TW201732990A - 載置構件之製造方法 - Google Patents

載置構件之製造方法 Download PDF

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Publication number
TW201732990A
TW201732990A TW106101155A TW106101155A TW201732990A TW 201732990 A TW201732990 A TW 201732990A TW 106101155 A TW106101155 A TW 106101155A TW 106101155 A TW106101155 A TW 106101155A TW 201732990 A TW201732990 A TW 201732990A
Authority
TW
Taiwan
Prior art keywords
mounting member
carbon nanotube
carbon nanotubes
smoothing plate
catalyst layer
Prior art date
Application number
TW106101155A
Other languages
English (en)
Chinese (zh)
Inventor
shotaro Masuda
Tomoaki Ichikawa
Yohei Maeno
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201732990A publication Critical patent/TW201732990A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/152—Fullerenes
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/158—Carbon nanotubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Composite Materials (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
TW106101155A 2016-01-15 2017-01-13 載置構件之製造方法 TW201732990A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016006144A JP2017126695A (ja) 2016-01-15 2016-01-15 載置部材の製造方法

Publications (1)

Publication Number Publication Date
TW201732990A true TW201732990A (zh) 2017-09-16

Family

ID=59311047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101155A TW201732990A (zh) 2016-01-15 2017-01-13 載置構件之製造方法

Country Status (3)

Country Link
JP (1) JP2017126695A (fr)
TW (1) TW201732990A (fr)
WO (1) WO2017122620A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006035379A (ja) * 2004-07-27 2006-02-09 Society Of Chemical Engineers Japan カーボンナノチューブデバイス及びカーボンナノチューブデバイスの製造方法
CN101678970A (zh) * 2007-06-13 2010-03-24 株式会社爱发科 基板托持机构
EP2397440B1 (fr) * 2009-02-10 2019-11-20 Zeon Corporation Substrat pour produire des agregats de nanotubes de carbone alignes et procede de production des agregats de nanotubes de carbone alignes
WO2013039156A1 (fr) * 2011-09-14 2013-03-21 株式会社フジクラ Structure pour former une nanofibre de carbone, structure de nanofibre de carbone et procédé de production de celle-ci, et électrode de nanofibre de carbone
JP6210445B2 (ja) * 2012-07-04 2017-10-11 国立大学法人名古屋大学 カーボンナノチューブの製造方法
JP2014046231A (ja) * 2012-08-29 2014-03-17 Hitachi Chemical Co Ltd カーボンナノチューブ合成用触媒の製造方法
US9698035B2 (en) * 2013-12-23 2017-07-04 Lam Research Corporation Microstructures for improved wafer handling
US9343350B2 (en) * 2014-04-03 2016-05-17 Asm Ip Holding B.V. Anti-slip end effector for transporting workpiece using van der waals force

Also Published As

Publication number Publication date
JP2017126695A (ja) 2017-07-20
WO2017122620A1 (fr) 2017-07-20

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