TW201736011A - Automatic component segregator enabled with a smart diode testing kits - Google Patents

Automatic component segregator enabled with a smart diode testing kits Download PDF

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Publication number
TW201736011A
TW201736011A TW105138808A TW105138808A TW201736011A TW 201736011 A TW201736011 A TW 201736011A TW 105138808 A TW105138808 A TW 105138808A TW 105138808 A TW105138808 A TW 105138808A TW 201736011 A TW201736011 A TW 201736011A
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Taiwan
Prior art keywords
separator
diode
component
components
hopper
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TW105138808A
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Chinese (zh)
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尼汀 古普塔
艾密特 里茲瓦尼
高端夫 拉圖里
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艾特羅回收私人有限公司
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Publication of TW201736011A publication Critical patent/TW201736011A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07BSEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B15/00Combinations of apparatus for separating solids from solids by dry methods applicable to bulk material, e.g. loose articles fit to be handled like bulk material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07BSEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B13/00Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
    • B07B13/04Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices according to size
    • B07B13/05Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices according to size using material mover cooperating with retainer, deflector or discharger
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C1/00Magnetic separation
    • B03C1/02Magnetic separation acting directly on the substance being separated
    • B03C1/30Combinations with other devices, not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/178Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention relates to an apparatus and a method for automatic segregation of working and non-working parts from waste printed circuit boards or electronic waste with minimal or no manual efforts. The apparatus comprises a component segregation section and a functionality check section, to segregate functional and non-functional components in the various stages depending upon their functionality, nature and reusability. The apparatus takes in the bulk waste product as feed; the entry of the same is sensed by the sensors provided on the conveyor belt and that initiates the segregation process. The components from the waste product then undergo a number of stages wherein all necessary steps are taken like, size sorting, metallic parts sorting, reusable parts sorting. The apparatus is enabled with at least one smart diode testing device that checks the functionality of the diodes.

Description

利用智慧型二極體測試套件致能之自動元件分離器 Automatic component splitter enabled with smart diode test kit

本發明係有關於一種用以將可回收以及可重複使用之部件自電子廢棄物中自動分離之裝置以及方法。特別係有關於一種用以自動分離廢棄印刷電路板之工作部件以及非工作部分之裝置以及方法。 The present invention relates to an apparatus and method for automatically separating recyclable and reusable components from electronic waste. In particular, it relates to an apparatus and method for automatically separating a working component and a non-working portion of a waste printed circuit board.

對許多國家中之生態永續發展而言,電子廢棄物管理為一重要的必要條件。廢棄物之有效分類為當今社會之一主要議題,並且正成為廢棄物管理行業之一新興問題,以確保廢棄物之管理為有效且永續的。廢棄物之經濟價值最好實現於分類時。 For the sustainable development of ecology in many countries, e-waste management is an important requirement. The effective classification of waste is a major issue in today's society and is emerging as an emerging issue in the waste management industry to ensure that waste management is effective and sustainable. The economic value of waste is best achieved when classifying.

現今使手動控制之事物自動化之趨勢已成為常見之作法。讓事物自動化將可減少人類的負擔。此外,手動運作之產品之成本以及人力相較於自動化系統要高得多。 The trend to automate things that are manually controlled has become a common practice today. Automating things will reduce the burden on humans. In addition, the cost and labor of manually operated products is much higher than that of automated systems.

手動運作之廢棄物管理系統之主要問題為根據其再回復、再使用潛力來檢查以及分離元件。通常之方法包括手動方法,其中人必須穿梭於不同之地點、檢查用於收集廢棄物的地方、或者需要團隊來辨識以及分離元件。此為有點複雜且 耗時之程序。因此,考慮到近年來之技術進步,現今之廢物管理系統之效率並不高。因此,透過對電子廢棄物之底層元件作適當之辨識、分離以及應用廢棄物管理方法並無法確保可對電子廢棄物作有效之利用。 The main problem with manually operated waste management systems is the inspection and separation of components based on their re-response and reuse potential. Common methods include manual methods where a person must shuttle to a different location, inspect where the waste is collected, or require a team to identify and separate components. This is a bit complicated and Time-consuming program. Therefore, given the technological advances in recent years, today's waste management systems are not efficient. Therefore, proper identification, separation and application of waste management methods for the underlying components of e-waste cannot ensure the effective use of e-waste.

此外,更存在另一個問題,其中回收商需要辨識電子廢棄物之底層元件之價值或者再利用能力以決定或者計劃合適之廢棄物管理策略。PCB為電氣設備重要之元件,其具有一貴重的金屬、非金屬成分,例如二極體、半導體、電感、可移動板之端口等部件。因此,回收係成為一個更複雜之任務。再生過程之複雜性不僅是因為貴重成分之不同;而是因為存在需根據元件之功能狀態決定是否具有再利用、回收或者再生之可移除部件。 In addition, there is another problem in which recyclers need to identify the value or reuse of the underlying components of electronic waste to determine or plan an appropriate waste management strategy. PCB is an important component of electrical equipment, with a precious metal, non-metallic components, such as diodes, semiconductors, inductors, ports of movable boards and other components. Therefore, recycling is a more complex task. The complexity of the regeneration process is not only because of the difference in valuable components, but because there are removable components that need to be reused, recycled or regenerated depending on the functional state of the component.

再利用例如二極體、電感器、半導體等功能元件於有效的廢棄物管理程序中可為更佳的選擇且符合成本效益之方法。 Reusing functional components such as diodes, inductors, semiconductors, etc., can be a better and cost effective method for efficient waste management procedures.

CN101444784A公開一種於真空中高效回收廢棄電路板之方法以及裝置。根據所公開之方法,廢棄電路板係佈置於真空容器中並加熱以進行熱解,其中大部分熱解揮發性物質被冷卻並液化成液體油,以及剩餘之部份則被帶入一氣體收集器;一離心機裝置於熱解期間將錫焊自電路板分離;將基板以及熱解電路板之電子元件分類並收集以進一步地分離以及回收。方法之主要缺點為熱解過程中之加熱可能影響工作元件之功能,甚至於真空條件下進行熱解。 CN101444784A discloses a method and apparatus for efficiently recycling waste circuit boards in a vacuum. According to the disclosed method, the waste circuit board is placed in a vacuum vessel and heated for pyrolysis, wherein most of the pyrolysis volatiles are cooled and liquefied into liquid oil, and the remaining portion is brought into a gas collection. A centrifuge device separates the solder from the board during pyrolysis; classifies and collects the electronic components of the substrate and the pyrolysis board for further separation and recovery. The main disadvantage of the method is that the heating during the pyrolysis process may affect the function of the working element and even pyrolysis under vacuum conditions.

US6234317公開用於分類原料、預處理或者回收 散裝材料之裝置。裝置於回收之目的中具有較低之實用性,因為必須單獨執行自PCB移除元件之主要功能。 US6234317 is disclosed for sorting raw materials, pretreatment or recycling A device for bulk materials. The device has a lower utility for recycling purposes because the primary function of removing components from the PCB must be performed separately.

為了克服現有技術之限制,一種方式為提出一種方法,其可確保有效的廢棄物管理程序,無論例如金屬、非金屬等具有價值之材料之性質、功能狀態以及含量如何。此一方法應著重於操作之便利性、對人力之低依賴性以及傾向於在不中斷同時進行處理程序之情況下同時實施一個或者多個廢棄物管理技術。 In order to overcome the limitations of the prior art, one way is to propose a method that ensures an effective waste management procedure regardless of the nature, functional state and content of valuable materials such as metals, non-metals, and the like. This approach should focus on the ease of operation, low dependency on manpower, and the tendency to implement one or more waste management techniques simultaneously without interrupting simultaneous processing.

因此,需要一種方法,其可自動分離元件並決定元件之功能狀態,其有助於回收商設定廢棄物管理程序之流程以及目標,亦可為元件之再利用、再回收以及再回復。 Therefore, there is a need for a method that automatically separates components and determines the functional state of the components, which helps recyclers to set up the process and objectives of the waste management process, as well as reuse, recycle, and re-recover components.

【發明目的】 [Object of the Invention]

本發明之主要目的為提供一種自動元件分離器,包括一元件分離區以及配備有至少一二極體測試套件或者裝置之一功能檢查部分,所述區域被連續地連接以根據其功能、性質以及再使用性將各種階段中之功能以及非功能二極體分離。 SUMMARY OF THE INVENTION A primary object of the present invention is to provide an automatic component separator including a component separation region and a functional inspection portion equipped with at least one diode test kit or device, the regions being continuously connected to be based on their function, properties, and Reusability separates functions in various stages as well as non-functional diodes.

本發明另一個目的為提供一種可編程邏輯控制器(Programmable Logic Controller,PLC)控制裝置,其透過一系列之輸入/輸出模組、感測器模組以及通訊處理器以於一自動模式中操作分離程序。 Another object of the present invention is to provide a Programmable Logic Controller (PLC) control device that operates in an automatic mode through a series of input/output modules, sensor modules, and a communication processor. Separation procedure.

本發明另一個目的為提供一種用以分離存在於廢棄印刷電路板或者電子廢棄物中之元件之方法。 Another object of the present invention is to provide a method for separating components present in a waste printed circuit board or electronic waste.

本發明另一個目的為提供一種可根據每個分離程 序之要求定制例如溫度、速度、時間等特定參數之裝置。 Another object of the present invention is to provide a separation process according to each The sequence requires the customization of devices such as temperature, speed, time and other specific parameters.

本發明另一個目的為提供一種可啟動裝置以感測輸送帶上之廢棄物之存在並啟動帶之移動之感測機制。 Another object of the present invention is to provide a sensing mechanism for actuating a device to sense the presence of waste on the conveyor belt and initiate movement of the belt.

本發明另一個目的為提供一種自具有再利用、回收以及再循環之範圍中之元件之印刷電路板或者任何電子廢棄物產品進行包含例如尺寸分類、金屬分類以及二極體分類等之自動操作之分類之方法。 Another object of the present invention is to provide an automated operation including, for example, dimensional classification, metal classification, and diode classification, from printed circuit boards or any electronic waste products having components in the range of reuse, recycling, and recycling. The method of classification.

本發明另一個目的為提供一種自電子廢棄物中檢查以及分離工作或者可重複使用之二極體之方法。 Another object of the present invention is to provide a method of inspecting and separating working or reusable diodes from electronic waste.

本發明另一方面為提供一種具有安全機制之裝置,用以保護存在於電子廢棄物中之嵌入部件之損壞。 Another aspect of the present invention is to provide a device having a safety mechanism for protecting damage to embedded components present in electronic waste.

因此,本發明係有關於一種以最少或者無人力將工作以及非工作部件自廢棄印刷電路板或者電子廢棄物自動分離之裝置。裝置包括元件分離區以及功能檢查區,其配備有至少一二極體測試裝置,用以根據其功能、性質以及可利用性於各個階段中分離功能以及非功能二極體。 Accordingly, the present invention is directed to an apparatus for automatically separating work and non-working components from waste printed circuit boards or electronic waste with minimal or no manpower. The apparatus includes a component separation zone and a functional inspection zone that is equipped with at least one diode testing device for separating functions and non-functional diodes in various stages depending on their function, nature, and availability.

該裝置自動地接收散裝廢棄物作為給料;其輸入接著透過設置於輸送帶上之感測器感測並啟動分離程序。來自廢棄物之元件接著經歷多個階段,其中係採取所有必要之步驟,例如粉碎(shredding)、尺寸分類、金屬分類、再利用部件之分類,例如芯片、二極體、電阻等。 The device automatically receives bulk waste as a feedstock; its input is then sensed by a sensor disposed on the conveyor belt and the separation process is initiated. The components from the waste then go through multiple stages, taking all necessary steps such as shredding, size classification, metal classification, classification of reused components such as chips, diodes, resistors, and the like.

移除之元件,特別為二極體,接著透過套件/裝置進行測試以便重新利用。若測試為否定的,則其係導向至回收 程序。於功能檢查區,檢查分離之二極體之物理完整性,並進一步地透過各種元件特定測試;若二極體通過所述測試,則其有資格再被使用。若未通過測試,則將其送去機械回收。 The removed components, particularly the diodes, are then tested through the kit/device for reuse. If the test is negative, it is directed to recycling program. In the functional inspection zone, the physical integrity of the separated diodes is checked and further tested by various component specificities; if the diode passes the test, it is eligible for reuse. If it fails the test, it will be sent to the machine for recycling.

於本發明另一實施例中,使用檢查二極體之功能之至少一智慧型二極體測試套件致能裝置。智慧型二極體測試套件可檢查二極體之導電性(conductivity)以評估二極體之再使用性。 In another embodiment of the invention, at least one smart diode test kit enabling device that checks the function of the diode is used. The Smart Diode Test Kit checks the conductivity of the diode to evaluate the reusability of the diode.

二極體係透過這些智慧型套件檢查,以決定其是否應進行機械回收或者再使用。於測試台上,檢查移除之二極體之物理完整性並進行電導率測試;若二極體通過物理完整性以及電導率測試,則其有資格重複使用。若未通過,則將二極體進行機械回收。 The two-pole system checks through these smart kits to determine if they should be mechanically recycled or reused. On the test bench, the physical integrity of the removed diode is checked and the conductivity test is performed; if the diode passes the physical integrity and conductivity tests, it is eligible for reuse. If not, the diode is mechanically recovered.

110‧‧‧主要篩選單元 110‧‧‧Main screening unit

115‧‧‧給料器 115‧‧‧ feeder

120‧‧‧輸送系統 120‧‧‧Conveying system

125、130、140‧‧‧滾筒分離器 125, 130, 140‧‧ ‧ Roller separator

145‧‧‧主框架 145‧‧‧ main frame

200‧‧‧功能檢查區 200‧‧‧ functional inspection area

200‧‧‧輸送系統 200‧‧‧ delivery system

210‧‧‧檢查區域 210‧‧‧ inspection area

215‧‧‧二極體測試套件 215‧‧‧Diode Test Kit

230‧‧‧正連接板 230‧‧‧Connecting plate

235‧‧‧負連接板 235‧‧‧negative connection plate

240‧‧‧基座 240‧‧‧Base

245‧‧‧開關 245‧‧‧Switch

250‧‧‧外殼 250‧‧‧ Shell

255‧‧‧測試PCB 255‧‧‧Test PCB

260‧‧‧安裝螺釘 260‧‧‧Mounting screws

270‧‧‧指示裝置 270‧‧‧ indicating device

300‧‧‧分類系統 300‧‧‧Classification system

透過參考以下之描述、後附之申請專利範圍以及附圖將可更佳地理解本發明之電子廢棄物回收方法以及裝置之各種特徵、優點以及其它用途,其中:第1圖為根據本發明一實施例所述之與功能檢查區連續附接之元件分離器裝置之等距視圖。 The various features, advantages and other uses of the electronic waste recycling method and apparatus of the present invention will be better understood by reference to the following description, the appended claims and the accompanying drawings in which: FIG. An isometric view of the component separator device continuously attached to the functional inspection zone as described in the embodiments.

第2a圖為根據本發明一實施例所述之說明元件移除程序之過程流程圖。 Figure 2a is a process flow diagram illustrating a component removal procedure in accordance with an embodiment of the present invention.

第2b圖為解釋所獲得之剩餘材料之處理之示意性流程圖。 Figure 2b is a schematic flow diagram for explaining the processing of the remaining material obtained.

第3圖為根據本發明一實施例所述之描述例如尺寸分類、金屬分類以及晶片分類等各個階段之過程圖。 Figure 3 is a process diagram depicting various stages, such as size classification, metal classification, and wafer classification, in accordance with an embodiment of the present invention.

第4圖為根據本發明一實施例所述之主要元件隔離器以及 用以分離二極體之功能檢查區之透視圖。 4 is a main component isolator according to an embodiment of the invention and A perspective view of the functional inspection zone used to separate the diodes.

第5圖為用以控制裝置中所配備之各種元件移除機器之PLC控制系統之佈局。 Figure 5 is a layout of a PLC control system for controlling various component removal machines equipped in the apparatus.

第6圖為說明二極體再使用機制之流程圖。 Figure 6 is a flow chart illustrating the mechanism of diode reuse.

第7圖為根據本發明一實施例所述之二極體測試套件組件之前視圖。 Figure 7 is a front elevational view of a diode test kit assembly in accordance with an embodiment of the present invention.

第8圖為根據本發明一實施例所述之二極體測試套件組件之側視圖。 Figure 8 is a side elevational view of a diode test kit assembly in accordance with an embodiment of the present invention.

第9圖為根據本發明一實施例所述之二極體測試套件之俯視圖。 Figure 9 is a top plan view of a diode test kit in accordance with an embodiment of the present invention.

以下將參照附圖描述本發明,其中示出了本發明一些但並非全部之實施例。實際上,本發明可以許多不同之形式實施,且不應被解釋為受限於本文所描述之實施例;相反地,透過提供這些實施例將使得本發明滿足適用之法律要求。 The invention is described below with reference to the drawings in which some but not all embodiments of the invention are illustrated. In fact, the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein.

根據先前之描述以及相關之附圖中所呈現之教示可使本領域技術人員容易地想到本文所闡述之有關本發明之許多修改以及其它實施例。因此,必須理解的是,本發明不限於所公開之特定實施例,且修改以及其它實施例係包括於後附之圖式之範圍內。儘管本文採用特定術語,但其僅作為一般以及描述性意義上之使用,而並不以此為限。 Numerous modifications and other embodiments of the inventions set forth herein will be apparent to those skilled in the <RTIgt; Therefore, it must be understood that the invention is not limited to the particular embodiments disclosed, and modifications and other embodiments are included within the scope of the appended drawings. Although specific terms are used herein, they are used in a generic and descriptive sense only and not limiting.

第1圖係描述用以執行分離程序之完整系統之元件分離器之等距視圖。於第一步驟中,主要篩選單元110接收來自元件移除機器400之電子廢棄物元件以進行分類。除空白 板(blank board)之外,元件移除機器提供兩種類型之部分,即細的以及粗的部分。主要篩選單元110對含有焊球、灰塵、二極體、電容、接腳以及微粒之部分進行篩選,其更進一步用於單獨之分類系統300。此外,二極體以任何合適之方法分類以及分離,較佳為滾筒分離(roller separation)法。此後,二極體被選擇性地輸送至功能檢查區200,並以電導率測量之方式作二極體之功能確定。功能檢查區200配備有至少一二極體測試套件215,用以評估分離之二極體之功能。對於二極體之功能評估,於區域200之至少一側上係具有檢查區210。於另一實施例中,功能檢查區包括至少一輸送系統,用以朝向檢查區域(scrutiny area)210輸送二極體。 Figure 1 is an isometric view of a component separator depicting a complete system for performing a separation procedure. In a first step, primary screening unit 110 receives electronic waste components from component removal machine 400 for sorting. Except blank In addition to the blank board, the component removal machine provides two types of parts, thin and thick. The primary screening unit 110 screens portions containing solder balls, dust, diodes, capacitors, pins, and particles, which are further used in a separate classification system 300. Further, the diodes are classified and separated by any suitable method, preferably a roller separation method. Thereafter, the diode is selectively delivered to the functional inspection zone 200 and determined as a function of the diode by conductivity measurement. The functional inspection zone 200 is equipped with at least one diode test kit 215 for evaluating the function of the separated diodes. For functional evaluation of the diode, an inspection zone 210 is provided on at least one side of the region 200. In another embodiment, the functional inspection zone includes at least one delivery system for transporting the diodes toward the scrutiny area 210.

第2a圖係描述元件移除程序之過程流程圖,其中廢棄物材料被供給至元件移除機器/裝置中。元件移除機器(component removal machine,CRM)執行例如電子廢棄物以及電子廢棄物之元件移除(特別是廢棄印刷電路板)之初級分類之準備步驟。於移除元件後,將空白板送至粉碎並進一步地執行回收程序。而移除之元件則被送至進行本發明之分離程序。準確地說,連接於分類裝置前方之元件移除機器自印刷電路板移除所有工作以及非工作元件,並輸送上述元件以進行各種檢查,以根據每個元件之類型以及狀態確保合適之廢棄物管理方法。舉例來說,若將輸入印刷電路板作為給料,則裝置將移除印刷電路板之所有嵌入元件,並輸送所有上述部件以借助配備於裝置中之各種感測模組以及智慧型測試套件進行功能檢查。若元件處於良好之工作狀態,則將其將用於重複使用之 目的。類似地,若發現元件有缺陷,則可根據上述缺陷部件之再回復、再利用潛力以選擇廢棄物管理的其它方法。於去除元件後之空白板則送至進行金屬再回復程序。 Figure 2a is a process flow diagram depicting a component removal procedure in which waste material is supplied to the component removal machine/device. A component removal machine (CRM) performs preparatory steps for primary classification of, for example, electronic waste and component removal of electronic waste, particularly waste printed circuit boards. After the component is removed, the blank is sent to the comminution and the recovery process is further performed. The removed components are then sent to the separation process for carrying out the invention. Specifically, the component removal machine attached to the front of the sorting device removes all working and non-working components from the printed circuit board and transports the components for various inspections to ensure proper waste according to the type and state of each component. Management method. For example, if the input printed circuit board is used as a feedstock, the device will remove all embedded components of the printed circuit board and transport all of the above components to function with various sensing modules and smart test kits provided in the device. an examination. If the component is in good working condition, it will be used for reuse. purpose. Similarly, if the component is found to be defective, other methods of waste management may be selected based on the re-recovery and reuse potential of the defective component described above. The blank plate after the component is removed is sent to the metal re-recovery process.

參考第2b圖,其係解釋用於處理所獲得之剩餘材料之示意性流程圖。被移除之元件被送至進行尺寸分類、篩選、金屬分類以及晶片分類。被移除之元件之尺寸分類係通過滾筒分離方法進行。而存在於移除之元件中之金屬係透過磁性分類器(magnetic sorter)分類。 Referring to Figure 2b, a schematic flow diagram for processing the remaining material obtained is explained. The removed components are sent to size sorting, screening, metal sorting, and wafer sorting. The size classification of the removed components is performed by a drum separation method. The metal present in the removed component is classified by a magnetic sorter.

參考第3圖,其係顯示根據本發明一實施例所述之例如尺寸分類、金屬分類以及晶片分類各個階段之過程圖。進一步透過使元件通過滾筒以及分離連接器/端口、處理器插孔/鐵、二極體/電晶體等階段完成尺寸分類,其中二極體/電晶體被發送用於功能檢查以評估它們是否需要被引至機械回收或再利用。 Referring to Figure 3, there is shown a process diagram of various stages, such as size classification, metal classification, and wafer classification, in accordance with an embodiment of the present invention. Dimensional classification is further accomplished by passing the components through the rollers and the separate connectors/ports, processor jacks/irons, diodes/transistors, etc., where the diodes/transistors are sent for functional checks to assess whether they are needed It is led to mechanical recycling or reuse.

第4圖為根據本發明一實施例所述之主要元件分離器以及用於分離二極體之功能檢查區之透視圖。於此實施例中,分離器包括用以支撐輸送系統120以及其它子組件之框架145。有兩種類型之PCB材料部分係自CRM處理,而不是空白板之元件,即細的以及粗的部份。主要篩選單元110對焊球(solder ball)、灰塵、二極體、接腳以及細微粒進行篩選細分,其供單獨之分類系統使用。主要篩選單元110與螢幕一起形成前後振動之凸輪機構(cam mechanism)。其與振動給料器(feeder)相同。主要篩選單元110自元件移除機器(component removel machine,CRM)接收元件,其中粗元件 係與細元件分開。較粗的元件包括例如散熱器、插座、連接器、銅線圈、二極體、線圈、連接器基座、電晶體、電感、晶片等元件。粗元件傳送至接收混合元件之所有尺寸/粗的分類之給料器(feeder)115。其適用於來回振動之凸輪機構。其與振動給料器相同。給料器115連續地連接至輸送系統120。輸送系統120包括沿著主框架145縱向延伸並輸送通過各個分離階段之混合元件之粗的分類之以馬達驅動之輸送帶。輸送系統更包括相機以及近接感測器,以感測輸送帶上之元件並觸發馬達,從而於期望之方向上移動輸送帶。複數滾筒分離器(roller separator)125、130以及140係設置於輸送帶上方可調節高度之合適位置,使得輸送帶恰好於分離器下方運作。每個滾筒分離器單元設置有至少一給料斗155,以接收以及收集來自滾筒分離器單元之元件。每個滾筒分離器單元根據其尺寸分離元件,並將剩餘元件轉移至另一個滾筒分離器單元,其中各元件根據相同之原理(基於尺寸)分離。如上所述,將分離之元件收集於對應之給料斗155中。給料斗用以作為分離材料之導件並幫助將其轉移至功能檢查部分200。 Figure 4 is a perspective view of a main component separator and a functional inspection zone for separating the diodes in accordance with an embodiment of the present invention. In this embodiment, the separator includes a frame 145 for supporting the delivery system 120 and other subassemblies. There are two types of PCB material parts that are processed by CRM rather than the components of the blank board, ie thin and thick parts. The primary screening unit 110 screens and subdivides the solder balls, dust, diodes, pins, and fine particles for use in a separate sorting system. The main screening unit 110, together with the screen, forms a cam mechanism that oscillates back and forth. It is the same as the vibration feeder. The main screening unit 110 is a component remover machine (CRM) receiving component, wherein the coarse component It is separated from the fine elements. Thicker components include components such as heat sinks, sockets, connectors, copper coils, diodes, coils, connector pedestals, transistors, inductors, wafers, and the like. The coarse elements are passed to a feeder 115 that receives all sizes/coarse categories of the mixing elements. It is suitable for cam mechanisms that vibrate back and forth. It is the same as the vibrating feeder. Feeder 115 is continuously coupled to delivery system 120. The conveyor system 120 includes a motor-driven conveyor belt that extends longitudinally along the main frame 145 and conveys the coarse classification of the mixing elements through the various stages of separation. The delivery system further includes a camera and a proximity sensor to sense the components on the conveyor belt and trigger the motor to move the conveyor belt in a desired direction. A plurality of roller separators 125, 130, and 140 are disposed at appropriate positions above the conveyor belt to adjust the height so that the conveyor belt operates just below the separator. Each of the drum separator units is provided with at least one hopper 155 for receiving and collecting components from the drum separator unit. Each roller separator unit separates the components according to their size and transfers the remaining components to another roller separator unit, wherein the components are separated according to the same principle (based on size). The separated components are collected in the corresponding hopper 155 as described above. The hopper is used as a guide for the separation material and helps to transfer it to the function inspection portion 200.

對於磁性元件之分離,係設置有磁性分離器/分類器160。磁性分離器/分類器連接於滾筒分離器後,以對滾筒分離過程後所留下之元件啟始磁性分離過程,並將分離之鐵材料引導至收集箱(collection bin)。 For the separation of the magnetic elements, a magnetic separator/classifier 160 is provided. After the magnetic separator/classifier is connected to the drum separator, the magnetic separation process is initiated by the components left after the drum separation process, and the separated iron material is directed to a collection bin.

於另一個實施例中,功能檢查區200包括輸送系統、檢查區域210、至少一二極體測試套件215。輸送系統將分離之二極體輸送至檢查區域以於其中進行功能評估。 In another embodiment, the functional inspection zone 200 includes a delivery system, an inspection region 210, and at least one diode test kit 215. The delivery system delivers the separated diodes to the examination area for functional evaluation therein.

參考第5圖,用以控制各種元件移除機器之PLC控制系統之佈局裝備於裝置中。PLC系統以一自動模式操作所有機器、滾筒以及分類馬達。操作之狀態係顯示於LCD/TFT螢幕上,以監控裝置之正常功能。 Referring to Figure 5, the layout of the PLC control system for controlling the various component removal machines is equipped in the apparatus. The PLC system operates all machines, drums and sorting motors in an automatic mode. The status of the operation is displayed on the LCD/TFT screen to monitor the normal function of the unit.

參考第6圖,第6圖說明二極體再使用機制之流程圖,其中每種類型之二極體經過初步的物理測試。若二極體通過物理測試,則進行稱為導電性(或者連接性(connectivity))測試之進一步測試。若二極體於任一測試中失敗,則發送至機械回收。 Referring to Figure 6, Figure 6 illustrates a flow diagram of the diode reuse mechanism in which each type of diode undergoes preliminary physical testing. If the diode passes the physical test, a further test called conductivity (or connectivity) test is performed. If the diode fails in either test, it is sent to mechanical recycling.

參考第7圖,第7圖提供二極體測試套件組件之前視圖。於此實施例中,套件組件215包括至少一二極體測試套件。二極體測試套件包括ON/OFF開關245、外殼250、至少一測試PCB 255、至少一安裝螺釘260、至少一連接板、以及至少一指示裝置270。 Referring to Figure 7, Figure 7 provides a front view of the diode test kit assembly. In this embodiment, kit assembly 215 includes at least one diode test kit. The diode test kit includes an ON/OFF switch 245, a housing 250, at least one test PCB 255, at least one mounting screw 260, at least one connection plate, and at least one indicating device 270.

第8圖為根據本發明一實施例所述之二極體測試套件之側視圖。於此實施例中,二極體測試套件包括殼體220、至少一測試PCB 225、正連接板230、負連接板235,上述所有元件係安裝於基座240上。 Figure 8 is a side elevational view of a diode test kit in accordance with an embodiment of the present invention. In this embodiment, the diode test kit includes a housing 220, at least one test PCB 225, a positive connection plate 230, and a negative connection plate 235, all of which are mounted on the base 240.

參考第9圖,第9圖說明二極體測試套件之俯視圖。於此實施例中,套件包括:外殼220、至少一測試PCB 225、正連接板230、負連接板235,上述所有元件係安裝於基座240上。於本發明另一個實施例中,二極體測試套件包括以閃爍顯示二極體是否工作以及導通之指示LED、測試PCB、正連接板、負連接板以及外殼。二極體測試套件還包括用於套件之 On/Off按鈕。進行測試以確保二極體正在運作。透過將正極連接到正極連接板、將負極連接到負極連接板,若指示LED閃爍,則表明二極體導通並處於工作狀態。 Referring to Figure 9, Figure 9 illustrates a top view of the diode test kit. In this embodiment, the kit includes a housing 220, at least one test PCB 225, a positive connection plate 230, and a negative connection plate 235, all of which are mounted on the base 240. In another embodiment of the invention, the diode test kit includes an indicator LED, a test PCB, a positive connection plate, a negative connection plate, and a housing that are flashing to indicate whether the diode is operational and conductive. The diode test kit also includes kits On/Off button. Test to make sure the diode is working. By connecting the positive electrode to the positive electrode connection plate and the negative electrode to the negative electrode connection plate, if the indicator LED flashes, it indicates that the diode is conducting and operating.

一般而言,二極體測試套件包括外殼220、至少一測試PCB 225、至少一正連接板230、至少一負導電板235、用於電源指示之LED裝置270以及用於調整套件之ON/OFF狀態之開關245、以及複數連接板,即用以連接至二極體之正端以及負端之正連接板230以及負連接板235。 In general, the diode test kit includes a housing 220, at least one test PCB 225, at least one positive connection plate 230, at least one negative conductive plate 235, LED device 270 for power indication, and ON/OFF for adjustment kit The state switch 245, and the plurality of connecting plates, that is, the positive connecting plate 230 and the negative connecting plate 235 for connecting to the positive end and the negative end of the diode.

因此,於本發明之最佳實施例中,係提出了一種用以分離電子廢棄物元件之自動元件分離器,包括: Accordingly, in a preferred embodiment of the invention, an automatic component separator for separating electronic waste components is provided, comprising:

a)一框架; a) a framework;

b)至少一給料器,用以接收待分離之元件; b) at least one feeder for receiving the component to be separated;

c)至少一輸送系統,用於將元件移動遠離給料器,系統包括以馬達驅動之輸送帶、至少一近接感測器 c) at least one delivery system for moving the component away from the feeder, the system comprising a motor driven conveyor belt, at least one proximity sensor

d)複數滾筒分離器單元,用以分離二極體,滾筒分離器單元之每一者包括至少一滾筒分離器以及至少一給料斗; d) a plurality of roller separator units for separating the diodes, each of the roller separator units comprising at least one roller separator and at least one hopper;

e)至少一磁性分類器,相鄰於滾筒分離器單元,用以分離磁性元件;以及 e) at least one magnetic sorter adjacent to the roller separator unit for separating the magnetic elements;

f)至少一功能檢查區,相鄰於上述滾筒分離器單元之上述至少一給料斗,包括至少一二極體測試裝置、至少一檢查區以及至少一用以將二極體自給料斗移向檢查區之裝置; 其中,輸送系統感測負載並開始將元件朝向滾筒分離器單元輸送;滾筒分離器單元將待檢查之二極體分離並移動至相對於滾筒分離器單元之至少一給料斗中;以及功能檢查 區自至少一給料斗接收二極體以透過至少一二極體測試裝置執行元件之至少一功能測試。 f) at least one functional inspection zone, the at least one hopper adjacent to the drum separator unit, comprising at least one diode testing device, at least one inspection zone, and at least one for moving the diode self-feeding hopper to the inspection Device of the district; Wherein the transport system senses the load and begins to transport the component toward the roller separator unit; the roller separator unit separates and moves the diode to be inspected into at least one hopper relative to the roller separator unit; and functional inspection The region receives the diode from at least one of the hoppers to pass at least one functional test of the at least one diode test device actuator.

110‧‧‧主要篩選元件 110‧‧‧Main screening components

200‧‧‧功能檢查區 200‧‧‧ functional inspection area

300‧‧‧分類系統 300‧‧‧Classification system

400‧‧‧元件移除機器 400‧‧‧Component removal machine

Claims (6)

一種用於分離電子廢棄物元件之自動元件分離器,包括:a)一框架;b)至少一給料器,用於接收待分離之元件;c)至少一輸送系統,用於將上述元件移動遠離上述給料器,上述系統包括以馬達驅動之輸送帶、至少一近接感測器;d)複數滾筒分離器單元,用以分離二極體,滾筒分離器單元之每一者包括至少一滾筒分離器以及至少一給料斗;e)至少一磁性分類器,相鄰於上述滾筒分離器單元,用以分離磁性元件;以及f)至少一功能檢查區,相鄰於上述滾筒分離器單元之上述至少一給料斗,包括至少一二極體測試裝置、至少一檢查區以及至少一用以將上述二極體自上述給料斗移向檢查區之裝置;其中:一旦上述輸送帶自上述給料器接收上述元件,則觸發上述輸送系統,從而將上述元件朝向上述滾筒分離器單元輸送;上述滾筒分離器單元係設置於上述輸送帶之上方之一可調節高度處,使得上述輸送帶剛好運作於上述分離器之下方;上述滾筒分離器單元將待檢測之大小已分離之二極體分離並移動至相對於上述滾筒分離器單元之至少一給料斗中;上述功能檢查區自至少一給料斗接收上述二極體,以透過上述至少一二極體測試裝置執行上述元件之至少一功能測試;以及 上述分離器由可編程邏輯控制器控制。 An automatic component separator for separating electronic waste components, comprising: a) a frame; b) at least one feeder for receiving components to be separated; c) at least one transport system for moving the components away In the above feeder, the system includes a motor-driven conveyor belt, at least one proximity sensor, and d) a plurality of roller separator units for separating the diodes, each of the roller separator units including at least one roller separator And at least one hopper; e) at least one magnetic sorter adjacent to said roller separator unit for separating the magnetic elements; and f) at least one functional inspection zone adjacent said at least one of said roller separator units a hopper comprising at least one diode testing device, at least one inspection zone, and at least one device for moving the diode from the hopper to the inspection zone; wherein: the conveyor belt receives the component from the hopper Transmitting the conveying system to transport the component toward the roller separator unit; the roller separator unit is disposed on the conveyor belt One of the sides can adjust the height such that the conveyor belt operates just below the separator; the roller separator unit separates and moves the separated diodes to be detected to at least relative to the drum separator unit In a hopper; the functional inspection zone receives the diode from at least one hopper to perform at least one functional test of the component through the at least one diode testing device; The above splitter is controlled by a programmable logic controller. 如申請專利範圍第1項所述之自動元件分離器,其中上述功能測試可以手動或者自動模式或者上述兩者進行。 The automatic component separator of claim 1, wherein the functional test can be performed in a manual or automatic mode or both. 如申請專利範圍第1項所述之自動元件分離器,其中上述輸送系統更包括成像模組,用以偵測上述輸送帶上元件之存在。 The automatic component separator of claim 1, wherein the conveying system further comprises an imaging module for detecting the presence of components on the conveyor belt. 一種用於分離電子廢棄物元件之自動元件分離器,包括:a)一框架;b)至少一給料器,用以接收待分離之元件;c)至少一輸送系統,用以將上述部件移動遠離上述給料器,上述系統包括以馬達驅動之輸送帶、至少一近接感測器;d)至少一滾筒分離器單元,用以根據二極體各自之尺寸分離上述二極體,每個單元包括至少一滾筒分離器以及至少一給料斗;e)至少一磁性分類器,相鄰於上述滾筒分離器單元,用以分離磁性元件;以及f)至少一功能檢查區,相鄰於上述滾筒分離器單元之至少一給料斗,包括至少一二極體測試裝置、至少一檢查區以及至少一用以將上述二極體自給料斗移向上述檢查區之裝置;其中:一旦上述輸送帶自上述給料器接收上述元件,則觸發上述輸送系統,從而將上述元件朝向上述滾筒分離器單元輸送;上述滾筒分離器單元係設置於上述輸送帶之上方之一可調 節高度處,使得上述輸送帶剛好運作於上述分離器之下方;上述滾筒分離器單元將待檢測之大小已分離之二極體分離並移動至相對於上述滾筒分離器單元之至少一給料斗中;上述功能檢查區自至少一給料斗接收上述二極體,以透過上述至少一二極體測試裝置執行上述元件之至少一功能測試;以及上述分離器由可編程邏輯控制器控制。 An automatic component separator for separating electronic waste components, comprising: a) a frame; b) at least one feeder for receiving components to be separated; c) at least one transport system for moving the components away In the above feeder, the system includes a motor-driven conveyor belt, at least one proximity sensor, and d) at least one roller separator unit for separating the diodes according to respective sizes of the diodes, each unit including at least a roller separator and at least one hopper; e) at least one magnetic sorter adjacent to said roller separator unit for separating magnetic elements; and f) at least one functional inspection zone adjacent to said roller separator unit At least one feed hopper comprising at least one diode testing device, at least one inspection zone, and at least one device for moving the diode self-feeding hopper to the inspection zone; wherein: once the conveyor belt is received from the feeder The above-mentioned component triggers the conveying system to convey the component toward the roller separator unit; the roller separator unit is disposed above One of the top of an adjustable belt The height of the joint is such that the conveyor belt operates just below the separator; the drum separator unit separates and moves the separated diode to be detected into at least one hopper relative to the drum separator unit The functional inspection zone receives the diode from at least one hopper to perform at least one functional test of the component through the at least one diode test device; and the splitter is controlled by a programmable logic controller. 如申請專利範圍第4項所述之自動元件分離器,其中上述功能測試可以手動或者自動模式或者上述兩者進行。 The automatic component separator of claim 4, wherein the functional test is performed in a manual or automatic mode or both. 如申請專利範圍第4項所述之自動元件分離器,其中上述輸送系統更包括一成像模組,用以偵測上述輸送帶上元件之存在。 The automatic component separator of claim 4, wherein the conveying system further comprises an imaging module for detecting the presence of components on the conveyor belt.
TW105138808A 2015-11-25 2016-11-25 Automatic component segregator enabled with a smart diode testing kits TW201736011A (en)

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JP3418787B2 (en) * 1999-06-30 2003-06-23 株式会社日立製作所 Waste treatment method and equipment
US6634504B2 (en) * 2001-07-12 2003-10-21 Micron Technology, Inc. Method for magnetically separating integrated circuit devices

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