KR102329943B1 - Negative photosensitive resin composition and photo-cured pattern prepared from the same - Google Patents

Abstract

The present invention relates to a negative photosensitive resin composition and an insulating film prepared therefrom. The pattern manufactured using the negative photosensitive resin composition according to the present invention has excellent chemical resistance and pencil hardness, so it has excellent durability, and excellent transmittance. The device can be usefully used.

Description

Negative photosensitive resin composition and photocurable pattern prepared therefrom

The present invention relates to a negative photosensitive resin composition and a photocurable pattern prepared therefrom.

In the display field, a photosensitive resin composition is used to form various photocurable patterns such as a photoresist, an insulating film, a protective film, a black matrix, and a column spacer. Specifically, the photosensitive resin composition is selectively exposed and developed by a photolithography process to form a desired photocurable pattern. In this process, in order to improve the yield in the process and improve the physical properties of the target, photosensitive with high sensitivity A type resin composition is calculated|required.

The pattern formation of the photosensitive resin composition is caused by photolithography, that is, a change in the polarity of a polymer and a crosslinking reaction caused by a photoreaction. In particular, the characteristic of changing solubility in a solvent such as an aqueous alkali solution after exposure is used.

Pattern formation by the photosensitive resin composition is classified into a positive type and a negative type according to the solubility of the photosensitive portion to development. In the positive type photoresist, the exposed portion is dissolved by the developer, and in the negative type photoresist, the exposed portion is not dissolved in the developer and the unexposed portion is dissolved to form a pattern, and the positive and negative types are used They differ from each other, such as binder resin and a crosslinking agent.

In recent years, the use of a touch screen having a touch panel has been explosively increased, and in recent years, a flexible touch screen is receiving great attention. Accordingly, materials such as various substrates used for touch screens must have flexible characteristics, and accordingly, the available materials are also limited to flexible polymer materials, and the manufacturing process is also required to be performed under milder conditions. have.

Accordingly, the curing conditions of the photosensitive resin composition also require low-temperature curing in the conventional high-temperature curing, but low-temperature curing has problems in reactivity and durability of the formed pattern.

Korean Patent Registration No. 10-1302508 discloses a negative photosensitive resin composition that has excellent heat resistance and light resistance and can improve sensitivity by including a copolymer polymerized using a cyclohexenyl acrylate monomer, but at low temperature Under curing conditions, it does not exhibit the required durability.

Korean Patent Registration No. 10-1302508

An object of the present invention is to provide a negative photosensitive resin composition that can be cured at a low temperature, has excellent reactivity, and has excellent durability such as adhesion to a metal substrate and chemical resistance of a formed pattern.

1. A negative photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive, and (E) a solvent, wherein the (D) additive has the following formula A negative photosensitive resin composition, which is a compound represented by 1:

[Formula 1]

(In Formula 1,

The R ¹ or R ² are each independently hydrogen or a C ₁ -C ₆ straight-chain or branched alkyl group,

Wherein m and n each represent a repeating unit in the main chain,

wherein m is an integer from 4 to 12).

2. The negative photosensitive resin composition of the ^{above 1, wherein R 1} or R ² of the compound of Formula 1 is each independently hydrogen.

3. The negative photosensitive resin composition of the above 1, wherein the compound of Formula 1 is included in an amount of 0.1 to 5% by weight based on the total weight of the composition.

4. The negative of the above 1, wherein the (A) alkali-soluble resin comprises a first resin comprising a repeating unit represented by the following formula (2) and a second resin comprising a repeating unit represented by the following formula (3) Photosensitive resin composition:

[Formula 2]

[Formula 3]

(In Formula 3, R is hydrogen or methyl (-CH ₃ )).

5. The negative photosensitive resin composition according to the above 1, wherein the negative photosensitive resin composition can be cured at a low temperature of 70 to 100 ℃.

6. A photocurable pattern formed of the negative photosensitive resin composition of 1 to 5 above.

7. The photocurable pattern of the above 6, wherein the photocurable pattern is selected from the group consisting of an array planarization film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a black matrix pattern, and a column spacer pattern.

8. An image display device including the photocuring pattern of 6 above.

The pattern prepared by using the negative photosensitive resin composition according to the present invention has excellent adhesion to a metal substrate and chemical resistance of the pattern, and is useful for manufacturing a photocurable pattern and an image display device including a photocurable pattern prepared therefrom can be used

The present invention relates to a negative photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive, and (E) a solvent, wherein the (D) additive is Provided is a negative photosensitive resin composition, which is a compound represented by the formula (1):

[Formula 1]

(In Formula 1,

The R ¹ or R ² are each independently hydrogen or a C ₁ -C ₆ straight-chain or branched alkyl group,

Wherein m and n each represent a repeating unit in the main chain,

wherein m is an integer from 4 to 12).

According to the present invention, by including the additive compound represented by Formula 1 in the negative photosensitive resin composition, the pattern prepared using the composition has excellent adhesion to the metal substrate and chemical resistance of the pattern, and the photocurable pattern is manufactured and an image display device including a photocurable pattern prepared therefrom.

Hereinafter, the negative photosensitive resin composition according to the present invention will be described in more detail with respect to various aspects and various embodiments of the present invention.

The negative photosensitive resin composition of the present invention includes (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive represented by the formula (1), and (E) a solvent:

[Formula 1]

(In Formula 1,

The R ¹ or R ² are each independently hydrogen or a C ₁ -C ₆ straight-chain or branched alkyl group,

Wherein m and n each represent a repeating unit in the main chain,

wherein m is an integer from 4 to 12).

Alkali-soluble resin (A)

The alkali-soluble resin (A) used in the present invention is a negative photosensitive resin comprising a first resin including a repeating unit represented by the following formula (2) and a second resin including a repeating unit represented by the following formula (3) Composition:

[Formula 2]

[Formula 3]

In Formula 3, R is hydrogen or methyl (-CH ₃ ).

Since the alkali-soluble resin (A) of the present invention includes the first resin including the repeating unit of Chemical Formula 2, it is possible to exhibit the effect of improving adhesion after etchant treatment on a substrate such as a metal. The substrate may be a substrate provided with a metal film, a non-metal film, a metal oxide film, a non-metal oxide film, or the like. Specifically, if the film provided on these substrates is exemplified, an amorphous silicon film, a silicon nitride film, a silicon oxide film, indium tin oxide (ITO), tin oxide, aluminum (Al), molybdenum (Mo), chromium (Cr), copper (Cu) ), but is not limited thereto.

The amount of the repeating unit of Formula 2 with respect to the first resin may be preferably 2 to 30% by weight, and more preferably 5 to 10% by weight.

In addition, the alkali-soluble resin of the present invention includes the second resin including the repeating unit of Formula 3, thereby accelerating the ring opening reaction and polymerization by heat in the thermal process step, thereby reactivity This is improved, and chemical resistance, that is, damage due to the etchant, may be exhibited in a process manner.

The amount of the repeating unit of Formula 2 with respect to the second resin may be preferably 10 to 40% by weight, and more preferably 20 to 30% by weight.

The first resin and the second resin according to the present invention may further include, independently of each other, repeating units derived from other monomers known in the art in addition to the repeating units of Chemical Formulas 2 and 3.

The monomer forming the repeating unit that can be added to the first resin and the second resin is not particularly limited, but includes, for example, dicarboxylic acids and anhydrides thereof; aromatic vinyl compounds; vinyl cyanide compounds; Mono (meth)acrylates of a polymer having a carboxyl group and a hydroxyl group at both terminals; alkyl (meth)acrylates; alicyclic (meth)acrylates; aryl (meth) acrylates; (meth)acrylates substituted with a cycloalkane or dicycloalkane ring having 4 to 16 carbon atoms; unsaturated oxetane compounds; unsaturated oxirane compounds; One or two or more selected from the above may be mentioned, and more preferably a (meth)acrylic monomer may be used.

In the present invention, "(meth)acryl-" means "methacryl-", "acryl-", or both.

The (meth)acrylic monomer may more preferably be a monomer represented by the following formula (4).

[Formula 4]

In Formula 4, R is hydrogen or methyl (-CH ₃ ).

The first resin and the second resin included in the alkali-soluble resin are preferably included in a weight ratio of 1: 1 to 1: 15, and more preferably included in a weight ratio of 1: 1 to 1: 6.

In the present invention, the weight average molecular weight of the first resin contained in the alkali-soluble resin (A) is preferably 4,000 to 25,000, more preferably 5,000 to 10,000.

In addition, the weight average molecular weight of the second resin contained in the alkali-soluble resin (A) is preferably 4,000 to 25,000, more preferably 8,000 to 15,000.

The acid value of the alkali-soluble resin (A) is preferably 20 to 200 mgKOH/g, more preferably 40 to 100 mgKOH/g.

The content of the alkali-soluble resin (A) is not particularly limited, but may be included in a weight fraction of usually 10 to 90% by weight, more preferably 25 to 70% by weight, based on the solid content in the photosensitive resin composition.

polymeric Compound (B)

The polymerizable compound (B) used in the photosensitive resin composition of the present invention may increase the crosslinking density during the manufacturing process and may enhance the mechanical properties of the photocurable pattern.

The polymerizable compound (B) may be used without any particular limitation to those used in the art, for example, monofunctional monomers, difunctional monomers and other polyfunctional monomers, and the type is not particularly limited, but the following compounds are for example.

Specific examples of the monofunctional monomer include nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpyrrol money, etc. Specific examples of the bifunctional monomer include 1,6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, Bis(acryloyloxyethyl) ether of bisphenol A, 3-methylpentanediol di(meth)acrylate, etc. are mentioned. Specific examples of other polyfunctional monomers include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, and pentaerythritol tri (meth)acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol Hexa(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. are mentioned. Among these, the polyfunctional monomer more than bifunctional is used preferably.

The content of the polymerizable compound (B) is not particularly limited, but for example, 10 to 90 parts by weight, preferably 30 to 80 parts by weight, based on 100 parts by weight of the alkali-soluble resin based on the solid content in the photosensitive resin composition. It can be used in a negative range.

light curing initiator (C)

The photopolymerization initiator (C) according to the present invention can be used without particularly limiting the type as long as it can polymerize the polymerizable compound (B), for example, acetophenone-based compound, benzophenone-based compound, tria At least one compound selected from the group consisting of a ginsic compound, a biimidazole-based compound, a thioxanthone-based compound, and an oxime ester-based compound may be used, and an oxime ester-based compound is preferably used.

In addition, the photopolymerization initiator (D) may further include a photopolymerization initiator auxiliary in order to improve the sensitivity of the photosensitive resin composition of the present invention. The photosensitive resin composition according to the present invention contains a photopolymerization initiation adjuvant, thereby further increasing the sensitivity and improving productivity.

The photopolymerization initiation adjuvant may include at least one compound selected from the group consisting of an amine compound, a carboxylic acid compound, and an organic sulfur compound having a thiol group.

The content of the photopolymerization initiator (D) is not particularly limited, but, for example, may be included in an amount of 0.1 to 10 parts by weight, preferably 0.1 to 5 parts by weight, based on solid content, based on 100 parts by weight of the total photosensitive resin composition. may be included. When the above range is satisfied, the photosensitive resin composition is highly sensitive and the exposure time is shortened, so that productivity is improved and high resolution can be maintained, and the strength of the formed pixel part and smoothness on the surface of the pixel part can be improved. good in

Additive (D)

The photosensitive resin composition of the present invention includes an additive represented by the following formula (1):

[Formula 1]

(In Formula 1,

The R ¹ or R ² are each independently hydrogen or a C ₁ -C ₆ straight-chain or branched alkyl group,

Wherein m and n each represent a repeating unit in the main chain,

wherein m is an integer from 4 to 12).

The additive compound of Formula 1 according to the present invention has excellent chemical resistance by including a plurality of aromatic ring structures. In addition, -OH can improve adhesion to the metal substrate, and the cyclohexane functional group having the carboxyl group not only increases developability, but also increases the reaction reliability by the carbon double bond functional group at the end of the novolak-type epoxy-modified monomer. and has the effect of increasing the curing density.

In a preferred embodiment, in the compound of Formula 1 of the present invention, R ¹ or R ² are each independently hydrogen.

In addition, according to the present invention, when the integer m of the compound of Formula 1 is less than 4, there is a problem in that the residual film rate and chemical resistance are lowered, and when it exceeds 12, developability is lowered. In this aspect, m in Formula 1 of the present invention may be an integer of preferably 4 to 10, more preferably an integer of 4 to 8.

In the present invention, the compound of Formula 1 may be included in an amount of 0.1 to 5% by weight based on the total weight of the photosensitive resin composition.

As a preferred example, when the compound of Formula 1 is included in an amount of less than 0.1% by weight based on the total weight of the photosensitive resin composition, there is a problem that it is difficult to form a fine pattern due to severe swelling, and the compound of Formula 1 is used in the photosensitive resin composition When it exceeds 5% by weight based on the total weight, there may be a problem in that chemical resistance and hardness are remarkably deteriorated.

On the other hand, in addition to the additives represented by Formula 1 of the present invention, additives such as a basic compound, a surfactant, an adhesion improver, a thermal crosslinking agent, a light stabilizer, a photocuring accelerator, an antihalation agent (leveling agent), an antifoaming agent, etc. It may further include within a range that does not deviate from the purpose of the invention.

Solvent (E)

The type of solvent (E) is not particularly limited, and any solvent can be used as long as it can dissolve the above-mentioned components, has a suitable drying rate, and can form a uniform and smooth coating film after evaporation of the solvent.

The solvent is esters such as alkylene glycol alkyl ether acetates, ketones, butanediol alkyl ether acetates, butanediol monoalkyl ethers, 3-ethoxy ethyl propionate, 3-methoxy methyl propionate, etc. may be preferably used, more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, methoxybutyl acetate, methoxybutanol, 3-ethoxypropionate ethyl, 3-methoxypropionic acid methyl and the like can be used.

The content of the solvent (E) may be included in an amount of 40 to 95 parts by weight, preferably 45 to 85 parts by weight, based on 100 parts by weight of the total in the photosensitive resin composition. When the above range is satisfied, it is preferable because the applicability is improved when it is applied with an application device such as a spin coater, a slit & spin coater, a slit coater (sometimes called a die coater or a curtain flow coater), or an inkjet.

photocuring Pattern and image display device

An object of the present invention is to provide a photocurable pattern made of the photosensitive resin composition and an image display device including the photocurable pattern.

The photocurable pattern prepared from the photosensitive resin composition has excellent low-temperature curability, chemical resistance, heat resistance, and the like. Accordingly, in the image display device, various patterns, for example, an adhesive layer, an array planarization film, a protective film, an insulating film pattern, etc. may be used, and may be used as a photoresist, a black matrix, a column spacer pattern, a black column spacer pattern, etc. However, it is not limited thereto, and in particular, it is very suitable as an insulating film pattern.

An image display device having such a photocurable pattern or using the pattern during the manufacturing process may include a liquid crystal display device, an OLED, a flexible display, etc., but is not limited thereto, and all image display devices known in the art that can be applied can be exemplified.

The photocurable pattern can be prepared by coating the photosensitive resin composition of the present invention described above on a substrate and forming a photocurable pattern (after undergoing a developing process if necessary).

Hereinafter, the present invention will be described in more detail by way of Examples and the like, but the scope and content of the present invention may not be construed as being reduced or limited by the Examples below. In addition, based on the disclosure of the present invention including the following examples, it is clear that a person skilled in the art can easily practice the present invention for which no specific experimental results are presented, and such modifications and modifications are included in the attached patent. It goes without saying that they fall within the scope of the claims.

manufacturing example 1: Synthesis of alkali-soluble resin (A-1)

In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was flowed at 0.02 L/min to make a nitrogen atmosphere, and 150 g of diethylene glycol methyl ethyl ether was added and heated to 70° C. while stirring. Then, 132.2 g (0.60 mol) of a mixture of Chemical Formulas 5 and 6 ((molar ratio 50:50), (3-ethyl-3-oxetanyl)methyl methacrylate 55.3 g (0.30 mol) and methacrylic acid 8.6 g (0.10 mol) was dissolved in 150 g of diethylene glycol methyl ethyl ether and added.

[Formula 5]

[Formula 6]

After the prepared solution was added dropwise into the flask using a dropping funnel, 27.9 g (0.11 mol) of a polymerization initiator 2,2'-azobis (2,4-dimethylvaleronitrile) was added to 200 g of diethylene glycol methyl ethyl ether. The solution dissolved in was added dropwise into the flask over 4 hours using a separate dropping funnel. After the dropwise addition of the polymerization initiator solution was completed, it was maintained at 70° C. for 4 hours, then cooled to room temperature, and a solution of a copolymer having a solid content of 41.8 mass% and an acid value of 62 mg-KOH/g (in terms of solid content) was obtained. The weight average molecular weight Mw was 7,700, and molecular weight distribution was 1.89.

At this time, the weight average molecular weight (Mw) and number average molecular weight (Mn) of the dispersion resin were measured using HLC-8120GPC (manufactured by Toso Co., Ltd.), and the column was used by connecting TSK-GELG4000HXL and TSK-GELG2000HXL in series. , column temperature was 40 ° C, mobile phase solvent was tetrahydrofuran, flow rate was 1.0 ml/min, injection amount was 50 μl, detector RI was used, and the measurement sample concentration was 0.6 mass % (solvent = tetrahydrofuran), calibration standard As the material, TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, and A-500 (manufactured by Tosoh Corporation) were used.

The ratio of the weight average molecular weight and the number average molecular weight obtained above was taken as the molecular weight distribution (Mw/Mn).

manufacturing example 2: Synthesis of alkali-soluble resin (A-2)

In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was flowed at 0.02 L/min to make a nitrogen atmosphere, 200 g of diethylene glycol methyl ethyl ether acetate was introduced, and the temperature was raised to 100 ° C. Then, 10.4 g (0.10 mol) of styrene ), 23.5 g (0.25 mol) of norbornene, 12.9 g (0.15 mol) of methacrylic acid, 71.1 g (0.50 mol) of glycidyl methacrylate, and 2,2'-azobis (2,4- A solution of 2.0 g of dimethylvaleronitrile) dissolved in 100 g of diethylene glycol methyl ethyl ether was added dropwise from the dropping funnel to the flask over 2 hours, and further stirring was continued at 100° C. for 5 hours.

After completion of the reaction, a copolymer having a solid content acid value of 55 mgKOH/g was obtained. The weight average molecular weight in terms of polystyrene measured by GPC was 23,500, and the molecular weight distribution (Mw/Mn) was 2.3.

Example One

5.6% of the resin obtained in Preparation Example 1, 11.2% of the resin obtained in Preparation Example 2, and 11.2% dipentaerythritol hexaacrylate (KAYARAD DPHA: manufactured by Nippon Kayaku Co., Ltd.) as a monomer oxime ester compound OXE- After mixing 1% of SH-8400 and 1% of KBM-403 as a silane-based additive in 0.7% of 01, 2.4% of the additive compound of the following formula 9 was mixed, and mixed with PGMEA as a solvent so that the total content was 100% by weight. The mixture was stirred for 3 hours to prepare a photopolymerization composition.

[Formula 9]

Example 2

A photopolymerization composition was prepared in the same manner as in Example 1, except that the additive compound represented by the following Chemical Formula 10 was used.

[Formula 10]

Example 3

A photopolymerization composition was prepared in the same manner as in Example 1, except that 0.3 wt% of the additive compound of Formula 9 was added based on the total weight of the composition.

Example 4

A photopolymerization composition was prepared in the same manner as in Example 1, except that 7 wt% of the additive compound of Formula 9 was added based on the total weight of the composition.

comparative example One

A photopolymerization composition was prepared in the same manner as in Example 1, except that the additive compound of Formula 9 of the present invention was not included.

comparative example 2

A photopolymerization composition was prepared in the same manner as in Example 1, except that the additive compound represented by the following Chemical Formula 11 was used.

[Formula 11]

comparative example 3

A photopolymerization composition was prepared in the same manner as in Example 1, except that the additive compound represented by the following Chemical Formula 12 was used.

[Formula 12]

Experimental example

A glass substrate having a width of 2 inches (Eagle 2000; manufactured by Corning) was sequentially washed with a neutral detergent, water and alcohol, and then dried. Each of the photosensitive resin compositions prepared in Examples and Comparative Examples were spin-coated on the glass substrate and then pre-baked at 80° C. for 125 seconds using a hot plate. After cooling the pre-baked substrate to room temperature, using an exposure machine (UX-1100SM; manufactured by Ushio Co., Ltd.) at an interval of 150 μm with a quartz glass photomask, light was emitted at an exposure dose of 40 mJ/cm 2 (based on 365 nm). investigated. In this case, a photomask having a square pattern with a side of 30 μm on the same plane and having an interval of 100 μm was used.

After light irradiation, the coating film was developed by immersing it in 2.38% tetraammonium hydroxide aqueous solution at 25° C. for 60 seconds, washing with water and drying, and post-baking at 100° C. for 60 minutes using a clean oven. The film thickness of the obtained contact hole pattern formation coating film was 1.5 micrometers. The coating film thus obtained was subjected to chemical resistance evaluation as follows, and the results are shown in Table 1 below.

The coating film obtained above _{was immersed in HNO 3} and HCl aqueous solution (70% nitric acid (80%) + concentrated hydrochloric acid (20%)) and treated for 45 minutes/2 minutes with a cutter according to ASTM D-3359-08 standard test conditions. Chemical resistance was confirmed by attaching and peeling the tape on the cut surface. In the cutting/tape test after chemical treatment, the degree of peeling of the coating film is defined as 0B to 5B based on the standard test method, and 5B is judged to have the best performance (5B peeling 0%, 4B peeling less than 5%) , 3B peel 5~15%, 2B peel 15~35%, 1B peel 35~65%, 0B peel 65% or more).

(1) Surface damage

◎: No surface damage on the pattern surface during SEM observation

○: Observe 2~3% of 100 patterns of surface damage on the pattern surface during SEM observation

△: Observe 10~30% of 100 patterns of surface damage on the pattern surface when observing SEM

X: Observe 50~80% of 100 surface damage patterns on the pattern surface during SEM observation

(2) membrane change

◎: Less than 1% change in film thickness before and after etching treatment

○: 1~2% change in film thickness before and after etching treatment

△: 3 to 4% of film thickness change before and after etching treatment

X: Change in film thickness before and after etchant treatment 5 to 6%

adhesion surface damage membrane contraction Example 1 5B ◎ ◎ Example 2 5B ◎ ◎ Example 3 5B ◎ ◎ Example 4 4B ◎ ◎ Comparative Example 1 1B X X Comparative Example 2 2B X ○ Comparative Example 3 2B X ○

As shown in Table 1, it was confirmed that the patterns prepared using Examples, which are the photosensitive resin compositions of the present invention, were excellent in chemical resistance and pencil hardness, and thus had excellent durability and excellent transmittance.

However, in the case of the pattern prepared using the comparative example, not the photosensitive resin composition of the present invention, it was confirmed that the chemical resistance and pencil hardness were lowered compared to the examples, and the transmittance was also lowered.

Claims (8)

A negative photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a polymerizable compound, (C) a photoinitiator, (D) an additive, and (E) a solvent,
The (D) additive is a negative photosensitive resin composition which is a compound represented by the following Chemical Formula 1:
[Formula 1]

(In Formula 1,
Wherein R ¹ or R ² are each independently hydrogen or a C ₁ -C ₆ straight chain or C ₃ -C ₆ branched alkyl group,
Wherein m represents a repeating unit in the main chain,
wherein m is an integer from 4 to 12).
The negative photosensitive resin composition of ^{claim 1, wherein R 1} or R ² of the compound of Formula 1 is each independently hydrogen.
The negative photosensitive resin composition of claim 1, wherein the compound of Formula 1 is included in an amount of 0.1 to 5% by weight based on the total weight of the composition.
The negative photosensitive type of claim 1 , wherein the (A) alkali-soluble resin comprises a first resin including a repeating unit represented by the following formula (2) and a second resin including a repeating unit represented by the following formula (3). Resin composition:
[Formula 2]

[Formula 3]

(In Formula 3, R is hydrogen or methyl (-CH ₃ )).
The negative photosensitive resin composition of claim 1, wherein the negative photosensitive resin composition is curable at a low temperature of 70 to 100°C.
A photocurable pattern formed of the negative photosensitive resin composition of any one of claims 1 to 5.
The photocurable pattern of claim 6 , wherein the photocurable pattern is selected from the group consisting of an array planarization film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a black matrix pattern, and a column spacer pattern.
An image display device comprising the photocurable pattern of claim 6.