TW201719290A - Exposure apparatus and exposure method - Google Patents

Abstract

An exposure apparatus including a wafer-carrying stage and a photomask-carrying stage is provided. The photomask-carrying stage is disposed over the wafer-carrying stage and has a plurality of photomask-carrying regions.

Description

Exposure device and exposure method

The present invention relates to a semiconductor device and a semiconductor process, and more particularly to an exposure device and an exposure method.

In the manufacturing process of the integrated circuit, the lithography process is to irradiate the exposed area on the wafer by the exposure machine to transfer the reticle pattern to the photosensitive film on the wafer.

In order to be able to form smaller and more precise pattern sizes by lithography, multiple exposure (eg, double exposure) techniques must be used. For example, the current double exposure technique is to perform two mask exposures on each wafer before exposing two masks to the next wafer.

As a result, the entire batch of wafers will continue to repeat the process of mask exchange. The mask exchange is carried out by the robot arm, and each time the mask is exchanged, the transmission time of the mask is increased once, thereby increasing the exposure time of the entire batch of wafers. Therefore, if the exchange of the mask can be avoided, the exposure process of the entire batch of wafers can be reduced, thereby increasing the throughput of the exposure machine.

The invention provides an exposure apparatus and an exposure method, which do not need to exchange a photomask when performing a multiple exposure process, thereby effectively reducing the exposure process time.

The invention provides an exposure apparatus comprising a wafer carrier and a reticle stage. The reticle stage is located above the wafer carrier and has a plurality of reticle bearing areas.

According to an embodiment of the invention, in the above exposure apparatus, at least one reticle fixing device is further included. The reticle fixture is disposed on the reticle stage.

According to an embodiment of the invention, in the above exposure apparatus, the photomask holding device is, for example, a vacuum chuck.

According to an embodiment of the invention, in the exposure apparatus described above, a plurality of photomasks are further included. The masks are respectively disposed on the reticle bearing area and have different reticle patterns.

According to an embodiment of the invention, in the above exposure apparatus, a mobile device is further included. The mobile device carries a reticle stage.

According to an embodiment of the invention, in the above exposure apparatus, the mobile device is, for example, a linear motor.

According to an embodiment of the invention, in the above exposure apparatus, a light source is further included. The light source is located on a side of the reticle stage remote from the wafer carrier.

According to an embodiment of the invention, in the exposure apparatus described above, a lens system is further included. The lens system is located between the wafer carrier and the reticle stage.

The present invention provides an exposure method comprising the following steps. An exposure apparatus is provided, wherein the exposure apparatus comprises a wafer carrier and a mask carrier, the mask carrier is located above the wafer carrier, and the mask carrier has a plurality of mask bearing areas. A plurality of reticle are respectively disposed on the reticle bearing area, wherein the reticle has different reticle patterns. The wafer is placed on a wafer carrier. The wafer is subjected to a multiple exposure process by a reticle by moving the relative positions of the reticle stage and the wafer carrier.

According to an embodiment of the present invention, in the exposure method described above, the multiple exposure process includes the following steps. The wafer is exposed by one of the reticle. The relative position of the moving reticle stage to the wafer carrier. After moving the relative position of the reticle stage to the wafer carrier, the wafer is exposed by the other of the reticle.

Based on the above, in the exposure apparatus and exposure method proposed by the present invention, since the reticle stage has a plurality of reticle carrying areas, a plurality of reticles can be carried on the reticle stage. Therefore, by moving the position of the reticle carrier and the wafer carrier, the wafer can be subjected to multiple exposure processes by different reticle, without the need for reticle exchange, so that it can be effectively Reduce the exposure process time and increase the throughput of the exposure unit.

The above described features and advantages of the invention will be apparent from the following description.

1A and FIG. 1B are schematic diagrams showing the mask carrier and the wafer carrier in different positions in the exposure apparatus according to an embodiment of the present invention. In FIGS. 1A and 1B, for the sake of clarity, the mobile device and the photomask fixing device are omitted. 2 is a top plan view of a reticle stage and a moving device in accordance with an embodiment of the present invention. 3 and 4 are top views of a reticle stage according to another embodiment of the present invention. In FIGS. 3 and 4, for the sake of clarity, only the reticle carrying area on the reticle stage is shown, and other components on the reticle stage are omitted.

1A, 1B and 2, the exposure apparatus 100 includes a wafer carrier 102 and a mask carrier 104. The exposure device 100 is, for example, a step exposure device or a scanning exposure device. Wafer carrier 102 can be used to carry wafer W.

The mask carrier 104 is located above the wafer carrier 102 and has reticle carrying areas R1, R2. In this embodiment, although the reticle stage 104 is exemplified by having two reticle carrying areas (R1, R2), the present invention is not limited thereto. Those skilled in the art can adjust the number and arrangement of the reticle carrying areas on the reticle stage 104 according to the design requirements of the exposure machine and the exposure process, as long as the reticle stage 104 has a plurality of reticle carrying areas. That is, it falls within the scope of protection of the present invention. For example, as shown in FIG. 3, the reticle stage 104a may have reticle bearing regions R1a, R2a, R3a, R4a arranged in a line. Further, as shown in FIG. 4, the reticle stage 104b may have reticle bearing areas R1b, R2b, R3b, R4b arranged in a matrix.

1A, FIG. 1B and FIG. 2, the exposure apparatus 100 may further include at least one of the reticle fixing device 106, the reticle M1, M2, the moving device 108, the light source 110, and the lens system 112.

The reticle fixture 106 is disposed on the reticle stage 104 and can be used to fix the reticle M1, M2 to the reticle stage 104, respectively. The mask fixing device 106 is, for example, a vacuum chuck. In this embodiment, although the number of the reticle fixing devices 106 is described by taking four as an example, the present invention is not limited thereto.

The reticle M1, M2 are respectively disposed on the reticle carrying areas R1, R2 of the reticle stage 104, and have different reticle patterns. In this embodiment, the exposure apparatus 100 is illustrated by taking two photomasks (M1, M2) as an example, but the invention is not limited thereto, as long as the mask carrier 104 has a plurality of masks. That is, it falls within the scope of protection of the present invention.

The mobile device 108 carries a reticle stage 104 that can be used to move the reticle stage 104. The mobile device 108 is, for example, a linear motor such as a magnetic linear motor. Where the mobile device 108 employs a magnetic linear motor, both sides of the reticle stage 104 are located in the mobile device 108. For example, the mobile device 108 can move the reticle stage 104 such that the reticle M1 of the reticle carrying area R1 is located above the wafer W (FIG. 1A), or the reticle M2 of the reticle carrying area R2 is located on the wafer W. Above (Figure 1B). In this embodiment, the relative position of the reticle stage 104 and the wafer carrier 102 is moved by the mobile device 108 as an example. In addition, when the reticle stage 104b of FIG. 4 is employed, the mobile device 108 can include a plurality of sets of linear motors (not shown), and the reticle stage 104b can be moved two-dimensionally by a plurality of sets of linear motors.

The light source 110 is located on a side of the reticle stage 104 remote from the wafer carrier 102 for use as an exposure light source and emits light L. The light source 110 is, for example, a G-line, an I-line, a KrF, or an ArF.

Lens system 112 is located between wafer carrier 102 and reticle stage 104. Those skilled in the art will be able to select lens combinations in lens system 112 in accordance with actual exposure process requirements.

Based on the above embodiment, in the exposure apparatus 100, since the reticle stage 104 has a plurality of reticle carrying areas (eg, reticle carrying areas R1, R2 in FIGS. 1A and 1B), the reticle stage is provided. A plurality of reticle (e.g., reticle M1, M2 in Figures 1A and 1B) can be carried on 104. Therefore, by moving the relative positions of the reticle stage 104 and the wafer carrier 102, the wafer W can be subjected to multiple exposure processes in sequence by different reticle, without the need for reticle exchange procedures. The time of the exposure process can be effectively reduced, thereby increasing the throughput of the exposure apparatus 100.

FIG. 5 is a flow chart of an exposure process according to an embodiment of the present invention. Hereinafter, the exposure method of the present embodiment will be described by taking the exposure apparatus 100 of FIGS. 1A, 1B, and 2 as an example. The connection relationship, the number, the characteristics, and the effects of the respective members in the exposure apparatus 100 have been described in detail in the foregoing, and thus the detailed description thereof will not be repeated hereinafter. In addition, although the embodiment of FIGS. 1A and 1B is described by taking two mask bearing regions (R1, R2) and two masks (M1, M2) as an example, the present invention does not As long as the reticle carrying area and the reticle are multiple, it belongs to the scope protected by the present invention.

Referring to FIG. 1A, FIG. 1B, FIG. 2 and FIG. 5, step S100 is performed to provide an exposure apparatus 100. The exposure apparatus 100 includes a wafer carrier 102 and a mask carrier 104, and the mask carrier 104 is located on the wafer carrier. Above the stage 102, and the reticle stage 104 has reticle carrying areas R1, R2.

In step S102, the reticle M1, M2 are respectively disposed on the reticle carrying areas R1, R2, wherein the reticle M1, M2 have different reticle patterns. For example, the reticle M1, M2 can be disposed on the reticle carrying areas R1, R2 by mechanical arms, respectively.

In step S104, the wafer W is placed on the wafer carrier 102. For example, the wafer W can be placed on the wafer carrier 102 by a robotic arm.

In step S106, by moving the relative positions of the mask carrier 104 and the wafer carrier 102, the wafer W is sequentially subjected to a multiple exposure process by the masks M1 and M2. The steps of the multiple exposure process include the following steps. In step S108, the wafer W is exposed by one of the masks M1 and M2. Step S110 is performed to move the relative position of the reticle stage 104 and the wafer carrier 102. In step S112, after moving the relative position of the mask carrier 104 and the wafer carrier 102, the wafer W is exposed by the other of the masks M1 and M2.

Hereinafter, a double exposure process will be described as an example. First, referring to FIG. 1A, when the photomask M1 of the photomask carrying region R1 is located above the wafer W, the light L emitted from the light source 110 sequentially passes through the photomask M1 and the lens system 112 to be irradiated onto the wafer W. The film is used to expose the mask pattern of the mask M1 on the photosensitive film to complete the first exposure process.

Next, referring to FIG. 1B and FIG. 2, after the first exposure process is completed, the reticle stage 104 can be moved by the mobile device 108 such that the reticle M2 of the reticle carrying area R2 is positioned above the wafer W. Then, the light L emitted from the light source 110 is sequentially irradiated onto the photosensitive film on the wafer W through the mask M2 and the lens system 112 to expose the mask pattern of the mask M2 on the photosensitive film, thereby further Complete the second exposure process.

Next, the wafer W that has completed the double exposure process can be taken out by the robot arm, and the double exposure process is performed on the other wafer W. In this embodiment, the relative position of the reticle stage 104 and the wafer carrier 102 is moved by the mobile device 108 as an example.

Based on the above embodiments, the exposure method can perform multiple exposure processes on the wafer W by different reticle by moving the relative positions of the reticle stage 104 and the wafer carrier 102, without performing the exposure process. The procedure of the mask exchange can effectively reduce the exposure process time, thereby increasing the throughput of the exposure apparatus 100.

In summary, the exposure apparatus and the exposure method of the above embodiment do not require a mask exchange procedure when performing the multiple exposure process, so that the exposure process time can be effectively reduced, thereby increasing the throughput of the exposure apparatus.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Exposure device
102‧‧‧ Wafer Carrier
104, 104a, 104b‧‧‧mask carrier
106‧‧‧Photomask fixture
108‧‧‧Mobile devices
110‧‧‧Light source
112‧‧‧Lens system
L‧‧‧Light
M1, M2‧‧‧ mask
R1, R2, R1a, R2a, R3a, R4a, R1b, R2b, R3b, R4b‧‧‧ reticle bearing area
S100, S102, S104, S106, S108, S110, S112‧‧‧ steps
W‧‧‧ wafer

1A and FIG. 1B are schematic diagrams showing the mask carrier and the wafer carrier in different positions in the exposure apparatus according to an embodiment of the present invention. 2 is a top plan view of a reticle stage and a moving device in accordance with an embodiment of the present invention. 3 and 4 are top views of a reticle stage according to another embodiment of the present invention. FIG. 5 is a flow chart of an exposure process according to an embodiment of the present invention.

100‧‧‧Exposure device

102‧‧‧ Wafer Carrier

104‧‧‧Photomask carrier

110‧‧‧Light source

112‧‧‧Lens system

L‧‧‧Light

M1, M2‧‧‧ mask

R1, R2‧‧‧mask bearing area

W‧‧‧ wafer

Claims (10)

An exposure apparatus comprising: a wafer carrier; and a mask carrier located above the wafer carrier and having a plurality of mask bearing regions. The exposure apparatus of claim 1, further comprising at least one reticle fixing device disposed on the reticle stage. The exposure apparatus of claim 2, wherein the at least one reticle fixing device comprises a vacuum chuck. The exposure device of claim 1, further comprising a plurality of reticle disposed on the reticle bearing areas and having different reticle patterns. The exposure apparatus of claim 1, further comprising a moving device carrying the reticle stage. The exposure apparatus of claim 5, wherein the moving device comprises a linear motor. The exposure apparatus of claim 1, further comprising a light source, wherein the light source is located on a side of the reticle stage remote from the wafer carrier. The exposure apparatus of claim 1, further comprising a lens system between the wafer carrier and the mask carrier. An exposure method comprising: providing an exposure device, wherein the exposure device comprises a wafer carrier and a mask carrier, the mask carrier is located above the wafer carrier, and the mask carrier has a plurality of a mask bearing area; a plurality of masks respectively disposed on the mask bearing areas, wherein the masks have different mask patterns; placing a wafer on the wafer carrier; and moving The reticle carrier is in a relative position with the wafer carrier, and the wafer is sequentially subjected to a multiple exposure process by the reticle. The exposure method of claim 9, wherein the multiple exposure process comprises: exposing the wafer to one of the masks; moving the mask carrier to the wafer carrier a position; and after moving the relative position of the mask carrier to the wafer carrier, exposing the wafer to the other of the masks.