TW201807354A - LED light bulb having heat dissipation module the first voltage module and the second voltage module are respectively disposed on a first surface and a second surface for increasing the heat dissipating effect - Google Patents
LED light bulb having heat dissipation module the first voltage module and the second voltage module are respectively disposed on a first surface and a second surface for increasing the heat dissipating effect Download PDFInfo
- Publication number
- TW201807354A TW201807354A TW105127187A TW105127187A TW201807354A TW 201807354 A TW201807354 A TW 201807354A TW 105127187 A TW105127187 A TW 105127187A TW 105127187 A TW105127187 A TW 105127187A TW 201807354 A TW201807354 A TW 201807354A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- module
- voltage
- voltage module
- aluminum substrate
- Prior art date
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
本發明是有關於一種燈泡,特別是指一種具有散熱模組的LED燈泡。The invention relates to a light bulb, in particular to an LED light bulb with a heat dissipation module.
參閱圖1、2,一種現有的LED燈泡,包括一電路單元11、一發光單元12、一燈座單元13,及一燈罩14,該電路單元11具有一鋁基板111、一設置於該鋁基板111的第一電壓模組112,及一電連接該第一電壓模組112的第二電壓模組113,該發光單元12具有複數設置於該鋁基板111並電連接該第一電壓模組112的發光二極體121,該燈座單元13具有一相鄰該鋁基板111的導熱板131、一連接該導熱板131的外周緣的導熱圍壁132、一設置於該導熱圍壁132內並設置於該導熱板131相反該鋁基板111的一側的軟質層133,及一由該導熱圍壁132及該軟質層133共同圍繞界定的導熱空間134,該第二電壓模組113是設置於該軟質層133相反該導熱板131的一側,該燈罩14安裝於該燈座單元13。1 and 2, a conventional LED light bulb includes a circuit unit 11, a light-emitting unit 12, a lamp holder unit 13, and a lamp cover 14. The circuit unit 11 has an aluminum substrate 111 and an aluminum substrate disposed on the aluminum substrate 111. The first voltage module 112 of 111 and a second voltage module 113 electrically connected to the first voltage module 112. The light-emitting unit 12 has a plurality of LED modules 111 disposed on the aluminum substrate 111 and electrically connected to the first voltage module 112. The light-emitting diode 121 has a heat-conducting plate 131 adjacent to the aluminum substrate 111, a heat-conducting surrounding wall 132 connected to an outer periphery of the heat-conducting plate 131, and a heat-conducting surrounding wall 132 disposed in the heat-conducting surrounding wall 132. A soft layer 133 disposed on a side of the heat conducting plate 131 opposite to the aluminum substrate 111 and a heat conducting space 134 defined by the heat conducting surrounding wall 132 and the soft layer 133 together. The second voltage module 113 is disposed on The soft layer 133 is opposite to the heat conducting plate 131, and the lamp cover 14 is mounted on the lamp holder unit 13.
使用時,該第二電壓模組113可將交流電壓220V轉換成交流電壓110V,該第一電壓模組112再將交流電壓110V轉換成驅使該等發光二極體121發光的直流電壓,進而使該LED燈泡發光,而該等發光二極體121產生的熱量會經由該鋁基板111及該導熱板131後,最後由該導熱圍壁132將熱量散逸至該導熱空間134,而達到散熱的效果。In use, the second voltage module 113 can convert an AC voltage of 220V to an AC voltage of 110V, and the first voltage module 112 converts the AC voltage of 110V into a DC voltage that drives the light-emitting diodes 121 to emit light, thereby enabling The LED light bulb emits light, and the heat generated by the light-emitting diodes 121 passes through the aluminum substrate 111 and the heat conducting plate 131, and finally the heat dissipation wall 132 dissipates the heat to the heat conducting space 134, thereby achieving the effect of heat dissipation. .
然而,由於該等發光二極體121產生的熱量也會經由該鋁基板111而使該第一電壓模組112處於高溫環境,因此在長期使用下,該第一電壓模組112容易因積熱過高而損壞,因此進一步改良散熱方式是目前仍然在發展中的技術。However, since the heat generated by the light-emitting diodes 121 also causes the first voltage module 112 to be in a high-temperature environment through the aluminum substrate 111, the long-term use of the first voltage module 112 is liable to cause heat buildup. It is too high and damaged, so further improvement of heat dissipation is a technology that is still under development.
因此,本發明之目的,即在提供一種具有散熱模組的LED燈泡。Therefore, an object of the present invention is to provide an LED light bulb having a heat dissipation module.
於是,本發明具有散熱模組的LED燈泡,包含一電路單元、一發光單元,及一燈座單元。Therefore, the LED light bulb with a heat dissipation module of the present invention includes a circuit unit, a light emitting unit, and a lamp base unit.
該電路單元包括一阻熱板、一環繞該阻熱板外周緣的鋁基板、一覆蓋於該阻熱板及該鋁基板的同一側的反射層,及相互電連接的一第一電壓模組及一第二電壓模組,該反射層具有一相反該阻熱板的第一表面,該阻熱板具有一相反該反射層的第二表面,該第一電壓模組及該第二電壓模組分別設置於該第一表面及該第二表面,該發光單元包括複數設置於該第一表面對應該鋁基板處且電連接該第一電壓模組的發光二極體,該燈座單元包括一散熱模組,及一圍繞於該散熱模組外側的殼體,該散熱模組具有一鄰接於該鋁基板相反該反射層的一側的導熱板、一自該導熱板外周緣朝遠離該鋁基板方向延伸的導熱圍壁,及一由該導熱板及該導熱圍壁共同圍繞界定以容置該第二電壓模組的導熱空間,該導熱板具有一可供該第二電壓模組通過的導通孔。The circuit unit includes a heat blocking plate, an aluminum substrate surrounding the outer periphery of the heat blocking plate, a reflective layer covering the same side of the heat blocking plate and the aluminum substrate, and a first voltage module electrically connected to each other. And a second voltage module, the reflective layer has a first surface opposite to the heat blocking plate, the heat blocking plate has a second surface opposite to the reflective layer, the first voltage module and the second voltage mode The groups are respectively disposed on the first surface and the second surface. The light-emitting unit includes a plurality of light-emitting diodes disposed on the first surface corresponding to the aluminum substrate and electrically connected to the first voltage module. The lamp holder unit includes A heat dissipation module and a shell surrounding the outside of the heat dissipation module. The heat dissipation module has a heat conducting plate adjacent to a side of the aluminum substrate opposite to the reflective layer, and a heat conducting plate facing away from the heat conducting plate. A thermal conductive wall extending in the direction of the aluminum substrate, and a thermal conductive space defined by the thermal conductive plate and the thermal conductive wall to accommodate the second voltage module, the thermal plate has a second voltage module through Vias.
本發明之功效在於:藉由該第一電壓模組及該第二電壓模組分別設置於該第一表面及該第二表面,並使該等發光二極體所產生的熱量能經由該鋁基板而通過該導熱板的設計,而能提高散熱效果。The effect of the present invention is that the first voltage module and the second voltage module are respectively disposed on the first surface and the second surface, and the heat generated by the light emitting diodes can pass through the aluminum. The design of the heat transfer plate of the substrate can improve the heat dissipation effect.
參閱圖3、4,本發明具有散熱模組的LED燈泡之一實施例,包含一電路單元2、一發光單元3、一燈座單元4、一固定單元5,及一燈罩6。Referring to FIGS. 3 and 4, an embodiment of an LED light bulb with a heat dissipation module according to the present invention includes a circuit unit 2, a light emitting unit 3, a lamp holder unit 4, a fixing unit 5, and a lamp cover 6.
該電路單元2包括一阻熱板21、一環繞該阻熱板21外周緣的鋁基板22、一覆蓋於該阻熱板21及該鋁基板22的同一側的反射層23、相互電連接的一第一電壓模組24及一第二電壓模組25,及一插頭件26。The circuit unit 2 includes a heat-shielding plate 21, an aluminum substrate 22 surrounding the outer periphery of the heat-shielding plate 21, a reflective layer 23 covering the same side of the heat-shielding plate 21 and the aluminum substrate 22, and electrically connected A first voltage module 24 and a second voltage module 25, and a plug member 26.
該反射層23具有一相反該阻熱板21的第一表面231。於本實施例中,該反射層23是用以反射該發光單元3所發出的光,進而提高亮度。The reflective layer 23 has a first surface 231 opposite to the heat blocking plate 21. In this embodiment, the reflective layer 23 is used to reflect the light emitted by the light emitting unit 3, thereby improving the brightness.
該阻熱板21具有一相反該反射層23的第二表面211。The heat blocking plate 21 has a second surface 211 opposite to the reflective layer 23.
該第一電壓模組24及該第二電壓模組25分別設置於該第一表面231及該第二表面211。於本實施例中,該第一電壓模組24及該第二電壓模組25用來將交流電壓100V~240V轉換為驅動該發光單元3發光的直流電壓。The first voltage module 24 and the second voltage module 25 are respectively disposed on the first surface 231 and the second surface 211. In this embodiment, the first voltage module 24 and the second voltage module 25 are used to convert an AC voltage of 100V to 240V into a DC voltage that drives the light emitting unit 3 to emit light.
該發光單元3包括複數設置於該第一表面231對應該鋁基板22處且電連接該第一電壓模組24的發光二極體(LED)31。The light emitting unit 3 includes a plurality of light emitting diodes (LEDs) 31 disposed on the first surface 231 corresponding to the aluminum substrate 22 and electrically connected to the first voltage module 24.
該燈座單元4包括一散熱模組41,及一圍繞於該散熱模組41外側的殼體42。於本實施例中,該殼體42是由例如是PC材質的導熱塑膠製成,而能符合安全法規。The lamp base unit 4 includes a heat dissipation module 41 and a casing 42 surrounding the heat dissipation module 41. In this embodiment, the casing 42 is made of a thermally conductive plastic made of PC, for example, and can meet safety regulations.
該散熱模組41具有一鄰接於該鋁基板22相反該反射層23的一側的導熱板411、一自該導熱板411外周緣朝遠離該鋁基板22方向延伸的導熱圍壁412,及一由該導熱板411及該導熱圍壁412共同圍繞界定以容置該第二電壓模組25的導熱空間413。於本實施例中,該導熱板411與該導熱圍壁412是一體製成,而能提高導熱效果。The heat dissipation module 41 has a heat conducting plate 411 adjacent to the aluminum substrate 22 on the side opposite to the reflective layer 23, a heat conducting surrounding wall 412 extending from the outer periphery of the heat conducting plate 411 in a direction away from the aluminum substrate 22, and a The heat conducting plate 411 and the heat conducting surrounding wall 412 jointly surround the heat conducting space 413 defined to receive the second voltage module 25. In this embodiment, the heat-conducting plate 411 and the heat-conducting surrounding wall 412 are made integrally, so that the heat-conducting effect can be improved.
該導熱板411具有一可供該第二電壓模組25通過的導通孔414。The heat conducting plate 411 has a through hole 414 through which the second voltage module 25 can pass.
該電路單元2的該插頭件26設置於該殼體42相反該導熱板411的一側並以電路通過該導熱空間413及該導通孔414以電連接該第二電壓模組25。The plug member 26 of the circuit unit 2 is disposed on a side of the housing 42 opposite to the heat conducting plate 411 and electrically connects the second voltage module 25 through the heat conducting space 413 and the through hole 414 with a circuit.
該固定單元5包括複數位於該鋁基板22及該導熱板411的其中一者的定位孔51,及複數設置於該鋁基板22及該導熱板411的其中另一者以分別穿設於該等定位孔51的定位柱52。於本實施例中,該等定位孔51位於該鋁基板22,該等定位柱52設置於該導熱板411。The fixing unit 5 includes a plurality of positioning holes 51 located in one of the aluminum substrate 22 and the heat conducting plate 411, and a plurality of other holes provided in the aluminum substrate 22 and the heat conducting plate 411 to be respectively disposed in the The positioning post 52 of the positioning hole 51. In this embodiment, the positioning holes 51 are located on the aluminum substrate 22, and the positioning posts 52 are provided on the heat conducting plate 411.
該燈罩6自該第一表面231外側蓋設於該殼體42。The lampshade 6 is covered on the casing 42 from the outside of the first surface 231.
使用時,是以該插頭件26插設於一燈座(圖未示),當該燈座所提供的交流電壓為100V~240V時,該第一電壓模組24及該第二電壓模組25將交流電壓轉換為直流電壓以驅使該等發光二極體31發光。In use, the plug member 26 is inserted into a lamp holder (not shown). When the AC voltage provided by the lamp holder is 100V ~ 240V, the first voltage module 24 and the second voltage module 25 converts AC voltage to DC voltage to drive the light emitting diodes 31 to emit light.
此時,該等發光二極體31在運作時所產生的熱量會由該鋁基板22依序傳導至該導熱板411及該導熱圍壁412,除了會由該導熱圍壁412負責將熱量同時散逸於該導熱空間413中及透過該殼體42傳導至外部,該導熱板411由於直接相鄰該導熱空間413,因此也能夠用於將熱量散逸於該導熱空間413中,由於該導熱板411及該導熱圍壁412皆相鄰該導熱空間413,且該導熱圍壁412還相鄰可導熱的該殼體42,因此散熱效果較佳。At this time, the heat generated by the light-emitting diodes 31 during operation will be sequentially transmitted from the aluminum substrate 22 to the heat conducting plate 411 and the heat conducting surrounding wall 412, except that the heat conducting surrounding wall 412 is responsible for simultaneously transmitting heat. Dissipated in the heat-conducting space 413 and conducted to the outside through the housing 42. Since the heat-conducting plate 411 is directly adjacent to the heat-conducting space 413, it can also be used to dissipate heat in the heat-conducting space 413. And the heat-conducting surrounding wall 412 is adjacent to the heat-conducting space 413, and the heat-conducting surrounding wall 412 is also adjacent to the heat-conducting casing 42, so the heat dissipation effect is better.
由於該等發光二極體31的散熱效果很好,因此環繞該阻熱板21外周緣的該鋁基板22不會將熱量傳遞至位於中間的該阻熱板21,而能避免位於該鋁基板22中央的該第一電壓模組24及該第二電壓模組25受到該等發光二極體31的高熱影響而導致容易損壞的問題,進而提升使用壽命,並節省花費。Since the light-emitting diodes 31 have good heat dissipation effects, the aluminum substrate 22 surrounding the outer periphery of the heat-shielding plate 21 will not transfer heat to the heat-shielding plate 21 located in the middle, and can avoid being located on the aluminum substrate. The first voltage module 24 and the second voltage module 25 in the middle of 22 are affected by the high heat of the light-emitting diodes 31 and cause the problem of easy damage, thereby improving the service life and saving costs.
綜上所述,藉由該第一電壓模組24及該第二電壓模組25分別設置於該第一表面231及該第二表面211,並使該等發光二極體31所產生的熱量,能直接經由該鋁基板22而通過該導熱板411及該導熱圍壁412,不會向內積熱於該阻熱板21,而能提高散熱效果,以及提高使用壽命,故確實能達成本發明之目的。In summary, the first voltage module 24 and the second voltage module 25 are respectively disposed on the first surface 231 and the second surface 211, and the heat generated by the light emitting diodes 31 is made. Can directly pass through the aluminum substrate 22 through the heat conducting plate 411 and the heat conducting surrounding wall 412, it will not accumulate heat in the heat blocking plate 21 inward, and can improve the heat dissipation effect and the service life, so it can indeed reach the cost The purpose of the invention.
惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, any simple equivalent changes and modifications made according to the scope of the patent application and the contents of the patent specification of the present invention are still Within the scope of the invention patent.
2‧‧‧電路單元
21‧‧‧阻熱板
211‧‧‧第二表面
22‧‧‧鋁基板
23‧‧‧反射層
231‧‧‧第一表面
24‧‧‧第一電壓模組
25‧‧‧第二電壓模組
26‧‧‧插頭件
3‧‧‧發光單元
31‧‧‧發光二極體
4‧‧‧燈座單元
41‧‧‧散熱模組
411‧‧‧導熱板
412‧‧‧導熱圍壁
413‧‧‧導熱空間
414‧‧‧導通孔
42‧‧‧殼體
5‧‧‧固定單元
51‧‧‧定位孔
52‧‧‧定位柱
6‧‧‧燈罩2‧‧‧Circuit Unit
21‧‧‧Heat barrier
211‧‧‧Second Surface
22‧‧‧ aluminum substrate
23‧‧‧Reflective layer
231‧‧‧first surface
24‧‧‧First Voltage Module
25‧‧‧Second Voltage Module
26‧‧‧Plug
3‧‧‧light-emitting unit
31‧‧‧light-emitting diode
4‧‧‧ lamp holder unit
41‧‧‧Cooling Module
411‧‧‧Heat conduction plate
412‧‧‧Conductive wall
413‧‧‧Heat conduction space
414‧‧‧via
42‧‧‧shell
5‧‧‧Fixed unit
51‧‧‧ positioning holes
52‧‧‧Positioning post
6‧‧‧ Lampshade
本發明的其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一現有的LED燈泡的一剖視示意圖; 圖2是該現有的LED燈泡的一立體分解圖; 圖3是本發明具有散熱模組的LED燈泡的一實施例的一剖視示意圖;及 圖4是該實施例的一立體分解圖。Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a schematic sectional view of an existing LED light bulb; FIG. 2 is a three-dimensional exploded view of the existing LED light bulb 3; FIG. 3 is a schematic cross-sectional view of an embodiment of an LED bulb with a heat dissipation module according to the present invention; and FIG. 4 is an exploded perspective view of the embodiment.
2‧‧‧電路單元 2‧‧‧Circuit Unit
21‧‧‧阻熱板 21‧‧‧Heat barrier
22‧‧‧鋁基板 22‧‧‧ aluminum substrate
23‧‧‧反射層 23‧‧‧Reflective layer
231‧‧‧第一表面 231‧‧‧first surface
24‧‧‧第一電壓模組 24‧‧‧First Voltage Module
25‧‧‧第二電壓模組 25‧‧‧Second Voltage Module
4‧‧‧燈座單元 4‧‧‧ lamp holder unit
411‧‧‧導熱板 411‧‧‧Heat conduction plate
412‧‧‧導熱圍壁 412‧‧‧Conductive wall
413‧‧‧導熱空間 413‧‧‧Heat conduction space
414‧‧‧導通孔 414‧‧‧via
42‧‧‧殼體 42‧‧‧shell
5‧‧‧固定單元 5‧‧‧Fixed unit
26‧‧‧插頭件 26‧‧‧Plug
3‧‧‧發光單元 3‧‧‧light-emitting unit
31‧‧‧發光二極體 31‧‧‧light-emitting diode
51‧‧‧定位孔 51‧‧‧ positioning holes
52‧‧‧定位柱 52‧‧‧Positioning post
6‧‧‧燈罩 6‧‧‧ Lampshade
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105127187A TWI622729B (en) | 2016-08-25 | 2016-08-25 | LED bulb with cooling module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105127187A TWI622729B (en) | 2016-08-25 | 2016-08-25 | LED bulb with cooling module |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201807354A true TW201807354A (en) | 2018-03-01 |
TWI622729B TWI622729B (en) | 2018-05-01 |
Family
ID=62189603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105127187A TWI622729B (en) | 2016-08-25 | 2016-08-25 | LED bulb with cooling module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI622729B (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4865051B2 (en) * | 2010-04-20 | 2012-02-01 | シャープ株式会社 | PAR type lighting device |
CN202302936U (en) * | 2011-10-29 | 2012-07-04 | 金松山 | Power supply isolation type LED (light emitting diode) lamp |
CN202452202U (en) * | 2012-01-20 | 2012-09-26 | 讯凯国际股份有限公司 | Light-emitting device and lampshade thereof |
-
2016
- 2016-08-25 TW TW105127187A patent/TWI622729B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI622729B (en) | 2018-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5582305B2 (en) | Lamp apparatus and lighting apparatus | |
JP5600781B2 (en) | Electrical equipment | |
TWI461629B (en) | Illuminating apparatus and illuminating module thereof | |
KR101449821B1 (en) | Heat dissipation device and lighting device | |
JP2011228126A (en) | Par type lighting device | |
PT1895227E (en) | A semiconductor light-emitting apparatus provided with a heat conducting/dissipating module | |
JP2015038855A (en) | Led luminaire | |
TW201506296A (en) | Light emitting diode bulb | |
CA2886730C (en) | Slim recessed light fixture | |
TW201314121A (en) | LED lamp | |
JP2012069396A (en) | Lighting unit and lighting system | |
JP2012234792A (en) | Lighting device | |
TWM532015U (en) | LED bulb with heat dissipation module | |
TW201807354A (en) | LED light bulb having heat dissipation module the first voltage module and the second voltage module are respectively disposed on a first surface and a second surface for increasing the heat dissipating effect | |
TWI335402B (en) | Led lamp with a heat sink | |
JP2014170676A (en) | Lighting device | |
TWM456039U (en) | Wide-angle LED alarm lamp device | |
JP2012248438A (en) | Heat radiation structure of led lighting system | |
TWI616615B (en) | Lamp device and illuminating device | |
JP5620595B2 (en) | Light bulb type lighting device | |
TWM563516U (en) | Heat-dissipation device of lamp | |
JP5620558B2 (en) | Light bulb type lighting device | |
TWM449903U (en) | LED lamp | |
KR101059084B1 (en) | Dissipating device having lighting apparatus using led | |
JP5300957B2 (en) | Lighting device |