JP7015134B2 - Imprint device, imprint method, information processing device, generation method, program and manufacturing method of goods - Google Patents

Description

The present invention relates to an imprint device, an imprint method, an information processing device, a generation method, a program, and a method for manufacturing an article.

As a new photolithography technology, an imprint technology that can form a fine pattern (structure) on the order of several nanometers on a substrate is attracting attention. Imprint technology supplies (places) an imprint material on a substrate and cures the imprint material with the mold (mold or template) in contact with the imprint material to form a pattern on the substrate. It is a microfabrication technology to transfer. In the imprint technique, it is important to supply the imprint material to an appropriate position on the substrate, and some techniques related to the supply to the imprint material have been proposed (see Patent Documents 1 to 3).

Patent Document 1 includes an imprint having a substrate stage for holding a substrate, a dispenser for supplying an imprint material on the substrate, and a scope for detecting the position (giving position) of the imprint material supplied on the substrate. The device is disclosed. The imprint apparatus disclosed in Patent Document 1 calculates the amount of deviation between the applied position of the imprint material supplied to a predetermined area on the substrate and the reference position, and imprints on the substrate according to the amount of deviation. It controls the drive of the substrate stage when supplying the material.

Patent Document 2 discloses a method of determining a position (dropping position) of an impregnated material when an imprint material is supplied onto a substrate by an inkjet method. The method disclosed in Patent Document 2 is a step of determining whether or not a positional deviation occurs between the actual dropping position and the scheduled dropping position of the imprint material supplied on the substrate, and the positional deviation is corrected. It includes a step of determining the dropping position of the imprint material on the substrate.

Patent Document 3 discloses an imprint method in which an imprint material is supplied (discharged) from a plurality of nozzles (discharge ports) of an inkjet head according to a drop recipe indicating a drop position of the imprint material on a substrate. The imprint method disclosed in Patent Document 3 specifies a non-ejection nozzle from a plurality of nozzles of the inkjet head, and changes the drop recipe so that the imprint material is ejected by a nozzle different from the non-ejection nozzle. include.

Japanese Unexamined Patent Publication No. 2011-222705 Japanese Unexamined Patent Publication No. 2014-103189 Japanese Unexamined Patent Publication No. 2016-58476

However, in the imprint device, the nozzle (combination) used in the adjustment process for adjusting the supply position (drop position and drop position) of the imprint material on the substrate and the nozzle used in the actual process for manufacturing a device or the like are used. Is often different. Specifically, in the adjustment step, it is common to use all the nozzles, but in the actual step, not all the nozzles are used, but the nozzles selected according to the drop recipe are used. In such a case, the conventional technique has a problem that a positional deviation occurs between the supply position of the imprint material supplied on the substrate in the actual process and the target position. This is because the average misalignment amount of the entire nozzle may differ from the average misalignment amount of the nozzle used in the actual process.

The present invention has been made in view of such problems of the prior art, and it is an exemplary object to provide an imprinting apparatus which is advantageous for supplying an imprinting material to a target position on a substrate.

In order to achieve the above object, the imprint device as one aspect of the present invention is an imprint device that forms a pattern of imprint material on a substrate by using a mold, and a plurality of imprint devices that discharge the imprint material. A supply unit that includes the discharge port of the above and supplies the imprint material onto the substrate via the plurality of discharge ports, and each of the plurality of discharge ports is supplied onto the substrate from each discharge port. From the acquisition unit that acquires information including the amount of deviation between the position of the imprint material and the target position, and from the information, the first discharge port used for the supply among the plurality of discharge ports is placed on the substrate. Control to control the position of the imprint material supplied onto the substrate from the first discharge port so that the deviation between the average value of the positions of the supplied imprint materials and the target position is within an allowable range. It is characterized by having a portion and.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an imprinting apparatus advantageous for supplying an imprinting material to a target position on a substrate.

It is a schematic diagram which shows the structure of the imprint apparatus as one aspect of this invention. It is a flowchart for demonstrating the imprint process in this embodiment. It is a schematic diagram which shows the structure of the supply part of the imprint apparatus shown in FIG. It is a figure for demonstrating the offset amount of the discharge port of the supply part of the imprint apparatus shown in FIG. It is a figure for demonstrating the offset amount of the discharge port of the supply part of the imprint apparatus shown in FIG. It is a figure for demonstrating the offset amount of the discharge port of the supply part of the imprint apparatus shown in FIG. It is a figure for demonstrating the offset amount of the discharge port of the supply part of the imprint apparatus shown in FIG. It is a figure for demonstrating the manufacturing method of an article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is given to the same member, and duplicate description is omitted.

FIG. 1 is a schematic view showing the configuration of an imprint device 100 as one aspect of the present invention. The imprint device 100 is a lithography device that forms a pattern of an imprint material on a substrate using a mold (mold or template). The imprint device 100 contacts the imprint material supplied on the substrate with the mold and applies energy for curing to the imprint material to form a pattern of the cured product to which the uneven pattern of the mold is transferred. ..

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as energy for curing. As the electromagnetic wave, for example, light such as infrared rays, visible rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less is used.

The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material may be applied in a film form on the substrate by a spin coater or a slit coater. Further, the imprint material may be applied onto the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets by a liquid injection head. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

Glass, ceramics, metals, semiconductors, resins and the like are used for the substrate, and a member made of a material different from the substrate may be formed on the surface thereof, if necessary. Specifically, the substrate includes a silicon wafer, a compound semiconductor wafer, quartz glass and the like.

The imprint device 100 includes a surface plate 1, a frame 2, a damper 3, a stage drive unit 4, a substrate stage 5, an imprint head 7, a supply unit 9, a scope 10, and a control unit 11. Have. As shown in FIG. 1, the directions orthogonal to each other in the plane parallel to the upper surface of the platen 1 are defined as the X-axis and the Y-axis, and the directions perpendicular to the X-axis and the Y-axis are defined as the Z-axis.

The surface plate 1 is provided with a substrate stage 5 via a stage drive unit 4 including a linear motor and the like. The substrate stage 5 holds a substrate 6 such as a semiconductor wafer and is configured to be movable in the X direction and the Y direction. The stage drive unit 4 moves the substrate stage 5 in a direction parallel to the upper surface of the surface plate 1, that is, in the X direction and the Y direction. The position of the board stage 5 is measured by a measuring instrument such as an interferometer or an encoder, and is fed back to the stage drive unit 4 under the control of the control unit 11.

The surface plate 1 is provided with a frame 2 via a damper 3 that reduces (cancels) vibration from the floor. The frame 2 supports an imprint head 7 that holds the mold 8 at a position facing the substrate 6. The mold 8 has an uneven pattern formed on the surface facing the substrate 6. The imprint head 7 is configured to be driveable in a direction perpendicular to the surface of the substrate 6, that is, in the Z-axis direction, so that the imprint material on the substrate is brought into contact with the mold 8 or the imprint material on the substrate is used as the mold 8. To pull apart. The imprint head 7 has an internal curing portion for curing the imprint material on the substrate (for example, when the imprint material is photocurable, irradiation for irradiating the imprint material with ultraviolet rays). Part).

Further, the frame 2 is supported so that the supply unit (dispenser) 9 faces the substrate 6. The supply unit 9 includes a plurality of discharge ports (nozzles) arranged in the Y direction, and is configured to discharge (drop) the imprint material onto the substrate from each discharge port. In this way, the supply unit 9 supplies the imprint material onto the substrate through the plurality of discharge ports. The supply of the imprint material onto the substrate is controlled by the discharge of the imprint material from the discharge port of the supply unit 9 and the movement of the substrate stage 5. Further, by moving the substrate stage 5 in the X direction and the Y direction, the imprint material can be supplied to an arbitrary position on the substrate.

The imprint material is supplied to the optimum position on the substrate according to the pattern (concave and convex shape) of the mold 8. The position (optimal position) of the imprint material to be supplied on the substrate is mainly determined in consideration of the filling property when the mold 8 is brought into contact with the imprint material on the substrate to form the imprint material. As a drop recipe, for example, it is managed by the control unit 11. Drop recipes are generally different for each type 8 type, i.e., type 8 pattern.

Further, the frame 2 is supported by the scope 10 so as to face the substrate 6. The scope 10 detects an alignment mark provided on the substrate 6. The scope 10 also functions as a measuring unit for measuring the position of the imprint material discharged from each of the plurality of ejection ports of the supply unit 9 and supplied onto the substrate.

The control unit 11 controls the entire imprint device 100 (each part of the imprint device 100) including the CPU and the memory. In the present embodiment, the control unit 11 controls the imprint process and the process related thereto. For example, the control unit 11 performs alignment between the substrate 6 and the mold 8 based on the detection result of the scope 10. Further, the control unit 11 is a first discharge used for supplying the imprint material onto the substrate from the plurality of discharge ports of the supply unit 9 based on the drop recipe indicating the position of the imprint material to be supplied on the substrate. Identify the exit. Further, the control unit 11 determines the position of the imprint material supplied onto the substrate from the first discharge port so that the position of the imprint material supplied onto the substrate from the first discharge port falls within the allowable range with respect to the target position. To control.

The imprint process in the present embodiment will be described with reference to FIGS. 2 (a) and 2 (b). In the present embodiment, as a preparatory process before performing the imprint process, the amount of deviation between the position of the imprint material supplied onto the substrate from each discharge port and the target position for each of the plurality of discharge ports of the supply unit 9. Get information including. FIG. 2A is a flowchart for explaining the preparation process, and FIG. 2B is a flowchart for explaining the imprint process. As described above, the preparation process and the imprint process are performed by the control unit 11 comprehensively controlling each unit of the imprint device 100.

Referring to FIG. 2A, in the preparatory process, in S201, the imprint material is discharged from each of the plurality of discharge ports of the supply unit 9 to supply the imprint material on the substrate. In the present embodiment, in S201, the target for supplying the imprint material from the supply unit 9 is the substrate 6, but for example, the substrate stage 5 may be used. In other words, it is not necessary to limit the target to which the imprint material is supplied from the supply unit 9. When the object to which the imprint material is supplied from the supply unit 9 is the substrate 6, the processing after supplying the imprint material may be only to carry out the substrate 6 from the imprint device 100. Therefore, it is possible to suppress contamination of the imprint device 100 by the imprint material. On the other hand, when the target for supplying the imprint material from the supply unit 9 is the substrate stage 5, it is not necessary to prepare the substrate 6 in the maintenance work of the imprint apparatus 100.

In S202, the position of the imprint material discharged from each of the plurality of discharge ports of the supply unit 9 and supplied onto the substrate is measured by the scope 10. In S203, the offset amount is obtained from the position of the imprint material measured in S202 for each of the plurality of discharge ports of the supply unit 9, and the offset amount is stored in the storage unit of the imprint device 100, for example, the memory of the control unit 11. Remember in such. Here, the offset amount is the deviation between the position (actual supply position) of the imprint material supplied onto the substrate from each discharge port of the supply unit 9 and the target position (for example, the supply position indicated by the drop recipe). Amount (difference). As described above, in S203, information including the amount of deviation between the position of the imprint material supplied on the substrate from each discharge port and the target position is acquired for each of the plurality of discharge ports of the supply unit 9.

When the offset amount is stored in S203, the average deviation amount (XY) of the positions of all the imprint materials supplied on the substrate is stored separately by device offset, and the deviation amount from the device offset is stored in the discharge port. It may be stored separately as an offset amount for each. When storing the device offset, it can be used as one of the indexes for capturing changes in the imprint device 100 (positional deviation of the supply unit 9 (discharge port), changes over time, changes in the environment, etc.) from the viewpoint of device operation. be.

Referring to FIG. 2B, in the imprint process, in S204, the drop recipe corresponding to the pattern of the mold 8 is acquired. In S205, based on the drop recipe acquired in S204, a first discharge port used for supplying the imprint material to the substrate in the imprint process is specified from the plurality of discharge ports of the supply unit 9.

In S206, the offset corresponding to the first discharge port specified in S205 is obtained. Here, the offset corresponding to the first discharge port is an offset when the imprint material is supplied from the first discharge port in the imprint process, and is an imprint supplied onto the substrate from the first discharge port. This is to keep the position of the material within the allowable range with respect to the target position. Specifically, the offset amount of the first discharge port specified in S205 is extracted from the offset amount stored in S203, and the offset corresponding to the first discharge port is obtained based only on the offset amount of the first discharge port. Ask.

In S207, the imprint material is discharged from the first discharge port of the supply unit 9 to supply the imprint material on the substrate by using the offset obtained in S206. In S208, a pattern is formed on the substrate. Specifically, the imprint material is cured in a state where the mold 8 and the imprint material on the substrate are in contact with each other, and the mold 8 is separated from the cured imprint material to form a pattern of the imprint material on the substrate. do.

FIG. 3 is a schematic view showing the configuration of the supply unit 9, and shows a discharge surface on which a plurality of discharge ports 92 are formed. In this embodiment, the six discharge ports 92a to 92f are arranged in the Y direction. In order to supply the imprint material at a high density on the substrate, the supply unit 9 used in semiconductor manufacturing needs to arrange a plurality of discharge ports 92 on the order of microns. The number of discharge ports 92 possessed by one supply unit 9 is actually very large, but in the present embodiment, the case where the supply unit 9 possesses six discharge ports 92a to 92f will be described as an example. ..

With reference to FIGS. 4 (a) and 4 (b), offset amounts of the discharge ports 92a to 92f of the supply unit 9 will be described. While moving the substrate 6 or the supply unit 9 in the X direction, the imprint material is discharged four times from each of the discharge ports 92a to 92f of the supply unit 9 to supply the imprint material on the substrate. In FIG. 4A, the circle shown by the broken line is the target position (scheduled discharge position) TP of the imprint material on the substrate, and the circle indicated by the solid line in the arrow direction from the target position TP is on the substrate. This is the actual supply position SP of the imprint material. FIG. 4B shows that the target position TP of the imprint material and the actual supply position SP of the imprint material are associated with each of the discharge ports 92a to 92f of the supply unit 9 and the amount of deviation in the X direction is summarized. An offset table is obtained. At each of the discharge ports 92a to 92f, a deviation in the X direction occurs between the target position TP and the supply position SP, but the average value obtained by averaging them is 0 μm.

The average value of the deviation amount of the discharge ports 92a to 92f of the supply unit 9 is zero, but as described above, the discharge port used in the imprint process among the six discharge ports 92a to 92f depends on the drop recipe. Here, with reference to FIGS. 5 (a) and 5 (b), a case where only three discharge ports 92a, 92c and 92e among the six discharge ports 92a to 92f are used in the imprint processing will be described. As shown in FIG. 5A, while moving the substrate 6 or the supply unit 9 in the X direction, the imprint material is discharged four times from each of the discharge ports 92a, 92c, and 92e of the supply unit 9 on the substrate. Supply imprint material to. When the target position TP and the supply position SP are compared and the deviation amounts of the discharge ports 92a, 92c and 92e are averaged to obtain an average value, the average value is -12 μm as shown in FIG. 5 (b). In this way, it can be seen that the offset amount differs depending on the discharge port used in the imprint process, that is, the drop recipe.

The present embodiment will be specifically described with reference to FIGS. 6 (a) and 6 (b). In the present embodiment, first, as described above, the offset amounts (FIG. 4B) of the discharge ports 92a to 92f of the supply unit 9 are acquired. Next, based on the drop recipe, the first discharge ports 92a, 92c and 92e used in the imprint process are specified from the discharge ports 92a to 92f of the supply unit 9, and the offsets corresponding to the first discharge ports 92a, 92c and 92e are specified. Ask for. Here, as shown in FIG. 6B, the offset corresponding to the first discharge ports 92a, 92c and 92e is obtained only from the deviation amount of the first discharge ports 92a, 92c and 92e. Then, using the offset corresponding to the first discharge ports 92a, 92c and 92e, the imprint material is discharged from the first discharge ports 92a, 92c and 92e of the supply unit 9 as shown in FIG. 6A. Supply imprint material on the substrate. As a result, the average value obtained by averaging the deviations between the target position TP and the supply position SP can be set to 0 μm. In this way, the target position TP and the supply position SP are supplied by supplying the imprint material onto the substrate using the offset corresponding to the first discharge port used in the imprint processing among the plurality of discharge ports of the supply unit 9. It is possible to minimize the amount of deviation between and.

In the present embodiment, the case where the deviation between the target position TP and the supply position SP occurs only in the X direction has been described as an example, but the deviation between the target position TP and the supply position SP occurs in the Y direction. The same may be done in the case. Specifically, it is possible to control the supply position of the imprint material on the substrate for each drop recipe by holding the offset amount of each of the plurality of discharge ports of the supply unit 9 also in the Y direction. ..

Further, in FIG. 6A, the discharge ports 92a to 92f of the supply unit 9 are arranged in one row in the Y direction, but there are a plurality of rows of discharge ports, and the supply position SP can be controlled for each row. If this is the case, the offset may be obtained for each row of discharge ports.

As shown in FIG. 7A, it is assumed that the supply unit 9 has a discharge port row 9A including six discharge ports 92a to 92f and a discharge port row 9B including six discharge ports 92g to 92l. Consider the case where it is possible to control the supply position SP for each column. Here, the imprint material is discharged (supplied) from the discharge ports 92a to 92f of the discharge port row 9A while moving the substrate 6 in the + X direction, and the discharge port of the discharge port row 9B while moving the substrate 6 in the −X direction. The imprint material shall be discharged from 92 g to 92 l.

It is assumed that the four first discharge ports 92a, 92d, 92h and 92k used in the imprint processing are specified from the discharge ports 92a to 92l of the supply unit 9. In this case, the offset corresponding to the first discharge ports 92a and 92d is obtained only from the deviation amount of the first discharge ports 92a and 92d included in the discharge port row 9A. For example, as shown in FIG. 7B, if the deviation amount of the first discharge port 92a is -16 and the deviation amount of the first discharge port 92d is -22, the average value obtained by averaging them is -19. Similarly, the offset corresponding to the first discharge ports 92h and 92k is obtained only from the deviation amount of the first discharge ports 92h and 92k included in the discharge port row 9B. For example, as shown in FIG. 7B, if the deviation amount of the first discharge port 92h is 11 and the deviation amount of the first discharge port 92k is 11, the average value obtained by averaging them is 11. Then, when the imprint material is supplied while moving the substrate 6 in the + X direction, the offset corresponding to the first discharge ports 92a and 92d of the discharge port row 9A is used. On the other hand, when the imprint material is supplied while moving the substrate 6 in the −X direction, the offset corresponding to the first discharge ports 92h and 92k of the discharge port row 9B is used. As a result, the variation in the supply position SP is small, and the imprint material can be supplied to the target position SP.

Next, control of the position (supply position) of the imprint material supplied from the supply unit 9 onto the substrate will be described. Consider a case where the imprint material is supplied onto the substrate by fixing the position of the supply unit 9 and moving the substrate stage 5. In this case, the position of the imprint material supplied onto the substrate from the first discharge port of the supply unit 9 is controlled (adjusted) by changing the speed of the substrate stage 5 when passing under the supply unit 9. Can be done. For example, when the imprint material is supplied while moving the substrate stage 5 from the + X direction to the −X direction to the supply unit 9, the speed of the substrate stage 5 is slowed down to supply the imprint material on the substrate. The position can be changed to the -X side. If the substrate stage 5 can also be moved in the Z direction, the substrate stage 5 is moved so as to change the distance between the supply unit 9 and the substrate 6, so that the first ejection of the supply unit 9 is performed. The position of the imprint material supplied onto the substrate from the outlet can be controlled. For example, when the imprint material is supplied while moving the substrate stage 5 from the + X direction to the −X direction with respect to the supply unit 9, the substrate stage 5 is moved in the + Z direction (that is, the supply unit 9 and the substrate 6). Reduce the distance between). As a result, the supply position of the imprint material on the substrate can be changed to the −X side.

Further, the imprint device 100 may have a drive unit that drives the supply unit 9 so as to pass over the substrate 6 held by the substrate stage 5. In such a case, supply is performed by changing the speed of the supply unit 9 when passing over the substrate via the drive unit, or changing the distance between the supply unit 9 and the substrate 6. The position of the imprint material supplied onto the substrate from the first discharge port of the unit 9 can be controlled. The position of the imprint material supplied onto the substrate from the first discharge port of the supply unit 9 can also be controlled by changing the drive timing at which the supply unit 9 is started to be driven by the drive unit.

Further, in the imprint device 100, it may be possible to control the discharge profile of the imprint material in the supply unit 9. In such a case, the position of the imprint material supplied onto the substrate from the first discharge port can be controlled by changing the timing of discharging the imprint material from the first discharge port of the supply unit 9. .. Further, the position of the imprint material supplied onto the substrate from the first discharge port can be controlled by changing the speed of the imprint material discharged from the first discharge port of the supply unit 9. For example, by increasing the speed of the imprint material discharged from the first discharge port, the supply position of the imprint material on the substrate can be changed to the −X side.

As described above, in the present embodiment, first, for each of the plurality of discharge ports of the supply unit 9, information including the amount of deviation between the position of the imprint material supplied on the substrate from each discharge port and the target position is acquired. do. Next, the first discharge port used for supplying the imprint material onto the substrate in the imprint process is specified from the plurality of discharge ports of the supply unit 9, and the first discharge port corresponding to the first discharge port is obtained from the above information. Extract the amount of deviation. Then, based on the first displacement amount, the imprint supplied from the first ejection port onto the substrate so that the position of the imprint material supplied onto the substrate from the first ejection port falls within the allowable range with respect to the target position. Control the position of the material. At this time, the imprint material supplied onto the substrate from the first discharge port so that the deviation between the average value of the positions of the imprint material supplied onto the substrate from the first discharge port and the target position becomes zero. It is good to control the position. As a result, the imprint material can be supplied to the target position on the substrate.

Although the case where the preparatory process and the imprint process are performed in the imprint device 100 has been described so far, it is not necessary to perform all the steps in the imprint device 100. For example, the measurement of the position of the imprint material supplied on the substrate (S202) may be performed by an external measuring device. At this time, since it is necessary to match the coordinate system of the imprint device 100 with the coordinate system of the external measuring device, it is necessary to form a mark capable of alignment on the substrate 6. Aligning the substrate 6 before supplying the imprint material with the imprint device 100 and aligning the substrate 6 before measuring the position of the imprint material with an external measuring device are performed using the same mark. You can match each coordinate system with.

Further, the steps S204 to S206 in the imprint process can also be performed by an external information processing device in the same manner. Such an information processing device generates an offset corresponding to a first discharge port used for supplying an imprint material onto a substrate in an imprint process as control information for controlling the imprint device 100, and is an imprint device. Provide to 100. Therefore, the information processing apparatus acquires information including the amount of deviation between the position of the imprint material supplied on the substrate from each discharge port and the target position for each of the plurality of discharge ports for discharging the imprint material. Has a part. The information processing device also has a processing unit that generates control information for controlling the position of the imprint material supplied on the substrate from the first discharge port. The processing unit extracts the first deviation amount corresponding to the first discharge port from the plurality of discharge ports. Then, based on the first displacement amount, the imprint material supplied onto the substrate from the first discharge port is supplied onto the substrate from the first discharge port so that the position of the imprint material is within the allowable range with respect to the target position. Generates control information for controlling the position of the imprint material.

As described above, the number of discharge ports possessed by one supply unit 9 is actually very large. It takes an enormous amount of time to measure the position of the imprint material that has been ejected multiple times from such a large number of ejection ports and supplied onto the substrate. In addition, it takes an enormous amount of time to obtain an offset from the amount of deviation of each of such a large number of discharge ports. Therefore, by using an external measuring device or information processing device, it is possible to secure the operating time of the imprint device 100, and it is possible to suppress a decrease in throughput.

The pattern of the cured product formed by using the imprint device 100 is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memory such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching or ion implantation in the substrate processing process.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 8A, a substrate 6 such as a silicon wafer on which a material to be processed such as an insulator is formed on the surface is prepared, and subsequently, an imprint material is applied to the surface of the material to be processed by an inkjet method or the like. Is given. Here, a state in which a plurality of droplet-shaped imprint materials are applied onto the substrate is shown.

As shown in FIG. 8B, the imprint mold 8 is opposed to the imprint material on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 8 (c), the substrate 6 to which the imprint material is applied is brought into contact with the mold 8 to apply pressure. The imprint material is filled in the gap between the mold 8 and the material to be processed. When light is irradiated through the mold 8 as energy for curing in this state, the imprint material is cured.

As shown in FIG. 8D, when the mold 8 and the substrate 6 are separated from each other after the imprint material is cured, a pattern of the cured product of the imprint material is formed on the substrate. The pattern of the cured product has a shape in which the concave portion of the mold 8 corresponds to the convex portion of the cured product and the convex portion of the mold 8 corresponds to the concave portion of the cured product. It has been transcribed.

As shown in FIG. 8E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the material to be processed that has no cured product or remains thin is removed to form a groove. .. As shown in FIG. 8 (f), when the pattern of the cured product is removed, an article having grooves formed on the surface of the work material can be obtained. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

In the present invention, a program that realizes one or more functions of the above-described embodiment is supplied to a system or an apparatus via a network or a storage medium, and one or more processors in the computer of the system or the apparatus provide the program. It can also be realized by the process of reading and executing. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

6: Substrate 8: Mold 9: Supply unit 11: Control unit 100: Imprint device

Claims (15)

An imprint device that forms a pattern of imprint material on a substrate using a mold.
A supply unit that includes a plurality of discharge ports for discharging the imprint material and supplies the imprint material onto the substrate via the plurality of discharge ports.
For each of the plurality of discharge ports, an acquisition unit for acquiring information including the amount of deviation between the position of the imprint material supplied onto the substrate from each discharge port and the target position, and
From the above information, the deviation between the average value of the positions of the imprint material supplied onto the substrate from the first discharge port used for the supply among the plurality of discharge ports and the target position is within the allowable range. As described above, the control unit that controls the position of the imprint material supplied onto the substrate from the first discharge port, and the control unit.
An imprint device characterized by having. The first aspect of claim 1, wherein the control unit identifies the first discharge port from the plurality of discharge ports based on a drop recipe indicating the position of the imprint material to be supplied on the substrate. Imprint device. The control unit is on the substrate from the first discharge port so that the deviation between the average value of the positions of the imprint materials supplied onto the substrate from the first discharge port and the target position becomes zero. The imprint device according to claim 1 or 2, which controls the position of the imprint material supplied to the imprint material. Further having a stage for holding and moving the substrate,
The control unit moves the stage so as to change the distance between the first discharge port and the substrate, so that the position of the imprint material supplied from the first discharge port onto the substrate can be determined. The imprint device according to any one of claims 1 to 3, wherein the imprint device is controlled. Further having a stage for holding and moving the substrate,
The control unit controls the position of the imprint material supplied onto the substrate from the first discharge port by changing the speed of the stage when passing under the first discharge port. The imprint device according to any one of claims 1 to 3. The control unit is characterized in that the position of the imprint material supplied onto the substrate from the first discharge port is controlled by changing the timing of discharging the imprint material from the first discharge port. The imprint device according to any one of claims 1 to 3. The control unit is characterized in that the position of the imprint material supplied onto the substrate from the first discharge port is controlled by changing the speed of the imprint material discharged from the first discharge port. The imprint device according to any one of claims 1 to 3. It further has a drive unit that drives the supply unit so as to pass over the substrate.
The control unit determines the position of the imprint material supplied onto the substrate from the first ejection port by changing the speed of the supply unit when passing over the substrate via the drive unit. The imprint device according to any one of claims 1 to 3, wherein the imprint device is controlled. It further has a drive unit that drives the supply unit so as to pass over the substrate.
The control unit controls the position of the imprint material supplied onto the substrate from the first discharge port by changing the drive timing of the drive unit for passing the supply unit over the substrate. The imprint device according to any one of claims 1 to 3, wherein the imprinting apparatus is to be used. One of claims 1 to 9, wherein the acquisition unit includes a measurement unit that measures the position of the imprint material discharged from each of the plurality of discharge ports and supplied onto the substrate. The imprint device according to item 1. It is an imprint method that forms a pattern of imprint material on a substrate using a mold.
For each of the plurality of discharge ports for discharging the imprint material, a step of acquiring information including the amount of deviation between the position of the imprint material supplied on the substrate from each discharge port and the target position, and a step of acquiring the information.
From the above information, the deviation between the average value of the imprint material supplied onto the substrate from the first discharge port used for the supply among the plurality of discharge ports and the target position is within an allowable range. , A step of controlling the position of the imprint material supplied onto the substrate from the first discharge port, and
An imprint method characterized by having. An information processing device that generates control information for controlling an imprint device that forms a pattern of imprint material on a substrate using a mold.
For each of the plurality of discharge ports for discharging the imprint material, an acquisition unit for acquiring information including the amount of deviation between the position of the imprint material supplied on the substrate from each discharge port and the target position, and the acquisition unit.
From the above information, the deviation between the average value of the positions of the imprint material supplied onto the substrate from the first discharge port used for the supply among the plurality of discharge ports and the target position is within the allowable range. As described above, the processing unit that generates the control information for controlling the position of the imprint material supplied onto the substrate from the first discharge port, and the processing unit.
An information processing device characterized by having. It is a generation method for generating control information for controlling an imprint device that forms a pattern of imprint material on a substrate using a mold.
For each of the plurality of discharge ports for discharging the imprint material, a step of acquiring information including the amount of deviation between the position of the imprint material supplied on the substrate from each discharge port and the target position, and a step of acquiring the information.
From the above information, the deviation between the average value of the positions of the imprint material supplied onto the substrate from the first discharge port used for the supply among the plurality of discharge ports and the target position is within the allowable range. As described above, the step of generating the control information for controlling the position of the imprint material supplied from the first discharge port onto the substrate, and the process of generating the control information.
A generation method characterized by having. A program for causing a computer to execute each step of the generation method according to claim 13. A step of forming a pattern on a substrate by using the imprint device according to any one of claims 1 to 10.
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
The process of manufacturing an article from the processed substrate and
A method of manufacturing an article, characterized in that it has.

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