以下對本發明進行詳細地說明。＜ 正型感光性樹脂組合物 ＞
本發明之正型感光性樹脂組合物包含黏結劑樹脂，亦包含光致酸生成劑、光增感劑、溶劑、鹼性化合物、偶聯劑、界面活性劑及添加劑中之一者以上，該黏結劑樹脂包含：(a-1)將酚性羥基或羧基之至少一部分用酸分解性基團保護之樹脂、(a-2)含有甲矽烷基醚基之丙烯酸系樹脂及(a-3)含有環氧基之丙烯酸系樹脂。黏結劑樹脂
上述黏結劑樹脂包含黏結劑樹脂，該黏結劑樹脂包含：(a-1)將酚性羥基或羧基之至少一部分用酸分解性基團保護之樹脂、(a-2)含有甲矽烷基醚基之丙烯酸系樹脂及(a-3)含有環氧基之丙烯酸系樹脂： (a-1)樹脂為將酚性羥基或羧基之至少一部分用酸分解性基團保護之樹脂，曝光時由光致酸生成劑產生酸，使酸分解性基團脫離，發揮在顯影工序中賦予溶解性之功能。作為上述酸分解性基團之例子，可列舉出用烷氧基或環烷氧基取代之烷基；或四氫哌喃基。 就(a-1)樹脂而言，對上述作用基團並無特別之限制，可例示含有由下述化學式1表示之單體聚合而成之樹脂。 [化學式1]上述化學式1中，R為經碳數1~6之烷氧基或碳數4~8之環烷氧基取代或未取代之碳數1~6之烷基；或四氫哌喃基。 (a-1)樹脂可進一步含有由具有(未用酸分解性基團保護的)酚性羥基或羧基之單體形成之重複單元。作為此類單體，可例示具有上述之羧基之烯屬不飽和單體、羥基苯乙烯、羥基甲基苯乙烯等。 (a-1)樹脂之重量平均分子量較佳為5000~35000，更佳為5000~20000。(a-1)樹脂之重量平均分子量不到上述範圍之情況下，可能出現殘膜率降低之現象，超過上述範圍之情況下，可能發生殘渣、殘膜現象等。(a-1)樹脂之重量平均分子量在上述範圍內，此在殘膜率之改善及殘渣減少之方面優異。 上述(a-2)樹脂為含有甲矽烷基醚基之丙烯酸系樹脂，可為含有由下述化學式2表示之重複單元之樹脂。 [化學式2]. 式中，R1
、R2
及R3
相互獨立地為氫或甲基， R4
為來自由下述化學式3表示之單體之結構， [化學式3]R7
為碳數1~6之伸烷基， R8
為碳數1~2之烷基， R5
為來自自(甲基)丙烯酸、琥珀酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯及琥珀酸2-(甲基)丙烯醯氧基乙酯中選擇之單體之結構， R6
為來自由下述化學式4表示之單體之結構， [化學式4]R9
為碳數1~6之伸烷基，R10
為碳數1~6之烷基， 為a=40~80莫耳%、b=5~45莫耳%、c=10~55莫耳%。 此時，藉由(a-2)樹脂含有化學式3，從而獲得如下效果：在未經六甲基二矽氮烷處理之條件下矽之氮化物基板中之密合性及均一性亦優異。 更詳細而言，藉由(a-2)樹脂含有化學式4，從而起到與用於使有機絕緣膜固化之熱固化基、即後述之(a-3)樹脂中使用之環氧基相同的作用。 此時，為提高密合性，在基板上用此類六甲基二矽氮烷物質進行處理，但在本發明中具有如下特徵：由於不進行六甲基二矽氮烷處理，因此能夠減少工序過程，因此能夠縮短工序時間。 相對於黏結劑樹脂100重量份，上述(a-2)樹脂較佳含有10~30重量份。上述(a-2)樹脂在上述範圍以內之情況下，加工容易，密合性優異。 上述(a-2)樹脂之重量平均分子量較佳為5000~30000，更佳為8000~20000。(a-2)樹脂之重量平均分子量不到上述範圍之情況下，能夠出現殘膜率降低之現象，超過上述範圍之情況下，能夠發生殘渣、殘膜現象等。(a-2)樹脂之重量平均分子量在上述範圍內，此在顯影性導致之殘渣減少及經時穩定性之提高的方面優異。 上述(a-3)樹脂為含有環氧基之丙烯酸系樹脂，藉由使熱固化成為可能，從而可形成耐久性更高之圖案。熱固化例如能夠在後烘焙工序中進行。 為將環氧基導入丙烯酸系樹脂中，在本發明之一具體例中，根據本發明之(a-3)樹脂可藉由含有由下述化學式5表示之單體聚合而成。 [化學式5]上述化學式5中，R11
為氫原子或甲基；R12
為碳數1~6之伸烷基；R13
及R14
相互獨立地為氫原子或碳數1~6之烷基，或者能夠相互連接而形成碳數3~8之環；m為1~6之整數。 由化學式5表示之單體包含與R12
鄰接之氧原子，在鏈中含有氧原子之情況下，單鍵之旋轉半徑變大，玻璃化轉變溫度降低，使流動性改善，加工變得容易。 另外，在化學式5中藉由m之調整，可調節單體之長度，由此能夠調整形成之圖案之傾斜，此情況下，能夠降低圖案之傾斜，在透明電極之蒸鍍時能夠防止固化膜發生脫落、開裂。進而，由化學式5表示之單體能夠改善所聚合之樹脂之透射率。 (a-3)樹脂可在上述化學式5之單體外使用能夠形成丙烯酸系樹脂的此項技術中公知之單體聚合而成。 例如，能夠使用具有羧基之烯屬不飽和單體。對具有羧基之烯屬不飽和單體之種類並無特別限定，例如可列舉出丙烯酸、甲基丙烯酸、巴豆酸等單羧酸類；反丁烯二酸、中康酸、衣康酸等二羧酸類及其等酸酐；ω-羧基聚己內酯單(甲基)丙烯酸酯等在兩末端具有羧基及羥基之聚合物之單(甲基)丙烯酸酯類等，較佳地，可為丙烯酸及甲基丙烯酸。其等能夠單獨地使用或者將2種以上混合使用。 另外，可進一步含有可與上述單體共聚之至少一種其他單體聚合而成。例如可列舉出苯乙烯、乙烯基甲苯、甲基苯乙烯、對氯苯乙烯、鄰甲氧基苯乙烯、間甲氧基苯乙烯、對甲氧基苯乙烯、鄰乙烯基苄基甲基醚、間乙烯基苄基甲基醚、對乙烯基苄基甲基醚等芳族乙烯基化合物；N-環己基順丁烯二醯亞胺、N-苄基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺、N-鄰羥基苯基順丁烯二醯亞胺、N-間羥基苯基順丁烯二醯亞胺、N-對羥基苯基順丁烯二醯亞胺、N-鄰甲基苯基順丁烯二醯亞胺、N-間甲基苯基順丁烯二醯亞胺、N-對甲基苯基順丁烯二醯亞胺、N-鄰甲氧基苯基順丁烯二醯亞胺、N-間甲氧基苯基順丁烯二醯亞胺、N-對甲氧基苯基順丁烯二醯亞胺等N-取代順丁烯二醯亞胺系化合物；(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯等(甲基)丙烯酸烷基酯類；(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-甲基環己酯、(甲基)丙烯酸三環[5.2.1.02、6]癸烷-8-基酯、(甲基)丙烯酸2-雙環戊氧基乙酯、(甲基)丙烯酸異冰片酯等脂環族(甲基)丙烯酸酯類；(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯等(甲基)丙烯酸芳基酯類；3-(甲基丙烯醯氧基甲基)氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-3-乙基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-三氟甲基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-苯基氧雜環丁烷、2-(甲基丙烯醯氧基甲基)氧雜環丁烷、2-(甲基丙烯醯氧基甲基)-4-三氟甲基氧雜環丁烷等不飽和氧雜環丁烷化合物；以碳數4~16之環烷烴、雙環烷烴或三環烷烴環取代之(甲基)丙烯酸酯等。此等物能夠單獨地使用或者將2種以上混合使用。 就上述(a-3)樹脂而言，相對於黏結劑樹脂100重量份，較佳含有20~40重量份。上述(a-3)樹脂在上述範圍內之情況下，密合性優異。 (a-3)樹脂之重量平均分子量較佳為5000~40000，更佳為15000~30000。(a-3)樹脂之重量平均分子量不到上述範圍之情況下，會發生殘膜率降低之現象，超過上述範圍之情況下，則會發生殘渣及殘膜現象等。(a-3)樹脂之重量平均分子量在上述範圍內之情況下，在顯影性之改善及殘渣減少之方面較佳。 相對於黏結劑樹脂100重量份，上述(a-1)樹脂:(a-2)樹脂:(a-3)樹脂之比率較佳為40~60 : 10~30 : 20~40重量份。在上述(a-1)樹脂：(a-2)樹脂：(a-3)樹脂之比率在上述範圍內之情況下，在密合性、感度及透射率方面均優異。 根據本發明之黏結劑樹脂藉由將上述3種樹脂混合，在不使圖案形成能力下降之情況下，能夠顯著地使顯影性提昇，使殘渣減少。光致酸 生成劑
光致酸生成劑為藉由照射活性光線或放射線而使酸產生之化合物。 對光致酸生成劑之種類並無特別限定，例如可列舉出重氮鹽系、鏻鹽系、鋶鹽系、碘鎓鹽系、醯亞胺磺酸酯系、肟磺酸酯系、重氮二碸系、二碸系、鄰硝基苄基磺酸酯系、三嗪系化合物等。其等能夠單獨地使用或者將2種以上混合使用。 光致酸生成劑若在能夠發揮其功能之範圍內，則對其含量並無特別限定，例如，相對於黏結劑樹脂100重量份，能夠含有0.1~20重量份，較佳地，能夠含有0.5~10重量份。光致酸生成劑之含量在上述範圍內之情況下，具有如下優點：能夠充分地發生酸之催化作用引起之化學變化，在組合物塗佈時能夠均勻地進行塗佈。光增感劑
本發明中，根據需要，亦能夠與光致酸生成劑一起進一步包含光增感劑。 光增感劑為促進光致酸生成劑之分解、提高感度之成分。對根據本發明之光增感劑並無特別限定，例如可列舉出多核芳族類、呫噸類、呫噸酮類、菁類、Oxonol類、噻嗪類、吖啶類、吖啶酮類、蒽醌類、方酸類、苯乙烯基類、base styryl(ベーススチリル)類、香豆素類、蒽類化合物等。此等物能夠單獨地使用或者將2種以上混合使用。 光增感劑若在能夠發揮其功能之範圍內，則對其含量並無特別限定，例如，相對於黏結劑樹脂100重量份，能夠含有0.01~60重量份，較佳地，能夠含有0.5~10重量份。光增感劑之含量在上述範圍內之情況下，具有能夠使分光增減產生之感度提高或透射率之提高效果最大化的優點。溶劑
對溶劑之種類並無特別限定，只要能夠使上述提及之成分溶解，具有適合之乾燥速度，在溶劑蒸發後能夠形成均一且光滑之塗膜，則任何溶劑均能夠使用。 作為具體例子，可列舉出醚類、乙酸酯類、酯類、酮類、醯胺類、內酯類等。其等能夠單獨地使用或者將2種以上混合使用。 作為醚類之具體例子，可列舉出乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丙基醚、乙二醇單丁基醚等乙二醇單烷基醚類；乙二醇二甲基醚、乙二醇二乙基醚、乙二醇二丙基醚等乙二醇二烷基醚類；丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單丙基醚、丙二醇單丁基醚等丙二醇單烷基醚類；丙二醇二甲基醚、丙二醇二乙基醚、二甘醇單甲基醚、二甘醇單乙基醚等丙二醇二烷基醚類；二甘醇二甲基醚、二甘醇二乙基醚、二甘醇乙基甲基醚等二甘醇二烷基醚類；二丙二醇單甲基醚、二丙二醇單乙基醚、二丙二醇單丙基醚、二丙二醇單丁基醚等二丙二醇單烷基醚類；二丙二醇二甲基醚、二丙二醇二乙基醚、二丙二醇乙基甲基醚等二丙二醇二烷基醚類等。 作為乙酸酯類之具體例子，可列舉出乙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙酸酯、乙二醇單丙基醚乙酸酯、乙二醇單丁基醚乙酸酯等乙二醇單烷基醚乙酸酯類；丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、丙二醇單丙基醚乙酸酯、丙二醇單丁基醚乙酸酯等丙二醇單烷基醚乙酸酯類；二甘醇單甲基醚乙酸酯、二甘醇單乙基醚乙酸酯、二甘醇單丙基醚乙酸酯、二甘醇單丁基醚乙酸酯等二甘醇單烷基醚乙酸酯類；二丙二醇單甲基醚乙酸酯、二丙二醇單乙基醚乙酸酯、二丙二醇單丙基醚乙酸酯、二丙二醇單丁基醚乙酸酯等二丙二醇單烷基醚乙酸酯類；丙二醇甲基乙基乙酸酯等丙二醇二烷基乙酸酯類等。 作為酯類之具體例子，可列舉出乳酸甲酯、乳酸乙酯、乳酸正丙酯、乳酸異丙酯、乳酸正丁酯、乳酸異丁酯、乳酸正戊酯、乳酸異戊酯、醋酸正丁酯、醋酸異丁酯、醋酸正戊酯、醋酸異戊酯、醋酸正己酯、醋酸2-乙基己酯、丙酸乙酯、丙酸正丙酯、丙酸異丙酯、丙酸正丁酯、丙酸異丁酯、丁酸甲酯、丁酸乙酯、丁酸乙酯、丁酸正丙酯、丁酸異丙酯、丁酸正丁酯、羥基醋酸乙酯、2-羥基-2-甲基丙酸乙酯、2-羥基-3-甲基丁酸乙酯、甲氧基醋酸乙酯、乙氧基醋酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙酸3-甲氧基丁酯、乙酸3-甲基-3-甲氧基丁酯、丙酸3-甲基-3-甲氧基丁酯、丁酸3-甲基-3-甲氧基丁酯、乙醯醋酸甲酯、乙醯醋酸乙酯、丙酮酸、丙酮酸乙酯、二甘醇甲基乙基酯等。 作為酮類之具體例子，可列舉出甲基乙基酮、甲基丙基酮、甲基-正丁基酮、甲基異丁基酮、2-庚酮、3-庚酮、4-庚酮、環己酮等。 作為醯胺類之具體例子，可列舉出N-甲基甲醯胺、N,N-二甲基甲醯胺、N-甲基乙醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮等。 作為內酯類之具體例子，可列舉出γ-丁內酯。 較佳的是，在塗佈性及絕緣膜被膜之膜厚之均一性方面，較佳使用丙二醇甲基醚乙酸酯、二甘醇甲基乙基酯或其等混合物。 溶劑只要在能夠發揮其功能之範圍內即可，對其含量並無特別限定，例如相對於黏結劑樹脂100重量份，能夠含有200~400重量份溶劑，在上述範圍內含有溶劑之情況下，能夠將固體成分之含量及黏度維持在適當之水準，能夠使塗佈性增加。鹼性化合物
對鹼性化合物之種類並無特別限定，能夠自化學增幅抗蝕劑中使用之鹼性化合物中任意地選擇使用。作為具體例子，可列舉出脂族胺、芳族胺、雜環式胺、氫氧化四級銨、羧酸之四級銨鹽等。此等物能夠單獨地使用或者將2種以上混合使用。 作為脂族胺之具體例子，可列舉出三甲基胺、二乙基胺、三乙基胺、二正丙基胺、三正丙基胺、二正戊基胺、三正戊基胺、二乙醇胺、三乙醇胺、二環己胺、二環己基甲基胺等。 作為芳族胺之具體例子，可列舉出苯胺、苄胺、N,N-二甲基苯胺、二苯基胺等。 作為雜環式胺之具體例子，可列舉出吡啶、2-甲基吡啶、4-甲基吡啶、2-乙基吡啶、4-乙基吡啶、2-苯基吡啶、4-苯基吡啶、N-甲基-4-苯基吡啶、4-二甲基胺基吡啶、咪唑、苯并咪唑、4-甲基咪唑、2-苯基苯并咪唑、2,4,5-三苯基咪唑、菸鹼、菸酸、菸酸醯胺、喹啉、8-羥基喹啉、吡嗪、吡唑、噠嗪、嘌呤、吡咯啶、哌啶、1,5-二氮雜雙環[4.3.0]-5-壬烯、1,8-二氮雜雙環[5.3.0]-7-十一碳烯等。 作為氫氧化四級銨之具體例子，可列舉出氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四-正丁基銨、氫氧化四-正己基銨等。 作為羧酸之四級銨鹽之具體例子，可列舉出乙酸四甲基銨、苯甲酸四甲基銨、乙酸四-正丁基銨、苯甲酸四-正丁基銨等。 鹼性化合物若在能夠發揮其功能之範圍內，則對其含量並無特別限定，相對於黏結劑樹脂100重量份，能夠含有0.001~1重量份鹼性化合物，較佳地，能夠含有0.005~0.5重量份鹼性化合物。就鹼性化合物之含量而言，相對於黏結劑樹脂100重量份，含有0.001重量份以上且1重量份以下之情況下，具有能夠形成具有良好之耐熱性及耐溶劑性之層間絕緣膜的優點。偶聯劑
偶聯劑可用於提高成為基材之無機物例如矽、氧化矽、氮化矽等矽化合物、金、銅、鋁等金屬與絕緣膜之密合性，亦可用於與基板之錐角之調整。 對偶聯劑之種類並無特別限定，作為具體例子，可使用γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三烷氧基矽烷、γ-縮水甘油氧基丙基烷基二烷氧基矽烷、γ-甲基丙烯醯氧基丙基三烷氧基矽烷、γ-甲基丙烯醯氧基丙基烷基二烷氧基矽烷、γ-氯丙基三烷氧基矽烷、γ-巰基丙基三烷氧基矽烷、β-(3,4-環氧環己基)乙基三烷氧基矽烷、乙烯基三烷氧基矽烷等，其等能夠單獨地使用或者將2種以上混合使用，更佳使用γ-縮水甘油氧基丙基三烷氧基矽烷。界面活性劑
界面活性劑為改善基板與感光性樹脂組合物之密合性之成分。 對界面活性劑之種類並無特別限定，能夠使用含氟界面活性劑、非離子界面活性劑、陽離子界面活性劑、陰離子界面活性劑及矽界面活性劑這樣的各種界面活性劑。其等能夠單獨地使用或者將2種以上混合使用。 作為含氟界面活性劑之具體例子，可列舉出MAGAFAC F171、F172、F173、F176、F177、F141、F142、F143、F144、R30、F437、F475、F479、F482、F554、F780及F781 (商品名，DIC Corporation製品)、FLUORAD FC430、FC431及FC171 (商品名，Sumitomo 3M Limited製品)、SURFLON S-382、SC-101、SC-103、SC-104、SC-105、SC1068、SC-381、SC-383、S393及KH-40 (商品名，Asahi Glass Co., Ltd.製品)、SOLSPERSE 20000 (商品名，Lubrizol Japan Limited製品)等。 作為非離子界面活性劑之具體例子，可列舉出甘油、三羥甲基丙烷及三羥甲基乙烷、以及其等乙氧基化物或丙氧基化物(例如甘油丙氧基化物或甘油乙氧基化物)；PLURONIC L10、L31、L61、L62、10R5、17R2及25R2、以及TETRONIC 304、701、704、901、904及150R1 (商品名，BASF製品)這樣的聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、山梨糖醇酐脂肪酸酯等。 作為陽離子界面活性劑之具體例子，可列舉出EFKA-745 (商品名，Morishita＆Co., Ltd.製品)這樣的酞菁改性化合物、KP341 (商品名，Shin-Etsu Chemical Co., Ltd.製品)這樣的有機矽氧烷聚合物；POLYFLOW第75號、第90號、第95號(商品名，Kyoeisha Chemical Co., Ltd.製品)這樣的(甲基)丙烯酸系(共)聚合物、W001 (商品名，Yusho Co., Ltd.製品)等。 作為陰離子界面活性劑之具體例子，可列舉出W004、W005、W017 (商品名，Yusho Co., Ltd.製品)等。 作為矽界面活性劑之具體例子，可列舉出TORAY SILICONE DC3PA、SH7PA、DC11PA、SH21PA、SH28PA、SH29PA、SH30PA及SH8400 (商品名，Dow Corning Toray Co., Ltd.製品)、TSF-4440、4300、4445、4460及4452 (商品名，Momentive Performance Materials Inc.製品)、KP341、KF6001及KF6002 (商品名，Shin-Etsu Chemical Co., Ltd.製品)、BYK307、323及330 (商品名，BYK Chemie製品)等。 界面活性劑若在能夠發揮其功能之範圍內，則對其含量並無特別限定，相對於黏結劑樹脂100重量份，能夠含有0.01~5重量份，較佳地，能夠含有0.05~3重量份。對於界面活性劑之含量而言，在上述範圍內含有之情況下，具有能夠使基板與樹脂組合物之密合性之改善效果最大化的優點。添加劑
本發明之感光性樹脂組合物，此外，一般在不脫離本發明之目的之範圍內能夠進一步含有熱交聯劑、光穩定劑、光固化促進劑、防暈光劑(流平劑)、消泡劑等此類添加劑。 熱交聯劑為在用組合物形成絕緣膜時藉由UV之照射及熱處理而使交聯反應順利地發生、提高耐熱性之成分。 對熱交聯劑之種類並無特別限定，作為具體例子，可列舉出聚丙烯酸酯樹脂、環氧樹脂、酚醛樹脂、蜜胺樹脂、有機酸、胺化合物、無水化合物等。其等能夠單獨使用或者將2種以上混合使用。 熱交聯劑若在能夠發揮其功能之範圍內，則對其含量並無特別限定，相對於黏結劑樹脂100重量份，能夠含有0.01~5重量份，較佳地，能夠含有0.1~3重量份。熱交聯劑之含量相對於黏結劑樹脂100重量份，含有0.01重量份以上且5重量份以下之情況下，具有使耐熱性之提高效果最大化之優點。 光穩定劑為改善感光性樹脂組合物之耐光性之成分。 對光穩定劑之種類並無特別限定，作為具體例子，可列舉出苯并三唑系、三嗪系、二苯甲酮系、受阻胺基醚(hindered aminoether)系、受阻胺系化合物等。其等能夠單獨地使用或者將2種以上混合使用。 光穩定劑若在能夠發揮其功能之範圍內，則對其含量並無特別限定，相對於黏結劑樹脂100重量份，能夠含有0.01~5重量份，較佳地，能夠含有0.1~3重量份。光穩定劑之含量相對於黏結劑樹脂100重量份，含有0.01重量份以上且5重量份以下之情況下，具有使耐光性之改善效果最大化之優點。＜ 絕緣膜 ＞
本發明可形成用上述感光性樹脂組合物製造之絕緣膜。 此時，絕緣膜在基板上形成，作為基板，有液晶顯示裝置用或有機發光顯示裝置用基板，能夠使用石英或透明樹脂基板等。 對在基板之製造中應用之透明樹脂的種類並無特別限定，例如有聚醯亞胺樹脂、丙烯酸系樹脂、聚丙烯酸酯樹脂、聚碳酸酯樹脂、聚醚樹脂、聚對苯二甲酸乙二醇酯樹脂、磺酸樹脂等。其等能夠單獨地使用或者將2種以上混合使用。 可在基板上形成閘電極或源/汲電極，可在其上形成上述絕緣膜。另外，可在基板上形成有機絕緣膜或無機絕緣膜，在其上形成上述絕緣膜。 有機絕緣膜可為由丙烯酸系樹脂、聚醯亞胺系樹脂、聚醯胺系樹脂、矽氧烷系樹脂、感光性丙烯酸系含羧基之樹脂、酚醛清漆樹脂、鹼可溶性樹脂等製成之絕緣膜。另外，無機絕緣膜可為矽之氧化物(SiOx)、矽之氮化物(SiNx)、矽之氧氮化物(SiOxNy)、矽之氧碳化物(SiOxCy)、矽之碳氮化物(SiCxNy)、鋁之氧化物(AlOx)、鈦之氧化物(TiOx)、鉭之氧化物(TaOx)、鎂之氧化物(MgOx)、鋅之氧化物(ZnOx)、鉿之氧化物(HfOx)、鋯之氧化物(ZrOx)、鈦之氧化物(TiOx)，但在本發明中，自與用本發明之感光性樹脂組合物形成之絕緣膜的密合性之增大效果顯著的方面出發，最佳為矽之氮化物、矽之氧氮化物、矽之氧化物。 本發明之一實施方式中，可在上述矽之氮化物絕緣膜上形成上述絕緣膜。矽之氮化物由於一般與有機絕緣膜之密合性不優異，因此以往為了在由矽之氮化物構成之絕緣膜上形成有機絕緣膜，必須進行用於密合性改善的前處理工序例如HMDS塗佈等。但是，用根據本發明之感光性樹脂組合物形成之絕緣膜由於與矽之氮化物之密合性優異，因此可省略前處理工序。 對本發明之上述絕緣膜之厚度並無特別限定，例如可為0.5~100 μm。 根據本發明之絕緣膜形成方法可包含：將本發明之感光性樹脂組合物塗佈於顯示裝置之基板之上部、或者在基板上形成之源極/汲極或矽之氮化物層的上部之階段；對感光性樹脂組合物進行預烘焙(pre-bake)之階段；對感光性樹脂組合物選擇性地進行曝光、顯影，形成圖案之階段；及對形成之圖案進行熱處理之階段。 作為基板，主要使用在液晶顯示裝置、有機EL等中通常使用之玻璃或透明塑膠樹脂，不受所使用之顯示裝置之特性的特別限制。例如能夠使用在玻璃基板等絕緣基板上形成構成閘電極之金屬膜、該金屬膜由表面層構成之基板。 對將感光性樹脂組合物塗佈於基板等之上部之方法並無特別限定，例如有噴塗法、輥塗法、噴嘴式塗佈法等利用了狹縫噴嘴之塗佈法、中央滴下旋轉法等旋轉塗佈法、擠出塗佈法、棒塗法等，能夠將二種以上之塗佈方法組合來進行塗佈。 所塗佈之膜厚因塗佈方法、組合物之固體成分之濃度、黏度等而變，但通常以乾燥後膜厚成為0.5~100 μm之方式進行塗佈。 隨後進行之預烘焙階段為在塗膜形成後為得到無流動性之塗膜而施加真空、紅外線或熱使溶劑揮發之工序。加熱條件因各成分之種類、配合等而變，但在熱板(熱板、hot plate)加熱之情況下，能夠在60~130℃下進行5~500秒，使用熱烘箱之情況下，能夠在60~140℃下進行20~1000秒。 接下來，就選擇性之曝光工序而言，邊照射準分子雷射、遠紫外線、紫外線、可見光線、電子束、X射線或g射線(波長436 nm)、i射線(波長365 nm)、h射線(波長405 nm)或其等混合光線邊進行。曝光能夠採用接觸式(contact)、近接式(porximity)、投影式(projection)曝光法等進行。 本發明中，在進行鹼顯影後，進行對感光性樹脂組合物進行熱處理(高溫燒成)之階段。在用於上述高溫燒成之感光性樹脂組合物之構成中應用熱交聯劑等。上述熱處理階段能夠利用熱板或烘箱等加熱裝置在150~350℃之溫度下進行30分鐘~3小時。完成上述熱處理後，得到完全交聯固化之圖案。＜ 圖像顯示裝置 ＞
另外，本發明提供具備上述絕緣膜之圖像顯示裝置。 本發明之絕緣膜不僅可應用於通常之液晶顯示裝置，而且可應用於電致發光顯示裝置、電漿顯示裝置、場致發射顯示裝置等各種圖像顯示裝置。 圖像顯示裝置除上述絕緣膜外，能夠進一步包含此項技術中通常使用之構成。 以下為有助於本發明之理解而示出較佳之實施例，但此等實施例僅對本發明進行例示，並不限制所附之申請專利範圍，在本發明之範疇及技術思想範圍內可對實施例進行多種變形及修正，此對於熟習此項技術者而言為顯而易見的，此類變形及修正當然亦屬於所附之申請專利範圍。實施例 1~14 及比較例 1~3
製造了具有下述表1中記載之組成及含量之感光性樹脂組合物。 [表1]
A1-1.(a)/(b)=60/40 A1-2.(a)/(b)=70/30A2-1：(a)/(b)/(c)=20/60/20 A2-2：(a)/(b)/(c)=30/50/20R：乙基 A3-1：(a)/(b)/(c)/(d)=15/10/50/25 A3-2：(a)/(b)/(c)/(d)=25/15/30/30(B)(C)(D1)丙二醇甲基乙基乙酸酯 (D2)二甘醇甲基乙基酯 (E)二環己基甲基胺 (F)KBM-403 (γ-縮水甘油氧基丙基三烷氧基矽烷、信越化學工業株式會社製造) (G1)SH-8400 (東麗-道康寧公司製造) (G2)F-475 (DIC公司製造)實驗例
對於由實施例1~14及比較例1~3製造之樹脂組合物，進行下述之評價，將其結果記載於下述表2中。(1) 感度測定
在0.7mm厚之玻璃基板(CORNING 1737、康寧公司製造)上，採用旋塗器分別塗佈實施例及比較例之感光性樹脂組合物，在100℃之熱板上加熱125秒，使溶劑揮發，形成厚4.0 μm之感光性樹脂組合物層。 然後，為得到直徑10 μm之接觸孔圖案，利用曝光部帶有具有10 μm之邊的四方圖案開口部之遮罩，用i射線步進器(NSR-205i11D，尼康公司)實施曝光。 對於曝光後之基板，以2.38%氫氧化四甲基銨水溶液作為顯影液，在23℃下進行40秒旋覆浸沒顯影，在230℃之烘箱中加熱30分鐘，得到固化之膜。 然後，將基板垂直地切削，在各組成中藉由感度選擇成為10 μm接觸孔之曝光量。(2) 圖案角度
將得到之圖案垂直地切削，由光學照片算出與基板之角度。(3) 透射率測定
用分光光度計測定所得膜之400 nm下之透射率。(4) 密合性評價
在蒸鍍矽之氮化物之玻璃基板上，在未塗佈六甲基二矽氮烷溶液之狀態下，用旋塗器分別塗佈實施例1~14及比較例1~3之感光性樹脂組合物，在100℃之熱板上加熱125秒，使溶劑揮發，形成厚4.0 μm之感光性樹脂組合物層。然後，使用具有5~20 μm之孔圖案之遮罩，用i射線步進器(NSR-205i11D、尼康公司)實施曝光。對於曝光後之基板，以2.38%氫氧化四甲基銨水溶液作為顯影液，在23℃下進行40秒旋覆浸沒顯影，確認圖案是否可剝離。 ＜評價標準＞ ◎：在全部區域中完全沒有將圖案剝離 ○：將圖案在一部分之區域中微細地剝離 △：將相當部分之圖案剝離 X：將圖案之全部區域剝離 [表2]
參照上述表2可知，用實施例1~14之感光性樹脂組合物形成之絕緣膜的密合性非常優異，感度及透射率亦非常優異，顯示適當之圖案角度。但是，對於用未使用含有甲矽烷基醚基之丙烯酸系樹脂之比較例1~比較例3的感光性樹脂組合物形成之絕緣膜而言，可知顯示出密合性非常差之結果。The present invention will be described in detail below. < Positive photosensitive resin composition > The positive photosensitive resin composition of the present invention includes a binder resin, and also includes a photoacid generator, a photosensitizer, a solvent, a basic compound, a coupling agent, and a surfactant. And one or more of the additives, the binder resin includes: (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group; (a-2) a resin containing a silyl ether group; Acrylic resin and (a-3) epoxy resin containing acrylic resin. Binder resin The binder resin described above includes a binder resin including: (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group; (a-2) containing silane Ether-based acrylic resin and (a-3) epoxy-containing acrylic resin: (a-1) The resin is a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group. An acid is generated from a photoacid generator, and an acid-decomposable group is detached, and the function which provides solubility in a development process is exhibited. Examples of the acid-decomposable group include an alkyl group substituted with an alkoxy group or a cycloalkoxy group; or a tetrahydropiperanyl group. The resin (a-1) is not particularly limited to the above-mentioned functional group, and a resin containing a monomer represented by the following Chemical Formula 1 can be exemplified. [Chemical Formula 1] In the above Chemical Formula 1, R is an alkyl group having 1 to 6 carbon atoms which is substituted or unsubstituted by an alkoxy group having 1 to 6 carbon atoms or a cycloalkoxy group having 4 to 8 carbon atoms; or a tetrahydropiperanyl group. (a-1) The resin may further contain a repeating unit formed of a monomer having a phenolic hydroxyl group or a carboxyl group (not protected with an acid-decomposable group). Examples of such monomers include ethylenically unsaturated monomers having a carboxyl group described above, hydroxystyrene, and hydroxymethylstyrene. (a-1) The weight average molecular weight of the resin is preferably 5,000 to 35,000, and more preferably 5,000 to 20,000. (a-1) When the weight-average molecular weight of the resin is less than the above range, the residual film rate may decrease, and when it exceeds the above range, a residue or a residual film phenomenon may occur. (a-1) The weight-average molecular weight of the resin is within the above-mentioned range, and this is excellent in terms of improvement of the residual film rate and reduction of the residue. The (a-2) resin is an acrylic resin containing a silyl ether group, and may be a resin containing a repeating unit represented by the following Chemical Formula 2. [Chemical Formula 2] In the formula, R 1 , R 2 and R 3 are each independently hydrogen or methyl, and R 4 is a structure derived from a monomer represented by the following Chemical Formula 3, [Chemical Formula 3] R 7 is an alkylene group having 1 to 6 carbon atoms, R 8 is an alkyl group having 1 to 2 carbon atoms, and R 5 is a 2- (meth) acrylic acid ethoxylate derived from (meth) acrylic acid and succinate 2- (meth) acryloxyethyl hexahydrophthalate, 2- (meth) acryloxyethyl phthalate, and 2- (meth) acryloxyethyl succinate The structure of the selected monomer in the ester, R 6 is a structure derived from the monomer represented by the following Chemical Formula 4, [Chemical Formula 4] R 9 is an alkyl group having 1 to 6 carbon atoms, R 10 is an alkyl group having 1 to 6 carbon atoms, and is a = 40 to 80 mole%, b = 5 to 45 mole%, and c = 10 to 55 moles. ear%. At this time, when the resin (a-2) contains Chemical Formula 3, the following effects are obtained: the adhesion and uniformity of silicon nitride substrates are also excellent without hexamethyldisilazane treatment. In more detail, since (a-2) the resin contains Chemical Formula 4, it has the same properties as the thermosetting group for curing the organic insulating film, that is, the epoxy group used in the (a-3) resin described later. effect. In this case, in order to improve the adhesion, the substrate is treated with such a hexamethyldisilazane substance. However, in the present invention, there is a feature that the hexamethyldisilazane can be reduced because it is not treated. The process can shorten the process time. The resin (a-2) preferably contains 10 to 30 parts by weight based on 100 parts by weight of the binder resin. When the said (a-2) resin is in the said range, it is easy to process and it is excellent in adhesiveness. The weight average molecular weight of the (a-2) resin is preferably 5,000 to 30,000, and more preferably 8,000 to 20,000. (a-2) When the weight-average molecular weight of the resin is less than the above range, the residual film rate may decrease, and when it exceeds the above range, a residue or a residual film phenomenon may occur. (a-2) The weight-average molecular weight of the resin is within the above-mentioned range, and this is excellent in terms of reduction in residue due to developability and improvement in stability over time. The (a-3) resin is an acrylic resin containing an epoxy group, and it is possible to form a pattern with higher durability by enabling thermal curing. Thermal curing can be performed, for example, in a post-baking process. In order to introduce an epoxy group into an acrylic resin, in a specific example of the present invention, the (a-3) resin according to the present invention can be polymerized by containing a monomer represented by the following Chemical Formula 5. [Chemical Formula 5] In the above Chemical Formula 5, R 11 is a hydrogen atom or a methyl group; R 12 is an alkylene group having 1 to 6 carbon atoms; R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, or can be Connected to form a ring with 3 to 8 carbons; m is an integer from 1 to 6. The monomer represented by Chemical Formula 5 contains an oxygen atom adjacent to R 12. When an oxygen atom is contained in the chain, the rotation radius of a single bond becomes larger, the glass transition temperature is lowered, the fluidity is improved, and processing is facilitated. In addition, by adjusting m in Chemical Formula 5, the length of the monomer can be adjusted, so that the inclination of the formed pattern can be adjusted. In this case, the inclination of the pattern can be reduced, and the cured film can be prevented during vapor deposition of the transparent electrode Shedding and cracking occurred. Further, the monomer represented by Chemical Formula 5 can improve the transmittance of the polymerized resin. (a-3) The resin can be polymerized by using a monomer known in the art capable of forming an acrylic resin in addition to the monomer of Chemical Formula 5 above. For example, an ethylenically unsaturated monomer having a carboxyl group can be used. The type of the ethylenically unsaturated monomer having a carboxyl group is not particularly limited, and examples thereof include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid. Acids and their anhydrides; ω-carboxy polycaprolactone mono (meth) acrylates, etc. Mono (meth) acrylates of polymers having carboxyl groups and hydroxyl groups at both ends, etc., preferably, acrylic acid and Methacrylate. These can be used individually or in mixture of 2 or more types. Further, it may be obtained by polymerizing at least one other monomer copolymerizable with the monomer. Examples include styrene, vinyltoluene, methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, and o-vinylbenzyl methyl ether. , M-vinyl benzyl methyl ether, p-vinyl benzyl methyl ether and other aromatic vinyl compounds; N-cyclohexyl-cis-butene-diimide, N-benzyl-cis-butene-diimide, N -Phenyl-cis-butene-diimide, N-o-hydroxyphenyl-cis-butene-diimide, N-m-hydroxyphenyl-cis-butene-diimide, N-p-hydroxyphenyl-cis-butene-diimide Imine, N-o-methylphenylcis butene difluorene imine, N-m-methylphenylcis butene difluorene imine, N-p-methylphenylcis butene difluorene imine, N- N-substituted cis, such as o-methoxyphenylcis-butenedifluorene imine, N-m-methoxyphenylcisbutenedifluoreneimine, N-p-methoxyphenylcisbutenedifluoreneimine Butene difluorene imide compounds; methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate Ester, isobutyl (meth) acrylate, second butyl (meth) acrylate, (formaldehyde) ) Alkyl (meth) acrylates such as tert-butyl acrylate; cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, (formyl) Cyclic) (5.2.1.02, 6) decane-8-yl acrylate, 2-dicyclopentyloxyethyl (meth) acrylate, isobornyl (meth) such as isobornyl (meth) acrylate Acrylates; aryl (meth) acrylates such as phenyl (meth) acrylate and benzyl (meth) acrylate; 3- (methacryloxymethyl) oxetane, 3- (Methacryloxymethyl) -3-ethyloxetane, 3- (methacryloxymethyl) -2-trifluoromethyloxetane, 3- (formyl Allyloxymethyl) -2-phenyloxetane, 2- (methacryloxymethyl) oxetane, 2- (methacryloxymethyl)- Unsaturated oxetane compounds such as 4-trifluoromethyloxetane; (meth) acrylates substituted with a cycloalkane, bicycloalkane or tricycloalkane ring having 4 to 16 carbon atoms. These can be used individually or in mixture of 2 or more types. The resin (a-3) preferably contains 20 to 40 parts by weight based on 100 parts by weight of the binder resin. When the said (a-3) resin is in the said range, it is excellent in adhesiveness. (a-3) The weight average molecular weight of the resin is preferably 5,000 to 40,000, and more preferably 15,000 to 30,000. (a-3) When the weight-average molecular weight of the resin is less than the above range, the residual film rate will decrease. When it exceeds the above range, the residue and residual film phenomenon will occur. (a-3) When the weight average molecular weight of the resin is within the above range, it is preferable in terms of improvement of developability and reduction of residue. The ratio of the above (a-1) resin: (a-2) resin: (a-3) resin is preferably 40 to 60: 10 to 30: 20 to 40 parts by weight relative to 100 parts by weight of the binder resin. When the ratio of the above (a-1) resin: (a-2) resin: (a-3) resin is within the above range, the adhesiveness, sensitivity, and transmittance are excellent. By mixing the three resins described above, the binder resin according to the present invention can significantly improve the developability and reduce the residue without reducing the pattern forming ability. Photoacid generator Photoacid generator is a compound that generates an acid by irradiating active light or radiation. The type of the photoacid generator is not particularly limited, and examples thereof include a diazonium salt system, a sulfonium salt system, a sulfonium salt system, an iodonium salt system, a fluorenimide sulfonate system, an oxime sulfonate system, Azodifluorene, difluorene, o-nitrobenzyl sulfonate, triazine, etc. These can be used individually or in mixture of 2 or more types. The content of the photoacid generator is not particularly limited as long as it is within a range capable of exerting its function. For example, the photoacid generator may contain 0.1 to 20 parts by weight based on 100 parts by weight of the binder resin, and may preferably contain 0.5 ~ 10 parts by weight. When the content of the photoacid generator is within the above range, there is an advantage that chemical changes caused by the catalytic action of the acid can sufficiently occur, and the coating can be uniformly applied when the composition is applied. Photosensitizer In the present invention, a photosensitizer may be further contained together with the photoacid generator, if necessary. A photosensitizer is a component which promotes the decomposition of a photoacid generator and improves sensitivity. The photosensitizer according to the present invention is not particularly limited, and examples thereof include polynuclear aromatics, xanthenes, xanthone, cyanine, Oxonol, thiazine, acridine, and acridone , Anthraquinones, square acids, styryls, base styryls, coumarins, anthracene compounds, and the like. These can be used individually or in mixture of 2 or more types. The content of the photosensitizer is not particularly limited as long as it is within a range capable of exerting its function. For example, the photosensitizer can contain 0.01 to 60 parts by weight relative to 100 parts by weight of the binder resin, and preferably can contain 0.5 to 10 parts by weight. When the content of the photosensitizer is within the above range, there is an advantage that the sensitivity of the spectral increase or decrease or the effect of increasing the transmittance can be maximized. Solvent There is no particular limitation on the type of solvent. Any solvent can be used as long as it can dissolve the components mentioned above, have a suitable drying speed, and form a uniform and smooth coating film after the solvent evaporates. Specific examples include ethers, acetates, esters, ketones, amidines, and lactones. These can be used individually or in mixture of 2 or more types. Specific examples of the ethers include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether. ; Ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether; propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl Propylene glycol monoalkyl ethers such as ethers and propylene glycol monobutyl ether; propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, and diethylene glycol monoethyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether; dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and dipropylene glycol Dipropylene glycol monoalkyl ethers such as monopropyl ether and dipropylene glycol monobutyl ether; dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, and dipropylene glycol ethyl methyl ether; etc. . Specific examples of the acetates include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, and ethylene glycol monobutyl ether. Ether acetates such as ethylene glycol monoalkyl ether acetates; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate Esters such as propylene glycol monoalkyl ether acetates; diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl Diethylene glycol monoalkyl ether acetates such as ether acetate; dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether Dipropylene glycol monoalkyl ether acetates such as propyl ether acetate; propylene glycol dialkyl acetates such as propylene glycol methyl ethyl acetate; and the like. Specific examples of the esters include methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-amyl lactate, iso-amyl lactate, and n-acetate Butyl, isobutyl acetate, n-amyl acetate, isoamyl acetate, n-hexyl acetate, 2-ethylhexyl acetate, ethyl propionate, n-propyl propionate, isopropyl propionate, n-propionate Butyl, isobutyl propionate, methyl butyrate, ethyl butyrate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, ethyl hydroxyacetate, 2-hydroxyl Ethyl-2-methylpropanoate, ethyl 2-hydroxy-3-methylbutanoate, ethyl methoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, 3-methyl Ethyl propionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, 3-methyl-3-methoxybutyl butyrate, methyl ethyl acetate, ethyl ethyl acetate, pyruvate, ethyl pyruvate, Diethylene glycol methyl ethyl ester and the like. Specific examples of ketones include methyl ethyl ketone, methyl propyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, 2-heptanone, 3-heptanone, and 4-heptan Ketones, cyclohexanone, etc. Specific examples of amidines include N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N -Methylpyrrolidone and the like. Specific examples of lactones include γ-butyrolactone. It is preferable to use propylene glycol methyl ether acetate, diethylene glycol methyl ethyl ester, or a mixture thereof in terms of coating properties and uniformity of the film thickness of the insulating film. The content of the solvent is not particularly limited as long as it can perform its function. For example, it may contain 200 to 400 parts by weight of the solvent relative to 100 parts by weight of the binder resin. When the solvent is contained within the above range, The solid content and viscosity can be maintained at an appropriate level, and the coatability can be increased. Basic compound The type of the basic compound is not particularly limited, and it can be arbitrarily selected and used from basic compounds used in chemically amplified resists. Specific examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxide, and quaternary ammonium salts of carboxylic acids. These can be used individually or in mixture of 2 or more types. Specific examples of the aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, Diethanolamine, triethanolamine, dicyclohexylamine, dicyclohexylmethylamine, and the like. Specific examples of the aromatic amine include aniline, benzylamine, N, N-dimethylaniline, and diphenylamine. Specific examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole , Nicotine, nicotinic acid, ammonium nicotinate, quinoline, 8-hydroxyquinoline, pyrazine, pyrazole, pyridazine, purine, pyrrolidine, piperidine, 1,5-diazabicyclo [4.3.0 ] -5-nonene, 1,8-diazabicyclo [5.3.0] -7-undecene, and the like. Specific examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, and tetra-n-hexylammonium hydroxide. Specific examples of the quaternary ammonium salt of a carboxylic acid include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, and tetra-n-butylammonium benzoate. The content of the basic compound is not particularly limited as long as it can perform its function. It can contain 0.001 to 1 part by weight of the basic compound with respect to 100 parts by weight of the binder resin, and preferably can contain 0.005 to 0.5 parts by weight of a basic compound. The content of the basic compound has the advantage of being able to form an interlayer insulating film having good heat resistance and solvent resistance when the content is 0.001 parts by weight to 1 part by weight based on 100 parts by weight of the binder resin. . Coupling agentCoupling agent can be used to improve the adhesion between the inorganic material such as silicon, silicon oxide, silicon nitride, silicon compounds such as silicon, silicon oxide, silicon nitride, gold, copper, aluminum and other insulating films, as well as the cone angle with the substrate Of adjustment. The type of the coupling agent is not particularly limited, and as specific examples, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-glycidyloxypropyltrialkoxy can be used. Silane, γ-glycidoxypropylalkyldialkoxysilane, γ-methacryloxypropyltrialkoxysilane, γ-methacryloxypropylalkyldialkoxy Silane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrialkoxysilane, vinyltrialkoxy These can be used singly or in combination of two or more kinds, and γ-glycidoxypropyltrialkoxysilane is more preferably used. Surfactant surfactant to improve the adhesion of the substrate with the photosensitive resin composition of the adhesion of the composition. The type of the surfactant is not particularly limited, and various surfactants such as a fluorine-containing surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicon surfactant can be used. These can be used individually or in mixture of 2 or more types. Specific examples of the fluorine-containing surfactant include MAGAFAC F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, and F781 (trade names) , DIC Corporation products), FLUORAD FC430, FC431, and FC171 (trade names, products of Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC -383, S393 and KH-40 (trade names, products of Asahi Glass Co., Ltd.), SOLSPERSE 20000 (trade names, products of Lubrizol Japan Limited), and the like. Specific examples of the non-ionic surfactant include glycerin, trimethylolpropane and trimethylolethane, and ethoxylates or propoxylates thereof (e.g., glycerol propoxylate or glycerol ethyl acetate) (Oxylate); polyoxyethylene lauryl ether such as PLURONIC L10, L31, L61, L62, 10R5, 17R2, and 25R2, and TETRONIC 304, 701, 704, 901, 904, and 150R1 (trade names, BASF products), poly Oxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate , Sorbitan fatty acid esters, etc. Specific examples of the cationic surfactant include a phthalocyanine-modified compound such as EFKA-745 (trade name, product of Morishita & Co., Ltd.) and KP341 (trade name, product of Shin-Etsu Chemical Co., Ltd.) Such an organosiloxane polymer; (meth) acrylic (co) polymers such as POLYFLOW Nos. 75, 90, and 95 (trade names, products of Kyoeisha Chemical Co., Ltd.), W001 ( Trade names, products of Yusho Co., Ltd.). Specific examples of the anionic surfactant include W004, W005, and W017 (trade names, products of Yusho Co., Ltd.) and the like. Specific examples of the silicon surfactant include TORAY SILICONE DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, and SH8400 (trade names, products of Dow Corning Toray Co., Ltd.), TSF-4440, 4300, 4445, 4460, and 4452 (trade names, products of Momentive Performance Materials Inc.), KP341, KF6001, and KF6002 (trade names, products of Shin-Etsu Chemical Co., Ltd.), BYK307, 323, and 330 (trade names, products of BYK Chemie) )Wait. The content of the surfactant is not particularly limited as long as it is within a range capable of exerting its function, and can contain 0.01 to 5 parts by weight, preferably 0.05 to 3 parts by weight, relative to 100 parts by weight of the binder resin. . When the content of the surfactant is contained within the above range, there is an advantage that the effect of improving the adhesion between the substrate and the resin composition can be maximized. Additives The photosensitive resin composition of the present invention can generally further contain a thermal crosslinking agent, a light stabilizer, a light curing accelerator, an anti-halation agent (leveling agent), and the like, as long as it does not deviate from the object of the present invention Defoamers and other such additives. The thermal cross-linking agent is a component that causes a cross-linking reaction to occur smoothly by UV irradiation and heat treatment when an insulating film is formed from the composition, and improves heat resistance. The type of the thermal crosslinking agent is not particularly limited, and specific examples include polyacrylate resins, epoxy resins, phenol resins, melamine resins, organic acids, amine compounds, and anhydrous compounds. These can be used individually or in mixture of 2 or more types. The content of the thermal cross-linking agent is not particularly limited as long as it is within a range capable of exerting its function, and may contain 0.01 to 5 parts by weight relative to 100 parts by weight of the binder resin, and preferably 0.1 to 3 parts by weight. Serving. When the content of the thermal crosslinking agent is 0.01 parts by weight or more and 5 parts by weight or less based on 100 parts by weight of the binder resin, there is an advantage that the effect of improving heat resistance is maximized. A light stabilizer is a component which improves the light resistance of a photosensitive resin composition. The type of the light stabilizer is not particularly limited, and specific examples include benzotriazole-based, triazine-based, benzophenone-based, hindered aminoether-based, and hindered amine-based compounds. These can be used individually or in mixture of 2 or more types. The content of the light stabilizer is not particularly limited as long as it is within a range capable of exerting its function, and may contain 0.01 to 5 parts by weight, preferably 0.1 to 3 parts by weight, based on 100 parts by weight of the binder resin. . When the content of the light stabilizer is 0.01 parts by weight or more and 5 parts by weight or less based on 100 parts by weight of the binder resin, there is an advantage that the effect of improving light resistance is maximized. < Insulating film > The present invention can form an insulating film made of the above-mentioned photosensitive resin composition. At this time, the insulating film is formed on the substrate. As the substrate, there are substrates for liquid crystal display devices or organic light-emitting display devices, and quartz, transparent resin substrates, and the like can be used. The type of transparent resin used in the manufacture of the substrate is not particularly limited, and examples thereof include polyimide resin, acrylic resin, polyacrylate resin, polycarbonate resin, polyether resin, and polyethylene terephthalate. Alcohol ester resin, sulfonic acid resin, etc. These can be used individually or in mixture of 2 or more types. A gate electrode or a source / drain electrode may be formed on a substrate, and the above-mentioned insulating film may be formed thereon. In addition, an organic insulating film or an inorganic insulating film may be formed on a substrate, and the above-mentioned insulating film may be formed thereon. The organic insulating film can be made of acrylic resin, polyimide resin, polyimide resin, siloxane resin, photosensitive acrylic carboxyl group resin, novolac resin, alkali soluble resin, etc. membrane. In addition, the inorganic insulating film may be silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon oxycarbide (SiOxCy), silicon carbon nitride (SiCxNy), Aluminum oxide (AlOx), titanium oxide (TiOx), tantalum oxide (TaOx), magnesium oxide (MgOx), zinc oxide (ZnOx), hafnium oxide (HfOx), zirconium Oxide (ZrOx), titanium oxide (TiOx), but in the present invention, it is best from the standpoint that the effect of increasing the adhesion with the insulating film formed using the photosensitive resin composition of the present invention is significant Silicon nitride, silicon oxynitride, silicon oxide. In one embodiment of the present invention, the insulating film may be formed on the silicon nitride insulating film. Silicon nitride is generally not excellent in adhesion to an organic insulating film. Therefore, in order to form an organic insulating film on an insulating film composed of silicon nitride, a pretreatment process such as HMDS has been required to improve adhesion. Coating, etc. However, since the insulating film formed using the photosensitive resin composition according to the present invention has excellent adhesion to silicon nitride, the pretreatment step can be omitted. The thickness of the insulating film of the present invention is not particularly limited, and may be, for example, 0.5 to 100 μm. The method for forming an insulating film according to the present invention may include coating the photosensitive resin composition of the present invention on an upper portion of a substrate of a display device, or on an upper portion of a source / drain or a silicon nitride layer formed on the substrate. A stage; a stage of pre-baking the photosensitive resin composition; a stage of selectively exposing and developing the photosensitive resin composition to form a pattern; and a stage of heat-treating the formed pattern. As the substrate, glass or transparent plastic resin commonly used in liquid crystal display devices, organic ELs, etc. is mainly used, and is not particularly limited by the characteristics of the display device used. For example, it is possible to use a substrate in which a metal film constituting a gate electrode is formed on an insulating substrate such as a glass substrate, and the metal film includes a surface layer. The method for applying the photosensitive resin composition to an upper portion of a substrate is not particularly limited, and examples thereof include a spray method, a roll coating method, and a nozzle coating method using a slit nozzle method and a central drip rotation method. For example, a spin coating method, an extrusion coating method, a bar coating method, or the like, can be applied by combining two or more coating methods. The applied film thickness varies depending on the coating method, the concentration of the solid content of the composition, the viscosity, and the like, but it is usually applied so that the film thickness becomes 0.5 to 100 μm after drying. The subsequent pre-baking stage is a process of applying a vacuum, infrared, or heat to volatilize the solvent in order to obtain a non-flowing coating film after the coating film is formed. The heating conditions vary depending on the type and composition of each component, but when heated on a hot plate (hot plate, hot plate), it can be performed at 60 to 130 ° C for 5 to 500 seconds. When using a hot oven, it can It is performed at 60 to 140 ° C for 20 to 1,000 seconds. Next, in terms of the selective exposure process, excimer laser, far ultraviolet, ultraviolet, visible light, electron beam, X-ray or g-ray (wavelength 436 nm), i-ray (wavelength 365 nm), h The radiation (wavelength 405 nm) or its mixed light is performed. The exposure can be performed using a contact method, a proximity method, a projection method, or the like. In the present invention, after the alkali development is performed, a step of heat-treating (high-temperature firing) the photosensitive resin composition is performed. A thermal crosslinking agent or the like is applied to the constitution of the photosensitive resin composition used for the high-temperature firing. The heat treatment stage can be performed at a temperature of 150 to 350 ° C for 30 minutes to 3 hours by using a heating device such as a hot plate or an oven. After the heat treatment is completed, a fully cross-linked cured pattern is obtained. < Image display device > Moreover, this invention provides the image display device provided with the said insulation film. The insulating film of the present invention can be applied not only to ordinary liquid crystal display devices, but also to various image display devices such as electroluminescence display devices, plasma display devices, and field emission display devices. The image display device can further include a configuration generally used in this technology in addition to the above-mentioned insulating film. The following are preferred embodiments that are helpful to the understanding of the present invention, but these embodiments only exemplify the present invention and do not limit the scope of the attached patent application. The embodiment has various deformations and corrections, which is obvious to those skilled in the art, and such deformations and corrections certainly belong to the scope of the attached patent application. Examples 1 to 14 and Comparative Examples 1 to 3 produced photosensitive resin compositions having the compositions and contents described in Table 1 below. [Table 1] A1-1. (A) / (b) = 60/40 A1-2. (A) / (b) = 70/30 A2-1: (a) / (b) / (c) = 20/60/20 A2-2: (a) / (b) / (c) = 30/50/20 R: ethyl A3-1: (a) / (b) / (c) / (d) = 15/10/50/25 A3-2: (a) / (b) / (c) / (d) = 25/15/30/30 (B) (C) (D1) Propylene glycol methyl ethyl acetate (D2) Diethylene glycol methyl ethyl ester (E) Dicyclohexyl methylamine (F) KBM-403 (γ-glycidyloxypropyltrialkoxy Silane, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) (G1) SH-8400 (manufactured by Toray Dow Corning) (G2) F-475 (manufactured by DIC) Experimental Examples Manufactured from Examples 1 to 14 and Comparative Examples 1 to 3 The resin composition was evaluated as described below, and the results are shown in Table 2 below. (1) Sensitivity measurement On a 0.7 mm thick glass substrate (CORNING 1737, manufactured by Corning Corporation), the photosensitive resin compositions of the Examples and Comparative Examples were coated with a spin coater and heated on a hot plate at 100 ° C for 125 minutes. The solvent was evaporated in seconds to form a photosensitive resin composition layer having a thickness of 4.0 μm. Then, in order to obtain a contact hole pattern with a diameter of 10 μm, exposure was performed using an i-ray stepper (NSR-205i11D, Nikon Corporation) using a mask with an opening portion having a square pattern opening with a 10 μm side. For the exposed substrate, a 2.38% tetramethylammonium hydroxide aqueous solution was used as a developing solution, and spin-over immersion development was performed at 23 ° C for 40 seconds, and heated in an oven at 230 ° C for 30 minutes to obtain a cured film. Then, the substrate was cut vertically, and the exposure amount of the 10 μm contact hole was selected by sensitivity in each composition. (2) Pattern angle The obtained pattern was cut vertically, and the angle with the substrate was calculated from the optical photograph. (3) Measurement of transmittance The transmittance of the obtained film at 400 nm was measured with a spectrophotometer. (4) Evaluation of adhesion On the glass substrate on which silicon nitride was vapor-deposited, in a state where the hexamethyldisilazane solution was not applied, Examples 1 to 14 and Comparative Examples were applied with a spin coater. The photosensitive resin composition of 1 to 3 is heated on a hot plate at 100 ° C. for 125 seconds to volatilize the solvent to form a photosensitive resin composition layer having a thickness of 4.0 μm. Then, using a mask having a hole pattern of 5 to 20 μm, exposure was performed using an i-ray stepper (NSR-205i11D, Nikon Corporation). For the exposed substrate, a 2.38% tetramethylammonium hydroxide aqueous solution was used as a developing solution, and spin-over immersion development was performed at 23 ° C. for 40 seconds to confirm whether the pattern was peelable. <Evaluation Criteria> ◎: The pattern was not peeled at all in all areas. ○: The pattern was peeled finely in a part of the area. △: A considerable part of the pattern was peeled. With reference to Table 2 above, it can be seen that the insulating films formed using the photosensitive resin compositions of Examples 1 to 14 have very good adhesion, excellent sensitivity and transmittance, and exhibit appropriate pattern angles. However, it was found that the insulating film formed of the photosensitive resin compositions of Comparative Examples 1 to 3 without using a silyl ether group-containing acrylic resin showed a very poor adhesion.