TW201733773A - Imprint device, imprint method, and method for manufacturing article - Google Patents

Abstract

To provide an imprint device and an imprint method, capable of highly accurately supplying an imprint material. An imprint device 100 forms a pattern of a hardened imprint material 102 on a substrate 101 by bringing a mold 103 into contact with the imprint material 102 and hardening the imprint material 102. The imprint device comprises: moving means 111 for moving the substrate 101; discharging means 115 including a discharge port 116a and for discharging the imprint material 102 from the discharge port 116a while the moving means 111 is moving the substrate 101; measuring means 126 for measuring information about a position in a height direction of a surface of the substrate 101; determining means 122 for determining information about the distance distribution between the discharge port 116a and the substrate 101 on the basis of the determination results of the measuring means 126; and correcting means 122 for correcting the supply conditions of the imprint material 102 on the basis of the information determined by the determining means 122.

Description

Imprinting device, imprinting method, and method of manufacturing the article

The present invention relates to an imprint apparatus, an imprint method, and a method of manufacturing an article.

An imprint apparatus is known as an apparatus for forming a fine pattern on a substrate for manufacturing a semiconductor component or the like. The imprint apparatus is for contacting an imprint material (for example, a photocurable composition) supplied onto a substrate with a mold, and imparting energy for hardening to the imprint material, thereby forming a hardened material for transferring the uneven pattern of the mold. Graphic device.

Patent Document 1 discloses a correction method for correcting a direction in which a plurality of discharge ports of a discharge material are discharged and a short side direction of a rectangular processed region, and both are inclined in a direction of rotation in a vertical direction. The resulting positional target of the supply of the imprinted material is deviated from the supply position.

Specifically, it is disclosed that an angle of a rotation direction between a plurality of discharge ports and a short direction of a rectangular processed region is measured, and a time point of the discharge of the imprint material or a movement of the platform is corrected according to the rotation angle. direction.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-69758

In general, when the substrate is moved while the substrate is being moved, the discharge material is discharged by the discharge means, and the predetermined time of the discharge is determined in consideration of the predetermined time lag.

However, due to the bending of the substrate or the thickness distribution of the substrate, the distance between the discharge port and the substrate is often uneven, and the distance between the discharge port and the substrate is different, and the imprint material is discharged from the discharge to the substrate. There is a discrepancy in the time of the air gap.

The predetermined lag time deviates from the actual stagnation time, which causes the supply position of the embossed material to be offset from the target position.

Patent Document 1 describes a correction of the rotation angle, but does not disclose a supply position correction method in which the distance between the discharge port and the substrate is uneven.

Therefore, in the imprint apparatus of Patent Document 1, the distance between the discharge port and the substrate is uneven, and the supply position of the imprint material is shifted, which makes it difficult to form a pattern with high precision.

The present invention has been made in view of the above problems, and its object It is to provide an imprint apparatus and an imprint method which can supply an imprint material with high precision.

The present invention relates to an imprint apparatus for forming a pattern of an imprint material on a substrate by using a mold, comprising: a supply means including a discharge port, and discharging the imprint material from the discharge port and supplying the imprint material to the substrate And measuring means for measuring position information on a height direction of the surface of the substrate, wherein the supply means supplies the distribution information of the distance between the discharge port and the substrate obtained by the measurement result of the measuring means. The aforementioned imprinted material.

100‧‧‧ Imprinting device

101‧‧‧Substrate

102‧‧‧imprinted materials

103‧‧‧Mold

115‧‧‧ spitting means (supply means)

116a‧‧‧Export

122‧‧‧Control Department (decision means, means of correction)

126‧‧‧Measurement Department (measurement means)

Fig. 1 is a view showing the structure of an imprint apparatus according to an embodiment.

Fig. 2 is a view showing the structure of a discharge means.

Fig. 3 is a flow chart showing the imprint method of the first embodiment.

4 is a view for explaining a position in a height direction of a surface of a substrate.

Fig. 5 is a view showing a position at which the imprint material is supplied when the distance between the discharge port and the substrate is constant.

Fig. 6 is a view showing a position at which the imprint material is supplied in a case where the distance between the discharge port and the substrate is not constant.

Fig. 7 is a view for explaining a method of correcting supply conditions in the first embodiment;

Fig. 8 is a view showing a method of correcting supply conditions in the first embodiment;

Fig. 9 is a view for explaining a reference plane.

Fig. 10 is a view for explaining a measuring method according to a fifth embodiment;

Fig. 11 is a view showing the result of photography in the fifth embodiment.

[First Embodiment] (device configuration)

Fig. 1 is a view showing the structure of an imprint apparatus 100 according to an embodiment. In Fig. 1, the vertical direction (height direction) is the Z axis. Further, two axes orthogonal to each other are defined as an X-axis and a Y-axis in a plane perpendicular to the Z-axis (in a plane intersecting the height direction). The positional components in the X-axis direction and the Y-axis direction in the XY plane are represented by (X, Y).

In the present embodiment, the imprint material 102 is a photocurable material.

The illuminating unit 104 irradiates the substrate 101 with the ultraviolet ray 105 to cure the imprinted material 102 in the non-hardened state. The material of the mold 103 is a material such as quartz which allows the ultraviolet rays 105 to penetrate. The illuminating unit 104 includes a light source 106 that emits the ultraviolet ray 105 and a mirror 107 that bends the optical path of the ultraviolet ray 105 toward the direction of the substrate 101.

The outer periphery of the mold 103 has a rectangular shape, and has a rectangular pattern portion 103a in which a concave-convex pattern is formed at a central portion thereof. Multiple on the substrate 101 A pattern area 120 which is a processing area which is almost the same size as the pattern portion 103a is formed.

In the imprint apparatus 100, an operation of bringing the imprint material 102 into contact with the mold 103 (hereinafter referred to as a stamper operation) is performed. Further, in a state where the imprint material 102 is brought into contact with the mold 103, the imprint material 102 is cured to form a pattern on the substrate 101.

A plurality of pattern regions 120 are formed on the substrate 101, and the imprint apparatus 100 forms a transfer pattern of the pattern portion 103a on one pattern region 120 by a single stamper operation.

One graphic area 120 corresponds to one or a plurality of short areas. The short area refers to a unit area of the base layer on which the pattern has been formed, and is formed by separation lines (not shown).

One short area is, for example, a size of about 26 mm × 33 mm. In one short area, one or a plurality of patterns of the wafer size desired by the user can be formed.

The chuck 108 holds the mold 103 by vacuum suction or electrostatic force. The drive mechanism 109 moves the chuck 108 and the mold 103 in the Z-axis direction. In order to allow the ultraviolet ray 105 to reach the substrate 101, the chuck 108 and the drive mechanism 109 have an opening region 110 at the center portion. The mold 103 is moved during the press operation of the mold 103 and the separation operation of the mold 102 and the mold 103 (hereinafter referred to as the mold release operation).

The imprint apparatus 100 is a substrate platform (moving means) 111 which is a moving means for relatively moving the substrate 101 and the discharge port 116a. The substrate platform 111 has a suction cup 112a and a driving mechanism 112b. The substrate 101 is positioned in accordance with an instruction from a control unit 122 to be described later. The chuck 112a holds the substrate 101 by vacuum suction or electrostatic force. The drive mechanism 112b moves in the XY plane while the substrate 101 is held by the suction pad 112a. The user in the position measurement of the substrate 101 is provided on the drive mechanism 112b. The drive mechanism 112b is, for example, a pneumatic cylinder or a piezoelectric actuator.

The drive mechanism 109 and the drive mechanism 112b may be constituted by a plurality of drive systems such as a coarse drive system or a micro drive system. Further, the drive mechanism 109 may be a mechanism that moves the mold 103 in the X-axis direction, the Y-axis direction, and the rotation direction of each axis, not only in the Z-axis direction. The drive mechanism 112b may be a mechanism that moves the substrate 101 not only in the X-axis direction but also in the Y-axis direction, but also in other axial directions and in the rotation direction around each of the shafts. The stamper operation and the mold release operation may be performed by moving at least one of the mold 103 and the substrate 101 in the Z-axis direction.

A transmissive member 113 is disposed above the mold 103, whereby a space 114 in which pressure can be adjusted is provided in the opening region 110. When the pattern portion 103a is brought into contact with the imprint material 102, the pattern portion 103a is bent into a convex shape in the direction of the substrate 101. Thereby, air bubbles can be prevented from being mixed between the mold 103 and the imprinted material 102, and the imprinted material 102 can be filled to each corner of the pattern portion 103a.

Fig. 2 is a view showing the discharge means (supply means) 115 viewed from the -Z direction. A plurality of nozzles 116 are arranged along the Y-axis direction. The discharge means 115 is a discharge port (supply port) 116a including a nozzle 116. The plate stage 111 discharges the platen 102 from the discharge port 116a while the substrate 101 is moved in a predetermined direction (the -X direction in the present embodiment). The discharge means 115 discharges 110 parts of the imprint material 102 in one pattern area by one supply operation. The discharge means 115 that is fixedly disposed discharges the imprint material 102 by a predetermined amount at a predetermined time interval. Thereby, the imprint material 102 is supplied to the pattern area 120 on the substrate 101.

The nozzle 116 has a piezoelectric element (not shown) as a discharge mechanism, and the piezoelectric material 102 is extruded by a piezoelectric effect. The voltage waveform applied to the piezoelectric element (hereinafter referred to as a driving waveform) or the time at which the voltage is applied in accordance with the driving waveform is instructed by a control unit 122 to be described later. Moreover, the imprint material 102 discharged by the discharge means 115 is the imprint material 102 before hardening.

In the present embodiment and the subsequent embodiments, the discharge speed corresponds to the integral value of the speed of the imprinted material 102 in the air stagnation, and is divided by the value of the stagnation time Δt. This is to correct the deviation between the initial velocity given by the discharge means 115 and the speed before decelerating by the air impedance and reaching the substrate 101, and the speed of the imprinted material 102 in the drop is assumed to be the constant velocity.

The measuring unit 117 photographs the substrate 101 from above the mold 103, and measures the deviation of the relative positions between the plurality of marks 118 formed on the pattern portion 103a and the plurality of marks 119 formed in the pattern region 120.

The photographing unit 121 irradiates the light passing through the mold 103 toward the substrate 101, and receives the reflected light from the substrate 101 by an image pickup element such as a CCD, thereby photographing the contact state between the mold 103 and the imprint material 102. photography The portion 121 may have only a photographing function, and the light irradiated on the substrate 101 may be irradiated with a light source (not shown) different from the photographing portion 121. The expansion of the imprint material 102 in the pressing operation is observed, whereby the contamination between the pattern portion 103a and the substrate 101 is captured, or the imprint material 102 is filled in the pattern portion 103a.

The measuring unit 126 measures the distance between the measuring unit 126 and each position of the surface of the substrate 101. That is, positional information on the Z-axis direction of the surface of the substrate 101 (position information on the height direction of the substrate surface) is measured. The position in the Z-axis direction is hereinafter referred to as the Z position. In the present embodiment, the measuring unit 126 measures the position of the surface of the substrate 101 in the Z-axis direction.

The measuring unit 126 is, for example, a laser interferometer or a height measuring device that obliquely injects light onto the substrate and detects an oblique manner of the reflected light. The measuring unit 126 may be another measuring device such as a capacitance sensor or an encoder. In order to measure the complex point at the same time, a plurality of measuring sections may be included. The distance between the measuring unit 126 and the substrate 101 is used to cause the control unit 122 to calculate the distance between the discharge port 116a and the substrate 101.

The control unit (determination means, correction means) 122 includes a CPU, a RAM, and a ROM, and the irradiation unit 104, the drive mechanism 109, the substrate stage 111, the discharge means 115, the measurement unit 117, the imaging unit 121, and the storage unit 123 are connected via a line. This control is integrated, and the imprint process is performed in accordance with the program shown in the flowchart of FIG. 3 which will be described later.

The control unit 122 functions as a determination means, and determines the discharge port 116a and the base based on the measurement result of the measurement unit 126. Distribution information of the distance between the plates 101.

Further, the control unit 122 functions as a correction means, and corrects (adjusts) the supply conditions of the imprint material 102 to the substrate 101 based on the distance information between the discharge port 116a and the substrate 101 determined by the control unit 122.

This correction corrects the supply position of the imprint material 102 supplied onto the substrate 101 to an ideal supply position. The supply condition is at least one of a moving speed of the substrate stage 111 when the imprint material 102 is supplied onto the substrate 101, a discharge speed of the imprint material 102 from the discharge port 116a, and a discharge time point of the imprint material 102 from the discharge port 116a. .

The memory unit 123 is constituted by a hard disk (memory medium) or the like which is read by the control unit 122. The program shown in the flowchart of FIG. 3 stores the Z position of each of the measuring unit 126 and the discharge means 115, the arrangement of the nozzles 116, and the like. A substrate platform 111 is placed on the base plate 124. The drive mechanism 109 is suspended by the deck plate 125 for support.

(imprint method)

The imprint method of this embodiment will be described using the flowchart shown in FIG. Further, in the present embodiment, the distribution information of the distance between the discharge port 116a and the substrate 101 is a distance distribution in the height direction between the discharge port 116a and the supply position of the individual target on the surface of the substrate 101. The supply condition of the imprint material 102 corrected by the control unit 122 is the speed of the substrate stage 111. This embodiment is suitable for when the imprinted material 102 is discharged. The deviation of the movement direction of the substrate stage 111, that is, the supply position in the X-axis direction, is larger than the deviation of the supply position in the Y-axis direction of the non-moving direction of the substrate stage 111.

First, the position of the substrate 101 in the height direction is measured by the measuring unit 126 (S101). The measuring unit 126 is representatively measuring a plurality of measuring points. Then, the control unit 122 determines the distance between the discharge port 116a and each position on the surface of the substrate 101 (S102). The control unit 122 performs an arithmetic process of estimating the distance between the discharge port 116a and a position other than the measurement point based on the measurement result of the measurement unit 126, and obtains an approximate function F(x, y) indicating the surface height distribution of the substrate 101. The approximation function can be a quadratic function represented by F(x, y)=ax+by+f, and a quadratic function represented by F(x, y)=ax ² +bxy+cy ² +dx+ey+f Or a higher order function.

The measurement points are preferably selected to include a central region and a peripheral region of the substrate 101. The central area refers to the inner area of the virtual circle in which the radius of the substrate 101 is drawn by half the radius. The outer peripheral area refers to an area surrounding the central area and on the outer peripheral side of the central area. Thereby, the control unit 122 can accurately determine the approximation function F(x, y).

The measurement result by the measuring unit 126 will be described using FIG. 4. 4(a) is a view in which the substrate 101 is viewed from the +Z direction, and FIG. 4(b) is a view showing a positional distribution in the height direction between the X positions A-A' at the center of the substrate 101. The positional distribution in the height direction of each of the pattern regions 120 is approximated to the first-order equation with respect to the X-axis direction.

Returning to the description of the flowchart of FIG. Then, the control department 122, the supply position is corrected by the supply condition, and the supply position of the imprint material 102 to the pattern area 120 is the target supply position (S103). The correction of the supply conditions is performed for all the pattern regions 120 on the substrate 101. The steps of S103 are as described later.

In the imprint apparatus 100, the discharge means 115 and the substrate stage 111 are used, and the imprint material 102 is supplied to the pattern area 120 based on the supply conditions after correction (S104). The substrate stage 111 moves the substrate 101 to a position facing the mold 103. The mold 103 is lowered by the drive mechanism 109, and a press-molding operation is performed (S105).

In a state where the mold 103 is brought into contact with the imprint material 102, the image region 120 is irradiated with the ultraviolet ray 105 by the illuminating unit 104 to harden the embossed material 102 (S106). After the embossed material 102 is hardened, the mold 109 is raised by the drive mechanism 109 to perform a mold release operation (S107).

Next, the control unit 122 determines whether or not there is any graphic area 120 in which the next pattern should be formed (S108). In the case of the graphic area 120, the steps of S104 to S107 are repeated. In the case where there is no graphic area 120 in which a pattern is to be formed, the program ends, and the substrate on which the pattern is formed in the plurality of pattern areas 120 is carried out from the imprint apparatus 100.

In addition, in S103, only the correction of the supply condition of one of the graphics areas 120 is performed. If the determination in step S108 is Yes, the process returns to step S103.

Before the correction method for the supply condition of S103 is described, the case where the correction is not performed will be described with reference to FIGS. 5(a) and 5(b).

Figure 5 (a) shows the tilt of the flat substrate 101 Figure. The substrate 101 shows a predetermined height H0. The predetermined height is the design height at which the substrate 101 is placed on the chuck 112. Fig. 5(b) is a view in which the pattern region 120 to which the embossed material 102 is supplied is viewed from the +Z direction.

Fig. 6(a) is a view showing the inclination of the surface of the substrate 101, and Fig. 6(b) shows a case where the supply position of the imprinted material 102 is supplied only in the X-axis direction. The intersection 10 of the vertical and horizontal dashed lines arranged at equal intervals is the supply position of the desired imprint material 102, that is, the target position (target supply position). The black dots indicate the imprinted material 102 supplied to the substrate 101. When the substrate stage 111 is moved in the -X direction at a predetermined speed and supplied to the imprint material 102, since the distance from the discharge port 116a to the height H0 is constant, the imprint material 102 can be supplied to the intersection 10.

As in the position B-B' shown in Fig. 4(b), the position in the height direction of the pattern region 120 is inclined, and the distance from the discharge port 116a is reduced at a position higher than the height H0. The discharge means 115 supplies the imprint material 102 when the substrate 101 moves in the X-axis direction. Thereby, since the vacancy time of the embossed material 102 becomes short, it is supplied to the substrate 101 earlier than the case where the embossed material 102 is supplied at the position of the height H0.

Conversely, at a position lower than the height H0, the distance from the discharge port 116a becomes large. Therefore, since the quiescent time of the embossed material 102 becomes long, it is supplied to the substrate 101 more slowly than when the embossed material 102 is supplied at the position of the height H0.

Therefore, as shown in FIG. 6(b), the position of the substrate 101 in the height direction is farther from the height H0, and the position of the stamp 102 to the intersection 10 is obtained. The deviation will be greater.

In the X-axis direction in which the substrate stage 111 moves, the deviation of the supply position due to the distribution of the substrate 101 in the Z-axis direction has a method in which the control unit 122 corrects the moving speed of the substrate stage 111 to correct the deviation of the supply position.

Fig. 7 shows the case when the imprint material 102 is supplied at the position A of the height H1. The moving speed of the substrate stage 111 before correction is set to V1. The discharge speed of the embossed material 102 is V2. The Z-axis direction distance between the discharge port 116a and the target position of the height H1, that is, the position A is set to H1. When the distance between the X position of the position A at the time of discharge and the X position of the discharge port 116a is L1, the discharge means 115 discharges the imprint material 102. When the moving speed of the corrected substrate stage 111 is V1 + ΔV, the equations (1) and (2) are established.

The control unit 122 determines the correction amount ΔV of the speed by the equations (3) by the equations (1) and (2).

T1=L1/(V1+△V)‧‧‧(1)

T2=H1/V2‧‧‧(2)

△V=(L1.V2)/H1-V1‧‧‧(3)

FIG. 8(a) shows the relationship between the height of each X position of the substrate 101 and the moving speed of the substrate stage 111.

As described above, the control unit 122 sets the moving speed when the imprint material 102 is supplied at a target position lower than the predetermined height H0 to the moving speed when the imprint material 102 is supplied at a target position higher than the predetermined height H0.

When the control unit 122 corrects the supply condition, the distance between the discharge port 116a and the substrate can be uneven, and the imprint material 102 can be accurately supplied to the target position on the substrate 101 as compared with the related art.

Thereby, the imprint apparatus 100 can form a good pattern with less pattern defects as a pattern of the hardened imprint material 102.

[Second Embodiment]

In the present embodiment, the measuring unit 126 measures the Z position of the surface of the substrate 101. In the present embodiment, the distribution information of the distance between the discharge port 116a and the substrate 101 is a distance distribution in the height direction between the discharge port 116a and the supply position of the individual target on the surface of the substrate 101.

The supply condition of the imprint material 102 corrected by the control unit 122 is the discharge time point of the stamp material 102. The time point at which the discharge is performed is controlled by the time at which the first discharge starts and the time interval (discharge interval) from the previous discharge time to the next discharge time. The structure of the imprint apparatus 100 is the same as that of the first embodiment.

This embodiment can also be applied to a case where one of the inclination of the pattern region 120 in the X-axis direction and the inclination in the Y-axis direction is large. Among the imprint methods of the embodiment, only the steps of S103 which are different from the first embodiment will be described.

The discharge means 115 periodically discharges the imprint material 102 at the discharge interval T, and controls the discharge time point as shown in FIG. 8(b). In the case where the height is higher than H0, the T is delayed and the imprinted material is discharged. 102. When the height is lower than H0, the imprint material 102 is ejected early.

In other words, the discharge time point of the imprint material 102 supplied to the target position having a height lower than the predetermined height H0 is the discharge time point of the imprint material 102 supplied earlier than the target position higher than the predetermined height H0.

In the case where the supply is performed at a target position higher than the predetermined height H0, the control unit 122 corrects the time until the next time the supply of the imprint material 102 is performed after the imprint material 102 supplied at the predetermined height H0 is discharged to T+ΔT. The time point of the discharge is delayed by ΔT shown by the formula (4).

△T=L1/V1-H1/V2‧‧‧(4)

The position to be supplied after the position A is discharged is set to (T+2‧ΔT) by the time until the imprinted material 102 discharged toward the position A is discharged and the next time the imprinted material is discharged. By correcting the discharge time point at which the imprint material 102 is discharged each time, the deviation of the supply position can be corrected.

When the control unit 122 corrects the supply condition, the distance between the discharge port 116a and the substrate can be uneven, and the imprint material 102 can be accurately supplied to the target position on the substrate 101 as compared with the related art.

Thereby, the imprint apparatus 100 can form a good pattern with less pattern defects as a pattern of the hardened imprint material 102.

[Third embodiment]

In the present embodiment, the distribution information of the distance between the discharge port 116a and the substrate 101 is the distribution of the difference between the height of the reference position and the height of the target position of the platen 102. Imprinted material corrected by control unit 122 The supply condition of 102 is the discharge time point of the embossed material 102. The structure of the imprint apparatus 100 is the same as that of the first embodiment. Among the imprint methods of the embodiment, only the steps of S103 which are different from the first embodiment will be described.

The surface shape of the substrate 101 is measured as positional information on the Z-axis direction of the surface of the substrate 101. The measuring unit 126 outputs information on the surface shape of the substrate 101 to the control unit 122 as shown in FIG. 9 . The surface shape is shape information regarding the out-of-plane direction of the substrate 101 (the Z-axis direction in the present embodiment, the thickness direction of the substrate). The distance between the measuring unit 126 and the surface of the substrate 101 is measured at a plurality of portions of the substrate 101, and the surface shape of the third dimension of the substrate 101 is calculated based on the measurement result.

Information about the deviation of each position of the surface of the substrate 101 (the surface of the measurement target and the surface facing the mold 103) with respect to the virtual flat surface, that is, the reference surface 201, in the out-of-plane direction is obtained. The center of the reference surface 201 is referred to as a reference position.

FIG. 9 is a cross-sectional view of the substrate 101 in the X-axis direction, and is a view showing a relationship between the reference surface 201 (broken line) and the surface position (solid line) of the substrate 101 at each X position.

The control unit 122 determines the distribution of the difference ΔH between the height of the reference position and the height of the target position of the imprint material 102. In Fig. 9, the target position is shown as the difference ΔH between the positions C (X, Y). When the discharge speed of the resin from the discharge means 115 is V2, the air time is shorter than the reference position by ΔH/V2.

Therefore, the control unit 122 may correct the discharge time point to make the discharge time point ΔT=ΔH/V2 earlier. The control unit 122 corrects the discharge time point in the same manner when discharging the other target position.

As described above, the control unit 122 corrects the discharge time of the imprint material 102 supplied at a discharge time point of the imprint material 102 supplied at a target position lower than the predetermined height, and at a target position higher than the predetermined height. point.

When the control unit 122 corrects the supply condition, the distance between the discharge port 116a and the substrate can be uneven, and the imprint material 102 can be accurately supplied to the target position on the substrate 101 as compared with the related art.

Thereby, the imprint apparatus 100 can form a good pattern with less pattern defects as a pattern of the hardened imprint material 102.

Further, in the second embodiment and the third embodiment, the corrected discharge time point may have no time interval. When the timing at which the embossed material 102 is discharged is managed at the time, the timing at which the control unit 122 discharges the embossed material 102 supplied at a target position higher than the predetermined height H0 is earlier than the time before the correction.

Further, the control unit 122 corrects the timing at which the imprinted material 102 supplied to the target position which is lower than the predetermined height H0 is discharged, and corrects it to be later than the time before the correction.

In this case, the morning/late time of the discharge time point is when the distance between the position (X, Y) of the discharge port 116a and the position (X, Y) of the target position in the XY plane is large/small. Discharged from the discharge port 116a.

If you correct the time of the spit out as above, you can control it. The manufacturing unit 122 corrects the supply conditions, whereby the imprint material 102 can be accurately supplied to the target position on the substrate 101.

[Fourth embodiment]

In the present embodiment, the distribution information of the distance between the discharge port 116a and the substrate 101 is the distribution of the difference between the height of the reference position and the height of the target position of the platen 102. The description of the reference position is the same as that of the third embodiment, and the description thereof is omitted. The supply condition of the imprint material 102 corrected by the control unit 122 is the discharge speed of the stamp material 102. The structure of the imprint apparatus 100 is the same as that of the first embodiment.

The voltage drive waveform applied to the piezoelectric element is changed to correct the discharge speed. The control unit 122 is configured to make the discharge speed of the imprint material 102 supplied to the target position which is lower than the predetermined height, and the discharge speed of the imprint material 102 to be supplied at a target position higher than the predetermined height. Among the imprint methods of the embodiment, only the steps of S103 which are different from the first embodiment will be described.

Before the correction of the discharge speed, the substrate platform 111 is ejected at the speed V1 in the +X direction, and the discharge means 115 discharges the imprint material 102 at the discharge speed V2. The control unit 122 sets the discharge speed to be larger than V2 when the target position height of the substrate 101 is lower than the reference position height H0.

Specifically, when the target position is lower by ΔH than the height H0, the emptying time Δt of the imprinted material 102 after being discharged to the substrate 101 after the discharge is corrected is a discharge satisfying = (H0 + ΔH) / V. Speed V.

Similarly, the control unit 122 sets the discharge speed to be smaller than V2 when the target position height of the substrate 101 is higher than the height H0. Specifically, when the target position is higher than the height H0 by ΔH, the discharge speed V satisfying Δt=(H0-ΔH)/V is corrected.

As described above, the control unit 122 corrects the discharge speed based on the distribution information of the distance between the discharge port 116a and the substrate 101.

Thereby, the deviation of the supply position of the low-pressure printing material 102 from the target position can be reduced. Therefore, the imprint apparatus 100 can accurately form the pattern of the cured imprint material 102.

[Fifth Embodiment]

In the fifth embodiment, as the measuring means for measuring the position of the surface height direction of the substrate 101, the imaging unit 121 and the control unit 122 are used instead of the measuring unit 126. The imaging unit 121 captures the imprint material 102 which is ejected at different time points by the discharge means 115 and supplied to at least two of the substrates 101 while the substrate 101 is being moved.

Further, the control unit 122 uses the calculation means as an arithmetic means to image-process the result of the photographing by the photographing unit 121, thereby calculating the position of the at least two places. The structure of the imprint apparatus 100 is the same as that of the first embodiment.

Thereby, the Z position of the surface of the substrate 101 is measured.

Fig. 10 (a) is a view in which the discharge means 115 and the substrate stage 111 are viewed from the +Z direction, and Fig. 10 (b) is viewed from the -Y direction, and Fig. 10 (c) is viewed from the +X direction.

As shown in FIG. 10(b), while the substrate platform 111 moves the substrate 101 in the +X direction at the speed V1, the discharge means 115 discharges the imprinted material 102 at the discharge speed V2. The substrate 101 is inclined at an angle θ toward the rotation component ωY about the Y axis or at an angle θX about the X axis. The case of tilting in one direction will be described.

As shown in FIG. 10(c), two discharge ports 116a and 116b which are provided at a distance W in the vertical direction (Y-axis direction) with respect to the moving direction of the substrate stage 111 are illustrated.

For angle θ, angle The method of obtaining is as explained below.

First, the substrate 101 is moved at a constant speed V1 on the substrate stage 111, and at time T1, the discharge means 115 simultaneously discharges the imprinted material 102 from the discharge ports 116a, 116b. The discharge port 116a discharges the imprint material 102 first and then ejects the imprint material 102 after a predetermined time T (time T2).

That is, the discharge port 116a discharges at least two places of the substrate 101 at different time points.

The photographing unit 121 photographs the substrate 101 to which the overprinting material 102 is supplied. FIG. 11( a ) shows a case where the imaging unit 121 captures the imprint material 102 . The position 311 is the position of the imprint material 102 discharged from the discharge port 116a at the time T1. The position 312 is the position of the imprint material 102 discharged from the discharge port 116a at the time T2. The position 313 is the position of the imprint material 102 discharged from the discharge port 116a at time T1.

Next, the imaging unit 121 performs image processing on the imaging result, and calculates the position (X, Y) of the positions 311, 312, and 313 by the control unit 122. The control unit 122 calculates the angle θ and the angle using the calculated information of the positions 311, 312, and 313. . For angle θ, angle The calculation method will be described using FIG. 11(a) and FIG. 11(b).

The distance between position 311 and position 312 is L'. The distance L' is greater than the distance L = V1‧T which is advanced by the substrate V at a speed V1 between the times T and AL' = L' - L = L' - V1‧T.

This is because the surface shape of the substrate 101 is inclined by the distance θ from the horizontal plane by a distance H, and the empty time t of the imprinted material 102 discharged at the time T1 and the imprinted material discharged at the time T2. The dead time t2 of 102 is different.

Since the difference in the dead time is ΔT = t2 - t1 = H / V2, the distance H = (L' - V1‧T) ‧ V2 / V1 is established. The control unit 122 calculates the angle θ by calculating the equation (10).

θ=tan ^-1 (H/L')=tan ^-1 {(L'-V1‧T)‧V2/(V1‧L')}‧‧‧(10)

The control unit 122 calculates the angle using the information of the obtained positions 311 and 313. .

The X position of the position 311 and the X position of the position 312 are separated by a distance D1.

This is because the surface shape of the substrate 101 is inclined at an angle to the horizontal plane. At this time, the quiescent time becomes long, and the substrate 101 moves in the X-axis direction by the portion where the lag time becomes longer. Established D1/V1=W‧tan( ) /V2 relationship.

Thereby, the control unit 122 calculates the angle by calculating the equation (11). .

=tan ^-1 {(D1‧V2/(V1/W)}‧‧‧(11)

In this way, the control unit 122 can calculate the angle θ and the angle of the substrate 101. .

Further, the control unit 122 calculates the deviation ΔL between the position 312 and the ideal position 320, and calculates the Z position of the position 311.

In addition, use positions 312, 313, angle θ, angle Then, the Z positions of the positions 312 and 313 are calculated.

Thereby, the Z position of the substrate 101 is calculated (determined) based on the position of the XY of the positions 311, 312, and 313 (the positional component in the plane intersecting the height direction).

The control unit 122 determines distribution information on the distance between the discharge port 116a and the substrate 101 based on the Z positions of the positions 311, 312, and 313, and corrects the supply conditions of the imprint material. Since the detailed correction method is the same as that of the first embodiment, the description thereof is omitted.

When the control unit 122 corrects the supply conditions, the distance between the discharge port 116a and the substrate 101 can be uneven, and the imprint material 102 can be accurately supplied to the target position on the substrate 101 as compared with the related art.

Thereby, the imprint apparatus 100 can form a good pattern with less pattern defects as a pattern of the hardened imprint material 102.

In the case of the present embodiment, since both the imaging unit 121 and the control unit 122 are used for the imprint process of the cured imprint material 102, it is possible to suppress The increase in the device like the measuring unit 126.

Before the photographing unit 121 measures the position at which the imprinted material 102 is ejected, it is preferable to irradiate the substrate 101 with the ultraviolet ray 105 to cure the imprinted material 102.

At the time of image processing by the control unit 122, the accuracy of the position measurement of the imprint material 102 can be improved.

The substrate 101 used for measurement may be the same as the substrate (process wafer) used for the imprint process, or a different substrate (bare wafer) may be used.

When the process wafer is used, it is sufficient to adjust the movement condition of the substrate stage 111 or adjust the discharge time interval of the imprint material 102 to avoid supply to the separation line by avoiding the area where the pattern is formed by the imprint material 102.

In the case of using a bare wafer, it is preferable to use a material having a large contact angle of the imprint material 102 or a dedicated substrate for processing measurement.

For example, it is preferred to use a substrate coated with a fluorine-based material.

The adjustment time T makes the distance L small, whereby the inclination of each of the plurality of regions of the substrate 101 can be measured. The control unit 122 estimates the measurement result of the complex region and calculates the three-dimensional shape of the substrate 101. The number of the discharge ports 116a used for measurement is not limited to two. The surface shape of the substrate 101 may be measured over a wide range using all of the discharge ports.

And, for example, knowing that there is no angle In the case where there is no need for measurement, etc., only the discharge port 116a may be used.

[Other Embodiments]

Although the case where the predetermined supply condition is corrected by the control unit 122 to create a new supply condition has been described, the present invention is not limited thereto.

For example, the supply condition may be additionally generated based on the distribution information on the distance between the discharge port 116a and the substrate 101 obtained by the measurement unit 126 or the imaging unit 121.

The moving means for relatively moving the substrate 101 and the discharge port 116a may move the nozzle 116 to move the substrate 101 and the discharge port 116a relative to each other. The imprint apparatus 100 may also appropriately distribute the distribution information on the distance between the discharge port 116a and the substrate 101, the supply conditions of the imprint material 102 corrected by the control unit 122, and the measurement means in the above embodiments. combination. In the imprint apparatus 100 of the embodiment of the combination, the imprint material 102 can be accurately supplied to the target position on the substrate 101.

As a supply condition for correcting the deviation of the supply position, for example, the following conditions can be mentioned. The moving speed of the substrate stage 111 when the imprint material 102 is supplied onto the substrate 101, the ejecting speed of the imprint material 102 from the discharge port 116a, and the ejecting time point of the imprint material 102 from the discharge port 116a. The correction of the supply conditions of the plurality of types may be combined to correct at least one of the supply conditions.

The correction of the supply conditions by the control unit 122 may apply different correction amounts to the plurality of discharge ports 116a.

As an imprint method of the embodiment, the measuring unit 126 It can also be disposed outside the imprint apparatus 100. In this case, the information output from the measurement unit 126 to the control unit 122 may be the surface shape of the substrate 101.

The control unit 122 may be provided in a casing that is common to other components of the imprint apparatus 100, or may be provided outside the casing.

Further, the control unit 122 may be an aggregate of control boards that differ depending on the object to be controlled, the function (the function as the calculation means, the function as the determination means, the function as the correction means, etc.).

As the substrate 101, glass, ceramics, metal, semiconductor, imprint material, or the like is used, and if necessary, a member different from the substrate may be formed on the surface thereof. The substrate 101 is specifically a germanium wafer, a compound semiconductor wafer, quartz glass, or the like.

The embossed material 102 is made of a curable composition (also referred to as an uncured state embossed material) which is cured by imparting energy for curing.

As the energy for hardening, electromagnetic waves, heat, and the like are used.

The electromagnetic wave is, for example, light such as infrared rays, visible light rays, or ultraviolet rays selected from the range of a wavelength of 10 nm or more and 1 mm or less.

The curable composition is a composition that is hardened by irradiation of light or by heating. Among them, the photocurable composition which is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary.

A non-polymerizable compound is a group of a sensitizer, a hydrogen donor, an internal addition type release agent, a surfactant, an antioxidant, a polymer component, and the like. At least one of the choices.

The embossed material 102 may be formed in a droplet shape or an island shape or a film shape in which a plurality of droplets are connected to the substrate 101. The viscosity of the imprint material (viscosity at 25 ° C) is, for example, 1 mPa ‧ or more and 100 mPa ‧ s or less.

[Applicable to the manufacture of articles]

The pattern of the cured product formed by the imprint apparatus 100 is permanently used for at least a part of various articles or temporarily used for the manufacture of various articles.

The article is an electrical circuit component, an optical component, a MEMS, a memory component, a sensor, or a mold. Examples of the electric circuit component include volatile or nonvolatile semiconductor memory such as DRAM, SRAM, flash memory, and MRAM, LSI, CCD, image sensor, and FPGA-like semiconductor element. Examples of the mold include a mold for imprinting and the like.

The pattern of the cured product is used as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. In the processing of the substrate, the etching mask is removed after etching or ion implantation or the like.

The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments, and various modifications and changes can be made therein.

The present invention is not limited to the above-described embodiment, as long as it is not Various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, in order to disclose the scope of the present invention, the following claims are attached.

The priority is claimed on the basis of the Japanese patent application "Japanese Patent Application No. 2015-234318" filed on November 30, 2015, the entire contents of which are hereby incorporated herein.

Claims (11)

An imprint apparatus which is a device for forming a pattern of an imprint material on a substrate by using a mold, comprising: a supply means including a discharge port, and discharging the imprint material from the discharge port and supplying the imprint material to the substrate And measuring means for measuring position information on a height direction of the surface of the substrate, wherein the supply means supplies the distribution information on the distance between the discharge port and the substrate obtained from the measurement result of the measuring means. The aforementioned imprinted material. The imprint apparatus according to claim 1, comprising: a moving means for relatively moving the substrate and the discharge port, wherein the measuring means includes: a photographing means for opposing the substrate and the discharge port by the moving means During the moving period, the imprinted material that is ejected from the discharge port at different time points and supplied to at least two of the substrates is imaged, and a calculation means that images the image of the photographing means, thereby performing at least The positional components in the plane intersecting the height direction of the two places are calculated, and the distance between the discharge port and the substrate at the at least two places is calculated. The imprint apparatus according to claim 1, wherein the supply means supplies the supply condition when the imprint material is supplied based on distribution information on a distance between the discharge port and the substrate, and is at least one of the following: a relative moving speed between the substrate and the discharge port during supply of the imprint material to at least two of the substrates, a discharge speed of the imprint material from the discharge port, and a discharge time of the imprint material from the discharge port point. The imprint apparatus according to claim 3, further comprising: a correction means for correcting a supply condition of the imprint material of the supply means based on distribution information of a distance between the discharge port and the substrate, wherein the supply means is The embossed material is supplied by the supply conditions corrected by the correction means. The imprint apparatus according to claim 4, wherein the supply condition is the discharge time point, and the correction means supplies the discharge time of the imprint material to be supplied at a target supply position lower than a predetermined height, earlier than The discharge time point of the aforementioned imprint material is supplied in comparison with the target supply position at which the predetermined height is also high. The imprint apparatus according to claim 4, wherein the supply condition is the discharge speed, and the correction means is configured to supply a discharge speed of the imprinted material to a target supply position lower than a predetermined height, which is smaller than the predetermined ratio The discharge speed of the aforementioned imprinted material supplied from the target supply position of the height is also high. The imprint apparatus according to claim 4, wherein the supply condition is a relative movement speed between the substrate and the discharge port, and the correction means is to supply the target material at a target supply position lower than a predetermined height. Movement speed, set to be greater than before comparison The aforementioned moving speed when the target printing material is supplied to the target supply position having a predetermined height is described. The imprint apparatus according to claim 1, wherein the distribution information on the distance between the discharge port and the substrate is a distribution of a difference between a height of the reference position and a height of the target supply position of the imprint material. The imprint apparatus according to claim 1, wherein the distribution information of the distance between the discharge port and the substrate is a distance distribution in a height direction from the discharge port to a target supply position of the platen. An imprint method is a method for forming a pattern of an imprint material on a substrate by using a mold, comprising: a step of measuring position information about a height direction of the surface of the substrate; and obtaining the measurement result according to the measuring step a step of determining a supply condition of the imprint material by distributing distribution information of a distance between a discharge port of the imprint material supplied to the substrate and the substrate, and the substrate according to the supply condition determined by the determining step The step of supplying the aforementioned imprint material. A method of producing an article, comprising: a step of forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 9; and a step of processing the substrate after the step.