JP6083203B2 - Imprint resin dripping position determination method, imprint method, and semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a method for determining a dropping position of an imprint resin, a method for dropping an imprint resin at a dropping position determined by the method, and a method for manufacturing a semiconductor device.

  Nanoimprint technology, known as microfabrication technology, uses a mold member (imprint mold) in which a fine concavo-convex pattern is formed on the surface of a substrate, and transfers the fine concavo-convex pattern to a workpiece to produce fine concavo-convex This is a pattern formation technique for transferring a pattern at an equal magnification (see Patent Document 1). In particular, along with further miniaturization of semiconductor devices, nanoimprint technology is gaining more and more attention in semiconductor device manufacturing processes and the like.

  In this nanoimprint technology, generally, an imprint resin as a workpiece is applied onto a substrate on which a fine uneven pattern structure is formed, and the imprint resin and the imprint mold are in contact with each other. Is cured to form a fine concavo-convex pattern structure. As a method of applying the imprint resin on the substrate, an ink jet method or the like in which the imprint resin is discretely dropped onto a predetermined position on the substrate surface (surface on which the fine uneven pattern structure is formed) is known.

  When forming a fine concavo-convex pattern structure by nanoimprinting, it is required that the film thickness (remaining film thickness) of the concave portions in the fine concavo-convex pattern structure is uniform throughout. In addition, defects due to unfilled imprint resin in the concave portions of the fine concavo-convex pattern of the imprint mold or imperfections due to insufficient imprint resin spreading over the entire area where the fine concavo-convex pattern structure is formed (imprint resin It is necessary to prevent defects due to lack of

  When such residual film thickness unevenness or defect occurs, when using the fine concavo-convex pattern structure as an etching mask, the etching accuracy is reduced, resulting in variations in the dimensions of the fine concavo-convex pattern formed on the substrate by etching. There is a problem that it ends up.

  Therefore, in the technical field of nanoimprint, it is recognized as a problem to be solved to minimize the variation in the remaining film thickness and prevent the occurrence of the above-described defects. Conventionally, in order to solve the problem In addition, various techniques relating to a method for dropping an imprint resin by an inkjet method have been proposed.

  For example, when applying the imprint resin on the substrate by the inkjet method, the distribution of the imprint resin on the substrate based on the total volume of the recess of the imprint mold, the remaining film thickness, the amount of volatilization of the imprint resin, etc. A method of dropping the imprint resin according to the distribution (see Patent Document 2), filling amount information indicating the amount of the imprint resin filled in the concave portion of the imprint mold, and the remaining film thickness indicating the remaining film thickness A method of obtaining the dropping position (dropping amount) of the imprint resin based on each of the information and obtaining the dropping position of the imprint resin by adding together the obtained two dropping positions (dropping amount) (see Patent Document 3) Etc. have been proposed.

  On the other hand, in the inventions described in Patent Documents 2 and 3, the way in which the imprint resin droplets are spread and spread is isotropic, that is, the substantially circular droplets in a plan view are wetted in a substantially circular shape (radial). The dripping position is determined on the premise of spreading. However, the way in which the imprint resin droplets spread out varies depending on the structure (shape, etc.) of the fine uneven pattern of the imprint mold. For example, the way in which the imprint resin droplets spread out varies depending on whether the fine concavo-convex pattern of the imprint mold is a line and space pattern or a hole pattern. Therefore, depending on the structure (shape, etc.) of the fine uneven pattern of the imprint mold, there is a problem that unevenness occurs in the remaining film thickness as the droplets of the imprint resin spread out.

  In order to solve such a problem, conventionally, the distance between imprint resin droplets along the direction substantially parallel to the line direction in the line-and-space fine concavo-convex pattern is long and along the direction substantially perpendicular to the line direction. In addition, a nanoimprint method has been proposed in which the imprint resin droplets are applied so as to shorten the interval between the imprint resin droplets (see Patent Document 4).

US Pat. No. 5,772,905 JP 2009-88376 A JP 2012-54322 A JP2011-228619A

  In the inventions described in Patent Documents 2 to 4, the imprint resin dropping position (drop map) is determined in consideration of the distribution amount of the imprint resin on the substrate and the wet spread of the imprint resin droplets. It is set in advance. Then, according to the drop map, the imprint resin from each ejection hole (nozzle) of the head in the ink jet type resin coating apparatus is arranged so that the droplets of the imprint resin are arranged on the substrate according to the drop map. The dripping is controlled.

  However, at least a part of the position where the imprint resin is actually dropped (i.e., the landing position of the droplet of the imprint resin) may unintentionally shift from a preset drop position. For example, in the head, the edge shape of each ejection hole (nozzle) and the degree of dirt may be different, and the wettability with respect to the imprint resin may be different for each ejection hole (nozzle). As a result, a positional deviation from a preset dropping position may occur in at least a part of the landing position of the imprint resin.

  In the inventions described in Patent Documents 2 to 4, the thickness unevenness of the remaining film of the fine concavo-convex pattern structure formed by imprinting, a defect due to unfilled recesses of the imprint mold, and a defect due to insufficient imprint resin In order to prevent the occurrence of (open defects), etc., the imprint resin dropping position (drop map) is set in advance, but the actual imprint resin landing position misalignment as described above. As a result, there is a problem that unevenness of the remaining film thickness and the above-described defects occur.

  In view of such a problem, the present invention uses an imprint mold in which a concavo-convex pattern is formed in order to form a concavo-convex pattern structure having a uniform residual film thickness as a whole without causing the above defects. It is an object of the present invention to provide a method for determining a position where an imprint resin is dropped in consideration of a displacement of a landing position of a print resin, an imprint method using the method, and a method for manufacturing a semiconductor device.

In order to solve the above problems, the present invention provides a pattern on an imprint resin that is discretely dropped at a predetermined position on a transfer surface using an ink jet type resin coating apparatus including a head having a plurality of nozzles. In the imprint method of transferring the concavo-convex pattern using an imprint mold having a concavo-convex pattern formed on a forming surface, the method includes a method of determining a dropping position of the imprint resin on the transfer surface, A first dropping step of dropping the imprint resin by the head according to a planned dropping position of the imprint resin determined based on the uneven pattern of the print mold, and a dropping according to the planned dropping position by the first dropping step. In at least one of the landing positions of the imprinted resin, At least one of a positional deviation determination step for determining whether or not a positional deviation has occurred with respect to the resin dripping planned position, and a landing position of the imprint resin dropped according to the planned dripping position in the positional deviation judging step When it is determined that a positional deviation has occurred, a correction possibility determination step for determining whether or not the planned dropping position can be corrected, and the planned dropping position can be corrected by the correction possibility determination step. When the determination is made, a planned dropping position correcting step for correcting the planned dropping position, and a corrected dropping position in which the planned dropping position is corrected by the planned dropping position correcting step are determined on the surface of the imprint resin. possess a dropping position determination step of determining a dropping position, in the positional deviation determination step, the dropping predetermined position by the first dropping step Measuring the displacement direction of the landing position of the imprint resin dripped with respect to the planned dripping position of the imprint resin, and in the correction possibility determination step, the displacement direction and the main scanning direction of the head are Provided is a method for determining an imprint resin dripping position , wherein it is determined that the dripping planned position can be corrected when they substantially match (invention 1).

  According to the above invention (Invention 1), when the imprint resin droplet dropping position (landing position) is displaced on the transfer surface, the imprint resin dropping position is reflected to reflect the positional deviation. Since it can be determined, the imprint determined based on the uneven pattern of the imprint mold by dropping the imprint resin according to the dropping position determined as in the invention (Invention 1) during the imprint process The imprint resin can be dripped according to the planned dripping position of the resin, and the remaining film thickness as a whole can be achieved without causing imprint resin not filled into the recesses of the imprint mold or defects due to insufficient imprint resin. A uniform concavo-convex pattern structure can be formed.

  In the said invention (invention 1), in the said position shift determination process, it is between the landing position of the said imprint resin dripped according to the said dripping planned position by the said 1st dripping process, and the dripping planned position of the said imprint resin. The positional deviation amount is measured, it is determined whether the positional deviation has occurred based on the positional deviation amount, and in the planned dropping position correction step, the planned dropping position is determined based on the measured positional deviation amount. It is preferable to correct the position (Invention 2).

In the said invention (invention 1 and 2), it further has the droplet hardening process which hardens the said imprint resin dripped according to the said dripping planned position by the said 1st dripping process in the state of a droplet, The said position In the displacement determination step, the landing position of the imprint resin dropped according to the planned dropping position based on the position of each droplet of the imprint resin cured by the droplet curing step and the planned dropping position. It is preferable to determine whether or not there is a positional deviation with respect to the planned dropping position in at least one (Invention 3).

In addition, the present invention provides an imprint resin that is discretely dropped at a predetermined position on a transfer surface using an ink jet type resin coating apparatus that includes a head having a plurality of nozzles, and an uneven pattern on the pattern forming surface. An imprint method for transferring the concavo-convex pattern using an imprint mold formed with an alignment concavo-convex pattern, the method comprising: determining a dropping position of the imprint resin on the transfer surface, According to the planned dropping position of the imprint resin determined based on the uneven pattern of the print mold, a first dropping step of dropping the imprint resin on a predetermined plane by the head, and the first dropping step After the imprint resin is dropped on a predetermined plane according to the planned dropping position, A transfer step of curing the imprint resin wetted and spread on the flat surface by bringing the pattern forming surface of the print mold into contact with the imprint resin and forming a concavo-convex pattern structure on the flat plate; and the transfer A second dropping step of dropping the imprint resin on the concavo-convex pattern structure formed in the step according to the planned dropping position, and landing of the imprint resin dropped according to the planned dropping position in the second dropping step In at least one of the positions, a position shift determination step for determining whether or not a position shift has occurred with respect to the position where the imprint resin is to be dropped, and the step of dropping according to the position to be dropped by the position shift determination step When it is determined that there is a displacement in at least one of the imprint resin landing positions In addition, a correction possibility determining step for determining whether or not the planned dropping position can be corrected, and a correction of the planned dropping position when it is determined that the predetermined dropping position can be corrected by the correction possibility determining step. A scheduled dropping position correcting step, and a dropping position determining step for determining the corrected dropping position in which the planned dropping position is corrected by the scheduled dropping position correcting step as the dropping position of the imprint resin on the transfer surface. be closed to provide an imprint resin dropping position determination wherein the (invention 4).

In the above invention (inventions 4), the pre-Symbol the imprint resin dripped in accordance with the dropping position scheduled by the second dropping step, further comprising a droplet curing step of curing remains droplet state, the position In the displacement determination step, the landing position of the imprint resin dropped according to the planned dropping position based on the position of each droplet of the imprint resin cured by the droplet curing step and the planned dropping position. In at least one, it is preferable to determine whether or not a positional deviation has occurred with respect to the planned dropping position (Invention 5).

  In the above inventions (Inventions 1 to 5), the head further includes a head cleaning step of performing a cleaning process on the head when it is determined in the correction possibility determination step that the planned dropping position cannot be corrected. It is preferable that the first dropping step is performed by the head cleaned by the cleaning step (Invention 6).

  In the said invention (invention 1-6), when it judges that the said dripping scheduled position cannot be corrected by the said correction possibility determination process, it further has the adjustment process which adjusts operation | movement of the said resin coating apparatus, It is preferable that the first dropping step is performed by the head of the resin coating apparatus whose operation is adjusted by the adjusting step (Invention 7).

  The present invention also relates to an imprint method for forming a concavo-convex pattern structure by using an imprint mold having a concavo-convex pattern formed on a pattern forming surface and transferring the concavo-convex pattern to an imprint resin on a transfer surface. A resin drop that discretely drops the imprint resin onto a predetermined drop position on the transfer surface based on resin drop related information using an ink jet type resin coating apparatus including a head having a plurality of nozzles A step of bringing the imprint resin droplets onto the transfer surface into contact with the droplets of the imprint resin dropped onto the transfer surface and the pattern forming surface of the imprint mold. A transfer step of curing the imprint resin spread on the transfer surface to form the concavo-convex pattern structure, The resin dripping related information includes information on the dropping position of each droplet of the imprint resin on the transfer surface and information on the nozzle that drops the droplet of the imprint resin associated with each dropping position. At least, the dropping position in the resin dropping step is the corrected dropping position determined as the dropping position of the imprint resin by the imprint resin dropping position determination method according to the inventions (Inventions 1 to 7), or the Provided is an imprinting method characterized in that the position is a dripping planned position determined based on an uneven pattern of an imprint mold (Invention 8).

  In the said invention (invention 8), the said dripping position in the said resin dripping process is a dripping planned position determined based on the uneven | corrugated pattern of the said imprint mold, The imprint which concerns on the said invention (invention 1-7) In the resin dripping position determination method, when it is determined that the planned dripping position cannot be corrected, the nozzle responsible for dripping the imprint resin corresponding to the landing position in which a positional deviation occurs with respect to the planned dripping position Is preferably changed to another nozzle (Invention 9).

  Furthermore, the present invention is characterized in that the predetermined substrate is etched by using, as a mask, an uneven pattern structure formed on the transferred surface by the imprint method according to the above inventions (Inventions 8 and 9). A method of manufacturing a semiconductor device is provided (Invention 10).

  According to the present invention, in order to form a concavo-convex pattern structure having a uniform residual film thickness as a whole using an imprint mold in which a concavo-convex pattern is formed, the positional deviation of the landing position of the imprint resin is taken into consideration. It is possible to provide a method for determining a position where an imprint resin is dropped, an imprint method using the method, and a method for manufacturing a semiconductor device.

FIG. 1 is a flowchart (part 1) illustrating an imprint method according to an embodiment of the present invention. FIG. 2 is a flowchart (part 2) showing the imprint method according to the embodiment of the present invention. FIG. 3 is a flowchart (part 3) illustrating the imprint method according to the embodiment of the present invention. FIG. 4 is a flowchart (part 4) showing the imprint method according to the embodiment of the present invention. FIG. 5 is a flowchart (No. 5) showing the imprint method according to the embodiment of the present invention. FIG. 6 is a schematic view showing an example of the configuration (particularly, the configuration of the head) of the ink jet type resin coating apparatus used in the imprint method according to the embodiment of the present invention. FIG. 7 is a plan view showing an example of a transfer substrate used in the imprint method according to the embodiment of the present invention. FIG. 8 is a schematic view showing a positional deviation of the landing position of the imprint resin that is a target to be corrected in the imprint method according to the embodiment of the present invention. FIG. 9 is a plan view showing a position where the imprint resin can be dropped in the ink jet type resin coating apparatus used in the imprint method according to the embodiment of the present invention. FIG. 10 is a schematic diagram illustrating a technique for correcting the displacement of the landing position of the imprint resin in the imprint method according to the embodiment of the present invention.

Embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 1, first, an imprint mold is prepared which is used to form a fine concavo-convex pattern structure composed of an imprint resin in one or a plurality of substantially rectangular transfer regions on a transfer substrate. . And, at the time of imprint processing using the imprint mold, it is used when the imprint resin is discretely dropped onto the transfer region on the transfer substrate using a resin coating apparatus including a head having a plurality of nozzles. Temporary information (dropping related temporary information) related to the dropping of the imprint resin is generated (ST01).

  The imprint mold is not particularly limited, and examples thereof include those made of quartz glass, soda glass, fluorite, calcium fluoride, a silicon substrate, and the like.

  The fine concavo-convex pattern formed on the pattern forming surface of the imprint mold has a structure corresponding to the fine concavo-convex pattern in the fine concavo-convex pattern structure formed on the transfer substrate. Examples of the structure of such fine concavo-convex pattern include a line and space shape, a hole shape, a pillar shape, a lattice shape, and the like, and the dimensions and the like are not particularly limited, and are preferably about 100 nm or less, preferably Is about 10 to 60 nm.

  In this embodiment, a plurality of concavo-convex patterns for alignment are formed on the pattern forming surface of the imprint mold together with the fine concavo-convex pattern. The uneven pattern for alignment is used for alignment between the substrate to be transferred (transfer region) and the imprint mold during imprint processing using the imprint mold.

  The dripping related temporary information includes at least a temporary drop map. The temporary drop map is formed corresponding to coordinate information (XY coordinates) indicating the planned dropping position of each droplet of the imprint resin in the transfer region on the transfer substrate and the uneven pattern for alignment of the imprint mold. Coordinate information (XY coordinates) indicating the position of the concavo-convex pattern is included.

  The temporary drop map is generated based on the structure (shape, dimension, etc.) of the fine uneven pattern formed on the pattern forming surface of the imprint mold. Specifically, when the imprint resin droplet is brought into contact with the imprint mold pattern forming surface, the imprint resin droplet wets and spreads according to the structure of the fine concavo-convex pattern. And the amount of imprint resin necessary for forming the fine uneven pattern structure calculated from the remaining film thickness setting value in the fine uneven pattern structure, A temporary drop map is generated.

  The coordinate information indicating the planned dropping position of each droplet of imprint resin included in the temporary drop map is one corner arbitrarily selected from the four corners of the substantially rectangular transfer region (for example, the lower left corner). Is the XY coordinate of the geometric center of each droplet indicated by a circle. The coordinate information indicating the position of the concave / convex pattern formed corresponding to the alignment concave / convex pattern is the geometric center of the concave / convex pattern formed corresponding to the alignment concave / convex pattern when the corner is the origin. XY coordinates.

  Further, the drop-related temporary information includes information (nozzle-related information) related to the nozzle that drops each droplet of the imprint resin in the temporary drop map.

  As shown in FIG. 6, the head Hd provided in the resin coating apparatus in the present embodiment has a plurality of nozzles Nz. The plurality of nozzles Nz are arranged in parallel along a direction (sub-scanning direction) orthogonal to the main scanning direction (lateral direction in FIG. 6) of the head Hd, and are arranged in an oblique direction with respect to the main scanning direction. Further, the resin coating device includes a control unit CP that controls the operation of the resin coating device, and the control unit CP transmits a drive signal (discharge signal) to each nozzle Nz of the head Hd, so that each nozzle Nz The dripping of the imprint resin is controlled.

  When the imprint resin is dropped on the transfer region according to the drop map using the head Hd having such a configuration, each droplet in the drop map is generally moved while reciprocating the head Hd at a predetermined scanning speed in the main scanning direction. The imprint resin is dropped by the nozzle Nz and the drop timing (timing at which a drive signal (discharge signal) for dropping the imprint resin is sent to the nozzle Nz) according to the expected drop position. That is, once the drop map is determined, the information regarding the nozzle Nz responsible for dropping each droplet and the timing for dropping from the assigned nozzle Nz based on the planned dropping position of each droplet of the imprint resin in the drop map. Nozzle-related information including information is generated.

  Accordingly, in the present embodiment as well, based on the temporary drop map generated as described above, information on the nozzle Nz responsible for dropping each droplet in the temporary drop map and the drop timing from the assigned nozzle Nz. Nozzle related information including information about is generated.

  Next, the imprint resin is dropped based on the drop-related temporary information generated as described above (ST02). At this time, the imprint resin may be dropped on the transfer substrate on which the fine concavo-convex pattern structure is formed using the imprint mold, or a substrate different from the transfer substrate (substrate for determining misalignment). An imprint resin may be dropped on the top.

  The transfer substrate is a substantially circular substrate (silicon wafer or the like) having a plurality of transfer regions (regions on which fine concavo-convex pattern structures are formed) IA as shown in FIG. 7, and a step using an imprint mold When forming a fine concavo-convex pattern structure in each transfer area IA by an and repeat type imprint process, in ST02, the imprint resin may be dropped on one arbitrarily selected transfer area IA. When an area having the same shape as the transfer area IA can be secured in an area NA (non-transfer area) that is not the transfer area IA on the substrate, it is preferable to drop the imprint resin into the non-transfer area NA. By dropping the imprint resin onto the non-transfer area NA, the transfer target substrate can be effectively used.

  Next, the pattern forming surface of the imprint mold is brought into contact with the dropped droplets of the imprint resin, the imprint resin is wetted and spread, the imprint resin is cured, and then the imprint mold is peeled off to make fine An uneven pattern structure is formed (ST03).

  At this time, a concavo-convex pattern corresponding to the alignment concavo-convex pattern is formed together with the fine concavo-convex pattern corresponding to the fine concavo-convex pattern of the imprint mold. Since the temporary drop map included in the drop-related temporary information includes coordinate information indicating the position of the concave / convex pattern, the concavo-convex pattern formed in this way is converted into XY coordinates of the landing position of the imprint resin described later. It can be used as a reference mark in the step of measuring (ST06) and the step of determining the displacement of the landing position (ST07).

  Subsequently, an imprint resin is dropped on the fine concavo-convex pattern structure according to the temporary drop map (ST04), and the dropped imprint resin droplet is cured as it is (ST05). By hardening the droplets of the imprint resin dropped on the fine concavo-convex pattern structure as it is, the disappearance of the droplets due to the volatilization of the imprint resin can be prevented. It is also possible to measure the landing position without curing the imprint resin droplet, but if the imprint resin droplet moves after the imprint resin is dropped and before the landing position is measured. Accurate landing position measurement may be difficult. However, since the imprint resin droplets are cured, the imprint resin droplets are brought into close contact with each other, so that the landing position of the imprint resin can be measured more accurately. In addition, for the purpose of more accurately measuring the landing position of the imprint resin, the dropped droplets of the imprint resin are cured. Therefore, it is ideal to cure immediately after the imprint resin is dropped and before the imprint resin is volatilized, but even if the dropped imprint resin is volatilized somewhat, the landing position of the imprint resin is It is only necessary that the imprint resin droplets can remain as a cured product to the extent that measurement is possible.

  Then, the XY coordinates of the position (landing position) of each droplet of the cured imprint resin are measured (ST06). The XY coordinates of the landing position are the coordinates of the geometric center in plan view of each droplet when an arbitrarily selected corner (for example, the lower left corner) in the transfer region is the origin, It can be measured by optical means such as a microscope.

  In addition, a droplet of imprint resin was actually dropped at the position of the origin (an arbitrarily selected one corner in the transfer region) serving as a reference for the XY coordinates of the landing position in the temporary drop map of the drop-related temporary information. It cannot be accurately determined on the substrate to be transferred or the substrate for determining displacement. That is, the XY coordinates of the landing position cannot be accurately measured.

  However, the concavo-convex pattern formed corresponding to the concavo-convex pattern for alignment in the fine concavo-convex pattern structure formed in ST03 is formed in accordance with the position of the concavo-convex pattern in the temporary drop map. By measuring the XY coordinates of the landing positions when the concave / convex pattern is used as the origin in ST06, it is possible to accurately determine the presence / absence of positional deviation of each landing position in ST07 described later.

  The XY coordinates of each landing position thus measured are compared with the XY coordinates of each droplet of the imprint resin in the temporary drop map, and it is determined whether or not the landing position is displaced (ST07). ). More specifically, the measured value of the XY coordinates of each landing position in ST06 is compared with the difference between the XY coordinates of each droplet in the temporary drop map and the XY coordinates of the concavo-convex pattern set as the origin in ST06. The determination of whether or not the landing position is displaced may be made only when the landing positions are completely coincident with each other. However, even if the landing position is misaligned (when the two compared in ST07 do not match completely), the defect caused by the misalignment in the fine concavo-convex pattern structure formed by imprinting (For example, unfilled defects due to insufficient imprint resin, film thickness unevenness, etc.) or misalignment that does not affect the etching accuracy in the etching process as a subsequent process due to such misalignment. If so, it may be determined that there is no positional deviation of the landing position, assuming that the positional deviation is within an allowable range. The permissible range of the misregistration amount (the misregistration amount in the main scanning direction (X direction) and the misregistration amount in the sub-scanning direction (Y direction)) depends on the size and structure of the fine concavo-convex pattern of the imprint mold. Can be obtained empirically or experimentally or by simulation or the like according to the allowable range of dimensional errors of the fine concavo-convex pattern structure formed by the above.

  When it is determined that the landing position is not displaced (ST07, No), it can be evaluated that the imprint resin droplets are being dropped according to the position of each droplet in the temporary drop map. The temporary drop map is determined as a drop map (imprint resin dropping position), and the dropping related temporary information is determined as dropping related information (ST11).

  On the other hand, if it is determined that the landing position is displaced (ST07, Yes), it is determined whether the imprint resin dripping planned position in the temporary drop map can be corrected (ST08). That is, by correcting the position of the droplet dropped from the nozzle Nz that causes the positional deviation of the landing position, the droplet dropped from the nozzle Nz is in accordance with the imprint resin dropping planned position in the temporary drop map. It is determined whether or not it is dripped.

  For example, as shown in FIG. 8A, a specific row of droplets D among the droplets arranged in parallel in the main scanning direction of the head Hd (the horizontal direction in FIG. 8A) It is assumed that there is a positional deviation parallel to the main scanning direction with a predetermined positional deviation amount ΔX with respect to the print resin dripping planned position Dp. In this case, if the position of the row of droplets D in the temporary drop map is corrected along the main scanning direction, it is considered that the imprint resin is dropped according to the planned dropping position of each droplet in the temporary drop map. It is done.

  However, the resin coating apparatus in the present embodiment cannot change the interval between the plurality of nozzles Nz due to limitations on the apparatus, and the imprint resin from the scanning speed in the main scanning direction of the head Hd and the nozzles Nz. Are synchronized with the drop timing, and the scanning speed and the drop timing cannot be changed independently. Therefore, as shown in FIG. 9, the imprint resin can be dropped only on the intersection point PI of the predetermined grid line G.

The size (length t ₁ , t _{2 in the} main scanning direction (horizontal direction in FIG. 9) and sub-scanning direction (vertical direction in FIG. 9) of each substantially square cell C constituted by the grid lines G is: The nozzle Nz interval in the resin coating apparatus, the scanning speed of the head Hd in the main scanning direction, the drop timing of the imprint resin from the nozzle Nz, the movable distance of the head Hd in the sub-scanning direction (1 / of the interval between the plurality of nozzles Nz N (N is an integer greater than or equal to 1)) and the like.

Since each droplet of the imprint resin in the temporary drop map is located on the intersection point PI of the grid line G, the position of the droplet where the landing position is displaced is corrected only on the intersection point PI of the grid line G. obtain. That is, if the amount of positional deviation of the landing position in the main scanning direction is not a positive integer multiple (excluding 0) of the length t ₁ of the cell C in the main scanning direction, the imprint resin planned dropping position in the temporary drop map Even if the correction is made, it is impossible to drastically eliminate the positional deviation because the droplet of the imprint resin cannot be dropped at the corrected dropping planned position due to limitations on the apparatus.

  On the other hand, if the amount of positional deviation of the landing position is within the allowable range, a defect due to the positional deviation of the landing position does not occur in the formed fine concavo-convex pattern structure or even if the defect occurs, It does not affect the etching process of the transfer substrate.

Therefore, the main and positional deviation amount ΔX landing position in the scanning direction, (except for 0) positive integer multiple of the length t ₁ in the main scanning direction of the cell C difference Dt between _{(-t 1/2 ≦ Dt ≦} t _If 1/2) is within the allowable range of misalignment, in ST08, it is determined that the planned imprint resin dropping position in the temporary drop map can be corrected.

  Specifically, if the difference Dt calculated by the following equation (1) and the difference Dt satisfying the following equation (2) is within the allowable range of the positional deviation amount, the imprint in the temporary drop map It is determined that the planned dripping position of the resin can be corrected.

Dt = ΔX−a × t ₁ (1)
_{-T 1/2 ≦ Dt ≦ t} 1/2 ··· (2)
In Expression (1), ΔX represents “a positional deviation amount of the landing position in the main scanning direction”, and t ₁ represents “a length in the main scanning direction of the cell C set by the restriction on the apparatus of the resin coating apparatus”. A is a positive integer excluding 0.

  For example, as shown in FIG. 8B, the landing position D of the imprint resin is a position shift amount ΔX substantially parallel to the main scanning direction with respect to the planned imprint resin dropping position Dp in the temporary drop map. It is assumed that a positional deviation has occurred. At this time, as a difference between the positional deviation amount ΔX and a positive integer multiple (excluding 0) of the length t1 of the cell C in the main scanning direction, the following formulas (3) and (4) are obtained from the above formula (1). Is calculated as shown in FIG.

Dt1 = ΔX−2 × t ₁ (3)
Dt2 = ΔX−3 × t ₁ (4)

  Of the two differences Dt1 and Dt2 calculated in this way, when the difference Dt1 that satisfies the above equation (2) is within the allowable range of the positional deviation amount, the imprint resin is scheduled to be dropped in the temporary drop map. It is determined that the position can be corrected.

  On the other hand, as shown in FIG. 8C, when the positional deviation direction of the landing position is not substantially parallel to the main scanning direction, the temporary drop only needs to be corrected by correcting the planned imprint resin dropping position in the temporary drop map. The imprint resin cannot be dropped according to the position of each droplet on the map. Therefore, in this case, it is determined that the imprint resin dripping planned position in the temporary drop map cannot be corrected.

  As will be described later, in the step of correcting the temporary drop map (ST09), the temporary drop map is corrected to reflect the positional shift direction and the positional shift amount of the liquid droplet in which the positional shift has occurred. That is, according to the corrected drop map, each droplet is dropped according to the imprint resin dropping planned position in the temporary drop map by being dropped from the nozzle Nz that causes the positional deviation.

  On the other hand, when the misalignment direction is not substantially parallel to the main scanning direction and the planned dropping position in the temporary drop map is corrected to reflect the misalignment direction and the misalignment amount, based on the corrected drop map In the generated nozzle-related information, there is a possibility that the nozzle Nz in charge of dropping the droplet at the planned dropping position in the corrected drop map may be changed.

  If there is no displacement in the assigned nozzle Nz after the change, the imprint resin will be dripped in accordance with the corrected drop map, and even if there is a displacement in the assigned nozzle Nz after the change. It can be easily expected that the assigned nozzle Nz before the change is different from the misalignment direction and / or misalignment amount.

  For this reason, when the positional deviation direction of the landing position is not substantially parallel to the main scanning direction, even if the temporary drop map is corrected, the imprint resin droplets are not always dropped according to the temporary drop map. Therefore, it is determined that the imprint resin dripping planned position in the temporary drop map cannot be corrected.

  Therefore, in ST08, it is determined whether or not the landing position displacement direction is substantially parallel to the main scanning direction. Specifically, it is determined whether or not the amount of positional deviation in the sub-scanning direction (direction orthogonal to the main scanning direction) of the landing position is within an allowable range. Then, when it is determined that the positional deviation direction of the landing position is substantially parallel to the main scanning direction, a difference Dt that satisfies the above equation (2) is calculated by the above equation (1). When it is determined that the difference Dt is within the allowable range of the positional deviation amount, it is determined that the planned dropping position of the imprint resin in the temporary drop map can be corrected.

  On the other hand, when it is determined that the positional deviation direction of the landing position is not substantially parallel to the main scanning direction, or the positional deviation direction of the landing position is substantially parallel to the main scanning direction, the above formula (2) If it is determined that the difference Dt calculated by the above formula (1) is not within the allowable range of the positional deviation amount, the planned dropping position of the imprint resin in the temporary drop map cannot be corrected. It is judged.

  If it is determined in ST08 that the planned imprint resin dripping position in the temporary drop map can be corrected (ST08, Yes), the imprint resin dripping in the temporary drop map is determined based on the positional deviation amount of the landing position. A corrected drop map in which the planned position is corrected is generated, and drip related correction information including the corrected drop map and nozzle related information is generated (ST09). And dripping related correction information is determined as dripping related information (ST10).

For example, as shown in FIG. 8A, a specific row of droplets D among the droplets arranged in parallel in the main scanning direction of the head Hd (the horizontal direction in FIG. 8A) Consider a case in which a positional deviation occurs in parallel to the main scanning direction with a predetermined positional deviation amount ΔX with respect to the planned resin dropping position Dp. In this case, as shown in FIG. 10, the planned dropping position Dp in the temporary drop map is corrected in the direction (left direction in FIG. 10) opposite to the position shift direction (right direction in FIG. 10) along the main scanning direction. It will be. At this time, a positive integer multiple (a ×) of the length t ₁ of the cell C in the main scanning direction set by the restriction on the apparatus of the resin coating apparatus in the above formula (1) when the difference is calculated in ST08. t ₁ ) The planned dropping position Dp is corrected to the position Dp ′ shifted by an amount, and a corrected drop map is generated.

  Thereby, the dripping position of the imprint resin in which the positional deviation of the landing position of the imprint resin is reflected can be determined. Therefore, by controlling the resin coating device so that the imprint resin is dropped according to the modified drop map created in this way, the landing position is not unintentionally shifted and the temporary drop map is followed. The imprint resin is dropped at the planned dropping position. As a result, it is possible to form a fine concavo-convex pattern structure without generating defects due to the displacement of the landing position of the imprint resin. In addition, even if the landing position is misaligned, the imprint process can be continued without cleaning the inkjet head nozzles or replacing the inkjet head. Thus, the productivity of the fine uneven pattern structure can be improved.

  If it is determined that the imprint resin dropping scheduled position in the temporary drop map cannot be dealt with (ST08, No), the nozzle of the inkjet head is cleaned and the operation of the resin coating apparatus is adjusted (for example, The adjustment of the scanning speed in the main scanning direction of the head, the adjustment of the output (transmission) timing of the drive signal (ejection signal) from the control unit CP to each nozzle Nz, Any one of (position adjustment, etc.) is performed (ST12, ST24), and the same processes as ST2-ST07 are performed again (ST13-ST18, ST25-ST30).

  Since the misalignment of the landing position of the imprint resin may occur due to contamination of each nozzle of the inkjet head, in such a case, by appropriately cleaning the nozzle of the inkjet head (ST12), the misalignment can be reduced. The imprint resin can be dropped according to the planned dropping position in the temporary drop map.

  Further, by adjusting the scanning speed of the head Hd in the main scanning direction (ST24), it is also possible to bring the landing position of the imprint resin closer to the planned dropping position in the temporary drop map. For example, when the landing position of the imprint resin is deviated further in the traveling direction of the head Hd than the planned dropping position in the temporary drop map, the amount of positional deviation of the landing position is reduced by slowing the scanning speed of the head Hd. can do. On the other hand, when the landing position of the imprint resin is shifted to the front side in the traveling direction of the head Hd from the planned dropping position in the temporary drop map, the amount of positional deviation of the landing position can be reduced by increasing the scanning speed of the head Hd. Can be small. By adjusting the scanning speed of the head Hd in this manner, the displacement of the landing position can be eliminated, and the imprint resin can be dropped according to the planned dropping position in the temporary drop map.

  Further, the timing for transmitting (outputting) the drive signal (discharge signal) from the control unit CP of the resin coating apparatus to the nozzle Nz that causes the displacement of the landing position of the imprint resin is adjusted (faster or slower). By doing so, it is possible to eliminate the displacement of the landing position. Thereby, imprint resin can be dripped according to the dripping planned position in a temporary drop map.

  Furthermore, the displacement amount of the landing position of the imprint resin can be reduced by moving the substrate mounting table (stage) on which the transfer substrate is mounted in the resin coating apparatus in the in-plane direction (XY direction). . In this case, for example, the temporary drop map includes one temporary drop map that includes only the planned dropping position where the imprint resin is dropped by the nozzle Nz that does not cause the positional deviation of the landing position, and the positional deviation of the landing position. When the imprint resin is dropped according to another temporary drop map, the substrate is installed in two parts, the other temporary drop map consisting only of the planned drop position where the imprint resin is dropped by the nozzle Nz to be generated. The stage (stage) can be moved. By doing in this way, position shift of a landing position can be eliminated and imprint resin can be dripped according to the dripping planned position in a temporary drop map.

  Accordingly, when it is determined that the landing position is not displaced by the cleaning of the head Hd or the adjustment of the operation of the resin coating apparatus (ST18, No; ST30, No), it is generated in ST1. The dropped drop related temporary information is determined as drop related information (ST22, ST34).

  On the other hand, if it is determined that the landing position is still displaced (ST18, Yes; ST30, Yes), whether or not the temporary drop map can be corrected is determined in the same manner as in ST08 (ST19, ST31). . If it is determined that the temporary drop map can be corrected (ST19, Yes; ST31, Yes), the drop-related correction information is based on the positional deviation amount and the positional deviation direction in the same manner as in ST09 and ST10. (ST20, ST32), and the drip related correction information is determined as drip related information (ST21, ST33).

  When it is determined that the temporary drop map cannot be corrected (ST19, No; ST31, No), it is determined whether the adjustment of the operation of the resin coating apparatus or the cleaning of the nozzle of the head has been completed (ST23, If it is determined that both have ended (ST23, Yes; ST35, Yes), the processing after ST36 described later is performed. On the other hand, when it is determined that either one has not ended (ST23, No; ST35, No), the other of the adjustment of the operation of the resin coating apparatus and the cleaning of the nozzles of the head is performed (ST24, ST12). The same steps as ST02 to ST07 are performed again (ST25 to ST30, ST13 to ST18). When it is determined that the landing position is not displaced (ST30, No; ST18, No), the drop-related temporary information generated in ST01 is determined as the drop-related information (ST34, ST22). ).

  On the other hand, if it is determined that the landing position is still displaced (ST30, Yes; ST18, Yes), whether or not the temporary drop map can be corrected is determined in the same manner as in ST08 (ST31, ST19). . If it is determined that the temporary drop map can be corrected (ST31, Yes; ST19, Yes), the drop-related correction information is based on the positional deviation amount and the positional deviation direction in the same manner as ST09 and ST10. Is generated (ST32, ST20), and the drip related correction information is determined as drip related information (ST33, ST21).

  When both the cleaning of the nozzle of the head and the adjustment of the operation of the resin coating apparatus are performed, it is determined that the landing position is still displaced and the temporary drop map cannot be corrected (ST23, No). ; ST35, No), the nozzle related information included in the dripping related temporary information is corrected.

  First, the nozzle (abnormal nozzle) that caused the displacement of the landing position when the imprint resin is dropped based on the drop-related temporary information is identified (ST36). The abnormal nozzle can be identified by identifying the nozzle in charge of dropping the imprint resin droplet determined to be displaced in ST07 based on the provisional related information.

  Then, the abnormal nozzle is changed to another nozzle (ST37), the nozzle related information in the dripping related temporary information is corrected, and drip related correction information is generated (ST38). The other nozzles include an unused nozzle in the nozzle-related information, a nozzle that is used in the nozzle-related information and does not cause a displacement of the landing position, and a main scanning direction (traveling direction) of the head Hd in the nozzle-related information ) And nozzles that are displaced in parallel with each other.

  Subsequently, based on the drop-related correction information generated in ST38, an imprint resin is dropped (ST39), and a fine uneven pattern structure is formed in the same manner as ST03 (ST40). Then, the imprint resin is dropped on the fine concavo-convex pattern structure based on the drop-related correction information generated in ST38 (ST41), and the dropped imprint resin droplet is left as it is in the same manner as ST05. It is cured in a state (ST42).

  Next, in the same manner as in ST06 and ST07, the XY coordinates of the landing position of the imprint resin are measured (ST43), and it is determined whether or not the landing position is displaced (ST44). At this time, only the XY coordinates of the landing position of the imprint resin dropped from the assigned nozzle after the change are measured in ST37, and it is determined whether or not the landing position is misaligned.

  If it is determined in ST44 that the landing position is not displaced (ST44, No), the droplet of imprint resin from the assigned nozzle changed in ST37 according to the position of each droplet in the temporary drop map. Therefore, the provisional drop map is determined as a drop map (imprint resin dropping position), and the drop-related correction information generated in ST38 is determined as the drop-related information ( ST48).

  On the other hand, when it is determined that the landing position is displaced (ST44, Yes), the imprint resin droplet is dropped by the assigned nozzle changed in ST37 in the temporary drop map (ST37). In the same manner as in ST08, it is determined whether or not the position to be corrected can be corrected (ST45).

  If it is determined in ST45 that the imprint resin dripping planned position in the temporary drop map can be corrected (ST45, Yes), based on the positional deviation amount of the landing position from the assigned nozzle changed in ST37, A correction drop map is generated by correcting the planned dropping position of the imprint resin in the temporary drop map, and drop-related recorrection information including the correction drop map and the nozzle-related correction information is generated (ST46). Then, the drop related recorrection information is determined as the drop related information (ST47).

  When it is determined that the dropping position of the imprint resin in the temporary drop map cannot be corrected (ST45, No), the above ST37 to ST44 are repeated while changing the assigned nozzle.

  After correcting the temporary drop map and / or the nozzle related information as described above, and determining the drip related correction information or the drip related recorrection information including the corrected drop map and / or the nozzle related correction information as the drip related information, Based on the dropping related information, the imprint resin is dropped onto the transfer region on the transfer substrate using the resin coating apparatus (ST49).

  In the present embodiment, the imprint resin is not particularly limited, and a resin (such as a thermosetting resin or an ultraviolet curable resin) that is normally used for imprinting can be used.

  After that, the imprint resin that has been dropped onto the transfer area of the substrate to be transferred is brought into contact with the pattern forming surface of the imprint mold so that the imprint resin wets and spreads on the substrate. The resin is cured by application of heat, irradiation of ultraviolet rays, and the like, and the imprint mold is peeled off from the cured imprint resin (ST50). In this way, a fine concavo-convex pattern structure is formed on the transfer region of the transfer substrate.

  As described above, in the imprint method according to the present embodiment, the imprint resin is dropped according to a temporary drop map that can be a uniform residual film thickness according to the type of the fine uneven pattern of the imprint mold. Since the drop-related information is determined, the imprint resin dropped based on the drop-related information is dropped according to the temporary drop map on the transfer area of the transfer substrate. Therefore, by transferring the fine concavo-convex pattern to the imprint resin dropped in such a manner using an imprint mold, it is possible to form a fine concavo-convex pattern structure having a substantially uniform remaining film thickness as a whole. . In addition, since the displacement of the landing position of the imprint resin does not occur, without causing defects due to unfilled imprint resin in the recesses of the imprint mold, defects due to lack of imprint resin (open defects), etc. A fine concavo-convex pattern structure can be formed. Therefore, a fine concavo-convex pattern structure with high dimensional accuracy can be formed, and the occurrence of defects or the like in the fine concavo-convex pattern structure can be suppressed.

The imprint method according to the present embodiment as described above can be applied to a method for manufacturing a semiconductor device.
That is, the imprint method according to the present embodiment makes it possible to finely transfer a transfer substrate (a semiconductor substrate generally used in a semiconductor device such as a Si single crystal substrate, a Si epitaxial substrate, a GaAs substrate, a GaP substrate, or a GaN substrate) to a transfer region. An uneven pattern structure is formed, and the semiconductor substrate is etched using the fine pattern structure as an etching mask. A semiconductor device can be manufactured through such steps.

  By the imprint method according to the present embodiment, the remaining film thickness is substantially uniform as a whole, without causing defects (unfilled defects, open defects, etc.) due to misalignment of the landing position of the imprint resin, Since a fine uneven pattern structure having a substantially uniform remaining film thickness can be formed as a whole, according to the method for manufacturing a semiconductor device in this embodiment to which such an imprint method is applied, the semiconductor substrate is etched with high accuracy. Thus, a wiring pattern or the like in the semiconductor device can be formed with high accuracy.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  In the above embodiment, the drop related correction information generated in ST09, ST20, ST32 and the drop related recorrection information generated in ST46 are determined as the drop related information (ST10, ST21, ST33, ST47). The present invention is not limited to such an embodiment. For example, after generating the drip-related correction information or drip-related recorrection information (ST09, ST20, ST32, ST46), the imprint resin is dropped based on the information, and the displacement of the landing position of the imprint resin is eliminated. It may be confirmed whether or not it is done. Specifically, the same processing as ST02 to ST07 may be performed. As a result, the displacement of the landing position can be resolved more effectively.

  In the above-described embodiment, the fine uneven pattern structure is formed by performing a transfer process using an imprint mold on the imprint resin dropped based on the drop-related temporary information or the drop-related correction information. Although the imprint resin is dropped again on the pattern structure based on the drop-related temporary information or the drop-related correction information, it is determined whether or not the landing position is misaligned (ST02-07, ST13-18, ST25). -30, ST39-44), this invention is not limited to such an aspect. For example, the position of the landing position (droplet) of the imprint resin dropped based on the dripping related temporary information or the drop related correction information is measured without forming a fine uneven pattern structure, and the positional deviation of the landing position is detected. The presence or absence may be determined. In this case, when the XY coordinates of the landing position are measured, for example, a predetermined shape on the substrate to be transferred or the misregistration determination substrate (a corner or an edge of the mesa structure if it has a mesa structure). May be used instead of the reference mark.

  In the above embodiment, the imprint resin droplets dropped before the landing position is measured are cured as they are (ST05, ST16, ST28, ST42), but the present invention is limited to such a mode. The landing position may be measured without curing the droplets of the imprint resin.

  In the above embodiment, the presence / absence of displacement of the landing position is determined based on the measured landing position (see ST06, ST17, ST29, and ST43) (see ST07, ST18, ST30, and ST44). The invention is not limited to such an embodiment. For example, it is determined whether or not the landing position is displaced from at least the dropping of the imprint resin (ST04, ST15, ST27, ST41) (ST07, ST18, ST30, ST44). The above steps may be repeated a plurality of times (once for each of a plurality of transfer regions IA or non-transfer regions NA).

  In this case, the displacement direction and displacement amount of each landing position where displacement has occurred in each of the above-described steps (steps ST04 to ST07, ST15 to ST18, ST27 to ST30, ST41 to ST44) are obtained. . After that, among the landing positions where misalignment has occurred, the misalignment direction and misalignment amount at each time in the above-described steps (steps ST04 to ST07, ST15 to ST18, ST27 to ST30, ST41 to ST44). A substantially matching landing position (landing position at which approximately the same displacement behavior (position displacement direction and displacement amount) is indicated each time) is extracted. Then, it is only necessary to determine whether or not the imprint resin dripping planned position in the temporary drop map can be corrected at the landing position extracted in this way (see ST08, ST19, ST31, and ST45).

  If there are variations in the position shift direction and position shift amount of each landing position among the landing positions where the position shift occurs, the dripping schedule in the provisional drop map is determined only by determining once the presence or absence of the position shift. If the position is corrected, even if the imprint resin is dropped according to the drop-related correction information (see ST09, ST20, ST32, and ST46) including the generated correction drop map, the position of the landing position may still be displaced. . However, when the provisional drop map can be corrected based on the determination of whether or not the landing position has been displaced multiple times, a corrected drop map in which the planned dropping position is corrected only for the landing position extracted as described above. By generating the dripping related correction information including the imprint resin, the dripping position of the imprint resin can be determined in consideration of the positional deviation of the landing position more accurately.

  The present invention is useful as a nanoimprint process for forming a fine uneven pattern in the manufacturing process of a semiconductor device.

Claims (10)

An imprint in which a concavo-convex pattern is formed on a pattern forming surface of an imprint resin that is discretely dropped at a predetermined position on a transfer surface using an ink jet type resin coating apparatus having a head having a plurality of nozzles. In the imprint method of transferring the concavo-convex pattern using a mold, a method for determining a dropping position of the imprint resin on the transferred surface,
A first dropping step of dropping the imprint resin by the head according to a planned dropping position of the imprint resin determined based on the uneven pattern of the imprint mold;
A position for determining whether or not there is a positional shift with respect to the planned dropping position of the imprint resin in at least one of the landing positions of the imprint resin dropped according to the planned dropping position in the first dropping step. A deviation determination step;
Whether or not the planned dropping position can be corrected when it is determined that a positional deviation has occurred in at least one of the landing positions of the imprint resin dropped according to the planned dropping position in the positional deviation determination step. A correction propriety determining step for determining
When it is determined that the planned dropping position can be corrected by the correction possibility determining step, the planned dropping position correcting step for correcting the planned dropping position;
The dropping scheduled position is corrected corrected dropping position by the dropwise predetermined position correcting step, said possess a dropping position determination step of determining a dropping position of the imprint resin in the transfer plane,
In the misregistration determination step, measure the misalignment direction of the landing position of the imprint resin dripped according to the planned dripping position in the first dripping step with respect to the planned dripping position of the imprint resin,
The imprint resin dropping position characterized in that, in the correction possibility determination step, when the misalignment direction and the main scanning direction of the head substantially coincide with each other, it is determined that the planned dropping position can be corrected. Decision method. In the misregistration determination step, the misalignment amount between the landing position of the imprint resin dripped according to the planned dripping position in the first dripping step and the planned dripping position of the imprint resin is measured, and It is determined whether or not the positional deviation has occurred based on the positional deviation amount,
2. The imprint resin dropping position determination method according to claim 1, wherein the planned dropping position is corrected based on the measured displacement amount in the scheduled dropping position correction step. A liquid droplet curing step of curing the imprint resin dripped according to the planned dripping position in the first dripping step in a liquid droplet state;
Landing of the imprint resin dropped according to the planned dropping position based on the position of each droplet of the imprint resin cured by the droplet curing step and the planned dropping position in the positional deviation determination step The imprint resin dropping position determination method according to claim 1 or 2 , wherein at least one of the positions, it is determined whether or not a positional deviation has occurred with respect to the expected dropping position. An uneven pattern and an alignment uneven pattern are formed on the pattern forming surface of the imprint resin that is discretely dropped at a predetermined position on the transfer surface using an ink jet type resin coating apparatus including a head having a plurality of nozzles. In an imprint method for transferring the concavo-convex pattern using an imprint mold formed, a method for determining a dropping position of the imprint resin on the transferred surface,
A first dropping step of dropping the imprint resin on a predetermined plane by the head according to a planned dropping position of the imprint resin determined based on the uneven pattern of the imprint mold;
After the imprint resin is dropped on a predetermined plane according to the planned dropping position in the first dropping step, the pattern formation surface of the imprint mold and the imprint resin are brought into contact with each other to spread on the plane. A transfer step of curing the imprint resin and forming an uneven pattern structure on the flat plate;
A second dropping step of dropping the imprint resin on the concavo-convex pattern structure formed by the transfer step according to the planned dropping position;
A position for determining whether or not there is a positional shift with respect to the planned dropping position of the imprint resin in at least one of the landing positions of the imprint resin dropped according to the planned dropping position in the second dropping step. A deviation determination step;
Whether or not the planned dropping position can be corrected when it is determined that a positional deviation has occurred in at least one of the landing positions of the imprint resin dropped according to the planned dropping position in the positional deviation determination step. A correction propriety determining step for determining
When it is determined that the planned dropping position can be corrected by the correction possibility determining step, the planned dropping position correcting step for correcting the planned dropping position;
Inn characterized by chromatic and dropping position determination step of determining the dripping expected position corrected corrected dropping position by the dropwise predetermined position correcting step, as the dropping position of the imprint resin in the transferred surface on A method for determining the position of dripping printed resin. The pre-Symbol the imprint resin dripped in accordance with the dropping position scheduled by the second dropping step, further comprising a droplet curing step of curing remains droplet state,
Landing of the imprint resin dropped according to the planned dropping position based on the position of each droplet of the imprint resin cured by the droplet curing step and the planned dropping position in the positional deviation determination step The imprint resin dropping position determination method according to claim 4 , wherein at least one of the positions, it is determined whether or not a positional deviation has occurred with respect to the planned dropping position. A head cleaning step of performing a cleaning process on the head when it is determined by the correction propriety determination step that the planned dropping position cannot be corrected;
The imprint resin dripping position determination method according to claim 1, wherein the first dripping step is performed by the head washed by the head washing step. An adjustment step of adjusting the operation of the resin coating device when it is determined by the correction propriety determination step that the planned dropping position cannot be corrected;
The imprint resin dropping position determination method according to claim 1, wherein the first dropping step is performed by the head of the resin coating apparatus whose operation is adjusted by the adjusting step. Using an imprint mold in which a concavo-convex pattern is formed on a pattern forming surface, an imprint method for forming the concavo-convex pattern structure by transferring the concavo-convex pattern to an imprint resin on a transfer surface,
A resin dropping step of discretely dropping the imprint resin at a predetermined dropping position on the transfer surface based on resin dropping related information using an ink jet type resin coating apparatus including a head having a plurality of nozzles;
The imprint resin is dripped onto the transfer surface by bringing the imprint resin droplets dropped on the transfer surface into contact with the pattern forming surface of the imprint mold. A transfer step of curing the imprint resin spread on the transfer surface to form the concavo-convex pattern structure,
The resin dripping related information includes information on the dropping position of each droplet of the imprint resin on the transfer surface and information on a nozzle for dropping the droplet of the imprint resin associated with each dropping position. At least included,
The said dripping position in the said resin dripping process is the said correction dripping position determined as a dripping position of the said imprint resin by the imprint resin dripping position determination method in any one of Claims 1-7, or the said imprint mold An imprint method, which is a planned dropping position determined based on the uneven pattern. The dropping position in the resin dropping step is a planned dropping position determined based on the uneven pattern of the imprint mold,
In the imprint resin dripping position determination method in any one of Claims 1-7, when it determines that the said dripping planned position cannot be corrected, the said landing position which a position shift produces with respect to the said dripping planned position The imprint method according to claim 8, wherein a nozzle in charge of dripping of the imprint resin corresponding to is changed to another nozzle.   10. A method of manufacturing a semiconductor device, wherein the predetermined substrate is etched using the concave / convex pattern structure formed on the transfer surface by the imprint method according to claim 8 as a mask.

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