TW201741106A - Segmentation method for brittle substrate - Google Patents

Segmentation method for brittle substrate Download PDF

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Publication number
TW201741106A
TW201741106A TW106104258A TW106104258A TW201741106A TW 201741106 A TW201741106 A TW 201741106A TW 106104258 A TW106104258 A TW 106104258A TW 106104258 A TW106104258 A TW 106104258A TW 201741106 A TW201741106 A TW 201741106A
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Taiwan
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line
leading edge
blade
crack
brittle substrate
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TW106104258A
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Chinese (zh)
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TWI712478B (en
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曽山浩
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三星鑽石工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

To secure an easy preparation of a blade tip and a sufficient lifetime of the tip when the tip having an apex where three faces joint is slid with the ridgeline on the back side. A blade tip 51 is prepared which has a first face SD1, a second face SD2 adjacent to the first face SD1, and a third face SD3 that makes a ridgeline PS by adjacency to the second face SD2 and makes an apex PP by adjacency to each of the first face SD1 and the second face SD2. The ridgeline PS is processed by bevelling. A trench line TL having a groove shape is cracklessly formed on one face SF1 of the brittle substrate 4 by sliding the tip 51 on one face SF1 of the brittle substrate 4 from the ridgeline PS in a direction toward the first face SD1. A crack line CL is formed along the trench line TL. The brittle substrate 4 is segmented along the crack line CL.

Description

脆性基板之分斷方法 Fragmentation method of brittle substrate

本發明係關於一種脆性基板之分斷方法,尤其係關於使用刃前緣之滑動之脆性基板之分斷方法。 The present invention relates to a method for breaking a brittle substrate, and more particularly to a method for breaking a brittle substrate using a sliding edge of a blade.

於平面顯示器面板或太陽電池面板等電氣設備之製造中,常常必須分斷脆性基板。於典型性之分斷方法中,首先,於脆性基板上形成裂痕線。於本說明書中所謂「裂痕線」,係指於脆性基板之厚度方向局部地前進之裂痕於脆性基板之表面上線狀地延伸者。其次,進行所謂之斷裂步驟。具體而言,藉由對脆性基板施加應力,而使裂痕線之裂痕於厚度方向完全前進。藉此,脆性基板沿著裂痕線分斷。 In the manufacture of electrical equipment such as flat panel displays or solar panel panels, it is often necessary to break the brittle substrate. In a typical breaking method, first, a crack line is formed on a brittle substrate. In the present specification, the term "crack line" means a crack that partially advances in the thickness direction of the brittle substrate and linearly extends on the surface of the brittle substrate. Next, a so-called breaking step is performed. Specifically, by applying stress to the brittle substrate, the crack of the crack line is completely advanced in the thickness direction. Thereby, the brittle substrate is broken along the crack line.

根據專利文獻1,處於玻璃板之上表面之凹陷會於切割時產生。於該專利文獻1中,將該凹陷稱為「劃線」。又,與該劃線之刻設同時地,產生自劃線向正下方向延伸之裂痕。如該專利文獻1之技術所呈現,於習知之典型性之技術中,與劃線之形成同時地形成裂痕線。 According to Patent Document 1, the depression on the upper surface of the glass sheet is generated at the time of cutting. In Patent Document 1, the recess is referred to as "line". Further, at the same time as the scribe line, a crack extending from the scribe line in the downward direction is generated. As disclosed in the technique of Patent Document 1, in the conventional technique of the prior art, a crack line is formed simultaneously with the formation of the scribe line.

根據專利文獻2,提出有與上述典型性之分斷技術明顯不同之分斷技術。根據該技術,首先,藉由利用脆性基板上之刃前緣之滑動產生塑性變形,而形成該專利文獻2中被稱為「劃線」之槽形狀。於本說明 書中,以後將該槽形狀稱為「溝槽線」。於形成溝槽線之時間點,未於其下方形成裂痕。然後,藉由沿著溝槽線使裂痕伸展,而形成裂痕線。即,與典型性之技術不同,不伴隨裂痕之溝槽線一旦形成,之後便沿著溝槽線形成裂痕線。然後,沿著裂痕線進行通常之斷裂步驟。 According to Patent Document 2, there is proposed a breaking technique which is significantly different from the above-described typical breaking technique. According to this technique, first, a plastic deformation is performed by sliding of the leading edge of the blade on the brittle substrate, and a groove shape called "scribe line" in Patent Document 2 is formed. In this description In the book, the shape of the groove will be referred to as a "groove line" in the future. At the point in time when the groove line is formed, no crack is formed below it. Then, the crack line is formed by stretching the crack along the groove line. That is, unlike the typical technique, once the groove line without the crack is formed, a crack line is formed along the groove line. The usual breaking step is then carried along the crack line.

於本說明書中,將如上述專利文獻2之技術般積極地利用不伴隨裂痕之溝槽線之技術稱為「無裂痕劃刻技術」。於無裂痕劃刻技術中形成之溝槽線與伴隨裂痕之同時形成之典型性之劃線相比,能夠利用更低之負載之刃前緣之滑動而形成。若負載較小,則施加至刃前緣之損傷亦變小。因此,根據該分斷技術,可延長刃前緣之壽命。作為刃前緣之構成之一種,根據上述專利文獻2,揭示有具有3個面相交之頂點及自此處延伸之稜線者。具體而言,刃前緣具有頂面與第1側面與第2側面相交之頂點、以及第1側面及第2側面所成之稜線。作為於脆性基板上刃前緣滑動之方向,揭示有自頂面朝向稜線之第1方向、及自稜線朝向頂面之第2方向。 In the present specification, a technique of actively utilizing a groove line not accompanied by a crack as in the technique of Patent Document 2 described above is referred to as a "crack-free scribe technique". The groove line formed in the crack-free scribing technique can be formed by sliding the leading edge of the blade with a lower load than the typical scribing formed at the same time as the crack. If the load is small, the damage applied to the leading edge of the blade also becomes small. Therefore, according to the breaking technique, the life of the leading edge of the blade can be extended. As one of the configurations of the leading edge of the blade, according to the above Patent Document 2, a vertice having three faces intersecting and a ridge extending therefrom is disclosed. Specifically, the leading edge of the blade has an apex at which the top surface intersects the first side surface and the second side surface, and a ridge line formed by the first side surface and the second side surface. As a direction in which the leading edge of the blade slides on the brittle substrate, a first direction from the top surface toward the ridge line and a second direction from the ridge line toward the top surface are disclosed.

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平9-188534號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 9-188534

[專利文獻2]國際公開第2015/151755號 [Patent Document 2] International Publication No. 2015/151755

上述刃前緣並不限定於無裂痕劃刻技術,於伴隨裂痕之同時產生之典型性之劃刻技術中亦廣泛使用。於典型性之劃刻技術中,刃前緣 之滑動方向之上述第1方向為標準的。換言之,以稜線為前側,以頂面為後側者為標準的。其原因在於,容易抑制對刃前緣之損傷。另一方面,在無裂痕劃刻技術中,由於對刃前緣之負載較低故對刃前緣之損傷得到抑制,故而上述第2方向亦充分實用。而且,於無裂痕劃刻技術中,存在根據其用途而尤其期望第2方向而非第1方向之情形。關於適合於此種情形之刃前緣之具體構成,剛開始無裂痕劃刻技術之研究,而尚未進行具體研究。 The blade leading edge is not limited to the crack-free scribe technique, and is widely used in the sculpt technique which is accompanied by the typical cracking. In the typical scribing technique, the leading edge The first direction of the sliding direction is standard. In other words, the ridge line is the front side and the top surface is the back side. The reason for this is that it is easy to suppress damage to the leading edge of the blade. On the other hand, in the crack-free scribing technique, since the load on the leading edge of the blade is low, damage to the leading edge of the blade is suppressed, and the second direction is also sufficiently practical. Further, in the crack-free scribing technique, there is a case where the second direction is not particularly desired depending on the use thereof. Regarding the specific composition of the leading edge of the blade suitable for such a situation, the research on the technique of crack-free scoring has just begun, and no specific research has been conducted.

以工業目的使用之刃前緣由於其更換頻度相對較高,故而期望為容易準備者。尤其,於選擇上述第2方向作為刃前緣之滑動方向之情形時,與選擇第1方向之情形時相比容易對刃前緣施加損傷。因此,刃前緣之壽命容易變短,相應地刃前緣之更換頻度容易變高。因此,進一步期望刃前緣為可容易準備者。 The leading edge of the blade used for industrial purposes is expected to be easy to prepare because of the relatively high frequency of replacement. In particular, when the second direction is selected as the sliding direction of the leading edge of the blade, it is easier to apply damage to the leading edge of the blade than when the first direction is selected. Therefore, the life of the leading edge of the blade is likely to be shortened, and the frequency of replacement of the leading edge of the blade is likely to become high. Therefore, it is further desirable that the leading edge of the blade be an easy preparer.

本發明係為了解決如以上之課題而完成者,其目的在於提供一種脆性基板之分斷方法,其係於具有3個面相交之頂點之刃前緣以其稜線為後側而滑動之情形時,可容易地準備刃前緣,且可確保刃前緣之充分之壽命。 The present invention has been made in order to solve the above problems, and an object of the invention is to provide a method for breaking a brittle substrate, which is a case where a blade leading edge having a vertex of three faces intersects with a ridge line as a rear side and slides The leading edge of the blade can be easily prepared and the full life of the leading edge of the blade can be ensured.

按照本發明之一個態樣之脆性基板之分斷方法具有以下之步驟a)~e)。 The breaking method of the brittle substrate according to one aspect of the present invention has the following steps a) to e).

a)準備具有一個面及與一個面垂直之厚度方向之脆性基板。 a) Prepare a brittle substrate having a face and a thickness direction perpendicular to one face.

b)準備刃前緣,該刃前緣具有:第1面;第2面,其與第1面相鄰;及第3面,其係藉由與第2面相鄰而形成稜線且藉由與第1面及第2面之各 者相鄰而形成頂點。稜線為未經倒角加工者。 b) preparing a leading edge of the blade, the leading edge of the blade having: a first surface; a second surface adjacent to the first surface; and a third surface formed by forming a ridge line adjacent to the second surface With each of the first side and the second side Adjacent to form a vertex. The ridge line is the one that has not been chamfered.

c)藉由於脆性基板之一個面上使刃前緣向自稜線朝向第1面之方向滑動,而利用塑性變形使具有槽形狀之溝槽線形成於脆性基板之一個面上。溝槽線係以成為無裂痕狀態之方式形成,即,於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續地連接之狀態。 c) A groove line having a groove shape is formed on one surface of the brittle substrate by plastic deformation by sliding the leading edge of the blade toward the first surface on one surface of the brittle substrate. The groove lines are formed in a non-cracked state, that is, a state in which the brittle substrates are continuously connected in a direction intersecting the groove lines below the groove lines.

d)於步驟c)之後,藉由沿著溝槽線使厚度方向之脆性基板之裂痕伸展,而形成裂痕線。藉由裂痕線,使得於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續性之連接中斷。 d) After step c), the crack line is formed by stretching the crack of the brittle substrate in the thickness direction along the groove line. By the crack line, the connection of the brittle substrate in the direction intersecting the groove line is interrupted below the groove line.

e)沿著裂痕線分斷脆性基板。 e) Break the brittle substrate along the crack line.

按照本發明之另一態樣之脆性基板之分斷方法具有以下之步驟a)~e)。 The breaking method of the brittle substrate according to another aspect of the present invention has the following steps a) to e).

a)準備具有一個面及與一個面垂直之厚度方向之脆性基板。 a) Prepare a brittle substrate having a face and a thickness direction perpendicular to one face.

b)準備刃前緣,該刃前緣具有:第1面;第2面,其與第1面相鄰;及第3面,其係藉由與第2面相鄰而形成稜線且藉由與第1面及第2面之各者相鄰而形成頂點。刃前緣係於與稜線垂直之剖面中具有2μm以下之曲率半徑。 b) preparing a leading edge of the blade, the leading edge of the blade having: a first surface; a second surface adjacent to the first surface; and a third surface formed by forming a ridge line adjacent to the second surface Adjacent to each of the first surface and the second surface, an apex is formed. The leading edge of the blade has a radius of curvature of 2 μm or less in a cross section perpendicular to the ridge line.

c)藉由於脆性基板之一個面上使刃前緣向自稜線朝向第1面之方向滑動,而利用塑性變形使具有槽形狀之溝槽線形成於脆性基板之一個面上。溝槽線係以成為無裂痕狀態之方式形成,即,於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續地連接之狀態。 c) A groove line having a groove shape is formed on one surface of the brittle substrate by plastic deformation by sliding the leading edge of the blade toward the first surface on one surface of the brittle substrate. The groove lines are formed in a non-cracked state, that is, a state in which the brittle substrates are continuously connected in a direction intersecting the groove lines below the groove lines.

d)於步驟c)之後,藉由沿著溝槽線使厚度方向之脆性基板之裂痕伸展,而形成裂痕線。藉由裂痕線,使得於溝槽線之下方,脆性基板於與溝 槽線交叉之方向連續性之連接中斷。 d) After step c), the crack line is formed by stretching the crack of the brittle substrate in the thickness direction along the groove line. By the crack line, below the groove line, the brittle substrate is in the groove The continuity of the continuity of the slot line is interrupted.

e)沿著裂痕線分斷脆性基板。 e) Break the brittle substrate along the crack line.

根據按照本發明之一個態樣之脆性基板之分斷方法,刃前緣之稜線為未經倒角加工者。藉此,與刃前緣之稜線為經倒角加工者之情形時相比,容易準備刃前緣。又,藉由使用無裂痕劃刻技術,可降低對刃前緣之負載。藉此,可進行以稜線為後側之滑動,而且可確保刃前緣之充分之壽命。 According to the breaking method of the brittle substrate according to an aspect of the present invention, the ridgeline of the leading edge of the blade is a non-chamfered processor. Thereby, it is easier to prepare the leading edge of the blade than when the ridgeline of the leading edge of the blade is a chamfered processor. Moreover, by using the crack-free scribe technique, the load on the leading edge of the blade can be reduced. Thereby, the slanting of the ridge line can be performed, and the sufficient life of the leading edge of the blade can be ensured.

根據按照本發明之另一態樣之脆性基板之分斷方法,刃前緣係於與稜線垂直之剖面中具有2μm以下之曲率半徑。作為此種曲率半徑,於形成有形成稜線之一對面之後,僅藉由控制相對於稜線之倒角加工即可容易地獲得。因此,可容易地準備刃前緣。又,藉由使用無裂痕劃刻技術,可降低對刃前緣之負載。藉此,可進行以稜線為後側之滑動,而且可確保刃前緣之充分之壽命。 According to the breaking method of the brittle substrate according to another aspect of the present invention, the leading edge of the blade has a radius of curvature of 2 μm or less in a cross section perpendicular to the ridge line. Such a radius of curvature can be easily obtained only by controlling chamfering with respect to the ridge line after forming one surface opposite to the ridge line. Therefore, the leading edge of the blade can be easily prepared. Moreover, by using the crack-free scribe technique, the load on the leading edge of the blade can be reduced. Thereby, the slanting of the ridge line can be performed, and the sufficient life of the leading edge of the blade can be ensured.

ED‧‧‧邊緣 Edge of ED‧‧

AL‧‧‧輔助線 AL‧‧‧Auxiliary line

CL‧‧‧裂痕線 CL‧‧‧crack line

SD1‧‧‧頂面(第1面) SD1‧‧‧ top surface (1st side)

SD2‧‧‧側面(第2面) SD2‧‧‧ side (2nd side)

SD3‧‧‧側面(第3面) SD3‧‧‧ side (3rd side)

SF、SF1‧‧‧上表面(一個面) SF, SF1‧‧‧ upper surface (one side)

PP‧‧‧頂點 PP‧‧‧ vertex

TL‧‧‧溝槽線 TL‧‧‧ trench line

PS‧‧‧稜線 PS‧‧‧ ridgeline

CLa‧‧‧輔助裂痕線 CLa‧‧‧Assisted Crack Line

TLa‧‧‧輔助溝槽線 TLa‧‧‧Auxiliary groove line

4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)

51‧‧‧刃前緣 51‧‧‧blade front

51a‧‧‧輔助刃前緣 51a‧‧‧Auxiliary edge

圖1係概略性地表示本發明之實施形態1之脆性基板之分斷方法中所使用的切割器具之構成之側視圖。 Fig. 1 is a side view schematically showing the configuration of a cutting instrument used in the breaking method of the brittle substrate according to the first embodiment of the present invention.

圖2係圖1之箭頭II之視點之概略俯視圖。 Figure 2 is a schematic plan view of the viewpoint of the arrow II of Figure 1.

圖3係圖2之頂點附近之局部放大圖。 Figure 3 is a partial enlarged view of the vicinity of the apex of Figure 2.

圖4係模式性地表示用以算出與圖3之稜線垂直之剖面之曲率半徑的表面分佈之曲線圖。 Fig. 4 is a graph schematically showing a surface distribution for calculating a radius of curvature of a section perpendicular to the ridgeline of Fig. 3.

圖5係概略性地表示本發明之實施形態1~5之脆性基板之分斷方法之構成的流程圖。 Fig. 5 is a flow chart schematically showing the configuration of a breaking method of the brittle substrate according to the first to fifth embodiments of the present invention.

圖6係概略性地表示本發明之實施形態1之脆性基板之分斷方法之第1步驟的俯視圖。 Fig. 6 is a plan view schematically showing a first step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

圖7係沿著圖6之線VII-VII之概略端面圖。 Fig. 7 is a schematic end view taken along line VII-VII of Fig. 6.

圖8係概略性地表示本發明之實施形態1之脆性基板之分斷方法之第2步驟的俯視圖。 Fig. 8 is a plan view schematically showing a second step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

圖9係沿著圖8之線IX-IX之概略端面圖。 Figure 9 is a schematic end view taken along line IX-IX of Figure 8.

圖10係概略性地表示比較例1之脆性基板之分斷方法中所使用之切割器具之構成的俯視圖。 FIG. 10 is a plan view schematically showing a configuration of a cutting instrument used in the breaking method of the brittle substrate of Comparative Example 1. FIG.

圖11係表示實施形態1之實施例之脆性基板之分斷形狀之側視圖。 Fig. 11 is a side view showing the breaking shape of the brittle substrate according to the embodiment of the first embodiment.

圖12係表示比較例3之脆性基板之分斷形狀之側視圖。 Fig. 12 is a side view showing the breaking shape of the brittle substrate of Comparative Example 3.

圖13係概略性地表示本發明之實施形態2之脆性基板之分斷方法的溝槽線之形成方法之構成之流程圖。 Fig. 13 is a flow chart showing the configuration of a method of forming a groove line in the breaking method of the brittle substrate according to the second embodiment of the present invention.

圖14係概略性地表示本發明之實施形態3之脆性基板之分斷方法的第1步驟之俯視圖。 Fig. 14 is a plan view schematically showing a first step of the breaking method of the brittle substrate according to the third embodiment of the present invention.

圖15係沿著圖14之線XV-XV之概略端面圖。 Figure 15 is a schematic end view taken along line XV-XV of Figure 14.

圖16係概略性地表示本發明之實施形態3之脆性基板之分斷方法的第2步驟之俯視圖。 Fig. 16 is a plan view schematically showing a second step of the breaking method of the brittle substrate according to the third embodiment of the present invention.

圖17係概略性地表示本發明之實施形態3之脆性基板之分斷方法的第3步驟之俯視圖。 Fig. 17 is a plan view schematically showing a third step of the breaking method of the brittle substrate according to the third embodiment of the present invention.

圖18係概略性地表示本發明之實施形態4之脆性基板之分斷方法的第 1步驟之俯視圖。 FIG. 18 is a view schematically showing a method of dividing a brittle substrate according to Embodiment 4 of the present invention; A top view of the 1 step.

圖19係概略性地表示本發明之實施形態4之脆性基板之分斷方法的第2步驟之俯視圖。 Fig. 19 is a plan view schematically showing a second step of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

圖20係概略性地表示本發明之實施形態5之脆性基板之分斷方法中所使用的刃前緣之構成之剖視圖。 Fig. 20 is a cross-sectional view showing the configuration of a blade leading edge used in the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

圖21係概略性地表示本發明之實施形態5之脆性基板之分斷方法中所使用的輔助刃前緣之構成之剖視圖。 Fig. 21 is a cross-sectional view showing the configuration of the leading edge of the auxiliary blade used in the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

以下,基於圖式對本發明之實施形態進行說明。再者,於以下之圖式中對相同或相當之部分標註相同之參照編號,不重複其說明。 Hereinafter, embodiments of the present invention will be described based on the drawings. In the following drawings, the same or corresponding components are designated by the same reference numerals, and the description is not repeated.

<實施形態1> <Embodiment 1>

(切割器具之構成) (Composition of cutting instruments)

參照圖1及圖2,首先,對本實施形態之玻璃基板4(脆性基板)之分斷方法之溝槽線之形成步驟中所使用的切割器具50之構成進行說明。切割器具50具有刃前緣51及柄52。刃前緣51係藉由固定於作為其固持器之柄52而保持。 First, the configuration of the cutting tool 50 used in the step of forming the groove line of the method for dividing the glass substrate 4 (brittle substrate) of the present embodiment will be described with reference to FIG. 1 and FIG. The cutting instrument 50 has a blade leading edge 51 and a shank 52. The leading edge 51 of the blade is held by being fixed to the shank 52 as its holder.

於刃前緣51設置有頂面SD1(第1面)及包圍頂面SD1之多個面。該等多個面包含側面SD2(第2面)及側面SD3(第3面)。頂面SD1、側面SD2及SD3(第1~第3面)朝向相互不同之方向,且相互相鄰。刃前緣51具有頂面SD1、側面SD2及SD3相交之頂點。藉由該頂點PP而構成刃前緣51之突起部。又,側面SD2及SD3形成構成刃前緣51之側部 之稜線PS。稜線PS自頂點PP線狀地延伸,且具有線狀地延伸之凸形狀。根據以上之構成,刃前緣51具有:頂面SD1;側面SD2,其與頂面SD1相鄰;及側面SD3,其係藉由與側面SD2相鄰而形成稜線PS且藉由與頂面SD1及側面SD2之各者相鄰而形成頂點PP。 A top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1 are provided on the blade leading edge 51. The plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and the SD3 (the first to third surfaces) are oriented in mutually different directions and adjacent to each other. The leading edge 51 has an apex where the top surface SD1, the side surfaces SD2, and SD3 intersect. The protrusion of the blade leading edge 51 is formed by the vertex PP. Further, the side faces SD2 and SD3 are formed to form the side of the blade leading edge 51. The ridgeline PS. The ridge line PS extends linearly from the apex PP and has a convex shape extending linearly. According to the above configuration, the blade leading edge 51 has a top surface SD1, a side surface SD2 adjacent to the top surface SD1, and a side surface SD3 which is formed adjacent to the side surface SD2 to form the ridge line PS and by the top surface SD1 Each of the side faces SD2 is adjacent to each other to form a vertex PP.

稜線PS為未經倒角加工者。因此,刃前緣51之稜線呈銳利之形狀。具體而言,刃前緣51具有2μm以下之曲率半徑,較佳為具有1μm以下之曲率半徑,作為與稜線PS垂直之剖面之曲率半徑(以下,亦僅簡稱為「稜線PS之曲率半徑」)。以下,對該曲率半徑之測定方法之例進行說明。 The ridge line PS is a person who has not been chamfered. Therefore, the ridgeline of the blade leading edge 51 has a sharp shape. Specifically, the blade leading edge 51 has a radius of curvature of 2 μm or less, preferably has a radius of curvature of 1 μm or less, and has a radius of curvature as a cross section perpendicular to the ridge line PS (hereinafter, simply referred to as "curvature radius of the ridge line PS"). . Hereinafter, an example of a method of measuring the radius of curvature will be described.

參照圖3,上述曲率半徑可根據測定線SR上之側面SD2及SD3之表面分佈之測定結果而算出。測定線SR係位於刃前緣51中、頂點PP附近之對玻璃基板4起實質性作用之作用部分ER內者。測定線SR係於自頂點PP離開之位置與稜線PS正交。作用部分ER具有與稜線PS正交之方向之尺寸L1及沿著稜線PS之方向之尺寸L2。典型而言,尺寸L1為30μm以上且50μm以下,尺寸L2為10μm以上且30μm以下。頂點PP與測定線SR之間隔LD為如由頂點PP之存在所引起之對表面分佈之影響充分變小之間隔,例如為5μm左右。圖4係模式性地表示測定線SR上之位置與高度H之關係之測定結果之表面分佈。表面分佈之測定例如可使用雷射顯微鏡進行。藉由對所獲得之表面分佈於稜線PS之位置應用圓RR,可算出曲率半徑。 Referring to Fig. 3, the radius of curvature can be calculated from the measurement results of the surface distributions of the side faces SD2 and SD3 on the measurement line SR. The measurement line SR is located in the action portion ER which acts substantially on the glass substrate 4 in the vicinity of the vertex PP in the blade leading edge 51. The measurement line SR is orthogonal to the ridge line PS at a position away from the vertex PP. The action portion ER has a dimension L1 in a direction orthogonal to the ridge line PS and a dimension L2 in a direction along the ridge line PS. Typically, the dimension L1 is 30 μm or more and 50 μm or less, and the dimension L2 is 10 μm or more and 30 μm or less. The interval LD between the vertex PP and the measurement line SR is an interval in which the influence on the surface distribution caused by the presence of the vertex PP is sufficiently small, and is, for example, about 5 μm. Fig. 4 is a view schematically showing the surface distribution of the measurement result of the relationship between the position on the measurement line SR and the height H. The measurement of the surface distribution can be carried out, for example, using a laser microscope. The radius of curvature can be calculated by applying a circle RR to the position at which the obtained surface is distributed over the ridge line PS.

較佳為刃前緣51為金剛石點。即,自可減小硬度及表面粗糙度之方面而言,刃前緣51較佳為,由金剛石製成。更佳為,刃前緣51由單晶金剛石製成。進而較佳為,就結晶學而言,頂面SD1為{001}面, 側面SD2及SD3之各者為{111}面。於該情形時,側面SD2及SD3具有不同之方向,但是結晶學上為相互等價之結晶面。 Preferably, the leading edge 51 of the blade is a diamond dot. That is, the blade leading edge 51 is preferably made of diamond in terms of reducing hardness and surface roughness. More preferably, the leading edge 51 is made of single crystal diamond. Further preferably, in terms of crystallography, the top surface SD1 is a {001} plane, Each of the side faces SD2 and SD3 is a {111} face. In this case, the side faces SD2 and SD3 have different directions, but are crystallographically equivalent to each other.

再者,亦可使用並非單晶之金剛石,例如,亦可使用利用CVD(Chemical Vapor Deposition)法合成的多晶體金剛石。或者,亦可使用自微粒之石墨或非石墨狀碳將不包含鐵族元素等結合材燒結之多晶體金剛石粒子藉由鐵族元素等結合材而結合之燒結金剛石。 Further, a diamond which is not a single crystal may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may also be used. Alternatively, a sintered diamond in which polycrystalline diamond particles not containing a bonding material such as an iron group element are bonded by a binder such as an iron group element may be used from graphite or non-graphite carbon.

柄52沿著軸向AX延伸。較佳為,刃前緣51以頂面SD1之法線方向大致沿著軸向AX之方式安裝於柄52。 The shank 52 extends along the axial direction AX. Preferably, the blade leading edge 51 is attached to the shank 52 so as to be substantially along the axial direction AX in the normal direction of the top surface SD1.

(玻璃基板之分斷方法) (Method of breaking glass substrate)

其次,以下一面參照圖5所示之流程圖一面對玻璃基板4之分斷方法進行說明。 Next, a description will be given of a method of dividing the glass substrate 4 with reference to a flow chart shown in FIG.

於步驟S10(圖5)中,準備欲被分斷之玻璃基板4(圖1)。玻璃基板4具有上表面SF1(一個面)及其相反之下表面SF2(另一個面)。於上表面SF1設置有邊緣ED。於圖6所示之例中,邊緣ED具有長方形狀。玻璃基板4具有與上表面SF1垂直之厚度方向DT。又,於步驟S20(圖5)中,準備具有上述刃前緣51之切割器具50(圖1及圖2)。 In step S10 (Fig. 5), the glass substrate 4 (Fig. 1) to be broken is prepared. The glass substrate 4 has an upper surface SF1 (one surface) and an opposite lower surface SF2 (the other surface). An edge ED is provided on the upper surface SF1. In the example shown in Fig. 6, the edge ED has a rectangular shape. The glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1. Further, in step S20 (Fig. 5), the cutting tool 50 (Figs. 1 and 2) having the blade leading edge 51 is prepared.

參照圖6,於步驟S30(圖5)中形成溝槽線TL。具體而言,進行以下之步驟。 Referring to Fig. 6, a groove line TL is formed in step S30 (Fig. 5). Specifically, the following steps are performed.

首先,將刃前緣51(圖1)之頂點PP於位置N1壓抵於上表面SF1。藉此,刃前緣51接觸於玻璃基板4。較佳為,位置N1如圖所示,自玻璃基板4之上表面SF1之邊緣ED離開。換言之,於刃前緣51之滑動開始時間點,避免刃前緣51與玻璃基板4之上表面SF1之邊緣ED碰撞。 First, the vertex PP of the blade leading edge 51 (Fig. 1) is pressed against the upper surface SF1 at the position N1. Thereby, the blade leading edge 51 is in contact with the glass substrate 4. Preferably, the position N1 is separated from the edge ED of the upper surface SF1 of the glass substrate 4 as shown. In other words, at the sliding start timing of the blade leading edge 51, the blade leading edge 51 is prevented from colliding with the edge ED of the upper surface SF1 of the glass substrate 4.

其次,使如上所述壓抵之刃前緣51於玻璃基板4之上表面SF1上滑動(參照圖6之箭頭)。刃前緣51(圖1)於上表面SF1上向自稜線PS朝向頂面SD1之方向滑動。嚴格而言,刃前緣51向將自稜線PS經由頂點PP朝向頂面SD1之方向投影至上表面SF1上所成之方向DB滑動。方向DB大致沿著將頂點PP之附近之稜線PS之延伸方向投影至上表面SF1上所成之方向。於圖1中,方向DB對應於與將自刃前緣51延伸之軸向AX投影至上表面SF1上所成之方向相反之方向。因此,刃前緣51藉由柄52而壓入至上表面SF1上。 Next, the blade leading edge 51 which is pressed as described above is slid on the upper surface SF1 of the glass substrate 4 (see an arrow in Fig. 6). The blade leading edge 51 (Fig. 1) slides on the upper surface SF1 in the direction from the ridge line PS toward the top surface SD1. Strictly speaking, the blade leading edge 51 slides in a direction DB formed by projecting the ridge line PS from the apex PP toward the top surface SD1 toward the upper surface SF1. The direction DB is projected substantially in the direction in which the ridge line PS in the vicinity of the vertex PP is projected to the upper surface SF1. In FIG. 1, the direction DB corresponds to a direction opposite to the direction in which the axial direction AX extending from the blade leading edge 51 is projected onto the upper surface SF1. Therefore, the blade leading edge 51 is pressed into the upper surface SF1 by the shank 52.

於玻璃基板4之上表面SF1上滑動之刃前緣51(圖1)之稜線PS及頂面SD1之各者與玻璃基板4之上表面SF1形成角度AG1及角度AG2。較佳為,角度AG2小於角度AG1。 Each of the ridge line PS and the top surface SD1 of the blade leading edge 51 (FIG. 1) which slides on the upper surface SF1 of the glass substrate 4 forms an angle AG1 and an angle AG2 with the upper surface SF1 of the glass substrate 4. Preferably, the angle AG2 is smaller than the angle AG1.

藉由上述滑動而於上表面SF1上產生塑性變形。藉此,於上表面SF1上形成具有槽形狀之溝槽線TL(圖7)。較佳為,溝槽線TL僅藉由玻璃基板4之塑性變形而產生,於該情形時,於玻璃基板4之上表面SF1上不會產生切削。為了避免切削,只要不使刃前緣51之負載過高即可。由於無切削,故可避免於上表面SF1上產生不佳之微細之碎片。但是,通常可容許少許之切削。 Plastic deformation occurs on the upper surface SF1 by the above sliding. Thereby, a groove line TL having a groove shape is formed on the upper surface SF1 (FIG. 7). Preferably, the groove line TL is generated only by plastic deformation of the glass substrate 4, and in this case, no cutting occurs on the upper surface SF1 of the glass substrate 4. In order to avoid cutting, it is sufficient that the load on the leading edge 51 of the blade is not excessively high. Since there is no cutting, it is possible to avoid generation of fine and fine fragments on the upper surface SF1. However, a small amount of cutting is usually allowed.

溝槽線TL之形成係藉由於位置N1及位置N3e之間,使刃前緣51自位置N1經由位置N2向位置N3e滑動而進行。位置N2自玻璃基板4之上表面SF1之邊緣ED離開。位置N3e位於玻璃基板4之上表面SF1之邊緣ED。 The groove line TL is formed by sliding the blade leading edge 51 from the position N1 to the position N3e via the position N2 between the position N1 and the position N3e. The position N2 is separated from the edge ED of the upper surface SF1 of the glass substrate 4. The position N3e is located at the edge ED of the upper surface SF1 of the glass substrate 4.

溝槽線TL係以成為無裂痕狀態之方式形成,即,於溝槽線 TL之下方,玻璃基板4於與溝槽線TL之延伸方向(圖6中之橫方向)交叉之方向DC(圖7)連續地連接之狀態。於無裂痕狀態中,雖然形成有由塑性變形而形成之溝槽線TL,但不形成沿著其之裂痕。為了獲得適當之無裂痕狀態,而調整施加至刃前緣51之負載,以使其小至於溝槽線TL形成時間點不產生裂痕之程度,且大至產生如成為可於之後之步驟中產生裂痕之內部應力之狀態的塑性變形之程度。 The groove line TL is formed in a non-cracked state, that is, in the groove line Below the TL, the glass substrate 4 is continuously connected in a direction DC (FIG. 7) intersecting with the extending direction of the groove line TL (the horizontal direction in FIG. 6). In the non-cracked state, although the groove line TL formed by plastic deformation is formed, cracks along it are not formed. In order to obtain a proper crack-free state, the load applied to the leading edge 51 of the blade is adjusted so as to be small as to the extent that the groove line TL is formed at a point in time without cracking, and is generated as if it can be produced in a subsequent step. The degree of plastic deformation of the state of the internal stress of the crack.

為了形成溝槽線TL,如上所述滑動之刃前緣51最終到達位置N3e。於刃前緣51位於位置N2之時間點維持無裂痕狀態,進而,無裂痕狀態維持至刃前緣51到達位置N3e之瞬間為止。若刃前緣51到達位置N3e,則刃前緣51之稜線PS(圖1)切下玻璃基板4之上表面SF1之邊緣ED。 In order to form the groove line TL, the leading edge 51 of the sliding edge as described above finally reaches the position N3e. When the blade leading edge 51 is at the position N2, the crack-free state is maintained, and the crack-free state is maintained until the blade leading edge 51 reaches the position N3e. If the blade leading edge 51 reaches the position N3e, the ridge line PS (Fig. 1) of the blade leading edge 51 cuts off the edge ED of the upper surface SF1 of the glass substrate 4.

參照圖8及圖9,藉由上述之切下,而於位置N3e產生微細之破壞。以該破壞為起點,以將溝槽線TL附近之內部應力釋放之方式產生裂痕。具體而言,厚度方向DT之玻璃基板4之裂痕自位於玻璃基板4之上表面SF1之邊緣ED之位置N3e沿著溝槽線TL伸展(參照圖8中之箭頭)。換言之,裂痕線CL之形成開始。藉此,作為步驟S50(圖5),自位置N3e向位置N1形成裂痕線CL。 Referring to Fig. 8 and Fig. 9, by the above-described cutting, fine destruction occurs at the position N3e. Starting from this destruction, cracks are generated in such a manner that the internal stress near the groove line TL is released. Specifically, the crack of the glass substrate 4 in the thickness direction DT extends from the groove line TL at a position N3e located at the edge ED of the upper surface SF1 of the glass substrate 4 (refer to an arrow in FIG. 8). In other words, the formation of the crack line CL begins. Thereby, as step S50 (FIG. 5), the crack line CL is formed from the position N3e to the position N1.

再者,為了使裂痕線CL之形成更加確實,亦可使刃前緣51自位置N2向位置N3e滑動之速度小於自位置N1至位置N2之速度。同樣地,亦可使於自位置N2至位置N3e施加至刃前緣51之負載大於在維持無裂痕狀態之範圍內自位置N1至位置N2之負載。 Further, in order to make the formation of the crack line CL more certain, the speed at which the blade leading edge 51 slides from the position N2 to the position N3e may be made smaller than the speed from the position N1 to the position N2. Similarly, the load applied from the position N2 to the position N3e to the leading edge 51 of the blade can be made larger than the load from the position N1 to the position N2 in the range of maintaining the crack-free state.

藉由裂痕線CL,使得於溝槽線TL之下方,玻璃基板4於 與溝槽線TL之延伸方向(圖8中之橫方向)交叉之方向DC(圖9)連續性之連接中斷。此處所謂「連續性之連接」,換言之,係指不由裂痕遮蔽之連接。再者,於如上所述連續性之連接中斷之狀態中,亦可經由裂痕線CL之裂痕而使玻璃基板4之部分彼此接觸。又,亦可於溝槽線TL之正下方殘留少許連續性之連接。 By the crack line CL, under the trench line TL, the glass substrate 4 is The connection of the continuity DC (Fig. 9) in the direction in which the groove line TL extends (the horizontal direction in Fig. 8) is interrupted. Here, "continuous connection" means, in other words, a connection that is not obscured by cracks. Further, in the state in which the continuous connection is interrupted as described above, the portions of the glass substrate 4 may be brought into contact with each other via the crack of the crack line CL. Further, a slight continuous connection may be left immediately below the groove line TL.

裂痕線CL(圖8)沿著溝槽線TL(圖6)而伸展之方向(圖8之箭頭)與形成有溝槽線TL之方向(圖6之箭頭)相反。為了利用此種方向關係產生裂痕線CL,於為了形成溝槽線TL而將刃前緣51向方向DB(圖1)滑動時,較佳為,使角度AG2小於角度AG1。若不滿足該角度關係,則不易產生裂痕線CL。又,若角度AG1及角度AG2大致相同,則是否產生裂痕線CL容易變得不穩定。 The direction in which the crack line CL (Fig. 8) extends along the groove line TL (Fig. 6) (arrow of Fig. 8) is opposite to the direction in which the groove line TL is formed (arrow of Fig. 6). In order to generate the crack line CL by such a directional relationship, it is preferable to make the angle AG2 smaller than the angle AG1 when the blade leading edge 51 is slid in the direction DB (FIG. 1) in order to form the groove line TL. If the angle relationship is not satisfied, the crack line CL is less likely to occur. Moreover, if the angle AG1 and the angle AG2 are substantially the same, whether or not the crack line CL is generated tends to be unstable.

其次,於步驟S60(圖5)中,沿著裂痕線CL分斷玻璃基板4。即,進行所謂之斷裂步驟。斷裂步驟可藉由對玻璃基板4施加外力而進行。例如,藉由朝向玻璃基板4之上表面SF1上之裂痕線CL(圖9)將應力施加構件(例如,稱為「斷裂棒」之構件)壓抵於下表面SF2上,而將如打開裂痕線CL之裂痕之應力向玻璃基板4施加。再者,於裂痕線CL於其形成時於厚度方向DT完全前進之情形時,裂痕線CL之形成與玻璃基板4之分斷同時產生。 Next, in step S60 (Fig. 5), the glass substrate 4 is separated along the crack line CL. That is, a so-called breaking step is performed. The breaking step can be performed by applying an external force to the glass substrate 4. For example, a stress applying member (for example, a member called a "breaking bar") is pressed against the lower surface SF2 toward the crack line CL (FIG. 9) on the upper surface SF1 of the glass substrate 4, and the crack is opened, for example. The stress of the crack of the line CL is applied to the glass substrate 4. Further, in the case where the crack line CL is completely advanced in the thickness direction DT at the time of its formation, the formation of the crack line CL is simultaneously generated with the division of the glass substrate 4.

根據以上內容進行玻璃基板4之分斷。再者,上述裂痕線CL之形成步驟與所謂之斷裂步驟本質上不同。斷裂步驟係藉由將已經形成之裂痕於厚度方向進而伸展而將基板完全地分離者。另一方面,裂痕線CL之形成步驟帶來自藉由溝槽線TL之形成而獲得之無裂痕狀態向具有裂痕 之狀態的變化。認為該變化係藉由無裂痕狀態所具有之內部應力之釋放而產生。 The division of the glass substrate 4 is performed based on the above. Furthermore, the step of forming the crack line CL described above is substantially different from the so-called breaking step. The rupture step is to completely separate the substrate by stretching the already formed cracks in the thickness direction. On the other hand, the step of forming the crack line CL is from a crack-free state obtained by the formation of the groove line TL to a crack The change in state. This change is thought to be produced by the release of internal stresses in the crack-free state.

(比較例1) (Comparative Example 1)

參照圖10,本比較例之刃前緣59之頂點PP設置於4個面SE1~SE4相交之部位。自頂點PP設置有4個稜線PS1~PS4。於該情形時,於圖6之步驟中,可將玻璃基板4之上表面SF1之邊緣ED利用稜線PS1~PS4之任一者切下。因此,與本實施形態同樣地,具有容易確實地形成裂痕線CL之優點。另一方面,刃前緣59之形成需要較高之加工精度,因此具有其形成並不容易之缺點。其原因在於,如本比較例般於由面SE1~SE4相交之部位設置刃前緣之頂點PP之情形時,必須以通過該等之中3個面相交之點之方式,使剩餘之1個面之位置一致。 Referring to Fig. 10, the apex PP of the blade leading edge 59 of this comparative example is set at a portion where the four faces SE1 to SE4 intersect. The vertices PP are provided with four ridge lines PS1 to PS4. In this case, in the step of FIG. 6, the edge ED of the upper surface SF1 of the glass substrate 4 can be cut by any of the ridge lines PS1 to PS4. Therefore, similarly to the present embodiment, there is an advantage that the crack line CL can be easily formed reliably. On the other hand, the formation of the leading edge 59 requires a high degree of processing accuracy, and therefore has the disadvantage that it is not easy to form. The reason for this is that, in the case where the vertex PP of the blade leading edge is provided in the portion where the surfaces SE1 to SE4 intersect as in the present comparative example, the remaining one must be made by passing the points where the three faces intersect. The position of the face is the same.

(比較例2) (Comparative Example 2)

於本比較例中,將刃前緣51之滑動方向設為與方向DB(圖1)相反者。於該情形時,於圖6之步驟中,由頂面SD1並非稜線PS切下玻璃基板4之上表面SF1之邊緣ED。即,於切下時,於上述本實施形態中銳利之稜線PS起作用,相對於此,於本比較例中,平坦之頂面SD1起作用。因此,於本比較例中,變得不易產生成為裂痕線CL之形成開始之契機的微細之破壞。因此,確實地不易形成裂痕線CL。 In the present comparative example, the sliding direction of the blade leading edge 51 is set to be opposite to the direction DB (FIG. 1). In this case, in the step of FIG. 6, the edge ED of the upper surface SF1 of the glass substrate 4 is cut by the top surface SD1 instead of the ridge line PS. That is, in the case of cutting, the sharp ridge line PS acts in the above-described embodiment, whereas in the comparative example, the flat top surface SD1 functions. Therefore, in the comparative example, it is difficult to cause fine breakage which is a trigger for the formation of the crack line CL. Therefore, it is indeed difficult to form the crack line CL.

(實施例及比較例3) (Examples and Comparative Example 3)

圖11係概略性地表示本實施形態之實施例之玻璃基板4之分斷形狀之側視圖。圖12係概略性地表示比較例3之玻璃基板4之分斷形狀之側視圖。被分斷之玻璃基板4之厚度設為0.1mm。藉由分斷玻璃基板4而獲得之面 (以下,亦稱為「分斷面」)對應於圖11及圖12之右邊,且係基於藉由雷射顯微鏡而獲得之表面分佈,強調分斷面之高度差而描繪者。分斷時所使用之刃前緣51之稜線PS(圖3)於實施例中設為未經倒角加工者,於比較例3中設為經倒角處理者。稜線PS之曲率半徑於實施例中為0.6μm,於比較例3中為3.9μm。 Fig. 11 is a side view schematically showing the breaking shape of the glass substrate 4 of the embodiment of the embodiment. Fig. 12 is a side view schematically showing the breaking shape of the glass substrate 4 of Comparative Example 3. The thickness of the glass substrate 4 to be divided was set to 0.1 mm. The surface obtained by breaking the glass substrate 4 (hereinafter, also referred to as "cross-section") corresponds to the right side of FIGS. 11 and 12, and is based on the surface distribution obtained by a laser microscope, and emphasizes the height difference of the cross-section. The ridge line PS (Fig. 3) of the blade leading edge 51 used at the time of breaking is assumed to be a non-chamfering process in the embodiment, and is subjected to a chamfering process in Comparative Example 3. The radius of curvature of the ridge line PS was 0.6 μm in the examples and 3.9 μm in the comparative example 3.

實施例之分斷面與比較例3之分斷面相比,相對於上表面SF1之直角度良好。又,實施例之分斷面與比較例3之分斷面相比,平坦度良好。具體而言,分斷面之高度差係於實施例中為0.5μm,於比較例3中為2.3μm。此處所謂「高度差」,係指分斷面之表面分佈中最低之位置與最高之位置之差。如此,推測實施例與比較例3相比可獲得良好之分斷面之理由在於由於稜線PS之曲率半徑較小,而形成溝槽線TL時對玻璃基板4賦予之內部應力更局部地集中而賦予。 The cross-section of the example was better than the cross-section of Comparative Example 3, and the straight angle with respect to the upper surface SF1 was good. Further, the cross-section of the example was superior to the cross-section of Comparative Example 3 in flatness. Specifically, the height difference of the cross-section was 0.5 μm in the examples and 2.3 μm in Comparative Example 3. The term "height difference" as used herein refers to the difference between the lowest position and the highest position in the surface distribution of the sectional section. Thus, it is presumed that the reason why a good cross-section is obtained in comparison with the comparative example 3 is that the internal stress applied to the glass substrate 4 is more locally concentrated when the groove line TL is formed because the radius of curvature of the ridge line PS is small. Give.

(效果之總結) (summary of effects)

根據本實施形態,可容易地準備刃前緣51。其第1理由在於,與上述比較例1不同,刃前緣51之頂點係作為頂面SD1、側面SD2及側面SD3之3個面相交之部位而設置。假設,於藉由超過3個面相交之部位設置刃前緣之頂點之情形時,必須以通過3個面相交之點之方式,使剩餘之面之位置一致。因此,需要較高之加工精度。相對於此,於藉由3個面相交之部位設置刃前緣之頂點之情形時,並不需要那麼高之加工精度。第2理由在於,刃前緣51之稜線PS為未經倒角加工者。藉此,與刃前緣51之稜線PS為經倒角加工者之情形時相比,可容易地準備刃前緣51。若自其他觀點觀察該情況,則其原因在於,刃前緣51於與稜線PS垂直之剖面中具有2μm 以下,較佳為1μm以下之曲率半徑。此種曲率半徑係僅藉由於形成稜線PS之一對面形成之後,控制相對於稜線PS之倒角加工而可容易地獲得。因此,可容易地準備刃前緣51。 According to this embodiment, the blade leading edge 51 can be easily prepared. The first reason is that, unlike the first comparative example 1, the apex of the blade leading edge 51 is provided as a portion where the three faces of the top surface SD1, the side surface SD2, and the side surface SD3 intersect. It is assumed that when the apex of the blade leading edge is provided by a portion where more than three faces intersect, it is necessary to make the positions of the remaining faces coincide by the point where the three faces intersect. Therefore, higher processing accuracy is required. On the other hand, when the apex of the blade leading edge is provided by the portion where the three faces intersect, the processing precision is not required to be high. The second reason is that the ridge line PS of the blade leading edge 51 is a person who has not been chamfered. Thereby, the blade leading edge 51 can be easily prepared as compared with the case where the ridge line PS of the blade leading edge 51 is a chamfered processor. If the situation is observed from other viewpoints, the reason is that the blade leading edge 51 has 2 μm in the cross section perpendicular to the ridge line PS. Hereinafter, the radius of curvature of 1 μm or less is preferable. Such a radius of curvature can be easily obtained by controlling the chamfering process with respect to the ridge line PS only after the opposite side of the ridge line PS is formed. Therefore, the blade leading edge 51 can be easily prepared.

進而,根據本實施形態,藉由使用無裂痕劃刻技術,可降低對刃前緣51之負載。藉此,可一面進行以頂面SD1為前側且以稜線PS為後側之滑動,一面確保刃前緣51之充分之壽命。 Further, according to the present embodiment, the load on the leading edge 51 of the blade can be reduced by using the crack-free scribe technique. Thereby, the sufficient life of the blade leading edge 51 can be ensured while the top surface SD1 is the front side and the ridge line PS is the rear side.

進而,根據本實施形態,與進行了相對於稜線PS之倒角加工之比較例3相比,獲得良好之分斷面。具體而言,獲得相對於上表面SF1之直角度良好之分斷面。又,獲得平坦度良好之分斷面。 Further, according to the present embodiment, a good cross section is obtained as compared with Comparative Example 3 in which chamfering is performed with respect to the ridge line PS. Specifically, a cross section having a good straight angle with respect to the upper surface SF1 is obtained. Further, a cross section having a good flatness is obtained.

進而,根據本實施形態,可更確實地形成沿著溝槽線TL之裂痕線CL。其第1理由在於,與上述比較例2不同,為了形成溝槽線TL而滑動之刃前緣51之稜線PS切下玻璃基板4之上表面SF1之邊緣ED。第2理由在於,如此進行切下之稜線PS未倒角,或具有2μm以下之曲率半徑,故而成為銳利之狀態。藉由銳利之稜線PS切下玻璃基板4之上表面SF1之邊緣ED,可更確實地形成裂痕線CL。 Further, according to the present embodiment, the crack line CL along the groove line TL can be formed more reliably. The first reason is that, unlike the above-described Comparative Example 2, the edge line ED of the upper surface SF1 of the glass substrate 4 is cut by the ridge line PS of the blade leading edge 51 which is slid to form the groove line TL. The second reason is that the ridge line PS thus cut is not chamfered or has a radius of curvature of 2 μm or less, so that it is in a sharp state. The crack line CL can be formed more surely by cutting the edge ED of the upper surface SF1 of the glass substrate 4 by the sharp ridge line PS.

<實施形態2> <Embodiment 2>

再次,參照圖6,於本實施形態中,對在玻璃基板4之上表面SF1上刃前緣51會滑動之位置供給潤滑劑。換言之,形成溝槽線TL(圖6)之步驟(圖5:步驟S30)如圖13所示,包含供給潤滑劑之步驟S31、及於供給有潤滑劑之位置使刃前緣51滑動之步驟S32。為了實施步驟S31,例如,只要於柄52(圖1)設置潤滑劑供給部(未圖示)即可。再者,關於該等以外之構成,由於與上述實施形態1之構成大致相同,故而不重複其說明。又, 步驟S31亦能夠應用於下述實施形態3~5。 Referring to Fig. 6, in the present embodiment, a lubricant is supplied to a position where the blade leading edge 51 slides on the upper surface SF1 of the glass substrate 4. In other words, the step of forming the groove line TL (Fig. 6) (Fig. 5: step S30), as shown in Fig. 13, includes the step S31 of supplying the lubricant, and the step of sliding the blade leading edge 51 at the position where the lubricant is supplied. S32. In order to carry out step S31, for example, a lubricant supply unit (not shown) may be provided in the shank 52 (Fig. 1). Incidentally, the configuration other than the above is substantially the same as the configuration of the above-described first embodiment, and thus the description thereof will not be repeated. also, Step S31 can also be applied to the following embodiments 3 to 5.

於本實施形態中,與實施形態1同樣,選擇方向DB(圖1)作為刃前緣51之前進方向。於對刃前緣51之負載相同之條件下,向方向DB之滑動與向其相反方向之滑動相比,對刃前緣51之損傷容易變大。根據本實施形態,可有效地抑制該損傷。藉此,可延長刃前緣之壽命。 In the present embodiment, as in the first embodiment, the direction DB (Fig. 1) is selected as the forward direction of the blade leading edge 51. Under the condition that the load on the leading edge 51 of the blade is the same, the sliding in the direction DB is more likely to cause damage to the leading edge 51 of the blade than in the opposite direction. According to this embodiment, the damage can be effectively suppressed. Thereby, the life of the leading edge of the blade can be extended.

<實施形態3> <Embodiment 3>

參照圖14,於步驟S10(圖5)中,準備與上述實施形態1同樣之玻璃基板4。但是,於本實施形態中,於玻璃基板4之上表面SF1上設置有輔助線AL。參照圖15,輔助線AL具有輔助溝槽線TLa及輔助裂痕線CLa。輔助溝槽線TLa具有槽形狀。輔助裂痕線CLa係藉由厚度方向DT之玻璃基板4之裂痕沿著輔助溝槽線TLa延伸而構成。 Referring to Fig. 14, in step S10 (Fig. 5), the same glass substrate 4 as in the first embodiment described above is prepared. However, in the present embodiment, the auxiliary line AL is provided on the upper surface SF1 of the glass substrate 4. Referring to Fig. 15, the auxiliary line AL has an auxiliary groove line TLa and an auxiliary crack line CLa. The auxiliary groove line TLa has a groove shape. The auxiliary crack line CLa is formed by extending a crack of the glass substrate 4 in the thickness direction DT along the auxiliary groove line TLa.

於本實施形態中,輔助線AL係藉由同時形成輔助溝槽線TLa及輔助裂痕線CLa之步驟而設置於玻璃基板4之上表面SF1。此種輔助線AL可藉由通常之典型性之切割方法而形成。例如,此種輔助線AL如圖14之箭頭所示,可藉由將刃前緣擱置於玻璃基板4之上表面SF1之邊緣ED,然後使其於上表面SF1上移動而進行。藉由擱置時之衝擊而產生微細之裂痕,從而,於形成輔助溝槽線TLa時,能夠容易地同時形成輔助裂痕線CLa。為了抑制對擱置時之刃前緣及玻璃基板4之損傷,該刃前緣較佳為具有與刃前緣51之形狀不同之適合於擱置之形狀者。具體而言,刃前緣較佳為能夠旋動地保持者(輪型者)。換言之,刃前緣較佳為於玻璃基板4上旋動者而並非滑動者。再者,輔助線AL之起點於圖14中為邊緣ED,但亦可自邊緣ED離開。 In the present embodiment, the auxiliary line AL is provided on the upper surface SF1 of the glass substrate 4 by the step of simultaneously forming the auxiliary groove line TLa and the auxiliary crack line CLa. Such an auxiliary line AL can be formed by a typical typical cutting method. For example, such an auxiliary line AL can be carried out by placing the leading edge of the blade on the edge ED of the upper surface SF1 of the glass substrate 4 and then moving it on the upper surface SF1 as indicated by the arrow of FIG. The fine crack is generated by the impact at the time of the rest, so that the auxiliary crack line CLa can be easily formed simultaneously when the auxiliary groove line TLa is formed. In order to suppress damage to the leading edge of the blade and the glass substrate 4 during the rest, the leading edge of the blade preferably has a shape suitable for rest depending on the shape of the leading edge 51 of the blade. Specifically, the leading edge of the blade is preferably a holder that can be rotated (wheel type). In other words, the leading edge of the blade is preferably rotated on the glass substrate 4 rather than being a slider. Furthermore, the starting point of the auxiliary line AL is the edge ED in FIG. 14, but it can also be separated from the edge ED.

其次,於步驟S20(圖5)中,準備與實施形態1同樣之刃前緣51。再者,為了使上述輔助線AL用之刃前緣之準備容易,亦可使用該刃前緣51形成上述之輔助線AL。或者,亦可使用具有與刃前緣51之形狀同樣之形狀之刃前緣形成上述輔助線AL。 Next, in step S20 (Fig. 5), the blade leading edge 51 similar to that of the first embodiment is prepared. Further, in order to facilitate the preparation of the leading edge of the auxiliary line AL for the blade, the blade leading edge 51 may be used to form the above-described auxiliary line AL. Alternatively, the auxiliary line AL may be formed using a blade leading edge having the same shape as the shape of the blade leading edge 51.

參照圖16,其次,於步驟S30(圖5)中形成溝槽線TL。具體而言,進行以下之步驟。 Referring to Fig. 16, second, a groove line TL is formed in step S30 (Fig. 5). Specifically, the following steps are performed.

首先,進行與實施形態1同樣之動作。具體而言,於位置N1將刃前緣51(圖1)之頂點PP壓抵於上表面SF1。其次,使經壓抵之刃前緣51於玻璃基板4之上表面SF1上向方向DB(圖1)滑動(參照圖16之箭頭)。藉此,溝槽線TL以無裂痕狀態形成於上表面SF1上。 First, the same operation as in the first embodiment is performed. Specifically, the vertex PP of the blade leading edge 51 (FIG. 1) is pressed against the upper surface SF1 at the position N1. Next, the pressed blade leading edge 51 is slid in the direction DB (FIG. 1) on the upper surface SF1 of the glass substrate 4 (see an arrow in FIG. 16). Thereby, the groove line TL is formed on the upper surface SF1 in a crack-free state.

於本實施形態中,溝槽線TL之形成係藉由使刃前緣51於位置N1及位置N3a之間自位置N1經由位置N2向位置N3a滑動而進行。位置N3a配置於輔助線AL上。位置N2配置於位置N1與位置N3a之間。較佳為,刃前緣51超過輔助線AL上之位置N3a進而滑動至位置N4為止。較佳為,位置N4自邊緣ED離開。 In the present embodiment, the groove line TL is formed by sliding the blade leading edge 51 between the position N1 and the position N3a from the position N1 to the position N3a via the position N2. The position N3a is arranged on the auxiliary line AL. The position N2 is disposed between the position N1 and the position N3a. Preferably, the leading edge 51 of the blade exceeds the position N3a on the auxiliary line AL and then slides to the position N4. Preferably, position N4 exits from edge ED.

為了形成溝槽線TL,如上所述滑動之刃前緣51於位置N3a與輔助線AL交叉。因此,刃前緣51之稜線PS(圖1)亦與輔助線AL交叉。藉由該交叉而於位置N3a產生微細之破壞。以該破壞為起點,而以釋放溝槽線TL附近之內部應力之方式產生裂痕。具體而言,厚度方向DT之玻璃基板4之裂痕自位於輔助線AL上之位置N3a沿著溝槽線TL伸展(參照圖17之箭頭)。換言之,裂痕線CL自藉由刃前緣51之稜線PS而交叉之輔助線AL,沿著溝槽線TL伸展。藉此,作為步驟S50(圖5),自位置N3a 向位置N1形成裂痕線CL。於形成裂痕線CL之後,與實施形態1同樣,藉由裂痕線CL,使得於溝槽線TL之下方,玻璃基板4於與溝槽線TL交叉之方向連續性之連接中斷。 In order to form the groove line TL, the leading edge 51 of the sliding edge as described above intersects the auxiliary line AL at the position N3a. Therefore, the ridge line PS (Fig. 1) of the blade leading edge 51 also intersects the auxiliary line AL. By this intersection, fine destruction occurs at the position N3a. The break is used as a starting point, and a crack is generated in such a manner as to release the internal stress near the groove line TL. Specifically, the crack of the glass substrate 4 in the thickness direction DT extends from the groove line TL from the position N3a located on the auxiliary line AL (refer to the arrow of FIG. 17). In other words, the crack line CL extends along the groove line TL from the auxiliary line AL which is crossed by the ridge line PS of the blade leading edge 51. Thereby, as step S50 (Fig. 5), from position N3a A crack line CL is formed toward the position N1. After the crack line CL is formed, in the same manner as in the first embodiment, the connection of the glass substrate 4 in the direction intersecting the groove line TL is interrupted by the crack line CL.

刃前緣51到達位置N3a之後,自玻璃基板4離開。較佳為,刃前緣51超過位置N3a滑動至位置N4為止之後,自玻璃基板4離開。 After the blade leading edge 51 reaches the position N3a, it leaves from the glass substrate 4. Preferably, the blade leading edge 51 is separated from the glass substrate 4 after the position N3a has slid to the position N4.

其次,於步驟S60(圖5)中,與實施形態1同樣地,沿著裂痕線CL分斷玻璃基板4。根據以上內容,進行本實施形態之玻璃基板4之分斷方法。 Next, in step S60 (FIG. 5), the glass substrate 4 is cut along the crack line CL in the same manner as in the first embodiment. Based on the above, the method of dividing the glass substrate 4 of the present embodiment is performed.

根據本實施形態,與實施形態1同樣地,可更確實地形成沿著溝槽線TL之裂痕線CL。其原因在於,為了形成溝槽線TL而滑動之刃前緣51之稜線PS向設置於玻璃基板4之上表面SF1之輔助線AL與藉由滑動之刃前緣51之頂點而形成之溝槽線TL交叉的位置N3a(圖16)局部地施加應力。藉由該應力施加,而以較高之確實性獲得裂痕線CL之形成開始之契機。另外,獲得與實施形態1大致同樣之效果。 According to the present embodiment, as in the first embodiment, the crack line CL along the groove line TL can be formed more reliably. The reason for this is that the ridge line PS of the blade leading edge 51 which slides to form the groove line TL is directed to the auxiliary line AL provided on the upper surface SF1 of the glass substrate 4 and the groove formed by the apex of the leading edge 51 of the sliding blade. The position N3a (Fig. 16) where the line TL intersects locally applies stress. By the application of the stress, the start of the formation of the crack line CL is obtained with higher certainty. Further, substantially the same effects as those of the first embodiment were obtained.

<實施形態4> <Embodiment 4>

於本實施形態中,與實施形態3不同,輔助線AL(圖15及圖16)所具有之輔助溝槽線TLa及輔助裂痕線CLa之各者係藉由類似於實施形態1中所說明之溝槽線TL及裂痕線CL之形成方法的方法而形成。以下,對該方法具體地進行說明。 In the present embodiment, unlike the third embodiment, each of the auxiliary groove line TLa and the auxiliary crack line CLa included in the auxiliary line AL (Figs. 15 and 16) is similar to that described in the first embodiment. It is formed by the method of forming the groove line TL and the crack line CL. Hereinafter, the method will be specifically described.

首先,準備使用於輔助線AL之形成之刃前緣。該刃前緣亦可與刃前緣51(圖1及圖2)相同。即,輔助線AL之形成與然後形成之溝槽線TL之形成亦可藉由共通之刃前緣51而進行。或者,作為用以形成輔 助線AL之刃前緣,亦可準備與刃前緣51不同之刃前緣(以下,稱為「輔助刃前緣」)。輔助刃前緣亦可具有與刃前緣51(圖1及圖2)之形狀相同之形狀。或者,輔助刃前緣亦可具有與刃前緣51之形狀不同之形狀。於輔助刃前緣具有與刃前緣51之形狀不同之形狀之情形時,較佳亦為,輔助刃前緣具有形成頂點PP及稜線PS之頂面SD1、側面SD2及側面SD3之構成,上述形狀之差異係由該等構成間之配置之差異所引起者。此處考慮之刃前緣之「形狀」係刃前緣中頂點PP附近之部分,即對玻璃基板4起作用之部分之形狀,自該作用部分離開之部分之形狀通常並不重要。以下,為了不贅述,存在將使用於輔助線AL之形成之刃前緣無論其為刃前緣51或者為輔助刃前緣均僅稱為「刃前緣」之情形。 First, the leading edge of the blade for forming the auxiliary line AL is prepared. The leading edge of the blade may be the same as the leading edge 51 of the blade (Figs. 1 and 2). That is, the formation of the auxiliary line AL and the formation of the groove line TL which is then formed can also be performed by the common blade leading edge 51. Or as a substitute The leading edge of the edge of the auxiliary wire AL can also be prepared with a blade leading edge different from the leading edge 51 (hereinafter referred to as "auxiliary blade leading edge"). The leading edge of the cutting edge may also have the same shape as the leading edge 51 (Figs. 1 and 2). Alternatively, the leading edge of the cutting edge may have a different shape than the shape of the leading edge 51 of the blade. In the case where the leading edge of the auxiliary blade has a shape different from the shape of the leading edge 51 of the blade, it is preferable that the leading edge of the auxiliary blade has a top surface SD1, a side surface SD2, and a side surface SD3 which form the apex PP and the ridge line PS, The difference in shape is caused by the difference in the configuration between the components. Here, the "shape" of the leading edge of the blade is the portion near the vertex PP in the leading edge of the blade, that is, the shape of the portion that acts on the glass substrate 4, and the shape of the portion away from the active portion is usually not important. Hereinafter, in order not to be described again, there is a case where the leading edge of the blade used for forming the auxiliary line AL is simply referred to as a "blade leading edge" regardless of whether it is the leading edge 51 or the leading edge of the auxiliary blade.

參照圖18,其次,藉由類似於溝槽線TL之形成(圖6)之方法,而以無裂痕狀態形成輔助溝槽線TLa。參照圖19,其次,藉由類似於沿著溝槽線TL之裂痕線CL之形成方法(圖8)之方法,而形成沿著輔助溝槽線TLa(圖18)之輔助溝槽線TLa。根據以上內容,形成輔助線AL(圖15)。 Referring to Fig. 18, second, the auxiliary groove line TLa is formed in a crack-free state by a method similar to the formation of the groove line TL (Fig. 6). Referring to Fig. 19, second, the auxiliary trench line TLa along the auxiliary trench line TLa (Fig. 18) is formed by a method similar to the method of forming the crack line CL along the groove line TL (Fig. 8). According to the above, the auxiliary line AL (Fig. 15) is formed.

其次,與實施形態3同樣地,於步驟S30及S50(圖5)中,形成溝槽線TL(圖16)及裂痕線CL(圖17),於步驟S60(圖5)中,沿著裂痕線CL分斷玻璃基板4。根據以上內容,進行本實施形態之玻璃基板4之分斷方法。 Next, in the same manner as in the third embodiment, the groove lines TL (Fig. 16) and the crack lines CL (Fig. 17) are formed in steps S30 and S50 (Fig. 5), and in step S60 (Fig. 5), along the cracks. The line CL separates the glass substrate 4. Based on the above, the method of dividing the glass substrate 4 of the present embodiment is performed.

於本實施形態中,於溝槽線TL(圖16)之形成時施加至刃前緣51之負載與於輔助溝槽線TLa(圖18)之形成時施加至刃前緣之負載相比較大。根據本發明者之實驗性之研究,藉由如此對負載設置差異,可 更確實地產生裂痕線CL(圖17)。 In the present embodiment, the load applied to the blade leading edge 51 at the time of formation of the groove line TL (Fig. 16) is larger than the load applied to the leading edge of the blade when the auxiliary groove line TLa (Fig. 18) is formed. . According to the experimental study by the inventors, by setting the difference in the load as described above, The crack line CL is more reliably produced (Fig. 17).

較佳為,溝槽線TL(圖16)之形成時之角度AG2(圖1)小於輔助溝槽線TLa之形成時之角度AG2(圖1)。藉由使用此種角度關係,尤其,即便於用以形成輔助溝槽線TLa之刃前緣為刃前緣51或者為具有與刃前緣51之形狀相同之形狀之輔助刃前緣之情形時,亦容易設置上述負載之差異。該理由在於,於刃前緣之形狀同樣之情形時,角度AG2越小,則能夠以無裂痕狀態形成溝槽線TL(或輔助溝槽線TLa)之負載越大。於溝槽線TL之形成時,若角度AG2過大,則難以同時實現以無裂痕狀態形成溝槽線TL與使用較輔助溝槽線TLa之形成時之負載更大之負載。相對於此,於溝槽線TL(圖16)之形成時之角度AG2(圖1)小於輔助溝槽線TLa之形成時之角度AG2(圖1)之情形時,於溝槽線TL之形成時,容易使用較輔助溝槽線TLa之形成時之負載更大之負載。因此,無須擔心對溝槽線TL用之刃前緣51應用面向高負載之刃前緣設計,且對輔助溝槽線TLa用之刃前緣應用面向低負載之刃前緣設計。因此,於輔助溝槽線TLa之形成時,可使用溝槽線TL之形成時所使用之刃前緣51或具有與其形狀相同之形狀之輔助刃前緣。 Preferably, the angle AG2 (Fig. 1) at the time of formation of the groove line TL (Fig. 16) is smaller than the angle AG2 (Fig. 1) at the time of formation of the auxiliary groove line TLA. By using such an angular relationship, in particular, even when the leading edge of the blade for forming the auxiliary groove line TLa is the blade leading edge 51 or the auxiliary blade leading edge having the same shape as the blade leading edge 51 It is also easy to set the difference in the above load. This reason is that, in the case where the shape of the leading edge of the blade is the same, the smaller the angle AG2 is, the larger the load of the groove line TL (or the auxiliary groove line TLA) can be formed without cracking. When the groove line TL is formed, if the angle AG2 is excessively large, it is difficult to simultaneously achieve a load in which the groove line TL is formed in a crack-free state and the load is larger when the auxiliary groove line TLA is formed. On the other hand, when the angle AG2 (FIG. 1) at the time of formation of the groove line TL (FIG. 16) is smaller than the angle AG2 (FIG. 1) at the time of formation of the auxiliary groove line TLA, the formation of the groove line TL At the time, it is easy to use a load with a larger load than when the auxiliary trench line TLA is formed. Therefore, there is no need to worry about applying a blade leading edge design for the high load to the leading edge 51 of the groove line TL, and applying a blade leading edge design for the low load on the leading edge of the auxiliary groove line TLa. Therefore, at the time of forming the auxiliary groove line TLA, the blade leading edge 51 used in the formation of the groove line TL or the auxiliary blade leading edge having the same shape as that of the groove line TL can be used.

於如上所述對角度AG2(圖1)設置差異之情形時,作為用以形成輔助溝槽線TLa之刃前緣,較佳為,與用以形成溝槽線TL之刃前緣51不同地,準備輔助刃前緣。藉此,可於刃前緣51之角度AG2適合於溝槽線TL之形成之狀態下固定刃前緣51之姿勢。換言之,於輔助溝槽線TLa之形成步驟與溝槽線TL之形成步驟之間,不需要用以使角度AG2最佳化之刃前緣51之姿勢調整。 When the difference is set to the angle AG2 (FIG. 1) as described above, it is preferable that the leading edge of the blade for forming the auxiliary groove line TLa is different from the leading edge 51 of the blade for forming the groove line TL. , prepare the auxiliary blade leading edge. Thereby, the posture of the blade leading edge 51 can be fixed in the state where the angle AG2 of the blade leading edge 51 is suitable for the formation of the groove line TL. In other words, between the step of forming the auxiliary groove line TLa and the step of forming the groove line TL, the posture adjustment of the blade leading edge 51 for optimizing the angle AG2 is not required.

<實施形態5> <Embodiment 5>

參照圖20及圖21,於本實施形態中,於溝槽線TL之形成時使用刃前緣51,於輔助溝槽線TLa之形成時,使用輔助刃前緣51a作為實施形態4中所說明之輔助刃前緣。刃前緣51之形狀與輔助刃前緣51a之形狀相互不同。例如,於頂點PP(參照圖2)之附近,刃前緣51及輔助刃前緣51a之各者具有與稜線PS垂直之剖面之稜線PS之角度AP及APa,角度AP大於角度APa。再者,關於該等以外之構成,由於與上述實施形態4之構成大致相同,故而不重複其說明。 Referring to Fig. 20 and Fig. 21, in the present embodiment, the blade leading edge 51 is used for forming the groove line TL, and the auxiliary blade leading edge 51a is used as the fourth embodiment for forming the auxiliary groove line TLA. The leading edge of the auxiliary blade. The shape of the blade leading edge 51 and the shape of the auxiliary blade leading edge 51a are different from each other. For example, in the vicinity of the apex PP (see FIG. 2), each of the blade leading edge 51 and the auxiliary blade leading edge 51a has an angle AP and an angle APa of the ridge line PS of the cross section perpendicular to the ridge line PS, and the angle AP is larger than the angle APa. Incidentally, the configuration other than the above is substantially the same as the configuration of the above-described fourth embodiment, and thus the description thereof will not be repeated.

根據本實施形態,於輔助溝槽線TLa之形成時與溝槽線TL之形成時,使用具有不同之形狀之刃前緣。藉此,作為刃前緣之形狀,於輔助溝槽線TLa及溝槽線TL之各者之形成時,可使用適合相對低低負載者及適合高負載者。因此,於輔助溝槽線TLa及溝槽線TL之形成時可更確實地獲得無裂痕狀態,且可自輔助溝槽線TLa及溝槽線TL之各者更確實地產生輔助裂痕線CLa及裂痕線CL。 According to the present embodiment, when the auxiliary groove line TLA is formed and the groove line TL is formed, a blade leading edge having a different shape is used. Therefore, as the shape of the leading edge of the blade, when each of the auxiliary groove line TLa and the groove line TL is formed, a suitable low load and a low load can be used. Therefore, the crack-free state can be more surely obtained when the auxiliary trench line TLA and the trench line TL are formed, and the auxiliary crack line CLa can be more reliably generated from each of the auxiliary trench line TLA and the trench line TL. Crack line CL.

再者,於上述各實施形態中對上表面SF1之邊緣為長方形狀之情形時進行了圖示,但亦可使用其他形狀。又,對上表面SF1平坦之情形時進行了說明,但上表面亦可彎曲。又,對溝槽線TL為直線狀之情形時進行了說明,但溝槽線TL亦可為曲線狀。又,對使用玻璃基板4作為脆性基板之情形時進行了說明,但脆性基板亦可由玻璃以外之脆性材料製作,例如,可由陶瓷、矽、化合物半導體、藍寶石或石英製作。 Further, in the above embodiments, the case where the edge of the upper surface SF1 is formed in a rectangular shape is illustrated, but other shapes may be used. Further, the case where the upper surface SF1 is flat is described, but the upper surface may be curved. Further, the case where the groove line TL is linear is described, but the groove line TL may have a curved shape. Further, although the case where the glass substrate 4 is used as the brittle substrate has been described, the brittle substrate may be made of a brittle material other than glass, and may be made of, for example, ceramic, germanium, compound semiconductor, sapphire or quartz.

AG1‧‧‧角度 AG1‧‧‧ angle

AG2‧‧‧角度 AG2‧‧‧ angle

AX‧‧‧軸向 AX‧‧‧ axial

DB‧‧‧方向 DB‧‧‧ direction

DT‧‧‧厚度方向 DT‧‧‧ thickness direction

ED‧‧‧邊緣 Edge of ED‧‧

PP‧‧‧頂點 PP‧‧‧ vertex

PS‧‧‧稜線 PS‧‧‧ ridgeline

SD1‧‧‧頂面(第1面) SD1‧‧‧ top surface (1st side)

SD3‧‧‧側面(第3面) SD3‧‧‧ side (3rd side)

SF1‧‧‧上表面(一個面) SF1‧‧‧ upper surface (one side)

SF2‧‧‧下表面(另一個面) SF2‧‧‧ lower surface (the other side)

4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)

50‧‧‧切割器具 50‧‧‧ cutting instruments

51‧‧‧刃前緣 51‧‧‧blade front

52‧‧‧柄 52‧‧‧ handle

Claims (4)

一種脆性基板之分斷方法,其具備如下步驟:a)準備具有一個面及與上述一個面垂直之厚度方向之脆性基板;進而具備如下步驟:b)準備刃前緣,上述刃前緣具有:第1面;第2面,其與上述第1面相鄰;及第3面,其藉由與上述第2面相鄰而形成稜線且藉由與上述第1面及上述第2面之各者相鄰而形成頂點;上述稜線係未經倒角加工者;進而具備如下步驟:c)藉由於上述脆性基板之上述一個面上使上述刃前緣向自上述稜線朝向上述第1面之方向滑動,而利用塑性變形使具有槽形狀之溝槽線形成於上述脆性基板之上述一個面上,上述溝槽線係以成為無裂痕狀態之方式形成,即,於上述溝槽線之下方,上述脆性基板於與上述溝槽線交叉之方向連續地連接之狀態;進而具備如下步驟:d)於上述步驟c)之後,藉由沿著上述溝槽線使上述厚度方向之上述脆性基板之裂痕伸展而形成裂痕線,藉由上述裂痕線,使得於上述溝槽線之下方,上述脆性基板於與上述溝槽線交叉之方向連續性之連接中斷;進而具備如下步驟:e)沿著上述裂痕線分斷上述脆性基板。 A method for breaking a brittle substrate, comprising the steps of: a) preparing a brittle substrate having a surface and a thickness direction perpendicular to the one surface; and further comprising the steps of: b) preparing a blade leading edge, the blade leading edge having: a first surface; a second surface adjacent to the first surface; and a third surface formed by a ridge line adjacent to the second surface and each of the first surface and the second surface The ridge line is adjacent to the apex; the ridge line is not chamfered; and further comprising: c) causing the edge of the blade to face the ridge line from the ridge line on the one surface of the brittle substrate Sliding, and forming a groove line having a groove shape on the one surface of the brittle substrate by plastic deformation, wherein the groove line is formed in a non-cracked state, that is, below the groove line, a state in which the brittle substrate is continuously connected in a direction intersecting the groove line; and further comprising the step of: d) extending the crack of the brittle substrate in the thickness direction along the groove line after the step c) And forming a crack line, wherein the fragile substrate is interrupted in a direction perpendicular to the groove line by the crack line; and further comprising the following steps: e) along the crack line The above brittle substrate is separated. 一種脆性基板之分斷方法,其具備如下步驟: a)準備具有一個面及與上述一個面垂直之厚度方向之脆性基板;進而具備如下步驟:b)準備刃前緣,上述刃前緣具有:第1面;第2面,其與上述第1面相鄰;及第3面,其藉由與上述第2面相鄰而形成稜線且藉由與上述第1面及上述第2面之各者相鄰而形成頂點;上述刃前緣係於與上述稜線垂直之剖面中具有2μm以下之曲率半徑;進而具備如下步驟:c)藉由於上述脆性基板之上述一個面上使上述刃前緣向自上述稜線朝向上述第1面之方向滑動,而利用塑性變形使具有槽形狀之溝槽線形成於上述脆性基板之上述一個面上,上述溝槽線係以成為無裂痕狀態之方式形成,即,於上述溝槽線之下方,上述脆性基板於與上述溝槽線交叉之方向連續地連接之狀態;進而具備如下步驟:d)於上述步驟c)之後,藉由沿著上述溝槽線使上述厚度方向之上述脆性基板之裂痕伸展,而形成裂痕線,藉由上述裂痕線,使得於上述溝槽線之下方,上述脆性基板於與上述溝槽線交叉之方向連續性之連接中斷;進而具備如下步驟:e)沿著上述裂痕線分斷上述脆性基板。 A method for breaking a brittle substrate, which has the following steps: a) preparing a brittle substrate having one surface and a thickness direction perpendicular to the one surface; and further comprising the steps of: b) preparing a leading edge of the blade, the leading edge of the blade having a first surface; a second surface, and the first surface And a third surface formed by forming a ridge line adjacent to the second surface and adjacent to each of the first surface and the second surface; the front edge of the blade is The cross section perpendicular to the ridge line has a radius of curvature of 2 μm or less, and further includes the step of: c) sliding the leading edge of the blade toward the first surface from the ridge line on the one surface of the brittle substrate Forming a groove line having a groove shape on the one surface of the brittle substrate by plastic deformation, and the groove line is formed in a non-cracked state, that is, below the groove line, the brittle substrate is a state in which the direction intersecting the groove line is continuously connected; and further comprising the step of: d) extending the crack of the brittle substrate in the thickness direction along the groove line after the step c) a crack line, wherein the brittle substrate is discontinuously connected to the groove line in a direction perpendicular to the groove line by the crack line; and further comprising the following steps: e) along the crack line The above brittle substrate is broken. 如申請專利範圍第1或2項之脆性基板之分斷方法,其中上述步驟d)包含如下步驟:藉由上述步驟c)而滑動之上述刃前緣之上述稜線切下上述脆性基 板之上述一個面之邊緣;及上述裂痕線自藉由上述刃前緣之上述稜線而切下之上述邊緣沿著上述溝槽線伸展。 The method for breaking a brittle substrate according to claim 1 or 2, wherein the step d) comprises the step of: cutting the brittle base by the ridge of the leading edge of the blade which is slid by the above step c) An edge of the one surface of the plate; and the edge of the crack line extending from the edge line by the ridge line of the leading edge of the blade. 如申請專利範圍第1或2項之脆性基板之分斷方法,其中上述步驟a)包含形成輔助線之步驟,上述輔助線具有:輔助溝槽線,其於上述脆性基板之上述一個面上具有槽形狀;及輔助裂痕線,其係藉由上述厚度方向之上述脆性基板之裂痕沿著上述輔助溝槽線延伸而構成;上述步驟d)包含如下步驟:藉由上述步驟c)而滑動之上述刃前緣之上述稜線與設置於上述脆性基板之上述一個面上之上述輔助線交叉;及上述裂痕線自藉由上述刃前緣之上述稜線而交叉之上述輔助線沿著上述溝槽線伸展。 The method for breaking a brittle substrate according to claim 1 or 2, wherein the step a) comprises the step of forming an auxiliary line, the auxiliary line having: an auxiliary groove line having the one surface of the brittle substrate a groove shape; and an auxiliary crack line formed by extending the crack of the brittle substrate in the thickness direction along the auxiliary groove line; and the step d) includes the step of: sliding the above by the step c) The ridge line of the leading edge of the blade intersects with the auxiliary line provided on the one surface of the brittle substrate; and the crack line extends along the groove line from the auxiliary line intersecting by the ridge line of the blade leading edge .
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