WO2017086877A1

WO2017086877A1 - Apparatus and method for cleaning a wafer table surface and/or an object disposed thereon

Info

Publication number: WO2017086877A1
Application number: PCT/SG2015/050463
Authority: WO
Inventors: Jian Ping Jin; Tai Heng GAN
Original assignee: Semiconductor Technologies & Instruments Pte Ltd
Priority date: 2015-11-19
Filing date: 2015-11-19
Publication date: 2017-05-26
Also published as: TW201729333A

Abstract

The present disclosure relates to an apparatus for cleaning a wafer table surface and/or an object disposed thereon. The apparatus comprises: a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon; at least one cleaning device disposed above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface, each cleaning device carrying a set of orifices directed in a non-normal direction toward the wafer table surface; a set of internal chambers fluidically coupled to the set of orifices of each cleaning device; a pump assembly fluidically coupled to the set of internal chambers, the pump assembly operable for fluid communication with the set of internal chambers; and a displacement mechanism configured for automatically displacing the wafer table such that the set of orifices travels across at least portions of the wafer table surface. Fluid communication of the pump assembly with the set of internal chambers creates a pressure differential between the set of internal chambers and an environment external to the set of orifices to enable fluid transfer across the spatial gap between at least one orifice and the wafer table surface. The fluid transfer across the spatial gap causes particulate matter on the wafer table surface and/or the object to be removed therefrom, thereby cleaning the wafer table surface and/or the object.

Description

APPARATUS AND METHOD FOR CLEANING A WAFER TABLE SURFACE AND/OR AN OBJECT DISPOSED THEREON

Technical Field

The present disclosure generally relates to an apparatus and method for cleaning a wafer table surface. More particularly, aspects of the present disclosure are directed to an apparatus and method for cleaning a planar wafer table surface of a semiconductor wafer table structure and/or an object disposed on the wafer table surface.

Background

Semiconductor wafer processing operations involve the performance of various types of processing steps or sequences upon a semiconductor wafer upon which a number of dies (e.g. a large or very large number of dies) reside. The geometrical dimensions, line widths, or feature sizes of devices, circuits, or structures on each die are typically very small, for example, micron, submicron, or nanometre scale. Any given die includes a large number of integrated circuits or circuit structures that are fabricated, processed, and/or patterned on a layer-by-layer basis, for instance, by way of processing steps performed upon wafers sitting on planar wafer surfaces, such that the dies carried by the wafer are collectively subjected to the processing steps.

A wide variety of semiconductor device processing operations involve a number of handling systems that perform wafer or film frame handling operations which involve securely and selectively carrying (e.g. transporting, moving, displacing, or conveying) wafers or wafers mounted on film frames (hereinafter referred to as "film frame" for brevity) from one position, location, or destination to another, and/or maintaining wafers or film frames in particular positions during wafer or film frame processing operations. For instance, prior to the initiation of an optical inspection process, a handling system must retrieve a wafer or a film frame from a wafer or film frame source such as a wafer cassette, and transfer the wafer or film frame to the wafer table. The wafer table must establish secure retention of the wafer or film frame to its surface prior to the initiation of the inspection process, and must release the wafer or film frame from its surface after the inspection process is complete. Once the inspection process is complete, a handling system must retrieve the wafer or film frame from the wafer table, and transfer the wafer or film frame to a next destination, such as a wafer or film frame cassette or another processing system. A wafer table itself can be viewed or defined as a type of handling system, which must reliably, securely, and selectively position and hold a wafer or film frame on a wafer table surface while displacing the wafer or film frame relative to elements of a processing system, such as one or more light sources and one or more image capture devices corresponding to an optical inspection system.

In order to securely retain the wafer or film frame on the surface of the wafer table, the wafer table surface needs to be substantially planar. For handling die of very small size (e.g. 0.5 x 0.5 mm or smaller) and/or thickness (50 μιη or less - e.g. carried by a very thin and/or flexible wafer or substrate), this planarity requirement becomes even more critical. For wafers that are very thin, it is important for the wafer table to be ultra-planar, otherwise it is easy for one or more die on the wafer or film frame to become positioned out of the depth of focus during the inspection process. One of ordinary skill in the art will recognize that the smaller the die, the higher the magnification required, and hence the narrower the band of depth of focus in which the inspection plane must lie.

Other than the planarity of the wafer table surface, it is important to ensure that the wafer table surface does not contain any contaminants, impurities, and/or particulate matter that would affect the retention of the wafer or film frame on the wafer table surface. The presence of particulate matter, e.g. dust particles, results in the sawn wafers with small die sizes not sitting properly or uniformly on the chuck surface. More particularly, in regions where there are particles (and there can be many), the wafer or film frame can slightly bulge, due to a portion thereof being lifted upward away from the wafer table surface because the particles act as an obstacle therebetween. This results in the whole wafer surface lacking collective or common planarity across all dies, which is critical for optical inspection operations. This lack of planarity becomes more pronounced for small or very small die of sawn wafers. Further, the presence of a particle can cause die to be displaced at an angle relative to a common die inspection plane, or cause the die to tilt and sit at one or more different and higher planes. Residues and particulate matter can thus contaminate the wafer table surface and may subsequently contaminate the wafers or film frames which are placed on the wafer table surface, causing yield and reliability problems.

Prior to the commencement of and/or during the inspection process, it is similarly important to ensure that the wafer or film frame does not contain any contaminants, impurities, and/or particulate matter. Presence of particulate matter, e.g. dust particles, would affect the accuracy and efficiency of the inspection process. For example, if there is a dust particle present on a die of the wafer, inspection of the wafer would result in a determination that said die is defective. However, in actuality, the die merely has a dust particle sitting on top of it. The die could, and very likely is, non-defective if the dust particle was removed before inspection of the die. Inspecting a wafer or film frame with unwanted particulate matter, or that is tilted due to presence of particles underneath, will not contain or convey precise details and/or features of one or more regions of interest on the wafer or film frame, particularly the dies. This will adversely affect the quality of images captured during inspection, which can lead to inaccurate inspection results. Accordingly, a clean wafer table surface, as well as clean wafers or film frames, is necessary for the wafer and film frame to be in a planar or ultra-planar position that facilitates and enables accurate, high throughput wafer and/or film frame handling or processing operations, such as optical inspection processes. Cleaning is thus very important to ensure the removal of particulate matter and other unwanted materials that adhere to the wafer or film frame, such as silicon dust, silica, slurry residue, polymeric residue, metal flakes, atmospheric dust, plastic particles, and silicate particles.

Presently, cleaning the wafer or film frame may involve the using of deionized water, chemicals, or chemical solution applied to their surfaces with mechanical contact such as brush scrubbing. The wafer or film frame can be immersed in the deionized water / chemicals / chemical solution or the deionized water / chemical / chemical solution can be sprayed on the wafer or film frame. The wafer or film frame may then be subjected to a spin, rinse, and dry (SRD) cycle to further remove chemical residues or particulates. The wafer or film frame is subsequently in a dry state and ready for the next processing step. The complex steps of cleaning the wafers or film frames using specially produced compounds unfortunately delay the entire production process and increase costs. For cleaning the wafer table, the wafer table can be removed from service for cleaning, but this would also result in loss of productivity and increased costs.

The wafer table can be cleaned without being removed from service. For example, United States Patent 8,955,530 discloses the use of a cleaning cap to remove processing residues and particulates. The cleaning cap is configured to overlay and align with the wafer table and comprises a base, a roller, and cleaning cloths. The cleaning cloths rub the wafer table with translational and rotational motions. However, the physical contacts between the cleaning cloths and the wafer table may cause some contamination and/or damage to the wafer table, particularly the wafer table surface. A contaminated and/or damaged wafer table surface would be undesirable for inspection of a wafer or film frame mounted thereon.

United States Patent Publication 2003/0200996 introduces a method of cleaning a wafer table by an automated system that supplies a solvent to a wafer table surface and washes the wafer table surface. The automated system further dries the wafer table surface by spinning the wafer table. Alternatively, the automated system dries the wafer table surface by pulling a vacuum on the wafer table surface. Further alternatively, the automated system dries the wafer table surface by discharging a gas on the wafer table surface. A brush / sponge can also be used to wash the wafer table surface. However, the introduction of solvent (or any solutions / compounds) may cause some contamination and/or damage to the wafer table surface. In addition, the physical contact between the brush / sponge and the wafer table surface may also cause some contamination and/or damage to the wafer table surface. A contaminated and/or damaged wafer table surface would be undesirable for inspection of a wafer or film frame mounted thereon. Therefore, in order to address or alleviate at least one of the aforementioned problems and/or disadvantages, there is a need to provide an apparatus and method for cleaning a semiconductor wafer table surface, in which there are at least some improved features over the prior art.

Summary

According to a first aspect of the present disclosure, there is an apparatus for cleaning a wafer table surface and/or an object disposed thereon. The apparatus comprises: a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon; at least one cleaning device disposed above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface, each cleaning device carrying a set of orifices directed in a non-normal direction toward the wafer table surface; a set of internal chambers fluidically coupled to the set of orifices of each cleaning device, the set of internal chambers further being fluidically coupled to a pump source operable for fluid communication therewith; and a displacement mechanism configured for automatically displacing the wafer table such that the set of orifices travels across at least portions of the wafer table surface. Fluid communication of the pump source with the set of internal chambers creates a pressure differential between the set of internal chambers and an environment external to the set of orifices to enable fluid transfer across the spatial gap between at least one orifice and the wafer table surface. The fluid transfer across the spatial gap causes particulate matter on the wafer table surface and/or the object to be removed therefrom, thereby cleaning the wafer table surface and/or the object.

According to a second aspect of the present disclosure, there is a method for cleaning a wafer table surface and/or an object disposed thereon. The method comprises: providing a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon; providing at least one cleaning device, each carrying a set of orifices directed in a non-normal direction toward the wafer table surface; disposing each cleaning device above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface; providing a set of internal chambers fluidically coupled to the set of orifices of each cleaning device; providing a pump source fluidically coupled with the set of internal chambers; operating the pump source for fluid communication with the set of internal chambers; automatically displacing the wafer table with a displacement mechanism, such that the set of orifices travels across at least portions of the wafer table surface; and creating a pressure differential between the set of internal chambers and an environment external to the set of orifices that enables fluid transfer across the spatial gap between at least one orifice and the wafer table surface, in response to operation of the pump source and fluid communication of the pump source with the set of internal chambers. The fluid transfer across the spatial gap causes particulate matter on the wafer table surface and/or the object to be removed therefrom, thereby cleaning the wafer table surface and/or the object.

An advantage of the present disclosure is that the wafer table surface can be cleaned by blowing or sucking away particulate matter residing thereon. This would maintain the ultra-planarity of the wafer table surface when a wafer is placed on it. Further, by cleaning the wafer through the removal of particulate matter, the probability of detecting false defects (or false positives) can be reduced or eliminated. For example, non-defective devices / dies on the wafer are likely to be detected as having defects if the inspection process detects dust particles residing on it. If the dust particles have been removed by the cleaning apparatus, the inspection process would detect the devices / dies as non-defective. This would improve the efficiency of the inspection process and the eventual yield.

An apparatus and method for cleaning a semiconductor wafer table surface and/or an object disposed thereon according to the present disclosure is thus disclosed hereinabove. Various features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description of the embodiments of the present disclosure, by way of non-limiting examples only, along with the accompanying drawings in which like numerals represent like components. Brief Description of the Drawings

FIG. 1 A and FIG. 1 B are illustrations of a wafer / film frame handling system comprising an apparatus with one cleaning device, according to an embodiment of the present disclosure.

FIG. 2A is an illustration of the wafer / film frame handling system with a wafer, according to an embodiment of the present disclosure. FIG. 2B is an illustration of the wafer / film frame handling system with a film frame, according to an embodiment of the present disclosure.

FIG. 3 is an illustration of a wafer table with the first cleaning device, according to an embodiment of the present disclosure.

FIG. 4A to FIG. 4C are illustrations of the first cleaning device, according to an embodiment of the present disclosure.

FIG. 5A is an illustration of a cross-section of the first cleaning device, according to an embodiment of the present disclosure.

FIG. 5B is an illustration of a block diagram of components of the apparatus for operation of the first cleaning device. FIG. 5C to FIG. 5E are illustrations of arrangements of orifices of the first cleaning device.

FIG. 6A to FIG. 6C are illustrations of a wafer / film frame handling system comprising an apparatus with two cleaning devices and an inspection apparatus, according to an embodiment of the present disclosure.

FIG. 7 is an illustration of a second cleaning device, according to an embodiment of the present disclosure. FIG. 8A to FIG. 8D are illustrations of arrangements of orifices of the second cleaning device. FIG. 9 is an illustration of a wafer disposed on a wafer table of the apparatus, according to an embodiment of the present disclosure.

FIG. 10A and FIG. 10B are illustrations of block diagrams of control units, according to an embodiment of the present disclosure.

FIG. 1 1 A and FIG. 1 1 B are illustrations of flow charts for a cleaning procedure / process, according to an embodiment of the present disclosure.

FIG. 1 1 C is an illustration of a flow chart for a cleaning and inspection procedure / process, according to an embodiment of the present disclosure.

Detailed Description

In the present disclosure, depiction of a given element or consideration or use of a particular element number in a particular FIG. or a reference thereto in corresponding descriptive material can encompass the same, an equivalent, or an analogous element or element number identified in another FIG. or descriptive material associated therewith. The use of 7" in a FIG. or associated text is understood to mean "and/or" unless otherwise indicated. The recitation of a particular numerical value or value range herein is understood to include or be a recitation of an approximate numerical value or value range, for instance, within +/- 20%, +/- 15%, +/- 10%, +/- 5%, or +/- 0%. With respect to recitations herein directed to dimensional or numerical comparisons or equivalence, reference to the terms "generally," "approximately," or "substantially" is understood as falling within +/- 20%, +/- 15%, +/- 10%, +/- 5%, or +/- 0% of a representative / example comparison, or a specified or target value or value range; and reference to the term "essentially" is understood as falling within +/- 10%, +/- 5%, +/- 2%, +/- 1 %, or +/- 0% of a representative / example comparison, or a specified or target value or value range. As used herein, the term "set" corresponds to or is defined as a non-empty finite organization of elements that mathematically exhibits a cardinality of at least 1 (i.e., a set as defined herein can correspond to a unit, singlet, or single element set, or a multiple element set), in accordance with known mathematical definitions (for instance, in a manner corresponding to that described in An Introduction to Mathematical Reasoning: Numbers, Sets, and Functions, "Chapter 1 1 : Properties of Finite Sets" (e.g. as indicated on p. 140), by Peter J. Eccles, Cambridge University Press (1998)). In general, an element of a set can include or be a system, an apparatus, a device, a structure, an object, a process, a physical parameter, or a value depending upon the type of set under consideration.

For purposes of brevity and clarity, descriptions of embodiments of the present disclosure are directed to an apparatus and method for cleaning a semiconductor wafer table surface and/or an object disposed thereon, in accordance with the drawings in FIG. 1 A to FIG. 9. While aspects of the present disclosure will be described in conjunction with the embodiments provided herein, it will be understood that they are not intended to limit the present disclosure to these embodiments. On the contrary, the present disclosure is intended to cover alternatives, modifications and equivalents to the embodiments described herein, which are included within the scope of the present disclosure as defined by the appended claims. Furthermore, in the following detailed description, specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be recognized by an individual having ordinary skill in the art, i.e. a skilled person, that the present disclosure may be practiced without specific details, and/or with multiple details arising from combinations of aspects of particular embodiments. In a number of instances, well-known systems, methods, procedures, and components have not been described in detail as not to unnecessarily obscure aspects of the embodiments of the present disclosure. For purpose of brevity and to aid understanding, the term "object" as used herein can comprise a wafer, a partial wafer, a film frame on which a wafer or a portion thereof is mounted, or a set of devices or structures carried by the wafer, partial wafer, or film frame. The term "wafer" as used herein can encompass whole wafers, partial wafers, or other types of whole or partial objects or components (e.g. solar cells) having one or more planar surface areas upon which a set of optical inspection processes and/or other processing operations are desired or required. The term "film frame" in the description that follows generally refers to a support member or frame configured for carrying or supporting a wafer, a thinned or backlapped wafer, or a sawn wafer, for instance, by way of a thin layer or film of material that is disposed or stretched across a film frame surface area, and to which a wafer is mounted or adhered, in a manner understood by one of ordinary skill in the relevant art. Additionally, the term "wafer table" as used herein includes an apparatus for holding a wafer or a film frame during a wafer inspection process or a film frame inspection process, respectively, where the term "wafer table" will be understood by one of ordinary skill in the relevant art to correspond to or be equivalent, substantially equivalent, or analogous to a wafer chuck, a vacuum table, or a vacuum chuck. A wafer table comprising a wafer table providing a highly planar or ultra-planar wafer table surface in accordance with representative embodiments of the present disclosure can be used in association with or form a portion of a system for handling both wafers and film frames, such as an inspection system / apparatus as further detailed below. While embodiments of the present disclosure are directed to wafer and film frame inspection systems (e.g. optical inspection systems), other embodiments can additionally or alternatively be configured for supporting or performing other types of wafer and/or film frame front end or back end processing operations, such as test operations. Aspects of representative embodiments in accordance with the present disclosure are described in detail hereinafter based on wafer / film frame handling systems and/or inspection systems / apparatuses for purpose of brevity and to aid understanding.

The following description relates to aspects of some representative or exemplary embodiments of the present disclosure.

In representative or exemplary embodiments of the present disclosure, an apparatus for cleaning a semiconductor wafer table surface and/or an object disposed thereon, as well as a method for cleaning the semiconductor wafer table surface and/or the object disposed thereon, is described hereinafter.

By way of a single or unified wafer table configured for handling both wafers and film frames, embodiments in accordance with the present disclosure eliminate the need for or exclude a wafer table conversion kit, thus eliminating production downtime due to wafer-to-film frame and film frame-to-wafer conversion kit changeover and calibration operations, thereby enhancing average inspection process throughput. A single or unified wafer table facilitates or enables high accuracy inspection operations by providing a wafer table surface having a high or very high degree of planarity that maintains wafer die surfaces in a common inspection plane with minimal or negligible deviation therefrom.

FIG. 1 A illustrates a representative wafer / film frame handling system 20 which includes a cleaning apparatus 100. The apparatus 100 comprises a wafer table assembly 102 comprising a wafer table 104 providing a wafer table surface 106, which is configured for securely holding an object 108 disposed thereon. The wafer / film frame handling system 20 and apparatus 100 are thus configured for carrying, securely holding, and handling the object 108. The object 108 may be a wafer 108a or a film frame 108b. FIG. 2A illustrates the wafer / film frame handling system 20 configured for securely holding the wafer 108a. FIG. 2B illustrates the wafer / film frame handling system 20 configured for securely holding the film frame 108b. For purpose of brevity, the object 108 will hereinafter be referred to as a wafer 108, unless explicitly stated otherwise.

In some representative embodiments, the wafer table surface 106 of the apparatus 100 is configured for carrying and securely holding the wafer 108 disposed thereon. The wafer table surface 106 exhibits a high, very high, or ultra-high degree of planarity (e.g. planar to within +/- 50 - 200 μιη tolerance). The wafer 108 placed on the wafer table 104 will lay flatly on the wafer table surface 106, the wafer 108 squeezing out substantially all the air and/or fluid beneath it. The difference in atmospheric / environmental pressure between the upper and lower surfaces of the wafer 108 when the wafer 108 is disposed on the wafer table surface 106 results in a large force applied against the upper surface of the wafer 108 due to atmospheric pressure, holding the wafer 108 down strongly or reasonably strongly against the wafer table surface 106. As pressure is a function of surface area, the larger the size of the wafer 108, the greater the force applied downwards on the wafer 108. This is commonly referred to as the "inherent suction force" or "natural suction force" on the wafer. Further, the flatter the wafer table surface 106, the greater the natural suction force, up to the limit defined by the finite surface area of the wafer 108. A vacuum force may be applied through the wafer table 104 to the wafer table surface 106 to the lower surface of the wafer 108 to ensure that the wafer 108 remains as planar as possible and does not move during inspection, notwithstanding the presence of the natural suction force.

The wafer table 104 will be repeatedly accelerated over short distances, thereby displacing or translating the wafer table surface 106 and the wafer 108 disposed thereon, for purposes of inspection of the wafer 108 and each die residing in the wafer 108. Particularly, the wafer / film frame handling system 20 is configured to selectively and controllably displace or translate the wafer table 104 along two transverse spatial axes corresponding to or defining a plane. More particularly, the wafer table 104 is displaceable along at least a first spatial axis, i.e. an X-axis 22, and a second spatial axis, i.e. a Y-axis 24. The X-axis 22 and the Y-axis 24 are transverse relative to each other and correspond to or define a plane that is parallel relative to the wafer table surface 106. In addition, each of the X-axis 22 and the Y- axis 24 is transverse relative to a third spatial axis, i.e. a Z-axis 26. The Z-axis 26 is also referred to as a normal / perpendicular / orthogonal axis of the wafer table surface 106.

For example FIG. 1 B illustrates the wafer table assembly 102 being displaced or translated a distance along the X-axis 22, relative to the position of the wafer table assembly 102 as shown in FIG. 1 A. The displacement of the wafer table assembly 102 along the X-axis 22 correspondingly displaces the wafer table 104 and the wafer table surface 106 along the same direction. It would be readily understood by the skilled person that there are various mechanisms for configuring the wafer / film frame handling system 20 to displace or translate the wafer table 104 along at least one of the X-axis 22 and Y-axis 24. After the inspection process, the applied vacuum force is deactivated and ejector pins are deployed to lift the wafer 108 off of the wafer table surface 106, such that the wafer 108 can be retrieved or removed by an end effector or some other components. It would be apparent and readily understood by the skilled person that thicker wafers are more amenable to application of significant force applied through the ejector pins to lift the wafer 108 (against any residual suction force) without damage or breakage of the wafer 108.

As shown in FIG. 1 A and FIG. 1 B, the wafer / film frame handling system 20 provides a first set of tracks 28 along which the wafer table assembly 102 is displaceable toward or away (along the X-axis 22) from a predetermined loading position. The predetermined loading position is as shown in FIG. 1 A. In various embodiments, there may be a set of actuators or displacement mechanisms (not shown) which can drive or displace the wafer table assembly 102 (and correspondingly the wafer table 104 and wafer table surface 106) toward or away along the first set of tracks 28 from a predetermined loading position in association with a loading / unloading procedure, in a manner readily understood by one having ordinary skill in the relevant art. Further, the wafer table assembly 102 includes a second set of tracks 1 10 along which the wafer table 104 is displaceable toward or away (along the Y-axis 24) from a predetermined loading position. The displacement of the wafer table 104 along the Y-axis 24 correspondingly displaces along the Y- axis 24 the wafer table surface 106 and the wafer 108 disposed thereon. The wafer table assembly 102 comprises a conveyor mechanism 1 12, or any other displacement mechanism as readily known to a skilled person, for displacing or translating the wafer table 104 along the second set of tracks 1 10.

The wafer / film frame handling system 20 includes or operates in association with a wafer / film frame loading apparatus (not shown), which is configured for transferring individual objects 108 (e.g. wafers 108a or film frames 108b) from a wafer / film frame source or source locations onto the wafer table 104, specifically the wafer table surface 106, in association with a wafer / film frame loading procedure. Similarly, the wafer / film frame loading apparatus is configured for transferring individual objects 108 from the wafer table surface 106 to the wafer / film frame source or source locations, in association with a wafer / film frame unloading procedure. As described below, the wafer / film frame handling system 20 may include an inspection module or inspection system / apparatus configured for optically or visually inspecting at least existence, position, and/or orientation of an object 108 located on the wafer table surface 106, and/or configured for optically or visually inspecting at least an existence, size, and/or shape of particulate matter on wafer table surface 106, in association with an inspection procedure or process, as will be understood by one having ordinary skill in the relevant art. The wafer / film frame handling system 20 additionally or optionally includes a main controller or main control unit 34 (e.g. a computer, computer system, or computing device) having a processing unit and a memory in which one or more sets of program instructions reside. The program instructions can be executed by the processing unit such that the wafer / film frame handling system 20 performs the wafer and film frame loading/unloading procedures, and the apparatus 100 performs a cleaning procedure in accordance with embodiments of the present disclosure. FIG. 10A illustrates a block diagram of the functions of the main control unit 34. Further, the main control unit 34 can have data / signal communication, data storage, and/or information display devices / capabilities associated therewith, in a manner readily understood by those having ordinary skill in the relevant art.

In accordance with representative embodiments of the present disclosure, the cleaning procedure or process is performed by the apparatus 100, also referred to as the cleaning apparatus 100. Specifically, the apparatus 100 includes at least one cleaning device 200 disposed above the wafer table surface 106. Referring to the illustration in FIG. 3, the apparatus 100 includes at least one cleaning device 200 which is a unitary structure. Accordingly, the apparatus 100 consists of a unitary or single cleaning device 200. The cleaning device 200 is disposed vertically above the wafer table surface 106, such that a separation or spatial gap 1 14 is formed between the cleaning device 200 and the wafer table surface 106 along the Z-axis 26, which is the normal / perpendicular axis of the wafer table surface 106. The spatial gap 1 14 between the cleaning device 200 and the wafer table surface 106 is more readily apparent in the illustration in FIG. 5A, which shows that the spatial gap 1 14 has a height or separation distance H along the Z-axis 26.

As described above, the apparatus 100 includes the wafer table assembly 102. The wafer table 104 provides the wafer table surface 106 configured for carrying and securely holding the object or wafer 108. Particularly, the wafer table surface 106 provides an object carrying area whereon the wafer 108 is disposable. The object carrying area of the wafer table surface 106 has an overall length L1 and an overall width W1 , as indicated in FIG. 3.

The cleaning device 200 of the apparatus 100 is further elaborated with reference to FIG. 4A to FIG. 4C. In some representative embodiments, the cleaning device 200 comprises and carries a set of orifices / nozzles / holes / apertures 202 directed in a non-normal direction toward the wafer table surface 106. The non-normal direction as used herein is defined as being non-parallel relative to the Z-axis 26. In other words, the set of orifices 202 of the cleaning device 200 can be directed or orientated in any direction toward the wafer table surface 106, except along the vertical Z-axis 26. Looking at FIG. 4A and FIG. 4B, the cleaning device 200 has an elongated structure, e.g. a rod or a bar form, having an overall length L2. With reference to FIG. 3, the overall length L2 of the cleaning device 200 is at least equal to either the overall length L1 or width W1 of the wafer table surface 106. This advantageously allows the cleaning device 200 to clean the wafer table surface 106, particularly the object carrying area where the wafer 108 is disposed on, and/or the wafer 108 disposed thereon by displacement or translation in a single direction, i.e. along the X-axis 22. In some other embodiments, the overall length L2 of the cleaning device 200 may be shorter than the overall length L1 or width W1 of the wafer table surface 106. This would require the wafer table 104 to displace or translate along both the X-axis 22 and Y-axis 24 in order to clean the wafer table surface 106 and/or the wafer 108 disposed thereon.

The cleaning device 200 has an elongated structure with a first end 204a and a second end 204b. The overall length L2 of the cleaning device 200 spans or extends from the first end 204a to the second end 204b. The cleaning device 200 further comprises an upper elongated surface 206 and a lower elongated surface 208 between the first end 204a and the second end 204b. The cleaning device 200 further comprises a first oblique surface 210 and a second oblique surface 212. Each of the first oblique surface 210 and second oblique surface 212 joins the upper elongated surface 206 to the lower elongated surface 208. Accordingly, a cross- section of the cleaning device 200 as viewed from the XZ-plane (defined by the X- axis 22 and the Z-axis 26) has a trapezoidal form / shape / profile. FIG. 5A illustrates a magnified cross-section of the cleaning device 200 as viewed from the XZ-plane. The trapezoidal profile of the cross-section can be readily seen in FIG. 5A.

The set of orifices 202 carried by the cleaning device 200 is disposed along the elongated lower surface 208, as shown in FIG. 4C. The apparatus 100 comprises a set of internal chambers (not shown) that is fluidically coupled to the set of orifices 202 of the cleaning device 200. The set of internal chambers may be fluidically coupled or connected to a pump source that is located away from the apparatus 100. For example, the apparatus 100 may be operated in a facility / room / environment wherein there is an integrated or dedicated pump source for the facility. The pump source is thus operable for activating or effecting fluid communication with the set of internal chambers, thereby enabling fluid communication between the set of internal chambers and the set of orifices 202 of the cleaning device 200. Alternatively, the instead of using the pump source of the facility, the apparatus 100 may comprise a pump assembly 218 that is fluidically coupled or connected to the set of internal chambers. The pump assembly 218 is operable for activating or effecting fluid communication with the set of internal chambers, thereby enabling fluid communication between the set of internal chambers and the set of orifices 202 of the cleaning device 200. For purposes of brevity, some embodiments in the following description relates to the apparatus 100 comprising the pump assembly 218. However, it would be readily apparent to and understood by the skilled person that the apparatus 100 may be operable in a similar manner with a pump source that is located away from the apparatus 100 but within the same facility / room / environment as the apparatus. The set of orifices 202 of the cleaning device 200 is configured for at least one of fluid discharge and fluid suction across the spatial gap 1 14. Accordingly, a user of the apparatus 100 can operate the cleaning device 200 to effectuate fluid discharge from the set of orifices 202 across the spatial gap 1 14 toward the wafer table surface 106. Alternatively or additionally, the user can operate the cleaning device 200 to effectuate fluid suction from the wafer table surface 106 across the spatial gap 1 14 into the set of orifices 202.

The set of orifices 202 comprises a set of discharge orifices 214 configured for fluid discharge toward the wafer table surface 106. The set of discharge orifices 214 may also be referred to as blowers or fans. The set of discharge orifices 214 is configured for discharging or blowing a fluid across the spatial gap 1 14 toward the wafer table surface 106, along a non-normal direction, e.g. a first non-normal direction 30 that is not perpendicular relative to the planar wafer table surface 106. In the embodiment as shown in FIG. 5A, the first non-normal direction 30 is substantially parallel relative to the second oblique surface 212.

The set of orifices 202 further comprises a set of suction orifices 216 configured for fluid discharge toward the wafer table surface 106. The set of suction orifices 216 may also be referred to as vacuums. The set of suction orifices 216 is configured for sucking or suction of a fluid across the spatial gap 1 14 from the wafer table surface 106, along a non-normal direction, e.g. a second non-normal direction 32 that is not perpendicular relative to the planar wafer table surface 106. In the embodiment as shown in FIG. 5A, the second non-normal direction 32 is substantially parallel relative to the first oblique surface 210.

Referring to FIG. 5A, the first non-normal direction 30 and the non-normal second direction 32 forms an angle between each other, wherein a normal axis (along the direction of the Z-axis 26) of the wafer table surface 106 interposes or is between the first non-normal direction 30 and the second non-normal direction 32. Accordingly, the set of orifices 202 is thus directed in a non-normal direction toward the wafer table surface 106. The set of discharge orifices 214 is fluidically coupled to the set of internal chambers which is in turn fluidically coupled to the pump assembly 218 of the apparatus 100. As mentioned above, it would be readily apparent and understood by the skilled person that a pump source of the facility / room / environment of the apparatus 100 may be used instead of the pump assembly 218. The pump assembly 218 is coupled to or integrated with a source of fluid for communication to the set of internal chambers and the set of discharge orifices 214 for discharge therefrom. The fluid may be a pressurized gas such as clean dry air, nitrogen gas, or argon gas, etc. Other types of fluids or fluidic compounds may be used or selected based on the actual need, as readily understood by an individual having ordinary skill in the relevant art. Similarly, the set of suction orifices 216 is fluidically coupled to the set of internal chambers which is in turn fluidically coupled to the pump assembly 218. The set of suction orifices 216 is configured for drawing or extracting fluid away from the wafer table surface 106.

The pump assembly 218 may comprise a first set of pumps dedicated for discharge of fluid using the set of discharge orifices 214. A first set of internal chambers resides between the first set of pumps and the set of discharge orifices 214. The pump assembly 218 may further comprise a second set of pumps dedicated for suction of fluid using the set of suction orifices 216. A second set of internal chambers resides between the second set of pumps and the set of suction orifices 216. The activation and/or operation of the pump assembly 218 or the sets of pumps thereof, enable fluid communication with the respective sets of internal chambers. Fluid communication of the pump assembly 218 with the sets of internal chambers creates a pressure differential between the sets of internal chambers and an environment external to the sets of orifices 202.

For the set of discharge orifices 214, fluid communication between the first set of pumps and the first set of internal chambers creates a positive pressure differential between the first set of internal chambers and the environment external to the set of discharge orifices 214, e.g. the spatial gap 1 14. The positive pressure differential enables fluid transfer from the set of discharge orifices 214, specifically at least one orifice thereof, toward the wafer table surface 106. More particularly, the operation of the pump assembly 218 provides or generates a layer / blade of fluid / air directed from the set of discharge orifices 214 toward the wafer table surface 106.

For the set of suction orifices 216, fluid communication between the second set of pumps and the second set of internal chambers creates a negative pressure differential between the second set of internal chambers and the environment external to the set of suction orifices 216, e.g. the spatial gap 1 14. The negative pressure differential enables fluid transfer from the wafer table surface 106 toward the set of suction orifices 216, specifically at least one orifice thereof.

The fluid transfer across the spatial gap 1 14 between at least one orifice of the set of orifices 202 and the wafer table surface 106 advantageously causes particulate matter, e.g. dust particles and unwanted materials, which reside or adhere on the wafer table surface 106 and/or the wafer 1 08 to be removed therefrom. The operation of the pump assembly 218 provides or generates a layer / blade of fluid / air directed from the set of orifices 202 toward the wafer table surface 106. The air layer sweeps across the wafer table surface 106 and has a length extending across at least the overall length L1 or overall width W1 of the wafer table surface 106. The air layer assists in the removal of particulate matter from the wafer table surface 106. For example, fluid discharged from the set of discharge orifices 214 generates an air layer that blows the particulate matter away from the wafer table surface 106 and/or the wafer 108. Similarly, an air layer is generated during suction of fluid by the set of suction orifices 216. The suction of fluid from or through the air layer in turn sucks or extracts the particulate matter away from the wafer table surface 106 and/or the wafer 108. The removal of the particulate matter effectuates cleaning of the wafer table surface 106 and/or the wafer 108, advantageously without the use of chemicals or chemical compounds.

FIG. 5B illustrates a block diagram showing the relationship between a pump assembly 218, a set of internal chambers 220, and a set of orifices 202 of the cleaning apparatus 100. The set of orifices 202 may include at least one of the set of discharge orifices 214 and the set of suction orifices 216. The set of orifices 202 may be separated or segmented into a plurality of subsets of orifices 202a, 202b, 202c, and 202d. Similarly, the set of internal chambers 220 comprises a plurality of internal chambers 220a, 220b, 220c, and 220d that are separated / compartmentalized and fluidically sealed from one another. As such, there is no fluid communication between any pair of the plurality of internal chambers 220a, 220b, 220c, and 220d. Each subset of orifices 202a, 202b, 202c, and 202d is fluidically coupled to one internal chamber 220a, 220b, 220c, and 220d, respectively. Each internal chamber 220a, 220b, 220c, and 220d is fluidically coupled to the pump assembly 218 via a channel 222a, 222b, 222c, and 222d, respectively. All the channels 222a, 222b, 222c, and 222d converge at the pump assembly 218, such that a single or unitary pump assembly 218 can effectuate fluid communication to the other components.

An advantage of the arrangement as shown in FIG. 5B is that each internal chamber 220a, 220b, 220c, or 220d is associated with a single subset of orifices 202a, 202b, 202c, or 202d, respectively. Each single subset of orifices 202a, 202b, 202c, and 202d has a smaller number of orifices as compared to the entire set of orifices 202. This advantageously allows for more efficient and evenly distributed fluid communication as each internal chamber 202a, 202b, 202c, or 202d only needs to effectuate fluid communication with a smaller number of orifices. In contrast, if a single internal chamber 220 is used for the entire set of orifices 202, the fluid distribution across the set of orifices 202 will reduce the efficiency of fluid transfer therewith. When the pump assembly 218 is operating, each of the channels 222a, 222b, 222c, and 222d will be at the same pressure level. This results in each of the internal chambers 220a, 220b, 220c, and 220d being at the same pressure level, without interference or pressure leakage with other internal chambers. This further allows each subset of orifices 202a, 202b, 202c, and 202d to have a dedicated internal chamber 220a, 220b, 220c, or 220d. Further advantageously, each subset of orifices 202a, 202b, 202c, and 202d will have a substantially equal pressure or power with respect to one another. It would be readily apparent and understood by the skilled person that the number of subsets of orifices, number of internal chambers, and number of channels can be adjusted and varied depending on operation requirements, such as fluid flow rate and pressure levels. Referring back to FIG. 5A, the set of discharge orifices 214 discharges fluid toward the wafer table surface 106 along the first non-normal direction 30. The discharge of fluid (e.g. gas or air) toward the wafer table surface 106 assists in blowing away particulate matter that may be residing or adhering on the wafer table surface 106. For example, an air layer / blade or air current may be directed from the set of discharge orifices 214 toward the wafer table surface 106 with particulate matter residing thereon. Upon impact from the air current, the particulate matter will be subjected to a force therefrom and may be dislodged from the wafer table surface 106. As such, the particulate matter may be lifted away from the wafer table surface 106 such that they are no longer in contact with each other.

In addition, the set of suction orifices 216 sucks fluid from the wafer table surface 106 along the second non-normal direction 32. The suction of fluid or fluid transfer enables movement of fluid which may potentially carry particulate matter. For example, if air is being sucked away from the wafer table surface 106 toward the set of suction orifices 216, any particulate matter that is present in the air will also be sucked into the set of suction orifices 216. Accordingly, particulate matter that is dislodged and lifted away from the wafer table surface 106, due to the set of discharge orifices 214, may be sucked and extracted by the set of suction orifices 216.

The cleaning apparatus 100 may further comprise a control unit 36 configured for automatically activating the pump assembly 218 for operation thereof, such as for effectuating fluid communication through the set of orifices 202. FIG. 10B illustrates a block diagram of the functions of the control unit 36 of the cleaning apparatus 100. The pump assembly 218 may be operable for fluid suction through the set of suction orifices 216 simultaneously with fluid discharge through the set of discharge orifices 214. In other words, the cleaning device 200 can be operated to have fluid being discharged from the set of discharge orifices 214 to dislodge particulate matter from the wafer table surface 106, as well as to simultaneously have fluid being sucked into the set of suction orifices 216 to extract and remove the dislodged particulate matter. As such, there is a zero time difference between operation of the set of suction orifices 216 and operation of the set of discharge orifices 214. Alternatively, the control unit 36 may control the pump assembly 218 to activate operation of the set of suction orifices 216 in response to the activation of operation of set of discharge orifices 214. There may be a predetermined time duration between operation of the set of suction orifices 216 after operation of the set of discharge orifices 214. The predetermined time duration is in the order of milliseconds. This time duration would allow time for particulate matter to travel closer toward the set of suction orifices 216, after being dislodged from the wafer table surface 106 as a result of being blown by the set of discharge orifices 214. It would be understood by the skilled person that the predetermined time duration is adjustable, depending on operation requirements, particularly the height or separation distance H of the spatial gap 1 14. For example, a larger separation distance H of the spatial gap 1 14 would require more time for the dislodged particulate matter to travel closer to the set of suction orifices 216, thereby requiring a longer predetermined time duration. Thus, the combination of operations of the set of discharge orifices 214 and the set of suction orifices 216 effectively dislodges and removes particulate matter from the wafer table surface 106. The trapezoidal form of the cross-section of the cleaning device 200 has an advantage in that the set of discharge orifices 214 assists to blow and dislodge particulate matter toward the set of suction orifices 216 for extraction. Another advantage is that the lower elongated surface 208 significantly reduces the risk of any dislodged particulate matter from escaping upwards into the environment and escape the suction / extraction from the set of suction orifices 216. The angles a and β of the first non-normal direction 30 and the second non-normal direction 32, respectively, with respect to the wafer table surface 106, can theoretically be more than 0 degrees and less than 90 degrees. Preferably, the angle a and β is between 30 and 60 degrees, with an optimal angle of approximately 45 degrees. It would be readily understood by the skilled person that the angles a and β can be changed to optimize or adjust the removal of particulate matter from wafer table surface 106, depending on operation requirements. In addition, instead of linear non-normal directions, the orifices may be directed such that the discharge/suction of fluid follows a curved or curvilinear path / profile. The set of orifices 202, including the set of discharge orifices 214 and the set of suction orifices 216, of the cleaning device 200 is disposed on the lower elongated surface 208 thereof, as shown in FIG. 4C. In some representative embodiments, the set of discharge orifices 214 comprises a plurality of distinct apertures and the set of suction orifices 216 comprises a single or unitary elongated aperture. FIG. 5C shows an example of such arrangement of the set of orifices 202 distributed along the lower elongated surface 208. The set of discharge orifices 214, being in the form of a plurality of distinct apertures, allows for more dedicated fluid flow therefrom. The elongated suction aperture 216 is continuous and does not have separation structures as with the set of discharge orifices 214. This advantageously prevents any dislodged particulate matter from escaping suction / extraction, which could possibly occur if some of the particulate matter lands on such separation suctions. Another advantage is that, being a continuous length of aperture, the suction area of the aperture is larger and there is a higher probability of extracting particulate matter that is dislodged from the wafer table surface 106.

FIG. 5C only shows an exemplary arrangement of the set of orifices 202. Other arrangements, distributions, as well as aperture shapes and sizes, are possible, as readily known by the skilled person. FIG. 5D shows one other possible arrangement of the set of orifices 202. In another possible arrangement shown in FIG. 5E, the set of orifices 202 includes only the set of discharge orifices 214 or the set of suction orifices 216. Generally, the set of orifices 202 is distributed across a length that is substantially close or equal to the overall length L2 of the cleaning device 200. This advantageously allows the set of orifices 202 of the cleaning device 200 to remove particulate matter from the wafer table surface 106 by sweeping across in one direction, e.g. along the Y-axis 24.

In some representative embodiments, various parameters for operation of the pump assembly 218 may be selected. For example, the speed and direction of the fluid flow from the set of orifices 202 may be programmably selectable. Accordingly, the fluid flow rate and/or the angles a and β of the first non-normal direction 30 and the second non-normal direction 32, respectively, may be programmably selectable. A user may thus program or select the angles a and β to be more acute / obtuse relative to the wafer table surface 106, such as to optimize deflection effects or motions of particulate matter on the wafer table surface 1 06 when fluid or air is blown thereon. For example, a more acute angle may deflect particulate matter more easily toward the sides of the wafer table surface 106 for removal therefrom, e.g. by the suction orifices 216.

In addition, the mode of flow, such as constant or intermittent at predetermined intervals, may be programmably selectable. A fluid flow control mechanism 38 can be coupled to the set of orifices 202, the set of internal chambers, and/or the pump assembly 218. The control unit 36 of the apparatus 100 stores and transmits programmed instructions to program, define, and/or select the various parameters. For example, the fluid flow control mechanism 38 can include a valve capable of actuation between opened and closed positions corresponding to permitting and preventing fluid flow through the set of orifices 202.

The fluid flow control mechanism 38 can further be configured for selection of intermediate positions for progressively increasing / decreasing between the fully closed and open positions to provide proportionately greater / lesser opening of the valve. The fluid flow control mechanism 38 can also be used to realize the programmable selection of mode of the fluid flow. For example, the valve or possibly a second independent valve can be configured to provide constant or intermittent fluid flow. Accordingly, the flow rate through the set of orifices 202 and the mode of fluid flow can be controlled by the fluid flow control mechanism 38 and the valve(s), using the control unit 36 and the programmed instructions stored therein.

The fluid flow control mechanism 38 can further be configured for selecting the direction of fluid flow according to the programmed instructions transmitted by the control unit 36. For example, the fluid flow control mechanism 38 can include an actuator which is capable of turning the set of orifices 202 so that it directs fluid flow toward the wafer table surface 106 in a selected direction or orientation. Accordingly, the first non-normal direction 30 and the second non-normal direction 32 is part of the set of directions / orientations selectable by the fluid flow control mechanism 38 and the control unit 36. With reference to FIG. 1 A and FIG. 3, the apparatus 100 further comprises a supporting arm 1 16 configured for structurally holding / supporting the cleaning device 200 relative to the wafer table surface 106. The supporting arm 1 16 supports and maintains the set of orifices 202 stationary while the wafer table 104 is being displaced underneath. From the perspective of the cleaning device 200, the set of orifices 202 is travelling or traversing across at least a portion or portions of the wafer table surface 106. In an alternative embodiment, the cleaning device 200 may be configured to be displaceable relative to the wafer table surface 106 while the wafer table 104 remains stationary. Accordingly, the cleaning device 200 and the wafer table 104 are configured to be in relative motion with each other. Further, the supporting arm 1 16 is configured to maintain the spatial gap 1 14 between the cleaning device 200 and the wafer table surface 106 while the wafer table 104 and the cleaning device 200 are in relative motion with each other.

The pump assembly 218 is operable while the cleaning device 200 and the wafer table 104 are in relative motion with each other. This advantageously allows the cleaning device 200 to dislodge and remove particulate matter from the wafer table surface 106 while sweeping across the wafer table surface 106, thereby improving efficiency of the cleaning procedure. In some embodiments, the supporting arm 1 16 is configured for holding the cleaning device 200 stationary while the wafer table 104 is moving underneath. The wafer table assembly 102 is displaceable along the first set of tracks 28 while the cleaning device 200 remains stationary. The wafer table 104 may further be configured to be displaceable along the second set of tracks 1 10 by the conveyor mechanism 1 12. The displacement of the wafer table 104 relative to the stationary cleaning device 200 allows at least a portion or portions of the wafer table surface 106 to be swept beneath the cleaning device 200.

In some alternative embodiments, the cleaning device 200 is configured to be displaceable, e.g. via the supporting arm 1 16, while the wafer table 104 remains stationary, such that the cleaning device 200 is swept across at least portions of the wafer table surface 106. Accordingly, the wafer table 104, and correspondingly the wafer table surface 106, remains stationary while the cleaning device 200 is displaced along at least the direction of the X-axis 22. If necessary, the cleaning device 200 can also be displaced or moved along the direction of the Y-axis 24.

In accordance with various embodiments of the present disclosure, a cleaning procedure or process 500 / 510 using the apparatus 100 and the cleaning device 200 is described hereinafter, with reference to FIG. 1 1 A and FIG. 1 1 B.

After the wafer table 104 is positioned at the predetermined loading position in association with a loading procedure, the relative displacement between the cleaning device 200 and the wafer table 104 along the direction of the X-axis 22, e.g. by displacing the wafer table 104, progressively moves the set of orifices 202 across the overall width W1 of the object carrying area of the wafer table surface 106 of the wafer table 104, as viewed from the perspective of the wafer table surface 106. During the cleaning procedure 500 / 510, fluid transfer between the set of orifices 202 and the wafer table surface 106, by at least one of fluid discharge and fluid suction, while the cleaning device 200 and the wafer table 104 are in relative motion with each other.

The displacement of the wafer table 104 can be selectively or selectably activated / operated, such as by way of the control unit 36 of the apparatus 100, while maintaining the separation distance H of the spatial gap 1 14. Displacement mechanisms of the wafer / film frame handling system 20 can also be selectively or selectably activated / operated to displace or move the wafer table assembly 102 along the first set of tracks 28, thereby displacing the wafer table 104 relative to the cleaning device 200. Further, the conveyor mechanism 1 12 can be selectively or selectably activated / operated to displace or move the wafer table 104 along the second set of tracks 1 10, relative to the cleaning device 200. As readily understood by the skilled person, the various displacement mechanisms may be operable by means or elements such as wheels, pulleys, belts, chains, and/or gears. Thus, the various displacement mechanisms in the apparatus 100 can be selectively or selectably activated / operated to displace or move the wafer table 104, while keeping the cleaning device 200 stationary, to clean the wafer table surface 106, e.g. the object carrying area thereof, in accordance with the cleaning procedure 500 / 510. Alternatively, the wafer table 104 may be kept stationary while the cleaning device 200 is being displaced relatively thereto.

The flow chart as shown FIG. 1 1 A is a cleaning procedure or process 500 using the cleaning device 200 for a wafer table 104 without an object / wafer 108 disposed thereon, i.e. the wafer / film frame handling system 20 is unloaded. The flow chart as shown FIG. 1 1 B is a cleaning procedure or process 510 using the cleaning device 200 for a wafer table 104 with an object / wafer 108 disposed thereon, i.e. the wafer / film frame handling system 20 is loaded.

After the wafer table 104, with or without an object / wafer 108 disposed thereon, is positioned at the predetermined loading position, the displacement mechanisms of the apparatus 100 can be activated to move the wafer table 104 to a first cleaning position (e.g. an initial cleaning position at one end of the overall width W1 ) relative to the cleaning device 200. At the first cleaning position, the cleaning device 200 is disposed above the wafer table 104, such that the set of orifices 202 and a first end 120a of the wafer table surface 106 are within the same vertical plane or YZ-plane (defined by the Y-axis 24 and the Z-axis 26) which is perpendicular relative to the X- axis 22. The first cleaning position of the wafer table 104 relative to the cleaning device 200 can be detected by a first sensor 122 (e.g. an optical sensor) coupled to the wafer table 104 at the first end 120a of the wafer table surface 106. Specifically, when a light source included in the first sensor 122 emits a light normal to or relative to the wafer table surface 106, the light can be reflected by the cleaning device 200 and received / detected by the first sensor 122, if the wafer table 104 is at the first cleaning position. Otherwise, no reflected light can be received / detected by the first sensor 122. The first sensor 122 provides corresponding feedback to the various displacement mechanisms to indicate whether the wafer table 104 is disposed at the first cleaning position relative to the cleaning device 200. The wafer table 104 is further moved along the first set of tracks 28 until the wafer table 104 is disposed at a second cleaning position (e.g. a final cleaning position at the opposite end of the overall width W1 ) relative to the cleaning device 200. At the second cleaning position, the cleaning device 200 is disposed above the wafer table 104, such that the set of orifices 202 and a second end 120b of the wafer table surface 106 are within the same vertical plane. The second cleaning position of the wafer table 104 relative to the cleaning device 200 can be detected by a second sensor 124 (e.g. an optical sensor) coupled to the wafer table 104 at the second end 120b. The operation of the second sensor 124 at the second cleaning position is analogous to the operation of the first sensor 122 described above for the first cleaning position. Similarly, the second sensor 124 also provides corresponding feedback to the various displacement mechanisms to indicate whether the wafer table 104 is disposed at the second cleaning position relative to the cleaning device 200.

Other types of sensors such as electrical and/or mechanical sensors, as readily known and understood by the skilled person, can also be used for detection of the first cleaning position and the second cleaning position of the wafer table 104 relative to the cleaning device 200. Further, although the above description generally describes displacement of the wafer table 104 relative to the cleaning device 200, it would be readily understood by the skilled person that, alternatively, the cleaning device 200 can be displaced relative to the wafer table 104. The second cleaning position of the wafer table 104 relative to the cleaning device 200 can also be determined by a predetermined time period that has elapsed from the time when the wafer table 104 is disposed at the first cleaning position relative to the cleaning device 200. The predetermined time period is calculated by the overall width W1 of the wafer table surface 106 divided by the speed of the displacement of wafer table 104 or the cleaning device 200 relative to the other. It should be noted that the overall width W1 of the wafer table surface 106 spans or extends from the first end 120a to the second end 120b. The speed of the displacement of the wafer table 104 relative to the cleaning device 200 may be programmably selectable with the control unit 36.

While the wafer table 104 is being moved from the first cleaning position to the second cleaning position relative to the cleaning device 200, the set of orifices 202 carried by the cleaning device 200 are progressively moved across the overall width W1 of the wafer table surface 106 in a relative manner, in association with a first phase of the cleaning procedure 500 / 510. After the wafer table 104 reaches the second cleaning position relative to the cleaning device 200, a wafer table / wafer / film frame inspection procedure or process can be initiated by the inspection module or inspection system / apparatus included in the wafer / film frame handling system 20. The inspection process inspects the wafer table surface 106 and/or an object / wafer 108 disposed thereon. The inspection system / apparatus will determine whether a second phase of the cleaning procedure 500 / 510 is required based on predetermined criteria and provide a corresponding feedback signal. An example of a predetermined criterion is a predetermined number of phases or iterations of the cleaning procedure 500 / 510. For instance, a user of the apparatus 100 may predefine the number of iterations to be two, such that the apparatus will automatically commence the second phase of the cleaning procedure 500 / 510 upon completion of the first phase. In the second phase of the cleaning procedure 500 / 510, the wafer table 104 will be moved from the second cleaning position back to the first cleaning position relative to the cleaning device 200, in a manner essentially identical or analogous to that described above for the first phase of the cleaning procedure 500 / 510. The second phase of the cleaning procedure 500 / 510 can also be initiated directly or immediately after the first phase of the cleaning procedure 500 / 510. Thus, the cleaning procedure 500 / 510 can be performed such that the wafer table 104 is (a) moved from the first cleaning position to the second cleaning position relative to the cleaning device 200, in a manner essentially identical or analogous to that described above for the first phase of the cleaning procedure 500 / 510; and then (b) moved from the second cleaning position back to the first cleaning position relative to the cleaning device 200, in a manner essentially identical or analogous to that described above for the second phase of cleaning procedure 500 / 510. This advantageously allows the wafer table surface 106 to sweep twice beneath the cleaning device 200, resulting in more effective cleaning of the wafer table surface 106 and/or the object 108 / wafer 108a / film frame 108b disposed thereon. Semiconductor wafer processing operations are often conducted and performed in a clean facility / room / environment to reduce the risks of or prevent contamination. As such, the wafer / film frame handling system 20 is normally operated or used in a clean facility. In the clean facility, there is constant air flow or air exchange to discharge contaminants, unwanted materials, and/or particulate matter away from the clean facility, thereby preventing, as far as possible, from coming into conduct with sensitive semiconductor components, e.g. wafers. In some embodiments of the present disclosure, the cleaning device 200 is configured for removal of particulate matter from the wafer table surface 106 and/or the wafer 108, thereby cleaning them. Any particulate matter that is dislodged from the wafer table surface 106 and/or the wafer 108 would also be caught in the constant air flow of the clean facility, and consequently be discharged away from the clean facility. Thus, in addition to the environmental conditions of the clean facility, the cleaning apparatus 100 helps to clean semiconductor components can significantly mitigate the risk of contamination.

The following description relates to various alterative aspects of alternative representative or exemplary embodiments of the present disclosure, particularly embodiments with an apparatus 100 having two or multiple cleaning devices. In some alternative embodiments of the apparatus 100 of the present disclosure, there is a wafer / film frame handling system 20 comprising the apparatus 100 and an inspection system or inspection apparatus 300, as illustrated in FIG. 6A. The apparatus 100 comprises a wafer table assembly 102 comprising a wafer table 104 providing a wafer table surface 106, which is configured for securely holding an object 108 disposed thereon. FIG. 6B illustrates the wafer / film frame handling system 20 carrying the object 108, which can be a wafer or film frame.

The apparatus 100 comprises at least one cleaning device 200 disposed above the wafer table surface 106, each cleaning device 200 carrying a set of orifices. Specifically, the at least one cleaning device 200 includes a first cleaning device 200 and a second cleaning device 400. The first cleaning device 200 is substantially similar to the single / unitary cleaning device 200 described for the aforementioned representative embodiments. The first cleaning device 200 carries a first set of orifices 202 and the second cleaning device 400 carries a second set of orifices 402.

The first set of orifices 202 of the first cleaning device 200 comprises at least one of (i) a set of discharge orifices 214 configured for fluid discharge along a first non- normal direction 30 to the wafer table surface 106; and (ii) a set of suction orifices 216 configured for fluid suction along a second non-normal direction 32 from the wafer table surface 106. The normal axis of the wafer table surface 106 is parallel relative to the Z-axis 26 and interposes or is between the first non-normal direction 30 and the second non-normal direction 32.

The second set of orifices 402 of the second cleaning device 400 comprises at least one of (i) a set of discharge orifices 414 configured for fluid discharge along a first non-normal direction to the wafer table surface 106; and (ii) a set of suction orifices 416 configured for fluid suction along a second non-normal direction from the wafer table surface 106. The normal axis of the wafer table surface 106 is parallel relative to the Z-axis 26 and interposes or is between the first and second non-normal directions. The apparatus 100 comprises a set of internal chambers that is fluidically coupled to each set of orifices 202 and 402. There may be a subset of internal chambers for each cleaning device 200 or 400. Further, there may be subsets of internal chambers for each set of discharge / suction orifices 214, 216, 414, and 416, or for a subset thereof. The apparatus 100 further comprises a pump source or pump assembly 218 that is fluidically coupled to the set(s) or subset(s) of internal chambers. The pump assembly 218 may include individual pumps for each cleaning device 200 or 400. Further, there may be individual pumps for each set of discharge / suction orifices 214, 216, 414, and 416, or for a subset thereof. It would be apparent and understood by the skilled person on the different possible configurations for the pump assembly 218, internal chambers, cleaning devices 200 and 400, and sets of orifices 202 and 402. The pump assembly 218 operable for activating or effecting fluid communication with the set of internal chambers, thereby enabling fluid communication between the set of internal chambers and the sets of orifices 202 and 402. Further details on the operation of the pump assembly 218, particularly in relation to the creation of pressure differentials between the set of internal chambers and an environment external to the set of orifices 202 and 402 will be readily understood by the skilled person based on the description in the earlier parts of the present disclosure.

As mentioned above, the apparatus 100 may include displacement mechanisms configured for automatically displacing the wafer table 104, based on the control unit 36 and programmed instructions therein. The displacement of the wafer table 104 indirectly enables the first set of orifices 202 and/or second set of orifices 402 to travel or traverse across at least a portion or portions of the wafer table surface 106, as viewed from the perspective of the wafer table surface 106. In some alternative embodiments, there may be separate displacement mechanisms or an integrated displacement mechanism configured for displacing each of the first cleaning device 200 and the second cleaning device 400 relative to the wafer table surface 106. Therefore, each of the first cleaning device 200 and the second cleaning device 400 and the wafer table 104 can be configured to be in relative motion with each other, while maintaining the separation distance H of the spatial gap 1 14. The pump assembly 218 is further operable while at least one of (i) the first cleaning device 200 and the wafer table 104 are in relative motion with each other; and (ii) the second cleaning device 400 and the wafer table 104 are in relative motion with each other. The wafer table 104 is displaceable while each of the first cleaning device 200 and the second cleaning device 400 remains stationary. For example, the wafer table assembly 102 is displaceable along the first set of tracks 28 by a displacement mechanism 128, thereby displacing the wafer table 104 along the direction of the X- axis 22. The wafer table 104 is also displaceable along the second set of tracks 1 10 by a conveyor mechanism 1 12, along the direction of the Y-axis 24. The displacement of the wafer table 104 relative to the stationary first cleaning device 200 and the stationary second cleaning device 400 allows at least a portion or portions of the wafer table surface 106 to be swept beneath at least one of the first cleaning device 200 and the second cleaning device 400.

With reference to FIG. 6C, the apparatus 100 comprises an inspection apparatus 300. The inspection apparatus 300 includes an objective lens 302 for inspecting the object / wafer 108 disposed on the wafer table surface 106 and/or the wafer table surface 106. The inspection apparatus 300 may alternatively include a set of or a plurality of objective lens 302, each having different specifications, e.g. focal length and aperture. The objective lens 302 is primarily configured for inspection of a wafer 108 disposed on the wafer table surface 106, such as checking for defects and comparing the inspection results against predetermined data.

Like the first cleaning device 200 and the second cleaning device 400, the objective lens 302 remains stationary while the wafer table 104 is being displaced. The objective lens 302 is thus able to be positioned relative to the wafer table surface 106 as a result of the displacement of the wafer table 104 relative to the objective lens 302. As shown in FIG. 6A and FIG. 6B, the first cleaning device 200 is disposed at a first location away from the inspection apparatus 300, and the second cleaning device 400 is disposed at a second location. The second location is distinct and away from the first location, thereby spatially separating the first cleaning device 200 and the second cleaning device 400 away from each other.

Alternatively, instead of the wafer table 104 being displaceable while the other components remain stationary, the first cleaning device 200, second cleaning device 400, and/or objective lens 302 can be configured to be displaceable while the wafer table 104 remains stationary, such that at least one of the first cleaning device 200, second cleaning device 400, and objective lens 302 is swept across at least portions of the wafer table surface 106. The second cleaning device 400 may further be configured for simultaneous displacement with the objective lens 302 relative to the wafer table surface. The simultaneous displacement of the second cleaning device 400 and the objective lens 302 advantageously allows the second cleaning device 400 to move together with the objective lens 302 during an inspection process, and further allows on-the-move cleaning of the object / wafer 108 during the inspection process.

The set of orifices 202 of the first cleaning device 200 is disposed along an elongated structure, while the set of orifices 402 of the second cleaning device 400 is disposed around a circular region. The set of orifices 404 of the second cleaning device 400 is configured for at least one of fluid discharge and fluid suction across the spatial gap 1 14. Accordingly, a user of the apparatus 100 can operate the second cleaning device 400 to effectuate fluid discharge from the set of orifices 402 across the spatial gap 1 14 toward the wafer table surface 106. Alternatively or additionally, the user can operate the second cleaning device 400 to effectuate fluid suction from the wafer table surface 106 across the spatial gap 1 14 into the set of orifices 402. The set of orifices 402 comprises a set of discharge orifices 41 4 configured for fluid discharge toward the wafer table surface 106. The set of discharge orifices 414 may also be referred to as blowers or fans. The set of discharge orifices 414 is configured for discharging or blowing a fluid across the spatial gap 1 14 toward the wafer table surface 106, along a first non-normal direction that is not perpendicular relative to the planar wafer table surface 106. The set of orifices 402 further comprises a set of suction orifices 416 configured for fluid discharge toward the wafer table surface 106. The set of suction orifices 416 may also be referred to as vacuums. The set of suction orifices 416 is configured for sucking or suction of a fluid across the spatial gap 1 14 from the wafer table surface 106, along a second non-normal direction that is not perpendicular relative to the planar wafer table surface 106. The directions of fluid discharge and suction for the set of orifices 402 of the second cleaning device 400 is largely similar or analogous to that for the first cleaning device 200, as shown in FIG. 5A. Particularly, the angles a and β of the non-normal directions, with respect to the wafer 108, can theoretically be more than 0 degrees and less than 90 degrees, as described above.

FIG. 7 shows an exemplary illustration of the second cleaning device 400. The second cleaning device 400 includes a set of discharge orifices 414. In the embodiment as shown in FIG. 7, the second cleaning device 400 does not include any suction orifices 416. The set of discharge orifices 414 discharges fluid toward the wafer table surface 106 along a non-normal direction. The discharge of fluid (e.g. gas or air) toward the wafer table surface 106 assists in blowing away particulate matter that may be residing or adhering on the object, e.g. a wafer 108, disposed on the wafer table surface 106. For example, an air layer / blade or air current may be directed from the set of discharge orifices 414 toward the wafer 108 with particulate matter residing thereon. Upon impact from the air current, the particulate matter will be subjected to a force therefrom and may be dislodged from the wafer 108. As such, the particulate matter may be blown away from the wafer 108 such that they are removed therefrom.

Additionally, in the embodiment as shown in FIG. 7, the inspection apparatus 300 includes a hollow space 304 for accommodating the objective lens 302. Accordingly, the objective lens 302 is configured for inspecting the wafer 108 through the hollow space 304. The second cleaning device 400, particularly the set of discharge orifices 414, is disposed and carried around the hollow space 304, thereby surrounding the objective lens 302. Further, the inspection apparatus 300 may include an illumination apparatus 306 disposed around the objective lens 302. The illumination apparatus 306 may be in the form of a ring or an array of light-emitting devices or illumination devices, configured for illuminating the wafer 108 for improved and clearer inspection thereof.

In some other embodiments, for the second cleaning device 400, a set of suction orifices 416 can be included for operation in conjunction with the set of discharge orifices 414 for removal of particulate matter, similar or analogous to the above description regarding the first cleaning device 200. The set of suction orifices 416 sucks fluid from the wafer 108 along a non-normal direction. The suction of fluid or fluid transfer enables movement of fluid which may potentially carry particulate matter. For example, if air is being sucked away from the wafer 108 toward the set of suction orifices 416, any particulate matter that is present in the air will also be sucked into the set of suction orifices 416. Accordingly, particulate matter that is dislodged and blown away from the wafer 108, due to the set of discharge orifices 414, may be sucked and extracted by the set of suction orifices 416.

The set of orifices 402, including the set of discharge orifices 414 and the set of suction orifices 416, of the second cleaning device 400 is disposed on a lower surface 408 of the second cleaning device 400, as shown in FIG. 8A. The set of discharge orifices 414 comprises a plurality of distinct apertures. The set of suction orifices 416 comprises a single or unitary aperture having a curvilinear shape or profile. As the suction orifice 416 is a continuous length of aperture, the suction area of the aperture is larger and there is a higher probability of extracting particulate matter that is dislodged from the wafer 108. FIG. 8A only shows an exemplary arrangement of the set of orifices 402. FIG. 8B to FIG. 8D show other possibilities of the arrangement of the set of orifices 402. However, other arrangements, distributions, as well as aperture shapes and sizes, are possible, as readily known by the skilled person.

Thus, the combination of operations of the set of discharge orifices 414 and the set of suction orifices 416 effectively dislodges and removes particulate matter from the wafer 108. The non-normal directions of fluid flow have an advantage in that the set of discharge orifices 414 assists to blow and dislodge particulate matter toward the set of suction orifices 416 for extraction. Another advantage is that the lower surface 408 of the second cleaning device 400 significantly reduces the risk of any dislodged particulate matter from escaping upwards into the environment and escape the suction / extraction from the set of suction orifices 416. Alternatively, the lower surface 408 may comprise the hollow space 304 that allows for accommodation of an objective lens 302, as described above.

In the embodiments as shown in FIG. 6A to FIG. 6C, the second cleaning device 400 is disposed at a distinct second location, relative to the wafer table surface 106, the second location being away from the first location of the first cleaning device 200. In one embodiment, the second cleaning device 400 may be configured and be disposed at or near the bottom portion 308 of the illumination apparatus 306 of the inspection apparatus 300. Alternatively or additionally, the second cleaning device 400 may be, or further, configured as or in a ring form and disposed beside, around, and/or to surround, the bottom portion / periphery of the illumination apparatus 306 of the inspection apparatus 300, if it is desired that the illumination be disposed nearer to the wafer surface 106 of the wafer 108 to be inspected. In either embodiment, the orifices 402 of the second cleaning device 400 are configured to direct a layer / blade of fluid / air onto the wafer surface 106 of a wafer 108 comprising a plurality or a set of dies. Specifically, the orifices 402 are configured to direct a layer / blade of fluid / air onto a surface of a die that is disposed in an inspection area under the illumination apparatus 306 for inspection of the wafer 108. The discharged air from the orifices 402 thus advantageously flush away any remaining foreign particles that may still reside on the die's surface. The hollow space 304 of the illumination apparatus 306 that allows for accommodation of the objective lens 302, specifically to allow the objective lens 302 to move into a position normal to the wafer surface 106 for image capture of the wafer 108 or die disposed below the objective lens 302. In the embodiment where the second cleaning device 400 is configured and disposed beside and to surround the illumination apparatus 306, the second cleaning device 400 has a ring form and the hollow space 304 allows the illumination apparatus 306 to reside therewithin such that the second cleaning device 400 is disposed adjacent to the set of objective lens 302. Further, the second cleaning device 400 and the objective lens 302 may be configured for simultaneous displacement with each other.

In accordance with various embodiments of the present disclosure, a cleaning procedure or process 500 / 510 using the apparatus 100 and the first cleaning device 200, as well as an inspection procedure or process 520 using the inspection apparatus 300 and the second cleaning device 400, further with reference to FIG. 1 1 C, is described hereinafter.

After the wafer table 104 is positioned at the predetermined loading position in association with a loading procedure, the wafer table 104 is displaceable relative to the first cleaning device 200 such that relative displacement and operation of the first cleaning device 200 cleans the wafer table surface 106. The cleaning of the wafer table surface 106 by the first cleaning device 200 is in accordance with the cleaning procedure / process 500 / 510 discussed above, particularly the first phase of the cleaning procedure 500 / 510. In addition, the second phase or subsequent phases of the cleaning procedure 500 / 510 may be performed on the wafer table surface 106, depending on the number of cycles or iterations required for cleaning by the first cleaning device 200. It would be understood by the skilled person based on the aforementioned description on the cleaning procedure or process 500 / 510.

Accordingly, the wafer table 104 is displaceable such that the first cleaning device 200 relatively travels across at least a portion or portions of the wafer table surface 106 for cleaning thereof, prior to an inspection process performed by the inspection apparatus 300. For the inspection process 520, an object or wafer 108 is loaded onto the wafer table surface 106 and securely mounted thereon. The first cleaning device 200 can be operated to perform an initial cleaning procedure on the wafer 108. The wafer table 104 is also displaceable relative to the second cleaning device 400. The displacement of the wafer table 104 can be selectively or selectably activated / operated, such as by way of the control unit 36 of the apparatus 100. Specifically, displacement mechanisms of the wafer / film frame handling system 20, e.g. the displacement mechanism 128 and the conveyor mechanism 1 12, can be selectively or selectably activated / operated to displace or move the wafer table assembly 102 or wafer table 104, thereby displacing the wafer 108 relative to the second cleaning device 400. Thus, the various displacement mechanisms in the apparatus 100 can be selectively or selectably activated / operated to displace or move the wafer table 104 relative to the second cleaning device 400 to clean and inspect the wafer 108, in accordance with the inspection process 520.

Referring to FIG. 9, the wafer 108 comprises multiple sets of devices (e.g. semiconductor dies). The wafer 108 may be separated or segmented into a plurality of wafer portions 132 in a grid-like or array form. Each of the plurality of wafer portions 132 contains one device / die or a subset of devices / dies.

The wafer 108 is displaced by the respective displacement mechanisms until the wafer 108 is disposed at a first inspection position underneath the second cleaning device 400. At the first cleaning position, the second cleaning device 400 is disposed above the wafer 108, such that the set of orifices 402 is disposed above a first wafer portion 132a, preferably at or near an outer edge 134 of the wafer 108. Detection mechanisms and/or sensors can be implemented to ascertain the correct positioning of the second cleaning device 400 with respect to the wafer 108.

The pump assembly 218 of the apparatus 100 is subsequently activated to enable the second cleaning device 400 to clean the first wafer portion 132a. The respective displacement mechanisms then displace the wafer 108 until the wafer 108 is disposed at a second or subsequent inspection position underneath the second cleaning device 400. At the second position, the second cleaning device 400 is disposed above the wafer 108, such that the set of orifices 402 is disposed above a second wafer portion 132b. At the same time, due to displacement of the wafer 108, the objective lens 302 of the inspection apparatus 300 is now disposed or positioned above the first wafer portion 132a. The inspection apparatus 300 is operable to inspect the first wafer portion 132a, particularly for defects on the device(s) / die(s) residing thereon, while the second cleaning device 400 cleans the second wafer portion 132b. Accordingly, the wafer 108 is displaceable such that the second cleaning device 400 relatively travels across at least a portion or portions of the wafer table surface 106, to clean at least a portion or portions of the object / wafer 108 disposed thereon during the inspection process 520.

The inspection process 520 continues with the displacement of the wafer 108, such that the second cleaning device 400 relatively travels from the second wafer portion 132b to a third wafer portion 132c, and the objective lens 302 relatively travels from the first wafer portion 132a to the second wafer portion 132b. This advantageously allows each wafer portion 132 to be cleaned by the second cleaning device 400, as a result of activation and operation of the pump assembly 218 together with the set of orifices 402, prior to the inspection of the wafer portion 132. For example, an nth wafer portion is cleaned prior to inspection. The wafer 108 is displaced to allow for inspection of the nth wafer portion. At the same time, the (n+ 7)th wafer portion is cleaned during inspection of the nth wafer portion. The (n+ 7)th wafer portion is subsequently inspected. The inspection process 520 continues until all wafer portions 132 are cleaned by the second cleaning device 400 and inspected by the inspection apparatus 300, wherein each wafer portion 132 is cleaned prior to inspection, specifically just prior to or immediately before inspection. In some embodiments, the second cleaning device 400 and the objective lens 302 of the inspection apparatus 300 remain stationary while the wafer 108 is being displaced, such as by the displacement mechanism 128 for displacement along the first set of tracks 28 and/or the conveyor mechanism 1 12 for displacement along the second set of tracks 1 10. The wafer 108 is thus being displaced or moved underneath the set of orifices 402 and the objective lens 302 along a scan motion path 136 during the inspection process 520. The displacement of the wafer 108 along the scan motion path 136 enables each wafer portion 132 to be cleaned and inspected. Upon completion of the scan motion path 136, every wafer portion 132 of the wafer 108 would have been cleaned and inspected. The scan motion path 136 is preferably in a zig-zag form, such that each row of wafer portions 132 is cleaned and inspected before the wafer 108 displaces to the next row. An example of a zig-zag form of the scan motion path 136 is shown in FIG. 9. Other forms of the scan motion path 136 are possible, such as serpentine motion, as would be readily known to the skilled person. In some alternative embodiments, the second cleaning device 400 and the objective lens 302 are displaceable while the wafer 108 remains stationary.

Therefore, in accordance with various embodiments of the present disclosure, the apparatus 100 is configured for removal of particulate matter from a wafer table surface 106 and/or an object / wafer 108 using at least one cleaning device, e.g. a unitary cleaning device 200, thereby cleaning the wafer table surface 106 and/or the object / wafer 108 disposed thereon. The removal of particulate matter is performed through operation of a pump assembly 218 in conjunction with a set of orifices 202. Accordingly, the wafer table surface 106 and/or an object / wafer 108 are subjected to a cleaning procedure / process using the cleaning device 200.

In accordance with some alternative embodiments of the present disclosure, the apparatus 100 is configured for cleaning the wafer table surface 106 and/or the object / wafer 108 disposed thereon using a first cleaning device 200 under the cleaning procedure / process. Further, the apparatus 100 is configured for cleaning the object / wafer 108 disposed on the wafer table surface 106 using a second cleaning device 400. The removal of particulate matter for cleaning of the wafer table surface 106 and/or the object / wafer 108 is performed through operation of a pump assembly 218 in conjunction with a set of orifices 202 and/or 402. Yet further, the apparatus 100 is configured for inspecting the object / wafer 108 using an inspection apparatus 300 while the object / wafer 108 is being displaced and cleaned. Accordingly, the object / wafer 108 is inspected under an inspection procedure / process 520, in association with operation of the pump assembly 218 and the set of orifices 202 and/or 402 for the cleaning procedure / process 500 / 510.

In the foregoing detailed description, embodiments of the present disclosure in relation to an apparatus and method for cleaning a semiconductor wafer table surface and/or an object disposed thereon are described with reference to the provided figures. The description of the various embodiments herein is not intended to call out or be limited only to specific or particular representations of the present disclosure, but merely to illustrate non-limiting examples of the present disclosure. The present disclosure serves to address at least some of the mentioned problems and issues associated with the prior art. Although only some embodiments of the present disclosure are disclosed herein, it will be apparent to a person having ordinary skill in the art in view of the present disclosure that a variety of changes and/or modifications can be made to the disclosed embodiments without departing from the scope of the present disclosure. The scope of the present disclosure as well as the scope of the following claims is not limited to embodiments described herein.

Claims

1 . An apparatus for cleaning a wafer table surface and/or an object disposed thereon, the apparatus comprising:

a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon;

at least one cleaning device disposed above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface, each cleaning device carrying a set of orifices directed in a non-normal direction toward the wafer table surface;

a set of internal chambers fluidically coupled to the set of orifices of each cleaning device, the set of internal chambers further being fluidically coupled to a pump source operable for fluid communication therewith; and

a displacement mechanism configured for automatically displacing the wafer table such that the set of orifices travels across at least portions of the wafer table surface,

wherein fluid communication of the pump source with the set of internal chambers creates a pressure differential between the set of internal chambers and an environment external to the set of orifices to enable fluid transfer across the spatial gap between at least one orifice and the wafer table surface; and

wherein the fluid transfer across the spatial gap causes particulate matter on the wafer table surface and/or the object to be removed therefrom, thereby cleaning the wafer table surface and/or the object.

2. The apparatus as in claim 1 , further comprising a control unit configured for automatically activating the pump source for operation thereof.

3. The apparatus as in claim 1 , wherein each cleaning device and the wafer table are configured to be in relative motion with each other while maintaining the spatial gap.

4. The apparatus as in claim 3, wherein the pump source is operable while at least one cleaning device and the wafer table are in relative motion with each other.

5. The apparatus as in claims 3 or 4, wherein the displacement mechanism is configured for displacing the wafer table while each cleaning device remains stationary, such that at least portions of the wafer table surface is swept beneath at least one cleaning device.

6. The apparatus as in claims 3 or 4, wherein at least one cleaning device is displaceable while the wafer table remains stationary, such that the at least one cleaning device is swept across at least portions of the wafer table surface.

7. The apparatus as in claim 1 , wherein the at least one cleaning device is a unitary structure, and wherein the set of orifices is configured for at least one of fluid discharge and fluid suction across the spatial gap.

8. The apparatus as in claim 7, wherein the set of orifices comprises:

a set of discharge orifices configured for fluid discharge along a first non-normal direction to the wafer table surface; and

a set of suction orifices configured for fluid suction along a second non- normal direction from the wafer table surface,

wherein the normal axis of the wafer table surface interposes the first and second non-normal directions.

9. The apparatus as in claim 8, wherein the pump source is operable for fluid suction through the set of suction orifices, simultaneous with or immediately in response to discharge of fluid through the set of discharge orifices.

10. The apparatus as in claim 1 , wherein the set of orifices comprises a first set of orifices and a second set of orifices, and wherein the at least one cleaning device comprises:

a first cleaning device carrying the first set of orifices; and a second cleaning device carrying the second set of orifices, wherein each of the first and second sets of orifices is configured for at least one of fluid discharge and fluid suction across the spatial gap.

1 1 . The apparatus as in claim 10, wherein each of the first and second sets of orifices comprises:

a set of discharge orifices configured for fluid discharge along a first non-normal direction to the wafer table surface; and/or

12. The apparatus as in claim 1 1 , wherein for each of the first and second sets of orifices, the pump source is operable for fluid suction through the set of suction orifices, simultaneous with or immediately in response to discharge of fluid through the set of discharge orifices.

13. The apparatus as in claim 10, further comprising an inspection apparatus having an objective lens for inspecting the object disposed on the wafer table surface, wherein the first cleaning device is disposed at a first location away from the inspection apparatus, and the second cleaning device is disposed at a distinct second location.

14. The apparatus as in claim 13, wherein the first cleaning device is displaceable across at least portions of the wafer table surface prior to an inspection process performed by the inspection apparatus.

15. The apparatus as in claim 14, wherein the second cleaning device is displaceable across at least portions of the wafer table surface to clean at least a portion of the object disposed thereon prior to the inspection process.

16. The apparatus as in claims 14 or 15, wherein the object comprises multiple sets of devices carried by a wafer, and wherein the apparatus is configured to activate the pump source prior to the inspection of each set of devices while the wafer is displaced along a scan motion path during the inspection process.

17. The apparatus as in claim 13, wherein the second cleaning device is disposed at or near a bottom portion of the inspection apparatus.

18. The apparatus as in claims 13 or 17, wherein the second cleaning device is disposed as a ring-form configuration around the bottom portion of the inspection apparatus.

19. A method for cleaning a wafer table surface and/or an object disposed thereon, the method comprising:

providing a wafer table assembly comprising a wafer table providing the wafer table surface, the wafer table surface configured for securely holding the object disposed thereon;

providing at least one cleaning device, each carrying a set of orifices directed in a non-normal direction toward the wafer table surface;

disposing each cleaning device above the wafer table surface such that a spatial gap is formed between each cleaning device and the wafer table surface along a normal axis of the wafer table surface;

providing a set of internal chambers fluidically coupled to the set of orifices of each cleaning device;

providing a pump source fluidically coupled with the set of internal chambers;

operating the pump source for fluid communication with the set of internal chambers;

automatically displacing the wafer table surface with a displacement mechanism, such that the set of orifices travels across at least portions of the wafer table surface; and

creating a pressure differential between the set of internal chambers and an environment external to the set of orifices that enables fluid transfer across the spatial gap between at least one orifice and the wafer table surface, in response to operation of the pump source and fluid communication of the pump source with the set of internal chambers,

20. The method as in claim 19, further comprising automatically activating the pump source with a control unit for operation thereof.

21 . The method as in claim 19, further comprising displacing, with the displacement mechanism, the wafer table while each cleaning device remains stationary, such that at least portions of the wafer table surface is swept beneath at least one cleaning device.

22. The method as in claim 1 9, further comprising displacing at least one cleaning device while the wafer table remains stationary, such that the at least one cleaning device is swept across at least portions of the wafer table surface.

23. The method as in claim 1 9, wherein the set of orifices carried by each cleaning device is configured for at least one of fluid discharge and fluid suction across the spatial gap.

24. The method as in claim 23, further comprising:

discharging fluid through a set of discharge orifices along a first non- normal direction to the wafer table surface, the set of orifices of a cleaning device comprising the set of discharge orifices; and

sucking fluid through a set of suction orifices along a second non- normal direction from the wafer table surface, the set of orifices of the cleaning device comprising the set of suction orifices,

25. The method as in claim 24, wherein sucking fluid through a set of suction orifices occurs simultaneously with or immediately in response to discharging fluid through a set of discharge orifices.

26. The method as in claim 1 9, further comprising providing a layer of air from operation of the pump source, the layer of air directed from the set of orifices of a cleaning device toward the wafer table surface and having a length extending across at least an overall length of the wafer table surface.

27. The method as in claim 19, further comprising inspecting the object in an inspection process in association with operation of the pump source.

28. The method as in claim 27, wherein a portion of the object is cleaned by the at least one cleaning device prior to the inspection process.