TW201710531A - Vapor deposition apparatus having the capability to limit the injection scope of vapor particles at a predetermined incident angle - Google Patents

Abstract

Provided is a vapor deposition device for carrying out an easy maintenance operation of an evaporation source. An evaporation source (2) accommodating the vapor material is provided on the evaporation source portion (40) for performing vapor deposition, comprising a shielding portion (5) to surround the periphery of the evaporation source portion, the shielding portion has an open/close structure and a limiting plate disposed above same to limit the vapor particles from moving towards the substrate at a predetermined incident angle.

Description

Vapor deposition device

The present invention relates to a vapor deposition device.

A vapor deposition device that deposits a film-forming material that evaporates from an evaporation source and deposits on a substrate to form a film is widely used in the production of an organic EL device, and various efforts have been made to satisfy the manufacturing requirements. In Patent Document 1, in order to limit the radiation range of the vapor of the film forming material discharged from the evaporation source, it is disclosed that the outer side wall of the evaporation source housing portion in which the evaporation source is housed is provided with a regulating plate.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-68980

However, in the case of the above configuration, it is necessary to perform maintenance work such as cleaning of the evaporation source and replenishment and exchange of the film forming material contained in the evaporation source. To remove the limit plate and the fixed work, the maintenance work is less efficient.

The present invention solves the above problems and provides a vapor deposition device that facilitates maintenance work of an evaporation source.

The gist of the present invention will be described with reference to the accompanying drawings.

According to a first aspect of the present invention, there is provided a vapor deposition apparatus including an evaporation source 2 for vapor deposition of the substrate 1 in an evaporation source installation portion for a vapor deposition chamber, and shielding provided around the evaporation source installation portion 40. In the portion 5, the limiting plate 4 for restricting the incident angle of the evaporating particles of the film forming material discharged from the evaporation source 2 provided in the evaporation source setting portion 40 toward the substrate 1 is provided in the shielding. The configuration of the position above the portion 5 is such that the opening and closing portion 6 is provided in the shielding portion 5.

Further, in a vapor deposition device, the restriction plate 4 is provided in a fixed support member that does not open and close during maintenance.

Further, in a vapor deposition device, the opening and closing portion 6 is closed during vapor deposition and opened during maintenance.

Further, in the vapor deposition device, the fixed support member 7 is configured in a frame shape having an opening that allows opening and closing of the opening portion 6.

Further, in a vapor deposition device, the fixed support member 7 is provided at a position where the opening and closing operation of the opening and closing portion 6 does not interfere.

Furthermore, a vapor deposition apparatus in which the evaporation source is surrounded The shielding portion 5 on the side surface of the side of the second surface is provided with the opening and closing portion 6 at a position facing the side surface in the longitudinal direction of the evaporation source 2.

Further, in the vapor deposition device, when the shielding portion 5 is configured such that the opening and closing portion 6 is in an open state, the evaporation source 2 is exposed from the opening and closing portion 6 over the entire length in the longitudinal direction.

Further, in a vapor deposition device, the restricting plate 4 is movable with respect to the shielding portion 5.

Further, in a vapor deposition device, the shutter 9 that opens and closes the opening 10 of the shielding portion 5 surrounding the evaporation source 2 is movable relative to the shielding portion 5.

According to a second aspect of the invention, there is provided a vapor deposition device comprising: an evaporation source installation portion that houses an evaporation source that stores a film formation material; and a shielding portion that surrounds the periphery of the evaporation source installation portion, wherein the shielding portion has an opening and closing structure.

According to the vapor deposition device according to the present invention, the maintenance work of the evaporation source is facilitated, so that the time required for maintenance can be shortened.

1‧‧‧Substrate

2‧‧‧ evaporation source

4‧‧‧Restricted board

5‧‧‧Shading Department

6‧‧‧Opening and closing department

7‧‧‧Fixed support members

9‧‧‧Shader

10‧‧‧ openings

40‧‧‧Evaporation source setting department

Fig. 1 is a schematic perspective view showing the present embodiment.

Fig. 2 is a schematic cross-sectional view showing the present embodiment.

Fig. 3 is a schematic cross-sectional view showing the present embodiment.

Fig. 4 is a schematic side view showing the present embodiment.

Embodiments of the vapor deposition device according to the present invention will be described with reference to specific examples.

1 and 2 are views showing an embodiment of a vapor deposition device according to the present invention. Fig. 1 is a perspective view showing the internal structure of a vapor deposition device which is provided inside a vacuum chamber (not shown). Fig. 2 is a cross-sectional view of Fig. 1 in the short-side direction of the evaporation source support 3.

First, after explaining the main configuration of the vapor deposition device according to the present invention, another configuration will be described.

An evaporation source installation portion 40 is provided on the upper surface of the evaporation source support 3, and an evaporation source 2 in which a film formation material is accommodated is provided in the vapor deposition source installation portion 40. On the upper surface of the evaporation source support 3, a shielding portion 5 surrounding the periphery of the evaporation source 2 is further provided. In the present specification, the shielding portion 5 is present around the evaporation source 2 except for the lower portion of the evaporation source 2 (the bottom surface of the vapor deposition chamber where the evaporation source is provided) and the upper portion (the substrate side of the evaporation source). "Bound around." In other words, the shielding portion 5 is present on the side of the evaporation source. The shielding portion 5 is preferably disposed so as to prevent scattering of the film forming material in the circumferential direction of the evaporation source.

The evaporation source 2 is a so-called line source having a shape elongated in one direction, and is configured such that an upper cover (not shown) that juxtaposes a plurality of material discharge ports 11 is detachably provided in the container body. Inside the evaporation source 2, a material container for accommodating a film forming material is provided, and the upper cover is removed, so that the film forming material in the material container can be replenished and exchanged.

The evaporation source 2 is detachably provided in the evaporation source setting portion 40. evaporation Since the source installation portion 40 has substantially the same area as the bottom surface of the evaporation source 2, the shielding portion 5 provided to surround the periphery of the evaporation source 2 is provided to surround the periphery of the evaporation source installation portion 40. Further, the evaporation source installation unit 40 is provided with a positioning member (not shown) for determining the installation position of the evaporation source 2. For this reason, even if the evaporation source 2 is temporarily removed, it can be set again at the same position.

The shielding portion 5 is configured by a member that surrounds the peripheral surface of the evaporation source 2, and shields the vapor of the film forming material discharged from the evaporation source 2. In the present embodiment, each of the members is vertically disposed on the evaporation source 2, that is, around the evaporation source installation portion 40, and the shielding portion 5 having a rectangular shape in a plan view is formed. On the upper surface of the evaporation source support 3, a fixed support member 7 is further provided, and the support member 7 is fixed to limit the vapor deposition particles of the film formation material discharged from the evaporation source 2 toward the substrate 1 with respect to the substrate. The incident angle of 1 is provided with a limiting plate 4. The restricting plate 4 is disposed above the shielding portion 5.

When the amount of the material contained in the evaporation source 2 is reduced by the film formation, the film formation speed becomes unstable, and a predetermined film thickness or film quality cannot be obtained. In order to suppress such a situation, maintenance of the evaporation source 2 is performed. At the time of maintenance of the vapor deposition device, the upper cover of the evaporation source 2 is removed to perform internal cleaning, and the film forming material is replenished in a container that accommodates the material contained therein. The interval required for maintenance depends on the film formation time and the film formation speed. Therefore, when the vapor deposition device is used as a mass production machine, the frequency of maintenance becomes high.

However, since the periphery of the evaporation source 2 is surrounded by the shielding portion 5, maintenance in this state is extremely difficult. In the case of this embodiment, in the evaporation source 2 It is more difficult to arrange the restriction plate 4 in the upper portion. In the configuration of the conventional vapor deposition device disclosed in Patent Document 1, it is necessary to limit the removal and fixation of the member provided around the evaporation source such as a plate, and the efficiency of the maintenance work is lowered.

Therefore, the vapor deposition device according to the present invention is provided with an opening and closing structure in the shielding portion 5, and is provided with a permeable opening/closing structure, and is changed to a state in which the shielding portion 5 surrounds the evaporation source (closed state) and a state in which the evaporation source is exposed (open state). The opening and closing portion 6 for maintenance. For example, at the time of vapor deposition, the opening and closing portion 6 can be closed, and the opening and closing portion 6 can be opened by the opening and closing structure during maintenance or the like. Thereby, the efficiency of maintenance work is improved.

Specifically, the shielding portion 5 is configured by a pair of fixed members 14 and a pair of movable members 15 which are located on the side of the short side direction of the evaporation source 2 and fixed. In the direction opposite to the evaporation source support 3, the pair of movable members 15 are located on the side of the longitudinal direction of the evaporation source 2, and are movable between the pair of fixed members 14 with respect to the fixed member 14. .

The movable member 15 is longer than the longitudinal direction of the evaporation source 2, and the pair of movable members 15 are disposed to face each other between the pair of fixed members 14. Both ends of the movable member 15 are rotatably supported by the shaft rotating support portion 17 at the lower portion of the inner surface of the fixed member 14, so that the movable member 15 can be rotated from the vertical by the shaft rotation support portion 17 The state of the state in which the state is opened to the outside. With such an opening and closing structure, the opening and closing portion 6 in which the evaporation source 2 is shielded in the entire length in the longitudinal direction and the exposed state can be realized.

In the present embodiment, the shielding portion 5 has a function of shielding the heat generated from the evaporation source 2 in addition to the function of shielding the vapor of the film forming material discharged from the evaporation source 2. Therefore, the fixed member 14 and the movable member 15 are cooling plates of the refrigerant flow path 13 through which the refrigerant such as water flows, and the refrigerant flow path 13 is closed on the inner side surface of the movable member 15. The occlusion plate 16 is closed.

The fixed support member 7 is configured in a frame shape having an opening that allows opening and closing operations of the opening and closing portion 6. Specifically, the fixed support member 7 is formed to have four leg portions 18 provided at positions that do not interfere with the opening and closing operation of the opening and closing portion 6, and a horizontal member is placed on the upper end of the leg portion 18.

The four leg portions 18 are erected to a position outside the shaft rotation support portion 17 for opening and closing of each of the fixed members 14 with respect to the evaporation source 2 . That is, the interval between the leg portions 18 in the longitudinal direction of the evaporation source is longer than the length of the movable member in the longitudinal direction of the evaporation source.

The horizontal material is a pair of short horizontal members 19 that are parallel to the fixed member 14, and a pair of elongated horizontal members 20 that are parallel to the movable member 15. Further, the height of each of the leg portions 18 is set such that the horizontal members (19, 20) are provided at positions higher than the upper end of the movable member 15.

Therefore, the evaporation source 2 is disposed in a region surrounded by the frame-shaped fixed support member 7 composed of the four leg portions 18 and the horizontal member. In the present embodiment, the fixed support member 7 is formed of an angular material having an L-shaped cross section.

On the elongated horizontal member 20 which is the upper surface of the fixed support member 7, a pair of restricting plates 4 are provided.

The limiting plate 4 is provided such that the angle at which the vapor deposition particles of the film forming material enter the substrate 1 is restricted, and in the film formation using the mask, the substrate may be incident on the substrate at an angle between the mask and the substrate. The vapor deposited particles were shielded.

The restricting plate 4 is permeable to the sliding guide members respectively disposed on the elongated horizontal member 20, and is horizontally moved to be freely approached and fixed at a desired position. The restricting plate 4 has substantially the same length as the elongated horizontal member 20, and the distance between the pair of restricting plates 4 is adjusted so that the adjustment of the incident angle can be easily performed.

In FIGS. 3 and 4, a state in which the evaporation source 2 is exposed to the entire length in the longitudinal direction thereof by the opening and rotation of the movable member 15 is shown. 3 is a view seen from the longitudinal direction of the evaporation source 2, and FIG. 4 is a view seen from the short side direction of the evaporation source 2. In this manner, the evaporation source 2 is exposed to the entire length in the longitudinal direction, so that the upper cover of the evaporation source 2 can be easily removed. In other words, by providing the opening and closing portion 6, the removal and fixation of the member provided around the evaporation source 2 are unnecessary, and the workability of maintenance is improved. In addition, in the figure, the pair of movable members 15 located on the side surface side in the longitudinal direction may be opened and closed, but only one of the side faces on the longitudinal side may be provided as long as maintenance work is possible. The member 15 is made of the other member as a fixed member.

In particular, the restriction plate 4 is important for limiting the position at which the vapor deposition particles of the film formation material enter the substrate 1. Therefore, it takes a considerable time to reproduce the state before the removal. However, since the vapor deposition device of the present invention has the opening and closing portion 6 for maintenance, it is possible to close the state during vapor deposition. The moving member 15 is in an open state during maintenance so that maintenance can be easily performed. In this way, it is not necessary to remove the restriction plate 4 during maintenance, so that the maintenance of the position of the restriction plate 4 can be maintained, and the workability of maintenance is particularly improved. After the end of the maintenance, the movable member 15 is closed again to return to a state in which it can be easily vapor-deposited.

Next, another specific configuration of the vapor deposition device according to the present embodiment will be described in detail based on Figs.

In the present embodiment, the shutter 9 that opens and closes the opening 10 that surrounds the shielding portion 5 of the evaporation source 2 is movably provided. The shutter 9 is provided in a pair and is disposed slightly longer than the movable member 15 so as to block the opening 10 of the shielding portion 5. Specifically, both end portions of the respective shutters 9 are provided on the fixed member 14 via the slide guide members 21, respectively. Then, each of the shutters 9 moves closer to the fixed member 14 and opens and closes the opening 10.

Further, the shutter 9 is formed with a horizontal plate portion 22 that closes the opening portion 10 of the shielding portion 5, and a vertical plate that closes the gap between the elongated horizontal member 20 and the movable member 15 of the fixed supporting member 7. The structure of the part 23. The vertical plate portion 23 is formed on the upper surface of the horizontal plate portion 22 with an L-shaped angle member which is slightly shorter than the horizontal member 22.

Further, each of the horizontal plate portions 22 and the like is configured such that the opposing portions of the horizontal plate portion 22 are overlapped in a state where the shutter 9 is closed, and the shutter 9 is opened at the time of vapor deposition. The plate portion 22 closes (most of) the gap between the elongated horizontal member 20 and the movable member 15 (see FIGS. 1 and 2).

Specifically, the shielding portion 5 is formed to be inside the fixed member 14 and includes a rectangular shape having a width smaller than that of the pair of movable members 15 and a height higher than that of the fixed member 14 . The configuration of the plate body 8 is stopped.

The stop plate body 8 is configured to be provided in the longitudinal end portions of the shutter 9 and the folded portions 25 and 26 at the outer end portions in the width direction, and in the movable member 15 The folded portion 27 at both end portions of the blocking plate 16 on the front side is overlapped in a state in which the shutter 9 and the movable member 15 are closed. Therefore, the opening portion 10 of the shielding portion 5 in which the shutter 9 is closed is specifically the opening portion 10 that stops the space surrounded by the plate body 8 and the movable member 15.

Further, in the present embodiment, the folded portion 27 of the blocking plate 16 of the movable member 15 is overlapped with the outside of the stopping plate 8, and the folded portions 25 and 26 of the shutter 9 are overlapped on the outside of the blocking plate 16. . Therefore, it is possible to surely prevent the film formation material from leaking from the both end sides of the evaporation source 2 in the longitudinal direction, so that the vapor deposition source 2 can be vapor-deposited while the film formation material is well sealed in the space. Run in, etc.

According to the above, in the present embodiment, when the shutter 9 is opened during vapor deposition as shown in FIGS. 1 and 2, the opening 10 of the shielding portion 5 is opened, and the incident angle can be restricted by the restriction plate 4. Perform evaporation.

Further, at the time of maintenance of the evaporation source 2 or the like, the shutter 9 is opened to a position where the movable member 15 and the blocking plate 16 do not interfere as shown in Figs. 3 and 4, and the movable member 15 is opened outward. The evaporation source 2 is caused to extend from the leg portion 18 of the fixed support member 7 to the elongated horizontal member 20 throughout its entire length. The surrounding space is evaporated while the source 2 is exposed. In this state, the upper cover of the evaporation source 2 is removed and taken out from the shielding portion 5, so that cleaning, replenishment of the film forming material, and the like can be performed, and the maintenance time can be shortened. Further, it is not limited to the maintenance of the evaporation source 2, and it is not necessary to contact the restriction plate 4 provided on the fixed support member 7 when cleaning the other members such as the fixed member 14, the movable member 15, and the shutter 9. Maintain a set angle of incidence before and after maintenance. Further, the fine adjustment of the incident angle is also facilitated by adjusting the degree of deviation of the limiting plate 4.

Further, the evaporation source support 3 of the present embodiment is provided with a slider. Specifically, a guide rail 31 extending in the first direction is provided on the bottom surface of the vapor deposition chamber, and a frame-shaped first direction movement slider 32 that can slide back and forth with respect to the guide rail 31 is provided. Further, a guide rail 33 extending in the second movement direction is provided on the upper surface of the first direction moving slider 32, and a second direction movement capable of reciprocatingly sliding with respect to the guide rail 33 is provided in the lower portion of the evaporation source support body 3. Slide 35. On the bottom surface of the evaporation source support 3, an arm member 34 for moving the evaporation source support 3 is coupled, and the arm member 34 can be driven to move the evaporation source support 3 (evaporation source 2). In the first direction or the second direction.

Therefore, for example, two vapor deposition zones are juxtaposed in the first direction, so that one evaporation source 2 can be moved to the vapor deposition zone in the film formation moving direction (second direction) to form a film, and then moved to the vapor deposition. In the region moving direction (first direction), film formation or the like is performed in the same manner in the other vapor deposition regions. In the case of the present embodiment, when the film formation is performed in one vapor deposition zone, the evaporation source 2 is moved in a direction intersecting the longitudinal direction of the evaporation source 2. Film formation.

Further, the present invention is not limited to the embodiment, and the specific configuration of each constituent element can be appropriately designed.

1‧‧‧Substrate

3‧‧‧ evaporation source support

4‧‧‧Restricted board

5‧‧‧Shading Department

6‧‧‧Opening and closing department

7‧‧‧Fixed support members

9‧‧‧Shader

13‧‧‧Refrigerant flow path

14‧‧‧Fixed members

15‧‧‧ movable members

17‧‧‧Axis Rotation Support

18‧‧‧ feet

19‧‧‧Short horizontal timber

20‧‧‧Long horizontal timber

21‧‧‧Sliding guide members

31‧‧‧ rails

32‧‧‧First direction moving slider

33‧‧‧Second moving direction guide

34‧‧‧arm members

35‧‧‧Second direction moving slider

Claims (15)

In a vapor deposition apparatus, an evaporation source installation unit for providing an evaporation source for accommodating a film formation material is provided in a vapor deposition chamber, and a shielding portion that surrounds the evaporation source installation portion is provided, and is provided in the vapor deposition device. a restriction plate that restricts an incident angle of the evaporating particles of the film formation material discharged from the substrate to the substrate, and a restriction plate that is disposed at an upper position of the shielding portion, and is provided with an opening and closing portion in the shielding portion. unit. The vapor deposition device according to claim 1, wherein the restricting plate is provided as a fixed supporting member that does not open and close during maintenance. The vapor deposition device according to claim 1, wherein the opening and closing portion is closed during vapor deposition and opened during maintenance. The vapor deposition device according to the first aspect of the invention, wherein the fixed support member is formed in a frame shape having an opening that allows opening and closing of the opening. The vapor deposition device according to claim 1, wherein the fixed support member is provided at a position where the opening and closing operation of the opening and closing portion does not interfere. The vapor deposition device according to the first aspect of the invention, wherein the shielding portion is provided around the evaporation source installation portion, and the opening and closing portion is provided at a position facing a side surface in a longitudinal direction of the evaporation source installation portion. The vapor deposition device of the sixth aspect of the invention, wherein the shielding portion is configured such that when the opening and closing portion is in an open state, the evaporation source provided in the evaporation source installation portion is exposed from the opening and closing portion in the entire longitudinal direction thereof. dew. The vapor deposition device according to claim 1, wherein the restricting plate is movable with respect to the shielding portion. The vapor deposition device according to any one of the first to eighth aspects of the present invention, wherein the shutter that opens and closes the opening of the shielding portion that surrounds the evaporation source installation portion is movable relative to the shielding portion . A vapor deposition device includes an evaporation source installation portion for providing an evaporation source for accommodating a film formation material, and a shielding portion for surrounding the evaporation source installation portion, wherein the shielding portion has an opening and closing structure. The vapor deposition device according to claim 10, wherein the evaporation source installation portion is provided on the evaporation source support, and the shielding portion includes a pair of fixed members that face each other across the evaporation source installation portion, And a pair of members facing the evaporation source installation portion between the pair of fixed members, wherein the pair of fixed members are fixed to the evaporation source support, and the pair of members are At least one of the movable members is pivotally supported by the lower surface of the pair of fixed members by a shaft rotation support portion provided at both end portions. The vapor deposition device according to claim 11, wherein the evaporation source installation portion has an elongated shape in one direction, and the movable portion is provided along a longitudinal direction of the evaporation source installation portion. For example, the vapor deposition package of any of the 10th to 12th patent applications In the evaporation source support, a frame-shaped fixed support member surrounding the evaporation source installation portion is provided, and a restriction plate is provided on the upper surface of the fixed support member. The vapor deposition device according to claim 13, wherein an interval in a longitudinal direction of the evaporation source installation portion constituting the frame of the fixed support member is longer than a longitudinal direction of the evaporation source installation portion of the movable portion The length on the top is long. A vapor deposition device in which an evaporation source for vapor-depositing a substrate via a mask is provided in a vapor deposition chamber, and is characterized in that a shielding portion that surrounds the evaporation source is provided and is oriented toward the evaporation source The restricting plate that restricts the incident angle of the film forming material scattered on the substrate to the substrate is disposed above the shielding portion, and the shielding portion is opened and closed during maintenance to expose the evaporation source to the concealment The maintenance opening and closing portion is provided, and the restriction plate is provided on a fixed support member that does not open and close during maintenance.