TW201734643A - Negative photosensitive resin composition and photo-cured pattern prepared from same preparing a photo-cured pattern and an image display device with the photo-cured pattern prepared from the negative photosensitive resin composition - Google Patents

Abstract

This invention provides a negative photosensitive resin composition and an insulating film prepared from the same. A pattern prepared from the negative photosensitive resin composition provided by this invention is excellent in chemical resistance, pencil hardness, durability and penetration rate, so that the negative photosensitive resin composition can be usefully used for preparing a photo-cured pattern and an image display device with the photo-cured pattern prepared from the negative photosensitive resin composition.

Description

Negative photosensitive resin composition and photocurable pattern produced therefrom

The present invention relates to a negative photosensitive resin composition and a photocurable pattern produced therefrom.

In the field of displays, a photosensitive resin composition is used in order to form various photocuring patterns such as a photoresist, an insulating film, a protective film, a black matrix, and a column spacer. Specifically, the photosensitive resin composition is selectively exposed and developed by a photo-developing process to form a desired photo-curing pattern, but in the process, in order to improve the yield on the process and improve the physical properties of the applied article, it is required to be high. Sensitive photosensitive resin composition.

The pattern formation of the photosensitive resin composition is carried out by light development, that is, a polarity change of a polymer caused by a photoreaction, and a crosslinking reaction. In particular, the change property of solubility in a solvent such as an aqueous alkali solution after exposure is utilized.

The pattern formation using the photosensitive resin composition is classified into a positive type and a negative type according to the solubility of the photosensitive portion to development. In the case of a positive type resist, a pattern is formed by dissolving a portion of the exposed portion by a developing solution, and in the case of a negative type resist, the exposed portion is not dissolved in the developing solution, and the unexposed portion is dissolved. The way the pattern is formed. The positive and negative types are different from each other in the binder resin, the crosslinking agent, and the like used.

In recent years, the use of touch screens with touch panels has dramatically increased, and recently, flexible touch screens have received significant attention. Therefore, it is required to have flexible characteristics for raw materials such as various substrates used in a touch panel. Therefore, the raw materials that can be used are limited to flexible polymer raw materials, and the process is also required to be carried out under milder conditions.

Therefore, the curing conditions of the photosensitive resin composition must also be low-temperature curing which is not conventional high-temperature curing. However, low-temperature curing has a problem of a decrease in reactivity and a decrease in durability of a formed pattern.

Korean Patent No. 1,302,508 discloses a negative photosensitive resin composition which is excellent in heat resistance and light resistance by containing a copolymer polymerized using a cyclohexene acrylate-based monomer, and can improve sensitivity. However, the composition did not meet the required durability under low temperature curing conditions.

The problem to be solved by the invention:

An object of the present invention is to provide a negative photosensitive resin composition which is excellent in reactivity, and which is excellent in reactivity, and which is excellent in reactivity with a metal substrate and chemical resistance of a formed pattern, although it can be cured at a low temperature.

Means for solving the problem:

1. a negative photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive, and (E) a solvent, wherein The above (D) additive contains a compound represented by the following Chemical Formula 1.

[Chemical Formula 1]

In the above Chemical Formula 1, the above R ¹ and R ² are each independently hydrogen or a C ₁ - C ₆ linear or side chain alkyl group, and the above m represents the number of repeating units in the main chain, and the above m is 4 to 12 The integer.

2. The negative photosensitive resin composition of the above item 1, wherein R ¹ and R ² in the compound of the above Chemical Formula 1 are each independently hydrogen.

3. The negative photosensitive resin composition of the above item 1, wherein the compound of the above Chemical Formula 1 is contained in an amount of 0.1 to 5% by weight based on the total weight of the composition.

4. In the negative photosensitive resin composition of the above item 1, the (A) alkali-soluble resin includes a first resin having a repeating unit represented by the following Chemical Formula 2 and a second resin having a repeating unit represented by the following Chemical Formula 3 Resin.

[Chemical Formula 2]

[Chemical Formula 3]

R in the above Chemical Formula 3 is hydrogen or a methyl group (-CH ₃ ).

5. In the negative photosensitive resin composition of the above item 1, the negative photosensitive resin composition can be cured at a low temperature of 70 to 100 °C.

6. The light-curing pattern is formed of the negative photosensitive resin composition as described in any one of the above items 1 to 5.

7. The photocuring pattern of item 6, wherein the photocuring pattern is selected from the group consisting of an array planarization film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a black matrix pattern, and a column spacer pattern.

8. An image display device having the photocuring pattern described in the above item 6.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

The present invention provides a negative photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive, and (E) a solvent. Here, the above (D) additive is a compound represented by the following Chemical Formula 1.

[Chemical Formula 1]

In the above Chemical Formula 1, the above R ¹ and R ² are each independently hydrogen or a C ₁ - C ₆ linear or side chain alkyl group, and the above m represents the number of repeating units in the main chain, and the above m is 4 to 12 The integer.

According to the present invention, the additive compound represented by the above Chemical Formula 1 is contained in the negative photosensitive resin composition, and the pattern produced by using the above composition is excellent in adhesion to a metal substrate and chemical resistance of a pattern, and can be used usefully. The manufacture of a photocurable pattern and an image display device having a photocured pattern produced therefrom.

Hereinafter, the negative photosensitive resin composition according to the present invention will be more specifically described by the aspects and the respective embodiments of the present invention.

Alkali Soluble resin A )

The alkali-soluble resin (A) used in the present invention can contain a first resin having a repeating unit represented by the following Chemical Formula 2 and a second resin having a repeating unit represented by the following Chemical Formula 3.

[Chemical Formula 2]

[Chemical Formula 3]

R in the above Chemical Formula 3 is hydrogen or a methyl group (-CH ₃ ).

When the alkali-soluble resin (A) of the present invention contains the first resin having the repeating unit of the above Chemical Formula 2, it is possible to exhibit an effect of improving the adhesion after the treatment of the etchant on the substrate such as metal. The substrate may be a substrate provided with a metal film, a non-metal film, a metal oxide film, a non-metal oxide film, or the like. Specific examples of the film provided on the substrate include an amorphous tantalum film, a tantalum nitride film, a tantalum oxide film, indium tin oxide (ITO), tin oxide, aluminum (Al), and molybdenum (Mo). Chromium (Cr), copper (Cu), etc., but not limited to these.

The repeating unit of the above Chemical Formula 2 preferably contains 2 to 30% by weight, more preferably 5 to 10% by weight, based on the first resin.

In addition, the alkali-soluble resin of the present invention accelerates the ring opening reaction caused by heat in the thermal process and the polymerization caused by the second resin containing the repeating unit of the above Chemical Formula 3, and reacts The improvement in the properties can show the chemical resistance, that is, the effect of less damage caused by the etchant.

The repeating unit of the above Chemical Formula 2 preferably contains 10 to 40% by weight, more preferably 20 to 30% by weight, based on the second resin.

The first resin and the second resin according to the present invention may further comprise, independently of each other, repeating units (other than the repeating units of Chemical Formula 2 and Chemical Formula 3) derived from other monomers known in the art.

The monomer which forms a repeating unit which can be added to the above-mentioned first resin and the second resin is not particularly limited, and examples thereof include dicarboxylic acids and anhydrides thereof; aromatic vinyl compounds; vinyl cyanide; a compound; a mono(meth)acrylate of a polymer having a carboxyl group and a hydroxyl group at both terminals; an alkyl (meth)acrylate; an alicyclic (meth)acrylate; an aryl (meth)acrylate An ester; one or two of (meth) acrylates substituted with a cycloalkane or a bicycloalkane ring having 4 to 16 carbon atoms; an unsaturated oxetane compound; an unsaturated oxirane compound; the above. More preferably, a (meth)acrylic monomer can be used.

In the present invention, "(meth)acrylic acid" means "methacrylic acid", "acrylic acid" or both.

More preferably, the (meth)acrylic monomer may be a monomer of the following Chemical Formula 4.

[Chemical Formula 4]

R in the above Chemical Formula 4 is hydrogen or a methyl group (-CH3).

The first resin and the second resin contained in the alkali-soluble resin are preferably contained in a weight ratio of 1:1 to 1:15, more preferably in a weight ratio of 1:1 to 1:6.

In the present invention, the weight average molecular weight of the first resin contained in the alkali-soluble resin (A) is preferably from 4,000 to 25,000, more preferably from 5,000 to 10,000.

Further, the weight average molecular weight of the second resin contained in the alkali-soluble resin (A) is preferably from 4,000 to 25,000, more preferably from 8,000 to 15,000.

The acid value of the alkali-soluble resin (A) is preferably from 20 to 200 mgKOH/g, more preferably from 40 to 100 mgKOH/g.

The content of the alkali-soluble resin (A) is not particularly limited, and is 10 to 90% by weight, and more preferably 25 to 70% by weight, based on the solid content of the photosensitive resin composition.

Polymeric compound B )

The polymerizable compound (B) used in the photosensitive resin composition of the present invention can increase the crosslinking density in the process and enhance the mechanical properties of the photocurable pattern.

The polymerizable compound (B) is not particularly limited as long as it is a polymerizable compound used in the art, and is, for example, a monofunctional monomer, a bifunctional monomer, or another polyfunctional monomer, and the type thereof is not particularly limited. The following compounds are listed.

Specific examples of the monofunctional monomer include mercaptophenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, and 2-hydroxy acrylate. Ethyl ester, N-vinylpyrrolidone, and the like. Specific examples of the bifunctional monomer include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, and neopentyl glycol di(meth)acrylate. Triethylene glycol di(meth)acrylate, bis(acryloxyethyl)ether of bisphenol A, 3-methylpentanediol di(meth)acrylate, and the like. Specific examples of the other polyfunctional monomer include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, and propoxylated trishydroxyl Propane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate Ester, propoxylated dipentaerythritol hexa(meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like. Among them, a bifunctional or higher polyfunctional monomer is preferably used.

The content of the polymerizable compound (B) is not particularly limited, and may be, for example, 10 to 90 parts by weight, preferably 100 parts by weight, based on 100 parts by weight of the alkali-soluble resin, based on the solid content of the photosensitive resin composition. It is used in the range of 30 to 80 parts by weight.

Photoinitiator C )

The photoinitiator (C) according to the present invention is not particularly limited as long as it is an initiator capable of polymerizing the above polymerizable compound (B). For example, at least one compound selected from the group consisting of an acetophenone-based compound, a benzophenone-based compound, a triazine-based compound, a biimidazole-based compound, a thioxanthone-based compound, and an oxime ester-based compound can be used. Preferably, An oxime ester compound can be used.

Further, in order to improve the sensitivity of the photosensitive resin composition of the present invention, the photoinitiator (D) may further contain a photoinitiating aid. When the photosensitive resin composition according to the present invention contains a photo-initiating aid, the sensitivity is further improved, and productivity can be improved.

The photoinitiator auxiliary agent may be one or more compounds selected from the group consisting of an amine compound, a carboxylic acid compound, and an organic sulfur compound having a thiol group.

The content of the photoinitiator (D) is not particularly limited, and may be, for example, 0.1 to 10 parts by weight based on 100 parts by total of the photosensitive resin composition based on the solid content, preferably It is 0.1 to 5 parts by weight. When the above range is satisfied, the exposure time is shortened by the high sensitivity of the photosensitive resin composition, so that the productivity is improved, the high resolution can be maintained, and the strength of the formed pixel portion and the smoothness of the surface of the pixel portion are improved.

additive( D )

The photosensitive resin composition of the present invention contains an additive represented by the following Chemical Formula 1.

[Chemical Formula 1]

In the above Chemical Formula 1, the above R ¹ and R ² are each independently hydrogen or a C1-C6 linear or side chain alkyl group, and the above m represents the number of repeating units in the main chain, and the above m is an integer of 4 to 12 .

The additive compound of Chemical Formula 1 according to the present invention has excellent chemical resistance by containing a plurality of aromatic ring structures. Further, -OH can improve the adhesion to the metal substrate, and the cyclohexane functional group having the above carboxyl group not only increases the developability, but also enables the reaction reliability by the carbon double bond functional group at the terminal of the novolac type epoxy-modified monomer. The increase has an effect of increasing the curing density.

As a preferred example, in the compound of the above Chemical Formula 1 of the present invention, R ¹ and R ² are each independently hydrogen.

In addition, when the integer m of the compound of the above Chemical Formula 1 is less than 4, there is a problem that the residual film ratio and the chemical resistance are lowered, and if it exceeds 12, the developability is lowered. In this regard, m of the above Chemical Formula 1 of the present invention may preferably be an integer of 4 to 10, and more preferably may be an integer of 4 to 8.

In the present invention, the compound of the above Chemical Formula 1 can be contained in an amount of 0.1 to 5% by weight based on the total weight of the photosensitive resin composition.

In a preferred example, when the compound of the above Chemical Formula 1 is contained in an amount of less than 0.1% by weight based on the total weight of the photosensitive resin composition, there is a problem that swelling and development are remarkable, and formation of a fine pattern is difficult, and the photosensitive resin is used. When the compound of the above Chemical Formula 1 exceeds 5% by weight based on the total weight of the composition, there is a problem that chemical resistance and hardness are remarkably lowered.

Further, in addition to the additive represented by the above Chemical Formula 1 of the present invention, a commonly used basic compound, a surfactant, an adhesion improver, and thermal crosslinking may be further contained within a range not departing from the object of the present invention. Additives such as a light stabilizer, a light stabilizer, a light curing agent, a leveling agent, and an antifoaming agent.

Solvent E )

The solvent (E) is not particularly limited, and any solvent can be used as long as it can dissolve the above-mentioned components and has an appropriate drying rate, and a uniform and smooth coating film can be formed after evaporation of the solvent.

As the solvent, an alkylene glycol alkyl ether acetate, a ketone, a butanediol alkyl ether acetate, a butanediol monoalkyl ether can be preferably used in consideration of coatability and drying property. An ester such as ethyl 3-ethoxypropionate or methyl 3-methoxypropionate. More preferably, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, methoxybutyl acetate, methoxybutanol, ethyl 3-ethoxypropionate can be used. , 3-methoxypropionic acid methyl ester, and the like.

The content of the solvent (E) may be 40 to 95 parts by weight, preferably 45 to 85 parts by weight, based on 100 parts by total of the photosensitive resin composition. If the above range is satisfied, a spin coater, a slit and a spin coater, a slit coater (sometimes referred to as a "molding coater", a "curtain flow coater"), an inkjet, etc. are used. When the coating device is applied, the coating property is good, which is preferable.

Light curing pattern and image display device

An object of the present invention is to provide a photocured pattern produced by the above-described photosensitive resin composition and an image display device having the photocured pattern.

The photocurable pattern produced by the above-mentioned photosensitive resin composition is excellent in low-temperature curability, and is excellent in chemical resistance, heat resistance, and the like. Therefore, it can be used for various patterns in an image display device, for example, an adhesive layer, an array flattening film, a protective film, an insulating film pattern, etc., and can also be used for a photoresist, a black matrix, a columnar spacer pattern, Black columnar spacer pattern, etc. However, it is not limited to these, and it is especially preferable as an insulating film pattern.

Examples of the image display device having such a photocured pattern or using the above-described pattern in a manufacturing process include a liquid crystal display device, an OLED, a flexible display, and the like. However, it is not limited to these, and all the image display apparatuses which are known in the field applicable are mentioned.

The photocurable pattern can be produced by applying the above-described photosensitive resin composition of the present invention onto a substrate, and (after necessary, a development process is required) to form a photocurable pattern.

The preferred embodiments are shown below in order to facilitate the understanding of the present invention, but these are merely illustrative of the invention and are not intended to limit the scope of the appended claims. It is obvious to those skilled in the art that various modifications and changes can be made to the embodiments of the present invention, and such modifications and modifications are of course also included in the appended claims.

Manufacturing example 1 : alkali soluble resin ( A-1 )Synthesis

In a 1-L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, nitrogen was introduced at 0.02 L/min to make a nitrogen atmosphere, and 150 g of diethylene glycol methyl ethyl ether was added thereto, and the mixture was heated to 70 with stirring. °C. Next, a mixture of the following Chemical Formula 5 and Chemical Formula 6 (mole ratio: 50:50) 132.2 g (0.60 mol), (3-ethyl-3-oxetanyl)methyl methacrylate 55.3 g (0.30 mol) and 8.6 g (0.10 mol) of methacrylic acid were dissolved in 150 g of diethylene glycol methyl ethyl ether and put in.

[Chemical Formula 5]

[Chemical Formula 6]

After the prepared solution was dropped into the flask using a dropping funnel, 27.9 g (0.11 mol) of 2,2'-azobis(2,4-dimethylvaleronitrile) of the initiator was dissolved in diethylene glycol. A solution of 200 g of methyl ethyl ether was dropped into the flask over 4 hours using an additional dropping funnel. After the completion of the dropwise addition of the solution of the initiator, it was maintained at 70 ° C for 4 hours, and then cooled to room temperature. Thus, a solution of a copolymer having a solid content of 41.8% by mass and an acid value of 62 mg-KOH/g (in terms of solid content) was obtained. The weight average molecular weight Mw was 7,700 and the molecular weight distribution was 1.89.

In this case, the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the above-mentioned dispersion resin were measured using HLC-8120GPC (manufactured by Tosoh Corporation), and the column was connected by connecting TSK-GELG4000HXL and TSK-GELG2000HXL in series. The column temperature was 40 ° C, tetrahydrofuran was used as the mobile phase solvent, the flow rate was 1.0 mL / min, the injection amount was 50 μL, and the detector was used with RI to make the concentration of the measurement sample 0.6% by mass (solvent = tetrahydrofuran). TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, and A-500 (manufactured by Tosoh Corporation) were used as standard materials for calibration.

The ratio of the weight average molecular weight and the number average molecular weight obtained above was defined as a molecular weight distribution (Mw/Mn).

Manufacturing example 2 : alkali soluble resin ( A-2 )Synthesis

In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was introduced at 0.02 L/min to form a nitrogen atmosphere, and 200 g of diethylene glycol methyl ethyl ether acetate was added thereto, and the temperature was raised to 100 °C. Then, after adding 10.4 g (0.10 mol) of styrene, 23.5 g (0.25 mol) of norbornene, 12.9 g (0.15 mol) of methacrylic acid, and 71.1 g (0.50 mol) of glycidyl methacrylate, A solution of 2.0 g of 2,2'-azobis(2,4-dimethylvaleronitrile) dissolved in 100 g of diethylene glycol methyl ethyl ether was dropped into the flask over a period of 2 hours with a dropping funnel, and further Stirring was continued for 5 hours at 100 °C.

After completion of the reaction, a copolymer having a solid content acid value of 55 mgKOH/g was obtained. The polystyrene-equivalent weight average molecular weight measured by GPC was 23,500, and the molecular weight distribution (Mw/Mn) was 2.3.

Example 1

5.6% of the resin obtained in the above-mentioned Production Example 1, 11.2% of the resin obtained in the production example 2, and 11.2% of dipentaerythritol hexaacrylate (KAYARAD DPHA: manufactured by Nippon Kayaku Co., Ltd.) as a polymerizable compound, In 0.7% of the oxime ester compound OXE-01 as a photoinitiator, 1% of SH-8400 as a decane-based additive and 1% of KBM-403 were mixed. Then, 2.4% of the additive compound of the following Chemical Formula 9 was mixed, and PGMEA as a solvent was mixed so that the total content became 100% by weight. The mixture was stirred for 3 hours to prepare a photopolymerizable composition.

[Chemical Formula 9]

Example 2

A photopolymerizable composition was prepared in the same manner as in the above Example 1 except that the additive compound of the following Chemical Formula 10 was used.

[Chemical Formula 10]

Example 3

A photopolymerizable composition was prepared in the same manner as in the above Example 1, except that 0.3% by weight of the additive compound of the above Chemical Formula 9 was added to the total weight of the composition.

Example 4

A photopolymerizable composition was prepared in the same manner as in the above Example 1, except that 7% by weight of the additive compound of the above Chemical Formula 9 was added to the total weight of the composition.

Comparative example 1

A photopolymerizable composition was prepared in the same manner as in the above Example 1 except that the additive compound of Chemical Formula 9 of the present invention was not contained.

Comparative example 2

A photopolymerizable composition was prepared in the same manner as in the above Example 1 except that the additive compound of the following Chemical Formula 11 was used.

[Chemical Formula 11]

Comparative example 3

A photopolymerizable composition was prepared in the same manner as in the above Example 1 except that the additive compound of the following Chemical Formula 12 was used.

[Chemical Formula 12]

Experimental example

A 2-inch square glass substrate (EAGLE 2000, manufactured by Corning Incorporated) was washed successively with a neutral detergent, water and alcohol, and then dried. The photosensitive resin compositions prepared in the above Examples and Comparative Examples were spin-coated on the glass substrate, respectively, and then prebaked at 80 ° C for 125 seconds using a hot plate. After the pre-baked substrate was cooled to room temperature, the distance between the light-shielding and the quartz glass was 150 μm, and an exposure amount (365 nm/cm 2 ) was used (exposure machine (UX-1100SM, manufactured by Ushio Co., Ltd.) at 40 mJ/cm 2 (365 nm). Benchmark) Perform a light scan. At this time, as the light mask, a light mask having a square pattern having a side of 30 μm on the same plane and having a mutual interval of 100 μm was used.

After the light irradiation, the above coating film was immersed in a 2.38% aqueous solution of tetramethylammonium hydroxide at 25 ° C for 60 seconds, developed, washed with water and dried. Then, post-baking was carried out at 100 ° C for 60 minutes in a cleaning oven. The thickness of the obtained contact hole pattern forming coating film was 1.5 μm. The chemical resistance of the coating film thus obtained was evaluated as follows. The results are shown in Table 1 below.

The coating film obtained above was immersed in HNO ₃ and an aqueous HCl solution (70% nitric acid (80%) + concentrated hydrochloric acid (20%)), and treated at 45 ° C for 2 minutes. Then, based on the ASTM D-3359-08 standard test conditions, the coating film was cut by a cutter, and the chemical resistance was confirmed by attaching a tape to the surface and peeling off. In the test of the dicing/tape after the chemical liquid treatment, the degree of peeling of the coating film was determined to be 0B to 5B based on the standard test method, and the sample having the most excellent performance was set to 5B.

5B: Stripping 0%

4B: less than 5% stripping

3B: 5% or more and less than 15% peeling

2B: 15% or more and less than 35% peeling

1B: 35% or more and less than 65% peeling

0B: 65% or more peeling

(1) Surface damage

◎: There is no surface damage on the surface of the pattern when observed by SEM.

○: Surface damage was observed in 2 to 3% of 100 patterns during SEM observation

△: Surface damage was observed in 10 to 30% of 100 patterns when observed by SEM

×: Surface damage was observed in 50 to 80% of 100 patterns when observed by SEM

(2) Membrane changes

◎: The film thickness change before and after the etchant treatment is less than 1%

○: The change in film thickness before and after the etchant treatment is 1 to 2%.

△: The change in film thickness before and after the etchant treatment is 3-4%

×: The change in film thickness before and after the etchant treatment is 5 to 6%.

Table 1

It is confirmed from the above-mentioned Table 1 that the pattern produced by using the photosensitive resin composition of the present invention, that is, the composition of the examples, is excellent in chemical resistance and pencil hardness, excellent in durability, and excellent in transmittance.

In the pattern produced by the composition of the comparative example which is not the photosensitive resin composition of the present invention, it was confirmed that the chemical resistance and the pencil hardness were lower than those of the examples, and the transmittance was also lowered.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

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Claims (8)

A negative photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive, and (E) a solvent, wherein The (D) additive contains a compound represented by the following Chemical Formula 1, In the above Chemical Formula 1, the above R ¹ and R ² are each independently hydrogen or a C ₁ -C ₆ linear or side chain alkyl group, and the above m represents the number of repeating units in the main chain, and the above m It is an integer from 4 to 12. The negative photosensitive resin composition as described in claim 1, wherein R ¹ and R ² in the compound of Chemical Formula 1 are each independently hydrogen. The negative photosensitive resin composition as described in claim 1, wherein the compound of the chemical formula 1 is contained in an amount of 0.1 to 5% by weight based on the total weight of the negative photosensitive resin composition. The negative photosensitive resin composition according to claim 1, wherein the (A) alkali-soluble resin comprises a first resin having a repeating unit represented by the following Chemical Formula 2, and has the following Chemical Formula 3; The second resin of the repeating unit indicated, [Chemical Formula 2] R in the above Chemical Formula 3 is hydrogen or a methyl group (-CH ₃ ). The negative photosensitive resin composition as described in claim 1, wherein the negative photosensitive resin composition is cured at a temperature of 70 to 100 °C. A photocurable pattern formed of the negative photosensitive resin composition according to any one of claims 1 to 5. The photocuring pattern according to claim 6, wherein the photocuring pattern is selected from the group consisting of an array planarization film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a black matrix pattern, and a column spacer. pattern. An image display device having the photocuring pattern as described in claim 6 of the patent application.