KR102018580B1

KR102018580B1 - Liquid crystal display and method for fabricating the same

Info

Publication number: KR102018580B1
Application number: KR1020130063227A
Authority: KR
Inventors: 정한록
Original assignee: 엘지디스플레이 주식회사
Priority date: 2013-06-03
Filing date: 2013-06-03
Publication date: 2019-09-05
Also published as: KR20140141906A

Abstract

The present invention discloses a liquid crystal display and a method of manufacturing the same. According to the disclosed method for manufacturing a liquid crystal display device, a panel including a display area and a non-display area is formed by bonding a first substrate including a black matrix and a color filter and a second substrate including a thin film transistor to each other. A liquid crystal display device comprising: forming a black matrix second pattern on the first substrate in the non-display area, the black matrix first pattern having a line width less than or equal to the black matrix first pattern; Forming a real material between the first substrate and the second substrate to overlap the black matrix first pattern and the second pattern in the non-display area, and hardening the real material; Removing the black matrix first pattern through a burning process; Positioning a cutter on the first substrate on which the removed black matrix first pattern is formed, and cutting the panel.
Accordingly, the liquid crystal display device and the manufacturing method thereof according to the present invention may include a thin bezel by designing the distance between the cutting line and the real material to be small, thereby improving the vertical crack defect due to the tensile force of the real material, The quality of the cutting process is improved, and the black matrix pattern allows for positive judgment. In addition, it is possible to reduce the contamination of the cutting surface of the panel, and to enable the multi-pattern and the actual curing in both the lower substrate direction and the upper substrate direction to improve the adhesion of the real material to improve the reliability of the product.

Description

Liquid crystal display and its manufacturing method {Liquid crystal display and method for fabricating the same}

The present invention relates to a liquid crystal display device and a manufacturing method thereof, and more particularly, to a liquid crystal display device and a method for manufacturing the same, which improve the quality of the panel cutting process, improve the adhesion of the actual material, and are effective in determining whether the burning process is unsatisfactory. will be.

In line with the recent information age, the display field has also been rapidly developed, and as a flat panel display device (FPD) having the advantages of thinning, light weight, and low power consumption, a liquid crystal display device: LCD, plasma display panel device (PDP), electroluminescence display device (ELD), field emission display device (FED), etc. It is rapidly replacing ray tube (CRT).

Among them, the liquid crystal display device has been spotlighted as a next generation advanced display device having low power consumption, good portability, high technology value, and high added value. Among the liquid crystal display devices, an active matrix liquid crystal display device having a thin film transistor, which is a switching element that can control voltage on / off for each pixel, has the best resolution and video performance. It is attracting attention.

In addition, liquid crystal display devices are most actively used in fields such as notebooks, monitors, TVs, etc. due to their excellent contrast ratio and high contrast ratio. The liquid crystal display device applied to such various products requires a technology of making the edge of the display screen, that is, the bezel thinner, in order to improve the quality in terms of product design.

The conventional liquid crystal display includes a panel formed by cutting a bonded substrate divided into a non-display area and a display area in units of cells. The bonded substrate is formed by bonding an upper substrate including a color filter layer, a black matrix, and the like, and a lower substrate including a thin film transistor, a pixel electrode, and the like interposed therebetween.

The upper substrate is formed such that the real material and the black matrix overlap in the non-display area. For this reason, the actual curing UV cannot be irradiated from the upper substrate, and the actual curing UV is irradiated from the lower substrate. At this time, the UV irradiation aperture ratio should be secured at least 50% or more, and there is a limitation in narrowly designing the bezel.

In addition, the process of cutting the bonded substrate in units of cells may be cut and separated by placing a cutter on a cutting line and forming vertical cracks using characteristics of glass on the upper substrate and the lower substrate. At this time, when the cutting line is formed on the real material and the cutting process is performed using the cutting machine, the vertical crack is insufficiently formed on the substrate due to the tensile force of the real material, and a failure failure occurs. As a result of the experiment, vertical cracks were formed at about 570 μm in the region where no real material was formed, whereas vertical cracks were formed at 290 μm in the real region. Therefore, in consideration of the process margin and the tensile force of the material, the cutting line should be designed to maintain a constant distance of about 0.5mm from the outside of the material. Due to the gap between the actual material and the cutting line, there is a limit in designing a narrow bezel.

In addition, even when the process of removing the black matrix by burning or the like is considered, it is difficult to manage the burning line width, and when the black matrix is removed, there is a problem that the adhesive strength of the material is inferior.

SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which may include a thin bezel by designing a distance between a cutting line and an actual material.

Another object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which improves the quality of vertical cracks due to the tensile force of the material, thereby improving the quality of the substrate cutting process and reducing the contamination of the cutting surface of the panel. .

In addition, another object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which can improve the adhesive strength of a real material in a multi-pattern and improve the reliability of a product.

In addition, another object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which enables real curing to be performed in both the lower substrate direction and the upper substrate direction, thereby improving adhesion of the actual material.

In addition, another object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which are capable of making a positive determination through measurement and measurement of a burning process by vision inspection of a black matrix pattern.

In the liquid crystal display device manufacturing method of the present invention for solving the problems of the prior art as described above, the first substrate including the black matrix and the color filter and the second substrate including the thin film transistor are bonded to each other through the display area. And a panel including a black matrix first pattern and a black matrix first pattern on the first substrate in the non-display area, the black matrix agent having a line width equal to or less than that of the black matrix first pattern and the black matrix first pattern. Forming a pattern; Forming a real material between the first substrate and the second substrate to overlap the black matrix first pattern and the second pattern in the non-display area, and hardening the real material; Removing the black matrix first pattern through a burning process; Positioning a cutter on the first substrate on which the removed black matrix first pattern is formed, and cutting the panel.

In addition, the liquid crystal display device of the present invention is divided into a display area and a non-display area, a first substrate including a black matrix and a color filter layer in the display area and a second substrate including a thin film transistor in the display area; A liquid crystal display device comprising a panel including a material formed between the first substrate and a second substrate in the non-display area, wherein the material includes a black matrix pattern forming a concave-convex structure on the first substrate. It is formed so as to overlap, and the actual substrate and the first substrate is spaced apart from the outer end of the panel is characterized in that the empty space is formed.

The liquid crystal display device and the method of manufacturing the same according to the present invention have a first effect that a thin bezel can be included by designing the distance between the cutting line and the actual material to be small.

In addition, the liquid crystal display device and the manufacturing method thereof according to the present invention has a second effect of improving the quality of the vertical crack failure due to the tensile force of the real, improve the quality of the cutting process of the substrate, and reduce the contamination of the cutting surface of the panel have.

In addition, the liquid crystal display device and the manufacturing method thereof according to the present invention have a third effect of improving the adhesion of the real material in a multi-pattern and improving the reliability of the product.

In addition, the liquid crystal display device and the method of manufacturing the same according to the present invention have a fourth effect of enabling actual curing in both the lower substrate direction and the upper substrate direction to improve the adhesive force of the actual material.

In addition, the liquid crystal display according to the present invention and a method of manufacturing the same have a fifth effect that enables positive determination through measurement and measurement of a burning process by vision inspection of the black matrix pattern.

1 is a plan view illustrating a small model of the LCD substrate-attached substrate according to the present invention.
2 is a plan view illustrating a large-size model of a liquid crystal display bonding substrate according to the present invention.
3 is a cross-sectional view of a first substrate of a liquid crystal display according to the present invention.
4 is a cross-sectional view of a second substrate of a liquid crystal display according to the present invention.
5 is a cross-sectional view of a bonding substrate of a liquid crystal display according to a first embodiment of the present invention.
6 is a cross-sectional view of a bonding substrate of a liquid crystal display according to a second exemplary embodiment of the present invention.
7 is a cross-sectional view of a bonding substrate of a liquid crystal display according to a third exemplary embodiment of the present invention.
8 is a cross-sectional view of a burning process of the method of manufacturing a liquid crystal display device according to the present invention.
9 is a cross-sectional view illustrating a cutting process of a method of manufacturing a liquid crystal display according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a plan view illustrating a small model of the LCD substrate-attached substrate according to the present invention.

2 is a plan view illustrating a large-size model of a liquid crystal display bonding substrate according to the present invention.

1 and 2, the upper substrate and the lower substrate are bonded together with the liquid crystal layer and the substance 300 interposed therebetween, and the substance 300 is cured to form the bonded substrates 10 and 20. At this time, the bonded substrates 10 and 20 to which the upper substrate and the lower substrate are bonded are composed of a plurality of cells 50. The cell 50 is scribed using a cutter, and a cutting process is performed. When the cutting process is performed in units of the cells 50, the cells 50 form one panel 50.

The panel 50 includes a display area AA and a non-display area NA, respectively. The material 300 surrounds the display area AA and has a closed curve shape. In this case, a cutting line 40 is formed in an area overlapping the real material 300, and a substrate is scribed along a cutting line such as a diamond cutter along the cutting line 40 to perform a cutting process. Before scribing with a cutter, a burning process of removing the black matrix pattern of the region where the cutting line 40 is formed is performed.

Therefore, in the manufacturing method of the liquid crystal display according to the present invention, the cutting line 50 and the actual material 300 are not formed to be spaced apart from each other, but overlap the narrow bezel of the panel. A method of manufacturing such a liquid crystal display will be described in detail with reference to an enlarged cross-sectional view of region A of FIG. 1. A small model is described with reference to an enlarged cross-sectional view of area A of FIG. 1, but this technical feature may also be applied to a large model.

3 is a cross-sectional view of a first substrate of a liquid crystal display according to the present invention.

Referring to FIG. 3, the first substrate 100 of the liquid crystal display according to the present invention is divided into a display area AA and a non-display area NA, and the display area AA includes a plurality of pixel areas. do. In addition, the first substrate 100 includes a black matrix 102 and a color filter layer 103 on an insulating substrate 101 such as glass. Although not shown in the drawings, an overcoat layer, an alignment layer, and the like may be formed on the black matrix 102 and the color filter layer 103. The color filter layer 103 may include color filters of red (R), green (G), and blue (B) sequentially in the pixel area of the display area AA of the first substrate 100.

The black matrix 102 is formed in the black matrix first pattern 102a, the black matrix second pattern 102b and the black matrix third pattern 102c formed in the non-display area NA, and the display area AA. The black matrix fourth pattern 102d is formed. The black matrix fourth pattern 102d blocks light leakage from the display area AA such as a gate line, a data line, and a thin film transistor on a second substrate to a region other than the pixel area. ) Is formed into a structure.

The black matrix first pattern 102a formed in the non-display area NA is formed in an area corresponding to the cutting line in a later cutting process. The black matrix first pattern 102a may select a line width in consideration of a process margin of a cutting process. Preferably, it may be formed to 50 μm or more and 200 u μm or less. The black matrix first pattern 102a is a pattern that is later removed in the burning process, and prevents a vertical crack failure due to the tensile force of the material during the cutting process. As a result, a separate bezel is not required between the cutting line and the actual material, the bezel can be narrowly formed, and the quality of the cutting process can be improved.

The black matrix second pattern 102b formed in the non-display area NA is formed to be spaced apart from the black matrix first pattern 102a at the side of the black matrix first pattern 102a. The second pattern 102b may be formed on both sides of the black matrix first pattern 102a. In this case, the line width is the same as or smaller than the black matrix first pattern 102a, preferably 10 μm or more and 50 μm or less. In the drawing, three black patterns are formed on each side of the black matrix first pattern 102a. However, the black matrix second pattern 102b may be formed on two side surfaces of the black matrix first pattern 102a. It can be formed in five patterns, preferably in three patterns. The black matrix second pattern 102b formed of the plurality of patterns has a clear contrast depending on whether the pattern is burned for each pattern, so that it can be determined by vision inspection in a later process. In other words, it is possible to enable sophisticated burning. In addition, as the plurality of patterns form a concave-convex structure in the first substrate 100, and the material is filled between the pattern and the pattern, the contact area between the pattern and the material may be widened, and the adhesive strength after the actual hardening may be improved.

The black matrix third pattern 102c formed in the non-display area NA is formed at positions corresponding to both ends of the real material to be formed later. The black matrix third pattern 102c may prevent light from leaking into the non-display area NA, and the insulating substrate 101 may be disposed between the insulating substrate 101 of the first substrate 100 and the material. And may serve to fix and adhere the substance.

In addition, the black matrix first pattern 102a, the black matrix second pattern 102b, and the black matrix third pattern 102c formed in the non-display area NA surround the display area AA and have closed curve shapes, respectively. It can be formed as.

4 is a cross-sectional view of a second substrate of a liquid crystal display according to the present invention.

Referring to FIG. 4, the second substrate 200 of the liquid crystal display according to the present invention is divided into a display area AA and a non-display area NA. In the display area AA of the second substrate 200, a gate insulating layer 203 is interposed between insulating substrates 201, such as glass, and the gate wires and the data wires cross vertically to define pixel areas. In addition, a gate electrode 202 extending from the gate wiring, a gate insulating film 203, a semiconductor layer 204, a source electrode 205 extending from the data wiring, and a drain electrode are formed in the intersection region of the gate wiring and the data wiring. A thin film transistor (TFT) composed of 206 is formed. In addition, a passivation layer 207 is formed on the thin film transistor TFT, and a pixel electrode 208 is formed to be connected to the drain electrode 206 of the thin film transistor TFT through a contact hole formed in the passivation layer 207. do. Although not illustrated, an alignment layer may be further formed on the second substrate 200.

In the non-display area NA of the second substrate 200, the organic layer pattern 209 may be formed in a region corresponding to the region where the black matrix pattern of the first substrate is formed. The organic layer pattern 209 may be patterned together with the gate insulating layer 203 or the protective layer 207 formed in the display area AA. In addition, the organic layer pattern 209 may include an organic layer first pattern 209a and an organic layer second pattern 209b.

The organic layer first pattern 209a is formed in a region corresponding to the cutting line in a later cutting process. The organic layer first pattern 209a may be formed in the same shape as the black matrix first pattern of the first substrate. That is, the line width may be selected in consideration of the process margin of the cutting process. Preferably, it may be formed to 50 μm or more and 200 u μm or less.

In addition, the organic layer second pattern 209b is formed to be spaced apart from the organic layer first pattern 209a on the side of the organic layer first pattern 209a, and the organic layer second pattern 209b is It may be formed on both side surfaces of the organic layer first pattern 209a. In this case, the line width may be equal to or smaller than that of the organic layer first pattern 209a, and preferably, 10 μm or more and 50 μm or less. The organic layer second pattern 209b may be formed in the same shape as that of the black matrix second pattern of the first substrate. In the drawing, the organic film first pattern 209a is formed in three patterns on each side, but the organic film second pattern 209b is formed on two sides of the organic film first pattern 209a. It can be formed in five patterns, preferably in three patterns. The organic film second pattern 209b formed of the plurality of patterns forms a concave-convex structure in the second substrate 200, and as the material is filled between the plurality of patterns and the pattern, the contact area between the pattern and the material increases. Can improve the adhesive strength after actual curing.

5 is a cross-sectional view of a bonding substrate of a liquid crystal display according to a first embodiment of the present invention.

Referring to FIG. 5, the bonded substrate 10 of the liquid crystal display according to the first exemplary embodiment of the present invention may include a black matrix 102 and a color filter layer on the first insulating substrate 101. 103, the second substrate 200 is formed on the second insulating substrate 201, the gate electrode 202, the gate insulating film 203, the semiconductor layer 204, the source electrode 205 and the drain electrode And a pixel electrode 208 connected through the thin film transistor TFT including the thin film transistor TFT 206 and the passivation layer 207. The bonded substrate 10 is divided into a display area AA and a non-display area NA, and a real material 300 is coated on the non-display area NA of the bonded substrate 10 and cured to form the first substrate. The substrate 100 and the second substrate 200 are bonded to each other. In addition, the liquid crystal layer 150 is formed between the first substrate 100 and the second substrate 200 in the display area AA of the bonded substrate 10.

In the liquid crystal display according to the present invention, a twisted nematic (TN) mode, a vertical alignment (VA) mode, an in plane switching (IPS) mode, or a fringe field switching (FFS) mode according to a method of controlling the arrangement of the liquid crystal layer 150. The pixel electrode 208 formed on the second substrate 200 and the common electrode for forming an electric field may be formed on the first substrate 100 or the second substrate 200. Can be.

The black matrix first pattern 102a, the black matrix second pattern 102b, and the black matrix third pattern 102c are formed in the non-display area NA of the first substrate 100, and the display area AA is formed. The black matrix fourth pattern 102d is formed thereon. The material 300 completely overlaps the black matrix first pattern 102a and the black matrix second pattern 102b in the non-display area NA of the bonded substrate 10, and the black matrix third pattern 102c. It may be formed to overlap with a part of the). As a result, the plurality of patterns form a concave-convex structure in the first substrate 100, and the material 300 is formed on the patterns, and the material 300 is filled between the pattern and the pattern, thereby forming the pattern and the material 300. ), The contact area can be widened, and the adhesive strength can be improved after curing of the actual material 300.

The material 300 is cured due to UV irradiation. UV for curing the substance 300 is generally irradiated under the second substrate 200. In addition, the black matrix first pattern 102a, the second pattern 102b, and the third pattern 102c of the first substrate 100 are formed to be spaced apart from each other, and thus may be irradiated from the upper portion of the first substrate 100. have. UV irradiation is possible in the upper and lower portions of the bonding substrate 10, it is possible to improve the curing of the real material 300, it is possible to improve the adhesion of the real material (300).

The black matrix second pattern 102b formed in the non-display area NA is formed to be spaced apart from the black matrix first pattern 102a at the side of the black matrix first pattern 102a. The second pattern 102b may be formed on both sides of the black matrix first pattern 102a. In this case, the line width is the same as or smaller than the black matrix first pattern 102a, preferably 10 μm or more and 50 μm or less. In the drawing, three black patterns are formed on each side of the black matrix first pattern 102a. However, the black matrix second pattern 102b may be formed on two side surfaces of the black matrix first pattern 102a. It can be formed in five patterns, preferably in three patterns. The black matrix second pattern 102b formed of the plurality of patterns has a clear contrast depending on whether the pattern is burned for each pattern, so that it can be determined by vision inspection in a later process. In other words, it is possible to enable sophisticated burning.

6 is a cross-sectional view of a bonding substrate of a liquid crystal display according to a second exemplary embodiment of the present invention.

In the liquid crystal display according to the second exemplary embodiment of the present invention, a redundant description will be omitted. Referring to FIG. 6, in the bonded substrate 10 of the liquid crystal display according to the second exemplary embodiment, the organic layer pattern 210 is formed on the second insulating substrate 201 in the non-display area NA. . The organic layer pattern 210 may be formed to 50 μm or more and 400 μm or less, and preferably 50 μm or more and 200 μm or less. The organic layer pattern 210 may be formed together with the gate insulating layer 203 formed in the display area AA of the second substrate 200 and patterned. Alternatively, the organic layer pattern 210 may be formed together with the passivation layer 207 formed in the display area AA of the second substrate 200 and patterned. The organic layer pattern 210 is formed in a region corresponding to the cutting line in a later cutting process and corresponds to the black matrix patterns 102a, 102b and 102c formed in the non-display area NA of the first substrate 100. It is formed in the area. In addition, the organic layer pattern 210 is formed to completely overlap the real 300. That is, the organic film pattern 210 is formed to overlap with the real material 300, so that the contact between the real material 300 and the organic film pattern 210, the adhesive force of the real material 300 in the bonded substrate 10 Increases.

7 is a cross-sectional view of a bonding substrate of a liquid crystal display according to a third exemplary embodiment of the present invention.

In the liquid crystal display according to the third exemplary embodiment of the present invention, a redundant description will be omitted. Referring to FIG. 7, in the bonded substrate 10 of the liquid crystal display according to the third exemplary embodiment, an organic layer pattern is formed on the second insulating substrate 201 in the non-display area NA.

In the non-display area NA of the second substrate 200, the organic layer pattern 209 is formed in a region corresponding to the region where the black matrix pattern of the first substrate is formed. The organic layer pattern 209 may be patterned together with the gate insulating layer 203 or the protective layer 207 formed in the display area AA. In addition, the organic layer pattern 209 may include an organic layer first pattern 209a and an organic layer second pattern 209b. The organic film pattern 209 including the organic film first pattern 209a and the organic film second pattern 209b is formed to completely overlap the actual material 300.

In addition, the organic layer first pattern 209a is formed in a region corresponding to the cutting line in a later cutting process. In addition, the organic layer first pattern 209a may be formed in the same shape as the black matrix first pattern of the first substrate. In addition, the organic layer first pattern 209a may be formed to be 50 μm or more and 200 μm or less.

In addition, the organic layer second pattern 209b is formed to be spaced apart from the organic layer first pattern 209a on the side of the organic layer first pattern 209a, and the organic layer second pattern 209b is It may be formed on both side surfaces of the organic layer first pattern 209a. In this case, the line width may be equal to or smaller than that of the organic layer first pattern 209a, and preferably, 10 μm or more and 50 μm or less. The organic layer second pattern 209b may be formed in the same shape as that of the black matrix second pattern of the first substrate. In the drawing, the organic film first pattern 209a is formed in three patterns on each side, but the organic film second pattern 209b is formed on two sides of the organic film first pattern 209a. It can be formed in five patterns, preferably in three patterns. The organic film second pattern 209b formed of the plurality of patterns forms a concave-convex structure in the second substrate 200, and the organic film pattern 209 as the actual material 300 is filled between the plurality of patterns and the patterns. ) And the contact area of the real material 300 becomes wider, and the adhesive force after hardening the real material 300 can be improved.

8 is a cross-sectional view of a burning process of the method of manufacturing a liquid crystal display device according to the present invention.

Referring to FIG. 8, the burning process of the manufacturing method of the liquid crystal display according to the present invention will be described with reference to the bonding substrate 10 according to the third embodiment of the present invention. However, the present invention is not limited thereto and may be applied in various embodiments.

The laser 400 is irradiated on the upper portion of the first substrate 100 of the bonded substrate 10 including the hardened material 300 by irradiating UV. The laser 400 is irradiated only on the black matrix first pattern 102a of the first substrate 100. Irradiation line width of the laser 400 may be formed to more than 10㎛ 200㎛. The laser 400 burns and removes only the first pattern 102a of the black matrix, and since the black matrix first pattern 102a is made of a black resin series having a wide laser absorption wavelength band, low energy is generated. Even if the laser 400 is provided, the laser 400 is easily absorbed. In this case, the black matrix first pattern 102a may have a laser absorption wavelength band wider than that of the material 300, and damage to the material 300 may be minimized due to a laser. As a result, a space corresponding to the cutting line in a later cutting process and not filled with the material 300 is formed on the first substrate 100 in the region where the cutting machine is formed.

According to the present invention, since a plurality of patterns are formed in the non-display area NA of the first substrate 100, there is an effect that fewer fine residues are formed as compared with the case where the whole is formed in a black matrix without the pattern. In addition, after the burning process, the black matrix first pattern 102a is removed and a panel brush cleaning process for removing fine residues is further performed to prevent defects caused by fine residues. have. This can also reduce contamination of the cut surface of the panel.

In addition, the burning line width may be inspected through the design of the black matrix second pattern 102b for measuring the burning boundary of the pattern of the black matrix. The contrast is clearly revealed depending on whether the black matrix second pattern 102b is burned for each pattern. Therefore, in the process of burning the black matrix first pattern 102a through vision inspection, the presence or absence of damage and the extent of damage such as burning of the black matrix second pattern 102b can be confirmed. In addition, through the vision (vision) inspection is possible to determine the good, it is possible to manage the line width in the burning process. In other words, it is possible to enable sophisticated burning.

9 is a cross-sectional view illustrating a cutting process of a method of manufacturing a liquid crystal display according to the present invention.

Referring to FIG. 9, the burning process is performed to perform a cutting process of cutting the bonded substrate 10 from which the black matrix first pattern is removed. A cutting line 40 is formed along the area where the black matrix first pattern removed by the laser is formed, and the cutting machine 500 is positioned on the cutting line 40. The cutter 500 may be formed of a diamond cutter or the like. The cutter 500 performs a scribe to form vertical cracks on the first insulating substrate 101 and the second insulating substrate 201, and the scribed substrates can be easily separated using a roller or a wheel. have.

As the black matrix first pattern is removed, an empty space in which the real material 300 is not formed is formed under the cutter 500 formed on the first substrate 100. As a result, since the tensile force of the material 300 does not act on the first insulating substrate 101, vertical cracks may be formed without defects. In addition, the quality of the cutting process is improved by forming a good vertical crack.

In addition, the cutter 500 formed under the second substrate 200 may be positioned in a region corresponding to the organic layer first pattern 209a formed on the second substrate 200. In addition, a cutting process may be simultaneously performed on the first substrate 100 and the second substrate 200, and the bonded substrate 10 may be separated. In addition, since the cutting line 40 is formed on the region where the actual material 300 is formed, and a separate separation space between the actual material 300 and the cutting line 40 is not required, the bezel may be narrower. .

After the cutting process, the bonded substrate of the liquid crystal display according to the present invention forms one panel 50 included in the liquid crystal display as shown in FIGS. 1 and 2, respectively.

1, 2, and 9, the panel 50 is divided into a display area AA and a non-display area NA, and the first substrate 100 is the first in the display area AA. The black matrix fourth pattern 102d and the color filter layer 103 are formed on the insulating substrate 101. The second substrate 200 defines a plurality of pixel regions in which the gate line and the data line intersect each other with the gate insulating layer 203 therebetween on the second insulating substrate 201 in the display area AA. In addition, the second substrate 200 may include a gate electrode 202 connected to the gate line, a gate insulating layer 203, a semiconductor layer 204, a source electrode 205 and a drain electrode 206 connected to the data line. It includes a thin film transistor (TFT) comprising a. In addition, the pixel electrode 208 is connected to the drain electrode 206 of the thin film transistor TFT through the passivation layer 207.

In the non-display area NA of the panel 50, an actual material 300 joins the first substrate 100 and the second substrate 200. The real material 300 is formed in the shape of a closed curve along the outer edge of the panel 50 at the end of the panel 50. In addition, the real material 300 is formed on the first substrate 100 of the panel 50 so as to overlap the pattern including the uneven structure. In addition, the real material 300 may be formed to include the pattern on the pattern forming the uneven structure formed on the second substrate 200 of the panel 50 to overlap. A pattern forming a concave-convex structure formed on the first substrate 100 or the second substrate 200 may improve the adhesion of the real material 300. As the real material 300 is filled in the recessed portion of the uneven structure, the contact area between the pattern and the real material 300 may be widened, and the adhesive force may increase.

The pattern forming the uneven structure formed on the first substrate 100 may be formed together with the black matrix fourth pattern 102d of the display area AA. Preferably, the plurality of black matrix second patterns 102b are formed. And a black matrix third pattern 102c. The black matrix second pattern 102b may be formed in a plurality of patterns, preferably in two to five patterns. Therefore, three to six patterns forming the uneven structure formed on the first substrate 100 may be formed.

In addition, the pattern forming the uneven structure formed on the second substrate 200 may be formed of the organic layer first pattern 209a and the plurality of organic layer second patterns 209b. Preferably, the display area AA ) May be formed and patterned together with the gate insulating layer 203, or may be formed and patterned together with the passivation layer 207. The organic layer second pattern 102b may be formed in a plurality of patterns, preferably in two to five patterns. Therefore, three to six patterns forming the uneven structure formed on the second substrate 200 may be formed.

In addition, the outer end, which is a cut surface of the panel 50, may have an empty space between the real material 300 and the first substrate 100. As shown in FIG. 8, as the burning process of the first black matrix pattern 102a is performed, the real material 300 and the first substrate 100 are spaced apart from each other in a region where the first black matrix first pattern 102a is formed. Can be formed. The width of the empty space may be formed to be smaller than or equal to the line width of the black matrix first pattern 102a, preferably, greater than 0 μm and less than 200 μm.

In addition, an outer end, which is a cut surface of the panel 50, may be formed to overlap the actual material 300 and the second substrate 200 with the organic layer first pattern 209a therebetween. In the cutting process, the cutter 500 is positioned in a region corresponding to the organic film first pattern 209a formed on the second substrate 200 and the cutting process is performed. With the interposed therebetween, the real material 300 and the first substrate 100 may overlap each other.

Therefore, the method of manufacturing a liquid crystal display device according to the present invention may include a thin bezel by designing the distance between the cutting line and the real material to be small, and improve the vertical crack defect due to the tensile force of the real material, thereby cutting the substrate. It is possible to improve the quality of the product and make a positive judgment through the black matrix pattern. In addition, it is possible to reduce the contamination of the cutting surface of the panel, and to enable the multi-pattern and the actual curing in both the lower substrate direction and the upper substrate direction to improve the adhesion of the real material to improve the reliability of the product.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

10,20: bonded substrate 200: second substrate
40: cutting line 201: second insulating substrate
50 cell, panel 202 gate electrode
100: first substrate 203: gate insulating film
101: first insulating substrate 204: semiconductor layer
102: black matrix 205: source electrode
102a: black matrix first pattern 206: drain electrode
102b: black matrix second pattern 207: protective film
102c: black matrix third pattern 208: pixel electrode
102d: black matrix fourth pattern 209, 210: organic film pattern
103: color filter layer 209a: organic film first pattern
150: liquid crystal layer 209b: organic film second pattern
AA: display area 300: real
NA: non-display area 400: laser
TFT: thin film transistor 500: cutting machine

Claims

A liquid crystal display device which forms a panel including a display area and a non-display area by actually bonding a first substrate including a black matrix and a color filter and a second substrate including a thin film transistor to each other.
Forming a black matrix second pattern on the first substrate in the non-display area, the black matrix second pattern having a line width less than or equal to the black matrix first pattern;
Forming organic layer first and second patterns on the non-display area of the second substrate;
Forming a real material between the first substrate and the second substrate to overlap the black matrix first pattern and the second pattern in the non-display area, and hardening the real material;
Removing the black matrix first pattern through a burning process;
Positioning a cutter on the first substrate on which the removed black matrix first pattern is formed, and cutting the panel;
The material is formed to overlap in the same direction as the black matrix first and second patterns to include the black matrix first and second patterns,
The organic layer first and second patterns may be formed in the same direction as the black matrix first and second patterns in a region overlapping with the real material so as to correspond to the first and second black matrix patterns.
And the organic layer first and second patterns are formed together with a gate insulating layer or a protective layer formed in the display area of the second substrate.

The method of claim 1,
The black matrix second pattern is formed on both sides of the black matrix first pattern.

The method of claim 2,
And two to five black matrix second patterns on the side surfaces of the black matrix first pattern.

The method of claim 1,
After removing the black matrix first pattern through a burning process,
And vision inspection of the black matrix second pattern to determine whether the black matrix is patterned.

The method of claim 1,
After removing the black matrix first pattern,
And removing fine residues of the black matrix first pattern through a brushing process.

The method of claim 1,
The line width of the first black matrix pattern is 50㎛ 200㎛ less liquid crystal display device manufacturing method.

The method of claim 1,
A line width of the second black matrix pattern is 10 μm or more and 50 μm or less.

The method of claim 1,
The curing of the material may include curing the UV by irradiating UV from an upper portion of the first substrate and a lower portion of the second substrate.

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The method of claim 1,
And two to five organic layer second patterns on both sides of the organic layer first pattern.

The method of claim 1,
The cutting of the panel may include simultaneously cutting the first substrate and the second substrate.

A second substrate divided into a display area and a non-display area, the first substrate including a black matrix and a color filter layer in the display area, and a second substrate including a thin film transistor in the display area;
A liquid crystal display device comprising a panel including a material formed between the first substrate and a second substrate in the non-display area.
The material is formed to overlap in the same direction as the black matrix first and second patterns to include the black matrix first and second patterns forming the uneven structure on the non-display area of the first substrate,
At the outer end of the panel, the material and the second substrate overlap with the organic layer first and second patterns interposed therebetween.
The organic layer first and second patterns may be formed in the same direction as the black matrix first and second patterns in a region overlapping with the real material so as to correspond to the first and second black matrix patterns.
The organic layer first and second patterns are formed together with a gate insulating layer or a protective layer formed in the display area of the second substrate.
And an empty space spaced apart from the actual substrate at the outer end of the panel.

The method of claim 15,
The width of the empty space is greater than 0㎛ less than 200㎛ liquid crystal display device.

The method of claim 15,
And 2 to 6 black matrix second patterns forming a concave-convex structure on the first substrate.

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The method of claim 15,
And two to six organic film second patterns formed on the second substrate in an uneven structure.