picked up, flipped and placed, which can significantly increase the speed of component unloading.

In particular, the first transfer tool rotates around a rotation axis that is perpendicular to the upper surface of the loading part, and after picking and flipping the component at the pick-up position, it is transferred from the transfer position to the second transfer tool. Installation and placement, which can significantly improve component unloading speed.

At the same time, the second transfer tool is a component that is picked up and inverted by the first transfer tool around a rotation axis that is perpendicular to the upper layer of the loading part, and receives the component from the first transfer tool at the transfer position and unloads at the unloading position. Components can therefore be continuously picked, flipped, and placed, which can significantly increase component unloading speed.

That is, the first conveying tool and the second conveying tool have a horizontal turntable structure in which a plurality of pickers rotate horizontally, so that components can be continuously picked up, inverted, and placed, thereby significantly improving component unloading speed.

1‧‧‧ components

22‧‧‧slot

24‧‧‧Vacuum pressure forming device

60‧‧‧ Loading parts

61‧‧‧Tape

62‧‧‧Frame Parts

70‧‧‧ unloading parts

71‧‧‧ Pocket

78‧‧‧ roller parts

79‧‧‧ support parts

100‧‧‧ Loading parts carrier

200‧‧‧ Loading component work tray

300‧‧‧Unloading Department

311‧‧‧Structure 1

312‧‧‧Structure 2

400‧‧‧ First Teleporter

410‧‧‧Pickup

420‧‧‧first rotation axis

430‧‧‧ Flip Rotary

500‧‧‧ Second Teleporter

510‧‧‧Pickup

520‧‧‧Second rotation axis

810‧‧‧First Image Acquisition Department

820‧‧‧Second Image Acquisition Department

830‧‧‧Third Image Acquisition Department

840‧‧‧Fourth Image Acquisition Department

P ₁ ‧‧‧Pick up position

P ₂ ‧‧‧ pass location

P ₃ ‧‧‧ unloading position

1 is a plan view showing a design concept of a flip-chip processor according to the present invention; FIGS. 2a and 2b are perspective views and cross-sectional views showing an example of a loading component suitable for the flip-chip processor of FIG. 1; FIG. 1 is a perspective view of another example of a loading part of the flip-chip processor; FIG. 4 is a cross-sectional view taken along the IV-IV direction of FIG. 1; and FIG. 5 is a view showing the use of the first transfer tool and the second transfer tool in FIG. 1. Partial side view of the transfer process.

The following describes a flip-chip processor according to the present invention with reference to the accompanying drawings.

As shown in FIGS. 1 and 5, the flip-chip component processor of the present invention includes a loading component work tray 200, and the loading component 60 is obtained from a loading component carrier 100 for loading a loading component 60 to which a plurality of components 1 are attached, and the loading component 60 is horizontally oriented. The loading part 60 is moved; the unloading part 300 is horizontally spaced from the loading part work tray 200, and is provided with more than one unloading part 70 that is connected to the component 1 from the loading part 60 and loaded; The component work tray 200 picks up the component 1 from the pick-up position P _{1 of the} loading component 60 and then flips to the transfer position P ₂ ; the second transfer tool 500 receives the component 1 from the first transfer tool 400 at the transfer position P ₂ , At the unloading position P _3, the component 1 is unloaded to the unloading member 70.

The loading member carrier portion 100 loads a loading member 60 to which a plurality of components 1 are attached, and various structures can be adopted.

Among them, the components loaded on the loading part 60 are components that complete the semiconductor process and the dicing process in a wafer state; the components classified by a separate component processor through a visual inspection in the wafer state can be various components.

In particular, the component 1 is different from a general component that is subjected to a packaging process after a semiconductor process, and a variety of components such as a wafer-level component that does not require a packaging process can become its object and be loaded in an inverted state (that is, in an inverted state). The unloading member 70 such as a carrier tape may also be referred to as its object.

In addition, as shown in FIGS. 2 a and 2 b, the mounting member 60, as a structure for loading the component 1 that has completed the semiconductor process and the dicing process, includes a tape 61 to which the component 1 is attached and a frame member 62 that fixes the tape 61.

In addition, the adhesive tape 61 may be a component of any attachable element 1.

The frame member 62 has a structure for fixing the adhesive tape 61 of the attachment element 1, and may include a circular ring as shown in FIGS. 2 a and 2 b, a four-corner ring as shown in FIG. 3, and the like, and various structures may be adopted.

On the other hand, as for the unloading member 70, as long as it has a structure capable of loading the flip-chip component 1, it may be any structure, and a tape as shown in FIG. 1 and a tape carrier tape and an upper sealing tape may be used; as shown in FIG. 3 The illustrated tape-attached tray, a tray composed of a plurality of insertion slots of the loading element 1, and the like can be used for a variety of parts temporarily loaded for market shipment or other processes.

In addition to the components for temporarily loading the component 1, the unloading component 70 may be a component for loading a wafer or a packaging process such as a substrate such as a PCB for manufacturing the component 1, a strip, or a lead frame of a wafer.

The loading member carrier portion 100 is configured to load a plurality of loading members 60, and any structure may be used as long as a plurality of loading members 60 are stacked on top of each other.

The loading member work tray 200 is configured to receive the loading member 60 from the loading member carrier portion 100 and move the loading member 60 in the horizontal direction, and various structures can be adopted.

For example, the loading unit work tray 200 receives the loading unit 60 from the loading unit carrier 100 through a wafer ring loading unit (not shown), and moves the loading unit 60 in a horizontal direction, so that the first transfer tool 400 picks up the component 1. The structure can be a variety of structures such as XY work plate, XY-θ work plate.

In addition, the loading member work tray 200 can be moved in the vertical direction, that is, in the Z-axis direction.

And, preferably, thimble assembly 200 is disposed in the working disk loading member (not shown), and further smooth the pickup position P ₁ pickup element.

The thimble assembly is that the picker 410 of the first transfer tool 400 applies pressure to the loading member 60 when picking up the component 1 at the picking position P ₁ , for example, applies pressure to the bottom surface of the tape 61 on the wafer ring to attach the component The tape 61 of 1 can be lifted in the direction of the picker 410, etc., and various structures are employable.

In addition, it is preferable that a first image acquisition portion 810 that acquires an image of the component 1 loaded on the loading member 60 is provided on the pickup 410 of the first transfer tool 400 at the pickup position P ₁ .

The first image acquisition unit 810 is configured to acquire an image of the element 1 loaded on the loading unit 60, and various structures such as a scanner and a camera can be adopted.

Also, the first image acquisition section 810 may be applied to identify the position of the component 1 picked up by the picker 410 of the first conveyance tool 400, inspect the upper part of the component 1, and the like.

The first image acquisition section 810 is preferably provided near the loading member 60. In order to prevent the interference of the first transfer tool 400, it may be provided on the upper portion of the loading member work tray 200 and may be moved horizontally or vertically.

In addition, as for the loading part loading part (not shown) for transferring the loading part 60 from the loading part carrier part 100 to the loading part work tray 200, as long as the loading part 60 can be taken out from the loading part carrier part 100 and the loaded loading part 60 can be taken out The structure transferred to the loading unit work tray 200 may be any structure.

For example, the loading part loading section may have various structures such as a clamping device and a linear driving device structure, or a linear driving device including a pushing unit and a linear moving pushing unit.

The unloading section 300 is horizontally spaced from the loading member work tray 200 and is provided with an unloading member 70 that receives the flipped component 1 from the loading member 60 for loading, and can adopt various structures.

In particular, the unloading unit 300 can be determined according to the configuration of the unloading member 70 such as a tape and a reel (a carrier tape and a top cover tape).

For example, as shown in FIGS. 1 and 4, the unloading section 300 includes a unwinding shaft, a pocket section 71 of the loading element 1 formed along the length unfolding direction, and a carrier tape sealed by an adhesive tape (not shown) after loading the element. In the case where the unloading member 70 is configured, it is rotatably provided on one end to wind the carrier tape of the element 1 to be loaded; and a winding roller (not shown) is rotatably provided on the other end and is wound around the loading element and sealed by an adhesive tape. The carrier tape guide (not shown) guides the movement of the carrier tape so that the carrier tape unwound from the unwinding roller (not shown) passes through the loading position.

Here, as shown in FIG. 4, the unloading member 70 may form a plurality of grooves 22 on the bottom surface of the pocket portion 71 of the loading element 1.

Then, when the unloading member 70 is located at the loading position, a vacuum pressure forming device 24 for forming a vacuum pressure vertically below the unloading member 70 is provided, and when the second transfer tool 500 described later is loaded, the element 1 can be stably loaded.

Here, as shown in FIG. 4, when the unloading member 70 is a carrier tape, a pair of roller members 78 that guide a wing portion of the carrier tape and a support member 79 that fixes the roller members can be used to guide the movement process.

As another example of the unloading section 300, when a board (see FIG. 3) of the unloading member 70 is attached, the component unloading section 300 may include a board loading section provided at one end and loading a board to which a plurality of semiconductor elements 1 are attached. XY stage, which supports and moves the component at the component 1 loading position, and can receive the component 1 through the conveying tool 500; the tray moving section (not shown) transfers the plate from the tray loading section to XY station.

Here, as shown in FIG. 3, as a structure similar to the loading member 60, the plate is composed of a frame member having an adhesive tape of the attachment element 1 and a fixed adhesive tape, and having a lot (LOT) number, a classification level, and other identifiers. Or, as a tray formed with a plurality of insertion grooves in which the component 1 is formed, a standard tray, that is, a reliability test (JEDEC) tray can be used according to the type of the component 1.

On the other hand, as shown in FIG. 1, the unloading section 300 is constituted only by one of the structure 1 311 for loading the component 1 on a carrier tape and the structure 2 312 for loading the component 1 on a board, or the structure 1 311 And structure two 312 includes two or all structures.

In addition, of course, the unloading unit 300 may be provided with at least two identical structures, specifically, a structure 1 311 for loading the component 1 on a carrier tape, a structure 312 for loading the component 1 on a board, and the like.

Here, if a plurality of unloading sections 300 are used, they need to be moved in the direction in which they are arranged. At this time, each of the pickers 510 of the second conveyance tool 500 can be moved horizontally along the arrangement direction of the unloading sections 300 individually or entirely.

The first transfer tool 400 has a structure in which the loading member work tray 200 can be picked up from the loading member 60 at the picking position P ₁ and flipped to the transfer position P ₂ , and various structures can be adopted.

For example, the plurality of pickers 410 may adopt a horizontally rotating horizontal turntable structure, that is, as shown in FIG. 1 and FIG. 2, the first transfer tool 400 may include two or more pickers 410, and a loading tray 200, in the above load in a vertical member 60 of the first rotary shaft 420 rotates through the pick-up position P ₁ P ₂ and the delivery location, the pickup element picking position P ₁ 1, P ₂ and the delivery location is transmitted to the second transmission means 500 Element 1; a first rotation driving part, which drives two or more pickups 410 in rotation around a first rotation shaft 420 as a center, and sequentially passes through a pickup position P ₁ and a transfer position P ₂ ; the flip-chip rotation part 430 makes the pickups by rotating The pickup head of 410 faces the upper side of the loading member 60 in the pickup position P ₁ , and the pickup head of the pickup 410 faces the upper side in the transfer position P ₂ .

Two or more pickers 410 can be rotated on the loading member work tray 200 around a first rotation axis 420 that is perpendicular to the upper portion of the loading member 60 as a center, to pass through the picking position P ₁ and the transfer position P ₂ , and at the picking position P ₁ Various structures can be adopted for picking up the component 1 and transferring the component 1 to the second transfer tool 500 at the transfer position P ₂ .

In particular, each picker 410 can pick up the component 1 from the loading member 60 using vacuum pressure.

For example, the picker 410 may include an air pressure connection portion that receives air pressure from the outside, and a pickup head provided at an end to pick up or release the element 1 by using the air pressure transmitted by the air pressure connection portion.

At the same time, two or more pickups 410 are spaced a fixed distance from each other with the first rotation axis 420 as the center, and the pickups are arranged at equal intervals, such as 180 ° for two, 120 ° for three, and 90 ° for four.

Moreover, the picker 410 is rotated around the first rotation shaft 420, and the picker 410 can be rotated by a rotary joint or the like and can transmit air pressure. The first rotation driving unit adopts a structure in which two or more pickups 410 are rotationally driven in order through the pickup position P ₁ and the transfer position P ₂ with the first rotation axis 420 as a center. Various structures such as rotary motors.

The flip rotation part 430 uses a rotary picker 410, so that the picking head of the picker 410 faces the loading member 60 at the picking position P _{1 and} the picking head of the picker 410 at the transfer position P ₂ faces the upper side. structure.

For example, the flip-chip rotation portion 430 is connected to the first rotation shaft 420 and is provided on an arm portion supporting each of the pickups 410, and may be constituted by a rotation motor that rotates the pickups 410.

The second transfer tool 500 adopts a structure in which the component 1 is received from the first transfer tool 400 at the transfer position P _{2 and the} component 1 is unloaded to the unloading member 70 at the unloading position P ₃ , and various structures can be adopted.

For example, as shown in FIGS. 1 and 2, the second conveyance tool 500 may include two or more pickers 510, and a second rotation axis 520 that is perpendicular to the upper part of the loading part 60 on the loading part work tray 200 as the center of rotation, to pass through the transfer position and the unloading position P ₂ P _3, P ₁ position of the pickup at the pickup 410 is a first pick-up transfer means 400 and flip chip pickup element 1, P ₃ in the unloading position to unload the unloading means 70 Element 1; the second rotation driving unit drives two or more pickups 510 in rotation around the second rotation shaft 520 as the center, and sequentially passes through the transfer position P ₂ and the unloading position P ₃ .

More than two pickup 200 to 510 using a second rotary shaft 520 in a vertical load to the upper member 60 rotates around the loading plate working member to pass through the position P ₂ and the unloading position P _3, at the pickup position P ₁ The structure of picking up the component 1 picked up by the picker 410 of the first transfer tool 400 and being flipped, and unloading the component 1 to the unloading part 70 at the unloading position P ₃ , and various structures may be adopted.

In particular, each picker 510 may use vacuum pressure to pick up the flip-chip component 1 by the picker 410 of the first transfer tool 400.

For example, the picker 510 may include: an air pressure connection portion that receives air pressure from the outside; and a pickup head provided at an end to pick up or release the element 1 by using the air pressure transmitted from the air pressure connection portion.

Then, two or more pickups 510 are spaced a fixed distance from each other with the second rotation axis 520 as the center, 180 ° for two, 120 ° for three, 90 ° for four, etc., and they can be arranged at equal intervals.

In addition, the pickup 510 is rotated about the second rotation shaft 520 as a center, and each of the pickups 510 can be rotated by a rotary joint or the like while transmitting air pressure.

The second rotation driving part adopts a structure in which two or more pickups 510 are rotationally driven with the second rotation shaft 520 as the center, and sequentially passes through the transfer position P ₂ and the unloading position P ₃ . Various structures such as rotary motors.

On the other hand, reference numerals 820, 830, and 840 that are not described in the drawings are each a second image acquisition section, a third image acquisition section, and a fourth image acquisition section.

The second image acquisition section 820 is provided at an upper portion of the transfer position P ₂ and acquires an image of the element 1 picked up by the pickup 410 of the first transfer tool 400. Various structures such as a scanner and a camera can be adopted.

In addition, the second image acquisition section 820 can also be applied to confirm the position of the component 1 picked up by the pickup 410 of the first conveyance tool 400, check the bottom surface of the component 1, and the like.

In particular, the second image acquisition section 820 is applicable to correct a rotation error (a rotation error in the Z-axis direction) of the element 1 picked up by the pickup 410 of the first transfer tool 400.

At this time, the rotation error of the component 1 picked up by the picker 410 of the first transfer tool 400 can be corrected by finely rotating the picker 410 of the first transfer tool 400 around the Z axis and finely rotating the second transfer tool around the Z axis. 500's picker 510 and so on.

The third image acquisition section 830 is provided on the moving path of the picker 510 of the second transfer tool 500 that picks up the component 1, and acquires an image of the element 1 picked up by the picker 510 of the second transfer tool 500. A scanner, Various structures such as cameras.

Then, the third image acquisition section 830 can also be applied to confirm the position of the component 1 picked up by the pickup 510 of the second conveyance tool 500, check the top of the component 1, and the like.

The fourth image acquisition section 840 may adopt a structure that acquires an image of the element 1 that is unloaded on the unloading part 70 of the unloading section 300 by the pickup 510 of the second transfer tool 500, and may adopt various structures such as a scanner and a camera.

In addition, the fourth image acquisition section 840 can be applied to confirm the state of the component 1 on the unloading section 70 of the unloading section 300 by the pickup 510 of the second transfer tool 500.

The above description is only part of the preferred embodiments that can be implemented by the present invention. Therefore, it is well known that the scope of the present invention cannot be limited by the above-mentioned embodiments, and the technical idea of the present invention as described above and its fundamental technical idea are included in the scope of the present invention.

Claims (3)

A flip-chip component processor includes a loading component work tray (200) that receives the loading component (60) from a loading component carrier (100) loading a loading component (60) to which a plurality of components (1) are attached. ) And move the loading member (60) in a horizontal direction; an unloading section (300) is horizontally spaced from the loading member work tray (200), and is provided with more than one from the loading member (60) An unloading part (70) that receives the component (1) and loads it; a first transfer tool (400) at a pick-up position (P) of the loading part work tray (200) from the loading part (60) ₁ ) picking up the component (1) and flipping it, and then moving to a transfer position (P ₂ ); and a second transfer tool (500) from the first transfer at the transfer position (P ₂ ) means (400) receiving the element (1), a discharge unit to said unloading position (P _{3) (70)} remove the element (1). The flip-chip processor according to item 1 of the scope of patent application, wherein the first transfer tool (400) includes: two or more pickers (410), and the loading part work tray (200), a first rotating shaft (420) to above the loading member (60) is rotated perpendicular to through the pickup position ((P ₁₎ and said transfer position (P _2), said pickup position ((P ₁₎ of said pickup element (1), in the transfer position (P ₂₎ (500) transmitting said second member to said conveying means (1); a first rotational driving unit, in the said first rotary shaft (420) rotates to drive two or more of said pickup (410), sequentially through the pick-up position (P ₁₎ and said transfer position (P _2); and a flip-rotating portion (430), by the rotation of the pickup (410) of the pick-up head in a pickup position (P ₁₎ towards the loading member (60) above, in the transfer position (P ₂₎ the The pickup head of the pickup (410) faces the upper side. The flip-chip processor according to item 1 or item 2 of the patent application scope, wherein the second transfer tool (500) includes: two or more pickers (510), and the loading part working tray (200) Rotate around a second rotation axis (520) perpendicular to the upper surface of the loading member (60), and pass through the transfer position (P ₂ ) and the unloading position (P ₃ ). The pick-up position (P ₁ ) picks up the component (1) picked up by the picker (410) of the first transfer tool (400) and is inverted, and moves toward the destination at the unloading position (P ₃ ). The unloading component (70) unloads the component (1); and a second rotary driving section rotates and drives two or more of the pickers (510) with the second rotary shaft (520) as a center, and sequentially passes The transfer position (P ₂₎ and the unloading position (P ₃ ).