TW201711969A - Method for breaking brittle substrate capable of accurately breaking a brittle substrate along a trench line - Google Patents

Abstract

The present invention discloses a method for breaking a brittle substrate accurately along a trench line. Prepare a brittle substrate 11 which is provided with a first surface SF1 containing a trench line TL consisted of a first part LR and a second part HR, and a second surface SF2 opposite to the first surface SF1. Cracks extend only along the second part HR of the first part LR and the second part HR. Next, place the first surface SF1 of the brittle substrate 11 on a support part 80 via a first elastic member 71, wherein the first elastic member 71 is more elastic than both the brittle substrate 11 and the support part 80. Subsequently, press a stress-applying member 85 against the second surface SF2 of the brittle substrate 11 via a second elastic member 72, wherein the second elastic member 71 is more elastic than both the brittle substrate 11 and the tress-applying member 85.

Description

Fragmentation method of brittle substrate

The present invention relates to a method of breaking a brittle substrate.

In the manufacture of electrical equipment such as a flat panel display panel or a solar panel, it is often necessary to break a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. The scribing can be formed by machining the substrate using the tip. A groove obtained by plastic deformation is formed on the substrate by sliding or rolling the blade tip on the substrate, and at the same time, a vertical crack is formed below the groove. Thereafter, stress imparting is referred to as a fracture step. Thereby, the vertical crack is completely traveled in the thickness direction to break the substrate. The step of dividing the substrate is performed relatively immediately after the step of forming the scribe line on the substrate. However, the step of processing the substrate between the step of forming the scribe line and the step of breaking is also proposed. For example, according to the technique of International Publication No. 2002/104078, in the manufacturing method of an organic EL (Electroluminescence) display, a scribe line is formed on a glass substrate for each region of each organic EL display before the sealing cover is mounted. . Therefore, it is possible to avoid contact between the sealing cover which is a problem when the scribing is formed on the glass substrate after the sealing cover is provided, and the glass cutter. Further, for example, according to the technique of the international publication No. 2003/006391, in the method of manufacturing a liquid crystal display panel, two glass substrates are bonded together after forming a scribe line. Thereby, it is possible to simultaneously break two brittle substrates in one breaking step. [Prior Art Document] [Patent Document] [Patent Document 1] International Publication No. 2002/104078 [Patent Document 2] International Publication No. 2003/006391

[Problem to be Solved by the Invention] According to the above prior art, the processing of the brittle substrate is performed after the scribing is formed, and the stress is applied to the subsequent fracture step. This situation means that there is already a vertical crack along the entire scribe line during processing of the brittle substrate. Therefore, there may be a case where the vertical stretching in the thickness direction of the vertical crack is unexpectedly generated during processing, resulting in separation of the brittle substrate which should be integrated during processing. Further, even when the processing step of the substrate is not performed between the step of forming the scribe line and the step of structuring the substrate, it is usually necessary to transport or store the substrate after the step of forming the scribe line and before the step of rupturing the substrate. There may be cases where the substrate is accidentally broken. In order to solve the above problems, the inventors of the present invention have developed a separate breaking technique. According to this technique, as a line defining a position at which the brittle substrate is divided, first, a groove line having no crack is formed under the line. The position at which the brittle substrate is broken is defined by forming the groove lines. Thereafter, as long as the state in which no crack exists below the groove line is maintained, the break along the groove line is less likely to occur. By using this state, it is possible to prevent the brittle substrate from being accidentally broken before the time point at which the brittle substrate is to be separated, by preliminarily specifying the position at which the brittle substrate is to be separated. As described above, the groove line is less likely to be broken along with the usual scribe line. Thereby, the accidental breaking of the brittle substrate is prevented, and on the other hand, there is a problem that it is difficult to accurately perform the breaking of the brittle substrate along the groove line. The present invention has been made in order to solve the above problems, and an object thereof is to provide a breaking method capable of accurately performing a brittle substrate along which a groove line having no cracks is formed below. [Technical means for solving the problem] The breaking method of the brittle substrate of the present invention has the following steps. a) A brittle substrate having a first surface on which the groove lines including the first and second portions are provided and a second surface opposite to the first surface, and a thickness direction perpendicular to the first surface. Only under the first part of the first part and the second part, the brittle substrate is in a state of continuous connection in a direction crossing the groove line, that is, a crack-free state. The crack extends only along the second part of the first and second parts. b) The first surface of the brittle substrate is placed on the support portion via the first elastic member. The first elastic member is more flexible than each of the brittle substrate and the support portion. c) After step b), the stress applying member is pressed against the second surface of the brittle substrate via the second elastic member. The second elastic member is more elastic than each of the brittle substrate and the stress applying member. [Effects of the Invention] According to the invention, the first elastic member is more elastic than the brittle substrate and the support portion. Further, the second elastic member is more elastic than each of the brittle substrate and the stress applying member. Thereby, first, the separation of the brittle substrate along the second portion of the groove line is stably generated. Thereafter, further separation of the brittle substrate is stably generated along the first portion of the trench line. Therefore, the brittle substrate can be stably broken along the entire groove line.

Hereinafter, a method of dividing a brittle substrate in each embodiment of the present invention will be described based on the drawings. In the following, the same or corresponding components are denoted by the same reference numerals, and the description thereof is not repeated. <Embodiment 1> (Blocking method) The breaking method of the brittle substrate of the present embodiment will be described below with reference to the flowchart of Fig. 1 . The glass substrate 11 is prepared with reference to Figs. 2 to 4 . The glass substrate 11 has a first surface SF1 and a second surface SF2 opposite thereto. Further, the glass substrate 11 has a thickness direction DT perpendicular to the first surface SF1. Further, a scribing tool having a blade tip is prepared. The details of the marking device are described below. Then, while the blade edge is pressed against the first surface SF1 of the glass substrate 11, the blade edge is moved from the starting point N1 to the end point N3 from the starting point N1 on the first surface SF1. Thereby, plastic deformation occurs on the first surface SF1 of the glass substrate 11. Thereby, the groove line TL extending from the starting point N1 to the end point N3 via the intermediate point N2 is formed on the first surface SF1 (FIG. 1: Step S11). In Fig. 2, three TLs are formed by the movement of the blade edge in the direction DA. The step of forming the trench line TL includes a step of forming a low load section LR (first part) as a part of the trench line TL, and a step of forming a high load section HR (part 2) as a part of the trench line TL . In FIG. 2, a low load section is formed from the starting point N1 to the halfway point N2, and a high load section is formed from the midway point N2 to the end point N3. The load applied to the tool tip in the step of forming the high load interval HR is higher than the load used in the step of forming the low load interval LR. Conversely, the load applied to the tool tip in the step of forming the low load section LR is lower than the load used in the step of forming the high load section HR, for example, about 30 to 50% of the load of the high load section HR. Therefore, the width of the high load interval HR is greater than the width of the low load interval LR. For example, the high load interval HR has a width of 10 μm and the low load interval LR has a width of 5 μm. Also, the depth of the high load section HR is greater than the depth of the low load section LR. The cross section of the groove line TL has, for example, a V shape having an angle of about 160°. The step of forming the trench line TL is performed in such a manner that the glass substrate 11 is crossed in the direction intersecting the trench line TL below both the low load section LR and the high load section HR (FIG. 4(A) and (B)) The state of continuous connection is the state of no crack. For this reason, the load applied to the blade tip is made large to the extent that the plastic deformation of the glass substrate 11 is generated, and is small enough not to cause cracks starting from the plastic deformation portion. Next, the crack is generated only along the high load section HR of the groove line TL and the high load section HR in the low load section LR (FIG. 1: Step S12). Specifically, the following steps are performed. Referring to FIGS. 5 to 7 , first, an auxiliary line AL intersecting the high load section HR is formed on the first surface SF1 of the glass substrate 11 . The auxiliary line AL is accompanied by a crack which penetrates into the thickness direction of the glass substrate 11. The auxiliary line AL can be formed by a usual scribing method. Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a usual cleavage step. In response to this separation, the crack of the glass substrate 11 in the thickness direction extends only along the low load section LR of the trench line TL and the high load section HR in the high load section HR. 8 and 9, according to the above, the crack is generated only along the low load section LR of the groove line TL and the high load section HR in the high load section HR. Specifically, the crack line CL is formed in a portion between the edge newly generated by the separation and the halfway point N2 in the high load section HR. The direction in which the crack line CL is formed is opposite to the direction DA (FIG. 2) in which the groove line TL is formed. Further, the portion between the side newly formed by the separation and the end point N3 is less likely to form the crack line CL. This direction dependence is caused by the state of the blade edge when the high load section HR is formed, which will be described in detail below. Referring to Fig. 10, the glass substrate 11 is continuously disconnected in the direction DC intersecting the extending direction of the groove line TL by the crack line CL below the high load interval HR of the groove line TL. Here, "continuous connection", in other words, is a connection that is not interrupted by cracks. Further, in a state where the continuous connection is broken as described above, portions of the glass substrate 11 can also be in contact with each other via the crack of the crack line CL. Further, a slightly continuous connection may remain immediately below the groove line TL. From the above, the glass substrate 11 which was broken by the following procedure was prepared (FIG. 1: Step S10). At this point of time, the glass substrate 11 is in a state of being continuously connected in a direction intersecting the groove line TL, that is, in a state where there is no crack, only under the low load section LR in the low load section LR and the high load section HR. Further, the crack extends only along the high load section HR in the low load section LR and the high load section HR. Next, a step of breaking the glass substrate 11 along the groove line TL is performed. At this time, by applying stress to the glass substrate 11, the crack is stretched along the low load section LR starting from the crack line CL. The direction in which the crack is stretched (arrow PR in Fig. 11) is opposite to the direction DA (Fig. 2) in which the groove line TL is formed. The details of the breaking step will be described below. Referring to Fig. 12, a platform 80 (support portion) is prepared. The platform 80 is made, for example, of glass or stainless steel. Platform 80 typically has a flat surface. Next, the first surface SF1 of the glass substrate 11 is placed on the stage 80 via the lower elastic piece 71 (first elastic member) (FIG. 1: Step S20). The lower elastic piece 71 is made of a general elastic body, and thus is more elastic than each of the glass substrate 11 and the stage 80. In other words, the lower elastic piece 71 has a Young's modulus lower than the Young's modulus of each of the glass substrate 11 and the stage 80. Further, in other words, the lower elastic sheet 71 has a hardness lower than that of each of the glass substrate 11 and the stage 80. The hardness of the lower elastic sheet 71 is preferably 40 to 90°. The elastic body as the material of the lower elastic sheet 71 is preferably rubber, such as polyoxymethylene rubber, chloroprene rubber or natural rubber. The thickness of the lower elastic piece 71 is, for example, about several mm. Referring to FIGS. 13 and 14 , the upper elastic piece 72 (second elastic member) is placed on the second surface SF2 of the glass substrate 11 . Further, the rod 85 (stress applying member) is prepared to be broken. As shown in Fig. 14, the breaking lever 85 preferably has a shape that protrudes so as to be locally pressed against the object to which the stress is applied, and has a substantially V-shaped shape in Fig. 14 . As shown in Fig. 13, the protruding portion extends linearly. The break lever 85 is made of, for example, a cemented carbide, partially stabilized zirconia or stainless steel. The upper elastic piece 72 is made of a general elastic body, and thus is more elastic than each of the glass substrate 11 and the breaking lever 85. In other words, the upper elastic piece 72 has a Young's modulus which is lower than the Young's modulus of each of the glass substrate 11 and the break lever 85. Further, in other words, the upper elastic piece 72 has a hardness lower than that of each of the glass substrate 11 and the break lever 85. The hardness of the upper elastic sheet 72 is preferably 40 to 90°. The elastomer as the material of the upper elastic sheet 72 is preferably rubber, such as polyoxyethylene rubber, chloroprene rubber or natural rubber. The material of the upper elastic piece 72 may be the same as that of the lower elastic piece 71. The thickness of the upper elastic piece 72 is, for example, about several mm. Referring to Figure 15, second, the break lever 85 is brought close to the platform 80. Preferably, the break lever 85 is linearly moved relative to the platform 80 in the direction DR. The direction DR may be selected in such a manner that the breaking lever 85 is close to the stage 80, for example, a direction perpendicular to the surface (upper surface in the drawing) of the stage 80. The break lever 85 is typically moved toward the glass substrate 11 by a distance of about several hundred μm based on the position at which the upper elastic piece 72 is in contact with the glass substrate 11 . By this movement, the break lever 85 is pressed against the second surface SF2 of the glass substrate 11 via the upper elastic piece 72 (FIG. 1: Step S30). Thereby, stress is applied to the glass substrate 11 by being sandwiched between the upper elastic sheet 72 and the lower elastic sheet 71. As a result, the crack spreads from the crack line CL set along the high load section HR. Referring to Fig. 16, the glass substrate 11 is separated along the high load section HR due to the expansion of the crack. Further, as shown by an arrow PR in the figure, the crack extends from the high load section HR to the low load section LR. As described above, the glass substrate 11 is divided along the groove line TL along both the high load section HR and the low load section LR. That is, a breaking step of dividing the glass substrate 11 as shown in FIG. 11 is performed. (Scribing Apparatus) Referring to Figs. 17(A) and (B), the scribing tool 50 suitable for the formation of the groove line TL will be described. The scribing tool 50 is relatively moved with respect to the glass substrate 11 by being attached to a scribing head (not shown), thereby scribing the glass substrate 11. The scribing tool 50 has a blade tip 51 and a handle 52. The tip 51 is held by the handle 52. The blade tip 51 is provided with a top surface SD1 and a plurality of faces surrounding the top surface SD1. The plurality of faces include a side surface SD2 and a side surface SD3. The top surface SD1, the side surfaces SD2, and the SD3 face different directions from each other and are adjacent to each other. The blade edge 51 has a vertex where the top surface SD1, the side surfaces SD2, and SD3 merge, and the apex constitutes the protrusion PP of the blade edge 51. Further, the side faces SD2 and SD3 form a ridge line constituting the side portion PS of the blade edge 51. The side portion PS extends linearly from the protrusion portion PP. Further, since the side portion PS is a ridge line as described above, it has a convex shape extending in a line shape. The tip 51 is preferably a diamond tip. That is, the cutting edge 51 is preferably made of diamond. In this case, the hardness can be easily increased and the surface roughness can be made small. More preferably, the tip 51 is made of single crystal diamond. More preferably, crystallographically, the top surface SD1 is a {001} plane, and each of the side surfaces SD2 and SD3 is a {111} plane. In this case, the side faces SD2 and SD3 have different directions, but are crystallographically equivalent to each other. Further, a non-single crystal diamond may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may also be used. Alternatively, a polycrystalline diamond obtained by sintering a particulate material such as graphite or a non-graphite carbon containing no iron group element, or a sintered diamond obtained by combining diamond particles by a bonding material such as an iron group element may be used. The shank 52 extends along the axial direction AX. The blade edge 51 is preferably attached to the shank 52 so as to be substantially along the axial direction AX in the normal direction of the top surface SD1. In the formation of the groove line TL using the scribing tool 50, the blade edge 51 is first pressed against the first surface SF1 of the glass substrate 11. Specifically, the protrusion PP and the side portion PS of the blade edge 51 are pressed against the thickness direction DT of the glass substrate 11 . Next, the blade tip 51 that has been pressed is slid in the direction DA on the first surface SF1. The direction DA is projected onto the first surface SF1 from the direction in which the protrusion portion PP extends along the side portion PS, and substantially corresponds to the direction in which the axial direction AX is projected onto the first surface SF1. When sliding, the blade edge 51 is dragged and slid on the first surface SF1 by the shank 52. By this sliding, plastic deformation occurs on the first surface SF1 of the glass substrate 11. The groove line TL is formed by the plastic deformation. Further, in the formation of the groove line TL from the starting point N1 to the end point N3 in the present embodiment, when the blade edge 51 is moved in the direction DB, in other words, the blade edge 51 is referenced based on the moving direction of the blade edge 51. When the posture is inclined in the reverse direction, the formation of the crack line CL shown in FIG. 9 and the progress of the crack shown in FIG. 16 are less likely to occur than in the use direction DA. More generally, in the groove line TL formed by the movement of the blade edge 51 in the direction DA, the crack easily spreads in a direction opposite to the direction DA. On the other hand, in the groove line TL formed by the movement of the blade edge 51 in the direction DB, the crack easily spreads in the same direction as the direction DB. It is presumed that such a direction dependency may be associated with a stress distribution generated in the glass substrate 11 due to plastic deformation generated when the groove line TL is formed. Moreover, according to the study by the inventors of the present invention, the axial dependence can be reversed by making the axial direction AX closer to the vertical with respect to the first surface SF1. (Comparative Example) A comparative example in which the glass substrate 11 is sandwiched between the stage 80 and the break lever 85 without the lower elastic sheet 71 and the upper elastic sheet 72 is shown in Fig. 15 . In this case, in the initial stage of applying stress to the glass substrate 11 by the break lever 85, a large stress can be locally applied to the glass substrate 11. Specifically, a large stress can be locally applied to the position where the break lever 85 of the second surface SF2 of the glass substrate 11 initially contacts. When the position is on the low load section LR (FIG. 15) where the crack is not provided, a large stress is locally applied to the region where the crack which is the starting point is not present, and as a result, it is easy to be from the low load section LR. The glass substrate 11 is separated by the wire being separated. This problem can be avoided if the break lever 85 can simultaneously contact the entire line along the line of the groove line TL (the upper side of the glass substrate 11 in Fig. 15). However, strict position control is required for this purpose, and in particular, the larger the length of the glass substrate 11 (the lateral dimension in Fig. 15), the more difficult it is to carry out, and it is particularly difficult to be about 500 mm or more. If the right side of the map of the break lever 85 (FIG. 13) is disposed substantially below the left side, the break lever 85 is linearly moved relative to the platform 80 in the direction DR (FIG. 15). In the initial stage of stress application, the break lever 85 is more marginally contacted with the high load section HR than the low load section LR of the second face SF2. In this case, it is prevented that a large stress is locally applied to the vicinity of the low load section LR in the initial stage of stress application. However, if the break lever 85 is further brought closer to the platform 80 in order to advance the breaking step, the right side of the break lever 85 collides with the platform 80. Therefore, it becomes difficult to complete the fracture step until the end. The larger the length of the glass substrate 11 (the lateral dimension in FIG. 15), the more remarkable the problem is, and it is particularly problematic if it is about 500 mm or more. (Effect) Unlike the above comparative example, according to the present embodiment, the lower elastic sheet 71 and the upper elastic sheet 72 (Fig. 15) are used in the breaking step. The lower elastic piece 71 is more elastic than each of the glass substrate 11 and the stage 80. Further, the upper elastic piece 72 is more elastic than each of the glass substrate 11 and the break lever 85. By the lower elastic piece 71 and the upper elastic piece 72, it is suppressed that a large stress is locally applied to the glass substrate 11 in the initial stage of stress application. Thereby, in the initial stage, first, the separation of the glass substrate 11 along the high load section HR of the groove line TL is stably generated. Thereafter, the further separation of the glass substrate 11 is stably generated along the low load interval LR of the groove line TL. Thereby, the glass substrate 11 can be stably broken along the entire groove line TL. Preferably, the contact of the break lever 85 with respect to the second surface SF2 of the glass substrate 11 is performed by linearly moving the break lever 85 in the direction DR with respect to the stage 80. Thereby, the breakage can be performed without breaking the complicated action of the rod 85 or the platform 80. Further, according to the present embodiment, when the groove line TL (Figs. 2 and 3) for defining the position at which the glass substrate 11 is to be separated is formed, the light load is reduced in the low load section LR as compared with the high load section HR. The load applied by the tip 51 (Fig. 17(A)). Thereby, damage to the blade edge 51 can be reduced. Further, when the low load section LR in the low load section LR and the high load section HR is in the non-cracked state (Figs. 8 and 9), the crack at the starting point for breaking the glass substrate 11 does not exist in the low load section. LR. Therefore, when the glass substrate 11 is subjected to an arbitrary treatment in this state, even if an unexpected stress is applied to the low load section LR, the accidental breakage of the glass substrate 11 is less likely to occur. Therefore, the above processing can be performed stably. Further, when both the low load section LR and the high load section HR are in the non-cracked state (FIGS. 2 and 3), the crack which is the starting point for breaking the glass substrate 11 does not exist in the groove line TL. Therefore, in the case where the glass substrate 11 is subjected to an arbitrary treatment in this state, even if an unexpected stress is applied to the groove line TL, the accidental breakage of the glass substrate 11 is less likely to occur. Therefore, the above processing can be performed more stably. Further, the groove line TL is formed before the formation of the auxiliary line AL. Thereby, it is possible to avoid the influence of the auxiliary line AL when the groove line TL is formed. In particular, it is possible to avoid the formation of an abnormality immediately after the cutting edge 51 passes through the auxiliary line AL in order to form the groove line TL. Next, a modification of the first embodiment will be described below. Referring to Fig. 18, it is also possible to form a crack line CL by crossing the auxiliary line AL and the groove line TL. This phenomenon may occur when the stress applied to the glass substrate 11 when the auxiliary line AL is formed is large. Referring to Fig. 19, an auxiliary line AL may be first formed on the first surface SF1 of the glass substrate 11, and then a groove line TL (not shown in Fig. 19) may be formed. Referring to Fig. 20, the auxiliary line AL may be formed on the second surface SF2 of the glass substrate 11 so as to intersect the high load section HR in the planar layout. Thereby, both the auxiliary line AL and the groove line TL can be formed without affecting each other. Referring to Figs. 21(A) and (B), a scribing device 50v may be used instead of the scribing device 50 (Figs. 17(A) and (B)). The blade tip 51v has a conical shape including a vertex and a conical surface SC. The protrusion PPv of the blade edge 51v is constituted by a vertex. The side portion PSv of the blade edge is formed from an imaginary line extending from the apex on the conical surface SC (dashed line in FIG. 21(B)). Thereby, the side portion PSv has a convex shape extending in a line shape. <Embodiment 2> Referring to Fig. 22, first, a glass substrate 11 is prepared. Further, a scribing tool having a blade tip is prepared. The details of the marking device are described below. Then, by moving the blade edge on the first surface SF1 of the glass substrate 11 in the direction DB, the auxiliary line AL intersecting the following high load section HR (FIG. 23) is formed on the first surface SF1. Referring to Fig. 23, the groove line TL is formed on the first surface SF1 of the glass substrate 11 from the starting point Q1 via the intermediate point Q2 to the end point Q3 by the movement of the blade edge in the direction DB. The groove line TL from the starting point Q1 to the halfway point Q2 is formed as the high load section HR. The groove line TL from the half point Q2 to the end point Q3 is formed as the low load section LR. Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a usual cleavage step. With this separation, the crack of the glass substrate 11 in the thickness direction extends along the groove line TL only in the high load section HR in the groove line TL. Referring to Fig. 24, a crack line CL is formed along a portion of the groove line TL by the extension of the above-mentioned crack. Specifically, the crack line CL is formed in a portion between the newly generated side and the halfway point Q2 in the high load section HR by separation. The direction in which the crack line CL is formed is the same as the direction DB (Fig. 23) in which the groove line TL is formed. Further, it is difficult to form the crack line CL in the portion between the newly generated side and the starting point Q1 by separation. This direction dependence is caused by the state of the blade edge when the high load section HR is formed, which will be described in detail below. Next, in the same fracture step (Figs. 12 to 16) as in the first embodiment, a step of breaking the crack from the midway point Q2 toward the end point Q3 along the groove line TL with the crack line CL as a starting point is performed. Thereby, the glass substrate 11 is broken. Referring to FIGS. 25 and 26, as a first modification, the groove line TL may be formed first, and then the auxiliary line AL may be formed. Referring to Fig. 27, as a second modification, the formation of the auxiliary line AL may be triggered to form the crack line CL. Referring to Fig. 28, the auxiliary line AL may be formed on the second surface SF2 of the glass substrate 11 so as to intersect the high load section HR in the planar layout. Further, in the present embodiment, the high load section HR is formed from the starting point Q1, but the high load section HR may be formed in a portion intersecting the auxiliary line AL. For example, the low load section LR may be formed from the start point Q1 to the position where the auxiliary line AL intersects, and thereafter, the high load section HR is formed so as to intersect the auxiliary line AL. Referring to Fig. 29, a scribing tool 50R suitable for the formation of the groove line TL in the present embodiment will be described next. The scribing tool 50R has a scribing wheel 51R, a holder 52R, and a pin 53. The scribing wheel 51R has a substantially disk-like shape, and its diameter is typically about several mm. The scribing wheel 51R is rotatably held by the holder 52R around the rotation axis RX via the pin 53. The scribing wheel 51R has a peripheral portion PF provided with a blade edge. The outer peripheral portion PF extends in an annular shape around the rotation axis RX. As shown in Fig. 30(A), the outer peripheral portion PF is steeply ridged at a visual level, thereby constituting a blade edge including a ridge line and an inclined surface. On the other hand, at the microscope level, as shown in Fig. 30(B), the scribing wheel 51R enters the first surface SF1, thereby being in the actual functioning portion (more than the two-point chain line of Fig. 30(B) Further below, the ridgeline of the outer peripheral portion PF has a fine surface shape MS. The surface shape MS preferably has a curved shape when viewed from the front (Fig. 30(B)), and the curved shape has a finite radius of curvature. The scribing wheel 51R is formed using a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond. From the viewpoint of making the surface roughness of the ridge line and the inclined surface small, the entire scribing wheel 51R may be made of single crystal diamond. The formation of the groove line TL using the scribing tool 50R is performed by rolling the scribing wheel 51R on the first surface SF1 of the glass substrate 11 (FIG. 29: arrow RT). The wheel 51R travels in the direction DB on the first surface SF1. While the load F is applied to the scribing wheel 51R, the outer peripheral portion PF of the scribing wheel 51R is pressed against the first surface SF1 of the glass substrate 11, and the rolling is performed. Thereby, plastic deformation is generated on the first surface SF1 of the glass substrate 11, whereby the groove line TL having the groove shape is formed. The load F has a vertical component Fp parallel to the thickness direction DT of the glass substrate 11 and an in-plane component Fi parallel to the first surface SF1. The direction DB is the same as the in-plane component Fi. Further, the groove line TL may be formed by a method other than the scribing tool 50R that moves in the direction DB, for example, by the scribing device 50 that moves in the direction DB (Fig. 17(A) and B)) or 50v (Fig. 21 (A) and (B)) are formed. The components other than the above are substantially the same as those of the above-described first embodiment, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated. According to this embodiment, the same effects as those of the first embodiment are obtained. Further, in the present embodiment, the groove line TL can be formed by using the rotating blade edge instead of the fixed blade edge, so that the life of the blade edge can be extended. <Embodiment 3> Referring to Fig. 31 and Fig. 32, in the present embodiment, when the groove line TL is formed by the blade edge, the high load section HR is formed to the end point N4 on the edge of the glass substrate 11 instead of the end point N3 ( figure 2). Thereby, when the groove line TL is formed, the edge of the glass substrate 4 is cut at the end point N4. Referring to Fig. 33, the edge of the glass substrate 4 is cut, and as shown by the arrow in the figure, the crack extends from the edge of the glass substrate 4. Thereby, the crack line CL is formed. Referring to Figure 34, a desired number of trench lines TL are formed by repeating this step. Thereafter, the same fracture step as in the first embodiment was carried out. According to the present embodiment, it is possible to easily provide the glass substrate 4 with a start of the formation of the crack line CL without particularly requiring the formation of the auxiliary line AL (FIG. 5) or the like. <Embodiment 4> Referring to Fig. 35, in the present embodiment, when the first surface SF1 of the glass substrate 11 is placed on the stage 80 via the lower elastic sheet 71, the first surface SF1 and the lower surface of the glass substrate 11 are placed. A film 81 is disposed between the side elastic pieces 71. The film 81 is on the first surface SF1 side of the glass substrate 11, and has adhesiveness lower than that of the lower elastic sheet 71 (adhesiveness). The film 81 is preferably a resin film made of, for example, polyethylene terephthalate, polyethylene, polyvinyl chloride or polyolefin. The thickness of the film 81 is smaller than the thickness of the lower elastic sheet 71, and is, for example, about several tens of μm. When the break lever 85 is pressed against the second surface SF2 of the glass substrate 11 via the upper elastic sheet 72, the film 82 is placed between the second surface SF2 of the glass substrate 11 and the upper elastic sheet 72. Specifically, the film 82 is placed on the second surface SF2 of the glass substrate 11. The upper elastic sheet 72 is placed on the film 82. The film 82 is attached to the second surface SF2 side of the glass substrate 11, and has adhesiveness lower than that of the upper elastic sheet 72. The film 82 is preferably a resin film made of, for example, polyethylene terephthalate, polyethylene, polyvinyl chloride or polyolefin. The thickness of the film 82 is smaller than the thickness of the upper elastic sheet 72, and is, for example, about several tens of μm. In addition, the configuration other than the above is substantially the same as that of the above-described first to third embodiments, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated. According to the present embodiment, the lower elastic sheet 71 is prevented from being attached to the first surface SF1 by arranging the film 81 between the first surface SF1 of the glass substrate 11 and the lower elastic sheet 71. In addition, the film 82 is disposed between the second surface SF2 of the glass substrate 11 and the upper elastic sheet 72 to prevent the upper elastic sheet 72 from being attached to the second surface SF2. The breaking method of the brittle substrate according to each of the above embodiments is particularly preferably applied to a glass substrate, but the brittle substrate may be made of a material other than glass. For example, ceramics, ruthenium, compound semiconductors, sapphire, or quartz may be used as materials other than glass.

11‧‧‧Glass substrate (brittle substrate)
50‧‧‧Marking equipment
50R‧‧‧ marking equipment
50v‧‧‧ marking equipment
51‧‧‧Tool tip
51R‧‧‧marking wheel
51v‧‧‧ pointed
52‧‧‧ handle
52R‧‧‧ Holder
53‧‧ ‧ sales
71‧‧‧Bottom elastic sheet
72‧‧‧Upper elastic piece
80‧‧‧ Platform (Support Department)
81‧‧‧ film
82‧‧‧ film
85‧‧‧Disconnecting rod (stress applying member)
AL‧‧‧Auxiliary line
AX‧‧‧ axis direction
CL‧‧‧crack line
DA‧‧‧ directions
DB‧‧‧ direction
DC‧‧ direction
DR‧‧‧ direction
DT‧‧‧ thickness direction
F‧‧‧load
Fi‧‧‧Inside ingredients
Fp‧‧‧ vertical component
HR‧‧‧High load range (Part 2)
LR‧‧‧Low load range (Part 1)
MS‧‧‧ surface shape
Starting point for N1‧‧
N2‧‧‧ halfway point
N3‧‧‧ end point
N4‧‧‧ end point
PF‧‧‧Outer Week
PP‧‧‧Protruding
PPv‧‧‧Protruding
PR‧‧‧ arrow
PS‧‧‧ side
PSv‧‧‧ side
Starting point of Q1‧‧
Q2‧‧‧ halfway point
Q3‧‧‧ End
RT‧‧‧ arrow
RX‧‧‧Rotary axis
S10‧‧‧ steps
S11‧‧ steps
Step S12‧‧‧
S20‧‧‧ steps
S30‧‧‧ steps
SC‧‧‧Conical surface
SD1‧‧‧ top surface
SD2‧‧‧ side
SD3‧‧‧ side
SF1‧‧‧ first side
SF2‧‧‧2nd
TL‧‧‧ trench line

Fig. 1 is a flow chart schematically showing a method of dividing a brittle substrate in the first embodiment of the present invention. Fig. 2 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention. Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2 . 4 is a schematic cross-sectional view (A) taken along line IVA-IVA of FIG. 2, and a schematic cross-sectional view (B) taken along line IVB-IVB of FIG. 2. Fig. 5 is a plan view schematically showing a step of a method of dividing a brittle substrate in the first embodiment of the present invention. Fig. 6 is a schematic cross-sectional view taken along line VI-VI of Fig. 5. Fig. 7 is a schematic cross-sectional view taken along line VII-VII of Fig. 5. Fig. 8 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention. Figure 9 is a schematic cross-sectional view taken along line IX-IX of Figure 8. Figure 10 is a schematic cross-sectional view taken along line X-X of Figure 8. Fig. 11 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention. Fig. 12 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate in the first embodiment of the present invention. Fig. 13 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention. Figure 14 is a schematic partial cross-sectional view taken along line XIV-XIV of Figure 13 . Fig. 15 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention. Fig. 16 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate in the first embodiment of the present invention. FIG. 17 is a side view (A) showing a configuration of a scribing device used in the breaking method of the brittle substrate according to the first embodiment of the present invention, and a view corresponding to an arrow XVII of FIG. 17(A). The bottom view of the knife tip (B). FIG. 18 is a plan view schematically showing a step of a method of dividing a brittle substrate in a first modification of the first embodiment of the present invention. Fig. 19 is a plan view schematically showing one step of a method of dividing a brittle substrate in a second modification of the first embodiment of the present invention. FIG. 20 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate in the third modification of the first embodiment of the present invention. FIG. 21 is a side view (A) and a view of FIG. 21(A) showing a configuration of a scribing device used in a method for dividing a brittle substrate in a fourth modification of the first embodiment of the present invention. The bottom view (B) of the tip of the field of view corresponding to the arrow XXI. Fig. 22 is a plan view schematically showing one step of the breaking method of the brittle substrate in the second embodiment of the present invention. Fig. 23 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate in the second embodiment of the present invention. Fig. 24 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate in the second embodiment of the present invention. Fig. 25 is a plan view schematically showing one step of a method of dividing a brittle substrate in a first modification of the second embodiment of the present invention. Fig. 26 is a plan view schematically showing a step of a method of dividing a brittle substrate in a first modification of the second embodiment of the present invention. Fig. 27 is a plan view schematically showing one step of a method of dividing a brittle substrate in a second modification of the second embodiment of the present invention. FIG. 28 is a plan view schematically showing one step of the breaking method of the brittle substrate in the third modification of the second embodiment of the present invention. FIG. 29 is a side view schematically showing the configuration of a scribing device used in the method for dividing a brittle substrate in the second embodiment of the present invention. Fig. 30 is a front view (A) showing a configuration of the scribing wheel and the pin in Fig. 29, and a partially enlarged view (B) of Fig. 30 (A). Fig. 31 is a plan view schematically showing one step of the breaking method of the brittle substrate in the third embodiment of the present invention. Figure 32 is a schematic cross-sectional view taken along line XXXII-XXXII of Figure 31. Fig. 33 is a cross-sectional view schematically showing one of the steps of the breaking method of the brittle substrate in the third embodiment of the present invention. Fig. 34 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate in the third embodiment of the present invention. Fig. 35 is a partial cross-sectional view schematically showing a step of a method of dividing a brittle substrate in the fourth embodiment of the present invention.

11‧‧‧Glass substrate (brittle substrate)

71‧‧‧Bottom elastic sheet

72‧‧‧Upper elastic piece

80‧‧‧ Platform (Support Department)

85‧‧‧Disconnecting rod (stress applying member)

CL‧‧‧crack line

DR‧‧‧ direction

HR‧‧‧High load range (Part 2)

LR‧‧‧Low load range (Part 1)

SF1‧‧‧ first side

SF2‧‧‧2nd

TL‧‧‧ trench line

Claims (5)

A method for breaking a brittle substrate, comprising: a) preparing a brittle substrate having a first surface on which a groove line including first and second portions is provided, and a first surface opposite to the first surface The two surfaces have a thickness direction perpendicular to the first surface; and the brittle substrate is continuous in a direction crossing the groove line only under the first portion of the first portion and the second portion The state of the connection is the state of no crack, and the crack extends only along the second portion of the first and second portions; b) the first surface of the brittle substrate is placed on the support portion via the first elastic member Step, the first elastic member is more elastic than each of the brittle substrate and the support portion; c) after the step b), the stress applying member is pressed against the second surface of the brittle substrate via the second elastic member In the step, the second elastic member is more elastic than each of the brittle substrate and the stress applying member. The breaking method of the brittle substrate according to claim 1, wherein the step a) comprises: a1) pressing the blade edge against the first surface of the brittle substrate while the blade edge is on the first surface a step of forming the groove line by plastically deforming the first surface of the brittle substrate to form the groove line, and forming the second line of the groove line in the step of forming the groove line The load applied by the blade tip is higher than a load applied to the blade tip for forming the first portion of the groove line, and the step of forming the groove line is obtained under both the first and second portions The crack-free state is performed; a2) the step of causing the crack to be generated only along the second portion of the first and second portions of the groove line. The breaking method of the brittle substrate according to claim 1, wherein in the step b), the adhesion between the first surface of the brittle substrate and the first elastic member is lower than that of the first elastic member. Adhesive film. The breaking method of the brittle substrate according to claim 2, wherein in the step b), the adhesion between the first surface of the brittle substrate and the first elastic member is lower than that of the first elastic member. Adhesive film. The breaking method of the brittle substrate according to any one of claims 1 to 4, wherein in the step c), the second elastic layer is disposed between the second surface of the brittle substrate and the second elastic member A film with a low adhesion to the component.