TW201801390A - Sheet-shaped device, manufacturing method and manufacturing apparatus for sheet-shaped secondary cell - Google Patents

Sheet-shaped device, manufacturing method and manufacturing apparatus for sheet-shaped secondary cell Download PDF

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TW201801390A
TW201801390A TW106119389A TW106119389A TW201801390A TW 201801390 A TW201801390 A TW 201801390A TW 106119389 A TW106119389 A TW 106119389A TW 106119389 A TW106119389 A TW 106119389A TW 201801390 A TW201801390 A TW 201801390A
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sheet
secondary battery
shaped secondary
element pattern
laser light
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TW106119389A
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TWI617068B (en
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溝江佳亮
田中克己
植木勳
井手努
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日本麥克隆尼股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N99/00Subject matter not provided for in other groups of this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

To provide a technology to form device patterns at accurate positions on both faces of a sheet-shaped device or a sheet-shaped secondary cell. A manufacturing method for a sheet-shaped secondary cell of the present invention includes steps of (A) forming a first device pattern 80 on one face of a sheet-shaped secondary cell, (B) forming a through hole 84 at the sheet-shaped secondary cell in correspondence with the first device pattern 80, (C) forming a plurality of the first device patterns 80 and a plurality of the through holes 84 at the sheet-shaped secondary cell by repeating the step (A) and the step (B) while feeding the sheet-shaped secondary cell, (D) forming a second device pattern 85 on the other face of the sheet-shaped secondary cell after alignment is performed based on the through hole 84, (E) forming a plurality of the second device patterns 85 at the sheet-shaped secondary cell by repeating the step (D) while feeding the sheet-shaped secondary cell, and (F) cutting off the sheet-shaped secondary cell.

Description

片狀元件、片狀二次電池的製造方法、以及製造裝置Sheet-like element, manufacturing method of sheet-like secondary battery, and manufacturing apparatus

本發明係關於:在片狀二次電池或片狀元件的雙面中於正確的位置處形成元件圖案的技術。The present invention relates to a technique for forming an element pattern at a correct position on both sides of a sheet-shaped secondary battery or a sheet-shaped element.

專利文獻1中,揭示有對於被捲設於卷用之支撐體的基材網予以進行印刷的印表機。專利文獻1的印表機中,具有偵測經設置於基材網的同步標記的感應器。然後,印表機因應同步標記調整輸送方向的位置,而進行印刷。Patent Document 1 discloses a printer that prints a substrate web wound on a roll support. The printer of Patent Document 1 includes a sensor that detects a synchronization mark provided on a substrate web. Then, the printer performs printing by adjusting the position of the conveying direction in accordance with the synchronization mark.

專利文獻2中,揭示有於導線基材的正確位置熱焊接絕緣片的極耳導線構件的製造方法。專利文獻2中,包含在熱焊接絕緣片的加熱加壓步驟前,先行於導線基材的雙面側規定位置預貼絕緣片,而進行定位絕緣片的步驟。 〔先前技術文獻〕 〔專利文獻〕Patent Document 2 discloses a method for manufacturing a tab lead member that thermally welds an insulating sheet at a correct position of a lead base material. Patent Document 2 includes a step of positioning an insulating sheet by pre-adhering the insulating sheet at a predetermined position on both sides of the lead base material before the heating and pressing step of the heat-welded insulating sheet. [Prior Art Literature] [Patent Literature]

〔專利文獻1〕日本特開平10-264475號公報 〔專利文獻2〕日本特開2014-143051號公報[Patent Document 1] Japanese Patent Laid-Open No. 10-264475 [Patent Document 2] Japanese Patent Laid-Open No. 2014-143051

〔發明所欲解決之問題〕 但是,專利文獻1、2中,在卷狀的片材的雙面分別形成元件圖案的情況,有難以將雙面的元件圖案正確地對齊位置的問題點。特別在使用卷狀的片材的卷對卷的製造過程中,基材容易產生皺摺或彎曲變形之故,因此難以正確地校準。[Problems to be Solved by the Invention] However, in Patent Documents 1 and 2, when element patterns are formed on both sides of a rolled sheet, there is a problem that it is difficult to accurately align the element patterns on both sides. In particular, in a roll-to-roll manufacturing process using a roll-shaped sheet, the base material is prone to wrinkle or bending deformation, and therefore it is difficult to accurately align it.

鑒於上述問題點,本發明之目的為提供一種在片狀二次電池或片狀元件的雙面中於正確的位置處形成元件圖案的技術。 〔解決問題之技術手段〕In view of the above-mentioned problems, an object of the present invention is to provide a technique for forming an element pattern at a correct position on both sides of a sheet-shaped secondary battery or a sheet-shaped element. [Technical means to solve the problem]

關於本實施例的一樣態的片狀二次電池的製造方法,包含下列步驟:(A)在片狀二次電池的一側之表面形成一第一元件圖案,該片狀二次電池係捲設於具有一捲收軸盤及一送出軸盤的成對的輸送軸盤;(B)使對應於該第一元件圖案,而於該片狀二次電池形成貫穿孔;(C)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(A)步驟與該(B)步驟,於該片狀二次電池形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔;(D)基於該貫穿孔而進行校準,於該片狀二次電池之另一側的表面上形成第二元件圖案;(E)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(D)步驟,於該片狀二次電池形成複數個該第二元件圖案;以及(F)將該第一元件圖案與該第二元件圖案予以對應,而切斷該片狀二次電池。藉此,得以在片狀二次電池的雙面中,於正確的位置形成元件圖案。Regarding the manufacturing method of the same sheet secondary battery of this embodiment, the method includes the following steps: (A) forming a first element pattern on a surface of one side of the sheet secondary battery, and the sheet secondary battery is rolled It is provided on a pair of conveying reels having a winding reel and a sending reel; (B) forming a through-hole in the sheet-shaped secondary battery corresponding to the first element pattern; (C) by The pair of conveying shaft disks sends out the sheet-shaped secondary battery, and the steps (A) and (B) are repeatedly performed, and a plurality of the first element patterns are formed on the sheet-shaped secondary battery and correspond to the first A through hole of an element pattern; (D) calibration based on the through hole, forming a second element pattern on the surface of the other side of the sheet-shaped secondary battery; (E) by the pair of conveying shaft disks Sending out the sheet-shaped secondary battery, and repeatedly performing the step (D) to form a plurality of the second element patterns on the sheet-shaped secondary battery; and (F) applying the first element pattern and the second element pattern Correspondingly, the sheet-shaped secondary battery is cut. Thereby, an element pattern can be formed in a correct position on both sides of a sheet-shaped secondary battery.

在前述之製造方法中,亦可在該(A)步驟中,以照射來自雷射光源的雷射光,使經形成於該片狀二次電池之一側的表面的第一上部電極對應於該第一元件圖案而圖案化,在該(B)步驟中,以照射來自該雷射光源之雷射光,於該片狀二次電池形成該貫穿孔。由於此結構中,使用共同的雷射光源而形成第一元件圖案及貫穿孔,因此能以高生產率製造片狀二次電池。In the aforementioned manufacturing method, in the step (A), the first upper electrode formed on the surface of one side of the sheet-shaped secondary battery may be irradiated with laser light from the laser light source corresponding to the The first element is patterned and patterned. In the step (B), the through-hole is formed in the sheet-shaped secondary battery by irradiating laser light from the laser light source. In this structure, the first element pattern and the through-hole are formed using a common laser light source, so that a sheet-shaped secondary battery can be manufactured with high productivity.

在前述之製造方法中,亦可在該(A)步驟中,在形成該第一元件圖案的中途,進行該(B)步驟而形成該貫穿孔。藉此,能以高生產率製造片狀二次電池。In the aforementioned manufacturing method, in the step (A), the through-hole may be formed by performing the step (B) in the middle of forming the first element pattern. Thereby, a sheet-shaped secondary battery can be manufactured with high productivity.

在前述之製造方法中,亦可在該(D)步驟中,以照射來自雷射光源的雷射光,使經形成於該片狀二次電池另一側的表面的第二上部電極對應於該第二元件圖案而圖案化。由於使用共同的雷射光源形成第二元件圖案及第一元件圖案及貫穿孔,因此能以高生產率製造片狀二次電池。In the aforementioned manufacturing method, in the step (D), the second upper electrode formed on the surface on the other side of the sheet-shaped secondary battery may be irradiated with laser light from the laser light source so as to correspond to the The second element is patterned. Since the second element pattern, the first element pattern, and the through-hole are formed using a common laser light source, a sheet-shaped secondary battery can be manufactured with high productivity.

在前述之製造方法中,亦可在該(F)步驟中,以照射來自雷射光源的雷射光,使俯視中於鄰接的二個該第一元件圖案之間的位置形成切割線,沿著該切割線將該片狀二次電池予以切斷。In the aforementioned manufacturing method, in the step (F), a cutting line may be formed by irradiating the laser light from the laser light source so as to form a cutting line at a position between two adjacent first element patterns in a plan view. The cutting line cuts the sheet-shaped secondary battery.

在前述之製造方法中,亦可在將該片狀二次電池吸附於工件台的狀態下,該雷射光源對該片狀二次電池照射雷射光。藉此,由於可防止雷射照射中的位置誤差,因此能以更高的位置精度形成元件圖案。In the aforementioned manufacturing method, the sheet light secondary battery may be irradiated with the laser light while the sheet secondary battery is adsorbed on the work table. Thereby, since a position error in laser irradiation can be prevented, an element pattern can be formed with higher position accuracy.

在前述之製造方法中,亦可在該(D)步驟中,藉由拍攝手段,從另一側的表面側拍攝該片狀二次電池,基於藉由該拍攝手段所拍攝的圖像,進行該校準。藉此,可簡便地進行校準。In the aforementioned manufacturing method, in the step (D), the sheet-shaped secondary battery may be photographed from the other surface side by the photographing means, and based on the image photographed by the photographing means, The calibration. This allows easy calibration.

在前述之製造方法中,亦可在該(B)步驟中,在該片狀二次電池的捲收方向,形成分別對應於該第一元件圖案的二個該貫通孔,在該(D)步驟中,基於一側的該貫通孔所拍攝的第一圖像、及另一側的該貫通孔所拍攝的第二圖像,而進行該校準。藉此,能以更高的位置精度,於基材的雙面形成元件圖案。In the aforementioned manufacturing method, in the step (B), two through-holes respectively corresponding to the first element pattern may be formed in the winding direction of the sheet-shaped secondary battery, and in the (D) In the step, the calibration is performed based on a first image captured by the through-hole on one side and a second image captured by the through-hole on the other side. Thereby, element patterns can be formed on both sides of the substrate with higher position accuracy.

在前述之製造方法中,該片狀二次電池,亦可包含成為下部電極的基材,於該基材的一側的表面側,形成第一充電層及第一上部電極,於該基材的另一側的表面側,形成第二充電層及第二上部電極,於該第一充電層與該基材之間,形成第一n型金屬氧化物半導體層,於該第二充電層與該基材之間,形成第二n型金屬氧化物半導體層,該第一充電層及該第二充電層分別具有含有n型金屬氧化物半導體及絕緣體的物質。In the aforementioned manufacturing method, the sheet-shaped secondary battery may further include a substrate serving as a lower electrode, and a first charging layer and a first upper electrode are formed on a surface side of the substrate, and the substrate A second charging layer and a second upper electrode are formed on the other side of the surface. A first n-type metal oxide semiconductor layer is formed between the first charging layer and the substrate. Between the substrates, a second n-type metal oxide semiconductor layer is formed, and the first charging layer and the second charging layer each have a substance containing an n-type metal oxide semiconductor and an insulator.

本實施例相關之片狀二次電池的製造裝置,包含:一成對的輸送軸盤,具有捲收軸盤及送出軸盤;一雷射光源,以雷射光照射在張緊於該成對的輸送軸盤的片狀二次電池,而於該片狀二次電池之一側的表面形成第一元件圖案;一拍攝手段,以來自該雷射光源的雷射光從該片狀二次電池之該一側的表面側照射,而拍攝經形成於該片狀二次電池的貫穿孔;一驅動機構,基於以該拍攝手段所拍攝的圖像,校準在該片狀二次電池之另一側的表面中的該雷射光源的照射位置。藉此,可在片狀二次電池的雙面,於正確的位置形成元件圖案。The manufacturing device of a sheet-shaped secondary battery related to this embodiment includes a pair of conveying shaft disks with a winding shaft disk and a sending shaft disk; a laser light source, which is irradiated with the laser light and tensioned on the pair. A sheet-shaped secondary battery that conveys a shaft disk, and a first element pattern is formed on a surface on one side of the sheet-shaped secondary battery; a photographing means for extracting laser light from the laser light source from the sheet-shaped secondary battery The surface side of the one side is irradiated, and the through-hole formed in the sheet-shaped secondary battery is photographed; a driving mechanism is calibrated on the other side of the sheet-shaped secondary battery based on the image captured by the photographing means; The irradiation position of this laser light source in the side surface. Thereby, an element pattern can be formed on both sides of a sheet-shaped secondary battery at a correct position.

在前述之製造裝置中,(G)以該雷射光源從該片狀二次電池之一側的表面側照射該雷射光,而於該片狀二次電池之一側的表面形成該第一元件圖案;(H)以該雷射光源從該片狀二次電池之該一側的表面側照射該雷射光,而對應於該第一元件圖案,而於該片狀二次電池形成貫穿孔;(I)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(G)步驟及該(H)步驟,於該片狀二次電池,形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔;(J)在該驅動機構進行校準的狀態下,以該雷射光源從該片狀二次電池的另一側的表面之側照射雷射光,於該片狀二次電池的該另一側的表面上形成第二元件圖案;(K)藉由該成對的輸送軸盤而送出該片狀二次電池,反覆地進行該(J)步驟,於該片狀二次電池形成複數個該第二元件圖案。藉此,得以以高位置精度於片狀二次電池的雙面形成圖案。In the aforementioned manufacturing apparatus, (G) irradiates the laser light from a surface side of one side of the sheet-shaped secondary battery with the laser light source, and forms the first on a surface of one side of the sheet-shaped secondary battery. Element pattern; (H) radiating the laser light from the surface side of the one side of the sheet secondary battery with the laser light source, and corresponding to the first element pattern, forming a through hole in the sheet secondary battery ; (I) sending out the sheet-shaped secondary battery through the pair of conveying shaft disks, repeatedly performing the steps (G) and (H), and forming a plurality of the first on the sheet-shaped secondary battery; An element pattern and a through hole corresponding to the first element pattern; (J) irradiating the laser light from the side of the surface of the other side of the sheet-shaped secondary battery with the laser light source in a state where the driving mechanism is calibrated; Forming a second element pattern on the surface of the other side of the sheet-shaped secondary battery; (K) sending out the sheet-shaped secondary battery through the pair of conveying shaft disks, and repeatedly performing the (J) Step, forming a plurality of the second element patterns on the sheet-shaped secondary battery. Thereby, a pattern can be formed on both sides of a sheet-shaped secondary battery with high positional accuracy.

在前述之製造裝置中,亦可更包含吸附該片狀二次電池的工件台,其中在該工件台吸附該片狀二次電池的狀態下,該雷射光源對該片狀二次電池照射雷射光。藉此,可確實地在經定位的狀態照射雷射光。The aforementioned manufacturing apparatus may further include a workpiece stage that adsorbs the sheet-shaped secondary battery, and in a state where the workpiece stage adsorbs the sheet-shaped secondary battery, the laser light source irradiates the sheet-shaped secondary battery. laser. Thereby, laser light can be reliably irradiated in the positioned state.

本實施方式相關之片狀元件,包含:一片材;一第一元件圖案,形成於該片材之一側的表面;一第二元件圖案,形成於該片材之另一側的表面,並對應於該第一元件圖案;一貫穿孔,貫穿該片材而配置於該片材之一側的表面中的該第一元件圖案附近,及配置於該片材之另一側的表面中的該第二元件圖案附近。藉此,得以在片狀二次電池的雙面中,於正確的位置形成元件圖案。The sheet element related to this embodiment includes: a sheet of material; a first element pattern formed on a surface of one side of the sheet; a second element pattern formed on a surface of the other side of the sheet, And corresponds to the first element pattern; a through hole penetrating the sheet and disposed near the first element pattern in a surface on one side of the sheet, and disposed in a surface on the other side of the sheet Near the second element pattern. Thereby, an element pattern can be formed in a correct position on both sides of a sheet-shaped secondary battery.

本實施方式相關之片狀元件的製造方法,包含下列步驟:(A) 在片狀元件的一側之表面形成一第一元件圖案,該片狀元件係捲設於具有一捲收軸盤及一送出軸盤的成對的輸送軸盤;(B)使對應於該第一元件圖案,而於該片狀元件形成貫穿孔。(C)藉由該成對的輸送軸盤送出該片狀元件,反覆地進行該(A)步驟與該(B)步驟,於該片狀二次電池形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔;(D)基於該貫穿孔而進行校準,於該片狀元件之另一側的表面形成第二元件圖案;(E)藉由該成對的輸送軸盤送出該片狀元件,反覆地進行該(D)步驟,於該片狀元件形成複數個該第二元件圖案;以及(F)將該第一元件圖案與該第二元件圖案予以對應,而切斷該片狀元件。藉此,得以在片狀元件的雙面中,於正確的位置形成元件圖案。 〔對照先前技術之功效〕The manufacturing method of the sheet-like element related to this embodiment includes the following steps: (A) forming a first element pattern on a surface of one side of the sheet-like element, the sheet-like element being rolled on a roll having a winding shaft and A pair of conveying shaft disks sending out the shaft disks; (B) forming a through-hole in the sheet-shaped component corresponding to the first element pattern. (C) The sheet-shaped element is sent out through the pair of conveying shaft disks, and the steps (A) and (B) are repeatedly performed to form a plurality of the first element patterns and corresponding ones in the sheet-shaped secondary battery. Through the through hole of the first element pattern; (D) performing calibration based on the through hole, forming a second element pattern on the surface of the other side of the sheet element; (E) by the pair of conveying shaft disks Sending out the sheet element, and repeatedly performing the step (D), forming a plurality of the second element patterns on the sheet element; and (F) corresponding to the first element pattern and the second element pattern, and cutting Break the sheet-like element. Thereby, an element pattern can be formed at a correct position on both sides of the sheet-like element. [Contrast with the effect of the prior art]

若依據本發明,可提供在片狀二次電池或片狀元件的雙面中,於正確的位置形成元件圖案的技術。According to the present invention, it is possible to provide a technique for forming an element pattern at a correct position on both sides of a sheet-shaped secondary battery or a sheet-shaped element.

以下,對本發明的實施例的一範例參考圖面說明。以下說明雖顯示本發明合適的實施例,但本發明的技術性範圍並非限定於以下實施例。Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings. Although the following description shows suitable embodiments of the present invention, the technical scope of the present invention is not limited to the following embodiments.

實施例1.   以下說明為了製造根據本實施例的片狀元件之片狀二次電池的製造裝置。對根據本實施例1之片狀二次電池的製造裝置的結構,使用第1圖而說明。第1圖係示意性顯示製造裝置100的結構的立體圖。製造裝置100為對張緊於成對的軸盤的片材70進行雷射加工的雷射割線器。另外,為了明確地說明,於第1圖顯示XYZ三次元直角座標系。再者,X方向為張緊於成對的軸盤的片材70的輸送方向,Y方向為片材70的寬幅方向。Example 1. (1) A manufacturing apparatus for a sheet-shaped secondary battery for manufacturing a sheet-shaped element according to this example will be described below. The structure of the sheet-type secondary battery manufacturing apparatus according to the first embodiment will be described using FIG. 1. FIG. 1 is a perspective view schematically showing the structure of the manufacturing apparatus 100. The manufacturing apparatus 100 is a laser cutter that performs laser processing on a sheet 70 tensioned on a pair of axle disks. In addition, for the sake of clarity, the XYZ three-dimensional rectangular coordinate system is shown in FIG. 1. In addition, the X direction is the conveyance direction of the sheet material 70 tensioned on the pair of shaft disks, and the Y direction is the width direction of the sheet material 70.

製造裝置100包含:機架101、頭部102、工件台105、驅動機構106、工件台驅動機構107、及控制部108。機架101為藉由金屬等所形成的框架,設置於製造工廠等。機架101的內部安裝有頭部102、工件台105、驅動機構106、及工件台驅動機構107等各構成單元。The manufacturing apparatus 100 includes a frame 101, a head portion 102, a work table 105, a drive mechanism 106, a work table drive mechanism 107, and a control unit 108. The frame 101 is a frame formed of metal or the like, and is installed in a manufacturing factory or the like. Various components such as a head 102, a work table 105, a drive mechanism 106, and a work table drive mechanism 107 are mounted inside the frame 101.

頭部102包含雷射光源103及相機104等光學機組。即,頭部102內安裝有雷射光源103、及相機104。當然頭部102中不只雷射光源103及相機104,亦可安裝為了聚集雷射光的鏡片。頭部102以片材70為基準配置於+Z方向(換言之,為片材70的上方側)。The head 102 includes optical units such as a laser light source 103 and a camera 104. That is, a laser light source 103 and a camera 104 are mounted in the head 102. Of course, not only the laser light source 103 and the camera 104 can be installed in the head 102, but also a lens for collecting laser light can be installed. The head part 102 is arrange | positioned in the + Z direction based on the sheet 70 (in other words, it is the upper side of the sheet 70).

頭部102透過驅動機構106,安裝於機架101。驅動機構106使頭部102移動於X方向及Y方向。具體上,驅動機構106包含能夠驅動頭部102移動於分別X方向及Y方向之馬達及線性滑軌機構等。藉由驅動機構106驅動頭部102,能改變頭部102對片材70的X方向的位置及Y方向的位置。The head 102 is mounted on the frame 101 through the driving mechanism 106. The driving mechanism 106 moves the head 102 in the X direction and the Y direction. Specifically, the driving mechanism 106 includes a motor, a linear slide mechanism, and the like capable of driving the head portion 102 to move in the X direction and the Y direction, respectively. The driving mechanism 106 drives the head 102 to change the position of the head 102 with respect to the sheet 70 in the X direction and the position in the Y direction.

雷射光源103係為了於片材70形成切割線等的加工用雷射裝置。即,藉由雷射光源103輸出雷射光,能夠將片材70加工。雷射光源103可用於形成校準標記、及用於形成元件圖案。藉由驅動機構106驅動頭部102,雷射光源103能夠於片材70上的期望位置照射雷射光。對藉由雷射光源103的片材70的加工過程在後述說明。The laser light source 103 is a processing laser device for forming a cutting line or the like on the sheet 70. That is, the laser light source 103 outputs laser light, so that the sheet 70 can be processed. The laser light source 103 can be used for forming alignment marks and for forming element patterns. By driving the head portion 102 with the driving mechanism 106, the laser light source 103 can irradiate laser light at a desired position on the sheet 70. The processing of the sheet 70 by the laser light source 103 will be described later.

相機104為拍攝片材70的拍攝手段的一範例,例如能夠使用CCD(Charged Coupled Device)感應器或CMOS(Complementary metal Oxide Semiconductor)感應器等作為拍攝手段。然後,基於相機104拍攝的校準標記的位置,藉由以控制部108控制驅動機構106而驅動頭部102。藉由如此進行,能夠以高位置精度對片材70施予雷射加工。The camera 104 is an example of a photographing means for photographing the sheet 70. For example, a CCD (Charged Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor can be used as the photographing means. Then, based on the position of the calibration mark captured by the camera 104, the head unit 102 is driven by controlling the drive mechanism 106 with the control unit 108. By doing so, laser processing can be performed on the sheet 70 with high positional accuracy.

工件台設置於以片材70為基準的-Z方向(換言之,為片材70的下方側)。頭部102配置於工作台105的+Z方向。即,工作台105與頭部102介於片材70而相對向配置。工件台105,例如為吸附片材70的吸附工件台。例如,工件台105具有於上表面形成有空氣孔的吸附板。藉由自空氣孔排出空氣,使片材70吸附於工件台105。針對為了吸附之結構,由於可使用公眾知悉的手法,因此省略說明。在片材70吸附於工件台105的狀態下,對片材70施予雷射加工。藉此,可以在片材70相對於工件台而確實地被定位的狀態,照射雷射光。The work stage is provided in the -Z direction with respect to the sheet 70 (in other words, the lower side of the sheet 70). The head 102 is arranged in the + Z direction of the table 105. That is, the table 105 and the head portion 102 are arranged to face each other with the sheet 70 interposed therebetween. The work stage 105 is, for example, a suction work stage for the suction sheet 70. For example, the work stage 105 has a suction plate in which an air hole is formed on the upper surface. By discharging air from the air holes, the sheet 70 is attracted to the work table 105. As for the structure for adsorption, a publicly known method can be used, so description is omitted. In a state where the sheet 70 is adsorbed on the work table 105, laser processing is performed on the sheet 70. Thereby, laser light can be irradiated in the state in which the sheet | seat 70 is reliably positioned with respect to a work table.

工件台105經由工件台驅動機構107而安裝於機架101。工件台驅動機構107使工件台105上下升降。在工件台驅動機構107使工件台105上升的狀態,於片材70施予雷射加工。再者,在工件台驅動機構107使工件台105下降的狀態,片材70被輸送於X方向。The work stage 105 is mounted on the machine frame 101 via a work stage drive mechanism 107. The work table driving mechanism 107 raises and lowers the work table 105. In a state where the work table driving mechanism 107 raises the work table 105, laser processing is performed on the sheet 70. Further, in a state where the work table driving mechanism 107 lowers the work table 105, the sheet 70 is conveyed in the X direction.

控制部108為個人電腦等的運算處理裝置,具有處理器、記憶體、監視器及輸入裝置等。然後,控制部108控制頭部102、雷射光源103、相機104、工件台105、驅動機構106及工件台驅動機構107。例如,控制部108控制雷射光的照射位置及雷射照射強度。再者,控制部108控制後述的具有送出機組111的送出軸盤113的旋轉速度。控制部108不限於單一個裝置,由複數個裝置所構成亦可。The control unit 108 is an arithmetic processing device such as a personal computer, and includes a processor, a memory, a monitor, an input device, and the like. Then, the control unit 108 controls the head 102, the laser light source 103, the camera 104, the work table 105, the driving mechanism 106, and the work table driving mechanism 107. For example, the control unit 108 controls the laser light irradiation position and laser irradiation intensity. In addition, the control unit 108 controls the rotation speed of a sending-out shaft disk 113 having a sending-out unit 111 described later. The control unit 108 is not limited to a single device, and may be composed of a plurality of devices.

在工件台105吸附片材70的狀態下,施予規定的雷射加工。然後,當雷射加工結束,則解除藉由工件台的吸附,片材70被搬送於X方向。片材70的新範圍被送出至工件台105後,工件台105吸附片材70的新範圍。藉由反覆進行這些處理,可針對片材70整體施予雷射加工。A predetermined laser processing is performed in a state where the sheet 70 is adsorbed by the work table 105. Then, when the laser processing is completed, the suction by the work table is released, and the sheet 70 is transported in the X direction. After the new range of the sheet 70 is sent to the work table 105, the work table 105 adsorbs the new range of the sheet 70. By performing these processes repeatedly, laser processing can be applied to the entire sheet 70.

在此,使用第2圖及第3圖,針對因應工件台105的升降的動作說明。第2圖顯示工件台105為下降狀態的側視圖,第3圖顯示工件台105為上升狀態的側視圖。第2圖顯示的工作台105的位置為下降位置,第3圖顯示的工作台105的位置為上升位置。Here, using FIG. 2 and FIG. 3, the operation | movement according to the raising / lowering of the workpiece | work table 105 is demonstrated. FIG. 2 shows a side view of the workpiece table 105 in a lowered state, and FIG. 3 shows a side view of the workpiece table 105 in a raised state. The position of the table 105 shown in FIG. 2 is the lowered position, and the position of the table 105 shown in FIG. 3 is the raised position.

如第2圖、第3圖所顯示,送出機組111配置於工件台105的-X方向,捲收機組112配置於+X方向。工件台105配置於X方向中送出機組與捲收機組112之間。送出機組安裝有可旋轉的送出軸盤113。同樣地,捲收機組112,安裝有可旋轉的捲收軸盤114,送出軸盤113及捲收軸盤114藉由未圖示的馬達而旋轉。捲設於送出軸盤113的片材為送出卷70a,捲設於捲收軸盤114的片材為捲收卷70b。As shown in FIG. 2 and FIG. 3, the sending-out unit 111 is arranged in the −X direction of the work table 105, and the retracting unit 112 is arranged in the + X direction. The work stage 105 is arranged between the sending-out unit and the retracting unit 112 in the X direction. The sending unit is provided with a rotatable sending shaft 113. Similarly, the winding unit 112 is provided with a rotatable winding shaft 114, and the delivery shaft 113 and the winding shaft 114 are rotated by a motor (not shown). The sheet wound on the take-up reel 113 is a take-off roll 70a, and the sheet wound on the take-up reel 114 is a take-up roll 70b.

送出軸盤113及捲收軸盤114,成為將捲成卷狀的片材以片狀送出至工作台105上的成對的輸送軸盤。即,藉由使送出軸盤113及捲收軸盤114同步旋轉,使片材70被輸送往+X方向。藉此,捲成送出卷70a的片材通過工件台105的上方,往捲收卷70b移動。如此,捲成送出卷70a的片材張緊於工件台105之上,並同時被輸送往+X方向,而捲收於捲收軸盤114。以下,將片狀的片材只略記為片材70。The sending-out reel 113 and the winding-up reel 114 serve as a pair of conveying reels that feed the rolled-up sheet in a sheet shape onto the table 105. In other words, by synchronously rotating the sending-out reel 113 and the winding reel 114, the sheet 70 is conveyed in the + X direction. As a result, the sheet rolled into the unwinding roll 70a passes above the work table 105 and moves toward the winding-up roll 70b. In this way, the sheet rolled into the delivery roll 70a is tensioned on the work table 105, and is simultaneously conveyed in the + X direction, and is wound on the take-up reel 114. Hereinafter, the sheet-like sheet is simply referred to as a sheet 70.

在第2圖中,工件台105為下降位置,工件台105與片材70無接觸。在此狀態,送出軸盤113、捲收軸盤114將片材70往+X方向輸送。In FIG. 2, the work table 105 is in the lowered position, and the work table 105 is not in contact with the sheet 70. In this state, the delivery reel 113 and the take-up reel 114 convey the sheet 70 in the + X direction.

自第2圖所顯示的狀態,當工件台驅動機構107使工件台105上升,則工件台105移動至第3圖顯示之上升位置。在上升位置中,工件台105的上表面與片材70的下表面抵接。因此,工件台105可吸附保持片材70。即,在工件台105的上表面與片材70的下表面接觸的狀態,自空氣孔排出空氣,則工件台105吸附保持片材70。From the state shown in FIG. 2, when the work table driving mechanism 107 raises the work table 105, the work table 105 moves to the raised position shown in FIG. 3. In the raised position, the upper surface of the work table 105 is in contact with the lower surface of the sheet 70. Therefore, the work table 105 can suck and hold the sheet 70. That is, in a state where the upper surface of the work table 105 is in contact with the lower surface of the sheet 70 and air is exhausted from the air hole, the work table 105 adsorbs and holds the sheet 70.

然後,在片材70被工件台105吸附保持的狀態,雷射光源103朝向片材70照射雷射光。藉此,對片材70施予雷射加工。由於片材70被吸附,因此可防止雷射加工中的相對於工件台105的片材70的位置偏移,藉此,能以高位置精度將片材70予以雷射加工。Then, in a state where the sheet 70 is sucked and held by the work table 105, the laser light source 103 radiates laser light toward the sheet 70. Thereby, the sheet 70 is subjected to laser processing. Since the sheet 70 is attracted, the positional deviation of the sheet 70 with respect to the work table 105 during laser processing can be prevented, and thereby the sheet 70 can be laser-processed with high positional accuracy.

在第3圖所顯示的上升位置中,當規定的流程結束,則解除藉由工件台105吸附片材70。然後,藉由工件台驅動機構107使工件台105下降,工件台105回到第2圖所顯示的下降位置。在下降位置中,藉由送出軸盤113、捲收軸盤114的旋轉,片材70被輸送往X方向。藉由輸送規定量的片材70,使片材70的新的範圍輸送至工件台105上方。當片材的新的範圍移動至工件台105上方,工件台驅動機構107使工件台105位於上升位置。工件台驅動機構107將工件台105予以上升位置後,工件台105吸附保持片材70。在片材70被吸附保持的狀態,雷射光源103對片材70施予雷射加工。藉由反覆這些處理(工件台105的上升、吸附片材70,對片材70的雷射加工、工件台的下降及片材的移動),可對片材70整體施予雷射加工。In the raised position shown in FIG. 3, when the predetermined flow is completed, the suction of the sheet 70 by the work table 105 is released. Then, the workpiece table 105 is lowered by the workpiece table driving mechanism 107, and the workpiece table 105 is returned to the lowered position shown in FIG. 2. In the lowered position, the sheet 70 is conveyed in the X direction by the rotation of the feed-out reel 113 and the take-up reel 114. By conveying a predetermined amount of the sheet 70, a new range of the sheet 70 is conveyed above the work table 105. When the new range of the sheet is moved above the work table 105, the work table drive mechanism 107 places the work table 105 in the raised position. After the work table driving mechanism 107 raises the work table 105, the work table 105 sucks and holds the sheet 70. In a state where the sheet 70 is sucked and held, the laser light source 103 performs laser processing on the sheet 70. By repeating these processes (the ascent of the work table 105, the suction of the sheet 70, the laser processing of the sheet 70, the lowering of the work table, and the movement of the sheet), the entire sheet 70 can be subjected to laser processing.

在此,於片材70的雙面分別形成有充電層等。因此,於片材70的雙面施予前述的雷射加工。即,藉由雷射加工,於片材70的表面及背面形成元件圖案。更進一步,沿著切割線將片材70予以切斷。藉此,可製造在X方向中,鄰接的二個元件圖案被分割,於雙面形成元件圖案的片狀二次電池。Here, a charging layer and the like are formed on both sides of the sheet 70. Therefore, the aforementioned laser processing is applied to both sides of the sheet 70. That is, an element pattern is formed on the front surface and the back surface of the sheet 70 by laser processing. Furthermore, the sheet 70 is cut along a cutting line. Thereby, a sheet-shaped secondary battery in which two adjacent element patterns are divided in the X direction and element patterns are formed on both sides can be manufactured.

在此,使用第4圖,對於基材71的雙面經形成充電層的片材70的結構而說明。第4圖顯示片材70的俯視圖、仰視圖、A-A剖面圖、B-B剖面圖。A-A剖面圖為沿著XZ平面而切斷的剖面圖,B-B剖面圖為沿著YZ平面而切斷的剖面圖。第4圖顯示施予雷射加工前的片材70的結構。Here, the structure of the sheet | seat 70 which formed the charging layer on both sides of the base material 71 using FIG. 4 is demonstrated. FIG. 4 shows a plan view, a bottom view, an AA cross-sectional view, and a BB cross-sectional view of the sheet 70. AA cross-sectional view is a cross-sectional view cut along the XZ plane, and BB cross-sectional view is a cross-sectional view cut along the YZ plane. FIG. 4 shows the structure of the sheet 70 before the laser processing is applied.

參考A-A及B-B剖面圖,說明片材70的剖面構造。片材70包含基材71、第一充電層72、第一上部電級73、第二充電層74、第二上部電極75。基材71藉由導電性的片材所形成,例如,厚度10μm的SUS或鋁等金屬箔。藉由將基材71藉由導電性材料形成,可作為片狀二次電池的下部電極。再者,基材71藉由可視光不透過的不透明材料所形成。例如,基材71的在Y方向中的寬幅為350mm。A cross-sectional structure of the sheet 70 will be described with reference to AA and B-B cross-sectional views. The sheet 70 includes a substrate 71, a first charging layer 72, a first upper electric stage 73, a second charging layer 74, and a second upper electrode 75. The substrate 71 is formed of a conductive sheet, for example, a metal foil such as SUS or aluminum having a thickness of 10 μm. By forming the base material 71 with a conductive material, it can be used as a lower electrode of a sheet-shaped secondary battery. The substrate 71 is formed of an opaque material that is impermeable to visible light. For example, the width of the base material 71 in the Y direction is 350 mm.

於基材71的上表面形成第一充電層72,於下表面形成第二充電層74。第一充電層72及第二充電層74幾乎全表面地形成於基材71。A first charging layer 72 is formed on the upper surface of the substrate 71 and a second charging layer 74 is formed on the lower surface. The first charging layer 72 and the second charging layer 74 are formed on the substrate 71 on almost the entire surface.

於第一充電層72的上表面形成有第一上部電極73。在第二充電層74的下表面形成有第二上部電極75。第一上部電極73以覆蓋第一充電層72的方式形成。第二上部電極75以覆蓋第二充電層74的方式形成。A first upper electrode 73 is formed on the upper surface of the first charging layer 72. A second upper electrode 75 is formed on the lower surface of the second charging layer 74. The first upper electrode 73 is formed so as to cover the first charging layer 72. The second upper electrode 75 is formed so as to cover the second charging layer 74.

另外,將形成有片材70的第一上部電極73之側的面作為表面,將形成有第二上部電極75之側的面作為背面。第4圖中,片材70的表面為上表面,背面為下表面。The surface on the side of the first upper electrode 73 on which the sheet 70 is formed is used as the surface, and the surface on the side on which the second upper electrode 75 is formed is used as the back surface. In FIG. 4, the surface of the sheet 70 is the upper surface and the back surface is the lower surface.

在Z方向中,於第一上部電極73與是為下部電極的基材71之間配置第一充電層72。在Z方向中,於第二上部電極75與是為下部電極的基材71之間配置第二充電層74。藉此,成為在基材71的雙面中,充電層配置於上部電極與下部電極之間的結構。上部電極及下部電極的其中一個為片狀二次電池的正極,另一個為負極。In the Z direction, a first charging layer 72 is disposed between the first upper electrode 73 and the substrate 71 which is a lower electrode. In the Z direction, a second charging layer 74 is disposed between the second upper electrode 75 and the substrate 71 which is a lower electrode. Thereby, a structure in which the charging layer is arranged between the upper electrode and the lower electrode on both sides of the substrate 71 is obtained. One of the upper electrode and the lower electrode is a positive electrode of a sheet-shaped secondary battery, and the other is a negative electrode.

第一充電層72、第二充電層74可藉由例如塗佈熱分解法形成。具體上,塗佈混合脂肪酸鈦及矽油於溶媒而成的塗佈液,使之乾燥後燒成。藉此形成覆蓋於絕緣膜的二氧化鈦的微粒子層。第一上部電極73、第二上部電極75分別藉由濺射、離子鍍、電子束蒸鍍、真空蒸鍍、化學蒸鍍等的氣相沉積法而形成。另外,可藉由例如國際公開的WO2015/087388所記載的方法,於基材71上形成各個層。The first charging layer 72 and the second charging layer 74 can be formed by, for example, a coating thermal decomposition method. Specifically, a coating liquid prepared by mixing fatty acid titanium and silicone oil in a solvent is applied, dried, and fired. Thereby, a fine particle layer of titanium dioxide coated on the insulating film is formed. The first upper electrode 73 and the second upper electrode 75 are formed by a vapor deposition method such as sputtering, ion plating, electron beam evaporation, vacuum evaporation, or chemical vapor deposition. In addition, each layer can be formed on the substrate 71 by a method described in, for example, International Publication WO2015 / 087388.

本實施例,藉由後述之雷射加工,於片材70的雙面形成元件圖案。更進一步,在雷射加工中,針對片材70形成校準標記。藉由使用校準標記,可使片材70的雙面的元件圖案的位置一致。在此,本實施例中,於片材70形成貫穿孔作為校準標記。以下,對包含形成校準標記的雷射加工詳細說明。In this embodiment, element patterns are formed on both sides of the sheet 70 by laser processing described later. Furthermore, in laser processing, alignment marks are formed for the sheet 70. By using the alignment marks, the positions of the element patterns on both sides of the sheet 70 can be aligned. Here, in this embodiment, a through hole is formed in the sheet 70 as an alignment mark. Hereinafter, laser processing including formation of a calibration mark will be described in detail.

首先,針對對於片材70一側的表面的表面的處理,使用第5圖說明。第5圖為顯示對於片材70的表面的處理的流程圖。另外,第5圖中的各流程,主要藉由控制部108的控制所實施。在此,以片材70的表面成為上側的方式,送出軸盤113、捲收軸盤114設置於送出機組111、捲收機組112。First, the treatment of the surface of the surface on the sheet 70 side will be described using FIG. 5. FIG. 5 is a flowchart showing processing on the surface of the sheet 70. Each flow in FIG. 5 is mainly implemented by the control of the control unit 108. Here, the sending-out reel 113 and the winding-up reel 114 are provided in the sending-out unit 111 and the winding-up unit 112 so that the surface of the sheet 70 may become the upper side.

首先,藉由控制部108控制工件台驅動機構107,自第2圖所顯示的下降位置,工件台驅動機構107使工件台105上升(S11)。藉此,工件台105成為第3圖所顯示的上升位置。然後,工件台105吸附片材70(S12)。另外,在步驟S12中,以片材70的表面成為上側的方式,片材70藉由工件台105被吸附保持。First, the work table drive mechanism 107 is controlled by the control unit 108, and the work table drive mechanism 107 raises the work table 105 from the lowered position shown in FIG. 2 (S11). Thereby, the workpiece | work table 105 becomes a raising position shown in FIG. Then, the work table 105 sucks the sheet 70 (S12). In addition, in step S12, the sheet 70 is sucked and held by the work table 105 so that the surface of the sheet 70 becomes the upper side.

藉由控制部108控制頭部102及驅動機構106等,在片材70被吸附的狀態,雷射光源103於片材70形成元件圖案(S13)及校準標記(S14)。元件圖案及校準標記藉由雷射光源103的雷射照射而形成。在此,雷射照射藉由控制部108所控制。即,控制部108控制雷射光的照射位置及雷射照射強度及雷射照射時間。在此,對形成元件圖案及形成校準標記,使用第6圖說明。第6圖與第4圖同樣地顯示片材70的俯視圖、仰視圖、A-A剖面圖、及B-B剖面圖。The head unit 102, the drive mechanism 106, and the like are controlled by the control unit 108, and the laser light source 103 forms an element pattern (S13) and a calibration mark (S14) on the sheet 70 in a state where the sheet 70 is attracted. The element pattern and the alignment mark are formed by laser irradiation of the laser light source 103. Here, the laser irradiation is controlled by the control unit 108. That is, the control unit 108 controls the irradiation position of the laser light, the laser irradiation intensity, and the laser irradiation time. Here, the formation of the element pattern and the formation of the alignment mark will be described using FIG. 6. FIG. 6 is a plan view, a bottom view, a cross-sectional view taken along the line AA, and a cross-sectional view taken along the line BB, similarly to FIG. 4.

藉由對第一上部電極73照射雷射光,如第6圖的俯視圖所顯示,形成第一元件圖案80。第一元件圖案80形成為矩形狀,其端邊成為與X方向或Y方向平行。因此,於步驟S13中,沿著矩形狀的雷射照射線81,照射雷射光。即,藉由驅動機構106使頭部102沿著X方向及Y方向驅動,沿著雷射照射線81照射雷射光。By irradiating the first upper electrode 73 with laser light, the first element pattern 80 is formed as shown in the top view of FIG. 6. The first element pattern 80 is formed in a rectangular shape, and an end edge thereof is parallel to the X direction or the Y direction. Therefore, in step S13, laser light is irradiated along the rectangular laser irradiation line 81. That is, the head unit 102 is driven in the X direction and the Y direction by the driving mechanism 106, and the laser light is irradiated along the laser irradiation line 81.

具體上,沿著雷射照射線81,第一上部電極73被圖案化。即,如第6圖的B-B剖面圖所顯示,由於藉由雷射照射線81只除去第一上部電極73的緣故,因此露出第一充電層72。如此,沿著雷射照射線81雷射加工第一上部電極73,形成第一上部電極73的電極圖案73a。藉由於第一上部電極73形成電極圖案73a,於片材70形成第一元件圖案80。換言之,在俯視中,電極圖案73a對應於第一元件圖案80。例如,使用在Y方向中寬幅為350mm的片材70的情況,第一元件圖案80形成為280mm×280mm的正方形狀。Specifically, the first upper electrode 73 is patterned along the laser irradiation line 81. That is, as shown in the BB cross-sectional view of FIG. 6, since only the first upper electrode 73 is removed by the laser irradiation line 81, the first charging layer 72 is exposed. In this manner, the first upper electrode 73 is laser-processed along the laser irradiation line 81 to form an electrode pattern 73 a of the first upper electrode 73. By forming the electrode pattern 73 a by the first upper electrode 73, a first element pattern 80 is formed on the sheet 70. In other words, the electrode pattern 73 a corresponds to the first element pattern 80 in a plan view. For example, when a sheet 70 having a width of 350 mm in the Y direction is used, the first element pattern 80 is formed in a square shape of 280 mm × 280 mm.

更進一步,於第一元件圖案80的二側,形成有校準標記82。校準標記82以與雷射照射線81重疊的方式形成。如第6圖A-A剖面圖所顯示,藉由於片材70形成貫穿孔84,而形成校準標記82。即,藉由雷射照射,而形成貫穿基材71、第一充電層72、第一上部電極73、第二充電層74、第二上部電極75的貫穿孔84。Furthermore, alignment marks 82 are formed on both sides of the first element pattern 80. The calibration mark 82 is formed so as to overlap the laser irradiation line 81. As shown in the sectional view of FIG. 6A-A, the alignment mark 82 is formed by forming the through-hole 84 in the sheet 70. That is, through the laser irradiation, a through-hole 84 penetrating through the substrate 71, the first charging layer 72, the first upper electrode 73, the second charging layer 74, and the second upper electrode 75 is formed.

由於校準標記82藉由貫穿孔84而形成,因此為即使從背面也可目視確認校準標記82。在形成背面中的元件圖案時,基於校準標記82而進行校準。形成貫穿孔84的情況,雷射光的強度較高於形成第一元件圖案80的情況即可。或者,以加長雷射光的照射時間而形成貫穿孔84亦可。Since the calibration mark 82 is formed by the through hole 84, the calibration mark 82 can be visually confirmed even from the back surface. When the element pattern in the back surface is formed, calibration is performed based on the calibration mark 82. When the through-hole 84 is formed, the intensity of the laser light may be higher than when the first element pattern 80 is formed. Alternatively, the through hole 84 may be formed by increasing the irradiation time of the laser light.

第6圖中,針對一個的第一元件圖案80,二個的校準標記82形成於對應第一元件圖案的位置。具體上,在X方向中,校準標記82分別配置於第一元件圖案80的周緣上的二側。即,其中一個校準標記82,配置於第一元件圖案80的+X側端部,另一個校準標記82配置於第一元件圖案80的-X側端部。In FIG. 6, for one first element pattern 80, two calibration marks 82 are formed at positions corresponding to the first element pattern. Specifically, in the X direction, the calibration marks 82 are respectively disposed on two sides on the peripheral edge of the first element pattern 80. That is, one of the calibration marks 82 is arranged at the + X side end portion of the first element pattern 80, and the other calibration mark 82 is arranged at the −X side end portion of the first element pattern 80.

個別的校準標記82的卷輸送位置,儲存於例如控制部108所具有的記憶體等。再者,校準標記82形成於Y方向中第一元件圖案80的中央。The roll transfer positions of the individual calibration marks 82 are stored in, for example, a memory included in the control unit 108. Furthermore, the calibration mark 82 is formed in the center of the first element pattern 80 in the Y direction.

另外,校準標記82及第一元件圖案80的形成順序並無特別限定。例如,在形成第一元件圖案80的中途,形成校準標記82亦可。藉此,由於較在形成第一元件圖案80之後才形成校準標記82的情況能更迅速地形成校準標記82,因此能以高生產率製造片狀二次電池。The order in which the alignment marks 82 and the first element patterns 80 are formed is not particularly limited. For example, the alignment mark 82 may be formed in the middle of forming the first element pattern 80. Thereby, since the alignment mark 82 can be formed more quickly than when the alignment mark 82 is formed after the first element pattern 80 is formed, a sheet-shaped secondary battery can be manufactured with high productivity.

此外,亦可在形成校準標記82之後形成第一元件圖案80。或者,亦可在形成第一元件圖案80之後形成校準標記82。藉此,能使針對第一元件圖案80的校準標記82的位置正確。校準標記82形成於對應第一元件圖案的位置(例如,第一元件圖案的附近)。In addition, the first element pattern 80 may be formed after the alignment mark 82 is formed. Alternatively, the alignment mark 82 may be formed after the first element pattern 80 is formed. Thereby, the position of the calibration mark 82 with respect to the 1st element pattern 80 can be made correct. The calibration mark 82 is formed at a position corresponding to the first element pattern (for example, near the first element pattern).

相對於第一元件圖案80的校準標記82的位置,可因應雷射加工中的頭部102的移動距離等而算出。再者,在片材70中的校準標記82的位置,可藉由送出軸盤113及捲收軸盤114的旋轉量、及頭部102的位置而被算出。The position of the alignment mark 82 relative to the first element pattern 80 can be calculated in accordance with the moving distance of the head portion 102 during laser processing, and the like. The position of the calibration mark 82 in the sheet 70 can be calculated from the rotation amount of the delivery spool 113 and the take-up spool 114 and the position of the head 102.

回到第4圖的說明。當第一元件圖案80的形成(S13)及校準標記82的形成(S14)結束,則控制部108藉由控制工件台105而令工件台105解除對片材70的吸附。然後,控制部108藉由控制工件台驅動機構107而令工件台驅動機構107使工件台105下降(S16)。藉此,成為第2圖所顯示的下降位置。接著,控制部108藉由控制送出軸盤113及捲收軸盤114而令送出軸盤113及捲收軸盤114進行卷輸送(S17)。即,以能夠於片材70的新的範圍形成第一元件圖案80的方式,使送出軸盤113及捲收軸盤旋轉。藉此,片材70的新的範圍被送出至工件台之上。Returning to the description of FIG. 4. When the formation of the first element pattern 80 (S13) and the formation of the calibration mark 82 (S14) are completed, the control unit 108 controls the workpiece stage 105 to release the workpiece stage 105 from the adsorption of the sheet 70. Then, the control unit 108 controls the workpiece stage driving mechanism 107 to cause the workpiece stage driving mechanism 107 to lower the workpiece stage 105 (S16). Thereby, it becomes the lowering position shown in FIG. Next, the control unit 108 controls the sending-out reel 113 and the winding-up reel 114 to cause the sending-out reel 113 and the winding-up reel 114 to perform roll conveyance (S17). That is, the feed-out reel 113 and the take-up reel are rotated so that the first element pattern 80 can be formed in a new range of the sheet 70. Thereby, a new range of the sheet 70 is sent out above the work table.

然後,控制部108因應卷輸送位置而判定是否進行反覆(S18)。經判定為反覆處理的情況(S18:YES),步驟S11~S17的處理再次被執行。即,至送出卷70a的末端為止,對於無形成第一元件圖案80的情況輸送後的片材70的新的領域,施予步驟S11~S17的處理。藉此,沿著片材70的X方向,依次形成複數個第一元件圖案80。另一方面,判定不反覆處理的情況(S18:NO),結束對於片材70的表面的處理。即,至送出卷70a的末端為止都形成有第一元件圖案80的情況,結束對於片材70的表面的處理。Then, the control unit 108 determines whether or not to perform repetition in accordance with the roll conveyance position (S18). When it is determined that the process is repeated (S18: YES), the processes of steps S11 to S17 are executed again. That is, up to the end of the unwinding roll 70a, the processes of steps S11 to S17 are applied to a new area of the sheet 70 that has been transported without forming the first element pattern 80. Thereby, a plurality of first element patterns 80 are sequentially formed along the X direction of the sheet 70. On the other hand, it is determined that the process is not repeated (S18: NO), and the process on the surface of the sheet 70 is terminated. That is, when the first element pattern 80 is formed up to the end of the delivery roll 70a, the processing of the surface of the sheet 70 is finished.

對於片材70的表面的處理結束之後,進行對於背面的處理。因此,反轉片材的表面與背面。具體上,如第7圖所顯示,以片材70的背面成為上側的方式,將送出卷70a及捲收卷70b上下反轉,將送出軸盤113設置於送出機組111,捲收軸盤114設置於捲收機組112。After the process of the surface of the sheet 70 is completed, the process of the back surface is performed. Therefore, the front and back surfaces of the sheet are reversed. Specifically, as shown in FIG. 7, the delivery roll 70 a and the take-up roll 70 b are turned upside down so that the back surface of the sheet 70 becomes the upper side. It is installed in the winding unit 112.

第8圖為顯示對片材70的背面的處理的流程圖。首先,藉由控制部108控制工件台驅動機構107,而令工件台驅動機構107使工件台105上升(S21)。藉此,工件台105自第7圖所顯示的下降位置移動至第9圖所顯示的上升位置。藉此,工件台105的上表面與片材70的表面對接。藉由控制部108控制工件台105,使工件台105吸附片材70(S22)。於步驟S22中,以片材70的背面成為上側的方式,使片材70藉由工件台105而被吸附保持。FIG. 8 is a flowchart showing processing on the back surface of the sheet 70. First, the work table drive mechanism 107 is controlled by the control unit 108, and the work table drive mechanism 107 is caused to raise the work table 105 (S21). Thereby, the work table 105 is moved from the lowered position shown in FIG. 7 to the raised position shown in FIG. 9. Thereby, the upper surface of the work table 105 is in contact with the surface of the sheet 70. The control unit 108 controls the work stage 105 to cause the work stage 105 to adsorb the sheet 70 (S22). In step S22, the sheet 70 is sucked and held by the work table 105 so that the back surface of the sheet 70 becomes the upper side.

接著,基於相機104拍攝到的圖像,控制部108進行圖像處理(S23)。即,基於相機104拍攝到的校準標記82,控制部108進行圖像處理,偵測拍攝到的校準標記82的位置。另外,在以下說明中,雖然是以圖像處理為以控制部108的處理器而進行作為說明,但以相機104內部的處理器而進行亦可。第10圖顯示為以相機104拍攝到的圖像P。第10圖顯示包含校準標記82及其周圍的圖像P。Next, based on the image captured by the camera 104, the control unit 108 performs image processing (S23). That is, based on the calibration mark 82 captured by the camera 104, the control unit 108 performs image processing and detects the position of the captured calibration mark 82. In the following description, the image processing is described as the processor of the control unit 108, but it may be performed by the processor inside the camera 104. FIG. 10 shows an image P captured by the camera 104. FIG. 10 shows an image P containing a calibration mark 82 and its surroundings.

然後,基於控制部108偵測出的校準標記82的位置,求出校準標記82的偏移量(dX、dY)。第10圖中,將圖像P的中心O作為基準座標,將自X方向及Y方向中的基準座標的距離作為偏移量(dX、dY)。具體上,將經形成校準標記的頭部102的位置作為基準位置,於以頭部102作為基準位置的狀態下,相機104拍攝校準標記82。控制部108藉由對於圖像P進行圖像處理,而可求出偏移量。藉由圖案比對等圖像處理,控制部108可偵測出圖像P中的校準標記82的位置。另外,以圖像P中的畫素量作為偏移量亦可,或以片材70上的實際距離(mm)作為偏移量亦可。再者,校準標記82的大小能夠設為X方向1mmY、方向1mm的程度。Then, based on the position of the calibration mark 82 detected by the control unit 108, the offset amount (dX, dY) of the calibration mark 82 is obtained. In FIG. 10, the center O of the image P is used as the reference coordinate, and the distance from the reference coordinate in the X direction and the Y direction is used as the offset (dX, dY). Specifically, the position of the head 102 where the calibration mark is formed is used as the reference position, and the camera 104 captures the calibration mark 82 in a state where the head 102 is used as the reference position. The control unit 108 can obtain an offset amount by performing image processing on the image P. By image processing such as pattern comparison, the control unit 108 can detect the position of the calibration mark 82 in the image P. In addition, the amount of pixels in the image P may be used as the offset, or the actual distance (mm) on the sheet 70 may be used as the offset. The size of the calibration mark 82 can be approximately 1 mm in the X direction and 1 mm in the direction.

接著,藉由控制部108控制頭部102及驅動機構106等,雷射光源於片材的背面形成圖案(S24)。在此,雷射照射為藉由控制部108所控制。即,控制部108控制雷射光的照射位置及雷射照射強度。在此,僅以於步驟S23求出的偏移量補正XY移動量,而進行圖案形成。即,於基於校準標記82進行校準的狀態,進行藉由雷射照射對片材70的圖案形成。Next, the head part 102, the drive mechanism 106, etc. are controlled by the control part 108, and a laser light source forms a pattern on the back surface of a sheet | seat (S24). Here, the laser irradiation is controlled by the control unit 108. That is, the control unit 108 controls the laser light irradiation position and laser irradiation intensity. Here, only the shift amount obtained in step S23 is used to correct the XY movement amount to perform pattern formation. That is, in a state where the calibration is performed based on the calibration mark 82, the patterning of the sheet 70 by laser irradiation is performed.

具體上,驅動機構106將頭部102往經補正的位置僅移動偏移量。然後,將經補正的位置作為雷射開始位置,雷射光源103對片材70照射雷射光。藉由驅動機構106沿著矩形的四個邊驅動頭部102,而形成第二元件圖案85。藉由基於校準標記82進行校準,在XY平面中,在與第一元件圖案80的位置一致的位置形成第二元件圖案。Specifically, the driving mechanism 106 moves the head 102 by the offset amount only to the corrected position. Then, using the corrected position as the laser start position, the laser light source 103 irradiates the sheet 70 with laser light. The driving mechanism 106 drives the head 102 along the four sides of the rectangle to form a second element pattern 85. By performing calibration based on the calibration mark 82, a second element pattern is formed at a position that coincides with the position of the first element pattern 80 in the XY plane.

第11圖顯示經形成第二元件圖案85的片材70的結構。如第11圖所顯示,第二元件圖案85成為與第一元件圖案80同樣大小的矩形。藉由沿著矩形狀的雷射照射線86照射雷射光,第二上部電極75被圖案化。如第11圖的B-B剖面圖所顯示,於雷射照射線86中,由於僅除去第二上部電極,而露出第二充電層74。如此,沿著雷射照射線86加工第二上部電極75,而形成第二上部電極75的電極圖案75a。藉由於第二上部電極75形成電極圖案75a,於片材70形成第二元件圖案85。另外,於第11圖中,在二個第一元件圖案80之中,形成對應於左側的第一元件圖案80的第二元件圖案85。FIG. 11 shows the structure of the sheet 70 on which the second element pattern 85 is formed. As shown in FIG. 11, the second element pattern 85 is a rectangle having the same size as the first element pattern 80. The second upper electrode 75 is patterned by irradiating the laser light along the rectangular laser irradiation line 86. As shown in the BB sectional view of FIG. 11, in the laser irradiation line 86, only the second upper electrode is removed, and the second charging layer 74 is exposed. In this way, the second upper electrode 75 is processed along the laser irradiation line 86 to form an electrode pattern 75 a of the second upper electrode 75. By forming the electrode pattern 75 a by the second upper electrode 75, a second element pattern 85 is formed on the sheet 70. In addition, in FIG. 11, a second element pattern 85 corresponding to the left first element pattern 80 is formed among the two first element patterns 80.

雷射照射線86的位置基於校準標記82而被校準。即,第二元件圖案85的形成位置,基於校準標記82而被校準。藉由如此方式,可使正面的第一元件圖案與背面的校準標記82的XY位置正確地一致。於本實施例中,藉由貫穿孔84而形成校準標記82。因此,藉由自背面側拍攝校準標記82,在形成第二元件圖案85時,可偵測相對於第一元件圖案80的相對位置。由於對於片材70的雙面能以高位置精度施予雷射加工,因此可使雙面的元件圖案的位置予以一致。The position of the laser irradiation line 86 is calibrated based on the calibration mark 82. That is, the formation position of the second element pattern 85 is calibrated based on the calibration mark 82. In this way, the first element pattern on the front side and the XY position of the alignment mark 82 on the back side can be accurately matched. In this embodiment, the alignment mark 82 is formed by the through hole 84. Therefore, by photographing the calibration mark 82 from the back side, when the second element pattern 85 is formed, the relative position with respect to the first element pattern 80 can be detected. Since laser processing can be applied to both sides of the sheet 70 with high positional accuracy, the positions of the element patterns on both sides can be aligned.

進一步,將用於雷射加工第一元件圖案80、第二元件圖案85的雷射光源103使用於校準標記82的形成。因此,能以高位置精度簡便地形成校準標記82。Further, a laser light source 103 for laser processing the first element pattern 80 and the second element pattern 85 is used for forming the calibration mark 82. Therefore, the alignment mark 82 can be easily formed with high position accuracy.

進一步,於本實施例中,對於一個第二元件圖案85形成二個校準標記82。在此,亦可基於二個校準標記82的偏移量的平均值而設定元件圖案中心的補正值。Further, in this embodiment, two alignment marks 82 are formed for one second element pattern 85. Here, the correction value of the center of the element pattern may be set based on the average value of the offset amounts of the two calibration marks 82.

例如,如第11圖所顯示,相對於一個第一元件圖案80而形成左右對稱的校準標記82。藉由相機104進行兩次拍攝,而拍攝二個校準標記82。即,相機104取得拍攝第一元件圖案80+X側的校準標記82所得的第一圖像、及拍攝第一元件圖案80的-X側的校準標記所得的第二圖像。然後,基於第一圖像及第二圖像,能分別求出二個校準標記82的偏移量。頭部102移動至因應偏移量的平均值的補正位置。以此方式,能以更高的位置精度形成第二元件圖案85。相機104無法拍攝二個校準標記82的情況,則控制部018無法算出偏移量。此情況,控制部108將送出警告。例如,控制部108在螢幕上顯示警告、自擴音器送出警告音。For example, as shown in FIG. 11, left-right symmetrical alignment marks 82 are formed with respect to one first element pattern 80. Two shots are taken by the camera 104 and two calibration marks 82 are taken. That is, the camera 104 obtains a first image obtained by photographing the first element pattern 80 + X-side alignment mark 82 and a second image obtained by photographing the -X-side alignment mark of the first element pattern 80. Then, based on the first image and the second image, the offset amounts of the two calibration marks 82 can be obtained. The head 102 moves to a correction position corresponding to the average value of the amount of shift. In this way, the second element pattern 85 can be formed with higher position accuracy. When the camera 104 cannot capture two calibration marks 82, the control unit 018 cannot calculate the offset. In this case, the control unit 108 issues a warning. For example, the control unit 108 displays a warning on the screen and sends a warning sound from the loudspeaker.

第二元件圖案85形成後,工件台解除吸附片材70(S25)。工件台驅動機構107使工件台105下降至下降位置為止(S26)。然後,藉由使旋轉送出軸盤113、捲收軸盤114旋轉,進行卷輸送(S27)。藉此,可將片材70的新的範圍送出至工件台105之上。After the second element pattern 85 is formed, the work table releases the suction sheet 70 (S25). The work table driving mechanism 107 lowers the work table 105 to the lowered position (S26). Then, the rotary feed-out reel 113 and the take-up reel 114 are rotated to perform the roll conveyance (S27). Thereby, a new range of the sheet 70 can be sent out onto the work table 105.

然後,因應於卷輸送位置而判定是否進行反覆(S28)。經判定為反覆處理的情況(S28:YES),則步驟S21~S27的處理再次被執行。即,至送出卷70a的末端為止,無形成第二元件圖案85的情況,輸送片材70且對於輸送後的片材70的新的領域,施予步驟S21~S27的處理。藉此,如第12圖所顯示,於片材70的新範圍形成第二元件圖案85。藉此,沿著片材70的X方向,依次形成複數個第二元件圖案85。Then, it is determined whether or not to perform repetition according to the roll conveyance position (S28). When it is determined that the process is repeated (S28: YES), the processes of steps S21 to S27 are executed again. That is, the second element pattern 85 is not formed until the end of the unwinding roll 70a, and the sheet 70 is conveyed and the processes of steps S21 to S27 are applied to the new area of the sheet 70 after the conveyance. Thereby, as shown in FIG. 12, a second element pattern 85 is formed in a new range of the sheet 70. Thereby, a plurality of second element patterns 85 are sequentially formed along the X direction of the sheet 70.

另一方面,判定為不反覆處理的情況(S28:NO),則結束針對片材70a的背面的處理。即,至送出軸盤70a末端為止,已形成第二元件圖案85的情況,結束對於片材70的表面的處理。以此方式,能以高位置精度將第二元件圖案85圖案化。更進一步,能使正面與背面的元件圖案形成自動化。藉此,能以高生產率製造片狀二次電池。On the other hand, if it is determined that the process is not repeated (S28: NO), the process for the back surface of the sheet 70a is ended. That is, when the second element pattern 85 has been formed up to the end of the delivery of the spool 70a, the processing of the surface of the sheet 70 is terminated. In this manner, the second element pattern 85 can be patterned with high positional accuracy. Furthermore, it is possible to automate the formation of element patterns on the front and back sides. Thereby, a sheet-shaped secondary battery can be manufactured with high productivity.

以此方式,於片材70的雙面形成第一元件圖案80、第二元件圖案85。然後,切斷於雙面分別形成元件圖案80、85的片材70。例如,如第13圖所顯示,於鄰接的二個第二元件圖案85之間的位置形成切割線88。切割線88成為與Y方向平行。藉由去除Z方向中基材71的一部分,而形成切割線。In this way, the first element pattern 80 and the second element pattern 85 are formed on both sides of the sheet 70. Then, the sheet 70 on which element patterns 80 and 85 are respectively formed on both sides is cut. For example, as shown in FIG. 13, a cutting line 88 is formed at a position between two adjacent second element patterns 85. The cutting line 88 is parallel to the Y direction. A cutting line is formed by removing a part of the base material 71 in the Z direction.

如同前述,藉由來自雷射光源103的雷射照射,形成切割線88。在X方向中,複數個切割線88以350mm的間隔形成。另外,切割線88的形成步驟的順序並沒有特別限定。例如,藉由在步驟S24之前或之後對片材70照射雷射光,可形成切割線88。As described above, the cutting line 88 is formed by laser irradiation from the laser light source 103. In the X direction, a plurality of cutting lines 88 are formed at intervals of 350 mm. The order of forming the cutting lines 88 is not particularly limited. For example, the cutting line 88 may be formed by irradiating the sheet 70 with laser light before or after step S24.

然後,於切割線88分割片材70,如第14圖所顯示,製造片狀二次電池90。片材70被切割為複數個,而製造單片的片狀二次電池90。在XY平面中,片狀二次電池90成為350mm×350mm的正方形。Then, the sheet 70 is divided at the cutting line 88, and as shown in FIG. 14, a sheet-shaped secondary battery 90 is manufactured. The sheet 70 is cut into a plurality of pieces, and a single-piece sheet-shaped secondary battery 90 is manufactured. In the XY plane, the sheet-shaped secondary battery 90 has a square shape of 350 mm × 350 mm.

如此,由於成為可應用於卷對卷製造流程,可進行連續製造流程。藉此,能提升生產率。再者,由於藉由來自雷射光源103的雷射照射,能將第一元件圖案80、校準標記82、第二元件圖案85及切割線88全部形成,因此能以高生產率處理。In this way, since it can be applied to a roll-to-roll manufacturing process, a continuous manufacturing process can be performed. Thereby, productivity can be improved. In addition, since the first element pattern 80, the alignment mark 82, the second element pattern 85, and the cutting line 88 can all be formed by laser irradiation from the laser light source 103, it can be processed with high productivity.

接著,對於校準及第二元件圖案85的形成,使用第15圖而說明。第15圖為簡化校準及第二元件圖案85形成的步驟所顯示的流程圖。Next, the alignment and the formation of the second element pattern 85 will be described using FIG. 15. FIG. 15 is a flowchart showing the steps for simplifying the calibration and forming the second element pattern 85.

首先,於片狀70的正面形成校準標記82(S101)。即,自片材70的正面側照射雷射光,於對應於第一元件圖案80的位置形成貫穿孔84。貫穿孔84作為校準標記82。藉此,於片材70形成校準標記82。First, an alignment mark 82 is formed on the front surface of the sheet 70 (S101). That is, laser light is irradiated from the front side of the sheet 70 to form a through hole 84 at a position corresponding to the first element pattern 80. The through hole 84 serves as the calibration mark 82. Thereby, an alignment mark 82 is formed on the sheet 70.

接著,使用相機104於背面拍攝校準標記82(S102)。基於以相機104拍攝到的圖像P,測定自基準座標的校準標記82的偏移量(S103)。在此,藉由圖像處理測定偏移量亦可,操作人員等以目視測定偏移量亦可。Next, the calibration mark 82 is photographed on the back using the camera 104 (S102). Based on the image P captured by the camera 104, the amount of shift from the calibration mark 82 of the reference coordinates is measured (S103). Here, the shift amount may be measured by image processing, and the operator or the like may measure the shift amount visually.

然後,補正頭部102的移動量(S104)。即,將頭部102經補正僅偏移量的位置作為雷射照射開始位置,而進行雷射加工。判定是否因應於卷輸送位置進行反覆(S105)。經判定為至送出卷70a的末端為止無進行雷射加工的情況(S105:YES),則回到步驟S102而反覆處理。經判定為至送出卷70a的末端為止有進行雷射加工的情況(S105:NO),結束處理。藉由如此方式,可在卷狀的基材71的雙面,於正確的位置形成元件圖案。即,可使第一元件圖案80與第二元件圖案85的位置一致。Then, the amount of movement of the head 102 is corrected (S104). That is, the laser processing is performed by using the position where the head portion 102 is offset only by the correction amount as the laser irradiation start position. It is determined whether or not it should be repeated at the roll conveying position (S105). If it is determined that laser processing has not been performed until the end of the delivery roll 70a (S105: YES), the process returns to step S102 and repeats the process. It is determined that laser processing may be performed up to the end of the delivery roll 70a (S105: NO), and the process ends. In this way, an element pattern can be formed on both sides of the roll-shaped base material 71 at a correct position. That is, the positions of the first element pattern 80 and the second element pattern 85 can be made to coincide.

另外,於前述說明中,雖然片狀二次電池90具有於基材71的表面形成第一充電層72、第一上部電極73,背面形成有第二充電層74、第二上部電極75的結構,但片狀二次電池90的結構並不限於此。將不同剖面結構的片狀二次電池90a顯示於第16圖。如第16圖所顯示,於基材71的表面,依序堆積有第一n型半導體層76、第一充電層72、第一p型半導體層77、第一上部電極73。基材71的背面以此順序堆積有第二n型半導體層78、第二充電層74、第二p型半導體層79及第二上部電極75。例如,基材為負極,第二上部電極75及第一上部電極73成為正極。In the foregoing description, although the sheet-shaped secondary battery 90 has a structure in which the first charging layer 72 and the first upper electrode 73 are formed on the surface of the substrate 71, the second charging layer 74 and the second upper electrode 75 are formed on the back surface However, the structure of the sheet-shaped secondary battery 90 is not limited to this. A sheet-shaped secondary battery 90 a having a different cross-sectional structure is shown in FIG. 16. As shown in FIG. 16, a first n-type semiconductor layer 76, a first charging layer 72, a first p-type semiconductor layer 77, and a first upper electrode 73 are sequentially deposited on the surface of the substrate 71. A second n-type semiconductor layer 78, a second charging layer 74, a second p-type semiconductor layer 79, and a second upper electrode 75 are stacked on the back surface of the substrate 71 in this order. For example, the base material is a negative electrode, and the second upper electrode 75 and the first upper electrode 73 become a positive electrode.

第一n型半導體層76及第二n型半導體層78,例如,為n型金屬氧化物半導體層,可使用二氧化鈦(TiO2 )、二氧化錫(SnO2 )或氧化鋅(ZnO)作為材料。第一n型半導體層76配置於基材71與第一充電層72之間,第二n型半導體層78配置於基材71與第二充電層74之間。The first n-type semiconductor layer 76 and the second n-type semiconductor layer 78 are, for example, n-type metal oxide semiconductor layers, and titanium dioxide (TiO 2 ), tin dioxide (SnO 2 ), or zinc oxide (ZnO) can be used as materials. . The first n-type semiconductor layer 76 is disposed between the substrate 71 and the first charging layer 72, and the second n-type semiconductor layer 78 is disposed between the substrate 71 and the second charging layer 74.

作為第一p型半導體層77及第二p型半導體層79的材料,可使用氧化鎳(NiO)、氧化銅鋁(CuAlO2 )等的p型金屬氧化物半導體。第一p型半導體層77形成於第一充電層72與第一上部電極73之間,第二p型半導體層79形成於第二充電層74與第二上部電極75之間。另外,未予設置第一p型半導體層77及第二p型半導體層79亦可。As a material of the first p-type semiconductor layer 77 and the second p-type semiconductor layer 79, p-type metal oxide semiconductors such as nickel oxide (NiO) and copper aluminum oxide (CuAlO 2 ) can be used. A first p-type semiconductor layer 77 is formed between the first charging layer 72 and the first upper electrode 73, and a second p-type semiconductor layer 79 is formed between the second charging layer 74 and the second upper electrode 75. The first p-type semiconductor layer 77 and the second p-type semiconductor layer 79 may not be provided.

在如此結構中,也可藉由於基材71的表面形成第一上部電極73的電極圖案73,而形成第一元件圖案80。同樣地,藉由於基材71的背面形成第二上部電極75的電極圖案75a,能形成第二元件圖案85。更進一步,可藉由貫穿片材70的校準標記82而校準。因此,能在卷狀的基材71的雙面中,於正確的位置形成元件圖案。In such a structure, the first element pattern 80 can also be formed by forming the electrode pattern 73 of the first upper electrode 73 on the surface of the substrate 71. Similarly, the second element pattern 85 can be formed by forming the electrode pattern 75 a of the second upper electrode 75 on the back surface of the substrate 71. Furthermore, it can be calibrated by the calibration mark 82 penetrating through the sheet 70. Therefore, the element pattern can be formed at the correct position on both sides of the roll-shaped base material 71.

如第16圖所顯示的片狀二次電池90a的製造流程包含:將基材71作為第一電極(負極),於基材的71的雙面依序將由n型金屬氧化物半導體所構成的n型金屬氧化物層、及由含有n型金屬氧化物層及絕緣體的物質所構成的充電層予以堆積的處理。As shown in FIG. 16, the manufacturing process of the sheet-shaped secondary battery 90 a includes: using the substrate 71 as a first electrode (negative electrode), and both sides of the substrate 71 are sequentially composed of an n-type metal oxide semiconductor. The process of depositing an n-type metal oxide layer and a charging layer composed of a substance containing an n-type metal oxide layer and an insulator.

前述說明中,雖然藉由驅動機構106移動頭部102而進行校準,但亦可藉由移動片材70而進行校準。或者,亦可在頭部102內之中藉由調整光學系統而移動雷射光的照射位置,藉此進行校準。即,若可移動相對於片材70的雷射光的相對的照射位置,藉由任何方法進行校準亦可。In the foregoing description, the calibration is performed by moving the head 102 by the driving mechanism 106, but the calibration may also be performed by moving the sheet 70. Alternatively, it is also possible to perform the calibration by moving the irradiation position of the laser light in the head 102 by adjusting the optical system. That is, if the relative irradiation position of the laser light with respect to the sheet | seat 70 can be moved, calibration may be performed by any method.

本實施例相關之片狀二次電池的製造方法,亦可說為具有以下(A)~(F)步驟。 (A)在片狀二次電池的一側之表面形成一第一元件圖案,該片狀二次電池係捲設於具有一捲收軸盤及一送出軸盤的成對的輸送軸盤。 (B)使對應於該第一元件圖案,而於該片狀二次電池形成貫穿孔。 (C)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(A)步驟與該(B)步驟,於該片狀二次電池形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔。 (D)基於該貫穿孔而進行校準,於該片狀二次電池之另一側的表面上形成第二元件圖案。 (E)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(D)步驟,於該片狀二次電池形成複數個該第二元件圖案。 (F)將該第一元件圖案與該第二元件圖案予以對應,而切斷該片狀二次電池。It can also be said that the method for manufacturing a sheet-shaped secondary battery according to this embodiment includes the following steps (A) to (F). (A) A first element pattern is formed on a surface of one side of a sheet-shaped secondary battery, and the sheet-shaped secondary battery is rolled on a pair of conveying shaft disks having a winding shaft disk and a sending shaft disk. (B) Forming a through-hole in the sheet-shaped secondary battery corresponding to the first element pattern. (C) The sheet-shaped secondary battery is sent out through the pair of conveying shaft disks, and the steps (A) and (B) are repeatedly performed to form a plurality of the first element patterns on the sheet-shaped secondary battery. And a through hole corresponding to the first element pattern. (D) Calibration is performed based on the through hole, and a second element pattern is formed on the surface of the other side of the sheet-shaped secondary battery. (E) The sheet-shaped secondary battery is sent out through the pair of conveying shaft disks, and the step (D) is repeatedly performed to form a plurality of the second element patterns on the sheet-shaped secondary battery. (F) Correspond to the first element pattern and the second element pattern, and cut off the sheet-shaped secondary battery.

再者,雖然前述說明中,舉例片狀二次電池作為片狀元件的一範例而進行了說明,但為片狀二次電池以外的片狀元件亦可。此情況,於第一元件圖案及第二元件圖案,形成因應於元件用途的層。本實施例相關之片狀元件,包含一片材;一第一元件圖案,形成於該片材之一側的表面;一第二元件圖案,形成於該片材之另一側的表面,並對應於該第一元件圖案;一貫穿孔,貫穿該片材而配置於該片材之一側的表面中的該第一元件圖案附近,及配置於該片材之另一側的表面中的該第二元件圖案附近。In the foregoing description, although the sheet-shaped secondary battery has been described as an example of the sheet-shaped element, it may be a sheet-shaped element other than the sheet-shaped secondary battery. In this case, a layer corresponding to the use of the element is formed on the first element pattern and the second element pattern. The sheet element related to this embodiment includes a sheet; a first element pattern is formed on a surface of one side of the sheet; a second element pattern is formed on a surface of the other side of the sheet; and Corresponding to the first element pattern; a through hole penetrating the sheet and disposed near the first element pattern in a surface on one side of the sheet, and the element disposed in a surface on the other side of the sheet Near the second element pattern.

以上,雖說明本發明實施例的一範例,本發明包含包含不損及其目的及優點的適當的變形,更進一步,本發明並不受制於由於前述的實施例的限制。As mentioned above, although an example of the embodiment of the present invention has been described, the present invention includes appropriate modifications that do not damage its purpose and advantages. Furthermore, the present invention is not limited by the foregoing embodiments.

本申請,主張以在2016年6月17日所提出申請之日本特願2016-120694為基礎的優先權,其揭示的全部內容於此納入。This application claims priority based on Japanese Patent Application No. 2016-120694 filed on June 17, 2016, and the entire disclosure thereof is incorporated herein.

100‧‧‧製造裝置
101‧‧‧機架
102‧‧‧頭部
103‧‧‧雷射光源
104‧‧‧相機
105‧‧‧工件台
106‧‧‧驅動機構
107‧‧‧工件台驅動機構
108‧‧‧控制部
111‧‧‧送出機組
112‧‧‧捲收機組
113‧‧‧送出軸盤
114‧‧‧捲收軸盤
70‧‧‧片材
70a‧‧‧送出卷
70b‧‧‧捲收卷
71‧‧‧基材
72‧‧‧第一充電層
73‧‧‧第一上部電極
73a‧‧‧電極圖案
74‧‧‧第二充電層
75‧‧‧第二上部電極
76‧‧‧第一n型半導體層
77‧‧‧第一p型半導體層
78‧‧‧第二n型半導體層
79‧‧‧第二p型半導體層
80‧‧‧第一元件圖案
81‧‧‧雷射照射線
82‧‧‧校準標記
84‧‧‧貫穿孔
85‧‧‧第二元件圖案
86‧‧‧雷射照射線
88‧‧‧切割線
90‧‧‧片狀二次電池
100‧‧‧ manufacturing equipment
101‧‧‧ Rack
102‧‧‧Head
103‧‧‧laser light source
104‧‧‧ Camera
105‧‧‧Workbench
106‧‧‧Drive mechanism
107‧‧‧Worktable drive mechanism
108‧‧‧Control Department
111‧‧‧ send out the unit
112‧‧‧Rewinding unit
113‧‧‧ Send out the spool
114‧‧‧ Reel Reel
70‧‧‧ sheet
70a‧‧‧Send the volume
70b‧‧‧Rewind
71‧‧‧ substrate
72‧‧‧First charging layer
73‧‧‧First upper electrode
73a‧‧‧electrode pattern
74‧‧‧Second charging layer
75‧‧‧second upper electrode
76‧‧‧first n-type semiconductor layer
77‧‧‧first p-type semiconductor layer
78‧‧‧Second n-type semiconductor layer
79‧‧‧Second p-type semiconductor layer
80‧‧‧The first element pattern
81‧‧‧laser radiation
82‧‧‧calibration mark
84‧‧‧through hole
85‧‧‧second element pattern
86‧‧‧Laser radiation
88‧‧‧cut line
90‧‧‧ sheet secondary battery

第1圖示意性顯示製造裝置100的結構的立體圖。 第2圖係示意性顯示工件台為下降位置的狀態的製造裝置的結構的側視圖。 第3圖係示意性顯示工件台為上升位置的狀態的製造裝置的結構的側視圖。 第4圖係顯示雷射加工前的片材的結構的圖。 第5圖係顯示對片材的表面的處理的流程圖。 第6圖係顯示經形成圖案及校準標記之片材的結構的圖。 第7圖係示意性顯示在背面處理中,工件台為下降位置的狀態的製造裝置的結構的側視圖。 第8圖係顯示對片材的背面的處理的流程圖。 第9圖係示意性顯示在背面處理中,工件台為上升位置的狀態的製造裝置的結構的側視圖。 第10圖係示意性顯示以相機拍攝的圖像P的圖。 第11圖係顯示經形成第二元件圖案的狀態的片材的結構的圖。 第12圖係顯示經形成下一個第二元件的狀態的片材的結構的圖。 第13圖係顯示切割線的形成位置的圖。 第14圖係顯示經沿著切割線切斷的片狀二次電池的結構的圖。 第15圖係簡化顯示根據本實施例之片狀二次電池的製造方法的流程圖。FIG. 1 is a perspective view schematically showing a configuration of the manufacturing apparatus 100. Fig. 2 is a side view schematically showing the configuration of the manufacturing apparatus in a state where the work table is in a lowered position. FIG. 3 is a side view schematically showing the configuration of the manufacturing apparatus in a state where the work table is in a raised position. FIG. 4 is a diagram showing the structure of a sheet before laser processing. Fig. 5 is a flowchart showing the processing of the surface of the sheet. FIG. 6 is a diagram showing the structure of a sheet having a pattern and an alignment mark formed thereon. FIG. 7 is a side view schematically showing the configuration of the manufacturing apparatus in a state where the work table is in the lowered position during the back surface processing. FIG. 8 is a flowchart showing a process for the back surface of the sheet. FIG. 9 is a side view schematically showing the configuration of the manufacturing apparatus in a state where the work table is in the raised position during the back surface processing. FIG. 10 is a diagram schematically showing an image P taken by a camera. FIG. 11 is a diagram showing a structure of a sheet in a state where a second element pattern is formed. Fig. 12 is a view showing the structure of a sheet in a state where the next second element is formed. FIG. 13 is a diagram showing the formation position of the cutting line. Fig. 14 is a view showing a structure of a sheet-shaped secondary battery cut along a cutting line. FIG. 15 is a flowchart showing a simplified method of manufacturing the sheet-shaped secondary battery according to the present embodiment.

70‧‧‧片材 70‧‧‧ sheet

71‧‧‧基材 71‧‧‧ substrate

72‧‧‧第一充電層 72‧‧‧First charging layer

73‧‧‧第一上部電極 73‧‧‧First upper electrode

73a‧‧‧電極圖案 73a‧‧‧electrode pattern

74‧‧‧第二充電層 74‧‧‧Second charging layer

75‧‧‧第二上部電極 75‧‧‧second upper electrode

80‧‧‧第一元件圖案 80‧‧‧The first element pattern

82‧‧‧校準標記 82‧‧‧calibration mark

85‧‧‧第二元件圖案 85‧‧‧second element pattern

86‧‧‧雷射照射線 86‧‧‧Laser radiation

Claims (14)

一種片狀二次電池的製造方法,包含下列步驟: (A)在片狀二次電池的一側之表面形成一第一元件圖案,該片狀二次電池係捲設於具有一捲收軸盤及一送出軸盤的成對的輸送軸盤; (B)使對應於該第一元件圖案,而於該片狀二次電池形成貫穿孔; (C)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(A)步驟與該(B)步驟,於該片狀二次電池形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔; (D)基於該貫穿孔而進行校準,於該片狀二次電池之另一側的表面上形成第二元件圖案; (E)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(D)步驟,於該片狀二次電池形成複數個該第二元件圖案;以及 (F)使該第一元件圖案與該第二元件圖案予以對應,而切斷該片狀二次電池。A method for manufacturing a sheet-shaped secondary battery includes the following steps: (A) A first element pattern is formed on a surface of one side of the sheet-shaped secondary battery, and the sheet-shaped secondary battery is rolled with a winding shaft. Plate and a pair of conveying shaft disks which send out the shaft disk; (B) forming a through hole in the sheet-shaped secondary battery corresponding to the first element pattern; (C) by the pair of conveying shaft disks Sending out the sheet-shaped secondary battery, and repeatedly performing the steps (A) and (B), forming a plurality of the first element patterns and through holes corresponding to the first element patterns in the sheet-shaped secondary battery; (D) Calibration is performed based on the through-hole, and a second element pattern is formed on the surface of the other side of the sheet-shaped secondary battery; (E) The sheet-shaped secondary battery is sent out by the pair of conveying shaft disks Step (D) is repeatedly performed to form a plurality of the second element patterns on the sheet-shaped secondary battery; and (F) the first element pattern is corresponding to the second element pattern, and the sheet is cut Shape secondary battery. 如請求項1所述之片狀二次電池的製造方法,其中 在該(A)步驟中,以照射來自雷射光源的雷射光,使該片狀二次電池之一側的表面形成的第一上部電極對應於該第一元件圖案而圖案化。 在該(B)步驟中,以照射來自該雷射光源之雷射光,於該片狀二次電池形成該貫穿孔。The method for manufacturing a sheet-shaped secondary battery according to claim 1, wherein in the step (A), the surface of one side of the sheet-shaped secondary battery is irradiated with laser light from a laser light source. An upper electrode is patterned corresponding to the first element pattern. In the step (B), the through-hole is formed in the sheet-shaped secondary battery by irradiating laser light from the laser light source. 如請求項2所述之片狀二次電池的製造方法,其中 在該(A)步驟中,於形成該第一元件圖案的途中,進行該(B)步驟而形成該貫穿孔。The method for manufacturing a sheet-shaped secondary battery according to claim 2, wherein in the step (A), the through-hole is formed by performing the step (B) on the way of forming the first element pattern. 如請求項2或3所述之片狀二次電池的製造方法,其中 在該(D)步驟中,以照射來自雷射光源的雷射光,使該片狀二次電池另一側的表面形成的第二上部電極對應於該第二元件圖案而圖案化。The method for manufacturing a sheet-shaped secondary battery according to claim 2 or 3, wherein in the step (D), the surface of the other side of the sheet-shaped secondary battery is irradiated with laser light from a laser light source. The second upper electrode is patterned corresponding to the second element pattern. 如請求項2或3所述之片狀二次電池的製造方法,其中 在該(F)步驟中,以照射來自雷射光源的雷射光,使俯視中於鄰接的二個該第一元件圖案之間的位置形成切割線, 沿著該切割線將該片狀二次電池予以切斷。The method for manufacturing a sheet-shaped secondary battery according to claim 2 or 3, wherein in the step (F), laser light from a laser light source is irradiated so that two adjacent first element patterns are viewed in plan view. A cutting line is formed between the positions, and the sheet-shaped secondary battery is cut along the cutting line. 如請求項2或3所述之片狀二次電池的製造方法,其中 在該片狀二次電池吸附於工件台的狀態下,該雷射光源對該片狀二次電池照射雷射光。The method of manufacturing a sheet-shaped secondary battery according to claim 2 or 3, wherein the laser light source irradiates the sheet-shaped secondary battery with laser light in a state where the sheet-shaped secondary battery is adsorbed on a workpiece table. 如請求項1至3中任一項所述之片狀二次電池的製造方法,其中 在該(D)步驟中,藉由拍攝手段,從另一側的表面側拍攝該片狀二次電池,基於藉由該拍攝手段所拍攝的圖像,進行該校準。The method for manufacturing a sheet-shaped secondary battery according to any one of claims 1 to 3, wherein in the step (D), the sheet-shaped secondary battery is photographed from the other surface side by a photographing means. The calibration is performed based on an image captured by the photographing means. 如請求項7所述之片狀二次電池的製造方法,其中 在該(B)步驟中,於該片狀二次電池的捲收方向,形成分別對應於該第一元件圖案的二個該貫通孔, 在該(D)步驟中,基於一側的該貫通孔所拍攝的第一圖像、及另一側的該貫通孔所拍攝的第二圖像,而進行該校準。The method for manufacturing a sheet-shaped secondary battery according to claim 7, wherein in the step (B), in the winding direction of the sheet-shaped secondary battery, two pieces of the first element pattern corresponding to the first element pattern are formed. In the through-hole, in this step (D), the calibration is performed based on the first image captured by the through-hole on one side and the second image captured by the through-hole on the other side. 如請求項1至3中任一項所述之片狀二次電池的製造方法,其中 該片狀二次電池係包含: 成為下部電極的基材, 於該基材的一側的表面側,形成有第一充電層及第一上部電極, 於該基材的另一側的表面側,形成有第二充電層及第二上部電極, 於該第一充電層與該基材之間,形成有第一n型金屬氧化物半導體層, 於該第二充電層與該基材之間,形成有第二n型金屬氧化物半導體層, 該第一充電層及該第二充電層分別具有含有n型金屬氧化物半導體及絕緣體的物質。The method for manufacturing a sheet-shaped secondary battery according to any one of claims 1 to 3, wherein the sheet-shaped secondary battery comprises: a substrate to be a lower electrode, on a surface side of one side of the substrate, A first charging layer and a first upper electrode are formed, and a second charging layer and a second upper electrode are formed on the surface side of the other side of the substrate, and formed between the first charging layer and the substrate. There is a first n-type metal oxide semiconductor layer, and a second n-type metal oxide semiconductor layer is formed between the second charging layer and the substrate. The first charging layer and the second charging layer each have Substances of n-type metal oxide semiconductors and insulators. 一種片狀二次電池的製造裝置,包含: 一成對的輸送軸盤,具有捲收軸盤及送出軸盤; 一雷射光源,以雷射光照射在張緊於該成對的輸送軸盤的片狀二次電池,而於該片狀二次電池之一側的表面形成第一元件圖案; 一拍攝手段,以來自該雷射光源的雷射光從該片狀二次電池之該一側的表面側照射,而拍攝經形成於該片狀二次電池的貫穿孔; 一驅動機構,基於以該拍攝手段所拍攝的圖像,校準在該片狀二次電池之另一側的表面中的該雷射光源的照射位置。A manufacturing device of a sheet-shaped secondary battery, comprising: a pair of conveying shaft disks, which have a winding shaft disk and a sending shaft disk; a laser light source, which irradiates laser beams onto the pair of conveying shaft disks; A sheet-shaped secondary battery, and a first element pattern is formed on a surface of one side of the sheet-shaped secondary battery; a photographing means for using laser light from the laser light source from the side of the sheet-shaped secondary battery The surface side of the sheet-shaped secondary battery is irradiated, and the through-holes formed in the sheet-shaped secondary battery are photographed; a driving mechanism is calibrated in the surface of the other side of the sheet-shaped secondary battery based on the image captured by the photographing means; The irradiation position of the laser light source. 如請求項10所述之片狀二次電池的製造裝置,其中該片狀二次電池的製造裝置係: (G)以該雷射光源從該片狀二次電池之一側的表面側照射該雷射光,而於該片狀二次電池之一側的表面形成該第一元件圖案; (H)以該雷射光源從該片狀二次電池之該一側的表面側照射該雷射光,而對應於該第一元件圖案,而於該片狀二次電池形成貫穿孔; (I)藉由該成對的輸送軸盤送出該片狀二次電池,反覆地進行該(G)步驟及該(H)步驟,於該片狀二次電池,形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔; (J)在該驅動機構進行校準的狀態下,以該雷射光源從該片狀二次電池的另一側的表面之側照射雷射光,於該片狀二次電池的該另一側的表面上形成第二元件圖案; (K)藉由該成對的輸送軸盤而送出該片狀二次電池,反覆地進行該(J)步驟,於該片狀二次電池形成複數個該第二元件圖案。The manufacturing apparatus of a sheet-shaped secondary battery according to claim 10, wherein the manufacturing apparatus of the sheet-shaped secondary battery is: (G) the laser light source is irradiated from the surface side of one side of the sheet-shaped secondary battery The laser light, and the first element pattern is formed on a surface of one side of the sheet-shaped secondary battery; (H) radiating the laser light from the surface side of the one side of the sheet-shaped secondary battery with the laser light source; A through hole is formed in the sheet-shaped secondary battery corresponding to the first element pattern; (I) The sheet-shaped secondary battery is sent out by the pair of conveying shaft disks, and the step (G) is repeatedly performed And the step (H), forming a plurality of the first element pattern and a through hole corresponding to the first element pattern on the sheet-shaped secondary battery; (J) in a state where the driving mechanism is calibrated, using the The laser light source irradiates laser light from the side of the other surface of the sheet secondary battery to form a second element pattern on the surface of the other side of the sheet secondary battery; (K) by the The sheet-shaped secondary battery is sent out by a pair of conveying shaft disks, and the step (J) is repeatedly performed. , The sheet-type secondary battery to form a plurality of elements of the second pattern. 如請求項10或11所述之片狀二次電池的製造裝置,更包含吸附該片狀二次電池的工件台, 其中在該工件台吸附該片狀二次電池的狀態下,該雷射光源對該片狀二次電池照射雷射光。The apparatus for manufacturing a sheet-shaped secondary battery according to claim 10 or 11, further comprising a work table for adsorbing the sheet-shaped secondary battery, wherein the laser is in a state where the sheet-shaped secondary battery is adsorbed by the work-table. The light source irradiates laser light to the sheet-shaped secondary battery. 一種片狀元件,包含: 一片材; 一第一元件圖案,形成於該片材之一側的表面; 一第二元件圖案,形成於該片材之另一側的表面,並對應於該第一元件圖案; 一貫穿孔,貫穿該片材而配置於該片材之一側的表面中的該第一元件圖案附近,及配置於該片材之另一側的表面中的該第二元件圖案附近。A sheet-like element includes: a sheet of material; a first element pattern formed on a surface of one side of the sheet; a second element pattern formed on a surface of the other side of the sheet and corresponding to the sheet A first element pattern; a through hole penetrating the sheet and disposed near the first element pattern in a surface on one side of the sheet, and the second element disposed in a surface on the other side of the sheet Near the pattern. 一種片狀元件的製造方法,包含下列步驟: (A) 在片狀元件的一側之表面形成一第一元件圖案,該片狀元件係捲設於具有一捲收軸盤及一送出軸盤的成對的輸送軸盤; (B)使對應於該第一元件圖案,而於該片狀元件形成貫穿孔。 (C)藉由該成對的輸送軸盤送出該片狀元件,反覆地進行該(A)步驟與該(B)步驟,於該片狀二次電池形成複數個該第一元件圖案及對應於該第一元件圖案的貫穿孔; (D)基於該貫穿孔而進行校準,於該片狀元件之另一側的表面形成第二元件圖案; (E)藉由該成對的輸送軸盤送出該片狀元件,反覆地進行該(D)步驟,於該片狀元件形成複數個該第二元件圖案;以及 (F)將該第一元件圖案與該第二元件圖案予以對應,而切斷該片狀元件。A method for manufacturing a sheet-like element includes the following steps: (A) forming a first element pattern on a surface of one side of the sheet-like element; the sheet-like element is wound on a roll with a winding shaft and a sending shaft (B) forming a through-hole in the sheet-like element corresponding to the first element pattern. (C) The sheet-shaped element is sent out through the pair of conveying shaft disks, and the steps (A) and (B) are repeatedly performed to form a plurality of the first element patterns and corresponding ones in the sheet-shaped secondary battery. A through-hole in the first element pattern; (D) aligning based on the through-hole, forming a second element pattern on the surface of the other side of the sheet-like element; (E) by the pair of conveying shaft disks Sending out the sheet element, and repeatedly performing the step (D), forming a plurality of the second element patterns on the sheet element; and (F) corresponding to the first element pattern and the second element pattern, and cutting Break the sheet-like element.
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