JP5539293B2 - Exposure apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to an exposure apparatus and an exposure method used for manufacturing a semiconductor device or the like by exposing a pattern to a resist on a substrate, and a device manufacturing method using the same.

  A scanning exposure method that enlarges a transfer area by scanning and moving a reticle and a wafer in synchronization with a slit-shaped illumination light having a size approximately equal to the diameter of a circular imaging area of a projection optical system ( At present, the step-and-scan method is attracting attention as the mainstream of the exposure apparatus.

  In this method, when a projection optical system having an imaging region of the same size is used, a larger transfer area is ensured compared to the step-and-repeat method in which batch exposure is performed for each transfer region using a projection lens. be able to.

  In such an exposure apparatus, a blade as a light shielding means is provided so that light is not irradiated to an unintended shot region, and the blade is moved in synchronization with the scanning movement of the reticle and the wafer. (Patent Document 1).

Japanese Patent Application Laid-Open No. 10-09789

  However, when the blade is moved, a driving reaction force when driving the blade is applied as vibration disturbance to the illumination system support part via the support part of the blade. As a result, vibration remains in the exposure apparatus main body, and vibration disturbance is applied to the projection lens and the reticle stage, causing deterioration in exposure accuracy.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to reduce the influence of vibration disturbance due to a driving reaction force when driving a blade as a light shielding means.

In order to achieve the above object, the exposure apparatus of the present invention exposes the original pattern onto the substrate by scanning and moving the original and the substrate with respect to a projection optical system that projects the original pattern onto the substrate. In a scanning exposure type exposure apparatus, a plate-like member constituting a light-shielding means for the original plate, and a movable member is moved in a direction parallel to the gravity direction with respect to the stator, thereby causing the plate-like member to be parallel to the gravity direction Drive means for moving in any direction, and support means for supporting the stator so that the stator moves in a direction parallel to the direction of gravity when the plate-like member moves and functions as a counter. a, said support means includes a magnet for supporting the stator in a non-contact state, and a two leaf spring elastically supporting each said stator at positions corresponding to both ends of the stator And wherein the door.

  Here, the counter mass refers to a mechanism that cancels the influence of the reaction force due to the movement of the moving body by moving the mass body in the direction opposite to the moving direction of the moving body.

  The reaction force absorbing means includes, for example, an elastic body that elastically supports the stator of the driving means so as to be displaceable in a direction parallel to the moving direction of the light shielding means, and a magnet that is magnetically supported in a non-contact state. And at least one of them. Further, a means for applying a force to the moving direction of the stator of the driving means may be provided.

  The device manufacturing method of the present invention includes a step of exposing an exposure target using any one of the exposure apparatuses described above, and a step of developing the exposed exposure target.

  According to the present invention, it is possible to reduce the influence of vibration disturbance due to the driving reaction force when driving the blade as the light shielding means.

It is an elevational view showing a main part of an exposure apparatus including an illumination system according to an embodiment of the present invention. It is an arrangement plan of illumination systems etc. concerning the example of the present invention. It is a top view of the scan masking blade unit which concerns on Example 1 of this invention. It is a top view of the scan masking blade unit which concerns on Example 2 of this invention. It is a figure showing the flow of a device manufacturing process. It is a figure showing the flow of a wafer process.

  As a preferred embodiment of the present invention, an embodiment of the present invention will be described below with respect to a scanning exposure apparatus or the like in the case where the original plate is a reticle and the substrate is a wafer. 1 to 6 show Embodiment 1 and other embodiments of the present invention.

Example 1
FIG. 1 is an elevation view showing a main part of an exposure apparatus including an illumination system according to an embodiment of the present invention, and FIG. 2 is a layout view of the illumination system and the like.

  Here, reference numeral 1 denotes an illumination system unit having a function of shaping and irradiating an exposure light source and exposure light to a reticle. Reference numeral 1A denotes an illumination system support base, which supports and fixes the illumination system unit 1 to the exposure apparatus main body 5. 1B is an illumination system light source introduction part. 2C shown in FIG. 2 is an illumination optical system including the illumination system light source introduction unit 1B.

  Reference numeral 2 denotes a reticle stage on which a reticle as an exposure pattern master is mounted, and the reticle scan operation is performed on the wafer at a predetermined reduced exposure magnification ratio. Reference numeral 3 denotes a reduction projection lens, which reduces and projects an original pattern on a wafer (substrate).

  A wafer stage 4 is a stage for successively moving and positioning the substrate (wafer) sequentially with respect to the exposure position from the reduction projection lens 3 for each exposure. An exposure apparatus main body 5 supports the reticle stage 2, the reduction projection lens 3, the wafer stage 4, and the like.

  Reference numeral 6 denotes a scan masking unit having a light shielding means for shielding a pattern provided on the reticle, and a plate-like member (hereinafter referred to as a blade) constituting the light shielding means has a surface conjugate with the reticle surface. Provided.

  In the scanning exposure apparatus, since the reticle and the wafer are scanned and moved, the blade must also be moved in synchronization therewith.

  The scan masking unit according to the present embodiment will be described in more detail with reference to FIG. The scan masking unit 6 includes an X scan masking unit 7 and a Y scan masking unit 8. Reference numerals 6A and 6B denote Y blades. When scanning with the reticle, the Y blades 6A and 6B also scan and move substantially synchronously. 6C and 6D are X blades that perform light shielding in the scanning width direction of the reticle by moving in the direction perpendicular to the scanning direction of the Y blades 6A and 6B.

  Reference numeral 7 denotes an X scan masking unit, and 7A denotes an X linear motor stator that moves the X blades 6C and 6D in the X direction by the X mover 7C. 7B is an X linear encoder that measures the positions of the X blades 6C and 6D. Reference numeral 8A denotes a Y linear motor stator that moves the Y blades 6A and 6B in the Y direction by the Y movable element 8C. Reference numeral 8B denotes a Y linear encoder that measures the positions of the Y blades 6A and 6B.

  Here, the self-weight compensation magnet 8D is a magnet for self-weight compensation of the Y linear motor, and the same magnetic poles face each other so that self-weight compensation can be performed in a non-contact state. 8E is a leaf spring that elastically supports between the illumination system support base 1A and the Y linear motor stator 8A. One end of the leaf spring 8E is fixed to the illumination system support base 1A, and elastically supports the Y linear motor stator 8A so as to be movable in the thrust generation direction of the Y linear motor.

  8F is a stator position control motor, and controls the moving position of the Y linear motor stator 8A in the thrust direction.

  With the above configuration, when the driving reaction force of the Y mover 8C is generated with respect to the Y linear motor stator 8A when the Y blades 6A and 6B are moved by scanning, the Y linear motor stator 8A is generated. Moves in the direction indicated by the arrow and functions as a passive counter to absorb the driving reaction force.

  Further, the Y linear motor stator 8A that has moved is set and returned by the stator position control motor 8F, so that the position of the Y linear motor stator 8A is maintained and set at a substantially neutral position for continuous reciprocation. The

  As a result, vibration disturbance is not applied to the illumination system support base 1A, vibration does not remain on the exposure apparatus body 5, and it is avoided that vibration disturbance is applied to the reduction projection lens 3 and the reticle stage 2. Prevents degradation of accuracy.

  The above-described configuration is particularly effective in a linear motor that drives the blade in the scan (Y) direction, but also has an effect in the (X) direction. This will be described in Example 2.

(Example 2)
FIG. 4 is a plan view of a scan masking blade unit according to Embodiment 2 of the present invention. In the first embodiment described above, the leaf spring 8E and the stator position control motor 8F are provided as means for absorbing the reaction force of the Y blades 6A and 6B. In addition to these, in the second embodiment of the present invention, FIG. As shown in FIG. 4, leaf springs 7E are provided at positions corresponding to both ends of the X linear motor stator 7A, and a stator position control motor 7F is disposed on one end side of the X linear motor stator 7A.

  One end of the leaf spring 7E is fixed to the illumination system support base 1A, and elastically supports the X linear motor stator 7A so as to be movable in the thrust generation direction of the X linear motor. The stator position control motor 7F controls the moving position of the X linear motor stator 7A in the thrust direction.

  As described above, in this embodiment, the X linear motor stator 7A is also moved in the direction in which the driving reaction force is generated via the leaf spring 7E for the X blades 6C and 6D of the X linear motor stator 7A as well as the Y blades 6A and 6B. By providing elastic support and providing the stator position control motor 7F, it is possible to absorb the driving reaction force of the X linear motor.

(Example 3)
(Device manufacturing method using the above exposure apparatus)
Next, a semiconductor device manufacturing process using this exposure apparatus will be described as a third embodiment of the present invention. FIG. 5 is a diagram showing a flow of an entire manufacturing process of a semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask fabrication), a mask is fabricated based on the designed circuit pattern.

  On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by using the above-described exposure apparatus and lithography technology using the above-described mask and wafer. The next step 5 (assembly) is called a post-process, which is a process for forming a semiconductor chip using the wafer produced in step 5, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes, and is shipped in Step 7.

  The wafer process in step 4 has the following steps (FIG. 6). An oxidation step for oxidizing the surface of the wafer (step 11), a CVD step for forming an insulating film on the wafer surface (step 12), an electrode forming step for forming electrodes on the wafer by vapor deposition (step 13), and ions on the wafer Ion implantation step for implanting (step 14), resist processing step for applying a photosensitive agent to the wafer (step 15), exposure step for transferring a circuit pattern to the wafer after the resist processing step by the exposure apparatus (step 16), exposure step A developing step (step 17) for developing the wafer exposed in step (1), an etching step (step 18) for removing portions other than the resist image developed in the developing step, and a resist stripping step (step 19) for removing the resist that has become unnecessary after the etching. ). By repeating these steps, multiple circuit patterns are formed on the wafer.

Claims (8)

In an exposure apparatus of a scanning exposure method that exposes the original pattern onto the substrate by scanning and moving the original and the substrate with respect to a projection optical system that projects the original pattern onto the substrate,
A plate-like member constituting the light shielding means for pre-Symbol precursor,
Drive means for moving the plate member in a direction parallel to the gravity direction by moving the mover in a direction parallel to the gravity direction with respect to the stator;
And supporting means for supporting the stator so that the stator moves in a direction parallel to the direction of gravity when the plate member moves and functions as a counter ,
It said support means includes a comprising a magnet for supporting the stator in a non-contact state, and a two leaf spring elastically supporting each said stator at positions corresponding to both ends of the stator Exposure equipment to do. In an exposure apparatus of a scanning exposure method that exposes the original pattern onto the substrate by scanning and moving the original and the substrate with respect to a projection optical system that projects the original pattern onto the substrate,
A first plate member and second plate member constituting the light-shielding means for pre-Symbol precursor,
Is moved in a direction parallel to said first plate member in the direction of gravity by moving the first movable element in a direction parallel to the direction of gravity with respect to the stator, the second movable element with respect to the stator driving means for moving in a direction parallel to the second plate-like member before Symbol gravity direction by moving in the direction parallel to the direction of gravity,
Support means for supporting the stator so that when the first plate-like member and the second plate-like member are moved, the stator moves in a direction parallel to the gravity direction and functions as a counter ; Have
It said support means includes a comprising a magnet for supporting the stator in a non-contact state, and a two leaf spring elastically supporting each said stator at positions corresponding to both ends of the stator Exposure equipment to do. 3. The exposure apparatus according to claim 1 , wherein a part of the two leaf springs and a part of the stator overlap with each other at positions corresponding to both ends of the stator . The plate-like member, or the first plate-like member and the second plate-like member are provided on a surface conjugate with the surface of the original plate. 2. The exposure apparatus according to item 1. The exposure apparatus according to any one of claims 1 to 4, further comprising a linear motor, a for controlling the position of the moved the stator to act as a counter.   An exposure apparatus that exposes a pattern of the original on the substrate via a projection optical system while scanning and moving the original and the substrate,
  An exposure apparatus main body for supporting the projection optical system;
  An illumination system unit that irradiates the original plate with exposure light from above in the direction of gravity;
  An illumination system support base that supports the illumination system unit with respect to the exposure apparatus main body,
  The illumination system unit is
  A plate-like member that blocks the exposure light applied to the original plate;
  Driving means for moving the plate member in a direction parallel to the gravitational direction by driving the mover in a direction parallel to the gravitational direction with respect to the stator;
  Supporting means for supporting the stator so that the stator moves in the opposite direction when the plate member moves in a direction parallel to the direction of gravity and functions as a counter;
  The support means is
  A first magnet provided on the illumination system support base and a second magnet having the same magnetic pole as the first magnet provided on the stator so as to face the first magnet in a direction parallel to the gravitational direction;
  Two leaf springs extending from one end fixed to the illumination system support base in a direction different from the direction parallel to the gravitational direction,
  The first magnet and the second magnet support the stator in a non-contact state,
  The exposure apparatus according to claim 2, wherein the two leaf springs elastically support the stator at positions corresponding to both ends of the stator. The illumination system unit is
A second plate member that shields the exposure light applied to the original plate;
Second driving means for moving the second plate member in a direction perpendicular to the gravitational direction by driving the second movable element in a direction perpendicular to the gravitational direction with respect to the second stator;
The second stator is supported so that when the second plate member moves in a direction perpendicular to the direction of gravity, the second stator moves in the opposite direction and functions as a counter. Second support means,
The second support means includes
Two second leaf springs extending from one end fixed to the illumination system support base in a direction different from the direction perpendicular to the gravitational direction;
7. The exposure apparatus according to claim 6, wherein the two second leaf springs elastically support the second stator at positions corresponding to both ends of the second stator. Device manufacturing method and a step of exposing a substrate using an exposure apparatus according to any one of claims 1 to 7 and a step of developing the exposed said substrate.

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