TW201812065A - 靶材裝置、濺鍍裝置 - Google Patents

靶材裝置、濺鍍裝置 Download PDF

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Publication number
TW201812065A
TW201812065A TW106120611A TW106120611A TW201812065A TW 201812065 A TW201812065 A TW 201812065A TW 106120611 A TW106120611 A TW 106120611A TW 106120611 A TW106120611 A TW 106120611A TW 201812065 A TW201812065 A TW 201812065A
Authority
TW
Taiwan
Prior art keywords
magnet
sputtering
target
plate
permeability
Prior art date
Application number
TW106120611A
Other languages
English (en)
Chinese (zh)
Inventor
白井雅紀
山本拓司
高澤悟
石橋暁
Original Assignee
日商愛發科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商愛發科股份有限公司 filed Critical 日商愛發科股份有限公司
Publication of TW201812065A publication Critical patent/TW201812065A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW106120611A 2016-06-21 2017-06-20 靶材裝置、濺鍍裝置 TW201812065A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-123050 2016-06-21
JP2016123050 2016-06-21

Publications (1)

Publication Number Publication Date
TW201812065A true TW201812065A (zh) 2018-04-01

Family

ID=60784109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106120611A TW201812065A (zh) 2016-06-21 2017-06-20 靶材裝置、濺鍍裝置

Country Status (5)

Country Link
JP (1) JP6612448B2 (ja)
KR (1) KR20190003747A (ja)
CN (1) CN109312450B (ja)
TW (1) TW201812065A (ja)
WO (1) WO2017221821A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI762872B (zh) * 2019-06-26 2022-05-01 日商愛發科股份有限公司 濺射裝置
TWI802660B (zh) * 2018-04-03 2023-05-21 日商愛發科股份有限公司 濺射裝置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
JPH0774439B2 (ja) * 1989-01-30 1995-08-09 三菱化学株式会社 マグネトロンスパッタ装置
JPH0445267A (ja) * 1990-06-12 1992-02-14 Matsushita Electric Ind Co Ltd スパッタリング装置
EP0724652B1 (en) * 1993-10-22 2003-10-01 Manley, Kelly Method and apparatus for sputtering magnetic target materials
JPH07188918A (ja) * 1993-12-27 1995-07-25 Sumitomo Metal Mining Co Ltd マグネトロンスパッタ装置
JP2005008917A (ja) * 2003-06-17 2005-01-13 Nitto Denko Corp マグネトロンスパッタ装置用カソード
JPWO2012035603A1 (ja) * 2010-09-13 2014-01-20 株式会社シンクロン 磁場発生装置、マグネトロンカソード及びスパッタ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI802660B (zh) * 2018-04-03 2023-05-21 日商愛發科股份有限公司 濺射裝置
TWI762872B (zh) * 2019-06-26 2022-05-01 日商愛發科股份有限公司 濺射裝置

Also Published As

Publication number Publication date
JP6612448B2 (ja) 2019-11-27
WO2017221821A1 (ja) 2017-12-28
KR20190003747A (ko) 2019-01-09
CN109312450A (zh) 2019-02-05
CN109312450B (zh) 2021-01-12
JPWO2017221821A1 (ja) 2018-08-02

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