JP2009116309A - Liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display device capable of improving the display quality and manufacturing yield while suppressing a counter substrate from being charged. <P>SOLUTION: The liquid crystal display device includes: an array substrate AR; a counter-substrate CT which is disposed to be opposed to the array substrate AR; a liquid crystal layer LQ which is formed of a liquid crystal material which is held between the array substrate AR and the counter-substrate CT; and a sealant 300 which bonds the array substrate AR and the counter-substrate CT. The array substrate AR includes a pixel electrode EP having a slit SL, and a counter-electrode ET which is opposed to the pixel electrode EP via an interlayer insulation film IL. The counter-substrate CT has a shield electrode ES on an outer surface thereof. The shield electrode ES is disposed such that an end portion CTb thereof along at least one side of the counter-substrate CT, is exposed on the outer surface of the counter-substrate CT. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having a structure in which a pixel electrode and a counter electrode are provided on one substrate constituting a liquid crystal display panel.

  2. Description of the Related Art In recent years, flat display devices that replace CRT displays have been actively developed. Among them, liquid crystal display devices have attracted particular attention because of their advantages such as light weight, thinness, and low power consumption. In particular, an active matrix liquid crystal display device in which a switching element is incorporated in each pixel has a structure using a lateral electric field (including a fringe electric field) such as an IPS (In-Plane Switching) mode or an FFS (Fringe Field Switching) mode. Attention has been paid.

  This IPS mode or FFS mode liquid crystal display device includes a pixel electrode and a counter electrode formed on an array substrate, and a liquid crystal with a lateral electric field substantially parallel to the main surface of the array substrate formed therebetween. Switch molecules. Further, polarizing plates are arranged on the outer surfaces of the array substrate and the counter substrate so that their deflection axes are orthogonal to each other. With such a polarizing plate arrangement, for example, a black screen is displayed when no voltage is applied, and a white screen is displayed by gradually increasing the transmittance (modulation factor) by applying a voltage corresponding to the video signal to the pixel electrode. To do.

In such a liquid crystal display device, when the counter substrate is charged by static electricity or the like, a vertical electric field is formed between the counter substrate and the array substrate. When a vertical electric field is formed in this way, alignment defects of liquid crystal molecules occur, resulting in deterioration of display quality. For this reason, in order to prevent the counter substrate from being charged, a technique of disposing a shield electrode on the outer surface or the inner surface of the counter substrate has been disclosed (for example, see Patent Document 1).
JP 2005-234547 A

  In an IPS mode or FFS mode liquid crystal display device, the thickness of the liquid crystal layer is relatively thin. For this reason, when the shield electrode is disposed on the inner surface of the counter substrate, the shield electrode, the counter electrode, and the pixel electrode are close to each other. For this reason, the vertical electric field formed between the shield electrodes may cause alignment failure of liquid crystal molecules, leading to deterioration of display quality.

  In addition, in the configuration in which the shield electrode is arranged on the outer surface of the counter substrate, when the shield electrode is formed in a solid shape on the outer surface of the mother substrate to be the counter substrate, the shield is used when cutting out the counter substrate of a predetermined size from the mother substrate. There is a possibility that a part of the electrode peels off and becomes a conductive minute foreign matter and contaminates the surroundings.

  For example, when a mounting portion for connecting a wiring on the array substrate and a signal supply source such as a driving IC is contaminated, there is a possibility that a problem such as a short circuit between terminals may occur. Therefore, the display quality and reliability of the liquid crystal display device may be reduced, and the manufacturing yield may be reduced.

  Further, in the configuration in which the liquid crystal material is vacuum-injected, if the vicinity of the injection port is contaminated, the conductive foreign material may be drawn into the liquid crystal layer when the liquid crystal material is injected. As described above, the conductive foreign matter may cause a short circuit between the wirings or the electrodes or a liquid crystal molecule alignment defect. For this reason, there is a possibility that the display quality of the liquid crystal display device is lowered and the production yield is lowered.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a liquid crystal display device capable of improving display quality and manufacturing yield while suppressing charging of the counter substrate. is there.

The liquid crystal display device according to the first aspect of the present invention comprises:
A first substrate;
A second substrate disposed to face the first substrate;
A liquid crystal layer made of a liquid crystal material held between the first substrate and the second substrate;
A sealing material for bonding the first substrate and the second substrate;
The second substrate includes a shield electrode on an outer surface thereof,
The shield electrode is arranged on the outer surface of the second substrate so as to expose an end portion along at least one side of the second substrate.

A liquid crystal display device according to a second aspect of the present invention provides:
Forming a mounting portion and a first display element portion on one surface of the first substrate;
Forming a second display element portion on one surface of the second substrate;
Forming a shield electrode facing the second display element portion without overlapping the breaking line on the other surface of the second substrate;
Applying a sealing material so as to surround the first display element unit or the second display element unit;
Bonding the first substrate and the second substrate so that the first display element unit and the second display element unit face each other;
A step of cleaving the opposing region of the mounting portion of the second substrate along a cleaving line, and a liquid crystal display device formed through
The shield electrode is disposed on the other surface of the second substrate so as to expose an end portion along at least one side of the second substrate.

  According to the present invention, it is possible to provide a liquid crystal display device capable of improving display quality and manufacturing yield while suppressing charging of the counter substrate.

  A liquid crystal display device according to an embodiment of the present invention will be described below with reference to the drawings.

  Here, an FFS mode liquid crystal display device is taken as an example as a liquid crystal mode in which a pair of electrodes, that is, a pixel electrode and a counter electrode are provided on one substrate and liquid crystal molecules are switched using a lateral electric field formed therebetween. explain.

  As shown in FIGS. 1 to 3, the liquid crystal display device is an active matrix type liquid crystal display device and includes a liquid crystal display panel LPN. The liquid crystal display panel LPN is held between an array substrate (first substrate) AR, a counter substrate (second substrate) CT arranged opposite to the array substrate AR, and the array substrate AR and the counter substrate CT. Liquid crystal layer LQ. The array substrate AR and the counter substrate CT are bonded to each other with a sealing material 300. The sealing material 300 is disposed so as to surround the display area DSP. In the example shown in FIG. 1, the sealing material 300 is disposed so as to secure an injection port 300 </ b> A for injecting a liquid crystal material. The injection port 300A is sealed with a sealing material 500 made of a photosensitive resin or the like. The display area DSP is composed of a plurality of pixels PX arranged in an mxn matrix.

  The array substrate AR is formed using an insulating substrate 20 having optical transparency such as a glass plate or a quartz plate. That is, the array substrate AR has n × n pixel electrodes (second electrodes) EP arranged for each pixel PX and n scans extending in the row direction H of each pixel PX in the display area DSP. A line Y (Y1 to Yn), m signal lines X (X1 to Xm) extending in the column direction V of each pixel PX, and a region including the intersection of the scanning line Y and the signal line X in each pixel PX Are provided with m × n switching elements W, a pixel electrode EP, and a counter electrode (first electrode) ET disposed to face the pixel electrode EP with an interlayer insulating film IL interposed therebetween.

  Furthermore, the array substrate AR includes a mounting portion 10 outside the display area DSP. That is, the array substrate AR includes an extending portion ARa that extends outward from the end side CTa (L2) of the counter substrate CT. The mounting portion 10 is disposed on the surface side of the extending portion ARa (the side where the pixel electrode EP and the like are disposed). The mounting unit 10 is mounted with a signal supply source such as a driving IC including a gate driver 10a and a source driver 10b.

  The gate driver 10a is electrically connected to the n scanning lines Y, and supplies a scanning signal for driving each pixel PX in the display area DSP. The source driver 10b is electrically connected to the m signal lines X, and supplies a video signal to be written to each pixel PX in the display area DSP at a timing when the switching elements W in each row are turned on by the scanning signal. Thereby, the pixel electrode EP of each row is set to a pixel potential corresponding to the video signal supplied via the corresponding switching element W.

  Each switching element W is configured by, for example, a thin film transistor. The semiconductor layer of the switching element W can be formed of, for example, polysilicon or amorphous silicon. The gate electrode WG of the switching element W is connected to the scanning line Y (or formed integrally with the scanning line Y). The source electrode WS of the switching element W is connected to the signal line X (or formed integrally with the signal line X) and is in contact with the source region of the semiconductor layer. The drain electrode WD of the switching element W is connected to the pixel electrode EP (or formed integrally with the pixel electrode EP) and is in contact with the drain region of the semiconductor layer.

  For example, the counter electrode ET is arranged in an island shape in each pixel PX, and is electrically connected to the common wiring COM to which a common potential is supplied. An interlayer insulating film IL is disposed on the counter electrode ET. The pixel electrode EP is disposed on the interlayer insulating film IL. The pixel electrode EP is arranged in an island shape so as to face the counter electrode ET in each pixel PX. The pixel electrode EP is provided with a plurality of slits SL facing the counter electrode ET. The pixel electrode EP and the counter electrode ET are formed of a light-transmitting conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

  The surface in contact with the liquid crystal layer LQ of the array substrate AR is covered with the alignment film 36a.

  On the other hand, the counter substrate CT is formed using an insulating substrate 30 having optical transparency such as a glass plate or a quartz plate. In particular, in the color display type liquid crystal display device, as shown in FIG. 3, the counter substrate CT is a black matrix that partitions each pixel PX on the inner surface of the insulating substrate 30 (that is, the surface facing the liquid crystal layer LQ). 32, a color filter layer 34 disposed in each pixel PX surrounded by the black matrix 32, and the like. Further, the counter substrate CT may further include an overcoat layer arranged with a relatively thick film thickness so as to flatten the unevenness of the surface of the color filter layer 34.

  The black matrix 32 is arranged on the insulating substrate 30 so as to face the scanning lines Y and the signal lines X provided on the array substrate AR, and further the wiring portions such as the switching elements W. The color filter layer 34 is disposed on the insulating substrate 30 and is formed of a plurality of different colors, for example, colored resins that are colored in three primary colors such as red, blue, and green. The red colored resin, the blue colored resin, and the green colored resin are disposed corresponding to the red pixel, the blue pixel, and the green pixel, respectively. The color filter layer 34 may be disposed on the array substrate side.

  The surface in contact with the liquid crystal layer LQ of the counter substrate CT is covered with the alignment film 36b.

Further, the counter substrate CT includes a shield electrode ES on the outer surface thereof (that is, the surface opposite to the surface on the liquid crystal layer LQ side). Here, the shield electrode ES is disposed on the outer surface of the insulating substrate 30. The shield electrode ES is formed of a light-transmitting conductive material such as ITO or IZO, for example.
The counter substrate CT and the array substrate AR as described above are arranged so that the alignment films 36a and 36b face each other. At this time, a predetermined gap is formed between the array substrate AR and the counter substrate CT by a spacer (not shown). The liquid crystal layer LQ is made of a liquid crystal material including liquid crystal molecules sealed in a gap formed between the alignment film 36a of the array substrate AR and the alignment film 36b of the counter substrate CT.

  This liquid crystal display device includes an optical element OD1 provided on one outer surface of the liquid crystal display panel LPN (ie, the surface opposite to the surface in contact with the liquid crystal layer LQ of the array substrate AR), and the other side of the liquid crystal display panel LPN. Optical element OD2 provided on the outer surface (that is, the surface opposite to the surface in contact with the liquid crystal layer LQ of the counter substrate CT). Each of these optical elements OD1 and OD2 includes a polarizing plate. Further, these optical elements OD1 and OD2 may include a polarizing plate as necessary. The optical element OD1 is directly bonded to the insulating substrate 20. The optical element OD2 is bonded on the shield electrode ES.

  With such a configuration, the backlight light from the backlight unit BL disposed on the array substrate AR side with respect to the liquid crystal display panel LPN is selectively transmitted through the liquid crystal display panel LPN to display an image.

  Here, the shield electrode ES disposed on the outer surface of the counter substrate CT will be described in detail. The shield electrode ES is disposed so as to cover at least the entire display area DSP. Here, the shield electrode ES is formed in a substantially rectangular shape having a dimension equal to or larger than that of the display area DSP, corresponding to the substantially rectangular display area DSP. Such a shield electrode ES is disposed on the outer surface of the counter substrate CT so as to expose an end portion along at least one side of the counter substrate CT. In the example shown in FIG. 1, the shield electrode ES is disposed so as to expose the respective end portions C1, C2, C3, and C4 along the four sides L1, L2, L3, and L4 of the counter substrate CT.

  As described above, the shield electrode ES is interposed between the second optical element OD2 and the insulating substrate 30 constituting the counter substrate CT, so that the charge is dispersed even when the second optical element OD2 is charged. It is possible to suppress charging of the counter substrate CT. Further, since the shield electrode ES is disposed so as to cover the display area DSP, it is possible to shield an external electric field toward the display area DSP. For this reason, an undesired vertical electric field is not formed between the array substrate AR and the counter substrate CT, and display quality can be improved.

  Here, the first embodiment and the second embodiment will be described.

  In the first embodiment, as shown in FIGS. 4A and 4B, the shield electrode ES is formed larger than the display area DSP. Such a shield electrode ES is disposed so as to cover the display area DSP. Further, the shield electrode ES is formed in a size smaller than the counter substrate CT. Here, in particular, the array substrate AR and the counter substrate CT constituting the liquid crystal display panel are formed in a square shape. As in the example shown in FIG. 1, the shield electrode ES exposes the end portions along the four sides of the counter substrate CT (that is, the peripheral portion of the outer surface of the insulating substrate 30) on the outer surface of the counter substrate CT. Has been placed.

  The liquid crystal display device further includes a frame-shaped metal frame FL that covers the liquid crystal display panel LPN from the outer surface side of the counter substrate CT. The metal frame FL has a rectangular opening AP that is formed larger than the rectangular display area DSP and exposes the display area DSP. The opening AP is formed smaller than the shield electrode ES. Note that the second optical element OD2 is formed to be smaller than the shield electrode ES, and is disposed so as to expose a part of the shield electrode ES.

  That is, the metal frame FL surrounds the display area DSP and is arranged so as to overlap with the peripheral portion of the shield electrode ES (the portion exposed from the second optical element OD2). The metal frame FL is provided with a protrusion on the inner surface facing the shield electrode ES, and is in contact with the shield electrode ES via the protrusion. Alternatively, the metal frame FL and the shield electrode ES may be in direct contact. That is, the shield electrode ES and the metal frame FL are electrically connected outside the display area DSP.

  The metal frame FL is grounded, for example. Since the shield electrode ES is in contact with the metal frame FL at the ground potential via the protrusion, it is possible to release the charges charged in the second optical element OD2 or the counter substrate CT from the metal frame FL. For this reason, it becomes possible to suppress the charging of the counter substrate CT, and it is possible to suppress the formation of a vertical electric field between the counter substrate CT and the array substrate AR.

  In the second embodiment, as shown in FIGS. 5A and 5B, the shield electrode ES is formed in a size larger than the display area DSP and is arranged so as to cover the display area DSP. Further, the shield electrode ES is formed in a size smaller than that of the counter substrate CT, and the end portions along the four sides of the counter substrate CT are exposed on the outer surface of the counter substrate CT as in the example shown in FIG. Is arranged. In the second embodiment, the counter substrate CT further has a terminal portion ESa electrically connected to the shield electrode ES on its outer surface. The terminal portion ESa may be formed integrally with the same material as the shield electrode ES, or may be formed separately from a conductive material different from the shield electrode ES. This terminal portion ESa is drawn to one side of the counter substrate CT. According to such a configuration, it is possible to release the charges charged in the second optical element OD2 or the counter substrate CT to the outside via the terminal portion ESa.

  In particular, in the example shown in FIGS. 5A and 5B, the terminal portion ESa is drawn to the side L2 of the counter substrate CT. The extended portion ARa of the array substrate AR extends outward from the side L2 from which the terminal portion ESa is drawn. Further, the array substrate AR has a wiring Z having a ground potential. The wiring Z is disposed in the extending portion ARa of the array substrate AR. The terminal portion ESa is electrically connected to the wiring Z through a conductive member 200, for example, a conductive paste or a conductive tape.

  That is, since the shield electrode ES is connected to the wiring Z having the ground potential via the terminal portion ESa and the conductive member 200, the charge charged in the second optical element OD2 or the counter substrate CT can be released from the wiring Z. It becomes possible. For this reason, it becomes possible to suppress the charging of the counter substrate CT, and it is possible to suppress the formation of a vertical electric field between the counter substrate CT and the array substrate AR.

  Here, an example of a specific manufacturing method of the liquid crystal display device will be described.

  First, a first mother substrate for the array substrate AR and a second mother substrate for the counter substrate CT are prepared. The first mother substrate has an area where a plurality of array substrates AR can be formed. The second mother substrate has an area where a plurality of counter substrates CT can be formed.

  On one surface of the first mother substrate, a first display element portion corresponding to the mounting portion 10 and the display area DSP is formed in each array substrate formation region. In the first display element portion, a switching element W, a pixel electrode EP, a counter electrode ET, and the like are formed.

  A second display element portion is formed in each counter substrate formation region on one surface of the second mother substrate. In the second display element portion, a color filter layer 34, a black matrix 32, and the like are formed.

  Thereafter, on the other surface of the second mother substrate (the surface opposite to the surface on which the second display element portion is formed), a shield electrode ES facing the second display element portion is formed in each counter substrate formation region. . The shield electrode ES is formed in an island shape in a region facing the second display element portion by, for example, mask sputtering. In particular, the shield electrode ES is formed without overlapping with a breaking line when the second mother substrate is cut in a subsequent cutting step. The example shown in FIG. 6 corresponds to the first embodiment, and the shield electrode ES is disposed on the inner side surrounded by two adjacent breaking lines A and the breaking lines B1 and B2.

  Thereafter, the sealing material 300 is applied so as to surround the first display element portion of the first mother substrate or the second display element portion of the second mother substrate. The sealing material 300 is disposed so as to secure an injection port 300A for injecting a liquid crystal material in each liquid crystal display panel formation region. The inlet 300A is formed on a side different from the side where the mounting portion 10 is disposed. The sealing material 300 is formed of a resin material such as a thermosetting resin, for example.

  Then, the first mother substrate and the second mother substrate are arranged so that the first display element portion and the second display element portion face each other. And it heats, pressurizing in the direction which bonds a 1st mother board | substrate and a 2nd mother board | substrate. Thereby, the sealing material 300 is cured, and the first mother substrate and the second mother substrate are bonded together.

  Subsequently, as shown in FIG. 6, the bonded mother substrate pair is scribed along the cutting line A and then cut into strips. Thereafter, a liquid crystal material is vacuum injected from the injection port 300A. Thereafter, as the sealing material 500, for example, a photosensitive resin such as an ultraviolet curable resin is applied to the injection port 300A, and the liquid crystal material is sealed by irradiating with ultraviolet rays. Then, the strip-shaped mother substrate pair is cleaved after being scribed along the cutting line B1. Furthermore, the area | region facing the mounting part 10 of a 2nd mother board | substrate is removed by cleaving along the cutting line B2. Thereby, each cell which exposed the mounting part 10 is formed.

  By such a process, the liquid crystal display panel LPN holding the liquid crystal layer LQ between the array substrate AR and the counter substrate CT is formed.

  As described above, the shield electrode ES is disposed so as not to overlap the breaking line A that overlaps the injection port 300A. In the example shown in FIG. 6, the shielding electrode ES is disposed not to overlap any of the breaking lines A, B1, and B2. Has been. That is, the shield electrode ES is disposed so as not to overlap the breaking line A that is broken at least before the liquid crystal injection step. For this reason, when the mother substrate pair is cut along the cutting line A, the cutting member such as a cutter does not contact the shield electrode ES.

  Therefore, when the mother substrate pair is cleaved, the shield electrode ES is not scraped off and no conductive foreign matter is generated. For this reason, in the process of injecting the liquid crystal material, it is possible to prevent the conductive foreign matter from being mixed into the liquid crystal. Therefore, it is possible to prevent a short circuit between wirings and a short circuit between electrodes in the liquid crystal layer. In addition, it is possible to prevent alignment defects of liquid crystal molecules due to foreign matters.

  That is, as shown in FIG. 1, the shield electrode ES is arranged on the outer surface of the counter substrate CT so as to expose at least the end portion along the side L1 of the counter substrate CT provided with the injection port 300A. In other words, the shield electrode ES is provided so as not to reach the side L1 of the counter substrate CT. With such a shape of the shield electrode ES, the display quality of the display device can be improved and the manufacturing yield can be improved.

  Further, as described above, the shield electrode ES is disposed so as not to overlap the breaking line B2. For this reason, when the region facing the mounting portion 10 of the second mother substrate is cut along the cutting line B2, the shield electrode ES is not scraped off without the cutter or the like coming into contact with the shield electrode ES. Thereby, the contact to the part of mounting part 10 from which the shield electrode ES has peeled off can be prevented. That is, it is possible to prevent the mounting unit 10 from being contaminated, and it is possible to prevent a short circuit in the mounting unit 10.

  That is, as shown in FIG. 1, the shield electrode ES is disposed on the outer surface of the counter substrate CT so that at least the end portion along the side L2 on the side where the mounting portion 10 is disposed is exposed. In other words, the shield electrode ES is provided so as not to reach the side L2 of the counter substrate CT. As a result, the display quality of the display device can be improved and the manufacturing yield can be improved.

  In the above-described example, the shield electrode ES is formed before the first mother substrate and the second mother substrate are bonded together. However, after the first mother substrate and the second mother substrate are bonded together, the shield electrode ES is liquid crystal. You may form in the step before inject | pouring material.

  In the manufacturing method described above, the example in which the liquid crystal material is vacuum-injected after the first mother substrate and the second mother substrate are bonded to each other has been described. However, the present invention is not limited to this example. Hereinafter, an example in which a liquid crystal material is dropped and injected as a manufacturing method will be described. As a feature of the liquid crystal display panel to which the dropping injection method is applied, as shown in FIG. 7, a sealing material 300 for bonding the array substrate AR and the counter substrate CT is formed in a loop shape surrounding the display area DSP. Is mentioned.

  Such a liquid crystal display panel is manufactured as follows.

  First, as shown in FIG. 8, a first mother substrate M1 for the array substrate AR and a second mother substrate M2 for the counter substrate CT are prepared by the same procedure as that for vacuum injection of the liquid crystal material. That is, the first display element unit 12 corresponding to the mounting unit 10 and the display area DSP is formed in each array substrate formation region on one surface of the first mother substrate M1. In addition, the second display element unit 14 is formed in each counter substrate formation region on one surface of the second mother substrate M2.

  Thereafter, on the other surface of the second mother substrate M2, a shield electrode ES facing the second display element unit 14 is formed in each counter substrate formation region. In particular, the shield electrode ES is formed without overlapping with a breaking line when the second mother substrate M2 is cleaved in a later cleaving process.

  Thereafter, the sealing material 300 is applied in a loop shape so as to surround the first display element portion 12 of the first mother substrate M1 or the second display element portion 14 of the second mother substrate M2.

  After that, the liquid crystal material 400 is dropped on the inner region surrounded by the sealing material 300.

  Thereafter, the first mother substrate M1 and the second mother substrate M2 are disposed so that the first display element unit 12 and the second display element unit 14 face each other.

  Then, as shown in FIG. 9, the first mother substrate M1 and the second mother substrate M2 are bonded together by heating them while applying pressure in the bonding direction to the first mother substrate M1 and the second mother substrate M2. FIG. 12 shows a plan view of the bonded mother substrate pair.

  Then, the bonded mother substrate pair is cut along the cutting lines A, B1, and B2. In particular, as shown in FIG. 10, in the step of removing the region MX facing the mounting portion 10 of the second mother substrate M2, first, scribing is performed by a scribe member along the breaking line B2. Then, an impact is applied using a break bar or the like, the crack is advanced, and it is cut along the cutting line B2. Thereby, the region MX is removed, and as shown in FIG. 11, a liquid crystal display panel LPN holding the liquid crystal layer LQ between the array substrate AR and the counter substrate CT is formed.

  As described above, similarly to the case where the liquid crystal material 400 is vacuum-injected, the shield electrode ES is disposed so as not to overlap the breaking line B2. Therefore, the shield electrode ES is not scraped off in the cleaving process along the cleaving line B2, and contamination due to conductive foreign matter does not occur. That is, it is possible to prevent the mounting unit 10 from being contaminated, and it is possible to prevent a short circuit in the mounting unit 10. For this reason, the display quality of the display device can be improved and the manufacturing yield can be improved.

  In addition, the manufacturing time can be shortened by forming the liquid crystal layer LQ by dropping the liquid crystal material 400 before the first mother substrate M1 and the second mother substrate M2 are bonded to each other.

  In particular, as shown in FIGS. 6 and 12, the shield electrode ES is arranged so as not to overlap any of the breaking lines A, B1, and B2, so that in the cutting process along all the breaking lines, the shielding electrode ES The ES is not scraped off and no conductive foreign matter is generated. For this reason, it becomes possible to suppress the adhesion of the conductive foreign matter to each liquid crystal display panel LPN and the contamination of the surrounding manufacturing environment.

  As described above, according to the present embodiment, the liquid crystal display device can prevent a decrease in the yield of the display device while preventing the counter substrate CT from being charged.

  In addition, this invention is not limited to the said embodiment itself, In the stage of implementation, it can change and implement a component within the range which does not deviate from the summary. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

  When the liquid crystal material 400 is vacuum-injected, the shield electrode ES may be disposed so as to expose at least the end portion CTb along the side L1 where the injection port 300A is provided. In other words, an interval may be provided between the periphery of the shield electrode ES and the side L1 of the counter substrate CT, and the periphery of the shield electrode ES may be disposed so as to cross the injection port 300A. In the case where the mounting portion 10 is provided in the extending portion ARa of the array substrate AR, the shield electrode ES exposes at least the end portion C2 along the side L2 on the side where the mounting portion 10 is disposed. It suffices if they are arranged at intervals. Furthermore, the shield electrode ES is more preferably arranged so as to expose the end portions C1, C2, C3, and C4 along the four sides L1, L2, L3, and L4 of the counter substrate CT. That is, the shield electrode ES covers the entire surface of the display area DSP, and the area of the shield electrode ES may be smaller than the area of the counter substrate CT and larger than the area of the display area DSP.

  In the first embodiment, the shield electrode ES is formed larger than the display area DSP so as to have a contact with the metal frame FL outside the display area DSP. In the second embodiment, the shield electrode ES is Since the connection is made to the terminal portion ESa drawn to the end side of the counter substrate CT, the shield electrode ES may be formed so as to be approximately the same size as the display area DSP. By forming the shield electrode ES in this way, it is possible to ensure a long distance from the shield electrode ES to the breaking lines A and B (that is, a distance from the shield electrode to the edge of the counter substrate). For this reason, it is possible to further suppress contact of the cleaving member with the shield electrode ES when cleaving along the cleaving line. Further, since the size of the shield electrode ES can be reduced, the consumption of material can be suppressed, and the manufacturing cost can also be suppressed.

  In the above-described embodiment, the FFS mode in which the liquid crystal molecules are switched using the horizontal electric field has been described as an example of the liquid crystal mode. However, the present invention is not limited to this example. Other liquid crystal modes that need to be arranged, for example, TN (Twisted Nematic) mode, and multi-domain structure VA (Vertical Alignment) mode in which a slit is formed in the counter electrode, to make liquid crystal molecules The present invention can also be applied to a switching liquid crystal mode.

FIG. 1 is a diagram schematically showing a configuration of a liquid crystal mode liquid crystal display device using a lateral electric field according to an embodiment of the present invention. FIG. 2 is a plan view schematically showing the structure of a pixel electrode and a counter electrode of one pixel applied to the liquid crystal display device shown in FIG. FIG. 3 is a cross-sectional view schematically showing structures of an array substrate and a counter substrate applied to the liquid crystal display device shown in FIG. FIG. 4A is a cross-sectional view schematically showing structures of the array substrate and the counter substrate in the first embodiment. FIG. 4B is a plan view schematically showing the structure of the shield electrode and the metal frame in the first embodiment. FIG. 5A is a cross-sectional view schematically showing structures of an array substrate and a counter substrate in the second embodiment. FIG. 5B is a diagram schematically showing the configuration of the liquid crystal display device according to the second embodiment. FIG. 6 is a diagram for explaining a cleaving step in the method of manufacturing a liquid crystal display device. FIG. 7 is a diagram schematically showing the configuration of a liquid crystal mode liquid crystal display device using a horizontal electric field according to another embodiment. FIG. 8 is a diagram for explaining a manufacturing method when a liquid crystal material is dropped and injected, and is a diagram for explaining a step of dripping the liquid crystal material. FIG. 9 is a diagram for explaining a process of bonding the first mother substrate and the second mother substrate. FIG. 10 is a diagram for explaining a process of forming a scribe surface in order to remove a region facing the mounting portion of the second mother substrate. FIG. 11 is a cross-sectional view schematically showing the configuration of the liquid crystal display device formed through the steps of FIGS. FIG. 12 is a diagram for explaining a cleaving step in the method of manufacturing a liquid crystal display device.

Explanation of symbols

LPN ... Liquid crystal display panel AR ... Array substrate (first substrate)
CT: Counter substrate (second substrate)
LQ ... Liquid crystal layer DSP ... Display area PX ... Pixel EP ... Pixel electrode (second electrode)
ET ... Counter electrode (first electrode)
COM ... Common wiring IL ... Interlayer insulating film ES ... Shield electrode 30 ... Insulating substrate 32 ... Black matrix 34 ... Color filter layer BL ... Book light unit

Claims (12)

A first substrate;
A second substrate disposed to face the first substrate;
A liquid crystal layer made of a liquid crystal material held between the first substrate and the second substrate;
A sealing material for bonding the first substrate and the second substrate;
The second substrate includes a shield electrode on an outer surface thereof,
The liquid crystal display device, wherein the shield electrode is disposed on an outer surface of the second substrate so as to expose an end portion along at least one side of the second substrate. The first substrate is
A first electrode;
An interlayer insulating film disposed on the first electrode;
A second electrode disposed on the interlayer insulating film, facing the first electrode and having a slit;
The liquid crystal display device according to claim 1, further comprising:   The liquid crystal display device according to claim 2, wherein the shield electrode is disposed so as to cover the display area constituted by a plurality of pixels. The sealing material is arranged to form an inlet for injecting the liquid crystal material,
The said shield electrode is arrange | positioned so that the edge part along the edge | side of the said 2nd board | substrate with which the said injection hole was provided may be exposed in the outer surface of the said 2nd board | substrate. Liquid crystal display device. The first substrate includes a mounting portion in an extending portion extending outward from an end side of the second substrate,
The liquid crystal display device according to claim 2, wherein the shield electrode is disposed on the outer surface of the second substrate so as to expose an end portion along the end side.   The liquid crystal display device according to claim 5, wherein the sealing material is arranged in a loop shape. The sealing material is arranged so as to form an injection port for injecting the liquid crystal material into a side different from the side where the mounting part is arranged,
The said shield electrode is arrange | positioned so that the edge part along the edge | side of the said 2nd board | substrate with which the said injection hole was provided may be exposed in the outer surface of the said 2nd board | substrate. Liquid crystal display device. The second substrate is formed in a square shape,
The liquid crystal display device according to claim 2, wherein the shield electrode is disposed on the outer surface of the second substrate so as to expose end portions along four sides of the second substrate.   The liquid crystal display device according to claim 8, further comprising a metal frame in contact with the shield electrode.   The liquid crystal display device according to claim 8, further comprising a terminal portion that is electrically connected to the shield electrode and led out to one side of the second substrate. The first substrate has a wiring having a ground potential in an extending portion extending outward from an end side from which the terminal portion of the second substrate is drawn,
The liquid crystal display device according to claim 10, wherein the terminal portion and the wiring are connected via a conductive member. Forming a mounting portion and a first display element portion on one surface of the first substrate;
Forming a second display element portion on one surface of the second substrate;
Forming a shield electrode facing the second display element portion without overlapping the breaking line on the other surface of the second substrate;
Applying a sealing material so as to surround the first display element unit or the second display element unit;
Bonding the first substrate and the second substrate so that the first display element unit and the second display element unit face each other;
A step of cleaving the opposing region of the mounting portion of the second substrate along a cleaving line, and a liquid crystal display device formed through
The liquid crystal display device, wherein the shield electrode is disposed on the other surface of the second substrate so as to expose an end portion along at least one side of the second substrate.

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