TW201725618A - Substrate cutting method characterized by reducing useless parts of frame shape as far as possible when cutting a main substrate to get a plurality of substrates - Google Patents
Substrate cutting method characterized by reducing useless parts of frame shape as far as possible when cutting a main substrate to get a plurality of substrates Download PDFInfo
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- TW201725618A TW201725618A TW105130743A TW105130743A TW201725618A TW 201725618 A TW201725618 A TW 201725618A TW 105130743 A TW105130743 A TW 105130743A TW 105130743 A TW105130743 A TW 105130743A TW 201725618 A TW201725618 A TW 201725618A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
本發明係關於一種基板切斷方法，尤其關於將使第1基板與第2基板藉由配置於該等之間之密封材而貼合之母基板沿密封材切斷之基板切斷方法。The present invention relates to a substrate cutting method, and more particularly to a substrate cutting method in which a mother substrate to which a first substrate and a second substrate are bonded together by a sealing material disposed between the first substrate and the second substrate is cut along a sealing material.
行動電話等之液晶顯示面板係將母基板切斷成複數個基板而形成。母基板係使2個基板藉由密封材貼合而形成。母基板係藉由於基板表面形成劃線之劃線步驟、與沿劃線對基板表面施加特定之力之切斷步驟而被切斷成複數個基板。 於劃線步驟中，劃線輪之刀尖被按壓於基板表面，且沿切斷預定線移動。於該劃線之形成時，使用具備劃線頭之劃線裝置。 例如，於專利文獻1，記述有用以自母基板切出液晶面板之方法。於該專利文獻1之方法中，首先，藉由形成有薄膜電晶體(TFT(Thin Film Transistor：薄膜電晶體))之基板、與形成有彩色濾光片(CF(Color Filter：彩色濾光片))之基板介隔密封材貼合，而形成母基板。且，藉由切斷該母基板，獲得各個液晶顯示面板。於切斷時，以2個基板貼合之狀態，以留出作為液晶注入區域之空間之方式，避開密封材而劃線。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2006-137641號公報A liquid crystal display panel such as a mobile phone is formed by cutting a mother substrate into a plurality of substrates. The mother substrate is formed by bonding two substrates together by a sealing material. The mother substrate is cut into a plurality of substrates by a step of forming a scribe line on the surface of the substrate and a cutting step of applying a specific force to the surface of the substrate along the scribe line. In the scribing step, the tip of the scribing wheel is pressed against the surface of the substrate and moved along the line to cut. When the scribing is formed, a scribing device having a scribing head is used. For example, Patent Document 1 describes a method for cutting out a liquid crystal panel from a mother substrate. In the method of Patent Document 1, first, a substrate on which a thin film transistor (TFT (Thin Film Transistor)) is formed, and a color filter (CF (Color Filter)) are formed. The substrate is bonded to the sealing material to form a mother substrate. Further, each of the liquid crystal display panels is obtained by cutting the mother substrate. At the time of cutting, in a state in which two substrates are bonded together, the space is used as a liquid crystal injection region, and the sealing material is used to scribe lines. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-137641
[發明欲解決之問題] 於專利文獻1之方法中，與被切斷之各個液晶顯示面板對應而形成有密封材。且，切斷線係設定於鄰接之液晶顯示面板之間，即，1個液晶顯示面板用之密封材、與鄰接之液晶顯示面板用之密封材之間。因此，若沿該切斷線切斷母基板，則於各液晶顯示面板之周圍，留出特定寬之框狀之未參與液晶顯示之部分。 因留出此框狀之部分，致使液晶顯示面板相對於框體之大小變窄，若欲採用面積較廣之液晶顯示面板，則必須增大框體，致使例如行動電話之整體大小變大。 本發明之目的在於，自母基板切斷獲得複數個基板時，儘量減少無用之框狀之部分。又，本發明之目的在於，於自母基板切斷獲得複數個基板時，容易進行切斷。 [解決問題之技術手段] (1)本發明之基板切斷方法係將使第1基板與第2基板藉由配置於該等之間之密封材而貼合之母基板沿密封材切斷之方法。該基板切斷方法包含密封材硬化步驟、及切斷步驟。密封材硬化步驟係對密封材照射雷射光，使密封材硬化。切斷步驟係將設置有硬化之密封材之部分作為切斷線而將母基板切斷成複數個基板。 以該方法，將設置有密封材之部分作為切斷線而將母基板切斷成複數個基板。因此，可將切斷之基板周圍之無用框狀部分設得非常窄。因此，可使組裝有所切斷之基板的裝置小型化。 又，密封材一般以樹脂形成，且具有彈性，因而直接以該狀態切斷設置有密封材之部分較為困難。然而，於本發明中，因對密封材照射雷射光使之硬化，使密封材變脆後進行切斷，故可容易地切斷設置有密封材之部分。 (2)較佳進而包含裂紋形成步驟作為密封材硬化步驟之前步驟。裂紋形成步驟係於第1基板及第2基板之設置有密封材之部分形成到達至密封材之裂紋。 此處，密封材一般以樹脂形成，因而存在若對密封材照射雷射光使之硬化，則由密封材產生氣泡之情形。若該氣泡侵入第1基板與第2基板之間，則有引起製品缺陷之虞。 因此，對密封材照射雷射光前，藉由預先於各基板上形成自密封材連通至外部之裂紋，使氣泡通過裂紋排出至外部。因此，可防止氣泡之產生引起製品之缺陷。 (3)較佳裂紋形成步驟包含以下步驟。 ・於第1基板之設置有密封材之部分，自第1基板之與密封材接觸之側相反側之第1面形成第1劃線之步驟。 ・於第2基板之設置有密封材之部分，自第2基板之與密封材接觸之側相反側之第2面形成第2劃線之步驟。 ・形成沿第1劃線到達至密封材之第1裂紋之步驟。 ・形成沿第2劃線到達至密封材之第2裂紋之步驟。 (4) 較佳切斷步驟包含以下步驟。 ・於第1基板之設置有密封材之部分形成第1劃線之步驟。 ・於第2基板之設置有密封材之部分形成第2劃線之步驟。 ・對母基板作用切斷力，將母基板沿各劃線切斷成複數個基板之步驟。 (5) 較佳密封材藉由熱硬化性樹脂形成。 (6) 較佳密封材藉由光硬化性樹脂形成。 [發明之效果] 如上述之本發明中，於自母基板切斷獲得複數個基板時，可儘量減少無用之框狀之部分。又，因使密封材硬化並切斷，故切斷變得容易。[Problem to be Solved by the Invention] In the method of Patent Document 1, a sealing material is formed corresponding to each of the liquid crystal display panels that are cut. Further, the cutting line is set between the adjacent liquid crystal display panels, that is, between the sealing material for one liquid crystal display panel and the sealing material for the adjacent liquid crystal display panel. Therefore, when the mother substrate is cut along the cutting line, a portion of a frame having a specific width which is not involved in liquid crystal display is left around each liquid crystal display panel. Since the frame-like portion is left, the size of the liquid crystal display panel is narrowed relative to the frame. If a liquid crystal display panel having a relatively large area is to be used, the frame must be enlarged, so that the overall size of, for example, the mobile phone becomes large. It is an object of the present invention to minimize the useless frame-like portion when cutting a plurality of substrates from the mother substrate. Further, an object of the present invention is to facilitate cutting when a plurality of substrates are obtained by cutting from a mother substrate. [Means for Solving the Problem] (1) The substrate cutting method according to the present invention is a method in which a mother substrate to which a first substrate and a second substrate are bonded together by a sealing material disposed between the first substrate and the second substrate is cut along the sealing material. method. The substrate cutting method includes a sealing material hardening step and a cutting step. The sealing material hardening step irradiates the sealing material with laser light to harden the sealing material. In the cutting step, the mother substrate is cut into a plurality of substrates by using a portion of the cured sealing material as a cutting line. In this method, the mother substrate is cut into a plurality of substrates by using a portion in which the sealing material is provided as a cutting line. Therefore, the useless frame-like portion around the cut substrate can be made very narrow. Therefore, it is possible to miniaturize the apparatus for assembling the cut substrate. Further, since the sealing material is generally formed of a resin and has elasticity, it is difficult to directly cut the portion in which the sealing material is provided in this state. However, in the present invention, since the sealing material is irradiated with laser light to be hardened, and the sealing material is cautious and then cut, the portion in which the sealing material is provided can be easily cut. (2) It is preferable to further include a crack forming step as a step before the sealing member hardening step. The crack forming step forms a crack reaching the sealing material in a portion where the sealing material is provided on the first substrate and the second substrate. Here, since the sealing material is generally formed of a resin, when the sealing material is irradiated with laser light to be hardened, bubbles are generated by the sealing material. When the air bubbles intrude between the first substrate and the second substrate, there is a flaw in the product. Therefore, before the laser beam is irradiated with the laser beam, the crack is communicated to the outside by forming a self-sealing material on each of the substrates in advance, and the air bubbles are discharged to the outside through the crack. Therefore, it is possible to prevent the occurrence of bubbles from causing defects in the article. (3) The preferred crack formation step comprises the following steps. The step of forming the first scribe line on the first surface of the first substrate opposite to the side where the sealing material is in contact with the portion of the first substrate on which the sealing material is provided. A step of forming a second scribe line on a second surface of the second substrate opposite to the side on which the sealing material is in contact with the second substrate.・The step of reaching the first crack of the sealing material along the first scribe line is formed.・The step of forming the second crack to the sealing material along the second scribe line is formed. (4) The preferred cutting step comprises the following steps. A step of forming a first scribe line on a portion of the first substrate on which the sealing material is provided. A step of forming a second scribe line on a portion of the second substrate on which the sealing material is provided. The step of cutting the mother substrate into a plurality of substrates along the respective scribe lines by applying a cutting force to the mother substrate. (5) A preferred sealing material is formed of a thermosetting resin. (6) A preferred sealing material is formed of a photocurable resin. [Effects of the Invention] In the above-described invention, when a plurality of substrates are cut from the mother substrate, the useless frame portion can be minimized. Moreover, since the sealing material is hardened and cut, the cutting becomes easy.
[母基板] 圖1係將作為切斷對象之母基板與先前者對比而顯示。圖1(a)係使用先前之切斷方法之情形之母基板1之俯視圖，圖1(b)係使用本實施形態之切斷方法之情形之母基板10之俯視圖。兩圖均透視顯示設置密封材2之部分。 如圖1(a)所示，使用先前之切斷方法之情形係於1個液晶顯示面板1a用之密封材2、與鄰接之液晶顯示面板1b用之密封材2之間，存在有未作為液晶顯示面板而發揮功能之部分1c。於該部分1c設定切斷線C。 另一方面，如圖1(b)所示，使用本實施形態之切斷方法之情形，於1個液晶顯示面板10a與鄰接之液晶顯示面板10b之間，僅形成有1個密封材2。且，切斷線C設定於形成有該密封材2之區域內。因此，於以本實施形態之切斷方法切斷之母基板10中，未作為液晶顯示面板發揮功能之部分幾乎不存在。因此，可自母基板更有效率地切出液晶顯示面板。又，因可大致除去所切出之液晶顯示面板之周圍之框狀之區域，故可將較大之液晶顯示面板收納於較小之框體。 [液晶顯示面板] 液晶顯示面板自身之構成係與先前之構成相同。即，如圖2所示，第1玻璃基板11及第2玻璃基板12經由密封材2貼合，構成貼合基板。且，於第1玻璃基板11與第2玻璃基板12之間之由密封材2包圍之區域，形成有成為液晶注入區域13之空間。又，雖未圖示，但於該液晶注入區域13，設置有用以維持第1玻璃基板11與第2玻璃基板12之間之間隙(單元間隙)之複數個間隔件。 [切斷方法：第1實施形態] 其次，使用圖3等針對切斷母基板10之方法進行說明。此處，於第1玻璃基板11中，將圖之上方側之面作為第1面11a，且將下方側之形成液晶注入區域13之面作為第2面11b。又，於第2玻璃基板12中，將圖之上方側之形成液晶注入區域13之面作為第1面12a，且將下方側之面作為第2面12b。 另，密封材2係以環氧樹脂形成，具有熱硬化性。即，密封材2係藉由加熱而硬化。作為密封材2，亦可為藉由紫外線之照射等而硬化之具有光硬化性之樹脂。 首先，如圖3(a)所示，於各玻璃基板11、12之與密封材2接觸之部分形成劃線SL1、SL2。具體而言，如圖2所示，於第1玻璃基板11之第1面11a，藉由機械劃線，而形成特定深度之第1劃線SL1。又，同樣，於第2玻璃基板12之第2面12b，藉由機械劃線，而形成特定深度之第2劃線SL2。第1劃線SL1與第2劃線SL2係設定於成為1條直線上之位置的位置。 其次，按壓第1玻璃基板11之第1劃線SL1之兩側，使垂直裂紋自第1劃線SL1開始伸展，並使垂直裂紋到達至密封材2。對於第2玻璃基板12，亦藉由同樣之步驟，形成第2劃線SL2，且使垂直裂紋自該第2劃線SL2開始伸展，並到達至密封材2。將該狀態顯示於圖3(b)中。 其次，如圖3(c)所示，自第1玻璃基板11之第1面11a側對密封材2照射雷射光L。藉由照射該雷射光L，使密封材2硬化且變脆。 此處，因對密封材2照射雷射光，且加熱，故自密封材2產生氣泡。若該氣泡侵入液晶注入區域13，則會引起製品之缺陷。然而，於該實施形態中，由於於利用雷射光L加熱前，形成有自密封材2連通至外部之垂直裂紋(第1及第2劃線SL1、SL2)，因而氣泡通過垂直裂紋排出至外部。因此，可防止氣泡侵入液晶注入區域13。 其次，如圖4所示，形成垂直裂紋(第1及第2劃線SL1、SL2)，且將硬化之密封材2之部分配置為自工作台15突出。其後，自上方按壓各劃線SL1、SL2之更外側(參照圖4之箭頭P)。藉由該按壓，如圖5所示，於密封材2之形成部分，即包含因硬化而變脆之密封材2，使第1玻璃基板11及第2玻璃基板12沿切斷預定線被切斷。 如上所述，根據該實施形態之方法，自母基板切出複數個液晶顯示面板時之良率提高。又，因於切出之液晶顯示面板之周圍幾乎不存在框狀之部分，故例如將該液晶顯示面板組裝入行動電話時，即便為同尺寸之液晶顯示面板亦可縮小框體，可使裝置小型化。再者，於切斷密封材2之部分時，因密封材2硬化且變脆，故可容易切斷包含密封材2之部分。 又，於照射雷射光L使密封材2硬化時，可不使由密封材2產生之氣泡侵入液晶注入區域13而排出至外部。因此，可防止氣泡之產生引起製品之缺陷。 [切斷方法：第2實施形態] 其次，對其他切斷方法進行說明。此處，作為切斷對象之母基板之構成及液晶顯示面板之構成與先前之實施形態同樣。 首先，如圖6(a)所示，自第1玻璃基板11之第1面11a側對密封材2照射雷射光L。因照射該雷射光L，密封材2硬化且變脆。 其次，如圖6(b)所示，於各玻璃基板11、12之與密封材2接觸之部分形成劃線SL1、SL2。該步驟係與先前之實施形態中圖3(a)及(b)之步驟同樣，於第1玻璃基板11之第1面11a及第2玻璃基板12之第2面12b，分別形成第1劃線SL1及第2劃線SL2。接著，按壓各劃線SL1、SL2之兩側，使垂直裂紋自各劃線SL1、SL2開始伸展，並使垂直裂紋到達至密封材2。 其次，將形成經硬化之密封材2及垂直裂紋(第1及第2劃線SL1、SL2)之部分配置為自工作台突出，其後，自上方按壓各劃線SL1、SL2之更外側。藉由該按壓，如圖6(c)所示，使密封材2之形成之部分，即包含因硬化而變脆之密封材2，使第1玻璃基板11及第2玻璃基板12沿切斷預定線被切斷。 根據該實施形態之方法，與上述實施形態同樣，自母基板切出複數個液晶顯示面板時之良率提高。又，因可將液晶顯示面板之周圍之框狀之部分設得非常窄，故可使組裝該液晶顯示面板之裝置小型化。再者，於切斷密封材2之部分時，因密封材2硬化且變脆，故可容易切斷。 [其他實施形態] 本發明並不限定於如以上所述之實施形態，在不脫離本發明之範圍內可進行各種變化或修正。 密封材之種類並非限定於上述實施形態者，只要為藉由雷射光之照射而硬化之材料，則可為任意材料。 又，於上述實施形態中，雖應用本發明作為製造液晶顯示面板時之方法，但本發明亦可同樣應用於其他基板之切斷。[Female substrate] Fig. 1 shows a mother substrate as a cutting target in comparison with the former. Fig. 1(a) is a plan view of the mother substrate 1 in the case where the previous cutting method is used, and Fig. 1(b) is a plan view of the mother substrate 10 in the case where the cutting method of the present embodiment is used. Both figures show in perspective the portion of the sealing material 2 that is provided. As shown in Fig. 1(a), the case where the previous cutting method is used is used between the sealing material 2 for one liquid crystal display panel 1a and the sealing material 2 for the liquid crystal display panel 1b adjacent thereto. A portion 1c that functions as a liquid crystal display panel. The cutting line C is set in this portion 1c. On the other hand, as shown in FIG. 1(b), in the case of the cutting method of the present embodiment, only one sealing material 2 is formed between one liquid crystal display panel 10a and the adjacent liquid crystal display panel 10b. Further, the cutting line C is set in a region where the sealing material 2 is formed. Therefore, in the mother substrate 10 cut by the cutting method of the present embodiment, the portion that does not function as a liquid crystal display panel hardly exists. Therefore, the liquid crystal display panel can be cut out more efficiently from the mother substrate. Moreover, since the frame-shaped area around the cut liquid crystal display panel can be removed substantially, a large liquid crystal display panel can be accommodated in a small frame. [Liquid Crystal Display Panel] The configuration of the liquid crystal display panel itself is the same as that of the prior art. In other words, as shown in FIG. 2, the first glass substrate 11 and the second glass substrate 12 are bonded together via the sealing material 2 to form a bonded substrate. Further, a space which is the liquid crystal injection region 13 is formed in a region surrounded by the sealing material 2 between the first glass substrate 11 and the second glass substrate 12. Further, although not shown, a plurality of spacers for maintaining a gap (cell gap) between the first glass substrate 11 and the second glass substrate 12 are provided in the liquid crystal injection region 13. [Cutting method: First embodiment] Next, a method of cutting the mother substrate 10 will be described with reference to Fig. 3 and the like. Here, in the first glass substrate 11, the surface on the upper side in the drawing is referred to as a first surface 11a, and the surface on the lower side in which the liquid crystal injection region 13 is formed is referred to as a second surface 11b. In the second glass substrate 12, the surface on which the liquid crystal injection region 13 is formed on the upper side in the drawing is referred to as a first surface 12a, and the surface on the lower side is referred to as a second surface 12b. Further, the sealing material 2 is formed of an epoxy resin and has thermosetting properties. That is, the sealing material 2 is hardened by heating. The sealing material 2 may be a photocurable resin which is cured by irradiation of ultraviolet rays or the like. First, as shown in FIG. 3(a), scribe lines SL1 and SL2 are formed in portions of the glass substrates 11 and 12 that are in contact with the sealing material 2. Specifically, as shown in FIG. 2, the first scribe line SL1 having a specific depth is formed on the first surface 11a of the first glass substrate 11 by mechanical scribing. Further, similarly, the second scribe line SL2 having a specific depth is formed on the second surface 12b of the second glass substrate 12 by mechanical scribing. The first scribe line SL1 and the second scribe line SL2 are set at positions that are at positions on one straight line. Then, both sides of the first scribe line SL1 of the first glass substrate 11 are pressed, and the vertical cracks are extended from the first scribe line SL1, and the vertical cracks are reached to the sealing material 2. In the second glass substrate 12, the second scribe line SL2 is formed in the same manner, and the vertical crack is extended from the second scribe line SL2 to reach the sealing material 2. This state is shown in Fig. 3(b). Next, as shown in FIG. 3(c), the sealing material 2 is irradiated with the laser light L from the first surface 11a side of the first glass substrate 11. By irradiating the laser light L, the sealing material 2 is hardened and becomes brittle. Here, since the sealing material 2 is irradiated with the laser light and heated, bubbles are generated from the sealing material 2 . If the bubble intrudes into the liquid crystal injection region 13, it causes defects in the product. However, in this embodiment, since the vertical cracks (the first and second scribe lines SL1 and SL2) that communicate with the outside of the self-sealing material 2 are formed before the heating by the laser light L, the bubbles are discharged to the outside through the vertical cracks. . Therefore, it is possible to prevent air bubbles from intruding into the liquid crystal injection region 13. Next, as shown in FIG. 4, vertical cracks (first and second scribe lines SL1, SL2) are formed, and portions of the cured sealing material 2 are arranged to protrude from the table 15. Thereafter, the outer sides of the scribe lines SL1 and SL2 are pressed from above (see an arrow P in FIG. 4). By this pressing, as shown in FIG. 5, the first glass substrate 11 and the second glass substrate 12 are cut along the line to cut along the portion where the sealing material 2 is formed, that is, the sealing material 2 which is brittle by hardening. Broken. As described above, according to the method of the embodiment, the yield is improved when a plurality of liquid crystal display panels are cut out from the mother substrate. Moreover, since there is almost no frame-like portion around the cut liquid crystal display panel, for example, when the liquid crystal display panel is incorporated in a mobile phone, the frame can be reduced even if the liquid crystal display panel of the same size is used. miniaturization. Further, when the sealing material 2 is cut, the sealing material 2 is hardened and becomes brittle, so that the portion including the sealing material 2 can be easily cut. Further, when the sealing material 2 is cured by the irradiation of the laser light L, the air bubbles generated by the sealing material 2 are prevented from entering the liquid crystal injection region 13 and being discharged to the outside. Therefore, it is possible to prevent the occurrence of bubbles from causing defects in the article. [Cutting method: second embodiment] Next, another cutting method will be described. Here, the configuration of the mother substrate to be cut and the configuration of the liquid crystal display panel are the same as those of the previous embodiment. First, as shown in FIG. 6( a ), the sealing material 2 is irradiated with the laser light L from the first surface 11 a side of the first glass substrate 11 . Due to the irradiation of the laser light L, the sealing material 2 hardens and becomes brittle. Next, as shown in FIG. 6(b), scribe lines SL1 and SL2 are formed in portions of the glass substrates 11 and 12 that are in contact with the sealing material 2. This step forms the first stroke on the first surface 11a of the first glass substrate 11 and the second surface 12b of the second glass substrate 12, respectively, in the same manner as the steps of FIGS. 3(a) and 3(b) in the previous embodiment. Line SL1 and second line SL2. Next, both sides of each of the scribe lines SL1 and SL2 are pressed, and the vertical cracks are stretched from the scribe lines SL1 and SL2, and the vertical cracks are reached to the sealing material 2. Next, a portion where the cured sealing material 2 and the vertical cracks (the first and second scribe lines SL1 and SL2) are formed is arranged to protrude from the table, and thereafter, the outer sides of the scribe lines SL1 and SL2 are pressed from above. By this pressing, as shown in FIG. 6(c), the first glass substrate 11 and the second glass substrate 12 are cut along the portion where the sealing material 2 is formed, that is, the sealing material 2 which is brittle by curing. The predetermined line is cut. According to the method of the embodiment, as in the above-described embodiment, the yield is improved when a plurality of liquid crystal display panels are cut out from the mother substrate. Moreover, since the frame-shaped portion around the liquid crystal display panel can be made very narrow, the apparatus for assembling the liquid crystal display panel can be downsized. Further, when the sealing material 2 is cut, the sealing material 2 is hardened and becomes brittle, so that it can be easily cut. [Other Embodiments] The present invention is not limited to the embodiments described above, and various changes or modifications can be made without departing from the scope of the invention. The type of the sealing material is not limited to the above embodiment, and any material may be used as long as it is hardened by irradiation of laser light. Further, in the above embodiment, the present invention is applied as a method of manufacturing a liquid crystal display panel, but the present invention is also applicable to the cutting of other substrates.
1‧‧‧母基板
1a‧‧‧液晶顯示面板
1b‧‧‧液晶顯示面板
1c‧‧‧部分
2‧‧‧密封材
10‧‧‧母基板
10a‧‧‧液晶顯示面板
10b‧‧‧液晶顯示面板
11‧‧‧第1玻璃基板
11a‧‧‧第1面
11b‧‧‧第2面
12‧‧‧第2玻璃基板
12a‧‧‧第1面
12b‧‧‧第2面
13‧‧‧液晶注入區域
15‧‧‧工作台
C‧‧‧切斷線
L‧‧‧雷射光
P‧‧‧箭頭
SL1‧‧‧劃線(裂紋)
SL2‧‧‧劃線(裂紋)1‧‧‧ mother substrate
1a‧‧‧LCD panel
1b‧‧‧LCD panel
1c‧‧‧section
2‧‧‧ Sealing material
10‧‧‧ mother substrate
10a‧‧‧LCD panel
10b‧‧‧LCD panel
11‧‧‧1st glass substrate
11a‧‧‧1st
11b‧‧‧2nd
12‧‧‧2nd glass substrate
12a‧‧‧1st
12b‧‧‧2nd
13‧‧‧LCD injection area
15‧‧‧Workbench
C‧‧‧ cut line
L‧‧‧Laser light
P‧‧‧ arrow
SL1‧‧‧Dashing (crack)
SL2‧‧‧Dashing (crack)
圖1(a)、(b)係先前之母基板及依據本發明之一實施形態之母基板之俯視圖。 圖2係母基板之剖視圖。 圖3(a)～(c)係顯示本發明第1實施形態之切斷方法之裂紋形成步驟及密封材硬化步驟之圖。 圖4係顯示本發明第1實施形態之切斷方法之切斷步驟之圖。 圖5係所切斷之母基板之剖視圖。 圖6(a)～(c)係顯示本發明第2實施形態之切斷方法之各步驟圖。1(a) and 1(b) are plan views of a prior mother substrate and a mother substrate according to an embodiment of the present invention. 2 is a cross-sectional view of the mother substrate. 3(a) to 3(c) are diagrams showing a crack forming step and a sealing member curing step in the cutting method according to the first embodiment of the present invention. Fig. 4 is a view showing a cutting step of the cutting method according to the first embodiment of the present invention. Fig. 5 is a cross-sectional view of the mother substrate cut off. 6(a) to 6(c) are diagrams showing the steps of the cutting method according to the second embodiment of the present invention.
2‧‧‧密封材 2‧‧‧ Sealing material
11‧‧‧第1玻璃基板 11‧‧‧1st glass substrate
11a‧‧‧第1面 11a‧‧‧1st
11b‧‧‧第2面 11b‧‧‧2nd
12‧‧‧第2玻璃基板 12‧‧‧2nd glass substrate
12a‧‧‧第1面 12a‧‧‧1st
12b‧‧‧第2面 12b‧‧‧2nd
13‧‧‧液晶注入區域 13‧‧‧LCD injection area
L‧‧‧雷射光 L‧‧‧Laser light
SL1‧‧‧劃線(裂紋) SL1‧‧‧Dashing (crack)
SL2‧‧‧劃線(裂紋) SL2‧‧‧Dashing (crack)
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| JP2016000452A JP6638400B2 (en) | 2016-01-05 | 2016-01-05 | Substrate cutting method |
| JP??2016-000452 | 2016-01-05 |
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| JPWO2019131525A1 (en) * | 2017-12-27 | 2021-01-14 | 三星ダイヤモンド工業株式会社 | Scribe processing method and scribe processing equipment |
| JP7228883B2 (en) * | 2019-01-30 | 2023-02-27 | 三星ダイヤモンド工業株式会社 | Division method and break method |
| JP2021167257A (en) * | 2020-04-09 | 2021-10-21 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing device |
| WO2024018689A1 (en) * | 2022-07-22 | 2024-01-25 | パナソニックＩｐマネジメント株式会社 | Method for manufacturing glass panel unit, and glass panel unit assembly |
| WO2024018690A1 (en) * | 2022-07-22 | 2024-01-25 | パナソニックＩｐマネジメント株式会社 | Glass panel unit manufacturing method and glass panel unit assembly |
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| JP2006137641A (en) | 2004-11-12 | 2006-06-01 | Sanyo Electric Co Ltd | Cutting method of glass substrate |
| KR100881466B1 (en) * | 2004-12-28 | 2009-02-06 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for cutting brittle material substrate and substrate cutting system |
| KR20060081587A (en) * | 2005-01-10 | 2006-07-13 | 삼성전자주식회사 | Liquid crystal display and manufacturing method thereof |
| KR100956355B1 (en) * | 2008-06-10 | 2010-05-07 | 세메스 주식회사 | Scribing apparatus |
| KR20100000401A (en) * | 2008-06-24 | 2010-01-06 | 엘지디스플레이 주식회사 | Manufacturing method of display panel using the same |
| JP5070341B2 (en) * | 2008-09-12 | 2012-11-14 | シャープ株式会社 | Manufacturing method of display panel |
| KR101777134B1 (en) * | 2011-04-27 | 2017-09-11 | 엘지디스플레이 주식회사 | Method of fabricating liquid display panel |
| JP2014048432A (en) * | 2012-08-31 | 2014-03-17 | Mitsuboshi Diamond Industrial Co Ltd | Processing method of cell substrate |
| JP2014077912A (en) * | 2012-10-11 | 2014-05-01 | Japan Display Inc | Display device and method for manufacturing the same |
| KR101614379B1 (en) * | 2014-06-25 | 2016-04-21 | 한국미쯔보시다이아몬드공업(주) | Method for cutting of bonded substrate |
| CN104102051B (en) * | 2014-06-30 | 2016-08-17 | 京东方科技集团股份有限公司 | A kind of motherboard of liquid crystal display to cassette method, the liquid crystal display substrate of off-standard size |
| CN204215124U (en) * | 2014-12-03 | 2015-03-18 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
-
2016
- 2016-01-05 JP JP2016000452A patent/JP6638400B2/en not_active Expired - Fee Related
- 2016-09-23 TW TW105130743A patent/TWI656571B/en not_active IP Right Cessation
- 2016-10-10 KR KR1020160130421A patent/KR101876396B1/en active IP Right Grant
- 2016-10-19 CN CN201610911595.5A patent/CN106940487B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN106940487A (en) | 2017-07-11 |
| KR20170082120A (en) | 2017-07-13 |
| JP6638400B2 (en) | 2020-01-29 |
| CN106940487B (en) | 2021-02-05 |
| JP2017122015A (en) | 2017-07-13 |
| KR101876396B1 (en) | 2018-08-09 |
| TWI656571B (en) | 2019-04-11 |
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