TW201729333A - Apparatus and method for cleaning a wafer table surface and/or an object disposed thereon - Google Patents

Abstract

The present disclosure relates to an apparatus for cleaning a wafer table surface and/or an object disposed thereon. The apparatus comprises: a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon; at least one cleaning device disposed above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface, each cleaning device carrying a set of orifices directed in a non-normal direction toward the wafer table surface; a set of internal chambers fluidically coupled to the set of orifices of each cleaning device; a pump assembly fluidically coupled to the set of internal chambers, the pump assembly operable for fluid communication with the set of internal chambers; and a displacement mechanism configured for automatically displacing the wafer table such that the set of orifices travels across at least portions of the wafer table surface. Fluid communication of the pump assembly with the set of internal chambers creates a pressure differential between the set of internal chambers and an environment external to the set of orifices to enable fluid transfer across the spatial gap between at least one orifice and the wafer table surface. The fluid transfer across the spatial gap causes particulate matter on the wafer table surface and/or the object to be removed therefrom, thereby cleaning the wafer table surface and/or the object.

Description

Apparatus and method for cleaning a wafer mount surface and/or articles disposed thereon

The present invention generally relates to an apparatus and method for cleaning the surface of a wafer holder. In particular, embodiments of the present invention relate to an apparatus and method for cleaning a flat wafer mount surface of a semiconductor wafer mount structure and/or articles disposed on the surface of the wafer mount.

Semiconductor wafer processing operations involve performing various types of processing steps or sequences on a semiconductor wafer on which many grains (e.g., large or very large grains) remain. The geometry, line width, or shape of the device, circuit, or structure on each die is typically very small, such as micrometer, millimeter, or nanoscale. Any given die comprises a plurality of integrated circuits or circuit structures fabricated on a laminate basis, for example by processing steps on a wafer positioned on a flat wafer surface. , processed, and/or patterned such that the wafer-bearing grains collectively undergo a processing step.

Widely used semiconductor device processing operations include a number of processing systems that perform wafer or film rack processing operations that include robust and selective wafer mounting during wafer or film rack processing operations The wafer on the film frame (referred to as "film shelf" for convenience) is carried (eg, handled, moved, transferred, or transported) from one location, orientation, destination to another, and/or wafer or The film holder is in a specific position. For example, prior to the start of the optical inspection process, the processing system must retrieve the wafer or film holder from a wafer or film holder source, such as a wafer cassette, and transport the wafer or film holder to the wafer holder. Prior to the start of the inspection process, the wafer holder must hold the wafer or film holder firmly on its surface and release the wafer or film holder from its surface after the inspection process is completed. Once the inspection process is complete, the processing system must retrieve the wafer or film holder from the wafer holder and transfer the wafer or film holder to the next Destination, such as a wafer or film cassette or another processing system. The wafer holder itself can be considered or defined as a type of processing system that must reliably and stably position and hold the wafer or film holder on the surface of the wafer holder while being relative to the processing system. The component moves the wafer or film holder, for example, corresponding to one or more light sources of the optical detection system and one or more image capture devices.

In order to firmly hold the wafer or film holder on the surface of the wafer holder, the wafer holder surface needs to be sufficiently flat. In order to process grains of very small dimensions (eg 0.5 x 0.5 mm or less) and/or thickness (50 μm or less, such as very thin and/or flexible wafers or substrates), this flatness requirement is changed. More crucial. For very thin wafers, it is important that the wafer holder is ultra-flat, otherwise one or more of the dies on the wafer or film holder are easily positioned for depth of field during the inspection process. Those skilled in the art can recognize that the smaller the crystal grains, the higher the magnification required, and the narrower the depth of field that the detection surface must be placed.

In addition to the flatness of the wafer mount surface, it is important to ensure that the wafer mount surface does not have any contaminants, impurities, and/or particulates that affect the wafer or film holder remaining on the wafer mount surface. The presence of particulate matter such as dust particles results in a sawed wafer having a small grain size that cannot be properly or evenly disposed on the surface of the disk. In particular, in areas where there are particulates (possibly many), a portion of the wafer or film holder is lifted off the surface of the wafer holder because the particles act as an obstacle therebetween. The wafer or film holder is slightly raised. This results in a lack of total or common flatness across the entire die surface, which is critical for optical inspection systems. The lack of flatness becomes more pronounced for the tiny or very small grains of the sawed wafer. Further, the presence of particles causes the grains to move at an angle relative to the common grain detection plane, or cause the grains to tilt and lie on one or more different and higher planes. Residues or particulates thus contaminate the surface of the wafer mount and subsequently contaminate the wafer or film holder placed on the surface of the wafer mount, resulting in yield and reliability issues.

It is also important to ensure that the wafer or film holder does not contain any dirt, impurities, and/or particulate matter prior to the start of the test procedure and/or during the test procedure. The presence of particulate matter such as dust particles will affect the accuracy and efficiency of the testing procedure. For example, if there are dust particles on the grains of the wafer, the detection of the wafer will result in defects in the grains. However, in fact, the grains only have dust particles on top of them. If the dust particles are removed before the grains are detected, the grains can and are likely to be acceptable. Detect wafers that have unwanted particles or are tilted due to the presence of particulate matter Or the film carrier will not contain or convey the precise details and/or features of one or more regions of interest, particularly the die, on the wafer or film frame. This in turn affects the quality of the image captured during the test, which may result in inaccurate detection results.

Thus, a clean wafer mount surface, as well as a clean wafer or film holder, is necessary for wafers and film holders in flat or ultra-flat positions, and a flat or ultra-flat position helps and enables accurate, High throughput wafer and/or film rack handling or processing operations, such as optical inspection procedures. Therefore cleaning is very important to ensure the removal of particulates or other unwanted materials that adhere to the wafer or film holder, such as swarf, vermiculite, slag, polymer residue, metal flakes, atmospheric dust, plastic particles, And citrate particles.

Currently, cleaning wafers or film holders involves applying to a surface thereof using deionized water, chemicals, or chemical solutions using mechanical contact, such as a plate scrub. The wafer or film holder can be immersed in deionized water/chemicals/or chemical solutions or deionized water/chemicals/chemical solutions can be sprayed onto the wafer or film holder. The wafer or film holder is then passed through a spin, rinse, dry (SRD) cycle to further remove chemical residues or particulates. The wafer or film holder then enters a dry state and is ready for the next processing step. The complex steps of cleaning a wafer or film holder with specially produced compounds disadvantageously delays the overall production process and adds cost. In order to clean the wafer mount, the wafer mount can be removed from the cleaning service, but this also results in lost productivity and increased cost.

The wafer holder can be cleaned without being disconnected from the job. For example, U.S. Patent No. 8,955,530 discloses the use of a cleaning cover to remove treated residues and particles. The cleaning cover is configured to cover and align the wafer mounting station and includes a base portion, a roller, and a cleaning cloth. The cleaning cloth rubs the wafer fixing table with translational and rotational motion. However, physical contact between the cleaning cloth and the wafer holder may cause some contamination and/or damage to the wafer holder, especially the wafer holder surface. For the inspection of wafers or film holders mounted thereon, contamination and/or damage to the wafer holder surface is not expected.

U.S. Patent Publication No. 2003/0200996 discloses a method of cleaning a wafer holder by an automated system that applies solvent to the surface of the wafer holder and rinses the surface of the wafer holder. The automated system further dries the surface of the wafer holder by rotating the wafer holder. Alternatively, the automated system dries the surface of the wafer holder by vacuuming the surface of the wafer holder. Or alternatively, the automated system dries the wafer by discharging the gas onto the surface of the wafer mounting table. Set the surface. The brush/sponge can also be used to clean the surface of the wafer holder. However, the introduction of a solvent (or any solution/compound) may cause some contamination and/or damage to the surface of the wafer holder. In addition, the physical contact of the brush/sponge with the surface of the wafer holder also causes some contamination and/or damage to the surface of the wafer holder. For the inspection of wafers or film holders mounted thereon, contamination and/or damage to the wafer holder surface is not expected.

Accordingly, in order to address or alleviate at least one of the foregoing problems and/or disadvantages, it is desirable to provide an apparatus and method for cleaning a surface of a semiconductor wafer mount having at least some improved features over the prior art.

According to a first embodiment of the present invention, there is provided an apparatus for cleaning a surface of a wafer fixing station and/or an object disposed thereon, the apparatus comprising: a wafer fixing stage assembly including a wafer fixing station, The wafer fixing station provides a wafer fixing table surface configured to securely fix the object disposed thereon; at least one cleaning device, the at least one cleaning device being disposed on the wafer fixing table Above the surface, a normal gap is formed between each cleaning device and the surface of the wafer fixing table along a normal axis of the surface of the wafer fixing table, and each cleaning device has a fixed line in the direction of the illegal line. a set of apertures in the surface; a set of lumens fluidly coupled to the set of apertures of each cleaning device, the set of lumens being further fluidly coupled to a pump source operable for fluid communication therein; and a moving mechanism Configuring to automatically move the wafer holder such that the set of holes passes at least a portion of the wafer mount surface; wherein the pump source is in fluid communication with the set of chambers in the set of chambers a pressure difference between the environments outside the set of holes to enable fluid to pass through the space gap between the at least one hole of the set of holes and the surface of the wafer mount; and wherein the fluid passes through the space gap to cause the wafer The surface of the fixture and/or particulate matter on the article is removed therefrom, thereby cleaning the wafer mount surface and/or the article.

According to a second embodiment of the present invention, there is provided a method for cleaning a surface of a wafer holder and/or an article disposed thereon, the method comprising: providing a wafer holder assembly, the wafer holder assembly comprising a wafer fixing station, the wafer fixing station providing a wafer fixing table surface configured to stably hold the object disposed thereon; One less cleaning device, each cleaning device having a set of holes directed toward the surface of the wafer fixing table in an illegal line direction; each cleaning device is disposed on the surface of the wafer fixing table such that a space gap is along the crystal A normal axis of the surface of the circular fixture is formed between each cleaning device and the surface of the wafer holder; a set of lumens are provided, fluidly coupled to the set of apertures of each cleaning device; a pump source is provided, fluidly coupled To the set of chambers; operating the pump source in fluid communication with the set of chambers; automatically moving the surface of the wafer holder with a moving mechanism such that the set of holes passes at least a portion of the surface of the wafer holder; and within the group A pressure differential is created between the cavity and the environment outside the set of holes such that fluid can pass through the space gap between the at least one hole and the surface of the wafer mount in response to operation of the pump source and the pump source and the set Fluid communication of the cavity; wherein the fluid passes through the spatial gap to cause particulate matter on the surface of the wafer mounting station and/or the object to be removed therefrom, thereby cleaning the surface of the wafer mounting table and/or the object .

One advantage of the present invention is that the surface of the wafer holder can be cleaned by blowing away or sucking away particulate matter remaining thereon. This will maintain the hyperplane of the wafer table surface when the wafer is placed thereon. In addition, by removing the particulate matter to clean the wafer, the possibility of detecting a false defect (or false positive) can be reduced or eliminated. For example, if dust particles are detected on the inspection process, the die on the defect-free device/wafer may be detected to have defects. If dust particles are removed through the cleaning device, the inspection device/die will be defect free during the inspection process. This will improve the efficiency and final yield of the detection process.

Thus, an apparatus and method for cleaning the surface of a semiconductor wafer mount and/or articles disposed thereon in accordance with the present invention is disclosed above. The various features, aspects, and advantages of the present invention are more apparent from the following detailed description of the embodiments of the invention.

100‧‧‧Cleaning equipment

102‧‧‧Fabric station assembly

104‧‧‧Fabric fixed table

106‧‧‧ wafer mount surface

108‧‧‧ objects

108a‧‧‧ Wafer

108b‧‧‧ film holder

110‧‧‧Second group of tracks

112‧‧‧Transportation agencies

34‧‧‧Main control unit

114‧‧‧Space clearance

116‧‧‧Support arm

120a‧‧‧ First end of the surface of the wafer fixed table

120b‧‧‧ second end of the surface of the wafer fixed table

122‧‧‧First sensor

124‧‧‧Second sensor

132‧‧‧ Wafer Department

134‧‧‧ outer edge

132a‧‧‧First Wafer Department

132b‧‧‧Second Wafer Department

136‧‧‧ scan motion path

20‧‧‧ Wafer/Film Frame Processing System

22‧‧‧X-axis

24‧‧‧Y-axis

26‧‧‧Z-axis

28‧‧‧First set of tracks

200‧‧‧cleaning device/first cleaning device

204a‧‧‧ first end of the elongated structure

204b‧‧‧The second end of the elongated structure

206‧‧‧Upper elongated surface

208‧‧‧lower surface

210‧‧‧First inclined surface

212‧‧‧Second inclined surface

202‧‧‧ hole

214‧‧‧Drain hole

216‧‧‧ absorption hole

218‧‧‧ pump components

202a~202d‧‧‧ subset hole

220a~220d‧‧‧ lumen

222a~222d‧‧‧ channel

300‧‧‧Detection device

302‧‧‧ Objective lens

304‧‧‧ hollow space

306‧‧‧Lighting device

308‧‧‧ bottom

30‧‧‧First illegal line direction

32‧‧‧Second illegal line direction

36‧‧‧Control unit

38‧‧‧ Fluid flow control mechanism

400‧‧‧Second cleaning device

402‧‧‧ hole

408‧‧‧ lower surface

414‧‧‧Drain hole

416‧‧‧ absorption hole

500/510‧‧‧ cleaning procedures or processes

520‧‧‧Test procedures/processes

H‧‧‧ Height or separation distance

L1‧‧‧ total length

L2‧‧‧ total length

W1‧‧‧ total width

‧‧‧‧ angle

‧‧‧‧ angle

1A and 1B are diagrams illustrating a wafer/film rack processing system including an apparatus having a cleaning device according to an embodiment of the present invention; and FIG. 2A is a view showing a wafer having a wafer according to an embodiment of the present invention. / film rack processing system; 2B is a view showing a wafer/film rack processing system having a film holder according to an embodiment of the present invention; and FIG. 3 is a view showing a wafer fixing table having a first cleaning device according to an embodiment of the present invention; FIG. 4C is a first cleaning device according to an embodiment of the present invention; FIG. 5A is a cross-sectional view illustrating a first cleaning device according to an embodiment of the present invention; and FIG. 5B is a view illustrating an embodiment of the present invention; A block diagram of an apparatus assembly for operating a first cleaning device; FIGS. 5C-5E are diagrams illustrating a hole arrangement of the first cleaning device; and FIGS. 6A-6C are diagrams illustrating an embodiment of the present invention. A wafer/film frame processing system having two cleaning devices and a detecting device; FIG. 7 is a view illustrating a second cleaning device according to an embodiment of the present invention; and FIGS. 8A to 8D are diagrams illustrating a second cleaning device Hole arrangement; FIG. 9 is a view illustrating a wafer disposed on a wafer fixing stage of the apparatus according to an embodiment of the present invention; FIGS. 10A to 10B are block diagrams illustrating a control unit according to an embodiment of the present invention; ; Figure 11A to Figure 11B are to say The embodiment of a flowchart of the cleaning procedure / process of the present invention, one embodiment; and FIG. 11C is a flowchart illustrating a first embodiment of the cleaning and testing procedures / procedure according to an embodiment of the present invention.

In the present invention, the recitation or use of a given element or the reference to a particular element number in a particular drawing or the additional reference in the corresponding description material may be included in the same or in the description material associated with the other drawing, Equivalent, or similar component or component number. The use of "/" in the drawings or related text is understood to mean "and/or" unless otherwise indicated. The recitation of specific numerical values or ranges of values recited herein is to be construed as an inclusive or a range of values, such as +/- 20%, +/- 15%, +/- 10%, +/- 5%, or Within +/- 0%. With respect to this description of pointing dimensions or comparative values and their equivalents, references to the terms "normal," "approximately," "substantially" shall be taken to mean a representative/comparative example, or a specific or target value or range of values. Within +/- 20%, +/- 15%, +/- 10%, +/- 5%, or +/- 0%, the reference to the term "essentially" should be understood to fall within the representative/comparative example. , or +/- 10%, +/- 5%, +/- 2%, +/- 1% of a specific or target value or range of values, Or within +/- 0%.

As used herein, the term "set" corresponds to or is defined as a set of non-empty finite elements, according to known mathematical definitions (eg, to correspond to an introduction to mathematical reasoning: numbers, sets, and functions "Chapter 11: Properties of finite sets" (Example: shown on page 140), Peter Eccles, Cambridge University Press (1998), the non-empty finite element group mathematically displays a cardinality of at least 1 (ie, the set defined here can correspond to a unit , singleton or single element collection, or multi-element collection). Typically, an element group can include or be a system, device, device, structure, object, process, physical parameter, or a value, depending on the type of group in the study.

For the sake of brevity and clarity, the description of embodiments of the present invention is directed to an apparatus and method for cleaning a surface of a semiconductor wafer mount and/or articles disposed thereon. The various embodiments of the present invention are described in conjunction with the embodiments of the present invention, as illustrated in FIGS. 1A through 9A, and it is understood that the invention is not intended to limit the invention to the embodiments. Rather, the invention is intended to cover alternatives, modifications, and equivalents of the embodiments described herein, which are included within the scope of the invention as defined by the appended claims. In addition, in the following detailed description, specific details are set forth However, it will be apparent to those skilled in the art that the present invention may be practiced without the specific details and/or various details of the various embodiments of the specific embodiments. In many instances, well-known systems, methods, procedures, and components are not described in detail, in order to avoid unnecessary obscuring embodiments of the various embodiments of the invention.

For the sake of brevity and ease of understanding, the term "object" as used herein may include a wafer, a partial wafer, a film holder on which a wafer or a portion of a wafer is mounted, or a wafer, a partial wafer, or a film holder loaded. a group of devices or structures. The term "wafer" as used herein may include an entire wafer, a portion of a wafer, or other types of all or a portion of an object or component (eg, a solar panel) having one or more planar regions, desired on a planar area. Or a set of optical inspection procedures and/or other processing operations are required. The term "film carrier" in the following description generally refers to a support member or frame, for example by means of a thin layer or film material disposed or spanned over the surface area of the film frame, and to which the wafer is mounted or adhered. Modes understood by those skilled in the art are configured to carry or support a wafer, a thin or stacked wafer, or a sawed wafer. Alternatively, the term "wafer mounting station" as used herein includes devices for holding a wafer or film holder in a wafer inspection program or a film holder inspection program, respectively, wherein those skilled in the art can understand the terminology. A "wafer mounting station" corresponds to an equivalent, or substantially equivalent, or similar to a wafer chuck, vacuum table, or vacuum chuck.

A wafer mounting station including a wafer mounting station provided with a highly planar or ultra-planar wafer mounting table surface in accordance with a representative embodiment of the present invention can be used in conjunction with or formed into a system for processing both wafer and film holders A portion of a system of both a wafer and a film holder, such as the detection system/device described in further detail below. While embodiments of the present invention are directed to wafer and film frame inspection systems (eg, optical inspection systems), other embodiments are additionally or alternatively configured to support or perform other types of wafer and/or film frame front or back ends. Processing operations, such as test operations. For the sake of brevity and ease of understanding, various embodiments in accordance with representative embodiments of the present invention are described in detail below based on a wafer/film shelf processing system and/or detection system/device.

The following description is in terms of various embodiments of some representative or exemplary embodiments of the invention.

In a representative or exemplary embodiment of the present invention, an apparatus for cleaning a surface of a semiconductor wafer mount and/or an article disposed thereon, and a surface and/or a surface for cleaning a semiconductor wafer mount are described below. The method of the object on it.

Eliminating the need for a wafer mount conversion kit or eliminating a wafer mount conversion kit by means of a single or uniform wafer mount configured to hold both the wafer and the film holder This eliminates production downtime due to wafer-to-film holder and film holder-to-wafer conversion kit switching and calibration operations, thereby increasing average inspection throughput. A single or unified wafer mount facilitates or enables high-accuracy inspection operations by providing a wafer mount surface with high or very high flatness, the wafer mount surface holding the wafer die to a minimum Deviation or neglect on the common detection plane without deviation.

FIG. 1A shows a typical wafer/film shelf processing system 20 that includes a cleaning device 100. The apparatus 100 includes a wafer mount assembly 102 having a wafer mount 104 that provides a wafer mount surface 106 that is configured to maintain a stable setting The object 108 on it. Wafer/film shelf processing system 20 and apparatus 100 are thus configured to carry, securely hold, and process object 108. The article 108 can be a wafer 108a or a film frame 108b. 2A shows a wafer/film shelf processing system 20 configured to stably hold wafer 108a. Figure 2B shows the wafer configured to hold the film holder 108b securely / Film rack handling system 20. For the sake of brevity, object 108 is hereinafter referred to as wafer 108 unless explicitly stated otherwise.

In some representative embodiments, the wafer mount surface 106 of the device 100 is configured to carry and securely hold the wafer 108 disposed thereon. The wafer mount surface 106 exhibits high, very high, ultra-high flatness (eg, the plane is within a tolerance of +/- 50-200 μm). The wafer 108 placed on the wafer holder 104 lies flat on the wafer mount surface 106, which essentially intrinsically extrudes air and/or fluid beneath it. When the wafer 108 is disposed on the wafer holder surface 106, the atmospheric/ambient pressure difference between the upper and lower surfaces of the wafer 108 causes a large force to be applied to the upper surface of the wafer 108 due to atmospheric pressure, strongly The wafer 108 is held relatively tightly against the wafer mount surface 106. Since pressure is a function of surface area, the larger the area of wafer 108, the greater the force applied downward to wafer 108. This is often referred to as "intrinsic suction" or "natural suction" on the wafer. Further, the flatter the wafer mount surface 106, the greater the natural suction force until the limit defined by the limited surface area of the wafer 108. Vacuum forces can be applied to the lower surface of wafer 108 through wafer mount 104 to wafer mount surface 106 to ensure that wafer 108 remains as flat as possible and does not move during detection, despite the presence of natural suction.

In order to inspect the wafer 108 and each die remaining in the wafer 108, the wafer station 104 is accelerated multiple times over a short distance, thereby moving or transferring the wafer holder surface 106 and the wafer disposed thereon 108. In particular, the wafer/film shelf processing system 20 is configured to selectively or controlly move or transfer the wafer station 104 along two transverse spatial axes corresponding to or defining a plane. In particular, the wafer holder 104 is movable along at least the first spatial axis, i.e., the X-axis 22, and the second spatial axis, i.e., the Y-axis 24. X-axis 22 and Y-axis 24 are transverse to each other and correspond to or define a plane that is parallel with respect to wafer mount surface 106. Further, each of the X-axis 22 and the Y-axis 24 is transected with respect to the third spatial axis, that is, the Z-axis 26. Z-axis 26 is also referred to as the normal/vertical/orthogonal axis of wafer mount surface 106.

For example, FIG. 1B shows wafer mount assembly 102 moving or transferring a distance along X-axis 22 relative to the position of wafer mount assembly 102 as shown in FIG. 1A. The movement of the wafer holder assembly 102 along the X-axis 22 correspondingly moves the wafer holder 104 and the wafer holder surface 106 in the same direction. One skilled in the art will readily appreciate that there are various mechanisms for configuring the wafer/film shelf processing system 20 to move or transfer the wafer fixture 104 along at least one of the X-axis 22 and the Y-axis 24. After the test procedure, release the applied vacuum force and configure the ejector to crystal The circle 108 is lifted from the wafer mount surface 106 such that the wafer 108 can be recovered or removed by a terminal actuator or some other component. It will be apparent to the skilled person and readily understood that thicker wafers are more able to withstand the application of a strong force through the ram to lift the wafer 108 (resisting any residual suction) without damaging or destroying the wafer 108.

As shown in Figures 1A and 1B, the wafer/film shelf processing system 20 provides a first set of tracks 28 along which the wafer station assembly 102 moves toward or away (along the X- The shaft 22) is intended to be loaded. This predetermined loading position is as shown in Figure 1A. In various embodiments, there may be a set of brake or displacement mechanisms (not shown) that drive or move the wafer mount assembly 102 (and corresponding wafer mounts 104) in a manner that is readily understood by those skilled in the art. And wafer mount surface 106) along the first set of tracks 28 toward or away from a predetermined loading position associated with the load/unload procedure. Further, the wafer stage assembly 102 includes a second set of tracks 110 along which the wafer stage 104 moves toward or away (along the Y-axis 24) a predetermined loading position. The wafer holder 104 moves along the Y-axis 24 along the Y-axis 24 to move the wafer holder surface 106 and the wafer 108 disposed thereon. The wafer mount assembly 102 includes a transport mechanism 112, or any other displacement mechanism readily known to the skilled artisan for moving or transferring the wafer mount 104 along the second set of tracks 110.

The wafer/film rack processing system 20 includes a wafer/film holder loading device (not shown) or operates in conjunction with a wafer/film holder loading device configured to bond wafers/films The rack loader transfers a single item 108 (e.g., wafer 108a or film holder 108b) from the wafer/film holder source or source location onto wafer mount 104, particularly on wafer mount surface 106. Similarly, the wafer/film holder loading device is configured to transfer a single item 108 from the wafer holder surface 106 to the wafer/film holder source or source location in conjunction with the wafer/film rack unloading procedure. As described below, the wafer/film shelf processing system 20 includes a detection module or detection system/device that is configured to be optically or in combination with a detection process or program as would be understood by those skilled in the art. Visually detecting at least the presence, location, and/or orientation of the article 108 disposed on the wafer mount surface 106, and/or configured to optically or visually detect at least particulate matter on the wafer mount surface 106 The existence, size and / or shape.

The wafer/film rack processing system 20 additionally or alternatively includes a main controller or main control unit 34 (eg, a computer, computer system, or computing device) having one or more of the groups A processing unit and memory of program instructions. Program instructions The wafer/film rack handling system 20 in accordance with an embodiment of the present invention performs a wafer and film rack loading/unloading procedure by execution of the program unit, and the apparatus 100 performs a cleaning procedure. FIG. 10A is a block diagram showing the function of the main control unit 34. Further, main control unit 34 has the capabilities of data/signal communication, data storage, and/or information display devices/related thereto in a manner that is readily understood by those skilled in the art.

In accordance with a representative embodiment of the present invention, the cleaning process or process is performed by device 100, also referred to as cleaning device 100. In particular, apparatus 100 includes at least one cleaning device 200 disposed on wafer mount surface 106. Referring to the illustration of FIG. 3, apparatus 100 includes at least one cleaning device 200 of an integrated structure. Accordingly, device 100 includes an integrated or single cleaning device 200. The cleaning device 200 is longitudinally disposed on the wafer mounting table surface 106 such that a spacing or space gap 114 is formed along the Z-axis 26 between the cleaning device 200 and the wafer mounting table surface 106, and the Z-axis 26 is wafer secured. The normal/vertical axis of the table surface 106. The spatial gap 114 between the cleaning device 200 and the wafer holder surface 106 is more apparent in the illustration of Figure 5A, which shows that the space gap 114 has a height or spacing distance H along the Z-axis 26.

As noted above, device 100 includes a wafer mount assembly 102. Wafer mount 104 provides a wafer mount surface 106 that is configured to carry and securely hold an article or wafer 108. In particular, wafer mount surface 106 provides an article carrying area on which wafer 108 can be placed. The article carrying area of the wafer holder surface 106 has a total length L1 and a total width W1 as shown in FIG.

The cleaning device 200 of the apparatus 100 will be described in further detail with reference to FIGS. 4A through 4C. In some representative embodiments, cleaning device 200 includes and has a set of holes/nozzles/holes/voids 202 that are directed toward the wafer mount surface 106 in an illegal line direction. The illegal line direction used herein is defined as being non-parallel with respect to the Z-axis 26. In other words, a set of apertures 202 of the cleaning device 200 can be oriented or oriented in any direction toward the wafer mount surface 106, except along the vertical Z-axis 26. Referring to Figures 4A and 4B, the cleaning device 200 has an elongated structure, such as the shape of a rod or rod, the elongated structure having a total length L2. Referring to FIG. 3, the total length L2 of the cleaning device 200 is at least equal to the total length L1 or the width W1 of the wafer fixing table surface 106. This advantageously allows the cleaning device 200 to clean the wafer holder surface 106, in particular the article carrying area of the wafer 108, and/or thereon by movement or transfer in a single direction, i.e., along the X-axis 22. Wafer 108. In some other embodiments, the total length L2 of the cleaning device 200 can be greater than the wafer mount surface 106 The total length L1 or the width W1 is short. This requires the wafer holder 104 to be moved or transferred along both the X-axis 22 and the Y-axis 24 to clean the wafer holder surface 106 and/or the wafer 108 disposed thereon.

The cleaning device 200 has an elongated structure having a first end 204a and a second end 204b. The overall length L2 of the cleaning device 200 extends across or from the first end 204a to the second end 204b. The cleaning device 200 further includes an upper elongated surface 206 and a lower elongated surface 208 between the first end 204a and the second end 204b. The cleaning device 200 further includes a first inclined surface 210 and a second inclined surface 212. Each of the first inclined surface 210 and the second inclined surface 212 connects the upper elongated surface 206 to the lower elongated surface 208. Thus, the cross-section of the cleaning device 200 as shown by the XZ-plane (defined by the X-axis 22 and the Z-axis 26) has a trapezoidal form/shape/profile. Figure 5A shows an enlarged cross section of the cleaning device 200 shown in the XZ-plane. The trapezoidal profile of the cross section is easily seen in Figure 5A.

The cleaning device 200 has a set of apertures 202 disposed along the lower elongated surface 208, as shown in FIG. 4C. Device 100 includes a set of lumens (not shown) that are fluidly coupled to a set of apertures 202 of cleaning device 200. The set of lumens can be fluidly coupled or connected to a pump source disposed remotely from the apparatus 100. For example, device 100 can operate in a facility/house/environment with an integrated or dedicated pump source for the facility. The pump source is thus operable to initiate or affect fluid communication with the set of lumens, thereby enabling fluid communication between the set of lumens and the set of apertures 202 of the cleaning device 200. Alternatively, instead of using a pump source for the facility, device 100 can include a pump assembly 218 that is in fluid communication or connected to the set of lumens. The pump assembly 218 is operable to initiate or affect fluid communication with the set of lumens, thereby enabling fluid communication between the set of lumens and the set of apertures 202 of the cleaning device 200. For the sake of brevity, some of the following descriptions relate to apparatus 100 that includes pump assembly 218. However, it will be apparent and readily understood by the skilled person that the device 100 can operate in a similar manner with a pump source that is located remotely from the device 100 but that is in the same facility/house/environment.

The set of apertures 202 of the cleaning device 200 are configured for at least one of fluid drainage and fluid absorption through the spatial gap 114. Accordingly, a user of device 100 can operate cleaning device 200 to complete fluid discharge from set of holes 202 toward wafer mount surface 106 through space gap 114. Still alternatively, the user can operate the cleaning device 200 to complete fluid absorption from the wafer holder surface 106 to the set of holes 202 through the space gap 114.

The set of holes 202 includes a set of venting holes 214 that are configured to face the wafer mounting table surface 106 for fluid discharge. The set of venting holes 214 can also be referred to as a fan or fan. The set of venting holes 214 are configured to vent or blow fluid through the space gap 114 toward the wafer mounting table surface along an illegal line direction, such as a first illegal line direction 30 that is not perpendicular to the planar wafer station surface 106. 106. In the embodiment illustrated in FIG. 5A, the first illegal line direction 30 is substantially parallel to the second inclined surface 212.

The set of apertures 202 further includes a set of absorption apertures 216 that are configured to discharge fluid toward the wafer mount surface 106. The set of absorption holes 216 can also be referred to as a vacuum device. The set of absorption apertures 216 are configured to absorb or draw fluid from the wafer fixation station surface 106 through the spatial gap 114 along a direction of the illegal line, such as a second illegal line direction 32 that is not perpendicular to the planar wafer station surface 106. . In the embodiment illustrated in FIG. 5A, the second illegal line direction 32 is substantially parallel to the first inclined surface 210.

Referring to FIG. 5A, the first illegal line direction 30 and the second illegal line direction 32 form an angle with each other, wherein the normal axis of the wafer fixing table surface 106 (in the direction of the Z-axis 26) is inserted or is An illegal line direction 30 and a second illegal line direction 32. Thus, the set of apertures 202 are thus oriented in an illegal line direction toward the wafer mount surface 106.

The set of venting holes 214 are fluidly coupled to the set of internal cavities that are alternately fluidly coupled to the pump assembly 218 of the apparatus 100. As noted above, the skilled artisan will readily and readily appreciate that instead of the pump assembly 218, a pump source of the apparatus 100 can be used in a facility/house/environment. Pump assembly 218 is coupled to or integrated with a fluid source for communication to the set of lumens and the set of venting holes 214 for discharge. The fluid can be a pressurized gas such as clean dry air, nitrogen, argon, and the like. Those skilled in the art will readily appreciate that other types of fluids or fluid mixtures can be used or selected as desired. Similarly, the set of absorption apertures 216 are fluidly coupled to the set of lumens that are alternately fluidly coupled to the pump assembly 218. The set of absorbent apertures 216 are configured to attract or draw fluid away from the wafer mount surface 106.

Pump assembly 218 includes a first set of pumps that specifically utilize the set of bleed holes 214 to discharge fluid. A first set of lumens exists between the first set of pumps and the set of venting holes 214. The pump assembly 218 further includes a second set of pumps that specifically utilize the set of absorbent apertures 216 to absorb fluid. A second set of lumens is present between the second set of pumps and the set of absorbent apertures 216. The activation and/or operation of the pump assembly 218 or its pump set enables fluid to communicate with the respective set of lumens. Pump assembly 218 Fluid communication with the set of lumens creates a pressure differential between the set of lumens and the environment outside of the set of apertures 202.

For the set of venting holes 214, the fluid communication between the first set of pumps and the first set of internal cavities creates a positive pressure differential between the first set of internal cavities and the set of venting holes 214, such as the environment outside of the interstitial space 114. The positive pressure differential causes fluid to transfer from the set of venting apertures 214, particularly at least one of its apertures, toward the wafer mount surface 106. In particular, operation of pump assembly 218 provides or produces fluid/air that is directed from the set of venting holes 214 toward a layer/sheet of wafer holder surface 106.

For the set of absorbent apertures 216, fluid communication between the second set of pumps and the second set of lumens creates a negative pressure differential between the second set of lumens and the set of absorbent apertures 216, such as the environment outside of the spatial gap 114. The negative pressure differential causes fluid to transfer from the wafer mount surface 106 toward the set of absorbent apertures 216, particularly at least one of its apertures.

The transfer of fluid through the space gap 114 between the at least one aperture of the set of apertures 202 and the wafer holder surface 106 advantageously produces particulate matter, such as staying on or adhering to and/or from the wafer mount surface 106. Dust particles and unwanted materials on the wafer 108. The operation of pump assembly 218 provides or produces fluid/air that is directed from the set of apertures 202 toward the layer/sheet of wafer mount surface 106. The air layer sweeps across the wafer mount surface 106 and has a length that spans at least the total length L1 or the total width W1 of the wafer mount surface 106. The air layer assists in removing particulate matter from the wafer mount surface 106. For example, fluid discharged from the set of vents 214 creates an air layer that blows particulate matter away from the wafer mount surface 106 and/or wafer 108. Similarly, an air layer is created by the set of absorption holes 216 during liquid absorption. The absorbed liquid from or through the air layer alternately absorbs or draws particulate matter away from the wafer mount surface 106 and/or wafer 108. Removal of particulate matter enables cleaning of wafer mount surface 106 and/or wafer 108, advantageously without the use of chemicals or compounds.

FIG. 5B illustrates a block diagram showing the relationship between the pump assembly 218 of the cleaning apparatus 100, the set of lumens 220, and the set of apertures 202. The set of apertures 202 includes at least one of the set of venting apertures 214 and the set of absorbing apertures 216. The set of apertures 202 can be divided or divided into a plurality of subset apertures 202a, 202b, 202c, and 202d. Similarly, the set of lumens 220 includes a plurality of lumens 220a, 220b, 220c, and 220d that are separated/separated and fluidly sealed from one another. Thus, there is no fluid communication between any pair of lumens 220a, 220b, 220c, and 220d. Each subset of apertures 202a, 202b, 202c, and 202d is fluidly coupled to a lumen 220a, 220b, 220c, respectively And 220d. Each of the lumens 220a, 220b, 220c, and 220d is fluidly coupled to the pump assembly 218 by channels 222a, 222b, 222c, and 222d, respectively. All of the channels 222a, 222b, 222c, and 222d converge on the pump assembly 218 such that the single or integrally formed pump assembly 218 achieves fluid communication to other components.

An advantage of the configuration shown in Figure 5B is that each of the lumens 220a, 220b, 220c, and 220d is coupled to a single subset of apertures 202a, 202b, 2020, and 2c2d, respectively. Each of the individual subset holes 202a, 202b, 202c, and 202d has a smaller number of holes than the entire set of holes 202. This advantageously allows for more efficient and uniform distribution of the flow communication, as each lumen 220a, 220b, 220c, and 220d only needs to be in fluid communication with a few holes. Conversely, if a single lumen 220 is used for the entire set of apertures 202, the fluid distributed over the set of apertures 202 will reduce the fluid efficiency of subsequent transfers. Each of the channels 222a, 222b, 222c, and 222d are at the same pressure level when the pump assembly 218 is operating. This results in each of the internal cavities 220a, 220b, 220c, and 220d being at the same pressure level without interference or pressure leaks with other internal cavities. This further allows each subset of apertures 202a, 202b, 202c, and 202d to have dedicated lumens 220a, 220b, 220c, and 220d. Further advantageously, each subset aperture 202a, 202b, 202c, and 202d has substantially equal pressure or power relative to each other. The skilled person will readily and readily understand the number of subset holes, the number of lumens, and the number of channels that can be adjusted and varied depending on operational needs, such as fluid flow and pressure levels.

Referring back to FIG. 5A, the set of venting holes 214 discharges liquid toward the wafer mounting table surface 106 along the first illegal line direction 30. Fluid (eg, gas or air) that is discharged toward the wafer mount surface 106 helps to blow away particulate matter that remains or adheres to the wafer mount surface 106. For example, the air layer/sheet or air stream may be directed from the set of venting holes 214 toward the wafer station surface 106 on which the particulate matter remains. Under the impact of the airflow, the particulates are subjected to the forces therein and are dissipated from the wafer mount surface 106. Therefore, the particulate matter is carried away from the wafer fixing table surface 106 so that they can no longer contact each other.

In addition, the set of absorption apertures 216 absorb fluid from the wafer mount surface 106 along the second illegal line direction 32. Absorption or fluid transfer of the fluid enables the fluid to move, which may carry away particulate matter. For example, if air is drawn from the wafer holder surface 106 toward the set of absorption holes 216, any particulate matter present in the air will also be drawn into the set of absorption holes 216. Therefore, due to the set of discharge holes 214, particulate matter driven away and carried away from the wafer fixing table surface 106 can be absorbed by the set of absorption holes. 216 absorption and extraction.

The cleaning apparatus 100 can further include a control unit 36 configured to automatically activate the pump assembly 218 for fluid communication of the set of holes 202 for operation of the pump assembly 218, for example. FIG. 10B is a block diagram showing the function of the control unit 36 of the cleaning apparatus 100. The operative pump assembly 218 is used for fluid absorption by the set of absorbing apertures 216 while discharging fluid through the set of venting apertures 214. In other words, the cleaning device 200 can be operated to expel fluid from the set of venting holes 214 to drive particulate matter away from the wafer mounting table surface 106, and at the same time cause fluid to be drawn into the set of absorbing holes 216 for scooping or removal. Detached particles. Thus, there is a zero time difference between the operation of the set of absorption holes 216 and the operation of the set of discharge holes 214. Alternatively, control unit 36 may control pump assembly 218 to initiate operation of the set of bleed holes 216 in response to the set of vent holes 214 that are activated. There is a predetermined period of time between the operation of the set of venting holes 214 and the operation of the set of absorbing holes 216. The predetermined time period is in milliseconds. This period of time allows the particulate matter to travel closer to the set of absorption apertures 216 after being driven away from the wafer fixed station surface 106 by the set of venting holes 214. The skilled person will understand that the predetermined time period can be adjusted depending on the operational requirements, in particular the height or separation distance H of the spatial gap 114. For example, the greater the separation distance H of the space gap 114, the more quickly the driven particulate matter needs to travel closer to the set of absorption holes 216, thereby requiring a longer predetermined period of time.

Thus, the operational combination of the set of venting holes 214 and the set of absorbing holes 216 effectively dislodges and removes particulate matter from the wafer mounting table surface 106. An advantage of the trapezoidal shape of the cross-section of the cleaning device 200 is that the set of venting holes 214 facilitates blowing and dislodging particulate matter toward the set of absorbing apertures 216 for scooping. Another advantage is that the lower elongated surface 208 significantly reduces the risk of any escaping particulate matter escaping into the environment and escaping from the absorption/extraction of the set of absorbing apertures 216. The angles α and β of the first illegal line direction 30 and the second illegal line direction 32 with respect to the wafer fixing table surface 106, respectively, are theoretically greater than 0 degrees and less than 90 degrees. Preferably, the angles α and β are between 30 and 60 degrees, and the optimum angle is about 45 degrees. Depending on the operational requirements, the skilled artisan will readily appreciate that the angles a and β can be varied to optimize or adjust the removal of particulate matter from the wafer mount surface 106. Furthermore, instead of a linear illegal line direction, the holes can be directed such that the discharge/absorption of fluid is along a curved or curved path/contour.

The set of holes 202 of the cleaning device 200 including the set of venting holes 214 and the set of absorbing holes 216 are disposed on the lower elongated surface 208 of the cleaning device 200, as shown in FIG. 4C. In some In the representative embodiment, the set of venting apertures 214 includes a plurality of separate apertures and the set of absorbing apertures 216 includes a single or integrally formed elongated aperture. Figure 5C shows an example of such a set of apertures 202 distributed along the lower elongated surface 208. The set of venting holes 214 in the form of a plurality of individual holes allows more dedicated fluid to flow therein. The elongated absorbent apertures 216 are continuous and do not have the same spacing structure as the set of discharge apertures 214. This advantageously prevents any escaping particulate matter from escaping absorption/extraction, which may occur if some particulate matter falls on such spaced absorbing pores. Another advantage is that due to the continuous long holes, the holes have a larger absorption area and a higher likelihood of picking up particulate matter that is driven away from the wafer holder surface 106.

FIG. 5C shows only an exemplary configuration of the set of holes 202. It is readily understood by the skilled person that other configurations, distributions, and hole shapes and sizes are possible. Figure 5D shows one other possible configuration of the set of holes 202. In another possible configuration shown in FIG. 5E, the set of holes 202 includes only the set of venting holes 214 or the set of absorbing holes 216. Typically, the set of apertures 202 are distributed over a length substantially close to or equal to the total length L2 of the cleaning device 200. This advantageously allows the set of holes 202 of the cleaning device 200 to remove particulate matter from the wafer fixed station surface 106 by sweeping in one direction, for example along the Y-axis 24.

In some alternative embodiments, various parameters of pump assembly 218 operation may be selected. For example, the velocity and direction of fluid flowing from the set of holes 202 can be programmed. Thus, the respective fluid velocity and/or the angles α and β of the first illegal line direction 30 and the second illegal line direction 32 may be programmed. The user can thus program or select sharper/blunt angles a and β relative to the wafer mount surface 106, such as optimizing the wafer mount surface as fluid or air blows over the wafer mount surface 106. The deflection effect or motion of the particles on 106. For example, a sharper angle can more easily deflect particles toward the sides of the wafer holder surface 106, such as through the set of absorption holes 216, for removal from the sides of the wafer holder surface 106.

Further, for example, a constant or intermittent flow pattern in a predetermined interval is program selected. Fluid flow control mechanism 38 may be coupled to the set of apertures 202, the set of lumens, and/or pump assembly 218. Control unit 36 of device 100 stores and transmits programming instructions for programming, defining, and/or selecting various parameters. For example, fluid flow control mechanism 38 can include a valve that is actuatable between open and closed positions that permit and prevent fluid from passing through the set of apertures 202.

The fluid flow control mechanism 38 is further configured for selection of an intermediate position for progressively increasing/decreasing between fully closed and open positions to provide a proportional greater/more The small valve opens. Fluid flow control mechanism 38 is also used to implement a programmable selection mode of fluid flow. For example, the valve or, if possible, a second independent valve can be configured to provide a constant or intermittent fluid flow. Thus, the fluid flow control mechanism 38 and the valve can control the flow rate and flow pattern through the set of orifices 202 using the control unit 36 and the programmed commands stored therein.

Fluid flow control mechanism 38 is further configured to select a direction of fluid flow in accordance with programming instructions transmitted by control unit 36. For example, fluid flow control mechanism 38 includes a driver that is capable of rotating the set of apertures 202 such that the set of apertures 202 direct fluid flow toward the wafer mount surface 106 in a selected direction or orientation. Thus, the first illegal line direction 30 and the second illegal line direction 32 are part of a direction/orientation group selectable by the fluid flow control mechanism 38 and the control unit 36.

Referring to FIGS. 1A and 3, apparatus 100 further includes a support arm 116 configured to structurally retain/support cleaning device 200 relative to wafer mount surface 106. The support arm 116 supports and maintains the set of apertures 202 stationary while the wafer fixation station 104 moves beneath it. From the perspective of cleaning device 200, the set of apertures 202 pass or pass over at least a portion or portions of wafer mount surface 106. In an alternate embodiment, the cleaning device 200 is configured to be movable relative to the wafer station surface 106 while the wafer station 104 remains stationary. Therefore, the cleaning device 200 and the wafer fixing station 104 are configured to move relative to each other. Further, the support arm 116 is configured to maintain a spatial gap 114 between the cleaning device 200 and the wafer mount surface 106 while the wafer mount 104 and the cleaning device 200 move relative to each other.

The pump assembly 218 is operable while the cleaning device 200 and the wafer holder 104 move relative to one another. This advantageously allows the cleaning device 200 to be driven away from the wafer holder surface 106 and to remove particulate matter as it sweeps across the wafer mount surface 106, thereby increasing the efficiency of the cleaning process. In some embodiments, the support arm 116 is configured to maintain the cleaning device 200 stationary while the wafer station 104 is moving beneath it. The wafer mount assembly 102 moves along the first set of rails 28 while the cleaning device 200 remains stationary. The wafer station 104 is further configured to be moved along the second set of tracks 110 by the transport mechanism 112. Movement of the wafer holder 104 relative to the stationary cleaning device 200 allows at least a portion or portion of the wafer holder surface 106 to be swept under the cleaning device 200.

In some alternative embodiments, the cleaning device 200 is configured to move, for example, via the support arm 116 while the wafer station 104 remains stationary such that the cleaning device 200 sweeps through at least The wafer fixed stage surface 106. Thus, wafer mount 104 and corresponding wafer mount surface 106 remain stationary and cleaning device 200 moves at least in the direction of X-axis 22. The cleaning device 200 can also move or move in the direction of the Y-axis 24 as necessary.

In accordance with various embodiments of the present invention, a cleaning procedure or process 500/510 utilizing apparatus 100 and cleaning apparatus 200 is described below with reference to FIGS. 11A and 11B.

After the wafer mounting table 104 is positioned at the predetermined loading position by the binding loading program, the relative movement of the cleaning device 200 and the wafer fixing table 104 along the X-axis 22 direction, for example, is viewed from the perspective of the wafer fixing table surface 106. The set of apertures 202 is gradually moved across the total width W1 of the article carrying area of the wafer holder surface 106 of the wafer holder 104 by moving the wafer stage 104. In the cleaning procedure 500/510, fluid is transferred between the set of holes 202 and the wafer holder surface 106 by at least one of fluid discharge and fluid absorption, while the cleaning device 200 and the wafer holder 104 move relative to each other. .

The movement of the wafer station 104 is selectively or selectively activated/operated, for example by means of the control unit 36 of the device 100, while maintaining the separation distance H of the space gap 114. The moving mechanism of the wafer/film shelf processing system 20 can also be selectively or selectively activated/operated to transfer or move the wafer mounting station assembly 102 along the first set of tracks 28, thereby moving the wafer relative to the cleaning device 200. Fixed station 104. Further, the transport mechanism 112 is selectively or selectively activated/operated to transfer or move the wafer mount 104 along the second set of tracks 110 relative to the cleaning device 200. The skilled artisan will readily appreciate that various moving mechanisms operate through devices or elements such as wheels, pulleys, belts, chains, and/or gears. Accordingly, various moving mechanisms in device 100 can be selectively or selectively activated/operated to transfer or move wafer mount 104 while keeping cleaning device 200 stationary to clean the wafer mount surface in accordance with cleaning program 500/510. 106, such as its object carrying area. Alternatively, the wafer station 104 can remain stationary and moved to the relative position of the cleaning device 200.

The flow chart shown in FIG. 11A is a cleaning procedure or process 500 of the wafer/film rack processing system 20 that is unloaded using the cleaning apparatus 200 of the wafer holding station 104 on which the object/wafer 108 is not disposed. The flowchart shown in FIG. 11B is a cleaning procedure or process 510 of the loaded wafer/film shelf processing system 20 using the cleaning device 200 of the wafer mounting station 104 on which the article/wafer 108 is disposed.

Wafer mounting station with or without an object/wafer 108 disposed thereon After positioning at the predetermined loading position, the movement mechanism of the device 100 can be activated to move the wafer station 104 relative to the cleaning device 200 to a first cleaning position (eg, an initial cleaning position at one end of the overall width W1). In the first cleaning position, the cleaning device 200 is disposed over the wafer mounting station 104 such that the set of holes 202 and the first end 120a of the wafer mounting table surface 106 are in the same vertical plane or YZ perpendicular to the X-axis 22. - In-plane (defined by Y-axis 24 and Z-axis 26). The first cleaning position of the wafer holder 104 relative to the cleaning device 200 can be coupled to the first sensor 122 of the wafer holder 104 at the first end 120a of the wafer holder surface 106 (eg, an optical sensor) ) Detection. In particular, when the light source included in the first sensor 122 emits light perpendicular to or relative to the wafer fixed stage surface 106, the light may be reflected by the cleaning device 200 if the wafer fixing station 104 is in the first cleaning position. And is received/detected by the first sensor 122. Otherwise, no reflected light is received/detected by the first sensor 122. The first sensor 122 provides corresponding feedback to each of the moving mechanisms to indicate whether the wafer station 104 is disposed in the first cleaning position relative to the cleaning device 200.

The wafer holder 104 is further moved along the first set of tracks 28 until the wafer station 104 is disposed in a second cleaning position relative to the cleaning device 200 (eg, the final cleaning position at the other end of the overall width W1). In the second cleaning position, the cleaning device 200 is disposed over the wafer mount 104 such that the set of holes 202 are in the same vertical plane as the second end 120b of the wafer mount surface 106. The second cleaning position of the wafer station 104 relative to the cleaning device 200 can be detected by a second sensor 124 (eg, an optical sensor) coupled to the wafer station 104 at the second end 120b. The operation of the second sensor 124 in the second cleaning position is similar to the operation of the first sensor 122 described above in the first cleaning position. Similarly, the second sensor 124 also provides corresponding feedback to each of the moving mechanisms to indicate whether the wafer station 104 is disposed in the second cleaning position relative to the cleaning device 200.

The skilled person will readily appreciate that other types of sensors, such as electronic and/or mechanical sensors, can also be used to detect the first and second cleaning positions of the wafer station 104 relative to the cleaning device 200. Further, while the above description generally describes the displacement of the wafer holder 104 relative to the cleaning device 200, the skilled artisan will readily appreciate that, alternatively, the cleaning device 200 can be moved relative to the wafer station 104.

The second cleaning position of the wafer fixing station 104 relative to the cleaning device 200 may also be performed when the wafer fixing table 104 is disposed relative to the cleaning device 200 at the first cleaning position. The time is determined by a predetermined time period. The predetermined time period is calculated by dividing the total width W1 of the wafer fixing table surface 106 by the moving speed of the wafer fixing station 104 or the cleaning device 200 with respect to the other. It should be noted that the total width W1 of the wafer mount surface 106 spans or extends from the first end 120a to the second end 120b. The speed of movement of the wafer station 104 relative to the cleaning device 200 can be programmatically selected using the control unit 36.

When the wafer holding station 104 is moved from the first cleaning position to the second cleaning position relative to the cleaning device 200, in conjunction with the first stage of the cleaning procedure 500/510, the set of holes 202 of the cleaning device 200 has a progressive manner in a relative manner. The total width W1 of the wafer mount surface 106 is moved. At the wafer mounting station 104 to the second cleaning position relative to the cleaning device 200, the wafer mounting station/wafer/film frame inspection can be initiated by the inspection module or inspection system/device included in the wafer/film shelf processing system 20. Program or process. The inspection program detects the wafer mount surface 106 and/or the article/wafer 108 disposed thereon. The detection system/device will determine if the second phase of the cleaning procedure 500/510 is required based on predetermined criteria and provide a corresponding feedback signal. An example of a predetermined criterion is a predetermined number of stages or a predetermined number of repetitions of the cleaning program 500/510. For example, a user of device 100 can pre-define the number of repetitions to two such that the device automatically begins the second phase of cleaning procedure 500/510 after completing the first phase. In the second phase of the cleaning procedure 500/510, the wafer station 104 is moved back from the second cleaning position to the first with respect to the cleaning device 200 in a manner substantially equal to or similar to the first stage of the cleaning procedure 500/510 described above. Clean the location.

The second phase of the cleaning procedure 500/510 can also be started directly or immediately after the first phase of the cleaning procedure 500/510. Accordingly, cleaning program 500/510 can be performed such that wafer holding station 104(a) moves from the first cleaning position to the first cleaning stage 200 in a manner substantially equal to or similar to the first stage of cleaning program 500/510 described above. And (b) moving back from the second cleaning position to the first cleaning position relative to the cleaning device 200 in a manner substantially equal to or similar to the second stage of the cleaning procedure 500/510 described above. This advantageously allows the wafer holder surface 106 to be swept twice under the cleaning device 200, resulting in more efficient cleaning of the wafer holder surface 106 and/or the article 108/wafer 108a/film frame 108b disposed thereon. .

Semiconductor wafer processing operations are often performed and performed in a cleaning facility/house/environment to reduce the risk of contamination or to prevent contamination. Thus, the wafer/film shelf processing system 20 is typically operated or used in a cleaning facility. In a cleaning facility, with constant air flow or air exchange to remove contaminants, unwanted materials, and/or particulate matter from the cleaning facility, thereby preventing as much as possible A sensed semiconductor component, such as a wafer, produces electrical conduction. In some embodiments of the invention, cleaning device 200 is configured to remove particulate matter from wafer mount surface 106 and/or wafer 108, thereby cleaning wafer mount surface 106 and/or wafer 108. Any particulate matter that is driven away from wafer mount surface 106 and/or wafer 108 is also captured in a constant airflow of the cleaning facility and subsequently removed from the cleaning facility. Thus, in addition to the environmental conditions of the cleaning facility, the cleaning apparatus 100 helps to clean the semiconductor components, which can significantly reduce the risk of contamination.

Alternative representative or exemplary embodiments relating to various other embodiments of the present invention are described below, particularly embodiments having apparatus 100 having two or more cleaning devices.

In an alternate embodiment of the apparatus 100 of the present invention, there is a wafer/film shelf processing system 20, as shown in FIG. 6A, which includes apparatus 100 and a detection system or detection device 300. The apparatus 100 includes a wafer mount assembly 102 having a wafer mount 104 that provides a wafer mount surface 106 that is configured to be held securely An object 108 disposed thereon. Figure 6B shows the wafer/film shelf processing system 20 carrying the article 108, which may be a wafer or film shelf.

Apparatus 100 includes at least one cleaning device 200 disposed above wafer mounting surface 106, each cleaning device 200 having a plurality of apertures. Specifically, the at least one cleaning device 200 includes a first cleaning device 200 and a second cleaning device 400. The first cleaning device 200 is substantially similar to the single/integrated cleaning device 200 described above in relation to the representative embodiments. The first cleaning device 200 has a first set of apertures 202 and the second cleaning device 400 has a second set of apertures 402.

The first set of apertures 202 of the first cleaning device 200 includes (i) a set of venting apertures 214 configured to discharge fluid to the wafer fixed station surface 106 along a first illegal line direction 30; and (ii) configured At least one of a set of absorption apertures 216 for absorbing fluid from the wafer holder surface 106 along the second illegal line direction 32. The normal axis of the wafer holder surface 106 is relatively parallel to the Z-axis 26 and is interposed or between the first illegal line direction 30 and the second illegal line direction 32.

The second set of apertures 402 of the second cleaning device 400 includes (i) a set of venting holes 414 configured to discharge fluid to the wafer fixed station surface 106 along a first illegal line direction; and (ii) configured At least one of a set of absorption holes 416 that absorb fluid from the wafer holder surface 106 along a second illegal line direction. The normal axis of the wafer holder surface 106 is relatively parallel to the Z-axis 26 and is interposed or between the first illegal line direction and the second illegal line direction.

Apparatus 100 includes a set of lumens fluidly coupled to each set of apertures 202 and 402. can There is a subset of lumens for each cleaning device 200 or 400. Further, there may be a subset of lumens for each set of drain/absorption apertures 214, 216, 414, and 416 or subsets thereof. The apparatus 100 further includes a pump source or pump assembly 218 that is fluidly coupled to the set of lumens or lumen subsets. Pump assembly 218 includes a single pump for each cleaning device 200 or 400. Further, there may be a single pump for each of the drain/absorption apertures 214, 216, 414, and 416 or a subset of the apertures thereof. It will be apparent to the skilled person and readily understood that pump assembly 218, lumen, cleaning device 200, and group apertures 202 and 402 can be used in different possible configurations.

The pump assembly 218 is operable to initiate or affect fluid communication with the set of lumens, thereby enabling fluid communication between the set of lumens and the set of apertures 202 and 402 of the cleaning device 200. Further details of the operation of pump assembly 218, particularly with respect to the pressure differential created between the set of chambers and the environment outside of the set of apertures 202 and 402, are readily understood by the skilled artisan based on the description in the previous section of the present invention.

As noted above, apparatus 100 includes a movement mechanism that is configured to automatically move wafer mount 104 based on control unit 36 and programming instructions therein. From the perspective of the wafer mount surface 106, the displacement of the wafer mount 104 indirectly causes the first set of holes 202 and/or the second set of holes 402 to pass or pass over at least a portion or portions of the wafer mount surface 106. In some alternative embodiments, there may be a separate moving mechanism or integrated moving structure that moves each of the first cleaning device 200 and the second cleaning device 400 relative to the wafer fixed station surface 106. Accordingly, each of the first cleaning device 200 and the second cleaning device 400 and the wafer fixing station 104 may be configured to move relative to each other while maintaining the separation distance H of the space gap 114. The pump assembly 218 is further operated while at least one of the following occurs: (i) the first cleaning device 200 and the wafer fixing station 104 move relative to each other; and (ii) the second cleaning device 400 and the wafer fixing table 104 move relative to each other .

The wafer fixing station 104 is movable while each of the first cleaning device 200 and the second cleaning device 400 remains stationary. For example, the wafer station assembly 102 is movable along the first set of tracks 28 by the moving mechanism 128, thereby moving the wafer station 104 in the direction of the X-axis 22. The wafer holder 104 is also movable along the second set of tracks 110 by the transport mechanism 112 along the Y-axis 24 direction. Displacement of the wafer holder 104 relative to the stationary first cleaning device 200 and the stationary second cleaning device 400 allows at least a portion or portion of the wafer mounting table surface 106 to be at least in the first cleaning device 200 and the second cleaning device 400 One was swept below.

Referring to Figure 6C, device 100 includes a detection device 300. The detection device 300 includes an objective lens 302 for detecting an object/wafer 108 and/or a wafer holder surface 106 disposed on the wafer mount surface 106. Detection device 300 may alternatively include one or more objective lenses 302, each having different dimensions, such as focal length and aperture. The objective lenses 302 are primarily configured to detect wafers 108 disposed on the wafer mount surface 106, such as to inspect defects and compare the test results to predetermined data.

Similar to the first cleaning device 200 and the second cleaning device 400, the objective lens 302 remains stationary and the wafer fixing station 104 is moved. Due to the displacement of the wafer holder 104 relative to the objective lens 302, the objective lens 302 can thus be positioned relative to the wafer holder surface 106. As shown in FIGS. 6A and 6B, the first cleaning device 200 is disposed at a first position away from the detecting device 300, and the second cleaning device 400 is disposed at a second position. The second position is independent and remote from the first position, thereby separating the first cleaning device 200 and the second cleaning device 400 from each other in space.

Alternatively, instead of the wafer holder 104 being movable while the other components remain stationary, the first cleaning device 200, the second cleaning device 400, and/or the objective lens 302 can be configured to be movable while the wafer holder 104 remains Still, at least one of the first cleaning device 200, the second cleaning device 400, and the objective lens 302 is swept through at least a portion of the wafer holder surface 106. The second cleaning device 400 is further configured to move simultaneously with the objective lens 302 relative to the wafer mount surface. Simultaneous movement of the second cleaning device 400 and the objective lens 302 advantageously allows the second cleaning device 400 to move with the objective lens 302 during the inspection process and further allows the article/wafer 108 to be cleaned in progress during the inspection process.

The set of apertures 202 of the first cleaning device 200 are disposed along an elongated configuration while the set of apertures 402 of the second cleaning device 400 are disposed about a circular region. The set of apertures 404 of the second cleaning device 400 are configured for at least one of fluid drainage and fluid absorption through the spatial gap 114. Accordingly, a user of device 100 can operate second cleaning device 400 to effect fluid discharged from the set of apertures 402 through space gap 114 toward wafer mount surface 106. Still alternatively, the user can operate the second cleaning device 400 to effect fluid absorption from the wafer mounting table surface 106 through the space gap 114 to the set of holes 402.

The set of apertures 402 includes a plurality of venting apertures 414 that are configured to vent fluid to the wafer mount surface 106. The set of venting holes 414 can also be referred to as a fan or fan. The set of venting holes 414 are configured to be non-perpendicular along the wafer mounting table surface 106 relative to the plane The first illegal line direction discharges or blows fluid through the space gap 114 toward the wafer mount surface 106. The set of apertures 402 further includes a plurality of absorption apertures 416 configured to direct fluid to the wafer mount surface 106. The set of absorption holes 416 can also be referred to as a vacuum device. The set of absorption apertures 416 are configured to absorb or draw fluid from the wafer fixation station surface 106 through the spatial gap 114 along a second illegal line direction that is not perpendicular relative to the planar wafer mount surface 106. The direction of fluid discharge and absorption of the set of apertures 402 of the second cleaning device 400 is mostly similar or similar to the orientation of the first cleaning device 200, as shown in FIG. 5A. In particular, the angles α and β with respect to the illegal line direction of the wafer 108 are theoretically greater than 0 degrees and less than 90 degrees, as described above.

FIG. 7 shows an illustration of the second cleaning device 400. The second cleaning device 400 includes a plurality of discharge holes 414. In the embodiment illustrated in FIG. 7, the second cleaning device 400 does not include any of the absorption holes 416. The set of venting holes 414 direct fluid to the wafer station surface 106 along the illegal line direction. Fluid (e.g., gas or air) that is discharged toward the wafer mount surface 106 helps to blow away particulate matter that remains or adheres to articles such as wafer 108 disposed on the wafer mount surface 106. For example, the air layer/sheet or air flow may be directed from the set of venting holes 414 toward the wafer station surface 106 on which the particulate matter remains. Under the impact of the gas stream, the particles are subjected to the forces therein and are dissipated from the wafer 108. Thus, particulate matter is blown away from the wafer 108 such that they are removed therefrom.

Further, in the embodiment shown in FIG. 7, the detecting device 300 includes a hollow space 304 for housing the objective lens 302. Thus, objective lens 302 is configured to detect wafer 108 through hollow space 304. The second cleaning device 400, in particular, the set of venting holes 414 is disposed and carried around the hollow space 304, thereby surrounding the objective lens 302. Further, the detecting device 300 includes a lighting device 306 disposed around the objective lens 302. The illumination device 306 can be a ring or array of illumination devices or illumination devices configured to illuminate the wafer 108 for improvement of the wafer 108 and for a clearer inspection.

In some other embodiments, for the second cleaning device 400, a set of absorption apertures 416 can be included for operation in conjunction with the set of discharge apertures 414 to remove particulate matter, similar or similar to the above regarding the first cleaning device 200. Narrative. The set of absorption holes 416 absorb fluid from the wafer 108 in an illegal line direction. Absorption or fluid transport of the fluid enables the fluid to move, and the movement of the fluid potentially carries particulate matter. For example, if air is drawn from the wafer 108 toward the set of absorption holes 416, any particulate matter present in the air is also drawn into the set of absorption holes 416. Therefore, by At the set of vents 414, particulate matter that is driven away and blown away from the wafer 108 can be absorbed and captured by the set of absorbing apertures 416.

The set of holes 402 of the second cleaning device 400 including the set of venting holes 414 and the set of absorbing holes 416 are disposed on the lower surface 408 of the second cleaning device 400, as shown in FIG. 8A. The set of venting holes 414 includes a plurality of separate holes. The set of absorbent apertures 416 includes a single or integrally formed aperture having a curved shape or contour. Since the absorbing aperture 416 is a continuous length of aperture, the absorbing region of the aperture is relatively large and there is a high probability of absorbing particulate matter that is driven away from the wafer 108. Figure 8A shows only an exemplary configuration of the set of holes 402. Figures 8B through 8D show other possible configurations of the set of holes 402. However, the skilled person will readily appreciate that other configurations, distributions, and hole shapes and sizes are possible.

Thus, the operational combination of the set of bleed holes 414 and the set of absorbing holes 416 effectively dislodges from the wafer 108 and removes particulate matter. An advantage of the illegal line direction of fluid flow is that the set of venting holes 414 facilitates blowing and dislodging particulate matter toward the set of absorbing apertures 416 for scooping. Another advantage is that the lower surface 408 of the second cleaning device 400 significantly reduces the risk of any escaping particulate matter escaping into the environment and escaping from the absorption/extraction of the set of absorbing apertures 416. Alternatively, as described above, the lower surface 408 includes a hollow space 304 for receiving the objective lens 302.

In the embodiment shown in FIGS. 6A to 6C, the second cleaning device 400 is disposed at a separate second position with respect to the wafer fixing table surface 106, and the second position is away from the first of the first cleaning device 200. position. In an embodiment, the second cleaning device 400 can be configured and disposed at or near the bottom 308 of the illumination device 306 of the detection device 300. Alternatively or additionally, the second cleaning device 400 may or alternatively be configured or in a ring shape and disposed adjacent to, around, and/or surrounding the illumination device 306 of the detection device 300 at the bottom/periphery of the illumination device 306 of the detection device 300 The bottom/peripheral if the illumination is desired to be placed closer to the wafer surface 106 of the wafer 108 to be inspected. In another embodiment, the apertures 402 of the second cleaning device 400 are configured to direct a layer/sheet of fluid/air onto the wafer surface 106 of the wafer 108 comprising a plurality of die sets. In particular, the apertures 402 are configured to direct a fluid/air layer/sheet to the surface of the die in the detection region disposed below the illumination device 306 for detecting the wafer 108. The venting holes from the holes 402 thereby advantageously wash away any residual foreign particles that remain on the surface of the dies. The hollow space 304 of the illumination device 306 allows for housing the objective lens 302, particularly allowing the objective lens 302 to move into a position perpendicular to the wafer surface 106 for placement beneath the objective lens 302. Image capture of wafer 108 or die. In an embodiment in which the second cleaning device 400 is disposed and disposed around the illumination device 306 and surrounds the illumination device 306, the second cleaning device 400 has a ring shape and the hollow space 304 allows the illumination device 306 to be disposed therebetween such that the second cleaning device 400 Set near the objective lens set 302. Further, the second cleaning device 400 and the objective lens 302 may be configured to move simultaneously with each other.

In accordance with various embodiments of the present invention, with further reference to FIG. 11C, a cleaning procedure or process 500/510 utilizing apparatus 100 and first cleaning apparatus 200 and a detection procedure or process 520 utilizing detection apparatus 300 and second cleaning apparatus 400 are described below. .

After the wafer mounting station 104 is coupled to a predetermined loading position in conjunction with a loading procedure, the wafer mounting station 104 is movable relative to the first cleaning device 200 such that relative movement and operation of the first cleaning device 200 cleans the wafer Fixed table surface 106. The cleaning of the wafer holder surface 106 by the first cleaning device 200 is in accordance with the cleaning procedure 500/510 discussed above, particularly the first stage of the cleaning procedure 500/510. Moreover, the second or subsequent stages of the cleaning procedure 500/510 can be performed on the wafer mount surface 106 in accordance with the number of cycles or number of iterations required by the first cleaning device 200 to clean. It can be understood by the skilled person based on the aforementioned description of the cleaning procedure or process 500/510.

Therefore, the wafer fixing station 104 is movable such that the first cleaning device 200 relatively passes through at least a portion or a portion of the wafer fixing table surface 106 for cleaning the wafer fixing table before the detecting process performed by the detecting device 300. Surface 106. For inspection program 520, the article or wafer 108 is loaded onto the wafer mount surface 106 and securely mounted thereto. The first cleaning device 200 can be operated to perform an initial cleaning procedure on the wafer 108.

The wafer fixing station 104 is also movable relative to the second cleaning device 400. The movement of the wafer station 104 can be selectively/optionally activated/operated, such as by means of the control unit 36 of the device 100. In particular, the moving mechanisms of the wafer/film shelf processing system 20, such as the moving mechanism 128 and the transport mechanism 112, can be selectively or selectively activated/operated to transfer or move the wafer mount assembly 102 or wafer mount 104, thereby moving the wafer 108 relative to the second cleaning device 400. Thus, in accordance with test procedure 520, various moving mechanisms in device 100 can be selectively or selectively activated/operated to transfer or move wafer fixed station 104 relative to second cleaning device 400 to clean and inspect wafer 108.

Referring to Figure 9, wafer 108 includes a plurality of sets of devices (e.g., semiconductor dies). crystal The circle 108 can be divided or divided into a plurality of lattice portions or arrays of wafer portions 132. Each of the wafer portions 132 includes a device/die or a sub-device/die.

The wafer 108 is moved by each moving mechanism until the wafer 108 is disposed at a first detection position below the second cleaning device 400. In the first cleaning position, the second cleaning device 400 is disposed over the wafer 108 such that the plurality of holes 402 are disposed over the first wafer portion 132a, preferably at or near the outer edge 134 of the wafer 108. A detection mechanism and/or a sensor can be used to determine the correct positioning of the second cleaning device 400 relative to the wafer 108.

The pump assembly 218 of the device 100 is then activated to enable the second cleaning device 400 to clean the first wafer portion 132a. Each moving mechanism then moves the wafer 108 until the wafer 108 is disposed in a second position below the second cleaning device 400. In the second position, the second cleaning device 400 is disposed on the wafer 108 such that the group of holes 402 are disposed above the second wafer portion 132b. At the same time, due to the movement of the wafer 108, the objective lens 302 of the detecting device 300 is disposed or positioned above the first wafer portion 132a. The detecting device 300 is operable to detect the first wafer portion 132a, particularly the defects remaining on the device/die, while the second cleaning device 400 cleans the second wafer portion 132b. Accordingly, the wafer 108 is movable such that the second cleaning device 400 relatively passes through at least a portion or portions of the wafer mounting table surface 106 to clean at least a portion or portions of the object/wafer disposed thereon during the inspection process 520. 108.

The detection program 520 continues the movement of the wafer 108 such that the second cleaning device 400 travels from the second wafer portion 132b to the third wafer portion 132c, and the objective lens 302 relatively travels from the first wafer portion 132a to the second Wafer portion 132b. Prior to inspection of the wafer portion 132, this advantageously allows each wafer portion 132 to be cleaned by the second cleaning device 400 due to the activation and operation of the pump assembly 218 along with the set of holes 402. For example, the nth wafer portion is cleaned between inspections. The wafer 108 is moved to allow detection of the nth wafer portion. At the same time, the (n+1)th wafer portion is cleaned during the nth wafer portion inspection. The (n+1)th wafer portion is subsequently detected. The test procedure 520 continues until all of the wafer portions 132 are cleaned by the second cleaning device 400 and detected by the detecting device 300, wherein each wafer portion 132 is cleaned prior to detection, specifically, only before detection or immediately after detection .

In some embodiments, the second cleaning device 400 remains stationary with the objective lens 302 of the detection device 300 while the wafer 108 is, for example, by a moving mechanism 128 for movement along the first set of tracks 28 and/or along a second set of tracks 110 is used for moving transport mechanism 112 to move. Wafer 108 thus During the detection process 520, it is transferred or moved along the scan motion path 136 under the set of apertures 402 and objective lens 302. Movement of wafer 108 along scan motion path 136 causes each wafer portion 132 to be cleaned and detected. Upon completion of the scan motion path 136, each wafer portion 132 of the wafer 108 has been cleaned and detected. The scan motion path 136 is preferably serrated so that each row of wafer portions 132 is cleaned and detected before the wafer 108 is transferred to the next row. Figure 9 shows an example of a zigzag scanning motion path 136. It is possible for the skilled person to readily understand the scanning motion path 136 of other shapes such as serpentine motion. In some alternative embodiments, the second cleaning device 400 and the objective lens 302 are movable while the wafer 108 remains stationary.

Thus, in accordance with various embodiments of the present invention, apparatus 100 is configured to remove particulate matter from wafer mount surface 106 and/or article/wafer 108 using at least one cleaning device, such as integrally formed cleaning device 200, thereby cleaning Wafer mount surface 106 and/or article/wafer 108 disposed thereon. Removal of particulate matter is performed by pump assembly 218 along with operation of group orifices 202. Thus, wafer mount surface 106 and/or article/wafer 108 utilize cleaning device 200 for cleaning procedures/processes.

In accordance with some alternative embodiments of the present invention, apparatus 100 is configured to clean wafer mount surface 106 and/or article/wafer 108 with first cleaning device 200 under a cleaning process/process. Further, device 100 is configured to clean article/wafer 108 disposed on wafer mount surface 106 with second cleaning device 400. Removal of particulate matter for cleaning wafer mount surface 106 and/or article/wafer 108 is performed by pump assembly 218 along with operation of group holes 202 and/or 402. Still further, device 100 is configured to detect object/wafer 108 with a detection device 300 while object/wafer 108 is moved and cleaned. Thus, in conjunction with the operation of the pump assembly 218 for the cleaning program/process 500/510 and the set of apertures 202 and/or 402, the article/wafer 108 is detected under the inspection procedure/process 520.

In the foregoing detailed description, an embodiment of the present invention relating to an apparatus and method for cleaning a surface of a semiconductor wafer mounting table and/or an article disposed thereon is described with reference to the accompanying drawings. The various embodiments described herein are not intended to be limited or limited to the specific or specific embodiments of the invention. The present invention is directed to solving at least some of the problems and difficulties mentioned in connection with the prior art. Although only a few embodiments of the invention are disclosed herein, it will be apparent to those skilled in the art that The scope of the invention and the following patent applications The scope is not limited to the embodiments described herein.

104‧‧‧Fabric fixed table

106‧‧‧ wafer mount surface

116‧‧‧Support arm

120a‧‧‧ First end of the surface of the wafer fixed table

120b‧‧‧ second end of the surface of the wafer fixed table

122‧‧‧First sensor

124‧‧‧Second sensor

22‧‧‧X-axis

24‧‧‧Y-axis

26‧‧‧Z-axis

200‧‧‧cleaning device/first cleaning device

L1‧‧‧ total length

W1‧‧‧ total width

Claims (28)

An apparatus for cleaning a surface of a wafer mounting table and/or an object disposed thereon, the apparatus comprising: a wafer fixing station assembly including a wafer fixing station, the wafer fixing station providing a wafer fixing station a surface of the wafer mounting table configured to securely secure the article disposed thereon; at least one cleaning device disposed over the surface of the wafer mounting table such that the surface of the wafer is fixed along the wafer The bobbin forms a space gap between each cleaning device and the surface of the wafer fixing table, each cleaning device having a set of holes directed toward the surface of the wafer fixing table along the illegal line direction; a set of inner cavities, fluidly coupled To the set of apertures of each of the cleaning devices, the set of lumens is further fluidly coupled to a pump source operable for fluid communication therein; and a moving mechanism configured to automatically move the wafer mount And causing the set of holes to pass at least a portion of the surface of the wafer holder; wherein fluid communication between the pump source and the set of chambers creates a pressure differential between the set of chambers and an environment outside the set of apertures such that flow The space passes through the space gap between the at least one hole of the set of holes and the surface of the wafer fixing table; and wherein the fluid passes through the space gap to cause particles on the surface of the wafer fixing table and/or the object to be Removal, thereby cleaning the wafer mount surface and/or the object. The device of claim 1, further comprising a control unit configured to automatically activate the pump source for operation of the pump source. The apparatus of claim 1, wherein each of the cleaning devices and the wafer fixing station are configured to move relative to each other while maintaining the space gap. The apparatus of claim 3, wherein the pump source is operable when the at least one cleaning device and the wafer fixing table are moved relative to each other. The apparatus of claim 3, wherein the moving mechanism is configured to move the wafer fixing station while each cleaning device remains stationary such that the crystal is under the at least one cleaning device The surface of the circular fixed table is at least partially swept. The apparatus of claim 3, wherein the at least one cleaning device is movable while the wafer fixing station remains stationary, such that the at least one cleaning device sweeps at least a portion of the wafer. Table surface. The apparatus of claim 1, wherein the at least one cleaning device is an integrally formed structure, and wherein the set of apertures is configured for at least one of fluid drainage and fluid absorption through the spatial gap. The apparatus of claim 7, wherein the set of holes comprises: a set of discharge holes configured to discharge fluid along the first illegal line direction to the surface of the wafer fixing table; and a set of absorption a hole configured to absorb fluid from the surface of the wafer fixing table along a second illegal line direction, wherein the normal axis of the surface of the wafer fixing table is inserted in the first illegal line direction and the second illegal line direction in. The apparatus of claim 8, wherein the pump source is operable for fluid absorption through the set of absorption orifices, or simultaneously or immediately responsive to fluid discharge through the set of discharge orifices. The apparatus of claim 1, wherein the set of holes comprises a first set of holes and a second set of holes, and wherein the at least one cleaning device comprises: a first cleaning having the first set of holes And a second cleaning device having the second set of apertures, wherein each of the first set of apertures and the second set of apertures are configured for at least fluid drainage and fluid absorption through the spatial gap one of them. The apparatus of claim 10, wherein each of the first set of holes and the second set of holes comprises: a set of venting holes configured to discharge fluid along the first illegal line direction to the surface of the wafer mounting table; and/or a set of absorbing holes configured to follow the direction of the second illegal line Fluid absorption at the surface of the wafer holder, wherein the normal axis of the surface of the wafer holder is inserted in the first illegal line direction and the second illegal line direction. The apparatus of claim 11, wherein, for each of the first set of holes and the second set of holes, the pump source is operable for fluid absorption through the set of absorption holes, or Immediately respond to fluid discharge through the set of vents. The apparatus of claim 10, further comprising a detecting device having an objective lens for detecting an object disposed on a surface of the wafer fixing table, wherein the first cleaning device is disposed away from the object A first position of the detecting device is provided, and the second cleaning device is disposed at a separate second position. The apparatus of claim 13, wherein the first cleaning device is movable by at least a portion of the surface of the wafer mounting table prior to the detecting process performed by the detecting device. The apparatus of claim 14, wherein the second cleaning device is movable by at least a portion of the surface of the wafer mounting table prior to the detecting process to clean the article disposed on at least a portion thereof. The device of claim 14 or 15, wherein the article comprises a plurality of sets of devices loaded by the wafer, and wherein the device is configured to activate the pump source prior to detecting each set of devices, The wafer moves along a scan motion path during the detection procedure. The apparatus of claim 13, wherein the second cleaning device is disposed at or near a bottom of the detecting device. The apparatus of claim 13 or 17, wherein the second cleaning device is disposed in an annular configuration surrounding the bottom of the detecting device. A method for cleaning a surface of a wafer mounting table and/or an object disposed thereon, the method comprising: providing a wafer fixing station assembly, the wafer fixing table assembly including a wafer fixing station, the wafer fixing The stage provides a wafer fixing table surface configured to stably hold the object disposed thereon; at least one cleaning device is provided, each cleaning device having a fixed orientation along the illegal line direction a set of holes in the surface of the table; each cleaning device is disposed on the surface of the wafer fixing table such that a normal axis along the surface of the wafer fixing table is formed between each cleaning device and the surface of the wafer fixing table a space gap; providing a set of lumens fluidly coupled to the set of apertures of each cleaning device; providing a pump source fluidly coupled to the set of lumens; operating the pump source for fluids with the set of lumens Connected; automatically moving the surface of the wafer holder with a moving mechanism such that the set of holes pass through at least a portion of the surface of the wafer mounting table; and creating a pressure differential between the set of chambers and the environment outside the set of holes, Passing a fluid through the space gap between the at least one aperture and the surface of the wafer fixture in response to operation of the pump source and fluid communication of the pump source with the set of lumens; wherein the fluid passes through the space gap to cause The wafer mount surface and/or particulate matter on the article is removed therefrom, thereby cleaning the wafer mount surface and/or the article. The method of claim 19, further comprising automatically activating the pump source with a control unit for operation of the pump source. The method of claim 19, further comprising moving the wafer fixing station with the moving mechanism while each cleaning device remains stationary such that at least a portion of the wafer fixing table surface under the at least one cleaning device is Sweep over. The method of claim 19, further comprising moving at least one cleaning And wherein the wafer mounting station remains stationary such that the at least one cleaning device sweeps across at least a portion of the wafer mounting surface. The method of claim 19, wherein the set of holes loaded by each cleaning device is configured for at least one of fluid discharge and fluid absorption to pass through the space gap. The method of claim 23, further comprising: discharging fluid to the surface of the wafer fixing station through a set of discharge holes along a first illegal line direction, the set of holes of the cleaning device including the group of emissions And absorbing fluid from the surface of the wafer fixing station through a set of absorption holes along a second illegal line direction, the set of holes of the cleaning device including the group of absorption holes; wherein the method of fixing the surface of the wafer The spool is inserted in the first illegal line direction and the second illegal line direction. The method of claim 24, wherein the fluid is discharged through the set of discharge holes while absorbing fluid through the set of absorption holes. The method of claim 19, further comprising providing an air layer from operation of the pump source, the air layer being directed from the set of apertures of the cleaning device to the surface of the wafer fixture and having at least The length of the total length of the wafer mount surface. The method of claim 19, further comprising detecting the object in a test procedure associated with operation of the pump source. The method of claim 27, wherein a portion of the article is cleaned by the at least one cleaning device prior to the detecting procedure.