TW201724342A - Support body separation device and support body separation method capable of holding a laminated body smoothly without relying on the thickness of the laminated body and capable of being separated from the laminated body - Google Patents

Abstract

An object of the present invention is a support body capable of holding a laminated body smoothly without relying on the thickness of the laminated body and capable of being separated from the laminated body. The solution of the present invention includes: a support body separation apparatus (100) having a platform (15) for fixing a substrate (20), a claw part (12) holding an auxiliary board (18), an escalating part (5) allowing the claw part (12) to move upward or downward, and a hook part (1) to hook and hold the claw part (12) at the escalating part (5). The claw part (12) is hooked by the hook part (1) at the escalating part (5) in a manner of moving in an upward/downward direction.

Description

Support separation device and support separation method

The present invention relates to a support separation device and a support separation method.

In recent years, electronic devices such as IC cards and mobile phones have been required to be thinner, smaller, and lighter. In order to satisfy these requirements, it is also necessary to use a thin semiconductor wafer with respect to the semiconductor wafer to be incorporated. Therefore, the thickness (film thickness) of the wafer substrate which is the base of the semiconductor wafer is 125 μm to 150 μm in the current state, but the next generation wafer must be 25 μm to 50 μm. Therefore, in order to obtain the above-mentioned wafer thickness of the wafer substrate, a thinning process of the wafer substrate is required.

In order to prevent the wafer substrate from being damaged by the thinning of the wafer substrate, the wafer is automatically transferred while being bonded to the wafer substrate in the process, and is on the wafer substrate. A structure such as a circuit is mounted. Then, after the process, the wafer substrate and the auxiliary board are separated. Therefore, various methods of peeling off the support from the wafer have hitherto been used.

Patent Document 1 describes that the connection is rotatably disposed in The robot arm of the machine holder holds the robot of the wafer transfer robot that transports the wafer, and has a robot that holds the grip portion on the outer peripheral surface of the wafer.

Patent Document 2 describes a method in which a peeling and transmitting adhesive is bonded to a semiconductor wafer having a rigid support, and includes an insertion process for inserting the insert member into the adhesive, and plucking the semiconductor wafer from the support. A method of peeling off a semiconductor wafer by applying vibration to the adhesive material.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 11-116046 (published on Apr. 27, 1999)

[Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-32506 (published on Feb. 2, 2006)

Patent Document 1 does not disclose a support separation device and a support separation method that can prevent the substrate from being damaged when the substrate and the support are separated.

Further, in the support separation method described in Patent Document 2, since the tip end of the board is inserted between the wafer and the support, the wafer is broken at the time of insertion of the board.

Moreover, the support separation method described in Patent Document 2, It is not disclosed that the support body of the laminate can be smoothly held without depending on the thickness of the laminate, and the support separation device and the support separation method for separating the support from the laminate can be disclosed.

The present invention has been made in view of the above problems, and an object thereof is to provide a support separation device capable of smoothly holding a support without depending on the thickness of the laminate, and a support separation device for separating the support from the laminate and its association technology.

In order to solve the above problems, the inventors of the present invention have determined the results of the review and have arrived at the following invention.

The support separation device of the present invention is a support separation device that separates the support from a laminate that is attached to a support that supports the substrate through an adhesive layer, and is characterized in that it has a fixing portion and a fixing portion. The substrate is fixed to the laminate; the holding portion holds the support of the laminate; the lifting portion moves the holding portion up and down; and the hook portion hooks the holding portion to the front side The lifting portion; the holding portion is hooked to the lifting portion so as to be movable in the vertical direction by the hook portion.

Moreover, the support separation method of the present invention is a method of separating a support body from a laminate obtained by attaching a substrate and a support supporting the substrate, and is characterized in that: a holding process is performed, and the method is: a substrate of the laminate, holding the support of the laminate; and a separation process, lifting the held support after the holding process In the holding process, the holding portion hooked so as to be movable in the vertical direction is lowered to abut against the flat portion of the support, and the support is held.

According to the present invention, it is possible to exhibit the effect of separating the support from the laminate without depending on the thickness of the laminate, and the support of the laminate can be smoothly held.

1‧‧‧ hook stop

2‧‧‧ bearing part (hook stop)

2a‧‧‧Cone surface (opening surface, bearing part)

3‧‧‧Abutment (hook stop)

3a‧‧‧Fitting surface (abutment, hook stop)

4‧‧‧Axis (hook stop)

5‧‧‧ Lifting Department

6‧‧‧Floating joints (joints, lifting parts)

7‧‧‧stops

8‧‧‧ Lifting plate (lifting section)

8'‧‧‧ Lifting plate (lifting section)

10‧‧‧Separation plate (plate part, holding part)

10'‧‧‧Separation plate (plate part, holding part)

10a‧‧‧Abutment (board)

12‧‧‧ claws

12a‧‧‧Capture surface (claw)

12b‧‧‧Sloping surface (claw)

12c‧‧‧Adjustment Department

12d‧‧‧ screw shaft

12e‧‧‧Flat Department

13‧‧‧ Drive Department

13a‧‧‧Moving axis

13b‧‧‧Support Department

14‧‧‧Magnetic sensor

14a‧‧‧ Magnet

14b‧‧‧Sensing head

14c‧‧ ‧Sensing head

15‧‧‧ Platform (fixed department)

16‧‧‧Porous part (fixed part)

17‧‧‧The outer part (fixed part)

18‧‧‧Auxiliary board (support)

18’‧‧‧Auxiliary board (support)

18a‧‧‧Chamfering part (support)

19‧‧‧Next layer

20‧‧‧Substrate

21‧‧‧Layer

21’‧‧‧Layer

22‧‧‧Cut Tape

23‧‧‧ cutting frame

24‧‧‧Adsorption pad (holding section)

25‧‧‧Separation layer

100‧‧‧Support body separation device

101‧‧‧Support body separation device

Fig. 1 is a view showing the outline of a support separation device 100 according to an embodiment (first embodiment) of the present invention.

Fig. 2 is a view for explaining an outline of the operation of the support separating apparatus 100 according to an embodiment (first embodiment) of the present invention.

[Fig. 3] A schematic view of a claw portion 12 provided in a support separating device 100 according to an embodiment (first embodiment) of the present invention.

Fig. 4 is a view showing the outline of a support separating apparatus 101 according to an embodiment (second embodiment) of the present invention.

<Support body separation device 100>

One embodiment of the present invention is implemented using FIGS. 1 to 3 (first implementation) The support separation device 100 of the type) will be described in detail.

Fig. 1 (a) shows the arrangement of the bearing portion 2 and the abutting portion 3 which are provided in the hook portion 1 of the elevating plate 8 in a plan view, and the separating plate (plate portion, holding portion) provided under the elevating plate 8 A diagram of the arrangement of the claw portions 12 of 10. Further, Fig. 1(b) is a schematic view showing the support separation device 100 in accordance with the A-A' line arrow cross section shown in Fig. 1(a).

As shown in FIGS. 1(a) and 1(b), the support separation device 100 of the present embodiment includes a plurality of hook portions 1, a lifting portion 5, and a plurality of claw portions (holding portions) 12. Here, the elevating portion 5 passes through the elevating plate 8, and the hooking portion 1 hooks the separating plate 10, whereby the claw portion 12 disposed on the outer peripheral portion of the separating plate 10 is moved up and down. Further, the claw portion 12 is moved by the driving portion 13.

Further, the support separation device 100 includes a stage (fixed portion) 15 on which the laminate 21 formed by the sequential laminate auxiliary plate (support) 18, the subsequent layer 19, and the substrate 20 is fixed. Further, the adhesive layer 19 of the laminate 21 is reduced in adhesion by swelling or the like by the peeling liquid or the like.

Further, in the support separation device 100 of the present embodiment, the dicing tape 22 is bonded to the substrate 20 side of the laminate 21 fixed to the stage 15, and the dicing tape 22 is provided with the dicing frame 23.

As shown in Fig. 1(a), in the support body separating device 100, the bearing portion 2 and the abutting portion 3 constituting the plurality of hook portions 1 are disposed at equal intervals on the peripheral portion of the lift plate 8. Further, the plurality of claw portions 12 are disposed on the separating plate 10 at equal intervals across the driving portion 13. Hook stop 1 and claw The 12 series are alternately arranged, and the hook portion 1 and the claw portion 12 are disposed at an intermediate interval in plan view. Therefore, the force applied to the hooking portion 1 through the elevating plate 8 is equally applied to the plurality of claw portions 12 disposed on the separating plate 10 by raising the elevating portion 5. Therefore, when the stacking body 21 is held (held) by the plurality of claw portions 12 and the lifting and lowering portion 5 lifts the separating plate 10 through the hook stopping portion 1, the force can be equally applied to the laminated body 21 from the plurality of claw portions 12. .

Hereinafter, the hooking portion 1, the lifting portion 5, the separating plate 10, the claw portion 12, the driving portion 13, the magnetic sensor 14, and the stage 15 provided in the support separating device 100 will be described in more detail.

[hook stop 1]

The plurality of hook portions 1 hook the separation plate 10 to the lift plate 8 provided in the lift portion 5. In addition, the hooking portion 1 moves up and down along the Y-axis direction (elevating direction) shown in FIG. 1(b) as the lifting portion 5 moves up and down, and raises and lowers the hooking separating plate 10. Accordingly, the driving portion 13 and the claw portion 12 provided on the separating plate 10 are moved up and down.

Each of the plurality of hook portions 1 includes a bearing portion 2, a contact portion 3, and a shaft portion 4.

The bearing portion 2 has a hole that penetrates the vertical direction along the Y axis shown in FIG. 1(b), and the shaft portion 4 including the contact portion 3 is inserted into the hole. Here, the bearing portion 2 has a conical tapered surface (opening surface) 2a that expands upward in the Y-axis direction.

The abutting portion 3 is provided on the upper side in the Y-axis direction of the shaft portion 4, and is fitted to the tapered surface 2a facing the bearing portion 2 The fitting surface 3a of the surface 2a.

Further, as shown in Fig. 1(b), in the state in which the abutting surface 10a of the separating plate 10 is not in contact with the auxiliary plate 18 of the laminated body 21, the fitting surface 3a of the abutting portion 3 is fitted to The tapered surface 2a of the bearing portion 2. Thereby, the separating plate 10 is hooked to the lifting plate 8 by the hooking portion 1.

(a) to (c) of FIG. 2 are views showing an outline of the operation of the support separation device 100 of the present embodiment. In addition, in FIGS. 2(a) to 2(c), the elevating portion 5 included in the support separating device 100 is omitted.

As shown in Fig. 2(a), the elevating plate 8 descends in the Y-axis direction, and after the flat portion of the auxiliary plate 18 of the laminated body 21 abuts against the abutting surface 10a of the separating plate 10, and further, on the elevating plate 8 At the time of the lowering, the tapered surface 2a of the bearing portion 2 of the hooking portion 1 is separated from the fitting surface 3a of the abutting portion 3 of the shaft portion 4, and the shaft portion 4 is slid inside the hole of the bearing portion 2. That is, when the lifting portion 5 is lowered, the force applied to the lifting plate 8 is not caused by the hooking portion 1 to hook the separating plate 10 to the lifting plate 8, and is not transmitted from the lifting plate 8 to the separating plate 10. Therefore, it is possible to prevent the force from being applied to the laminated body 21 from the lifting plate 8 through the abutting surface 10a of the separating plate 10. Therefore, excessive force is prevented from being applied to the laminated body 21, and the laminated body 21 is broken.

Further, the tapered surface 2a of the bearing portion 2 and the fitting surface 3a of the abutting portion 3 provided on the shaft portion 4 when the abutting surface 10a of the separating plate 10 abuts against the laminated body does not depend on the thickness of the laminated body. Separation allows force to be transmitted from the lift plate 8 to the separation plate 10. That is, it is possible to prevent an excessive force from being applied to the laminated body by the separating plate 10 without depending on the thickness of the laminated body. therefore, It is not necessary to adjust the position at which the separation plate is lowered in response to the thickness of the laminate. Therefore, the laminated body 21 can be abutted against the abutting surface 10a of the separating plate 10 without depending on the thickness of the laminated body, and the outer peripheral end of the auxiliary plate 18 of the laminated body 21 can be gripped smoothly by the claw portion 12. (Fig. 2(b)).

Thereafter, as shown in FIG. 2( c ), the lift plate 8 is raised upward in the Y-axis direction while the auxiliary plate 18 is held by the claw portion 12 . Thereby, the shaft portion 4 is slid inside the hole of the bearing portion 2, and the tapered surface 2a of the bearing portion 2 is fitted to the fitting surface 3a of the abutting portion 3. Therefore, the force for lifting the lift plate 8 when the lift unit 5 is raised is transmitted to the separation plate 10 and the claw portion 12 of the separation plate 10 through the hook portion 1 . When the hooking portion 1 lifts the separating plate 10, the separating plate 10 can be placed at a specific position with respect to the lifting plate 8 by the fitting surface 3a of the fitting bearing portion 2 and the fitting surface 3a of the abutting portion 3. Therefore, by the plurality of hook portions 1 and the plurality of claw portions 12 shown in Figs. 1 (a) and (b), a force can be uniformly applied to the laminated body 21, and the auxiliary plate 18 can be smoothly separated (Fig. 2 (c )).

Further, the support body separating device 100 is provided on the peripheral portion of the elevating plate 8 and has three hooking portions 1 at equal intervals. However, the hooking portion is not limited as long as the separating plate (plate portion, holding portion) can be hooked. quantity. Further, the fitting surface of the abutting portion of the hooking portion and the opening surface of the bearing portion may be fitted to each other. For example, the fitting surface of the abutting portion is a cylindrical convex shape larger than the diameter of the shaft portion, and the opening is opened. The surface may be a concave type that is fitted to the convex shape.

[lifting section 5]

The lifting portion 5 is provided with a lifting plate 8 which is fixed to the lifting plate Department 5. The elevating portion 5 is configured such that the plurality of hook portions 1 are hooked to the separating plate 10 of the elevating plate 8, and are moved up and down.

The speed at which the lifting portion 5 of the holding auxiliary plate 18 is raised in a state where the substrate 20 is fixed to the stage 15 is preferably 0.1 mm/sec or more and 2 mm/sec or less. Thereby, the substrate 20 and the auxiliary board 18 can be prevented from being burdened with excessive force. Therefore, the auxiliary board 18 can be gradually separated.

[Separation plate 10]

The separating plate (plate portion, holding portion) 10 has a circular shape equal to the auxiliary plate 18, and the diameter of the separating plate 10 is equal to or slightly smaller than the diameter of the auxiliary plate 18. Further, the separation plate 10 has an abutting surface 10a on the bottom surface side (Fig. 1(b)).

The separating plate 10 is attached to the upper surface portion, and the plurality of claw portions 12 attached to the plurality of driving portions 13 are provided at equal intervals (Fig. 1 (a)).

[Claw 12]

The claw portions 12 provided in the support separating device 100 of the present embodiment will be described in more detail with reference to Figs. 3(a) to 3(c).

Fig. 3(a) is a schematic view showing the claw portion 12 and the adjustment portions 12c, 12d, and 12e provided in the claw portion 12, and Fig. 3(b) is a view showing the inclined surface (inclined portion) 12b of the claw portion 12, abutting FIG. 3(c) is a view taken along line BB' of the arrow of FIG. 3(a), and the capturing surface 12a captures the laminated body 21 in a state of the chamfered portion 18a of the auxiliary plate 18 of the laminated body 21. A view of the state before the outer peripheral end of the auxiliary plate 18.

The plurality of claw portions 12 are arranged at equal intervals with respect to the outer peripheral end portions of the separating plate 10 (Fig. 1 (a)). Further, in the state in which the claw portions 12 are respectively gripped at the outer peripheral end portions of the auxiliary plates 18, a pitch (gap) is provided between the outer peripheral end portions of the separating plates 10 (Fig. 2(b)).

As shown in FIGS. 3(a) to 3(c), the claw portion 12 includes a catching surface 12a, an inclined surface 12b, and an adjustment portion 12c.

The material for forming the claw portion 12 may be appropriately selected depending on the material of the auxiliary plate 18 to be held. Therefore, as the material for forming the claw portion, a metal such as stainless steel or aluminum, an engineering plastic or the like can be used. Further, when the material of the auxiliary plate 18 is glass, it is more preferably formed of an aromatic polyetherketone (Aromatic polyether ketone) which is an engineering plastic, and an aromatic polyetheretherketone is used even in the aromatic polyether ketone. PEEK), polyetherketoneketone (PEKK) having an aromatic group, and polyetheretherketoneketone (PEEKK) having an aromatic group are preferred, and PEEK is most preferred. Thereby, when the outer peripheral end portion of the auxiliary plate 18 made of glass is held by the claw portion 12, the auxiliary plate 18 can be prevented from being damaged.

(capture face 12a)

The capturing surface 12a captures the outer peripheral end of the auxiliary plate 18. Here, the capturing surface 12a is a surface that is perpendicular to the abutting surface 10a of the separating plate 10, and is curved like the outer peripheral end of the auxiliary plate 18, or a curved surface that depicts a larger arc.

The capturing surface 12a of the plurality of claws 12 is in a state of abutting the planar portion of the auxiliary plate 18 against the abutting surface 10a of the separating plate 10, and is surrounded by The outer peripheral end portion of the auxiliary plate 18 is moved toward the center point of the separating plate 10 (Figs. 2(a) and (c)). Here, the capturing surface 12a of the plurality of claw portions 12 is approached to the outer peripheral end portion of the auxiliary plate 18 at the same speed by the driving portion 13. Therefore, the laminated body 21 can be induced to overlap the center point of the auxiliary plate 18 of the laminated body 21 by the center of the auxiliary plate 18 of the laminated body 21 while holding the outer peripheral end of the auxiliary plate 18 by the capturing surface 12a. unit. Further, the capturing surface 12a which is curved in the same manner as the outer peripheral end portion of the auxiliary plate 18 or which is curved in a larger arc shape is abutting against the outer peripheral end portion of the auxiliary plate 18 in the vicinity of the center point of the circular arc. Board 18. Therefore, the circular auxiliary plate 18 can be held in each center portion of the plurality of capturing faces 12a. Therefore, the outer peripheral end portions of the auxiliary plates 18 can be gripped at equal intervals and smoothly by the plurality of claw portions 12. Therefore, when the separation plate 10 is lifted, the force applied to the auxiliary plate 18 by the plurality of claw portions 12 can be made uniform.

(inclined surface 12b)

As shown in FIG. 3(b), the inclined surface (inclined portion) 12b is a non-curved plane in which the laminated body 21 abuts against the chamfered portion 18a of the auxiliary plate 18. The inclined surface 12b is provided along a portion of the center point including the end side of the capturing surface 12a.

The inclined surface 12b is in the surface direction of the abutting surface 10a of the separating plate 10, and the inclination from the outer circumference toward the inner circumference of the abutting surface 10a is larger as it goes away from the abutting surface 10a (Fig. 3(b)). Thereby, in the outer peripheral end portion of the auxiliary plate 18, the inclined surface 12b can be abutted on the chamfered portion 18a on the back side of the surface facing the separation plate 10.

The inclined portion 12b has an inclination in a range of 30° or more and less than 90° with respect to the abutting surface 10a of the separating plate 10. Thereby, excessive force is applied from the inclined surface 12b to the chamfered portion 18a of the auxiliary plate 18. Further, in a state where the flat portion of the auxiliary plate 18 is in contact with the abutting surface 10a of the separating plate 10, the inclination of the inclined surface 12b is set so that the inclination of the chamfered portion 18a of the auxiliary plate 18 is parallel, because It is preferable that the end portion of the chamfered portion 18a does not concentrate excessive force.

Further, the inclined surface 12b is provided along the end side of the capturing surface 12a separated from the abutting surface 10a of the separating plate 10, and is provided at a part including the center point of the end side. As a result, the outer peripheral end portion of the assisted auxiliary plate 18 can be smoothly brought into contact with the center point of the arc of the capturing surface 12a of the claw portion 12 in a state in which the inclined surface 12b close to the plane is brought into close contact with the plane. nearby. Therefore, the support body separating device 100 holds the outer peripheral end portion of the auxiliary plate 18 in a state of being brought close to a large point by the plurality of inclined faces 12b arranged at equal intervals so as to surround the separating plate 10. Therefore, the force for holding the auxiliary plate 18 can be equally applied from the plurality of inclined faces 12b, and when the separation plate 10 is lifted, the outer peripheral end portion of the auxiliary plate 18 abutting against the plurality of inclined faces 12b can be prevented from the inclined face 12b. Get rid of.

Further, as shown in FIG. 3(b), the lower end of the inclined surface 12b is disposed on the same plane as the surface of the auxiliary plate 18 facing the substrate 20. Thereby, the inclined surface 12b can be prevented from being caught by the substrate 20, the subsequent layer 19, and the like. Therefore, only the inclined surface 12b is abutted against the auxiliary plate 18, and the auxiliary plate 18 can be smoothly gripped by the claw portion 12.

[Adjustment section 12c]

As shown in Fig. 3 (a), the adjustment portion 12c includes a screw shaft 12d and a flat portion 12e, and the claw portion 12 is vertically moved to the abutting surface 10a of the separating plate 10 by pushing the screw shaft 12d against the flat portion 12e. Thereby, the distance between the lower end of the inclined surface 12b of the claw portion 12 and the abutting surface 10a of the separating plate 10 can be adjusted in accordance with the thickness of the auxiliary plate 18. Therefore, the chamfered portion 18a of the auxiliary plate 18 can be more accurately held by the claw portion 12 without depending on the thickness of the auxiliary plate 18 of the laminated body 21. Further, the adjustment of the distance between the abutting surface 10a of the separating plate 10 by the adjusting portion 12c may be performed in advance in accordance with the type of the support to be separated.

[Drive unit 13]

The drive unit 13 includes a movement shaft 13a that moves the claw portion 12, and a support portion 13b that movably supports the movement shaft 13a. The driving portions 13 are disposed at equal intervals on the upper surface portion of the separating plate 10, and move the claw portions 12 in parallel so as to approach or separate from the outer peripheral end portion of the separating plate 10 along the abutting surface 10a of the separating plate 10. (Figure 2 (a) and (b)). Further, the drive unit 13 moves the claw portions 12 toward the outer peripheral end portion of the auxiliary plate 18 at the same speed at the same time. Thereby, the outer peripheral end portion of the auxiliary plate 18 can be gripped while being surrounded by the claw portion.

[Magnetic Sensor 14]

The magnetic sensor (detection unit) 14 individually detects the respective positions of the claw portions 12 moved by the drive unit 13. Furthermore, the magnetic sensor 14 is Control unit control.

As shown in FIGS. 2(a) and 2(b), the magnetic sensor 14 includes a magnet 14a fixed to the moving shaft 13a of the driving unit 13, and the magnet 14a is detected before being placed in the moving direction of the magnet 14a. The two sensing heads 14b and 14c are displaced. Here, the magnet 14a moves at the same time when the moving shaft 13a moves the claw portion 12. At this time, the two sensing heads 14b and 14c detect that the magnet 14a is displaced or moved due to the movement of the moving shaft 13a in accordance with the change in the magnetic force emitted from the magnet 14a.

The two sensing heads 14b and 14c quantify the distance between the sensing heads 14b and 14c with reference to the two positions, for example, a value of 0 to 100. For example, when the distance between the sensing heads 14b and 14c is set to a few mm, the position of the claw portion 12 can be determined by the μm level. Based on the scaled value, the sensing heads 14b and 14c determine the position of the magnet 14a. Thereby, the position of the claw portion 12 which is moved by the movable shaft 13a and the magnet 14a at the same time can be correctly determined. More specifically, in the range of the scaled value, it is determined that the claw portion 12 is disposed at a position before the outer peripheral end portion of the grip auxiliary plate 18, or the claw portion 12 is holding the outer peripheral end portion of the auxiliary plate 18, and Or the claw portion 12 fails to grip the outer peripheral end portion of the auxiliary plate 18. For example, when the value indicating the value of the scaled value in the range of 0 to 100 is greater than 60, it can be determined that the claw portion 12 is disposed at the position before the outer peripheral end portion of the grip auxiliary plate 18, and indicates that it is greater than 10 and 60. When the value is the following, it can be determined that the claw portion 12 is disposed at the outer peripheral end portion of the grippable auxiliary plate 18, and when the value is 0 or more and 10 or less, it can be determined that the claw portion 12 is disposed to be more than the grippable auxiliary. The position of the outer peripheral end of the plate 18 is further on the inner side, and the scaled value is adjusted. With the configuration of the claws. Here, when the claw portion 12 is disposed inside the position at which the outer peripheral end portion of the auxiliary plate 18 can be gripped, it can be confirmed that the claw portion 12 fails to grip the outer peripheral end portion of the auxiliary plate 18. As described above, by using the magnetic sensor 14, it is possible to determine not only whether the claw portion 12 is gripping the outer peripheral end portion of the auxiliary plate 18 but also whether or not the claw portion 12 fails to grip the outer peripheral end portion of the auxiliary plate 18. Further, the determination by the magnetic sensor 14 is performed in the complex drive unit 13. By confirming that the outer peripheral end portion of the auxiliary plate 18 is not gripped in at least one of the claw portions 12, the separation of the auxiliary plate 18 is interrupted, and the adhesive layer of the laminated body 21 may be swelled by the peeling liquid. Alternatively, the positions of the plurality of claw portions 12 and the separation plate 10 of the support body separating device 100 may be returned to the initial state, and the separation of the auxiliary plates 18 may be performed again. These operations are performed by controlling the drive unit 13 and the magnetic sensor 14 by a control unit (not shown).

In the support body separating device 100 of the present embodiment, a magnetic sensor is used, but the detecting portion is not limited to the magnetic sensor. Specifically, any sensor can be used as long as it is a position detecting sensor that can detect the displacement of the object by light, ultrasonic or laser.

As the position detecting sensor, in addition to the magnetic sensor, for example, an ultrasonic sensor, an eddy current sensor, a laser sensor, a contact sensor, or the like can be given.

[platform 15]

The stage 15 is a substrate 20 to which the laminated body 21 is fixed. In the support separation device 100 of the present embodiment, the platform 15 is provided with a porous portion 16 and The outer peripheral portion 17. The laminate 21 of the adhesive dicing tape 22 is placed on the stage 15 such that the laminate 21 is placed on the porous portion 16.

(Porous part 16)

The porous portion 16 is a porous portion provided in the outer peripheral portion 17. The porous portion 16 is capable of attracting the substrate 20 of the laminate 21 in which the dicing tape 22 is bonded to the porous portion thereof by a pressure reducing portion (not shown). Thereby, the substrate 20 can be ideally fixed to the stage 15.

In the present embodiment, the platform 15 is provided with the porous portion 16 and the outer peripheral portion 17. However, in the present invention, any substrate may be used as long as the substrate 20 of the laminate 21 can be fixed.

[Layer 21]

As shown in Fig. 1(b), the laminate 21 of the auxiliary plate 18 is separated by the support separation device 100 of the present embodiment, and will be described in detail. The laminate 21 is attached to the substrate 20 and the auxiliary plate 18 through the adhesive layer 19.

(auxiliary board 18)

The auxiliary board 18 is attached to the substrate 20 through the adhesive layer 19 in order to prevent the substrate 20 from being damaged or deformed during the process of thinning, transporting, or mounting the substrate 20 .

In the laminate 21 separated in the support separation device 100 of the present embodiment, the auxiliary plate 18 has a circular plate shape in plan view, and a plurality of through holes are provided in the thickness direction. Auxiliary board 18 can be utilized The peeling liquid is supplied from the through hole, and the adhesive layer 19 is swollen.

The auxiliary board (support) 18 is a support for supporting the substrate 20, and the substrate 20 is attached through the adhesive layer 19. Therefore, in the process of thinning, transporting, or mounting the substrate 20, the auxiliary plate 18 may have necessary strength in order to prevent breakage or deformation of the substrate 20. Further, it may be a light that transmits the deterioration of the separation layer. From the above viewpoints, examples of the auxiliary plate 18 include glass, enamel, and acrylic resin. Further, the auxiliary plate may be formed by a separation layer formed by illuminating the surface on the side opposite to the adhesion layer.

Further, the auxiliary board 18 can be used with a thickness of 300 to 1000 μm. According to the support body separating apparatus 100 of the present embodiment, even in the support body having a small thickness, the outer peripheral end portion of the support can be smoothly gripped while preventing the support from being damaged.

(Next layer 19)

Next, the layer 19 is bonded to the substrate 20 and the auxiliary board 18, and is formed by applying an adhesive to the substrate 20. The coating method of the adhesive agent for the substrate 20 or the auxiliary plate 18 is not particularly limited, and examples thereof include a method of spin coating, dipping, roller scraping, spray coating, and slit coating. Further, the subsequent layer 19 may be formed by, for example, directly applying an adhesive to the substrate 20, and attaching a film (so-called dry film) on which both surfaces are applied with an adhesive to the substrate 20.

The thickness of the layer 19 can be adapted to the type of the substrate 20 and the auxiliary plate 18 to be bonded, and the subsequent application to the substrate 20. When set, 10~150μm is better, and 15~100μm is better.

The adhesive for forming the adhesive layer 19 can be used without particular limitation, and it is preferable to heat the adhesive material which can improve the thermal fluidity. Examples of the thermoplastic adhesive material include an acrylic resin, a styrene resin, a maleic imine resin, a hydrocarbon resin, an elastomer, and a polyfluorene resin.

(substrate 20)

The substrate 20 can be supplied to a process of thinning, mounting, or the like in a state where it is supported by the auxiliary plate 18 via the adhesive layer 19. The substrate 20 is not limited to the tantalum wafer, and any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate can be used.

(Cutting Tape 22)

The dicing tape 22 is bonded to the substrate 20 side of the laminate 21, and is used for cutting the substrate 20 after peeling the auxiliary sheet 18.

As the dicing tape 22, for example, a dicing tape 22 having an adhesive layer formed on the structure of the base film can be used. As the base film, for example, a resin film of PVC (polyvinyl chloride), polyolefin or polypropylene can be used.

(Cutting frame 23)

On the outer periphery of the exposed face of the dicing tape 22, a cutting frame 23 for preventing the dicing tape 22 from being bent is attached. Examples of the cutting frame 23 include a metal cutting frame made of aluminum or the like, stainless steel (SUS), or the like. A cutting frame made of alloy and a cutting frame made of resin.

<Support body separation device 101>

The support separation device of the present invention is not limited to the above-described embodiment (first embodiment). As shown in FIGS. 4(a) and 4(b), for example, in an embodiment (second embodiment), a holding portion for holding the auxiliary plate 18 is provided, and an adsorption pad 24 is provided instead of the claw portion 12. structure.

Fig. 4 (a) is a view showing the arrangement of the bearing portion 2 and the abutting portion 3 which are provided in the hook portion 1 of the lifting plate 8' in plan view, and the suction pad provided on the separating plate 10' under the lifting plate 8'. Diagram of the arrangement of (holding unit) 24. Further, Fig. 4(b) is a schematic view showing the support separation device 101 of the present embodiment, based on the C-C' line arrow cross section shown in Fig. 4(a). In addition, the same component number as the first embodiment is the same as the same, and the description thereof is omitted.

[lifting section 5]

In the present embodiment, the lifting portion 5 is provided with a floating engaging member 6 in addition to the lifting plate 8', and is hooked to the separating plate 10' of the lifting plate 8' by the plurality of hooking portions 1 in the up and down direction. Lifting.

(floating joint 6)

The floating joint (joining member) 6 is provided at a central portion on the upper surface side of the circular lift plate 8' in a plan view. By being coupled to the lifting portion 5 through the floating joint 6, the lifting plate 8' is rotatable and is hooked to the lift The plane of the laminated body 21' to which the platform 15 of the separating plate 10' of the lowering plate 8' is horizontally inclined is movable.

When a force is applied to the laminated body 21' from the separating plate 10' through the floating joint 6, when the force concentrates on a part of the outer peripheral end portion of the laminated body 21', the floating engaging member 6 is movable, and the separating plate 10' is conventionally peripheral. A portion of the end portion is inclined toward the surface of the suction pad 24 that contacts the auxiliary plate 18'. Accordingly, the auxiliary plate 18' separated from the laminated body 21' is inclined. Thereby, excessive force can be prevented from being applied to the auxiliary board 18' and a part of the substrate 20, and the force can be concentrated on the separation layer which is laminated between the auxiliary board 18' and the bonding layer 19 and which is deteriorated by the irradiation of the light. 25. Therefore, the auxiliary plate 18' can be preferably peeled off from the substrate 20 while preventing the auxiliary plate 18' and the substrate 20 from being damaged by excessive force.

The support body separating device 100 of the present embodiment is provided with the floating joint member 6. However, as long as it is movable to the lift plate 8' and the split plate 10', for example, it may be a universal joint.

Further, the support body separating device 100 is provided as a locking portion that locks the lifting plate 8' so as not to be inclined more than necessary, and a stopper 7 is provided. At this time, if the elevating plate 8' is to be inclined more than necessary, the stopper 7 comes into contact with the floating engaging member 6 or the elevating plate 8', so that the elevating plate 8' is not inclined more. Therefore, it is possible to prevent the separation plate 10' from being tilted more than necessary, and the auxiliary plate 18' and the substrate 20 are excessively warped.

Further, when the substrate 20 side of the laminate 21' is fixed to the stage 15, and the auxiliary plate 18' is inclined, the height difference between the highest position of the auxiliary plate 18' and the lowest position of the auxiliary plate 18' is set to 1 cm or less. block The stopper 7 is preferably. By setting the height difference to 1 cm or less, the substrate 20 or the auxiliary plate 18' does not burden excessive force, and damage or deformation of the substrate 20 or the auxiliary plate 18' can be prevented.

[Adsorption pad 24]

The adsorption pad (holding portion) 24 is attached to the surface opposite to the surface on which the bonding layer 19 of the auxiliary plate 18' is provided.

The adsorption pad 24 is connected to a decompression portion (not shown), and the auxiliary plate 18' is held by a peripheral portion of a plane that is adsorbed on the auxiliary plate 18'.

As shown in Fig. 4 (a), in the support body separating device 101, the bearing portion 2 and the abutting portion 3 constituting the plurality of hook portions 1 are disposed at equal intervals on the peripheral portion of the lift plate 8'. Further, the adsorption pads 24 are disposed at equal intervals on the peripheral portion of the separation plate 10'. The hooking portion 1 and the suction pad 24 are alternately arranged, and the hooking portion 1 and the suction pad 24 are disposed at an intermediate interval in plan view. Therefore, in the same manner as the support separation device 100, the laminated body 21' is held by the plurality of adsorption pads 24, and when the lifting portion 5 lifts the separation plate 10' through the hook portion 1, the force can be equalized from the adsorption pad 24. Applied to the laminate 21'.

Further, as shown in FIG. 4(b), the support body separating device 101 is lowered in the Y-axis direction, and after the suction pad 24 abuts on the plane portion of the auxiliary plate 18' of the laminated body 21', Further, when the elevating plate 8 is lowered, the tapered surface 2a of the bearing portion 2 of the hooking portion 1 is separated from the fitting surface 3a of the abutting portion 3 provided on the shaft portion 4, and the shaft portion 4 is slidable to the bearing portion 2 The inside of the hole. Therefore, similarly to the state of the support separating apparatus 100, it is possible to prevent the force from being applied to the laminated body 21' from the elevating plate 8' through the suction pad 24 of the separating plate 10'. Therefore, excessive force is prevented from being applied to the laminated body 21', and the laminated body 21' is broken.

Further, when the adsorption pad 24 abuts against the laminate without depending on the thickness of the laminate, the tapered surface 2a of the bearing portion 2 is separated from the fitting surface 3a of the abutment portion 3 provided on the shaft portion 4, and the force can be made It is not transmitted from the lifting plate 8' to the separating plate 10'. Therefore, it is not necessary to adjust the position at which the separation plate 10' is lowered in accordance with the thickness of the laminate. Therefore, the outer peripheral end portion of the auxiliary plate 18' of the laminated body 21' can be held by the suction pad 24 of the separating plate 10' without depending on the thickness of the laminated body (Fig. 4(b)).

Furthermore, the arrangement and number of the adsorption pads 24 are not limited to the arrangement and number shown in FIG. 4(a). The arrangement and the number of the adsorption pads 24 may be appropriately designed in accordance with the type and size of the auxiliary plate 18' separated from the laminate 21'.

[Layer 21']

In the support separation device 101 of the present embodiment, the laminated body 21' is separated from the sequentially laminated substrate 20, the subsequent layer 19, the separation layer 25 which is deteriorated by irradiation with light, and the auxiliary plate 18'. Board 18'. In addition, the substrate 20 and the adhesive layer 19 can be the same as those of the laminated body 21, and the description thereof will be omitted.

(auxiliary board 18')

The auxiliary plate 18' is in the thickness direction thereof, and a plurality of through holes are not provided, unlike the auxiliary plate 18. Further, a separation layer 25 is formed on the surface of the auxiliary plate 18' facing the side of the adhesive layer 19.

(separation layer 25)

The separation layer 25 is a layer which is deteriorated by absorbing light irradiated through the auxiliary plate 18'.

The separation layer 25 is, for example, fluorocarbon (Fluorocarbon) formed by a plasma CVD (Chemical Vapor Deposition) method. Further, for example, the separation layer 25 may be a polymer having a structure having a light absorbing property, an inorganic substance, a compound having an infrared absorbing property, and a reactive polysesquioxalate (Polysilsesquioxane). A separation layer formed. In addition, the light which is irradiated to the separation layer 25 may be appropriately selected depending on the wavelength absorbed by the separation layer 25.

The thickness of the separation layer 25 is preferably in the range of, for example, 0.05 μm or more and 50 μm or less, and more preferably in the range of 0.3 μm or more and 1 μm or less. When the thickness of the separation layer 25 can be in the range of 0.05 μm or more and 50 μm or less, the separation layer 25 can be deteriorated by irradiation of light for a short period of time and irradiation of light of low energy. Further, the thickness of the separation layer 25 is particularly preferably in the range of 1 μm or less from the viewpoint of productivity.

In the present specification, the "deterioration" of the separation layer refers to a state in which the separation layer is subjected to a slight external force and may be destroyed, or a state in which the adhesion between the separation layer and the contact layer is lowered. By absorbing infrared rays As a result of the deterioration of the resulting separation layer, the separation layer loses the strength or adhesion before exposure to light. That is, the separation layer becomes weak because of the absorption of light. The deterioration of the separation layer may also be due to the decomposition of the energy of the light absorbed by the separation layer, the change in the stereo configuration, or the dissociation of the functional group. The metamorphism of the separation layer is the result of absorbing light.

Therefore, for example, it is possible to separate the auxiliary plate and the substrate by deteriorating the separation layer by merely lifting the auxiliary plate. More specifically, for example, one of the substrate and the auxiliary plate of the laminate is fixed to the mounting table by a support separation device or the like, and the other is held by the adsorption pad (holding portion) provided with the adsorption means. The substrate is lifted, the auxiliary plate and the substrate are separated, or a separation plate having a clamp (claw portion) or the like is attached, and a chamfered portion of the peripheral portion of the auxiliary plate is gripped to apply a force to separate the substrate from the auxiliary plate. Moreover, for example, the support plate may be peeled off from the substrate of the laminate by the support separation device including the release means for supplying the release liquid for peeling off the adhesive. By applying the peeling liquid to at least a part of the peripheral end portion of the adhesive layer of the laminate by the peeling means, the adhesive layer of the laminate is swollen, whereby the force is concentrated on the separation layer from the swelling of the adhesive layer. A force is applied to the substrate and the auxiliary plate. Therefore, it is desirable to separate the substrate from the auxiliary board.

Thereafter, in a state where the auxiliary plate 18' is held by the suction pad 24, the elevating plate 8' is raised upward in the Y-axis direction. Thereby, the shaft portion 4 is slid inside the hole of the bearing portion 2, and the tapered surface 2a of the bearing portion 2 is fitted to the fitting surface 3a of the abutting portion 3. Therefore, the force for lifting the lift plate 8' when the lift portion 5 is raised is transmitted to the separation plate 10 and the claw portion 12 of the separation plate 10 through the hook portion 1. Therefore, by the plurality of hooks 1 and The number of adsorption pads 24 can equally apply force to the laminate 21', and the auxiliary plate 18' can be smoothly separated.

In addition, the force applied to the laminate is not limited as long as it is appropriately adjusted depending on the size of the laminate, and for example, a laminate having a diameter of about 300 mm can be applied with a force of about 0.1 to 5 kgf. It is ideal to separate the substrate from the auxiliary board.

<Support separation method>

Further, in the support separation method according to an embodiment of the present invention, the support body of the auxiliary plate 18 is separated from the laminate 21' formed by the auxiliary substrate (support) 18' to which the substrate 20 and the support substrate 20 are attached. The separation method includes the substrate 20 of the fixed laminate 21', the holding process of the auxiliary plate 18' of the laminated body 21, and after the holding process, the held auxiliary plate 18 is lifted and removed from the laminated body 21 'Separation separation work; in the holding process, the suction pad 24 hooked in such a manner as to be movable in the up and down direction is lowered to abut against the flat portion of the auxiliary plate 18', and the auxiliary plate 18' is held.

Further, in the support separation method according to the embodiment of the present invention, the claw portion (holding portion) 12 has the abutting surface 10a that abuts against the flat portion of the auxiliary plate 18, and is disposed to surround the auxiliary plate 18. The plurality of inclined surfaces 12b that are inclined from the outer circumference of the abutting surface 10a toward the inner circumference in the surface direction of the abutting surface 10a are brought into contact with each other by the flat portion of the auxiliary plate 18 during the holding process. The joint surface 10a abuts the plurality of inclined surfaces 12b against the chamfered portion 18a provided at the outer peripheral end portion of the auxiliary plate 18, and holds the auxiliary plate 18.

That is, in the respective embodiments of the above-described support separation devices 100 and 101, the support separation method of the present invention is based on the above-described embodiment and the description of Figs.

The present invention is not limited to the above-described embodiments, and various modifications can be made in the scope of the application, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in the present invention. Technical scope.

[Industrial use possibility]

The support separation device and the support separation method of the present invention can be widely used, for example, in the manufacturing process of a miniaturized semiconductor device.

1‧‧‧ hook stop

2‧‧‧ bearing department

2a‧‧‧ Cone

3‧‧‧Apartment

3a‧‧‧Fitting face

4‧‧‧Axis

5‧‧‧ Lifting Department

6‧‧‧Floating joints

8‧‧‧ lifting plate

10‧‧‧Separation board

10a‧‧‧Abutment (board)

12‧‧‧ claws

12c‧‧‧Adjustment Department

13‧‧‧ Drive Department

13a‧‧‧Moving axis

13b‧‧‧Support Department

14‧‧‧Magnetic sensor

14a‧‧‧ Magnet

14b‧‧‧Sensing head

14c‧‧ ‧Sensing head

15‧‧‧ platform

16‧‧‧Porous Department

17‧‧‧The outer part

18‧‧‧Auxiliary board

19‧‧‧Next layer

20‧‧‧Substrate

21‧‧‧Layer

22‧‧‧Cut Tape

23‧‧‧ cutting frame

100‧‧‧Support body separation device

Claims (8)

A support separation device is a support separation device that separates a support from a support that is attached to a substrate and supports the substrate, and is provided with a fixing portion that fixes the aforementioned a substrate according to the laminate; a holding portion for holding the support body of the laminate; a lifting portion for lifting the holding portion in a vertical direction; and a hook portion for hooking the holding portion to the lifting portion The holding portion is hooked to the lifting portion by the hook portion so as to be movable in the vertical direction. The support body separating device according to the first aspect of the invention, further comprising: the plurality of hooking portions; wherein the hooking portion has a bearing portion that penetrates a hole extending in a vertical direction when the lifting portion is raised and lowered, and The hole is inserted into the hole, and the shaft end of the abutting portion having a diameter larger than the diameter of the hole is formed at the upper end, and the lower end of the shaft portion is fixed to the holding portion. The support separation device according to the second aspect of the invention, wherein the abutting portion provided at an upper end of the shaft portion has a hole that is fitted to a hole of the bearing portion when the lifting portion is moved up and down The fitting surface of the open face. The support separation device according to any one of the first aspect, wherein the holding portion includes a plate portion having an abutting surface that abuts against a flat portion of the support body. And the plurality of claws are disposed so as to surround the outer circumference of the plate portion; the claw portion has a distance from the abutting surface in the surface direction of the abutting surface, and the outer circumference of the abutting surface faces the inner circumference. The inclined portion having a larger inclination; the holding portion is configured such that the flat portion of the support abuts against the abutting surface of the plate portion, and the inclined portion of the claw portion abuts on the outer peripheral end portion of the support body The chamfered portion is thereby held by the support. The support separation device according to the fourth aspect of the invention, wherein the inclined portion has an inclination in a range of 30° or more and less than 90° with respect to the contact surface of the plate portion. The support separation device according to any one of claims 1 to 3, wherein the holding portion includes a plate portion having a plurality of adsorption pads that adsorb and hold the support; and the lifting portion is Further, the joint member that can move the plate portion having the suction pad so as to be inclined with respect to the horizontal plane is provided, and the plate member hooked by the hook portion is moved up and down in the vertical direction. A support separation method, which is from attaching a substrate and supporting the aforementioned a laminate formed by a support of a substrate, and a method for separating a support for separating the support, comprising: a holding process, fixing a substrate of the laminate, and holding a support of the laminate; and separating In the above-described holding process, the held support is lifted and separated from the laminate; in the holding process, the holding portion that can be hooked in the vertical direction is lowered. The support is held by the flat portion of the support. The support separation method according to claim 7, wherein the holding portion has an abutting surface that abuts against a flat portion of the support, and a plurality of inclined surfaces that surround the support In this manner, the outer surface of the abutting surface is inclined toward the inner circumference as it leaves the abutting surface in the surface direction of the abutting surface. In the holding process, the planar portion of the support is brought into contact with the abutting surface. The connection surface is such that the plurality of inclined surfaces abut against the chamfered portion provided at the outer peripheral end portion of the support body, thereby holding the support.