TW201724344A - Support body separation device and support body separation method capable of detecting support body having its holding portion failing holding laminated body - Google Patents

Abstract

The subject of the present invention is to detect the support body whose holding portion could not hold a laminated body. The support body separation device (100) as the solution of the present invention comprises a claw portion (1) for holding a support plate (17), a driving portion (2), a magnetic sensor (3) for detecting the position of the claw portion (1) that is moved by the driving portion (2), and a control portion for controlling the claw portion (1) to move to an initial position while the magnetic sensor (3) detected that the claw portion (1) is moved closer the inner side than a predetermined area.

Description

Support separation device and support separation method

The present invention relates to a support separation device and a support separation method.

In recent years, electronic devices such as IC cards and mobile phones have been required to be thinner, smaller, and lighter. In order to satisfy these requirements, it is also necessary to use a thin semiconductor wafer with respect to the semiconductor wafer to be incorporated. Therefore, the thickness (film thickness) of the wafer substrate which is the base of the semiconductor wafer is 125 μm to 150 μm in the current state, but the next generation wafer must be 25 μm to 50 μm. Therefore, in order to obtain the above-mentioned wafer thickness of the wafer substrate, a thinning process of the wafer substrate is required.

In order to prevent the wafer substrate from being damaged by the thinning of the wafer substrate, the wafer is automatically transferred while being bonded to the wafer substrate in the process, and is on the wafer substrate. A structure such as a circuit is mounted. Then, after the process, the wafer substrate and the auxiliary board are separated. Therefore, various methods of peeling off the support from the wafer have hitherto been used.

Patent Document 1 describes that the connection is rotatably disposed in The robot arm of the machine holder holds the robot of the wafer transfer robot that transports the wafer, and has a robot that holds the grip portion on the outer peripheral surface of the wafer.

Patent Document 2 describes a method in which a peeling and transmitting adhesive is bonded to a semiconductor wafer having a rigid support, and includes an insertion process for inserting the insert member into the adhesive, and plucking the semiconductor wafer from the support. A method of peeling off a semiconductor wafer by applying vibration to the adhesive material.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 11-116046 (published on Apr. 27, 1999)

[Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-32506 (published on Feb. 2, 2006)

Patent Document 1 does not disclose a support separation device and a support separation method that can prevent the substrate from being damaged when the substrate and the support are separated.

In the support separation method described in Patent Document 2, since the tip end of the board is inserted between the wafer and the support, the wafer is broken at the time of insertion of the board.

Further, the method of separating the support described in Patent Document 2 does not disclose a method of detecting that the grip portion fails to hold the support of the laminate.

The present invention has been made in view of the above problems, and an object thereof is to provide a support separation device capable of detecting a support in which a grip portion fails to hold a laminate, and a related art thereof.

In order to solve the above problems, the inventors of the present invention have determined the results of the review and have arrived at the following invention.

The support separation device of the present invention is a support separation device that separates the support from the support substrate and the support that supports the substrate, and is characterized in that it has a plurality of claws and holds the aforementioned a peripheral end portion of the support body of the laminate; the drive portion moves the claw portions individually in parallel with respect to a plane portion of the support body; and the detecting portion individually detects the claws moved by the driving portion And the control unit is configured to control all of the plurality of claws when the detecting unit detects that at least one of the plurality of claws moves to be inside the predetermined area, and moves to an initial position. unit.

Moreover, the support separation method of the present invention is a method of separating a support body from a laminate obtained by attaching a substrate and a support supporting the substrate, and is characterized in that the support body is separated by a plurality of claws. Grip holding the outer peripheral end of the aforementioned support body of the aforementioned laminate; In the gripping process, the respective positions of the claws that are moved are individually detected, and when at least one of the plurality of claws is detected to be moved to the inner side than the predetermined area, the movement is controlled to the initial position. All of the aforementioned plurality of claws.

The present invention can exert the effects of providing a support separation device capable of detecting a support body in which the grip portion fails to hold the laminate, and related art.

1‧‧‧ claws

1a‧‧‧ capture surface (claw)

1b‧‧‧Sloping surface (claw)

1c‧‧‧Adjustment Department

1d‧‧‧ screw shaft

1e‧‧‧Flat Department

2‧‧‧ Drive Department

2a‧‧‧Moving shaft (driver)

2b‧‧‧Support Department (Drive Department)

3‧‧‧Magnetic sensor (detection department)

3a‧‧‧ Magnet (detection department)

3b‧‧‧Sensing head (detection department)

3c‧‧‧Sensing head (detection department)

4‧‧‧Separation board (board part)

4a‧‧‧Abutment (board)

6‧‧‧ hook stop

7‧‧‧ bearing part (hook stop)

7a‧‧‧Cone surface (opening surface, hook stop)

8‧‧‧Abutment (hook stop)

8a‧‧‧Fitting surface (hook stop)

9‧‧‧Axis (hook stop)

10‧‧‧ Lifting Department

13‧‧‧ lifting plate

14‧‧‧ Platform (fixed department)

15‧‧‧Porous Department

16‧‧‧The outer part

17‧‧‧Auxiliary board (support)

17a‧‧‧Chamfering part (support)

18‧‧‧Next layer

19‧‧‧Substrate

20‧‧‧Layer

23‧‧‧Control Department

100‧‧‧Support body separation device

Fig. 1 is a view showing the outline of a support separating apparatus 100 according to an embodiment of the present invention.

Fig. 2 is a view for explaining an outline of the operation of the support separating apparatus 100 according to the embodiment of the present invention.

[Fig. 3] A schematic view of a claw portion 1 provided in a support separating device 100 according to an embodiment of the present invention.

Fig. 4 is a block diagram showing the outline of a support separating apparatus 100 according to an embodiment of the present invention.

<Support body separation device 100>

Supporting body separation for an embodiment of the present invention using Figures 1-4 The device 100 will be described in detail.

Fig. 1(a) is a view showing the arrangement of the bearing portion 7 and the abutting portion 8 which are provided in the hook portion 6 of the lift plate 13 in a plan view, and the claws provided in the separating plate (plate portion) 4 located under the lift plate 13. A diagram of the configuration of the section 1. Further, Fig. 1(b) is a schematic view showing the support separation device 100 in accordance with the A-A' line arrow cross section shown in Fig. 1(a).

As shown in FIGS. 1(a) and 1(b), the support separating device 100 of the present embodiment includes a plurality of claw portions (grip portions) 1, a plurality of hook portions 6, and a lifting portion 10. Here, the elevating portion 10 passes through the elevating plate 13, and the hooking portion 6 hooks the separating plate 4, whereby the claw portion 1 disposed on the outer peripheral portion of the separating plate 4 is moved up and down. Further, the claw portion 1 is moved by the driving portion 2.

Further, the control unit 23 controls the operations of the drive unit 2 and the lift unit 10 in accordance with the position of the claw portion 1 detected by the magnetic sensor (detection unit) 3.

Further, the support separation device 100 includes a stage (fixed portion) 14 on which the laminate 20 formed by the sequential laminate auxiliary plate (support) 17, the subsequent layer 18, and the substrate 19 is fixed. The adhesive layer 18 of the laminate 20 is reduced in adhesion by swelling due to swelling or the like.

Further, in the support separation device 100 of the present embodiment, the dicing tape 21 is bonded to the substrate 19 side of the laminate 20 fixed to the stage 14, and the dicing tape 21 is provided with the dicing frame 22.

As shown in FIG. 1(a), in the support body separating device 100, the bearing portion 7 and the abutting portion 8 of the plurality of hook portions 6 are formed on the lift plate 13 The peripheral portions are arranged at medium intervals. Further, the plurality of claws 1 are disposed on the separation plate 4 at equal intervals with the drive unit 2 interposed therebetween. The hook portion 6 and the claw portion 1 are alternately arranged, and the hook portion 6 and the claw portion 1 are disposed at an intermediate interval in plan view. Therefore, by raising the elevating portion 10, the force applied to the hooking portion 6 through the elevating plate 13 is equally applied to the plurality of claw portions 1 disposed on the separating plate 4. Therefore, when the stacked body 20 is gripped (held) by the plurality of claws 1, and the lifting and lowering portion 10 lifts the separating plate 4 through the hook stopping portion 6, the force can be equally applied to the laminated body 20 from the plurality of claw portions 1. .

Hereinafter, the claw portion 1, the driving portion 2, the magnetic sensor 3, the separating plate 4, the hooking portion 6, the lifting portion 10, the stage 14, and the control portion 23 provided in the support separating device 100 will be described in more detail.

[Claw 1]

The claw portion 1 provided in the support separating device 100 of the present embodiment will be described in more detail with reference to Figs. 2 and 3 .

(a) to (c) of FIG. 2 are views showing an outline of the operation of the support separation device 100 of the present embodiment. In addition, in FIGS. 2(a) to 2(c), the elevating portion 10 included in the support separating device 100 is omitted. 3(a) is a schematic view showing the claw portion 1 and the adjustment portion 1c provided in the claw portion 1, and FIG. 3(b) is a view showing the inclined surface 1b of the claw portion 1 and abutting on the laminated body 20 The state of the chamfered portion 17a of the auxiliary plate 17 is shown in Fig. 3(c) in the BB' line arrow cross section of Fig. 3(a), and the capturing surface 1a captures the outer periphery of the auxiliary plate 17 of the laminated body 20. A diagram of the state before the end.

First, as shown in Fig. 2(a), the plurality of claws 1 are separated by The off-board 4 is lowered in the Y-axis direction by the elevating portion 10, and is disposed on the outer side of the outer peripheral end portion of the auxiliary plate 17 that abuts against the abutting surface 4a of the separating plate 4.

Further, the plurality of claw portions 1 are arranged at equal intervals with respect to the outer peripheral end portions of the separating plate 4 (Fig. 1 (a)). Further, in the state in which the claw portion 1 is held at the outer peripheral end portion of the auxiliary plate 17, a pitch (gap) is provided between the outer peripheral end portion of the separating plate 4 (Fig. 2(b)).

The material for forming the claw portion 1 may be appropriately selected depending on the material of the auxiliary plate 17 to be held. Therefore, as the material for forming the claw portion, a metal such as stainless steel or aluminum, an engineering plastic or the like can be used. Further, when the material of the auxiliary plate 17 is glass, it is more preferably formed of an aromatic polyetherketone (Aromatic polyether ketone) which is an engineering plastic, and an aromatic polyetheretherketone is used even in the aromatic polyether ketone. PEEK), polyetherketoneketone (PEKK) having an aromatic group, and polyetheretherketoneketone (PEEKK) having an aromatic group are preferred, and PEEK is most preferred. Thereby, when the outer peripheral end portion of the auxiliary plate 17 made of glass is held by the claw portion 1, the auxiliary plate 17 can be prevented from being damaged.

As shown in FIGS. 3( a ) to 3 ( c ), the claw portions 1 each have a capturing surface 1 a and an inclined surface 1 b , and include an adjusting portion 1 c .

(capture face 1a)

The capturing surface 1a captures the outer peripheral end of the auxiliary plate 17. Here, the capturing surface 1a is a surface that is perpendicular to the abutting surface 4a of the separating plate 4, and is curved like the outer peripheral end of the auxiliary plate 17, or a curved surface of a larger arc.

The capturing surface 1a of the plurality of claws 1 is in a state in which the flat portion of the auxiliary plate 17 abuts against the abutting surface 4a of the separating plate 4, and surrounds the outer peripheral end portion of the auxiliary plate 17 so as to face the center point of the separating plate 4. Move in mode (Fig. 2(a) and (b)). Here, the capturing surface 1a of the plurality of claw portions 1 is approached to the outer peripheral end portion of the auxiliary plate 17 at the same speed by the driving portion 2. Therefore, the laminated body 20 can be induced while the center point of the auxiliary plate 17 of the laminated body 20 overlaps with the center point of the separating plate 4 by the capturing surface 1a, while the outer peripheral end of the auxiliary plate 17 is gripped. unit. Further, the capturing surface 1a which is curved in the same manner as the outer peripheral end portion of the auxiliary plate 17 or which is curved in a larger arc shape is abutting against the outer peripheral end portion of the auxiliary plate 17 in the vicinity of the center point of the circular arc. Board 17. Therefore, in the center portions of the plurality of capturing faces 1a, the circular auxiliary plate 17 can be held. Therefore, the outer peripheral end portions of the auxiliary plates 17 can be gripped at equal intervals and smoothly by the plurality of claw portions 1. Therefore, when the separation plate 4 is lifted, the force applied to the auxiliary plate 17 by the plurality of claw portions 1 can be made equal.

(inclined surface 1b)

As shown in FIG. 3(b), the inclined surface 1b is a non-curved plane in which the laminated body 20 abuts against the chamfered portion 17a of the auxiliary plate 17. The inclined surface 1b is provided along a portion of the center point including the end side of the capturing surface 1a.

The inclined surface 1b is in the surface direction of the abutting surface 4a of the separating plate 4, and the inclination from the outer circumference toward the inner circumference of the abutting surface 4a is larger as it goes away from the abutting surface 4a (Fig. 3(b)). Thereby, in the outer peripheral end portion of the auxiliary plate 17, the chamfered portion on the back side of the surface facing the separation plate 4 17a, can abut the inclined surface 1b.

The inclined portion 1b has an inclination in a range of 30° or more and less than 90° with respect to the abutting surface 4a of the separating plate 4. Thereby, it is possible to prevent an excessive force from being applied to the chamfered portion 17a of the auxiliary plate 17 from the inclined surface 1b. Further, in a state in which the planar portion of the auxiliary plate 17 abuts against the abutting surface 4a of the separating plate 4, the inclination of the inclined surface 1b is set so as to be parallel to the inclination of the chamfered portion 17a of the auxiliary plate 17, because It is preferable that the end portion of the chamfered portion 17a does not concentrate excessive force.

Further, the inclined surface 1b is provided along the end side of the capturing surface 1a separated from the abutting surface 4a of the separating plate 4, and is provided at a part including the center point of the end side. Thereby, the outer peripheral end portion of the auxiliary plate 17 to be caught can smoothly abut against the center point of the arc of the capturing surface 1a of the claw portion 1 in a state in which the inclined surface 1b close to the plane is brought into close contact with the plane. nearby. Therefore, the support body separating device 100 holds the outer peripheral end portion of the auxiliary plate 17 in a state of being brought close to a large point by the plurality of inclined faces 1b arranged at equal intervals so as to surround the separating plate 4. Therefore, the force for gripping the auxiliary plate 17 can be equally applied from the plurality of inclined faces 1b, and when the separation plate 4 is lifted, the outer peripheral end portion of the auxiliary plate 17 abutting against the plurality of inclined faces 1b can be prevented from the inclined face 1b. Get rid of.

Further, as shown in FIG. 3(b), the lower end of the inclined surface 1b is disposed on the same plane as the surface of the auxiliary plate 17 facing the substrate 19. Thereby, the inclined surface 1b can be prevented from being caught by the substrate 19, the subsequent layer 18, and the like. Therefore, only the inclined surface 1b is brought into contact with the auxiliary plate 17, and the auxiliary plate 17 can be smoothly gripped by the claw portion 1.

[Adjustment section 1c]

As shown in Fig. 3 (a), the adjustment portion 1c includes a screw shaft 1d and a flat portion 1e, and the claw portion 1 is vertically moved to the abutting surface 4a of the separating plate 4 by pushing the screw shaft 1d against the flat portion 1e. Thereby, the distance between the lower end of the inclined surface 1b of the claw portion 1 and the abutting surface 4a of the separating plate 4 can be adjusted in accordance with the thickness of the auxiliary plate 17. Therefore, the chamfered portion 17a of the auxiliary plate 17 can be more accurately held by the claw portion 1 without depending on the thickness of the auxiliary plate 17 of the laminated body 20. Further, the adjustment of the distance between the abutting surface 4a of the separating plate 4 by the adjusting portion 1c may be performed in advance in accordance with the type of the support to be separated.

[Drive unit 2]

The drive unit 2 includes a movement shaft 2a that moves the claw portion 1, and a support portion 2b that movably supports the movement shaft 2a. The driving unit 2 is disposed at an upper surface portion of the separating plate 4 at equal intervals, and moves the claw portions 1 in such a manner as to approach or close to the outer peripheral end portion of the separating plate 4 along the abutting surface 4a of the separating plate 4 in parallel. (Figure 2 (a) and (b)). Moreover, the drive unit 2 moves the respective claw portions 1 toward the outer peripheral end portion of the auxiliary plate 17 at the same speed. Thereby, the outer peripheral end portion of the auxiliary plate 17 can be gripped by the claw portion 1 while being surrounded. Furthermore, the complex drive unit 2 controls the operation by the control unit 23.

[Magnetic Sensor 3]

The magnetic sensor (detection unit) 3 detects the movement of the driven portion 2 individually The respective positions of the claws 1.

As shown in FIGS. 2(a) and 2(b), the magnetic sensor 3 includes a magnet 3a fixed to the moving shaft 2a of the driving unit 2, and the magnet 3a is detected before being placed in the moving direction of the magnet 3a. The two sensing heads 3b and 3c are displaced. Here, the magnet 3a moves at the same time when the moving shaft 2a moves the claw portion 1. At this time, the two sensing heads 3b and 3c detect the movement of the moving shaft 2a in response to the change in the magnetic force emitted from the magnet 3a, and the magnet 3a is displaced and moved.

The two sensing heads 3b and 3c quantify the distance between the sensing heads 3b and 3c with reference to the two positions, for example, a value of 0 to 100. For example, when the distance between the sensing heads 3b and 3c is set to a few mm, the position of the claw portion 1 can be determined by the μm level. Based on the scaled value, the sensing heads 3b and 3c determine the position of the magnet 3a. Thereby, the position of the claw portion 1 at the same distance by the movement of the moving shaft 2a and the magnet 3a can be accurately determined. More specifically, in the range of the scaled value, it is determined that the claw portion 1 is disposed at a position before the outer peripheral end portion of the grip auxiliary plate 17, or the claw portion 1 is holding the outer peripheral end portion of the auxiliary plate 17, and Or the claw portion 1 fails to grip the outer peripheral end portion of the auxiliary plate 17. For example, when the value indicating the value of the scaled value in the range of 0 to 100 is greater than 60, it can be determined that the claw portion 1 is disposed before the outer peripheral end portion of the grip auxiliary plate 17, indicating that it is greater than 10 and 60. When the value is the following, it can be determined that the claw portion 1 is disposed at the outer peripheral end portion of the grippable auxiliary plate 17, and when the value is 0 or more and 10 or less, it can be determined that the claw portion 1 is disposed to be more than the grippable auxiliary. The arrangement of the gauge value and the claw portion is adjusted such that the position of the outer peripheral end portion of the plate 17 is further inside. here, When the claw portion 1 is disposed further inside than the position at which the outer peripheral end portion of the auxiliary plate 17 can be gripped, it can be confirmed that the claw portion 1 fails to grip the outer peripheral end portion of the auxiliary plate 17. As described above, by using the magnetic sensor 3, it is possible to determine not only whether the claw portion 1 is gripping the outer peripheral end portion of the auxiliary plate 17, but also whether or not the claw portion 1 fails to grip the outer peripheral end portion of the auxiliary plate 17. Further, the determination by the magnetic sensor 3 is performed in the complex drive unit 2, respectively.

In the support separation device 100 of the present embodiment, a magnetic sensor is used, but the detection unit is not limited to the magnetic sensor. Specifically, any sensor can be used as long as it is a position detecting sensor that can detect the displacement of the object by light, ultrasonic or laser.

As the position detecting sensor, in addition to the magnetic sensor, for example, an ultrasonic sensor, an eddy current sensor, a laser sensor, a contact sensor, or the like can be given.

[Separation plate 4]

The separating plate (plate portion) 4 has a circular shape equal to the auxiliary plate 17, and the diameter of the separating plate 4 is equal to or slightly smaller than the diameter of the auxiliary plate 17. Further, the separating plate 4 has an abutting surface 4a on the bottom surface side (Fig. 1(b)).

The separating plate 4 is attached to the upper surface portion, and the plurality of claw portions 14a attached to the plurality of driving portions 2 are provided at equal intervals (Fig. 1 (a)).

Thereby, when the separation plate 4 lifts the auxiliary plate 17 from the laminated body 20 fixed to the stage 14, the auxiliary plate 17 can be prevented from being warped. Therefore, when the auxiliary plate 17 is separated from the laminated body 20, the auxiliary plate 17 can be prevented from being damaged.

[hook stop 6]

The plurality of hook portions 6 hook the separation plate 4 to the lift plate 13 provided in the lift unit 10. In addition, the hooking portion 6 moves up and down along the Y-axis direction (elevating direction) shown in FIG. 1(b) as the lifting portion 10 moves up and down, and raises and lowers the hooking separation plate 4. Accordingly, the drive unit 2 and the claw portion 1 provided on the separation plate 4 are moved up and down.

The plurality of hook portions 6 are provided with a bearing portion 7, a contact portion 8, and a shaft portion 9, respectively.

The bearing portion 7 has a hole that penetrates the vertical direction along the Y axis shown in FIG. 1(b), and the shaft portion 9 including the contact portion 8 is inserted into the hole. Here, the bearing portion 7 has a conical tapered surface (opening surface) 2a that expands upward in the Y-axis direction.

The abutting portion 8 is provided on the upper side in the Y-axis direction of the shaft portion 9, and has a fitting surface 8a fitted to the tapered surface 7a on a surface facing the tapered surface 7a of the bearing portion 7.

Further, as shown in Fig. 1(b), in the state in which the abutting surface 4a of the separating plate 4 is not in contact with the auxiliary plate 17 of the laminated body 20, the fitting surface 8a of the abutting portion 8 is fitted to The tapered surface 7a of the bearing portion 7. Thereby, the separating plate 4 is hooked to the lifting plate 13 by the hooking portion 6.

(a) to (c) of FIG. 2 are views showing an outline of the operation of the support separation device 100 of the present embodiment. In addition, in FIGS. 2(a) to 2(c), the elevating portion 10 included in the support separating device 100 is omitted.

As shown in Fig. 2(a), the lifting plate 13 is arranged along the Y-axis direction. After the flat portion of the auxiliary plate 17 of the laminated body 20 abuts against the abutting surface 4a of the separating plate 4, and further, when the lifting plate 13 is lowered, the tapered surface 7a of the bearing portion 7 of the hooking portion 6 is The fitting surface 8a provided in the abutting portion 8 of the shaft portion 9 is separated, and the shaft portion 9 is slid inside the hole of the bearing portion 7. That is, when the lifting portion 10 is lowered, the force applied to the lifting plate 13 is not caused by the hooking portion 6 to hook the separating plate 4 to the lifting plate 13, and is not transmitted from the lifting plate 13 to the separating plate 4. Therefore, it is possible to prevent the force from being applied to the laminated body 20 from the lifting plate 13 through the abutting surface 4a of the separating plate 4. Therefore, the laminated body 20 can be prevented from being excessively applied, and the laminated body 20 can be broken.

Further, the tapered surface 7a of the bearing portion 7 and the fitting surface 8a of the abutting portion 8 provided on the shaft portion 9 are not depending on the thickness of the laminated body, and the abutting surface 4a of the separating plate 4 abuts against the laminated body. Separation allows force to be transmitted from the lifting plate 13 to the separating plate 4. That is, it is possible to prevent an excessive force from being applied to the laminate by the separation plate 4 without depending on the thickness of the laminate. Therefore, it is not necessary to adjust the position at which the separation plate is lowered in accordance with the thickness of the laminate. Therefore, the laminated body 20 can be abutted against the abutting surface 4a of the separating plate 4 without depending on the thickness of the laminated body, and the outer peripheral end portion of the auxiliary plate 17 of the laminated body 20 can be gripped smoothly by the claw portion 1. (Fig. 2(b)).

Thereafter, as shown in FIG. 2( c ), the lift plate 13 is raised upward in the Y-axis direction while the auxiliary plate 17 is held by the claw portion 1 . Thereby, the shaft portion 9 is slid inside the hole of the bearing portion 7, and the tapered surface 7a of the bearing portion 7 is fitted to the fitting surface 8a of the abutting portion 8. Therefore, the force for lifting the lift plate 13 when the lift unit 10 is raised is transmitted to the claw portion 1 of the separating plate 4 and the separating plate 4 through the hook portion 6. Here, the hook portion 6 is lifted In the case of the separation plate 4, the separation plate 4 can be placed at a specific position with respect to the lift plate 13 by the fitting surface 8a of the tapered surface 7a of the fitting bearing portion 7 and the abutting portion 8. Therefore, by the plurality of hook portions 6 and the plurality of claw portions 1 shown in Figs. 1 (a) and (b), a force can be uniformly applied to the laminated body 20, and the auxiliary plate 17 can be smoothly separated (Fig. 2 (c )).

Further, the support separation device 100 is provided on the peripheral portion of the lift plate 13 and has three hook portions 6 at equal intervals. However, the number of the hook portions is not limited as long as the separation plate (plate portion) can be hooked. Further, the fitting surface of the abutting portion of the hooking portion and the opening surface of the bearing portion may be fitted to each other. For example, the fitting surface of the abutting portion is a cylindrical convex shape larger than the diameter of the shaft portion, and the opening is opened. The surface may be a concave type that is fitted to the convex shape.

[lifting unit 10]

The lift unit 10 is provided with a lift plate 13 that is fixed to the lift unit 10. The elevating portion 10 is hooked and held by the separating plate 4 of the elevating plate 13 by the plurality of hook portions 6, and is moved up and down.

The speed at which the elevating portion 10 of the holding auxiliary plate 17 is raised in a state where the substrate 19 is fixed to the stage 14 is preferably 0.1 mm/sec or more and 2 mm/sec or less. Thereby, the substrate 19 and the auxiliary board 17 can be prevented from being burdened with excessive force. Therefore, the auxiliary board 17 can be gradually separated.

[platform 14]

The platform 14 is a substrate 19 that holds the laminate 20. In the support separation device 100 of the present embodiment, the stage 14 is provided with the porous portion 15 and The outer peripheral portion 16. The laminate 20 of the adhesive dicing tape 21 is placed on the stage 14 such that the laminate 20 is placed on the porous portion 15.

(Porous portion 15)

The porous portion 15 is a porous portion provided in the outer peripheral portion 16. The porous portion 15 can attract the substrate 19 of the laminate 20 in which the dicing tape 21 is bonded to the porous portion thereof by a pressure reducing portion (not shown). Thereby, the substrate 19 can be ideally fixed to the stage 14.

In the present embodiment, the platform 14 is provided with the porous portion 15 and the outer peripheral portion 16. However, in the present invention, any substrate 19 may be used as long as the substrate 19 of the laminate 20 can be fixed.

[Control Unit 23]

As shown in FIG. 4, the control unit 23 controls the drive unit 2, the magnetic sensor 3, and the lift unit 10. The control unit 23 is communicably connected to the drive unit 2, the magnetic sensor 3, and the elevation unit 10 by wired or wireless communication. Hereinafter, an example of the operation of the support separation device 100 by the control unit 23 will be described.

First, the control unit 23 lowers the elevating unit 10 so that the abutting surface 4a of the separating plate 4 abuts against the flat surface of the auxiliary plate 17 of the laminated body 20 fixed to the stage 14. Next, the control unit 23 transmits a command to move the moving shaft 2a of the driving unit 2 so that the plurality of claws 1 grip the outer peripheral end portion of the auxiliary plate 17.

Next, the control unit 23 determines that each of the control units 23 is set to plural The scaled value shown by the magnetic sensor 3 of the drive unit 2 determines whether or not each of the claw portions 1 is holding the outer peripheral end portion of the auxiliary plate 17.

Here, the control unit 23 raises the lift unit 10 when it is determined that all the claws 1 are disposed at the position of the outer peripheral end of the auxiliary plate 17 in accordance with the scaled values indicated by all the magnetic sensors 3. Thereby, the separation plate 4 hooked by the hooking portion 6 is lifted, and accordingly, all the claw portions 1 are lifted up. Therefore, a force is applied in such a manner that the auxiliary plate 17 is separated from the laminated body 20. Thereby, when the auxiliary board 17 is separated from the laminated body 20, the separation of the auxiliary board 17 is completed, and the support body separation apparatus 100 performs the following processes.

Further, when the control unit 23 raises the elevating unit 10 and applies a force to separate the auxiliary plate 17 from the laminated body 20, when at least one of the claws 1 is disengaged from the auxiliary plate 17, the gripping claw 1 is applied to the disengaged claw portion 1. The driving portion 2 of the force of the plate 17 moves the claw portion 1 toward the outer peripheral end portion of the separating plate 4. Therefore, the scaled value shown by the magnetic sensor 3 becomes smaller than a value within a predetermined range determined to be the outer peripheral end portion of the claw-side holding auxiliary plate 17. When the control unit 23 confirms that the scaled value shown by the magnetic sensor 3 is smaller than the predetermined range, the control unit 23 lowers the lift unit 10, and moves the claws 1 to the initial position of the drive unit 2 The command is sent in the same way. Thereafter, the control unit 23 instructs the drive unit 2 so that all the claw portions 1 grip the outer peripheral end portion of the auxiliary plate 17, and then sends an instruction to the lift unit 10 to raise it. When the auxiliary plate 17 is separated from the laminated body 20 by the separate separating operation, the separation of the auxiliary plate 17 is completed, and the support body separating device 100 performs the following work. Further, in the re-separation operation, if the separation of the auxiliary plate 17 fails, the control unit 23 transmits the same. The robot arm (not shown) conveys the laminated body 20 which failed the separation to the outside. The laminate 20 conveyed to the outside of the support separation device 100 is again swollen by the peeling liquid.

Further, the number of times the control unit 23 performs the separation operation again may be selected by the user and may be instructed by the control unit 23.

Further, when the laminated body that has failed to be separated has a separation layer on the surface opposite to the adhesive layer of the auxiliary plate, the separation layer is irradiated with light through the auxiliary plate to deteriorate the separation layer, and the adhesion may be lowered.

[Layer 20]

As shown in Fig. 1(b), the laminate 20 of the auxiliary plate 17 is separated by the support separation device 100 of the present embodiment, and will be described in detail. The laminate 20 is attached to the substrate 19 and the auxiliary plate 17 through the adhesive layer 18.

(auxiliary board 17)

The auxiliary board 17 is attached to the substrate 19 through the adhesive layer 18 in order to prevent the substrate 19 from being damaged or deformed during the process of thinning, transporting, or mounting the substrate 19.

In the laminate 20 separated by the support separation device 100 of the present embodiment, the auxiliary plate 17 has a circular plate shape in plan view, and a plurality of through holes are provided in the thickness direction. The auxiliary plate 17 can swell the adhesive layer 18 by supplying the peeling liquid from the through holes.

The auxiliary plate (support) 17 is a support for supporting the substrate 19, and is attached to the substrate 19 through the adhesive layer 18. Therefore, as the auxiliary board 17, in In the process of thinning, transporting, or mounting the substrate 19, it is necessary to have necessary strength in order to prevent breakage or deformation of the substrate 19. Further, the auxiliary plate may be formed by a separation layer formed by illuminating the surface on the side opposite to the adhesion layer. Therefore, it is sufficient to transmit light for deteriorating the separation layer. From the above viewpoints, examples of the auxiliary plate 17 include glass, enamel, and acrylic resin.

Further, the auxiliary plate 17 can be used in a thickness of 300 to 1000 μm. According to the support separation device 100 of the present embodiment, even in the support having a small thickness, the outer peripheral end portion of the support can be smoothly gripped while preventing the support from being damaged.

(Next layer 18)

Next, the layer 18 is bonded to the substrate 19 and the auxiliary board 17, and is formed by applying an adhesive to the substrate 19. The coating method of the adhesive agent for the substrate 19 or the auxiliary plate 17 is not particularly limited, and examples thereof include a method of spin coating, dipping, roller scraping, spray coating, and slit coating. Further, the bonding layer 18 may be formed by, for example, directly applying a bonding agent to the substrate 19, and attaching a film (so-called dry film) on which both surfaces are applied with an adhesive to the substrate 19.

The thickness of the layer 18 can be appropriately set in accordance with the type of the substrate 19 and the auxiliary plate 17 to be bonded, the treatment applied to the subsequent substrate 19, and the like, preferably 10 to 150 μm, more preferably 15 to 100 μm.

As the adhesive for forming the adhesive layer 18, it can be used without any particular limitation, and a thermoplastic material which can improve thermal fluidity by heating can be used. It is better. Examples of the thermoplastic adhesive material include an acrylic resin, a styrene resin, a maleic imine resin, a hydrocarbon resin, an elastomer, and a polyfluorene resin.

(substrate 19)

The substrate 19 can be supplied to a process of thinning, mounting, or the like in a state where it is supported by the auxiliary plate 17 via the adhesive layer 18. The substrate 19 is not limited to the ruthenium wafer substrate, and any substrate such as a ceramic substrate, a film substrate, or a flexible substrate can be used.

(Cutting Tape 21)

The dicing tape 21 is bonded to the substrate 19 side of the laminated body 20, and is used for cutting the substrate 19 after peeling the auxiliary plate 17.

As the dicing tape 21, for example, a dicing tape 21 having a structure in which an adhesive layer is formed on a base film can be used. As the base film, for example, a resin film of PVC (polyvinyl chloride), polyolefin or polypropylene can be used.

(Cutting frame 22)

On the outer periphery of the exposed face of the dicing tape 21, a cutting frame 22 for preventing the dicing tape 21 from being bent is attached. The cutting frame 22 is, for example, a metal cutting frame made of aluminum or the like, a cutting frame made of an alloy such as stainless steel (SUS), or a resin cutting frame.

<Support separation method>

The support separation method according to the embodiment of the present invention is a laminate body 20 formed by attaching the substrate 19 and the auxiliary plate (support) 17 of the support substrate 19, and a method for separating the support of the auxiliary plate 17, including Holding the outer peripheral end of the auxiliary plate of the laminated body 20 by the plurality of claws 1; in the holding process, the respective positions of the moving claws 1 are individually detected, and the plurality of claws are detected When at least one of 1 moves to the inside of the predetermined area, all of the plurality of claws 1 are controlled in such a manner as to move to the initial position.

Further, in the support separation method according to the embodiment of the present invention, when the claw portion 1 is moved to the inside of the predetermined region, all of the plurality of claw portions 1 are moved to the initial position, and then the same is performed again. The laminate 20 can also be held by a holding project.

Further, in the support separation method according to the embodiment of the present invention, the flat portion of the auxiliary plate 17 is brought into contact with the abutting surface 4a that abuts against the flat portion of the auxiliary plate 17 in the gripping process; The chamfered portion 17a of the auxiliary plate 17 abuts against the abutting surface 4a in the surface direction of the abutting surface 4a, and the inclination of the outer peripheral portion toward the inner circumference of the abutting surface 4a is larger. Multiple inclined faces 1b to better hold the auxiliary plate

Further, in the support separation method according to the embodiment of the present invention, the end surface of the inclined surface 1b of the claw portion 1 is adjusted in accordance with the thickness of the auxiliary plate 17 in the surface direction of the contact surface 4a before the gripping process. The adjustment of the distance between the abutting faces 4a is better.

A support separation method according to an embodiment of the present invention is provided with a contact surface 4a in a holding process, and is movable to the upper and lower sides. The separating plate (plate portion) 4 that has been hooked thereto is lowered, and the abutting surface 4a may be in contact with the flat portion of the auxiliary plate 17.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention, and the embodiments obtained by appropriately combining the technical means disclosed in the respective embodiments are also included in the technical scope of the present invention.

[Industry use possibility]

The support separation device and the support separation method of the present invention can be widely used, for example, in the manufacturing process of a miniaturized semiconductor device.

1‧‧‧ claws

2‧‧‧ Drive Department

3‧‧‧Magnetic sensor

3a‧‧‧ Magnet

3b‧‧‧Sensing head

3c‧‧ ‧Sensing head

4‧‧‧Separation board

6‧‧‧ hook stop

10‧‧‧ Lifting Department

23‧‧‧Control Department

100‧‧‧Support body separation device

Claims (11)

A support separation device is a support separation device that separates a support from a substrate and a support for supporting the substrate, and is characterized in that the support separation device includes a plurality of claws and holds the laminate a driving portion that moves the claw portions individually in parallel with respect to a plane portion of the support body; and the detecting portion individually detects the claw portion moved by the driving portion And the control unit controls the all of the plurality of claws so as to move to the initial position when the detecting unit detects that at least one of the plurality of claws moves to the inside of the predetermined area. The support separation device according to claim 1, wherein the detection unit includes a position detecting sensor that detects displacement of the claw portion. The support separation device according to the first or second aspect of the invention, wherein the drive unit includes a movement axis and a support unit that movably supports the movement axis; and the detection unit includes at least one a magnet, and at least two sensing heads for detecting displacement of the magnet; the claws are disposed on the support body disposed opposite to the holder An end portion of the moving shaft on the outer side of the outer peripheral end portion; the sensing head is disposed on a front side and a rear side of the moving direction of the moving shaft of the support portion; and the magnet is fixed to the moving shaft , disposed between the two sensing heads. The support separation device according to the first or second aspect of the invention, wherein the drive unit is provided on a plate portion having a planar portion that is in contact with the support body of the laminate. The abutting surface; the claw portion is provided with an inclined surface that is larger in inclination from the outer circumference of the abutting surface toward the inner circumference than the abutting surface that is apart from the plate portion; and the flat portion of the support body is abutted The support body is gripped by the abutting surface, and the inclined surface is brought into contact with a chamfered portion provided at an outer peripheral end portion of the support body. The support body separating device according to the fourth aspect of the invention, wherein the claw portion is provided in an end surface of the abutting surface of the plate portion, and an edge of the inclined surface of the claw portion is adjusted to the plate The adjustment unit of the distance between the abutting faces of the part. The support separation device according to claim 4, further comprising: the plate portion; and a fixing portion that fixes the substrate side of the laminate; The lifting portion moves the plate portion up and down. The plate portion is hooked to the lifting portion by a hooking portion so as to be movable in the vertical direction. A method for separating a support, which is a method for separating a support from a support substrate and a support for supporting the substrate, and separating the support from the support, comprising: holding the layer by a plurality of claws Holding the outer peripheral end of the support body of the integrated body; in the holding project, individually detecting the respective positions of the moving claw portions, and detecting at least one of the plurality of claw portions moving to a ratio When the predetermined area is further inside, all of the plurality of claws are controlled in such a manner as to move to the initial position. The support separation method according to claim 7, wherein when the claw portion is detected to move further inside than the predetermined region, all of the plurality of claw portions are moved to an initial position, and then, again, The same laminate is subjected to the aforementioned holding work. The support separation method according to the seventh aspect of the invention, wherein the flat portion of the support member abuts against the planar portion of the support body in the gripping process. And a contact surface provided in the chamfered portion of the support body, the abutting of the plurality of claw portions in the surface direction of the abutting surface, and the distance from the outer surface of the abutting surface The slope of the week is steeper Face, to hold the aforementioned support. The method for separating a support according to the ninth aspect of the invention, further comprising: an adjustment project, wherein the claw is adjusted in a surface direction of the abutting surface in response to a thickness of the support body before the holding process The distance between the end of the inclined surface of the portion and the abutting surface. The support separation method according to the ninth aspect of the invention, wherein the abutting surface is provided, and the plate portion that is hooked to the upper and lower directions is lowered, and the The junction abuts against the flat portion of the support.